WO2021022784A1 - 显示面板及其制作方法 - Google Patents

显示面板及其制作方法 Download PDF

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Publication number
WO2021022784A1
WO2021022784A1 PCT/CN2020/070894 CN2020070894W WO2021022784A1 WO 2021022784 A1 WO2021022784 A1 WO 2021022784A1 CN 2020070894 W CN2020070894 W CN 2020070894W WO 2021022784 A1 WO2021022784 A1 WO 2021022784A1
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WIPO (PCT)
Prior art keywords
flexible substrate
display panel
buffer layer
rough structure
bending area
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PCT/CN2020/070894
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English (en)
French (fr)
Inventor
胡凯
Original Assignee
武汉华星光电半导体显示技术有限公司
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Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/640,634 priority Critical patent/US12035609B2/en
Publication of WO2021022784A1 publication Critical patent/WO2021022784A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1641—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being formed by a plurality of foldable display components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/12—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a stress relaxation structure, e.g. buffer layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the field of display technology, in particular to a display panel and a manufacturing method thereof.
  • polyimide has a weak molecular polarity and weak bonding force with the buffer layer of silicon dioxide, and the phenomenon of polyimide peeling easily occurs when the display panel is bent. , which seriously affects the display effect of the display panel.
  • the existing means to improve the peeling is to clean the surface of the polyimide substrate and reduce particles, but this method cannot solve this problem from the root.
  • the polyimide has a weak molecular polarity and has a weak bonding force with the buffer layer of silicon dioxide, and the phenomenon of polyimide peeling easily occurs when the display panel is bent. The display effect of the display panel is seriously affected.
  • the existing method to improve the peeling is to clean the surface of the polyimide substrate and reduce particles, but this method cannot solve this problem from the root.
  • the present invention provides a display panel, which can enhance the interface bonding force between a flexible substrate and a buffer layer, so as to solve the problem that the material of the flexible substrate and the material of the buffer layer in the existing display panel have relatively strong bonding force due to its own performance. Poor, thereby affecting the display of technical issues.
  • the present invention provides a display panel, the display panel includes a bending area, and the display panel includes:
  • the surface of the first flexible substrate contacting the buffer layer has a rough structure.
  • the display panel further includes a non-bending area, and in the non-bending area, the surface of the first flexible substrate contacting the buffer layer has the rough structure.
  • the display panel further includes a second flexible substrate, and the second flexible substrate is formed on a surface of the buffer layer on a side away from the first flexible substrate;
  • the surface of the second flexible substrate contacting the buffer layer is the rough structure.
  • a chemical bond is formed between the material molecules of the rough structure and the material molecules of the buffer layer.
  • the material of the buffer layer is silicon dioxide
  • the material of the rough structure includes a carboxylic acid group
  • a chemical bond is formed between the carboxylic acid group and the silicon dioxide.
  • the rough structure is a structure in a predetermined pattern.
  • the rough structure is formed by a plurality of notches.
  • the present invention also provides a manufacturing method of a display panel, the method includes the following steps:
  • the first flexible substrate including a bending area
  • a buffer layer is deposited on the surface of the first flexible substrate where the rough structure is formed.
  • the method further includes the following steps:
  • the second flexible substrate including a bending area
  • the surface of the second flexible substrate formed with the rough structure contacts the buffer layer.
  • a chemical bond is formed between the material molecules of the rough structure and the material molecules of the buffer layer.
  • the material of the buffer layer is silicon dioxide
  • the material of the rough structure includes a carboxylic acid group
  • a chemical bond is formed between the carboxylic acid group and the silicon dioxide.
  • the rough structure is a structure in a predetermined pattern.
  • the rough structure is formed by a plurality of notches.
  • the first flexible substrate further includes a non-bending area, and in the non-bending area, the surface of the first flexible substrate contacting the buffer layer is the Rough structure.
  • the present invention provides a display panel and a manufacturing method thereof.
  • the display panel includes a bending area.
  • the display panel includes a first flexible substrate and a buffer layer formed on the surface of the first flexible substrate.
  • the surface of a flexible substrate contacting the buffer layer is a rough structure. This rough structure has a certain roughness and can increase the interface bonding force between the buffer layer and the flexible substrate; and there are carboxylic acid groups in the rough structure.
  • a chemical bond can be formed between the acid group and the material of the buffer layer, which further strengthens the interface bonding force between the flexible substrate and the buffer layer, and solves the problem of easy peeling of the flexible substrate when the bending zone is bent;
  • the display panel of the invention can also form a rough structure on the surface of the flexible substrate in the non-bending area contacting the buffer layer, while avoiding the risk of peeling of the flexible substrate in the non-bending area;
  • the manufacturing method of the display panel of the present invention is simple and the manufacturing process It is easy to control, the display panel produced is excellent in display quality, and the product yield is high.
  • FIG. 1 is a schematic structural diagram of a display panel provided by the first embodiment of the present invention.
  • FIG. 2 is a schematic diagram of the structure of a display panel provided by a second embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of a display panel provided by a third embodiment of the present invention.
  • FIG. 4 is a schematic flowchart of a manufacturing method of a display panel provided by an embodiment of the present invention.
  • Fig. 5 is a schematic diagram of the molecular structure of the interaction between the material of the rough structure and the material of the buffer layer of the present invention.
  • the present invention addresses the technical problem that the material of the flexible substrate in the existing display panel has poor bonding force with the material of the buffer layer due to its own performance, and thus affects the display. This embodiment can solve this defect.
  • a first embodiment of the present invention provides a display panel, the display panel includes a bending area 1011, the display panel includes: a first flexible substrate 101; a buffer layer 102, the buffer layer 102 is formed On the surface of one side of the first flexible substrate 101; wherein, in the bending area 1011, the surface of the first flexible substrate 101 contacting the buffer layer 102 is a rough structure 103.
  • the material of the first flexible substrate 101 is polyimide, and the material of the buffer layer 102 is silicon dioxide; the surface of the first flexible substrate 101 in contact with the buffer layer 102 is processed , The first flexible substrate 101 is brought into contact with the surface of the buffer layer 102 to form a rough structure 103; in the process of forming the rough structure 103, the imide bond in the polyimide is hydrolyzed to form A carboxylic acid group, the carboxylic acid group combines with the silicon dioxide in the buffer layer 102 to form a chemical bond, thereby enhancing the interface bonding force between the first flexible substrate 101 and the buffer layer 102 .
  • the rough structure 103 may be a structure presenting a preset pattern. Specifically, when the surface of the first flexible substrate 101 contacting the buffer layer 102 is processed, a photoresist material is used to protect the first flexible substrate. The non-bending part of the bottom 101 is processed in a specific direction on the surface of the first flexible substrate 101 contacting the buffer layer 102, and finally the rough structure 103 showing a preset pattern is obtained.
  • the rough structure 103 may be composed of a plurality of notches. Specifically, when the surface of the first flexible substrate 101 contacting the buffer layer 102 is processed, a photoresist material is used to protect the first A non-bending part of the flexible substrate 101 finally obtains the rough structure 103 formed by a plurality of notches.
  • the first embodiment of the present invention uses the roughness of the first flexible substrate to increase the interface bonding between the first flexible substrate and the buffer layer by forming a rough structure on the surface of the first flexible substrate located in the bending area.
  • carboxylic acid groups in the rough structure. Please refer to Figure 5.
  • the carboxylic acid groups form a chemical bond with the silicon dioxide of the buffer layer to further enhance the interface bonding between the first flexible substrate and the buffer layer. In order to improve the peeling of the first flexible substrate and the buffer layer when the bending zone is bent.
  • the difference between the display panel provided by the second embodiment of the present invention and the first embodiment is that the display panel further includes a non-bending area 2012.
  • the first The surface of the flexible substrate 101 contacting the buffer layer 102 is also the rough structure 103.
  • the entire surface of the first flexible substrate 101 contacting the buffer layer 102 may be treated; the rough structure 103 may be a structure presenting a preset pattern, specifically, the first flexible substrate 101 When the substrate 101 contacts the surface of the buffer layer 102 for processing, the surface of the first flexible substrate 101 contacting the buffer layer 102 is processed in a specific direction, and finally the rough structure showing a preset pattern is obtained 103; or, the rough structure 103 may be composed of a plurality of notches. Specifically, the surface of the first flexible substrate 101 in contact with the buffer layer 102 is treated for a period of time to obtain a plurality of notches. The rough structure 103 formed by the mouth.
  • the first flexible substrate 101 is polyimide
  • the buffer layer 102 is silicon dioxide.
  • the polyimide is hydrolyzed to generate carboxylate.
  • Acid groups and carboxylic acid groups combine with the silicon dioxide in the buffer layer 102 to form a chemical bond to enhance the adhesion between the first flexible substrate 101 and the buffer layer 102.
  • the second embodiment of the present invention forms a rough structure on the entire surface of the first flexible substrate of the display panel.
  • the roughness of the first flexible substrate is used to increase the interface bonding force between the flexible substrate and the buffer layer.
  • the presence of carboxylic acid groups in the buffer layer please refer to Figure 5.
  • the carboxylic acid groups form a chemical bond with the silica of the buffer layer, which further enhances the interface bonding force between the first flexible substrate and the buffer layer, and not only improves the bending
  • the peeling of the first flexible substrate and the buffer layer in the folding area can also avoid the risk of peeling of the first flexible substrate and the buffer layer in the non-bending area.
  • the difference between the display panel provided by an implementation of the third embodiment of the present invention and the first embodiment is that the display panel further includes a second flexible substrate 304, and the second flexible substrate 304 is formed On the surface of the buffer layer 102 on the side away from the first flexible substrate 101; wherein, in the bending area 1011, the surface of the second flexible substrate 304 that contacts the buffer layer 102 is the Rough structure 103.
  • the display panel of this embodiment adopts a two-layer flexible substrate structure, and the second flexible substrate 304 is also processed to form the rough structure 103 to strengthen the gap between the second flexible substrate 304 and the buffer layer 102.
  • the interface bonding force is also processed to form the rough structure 103 to strengthen the gap between the second flexible substrate 304 and the buffer layer 102.
  • the rough structure 103 may be a structure presenting a preset pattern. Specifically, when the surface of the second flexible substrate 304 contacting the buffer layer 102 is processed, a photoresist material is used to protect the second flexible substrate. The non-bending part of the bottom 304 is processed in a specific direction on the surface of the second flexible substrate 304 contacting the buffer layer 102, and finally the rough structure 103 showing a preset pattern is obtained.
  • the rough structure 103 may be composed of a plurality of notches. Specifically, when the surface of the second flexible substrate 304 contacting the buffer layer 102 is processed, a photoresist material is used to protect the first In the non-bending part of the two flexible substrates 304, the rough structure 103 formed by a plurality of notches is finally obtained.
  • the third embodiment of the present invention may also have another implementation manner.
  • the display panel includes a first flexible substrate 101 and a second flexible substrate 304, and the second flexible substrate 304 is formed on the buffer.
  • the layer 102 is away from the surface of the first flexible substrate 101 side; in the bending area 1011 and the non-bending area 2012, the first flexible substrate 101 and the second flexible substrate 304
  • the surfaces respectively contacting the buffer layer 102 are the rough structures 103.
  • the display panel of the third embodiment of the present invention has a double-layer flexible substrate structure, by forming a rough structure on the surface of the bent portion of the second flexible substrate, or forming a rough structure on the entire surface of the second flexible substrate.
  • Structure use the roughness of the second flexible substrate to increase the interface bonding force between the second flexible substrate and the buffer layer, and there are carboxylic acid groups in the rough structure, please refer to Figure 5, carboxylic acid groups and A chemical bond is formed between the silicon dioxide of the buffer layer, which further enhances the interface bonding force between the second flexible substrate and the buffer layer, thereby improving the first flexible substrate and the second flexible substrate when the bending area is bent
  • the phenomenon of easy peeling from the buffer layer can also avoid the risk of peeling of the first flexible substrate and the second flexible substrate from the buffer layer in the non-bending area.
  • the present invention provides a manufacturing method of a display panel, including the following steps:
  • the portion of the bending area 1011 may be marked on the first flexible substrate 101.
  • a layer of alkali treatment liquid may be coated on the surface of the first flexible substrate 101, or one side surface of the first flexible substrate 101 may be immersed in the alkali treatment liquid, and then at a certain concentration and At a certain temperature, the first flexible substrate 101 is allowed to stand for a period of time.
  • the alkaline treatment liquid includes, but is not limited to, lithium hydroxide, sodium hydroxide, potassium hydroxide, ammonia, tetramethyl sodium hydroxide, ethanolamine and other aqueous solutions containing alkaline ions; the alkaline treatment liquid contains a large amount of Anions including ammonium ion (NH3-) and hydroxide ion (OH-), the alkali treatment solution can react with the polyimide of the first flexible substrate 101 to slightly hydrolyze the imide bond A small amount of carboxylic acid groups are generated.
  • NH3- ammonium ion
  • OH- hydroxide ion
  • the processing of the first flexible substrate 101 can be controlled by adjusting the concentration of the alkali treatment solution, the time of the alkali treatment, and the temperature of the alkali treatment.
  • concentration of the alkali treatment solution is higher, the alkali treatment temperature is higher, and the alkali treatment time is longer, the effect of processing the first flexible substrate 101 can be optimized.
  • concentration of the alkali treatment solution should not be too high. If the concentration of the alkali treatment solution exceeds a certain value, it will affect the performance of the first flexible substrate 101, and even corrode through the first flexible substrate 101. .
  • the concentration of alkaline ions in the alkaline treatment solution ranges from 1 to 10 mol/L.
  • the temperature range of alkali treatment of the first flexible substrate 101 is 5-70°C. After coating the alkali treatment solution, the standing time of the first flexible substrate 101 is 0.01-24 h.
  • the surface of the first flexible substrate 101 after alkali treatment has a rough structure 103.
  • the first flexible substrate 101 when the first flexible substrate 101 is alkali-treated, a photoresist material needs to be used to protect the portion of the first flexible substrate 101 in the non-bending area, and then alkali treatment can be performed. Or, when the alkali treatment solution is applied in a specific direction, a specific pattern with a certain regularity can be formed on the surface of the first flexible substrate 101 finally. However, in other embodiments, the alkali treatment solution may also be coated on the entire surface of the first flexible substrate 101. After the treatment, the first flexible substrate 101 will form irregular and uniformly distributed recesses. mouth.
  • the first flexible substrate 101 is cleaned with deionized water, and then CVD is deposited on the surface of the first flexible substrate 101 subjected to the alkali treatment. Buffer layer 102.
  • the manufacturing method of the display panel provided in this embodiment may further include the following steps:
  • a second flexible substrate 304 is provided, and the second flexible substrate 304 includes a bending area 1011.
  • the portion of the bending area 1011 may be marked on the second flexible substrate 304; it should be pointed out that the bending area 1011 of the first flexible substrate 101 and the second flexible substrate 304 The bending area 1011 should be in corresponding positions.
  • the rough structure 103 is formed on the surface of the second flexible substrate 304 on one side of the bending area 1011 part.
  • the surface of the second flexible substrate 304 can be coated with a layer of alkali treatment liquid, or one side surface of the second flexible substrate 304 can be immersed in the alkali treatment liquid, and then the surface of the second flexible substrate 304 At a certain temperature, the second flexible substrate 304 is allowed to stand for a period of time.
  • the alkaline treatment liquid includes, but is not limited to, lithium hydroxide, sodium hydroxide, potassium hydroxide, ammonia, tetramethyl sodium hydroxide, ethanolamine and other aqueous solutions containing alkaline ions; the alkaline treatment liquid contains a large amount of Anions including ammonium ions (NH3-) and hydroxide ions (OH-), the alkali treatment solution can react with the polyimide of the second flexible substrate 304 to slightly hydrolyze the imide bond A trace amount of carboxylic acid is generated.
  • NH3- ammonium ions
  • OH- hydroxide ions
  • the processing of the second flexible substrate 304 can be controlled by adjusting the concentration of the alkali treatment solution, the time of the alkali treatment, and the temperature of the alkali treatment.
  • concentration of the alkali treatment solution is higher, the alkali treatment temperature is higher, and the alkali treatment time is longer, the effect of processing the second flexible substrate 304 can be optimized.
  • the concentration of the alkali treatment solution should not be too high. If the concentration of the alkali treatment solution exceeds a certain value, it will affect the performance of the second flexible substrate 304, and even corrode through the second flexible substrate 304. .
  • the concentration of alkaline ions in the alkaline treatment solution ranges from 1 to 10 mol/L.
  • the temperature range of alkali treatment of the second flexible substrate 304 is 5-70°C. After coating the alkali treatment solution, the standing time of the second flexible substrate 304 is 0.01-24 h.
  • the surface of the second flexible substrate 304 after alkali treatment has a rough structure 103.
  • the second flexible substrate 304 when the second flexible substrate 304 is alkali-treated, a photoresist material needs to be used to protect the portion of the second flexible substrate 304 located in the non-bending area before alkali treatment is performed, which can be sprayed Or, when the alkali treatment liquid is applied in a specific direction, a specific pattern with a certain regularity can be formed on the surface of the second flexible substrate 304 finally.
  • the alkaline treatment solution may also be coated on the entire surface of the second flexible substrate 304. After the treatment, the second flexible substrate 304 will form irregular and uniformly distributed recesses. mouth.
  • the second flexible substrate 304 is disposed on the surface of the buffer layer 102 away from the first flexible substrate 101.
  • the surface of the second flexible substrate 304 formed with the rough structure 103 contacts the buffer layer 102.
  • the manufacturing method of the display panel provided by this embodiment has simple manufacturing method and easy control of the manufacturing process.
  • the surface of the first flexible substrate is formed with a rough structure, and the buffer layer is silicon dioxide Die
  • a small amount of carboxylic acid groups are formed in the rough structure of the first flexible substrate.
  • the carboxylic acid groups form chemical bonds with silicon dioxide, which can The interface bonding force between the first flexible substrate and the buffer layer is enhanced, and the display quality is improved.
  • the present invention provides a display panel and a manufacturing method thereof.
  • the display panel includes a bending area, the display panel includes a first flexible substrate and a buffer layer formed on the surface of the first flexible substrate, wherein: In the bending zone, the surface of the first flexible substrate contacting the buffer layer has a rough structure.
  • This rough structure has a certain roughness and can increase the interface bonding force between the buffer layer and the flexible substrate; and in the rough structure
  • the presence of carboxylic acid groups can form chemical bonds with the material of the buffer layer, which further strengthens the interface bonding force between the flexible substrate and the buffer layer, and solves the problem that the flexible substrate is easy to bend when the bending zone is bent
  • the display panel of the present invention can also form a rough structure on the surface of the flexible substrate in the non-bending area contacting the buffer layer, while avoiding the risk of peeling of the flexible substrate in the non-bending area; the display panel of the present invention
  • the manufacturing method is simple, the manufacturing process is easy to control, the manufactured display panel has good display quality, and the product yield is high.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种显示面板及其制作方法。该显示面板包括弯折区（1011），所述显示面板包括：第一柔性衬底（101）；缓冲层（102），所述缓冲层（102）形成于所述第一柔性衬底（1011）一侧的表面；其中，在所述弯折区（1011）内，所述第一柔性衬底（101）接触所述缓冲层（102）的表面为粗糙结构（103）。

Description

显示面板及其制作方法
本申请要求于2019年8月8日提交中国专利局、申请号为201910730167.6、发明名称为“显示面板及其制作方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及显示技术领域，尤其涉及一种显示面板及其制作方法。
 背景技术
目前为实现可折叠和窄边框设计大部分厂商都是使用以柔性聚酰亚胺为基材的AMOLED（Active-matrix organic light-emitting diode）技术。聚酰亚胺具有较好的柔性，因此具备了可折叠的前提。通过对下边框COF（Chip On Film，封装技术）的结合区或COP（Chip On Pi，封装技术）的IC（Integrated Circuit，集成电路）结合区以及一些走线和电路的下弯折可以将原有刚性的显示面板下边框变小。
但是在现有的显示面板中，聚酰亚胺由于分子极性较小，与二氧化硅的缓冲层之间的结合力较弱，在显示面板弯折时容易发生聚酰亚胺剥离的现象，严重影响显示面板的显示效果，现有的改善剥离的手段是对聚酰亚胺衬底的表面进行清洁和减少颗粒，但这种方法并不能从根源上解决此问题。
因此，需要一种新的显示面板，以解决上述问题。
 技术问题
在现有的显示面板中，聚酰亚胺由于分子极性较小，与二氧化硅的缓冲层之间的结合力较弱，在显示面板弯折时容易发生聚酰亚胺剥离的现象，严重影响显示面板的显示效果，现有的改善剥离的手段是对聚酰亚胺衬底的表面进行清洁和减少颗粒，但这种方法并不能从根源上解决此问题。
 技术解决方案
本发明提供一种显示面板，能够增强柔性衬底与缓冲层之间的界面结合力，以解决现有的显示面板中柔性衬底的材料因自身性能原因与缓冲层的材料之间结合力较差从而影响显示的技术问题。
为解决上述问题，本发明提供的技术方案如下：
本发明提供一种显示面板，所述显示面板包括弯折区，所述显示面板包括：
第一柔性衬底；
缓冲层，所述缓冲层形成于所述第一柔性衬底一侧的表面；
其中，在所述弯折区内，所述第一柔性衬底接触所述缓冲层的表面为粗糙结构。
在本发明的一种实施例中，所述显示面板还包括非弯折区，在所述非弯折区内，所述第一柔性衬底接触所述缓冲层的表面为所述粗糙结构。
在本发明的一种实施例中，所述显示面板还包括第二柔性衬底，所述第二柔性衬底形成于所述缓冲层远离所述第一柔性衬底一侧的表面；
其中，在所述弯折区内，所述第二柔性衬底接触所述缓冲层的表面为所述粗糙结构。
在本发明的一种实施例中，所述粗糙结构的材料分子与所述缓冲层的材料分子之间形成有化学键。
在本发明的一种实施例中，所述缓冲层的材料为二氧化硅，所述粗糙结构的材料包括羧酸基团，所述羧酸基团与所述二氧化硅之间形成有化学键。
在本发明的一种实施例中，所述粗糙结构为呈预设图形的结构。
在本发明的一种实施例中，所述粗糙结构由多个凹口所构成。
本发明还提供一种显示面板的制作方法，所述方法包括如下步骤：
提供一第一柔性衬底，所述第一柔性衬底包括弯折区；
在所述第一柔性衬底位于所述弯折区部分的一侧的表面形成粗糙结构；
在所述第一柔性衬底形成有所述粗糙结构的表面沉积缓冲层。
在本发明的一种实施例中，所述方法还包括如下步骤：
提供第二柔性衬底，所述第二柔性衬底包括弯折区；
在所述第二柔性衬底位于所述弯折区部分的一侧的表面形成所述粗糙结构；
将所述第二柔性衬底设置于所述缓冲层远离所述第一柔性衬底一侧的表面；
其中，所述第二柔性衬底形成有所述粗糙结构一侧的表面接触所述缓冲层。
在本发明的一种实施例中，所述粗糙结构的材料分子与所述缓冲层的材料分子之间形成有化学键。
在本发明的一种实施例中，所述缓冲层的材料为二氧化硅，所述粗糙结构的材料包括羧酸基团，所述羧酸基团与所述二氧化硅之间形成有化学键。
在本发明的一种实施例中，所述粗糙结构为呈预设图形的结构。
在本发明的一种实施例中，所述粗糙结构由多个凹口所构成。
在本发明的一种实施例中，所述第一柔性衬底还包括非弯折区，在所述非弯折区内，所述第一柔性衬底接触所述缓冲层的表面为所述粗糙结构。
 有益效果
本发明提供一种显示面板及其制作方法，该显示面板包括弯折区，显示面板包括第一柔性衬底以及形成于第一柔性衬底表面的缓冲层，其中，在弯折区内，第一柔性衬底接触缓冲层的表面为粗糙结构，这种粗糙结构具有一定粗糙度，能够增大缓冲层与柔性衬底之间的界面结合力；且在粗糙结构中存在羧酸基团，羧酸基团与缓冲层的材料之间能形成化学键，更进一步的加强柔性衬底与缓冲层之间的界面结合力，解决弯折区在弯折时柔性衬底易发生剥离的问题；本发明的显示面板也可在非弯折区的柔性衬底接触缓冲层的表面形成粗糙结构，同时能避免非弯折区柔性衬底发生剥离的风险；本发明的显示面板的制作方法简单，制作过程易控制，所制作得到的显示面板显示品质优良，产品的良率高。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明第一实施例提供的显示面板的结构示意图；
图2为本发明第二实施例提供的显示面板的结构示意图；
图3为本发明第三实施例提供的显示面板的结构示意图；
图4为本发明实施例提供的显示面板的制作方法的流程示意图；
图5为本发明的粗糙结构的材料与缓冲层的材料之间作用的分子结构示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是用以相同标号表示。
本发明针对现有的显示面板中柔性衬底的材料因自身性能原因与缓冲层的材料之间结合力较差从而影响显示的技术问题，本实施例能够解决该缺陷。
请参阅图1，本发明第一实施例提供一种显示面板，所述显示面板包括弯折区1011，所述显示面板包括：第一柔性衬底101；缓冲层102，所述缓冲层102形成于所述第一柔性衬底101一侧的表面；其中，在所述弯折区1011内，所述第一柔性衬底101接触所述缓冲层102的表面为粗糙结构103。
具体地，所述第一柔性衬底101的材料为聚酰亚胺，所述缓冲层102的材料为二氧化硅；将所述第一柔性衬底101接触所述缓冲层102的表面进行处理，使所述第一柔性衬底101接触所述缓冲层102的表面形成粗糙结构103；在形成所述粗糙结构103的过程中，所述聚酰亚胺中的酰亚胺键发生水解，形成羧酸基团，所述羧酸基团与所述缓冲层102中的二氧化硅结合，形成化学键，以此增强所述第一柔性衬底101与所述缓冲层102之间的界面结合力。
所述粗糙结构103可以是呈现预设图形的结构，具体地，在对所述第一柔性衬底101接触所述缓冲层102的表面进行处理时，用光阻材料保护所述第一柔性衬底101的非弯折部分，沿特定的方向对所述第一柔性衬底101接触所述缓冲层102的表面进行处理，最后得到呈现预设图形的所述粗糙结构103。
或者，所述粗糙结构103可以是由多个凹口所构成，具体地，在对所述第一柔性衬底101接触所述缓冲层102的表面进行处理时，用光阻材料保护所述第一柔性衬底101的非弯折部分，最后得到由多个凹口所构成的所述粗糙结构103。
本发明第一实施例通过在第一柔性衬底位于弯折区部分的表面上形成粗糙结构，利用第一柔性衬底的粗糙度来增大第一柔性衬底与缓冲层之间的界面结合力，且在粗糙结构中存在羧酸基团，请参阅图5，羧酸基团与缓冲层的二氧化硅之间形成化学键，更进一步增强第一柔性衬底与缓冲层之间的界面结合力，以此改善在弯折区弯折时第一柔性衬底与缓冲层剥离的现象。
请参阅图2，本发明第二实施例提供的显示面板与第一实施例的区别在于，所述显示面板还包括非弯折区2012，在所述非弯折区2012内，所述第一柔性衬底101接触所述缓冲层102的表面也为所述粗糙结构103。
此时，可以对所述第一柔性衬底101接触所述缓冲层102的表面进行整面处理；所述粗糙结构103可以是呈现预设图形的结构，具体地，在对所述第一柔性衬底101接触所述缓冲层102的表面进行处理时，沿特定的方向对所述第一柔性衬底101接触所述缓冲层102的表面进行处理，最后得到呈现预设图形的所述粗糙结构103；或者，所述粗糙结构103可以是由多个凹口所构成，具体地，对所述第一柔性衬底101接触所述缓冲层102的表面处理一段时间，即可得到由多个凹口所构成的所述粗糙结构103。
所述显示面板中，所述第一柔性衬底101为聚酰亚胺，所述缓冲层102为二氧化硅，在处理所述第一柔性衬底101时，聚酰亚胺发生水解生成羧酸基团，羧酸基团与所述缓冲层102中的二氧化硅结合，形成化学键，以增强第一柔性衬底101与缓冲层102之间的粘结力。
本发明第二实施例在显示面板的整个第一柔性衬底表面形成粗糙结构，利用第一柔性衬底的粗糙度来增大柔性衬板与缓冲层之间的界面结合力，且在粗糙结构中存在羧酸基团，请参阅图5，羧酸基团与缓冲层的二氧化硅之间形成化学键，更进一步增强第一柔性衬底与缓冲层之间的界面结合力，不仅能改善弯折区内第一柔性衬底与缓冲层剥离的现象，还能避免非弯折区内第一柔性衬底与缓冲层也发生剥离的风险。
请参阅图3，本发明第三实施例的一种实施方式提供的显示面板与第一实施例区别在于，所述显示面板还包括第二柔性衬底304，所述第二柔性衬底304形成于所述缓冲层102远离所述第一柔性衬底101一侧的表面；其中，在所述弯折区1011内，所述第二柔性衬底304接触所述缓冲层102的表面为所述粗糙结构103。
本实施例的显示面板采用两层柔性衬底结构，所述第二柔性衬底304也经过处理形成所述粗糙结构103，以增强所述第二柔性衬底304与所述缓冲层102之间的界面结合力。
所述粗糙结构103可以是呈现预设图形的结构，具体地，在对所述第二柔性衬底304接触所述缓冲层102的表面进行处理时，用光阻材料保护所述第二柔性衬底304的非弯折部分，沿特定的方向对所述第二柔性衬底304分别接触所述缓冲层102的表面进行处理，最后得到呈现预设图形的所述粗糙结构103。
或者，所述粗糙结构103可以是由多个凹口所构成，具体地，在对所述第二柔性衬底304接触所述缓冲层102的表面进行处理时，用光阻材料保护所述第二柔性衬底304的非弯折部分，最后得到由多个凹口所构成的所述粗糙结构103。
本发明第三实施例还可以有另一种实施方式，具体地，所述显示面板包括第一柔性衬底101和第二柔性衬底304，所述第二柔性衬底304形成于所述缓冲层102远离所述第一柔性衬底101一侧的表面；在所述弯折区1011和所述非弯折区2012内，所述第一柔性衬底101与所述第二柔性衬底304分别接触所述缓冲层102的表面均为所述粗糙结构103。
本发明第三实施例的显示面板为双层柔性衬底结构，通过在第二柔性衬底的弯折部分的表面上也形成粗糙结构，或者，在第二柔性衬底的整体表面上形成粗糙结构，利用第二柔性衬底的粗糙度来增大第二柔性衬底与缓冲层之间的界面结合力，且在粗糙结构中存在羧酸基团，请参阅图5，羧酸基团与缓冲层的二氧化硅之间形成化学键，更进一步增强第二柔性衬底与缓冲层之间的界面结合力，以此改善在弯折区弯折时第一柔性衬底和第二柔性衬底容易与缓冲层剥离的现象，也可避免非弯折区内第一柔性衬底和第二柔性衬底与缓冲层剥离的风险。
请参阅图4，本发明提供一种显示面板的制作方法，包括如下步骤：
S401、提供一第一柔性衬底101，所述第一柔性衬底101包括弯折区1011。
具体地，可以在所述第一柔性衬底101标注出所述弯折区1011的部分。
S402、在所述第一柔性衬底101位于所述弯折区1011部分的一侧的表面形成粗糙结构103。
具体地，可以在所述第一柔性衬底101的表面涂覆一层碱处理液，或者，将所述第一柔性衬底101的一侧表面浸泡在碱处理液中，之后在一定浓度和一定温度下，将所述第一柔性衬底101静置一段时间。
其中，所述碱处理液包括但不限于氢氧化锂、氢氧化钠、氢氧化钾、氨水、四甲基氢氧化钠、乙醇胺等包含碱性离子的水溶液；所述碱处理液中包含大量的铵根离子（NH3-）和氢氧根离子（OH-）在内的阴离子，所述碱处理液能与所述第一柔性衬底101的聚酰亚胺反应，使酰亚胺键轻微水解而生成微量的羧酸基团。
处理所述第一柔性衬底101可通过调节所述碱处理液的浓度、碱处理的时间以及碱处理的温度来控制。当所述碱处理液的浓度较高、碱处理温度较高、碱处理时间较长，则能够优化处理所述第一柔性衬底101的效果。但所述碱处理液的浓度不宜过高，所述碱处理液的浓度超过一定值，会对所述第一柔性衬底101的性能产生影响，甚至腐蚀穿过所述第一柔性衬底101。
在本发明实施例中，所述碱处理液中的碱性离子的浓度范围为1-10mol/L。碱处理所述第一柔性衬底101的温度范围为5-70℃。涂覆所述碱处理液后，所述第一柔性衬底101的静置时间为0.01-24h。碱处理后的所述第一柔性衬底101的表面为粗糙结构103。
在本实施例中，在碱处理所述第一柔性衬底101时，需使用光阻材料对所述第一柔性衬底101位于非弯折区的部分进行保护后再进行碱处理，可以喷涂或涂覆所述碱处理液时沿特定方向，最后可在所述第一柔性衬底101的表面形成有一定规律的特定图案。但在其它实施例中，也可以是在所述第一柔性衬底101的整面涂覆所述碱处理液，处理过后所述第一柔性衬底101将会形成无规律且均匀分布的凹口。
S403、在所述第一柔性衬底101形成有所述粗糙结构103的一侧表面沉积缓冲层102。
具体地，在对所述第一柔性衬底101进行碱处理后，使用去离子水清洗所述第一柔性衬底101，之后在进行碱处理的所述第一柔性衬底101表面使用CVD沉积缓冲层102。
进一步地，本实施例提供的显示面板的制作方法，还可以包括如下步骤：
提供一第二柔性衬底304，所述第二柔性衬底304包括弯折区1011。
具体地，可在所述第二柔性衬底304上标注出所述弯折区1011的部分；需要指出，所述第一柔性衬底101的弯折区1011与所述第二柔性衬底304的弯折区1011应处于相互对应的位置。
在所述第二柔性衬底304位于所述弯折区1011部分的一侧的表面形成所述粗糙结构103。
具体地，可以在所述第二柔性衬底304的表面涂覆一层碱处理液，或者，将所述第二柔性衬底304的一侧表面浸泡在碱处理液中，之后在一定浓度和一定温度下，将所述第二柔性衬底304静置一段时间。
其中，所述碱处理液包括但不限于氢氧化锂、氢氧化钠、氢氧化钾、氨水、四甲基氢氧化钠、乙醇胺等包含碱性离子的水溶液；所述碱处理液中包含大量的铵根离子（NH3-）和氢氧根离子（OH-）在内的阴离子，所述碱处理液能与所述第二柔性衬底304的聚酰亚胺反应，使酰亚胺键轻微水解而生成微量的羧酸。
处理所述第二柔性衬底304可通过调节所述碱处理液的浓度、碱处理的时间以及碱处理的温度来控制。当所述碱处理液的浓度较高、碱处理温度较高、碱处理时间较长，则能够优化处理所述第二柔性衬底304的效果。但所述碱处理液的浓度不宜过高，所述碱处理液的浓度超过一定值，会对所述第二柔性衬底304的性能产生影响，甚至腐蚀穿过所述第二柔性衬底304。
在本发明实施例中，所述碱处理液中的碱性离子的浓度范围为1-10mol/L。碱处理所述第二柔性衬底304的温度范围为5-70℃。涂覆所述碱处理液后，所述第二柔性衬底304的静置时间为0.01-24h。碱处理后的所述第二柔性衬底304的表面为粗糙结构103。
在本实施例中，在碱处理所述第二柔性衬底304时，需使用光阻材料对所述第二柔性衬底304位于非弯折区的部分进行保护后再进行碱处理，可以喷涂或涂覆所述碱处理液时沿特定方向，最后可在所述第二柔性衬底304的表面形成有一定规律的特定图案。但在其它实施例中，也可以是在所述第二柔性衬底304的整面涂覆所述碱处理液，处理过后所述第二柔性衬底304将会形成无规律且均匀分布的凹口。
将所述第二柔性衬底304设置于所述缓冲层102远离所述第一柔性衬底101一侧的表面。
其中，所述第二柔性衬底304形成有所述粗糙结构103一侧的表面接触所述缓冲层102。
本实施例提供的显示面板的制作方法，该制作方法简单，制作过程易控制，通过将第一柔性衬底进行碱处理，使第一柔性衬底表面形成粗糙结构，而缓冲层为二氧化硅晶粒，碱处理第一柔性衬底之后，在第一柔性衬底的粗糙结构中形成了少量的羧酸基团，请参阅图5，羧酸基团与二氧化硅形成化学键，以此能够增强第一柔性衬底与缓冲层之间的界面结合力，提升显示品质。
本发明的有益效果为：本发明提供一种显示面板及其制作方法，该显示面板包括弯折区，显示面板包括第一柔性衬底以及形成于第一柔性衬底表面的缓冲层，其中，在弯折区内，第一柔性衬底接触缓冲层的表面为粗糙结构，这种粗糙结构具有一定粗糙度，能够增大缓冲层与柔性衬底之间的界面结合力；且在粗糙结构中存在羧酸基团，羧酸基团与缓冲层的材料之间能形成化学键，更进一步的加强柔性衬底与缓冲层之间的界面结合力，解决弯折区在弯折时柔性衬底易发生剥离的问题；本发明的显示面板也可在非弯折区的柔性衬底接触缓冲层的表面形成粗糙结构，同时能避免非弯折区柔性衬底发生剥离的风险；本发明的显示面板的制作方法简单，制作过程易控制，所制作得到的显示面板显示品质优良，产品的良率高。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (14)

  1. 一种显示面板，所述显示面板包括弯折区，所述显示面板包括：
    第一柔性衬底；
    缓冲层，所述缓冲层形成于所述第一柔性衬底一侧的表面；
    其中，在所述弯折区内，所述第一柔性衬底接触所述缓冲层的表面为粗糙结构。
  2. 根据权利要求1所述的显示面板，其中，所述显示面板还包括非弯折区，在所述非弯折区内，所述第一柔性衬底接触所述缓冲层的表面为所述粗糙结构。
  3. 根据权利要求1所述的显示面板，其中，所述显示面板还包括第二柔性衬底，所述第二柔性衬底设置于所述缓冲层远离所述第一柔性衬底一侧的表面；
    其中，在所述弯折区内，所述第二柔性衬底接触所述缓冲层的表面为所述粗糙结构。
  4. 根据权利要求1所述的显示面板，其中，所述粗糙结构的材料分子与所述缓冲层的材料分子之间形成有化学键。
  5. 根据权利要求4所述的显示面板，其中，所述缓冲层的材料为二氧化硅，所述粗糙结构的材料包括羧酸基团，所述羧酸基团与所述二氧化硅之间形成有化学键。
  6. 根据权利要求1所述的显示面板，其中，所述粗糙结构为呈预设图形的结构。
  7. 根据权利要求1所述的显示面板，其中，所述粗糙结构由多个凹口所构成。
  8. 一种显示面板的制作方法，所述方法包括如下步骤：
    提供一第一柔性衬底，所述第一柔性衬底包括弯折区；
    在所述第一柔性衬底位于所述弯折区部分的一侧的表面形成粗糙结构；
    在所述第一柔性衬底形成有所述粗糙结构的表面沉积缓冲层。
  9. 根据权利要求8所述的显示面板的制作方法，其中，所述方法还包括如下步骤：
    提供一第二柔性衬底，所述第二柔性衬底包括弯折区；
    在所述第二柔性衬底位于所述弯折区部分的一侧的表面形成所述粗糙结构；
    将所述第二柔性衬底设置于所述缓冲层远离所述第一柔性衬底一侧的表面；
    其中，所述第二柔性衬底形成有所述粗糙结构一侧的表面接触所述缓冲层。
  10. 根据权利要求8所述的显示面板的制作方法，其中，所述粗糙结构的材料分子与所述缓冲层的材料分子之间形成有化学键。
  11. 根据权利要求10所述的显示面板的制作方法，其中，所述缓冲层的材料为二氧化硅，所述粗糙结构的材料包括羧酸基团，所述羧酸基团与所述二氧化硅之间形成有化学键。
  12. 根据权利要求8所述的显示面板的制作方法，其中，所述粗糙结构为呈预设图形的结构。
  13. 根据权利要求8所述的显示面板的制作方法，其中，所述粗糙结构由多个凹口所构成。
  14. 根据权利要求8所述的显示面板的制作方法，其中，所述第一柔性衬底还包括非弯折区，在所述非弯折区内，所述第一柔性衬底接触所述缓冲层的表面为所述粗糙结构。
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