WO2021019891A1 - Module thermoélectrique et procédé de fabrication de module thermoélectrique - Google Patents

Module thermoélectrique et procédé de fabrication de module thermoélectrique Download PDF

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Publication number
WO2021019891A1
WO2021019891A1 PCT/JP2020/021254 JP2020021254W WO2021019891A1 WO 2021019891 A1 WO2021019891 A1 WO 2021019891A1 JP 2020021254 W JP2020021254 W JP 2020021254W WO 2021019891 A1 WO2021019891 A1 WO 2021019891A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
electrode
stress relaxation
anchor
thermoelectric element
Prior art date
Application number
PCT/JP2020/021254
Other languages
English (en)
Japanese (ja)
Inventor
鎔勲 李
Original Assignee
株式会社Kelk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Kelk filed Critical 株式会社Kelk
Priority to US17/625,055 priority Critical patent/US20220293840A1/en
Publication of WO2021019891A1 publication Critical patent/WO2021019891A1/fr

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un module thermoélectrique qui comprend un élément thermoélectrique disposé entre une paire d'électrodes, et une couche d'ancrage disposée entre les électrodes et l'élément thermoélectrique et reliée à l'élément thermoélectrique.
PCT/JP2020/021254 2019-07-30 2020-05-28 Module thermoélectrique et procédé de fabrication de module thermoélectrique WO2021019891A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US17/625,055 US20220293840A1 (en) 2019-07-30 2020-05-28 Thermoelectric module and method for manufacturing thermoelectric module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019140282A JP7438685B2 (ja) 2019-07-30 2019-07-30 熱電モジュール及び熱電モジュールの製造方法
JP2019-140282 2019-07-30

Publications (1)

Publication Number Publication Date
WO2021019891A1 true WO2021019891A1 (fr) 2021-02-04

Family

ID=74230277

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/021254 WO2021019891A1 (fr) 2019-07-30 2020-05-28 Module thermoélectrique et procédé de fabrication de module thermoélectrique

Country Status (3)

Country Link
US (1) US20220293840A1 (fr)
JP (1) JP7438685B2 (fr)
WO (1) WO2021019891A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102536107B1 (ko) * 2021-07-02 2023-05-26 고려대학교 산학협력단 태양전지와 열전소자를 이용한 에너지 하베스팅 시스템

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002124707A (ja) * 2000-10-16 2002-04-26 Matsushita Electric Works Ltd 熱電変換モジュールの製造方法
JP2017130596A (ja) * 2016-01-22 2017-07-27 日立化成株式会社 熱電変換モジュールおよびその製造方法
JP2017535939A (ja) * 2014-09-18 2017-11-30 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 熱電材料の熱圧着
JP2018160560A (ja) * 2017-03-23 2018-10-11 日立化成株式会社 熱電変換モジュールおよびその製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3459328B2 (ja) * 1996-07-26 2003-10-20 日本政策投資銀行 熱電半導体およびその製造方法
JP3600486B2 (ja) 1999-08-24 2004-12-15 セイコーインスツル株式会社 熱電変換素子の製造方法
JP2003197981A (ja) 2001-12-26 2003-07-11 Kyocera Corp 熱電モジュール
JP2007535803A (ja) 2003-12-11 2007-12-06 ネクストリーム・サーマル・ソリューションズ 電力変換及び冷却用の薄膜熱電装置
JP4801466B2 (ja) 2006-02-24 2011-10-26 財団法人電力中央研究所 熱応力緩和パッドおよびそれを用いた熱電変換システム並びにペルチェ冷却システム
JP2013089719A (ja) 2011-10-17 2013-05-13 Toyota Industries Corp 熱電変換素子
TW201624779A (zh) 2014-12-23 2016-07-01 財團法人工業技術研究院 熱電轉換裝置及其應用系統
KR101645585B1 (ko) * 2014-12-26 2016-08-09 주식회사 제펠 앵커부를 가진 열전레그를 포함하는 열전모듈 및 그 제조방법
JP2017204550A (ja) 2016-05-11 2017-11-16 積水化学工業株式会社 熱電変換材料、熱電変換素子及び熱電変換素子の製造方法
CN107681044B (zh) 2017-10-16 2020-08-14 中国科学院上海硅酸盐研究所 一种多段结构宽温域热电发电器件及制备方法
KR102429504B1 (ko) 2017-12-18 2022-08-05 현대자동차주식회사 열전 모듈 제조 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002124707A (ja) * 2000-10-16 2002-04-26 Matsushita Electric Works Ltd 熱電変換モジュールの製造方法
JP2017535939A (ja) * 2014-09-18 2017-11-30 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 熱電材料の熱圧着
JP2017130596A (ja) * 2016-01-22 2017-07-27 日立化成株式会社 熱電変換モジュールおよびその製造方法
JP2018160560A (ja) * 2017-03-23 2018-10-11 日立化成株式会社 熱電変換モジュールおよびその製造方法

Also Published As

Publication number Publication date
US20220293840A1 (en) 2022-09-15
JP7438685B2 (ja) 2024-02-27
JP2021022712A (ja) 2021-02-18

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