WO2021025045A1 - Dissipateur thermique - Google Patents

Dissipateur thermique Download PDF

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Publication number
WO2021025045A1
WO2021025045A1 PCT/JP2020/029945 JP2020029945W WO2021025045A1 WO 2021025045 A1 WO2021025045 A1 WO 2021025045A1 JP 2020029945 W JP2020029945 W JP 2020029945W WO 2021025045 A1 WO2021025045 A1 WO 2021025045A1
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WO
WIPO (PCT)
Prior art keywords
heat sink
groove
metal wire
outer diameter
heat
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Application number
PCT/JP2020/029945
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English (en)
Japanese (ja)
Inventor
光太郎 渡邊
俊彦 幸
Original Assignee
三菱マテリアル株式会社
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Filing date
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Application filed by 三菱マテリアル株式会社 filed Critical 三菱マテリアル株式会社
Publication of WO2021025045A1 publication Critical patent/WO2021025045A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a heat sink used to dissipate heat.
  • the present application claims priority based on Japanese Patent Application No. 2019-144843 filed on August 6, 2019, the contents of which are incorporated herein by reference.
  • a heat sink is provided to dissipate the heat of the semiconductor elements in order to operate the electronic components normally.
  • This heat sink is made of aluminum or copper having high thermal conductivity, and a structure in which a large number of plate-shaped or pin-shaped fins are erected on one side of a flat plate-shaped substrate is often used.
  • the substrate portion is brought into close contact with a body to be cooled such as a power module, and fins are arranged in a heat medium flow path to cool the body to be cooled.
  • Patent Document 1 describes a heat sink in which fins of a solid material are erected on a base plate.
  • Patent Document 2 describes a heat sink in which a porous material is filled between fins of a solid material, and a high heat transfer coefficient can be obtained by increasing the specific surface area of the fins.
  • Patent Document 3 describes a heat sink in which a coil is arranged on a base plate, and has a high specific surface area and a high heat transfer coefficient as compared with fins formed of a solid material.
  • the heat sink described in Patent Document 1 since the fin is a solid material, the surface area is small and a high heat transfer coefficient cannot be expected.
  • the heat resistance is low because the specific surface area of the porous body is high, but the pressure loss becomes too high because the space through which the heat medium flows is small.
  • the coil is a wire rod, the cross-sectional area is small, and the thermal resistance is high, so that it is difficult for heat to spread throughout the coil.
  • Patent Document 4 proposes a straight fin having a structure in which a fibrous porous body is bonded to the surface of a core portion of a solid material. It is assumed that this heat sink has a lower pressure loss than the foamed metal because the fibers of the fibrous porous body that fills the groove of the straight fin have an orientation that reduces the pressure loss.
  • the cooling method may be natural cooling that does not allow the refrigerant to flow.
  • a heat sink that can reliably cool even in such a case is desired.
  • An object of the present invention is to provide a heat sink having cooling performance capable of coping with natural cooling while reducing convective thermal resistance.
  • the heat sink of the present invention is a metal molded body having a substrate portion, two or more fin portions erected on the surface of the substrate portion and arranged in parallel with each other, and one or more formed between the fin portions. It has one or more fillers made of a plurality of coiled metal wires filled in the groove portion, and the coiled metal wire has a first end portion having a first outer diameter and the first outer diameter. It has a second end with a second outer diameter of a different size and is partially metallurgically joined to at least one of the inner surface of the groove and the other coiled metal wire.
  • the heat sink extends along the depth direction of the groove portion and divides the depth into three with respect to the gap portion on each of the first dividing lines.
  • the average value of the lengths of the two second portions is such that the ratio to the depth of the groove is 20% or more and 60% or less, and the width of the groove is divided into three in a cross section orthogonal to the length direction of the groove.
  • the average value of the lengths of the gaps on each of the second dividing lines is such that the ratio to the width of the groove is 45% or more and 65% or less.
  • a filler made of a plurality of coiled metal wires is filled in the groove between the fin portions of the solid material, and heat transfer is performed in a wide area including the fin portion, the substrate portion and the filler.
  • the coiled metal wire is metallurgically bonded to the metal molded body or other coiled metal wire, that is, the filler made of the coiled metal wire is bonded to the inner surface of the groove via the metallurgical joint.
  • the thermal resistance at the junction interface between the metal molded body and the filler is small, and heat transfer is smoothly promoted.
  • Heat is exchanged between the heat medium that fills the voids in the filling body in the groove and the surface of the coiled metal wire and the metal molded body. At this time, if the heat medium is not forcibly distributed, the heat medium flows (moves) from the surface of the coiled metal wire or the metal molded body by natural convection. Since the filler of the present invention is made of a coiled metal wire, the voids are large and the pressure loss is small as compared with the foamed metal or the porous fiber.
  • each part of the wire intersects with the flow of the heat medium in the direction orthogonal to the length direction of the coil. Further, since the outer diameter of the coil is different between the first end side and the second end side, each part of the wire rod intersects with the flow of the heat medium in the direction along the length direction of the coil.
  • heat can be reliably exchanged between the coiled metal wire and the heat medium. Therefore, heat can be quickly dissipated not only in the case of forced distribution of the heat medium but also in the case of natural cooling.
  • the filling material has a high degree of freedom in product design because the filling rate in the groove can be freely controlled by simply changing the thickness and number of turns of the coiled metal wire.
  • the coiled metal wire has a shape in which the wire is wound into a coil and can be easily molded.
  • a cutting piece obtained by cutting a solid material can also be used.
  • the gap is too large, so that the metal molded body and the coiled metal Heat dissipation due to heat transfer of the material is reduced.
  • the fin portion, the substrate portion, and the filler are metallurgical bonding having a chemical bond between metal atoms at the interface, unlike mechanical bonding such as sintering, solid phase bonding, soldering, or brazing. It is joined by.
  • the cross-sectional shape orthogonal to the length direction of the coiled metal wire is formed into a polygon of pentagon or less.
  • the cross-sectional shape of the coiled metal wire may be circular or elliptical, but in the case of a circle or ellipse, the flow of the heat medium is smoothly divided along both side surfaces (arc surfaces) of the coiled metal wire.
  • the cross-sectional shape of the coiled metal wire is any of a triangle, a quadrangle, and a pentagon
  • the outer shape is formed by a plurality of planes or curved surfaces having a large radius of curvature.
  • a vortex is generated behind the coiled metal wire.
  • the cross-sectional shape is quadrangular, a thin plate-shaped wire rod is also included.
  • the coiled metal wire has a ratio N / L of 0.1 mm -1 or more when the total length of a single coil is L mm and the number of turns is N.
  • the ratio (DA-DB) / L is 0.05 or more. It would be nice to have one.
  • a preferred embodiment of the heat sink of the present invention is a cut piece produced by cutting.
  • the porosity occupied by the volume of the void portion with respect to the total volume V S1 ⁇ S2 ⁇ h1 in which the flat area of the substrate portion is set to S1 ⁇ S2 and the height of the fin portion is set to h1. Is preferably 50% or more and 65% or less. Even when a solder material or a brazing material is used for the metallurgical joining of the coiled metal wire, if the porosity is within this range, the flow (movement) of the heat medium can be appropriately secured, and efficient heat transfer is possible. ..
  • the surface area that contributes to heat exchange is increased by using the coiled metal wire, and the coiled metal wire having different diameters at both ends makes it difficult to hinder the movement of the heat medium.
  • FIG. 1 It is a perspective view which shows typically the heat sink of one Embodiment. It is an enlarged plan view of a part of FIG. It is a side view which enlarged a part of FIG. It is a top view which shows typically the filling body filled in the groove part of the metal molded body. It is a schematic diagram of a coiled metal wire rod forming a filler. It is a schematic diagram of a coiled metal wire rod forming a filler. It is a photograph of a cutting piece used as a coiled metal wire. It is a cross-sectional photograph of a cutting piece. It is a side view which shows typically one process of the manufacturing method of the heat sink of one Embodiment. It is a side view which shows typically the state following FIG.
  • the heat sink 101 As shown in FIGS. 1 to 3, the heat sink 101 according to the embodiment of the present invention has a composite structure in which the metal molded body 10 and one or more (9 pieces in the present embodiment) filler 20 are combined. There is.
  • the metal molded body 10 has a plate-shaped substrate portion 11 and a large number of strip-shaped (plate-shaped) fins erected on one side of the substrate portion 11 and arranged in parallel with each other (8 in this embodiment). It has a portion 12 and one or more groove portions 13 formed between the fin portions 12.
  • the metal molded body 10 is a molded body in which the substrate portion 11 and each fin portion 12 are integrally formed of a solid material of aluminum (including an aluminum alloy).
  • the filler 20 is formed of a plurality of coiled metal wires 21 (hereinafter, “coil chips 21”) made of aluminum (or an aluminum alloy) made of the same material as the metal molded body 10. There is.
  • One filler 20 is provided in one groove 13.
  • the metal molded body 10 and the filler 20 may have good thermal conductivity, and are not limited to those made of aluminum or an aluminum alloy. When the metal molded body 10 and the packed body 20 are joined by sintering as described later, the metal molded body 10 and the packed body 20 may be made of different metals as long as they can be sintered. When the metal molded body 10 and the filler 20 are joined by soldering or brazing, any metal having good thermal conductivity and capable of soldering or brazing may be used.
  • the substrate portion 11 has a rectangular planar shape having a length S1 and a width S2.
  • Each fin portion 12 is erected vertically from the surface of the substrate portion 11 at a predetermined height h1 and a predetermined thickness t1.
  • the fin portions 12 are provided on the surface of the substrate portion 11 over the entire length in the length direction, and are arranged parallel to each other with a predetermined separation interval c1 in the width direction of the substrate portion 11. There is. As a result, the opening width of the groove portion 13 provided between the fin portions 12 becomes c1. A heat medium is introduced into the groove 13.
  • the outer surface of the outer fin portion 12A arranged on the outermost side of the fin portions 12 is arranged inside the side edge surfaces of the substrate portion 11, but the outer surface of the outer fin portion 12A and the substrate Both side edge surfaces of the portion 11 may be the same surface. That is, the outer fin portion 12A does not necessarily have to be arranged inside the side edge surfaces of the substrate portion 11. In this case, the filler 20 is not arranged on the outside of the outer fin portion 12A.
  • the separation distance c2 from the outer surface of the outer fin portion 12A to the side edge surface of the substrate portion 11 is formed to be the same as the separation distance c1 between the fin portions 12 or smaller than the separation distance c1.
  • the coil tip 21 forming the filler 20 is wound in a substantially spiral shape as a whole, but is not a perfect coil shape and is screwed as a whole. It is formed so that it can be used.
  • the end portion on the larger outer diameter side is the first end portion 21a (first outer diameter d1), and the end portion on the smaller outer diameter side is the second end portion 21b (second end portion 21b).
  • the outer diameter is d2). Since it is difficult to measure the outer diameter of the substantially spiral coil tip 21 as the diameter of a circle, it is the outermost wire in a wire rod of about one turn or more from the tip (first end 21a, second end 21b).
  • the outer diameter (d1, d2) is defined as the dimension obtained when two points 180 ° facing each other are measured in a direction orthogonal to the length direction of the coil.
  • each coil tip 21 of the filler 20 when the total length of one coil tip 21 is L mm and the number of turns is N, the ratio N / L is 0.1 mm -1 or more, the maximum outer diameter is DA mm, and the minimum outside.
  • the ratio (DA-DB) / L is 0.05 or more.
  • the maximum outer diameter DA of the coil tip 21 referred to here is not the first outer diameter d1 when the coil tip 21 is measured by itself, but a state in which the coil tip 21 is pressed and deformed by being filled between the fin portions 12.
  • the minimum outer diameter DB is not the second outer diameter d2 when the coil chip 21 is measured by itself, but the average value of the minimum major diameter in the pressed and deformed state and the minor diameter corresponding to the right angle thereof.
  • the minimum outer diameter DB may be regarded as the same as the second outer diameter d2.
  • each coil tip 21 orthogonal to the length direction is not circular but triangular.
  • the filler 20 is provided so as to fill each groove portion 13, and is joined to the inner surface (surface of the fin portion 12 and the substrate portion 11) of each groove portion 13 via a sintered portion (metallurgical joint portion) 22. As shown in FIG. 4, not all coil chips 21 are bonded to the fin portion 12 or the substrate portion 11, but are bonded only to the other coil chips 21 via the sintered portion 22. There is also a coil tip 21. However, one filler 20 is joined to the fin portion 12 and the substrate portion 11 via the sintered portion 22 at any portion of the total length.
  • each coil tip 21 is joined to at least one of the inner surface of the groove 13 and the other coil tip 21.
  • the hatched coil tip 21 is not joined to the metal molded body 10, but is joined only to another coil tip 21.
  • each coil tip 21 has a different outer diameter between the first end portion 21a and the second end portion 21b.
  • Each coil chip 21 is arranged so that the length direction is along the length direction of the groove portion 13, that is, the flow direction of the heat medium, so that the circumferential direction (side surface of the wire rod) of the coil chip 21 is the length of the groove portion 13. It intersects the direction, i.e. the flow of heat medium. Since the cross section of the coil tip 21 has a substantially triangular shape in which a plurality of straight lines or curves are combined, the plane or curved surface forming the surface of the coil tip 21 intersects with the flow of the heat medium.
  • the coil tip 21 is not only obtained by precision machining, but also a cutting piece (see FIGS. 7 and 8) produced by cutting with a milling machine or the like is preferably used.
  • the shape of the cutting piece is not constant.
  • the surface of the coil tip 21 is formed by a flat surface, a curved surface, a curved surface having some irregularities, and the like, and has a plurality of corners.
  • the cross-sectional shape of the coiled metal wire is not limited to a triangle, and a quadrangle or a pentagon can also be used.
  • the size (porosity) of the gap G through which the heat medium can flow affects the pressure loss and heat transfer amount of the heat medium.
  • the porosity of the heat sink 101 is the product of the flat area of the region where the heat medium is circulated on the surface of the substrate portion 11 (flat area of the metal molded body 10, S1 ⁇ S2 in FIG. 1) and the height h1 of the fin portion 12. Is taken as the total volume V, and is obtained as the ratio of the volume of the void portion G (the volume of the space excluding the metal (aluminum) portion of the fin portion 12 and the filler 20) to the total volume V.
  • the porosity is preferably 50% or more and 65% or less.
  • the total volume V is the product of the flat area (S1 ⁇ S2) of the metal molded body 10 and the height h1 of the fin portion 12.
  • the width of one groove portion 13 is divided into three and the gap portions G on the two first dividing lines A1 and A2 extending in the depth direction are divided into three.
  • the average value Fa of the lengths F1 to F6 and the average value Wa of the lengths W1 to W4 of the gaps G on the two second dividing lines B1 and B2 extending in the width direction are obtained by dividing the depth into three.
  • the ratio of the average value Wa of W1 to W4 to the opening width c1 of the groove portion 13 is 45% or more and 65% or less, and the ratio of the average value Fa of F1 to F6 to the depth h1 of the groove portion 13 is 20% or more and 60% or less. is there.
  • the average value Wa of the width direction lengths of the gap portions G on each dividing line is 0.9 mm or more 1
  • the average value Fa of the length in the depth direction is 0.8 mm or more and 6 mm or less.
  • the groove portion 13 has a depth h1 larger than the opening width c1.
  • the substrate portion 11 and the fin portion 12 are formed by, for example, extrusion molding, forging molding, casting molding of aluminum, or brazing to join the substrate portion 11 and the fin portion 12.
  • the solid metal molded body 10 having the above is integrally formed.
  • the coil tip 21 (filler 20) is joined into the groove portion 13 between the fin portions 12 by using the mold 51 shown in FIGS. 9 and 10.
  • a mixed powder of magnesium and silicon is used for joining the coil tip 21.
  • Mg and Si are eutectic elements of Al, and by adhering to the surface of a wire rod made of an aluminum alloy and heating it, only the adhered portion of the wire rod can be melted and bonded.
  • a suitable mixing ratio of magnesium and silicon in the mixed powder is, for example, 1.5 silicon to 1 magnesium by weight, whereby the bonding strength of the coil tip 21 can be sufficiently secured.
  • This mixed powder is attached to the surface of the coil tip 21 using a binder having a property of burning at a high temperature.
  • the mold 51 is made of a material (for example, carbon or the like) that does not easily react with the coil tip 21 of the metal molded body 10 and the filler 20, and as shown in FIGS. 9 and 10, a rectangular recess for accommodating the fin portion 12. It is formed in a plate shape having 52 on one side.
  • a space 53 is provided between the metal molded body 10 (the substrate portion 11 and each fin portion 12) and the mold 51. Is formed.
  • the coil tip 21 For the coil tip 21, prepare a cutting piece generated by cutting such as a milling machine. As shown in FIG. 9, the plurality of coil chips 21 are arranged side by side on the groove portion 13 so as to be aligned with the length direction of the groove portion 13.
  • the coil tips 21 having a first outer diameter d1 larger than the separation interval c1 are arranged between the fin portions 12 and arranged at the upper part of the groove portion 13.
  • a coil tip 21 having a first outer diameter d1 smaller than the separation interval c1 is placed on the coil tip 21.
  • each coil tip 21 does not fall into the groove portion 13 as shown in FIG. 9, but is held at the upper end portion of each fin portion 12 in a state of being in contact with each other.
  • the mold 51 After arranging the coil tip 21 in which the above-mentioned mixed powder of magnesium and silicon is adhered to the surface by a binder as described above, the mold 51 is superposed on the metal molded body 10 and advanced, and the coil tip 21 is placed in the groove portion 13. The coil tip 21 is filled in each space 53.
  • each contact point between the coil tip 21 and the metal molded body 10 and each contact point between the coil tips 21 are brought into contact with each other.
  • the sintered portion 22 to be joined is formed.
  • the filler 20 formed by joining the coil chips 21 to each other via the sintered portion 22 is formed, and the metal molded body 10 and the filler 20 are integrally joined via the sintered portion 22.
  • a heat sink 101 can be obtained.
  • heat transfer is performed in a wide area including each fin portion 12, the substrate portion 11, and the filler 20. Further, since the fin portion 12, the substrate portion 11, and the filler 20 are joined via the sintered portion 22, the thermal resistance at the bonding interface is small, and the heat from the substrate portion 11 and the fin portion 12 to the filler 20 is small. Movement is facilitated smoothly.
  • the heat medium flows through the gap portion G, heat is exchanged between the surfaces of the filler 20, the fin portion 12, and the substrate portion 11 and the heat medium. Since a large surface area is formed by the filler 20, the heat received by the filler 20 from the metal molded body 10 is efficiently transferred to the heat medium, so that the heat sink 101 can obtain an excellent heat transfer coefficient. Since the filler 20 obstructs the flow of the heat medium and can disturb the flow of the heat medium, it has the effect of promoting heat exchange more than the specific surface area becomes larger than that of the heat sink made of only the solid material. is there.
  • the coil tip 21 has a large void, the pressure loss of the filler 20 is lower than that of the foamed metal or the porous fiber. Since the filler 20 can freely control the size of the porosity and the like only by changing the thickness and outer diameter of each coil tip 21 and the filling method, the degree of freedom in product design is high.
  • the porosity is reduced due to the penetration of the brazing material and filling of the filler 20. (Increase in metal density) does not occur.
  • an appropriate amount of brazing material or solder material that does not excessively reduce the porosity may be used, and even in that case, the porosity is preferably 50% or more and 65% or less.
  • the joint portion between the fin portion 12 and the substrate portion 11 and the filler 20 including the sintered portion and the brazing joint portion is referred to as a metallurgical joint portion.
  • each coil tip 21 of the present embodiment has a groove portion 13 length because the first outer diameter d1 of the first end portion 21a and the second outer diameter d2 of the second end portion 21b are different.
  • each part intersects the flow, and the heat from the heat medium can be reliably received.
  • heat transfer occurs in contact with each part of the entire length of the coil tip 21. Therefore, the coil tip 21 reliably transfers heat to the heat medium regardless of the orientation of its arrangement, and brings excellent heat dissipation to the heat sink 101.
  • each coil chip 21 Since the surface of each coil chip 21 is composed of a plurality of planes or curved surfaces having a large radius of curvature and the cross section is formed in a triangular shape, the surfaces exist in a direction intersecting the flow of the heat medium, and the heat medium The flow is received by the surface of the coil chip 21 to ensure that the heat from the heat medium is received. Further, the flow collides with the surface of the coil tip 21 and a vortex is generated behind the coil tip 21, and as a result, the flow of the heat medium is more disturbed and the disturbing effect is enhanced, further promoting heat exchange. Can be done.
  • FIGS. 12 to 16 are observation images of an actual heat sink produced by the above configuration.
  • FIG. 12 is a plan view of the heat sink 101A
  • FIG. 13 is a side view thereof.
  • FIG. 14 is a plan view of the heat sink 101B different from that of FIG. 12, and
  • FIG. 15 is a side view thereof.
  • FIG. 16 is an observation image of a cross section of one groove portion 13 of the heat sink 101B of FIG.
  • the coil chips 21 are arranged in an orderly manner with an appropriate distance between the coil chips 21 and the metal molded body 10.
  • FIG. 17 is an application example in which the heat sink 101C is used as a heat radiating component of an LED.
  • a thermal interface material 31 is provided on a flat surface of the substrate portion 11 opposite to the fin portion 12, an insulating circuit board 32 is provided on the thermal interface material 31, and an LED is provided on the insulating circuit board 32 by a solder layer 34.
  • Package 33 is attached.
  • the insulating circuit board 32 has a configuration in which a metal layer 36 made of copper or the like is formed on one surface of the insulating substrate 35, and a circuit layer 37 made of copper or the like is formed on the other surface of the insulating substrate 35.
  • the thermal interface material 31 is made of a heat conductive material such as a heat conductive sheet and grease.
  • the metal layer 36 and the circuit layer 37 are bonded to the insulating substrate 35 by adhesion or the like.
  • the LED package 33 is a package substrate in which an LED element is bonded to an electrode of a package substrate with a bonding wire or the like and integrally sealed with a resin.
  • a heat sink equipped with such an LED is used as a lighting fixture for vehicles and the like. In many cases, it is attached to a housing such as a vehicle body and cooled by natural cooling, and even in that case, as described above, it has excellent heat dissipation.
  • a heat sink 101 having a strip-shaped (plate-shaped) fin portion 12 shown in FIG. 3 was produced.
  • each fin portion 12 was set to 6 mm.
  • Number of fins 12, separation interval of fins 12 (opening width of groove 13) c1, maximum outer diameter DA of coil tip 21, minimum outer diameter DB, overall length of coil tip 21 (total length of single coil) L, number of turns N is as shown in Table 1.
  • each coil tip 21 is the second outer diameter d2 of the second end portion 21b described above, but the maximum outer diameter DA is the maximum major diameter in a state of being filled between the fin portions 12 and its right angle. It is the average value of the minor axis corresponding to.
  • the cross section of the coil tip 21 of each embodiment is formed in a substantially triangular shape.
  • A1050 was used as the material for the metal molded body 10 and the filler 20.
  • Table 1 shows the metal molded body 10 and the coiled metal molded body.
  • the items related to the coiled metal wire are indicated by "-" in Table 1.
  • the groove portion (groove portion is odd number) arranged in the center in the width direction of the heat sink from each cross section.
  • Table 2 shows these results.
  • the items related to the coiled metal wire are indicated by “-” in Table 2.
  • a heat medium (water) at 30 ° C. is 4 L / min (constant) between each fin portion 12 (inside each groove portion 13) in an environment adjusted to a constant temperature of 25 ° C. )
  • the temperature Tb1 at the interface between the surface and the substrate portion 11 and the water temperature Tw of the heat medium were measured.
  • h0 is the thickness of the substrate portion 11
  • A is the mounting area of the object to be cooled on the substrate portion 11
  • k is the thermal conductivity of A1050.
  • the LED package was mounted on the heat sink, and the natural cooling performance was confirmed.
  • a thermal interface member a heat transfer sheet (manufactured by Denka Co., Ltd., model number: BFG45A) was used, and LEDs (manufactured by OSRAM, model number: LUW CEUP, CE) were fixed in two places with a torque of 1 cNm. This was installed in a constant temperature bath at 30 ° C. with a heat sink arranged horizontally, a direct current of 0.3 A was passed through the LED, the voltage after 30 minutes was measured, and the electric resistance was calculated.
  • the heat transfer coefficient is 40 kW / m 2 K or more, and the pressure loss is small. Further, it can be seen that the electric resistance of the LED is as high as 36.8 ⁇ or more, the temperature rise of the LED is suppressed, and the heat dissipation is excellent.
  • Comparative Examples 4 and 5 the groove portion was filled with a fibrous porous body, and the heat transfer coefficient was high, but the pressure loss was large. Further, in the test in which the LED was mounted, in Comparative Example 4, the electric resistance was also low because the length ratio of the gap portion in each direction was small. In Comparative Example 6, although no filler was provided, the heat dissipation was inferior due to the large porosity, and the electrical resistance of the LED was low.
  • the surface area that contributes to heat exchange is expanded, and by using a coiled metal wire with different diameters at both ends, the movement of the heat medium is less likely to be hindered, and a large void is formed.
  • the heat dissipation is excellent, and the excellent heat dissipation can be exhibited even when the heat medium is not forcibly circulated.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention porte sur un dissipateur thermique comprenant un corps moulé métallique qui présente deux ailettes parallèles ou plus, et une charge qui comprend une pluralité de fils métalliques en forme de bobine remplissant au moins une rainure formée entre les ailettes, les fils métalliques en forme de bobine présentant chacun une extrémité et une autre extrémité ayant des diamètres externes différents ; chacun des fils métalliques en forme de bobine étant partiellement joint par liaison métallurgique à la surface interne de la ou des rainures du corps moulé métallique et/ou à un autre fil métallique en forme de bobine ; et dans une section perpendiculaire à la direction longitudinale de la rainure, les proportions de la valeur moyenne de longueurs de vides sur des lignes de division obtenues en divisant en trois la profondeur et la largeur de la rainure sont de 45 à 65 % par rapport à la largeur de la rainure, et de 20 à 60 % par rapport à la profondeur de la rainure.
PCT/JP2020/029945 2019-08-06 2020-08-05 Dissipateur thermique WO2021025045A1 (fr)

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JP2019144843 2019-08-06
JP2019-144843 2019-08-06

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0936284A (ja) * 1995-07-24 1997-02-07 Atsushi Terada ヒートシンク及び熱交換器
WO2005067036A1 (fr) * 2004-01-07 2005-07-21 Jisouken Co., Ltd. Source de froid
JP2008108922A (ja) * 2006-10-25 2008-05-08 Jigyo Sozo Kenkyusho:Kk ヒートシンク及びその製造方法
JP2009141136A (ja) * 2007-12-06 2009-06-25 Mitsubishi Electric Corp ヒートシンクおよび半導体装置
JP2010531536A (ja) * 2007-07-05 2010-09-24 ファウ テクノロジー カンパニー，リミテッド 線形放熱部材を備えた放熱装置及びこれを備えたファンレスｌｅｄ照明器具
JP2014090209A (ja) * 2014-01-17 2014-05-15 Panasonic Corp ヒートシンク、及び、空気調和装置
WO2018159601A1 (fr) * 2017-02-28 2018-09-07 三菱マテリアル株式会社 Élément d'échange de chaleur
WO2019026952A1 (fr) * 2017-08-02 2019-02-07 三菱マテリアル株式会社 Dissipateur de chaleur

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0936284A (ja) * 1995-07-24 1997-02-07 Atsushi Terada ヒートシンク及び熱交換器
WO2005067036A1 (fr) * 2004-01-07 2005-07-21 Jisouken Co., Ltd. Source de froid
JP2008108922A (ja) * 2006-10-25 2008-05-08 Jigyo Sozo Kenkyusho:Kk ヒートシンク及びその製造方法
JP2010531536A (ja) * 2007-07-05 2010-09-24 ファウ テクノロジー カンパニー，リミテッド 線形放熱部材を備えた放熱装置及びこれを備えたファンレスｌｅｄ照明器具
JP2009141136A (ja) * 2007-12-06 2009-06-25 Mitsubishi Electric Corp ヒートシンクおよび半導体装置
JP2014090209A (ja) * 2014-01-17 2014-05-15 Panasonic Corp ヒートシンク、及び、空気調和装置
WO2018159601A1 (fr) * 2017-02-28 2018-09-07 三菱マテリアル株式会社 Élément d'échange de chaleur
WO2019026952A1 (fr) * 2017-08-02 2019-02-07 三菱マテリアル株式会社 Dissipateur de chaleur

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