WO2021029141A1 - インダクタ - Google Patents

インダクタ Download PDF

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Publication number
WO2021029141A1
WO2021029141A1 PCT/JP2020/024102 JP2020024102W WO2021029141A1 WO 2021029141 A1 WO2021029141 A1 WO 2021029141A1 JP 2020024102 W JP2020024102 W JP 2020024102W WO 2021029141 A1 WO2021029141 A1 WO 2021029141A1
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WO
WIPO (PCT)
Prior art keywords
wiring
facing portion
recess
length
thickness direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/024102
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
佳宏 古川
圭佑 奥村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to US17/633,453 priority Critical patent/US12255005B2/en
Priority to CN202511494512.2A priority patent/CN121260652A/zh
Priority to KR1020227003575A priority patent/KR102786140B1/ko
Priority to EP20852096.5A priority patent/EP4012732B1/en
Priority to CN202080056602.2A priority patent/CN114207751B/zh
Publication of WO2021029141A1 publication Critical patent/WO2021029141A1/ja
Anticipated expiration legal-status Critical
Priority to US19/046,079 priority patent/US20250182951A1/en
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00—Adaptations of transformers or inductances for specific applications or functions
    • H01F38/20—Instruments transformers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H01F27/255—Magnetic cores made from particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/04—Fixed inductances of the signal type with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2823—Wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F3/00—Cores, Yokes, or armatures
    • H01F3/10—Composite arrangements of magnetic circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
    • H01F1/36—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
    • H01F1/37—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles in a bonding agent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F3/00—Cores, Yokes, or armatures
    • H01F3/10—Composite arrangements of magnetic circuits
    • H01F2003/106—Magnetic circuits using combinations of different magnetic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/04—Fixed inductances of the signal type with magnetic core
    • H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder

Definitions

  • the present invention relates to an inductor.
  • Patent Document 1 another ferrite raw sheet is laminated on a ferrite raw sheet on which a plurality of conductors are arranged, and these are fired to obtain an inductor.
  • inductors are required to have high inductance, excellent DC superimposition characteristics, and excellent Q value.
  • the present invention provides an inductor having high inductance, excellent DC superimposition characteristics, and excellent Q value.
  • the first wiring and the second wiring which are adjacent to each other with a distance from each other, a first surface which is continuous in the surface direction, and a surface which is separated from the first surface in the thickness direction. It has a second surface that is continuous in the direction, and an inner peripheral surface that is located between the first surface and the second surface and is in contact with the outer peripheral surface of the first wiring and the outer peripheral surface of the second wiring. It has a first magnetic layer containing substantially spherical magnetic particles and a resin, a third surface in contact with the first surface, and a fourth surface spaced apart from the third surface in the thickness direction.
  • the second magnetic layer has a second magnetic layer containing flat magnetic particles and a resin, a fifth surface in contact with the second surface, and a sixth surface separated from the fifth surface in the thickness direction, and has a substantially flat shape.
  • the second magnetic layer and the third magnetic layer are each provided with a third magnetic layer containing the magnetic particles and the resin, and the specific magnetic permeability of each of the second magnetic layer is higher than the specific magnetic permeability of the first magnetic layer.
  • the surface has a first concave portion recessed from the first facing portion facing the first wiring in the thickness direction and a second facing portion facing the second wiring in the thickness direction.
  • the fourth surface has a second recess formed therein between a third facing portion facing the first facing portion in the thickness direction and a fourth facing portion facing the second facing portion in the thickness direction.
  • the fifth surface has a third surface recessed from the fifth facing portion facing the first wiring in the thickness direction and the sixth facing portion facing the second wiring in the thickness direction.
  • the sixth surface has a recess, and the sixth surface is formed between a seventh facing portion facing the fifth facing portion in the thickness direction and an eighth facing portion facing the second facing portion in the thickness direction. Includes an inductor with a recessed fourth recess.
  • the inductor 1 includes a first magnetic layer containing substantially spherical magnetic particles, and a second magnetic layer and a third magnetic layer containing substantially flat magnetic particles. Moreover, the relative magnetic permeability of each of the second magnetic layer and the third magnetic layer is higher than the relative magnetic permeability of the first magnetic layer. Therefore, this inductor has a high inductance and is excellent in DC superimposition characteristics.
  • the magnetic particles having a substantially flat shape are formed in the first recess and the second recess. Can be oriented to recesses.
  • the third magnetic layer has the third recess and the fourth recess, in the region surrounded by the third recess and the fourth recess in the third magnetic layer, the magnetic particles having a substantially flat shape are formed in the third recess and the fourth recess. Can be oriented to recesses. Therefore, an excellent Q value can be obtained.
  • this inductor has high inductance and excellent DC superimposition characteristics, but also has an excellent Q value.
  • the length L1 between the first facing portion and the first wiring, the length L2 between the second facing portion and the second wiring, and the depth L3 of the first recess are defined. Satisfies the following formulas (1) and (2), and the length L4 between the third facing portion and the first wiring and the length L5 between the fourth facing portion and the second wiring.
  • the depth L3 of the first recess and the depth L7 of the second recess satisfy the following formula (5), and the depth L6 of the third recess and the fourth recess.
  • the depth L8 of the recess includes the inductor according to [1] or [2], which satisfies the following formula (6).
  • the length L1 between the first facing portion and the first wiring and the length L9 in the thickness direction of the first wiring satisfy the following formula (7), and the second facing portion is satisfied.
  • the length L2 between the portion and the second wiring and the length L10 in the thickness direction of the second wiring satisfy the following formula (8), and the length L4 between the third facing portion and the first wiring.
  • the length L9 of the first wiring satisfies the following formula (9), and the length L5 between the fourth facing portion and the second wiring and the length L10 of the second wiring.
  • the inductor according to any one of [1] to [3], which satisfies the following formula (10), is included.
  • the inductor of the present invention has high inductance and excellent DC superimposition characteristics, but also has an excellent Q value.
  • FIG. 1 is a cross-sectional view of an embodiment of the inductor of the present invention.
  • FIG. 2 is a cross-sectional view of the magnetic particles contained in the first magnetic layer, the second magnetic layer, and the third magnetic layer in the inductor shown in FIG.
  • FIG. 3 shows a first step of preparing a hot press device in the method of manufacturing an inductor.
  • FIG. 4 shows a third step of setting the magnetic sheet, the first wiring, and the second wiring in the heat press device in the method of manufacturing the inductor, following FIG.
  • FIG. 5 shows, following FIG. 4, in the method of manufacturing an inductor, the outer frame member is brought into close contact with the first mold to form a first closed space, and then the first closed space is depressurized to form a reduced pressure space.
  • FIG. 6 shows a fifth step in the method of manufacturing an inductor, in which an inner frame member is pressed into a first mold to form a second closed space in a depressurized atmosphere
  • FIG. 7 shows a sixth step of hot-pressing the magnetic sheet, the first wiring, and the second wiring in the method of manufacturing the inductor
  • FIG. 8 shows a step of forming a through hole in the inductor taken out from the heat press device in FIG. 7.
  • FIG. 9 shows a cross-sectional view of a modification of the inductor shown in FIG. 1 (a mode in which the inductor further includes a functional layer).
  • This inductor 1 has a substantially sheet shape extending in the plane direction orthogonal to the thickness direction.
  • the inductor 1 includes a first wiring 21, a second wiring 22, a first magnetic layer 31, a second magnetic layer 51, and a third magnetic layer 71.
  • the first wiring 21 and the second wiring 22 are adjacent to each other at intervals in the first direction orthogonal to the electricity transmission direction (second direction) (extending direction) and the thickness direction.
  • the first direction and the second direction are included in the plane direction and are orthogonal to each other in the plane direction.
  • the first wiring 21 and the second wiring 22 is arranged on one side in the first direction, and the second wiring 22 is arranged on the other side in the first direction.
  • Each of the first wiring 21 and the second wiring 22 has, for example, a substantially circular shape in cross section.
  • Each of the first wiring 21 and the second wiring 22 has an outer peripheral surface 25 facing the first magnetic layer 31 described below.
  • Each of the first wiring 21 and the second wiring 22 includes a lead wire 23 and an insulating film 24 that covers the lead wire 23.
  • the lead wire 23 has a substantially circular cross-sectional view that shares a central axis with each of the first wiring 21 and the second wiring 22.
  • the material of the conducting wire 23 is a metal conductor such as copper.
  • the lower limit of the radius of the lead wire 23 is, for example, 25 ⁇ m, and the upper limit is, for example, 2,000 ⁇ m.
  • the insulating film 24 covers the entire peripheral surface of the lead wire 23.
  • the insulating film 24 has a substantially annular shape in cross section that shares a central axis with each of the first wiring 21 and the second wiring 22.
  • Examples of the material of the insulating film 24 include insulating resins such as polyester, polyurethane, polyesterimide, polyamideimide, and polyimide.
  • the insulating film 24 is a single layer or a plurality of layers.
  • the lower limit of the thickness of the insulating film 24 is, for example, 1 ⁇ m, and the upper limit is, for example, 100 ⁇ m.
  • the radius of each of the first wiring 21 and the second wiring 22 is the sum of the radius of the lead wire 23 and the thickness of the insulating film 24, and specifically, the lower limit thereof is, for example, 25 ⁇ m, preferably 50 ⁇ m.
  • the upper limit is, for example, 2,000 ⁇ m, preferably 200 ⁇ m.
  • the lower limit of the distance (interval) L0 between the first wiring 21 and the second wiring 22 is appropriately set according to the application and purpose of the inductor 1, and is, for example, 10 ⁇ m, preferably 50 ⁇ m, and the upper limit is, for example. It is 10,000 ⁇ m, preferably 5,000 ⁇ m.
  • the first magnetic layer 31 has an inner peripheral surface 32, a first surface 33, and a second surface 34.
  • the inner peripheral surface 32 comes into contact with the outer peripheral surface 25 of the first wiring 21 and the second wiring 22.
  • the inner peripheral surface 32 which will be described next, is located between the first surface 33 and the second surface 34 in the thickness direction.
  • the first surface 33 is continuous in the surface direction.
  • the first surface 33 is arranged on one side of the inner peripheral surface 32 in the thickness direction at intervals.
  • the first surface 33 is one surface in the thickness direction of the first magnetic layer 31.
  • the first surface 33 has a first raised portion 35, a second raised portion 36, and a recess 37 on one side.
  • the first raised portion 35 has a cross-sectional view along the thickness direction and the first direction (hereinafter, may be simply referred to as “cross-sectional view”) with respect to one side surface 26 in the thickness direction on the outer peripheral surface 25 of the first wiring 21. , Facing at intervals.
  • the upper limit of the central angle ⁇ 1 of one side surface 26 of the first wiring 21 is, for example, 90 degrees, preferably 60 degrees, and the lower limit is. For example, it is 15 degrees, preferably 30 degrees.
  • the central angle ⁇ 1 of one side surface 26 of the first wiring 21 is defined about the central axis CA1 of the first wiring 21.
  • the first raised portion 35 is a region that overlaps one side surface 26 when projected in the radial direction from the central axis CA1 (or the center of gravity) of the first wiring 21.
  • the first raised portion 35 is curved along one side surface 26 of the first wiring 21.
  • the bending direction of the first raised portion 35 is the same as that of the one side surface 26 of the first wiring 21.
  • the second raised portion 36 faces the one side surface 26 in the thickness direction of the outer peripheral surface 25 of the second wiring 22 at a distance in a cross-sectional view.
  • the upper limit of the central angle ⁇ 2 of one side surface 26 of the second wiring 22 is, for example, 90 degrees, preferably 60 degrees, and the lower limit is. For example, it is 15 degrees, preferably 30 degrees.
  • the central angle ⁇ 2 of the one side surface 26 of the second wiring 22 is defined about the central axis CA2 of the second wiring 22.
  • the second raised portion 36 is a region that overlaps one side surface 26 when projected in the radial direction from the central axis CA2 (or the center of gravity) of the second wiring 22.
  • the second raised portion 36 is curved along one side surface 26 of the second wiring 22.
  • the bending direction of the second raised portion 36 is the same as that of the one side surface 26 of the second wiring 22.
  • the one-side recess 37 is arranged between the first raised portion 35 and the second raised portion 36.
  • the one-side recess 37 connects the first raised portion 35 and the second raised portion 36 in the first direction.
  • the one-side recess 37 does not overlap the first wiring 21 and the second wiring 22 when projected in the thickness direction, and is arranged between the first wiring 21 and the second wiring 22.
  • the one-side recess 37 is recessed from the first raised portion 35 and the second raised portion 36 toward the other side in the thickness direction.
  • the second surface 34 is arranged to face the first surface 33 on the other side in the thickness direction at intervals.
  • the second surface 34 is located on the opposite side of the first surface 33 with respect to the first wiring 21 and the second wiring 22.
  • the second surface 34 is the other surface in the thickness direction of the first magnetic layer 31.
  • the second surface 34 is continuous in the surface direction.
  • the second surface 34 has a third raised portion 41, a fourth raised portion 42, and a recess 43 on the other side.
  • the third raised portion 41 faces the other side surface 27 in the thickness direction of the outer peripheral surface 25 of the first wiring 21 at a distance in a cross-sectional view.
  • the upper limit of the central angle ⁇ 3 of the other side surface 27 is, for example, 90 degrees, preferably 60 degrees, and the lower limit is, for example, 15 degrees. Preferably, it is 30 degrees.
  • the central angle ⁇ 3 of the side surface 27 is determined about the central axis CA1 of the first wiring 21.
  • the third raised portion 41 is a region that overlaps the other side surface 27 when projected in the radial direction from the central axis CA1 (or the center of gravity) of the first wiring 21.
  • the third raised portion 41 is curved along the other side surface 27 of the first wiring 21. The bending direction of the third raised portion 41 is the same as that of the other side surface 27 of the first wiring 21.
  • the fourth raised portion 42 faces the other side surface 27 in the thickness direction of the outer peripheral surface 25 of the second wiring 22 at a distance in a cross-sectional view.
  • the upper limit of the central angle ⁇ 4 of the other side surface 27 is, for example, 90 degrees, preferably 60 degrees, and the lower limit is, for example, 15 degrees. Preferably, it is 30 degrees.
  • the central angle ⁇ 4 of the side surface 27 is determined around the central axis CA2 of the second wiring 22.
  • the fourth raised portion 42 is a region that overlaps the other side surface 27 when projected in the radial direction from the central axis CA2 (or the center of gravity) of the second wiring 22.
  • the fourth raised portion 42 curves along the other side surface 27 of the second wiring 22.
  • the bending direction of the fourth raised portion 42 is the same as that of the other side surface 27 of the second wiring 22.
  • the other side recess 43 is arranged between the third raised portion 41 and the fourth raised portion 42.
  • the other side recess 43 connects the third raised portion 41 and the fourth raised portion 42 in the first direction.
  • the other side recess 43 does not overlap the first wiring 21 and the second wiring 22 when projected in the thickness direction, and is arranged between the first wiring 21 and the second wiring 22.
  • the other side recess 43 is recessed from the third raised portion 41 and the fourth raised portion 42 toward one side in the thickness direction.
  • the material, physical properties and dimensions of the first magnetic layer 31 will be described later.
  • the second magnetic layer 51 is arranged on the first surface 33 of the first magnetic layer 31.
  • the second magnetic layer 51 has a third surface 53 and a fourth surface 54.
  • the third surface 53 is a contact surface that contacts the first surface 33 of the first magnetic layer 31.
  • the third surface 53 is continuous in the surface direction.
  • the third surface 53 is the other surface in the thickness direction of the second magnetic layer 51.
  • the third surface 53 has a first facing portion 55, a second facing portion 56, and a first recess 57.
  • the first facing portion 55 comes into contact with the first raised portion 35.
  • the first facing portion 55 has the same shape as the first raised portion 35 in cross-sectional view.
  • the first facing portion 55 includes a first top portion 91 located on one side in the thickness direction.
  • the second facing portion 56 comes into contact with the second raised portion 36.
  • the second facing portion 56 has the same shape as the second raised portion 36 in a cross-sectional view.
  • the second facing portion 56 includes a second top portion 92 located on one side in the thickness direction.
  • the first recess 57 comes into contact with the recess 37 on one side.
  • the first recess 57 is recessed between the first facing portion 55 and the second facing portion 56 toward the other side in the thickness direction.
  • the first recess 57 has the same shape as the one-side recess 37.
  • the first recess 57 has a first bottom 38 located on the other side in the thickness direction.
  • the first recess 57 includes a first arc surface 39 whose central axis is located on one side in the thickness direction of the recess 37 on one side.
  • the first arc plane 39 includes a first bottom 38.
  • the fourth surface 54 is arranged to face one side of the third surface 53 in the thickness direction at a distance.
  • the fourth surface 54 forms one surface of the second magnetic layer 51 and the inductor 1 in the thickness direction.
  • the fourth surface 54 is an exposed surface exposed on one side in the thickness direction.
  • the fourth surface 54 is continuous in the surface direction.
  • the fourth surface 54 has a third facing portion 58, a fourth facing portion 59, and a second recess 60.
  • the third facing portion 58 faces the first facing portion 55 of the third surface 53 in the thickness direction.
  • the third facing portion 58 is curved along the first facing portion 55 in a cross-sectional view.
  • the third facing portion 58 has a fifth top portion 86 facing one side in the thickness direction of the first top portion 91 of the first facing portion 55.
  • the fifth top portion 86 is located on one side of the third facing portion 58 in the thickness direction.
  • the fourth facing portion 59 faces the second facing portion 56 of the third surface 53 in the thickness direction.
  • the fourth facing portion 59 is curved along the second facing portion 56.
  • the fourth facing portion 59 has a sixth top portion 87 facing one side in the thickness direction of the second top portion 92.
  • the sixth top portion 87 is located on one side in the thickness direction of the fourth facing portion 59.
  • the second recess 60 faces the first recess 57 on the third surface 53 in the thickness direction.
  • the second recess 60 is recessed between the third facing portion 58 and the fourth facing portion 59 toward the other side in the thickness direction.
  • the second recess 60 is recessed along the first recess 57.
  • the second recess 60 has a third bottom 63 located on the other side in the thickness direction.
  • the third bottom portion 63 faces the first bottom portion 38 of the first recess 57 in the thickness direction.
  • the material, physical properties and dimensions of the second magnetic layer 51 will be described later.
  • the third magnetic layer 71 is arranged on the second surface 34 of the first magnetic layer 31.
  • the third magnetic layer 71 has a fifth surface 73 and a sixth surface 74.
  • the fifth surface 73 is a contact surface that contacts the second surface 34 of the first magnetic layer 31.
  • the fifth surface 73 is continuous in the surface direction.
  • the fifth surface 73 is one surface in the thickness direction of the third magnetic layer 71.
  • the fifth surface 73 has a fifth facing portion 75, a sixth facing portion 76, and a third recess 77.
  • the fifth facing portion 75 comes into contact with the third raised portion 41. Specifically, the fifth facing portion 75 has the same shape as the third raised portion 41 in a cross-sectional view. The fifth facing portion 75 has a third top portion 93 located on the other side in the thickness direction.
  • the sixth facing portion 76 comes into contact with the fourth raised portion 42. Specifically, the sixth facing portion 76 has the same shape as the fourth raised portion 42 in a cross-sectional view. The sixth facing portion 76 has a fourth top portion 94 located on the other side in the thickness direction.
  • the third recess 77 comes into contact with the other recess 43.
  • the third recess 77 is recessed between the fifth facing portion 75 and the sixth facing portion 76 toward one side in the thickness direction.
  • the third recess 77 has the same shape as the other recess 43.
  • the third recess 77 has a second bottom 44 located on one side in the thickness direction.
  • the other side recess 43 includes a second arc surface 49 whose central axis is located on the other side in the thickness direction from the other side recess 43.
  • the second arc plane 49 includes a second bottom 44.
  • the sixth surface 74 is arranged to face the other side of the fifth surface 73 in the thickness direction at intervals.
  • the sixth surface 74 forms the other surface of the third magnetic layer 71 and the inductor 1 in the thickness direction.
  • the sixth surface 74 is an exposed surface exposed on the other side in the thickness direction.
  • the sixth surface 74 is continuous in the surface direction.
  • the sixth surface 74 has a seventh facing portion 78, an eighth facing portion 79, and a fourth recess 80.
  • the seventh facing portion 78 faces the fifth facing portion 75 of the fifth surface 73 in the thickness direction.
  • the seventh facing portion 78 is curved along the fifth facing portion 75 in a cross-sectional view.
  • the seventh facing portion 78 has a seventh top portion 88 facing the third top portion 93 of the fifth facing portion 75 and the other side in the thickness direction.
  • the seventh top portion 88 is located on the other side of the seventh facing portion 78 in the thickness direction.
  • the eighth facing portion 79 faces the sixth facing portion 76 of the fifth surface 73 in the thickness direction.
  • the eighth facing portion 79 is curved along the sixth facing portion 76 in a cross-sectional view.
  • the eighth facing portion 79 has an eighth top portion 89 facing the fourth top portion 94 of the sixth facing portion 76 and the other side in the thickness direction.
  • the eighth apex 89 is located on the other side of the eighth facing portion 79 in the thickness direction.
  • the fourth recess 80 faces the third recess 77 on the fifth surface 73 in the thickness direction.
  • the fourth recess 80 is recessed between the seventh facing portion 78 and the eighth facing portion 79 toward one side in the thickness direction.
  • the fourth recess 80 is recessed along the third recess 77.
  • the fourth recess 80 has a fourth bottom 64 located on one side in the thickness direction.
  • the fourth bottom portion 64 faces the second bottom portion 44 of the third recess 77 in the thickness direction.
  • the material of the first magnetic layer 31, the second magnetic layer 51, and the third magnetic layer 71 is a magnetic composition containing magnetic particles and a resin.
  • Examples of the magnetic material constituting the magnetic particles include a soft magnetic material and a hard magnetic material.
  • a soft magnetic material is preferably used from the viewpoint of inductance.
  • the soft magnetic material examples include a single metal body containing one kind of metal element in a pure substance state, for example, one or more kinds of metal elements (first metal element) and one or more kinds of metal elements (second metal element).
  • first metal element one or more kinds of metal elements
  • second metal element one or more kinds of metal elements
  • the single metal body examples include a single metal composed of only one kind of metal element (first metal element).
  • the first metal element is appropriately selected from, for example, iron (Fe), cobalt (Co), nickel (Ni), and other metal elements that can be contained as the first metal element of the soft magnetic material. ..
  • the single metal body includes, for example, a core containing only one kind of metal element and a surface layer containing an inorganic substance and / or an organic substance that modifies a part or all of the surface of the core, for example.
  • examples thereof include an organic metal compound containing a first metal element and a form in which an inorganic metal compound is decomposed (thermal decomposition, etc.).
  • thermal decomposition etc.
  • iron powder obtained by thermally decomposing an organic iron compound (specifically, carbonyl iron) containing iron as the first metal element (sometimes referred to as carbonyl iron powder). And so on.
  • the position of the layer containing the inorganic substance and / or the organic substance that modifies the portion containing only one kind of metal element is not limited to the above-mentioned surface.
  • the organometallic compound or inorganic metal compound capable of obtaining a single metal body is not particularly limited, and a known or commonly used organometallic compound or inorganic metal compound capable of obtaining a soft magnetic single metal body is not particularly limited. Can be appropriately selected from.
  • the alloy body is a eutectic of one or more kinds of metal elements (first metal element) and one or more kinds of metal elements (second metal element) and / or non-metal elements (carbon, nitrogen, silicon, phosphorus, etc.). It is not particularly limited as long as it is a body and can be used as an alloy body of a soft magnetic material.
  • the first metal element is an essential element in the alloy body, and examples thereof include iron (Fe), cobalt (Co), and nickel (Ni). If the first metal element is Fe, the alloy body is an Fe-based alloy, and if the first metal element is Co, the alloy body is a Co-based alloy, and the first metal element is Ni. For example, the alloy body is a Ni-based alloy.
  • the second metal element is an element (sub-component) secondarily contained in the alloy body, and is a metal element that is compatible (co-fused) with the first metal element.
  • iron (Fe) the first. 1
  • cobalt (Co) when the first metal element is other than Co
  • nickel (Ni) when the first metal element is other than Ni
  • Cr chromium
  • Al aluminum
  • Si silicon
  • Cu copper
  • manganese (Mn) calcium (Ca), barium (Ba), titanium (Ti), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb), tantalum (Ta), molybdenum (Mo), tungsten (W), ruthenium (Ru), rhodium (Rh), zinc (Zn), gallium (Ga), indium (In), germanium Examples thereof include (Ge), tin (Sn), lead (Pb), scan
  • the non-metal element is an element (sub-component) secondarily contained in the alloy body, and is a non-metal element that is compatible (combined) with the first metal element.
  • boron (B) and carbon examples thereof include (C), nitrogen (N), silicon (Si), phosphorus (P) and sulfur (S). These can be used alone or in combination of two or more.
  • Fe-based alloys examples include magnetic stainless steel (Fe-Cr-Al-Si alloy) (including electromagnetic stainless steel), sentust (Fe-Si-Al alloy) (including super sentust), and permalloy (including supersendust).
  • magnetic stainless steel Fe-Cr-Al-Si alloy
  • sentust Fe-Si-Al alloy
  • permalloy including supersendust
  • Fe-Ni alloy Fe-Ni alloy
  • Fe-Ni-Mo alloy Fe-Ni-Mo-Cu alloy
  • Fe-Ni-Co alloy Fe-Cr alloy
  • Fe-Cr-Al alloy Fe-Ni-Cr alloy
  • Fe- Ni—Cr—Si alloy silicon copper (Fe—Cu—Si alloy)
  • Fe—Si alloy Fe—Si—B (—Cu—Nb) alloy
  • Fe—B—Si—Cr alloy Fe—Si—Cr -Ni alloy
  • Fe-Si-Cr alloy Fe-Si-Al-Ni-Cr alloy
  • Fe-Ni-Si-Co alloy Fe-N alloy, Fe-C alloy, Fe-B alloy, Fe-P alloy
  • Ferrites stainless ferrites, Mn-Mg-based ferrites, Mn-Zn-based ferrites, Ni-Zn-based ferrites, Ni-Zn-Cu-based ferrites, Cu-Zn-based ferrites, Cu-Mg-Zn-based
  • Co-based alloys which are examples of alloys, include Co-Ta-Zr and cobalt (Co) -based amorphous alloys.
  • Ni-based alloys which are examples of alloys, include Ni—Cr alloys.
  • the shape of the magnetic particles contained in the first magnetic layer 31 is a substantially spherical shape.
  • the shape of the magnetic particles contained in the second magnetic layer 51 and the third magnetic layer 71 is a substantially flat shape (plate shape). Therefore, the substantially spherical magnetic particles of the first magnetic layer 31 improve the DC superimposition characteristics, and the substantially flat magnetic particles of the second magnetic layer 51 and the third magnetic layer 71 provide high inductance and further. An excellent Q value can be obtained.
  • the lower limit of the average value of the maximum lengths of the magnetic particles is, for example, 0.1 ⁇ m, preferably 0.5 ⁇ m, and the upper limit is, for example, 200 ⁇ m, preferably 150 ⁇ m.
  • the average value of the maximum lengths of the magnetic particles is calculated as the medium particle diameter of the magnetic particles.
  • the volume ratio (filling rate) of the magnetic particles in the magnetic composition is, for example, 10% by volume or more, and for example, 90% by volume or less.
  • thermosetting resins examples include thermosetting resins.
  • thermosetting resin examples include epoxy resin, melamine resin, thermosetting polyimide resin, unsaturated polyester resin, polyurethane resin, silicone resin and the like. From the viewpoint of adhesiveness, heat resistance and the like, epoxy resin is preferable.
  • thermosetting resin contains an epoxy resin
  • it is an epoxy containing an epoxy resin (cresol novolac type epoxy resin, etc.), a curing agent (phenol resin, etc.) and a curing accelerator (imidazole compound, etc.) in an appropriate ratio. It may be prepared as a resin composition.
  • the number of parts of the thermosetting resin with respect to 100 parts by volume of the magnetic particles is, for example, 10 parts by volume or more, and 90 parts by volume or less.
  • the resin can contain a thermoplastic resin such as an acrylic resin in an appropriate ratio.
  • a thermoplastic resin such as an acrylic resin in an appropriate ratio.
  • the relative magnetic permeability of the first magnetic layer 31, the second magnetic layer 51, and the third magnetic layer 71 are all measured at a frequency of 10 MHz.
  • the relative magnetic permeability of each of the second magnetic layer 51 and the third magnetic layer 71 is higher than the specific magnetic permeability of the first magnetic layer 31.
  • the lower limit of the ratio of the relative magnetic permeability of each of the second magnetic layer 51 and the third magnetic layer 71 to the relative magnetic permeability of the first magnetic layer 31 exceeds, for example, 1, preferably 1.1. , More preferably 1.5, and the upper limit is, for example, 20, preferably 10.
  • this inductor 1 Since the relative magnetic permeability of each of the second magnetic layer 51 and the third magnetic layer 71 is higher than the relative magnetic permeability of the first magnetic layer 31, this inductor 1 is excellent in DC superimposition characteristics.
  • the relative magnetic permeability of the first magnetic layer 31, the second magnetic layer 51, and the third magnetic layer 71 is the first sheet 65, the second sheet 66, and the third sheet 67 for forming them (FIGS. 4 to 4). It is obtained by measuring the relative magnetic permeability of (see 6). Further, the relative magnetic permeability of the first magnetic layer 31, the second magnetic layer 51 and the third magnetic layer 71 can be directly measured.
  • the length L1 between the first facing portion 55 and the first wiring 21, the length L2 between the second facing portion 56 and the second wiring 22, and the depth L3 of the first recess are, for example, the following equation (1).
  • the following formula (2) are satisfied, preferably the following formulas (1A) and the following formulas (2A) are satisfied, and more preferably the following formulas (1B) and the following formulas (2B) are satisfied.
  • the following formula (1C) and the following formula (2C) are satisfied.
  • the depth L3 of the first recess 57, the length L1 between the first facing portion 55 and the first wiring 21, and the second facing portion 56 It can be sufficiently deep with respect to the length L2 between the second wiring 22 and the second wiring 22. Therefore, as shown in FIG. 2, the substantially flat magnetic particles in the vicinity of the first recess 57 in the second magnetic layer 51 can be sufficiently oriented with respect to the first recess 57. As a result, the Q value of the inductor 1 can be improved.
  • the lower limit of the ratio (L2 / L1) of the length L2 between the second facing portion 56 and the second wiring 22 to the length L1 between the first facing portion 55 and the first wiring 21 is preferably 0.7, for example. Is 0.9, and the upper limit is, for example, 1.3, preferably 1.1.
  • the length L4 between the fifth facing portion 75 and the first wiring 21, the length L5 between the sixth facing portion 76 and the second wiring 22, and the depth L6 of the third recess 77 are, for example, as follows.
  • the following formula (3) and the following formula (4) are satisfied, preferably the following formula (3A) and the following formula (4A) are satisfied, and more preferably the following formula (3B) and the following formula (4B) are satisfied. Also, for example, the following formula (3C) and the following formula (4C) are satisfied.
  • the formulas (1), (2), (3) and (4) are satisfied at the same time, and preferably, the formulas (1A), (2A) and (3A) are satisfied.
  • formula (4A) at the same time more preferably formula (1B), formula (2B), formula (3B) and formula (4B) are satisfied at the same time, and more preferably formula (1C), formula (2C). ), Equation (3C) and Equation (4C) are satisfied at the same time.
  • the lower limit of the ratio (L5 / L4) of the length L5 between the sixth facing portion 76 and the second wiring 22 to the length L4 between the fifth facing portion 75 and the first wiring 21 is, for example, 0.7. , Preferably 0.9, and the upper limit is, for example, 1.3, preferably 1.1.
  • the depth L3 of the first recess 57 and the depth L7 of the second recess 60 satisfy, for example, the following formula (5), preferably the following formula (5A), and more preferably. Satisfies the following formula (5B), and also satisfies, for example, the following formula (5C).
  • the depth L6 of the third recess 77 and the depth L8 of the fourth recess 80 satisfy, for example, the following formula (6), preferably the following formula (6A), and more preferably the following formula. (6B) is satisfied, and for example, the following formula (6C) is satisfied.
  • the depth L8 of the fourth recess 80 can be made sufficiently deeper than the depth L6 of the third recess 77. Therefore, as shown in FIG. 2, the substantially flat magnetic particles between the third recess 77 and the fourth recess 80 are sufficiently oriented along the third recess 77 and the deeply recessed fourth recess 80. Can be made to. As a result, the Q value of the inductor 1 can be improved.
  • the formulas (5) and (6) are satisfied at the same time, preferably the formulas (5A) and (6A) are satisfied at the same time, and more preferably the formulas ( 5B) and formula (6B) are satisfied at the same time, and more preferably, formula (5C) and formula (6C) are satisfied at the same time.
  • the Q value of the inductor 1 can be efficiently improved.
  • the length L1 between the first facing portion 55 and the first wiring 21 and the length L9 in the thickness direction of the first wiring 21 satisfy, for example, the following formula (7), and preferably the following formula. (7A) is satisfied, more preferably the following formula (7B) is satisfied, and for example, the following formula (7C) is satisfied.
  • the length L2 between the second facing portion 56 and the second wiring 22 and the length L10 in the thickness direction of the second wiring 22 satisfy, for example, the following formula (8), and preferably the following formula (8A). Satisfied, more preferably, the following formula (8B) is satisfied, and for example, the following formula (8C) is satisfied.
  • the length L4 between the third facing portion 58 and the first wiring 21 and the length L9 of the first wiring 21 satisfy, for example, the following formula (9), and preferably the following formula (9A). More preferably, the following formula (9B) is satisfied, and for example, the following formula (9C) is satisfied.
  • the length L5 between the fourth facing portion 59 and the second wiring 22 and the length L10 of the second wiring 22 satisfy the following formula (10), preferably the following formula (10A).
  • the following formula (10B) is satisfied, and for example, the following formula (10C) is satisfied.
  • the formulas (7), (8), (9) and (10) are satisfied at the same time, and the formula (7A) is preferable.
  • Formula (8A), formula (9A) and formula (10A) are satisfied at the same time, more preferably formula (7B), formula (8B), formula (9B) and formula (10B) are satisfied at the same time, and more preferably. Satisfies equation (7C), equation (8C), equation (9C) and equation (10C) at the same time. As a result, the Q value of the inductor 1 can be efficiently improved.
  • L1 to L10 The lengths of L1 to L10 described above are defined as follows.
  • the length L1 between the first facing portion 55 and the first wiring 21 is the shortest distance L1 between the first top portion 91 and the first wiring 21.
  • the length L2 between the second facing portion 56 and the second wiring 22 is the shortest distance between the second top portion 92 and the second wiring 22.
  • the depth L3 of the first recess 57 is the longest length L3 in the thickness direction from the line connecting the first top 91 and the second top 92 to the first bottom 38 of the first recess 57.
  • the length L4 between the fifth facing portion 75 and the first wiring 21 is the shortest distance L4 between the third top portion 93 and the first wiring 21.
  • the length L5 between the sixth facing portion 76 and the second wiring 22 is the shortest distance L5 between the fourth top portion 94 and the second wiring 22.
  • the depth L6 of the second recess 60 is the longest length L6 in the thickness direction from the line connecting the third top 93 and the fourth top 94 to the second bottom 44 of the third recess 77.
  • the depth L7 of the second recess 60 is the longest length L7 in the thickness direction from the line connecting the fifth top 86 and the sixth top 87 to the third bottom 63 of the second recess 60.
  • the depth L8 of the fourth recess 80 is the longest length L8 in the thickness direction from the line connecting the seventh top 88 and the eighth top 89 to the fourth bottom 64 of the fourth recess 80.
  • the lower limit of the Q value of the inductor 1 is, for example, 30, preferably 35, and more preferably 40.
  • the Q value is equal to or higher than the above-mentioned lower limit, the resistance component that causes loss is small, and therefore the inductance becomes high.
  • the upper limit of the Q value of the inductor 1 is not particularly limited, and it is preferable that the Q value is high.
  • the magnetic sheet 8 (described later) and the first wiring 21 and the second wiring 22 are hot-pressed by the first step (see FIG. 3) of preparing the hot press device 2 and the hot press device 2.
  • a second step (see FIG. 7) is provided.
  • the heat pressing device 2 is an isotropic pressure pressing device capable of isotropically heat pressing (isotropic pressure pressing) the magnetic sheet 8, the first wiring 21, and the second wiring 22 (see FIG. 4).
  • the heat pressing device 2 includes a first mold 3, a second mold 4, an inner frame member 5, an outer frame member 81, and a fluidity flexible sheet 6.
  • the heat pressing device 2 is configured so that the second mold 4, the inner frame member 5, and the outer frame member 81 are close to the first mold 3 and can be pressed (closely attached).
  • the first type 3 is immovable in the pressing direction of the heat pressing device 2.
  • Type 1 3 has a substantially plate shape.
  • the first mold 3 has a first press surface 61 facing the second mold 4 described below.
  • the first press surface 61 extends in a direction (plane direction) orthogonal to the press direction.
  • the first press surface 61 is flat.
  • the first type 3 includes a heater (not shown).
  • the second type 4 is separated from the first type 3 in the pressing direction.
  • the second mold 4 can move in the pressing direction with respect to the first mold 3.
  • the second type 4 has a substantially plate shape smaller than that of the first type 3.
  • the second type 4 is included in the first type 3 when projected in the pressing direction.
  • the second mold 4 overlaps the central portion in the plane direction of the first mold 3 when projected in the pressing direction.
  • the second mold 4 has a second press surface 62 facing the central portion of the first press surface 61 of the first mold 3 in the surface direction.
  • the second press surface 62 extends in the surface direction.
  • the second press surface 62 is parallel to the first press surface 61.
  • the second type 4 includes a heater (not shown).
  • the inner frame member 5 surrounds the second type 4. Although not shown in detail, the inner frame member 5 surrounds the entire circumference of the second type 4. Further, in the first step, the inner frame member 5 is separated from the peripheral end portion of the first mold 3 in the pressing direction. That is, in the first step, the inner frame member 5 is arranged to face the peripheral end portion of the first mold 3 at a distance in the pressing direction.
  • the inner frame member 5 integrally has a third press surface 98 facing the peripheral end of the first press surface 61 and an inner surface 99 facing inward. The inner frame member 5 is movable in the pressing direction with respect to both the first mold 3 and the second mold 4.
  • a seal member (not shown) is provided between the inner frame member 5 and the second type 4.
  • the seal member prevents the fluid flexible sheet 6 described below from entering between the inner frame member 5 and the second mold 4 during the relative movement of the inner frame member 5 and the second mold 4.
  • the outer frame member 81 surrounds the inner frame member 5. Although not shown in detail, the outer frame member 81 surrounds the entire circumference of the inner frame member 5. Further, in the first step, the outer frame member 81 is separated from the peripheral end portion of the first mold 3 in the pressing direction. That is, in the first step, the outer frame member 81 is arranged to face the peripheral end portion of the first mold 3 at a distance in the pressing direction.
  • the outer frame member 81 integrally has a contact surface 82 facing the peripheral end of the first press surface 61 and an inner surface surface 83 of the chamber facing inward. The outer frame member 81 is movable in the pressing direction with respect to both the first type 3 and the inner frame member 5.
  • the outer frame member 81 has an exhaust port 15.
  • the exhaust port 15 has an upstream end in the exhaust direction facing the inner end of the inner surface 83 of the chamber.
  • the exhaust port 15 is connected to the vacuum pump 16 via an exhaust line 46. In the first step, the exhaust line 46 is closed.
  • a seal member (not shown) is provided between the outer frame member 81 and the inner frame member 5.
  • a seal member prevents the second sealed space (described later) 45 from communicating with the outside during the relative movement of the outer frame member 81 and the inner frame member 5.
  • the fluid flexible sheet 6 has a substantially plate shape extending in the plane direction orthogonal to the pressing direction.
  • the fluidity flexible sheet 6 is arranged on the second press surface 62 of the second mold 4. Further, the fluidity flexible sheet 6 is also arranged on the inner side surface 99 of the inner frame member 5. More specifically, the fluid flexible sheet 6 is in contact with the entire surface of the second press surface 62 and the inner side surface 99 on the downstream side in the press direction.
  • a seal member (not shown) is provided between the fluid flexible sheet 6 and the inner side surface 99 of the inner frame member 5.
  • the inner frame member 5 is movable in the pressing direction with respect to the fluidity flexible sheet 6.
  • the material of the fluidity flexible sheet 6 is not particularly limited as long as it can exhibit fluidity and flexibility during hot pressing, and examples thereof include gels and soft elastomers.
  • the material of the fluid flexible sheet 6 may be a commercially available product, and examples thereof include an ⁇ GEL series (manufactured by Taica Corporation) and a Riken elastomer series (manufactured by RIKEN TECHNOS).
  • the thickness of the fluidity flexible sheet 6 is not particularly limited, and specifically, the lower limit of the thickness is, for example, 1 mm, preferably 2 mm, and the upper limit of the thickness is, for example, 1,000 mm, preferably 1,000 mm. , 100 mm.
  • the heat press device 2 is described in detail in, for example, Japanese Patent Application Laid-Open No. 2004-296746. Further, as the heat pressing device 2, a commercially available product can be used, and for example, a dry laminator series manufactured by Nikkiso Co., Ltd. is used.
  • the second step includes a third step, a fourth step, a fifth step, and a sixth step.
  • the third step, the fourth step, the fifth step, and the sixth step are carried out in order.
  • the first mold release sheet 14 is arranged on the first press surface 61 of the first mold 3.
  • the first release sheet 14 is smaller than the inner frame member 5 when projected in the thickness direction.
  • the first release sheet 14 includes, for example, a first release film 11, a cushion film 12, and a second release film 13 in this order toward the downstream side in the press direction.
  • the materials of the first release film 11 and the second release film 13 are appropriately selected according to the intended use and purpose, and are, for example, polyesters such as polyethylene terephthalate (PET), for example, polyolefins such as polymethylpentene (TPX) and polypropylene. Can be mentioned.
  • PET polyethylene terephthalate
  • TPX polyolefins
  • the thickness of the first release film 11 and the thickness of the second release film 13 are, for example, 1 ⁇ m or more, and for example, 1,000 ⁇ m or less, respectively.
  • the cushion film 12 includes a flexible layer. The flexible layer flows in the plane direction and the thickness direction during hot pressing in the second step.
  • the material of the flexible layer examples include a heat-fluid material that flows in the plane direction and the press direction by the heat press in the second step described later.
  • the thermofluid material contains, for example, an olefin- (meth) acrylate copolymer (ethylene-methyl (meth) acrylate copolymer, etc.), an olefin-vinyl acetate copolymer, or the like as a main component.
  • the thickness of the cushion film 12 is, for example, 50 ⁇ m or more, and for example, 500 ⁇ m or less.
  • a commercially available product can be used, and for example, a release film OT series (manufactured by Sekisui Chemical Co., Ltd.) is used.
  • the first release sheet 14 can include the cushion film 12, any one of the first release film 11 and the second release film 13, or may be only the cushion film 12.
  • the magnetic sheet 8, the first wiring 21, and the second wiring 22 are placed between the first release sheet 14 and the second release sheet 7 in the pressing direction. Set so that it overlaps with the fluidity flexible sheet 6 when projected onto.
  • the magnetic sheet 8 includes three types of magnetic sheets for forming the first magnetic layer 31, the second magnetic layer 51, and the third magnetic layer 71.
  • the magnetic sheet 8 includes a first sheet 65, a second sheet 66, and a third sheet 67.
  • the first sheet 65 is a magnetic sheet for producing the first magnetic layer 31.
  • the second sheet 66 is a magnetic sheet for producing the second magnetic layer 51.
  • the third sheet 67 is a magnetic sheet for producing the third magnetic layer 71.
  • Each of the first sheet 65, the second sheet 66 and the third sheet 67 is singular or plural.
  • the magnetic sheet 8 is made of the above-mentioned magnetic composition. In the magnetic composition forming the magnetic sheet 8, the thermosetting resin is B stage.
  • the magnetic sheet 8 can be temporarily fixed to the first wiring 21 and the second wiring 22 by a flat plate press including two parallel flat plates to produce the laminated body 48.
  • the second release sheet 7 is placed on the laminated body 48 (third sheet 67).
  • the second release sheet 7 has the same layer structure as the first release sheet 14.
  • the first release sheet 14 is smaller than the inner frame member 5 when projected in the thickness direction.
  • the outer frame member 81 is pressed against the peripheral end of the first press surface 61 of the first mold 3.
  • the contact surface 82 of the outer frame member 81 and the peripheral end portion of the first press surface 61 of the first mold 3 come into close contact with each other (preferably press).
  • the decompression space 85 is formed by the chamber inner side surface 83 of the outer frame member 81, the third press surface 98 and inner side surface 99 of the inner frame member 5, the second press surface 62 of the fluid flexible sheet 6, and the first mold 3. It is partitioned by a first press surface 61.
  • the inner side surface 83 of the chamber that partitions the decompression space 85 constitutes a chamber device together with the first type 3.
  • the pressure of the outer frame member 81 on the first mold 3 is set to such an extent that the airtightness of the decompression space 85, which will be described later, can be ensured by the close contact between the contact surface 82 and the first press surface 61. Specifically, it is 0.1 MPa or more and 20 MPa or less.
  • the first sealed space 84 is formed between the first type 3, the outer frame member 81, and the fluid flexible sheet 6.
  • the first closed space 84 is shielded from the outside.
  • the exhaust line 46 leads to the first closed space 84.
  • the second release sheet 7 and the fluid flexible sheet 6 are still spaced apart in the pressing direction.
  • the first closed space 84 is decompressed to form the decompression space 85.
  • the vacuum pump 16 is driven, and then the exhaust line 46 is opened. As a result, the pressure of the first closed space 84 communicating with the exhaust port 15 is reduced. As a result, the first closed space 84 becomes the decompression space 85.
  • the upper limit of the pressure in the decompression space 85 (or the exhaust line 46) is, for example, 100,000 Pa, preferably 10,000 Pa, and the lower limit is 1 Pa.
  • the inner frame member 5 is pressed against the peripheral end of the first press surface 61 of the first mold 3.
  • the third press surface 98 of the inner frame member 5 and the peripheral end portion of the first press surface 61 of the first mold 3 are brought into close contact with each other.
  • the pressure of the inner frame member 5 on the first mold 3 is such that the liquid flexible sheet 6 can be prevented from leaking to the outside in the sixth step described later due to the close contact between the third press surface 98 and the first press surface 61 described above. Specifically, it is 0.1 MPa or more and 50 MPa or less.
  • a second sealed space 45 surrounded by the first mold 3 and the fluid flexible sheet 6 in the pressing direction is formed inside the inner frame member 5.
  • the communication between the second closed space 45 and the exhaust line 46 is blocked by the inner frame member 5.
  • the second closed space 45 has the same degree of decompression (atmospheric pressure) as the decompression space 85 described above.
  • the second release sheet 7 and the fluid flexible sheet 6 are still separated from each other in the pressing direction.
  • the heaters contained in each of the first type 3 and the second type 4 are heated. Subsequently, the second mold 4 is moved in the pressing direction. Then, the fluid flexible sheet 6 approaches the second release sheet 7 as the second mold 4 moves.
  • the fluid flexible sheet 6 flexibly contacts everything except the peripheral end portion on the upstream side surface of the second release sheet 7 in the pressing direction. At this time, since the fluidity flexible sheet 6 has fluidity and flexibility, it follows the shapes of the first wiring 21 and the second wiring 22 together with the second release sheet 7. The fluid flexible sheet 6 is in close contact with the second release sheet 7.
  • the lower limit of the pressure of the hot press is, for example, 0.1 MPa, preferably 1 MPa, more preferably 2 MPa, and the upper limit is, for example, 30 MPa, preferably 20 MPa, more preferably 10 MPa.
  • the lower limit of the heating temperature is, for example, 100 ° C., preferably 110 ° C., more preferably 130 ° C.
  • the upper limit is, for example, 200 ° C., preferably 185 ° C., more preferably 175 ° C. ..
  • the lower limit of the heating time is, for example, 1 minute, preferably 5 minutes, more preferably 10 minutes, and the upper limit is, for example, 1 hour, preferably 30 minutes.
  • the magnetic sheet 8, the first wiring 21, and the second wiring 22 are pressed with equal pressure from both the thickness direction and the surface direction of the magnetic sheet 8.
  • the magnetic sheet 8, the first wiring 21, and the second wiring 22 are isotropically pressed.
  • the magnetic sheet 8 flows so as to bury the first wiring 21 and the second wiring 22. Further, the magnetic sheet 8 straddles between the adjacent first wiring 21 and the second wiring 22.
  • peripheral side surface 52 of the magnetic sheet 8 is pressed from the side (outside) to the inside by the fluid flexible sheet 6 and the second release sheet 7. Therefore, it is suppressed that the peripheral side surface 52 of the magnetic sheet 8 flows out.
  • the flow of the magnetic sheet 8 described above is the flow of the thermosetting resin of the B stage based on the heating of the heaters of the first type 3 and the second type 4, and the flow of the thermoplastic resin to be blended if necessary. to cause.
  • thermosetting resin becomes the C stage. That is, the first magnetic layer 31, the second magnetic layer 51, and the third magnetic layer 71 containing the magnetic particles and the cured body (C stage body) of the thermosetting resin are formed.
  • the first magnetic layer 31 that covers the first wiring 21 and the second wiring 22 so as to straddle the first wiring 21 and the second wiring 22 and the adjacent first wiring 21 and the second wiring 22.
  • the inductor 1 including the second magnetic layer 51 and the third magnetic layer 71 arranged on the first surface 33 and the second surface 34 of the first magnetic layer 31, respectively, are manufactured.
  • the inductor 1 is taken out from the heat press device 2. Subsequently, the inductor 1 is externally processed. For example, through holes 47 are formed in the second magnetic layer 51 and the first magnetic layer 31 corresponding to the longitudinal ends of the first wiring 21 and the second wiring 22. Specifically, the through hole 47 is formed by removing the corresponding second magnetic layer 51, the first magnetic layer 31, and the insulating film 24 with a laser, a perforator, or the like. The through hole 47 exposes a part of one side surface 26 of the lead wire 23.
  • a conductive member (not shown) or the like is arranged in the through hole 47, and the external device and the conducting wire 23 are electrically connected via the conductive connecting material such as solder, solder paste, or silver paste.
  • the conductive member includes plating.
  • the conductive member and the conductive connecting material are reflowed in the reflow process.
  • the inductor 1 includes a first magnetic layer 31 containing substantially spherical magnetic particles, and a second magnetic layer 51 and a third magnetic layer 71 containing substantially flat magnetic particles. Moreover, the relative magnetic permeability of each of the second magnetic layer 51 and the third magnetic layer 71 is higher than the relative magnetic permeability of the first magnetic layer 31. Therefore, the inductor 1 has a high inductance and is excellent in DC superimposition characteristics.
  • the second magnetic layer 51 has the first recess 57 and the second recess 60, in the region surrounded by the first recess 57 and the second recess 60 in the second magnetic layer 51, the magnetic particles having a substantially flat shape are formed. It can be efficiently oriented to the first recess 57 and the second recess 60.
  • the third magnetic layer 71 has the third recess 77 and the fourth recess 80, in the region surrounded by the third recess 77 and the fourth recess 80 in the third magnetic layer 71, the magnetic particles having a substantially flat shape are formed. It can be efficiently oriented to the third recess 77 and the fourth recess 80. Therefore, an excellent Q value can be obtained.
  • this inductor has high inductance and excellent DC superimposition characteristics, but also has an excellent Q value.
  • the depth L3 of the first recess 57 is set to the length between the first facing portion 55 and the first wiring 21. It can be made sufficiently deep with respect to L1 and the length L2 between the second facing portion 56 and the second wiring 22. Therefore, as shown in FIG. 2, the substantially flat magnetic particles in the vicinity of the first recess 57 in the second magnetic layer 51 can be sufficiently oriented with respect to the first recess 57. As a result, the Q value of the inductor 1 can be improved.
  • the depth L6 of the third recess 77 is set to the length between the fifth facing portion 75 and the first wiring 21. It can be sufficiently deep with respect to L4 and the length L5 between the sixth facing portion 76 and the second wiring 22. Therefore, the substantially flat magnetic particles in the vicinity of the third recess 77 in the third magnetic layer 71 can be sufficiently oriented with respect to the third recess 77. As a result, the Q value of the inductor 1 can be improved.
  • the depth L7 of the second recess 60 can be made sufficiently deeper than the depth L3 of the first recess 57. Therefore, as shown in FIG. 2, the substantially flat magnetic particles between the first recess 57 and the second recess 60 are sufficiently oriented along the first recess 57 and the deeply recessed second recess 60. Can be made to. As a result, the Q value of the inductor 1 can be improved.
  • the depth L8 of the fourth recess 80 can be made sufficiently deeper than the depth L6 of the third recess 77. Therefore, as shown in FIG. 2, the substantially flat magnetic particles between the third recess 77 and the fourth recess 80 are sufficiently oriented along the third recess 77 and the deeply recessed fourth recess 80. Can be made to. As a result, the Q value of the inductor 1 can be improved.
  • the length L1 between the first facing portion 55 and the first wiring 21 can be sufficiently lengthened with respect to the thickness direction length L9 of the first wiring 21. .. Therefore, the Q value of the inductor 1 can be improved while maintaining a high inductance of the inductor 1.
  • the length L2 between the second facing portion 56 and the second wiring 22 can be sufficiently lengthened with respect to the thickness direction length L10 of the second wiring 22. .. Therefore, the Q value of the inductor 1 can be improved while maintaining a high inductance of the inductor 1.
  • the length L4 between the third facing portion 58 and the first wiring 21 can be sufficiently lengthened with respect to the length L9 of the first wiring 21. Therefore, the Q value of the inductor 1 can be improved while maintaining a high inductance of the inductor 1.
  • a plurality of magnetic sheets 8 are heat-pressed at once, but although not shown, for example, each of the first sheet 65, the second sheet 66, and the third sheet 67 is heat-pressed in order. You can also do it.
  • the inductor 1 is manufactured by the heat pressing apparatus 2 shown in FIG. 3, but if the second concave portion 60 can be formed in the second magnetic layer 51 and the fourth concave portion 80 can be formed in the third magnetic layer 71,
  • the manufacturing apparatus is not particularly limited.
  • the flat plate press cannot form the second recess 60 and the fourth recess 80 described above, and each of the fourth surface 54 and the sixth surface 74 becomes flat, so that it is not suitable for this embodiment.
  • the inductor 1 can further include a functional layer 95 that does not contain magnetic particles.
  • the functional layer 95 includes a first functional layer 96 arranged on the fourth surface 54 of the second magnetic layer 51 and a second functional layer 97 arranged on the sixth surface 74 of the third magnetic layer 71.
  • the first functional layer 96 and the second functional layer 97 are, for example, resin layers made of only resin.
  • Both the one surface in the thickness direction of the first functional layer 96 and the other surface in the thickness direction of the second functional layer 97 are flat surfaces.
  • One surface in the thickness direction of the first functional layer 96 and / or the other surface in the thickness direction of the second functional layer 97 is provided as, for example, a pickup surface of a suction (suction) type pickup device.
  • the functional layer 95 may be a barrier layer that suppresses the permeation of water and / oxygen. According to this, it is possible to prevent the second magnetic layer 51 and the third magnetic layer 71 from being corroded by the barrier layer.
  • Each of the first wiring 21 and the second wiring 22 may have a substantially rectangular cross-sectional view, such as a substantially rectangular cross-sectional view, although not shown, for example.
  • Preparation Example 1 Binder by mixing 24.5 parts by mass of epoxy resin (main agent), 24.5 parts by mass of phenol resin (curing agent), 1 part by mass of imidazole compound (curing accelerator), and 50 parts by mass of acrylic resin (thermoplastic resin). was prepared.
  • Example 1 As shown in FIG. 3, first, a dry laminator (manufactured by Nikkiso Co., Ltd.) was prepared as the above-mentioned heat pressing device 2 (implementation of the first step).
  • the magnetic particles and the binder of Preparation Example 1 were blended and mixed so as to have the volume ratios shown in Table 1, and the first sheet 65, the second sheet 66 and the third sheet 67 (magnetic sheet 8) were added. They were prepared so as to have the types and volume ratios of the magnetic particles shown in Table 1, respectively.
  • the first wiring 21 having an L9 of 260 ⁇ m and the second wiring 22 having an L10 of 260 ⁇ m were sandwiched between the magnetic sheets 8 described above, and a laminated body 48 was produced by a flat plate press.
  • the distance L0 between the first wiring 21 and the second wiring 22 was 240 ⁇ m.
  • the conditions for the flat plate press were a temperature of 110 ° C. for 1 minute and a pressure of 0.9 MPa (2 kN in gauge pressure).
  • the outer frame member 81 was brought into close contact with the first mold 3 to form the first closed space 84.
  • the vacuum pump 16 was driven to depressurize the first closed space 84 to form the decompression space 85 (fourth step).
  • the air pressure in the decompression space 85 was 2666 Pa (20 torr).
  • the inner frame member 5 was pressed into the first mold 3 to form a second closed space 45 of 2666 Pa, which was smaller than the decompression space 85 (fifth step).
  • the second mold 4 is brought closer to the first mold 3, and the magnetic sheet 8 and the first release sheet 8 are passed through the fluid flexible sheet 6, the second release sheet 7, and the first release sheet 14.
  • the first wiring 21 and the second wiring 22 were hot-pressed (sixth step).
  • the temperature of the hot press is 170 ° C. and the time is 15 minutes.
  • the pressure of the hot press is as shown in Table 1.
  • the inductor 1 including the first wiring 21, the second wiring 22, the first magnetic layer 31, the second magnetic layer 51, and the third magnetic layer 71 was manufactured.
  • Example 2 The inductor 1 was produced in the same manner as in Example 1 except that the thicknesses of the first sheet 65, the second sheet 66, and the third sheet 67 were changed as shown in Table 2.
  • Comparative Example 1 As shown in Table 3, except that the first sheet 65, the second sheet 66, and the third sheet 67 were heat-pressed by using a flat plate press device instead of the heat press device 2 shown in FIGS. 3 to 7. , The inductor 1 was manufactured in the same manner as in Example 1.
  • the shapes of the second magnetic layer 51 and the third magnetic layer 71 were observed.
  • the second magnetic layer 51 had a second recess 60.
  • the third magnetic layer 71 had a fourth recess 80.
  • the shape of the inductor 1 of Comparative Example 1 was observed.
  • the second magnetic layer 51 did not have the second recess 60, and the fourth surface 54 was flat.
  • the third magnetic layer 71 did not have the fourth recess 80, and the sixth surface 74 was flat.
  • ⁇ Inductance> The inductances of the first wiring 21 and the second wiring 22 of the inductor 1 in each Example and Comparative Example were measured. The inductance at a frequency of 10 MHz was evaluated according to the following criteria. In the measurement, an impedance analyzer (manufactured by Agilent, "4291B") was used. [Criteria] ⁇ : The inductance was 250 nH or more.
  • the DC superimposition characteristic was evaluated by measuring the inductance reduction rate of the inductor 1 in each Example and Comparative Example at a frequency of 10 MHz.
  • An impedance analyzer manufactured by Kuwagi Electronics Co., Ltd., "65120B" was used for the measurement of the inductance reduction rate.
  • the inductance reduction rate was evaluated according to the following criteria. [Inductance without applying DC bias current-Inductance with DC bias current 10A applied] / [Inductance with DC bias current 10A applied] x 100 (%) [Criteria] ⁇ : The inductance reduction rate with respect to Comparative Example 1 was 30% or less.
  • ⁇ Q value> The inductor 1Q value in each Example and Comparative Example was measured.
  • the Q value was evaluated according to the following criteria. In the measurement, an impedance analyzer (manufactured by Agilent, "4291B") was used. [Criteria] ⁇ : The Q value was 30 or more. X: The Q value was less than 30.
  • Inductors are used for various purposes.

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US17/633,453 US12255005B2 (en) 2019-08-09 2020-06-19 Inductor
CN202511494512.2A CN121260652A (zh) 2019-08-09 2020-06-19 电感器
KR1020227003575A KR102786140B1 (ko) 2019-08-09 2020-06-19 인덕터
EP20852096.5A EP4012732B1 (en) 2019-08-09 2020-06-19 Inductor
CN202080056602.2A CN114207751B (zh) 2019-08-09 2020-06-19 电感器
US19/046,079 US20250182951A1 (en) 2019-08-09 2025-02-05 Inductor

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