WO2021027528A1 - 一种抑制气体分子污染物扩散的洁净室 - Google Patents

一种抑制气体分子污染物扩散的洁净室 Download PDF

Info

Publication number
WO2021027528A1
WO2021027528A1 PCT/CN2020/104616 CN2020104616W WO2021027528A1 WO 2021027528 A1 WO2021027528 A1 WO 2021027528A1 CN 2020104616 W CN2020104616 W CN 2020104616W WO 2021027528 A1 WO2021027528 A1 WO 2021027528A1
Authority
WO
WIPO (PCT)
Prior art keywords
technical
interlayer
double wall
mezzanine
double
Prior art date
Application number
PCT/CN2020/104616
Other languages
English (en)
French (fr)
Inventor
李传琰
李鹏
王江标
张欣赏
盛受文
肖红梅
Original Assignee
世源科技工程有限公司
中国电子工程设计院有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 世源科技工程有限公司, 中国电子工程设计院有限公司 filed Critical 世源科技工程有限公司
Priority to KR1020227007036A priority Critical patent/KR20220035264A/ko
Priority to EP20851748.2A priority patent/EP4012139A4/en
Publication of WO2021027528A1 publication Critical patent/WO2021027528A1/zh

Links

Images

Classifications

    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04H—BUILDINGS OR LIKE STRUCTURES FOR PARTICULAR PURPOSES; SWIMMING OR SPLASH BATHS OR POOLS; MASTS; FENCING; TENTS OR CANOPIES, IN GENERAL
    • E04H1/00—Buildings or groups of buildings for dwelling or office purposes; General layout, e.g. modular co-ordination or staggered storeys
    • E04H1/12—Small buildings or other erections for limited occupation, erected in the open air or arranged in buildings, e.g. kiosks, waiting shelters for bus stops or for filling stations, roofs for railway platforms, watchmen's huts or dressing cubicles
    • E04H1/1277—Shelters for decontamination
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
    • F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
    • F24F3/16—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by purification, e.g. by filtering; by sterilisation; by ozonisation
    • F24F3/167—Clean rooms, i.e. enclosed spaces in which a uniform flow of filtered air is distributed
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04H—BUILDINGS OR LIKE STRUCTURES FOR PARTICULAR PURPOSES; SWIMMING OR SPLASH BATHS OR POOLS; MASTS; FENCING; TENTS OR CANOPIES, IN GENERAL
    • E04H5/00—Buildings or groups of buildings for industrial or agricultural purposes
    • E04H5/02—Buildings or groups of buildings for industrial purposes, e.g. for power-plants or factories
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00—Control or safety arrangements
    • F24F11/89—Arrangement or mounting of control or safety devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
    • F24F13/02—Ducting arrangements
    • F24F13/0227—Ducting arrangements using parts of the building, e.g. air ducts inside the floor, walls or ceiling of a building
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F7/00—Ventilation
    • F24F7/04—Ventilation with ducting systems, e.g. by double walls; with natural circulation
    • F24F7/06—Ventilation with ducting systems, e.g. by double walls; with natural circulation with forced air circulation, e.g. by fan positioning of a ventilator in or against a conduit
    • F24F7/08—Ventilation with ducting systems, e.g. by double walls; with natural circulation with forced air circulation, e.g. by fan positioning of a ventilator in or against a conduit with separate ducts for supplied and exhausted air with provisions for reversal of the input and output systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00—Control or safety arrangements
    • F24F11/0001—Control or safety arrangements for ventilation
    • F24F2011/0002—Control or safety arrangements for ventilation for admittance of outside air
    • F24F2011/0005—Control or safety arrangements for ventilation for admittance of outside air to create underpressure in a room, keeping contamination inside
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F2110/00—Control inputs relating to air properties
    • F24F2110/40—Pressure, e.g. wind pressure

Definitions

  • This application relates to the technical field of clean workshops, in particular to a clean room that inhibits the diffusion of gas molecular pollutants.
  • TFT-LCD process requirements for high standards continue to increase, in order to ensure the product qualification rate, the requirements for clean room air quality are getting higher and higher; clean air molecular pollutants AMC have The production process will produce certain adverse effects and affect the product yield.
  • Array Photo of TFT-LCD production plant, CF Photo coating and baking production process, PI coating, baking, PI heavy industry production process organic waste gas generated by organic solvent cleaning process in PI area of alignment film It is connected to the roof zeolite runner unit and the regenerative combustion furnace through the exhaust gas pipeline for centralized treatment; but there are still some volatile organic compounds VOC left in the clean room of the above-mentioned VOC production process, which has certain adverse effects on the human body and the manufacturing environment. In particular, some production processes (such as the liquid crystal dripping ODF area) are more sensitive to VOC. When the VOC concentration left in the VOC production process area is high and diffuses to the ODF area through the air flow, it will seriously affect the product yield.
  • VOC production area In order to reduce the VOC concentration in the VOC pollution source area (hereinafter referred to as the VOC production area) produced by Array Photo, CF Photo, and PI.
  • the current effective measures are: setting these areas that generate VOC pollution sources into independent return air areas (rooms) to isolate the large-area diffusion of VOCs; and setting up a zeolite runner unit under the clean room technically to prevent VOCs in the air.
  • the removal method of continuous adsorption and regeneration discharges the concentrated and desorbed VOC to the main organic waste gas treatment system of the roof. Although the VOC treatment efficiency of the zeolite runner unit can reach 95%, there is still a part of VOC left in the clean room of these process areas.
  • the room with high cleanliness level should maintain a positive pressure difference of not less than 5Pa compared to the room with low cleanliness level.
  • the VOC area is biased towards the VOC sensitive area, which will cause the VOC to spread to the adjacent VOC sensitive area and affect its production environment and product yield.
  • the present application provides a clean room that inhibits the diffusion of gas molecular pollutants, which can reduce or prevent pollutants generated in a pollution source production area from entering the pollution source production area, thereby improving the yield of products in the pollution source production area.
  • the present application provides a clean room that inhibits the diffusion of gaseous molecular pollutants, including an upper technical interlayer, a lower technical interlayer, and a clean production area located between the upper technical interlayer and the lower technical interlayer;
  • the two sides of the production area form technical corridors for connecting the upper technical interlayer and the lower technical interlayer; it also includes pressure regulating equipment components.
  • the upper technical interlayer, the lower technical interlayer and the clean production area are all provided with partition walls,
  • the partition wall in the clean production area is used to separate the clean production area into a pollution source production area and a pollution-free production area, and the partition wall in the upper technical interlayer is used to separate the upper technical interlayer into A technical interlayer with pollution sources and a technical interlayer without pollution sources.
  • the partition wall in the lower technical interlayer is used to separate the lower technical interlayer into a technical interlayer with pollution sources and a technical interlayer without pollution sources: wherein,
  • the partition wall provided in the upper technical mezzanine layer is double-layered to form the upper technical mezzanine double wall chute, and the pressure regulating equipment assembly is used to adjust the air pressure in the upper technical mezzanine double wall chute to ensure normal production of the clean room
  • the pressure regulating equipment assembly is used to adjust the air pressure in the upper technical mezzanine double wall chute to ensure normal production of the clean room
  • the partition wall provided in the lower technical mezzanine layer is double-layered to form a lower technical mezzanine double wall chute, and the pressure regulating equipment assembly is used to adjust the air pressure in the lower technical mezzanine double wall chute to ensure normal production of the clean room
  • the air pressure in the lower technical interlayer double wall channel is higher than the air pressure in the adjacent technical mezzanine with pollution source and the technical mezzanine without pollution source, or when the clean room is in normal production
  • the lower technical mezzanine double wall The air pressure in the tunnel is lower than the air pressure in the adjacent technical interlayer with pollution source and the technical interlayer without pollution source.
  • the upper technical mezzanine is provided with upper technical mezzanine double wall channels, and/or the lower technical mezzanine is provided with lower technical mezzanine double wall channels; when the upper technical mezzanine is provided When there is a double-wall interlayer on the technical mezzanine, the pressure regulating equipment components adjust the air pressure in the double-wall mezzanine of the upper technical mezzanine so that the air pressure in the double-wall mezzanine of the upper technical mezzanine is higher than the air pressure in the technical mezzanine with pollution sources and the technical mezzanine on pollution sources .
  • the gas in the upper technical interlayer double wall has a tendency to diffuse or diffuse into the technical interlayer on the pollution source and the technical interlayer on no pollution source, so that the gas with the pollution source in the technical interlayer on the pollution source cannot pass through the upper technical interlayer double wall
  • the channels enter the technical interlayer without pollution sources to prevent the gas with pollution sources from entering the production area without pollution sources from the technical interlayer without pollution sources.
  • the pressure regulating equipment components are used to adjust the air pressure in the lower technical mezzanine double wall chute, so that the air pressure in the lower technical mezzanine double wall chute is higher than that in the normal production of the clean room.
  • the air pressure in the adjacent technical interlayer with pollution sources and the technical interlayer without pollution sources therefore, under the action of atmospheric pressure, the gas in the technical interlayer with pollution sources and the technical interlayer without pollution sources cannot enter the double-walled channels of the lower technical interlayer.
  • Pollution sources cannot enter the technical interlayer without pollution sources through the double wall of the lower technical interlayer to prevent the gas with pollution sources from entering the technical interlayer without pollution sources through the technical interlayer under the technical interlayer without pollution sources, thereby entering the pollution-free production area
  • the air pressure in the double wall sandwich channel of the lower technical interlayer is lower than the air pressure in the adjacent technical interlayer with pollution source and the technical interlayer without pollution source.
  • the gas in the technical interlayer with pollution source and the gas in the technical interlayer with no pollution source have a tendency to move in the downward technical interlayer double-wall sandwich or downward technical interlayer double-wall sandwich movement, so that the pollution source in the technical interlayer with pollution source Gas cannot enter the interlayer of pollution-free technology.
  • the clean room in this application is formed by forming the upper technical interlayer double wall clamp in the upper technical interlayer, and adjusting the air pressure in the upper technical interlayer double wall clamp by adjusting the equipment components; and/or
  • the lower technical interlayer double wall channel in the lower technical interlayer and adjusting the air pressure in the lower technical interlayer double wall interlayer by adjusting the equipment components, it can ensure the pollution source gas in the technical interlayer above the pollution source and/or the technical interlayer below the pollution source It is impossible to enter the technical interlayer above the pollution source and/or the technical interlayer below the pollution source to improve the yield of products in the pollution-free production area.
  • the partition wall provided in the clean production area is double-layered to form a double-wall clamp in the clean production area
  • the pressure regulating equipment assembly is also used to adjust the air pressure in the double-wall clamp in the production area to make
  • the air pressure in the double-wall clamps of the clean production area is higher than the air pressure in the production area with pollution source and the production area without pollution source.
  • the pressure regulating equipment assembly includes a first pressure regulating device for simultaneously adjusting the air pressure in the clean production area double wall clip channel and the lower technology sandwich double wall clip channel and the upper technology The second pressure regulating device for the air pressure in the sandwich double wall sandwich.
  • the first pressure regulating device includes a first air supply device for cooperating with a fresh air unit for supplying clean fresh air into the double-wall cavities of the lower technical interlayer and the double-wall cavities of the clean production area;
  • the second pressure regulating device includes a second air supply device for cooperating with a fresh air unit for supplying clean fresh air into the upper technical interlayer double wall clip.
  • a first pressure difference sensor is provided in the lower technical sandwich double-wall chute or the clean production area double-wall chute, and the air outlet pipe of the first air supply device is provided with a first pressure difference sensor.
  • the first regulating valve whose opening degree is adjusted by the difference value detected by the difference sensor;
  • a second differential pressure sensor is provided in the upper technical sandwich double wall chute, and a second differential pressure sensor is provided on the air outlet pipe of the second air supply device for adjusting the opening according to the difference detected by the second differential pressure sensor. Regulating valve.
  • the pressure regulating equipment assembly includes a first pressure regulating device that regulates the air pressure in the upper technical mezzanine double wall clip channel, a second pressure regulating device that regulates the air pressure in the double wall clip channel of the clean production area, and The third pressure regulating device used to adjust the air pressure in the double wall of the lower technical mezzanine.
  • the first pressure regulating device includes a first air supply device for cooperating with a fresh air blower unit for supplying clean fresh air into the upper technical sandwich double wall clip;
  • the second pressure regulating device includes a second air supply device for cooperating with a fresh air unit for supplying clean fresh air into the double-wall clamps of the clean production area;
  • the third pressure regulating device includes a first exhaust device for exhausting the gas in the lower technical sandwich double wall clip channel.
  • it further includes a pollution source collection wind box and a zeolite runner unit connected with the pollution source collection wind box;
  • the pollution source collection wind box is used to collect the pollution sources generated in the pollution source production area, and make the collected pollution sources enter the zeolite runner unit.
  • the width of the upper technical interlayer double wall chute, the lower technical interlayer double wall chute, and the clean production area double wall chute is greater than or equal to 600 mm.
  • Figure 1 is a schematic diagram of a clean internal structure in the prior art
  • Fig. 2 is a structural schematic diagram of air flow deviation when the air pressure in a clean room with a pollution source is higher than that without a pollution source in the prior art;
  • FIG. 3 is a schematic structural diagram of the airflow deviation when the double wall clip channel of the clean room clean production area is connected to the lower technology sandwich double wall clip channel according to an embodiment of the application;
  • FIG. 4 is a schematic structural diagram of the airflow deviation when the double wall clip channel of the clean room and the clean production area of the clean room are isolated from the lower technology double wall clip channel and the upper technology double wall clip channel of the embodiment of the application;
  • FIG. 5 is a schematic structural diagram of the first type of airflow deviation when the clean room is not provided with double wall clamps in the clean production area according to an embodiment of the application;
  • FIG. 6 is a schematic structural diagram of the second type of airflow deviation when the clean room is not provided with double wall clamps in the clean production area according to an embodiment of the application.
  • the embodiments of the application provide a clean room that inhibits the diffusion of gaseous molecular pollutants, including an upper technology interlayer, a lower technology interlayer, and one between the upper technology interlayer and the lower technology interlayer.
  • the clean production area between the two sides; the two sides of the clean production area form a technical channel for connecting the upper technical interlayer and the lower technical interlayer; it also includes pressure regulating equipment components, the upper technical interlayer, the lower technical interlayer, and clean production
  • the partition walls in the upper technical interlayer The wall is used to separate the upper technical interlayer into a pollution source upper technical interlayer 1 and a non-polluting source upper technical interlayer 2, and the partition wall in the lower technical interlayer is used to separate the lower technical interlayer into a lower technical interlayer with a pollution source 5 and technical interlayer 6 without pollution source: among them,
  • the partition wall provided in the upper technical mezzanine is double-layered to form the upper technical mezzanine double-wall chute 9, and the pressure regulating equipment assembly is used to adjust the air pressure in the upper technical mezzanine double-wall chute 9 to make the clean room During normal production, the air pressure in the upper technical interlayer double-wall aisle 9 is higher than the air pressure in the adjacent technical interlayer 1 with pollution source and the technical interlayer 2 without pollution source;
  • the partition wall provided in the lower technical mezzanine layer is double-layered to form the lower technical mezzanine double wall chute 11, and the pressure regulating equipment assembly is used to adjust the air pressure in the lower technical mezzanine double wall chute 11 to make a clean room
  • the air pressure in the lower technical interlayer double-wall aisle 11 is higher than the air pressure in the adjacent technical interlayer 5 with pollution source and the technical interlayer 6 without pollution source, or when the clean room is produced normally
  • the air pressure in the lower technical interlayer double wall aisle 11 is lower than the air pressure in the adjacent technical interlayer 5 with pollution source and the technical interlayer 6 without pollution source.
  • the upper technical mezzanine is provided with upper technical mezzanine double-wall chute 9, and/or the lower technical mezzanine is provided with lower technical mezzanine double-wall chute 11; when the upper technical mezzanine is provided with upper technology
  • the pressure regulating equipment components can adjust the air pressure in the upper technical mezzanine double wall clip channel 9 so that the air pressure in the upper technical mezzanine double wall clip channel 9 is higher than the adjacent pollution source during the normal production of the clean room The air pressure in the technical interlayer 1 and the technical interlayer 2 on no pollution source.
  • the gas in the upper technical interlayer double-wall channel 9 has a tendency to diffuse into the technical interlayer 1 with pollution sources and the technical interlayer 2 without pollution sources, so that the gas with pollution sources in the technical interlayer 1 with pollution sources cannot pass through the upper technical interlayer
  • the double-walled aisle 9 enters the non-polluting source upper technical interlayer 2 to prevent the pollution source from entering the non-polluting source technical interlayer 2 into the pollution-free production area 4.
  • the partition wall provided in the lower technical mezzanine layer is double-layered to form the lower technical mezzanine double wall channel 11, and the pressure regulating equipment components are used to adjust the air pressure in the lower technical mezzanine double wall channel 11 so that the clean room can produce normally.
  • the air pressure in the double-wall aisle 11 is higher than the air pressure in the adjacent technical interlayer 5 with pollution sources and the technical interlayer 6 without pollution sources; therefore, under the action of atmospheric pressure, the technical interlayer 5 with pollution sources and the technical interlayer 6 without pollution sources are under the action of atmospheric pressure.
  • the gas inside cannot enter the lower technical mezzanine double wall clip 11, and then the pollution source cannot enter the pollution-free lower technical mezzanine 6 through the lower technical mezzanine double wall clip 11, to avoid the pollution source from entering the technical mezzanine 6 through the technical clip without pollution source Into the pollution-free upper technical interlayer 2, thereby entering the pollution-free production area 4.
  • the air pressure in the lower technical interlayer double-walled channel 11 is lower than the air pressure in the adjacent technical interlayer 5 with pollution source and the technical interlayer 6 without pollution source.
  • the gas in the technical interlayer 5 with pollution sources and the gas in the technical interlayer 6 without pollution sources all have a tendency to move downwards in the technical interlayer double-wall sandwich channel 11 or move downwards in the technical interlayer double-wall sandwich channel 11, so that the gas in the technical sandwich with pollution source The gas with pollution sources cannot enter the interlayer of pollution-free technology.
  • the clean room for suppressing the diffusion of gaseous molecular pollutants in this embodiment is formed by forming the upper technical interlayer double wall channel 9 in the upper technical interlayer, and adjusting the upper technical interlayer double wall by adjusting the equipment components.
  • the air pressure in the wall clamp; and/or the lower technical mezzanine double wall channel is formed in the lower technical mezzanine, and the air pressure in the lower technical mezzanine double wall mezzanine 11 is adjusted by adjusting the equipment components to ensure that the upper technical mezzanine 1 and/or
  • the pollution source gas in the pollution source lower technical interlayer 5 cannot enter the pollution source upper technical interlayer 2 and/or the pollution source lower technical interlayer 6 to improve the yield of products in the pollution source production area 4.
  • the air pressure in the upper technical mezzanine double wall channel 9 is higher than that of the upper technical mezzanine with pollution source
  • the air pressure in the double-walled channel 11 of the lower technical mezzanine is higher than the air pressure in the technical mezzanine 5 with pollution source and the technical mezzanine 6 without pollution source
  • the pressure difference value of each area +30Pa for production area 3 with pollution source, +25Pa for technical interlayer 5 with pollution source, -5Pa for technical interlayer 1 with pollution source, +25Pa for production area 4 without pollution source, +15Pa for technical interlayer 6 without pollution source, no pollution source
  • the upper technical mezzanine 2 is -10Pa
  • the upper technical mezzanine double wall channel 9 is +
  • the air pressure in the upper technical mezzanine double wall channel 9 is higher than that of the upper technical mezzanine 1 with pollution source and no
  • the air pressure in the technical mezzanine 2 above the pollution source and the air pressure in the double wall aisle 11 of the lower technical mezzanine is lower than the air pressure of the technical mezzanine 5 with pollution source and the technical mezzanine 6 without pollution source
  • the pressure difference value of each area production area with pollution source 3 +30Pa, +25Pa for technical interlayer 5 with pollution sources, -5Pa for technical interlayer 1 with pollution sources, +25Pa for production areas without pollution sources, +15Pa for technical interlayer 6 without pollution sources, and +15Pa for technical interlayer 2 without pollution sources -10Pa
  • the upper technical mezzanine double wall channel 9 is +5Pa
  • the pressure regulating equipment assembly is also used to adjust the double wall clip in the production area In order to make the air pressure in the double wall clip 10 of the clean production area higher than the air pressure in the production area 3 with pollution source and the production area 4 without pollution source.
  • the double wall clamp 10 in the clean production area isolates the pollution source production area 3 from the pollution-free production area 4 to form a buffer part.
  • the air pressure in the double wall clamp 10 in the clean production area is greater than that under the adjustment of the pressure regulating equipment components. The air pressure of the pollution source production area 3 and the pollution source production area 4 adjacent to it, so that the pollution source gas in the pollution source production area 3 cannot enter the pollution source production area 4 under the action of the air pressure.
  • the clean production area double wall chute 10 is The lower technical mezzanine double wall clip 11 is connected to and isolated from the upper technical mezzanine double wall clip 9, and the pressure regulating equipment assembly includes the double wall clip 10 and the lower technical mezzanine double wall clip for simultaneous adjustment of the clean production area
  • the lower technical mezzanine double wall clip 11 is connected to the clean production area double wall clip 10, and the clean production area double wall clip 10 is isolated from the upper technical mezzanine double wall clip 9, so that the lower technical mezzanine double wall clip 11 is connected to the clean
  • the double-wall chute 10 in the production area adjusts the internal air pressure through the first pressure regulating device, so as to increase the utilization rate of the first pressure-regulating device, while the upper-tech sandwich double-wall chuck 9 is adjusted by an independent second adjustment device to make the upper
  • the air pressure in the double-wall chute 9 of the technical mezzanine is different from the air pressure in the double-wall chute 10 of the clean production area.
  • the pressure difference value of each area +30Pa for production area 3 with pollution source, +25Pa for technical interlayer 5 with pollution source, with The technical mezzanine 1 on the pollution source is -5Pa, the pollution-free production area 4 is +25Pa, the technical mezzanine 6 under no pollution source is +15Pa, the technical mezzanine 2 on no pollution source is -10Pa, and the upper technical mezzanine double wall channel 9 is +5Pa, clean In the production area, the double wall clip 10 and the lower technical mezzanine double wall clip 11 are +35Pa.
  • the first pressure regulating device includes a first pressure regulating device for cooperating with a fresh air unit for supplying clean fresh air into the lower technical interlayer double wall clip 11 and the clean production area double wall clip 10 Wind supply equipment;
  • the second pressure regulating device includes a second air supply device for cooperating with a fresh air unit for supplying clean fresh air into the upper technical sandwich double wall clip 9.
  • the first air supply equipment supplies air to the lower technical mezzanine double wall clip 11 and the clean production area double wall clip 10, so as to ensure that the air pressure of the lower technical mezzanine double wall clip 11 is higher than the two adjacent ones.
  • the air pressure of the double wall in the clean production area is higher than the air pressure of the two adjacent areas, and the pressure difference is not less than 5Pa.
  • the setting of the second air supply equipment can make the air pressure in the upper technical interlayer higher than the same. Two adjacent areas, and the pressure difference is not less than 5Pa.
  • a first differential pressure sensor is provided in the lower technical sandwich double wall clip 11 or the clean production area double wall clip 10, and the air outlet pipe of the first air supply device is provided with A first regulating valve that adjusts its opening according to the difference detected by the first differential pressure sensor;
  • a second differential pressure sensor is provided in the upper technical sandwich double wall clip 9, and the air outlet pipe of the second air supply device is provided with a second differential pressure sensor for adjusting the opening according to the difference detected by the second differential pressure sensor.
  • Two regulating valve In this embodiment, the setting of the first differential pressure sensor can detect the air pressure difference between the lower technical interlayer double wall clip 11 and the production layer double wall clip 10 and the outside, and the setting of the second differential pressure sensor can detect the upper technical sandwich double The air pressure difference between the wall clamp 9 and the outside, so that the controller can control the first regulating valve and the second regulating valve respectively, and then control the amount of air intake in the double wall clamp 11 of the technical mezzanine and the double wall clamp 10 of the production layer.
  • the amount of air intake in the upper technical mezzanine double wall chute 9 ensures that the air pressure in the upper technical mezzanine double wall chute 9 and the lower technical mezzanine double wall chute 11 and the production layer double wall chute 10 are in the preset range.
  • the clean production area double wall chute 10 is The lower technical mezzanine double wall clip channel 11 and the upper technical mezzanine double wall clip channel 9 are isolated.
  • the pressure regulating equipment assembly includes a first pressure regulating device that regulates the air pressure in the upper technical sandwich double wall clip channel 9 and regulates the clean The second pressure regulating device for the air pressure in the double-wall chute 10 in the production area and the third pressure regulating device for regulating the air pressure in the double-wall chuck 11 of the lower technical sandwich.
  • the double wall clip 10 of the clean production area is not connected to the lower technical mezzanine double wall clip 11 and the upper technical mezzanine double wall clip 9 so that the partition wall can be installed in each mezzanine according to the equipment layout in the clean room. Different locations are separated to facilitate the transformation of the old clean room.
  • the upper technical mezzanine double wall chute 9, the clean production area double wall chute 10, and the lower technical mezzanine double wall chute 11 are distributed with the first pressure regulating equipment and the second The second pressure regulating equipment and the third pressure regulating equipment, in this way, the upper technical mezzanine double wall clip 9, the clean production area double wall clip 10 and the lower technical mezzanine double wall clip 11 can be independently controlled, so that the upper technical mezzanine double wall clip 9, The air pressure in the double-wall chute 10 of the clean production area and the double-wall chute 11 of the lower technical mezzanine can more easily reach the predetermined value.
  • the pressure difference value of each area +30Pa for the production area with pollution source 3, with pollution source
  • the lower technical interlayer 5 is +25Pa
  • the upper technical interlayer 1 with pollution source is -5Pa
  • the non-polluting source production area 4 is +25Pa
  • the pollution-free lower technical interlayer 6 is +15Pa
  • the upper technical interlayer 2 without pollution source is -10Pa
  • the upper technical interlayer is -10Pa.
  • the double wall clip channel 9 is +5Pa
  • the double wall clip channel 10 in the clean production area is +35Pa
  • the lower technical mezzanine double wall clip channel 11 is +0Pa.
  • the first pressure regulating device includes a first air supply device for cooperating with a fresh air unit for supplying clean fresh air into the upper technical interlayer double wall clip 9;
  • the second pressure regulating device includes a second air supply device for cooperating with a fresh air unit for supplying clean fresh air into the double-wall clip 10 of the clean production area;
  • the third pressure regulating device includes a first air exhaust device for exhausting the gas in the lower technical sandwich double wall clip channel 11.
  • the first air supply equipment and the second air supply equipment can be separately connected to a fresh air unit, and the two fresh air units are used to provide fresh air for the first air supply equipment and the second air supply equipment; in addition, the first air supply equipment And the second air supply equipment can also be connected to a fresh air unit.
  • the fresh air supply equipment is connected to at least two branch pipes.
  • the first air supply equipment and the second air supply equipment are respectively connected to the branch pipes.
  • the wind equipment and the second air supply equipment provide fresh air.
  • the first air supply equipment and the second air supply equipment are distributed to provide clean fresh air to the upper technical mezzanine double wall chute 9 and the clean production area double wall chute 10, and to increase the air pressure in the upper technical mezzanine double wall chute 9
  • the air pressure in the technical mezzanine 1 with pollution sources and the technical mezzanine 2 on non-polluting sources is not less than 5 Pa, so that the air pressure in the double wall clip 10 of the clean production area is higher than the air pressure in the production area 3 with pollution source and the production area 4 without pollution source.
  • the third pressure regulating device adjusts the air pressure in the lower technical mezzanine double wall chute 11 to 0 Pa, so that the air pressure in the lower technical mezzanine double wall chute 11 is lower than the technical mezzanine 5 with pollution source and the technical mezzanine 6 without pollution source.
  • the gas with pollution source generated in the pollution source production area 3 will not enter the pollution-free production area 4 through the double-walled channel 10 of the clean production area, nor will it pass through the pollution source technical interlayer 5 and/ Or the technical interlayer 1 above the pollution source enters the technical interlayer 6 below the pollution source and/or the technical interlayer 2 above the pollution source.
  • it also includes a pollution source collection wind box 7 and a zeolite runner unit 8 connected with the pollution source collection wind box 7;
  • the pollution source collection wind box 7 is used to collect the pollution sources generated in the pollution source production area 3 and allow the collected pollution sources to enter the zeolite runner unit 8.
  • the pollution source collection wind box 7 can collect the pollution source gas generated in the pollution source production area 3 and make this part of the gas enter the zeolite runner unit 8, and the zeolite runner unit 8 can treat the gas with the pollution source The treatment is performed to reduce the amount of pollution source gas in the technical interlayer 5 with pollution source, so as to reduce the probability that the pollution source gas enters the pollution-free production area 4.
  • the widths of the upper technical interlayer double wall chute 9, the lower technical interlayer double wall chute 11, and the clean production area double wall chute 10 are greater than or equal to 600 mm.
  • the speed of the fresh air diffusion is generally 3-4m/s.
  • the fresh air in the wall chute can diffuse better, so that the air pressure in each part of the double-wall chute is relatively uniform, and the width of each double-wall chute is preferably 600 mm.

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Ventilation (AREA)
  • Separation Of Gases By Adsorption (AREA)

Abstract

本申请涉及洁净厂房技术领域，公开了一种抑制气体分子污染物扩散的洁净室，包括调压设备组件，用于调节上技术夹层双墙夹道内气压，以正常生产时使上技术夹层双墙夹道内的气压高于与其相邻的带污染源上技术夹层和无污染源上技术夹层内的气压；和/或，用于调节下技术夹层双墙夹道内气压，以正常生产时使下技术夹层双墙夹道内的气压高于与其相邻的带污染源下技术夹层和无污染源下技术夹层内的气压，或，以正常生产时使下技术夹层双墙夹道内的气压低于与其相邻的带污染源下技术夹层和无污染源下技术夹层内的气压。本申请公开的洁净室，可以降低或避免带污染源生产区产生的污染物进入到无污染源生产区中，以提高无污染源生产区中产品的良率。

Description

一种抑制气体分子污染物扩散的洁净室
相关申请的交叉引用
本申请要求在2019年08月09日提交中国专利局、申请号为201910736090.3、申请名称为“一种洁净室”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及洁净厂房技术领域，特别涉及一种抑制气体分子污染物扩散的洁净室。
背景技术
随着电子工业的主流产品半导体IC和显示器件TFT-LCD工艺制程的高标准需求不断提升，为了保障产品合格率，从而对洁净室空气质量要求越来越高；洁净空气分子污染物AMC对各生产工序工艺制程会产生一定的不良影响，影响产品良率。
例如：TFT-LCD生产厂房阵列曝光区Array Photo、彩膜曝光区CF Photo涂胶与烘烤生产工序，配向膜PI区PI涂布、烘烤、PI重工生产工序有机溶剂清洗过程产生的有机废气通过废气管道接至屋面沸石转轮机组和蓄热燃烧炉进行集中处理；但仍存在一部分挥发性有机物VOC遗留在上述产VOC生产工序的洁净室内，对人体及制造环境均有一定的不良影响，尤其是某些生产工序(如液晶滴注ODF区)对VOC比较敏感，当产VOC生产工序区域遗留VOC浓度较高，且通过空气流扩散至ODF区时，会严重影响产品良率。
为降低Array Photo、CF Photo、PI产VOC污染源区(以下简称产VOC区)VOC的浓度。目前有效的措施是：将这些产生VOC污染源的区域单独设置成独立回风区(房间)来隔绝VOC的大面积扩散；且在其洁净室下技术夹层设置沸石转轮机组对空气中的VOC进行持续吸附再生的去除方法，将浓 缩脱附后的VOC排放至屋面主有机废气处理系统。目前沸石转轮机组的VOC处理效率虽可达到95％，但始终仍存在一部分VOC遗留在这些工序区的洁净室内。
但是，如图1和图2所示，若VOC敏感区洁净等级要求低于产VOC区，洁净等级高的房间应相对洁净等级低的房间保持不小于5Pa的正压差，此时空气流由产VOC区偏向VOC敏感区，会导致VOC扩散到相邻VOC敏感区影响其生产环境及产品良率。
发明内容
本申请提供了一种抑制气体分子污染物扩散的洁净室，可以降低或避免带污染源生产区产生的污染物进入到无污染源生产区中，从而能够提高无污染源生产区中产品的良率。
为了达到上述目的，本申请提供了一种抑制气体分子污染物扩散的洁净室，包括上技术夹层、下技术夹层以及位于所述上技术夹层和下技术夹层之间的洁净生产区；所述洁净生产区的两侧形成用于连通所述上技术夹层和下技术夹层的技术夹道；还包括调压设备组件，所述上技术夹层、下技术夹层以及洁净生产区内均设有隔板墙，所述洁净生产区内的隔板墙用于将所述洁净生产区分隔为带污染源生产区和无污染源生产区，所述上技术夹层内的隔板墙用于将所述上技术夹层分隔为带污染源上技术夹层和无污染源上技术夹层，所述下技术夹层内的隔板墙用于将所述下技术夹层分隔为带污染源下技术夹层和无污染源下技术夹层：其中，
所述上技术夹层内设有的隔板墙为双层以形成上技术夹层双墙夹道，所述调压设备组件用于调节所述上技术夹层双墙夹道内气压，以使洁净室正常生产时使所述上技术夹层双墙夹道内的气压高于与其相邻的带污染源上技术夹层和无污染源上技术夹层内的气压；
和/或；
所述下技术夹层内设有的隔板墙为双层以形成下技术夹层双墙夹道，所 述调压设备组件用于调节所述下技术夹层双墙夹道内气压，以使洁净室正常生产时使所述下技术夹层双墙夹道内的气压高于与其相邻的带污染源下技术夹层和无污染源下技术夹层内的气压，或者，使洁净室正常生产时使所述下技术夹层双墙夹道内的气压低于与其相邻的带污染源下技术夹层和无污染源下技术夹层内的气压。
本申请中的抑制气体分子污染物扩散的洁净室，上技术夹层内设有上技术夹层双墙夹道，和/或，下技术夹层内设有下技术夹层双墙夹道；当上技术夹层内设有上技术夹层双墙夹道时，调压设备组件调节上技术夹层双墙夹道内的气压，使上技术夹层双墙夹道内的气压高于带污染源上技术夹层和无污染源上技术夹层内的气压。因此，上技术夹层双墙夹道内的气体有向带污染源上技术夹层和无污染源上技术夹层内扩散或扩散的趋势，从而带污染源上技术夹层内的带污染源的气体无法通过上技术夹层双墙夹道进入到无污染源上技术夹层中，以避免带污染源的气体由无污染源上技术夹层进入到无污染源生产区中。
当下技术夹层内设有下技术夹层双墙夹道时，调压设备组件用于调节下技术夹层双墙夹道内的气压，以使洁净室正常生产时下技术夹层双墙夹道内的气压高于与其相邻的带污染源下技术夹层和无污染源下技术夹层内的气压；因此，在大气压的作用下带污染源下技术夹层和无污染源下技术夹层内的气体无法进入到下技术夹层双墙夹道内，进而污染源无法通过下技术夹层双墙夹道进入到无污染源下技术夹层内，以避免带污染源的气体由无污染源下技术夹层经技术夹道进入到无污染源上技术夹层中，从而进入到无污染源生产区中；或者，使洁净室正常生产时使所述下技术夹层双墙夹道内的气压低于与其相邻的带污染源下技术夹层和无污染源下技术夹层内的气压。这样带污染源下技术夹层和无污染源下技术夹层内的气体均具有向下技术夹层双墙夹道内的运动的趋势或向下技术夹层双墙夹道运动，以使带污染源技术夹层内的带污染源的气体无法进入到无污染源技术夹层内。
因此，与现有技术相对比，本申请中的洁净室，通过在上技术夹层中形 成有上技术夹层双墙夹道，并通过调节设备组件调节上技术夹层双墙夹内的气压；和/或通过在下技术夹层内形成有下技术夹层双墙通道，并通过调节设备组件调节下技术夹层双墙夹道内气压，能够保证带污染源上技术夹层和/或带污染源下技术夹层内的带污染源的气体无法进入到无污染源上技术夹层和/或无污染源下技术夹层中，以提高无污染源生产区中产品的良率。
优选地，所述洁净生产区内设有的隔板墙为双层以形成洁净生产区双墙夹道，所述调压设备组件还用于调节所述生产区双墙夹道内的气压，以使所述洁净生产区双墙夹道内的气压高于所述带污染源生产区和无污染源生产区内的气压。
优选地，当所述下技术夹层内设有的隔板墙为双层以形成下技术夹层双墙夹道时，所述洁净生产区双墙夹道与所述下技术夹层双墙夹道连通、且与所述上技术夹层双墙夹道隔离，所述调压设备组件包括用于同时调节所述洁净生产区双墙夹道和下技术夹层双墙夹道内气压的第一调压设备和用于调节上技术夹层双墙夹道内气压的第二调压设备。
优选地，所述第一调压设备包括用于与新风机组配合以用于向所述下技术夹层双墙夹道以及洁净生产区双墙夹道内供入洁净新风的第一供风设备；
所述第二调压设备包括用于与新风机组配合以用于向所述上技术夹层双墙夹道内供入洁净新风的第二供风设备。
优选地，所述下技术夹层双墙夹道或所述洁净生产区双墙夹道内设有第一压差传感器，所述第一供风设备的出风管上设有用于根据所述第一压差传感器检测的差值调节开度的第一调节阀；
所述上技术夹层双墙夹道内设有第二压差传感器，所述第二供风设备的出风管上设有用于根据所述第二压差传感器检测的差值调节开度的第二调节阀。
优选地，当所述下技术夹层内设有的隔板墙为双层以形成下技术夹层双墙夹道时，所述洁净生产区双墙夹道与所述下技术夹层双墙夹道及所述上技术夹层双墙夹道隔离，所述调压设备组件包括调节所述上技术夹层双墙夹道 内气压的第一调压设备、调节所述洁净生产区双墙夹道内气压的第二调压设备和用于调节下技术夹层双墙夹道内气压的第三调压设备。
优选地，所述第一调压设备包括用于与新风机组配合以用于向所述上技术夹层双墙夹道内供入洁净新风的第一供风设备；
所述第二调压设备包括用于与新风机组配合以用于向所述洁净生产区双墙夹道内供入洁净新风的第二供风设备；
所述第三调压设备包括用于将所述下技术夹层双墙夹道内气体排出的第一排风设备。
优选地，还包括污染源收集集风箱和与污染源收集集风箱连通的沸石转轮机组；
所述污染源收集集风箱用于将所述带污染源生产区产生的污染源收集，并使收集的污染源进入到所述沸石转轮机组内。
优选地，所述上技术夹层双墙夹道、所述下技术夹层双墙夹道和所述洁净生产区双墙夹道的宽度大于或等于600mm。
附图说明
图1为现有技术中的一种洁净内部结构示意图；
图2为现有技术中的一种洁净室内带污染源区的气压高于无污染源的气压时气流偏向的结构示意图；
图3为本申请实施例的一种洁净室洁净生产区双墙夹道与下技术夹层双墙夹道连通时气流偏向的结构示意图；
图4为本申请实施例的一种洁净室洁净生产区双墙夹道与下技术夹层双墙夹道及上技术双墙夹道均隔离时气流偏向的结构示意图；
图5为本申请实施例的一种洁净室未设置洁净生产区双墙夹道时第一种气流偏向的结构示意图；
图6为本申请实施例的一种洁净室未设置洁净生产区双墙夹道时第二种气流偏向的结构示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参照图5和图6，本申请实施例提供了本申请提供了一种抑制气体分子污染物扩散的洁净室，包括上技术夹层、下技术夹层以及位于所述上技术夹层和下技术夹层之间的洁净生产区；所述洁净生产区的两侧形成用于连通所述上技术夹层和下技术夹层的技术夹道；还包括调压设备组件，所述上技术夹层、下技术夹层以及洁净生产区内均设有隔板墙，所述洁净生产区内的隔板墙用于将所述洁净生产区分隔为带污染源生产区3和无污染源生产区4，所述上技术夹层内的隔板墙用于将所述上技术夹层分隔为带污染源上技术夹层1和无污染源上技术夹层2，所述下技术夹层内的隔板墙用于将所述下技术夹层分隔为带污染源下技术夹层5和无污染源下技术夹层6：其中，
所述上技术夹层内设有的隔板墙为双层以形成上技术夹层双墙夹道9，所述调压设备组件用于调节所述上技术夹层双墙夹道9内气压，以使洁净室正常生产时使所述上技术夹层双墙夹道9内的气压高于与其相邻的带污染源上技术夹层1和无污染源上技术夹层2内的气压；
和/或；
所述下技术夹层内设有的隔板墙为双层以形成下技术夹层双墙夹道11，所述调压设备组件用于调节所述下技术夹层双墙夹道11内气压，以使洁净室正常生产时使所述下技术夹层双墙夹道11内的气压高于与其相邻的带污染源下技术夹层5和无污染源下技术夹层6内的气压，或者，使洁净室正常生产时使所述下技术夹层双墙夹道11内的气压低于与其相邻的带污染源下技术夹层5和无污染源下技术夹层6内的气压。
本申请实施例中的洁净室，上技术夹层内设有上技术夹层双墙夹道9，和/或，下技术夹层内设有下技术夹层双墙夹道11；当上技术夹层内设有上技术 夹层双墙夹道9时，调压设备组件能够调节上技术夹层双墙夹道9内的气压，以使洁净室正常生产时上技术夹层双墙夹道9内的气压高于与其相邻的带污染源上技术夹层1和无污染源上技术夹层2内的气压。因此，上技术夹层双墙夹道9内的气体有向带污染源上技术夹层1和无污染源上技术夹层2内扩散的趋势，从而带污染源上技术夹层1内的带污染源的气体无法通过上技术夹层双墙夹道9进入到无污染源上技术夹层2中，以避免污染源由无污染源上技术夹层2进入到无污染源生产区4中。
当下技术夹层内设有的隔板墙为双层以形成下技术夹层双墙夹道11，调压设备组件用于调节下技术夹层双墙夹道11内的气压，以使洁净室正常生产时下技术夹层双墙夹道11内的气压高于与其相邻的带污染源下技术夹层5和无污染源下技术夹层6内的气压；因此，在大气压的作用下带污染源下技术夹层5和无污染源下技术夹层6内的气体无法进入到下技术夹层双墙夹道11内，进而污染源无法通过下技术夹层双墙夹道11进入到无污染源下技术夹层6内，以避免污染源由无污染源下技术夹层6经技术夹道进入到无污染源上技术夹层2中，从而进入到无污染源生产区4中。或者，使洁净室正常生产时使所述下技术夹层双墙夹道11内的气压低于与其相邻的带污染源下技术夹层5和无污染源下技术夹层6内的气压。这样带污染源下技术夹层5和无污染源下技术夹层6内的气体均具有向下技术夹层双墙夹道11内的运动的趋势或向下技术夹层双墙夹道11运动，以使带污染源技术夹层内的带污染源的气体无法进入到无污染源技术夹层内。
因此，与现有技术相对比，本实施例中的抑制气体分子污染物扩散的洁净室，通过在上技术夹层中形成有上技术夹层双墙夹道9，并通过调节设备组件调节上技术夹层双墙夹内的气压；和/或通过在下技术夹层内形成有下技术夹层双墙通道，并通过调节设备组件调节下技术夹层双墙夹道11内气压，能够保证带污染源上技术夹层1和/或带污染源下技术夹层5内的带污染源的气体无法进入到无污染源上技术夹层2和/或无污染源下技术夹层6中，以提高无污染源生产区4中产品的良率。
具体实施方式中，当上技术夹层中形成有上技术夹层双墙夹道9，下技术夹层中形成有下技术夹层双墙夹道11，且上技术夹层双墙夹道9中的气压高于带污染源上技术夹层1和无污染源上技术夹层2内的气压，下技术夹层双墙夹道11内的气压高于带污染源下技术夹层5和无污染源下技术夹层6的气压时，各个区域的压差数值：带污染源生产区3为+30Pa，带污染源下技术夹层5为+25Pa，带污染源上技术夹层1为-5Pa，无污染源生产区4为+25Pa，无污染源下技术夹层6为+15Pa，无污染源上技术夹层2为-10Pa，上技术夹层双墙夹道9为+5Pa。
当上技术夹层中形成有上技术夹层双墙夹道9，下技术夹层中形成有下技术夹层双墙夹道11，且上技术夹层双墙夹道9中的气压高于带污染源上技术夹层1和无污染源上技术夹层2内的气压，下技术夹层双墙夹道11内的气压低于带污染源下技术夹层5和无污染源下技术夹层6的气压时，各个区域的压差数值：带污染源生产区3为+30Pa，带污染源下技术夹层5为+25Pa，带污染源上技术夹层1为-5Pa，无污染源生产区4为+25Pa，无污染源下技术夹层6为+15Pa，无污染源上技术夹层2为-10Pa，上技术夹层双墙夹道9为+5Pa，下技术夹层双墙夹道11为0Pa。
作为一种可选方式，当所述洁净生产区内设有的隔板墙为双层以形成洁净生产区双墙夹道10，所述调压设备组件还用于调节所述生产区双墙夹道内的气压，以使所述洁净生产区双墙夹道10内的气压高于所述带污染源生产区3和无污染源生产区4内的气压。
本实施例中，洁净生产区双墙夹道10将带污染源生产区3与无污染源生产区4隔离，形成缓冲部分，另外洁净生产区双墙夹道10内的气压在调压设备组件的调解下大于与其相邻的带污染源生产区3和无污染源生产区4的气压，从而在气压的作用下带污染源生产区3内的带污染源的气体无法进入到无污染源生产区4内。
作为一种可选方式，请参照图3，当所述下技术夹层内设有的隔板墙为双层以形成下技术夹层双墙夹道11时，所述洁净生产区双墙夹道10与所述下 技术夹层双墙夹道11连通、且与所述上技术夹层双墙夹道9隔离，所述调压设备组件包括用于同时调节所述洁净生产区双墙夹道10和下技术夹层双墙夹道11内气压的第一调压设备和用于调节上技术夹层双墙夹道9内气压的第二调压设备。
本实施例中，下技术夹层双墙夹道11与洁净生产区双墙夹道10连通，且洁净生产区双墙夹道10与上技术夹层双墙夹道9隔离，从而下技术夹层双墙夹道11与洁净生产区双墙夹道10通过第一调压设备调节内部的气压，从而可提高第一调压设备的利用率，而上技术夹层双墙夹道9通过独立的第二调节设备进行调节，可以使上技术夹层双墙夹道9内的气压与洁净生产区双墙夹道10内的气压不同。
具体实施方式中，当下技术夹层双墙夹道11与洁净生产区双墙夹道10连通时，各个区域的压差数值：带污染源生产区3为+30Pa，带污染源下技术夹层5为+25Pa，带污染源上技术夹层1为-5Pa，无污染源生产区4为+25Pa，无污染源下技术夹层6为+15Pa，无污染源上技术夹层2为-10Pa，上技术夹层双墙夹道9为+5Pa，洁净生产区双墙夹道10与下技术夹层双墙夹道11为+35Pa。
作为一种可选方式，所述第一调压设备包括用于与新风机组配合以用于向所述下技术夹层双墙夹道11以及洁净生产区双墙夹道10内供入洁净新风的第一供风设备；
所述第二调压设备包括用于与新风机组配合以用于向所述上技术夹层双墙夹道9内供入洁净新风的第二供风设备。
本实施例中，第一供风设备对下技术夹层双墙夹道11及洁净生产区双墙夹道10内进行供风，从而保证下技术夹层双墙夹道11的气压高于与其相邻的两个区域的气压，洁净生产区双墙夹道10高于与其相邻的两个区域的气压，且压差值不小于5Pa，第二供风设备的设置能够使上技术夹层内的气压高于与其相邻的两个区域，且压差值不小于5Pa。
作为一种可选方式，所述下技术夹层双墙夹道11或所述洁净生产区双墙夹道10内设有第一压差传感器，所述第一供风设备的出风管上设有用于根据 所述第一压差传感器检测的差值调节开度的第一调节阀；
所述上技术夹层双墙夹道9内设有第二压差传感器，所述第二供风设备的出风管上设有用于根据所述第二压差传感器检测的差值调节开度的第二调节阀。本实施例中，第一压差传感器的设置能检测到下技术夹层双墙夹道11和生产层双墙夹道10与外部的气压差值，第二压差传感器的设置能检测到上技术夹层双墙夹道9与外部的气压差值，这样控制器就可以分别控制第一调节阀和第二调节阀，进而控制下技术夹层双墙夹道11和生产层双墙夹道10内的进气的量及上技术夹层双墙夹道9内的进气的量，从而保证上技术夹层双墙夹道9及下技术夹层双墙夹道11内和生产层双墙夹道10的气压在预设的范围中。
作为一种可选方式，请参照图4，当所述下技术夹层内设有的隔板墙为双层以形成下技术夹层双墙夹道11时，所述洁净生产区双墙夹道10与所述下技术夹层双墙夹道11及所述上技术夹层双墙夹道9隔离，所述调压设备组件包括调节所述上技术夹层双墙夹道9内气压的第一调压设备、调节所述洁净生产区双墙夹道10内气压的第二调压设备和用于调节下技术夹层双墙夹道11内气压的第三调压设备。
本实施例中，洁净生产区双墙夹道10与下技术夹层双墙夹道11及上技术夹层双墙夹道9均不连通，这样隔板墙可以根据洁净室内的设备布设的情况对于每个夹层在不同的位置进行分隔，便于对旧的洁净室进行改造，而且上技术夹层双墙夹道9、洁净生产区双墙夹道10及下技术夹层双墙夹道11内分布设置了第一调压设备、第二调压设备和第三调压设备，这样，上技术夹层双墙夹道9、洁净生产区双墙夹道10及下技术夹层双墙夹道11可以独立的控制，使上技术夹层双墙夹道9、洁净生产区双墙夹道10及下技术夹层双墙夹道11内的气压更容易达到预定的值。
具体实施方式中，当洁净生产区双墙夹道10与下技术夹层双墙夹道11及上技术夹层双墙夹道9隔离时，各个区域的压差数值：带污染源生产区3为+30Pa，带污染源下技术夹层5为+25Pa，带污染源上技术夹层1为-5Pa， 无污染源生产区4为+25Pa，无污染源下技术夹层6为+15Pa，无污染源上技术夹层2为-10Pa，上技术夹层双墙夹道9为+5Pa，洁净生产区双墙夹道10为+35Pa，下技术夹层双墙夹道11为+0Pa。
作为一种可选方式，所述第一调压设备包括用于与新风机组配合以用于向所述上技术夹层双墙夹道9内供入洁净新风的第一供风设备；
所述第二调压设备包括用于与新风机组配合以用于向所述洁净生产区双墙夹道10内供入洁净新风的第二供风设备；
所述第三调压设备包括用于将所述下技术夹层双墙夹道11内气体排出的第一排风设备。
其中，第一供风设备和第二供风设备可分别单独的与一个新风机组连接，使用两个新风机组分别为第一供风设备和第二供风设备提供新风；另外第一供风设备和第二供风设备也可共同连接在一个新风机组上，新风机组分接至少两个分接管，第一供风设备和第二供风设备分别于分接管连接，通过分接管为第一供风设备和第二供风设备提供新风。
本实施例中，第一供风设备和第二供风设备分布为上技术夹层双墙夹道9及洁净生产区双墙夹道10提供洁净新风，并使上技术夹层双墙夹道9内的气压高于带污染源上技术夹层1和无污染源上技术夹层2内气压不少于5Pa，使洁净生产区双墙夹道10内的气压高于隔为带污染源生产区3和无污染源生产区4内气压不少于5Pa；第三调节压设备将下技术夹层双墙夹道11内的气压调至0Pa，使下技术夹层双墙夹道11内的气压低于带污染源下技术夹层5和无污染源下技术夹层6内的气压，这样，带污染源生产区3产生的带有污染源的气体即不会通过洁净生产区双墙夹道10进入到无污染源生产区4中，也不会经带污染源下技术夹层5和/或带污染源上技术夹层1进入到无污染源下技术夹层6和/或无污染源上技术夹层2中。
作为一种可选方式，还包括污染源收集集风箱7和与污染源收集集风箱7连通的沸石转轮机组8；
所述污染源收集集风箱7用于将所述带污染源生产区3产生的污染源收 集，并使收集的污染源进入到所述沸石转轮机组8内。
本实施例中，污染源收集集风箱7能够将带污染源生产区3产生的带有污染源的气体收集并使这部分气体进入到沸石转轮机组8内，通过沸石转轮机组8对具有污染源的气体进行处理，使带污染源下技术夹层5内的污染源气体的量降低，以降低带污染源的气体进入到无污染源生产区4的几率。
作为一种可选方式，所述上技术夹层双墙夹道9、所述下技术夹层双墙夹道11和所述洁净生产区双墙夹道10的宽度大于或等于600mm。
本实施例中，因新风通过上技术夹层双墙夹道9、下技术夹层双墙夹道11及洁净生产区双墙夹道10进入，而且新风扩散的速度一般在3-4m/s，为了保证各个双墙夹道内的新风能够扩散的效果较佳，使各个双墙夹道内各部的气压相对均匀，进而优选地的各个双墙夹道的宽度为600mm。
以上所述仅为本申请的说明性实施例，并不用以限制本申请，凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (9)

  1. 一种抑制气体分子污染物扩散的洁净室，包括上技术夹层、下技术夹层以及位于所述上技术夹层和下技术夹层之间的洁净生产区；所述洁净生产区的两侧形成用于连通所述上技术夹层和下技术夹层的技术夹道；其特征在于，还包括调压设备组件，所述上技术夹层、下技术夹层以及洁净生产区内均设有隔板墙，所述洁净生产区内的隔板墙用于将所述洁净生产区分隔为带污染源生产区和无污染源生产区，所述上技术夹层内的隔板墙用于将所述上技术夹层分隔为带污染源上技术夹层和无污染源上技术夹层，所述下技术夹层内的隔板墙用于将所述下技术夹层分隔为带污染源下技术夹层和无污染源下技术夹层：其中，
    所述上技术夹层内设有的隔板墙为双层以形成上技术夹层双墙夹道，所述调压设备组件用于调节所述上技术夹层双墙夹道内气压，以使洁净室正常生产时使所述上技术夹层双墙夹道内的气压高于与其相邻的带污染源上技术夹层和无污染源上技术夹层内的气压；
    和/或；
    所述下技术夹层内设有的隔板墙为双层以形成下技术夹层双墙夹道，所述调压设备组件用于调节所述下技术夹层双墙夹道内气压，以使洁净室正常生产时使所述下技术夹层双墙夹道内的气压高于与其相邻的带污染源下技术夹层和无污染源下技术夹层内的气压，或者，使洁净室正常生产时使所述下技术夹层双墙夹道内的气压低于与其相邻的带污染源下技术夹层和无污染源下技术夹层内的气压。
  2. 根据权利要求1所述的抑制气体分子污染物扩散的洁净室，其特征在于，所述洁净生产区内设有的隔板墙为双层以形成洁净生产区双墙夹道，所述调压设备组件还用于调节所述生产区双墙夹道内的气压，以使所述洁净生产区双墙夹道内的气压高于所述带污染源生产区和无污染源生产区内的气压。
  3. 根据权利要求2所述的抑制气体分子污染物扩散的洁净室，其特征在于，当所述下技术夹层内设有的隔板墙为双层以形成下技术夹层双墙夹道时，所述洁净生产区双墙夹道与所述下技术夹层双墙夹道连通、且与所述上技术夹层双墙夹道隔离，所述调压设备组件包括用于同时调节所述洁净生产区双墙夹道和下技术夹层双墙夹道内气压的第一调压设备和用于调节上技术夹层双墙夹道内气压的第二调压设备。
  4. 根据权利要求3所述的抑制气体分子污染物扩散的洁净室，其特征在于，所述第一调压设备包括用于与新风机组配合以用于向所述下技术夹层双墙夹道以及洁净生产区双墙夹道内供入洁净新风的第一供风设备；
    所述第二调压设备包括用于与新风机组配合以用于向所述上技术夹层双墙夹道内供入洁净新风的第二供风设备。
  5. 根据权利要求4所述的抑制气体分子污染物扩散的洁净室，其特征在于，所述下技术夹层双墙夹道或所述洁净生产区双墙夹道内设有第一压差传感器，所述第一供风设备的出风管上设有用于根据所述第一压差传感器检测的差值调节开度的第一调节阀；
    所述上技术夹层双墙夹道内设有第二压差传感器，所述第二供风设备的出风管上设有用于根据所述第二压差传感器检测的差值调节开度的第二调节阀。
  6. 根据权利要求2所述的抑制气体分子污染物扩散的洁净室，其特征在于，当所述下技术夹层内设有的隔板墙为双层以形成下技术夹层双墙夹道时，所述洁净生产区双墙夹道与所述下技术夹层双墙夹道及所述上技术夹层双墙夹道隔离，所述调压设备组件包括调节所述上技术夹层双墙夹道内气压的第一调压设备、调节所述洁净生产区双墙夹道内气压的第二调压设备和用于调节下技术夹层双墙夹道内气压的第三调压设备。
  7. 根据权利要求6所述的抑制气体分子污染物扩散的洁净室，其特征在于，所述第一调压设备包括用于与新风机组配合以用于向所述上技术夹层双墙夹道内供入洁净新风的第一供风设备；
    所述第二调压设备包括用于与新风机组配合以用于向所述洁净生产区双墙夹道内供入洁净新风的第二供风设备；
    所述第三调压设备包括用于将所述下技术夹层双墙夹道内气体排出的第一排风设备。
  8. 根据权利要求2所述的抑制气体分子污染物扩散的洁净室，其特征在于，还包括污染源收集集风箱和与污染源收集集风箱连通的沸石转轮机组；
    所述污染源收集集风箱用于将所述带污染源生产区产生的污染源收集，并使收集的污染源进入到所述沸石转轮机组内。
  9. 根据权利要求2所述的抑制气体分子污染物扩散的洁净室，其特征在于，所述上技术夹层双墙夹道、所述下技术夹层双墙夹道和所述洁净生产区双墙夹道的宽度大于或等于600mm。
PCT/CN2020/104616 2019-08-09 2020-07-24 一种抑制气体分子污染物扩散的洁净室 WO2021027528A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020227007036A KR20220035264A (ko) 2019-08-09 2020-07-24 기체 분자 오염 물질 확산을 억제하기 위한 클린룸
EP20851748.2A EP4012139A4 (en) 2019-08-09 2020-07-24 CLEAN ROOM WITH CAPABILITY TO PREVENT GASEOUS MOLECULAR CONTAMINATION BY DIFFUSION

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910736090.3A CN110439332A (zh) 2019-08-09 2019-08-09 一种洁净室
CN201910736090.3 2019-08-09

Publications (1)

Publication Number Publication Date
WO2021027528A1 true WO2021027528A1 (zh) 2021-02-18

Family

ID=68434331

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/104616 WO2021027528A1 (zh) 2019-08-09 2020-07-24 一种抑制气体分子污染物扩散的洁净室

Country Status (4)

Country Link
EP (1) EP4012139A4 (zh)
KR (1) KR20220035264A (zh)
CN (1) CN110439332A (zh)
WO (1) WO2021027528A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113607765A (zh) * 2021-08-03 2021-11-05 亚翔系统集成科技（苏州）股份有限公司 一种基于半导体生产线中不良产品的污染源查找方法
TWI802027B (zh) * 2021-07-29 2023-05-11 台灣積體電路製造股份有限公司 半導體製造廠房中的外氣處理裝置及使用該裝置淨化空氣的方法
CN116105251A (zh) * 2023-03-14 2023-05-12 通威微电子有限公司 半导体厂房净化设备

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110439332A (zh) * 2019-08-09 2019-11-12 世源科技工程有限公司 一种洁净室
CN111457530A (zh) * 2020-04-01 2020-07-28 北京联合大学 洁净室内移动污染源污染气隐藏式快速清除系统
EP3912649B1 (de) * 2020-05-19 2023-10-25 SEIWO Technik GmbH Modularer schutzraum sowie durchreiche für einen schutzraum
CN114099194B (zh) * 2021-10-25 2023-09-08 北京机械设备研究所 一种正压隔离舱
CN115095187B (zh) * 2022-03-24 2023-10-03 成都格力新晖医疗装备有限公司 移动实验室及其舱体机构

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1731032A (zh) * 2005-08-22 2006-02-08 无锡华润微电子有限公司 洁净室的空气调节、净化系统流型
CN101503916A (zh) * 2009-03-30 2009-08-12 云南白药集团股份有限公司 一种模块化厂房结构
CN204402090U (zh) * 2014-10-29 2015-06-17 中国医药集团重庆医药设计院 避免人流、物流交叉的生物医药厂房结构
CN105135566A (zh) * 2015-09-09 2015-12-09 同济大学 一种基于空气定向流动原理的污染物隔断系统及其使用方法
CN106245944A (zh) * 2016-06-15 2016-12-21 高海 分析检测基础装备实验室建筑模块及其成套性设计方法
CN206385856U (zh) * 2016-06-15 2017-08-08 高海 低集成度成套性分析检测基础装备实验室建筑模块
US20180142912A1 (en) * 2016-11-19 2018-05-24 Harris Environmental Systems, Inc. Environmental room with reduced energy consumption
CN110439332A (zh) * 2019-08-09 2019-11-12 世源科技工程有限公司 一种洁净室
CN210713992U (zh) * 2019-08-09 2020-06-09 世源科技工程有限公司 一种洁净室

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS625031A (ja) * 1985-06-28 1987-01-12 Kajima Corp 部分的に清浄度の異なるクリ−ンル−ム
JP3090088B2 (ja) * 1997-02-07 2000-09-18 富士電機株式会社 クリーンルームのファンフィルタユニット
US5922095A (en) * 1997-03-20 1999-07-13 Acoustiflo, Llc Air handling system for buildings and clean rooms
US6574937B1 (en) * 1999-09-07 2003-06-10 Speedfam-Ipec Corporation Clean room and method
CN102889249B (zh) * 2012-10-30 2015-07-15 深圳市华星光电技术有限公司 一种风机滤器单元和无尘室空气净化系统
CN105987433B (zh) * 2014-12-25 2019-04-09 世源科技工程有限公司 空气处理系统

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1731032A (zh) * 2005-08-22 2006-02-08 无锡华润微电子有限公司 洁净室的空气调节、净化系统流型
CN101503916A (zh) * 2009-03-30 2009-08-12 云南白药集团股份有限公司 一种模块化厂房结构
CN204402090U (zh) * 2014-10-29 2015-06-17 中国医药集团重庆医药设计院 避免人流、物流交叉的生物医药厂房结构
CN105135566A (zh) * 2015-09-09 2015-12-09 同济大学 一种基于空气定向流动原理的污染物隔断系统及其使用方法
CN106245944A (zh) * 2016-06-15 2016-12-21 高海 分析检测基础装备实验室建筑模块及其成套性设计方法
CN206385856U (zh) * 2016-06-15 2017-08-08 高海 低集成度成套性分析检测基础装备实验室建筑模块
US20180142912A1 (en) * 2016-11-19 2018-05-24 Harris Environmental Systems, Inc. Environmental room with reduced energy consumption
CN110439332A (zh) * 2019-08-09 2019-11-12 世源科技工程有限公司 一种洁净室
CN210713992U (zh) * 2019-08-09 2020-06-09 世源科技工程有限公司 一种洁净室

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4012139A4 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI802027B (zh) * 2021-07-29 2023-05-11 台灣積體電路製造股份有限公司 半導體製造廠房中的外氣處理裝置及使用該裝置淨化空氣的方法
CN113607765A (zh) * 2021-08-03 2021-11-05 亚翔系统集成科技（苏州）股份有限公司 一种基于半导体生产线中不良产品的污染源查找方法
CN113607765B (zh) * 2021-08-03 2024-04-12 亚翔系统集成科技（苏州）股份有限公司 一种基于半导体生产线中不良产品的污染源查找方法
CN116105251A (zh) * 2023-03-14 2023-05-12 通威微电子有限公司 半导体厂房净化设备
CN116105251B (zh) * 2023-03-14 2024-01-05 通威微电子有限公司 半导体厂房净化设备

Also Published As

Publication number Publication date
KR20220035264A (ko) 2022-03-21
EP4012139A4 (en) 2022-09-28
EP4012139A1 (en) 2022-06-15
CN110439332A (zh) 2019-11-12

Similar Documents

Publication Publication Date Title
WO2021027528A1 (zh) 一种抑制气体分子污染物扩散的洁净室
CN210713992U (zh) 一种洁净室
KR100250354B1 (ko) 클린 룸
CN206222552U (zh) 模块化变工况医用空气净化系统及具有该系统的手术室
CN102210014A (zh) 表面处理装置
US20190374985A1 (en) Manufacturing enclosure environmental containment systems and methods
WO2017107022A1 (zh) 一种平衡式干燥系统
KR20150034973A (ko) 건조장치 및 건조방법
CN106871620A (zh) 玻璃清洗干燥设备
CN214862367U (zh) 一种箱式移动床废气净化系统
KR101933681B1 (ko) 연속식 고형 흡착제 재생 플랜트
CN207822765U (zh) 一种废气处理系统及其注入式低温等离子一体机设备
WO2021013133A1 (zh) 一种可分区控制的洁净厂房
WO2021051822A1 (zh) 一种模块化工业排气净化系统及支管数量设置方法
CN213841205U (zh) 一种设有分区压差的净化车间
CN112791558A (zh) 旋转式气体吸附装置及其工作方法
CN211949806U (zh) 一种具有二次加湿系统的洁净室布置结构及洁净生产厂房
CN212348219U (zh) 一种有机废气吸脱附催化燃烧系统
JPH08247512A (ja) クリーンルーム
CN116657966B (zh) 一种高精度恒温恒湿微电子百级洁净实验室
CN214581530U (zh) 一种双层镀膜光伏ar玻璃的底层冷却装置
CN219111218U (zh) 一种流延设备废气处理装置
JP3350890B2 (ja) クリーンルーム内清浄度制御装置
CN107983081A (zh) 一种钢板生产过程中产生的无组织废气吸附解吸装置
JPH0678833B2 (ja) 半導体製造用空気調和方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20851748

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20227007036

Country of ref document: KR

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 2020851748

Country of ref document: EP

Effective date: 20220309