WO2021027975A1 - 自助贴膜机以及其贴膜方法 - Google Patents

自助贴膜机以及其贴膜方法 Download PDF

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Publication number
WO2021027975A1
WO2021027975A1 PCT/CN2020/115699 CN2020115699W WO2021027975A1 WO 2021027975 A1 WO2021027975 A1 WO 2021027975A1 CN 2020115699 W CN2020115699 W CN 2020115699W WO 2021027975 A1 WO2021027975 A1 WO 2021027975A1
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WO
WIPO (PCT)
Prior art keywords
film
electronic device
component
protective film
protective
Prior art date
Application number
PCT/CN2020/115699
Other languages
English (en)
French (fr)
Inventor
陈冠华
Original Assignee
深圳市邦尼贴智能科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201910750660.4A external-priority patent/CN110497610B/zh
Priority claimed from CN202010059167.0A external-priority patent/CN111231296B/zh
Application filed by 深圳市邦尼贴智能科技有限公司 filed Critical 深圳市邦尼贴智能科技有限公司
Publication of WO2021027975A1 publication Critical patent/WO2021027975A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
    • B29C31/08—Feeding of the material to be moulded, e.g. into a mould cavity of preforms to be moulded, e.g. tablets, fibre reinforced preforms, extruded ribbons, tubes or profiles; Manipulating means specially adapted for feeding preforms, e.g. supports conveyors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B33/00—Packaging articles by applying removable, e.g. strippable, coatings
    • B65B33/02—Packaging small articles, e.g. spare parts for machines or engines

Definitions

  • the invention relates to the field of film sticking of electronic equipment, in particular to a self-service film sticking machine and a film sticking method thereof.
  • the film can improve the wear resistance and fall resistance of the electronic device and protect the electronic device. Therefore, it is necessary to apply a film to these electronic devices, such as the screen of a mobile phone.
  • the films used are hard protective films, such as the popular tempered film.
  • the film When the film is applied to the electronic equipment by the film machine, it is carried out in the atmosphere.
  • the protective film When the film is applied, the protective film and It is easy to have bubbles between electronic devices and cause the film to fail; therefore, in order to make the protective film close to the electronic screen without bubbles, it is often necessary to use a pressure roller to press the protective film on the surface of the electronic device.
  • the present invention provides a self-service film sticking machine and a film sticking method thereof.
  • a self-service film application method for self-service application of protective film to electronic equipment includes a film application mechanism, the film application mechanism includes a film removal component And the filming component
  • the method of filming includes the following steps: filming step 1: take the film component to pick up the protective film, and move the protective film to the upper part of the electronic device; filming step 2: take the film component and tilt the protective film at an angle c relative to the electronic device And one end is in contact with the electronic device; and the film sticking step 3: the film sticking component presses the end of the protective film for a preset period of time t; the protective film moves down to cover the electronic device.
  • the film sticking component is arranged directly above the end contacting the protective film and the electronic device in the film sticking step 2.
  • the film taking component is moved from the side of the plane where the electronic device and the film sticking component are located to the upper part of the electronic device.
  • the specific method is: the film-taking component inclines the protective film at an angle c relative to the electronic device, and continuously moves downward toward the electronic device until one end of the protective film touches the electronic device and stops; Or, after the film assembly is moved down the protective film by a preset distance, the protective film is inclined at an angle c relative to the electronic device until one end of the protective film touches the electronic device and stops.
  • step 3 of sticking the film when the sticking component immediately presses the end of the protective film for a preset time period t, the specific method is: the sticking component moves to the plane where the protective film and the electronic device are in contact; When the end of the film contacting the electronic device faces the other end, the film sticking component moves a preset distance of d and stops moving; to press the end of the protective film contacting the electronic device, the preset duration of pressing is t.
  • the specific method for moving the protective film downward to cover the electronic device is: taking the film component to loosen the protective film so that it moves downward to cover the electronic device under the reaction force of elastic deformation.
  • it further includes a film sticking step 4, in which the film sticking component moves from one end of the protective film to the other end until it passes through the entire protective film.
  • the specific method for releasing the protective film of the film-taking module is as follows: the film-taking module drives the protective film to move in a direction away from the electronic device, when the driving force provided by the film-taking module and/or the elasticity of the protective film makes the protective film insufficient When protecting the film, the protective film is detached from the film removal assembly.
  • the film taking component is moved out of the plane where the electronic device and the film sticking component are located.
  • the time period t is within 1 to 5 seconds.
  • a self-service film sticking machine includes a film taking component, the film taking component includes a driving part and a fixed part that are rotatably connected; the driving part further includes a hinge, an angle Adjust the cylinder, the fixed shaft, and the telescopic rod; the fixed part is used to contact the protective film and fix the protective film, the driving part can control the rotation of the fixed part; the driving part specifically controls the rotation of the fixed part: the fixed part is through the hinge and the fixed shaft Hinge connection, the angle adjustment cylinder can control the expansion and contraction of the telescopic rod. One end of the telescopic rod is fixed, and the other end is also hinged or fixedly connected to the fixed part. The angle adjustment cylinder controls the extension and contraction of the telescopic rod, thereby controlling the rotation of the fixed part. angle.
  • the self-service film sticking machine provided by the present invention has the following beneficial effects:
  • the present invention uses the fixed part of the film-taking module to fix the protective film, and the protective film and the electronic device are placed at an angle through the driving part. At the same time, it abandons the previous method of integrating the film-sticking mechanism and the film-taking structure. After one end of the protective film touches the electronic device, the film sticking component will pre-press the end of the protective film for a period of time.
  • the advantage of this is that one end of the protective film is fixed on the electronic device first, so that the subsequent sticking mechanism is In the process of moving and pressing the entire protective film, the protective film will not produce relative displacement due to the friction of the filming mechanism, resulting in misalignment, displacement, and bubbles in the electronic equipment.
  • the end of the protective film when the end of the protective film is pre-pressed After a period of time, the fixed part directly releases the protective film, and the protective film will instantly cover the electronic equipment due to the elastic deformation restoring force. It is easy for people in the industry to understand that usually when the film is applied or the film on the When the adhesive layer is peeled off, in order to reduce the influence of the surrounding air as soon as possible and prevent foaming during the filming, the film is usually peeled or pasted at a faster speed.
  • the present invention solves the problem of hard film sticking, because hard film is different from soft film; the past soft film is flexible because of its own flexibility. And it is not easy to slip, and only needs to be pressed by a pressing roller, while the hard film is difficult to achieve in automatic attachment.
  • the present invention cleverly uses the characteristic of the elastic deformation of the hard film to make the film After one end of the protective film is held for a period of time, the protective film and the electronic equipment are fully attached, ensuring that the protective film and the electronic equipment have sufficient adhesion and not easy to slip, and then use the elasticity of the hard film Quickly cover the electronic equipment, so as to quickly drive away the air, thereby realizing the automatic attachment of the hard film.
  • the filming component is set directly above the end where the protective film and the electronic device are in contact, and the film removing component is moved from the side of the plane where the electronic device and the filming component are located to the upper part of the electronic device, preventing the film removing component and the filming component from working They collide with each other, and the film-sticking components are directly arranged directly above the end where the protective film and the electronic device are in contact, which reduces the working stroke of the film-sticking components, thus simplifying the process and saving costs and energy consumption.
  • the film-sticking component is used to press the end of the film.
  • the film-sticking component is first moved to the plane where the protective film and the electronic device are in contact, and then along the protective film and In the direction from one end of the electronic device to the other end, the distance of the film component moving d stops, so it is similar to the rolling method.
  • the advantage of this method is that first, the method is used to press the end of the protective film and the electronic device. The tightening effect is better, which makes the contact between the protective film and the electronic device closer.
  • the second is that the size of the electronic device and the protective film is not fixed. This type of method can adjust the distance value of d to target different Electronic equipment and protective film meet the needs of different users and increase the versatility of the film application method of the self-service film application machine.
  • the protective film is loosened by the film-taking module.
  • the protective film is driven by the film-taking module to move in the direction away from the electronic device.
  • the protective film can be loosened only by moving in a single direction, simplifying the process and saving cost and energy. Consumption.
  • the present invention utilizes the elastic deformation characteristics of the protective film to cover the electronic device downward when the protective film is loosened by the film removing component, so as to prevent foaming when the film is attached.
  • the film sticking component will move from one end of the protective film to the other end, so that while the air bubbles on the protective film and the surface of the electronic device are discharged, the protective film is pressed tightly on the surface of the electronic device to be tested.
  • the film taking component While moving from this end to the other end of the protective film through the filming component, the film taking component is moved out from the side of the plane where the electronic equipment and the filming component are located, preventing the film taking component and the filming component from colliding with each other during work, and the filming
  • the membrane module is removed at the same time, which increases the operating timeliness and improves the operating efficiency within a certain production time.
  • the driving part of the control fixing part of the self-service film sticking machine includes a hinge, an angle adjustment cylinder, a fixed shaft, and a telescopic rod.
  • the angle adjustment cylinder makes the telescopic rod extend, so that the fixed part with the protective film is rotated , That is, one end of the fixing part is inclined downward, so that the corresponding end of the protective film is attached to the electronic device.
  • Fig. 1 is a three-dimensional structural diagram of a self-service film sticking machine in a first state according to a first embodiment of the present invention.
  • Fig. 2 is a three-dimensional structural diagram of the self-service film sticking machine in the second state of the first embodiment of the present invention.
  • FIG. 3 is a schematic structural view of the self-service film sticking machine in the first embodiment of the present invention with the outer casing removed from the first perspective;
  • Fig. 4 is a partial enlarged schematic diagram of the structure in Fig. 3;
  • Figure 5 is a schematic structural view of the feeding mechanism in the self-service film sticking machine according to the first embodiment of the present invention.
  • Figure 6 is a schematic structural view of a baffle in the self-service film sticking machine according to the first embodiment of the present invention.
  • Figure 7 is a schematic structural view of a cleaning mechanism in a self-service film sticking machine according to the first embodiment of the present invention.
  • FIG. 8 is a schematic structural view of the second embodiment of the self-service film sticking machine with the outer casing removed from the second perspective of the present invention
  • FIG. 9 is a schematic structural view of a film taking component in a self-service film sticking machine according to a second embodiment of the present invention from a first perspective;
  • FIG. 10 is a schematic structural view of a second view angle of the film taking component in the self-service film sticking machine according to the second embodiment of the present invention.
  • FIG. 11 is a schematic diagram of the structure of the protective film in the self-service film sticking machine according to the second embodiment of the present invention.
  • FIG. 12 is a schematic view of the structure of the self-service film sticking machine in the second embodiment of the present invention with the outer casing removed from a third perspective;
  • FIG. 13 is a schematic diagram of the film tearing step 1 of the self-service film sticking machine according to the second embodiment of the present invention.
  • FIG. 14 is a schematic diagram of the tearing step 2 of the self-service film sticking machine in the second embodiment of the present invention.
  • 15 is a schematic diagram of the film tearing step 3 of the self-service film sticking machine according to the second embodiment of the present invention.
  • 16 is a schematic diagram of the structure of the self-service film sticking machine according to the second embodiment of the present invention with the outer casing removed from a fourth perspective;
  • Fig. 17 is an enlarged schematic diagram of the position G in Fig. 16 corresponding to the filming step 1;
  • Fig. 18 is an enlarged schematic diagram of the position G in Fig. 16 corresponding to the filming step 2;
  • Fig. 19 is an enlarged schematic diagram of the position G in Fig. 16 corresponding to the filming step 3;
  • FIG. 20 is an enlarged schematic diagram of the position G in FIG. 16 after step 4 of sticking the film;
  • Fig. 21 is a partial structural diagram of a film sticking component in a self-service film sticking machine according to a second embodiment of the present invention.
  • Fig. 22 is a flowchart of the film sticking method of the self-service film sticking machine in the second embodiment of the present invention.
  • the peeling method of a self-service film sticking machine provided by the present invention is mainly suitable for self-service film sticking of electronic equipment that needs to be sticked, that is, automatically sticking a protective film on the electronic device, such as: automatically sticking a tempered film to a mobile phone; Solve the existing inconvenience caused by manual film sticking, so as to help industrial intelligent production, and good quality control when casting film.
  • the first embodiment of the present invention provides a self-service film sticking machine 10, which is used for self-service film sticking on electronic device A, that is, a protective film B is pasted on electronic device A to protect the electronic device A.
  • the self-service film sticking machine 10 includes a feeding mechanism 100, a positioning mechanism 300, a film sticking mechanism 700, and a supporting mechanism 900.
  • the supporting mechanism 900 is used to provide support for the feeding mechanism 100, positioning mechanism 300, and sticking mechanism 700.
  • the feeding mechanism 100 It is used for transmitting the electronic device A, the positioning mechanism 300 is used for positioning the electronic device A, and the film sticking mechanism 700 automatically sticks a film on the electronic device A according to the positioning information obtained by the positioning mechanism 300.
  • the self-service film sticking machine 10 When using the self-service film sticking machine 10 to self-stick the electronic device A, first, the user puts the electronic device A into the feeding mechanism 100, and the feeding mechanism 100 transfers the electronic device A to the set position; then, the positioning mechanism 300 pairs The electronic device A performs positioning; then, the film sticking mechanism 700 picks up the protective film B in the self-sticking machine 10, and sticks the protective film B to the electronic device A according to the positioning information obtained by the positioning mechanism 300; finally, the feeding mechanism 100
  • the electronic device A is transmitted from the self-service filming machine 10 to complete the self-service filming operation.
  • the self-service film sticking machine 10 is used to apply the film to the electronic device A.
  • the user does not need to master the filming skills, and only needs to put the electronic device A into the feeding mechanism 100, and the film can be completely applied by the self-service film sticking machine 10, which is more convenient. Smarter.
  • the electronic device A includes but is not limited to mobile phones, tablets, displays, etc.
  • the protective film B includes but is not limited to tempered film, privacy film, matte film, etc.
  • the protective film B is previously stored in the self-sticking film In the machine 10, when the user performs self-sticking, the film sticking mechanism 700 directly picks up the protective film B from the self-sticking machine 10.
  • the supporting mechanism 900 includes an outer shell 901 and a supporting platform 903.
  • the outer shell 901 is surrounded by the supporting platform 903 and the supporting platform 903 is fixed to the shell.
  • the feeding mechanism 100 is arranged on the supporting platform 903.
  • the outer casing 901 is provided with an opening 902 and a display screen 905, the feeding mechanism 100 is provided in the outer casing 901, and the position corresponds to the opening 902 for putting in or holding
  • the electronic device A is output, and the display screen 905 is used to display the filming process and advertising.
  • the opening 902 is also provided with a baffle 103, the size of the baffle 103 is adapted to the size of the opening 902, and can be magnetically attracted to the opening 902 of the outer shell 901 to close the opening 902, thereby Preventing dust and other dirt from entering the outer shell 901 through the opening 902 can also prevent personnel from being injured due to misoperation during the film sticking process.
  • the outer housing 901 is also provided with a Hall switch (not shown).
  • the positioning mechanism 300 recognizes the electronic device A conveyed by the feeding mechanism 100
  • the baffle 103 is magnetically attracted to the outer housing.
  • the Hall switch is triggered and the self-service film sticking machine 10 starts to stick the film;
  • the positioning mechanism 300 does not recognize the electronic device A delivered by the feeding mechanism 100, or the baffle 103 is not adsorbed on the outer shell 901 ,
  • the Hall switch cannot be triggered, the self-service filming machine 10 does not perform filming work, and the display screen 905 displays the reason for not performing filming work.
  • the shape of the opening 902 and the baffle 103 may be oval, circular, racetrack, rectangular, and the like.
  • the feeding mechanism 100 includes a feeding guide rail 101, a placing board 102 and a feeding driving member 104.
  • the placing board 102 is arranged on the feeding guide rail 101 and can slide on the feeding guide rail 101.
  • the feeding driving member 104 is arranged on one side of the feeding rail 101 and connected with the placing board 102 to drive the placing board 102 to move on the feeding rail 101.
  • the feeding guide rail 101 may be a screw rod, a sliding rail, etc.; the feeding driving member 104 may be an air cylinder, a motor, or the like.
  • the placement board 102 is provided with a non-slip layer to prevent the electronic device A from sliding after being placed on the placement board 102, so as to prevent the electronic device A from sliding on the placement board 102 when the film is attached.
  • the non-slip layer is also provided with a dimension line 1021, and the user places the electronic device A to be filmed on the placement board 102 according to the dimension line 1021 to make the film more precise, and the dimension line 1021 is at least comparable to two different sizes Electronic device A adapts.
  • the size line 1021 is an auxiliary line that matches the size of the electronic device A.
  • the placement plate 102 moves on the feeding guide 101 and extends from the opening 902, and the baffle 103 is magnetically attracted to the placement plate 102 and follows the placement plate 102 from the opening. 902 is removed, and the electronic device A can be put into the placing board 102 at this time; further, the feeding drive 104 drives the placing board 102 to transfer the electronic device A to the outer housing 901 for positioning.
  • the baffle 103 reaches the opening At the position of 902, it is attracted to the outer housing 901 by magnetism, and the opening 902 is closed.
  • baffle 103 is magnetic and/or the outer shell 901 and the placement plate 102 are magnetic.
  • a positioning hole 1031 is provided on the side of the baffle 103 close to the placing plate 102, and a positioning protrusion 1022 is provided on the side of the placing plate 102 close to the baffle 103.
  • the positioning protrusion 1022 is magnetically engaged with the positioning hole 1031 to prevent the baffle 103 from shaking.
  • the positioning mechanism 300 includes a first identification device 301, an infrared identification device 302, and a film identification device 303.
  • the first identification device 301 and the infrared identification device 302 are both installed in the outer housing 901, and the first identification device 301 and the infrared identification device 302 are located Both correspond to the feeding guide rail 101, so that when the feeding drive 104 drives the placement plate 102 to transfer the electronic device A to the position corresponding to the first identification device 301, the first identification device 301 obtains the first information of the electronic device A by taking a photo,
  • the infrared recognition device 302 obtains the second information of the electronic device A through infrared rays, and the film recognition device 303 is set on the film application mechanism 700.
  • the film sticking recognition device 303 acquires the position of the protective film B so that the film sticking mechanism 700 picks up the protective film B and sticks it on the electronic device A.
  • the first identification device 301 may be any one of a digital camera and an industrial camera to obtain the first information of the electronic equipment by taking pictures;
  • the infrared identification device 302 may be an infrared camera to obtain the information of the electronic equipment through infrared rays.
  • the film-sticking identification device 303 can be any one of a digital camera or an industrial camera, so as to obtain the position of the protective film B by taking pictures, and attach the picked-up protective film B to the electronic device A.
  • the first information includes the position, size, and screen integrity of the electronic device A
  • the second information includes the position of the black frame on the screen. That is, the first identification device 301 detects whether the position of the electronic device A is aligned with the dimension line 1021 in the placement board 102, specifically which dimension line 1021 in the placement board 102 is aligned, to obtain the position and size of the electronic device A, and simultaneously detect Whether the screen of the electronic device A is broken or cracked to obtain the integrity of the screen; the infrared recognition device 302 detects the position of the black frame on the screen of the electronic device A by infrared rays, and then determines the center of the screen according to the position of the black frame to make the film The mechanism 700 performs the filming operation according to the center of the screen, so that the protective film B is more accurately attached to the screen of the electronic device A.
  • the black frame on the screen is the actual size of the screen of the electronic device A.
  • the black frame on the screen can be observed with the naked eye.
  • the black screen and the black frame are the same.
  • the black frame cannot be observed by the naked eye, and infrared rays can distinguish the black frame from the black screen, and then the center of the screen can be determined according to the black frame.
  • the first identification device 301 and the infrared identification device 302 correspond to the same position of the feeding guide 101, so that when the electronic device A is transferred to the corresponding position of the first identification device 301, the first identification device 301 obtains the first information of electronic device A, and without the need to move electronic device A, obtains the second information of electronic device A through infrared recognition device 302, so as to make the obtained second information more accurate, and to make the protective film B is more accurately attached to the screen.
  • the self-service film sticking machine 10 further includes a cleaning mechanism 500, the cleaning mechanism 500 is arranged in the outer shell 901 near the opening 902, and the cleaning mechanism 500 Located above the feeding rail 101, the cleaning mechanism 500 cleans the screen of the electronic device A according to the first information and the second information obtained by the first identification device 301 and the infrared identification device 302.
  • the cleaning mechanism 500 includes a cleaning guide 501 , A cleaning assembly 502 and a cleaning drive 503, the cleaning drive 503 is located at one end of the cleaning guide 501, the cleaning assembly 502 is connected with the cleaning guide 501, the cleaning drive 503, so that the cleaning assembly 502 can move along the cleaning guide 501 under the action of the cleaning driving member 503.
  • the cleaning guide rail 501 may be a screw rod, a sliding rail, etc.; the cleaning driving member 503 may be a motor, an air cylinder, or the like.
  • the cleaning assembly 502 includes a fixed bracket 5023, a first cleaning roller 5021, and a second cleaning roller 5022.
  • the first cleaning roller 5021 and the second cleaning roller 5022 are sequentially installed on the fixed support 5023.
  • the fixing bracket 5023 is in the shape of "n". Both sides of the fixing bracket 5023 are provided with a mounting hole 50231 and a mounting portion 50232 in sequence.
  • the first cleaning roller 5021 is mounted on the fixing bracket 5023 through the mounting hole 50231.
  • the second cleaning roller 5022 is mounted on the fixed support 5023 through the mounting portion 50232, and the second cleaning roller 5022 can move on the fixed support 5023 along the mounting portion 50232.
  • due to the The mounting portion 50232 is disposed on the mounting hole 50231, so under the action of gravity, the second cleaning roller 5022 is always tangent to the first cleaning roller 5021 through the mounting portion 50232.
  • the mounting portion 50232 may be a waist hole or a sliding track.
  • Both the first cleaning roller 5021 and the second cleaning roller 5022 have viscosity, and the viscosity of the second cleaning roller 5022 is greater than that of the first cleaning roller 5021, and the second cleaning roller 5022 includes an adhesive tape 50221 and roller 50222.
  • the adhesive tape 50221 is curled on the roller 50222.
  • the first cleaning roller 5021 may be a roller with adhesiveness, or a combination of an adhesive tape and a roller.
  • the length f of the first cleaning roller 5021 and the second cleaning roller 5022 may be 90-220 mm, and further, the length f of the first cleaning roller 5021 and the second cleaning roller 5022 may also be 100-110 mm, Since most of the existing electronic devices A have a width less than 100 mm, the first cleaning roller 5021 and the second cleaning roller 5022 adopt a length f of 100-110 mm, which is suitable for most use occasions, and also Will not cause waste due to excessive length.
  • the diameter g of the second cleaning roller 5022 is 2 to 4 times the diameter g of the first cleaning roller 5021, and further, the diameter g of the second cleaning roller 5022 can also be the diameter g of the first cleaning roller 5021 2.5 to 3.5 times, this design can make the second cleaning roller 5022 use longer, without manual frequent maintenance, saving labor costs, and because the second cleaning roller 5022 interacts with the first cleaning roller 5022 by gravity
  • the cleaning roller 5021 is attached to the larger diameter g, and the weight of the second cleaning roller 5022 is relatively larger. Therefore, the attachment to the first cleaning roller 5021 is also tighter to better clean the place.
  • the first cleaning roller 5021 is described.
  • the cleaning driver 503 drives the cleaning assembly 502 to move along the cleaning guide 501 to a set position, that is, the cleaning driver 503 drives the cleaning assembly 502 along the cleaning
  • the guide rail 501 moves until the first cleaning roller 5021 is in contact with the surface of the electronic device A and remains at this position, and then the placing plate 102 drives the electronic device A to move, the first cleaning roller 5021 contacts the electronic device A, and the electronic device A moves and drives it
  • the first cleaning roller 5021 rotates, and the rotation of the first cleaning roller 5021 drives the second cleaning roller 5022 to rotate in the reverse direction, so that the first cleaning roller 5021 cleans the dirt on the surface of the electronic device A, and the second cleaning roller 5022 cleans the first cleaning roller
  • the dirt on the surface of 5021 until the first cleaning roller 5021 cleans from one end of the electronic device A to the other end.
  • the cleaning driving member 503 drives the cleaning assembly 502 to move along the cleaning guide 501 in a direction away from the electronic device A until it returns. This completes the cleaning work.
  • the cleaning assembly 502 By connecting the cleaning assembly 502 with the cleaning guide 501, the cleaning assembly 502 can be made more stable during movement and staying, and it is not easy to shake, so that the surface of the electronic device A can be effectively prevented from scratching.
  • the cleaning guide 501 may be omitted, and the cleaning driving member 503 is directly connected to the fixed bracket 5023 to drive the fixed bracket 5023 to move, so that the first cleaning roller 5021 cleans the dirt on the surface of the electronic device A.
  • the film sticking mechanism 700 also includes a film taking component 702 and a film sticking component 704.
  • the film taking component 702 is used to pick up the protective film B and drive the protective film B to move to a position corresponding to the sticking component 704.
  • the sticking component 704 is set in the feeding material.
  • the upper side of the guide rail 101 and the position corresponding to the placement plate 102 to press and fit the protective film B to the screen of the electronic device A.
  • the present invention completes the filming operation through the cooperation of the film removing component 702 and the filming component 704.
  • the film sticking mechanism 700 further includes a film taking guide 701 and a sticking film guide 707. Both the film taking guide 701 and the sticking guide 707 are fixed on the supporting platform 903.
  • the film taking component 702 can move on the film taking guide 701. 704 can move on the filming guide 707.
  • the film taking guide 701 includes a first X-axis guide 7011, a first Y-axis guide 7012 and a first Z-axis guide 7013, each of which controls the movement on the X/Y/Z axis.
  • the first X-axis guide 7011, the first Y-axis guide 7012 and the first Z-axis guide 7013 are all connected by sliding, and the film assembly 702 is arranged on the first Z-axis guide 7013, so as to realize the film assembly 702 in Movement in the X/Y/Z axis direction;
  • the filming guide 707 and the filming assembly 704 are fixedly connected, the filming guide 707 includes a second X-axis guide 7071 and/or a second Y-axis guide and a second Z-axis guide 7072, and the filming assembly 704 and the first One of the two X-axis guide rails 7071 and/or the second Y-axis guide rail and the second Z-axis guide rail 7072 is fixedly connected to realize the movement of the film taking component 702 in the X-axis and/or Y-axis and Z-axis directions.
  • the film-taking guide rail 701 and the film-sticking guide rail 707 are the same group of guide rails, and the film-sticking assembly 704 is realized by a group of guide rails. And take the movement of the membrane assembly 702.
  • the film sticking mechanism 700 further includes a film storage component 703, which includes at least two sets of limit blocks 7031, and each set of the limit blocks 7031 encloses each other to form placement areas of different sizes (not labeled) In order to form a film storage cavity, to place different sizes of protective film B.
  • the size of the protective film B should be adapted to each other, so that the protective film B can be placed in the placement area enclosed by the limit block 7031.
  • the limit Block 7031 is in 12 groups, and 12 placement areas are formed to place 12 different sizes and different types of protective films B.
  • the film module 702 obtains the first information according to the first identification device 301 and the second information obtained by the infrared identification device 302. The information takes out the protective film B of the corresponding size and type from the film storage component 703 for the filming operation; to meet the diversified choices of users, while taking into account the needs of different consumers.
  • the film storage cavities are arranged in a matrix; optionally, each of the film storage cavities is of the same size to facilitate production and processing and reduce manufacturing costs.
  • the vertical membrane storage module 703 can make full use of the space, that is, multiple storage cavities in the vertical It is distributed in the surface direction (relative to the horizontal plane) to reduce the size of the equipment and improve the space utilization rate, so that the self-service film sticking machine 1 can be set more compactly, which saves space, and the film storage module 703 can be arranged by m times With n film storage cavities, each independent film storage cavity presents an open shape, which can be placed with different specifications or sizes of protective films, so as to ensure that the self-service film sticking machine 1 can adapt to a wider range of users, more versatile, and suitable Equipped with a variety of screens of different models.
  • multiple storage cavities can be arranged along the horizontal plane.
  • the size of the storage cavity is also not limited, and it can have various sizes.
  • the structure is not limited, as long as it can play the role of accommodating the protective film B.
  • the film taking module includes a driving part 7021 and a fixed part 7022, wherein the driving part 7021 and the fixed part 7022 can be rotatably connected, the driving part 7021 can control the rotation of the fixed part 7022, the fixed part 7022 is used to The protective film B contacts and fixes the protective film B.
  • a vacuum chuck 7023 is provided on the fixing part 7022, which is optionally arranged on the side of the fixing part 7022 close to the electronic device A, so that the fixing part 7022 absorbs the protective film B through the vacuum chuck 7023 to fix it on the fixed part 7022.
  • the type of the vacuum chuck 7023 can be determined by the environment.
  • the vacuum chuck 7023 can be a flat disk-shaped vacuum chuck 7023.
  • the oval vacuum suction cup 7023 is used to absorb the protective film B adaptively.
  • the driving part 7021 includes a hinge, an angle adjusting cylinder 70212, a fixed shaft 70213, and a telescopic rod 70214.
  • the driving part 7021 specifically controls the rotation of the fixed part 7022 in a manner that the fixed part 7022 passes through a hinge 70211 Hinge connected to the fixed shaft 70213, the angle adjustment cylinder 70212 can control the expansion and contraction of the telescopic rod 70214.
  • One end of the telescopic rod 70214 is fixed, and the other end is hinged or fixedly connected to the fixed part 7022.
  • the angle adjustment cylinder 70212 can control the telescopic rod 70214. The elongation and contraction of, thereby controlling the rotation angle of the fixed portion 7022.
  • the fixed shaft 7021 and the fixed part 7022 are hingedly connected by the hinge 70211, which is used to enable the fixed part 7022 to rotate with the hinge 70211 as the axis.
  • the fixed part 7022 and the fixed shaft 70213 are in the absence of any external force
  • the fixed part 7022 cannot be rotated, and the angle adjustment of the control rotation is realized by the expansion and contraction of the telescopic rod 70214.
  • the telescopic rod 70214 is also hinged or fixedly connected to the fixed part 7022, After the angle adjustment cylinder 70212 is extended by the angle adjustment cylinder 70212, the telescopic rod 70214 is given a thrust to push the fixed portion 7022, so that the fixed portion 7022 is rotated.
  • the position where the fixed part 7022 and the fixed shaft 70213 are hingedly connected, and the position where the fixed part 7022 and the telescopic rod 70214 are fixedly connected or hingedly connected are not limited, as long as it is satisfied that the fixed part 7022 can be controlled to rotate by adjusting the length of the telescopic rod 70214 That is, in this embodiment, optionally, the fixed shaft 70213 is connected to the central position of the fixed portion 7022 through a hinge 70211, and the hinge 70211 and the fixed shaft 70213 are set vertically between the fixed shaft 70213 and the fixed portion 7022, and the shaft is extended and retracted. It is fixedly connected to one end of the fixed portion 7022 so that the fixed portion 7022 can rotate in the plane where the fixed shaft 70213 and the telescopic shaft are located, and the rotation angle can be controlled by the telescopic shaft.
  • the protective film B includes a protective layer B1 and an encapsulation layer B2.
  • the encapsulation layer B2 and the protective layer B1 are adsorbed and/or bonded to achieve connection; such as electrostatic adsorption and/or bonding of silica gel;
  • the protective layer B1 is mainly used to cover the screen of the electronic device A to protect the electronic device A, anti-wear, anti-explosion, waterproof, dust-proof, anti-peep and anti-radiation, etc.
  • Examples are: tempered glass layer , Anti-peep glass layer, resin layer, and the encapsulation layer B2 is used to protect the adsorption and/or adhesion properties of the protective layer B1, such as the packaging paper on the tempered mobile phone; wherein the encapsulation layer B2 is provided with a resist exposed to the protective layer Hold B3.
  • the film sticking mechanism 700 also includes a peeling plate 705.
  • the material of the peeling plate 705 is not limited. It can be regarded as a raised sheet for separating the protective layer B1 and the encapsulation layer B2 of the protective film B.
  • the support platform 903 has an inner hole 904, part of the peeling plate 705 is fixedly connected to the support platform 903, and the other part protrudes from the inner edge of the inner hole 904 to be suspended.
  • Step 1 The film-taking component 702 picks up the corresponding protective film B from the film-storing component 703;
  • Step 2 The film taking component 702 is peeled off the encapsulation layer B2 on the protective film B through the peeling plate 705;
  • Step 3 With the cooperation of the film attaching component 704, the film removing component 702 attaches the peeled protective film B to the electronic device A.
  • step one the film taking component 702 is picked up from the film storage component 703.
  • the type of protective film B corresponds to the electronic device A.
  • step 2 it can be seen from the above that when the film taking module 702 is adsorbing the protective film B through the vacuum suction cup 7023 of the fixing part 7022, the suction position should be set at the protective layer B1 of the protective film B Then, the encapsulation layer B2 is separated, and the protective layer B1 is left on the fixing portion 7022 for subsequent step three.
  • step two The specific steps for implementing the "method of peeling off the protective film B" in the above step two include the following steps:
  • Peeling step 1 Take the film assembly 702 to pick up the packaging layer B2, and cover all or part of the resisting portion B3 with the peeling plate 705;
  • Peeling step 2 the film taking component 702 moves in the first direction relative to the peeling plate 705, so that the protective layer B1 and the encapsulation layer B2 are partially or wholly separated;
  • Peeling step 3 The film taking component 702 is moved in the second direction relative to the peeling plate 705 to separate the protective layer B1 and the packaging layer B2 as a whole.
  • first direction is optionally a direction perpendicular to the surface where the peeling plate 705 is located
  • second direction is a direction parallel to the surface where the peeling plate 705 is located
  • moving in the first direction relative to the peeling plate 705, and moving in the second direction relative to the peeling plate 705" can be understood as the use of the film taking component 702 moving and the peeling plate 705 stationary, or the film taking component 702 stationary and the peeling plate 705 moving , And both the film taking component 702 and the peeling plate 705 move; it only needs to meet the result caused by the above movement.
  • the packaging layer B2 of this embodiment is made of a hard material
  • the holding part B3 is made of a hard material at this time, and the holding part B3 and the packaging layer B2 is fixedly connected or integrally formed
  • this embodiment is optionally: the size of the packaging layer B2 is set to be larger than the size of the protective layer B1, so that the part of the packaging layer B2 that exceeds the size of the protective layer B1 is exposed to define the resisting portion B3 .
  • the embodiment corresponding to the peeling step 1 in this embodiment is: the film taking component 702 is moved to the lower side of the peeling plate 705 through the film taking guide 701, and the edge line of the peeling plate 705 is located at the The upper side of the resisting portion B3, and the horizontal projection of the edge line is within the range of the resisting portion B3; that is, the projection of the edge line in the direction of the first Z-axis guide rail 7013 is on the resisting portion B3.
  • the embodiment corresponding to the peeling step 2 in this embodiment is as follows: the film taking assembly 702 is gradually moved upward under the drive of the first Z-axis guide 7013 until the edge of the peeling plate 705 resists After the resisting portion B3 continues to move upward, until the bottom surface of the protective layer B1 and the upper surface of the peeling plate 705 are higher than the distance e, the first Z-axis guide 7013 stops moving, where e is within 1 cm; at this time, the peeling plate 705 will resist The downward force of the holding portion B3 causes the encapsulation layer B2 to undergo elastic deformation, thereby gradually separating from the protective layer B1 and forming a gap with the encapsulation layer B2 or directly separated.
  • the separation from the protective layer is achieved through the elastic deformation of the encapsulation layer B2, the process is simple, and the protective layer B1 and the peeling plate 705 maintain a preset distance, so that the protective layer will not touch the peeling
  • the board 705 avoids scratches and crimping of the protective layer B1 caused by the peeling board 705.
  • “partially or wholly separated” can be understood as when the peeling plate 705 exerts downward force on the resisting portion B3 to cause elastic deformation of the encapsulation layer B2, there are two situations caused: one is that the encapsulation layer B2 is directly protected from When the layer B1 is separated, one is that a part of the packaging layer B2 is uncovered and the protective layer B1 creates a gap.
  • the specific situation is based on the ratio of the resisting portion B3 to the total length of the resisting portion B3 and the packaging layer B2, and the elastic mold of the packaging layer B2 For example, after the encapsulation layer B2 is given a downward external force by the peeling plate 705, when the elastic deformation is large, the encapsulation layer B2 will be directly separated from the protective layer B1.
  • the peeling step 3 needs to be entered.
  • the implementation of this embodiment corresponding to the peeling step 3 is: immediately under the drive of the first X-axis guide rail 7011, the film take-off assembly 702 moves linearly in the second direction, that is, the peeling plate 705 moves in parallel to make the peeling plate 705 Insert into the gap between the protective layer B1 and the encapsulation layer B2, and continuously move along the direction of the gap, until the protective layer B1 and the encapsulation layer B2 are completely separated.
  • this method is similar to the way the user usually separates the packaging layer B2 and the protective layer B1.
  • the peeling plate 705 is used to resist the abutting part so that the packaging layer B2 and the protective layer B1 are separated.
  • the action of opening the encapsulation layer B2 creates a gap between the encapsulation layer B2 and the protective layer B1, and then uses the peeling plate 705 to insert into the gap and move to the second direction.
  • the encapsulation layer B2 continues to undergo elastic deformation, thereby continuously reducing the encapsulation
  • the packaging layer B2 is made of soft material
  • the resisting portion B3 is made of hard material
  • the resisting portion B3 and the packaging layer B2 are fixedly connected.
  • the peeling step 1 the peeling step 2.
  • the film taking component 702 picks up the protective film B, so that the peeling plate 705 and the resisting portion B3 are fixedly connected and covering all or part of the resisting portion B3; the film taking component 702 moves in the first direction relative to the peeling plate 705 until the packaging layer B2 and The protective layer B1 is completely or partially separated.
  • the resisting part B3 is designed to be magnetically connected to the peeling plate 705.
  • the resisting part B3 is fixedly attracted to the peeling plate 705 by magnetic force.
  • the film taking component 702 moves the protective layer B1 in the first direction, that is, upwards relative to the peeling plate 705, and the encapsulation layer B2 is gradually peeled off from the protective layer B1, thereby achieving the encapsulation layer B2 and the protective layer B1 is separated in whole or in part; alternatively, a card slot (not shown) can be provided on the peeling plate 705, and the card slot and the resisting portion B3 are matched with each other, and the resisting portion B3 is inserted into the card slot through the film removing component 702 to fix the snap connection, Then, the protective layer B1 is moved in the first direction, that is, upward relative to the peeling plate 705. Similarly, the packaging layer B2 is gradually torn off from the protective layer B1, thereby realizing the whole or partial separation of the packaging layer B2 and the protective layer B1.
  • a part of the resisting portion B3 can be bonded to the protective layer B1, and the other part is exposed to the protective layer B1, while the resisting portion B3 and the packaging layer B2 are fixedly connected or integrated
  • the protective layer B1 moves in the first direction, that is, upward relative to the peeling plate 705
  • the resisting portion B3 detaches from the protective layer B1 and falls. Due to the preset weight of the resisting portion B3, the resisting portion B3 will cause The encapsulation layer B2 is torn off from the protective layer B.
  • the film sticking mechanism 700 further includes a recycling component 706, which is disposed on the lower side of the peeling plate 705, so that after the protective layer B1 and the encapsulation layer B2 are completely separated, the protective layer B1 It is still adsorbed on the fixing portion 7022, so the packaging layer B2 falls into the recycling assembly 706.
  • the recycling component 706 is a carrier for carrying the packaging layer B2 after the packaging layer B2 is completely separated.
  • the packaging layer B2 and the protective layer B1 are separated, the packaging layer B2 will naturally fall, and the recycling component 706 is It is arranged at the position where the encapsulation layer B2 falls, so as to recover the encapsulation layer B2. Therefore, the separated encapsulation layer B2 can be reused for continuous recycling, which is environmentally friendly and further maximizes economic benefits.
  • the encapsulation layer B2 and the protection layer B1 have the same width
  • the encapsulation layer B2 and the protection layer B1 have the same width
  • the encapsulation layer B2 is longer than the protection layer B1.
  • the distance a is extended, that is, the length a of the resisting portion B3, wherein the length a is one-eighth to one-third of the length of the protective layer B1.
  • the encapsulation layer B2 is set to have the same width as the protective layer B1, and is longer than the protective layer B1 by a distance in length, and the distance a is limited, that is, the length a of the resisting portion B3. This is because when the encapsulation layer B2 and the protective layer B1 are separated by the peeling plate 705, the peeling plate 705 needs to be used to resist the resisting part B3. If the length a of the resisting part B3 is too long, the torque given by the peeling plate 705 is It will be close to the center of the encapsulation layer B2, resulting in unsatisfactory separation effect or even impossible to implement.
  • the thickness b of the peeling plate 705 should be set at 1 to 4 cm.
  • the width of the peeling plate 705 is limited to the width of the gap between the encapsulation layer B2 and the protective layer B1 that are commonly used in daily use, and the width of the gap generated by elastic deformation is 1 to 4 cm. Second, during the relative movement of the peeling plate 705 in the direction of the gap, if the thickness of the peeling plate 705 is too thick, it is easy to cause the packaging layer B2 to undergo an excessive elastic deformation after the packaging layer B2 is inserted, causing the packaging layer B2 to be damaged.
  • step three where the step three is to realize "stick the peeled protective film B to the electronic device "A on” includes the following steps:
  • Film sticking step 1 Take the film component 702 to pick up the protective layer B1, and move the protective layer B1 to the upper part of the electronic device A;
  • Film sticking step 2 Take the film component 702 to incline the protective layer B1 at a preset angle c relative to the electronic device A, and one end contacts the electronic device A;
  • Film sticking step 3 After the film sticking component 704 presses the end of the protective layer B1 for a preset period of time t; the protective layer B1 moves down to cover the electronic device A; and
  • Film sticking step 4 The film sticking component 704 moves from one end of the protective layer B1 to the other end until it passes through the entire protective layer B1.
  • this embodiment corresponds to the implementation of the film sticking step 1: the film taking component 702 is moved to the upper side of the screen of the electronic device A through the film taking guide 701, that is, the upper side of the placing board 102;
  • the preset point on the protective layer B1 should be aligned with the center of the screen of the electronic device A, so that the protective layer B1 The frame corresponds to the edge of the screen of electronic device A.
  • this embodiment corresponds to the implementation of film sticking step 2:
  • the driving part 7021 rotates the fixing part 7022, thereby turning the protective layer B1 fixed thereon and the electronic device A on the placement board 102 into a preset state.
  • Set the angle c at this time, the fixed portion 7022 moves downward along the first Z-axis guide 7013, so that the protective layer B1 is close to the screen of the electronic device A until one end of the inclined protective layer B1 touches the electronic device A After the screen, the fixed part 7022 stops moving on the first Z-axis guide 7013.
  • the protective layer B1 is a curved protective layer B1
  • the plane where the two sides of the protective layer B1 are located, or the placement board 102 is used as a reference surface and the electronic device A film surface is placed at an angle c.
  • the protective layer B1 is inclined at an angle c relative to the electronic device A until one end of the protective layer B1 touches the electronic device A.
  • the film-taking component 702 should perform distance compensation, so that the outer frame of the protective layer B1 always corresponds to the edge of the screen of the electronic device A.
  • the filming component 704 is arranged directly above the end where the protective layer B1 contacts the electronic device A.
  • the film-taking component 702 is moved from the side of the plane where the electronic device A and the filming component 704 are located to the electronic device The upper part of A.
  • the film removing component 702 moves from the side of the plane where the electronic device A and the filming component 704 are located to the upper part of the electronic device A, preventing the film removing component 702 and the filming component 704 from colliding with each other during operation, and the filming component 704 is directly installed Just above the end where the protective layer B1 is in contact with the electronic device A, the working stroke of the filming assembly 704 is reduced, thus simplifying the process while saving cost and energy consumption.
  • this embodiment corresponds to the implementation of the film sticking step 3: and then the film sticking component 704 performs a pressing action, that is, the film sticking component 704 moves downward along the second Z-axis guide 7072 until it is pressed down to the protective layer B1 and The position of the electronic device A stops, and then immediately moves the preset distance d along the second X-axis guide 7071 and stops moving to press the end of the protective layer B1 in contact with the electronic device A, and at the same time make the protective layer B1 elastically deform. After the preset time t is pressed, the fixing part 7022 and the protective layer B1 are separated.
  • the way of disengagement can be alternatively: using the fixing part 7022 to move in the opposite direction along the first Z-axis guide 7013, that is, move upward, and press the filming assembly 704 Under the action of the protective layer B1, when the pressing force of the film-sticking component 704 against the protective layer B1 is less than the driving force provided by the film-taking component 702, the protective layer B1 is detached from the fixed portion 7022 and springs toward the electronic device under the force of elastic deformation A and fit it.
  • the way that the film-taking component 702 releases the protective layer is as follows: the vacuum chuck 7023 of the fixed portion 7022 for absorbing the protective layer is controlled by the gas path to directly detach the protective layer B1, thereby the protective layer B1 Bounce toward and fit electronic device A.
  • this embodiment corresponds to the implementation of the film sticking step 4: the placement plate 102 moves on the feed rail 101 toward the film sticking component 704, so that the sticking component 704 keeps pressing the protective layer B1, and the electronic One end of the device A is rolled to the other end, so that the entire protective layer B1 is attached to the electronic device A under the pressure of the film attaching component 704, and the entire film of the electronic device A is completed.
  • the placement board 102 is fixed, and the film sticking component 704 is rolled from one end of the electronic device A to the other end while keeping the pressure on the protective layer B1.
  • the film taking component 702 is moved out from the side of the plane where the electronic device A and the film sticking component 704 are located.
  • the film removing component 702 moves out of the side of the plane where the electronic device A and the film attaching component 704 are located, preventing the film removing component and the film attaching component 704 from being When working, they collide with each other, and when the film attaching component 704 moves, the film removing component is moved out at the same time, which increases the operating timeliness within a certain production time and improves the operating efficiency.
  • the distance d is one-fifteenth to one-third of the total length of the protective layer B1.
  • the screen of the electronic device A in this embodiment is optionally a horizontal plane, and when the protective film B and the screen of the electronic device A are placed at an angle, the entire protective film B is similarly inclined downward, which is closer to the electronic One end of the screen of the device A will be in contact for the first time.
  • the film-sticking component 704 will press down the end of the protective film B, that is, the end that is in contact with the screen, so that the end is pressed against the screen of the electronic device A, thereby strengthening Viscosity: It is equivalent to the pre-pressing method, so that the protective film B and the electronic device A are partially fixed, and the duration of t is to allow the air bubbles at the end to be discharged and to strengthen the adhesion between the end and the screen of the electronic device A.
  • the film sticking assembly 704 includes a pressure roller 7041.
  • the pressure roller 7041 is in contact with the protective layer B1 to complete pre-pressing and subsequent rolling by the pressure roller 7041.
  • the surface of the pressure roller 7041 is made of elastic material.
  • the electronic device A is attached to the electronic device A through the reaction force of the elastic deformation of the protective layer B1, which can reduce the influence of the surrounding air, so that the air is discharged to the periphery in the first time, thereby reducing the air not easily causing blistering.
  • the film assembly 704 The end of the protective film B is moved to the other end, so that the protective film B is fully compressed, and all the air inside the remaining gap is exhausted.
  • the preset angle c between the protective layer B1 and the screen of the electronic device A is set at 15° to 45°;
  • the angle c is set at 15° to 45°, and the overall elastic force is within a preset range after the filming component 704 presses one end of the attached layer Inside, it is necessary to ensure that the protective layer B1 does not damage the protective layer B1 under elastic deformation, such as bending or breaking, when the film-sticking component 704 is compressed, and a certain strength must be ensured to bring the expected effect.
  • the preset duration t is set to 1-30s, preferably 1-5s.
  • the film sticking component 704 performs a pressing action to compress one end of the protective film B and causes the protective film B to undergo elastic deformation for a preset period of time t, which is limited to 1-30s.
  • the protective film B and the electronic device The contact time of the A screen must ensure that the protective layer B1 is discharged, and it must also ensure that the time node of the production process cannot be slowed down. Therefore, the preset time length is set to 1 ⁇ 5s is a better choice.
  • the film recognition device 303 is installed on the fixed part 7022, the protective film B stored in the limit block 7031 is all provided with marks, and the mark on the protective film B can be pasted and drawn on the pattern or text on the encapsulation layer B2.
  • a mark is set on the protective film B to ensure that the film stored in the limit block 7031 is uniformly inspected by the management personnel of the self-service film machine 10 to ensure the quality of the protective film B.
  • the film recognition device 303 moves along with the fixed part 7022 to recognize the mark on the protective film B. Furthermore, the fixed part 7022 picks up the protective film B according to the recognition result of the film recognition device 303 When the film sticking recognition device 303 recognizes the mark on the protective film B, the fixing part 7022 moves along the first Z axis and picks up the recognized protective film B for sticking.
  • the positioning mechanism 300 performs positioning four times in sequence.
  • the feeding drive 104 drives the placement plate 102 to a set position for the first positioning, where the set position is the position corresponding to the first identification device 301, and the An identification device 301 obtains the size, position, and screen integrity of the electronic device A; then, the infrared identification device 302 performs a second positioning, that is, the infrared identification device 302 obtains the position of the black frame on the screen of the electronic device A;
  • the material assembly moves in the film taking guide 701 so that the fixed part 7022 corresponds to the position of the film storage assembly 703.
  • the device 303 starts the third positioning, and the film recognition device 303 recognizes whether there is a mark on the protective film B in the film storage assembly 703.
  • the fixing part 7022 starts to pick up the protective film B.
  • the fixing part 7022 does not pick up the protective film B;
  • the packaging layer B2 is peeled off with the cooperation of the peeling plate 705, and continues to face the electronic device Move in the direction of A to make the position of the protective layer B1 correspond to the electronic device A.
  • the film recognition device 303 starts the fourth positioning, that is, the film recognition device 303 takes a picture to make the center of the protective layer B1 match the screen of the electronic device A Align the center for filming operation.
  • the film sticking identification device 303 is arranged on the first Z axis to follow the first Z axis to move on the first X axis and the first Y axis, so as to obtain the mark on the protective film B.
  • the second embodiment of the present invention also provides a self-service film sticking method for sticking the protective film B to the electronic device A.
  • the sticking method includes the following steps:
  • Film sticking step 2 Take the film component to tilt the protective film at a preset angle relative to the electronic device and one end of it contacts the electronic device;
  • Film sticking step 3 After the film sticking component presses the end of the protective film for a preset period of time; the protective film moves down to cover the electronic device; and

Abstract

本发明公开了一种自助贴膜机的贴膜方法，用于自助式的将保护膜贴合于电子设备上，该自助贴膜机包括贴膜机构，贴膜机构包括取膜组件以及贴膜组件，贴膜的方法包括如下步骤：贴膜步骤1：取膜组件拾取保护膜，并将保护膜移动至电子设备的上部；贴膜步骤2：取膜组件将保护膜相对电子设备呈角度c倾斜且一端接触电子设备；及贴膜步骤3：贴膜组件压紧保护膜的该端持续预设的时长t时后；保护膜下移覆盖至电子设备。本发明还提供一种自助贴膜机。

Description

自助贴膜机以及其贴膜方法 【技术领域】
本发明涉及电子设备贴膜领域，具体涉及一种自助贴膜机以及其贴膜方法。
【背景技术】
有些电子设备在使用过程中，贴膜可以提高电子设备的抗磨耐摔性能，对电子设备起到保护作用，因此在这些电子设备中需要对其进行贴膜，示例性的如：手机的屏幕。
为了更好的保护电子设备，使用的膜大多为硬质的保护膜，如现今普遍流行的钢化膜，在采用贴膜机对电子设备贴膜时，都是在大气中进行，在贴膜时保护膜和电子设备之间很容易出现气泡从而导致贴膜失败；因此为了使得保护膜能达到贴紧电子屏幕且无气泡的效果，往往需要利用压力辊将保护膜在所贴的电子设备表面上进行压合，从而将其压紧的同时并将里面的气泡挤出，但是这样的手段，由于硬质保护膜自身特性的缘故，贴膜的效果均不佳，如压力辊在保护膜上移动的过程中，压力辊会和保护膜互相产生摩擦力，而刚开始贴膜时，保护膜和电子设备之间贴合接触的面积比较小，因此保护膜和电子设备之间的吸附力不够，在摩擦力的作用下使得保护膜产生和压力辊移动方向相反方向的位移趋势，导致了保护膜错位、气泡等现象的产生。
因此如何更优的实现硬质保护膜的自助贴膜，是现有自助贴膜设备有待解决的问题。
【发明内容】
为克服上述问题，本发明提供自助贴膜机以及其贴膜方法。
为解决上述问题，本发明提供一技术方案如下：即自助贴膜机的贴膜方法，用于自助式的将保护膜贴合于电子设备上，该自助贴膜机包括贴膜机构，贴膜机构包括取膜组件以及贴膜组件，贴膜的方法包括如下步骤：贴膜步骤1：取膜组件拾取保护膜，并将保护膜移动至电子设备的上部；贴膜步骤2：取膜组件将保护膜相对电子设备呈角度c倾斜且一端接触电子设备；及贴膜步骤3：贴膜组件压紧保护膜的该端持续预设的时长t时后；保护膜下移覆盖至电子设备。
优选地，贴膜组件设置于贴膜步骤2中保护膜和电子设备接触的一端的正上方，贴膜步骤1中，取膜组件从电子设备和贴膜组件所在平面的一侧移动至电子设备的上部。
优选地，贴膜步骤2中，具体的方式为：取膜组件将保护膜相对电子设备呈角度c倾斜，并不断朝靠近电子设备的方向下移，直至保护膜的其中一端接触到电子设备停止；或者取膜组件将保护膜下移预设的距离后，将保护膜相对电子设备呈角度c倾斜，直至保护膜的其中一端接触到电子设备停止。
优选地，贴膜步骤3中，贴膜组件立即压紧保护膜的该端并持续预设的时长t时，具体的方式为：贴膜组件移动至保护膜和电子设备接触的所在平面上；沿着保护膜和电子设备接触的一端朝另一端的方向，贴膜组件移动预设d的距离并停止移动；以按压住保护膜与电子设备接触的一端，其中按压预设的时长为t。
优选地，贴膜步骤3中，保护膜下移覆盖至电子设备具体的方式为：取膜组件将保护膜松开使其在弹性形变的反作用力下，下移覆盖至电子设备上。
优选地，进一步包括贴膜步骤4，贴膜组件从保护膜的该端至另一端移动，直至经过整个保护膜。
优选地，取膜组件保护膜松开具体的方式为：取膜组件带动保护膜沿背离电子设备的方向移动，当取膜组件提供的驱动力和/或保护膜的弹力使得保护膜不足以固定保护膜时，保护膜从取膜组件上脱离。
优选地，在贴膜组件从保护膜的该端至另一端移动的同时，取膜组件从电子设备和贴膜组件所在平面的一侧移出。
优选地，贴膜组件立即压紧保护膜的该端并持续预设的时长t时，时长t为1～5s内。
为更好的解决上述问题，本发明提供又一技术方案如下，即自助贴膜机，包括取膜组件，取膜组件包括采用可转动连接的驱动部以及固定部；驱动部进一步包括铰接件、角度调节气缸、固定轴、以及伸缩杆；固定部用于和保护膜接触并固定保护膜，驱动部可控制固定部旋转；驱动部具体控制固定部旋转的方式为：固定部通过铰链件和固定轴铰链连接，角度调节气缸可控制伸缩杆的伸缩，伸缩杆一端位置固定，一端同样铰链连接或者固定连接在固定部上，通过角度调节气缸控制伸缩杆的伸长和缩短，从而控制固定部的旋转角度。
与现有技术相比，本发明所提供的一种自助贴膜机具有如下的有益效果：
1、本发明使用取膜组件的固定部来固定好保护膜，并通过驱动部使其保护膜和电子设备上呈现角度放置，同时，摒弃以往的贴膜机构和取膜结构为一体的方式，当保护膜的其中一端接触到电子设备后，贴膜组件就会先预压住保护膜的该端一段时间，这样的好处在于，使其保护膜的一端先固定在电子设备上，从而后续贴膜机构在将整个保护膜移动压紧的过程中，保护膜不会因为贴膜机构的摩擦力产生相对位移，从而在电子设备产生错位、移位、多气泡的现象，而且，当预压住保护膜该端一段时间后，固定部直接将保护膜松开，保护膜此时会由于弹性形变后的恢复力立刻瞬速覆盖至电子设备上，本行业人员很容易理解，通常在贴膜时或者将膜上的粘贴层剥离时，为了尽快的减少周边空气的影响，防止在贴膜时起泡，通常以较快的速度进行撕膜或者贴膜，这是由于在较快的速度下，保护膜本身的摆动就会使得空气向外排出，而且较快时不容易形成空隙或者空气第一时间没办法进入空隙；这样的贴膜方式，首先相对于手工贴膜的效率低，贴膜质量差，受人为因素的影响较大，且人工成本相对较高等缺点，本发明整个自助贴膜的过程中，采用机械代替了繁琐的人力劳动，大大减低了贴膜的不良率，有效的提高了生产效率和降低了生产成本。
同时更重要的是，相对现有的自助式的或者自动式贴膜机，本发明解决了硬质膜的贴附问题，因硬质膜不同于软质膜；以往的软质膜因本身有柔性且不容易发生滑移，仅需采用压辊压紧即可，而硬质膜则在自动化的贴附上难以实现，因此本发明巧妙的利用了硬质膜的弹性形变这一特性，将膜保护膜的一端先抵住一段时间后，使保护膜和电子设备较充分的贴附，确保了保护膜和电子设备有足够的粘力而不容易发生滑移后，再利用硬质膜的弹力快速覆盖到电子设备，从而做到快速赶走空气，从而实现了硬质膜的自动贴附。
2、贴膜组件设置于保护膜和电子设备接触的一端的正上方，取膜组件从电子设备和贴膜组件所在平面的一侧移动至电子设备的上部，防止了取膜组件和贴膜组件在工作时相互碰撞，且贴膜组件直接设在保护膜和电子设备接触的一端的正上方，减少了贴膜组件的工作行程，因此简化工序同时节省成本和能耗。
3、取膜组件两种形式通过将保护膜倾斜放置接触电子设备，保护膜倾斜放置的好处在于，保护膜不会直接全部接触到电子设备，从而防止气泡和空隙的产生，使贴膜的效果更好。
4、保护膜倾斜后一端接触到电子设备时，在贴膜组件对该端进行压紧动作的方式，采用首先贴膜组件先移动至保护膜和电子设备接触的所在平面上，再沿着保护膜和电子设备接触的一端至另一端的方向，贴膜组件移动d的距离停止移动，因此类似滚压的方式，这样的方式的好处在于，一是采用该方式对保护膜和电子设备接触的一端的压紧效果更好，使得保护膜和电子设备接触的一端的接触更为紧密，第二是由于电子设备和保护膜的尺寸是不固定的，此类方式可以通过调控d的距离值来针对不同的电子设备和保护膜，满足不同用户的需求，增加了该自助贴膜机的贴膜方法的通用性。
3、取膜组件将保护膜松开的方式采用取膜组件带动保护膜沿背离电子设备的方向移动，仅通过单一方向上的移动即可实现将保护膜松开，简化工序同时节省成本和能耗。
5、本发明利用保护膜的弹性形变特性，在取膜组件将保护膜松开时向下覆盖电子设备，防止在贴膜时起泡。
5、贴膜组件会从保护膜上预压的一端到另一端移动，以使得保护膜和电子设备表面的气泡被排出的同时，保护膜被紧压在电子设备待测的表面上。
6、通过贴膜组件从保护膜的该端至另一端移动的同时，取膜组件从电子设备和贴膜组件所在平面的一侧移出，防止了取膜组件和贴膜组件在工作时相互碰撞，且贴膜组件移动时取膜组件同时移出，在一定生产时间内增加了运行时效，提高了运行效率
7、将t限定在1～5s内，是由于时间过短，保护膜和电子设备屏幕的接触时长不够，且保护膜该端的空气没有排出，但是时长过长也会影响到工序时长问题，拖慢生产工序的时间节点，因此预设的时长设置在1～5s是较优选择
8、本发明提供的自助贴膜机控制固定部的驱动部包括铰接件、角度调节气缸、固定轴、以及伸缩杆，通过角度调节气缸使得伸缩杆伸长，从而使得吸附有保护膜的固定部旋转，即固定部的一端向下倾斜，使得保护膜的对应端贴上电子设备。
【附图说明】
图1是本发明第一实施例自助贴膜机第一状态的立体结构示意图。
图2是本发明第一实施例自助贴膜机第二状态的立体结构示意图。
图3是本发明第一实施例自助贴膜机去除外壳体的第一视角的结构示意图；
图4是图3中局部放大结构示意图；
图5是本发明第一实施例自助贴膜机中入料机构的结构示意图；
图6是本发明第一实施例自助贴膜机中挡板的结构示意图；
图7是本发明第一实施例自助贴膜机中清洁机构的结构示意图；
图8是本发明第二实施例自助贴膜机去除外壳体的第二视角的结构示意图；
图9是本发明第二实施例自助贴膜机中取膜组件的第一视角的结构示意图；
图10是本发明第二实施例自助贴膜机中取膜组件的第二视角的结构示意图；
图11是本发明第二实施例自助贴膜机中保护膜的结构示意图；
图12是本发明第二实施例自助贴膜机去除外壳体的第三视角的结构示意图；
图13是本发明第二实施例自助贴膜机的撕膜步骤1的示意图；
图14是本发明第二实施例自助贴膜机的撕膜步骤2的示意图；
图15是本发明第二实施例自助贴膜机的撕膜步骤3的示意图；
图16是本发明第二实施例自助贴膜机去除外壳体的第四视角的结构示意图；
图17是图16中G处对应贴膜步骤1时的放大示意图；
图18是图16中G处对应贴膜步骤2时的放大示意图；
图19是图16中G处对应贴膜步骤3时的放大示意图；
图20是图16中G处对应贴膜步骤4后的放大示意图；
图21是本发明第二实施例自助贴膜机中贴膜组件的部分结构示意图。
图22是本发明第二实施例自助贴膜机的贴膜方法的流程图。
标识说明：10、自助贴膜机；100、入料机构；300、定位机构；500、清洁机构；700、贴膜机构；900、支撑机构；101、入料导轨；102、放置板；103、挡板；104、入料驱动件；301、第一识别装置；302、红外识别装置；303、贴膜识别装置；501、清洁导轨；502、清洁组件；503、清洁驱动件；701、取膜导轨；702、取膜组件；703、存膜组件；704、贴膜组件；705、剥离板；706、回收组件；707、贴膜导轨；901、外壳体；902、开口；903、支撑平台；904、内孔；905、显示屏；1021、尺寸线；1022、定位凸起；1031、定位孔；5021、第一清洁辊；5022、第二清洁辊；5023、固定支架；50221、粘贴带；50222、滚筒；50231、安装孔；50232、安装部；7011、第一X轴导轨；7012、第一Y轴导轨；7013、第一Z轴导轨；7021、驱动部；70211、铰链件；70212、角度调节气缸；70213、固定轴；70214、伸缩杆；7022、固定部；7023、真空吸盘；7031、限位块；7041、压力辊；7071、第二X轴导轨；7072、第二Z轴导轨；A、电子设备；B、保护膜；B1、保护层；B2、封装层；B3、抵持部。
【具体实施方式】
为了使本发明的目的，技术方案及优点更加清楚明白，以下结合附图及实施实例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
本发明提供的一种自助贴膜机剥离方法，主要适用于对需要贴膜电子设备进行自助化贴膜，即自动将保护膜贴附于电子设备上，示例性的如：给手机自动贴钢化膜；以解决现有通过人力贴膜带来的不便，从而助力工业智能化生产，铸造贴膜时良好的品控。
请参阅图1-图4，本实用新型第一实施例提供一种自助贴膜机10，用于对电子设备A进行自助贴膜，即在电子设备A上贴上一层保护膜B以保护电子设备A，该自助贴膜机10包括入料机构100、定位机构300、贴膜机构700及支撑机构900，支撑机构900用于为入料机构100、定位机构300、贴膜机构700提供支撑，入料机构100用于传送电子设备A，定位机构300用于对电子设备A进行定位，贴膜机构700根据定位机构300获得的定位信息对电子设备A进行自动贴膜。
使用自助贴膜机10对电子设备A进行自助贴膜时，首先，用户将电子设备A放入所述入料机构100，入料机构100将电子设备A传送至设定位置；然后，定位机构300对电子设备A进行定位；继而，贴膜机构700拾取自助贴膜机10内的保护膜B，并根据定位机构300获得的定位信息将保护膜B贴附于电子设备A上；最后，入料机构100将电子设备A从自助贴膜机10中传送出来，完成自助贴膜操作。通过自助贴膜机10对电子设备A进行自助贴膜，用户无需掌握贴膜技巧，只需将电子设备A放入所述入料机构100，即可完全通过自助贴膜机10进行贴膜，贴膜操作更方便，更智能。
可以理解，电子设备A包括但不限于手机、平板、显示器等，保护膜B包括但不限于钢化膜、防窥膜、磨砂膜等，在本实施例中，保护膜B为事先存放在自助贴膜机10中，以在用户进行自助贴膜时，贴膜机构700直接从自助贴膜机10中拾取保护膜B。
所述支撑机构900包括外壳体901和支撑平台903，外壳体901围设于支撑平台903四周，并将支撑平台903固定于外壳上，所述入料机构100设置于所述支撑平台903上。
请参阅图1-图6，所述外壳体901上设置有一开口902及一显示屏905，所述入料机构100设置于外壳体901内，且位置与开口902对应，以供放入或拿出电子设备A，显示屏905用于显示贴膜过程和广告宣传。所述开口902处还设置有一挡板103，所述挡板103尺寸与所述开口902尺寸相适配，并可通过磁性吸附于所述外壳体901的开口902 处，以封闭开口902，从而防止灰尘等脏物由所述开口902进入所述外壳体901内，还可以防止在贴膜过程中因误操作而造成人员受伤的情况发生。
作为一种变形，所述外壳体901上还设置有霍尔开关(图未示)，当定位机构300识别出入料机构100传送的电子设备A，同时挡板103通过磁性吸附于所述外壳体901上时，所述霍尔开关触发，自助贴膜机10开始进行贴膜工作；当定位机构300未识别出入料机构100传送的电子设备A，或者挡板103未吸附于所述外壳体901上时，不可触发霍尔开关，自助贴膜机10不进行贴膜工作，显示屏905显示不进行贴膜工作的原因。所述开口902与所述挡板103的形状可为椭圆形、圆形、跑道形、长方形等。
所述入料机构100包括入料导轨101、放置板102以及入料驱动件104，所述放置板102设置于所述入料导轨101上，并且可在所述入料导轨101上滑动。所述入料驱动件104设置于入料导轨101一侧，并与所述放置板102连接，以驱动所述放置板102在入料导轨101上移动。
可以理解，所述入料导轨101可为丝杆、滑轨等；所述入料驱动件104可为气缸、电机等。
所述放置板102上设置有防滑层，以防止电子设备A置于放置板102上之后滑动，从而避免贴膜时，电子设备A在放置板102上滑动。所述防滑层上还设置有尺寸线1021，用户根据尺寸线1021将待贴膜的电子设备A置于放置板102上，使贴膜更加的精准，并且所述尺寸线1021至少与两种不同尺寸的电子设备A适配。
可以理解，尺寸线1021即为与电子设备A尺寸相适配的辅助线，在本实施例中，尺寸线1021为五种，其分别对应电子设备A的尺寸为4.7寸、5.0寸、5.5寸、5.7寸及6.0寸。
具体地，在使用自助贴膜机10进行贴膜时，放置板102在入料导轨101上移动，并从开口902伸出，同时挡板103通过磁性吸附于放置板102上跟随放置板102一同从开口902移出，此时可将电子设备A放入放置板102中；进而，入料驱动件104驱动放置板102传送电子设备A至外壳体901内进行定位，在传送过程中，挡板103到达开口902的位置时，通过磁性与外壳体901吸附，并封闭所述开口902。
可以理解，所述挡板103带有磁性和/或所述外壳体901、所述放置板102带有磁性。
所述挡板103靠近放置板102的一面设置有定位孔1031，所述放置板102靠近所述挡板103的一面设置有定位凸起1022，当所述挡板103吸附于所述放置板102上时，所述定位凸起1022与所述定位孔1031磁吸配合，以防止所述挡板103晃动。
定位机构300包括第一识别装置301、红外识别装置302及贴膜识别装置303，第一识别装置301和红外识别装置302均设置于外壳体901内，且第一识别装置301、红外识别装置302位置均与入料导轨101对应，以在入料驱动件104驱动放置板102传送电子设备A至第一识别装置301对应的位置时，第一识别装置301通过拍照获取电子设备A的第一信息，入料驱动件104驱动放置板102传送电子设备A至红外识别装置302对应的位置时，红外识别装置302通过红外线获取电子设备A的第二信息，贴膜识别装置303设置于贴膜机构700上，通过贴膜识别装置303获取保护膜B的位置，以使贴膜机构700拾取保护膜B并贴附于电子设备A上。
可以理解，第一识别装置301可以为数码相机、工业相机中的任一种，以通过拍照获取电子设备的第一信息；所述红外识别装置302可以为红外相机，以通过红外线获取电子设备的第二信息。贴膜识别装置303可以为数码相机、工业相机中的任一种，以通过拍照获取获取保护膜B的位置，并将拾取的保护膜B贴附于电子设备A上。
其中，所述第一信息包括电子设备A的位置、尺寸大小及屏幕完整度，所述第二信息包括屏幕中黑框的位置。即第一识别装置301检测电子设备A的位置与放置板102中的尺寸线1021是否对齐，具体与放置板102中的哪个尺寸线1021对齐，以获取电子设备A的位置和尺寸大小，同时检测电子设备A屏幕是否有破碎、裂纹等情况，以获取屏幕完整度；红外识别装置302检测通过红外线检测电子设备A屏幕中黑框的位置，进而根据黑框的位置确定屏幕的中心，以使贴膜机构700根据屏幕的中心进行贴膜操作，使保护膜B更准确的贴附于电子设备A屏幕上。
可以理解，屏幕中的黑框为电子设备A屏幕实际尺寸的大小，屏幕在亮屏时，可以通过肉眼观察到屏幕中的黑框，屏幕在息屏时，黑色的屏幕和黑框浑然一色，无法通过肉眼观察到黑框，而红外线则可以从黑色的屏幕中分辨出黑框，进而根据黑框即可确定出屏幕的中心。
在本实施例中，第一识别装置301和红外识别装置302对应入料导轨101的同一位置，以在电子设备A被传送至第一识别装置301的对应的位置时，可通过第一识别装置301获取电子设备A第一信息，并且在不需要移动电子设备A的情况下，通过红外识别装置302获取电子设备A的第二信息，以使获取到的第二信息更准确，进而使保护膜B更准确的贴附于屏幕上。
请参阅图7，并结合图1-图6，自助贴膜机10进一步包括清洁机构500，所述清洁机构500设置于所述外壳体901内靠近所述开口902的位置，且所述清洁机构500位于所 述入料导轨101的上方，清洁机构500根据第一识别装置301、红外识别装置302获取的第一信息、第二信息对电子设备A屏幕进行清洁，所述清洁机构500包括清洁导轨501、清洁组件502以及清洁驱动件503，所述清洁驱动件503位于所述清洁导轨501的一端，所述清洁组件502与所述清洁导轨501、清洁驱动件503相连接，以使所述清洁组件502在清洁驱动件503的作用下，可沿着清洁导轨501移动。
可以理解，清洁导轨501可为丝杆、滑轨等；所述清洁驱动件503可为电机、气缸等。
所述清洁组件502包括固定支架5023、第一清洁辊5021以及第二清洁辊5022，所述第一清洁辊5021、第二清洁辊5022依次安装于所述固定支架5023上。
所述固定支架5023呈“n”型，其两侧均依次设置有安装孔50231与安装部50232，所述第一清洁辊5021通过所述安装孔50231安装于所述固定支架5023上，所述第二清洁辊5022通过所述安装部50232安装于所述固定支架5023上，所述第二清洁辊5022可沿所述安装部50232在所述固定支架5023上移动，本实用新型中，由于所述安装部50232设置于所述安装孔50231之上，因此在重力的作用下，所述第二清洁辊5022通过所述安装部50232始终与所述第一清洁辊5021相切。
可以理解，所述安装部50232可以为腰孔，还可为滑动轨道。
所述第一清洁辊5021与所述第二清洁辊5022均具有粘性，且所述第二清洁辊5022的粘性大于所述第一清洁辊5021的粘性，所述第二清洁辊5022包括粘贴带50221及滚筒50222，所述粘贴带50221卷曲于所述滚筒50222上，当所述粘贴带50221的表面被脏物覆盖，不能清洁第一清洁辊5021表面的脏物时，只需撕去表面一层的粘贴带50221，使下一层粘贴带50221与第一清洁辊5021相切，撕去表面一层粘贴带50221之后，第二清洁辊5022在重力作用下沿安装部50232滑动，使下一层粘贴带50221与第一清洁辊5021相切，操作简单便捷，既节省了维护的时间，也节省了使用成本。
进一步地，所述第一清洁辊5021可以为具有粘性的滚筒，也可以为粘贴带与滚筒的组合。
所述第一清洁辊5021与所述第二清洁辊5022的长度f可为90～220mm，进一步地，所述第一清洁辊5021与第二清洁辊5022的长度f还可为100～110mm，由于现有的大部分电子设备A的宽度均小于100mm，故所述第一清洁辊5021与所述第二清洁辊5022采用100～110mm的长度f，可适用于大部分的使用场合，并且还不会因为长度过长而导致浪费。
所述第二清洁辊5022的直径g为所述第一清洁辊5021直径g的2～4倍，进一步地，所述第二清洁辊5022的直径g还可为第一清洁辊5021直径g的2.5～3.5倍，这样的设计可使所述第二清洁辊5022使用的时间更长，无需人工频繁的去维护，节省人力成本，并且由于所述第二清洁辊5022通过重力与所述第一清洁辊5021相贴合，较大的直径g，所述第二清洁辊5022的重量也相对更大，因此与所述第一清洁辊5021贴合的也更架紧密，以更好的清洁所述第一清洁辊5021。
清洁机构500工作时，所述清洁驱动件503驱动所述清洁组件502沿着所述清洁导轨501移动至设定位置，也即所述清洁驱动件503驱动所述清洁组件502沿着所述清洁导轨501移动，直至第一清洁辊5021与电子设备A表面相接触，并保持在此位置，然后放置板102带动电子设备A移动，第一清洁辊5021与电子设备A接触，电子设备A移动带动第一清洁辊5021转动，第一清洁辊5021转动带动第二清洁辊5022反向转动，以使第一清洁辊5021清洁电子设备A表面的脏物，使第二清洁辊5022清洁第一清洁辊5021表面的脏物，直至第一清洁辊5021从电子设备A的一端清洁至另一端清洁驱动件503驱动所述清洁组件502沿着清洁导轨501朝向远离电子设备A的方向移动，直至归位，至此完成清洁工作。
通过将清洁组件502与所述清洁导轨501相连接，可使所述清洁组件502在移动以及停留过程中更加的平稳，不易产生晃动，从而可以有效的防止刮伤电子设备A表面。
作为一种变形，所述清洁导轨501可以省略，清洁驱动件503直接与固定支架5023连接，以驱动固定支架5023移动，进而使第一清洁辊5021清洁电子设备A表面的脏物。
请参阅图8，贴膜机构700还包括取膜组件702以及贴膜组件704，取膜组件702用于拾取保护膜B并带动保护膜B移动至贴膜组件704对应的位置，贴膜组件704设置于入料导轨101的上侧，且位置与放置板102相对应，以将保护膜B压紧贴合至电子设备A屏幕上，本发明通过取膜组件702以及贴膜组件704的配合以完成贴膜操作。
进一步地，贴膜机构700还包括取膜导轨701以及贴膜导轨707，取膜导轨701和贴膜导轨707均固定于支撑平台903上，取膜组件702可在取膜导轨701上移动，同理贴膜组件704可在贴膜导轨707上移动，其中，取膜导轨701包括第一X轴导轨7011、第一Y轴导轨7012以及第一Z轴导轨7013，各个导轨分别控制X/Y/Z轴上的移动；其中第一X轴导轨7011、第一Y轴导轨7012以及第一Z轴导轨7013均采用滑动连接，并且将取膜组件702设置于第一Z轴导轨7013上，从而实现取膜组件702在X/Y/Z轴方向上的移动；
更进一步地，贴膜导轨707和贴膜组件704固定连接，贴膜导轨707包括第二X轴导 轨7071和/或第二Y轴导轨以及第二Z轴导轨7072，且所述贴膜组件704和所述第二X轴导轨7071和/或第二Y轴导轨以及第二Z轴导轨7072其中一个固定连接，以实现所述取膜组件702在X轴和/或Y轴、以及Z轴方向的移动。
可选地，本实施例仅设定第二X轴导轨7071和第二Z轴导轨7072；一些实施例中，取膜导轨701以及贴膜导轨707为同一组导轨，通过一组导轨实现贴膜组件704以及取膜组件702的移动。
进一步地，贴膜机构700还包括存膜组件703，所述存膜组件703包括至少两组限位块7031，每组所述限位块7031互相围合以形成不同尺寸的放置区(未标号)以形成存膜腔，以放置不同尺寸的保护膜B。
可以理解，限位块7031围合后应当和保护膜B的尺寸大小相互适应，以使保护膜B可以正好可以放置于限位块7031围合的放置区内，本实施例中，由限位块7031为12组，并形成12个放置区以对应放置12种不同尺寸及不同类型的保护膜B，取膜组件702根据第一识别装置301获得第一信息和红外识别装置302获取的第二信息从存膜组件703取出对应尺寸及类型的保护膜B进行贴膜操作；以满足用户多样化的选择，同时兼顾不同消费者的需求。
在一些其他实施方式中，所述存膜腔呈现矩阵式排布；可选地，各个存膜腔为相同尺寸，以方便生产加工，减少制作成本。
可以理解，由于自助贴膜机1多投放于商场、学校、小区，其整体自助贴膜机1的尺寸不宜过大，通过竖立方式的存膜组件703可充分利用空间，即多个存膜腔在垂面方向(相对于水平面而言)上分布，以降低设备尺寸，提高空间利用率，使得自助贴膜机1可设置的较为小巧，起到节省空间的作用，且存膜组件703可排布m乘以n个存膜腔，每个独立的存膜腔呈现开口状，可放置不同规格或尺寸的保护膜，从而保证其自助贴膜机1所能适应的用户较为广泛，通用性更强，和适配多种不同机型的屏幕。
作为一种变形，多个存膜腔可以沿水平面方向设置。存膜腔大小也不做限定，其可以具有多种尺寸。其结构也不做限定，只要其能起到容纳保护膜B的作用即可。
请参阅图9-图10，取膜组件包括驱动部7021以及固定部7022，其中驱动部7021和固定部7022可转动连接，驱动部7021可控制固定部7022的旋转，固定部7022用于和所述保护膜B接触并固定所述保护膜B。
进一步地，所述固定部7022上设置有真空吸盘7023，可选地设置于固定部7022靠近电子设备A的一面，从而固定部7022通过真空吸盘7023吸附所述保护膜B从而将其固定在固定部7022上。
可以理解，其真空吸盘7023的类型具体可使环境而定，如保护膜B采用平面膜时，则真空吸盘7023采用平面的盘形真空吸盘7023即可，当保护膜B为曲面膜时，则采用椭圆真空吸盘7023，以适应性将保护膜B吸取。
更进一步地，驱动部7021包括铰接件、角度调节气缸70212、固定轴70213、以及伸缩杆70214，其所述驱动部7021具体控制所述固定部7022旋转的方式为：固定部7022通过铰链件70211和固定轴70213铰链连接，角度调节气缸70212可控制伸缩杆70214的伸缩，伸缩杆70214一端位置固定，一端同样铰链连接或者固定连接在固定部7022上，通过角度调节气缸70212可通过控制伸缩杆70214的伸长和缩短，从而控制固定部7022的旋转角度。
可以理解，固定轴70213和固定部7022是通过铰链件70211实现铰链连接，其用处是使得其固定部7022可以以铰链件70211为轴线旋转，当固定部7022和固定轴70213在没有任何外力的情况下，固定部7022无法发生旋转，而具体实现控制旋转的角度调节则是通过伸缩杆70214的伸缩从而实现的，由于伸缩杆70214同样铰链连接或者固定连接在固定部7022上，通过伸缩杆70214在角度调节气缸70212的作用下使其伸长后，伸缩杆70214相当是在给予一个推力推动给固定部7022，从而使得固定部7022旋转。
其中其固定部7022和固定轴70213铰链连接的位置，以及固定部7022和伸缩杆70214固定连接或者铰链连接的位置，均不予限定，只要满足通过调节伸缩杆70214的长度可以控制固定部7022旋转即可，本实施例可选地，固定轴70213通过铰链件70211连接于固定部7022的中心位置，铰链件70211和固定轴70213垂直设定与固定轴70213和固定部7022之间，同时伸缩轴固定连接在固定部7022的一端，以使固定部7022可在固定轴70213和伸缩轴所在的平面内旋转，且可通过伸缩轴加以控制其旋转角度。
请参阅11，保护膜B包括保护层B1、以及封装层B2，封装层B2和保护层B1吸附和/或粘接从而实现连接；如硅胶静电吸附和/或粘接；
其中保护层B1主要用于覆盖于电子设备A屏幕上，以对电子设备A起到保护、防磨、防爆、防水、防灰、防窥及防辐射等作用，示例性的如：钢化玻璃层、防窥玻璃层、树脂层，而封装层B2用于保护保护层B1的吸附和/或粘接特性，比如钢化手机上的包装纸；其中，封装层B2上设置有外露于保护层的抵持部B3。
请参阅12，贴膜机构700还包括剥离板705，所述剥离板705的材质不予限定，其可视为以凸起的薄板，以用于将保护膜B的保护层B1和封装层B2分离；支撑平台903 开有一内孔904，剥离板705部分固定连接于支撑平台903上，另一部分从内孔904的内边缘处伸出悬空设置。
请结合图11以及图12，上述已经说明了自助贴膜机10在实现贴膜时所需的结构，下面对具体如何实现贴膜的步骤进行阐述，其如下包括步骤一至步骤三：
步骤一、取膜组件702从存膜组件703内拾取对应的保护膜B；
步骤二、取膜组件702通过剥离板705将保护膜B上的封装层B2剥离；及
步骤三、在贴膜组件704的配合下，取膜组件702将剥离后的保护膜B贴至电子设备A上。
可以理解，其中步骤一二三中，取膜组件702以及贴膜组件704的移动均分别通过取膜导轨701以及贴膜导轨707予以实现，步骤一中，取膜组件702从存膜组件703内拾取的保护膜B类型与电子设备A对应，步骤二中，通过上述可知，取膜组件702在通过固定部7022的真空吸盘7023吸附保护膜B时，吸附位置应当设定在保护膜B的保护层B1上，从而将封装层B2分离，留下保护层B1在固定部7022上以后续进行步骤三。
上述步骤二中实现“将保护膜B剥离的方式”的具体步骤包括以下步骤：
剥离步骤1：取膜组件702拾取封装层B2，将剥离板705覆盖住抵持部B3的全部或者部分；
剥离步骤2：取膜组件702相对剥离板705朝第一方向移动，从而使保护层B1以及封装层B2部分或者整体分离；及
剥离步骤3：取膜组件702相对剥离板705朝第二方向移动，以使保护层B1和封装层B2整体分离。
其中，其中可选地“第一方向”为垂直剥离板705所在面的方向，“第二方向”为平行剥离板705所在面的方向。
其中，“相对剥离板705第一方向移动、相对剥离板705朝第二方向移动”可理解为，可以采用取膜组件702移动、剥离板705静止，或者取膜组件702静止，剥离板705移动，以及取膜组件702和剥离板705均移动；只需满足上述移动后造成的结果即可。
以下对于步骤1、2结合本实施例的具体实施方式予以阐述：可选地，本实施例封装层B2为硬质材料，此时抵持部B3采用硬质材料，抵持部B3与封装层B2采用固定连接或者一体成型；本实施例可选地为：将封装层B2的尺寸设置为大于保护层B1的尺寸，以使封装层B2超出保护层B1尺寸的部分外露出来界定抵持部B3。
请结合图10以及图11，本实施例对应剥离步骤1的实施方式为：取膜组件702通过取膜导轨701移动至剥离板705的下侧，且此时剥离板705的边缘线位于所述抵持部B3的上侧，且边缘线的水平投影在所述抵持部B3的范围内；即边缘线在第一Z轴导轨7013方向上的投影在所述抵持部B3上。
请结合图10以及图12、图13，本实施例对应剥离步骤2的实施方式为：取膜组件702在第一Z轴导轨7013的带动下逐渐上移，直到剥离板705的边缘抵持到抵持部B3后继续上移，直至保护层B1底面和剥离板705的上表面高出e距离时，第一Z轴导轨7013停止运动，其中e为1cm以内；此时剥离板705会给予抵持部B3向下的力使得述封装层B2发生弹性形变，从而和所述保护层B1逐渐分开与封装层B2形成空隙或者直接分离。
可以理解，利用硬质材质膜的特性，通过封装层B2的弹性形变实现和保护层分离，工序简洁，且保护层B1和剥离板705保持了预设的距离，从而保护层不会接触到剥离板705，避免了剥离板705对保护层B1造成划伤和折压的情况。
其中，“部分或者整体分离”可理解为，在剥离板705给予抵持部B3向下的力使得述封装层B2发生弹性形变时，造成的情况有两种：一是封装层B2直接从保护层B1脱离，一种是封装层B2揭开一部分和保护层B1产生间隙，具体的情况基于抵持部B3相对抵持部B3和封装层B2的总长度占比，以及封装层B2的弹性模量有关；示例性的如：封装层B2在剥离板705给予向下的外力后，弹性形变量较大时，封装层B2即会直接从保护层B1脱离，反之，弹性形变量较小时，便只是形成空隙，亦或是当抵持部B3相对抵持部B3和封装层B2的总长度占比较大时，在封装层B2在剥离板705给予向下的外力后，封装层B2即会直接从保护层B1脱离，反之亦然。
因此，如果在进行剥离步骤2时，封装层B2已经从保护层B1脱离，即无需剥离步骤3，反之则需要进入剥离步骤3。
本实施例对应剥离步骤3的实施方式为：紧接着在第一X轴导轨7011的带动下，取膜组件702朝第二方向直线移动，即剥离板705平行的方向移动，以使得剥离板705插入保护层B1和封装层B2的空隙内，并不断沿着空隙的方向移动，直至所述保护层B1和所述封装层B2完全分离。
可以理解，该方式类似于仿照用户在通常分离封装层B2和保护层B1的手法，用剥离板705抵持住所述抵触部从而使得封装层B2和保护层B1分离，类似用户在用手去揭开封装层B2的动作，使得封装层B2和保护层B1产生空隙，继而使用剥离板705插进空隙中，并不断向第二方向移动，此时封装层B2继续发生弹性形变，从而不断减少封装层B2和保护层B1的接触面积，直至保护层B1和封装层B2完全分离，从而在大批量贴 膜过程中具有剥离效率高，剥离效果好，结构简单，制造成本低，使用方便、快捷，实用性强等特点。
在本实施例中的一些变形例中，封装层B2采用软质材料时，抵持部B3采用硬质材料，抵持部B3与封装层B2采用固定连接，此时剥离步骤1、剥离步骤2的具体方式为：
取膜组件702拾取保护膜B，使剥离板705和抵持部B3固定连接并覆盖抵持部B3的全部或者部分；取膜组件702朝第一方向相对剥离板705移动，直至封装层B2和所述保护层B1整体或者部分分离。
可以理解，针对上述方式示例性的如：将抵持部B3设计可和剥离板705磁性连接，当取膜组件702拾取保护层B1靠近剥离板705后，抵持部B3通过磁力固定吸附在剥离板705上，此时取膜组件702将保护层B1朝第一方向即向上相对剥离板705移动，会将封装层B2从保护层B1上逐渐撕下，从而实现封装层B2和所述保护层B1整体或者部分分离；或者，剥离板705上可设置一卡槽(图未示)，卡槽和抵持部B3相互匹配，通过取膜组件702将抵持部B3插入卡槽固定卡接，再将保护层B1朝第一方向即向上相对剥离板705移动，同样，会将封装层B2从保护层B1上逐渐撕下，从而实现封装层B2和所述保护层B1整体或者部分分离。
还有一些本实施例特殊的变形例中，可将抵持部B3其中一部分和保护层B1粘接，另一部分外露于保护层B1，同时抵持部B3和封装层B2固定连接或者一体而成，在保护层B1朝第一方向即向上相对剥离板705移动时，抵持部B3从保护层B1脱离下落，由于抵持部B3预设好的重量下，抵持部B3在重力下会使得封装层B2从保护层B撕下。
请继续参阅图9以及图10，贴膜机构700进一步包括回收组件706，回收组件706设置于剥离板705的下侧，以使保护层B1和所述封装层B2完全分离后，所述保护层B1任然被吸附在固定部7022上，因此所述封装层B2掉落进所述回收组件706。
可以理解，回收组件706即为在封装层B2完全分离后，用于承载封装层B2的一个载具，当封装层B2和保护层B1分离时，封装层B2会自然掉落，回收组件706即设置在封装层B2掉落的位置，从而对封装层B2进行回收，因此可二次利用分离后的封装层B2，不断循环使用，环保且进一步使得经济效益最大化。
请重新参阅图9，本实施例可选地为，封装层B2和所述保护层B1宽度一致，所述封装层B2和所述保护层B1宽度一致，所述封装层B2长度比保护层B1长出a的距离，即所述抵持部B3的长度a，其中，长度a为所述保护层B1的自身长度的八分之一至三分之一。
可以理解，其中封装层B2设定为宽度和保护层B1一致，在长度上比保护层B1长出a的距离，且对该距离a进行限定，即所述抵持部B3的长度a，这是因为在封装层B2和保护层B1被剥离板705进行分离时，需要用剥离板705去抵持住抵持部B3，如果抵持部B3的长度a过长，剥离板705给的力矩即会靠近封装层B2的中心，从而导致分离的效果不理想甚至无法实施。
请重新参阅图12，所述剥离板705的厚度b应当设定在1～4cm。
可以理解，剥离板705的宽度限定在日常常用封装层B2和保护层B1弹性形变产生空隙的宽度1～4cm内，一是为了剥离板705能够成功插入所述空隙内并不断沿着空隙的方向移动，二是剥离板705在朝空隙方向相对移动的过程中，如果剥离板705的厚度太厚，容易在插入封装层B2后，导致封装层B2发生弹性形过大变引起封装层B2损坏。
以上对保护膜B的剥离进行了阐述，此时固定部7022上仅吸附有保护膜B的保护层B1，下面进入步骤三，其中步骤三中实现“将剥离后的保护膜B贴至电子设备A上”包括以下步骤：
贴膜步骤1：取膜组件702拾取所述保护层B1，并将所述保护层B1移动至所述电子设备A的上部；
贴膜步骤2：取膜组件702将保护层B1相对电子设备A呈预设的角度c倾斜且一端接触电子设备A；
贴膜步骤3：贴膜组件704压紧保护层B1的该端持续预设的时长t时后；所述保护层B1下移覆盖至电子设备A；及
贴膜步骤4：所述贴膜组件704从保护层B1的该端至另一端移动，直至经过整个保护层B1。
对于贴膜步骤1、2、3、4配合本实施例予以阐述:
请参阅图14以及图15，本实施例对应贴膜步骤1的实施方式：取膜组件702通过取膜导轨701移动至电子设备A屏幕的正上侧，即所述放置板102的正上侧；
可以理解，根据上述第一识别装置301、红外识别装置302以及贴膜识别装置303分别获取的信息，此时保护层B1上预设的点应当和电子设备A屏幕的中心对齐，以使保护层B1的外框和电子设备A屏幕的边缘对应。
请参阅图16，本实施例对应贴膜步骤2的实施方式：此时驱动部7021使得固定部7022旋转，从而将其上固定的所述保护层B1和放置板102上的电子设备A屏幕呈预设的角度c摆放；此时所述固定部7022沿第一Z轴导轨7013向下移动，使保护层B1靠近所 述电子设备A屏幕，直至倾斜的保护层B1其中一端接触到电子设备A屏幕后，固定部7022停止在第一Z轴导轨7013上移动。
一些实施例中，保护层B1如果为曲面的保护层B1，则以保护层B1两侧边所在的平面，或者放置板102作为参考面和电子设备A代贴膜表面呈角度c摆放。
一些实施例中，也可取膜组件702将保护层B1下移预设的距离后，将保护层B1相对电子设备A呈角度c倾斜，直至保护层B1的其中一端接触到电子设备A。
可以理解，在保护层B1倾斜的过程中，取膜组件702应当进行距离补偿，使得保护层B1的外框一直和电子设备A屏幕的边缘对应。
更进一步地，贴膜组件704设置于保护层B1和电子设备A接触的一端正上方，所述贴膜步骤1中，取膜组件702从电子设备A和贴膜组件704所在平面的一侧移动至电子设备A的上部。
可以理解，取膜组件702从电子设备A和贴膜组件704所在平面的一侧移动至电子设备A的上部，防止了取膜组件702和贴膜组件704在工作时相互碰撞，且贴膜组件704直接设在保护层B1和电子设备A接触的一端的正上方，减少了贴膜组件704的工作行程，因此简化工序同时节省成本和能耗。
请参阅图17，本实施例对应贴膜步骤3的实施方式：进而所述贴膜组件704进行下压动作，即贴膜组件704沿第二Z轴导轨7072向下移动，直至下压到保护层B1与电子设备A的位置停止，随后立即沿第二X轴导轨7071移动预设的距离d并停止移动，以按压住保护层B1与电子设备A接触的一端，同时使保护层B1发生弹性形变，按压预设的时长t后，固定部7022和保护层B1脱离，其脱离的方式可选地为：利用固定部7022沿第一Z轴导轨7013反向移动，即向上移动，在贴膜组件704按压保护层B1的作用下，贴膜组件704按压保护层B1的力度小于取膜组件702提供的驱动力时，保护层B1从固定部7022中脱离，并在弹性形变的作用力下，弹向电子设备A并与之贴合。
一些该实施例的变形例中，取膜组件702将保护层松开的方式为：固定部7022用于吸附保护层的真空吸盘7023通过气路控制，直接将保护层B1脱离，从而保护层B1弹向电子设备A并与之贴合。
请参阅图18，本实施例对应贴膜步骤4的实施方式：放置板102在入料导轨101上朝向贴膜组件704的方向移动，以使贴膜组件704在保持对保护层B1的按压下，由电子设备A的一端滚压至另一端，以在贴膜组件704的压力下，使整个保护层B1贴附于电子设备A上电子设备A至此完成整个贴膜。
一些实施例中，也可是放置板102固定不动，贴膜组件704在保持对保护层B1的按压朝电子设备A的一端滚压至另一端。
进一步地，放置板102在入料导轨101上朝向贴膜组件704的方向移动的同时，取膜组件702从电子设备A和贴膜组件704所在平面的一侧移出。
可以理解，通过贴膜组件704从保护膜B的该端至另一端移动的同时，取膜组件702从电子设备A和贴膜组件704所在平面的一侧移出，防止了取膜组件和贴膜组件704在工作时相互碰撞，且贴膜组件704移动时取膜组件同时移出，在一定生产时间内增加了运行时效，提高了运行效率。
其中，距离d为保护层B1总长度的十五分之一至三分之一。
可以理解，本实施例中所述电子设备A屏幕可选地为水平面，则当保护膜B和电子设备A屏幕是呈现角度摆放时，整个保护膜B类似下倾斜的形态，从而更接近电子设备A屏幕的一端会第一时间接触，此时贴膜组件704会下压动作压紧保护膜B的该端，即和屏幕接触的一端，以使得该端和电子设备A屏幕压紧，从而加固粘性；相当于预压的方式，让保护膜B和电子设备A有部分固定，持续t时是为了让该端的气泡排出且加固该端和电子设备A屏幕的粘接力度。
请参阅图19，其中贴膜组件704包括压力辊7041，贴膜组件704进行下压动作压紧保护层B1时，以及后续从所述保护层B1的该端至另一端进行移动时，均通过所述压力辊7041和所述保护层B1接触，以通过压力辊7041完成预压以及后续的滚压。所述压力辊7041表面为弹性材料。
电子设备A通过保护层B1弹性形变的反作用力贴附于电子设备A上，可减少周边空气的影响，使得空气第一时间向周边排出，从而减少空气不容易引起起泡，最后贴膜组件704再保护膜B的该端至另一端进行移动，从而将保护膜B全部压紧，且将剩余空隙内部空气全部排出。
进一步地，保护层B1和电子设备A屏幕预设的角度c设置在15°至45°；
可以理解，保护层B1和电子设备A屏幕呈角度c摆放时的角度c设置在15°至45°，则在贴膜组件704压住附层的一端后，整体的弹性力度在预设的范围内，既要保证贴膜组件704在压紧时，保护层B1弹性形变下不损坏保护层B1，如折弯折断，又要保证一定的力度，带来预期的效果。
进一步地，所述预设的时长t设定在1～30s，较优地为1～5s。
可以理解，贴膜组件704进行下压动作压紧保护膜B的其中一端并使所述保护膜B 发生弹性形变持续预设的时长t，将t限定在1～30s内，保护膜B和电子设备A屏幕的接触时长要保证保护层B1排出，又要保证不能拖慢生产工序的时间节点，因此预设的时长设置在1～5s是较优选择。
进一步地，贴膜识别装置303设置于固定部7022上，限位块7031中存放的保护膜B均设置有标记，保护膜B上的标记可以粘贴、绘制在封装层B2上的图案或者文字，通过在保护膜B上设置标记，以保证限位块7031中存放的贴膜均由自助贴膜机10的管理人员统一检验，保证保护膜B的质量。
固定部7022在取膜导轨701上移动时，贴膜识别装置303跟随固定部7022一同移动，以识别保护膜B上的标记，进而，固定部7022根据贴膜识别装置303的识别结果进行拾取保护膜B的操作，当贴膜识别装置303识别出保护膜B上的标记时，固定部7022沿第一Z轴移动，并拾取识别的保护膜B进行贴膜。
具体地，定位机构300先后进行四次定位，首先，入料驱动件104驱动放置板102至设定位置时进行第一次定位，其中设定位置为第一识别装置301对应的位置，通过第一识别装置301获取电子设备A的尺寸、位置及屏幕完整度；然后，通过红外识别装置302进行第二次定位，即通过红外识别装置302获取电子设备A屏幕中黑框的位置；进而，取料组件根据第一识别装置301和红外识别装置302获取的定位信息，在取膜导轨701中移动，以使固定部7022对应存膜组件703的位置，此时，安装于固定部7022上的贴膜识别装置303开始进行第三次定位，及贴膜识别装置303识别存膜组件703中的保护膜B是否存在标记，当识别出保护膜B上的标记时，固定部7022开始拾取保护膜B，当未识别出保护膜B上的标记时，则固定部7022不拾取保护膜B；最后，当固定部7022拾取保护膜B之后，在剥离板705的配合下将封装层B2剥离，并继续朝向电子设备A的方向移动，使保护层B1的位置与电子设备A对应，此时，贴膜识别装置303开始第四次定位，即贴膜识别装置303通过拍照以使保护层B1的中心与电子设备A屏幕的中心对齐，以进行贴膜操作。
作为一种变形，贴膜识别装置303设置于第一Z轴上，以跟随第一Z轴在第一X轴、第一Y轴上移动，从而获取保护膜B上的标记。
请参阅图22，本发明第二实施例还提供一种自助贴膜机的贴膜方法，用于自助式的将保护膜B贴合于电子设备A上，贴膜的方法包括如下步骤：
贴膜步骤1(S1)：取膜组件拾取所述保护膜，并将所述保护膜移动至所述电子设备的上部；
贴膜步骤2(S2)：取膜组件将保护膜相对电子设备呈预设的角度倾斜且一端接触电子设备；
贴膜步骤3(S3)：贴膜组件压紧保护膜的该端持续预设的时长时后；保护膜下移覆盖至电子设备；及
贴膜步骤4(S4)：贴膜组件从保护膜的该端至另一端移动，直至经过整个保护膜。
本领域技术人员也应当理解，如果将本发明所述方法或者装置、经过简单变化、在其上述方法增添功能进行组合、或者在其装置上进行替换，如各组件进行型号材料上的替换、使用环境进行替换、各组件位置关系进行简单替换等；或者将其所构成的产品一体设置；或者可拆卸设计；凡组合后的组件可以组成具有特定功能的方法/设备/装置，用这样的方法/设备/装置替代本发明的方法和装置均同样落在本发明的保护范围内。
以上仅为本发明较佳实施例而已，并不用以限制本发明，凡在本发明原则之内所作的任何修改，等同替换和改进等均应包含本发明的保护范围之内。

Claims (15)

  1. 一种自助贴膜机的贴膜方法，用于自助式的将保护膜贴合于电子设备上，其特征在于，该自助贴膜机包括贴膜机构，所述贴膜机构包括取膜组件以及贴膜组件，贴膜的方法包括如下步骤：
    贴膜步骤1：取膜组件拾取所述保护膜，并将所述保护膜移动至所述电子设备的上部；
    贴膜步骤2：取膜组件将保护膜相对电子设备呈预设的角度倾斜；及
    贴膜步骤3：贴膜组件压紧保护膜持续预设的时长时后；保护膜下移覆盖至电子设备。
  2. 如权利要求1所述的自助贴膜机的贴膜方法，其特征在于，取膜组件将保护膜相对电子设备呈预设的角度倾斜且一端接触电子设备，贴膜组件设置于所述贴膜步骤2中保护膜和电子设备接触的一端的正上方，所述贴膜步骤1中，取膜组件从电子设备和贴膜组件所在平面的一侧移动至电子设备的上部，所述贴膜步骤3中，贴膜组件紧压保护膜接触电子设备的一端。
  3. 如权利要求2所述的自助贴膜机的贴膜方法，其特征在于，所述贴膜步骤2为：所述取膜组件先将保护膜相对电子设备呈预设的角度倾斜，并不断朝靠近电子设备的方向下移，直至保护膜的其中一端接触到电子设备；
    或者取膜组件先将保护膜下移至预设的距离后，将保护膜相对电子设备呈角度c倾斜，直至保护膜的其中一端接触到电子设备。
  4. 如权利要求2所述的自助贴膜机的贴膜方法，其特征在于，所述贴膜步骤3为：贴膜组件移动至保护膜和所述电子设备接触的所在平面上；沿着所述保护膜和所述电子设备接触的一端朝另一端的方向，所述贴膜组件移动预设的距离并停止移动；以按压住保护膜与电子设备接触的一端，其中按压预设的时长为t。
  5. 如权利要求1所述的自助贴膜机的贴膜方法，其特征在于，所述贴膜步骤3中，所述保护膜下移覆盖至电子设备的方式为：所述取膜组件和保护膜脱离，以使保护膜下移覆盖至电子设备上。
  6. 如权利要求2所述的自助贴膜机的贴膜方法，其特征在于，所述方法进一步包括贴膜步骤4，所述贴膜组件从保护膜的与电子设备接触的一端至另一端移动，直至经过整个保护膜。
  7. 如权利要求5所述的自助贴膜机的贴膜方法，其特征在于，所述取膜组件和保护膜脱离的方式为：取膜组件带动保护膜沿背离电子设备的方向移动，在贴膜组件压紧保护膜的作用下时，保护膜从取膜组件上脱离。
  8. 如权利要求6所述的自助贴膜机的贴膜方法，其特征在于，在所述贴膜组件从保护膜与电子设备接触的一端至另一端移动的同时，所述取膜组件从电子设备和贴膜组件所在平面的一侧移出。
  9. 如权利要求2所述的自助贴膜机的贴膜方法，其特征在于，所述贴膜步骤3中，所述贴膜组件立即压紧保护膜的与电子设备接触的一端并持续预设的时长t时，所述时长t为1～30s内。
  10. 一种自助贴膜机，用于将自助式的将保护膜贴合于电子设备上，所述自助贴膜机包括：
    存膜组件，所述存膜组件设置有用于存放保护膜；
    取膜组件，所述取膜组件拾取所述保护膜，并将所述保护膜移动至所述电子设备的上部，取膜组件将保护膜相对电子设备呈预设的角度倾斜；
    贴膜组件，贴膜组件压紧保护膜持续预设的时长时后；保护膜下移覆盖至电子设备。
  11. 如权利要求10所述的自助贴膜机，其特征在于：所述取膜组件包括驱动部和固定部，所述固定部拾取所述保护膜，所述驱动部和固定部转动连接，所述驱动部可控制所述固定部的旋转，以使所述固定部拾取的保护膜产生倾斜。
  12. 如权利要求10所述的自助贴膜机，其特征在于：所述保护膜包括保护层和封装层，所述保护层定位在封装层上，所述封装层尺寸大于所述保护层；所述供膜机构包括多个形状尺寸相同的存膜腔，存膜腔存储至少两种保护膜，所述至少两种保护膜的保护层尺寸不同，封装层形状尺寸相同，所述保护膜通过封装层限位于存膜腔内。
  13. 如权利要求12所述的自助贴膜机，其特征在于：所述自助贴膜机还包括入料机构，所述入料机构包括入料导轨、放置板以及入料驱动件，所述放置板设置于所述入料导轨上，并且可在所述入料导轨上滑动，所述入料驱动件设置于入料导轨一侧，并与所述放置板连接，以驱动所述放置板在入料导轨上移动。
  14. 如权利要求13所述的自助贴膜机，其特征在于：所述放置板上设置有尺寸线，所述尺寸线至少与两种不同尺寸的电子设备适配，当所述电子设备放置在放置板上时所述电子设备与所述尺寸线对齐。
  15. 如权利要求10所述的自助贴膜机，其特征在于：所述贴膜组件包括压力辊，所述压力辊的表面为弹性材料。
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