WO2021017172A1 - 一种显示面板及其制备方法 - Google Patents

一种显示面板及其制备方法 Download PDF

Info

Publication number
WO2021017172A1
WO2021017172A1 PCT/CN2019/110832 CN2019110832W WO2021017172A1 WO 2021017172 A1 WO2021017172 A1 WO 2021017172A1 CN 2019110832 W CN2019110832 W CN 2019110832W WO 2021017172 A1 WO2021017172 A1 WO 2021017172A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
water
absorbing
film layer
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/110832
Other languages
English (en)
French (fr)
Inventor
郭天福
黄静
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to US16/761,427 priority Critical patent/US11482691B2/en
Priority to JP2020541369A priority patent/JP7048749B2/ja
Publication of WO2021017172A1 publication Critical patent/WO2021017172A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks

Definitions

  • the invention relates to the field of display, in particular to a display panel and a preparation method thereof.
  • the display panel Compared with the traditional LCD, the display panel has the advantages of lighter weight, wide viewing angle, fast response time, low temperature resistance, and high luminous efficiency. Therefore, it has always been regarded as the next generation of new display technology in the display industry.
  • OLED can be made into a flexible device that can be bent on a flexible substrate. This is a huge advantage unique to OLED.
  • TFE thin film encapsulation
  • the deadly killer of the display panel is the presence of water and oxygen in the external environment.
  • the intrusion of external water and oxygen can be divided into two categories: one is that the water and oxygen directly penetrate the TFE film from the top to the bottom to enter the inside of the display panel; the second is that the water and oxygen enters and corrodes the OLED from the side of the TFE film.
  • the thin film encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer, and is a sandwich film structure, which is a common TFE film structure in the industry.
  • the water vapor transmission rate (WVTR) of this sandwich film structure can achieve ⁇ 5 E-4 in the industry g/m2/day.
  • the first inorganic layer and the second inorganic layer are mainly used to block external water and oxygen from entering the organic layer inside the display panel. Because the organic layer is loose and porous, it does not have any ability to block water and oxygen. Therefore, the water and oxygen blocking effect of the display panel is poor.
  • the thin-film packaging structure adopts an aluminum oxide layer and a PP layer to form a laminated film layer.
  • This laminated film layer theoretically has good water and oxygen blocking performance, but in actual production, it cannot effectively wrap Avoid foreign objects, so the actual water and oxygen blocking effect is often poor.
  • the structure of the thin-film encapsulation layer includes a first inorganic layer/first organic layer/second inorganic layer/second organic layer/third inorganic layer, wherein the first inorganic layer is alumina.
  • the main disadvantage of the structure of this thin-film encapsulation layer is that the structure of the overlapping design of the inorganic layer and the organic layer is too thick, resulting in relatively poor bending resistance, the film layer is often too stressed, and may even cause the light-emitting film under the display panel The layer is grabbed, which is not conducive to the long-term development of the flexible display panel.
  • the present invention provides a display panel to solve the technical problems of poor water and oxygen blocking performance, poor flexibility, and affecting the normal light emission of the display panel in the prior art.
  • the present invention provides a display panel including a base substrate and a thin film encapsulation layer; the thin film encapsulation layer includes a first inorganic layer, an organic layer, a second inorganic layer, and a water-absorbing laminated film layer; An inorganic layer is provided on the surface of the base substrate; the organic layer is provided on the surface of the first inorganic layer on the side away from the base substrate; the second inorganic layer is provided on the organic layer The surface on the side away from the first inorganic layer; at least one of the water-absorbing laminated film layer is provided between the organic layer and the first inorganic layer and/or between the organic layer and the second inorganic layer between.
  • each of the water-absorbent laminated film layers includes a dense film layer and a water-absorbent film layer, and the water-absorbent film layer is attached to one side surface of the dense film layer.
  • the dense film layer of one water-absorbing laminated film layer is attached to the water-absorbing film layer of the other water-absorbing laminated film layer.
  • the thickness of the dense film layer is 1 to 1000 nm, and the refractive index is greater than 1.6; the thickness of the water absorbing film layer is 1 to 3000 nm.
  • the material of the dense film layer includes any one of aluminum oxide, titanium oxide, or zirconium oxide; the material of the water-absorbing film layer includes silicon oxide, zinc oxide, magnesium oxide, or aluminum-based organic Any of inorganic composites.
  • the present invention also provides a method for manufacturing a display panel, which includes the following steps: a base substrate providing step, providing a base substrate; and a thin film packaging layer preparation step, preparing a thin film on the upper surface of the base substrate Encapsulation layer; wherein, the preparation step of the thin film encapsulation layer includes the following steps: a first inorganic layer preparation step, a first inorganic layer is prepared on the upper surface of the base substrate; an organic layer preparation step, in the inorganic layer An organic layer is prepared above; and a second inorganic layer preparation step is to prepare a second inorganic layer above the organic layer; the thin-film encapsulation layer preparation step also includes a water-absorbent laminate layer preparation step, where the organic layer and the At least one water-absorbing laminated film layer is prepared between the first inorganic layer and/or between the organic layer and the second inorganic layer.
  • At least one water-absorbent laminate layer is deposited on the upper surface of the first inorganic layer; in the step of preparing the organic layer, on the water-absorbent laminate layer An organic layer is prepared on the surface.
  • the step of preparing the water-absorbent laminated film layer includes a step of depositing a dense film layer on the upper surface of the first inorganic layer; and a step of depositing a water-absorbent film layer on the upper surface of the dense film layer.
  • a water-absorbing film layer is deposited; wherein the dense film layer deposition step and the water-absorbing film layer deposition step are performed at least once.
  • the step of preparing the water-absorbing laminated film layer includes the step of depositing a water-absorbing film layer on the upper surface of the first inorganic layer; and the step of depositing a dense film layer on the upper surface of the water-absorbing film layer.
  • a uniform dense film layer is deposited; wherein the water-absorbing film layer deposition step and the dense film layer deposition step are performed at least once.
  • step of preparing the water-absorbent laminate layer at least one water-absorbent laminate layer is deposited on the upper surface of the organic layer; in the step of preparing the second inorganic layer, on the upper surface of the water-absorbent laminate layer Prepare a second inorganic layer.
  • the step of preparing the water-absorbent laminated film layer includes a dense film layer deposition step, depositing a uniform dense film layer on the upper surface of the organic layer; and a water-absorbent film layer deposition step, depositing a dense film layer on the upper surface of the dense film layer Water-absorbing film layer; wherein the dense film layer deposition step and the water-absorbing film layer deposition step are performed at least once.
  • the step of preparing the water-absorbent laminated film layer includes the step of depositing a water-absorbent film layer on the upper surface of the organic layer; and the step of depositing a dense film layer on the upper surface of the water-absorbent film layer. Dense film layer; wherein the water-absorbing film layer deposition step and the dense film layer deposition step are performed at least once.
  • an atomic deposition method is used to deposit aluminum oxide, titanium oxide or zirconium oxide; in the water absorption film deposition step, a chemical vapor deposition method, an atomic deposition method or The physical vapor deposition method deposits silicon oxide, zinc oxide, magnesium oxide or aluminum-based organic-inorganic composites.
  • the technical effect of the present invention is to provide a display panel and a preparation method thereof.
  • a water-absorbing laminated film layer is arranged between the inorganic layer and the organic layer, and the water-absorbing laminated film layer can block external water and oxygen from intruding into the display panel from the inorganic layer.
  • the organic layer has high density and water absorption, so that the film encapsulation layer has high water and oxygen barrier properties, while maintaining good flexible bending performance, and improving the light transmittance of the display panel.
  • FIG. 1 is a schematic diagram of the structure of the OLED display device of Embodiment 1;
  • FIG. 2 is a schematic diagram of the structure of the thin film encapsulation layer of Embodiment 1;
  • FIG. 3 is a schematic diagram of another structure of the thin-film encapsulation layer according to Embodiment 1;
  • Figure 4 is a flow chart of a method for preparing a display panel
  • Figure 5 is a flow chart of the preparation steps of the thin film encapsulation layer in Example 1
  • Example 6 is a flow chart of the preparation steps of the water-absorbing laminated film layer described in Example 1;
  • FIG. 7 is another flow chart of the preparation steps of the water-absorbent laminated film layer described in Example 1;
  • Example 8 is a graph of the water vapor transmission rate of the thin-film encapsulation layer of Example 1;
  • FIG. 9 is a schematic diagram of the structure of the thin film encapsulation layer of Embodiment 2.
  • FIG. 10 is a flowchart of the steps of preparing the thin film encapsulation layer described in Example 2.
  • FIG. 11 is a schematic diagram of the structure of the thin-film encapsulation layer according to Embodiment 3;
  • Example 12 is a flow chart of the steps of preparing the thin film encapsulation layer described in Example 3.
  • 201 active layer 202 polysilicon layer; 203 dielectric layer; 204 source and drain electrodes; 205 gate electrodes;
  • this embodiment provides a display panel including a base substrate 1 and a thin film packaging layer 2, and the thin film packaging layer 2 is provided on the upper surface of the base substrate 1.
  • the base substrate 1 includes a glass substrate 101, a PI substrate 102, a thin film transistor, a pixel definition layer 103, and a light emitting layer 104.
  • the glass substrate 101 is a glass substrate in the prior art.
  • the PI substrate 102 is a flexible substrate, and its material is mainly polyimide (Polyimide, PI), PI material can effectively improve light transmittance.
  • Each thin film transistor includes an active layer 201 (P-type doping), a polysilicon layer 202, a dielectric layer 203, a source and drain electrode 204, a gate electrode 205, an insulating layer 206, a flat layer 207, and an anode 208.
  • a doped region 2011 is provided in the active layer 201, and the doped region 2011 may be doped with P-type impurities or N-type impurities to form a connection region of the source and drain electrodes of the MOS transistor, which is connected to the source and drain electrodes 204 .
  • the polysilicon layer 202 forms a connection area of the gate electrode of the MOS tube, and is connected to the gate electrode 205.
  • the dielectric layer 203 is used to insulate the source and drain electrodes 204 and the gate electrode 205 to avoid contact between the two electrodes and cause a short circuit.
  • the insulating layer 206 is disposed on the upper surfaces of the active layer 202, the dielectric layer 203, and the gate layer 205, and is penetrated by the source and drain electrodes 204.
  • the flat layer 207 is provided on the upper surfaces of the source and drain electrodes 204 and the insulating layer 206.
  • the anode 208 is provided on the upper surface of the flat layer 207.
  • the planarization layer 207 is generally made of polymethyl methacrylate or nano-particle composite materials, which has better heat resistance.
  • the pixel defining layer 103 is provided on the upper surface of the anode 208 and the flat layer 207.
  • the light-emitting layer 104 is provided on the upper surface of the pixel defining layer 103, and a cathode (not shown) is provided in the light-emitting layer 104.
  • the thin-film encapsulation layer 2 includes a first inorganic layer 210, an organic layer 212, and a second inorganic layer 213.
  • the first inorganic layer 210 is provided on the upper surface of the base substrate 1
  • the organic layer 212 is provided on the upper surface of the first inorganic layer 210
  • the second inorganic layer 213 is provided on the organic layer 212.
  • the thin film encapsulation layer 2 further includes a water-absorbing laminated film layer 211 disposed between the first inorganic layer 210 and the organic layer 212.
  • Each water-absorbing laminated film layer 211 includes a dense film layer 2111 and a water-absorbing film layer 2112.
  • the material of the dense film layer 2111 includes any one of aluminum oxide, titanium oxide, or zirconium oxide, and these materials have good compactness.
  • the thickness of the dense film layer 2111 is 1 to 1000 nm, and the refractive index is greater than 1.6, which can make the film encapsulation layer have good flexibility and improve the light transmittance of the display panel.
  • the material of the water-absorbing film layer 2112 includes any one of silicon oxide, zinc oxide, magnesium oxide or aluminum-based organic-inorganic composite.
  • the thickness of the water-absorbing film layer 2112 is 1 ⁇ 3000nm, so that the thin film encapsulation layer 2 has a good Water absorption and flexibility.
  • the water and oxygen can be prevented from invading the organic layer 212, and the water and oxygen blocking performance of the thin film encapsulation layer is improved.
  • the dense film layer 2111 is provided on the upper surface of the first inorganic layer 210, and the water absorbing film layer 2112 is provided on the upper surface of the dense film layer 2111, so that the surface of the water absorbing laminated film layer 211 forms highly dense metaaluminate Salt improves the water and oxygen barrier properties of the film encapsulation layer.
  • the water-absorbing film layer 2112 may also be provided on the upper surface of the first inorganic layer 210, and the dense film layer 2111 may be provided on the upper surface of the water-absorbing film layer 2112, which has the same technical effect as this embodiment.
  • a plurality of water-absorbing laminated film layers 211 are provided between the first inorganic layer 210 and the organic layer 212, and the multilayer dense film layer 2111 and the multilayer water-absorbing film layer 2112 are alternately arranged.
  • the number of water-absorbent laminated film layers 211 is two, two dense film layers 2111 and two water-absorbent film layers 2112 are arranged between the first inorganic layer 210 and the organic layer 212, and they are arranged alternately.
  • the technical solution of using multiple water-absorbent laminated film layers at the same time makes the surface of the water-absorbent laminated film layer form high-density metaaluminate, so that the water-absorbent laminated film layer has a good water absorption effect, compared to the technology that only uses one water-absorbent laminated film layer Solution, and further improve the water and oxygen blocking performance of the film encapsulation layer.
  • this embodiment also provides a method for manufacturing a display panel, including the following steps S1 to S2.
  • the S1 base substrate providing step provides a base substrate.
  • the S2 thin-film packaging layer preparation step a thin-film packaging layer is prepared on the upper surface of the base substrate.
  • the preparation step of the S2 thin film encapsulation layer includes the following steps S211 to S214.
  • a first inorganic layer is prepared on the upper surface of the base substrate. Specifically, a method such as chemical vapor deposition (CVD), physical vapor deposition (PVD), etc. is used to deposit the first inorganic layer on the base substrate.
  • the thickness of the first inorganic layer is less than 2 ⁇ m, and the material can be silicon nitride (SiN), silicon oxynitride (SiON), silicon monoxide (SiO) and other inorganic compounds.
  • the first inorganic layer can block water and oxygen invaded from the outside, and can improve the performance of the display panel.
  • step of S212 water-absorbing laminated film layer preparation, at least one water-absorbing laminated film layer is deposited on the upper surface of the first inorganic layer.
  • the water-absorbing laminated film layer has high-density metaaluminate, which can block water and oxygen from the outside intrusion.
  • the preparation steps of the water-absorbent laminated film layer successively include a dense film layer deposition step and a water-absorbent film layer deposition step, and the order of execution of the two is interchangeable.
  • the preparation step of S212 water-absorbing laminated film layer includes steps S2121 to S2122.
  • a uniform dense film is deposited on the upper surface of the first inorganic layer.
  • a dense film layer is formed on the upper surface of the first inorganic layer using an atomic deposition method.
  • the material of the dense film layer includes aluminum oxide, titanium oxide or zirconium oxide, so that the dense film layer has good compactness.
  • the thickness of the dense film layer is 1 to 1000 nm, and the refractive index is greater than 1.6, which can make the thin film encapsulation layer have good flexibility and improve the light transmittance of the display panel.
  • a water absorption film layer is deposited on the upper surface of the dense film layer.
  • a water-absorbing film layer is formed on the upper surface of the dense film layer using a chemical vapor deposition method, an atomic deposition method or a physical vapor deposition method.
  • the material of the water-absorbing film layer includes silicon oxide, zinc oxide, magnesium oxide or aluminum-based organic-inorganic composite, and the thickness of the water-absorbing film layer ranges from 1 nm to 3000 nm.
  • the water-absorbing film layer can form a dense and uniform film layer, has a good water absorption effect, can prevent water and oxygen from invading the organic layer, and improve the water and oxygen barrier performance of the film encapsulation layer.
  • the water-absorbing effect of multiple water-absorbing laminated films is more excellent and can prevent water and oxygen from invading the organic layer. Improve the water and oxygen barrier properties of the film encapsulation layer.
  • an organic layer is prepared on the upper surface of the water-absorbing laminated film layer.
  • An organic layer is formed on the upper surface of the water-absorbing laminated film layer by inkjet printing (IJP), chemical vapor deposition (CVD), or evaporation.
  • the material of the organic layer may be hexamethyldimethicone (HMDSO), aluminum-based organic-inorganic composite (Alucone), epoxy resin, acrylic system, and silicon-containing organics. Therefore, the organic layer can wrap the foreign matter that occurs during the deposition process, relieve the stress generated by the first inorganic layer, and thereby improve the flexibility of the display panel package.
  • the second inorganic layer preparation step is to prepare a second inorganic layer on the upper surface of the organic layer.
  • a second inorganic layer is deposited on the upper surface of the organic layer using methods such as chemical vapor deposition (CVD), physical vapor deposition (PVD), and the like.
  • the thickness of the second inorganic layer is less than 2 ⁇ m, and the material may be an inorganic compound such as silicon nitride (SiN), silicon oxynitride (SiON), silicon monoxide (SiO), etc.
  • the second inorganic layer can block water and oxygen from outside, and can improve the performance of the display panel.
  • the step of preparing the S212 water-absorbing laminated film layer may include the following steps S2221 to S2222.
  • a water-absorbing film layer is deposited on the upper surface of the first inorganic layer.
  • a uniform dense film is deposited on the upper surface of the water-absorbing film.
  • the water vapor transmission rate (WVTR) of the first film encapsulation layer 10 provided by this embodiment is compared with the water vapor transmission rate of the second film encapsulation layer 20 in the prior art. It can be clearly seen that the water vapor transmission rate of the first thin-film encapsulation layer 10 of this embodiment is significantly increased, so that the thin-film encapsulation layer has a good effect of blocking water and oxygen, and improves the encapsulation effect of the display panel.
  • this embodiment provides a display panel, which includes most of the technical features of the display panel described in Embodiment 1. The difference is that in Embodiment 2, the water-absorbing laminated film layer 211 is provided on the second inorganic layer. Between 210 and the organic layer 212, rather than between the first inorganic layer 210 and the organic layer 212.
  • the thin-film encapsulation layer 2 in the display panel includes a first inorganic layer 210, an organic layer 212, a water-absorbing laminated film layer 211, and a second inorganic layer 213 in order from bottom to top.
  • Each water-absorbing laminated film layer 211 includes a dense film layer 2111 and a water-absorbing film layer 2112.
  • the dense film layer 2111 is provided on the upper surface of the organic layer 212
  • the water-absorbent film layer 2112 is provided on the upper surface of the dense film layer 2111, so that high-density metaaluminate is formed on the surface of the water-absorbent laminated film layer 211, which improves the water resistance of the film encapsulation layer. Oxygen performance.
  • the water-absorbing film layer 2112 may also be provided on the upper surface of the organic layer 212, and the dense film layer 2111 may be provided on the upper surface of the water-absorbing film layer 2112, which has the same technical effect as this embodiment.
  • a plurality of water-absorbing laminated film layers 211 are provided between the second inorganic layer 213 and the organic layer 212, and the multilayer dense film layer 2111 and the multilayer water-absorbing film layer 2112 are alternately arranged.
  • the technical solution of using multiple water-absorbent laminated film layers at the same time makes the surface of the water-absorbent laminated film layer form high-density metaaluminate, so that the water-absorbent laminated film layer has a good water absorption effect, compared to the technology that only uses one water-absorbent laminated film layer Solution, and further improve the water and oxygen blocking performance of the film encapsulation layer.
  • This embodiment also provides a method for manufacturing a display panel, including the following steps S1 to S2, refer to FIG. 4.
  • the S1 base substrate providing step provides a base substrate.
  • the S2 thin-film packaging layer preparation step a thin-film packaging layer is prepared on the upper surface of the base substrate.
  • the preparation step of the S2 thin film encapsulation layer includes the following steps S221 to S224.
  • a first inorganic layer is prepared on the upper surface of the base substrate.
  • an organic layer is deposited on the upper surface of the first inorganic layer.
  • At least one water-absorbing laminated film layer is deposited on the upper surface of the organic layer.
  • a second inorganic layer is prepared on the upper surface of the water-absorbing laminated film layer.
  • the difference between the steps S221 to S224 and the steps S211 to 214 described in the embodiment 1 is that the method for preparing the display panel described in the embodiment 2 performs the water-absorbent laminated film preparation step after the organic layer preparation step.
  • the technical effects of each step are basically the same as those of the corresponding steps in Embodiment 1, and will not be repeated here.
  • the display panel provided in this embodiment and the preparation method thereof can make the display panel have good water and oxygen blocking performance, flexible bending performance, and can improve the light transmittance of the display panel.
  • this embodiment provides a display panel that includes all the technical features of the display panel described in Example 1. The difference is that in Example 3, the water-absorbing laminated film layer is not only provided on the first inorganic layer. Between 210 and the organic layer 212, it is also provided between the second inorganic layer 210 and the organic layer 212.
  • the water-absorbing laminated film layer 211 includes a first water-absorbing laminated film layer 221 and a second water-absorbing laminated film layer 231.
  • the thin film encapsulation layer 2 in the display panel includes an inorganic layer 210, a first water-absorbing laminated film layer 221, an organic layer 212, a second water-absorbing laminated film layer 231, and a second inorganic layer 213 in order from bottom to top.
  • Each water-absorbing laminated film layer includes a dense film layer 2111 and a water-absorbing film layer 2112.
  • a dense film layer 2111 is provided on the upper surface of the first inorganic layer 210 and the organic layer 212, respectively, and the water-absorbing film layer 2112 is provided on the upper surface of the dense film layer 2111, so that the surface of the water-absorbent laminated film layer 211 forms high-density metaaluminate Salt improves the water and oxygen barrier properties of the film encapsulation layer.
  • a water-absorbing film layer 2112 is provided on the upper surfaces of the first inorganic layer 210 and the organic layer 212, respectively.
  • the dense film layer 2111 may be provided on the upper surface of the water-absorbing film layer 2112, which has the same technical effect as this embodiment. .
  • a plurality of water-absorbing laminated film layers 211 are provided between the first inorganic layer 210 and the organic layer 212 or between the second inorganic layer 213 and the organic layer 212, and the multilayer dense film layer 2111 It is arranged alternately with the multilayer water-absorbing film layer 2112.
  • the technical solution of using multiple water-absorbent laminated film layers at the same time makes the surface of the water-absorbent laminated film layer form high-density metaaluminate, so that the water-absorbent laminated film layer has a good water absorption effect, compared to the technology that only uses one water-absorbent laminated film layer Solution, and further improve the water and oxygen blocking performance of the film encapsulation layer.
  • This embodiment also provides a method for manufacturing a display panel, including the following steps S1 to S2, refer to FIG. 4.
  • the S1 base substrate providing step provides a base substrate.
  • the S2 thin-film packaging layer preparation step a thin-film packaging layer is prepared on the upper surface of the base substrate.
  • the preparation step of the S2 thin film encapsulation layer includes the following steps S231 to S235.
  • a first inorganic layer is prepared on the upper surface of the base substrate.
  • At least one first water-absorbing laminated film is deposited on the upper surface of the first inorganic layer.
  • an organic layer is deposited on the upper surface of the first water-absorbing laminated film layer.
  • the second water-absorbing laminated film layer preparation step is to prepare a water-absorbing laminated film layer on the upper surface of the organic layer.
  • a second inorganic layer is prepared on the upper surface of the second water-absorbing laminated film layer.
  • the difference between the steps S231 to S235 and the steps S211 to 214 in the embodiment 1 is that the preparation method of the display panel in the embodiment 3 executes the water-absorbing laminated film layer preparation step before and after the organic layer preparation step.
  • the technical effects of each step are basically the same as those of the corresponding steps in Embodiment 1, and will not be repeated here.
  • the technical solution of arranging a water-absorbing laminated film layer between the first inorganic layer and the organic layer and between the second inorganic layer and the second inorganic layer is compared with embodiment 1.
  • the water absorption effect of two or more water-absorbing laminated film layers is better, which can prevent water and oxygen from invading the organic layer, and improve the water and oxygen blocking performance of the film encapsulation layer.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Laminated Bodies (AREA)

Abstract

本发明提供一种显示面板及其制备方法，所述显示面板包括衬底基板、第一无机层、有机层以及吸水叠膜层；所述显示面板制备方法包括衬底基板提供步骤、第一无机层制备步骤、有机层制备步骤、第二无机层制备步骤以及吸水叠膜层制备步骤。

Description

一种显示面板及其制备方法 技术领域
本发明涉及显示领域，尤其涉及一种显示面板及其制备方法。
 背景技术
显示面板因其较传统LCD相比具有重量轻巧，广视角，响应时间快，耐低温，发光效率高等优点。因此，在显示行业一直被视其为下一代新型显示技术，特别是OLED可以在柔性基板上做成能弯曲的柔性器件，这是OLED所特有的巨大优势。为了实现OLED的该种优势（柔性显示），薄膜封装（TFE）技术是必不可少的核心技术。
显示面板的致命杀手是外界环境中存在的水氧。外界水氧的入侵途径可分为两类：途径一是水氧从上向下直接穿透TFE膜层进入显示面板内部；途径二是水氧从TFE膜层侧面进入侵蚀OLED。
常见的显示面板，包括玻璃基底、阵列基板、发光层、薄膜封装层。其中，薄膜封装层包括第一无机层、有机层以及第二无机层，为三明治膜层结构，是目前行业内较常见的TFE膜层结构。这种三明治膜层结构的水蒸气透过率（water vapor transmission rate，WVTR）行业内能做到< 5 E-4 g/m2/day。主要是通过第一无机层及第二无机层来阻隔外界水氧入侵到显示面板内部的有机层中。由于有机层的膜质疏松多孔，不具备任何阻隔水氧的能力。因此，导致显示面板的阻水氧效果较差。
现有技术中，薄膜封装结构采用氧化铝层与PP层形成叠膜层，这种叠膜层理论上具有较好的阻水氧性能，但是在实际工艺生产中，不能有效地包裹制程中不可避免的异物，因此实际的阻水氧效果往往较差。
在专利US20150021565、US20150048331中，薄膜封装层的结构包括第一无机层/第一有机层/第二无机层/第二有机层/第三无机层，其中第一无机层为氧化铝。这种薄膜封装层的结构的主要缺点为无机层与有机层交叠设计的结构过厚，导致耐弯折性能相对较差，膜层往往应力过大，甚至有可能会导致显示面板下层发光膜层被抓起，不利于柔性显示面板的长期发展。
 技术问题
为了解决上述问题，本发明提供一种显示面板，以解决现有技术中存在的阻水氧性能差、柔性性能差、影响显示面板正常出光的技术问题。
 技术解决方案
为实现上述目的，本发明提供一种显示面板，包括衬底基板以及薄膜封装层；其所述薄膜封装层包括第一无机层、有机层、第二无机层以及吸水叠膜层；所述第一无机层设于所述衬底基板一侧的表面；所述有机层设于所述第一无机层远离所述衬底基板一侧的表面；所述第二无机层设于所述有机层远离所述第一无机层一侧的表面；至少一所述吸水叠膜层设于所述有机层与所述第一无机层之间和/或所述有机层与所述第二无机层之间。
进一步地，每一所述吸水叠膜层包括致密膜层以及吸水膜层，所述吸水膜层贴附于所述致密膜层一侧表面。
进一步地，当所述吸水叠膜层的层数为两层以上时，一吸水叠膜层的致密膜层贴附另一吸水叠膜层的吸水膜层。
进一步地，所述致密膜层的厚度为1~1000nm，且折射率大于1.6；所述吸水膜层的厚度为1~3000nm。
进一步地，所述致密膜层的材质包括铝氧化物、钛氧化物或锆氧化物中的任一种；所述吸水膜层的材质包括硅氧化物、锌氧化物镁氧化物或铝基有机无机复合物中的任一种。
为实现上述目的，本发明还提供一种显示面板的制备方法，包括如下步骤衬底基板提供步骤，提供一衬底基板；以及薄膜封装层制备步骤，在所述衬底基板上表面制备一薄膜封装层；其中，所述薄膜封装层制备步骤包括如下步骤，第一无机层制备步骤，在所述衬底基板的上表面制备一第一无机层；有机层制备步骤，在所述一无机层上方制备一有机层；以及第二无机层制备步骤，在所述有机层上方制备一第二无机层；所述薄膜封装层制备步骤还包括吸水叠膜层制备步骤，在所述有机层与所述第一无机层之间和/或所述有机层与所述第二无机层之间制备至少一吸水叠膜层。
进一步地，在所述吸水叠膜层制备步骤中，在所述第一无机层的上表面沉积至少一吸水叠膜层；在所述有机层制备步骤中，在所述吸水叠膜层的上表面制备一有机层。
进一步地，所述吸水叠膜层制备步骤包括致密膜层沉积步骤，在所述第一无机层的上表面沉积一致密膜层；以及吸水膜层沉积步骤，在所述致密膜层的上表面沉积一吸水膜层；其中，所述致密膜层沉积步骤与所述吸水膜层沉积步骤被执行至少一次。
进一步地，所述吸水叠膜层制备步骤包括吸水膜层沉积步骤，在所述第一无机层的上表面沉积一吸水膜层；以及致密膜层沉积步骤，在所述吸水膜层的上表面沉积一致密膜层；其中，所述吸水膜层沉积步骤与所述致密膜层沉积步骤被执行至少一次。
进一步地，在所述吸水叠膜层制备步骤中，在所述有机层的上表面沉积至少一吸水叠膜层；在所述第二无机层制备步骤中，在所述吸水叠膜层上表面制备一第二无机层。
进一步地，所述吸水叠膜层制备步骤包括致密膜层沉积步骤，在所述有机层的上表面沉积一致密膜层；以及吸水膜层沉积步骤，在所述致密膜层的上表面沉积一吸水膜层；其中，所述致密膜层沉积步骤与所述吸水膜层沉积步骤被执行至少一次。
进一步地，所述吸水叠膜层制备步骤包括吸水膜层沉积步骤，在所述有机层的上表面沉积一吸水膜层；以及致密膜层沉积步骤，在所述吸水膜层的上表面沉积一致密膜层；其中，所述吸水膜层沉积步骤与所述致密膜层沉积步骤被执行至少一次。
进一步地，在所述致密膜层沉积步骤中，采用原子沉积方法沉积铝氧化物、钛氧化物或锆氧化物；在所述吸水膜层沉积步骤中，采用化学气相沉积方法、原子沉积方法或物理气相沉积方法沉积硅氧化物、锌氧化物、镁氧化物或铝基有机无机复合物。
 有益效果
本发明的技术效果在于，提供一种显示面板及其制备方法，在无机层与有机层之间设置吸水叠膜层，该吸水叠膜层可以阻隔外界的水氧从无机层入侵到显示面板内部的有机层，具有高致密性、吸水性，使薄膜封装层具有高阻水氧的性能，同时还保持良好的柔性弯折性能，并提升显示面板的透光率。
 附图说明
图1为实施例1所述OLED显示器件的结构示意图；
图2为实施例1所述薄膜封装层的结构示意图；
图3为实施例1所述薄膜封装层的另一种结构示意图；
图4为显示面板制备方法流程图；
图5为实施例1 所述薄膜封装层制备步骤的流程图
图6为实施例1所述吸水叠膜层制备步骤的流程图；
图7为实施例1所述吸水叠膜层制备步骤另一种的流程图；
图8为实施例1所述薄膜封装层水蒸气透过率的曲线图；
图9为实施例2所述薄膜封装层的结构示意图；
图10为实施例2所述薄膜封装层制备步骤的流程图；
图11为实施例3所述薄膜封装层的结构示意图；
图12为实施例3所述薄膜封装层制备步骤的流程图。
附图中部分标识如下：
1衬底基板；2薄膜封装层；
101玻璃基底；102 PI基底；103像素定义层；104发光层；
201有源层；202多晶硅层；203介电层；204源漏电极；205栅电极；
206绝缘层；207平坦层；208阳极；2011掺杂区；
210第一无机层；211吸水叠膜层；212有机层；213第二无机层；
221第一吸水叠膜层；231第二吸水叠膜层；
2111致密膜层；2112吸水膜层。
 本发明的实施方式
以下参考说明书附图介绍本发明的优选实施例，用以举例证明本发明可以实施，这些实施例可以向本领域中的技术人员完整介绍本发明的技术内容，使得本发明的技术内容更加清楚和便于理解。然而本发明可以通过许多不同形式的实施例来得以体现，本发明的保护范围并非仅限于文中提到的实施例。
实施例1
如图1所示，本实施提供一种显示面板，包括衬底基板1及薄膜封装层2，薄膜封装层2设于衬底基板1的上表面。
衬底基板1包括玻璃基底101、PI基底102、薄膜晶体管、像素定义层103以及发光层104。
玻璃基底101为现有技术中的玻璃基板。PI基底102为柔性基底，其材料主要为聚酰亚胺（Polyimide, PI），PI材料可以有效地提高透光度。每一薄膜晶体管包括有源层201（P型掺杂）、多晶硅层202、介电层203、源漏电极204、栅电极205、绝缘层206、平坦层207以及阳极208。具体地，在有源层201设有掺杂区2011，该掺杂区2011可以掺杂P型杂质或者N型杂质，用以形成MOS管的源漏电极的连接区域，连接至源漏电极204。多晶硅层202是形成MOS管的栅电极的连接区域，且连接至栅电极205。介电层203用以绝缘源漏电极204与栅电极205，避免两电极间接触，产生短路现象。绝缘层206设于有源层202、介电层203、栅极层205的上表面，且被源漏电极204贯穿。平坦层207设于源漏电极204、绝缘层206的上表面。阳极208设于平坦层207的上表面。平坦化层207一般由聚甲基丙烯酸甲酯或纳米粒子复合材料制成，其耐热性能较好。像素定义层103设于阳极208、平坦层207的上表面。发光层104设于像素定义层103的上表面，一阴极（图未示）设于发光层104中。
如图2~3所示，薄膜封装层2包括第一无机层210、有机层212以及第二无机层213。第一无机层210设于衬底基板1的上表面，有机层212设于第一无机层210的上表面，第二无机层213设于有机层212的上方。
本实施例中，薄膜封装层2还包括一吸水叠膜层211，设于第一无机层210与有机层212之间。
每一吸水叠膜层211包括致密膜层2111与吸水膜层2112。致密膜层2111的材质包括铝氧化物、钛氧化物或锆氧化物中的任一种，这些材质具有良好的致密性。致密膜层2111的厚度为1~1000nm，折射率大于1.6，可以使薄膜封装层具有良好的柔性性能、提高显示面板的透光率。
由于有机层212的膜质疏松多孔，不具备任何阻隔水氧的能力，外界的水氧从第一无机层211或者第二无机层213入侵到显示面板内部的有机层212内。因此，在第一无机层210的上表面或者有机层212的上表面设置致密膜层2111可以提升有机层212的致密性，从而增强有机层212的阻水氧性能，提升薄膜封装层2的性能。吸水膜层2112的材质包括硅氧化物、锌氧化物、镁氧化物或铝基有机无机复合物中的任一种，吸水膜层2112的厚度为1~3000nm，使得薄膜封装层2具有良好的吸水性和柔性。当外界的水氧入侵薄膜封装层2时，可以防止水氧入侵有机层212，提升薄膜封装层的阻水氧性能。
如图2所示，致密膜层2111设于第一无机层210的上表面，吸水膜层2112设于致密膜层2111的上表面，使吸水叠膜层211表面形成高致密性的偏铝酸盐，提升薄膜封装层阻水氧性能。
在其他实施例中，吸水膜层2112还可以设于第一无机层210的上表面，致密膜层2111可以设于吸水膜层2112的上表面，与本实施例技术效果相同。
在本实施例的改进实施例中，在第一无机层210与有机层212之间设有多个吸水叠膜层211，多层致密膜层2111与多层吸水膜层2112交错设置。如图3所示，当吸水叠膜层211数量为2个时，第一无机层210与有机层212之间设有两层致密膜层2111和两层吸水膜层2112，且彼此交错设置。
同时使用多个吸水叠膜层的技术方案，使吸水叠膜层表面形成高致密性的偏铝酸盐，使得吸水叠膜层具有良好吸水的效果，相对于仅使用一个吸水叠膜层的技术方案，并进一步地提升薄膜封装层阻水氧性能。
如图4所示，本实施还提供一种显示面板的制备方法，包括如下步骤S1~S2。S1衬底基板提供步骤，提供一衬底基板。S2薄膜封装层制备步骤，在所述衬底基板上表面制备一薄膜封装层。
如图5所示，S2薄膜封装层制备步骤包括如下步骤S211~S214。
S211第一无机层制备步骤，在衬底基板的上表面制备一第一无机层。具体地，采用化学气相沉积（CVD）、物理气相沉积（PVD）等方法在所述衬底基板沉积第一无机层。所述第一无机层的厚度小于2μm，其材质可以为氮化硅（SiN），氮氧化硅（SiON），一氧化硅（SiO）等无机化合物。所述第一无机层可以阻隔外界入侵的水氧，并能提高显示面板的性能。
S212吸水叠膜层制备步骤，在所述第一无机层的上表面沉积至少一吸水叠膜层。所述吸水叠膜层具有高致密性的偏铝酸盐，可以阻隔外界的水氧入侵。吸水叠膜层制备步骤先后包括致密膜层沉积步骤及吸水膜层沉积步骤，二者执行的先后顺序是可调换的。
如图6所示，S212吸水叠膜层制备步骤包括步骤S2121~S2122。
S2121致密膜层沉积步骤，在所述第一无机层的上表面沉积一致密膜层。采用原子沉积方法在所述第一无机层的上表面形成致密膜层。所述致密膜层的材质包括铝氧化物、钛氧化物或锆氧化物，使所述致密膜层具有良好的致密性。所述致密膜层的厚度为1~1000nm，折射率大于1.6，可以使薄膜封装层具有良好的柔性性能、提高显示面板的透光率。
S2122吸水膜层沉积步骤，在所述致密膜层的上表面沉积一吸水膜层。采用化学气相沉积方法、原子沉积方法或物理气相沉积方法在所述致密膜层的上表面形成吸水膜层。所述吸水膜层的材质包括硅氧化物、锌氧化物、镁氧化物或铝基有机无机复合物，所述吸水膜层的厚度范围在1~3000nm之间。在沉积的过程中，所述吸水膜层可以形成致密均匀的膜层，具有良好吸水的效果，可以防止水氧入侵都有机层，提升薄膜封装层的阻隔水氧性能。
用户可以根据需要执行S2121致密膜层沉积步骤与S2122水膜层沉积步骤至少一次，生成至少一吸水叠膜层，多个吸水叠膜层的吸水的效果更加优良，可以防止水氧入侵有机层，提升薄膜封装层的阻水氧性能。
S214有机层制备步骤，在所述吸水叠膜层的上表面制备一有机层。采用喷墨打印（IJP），化学气相沉积（CVD）或蒸镀等方法在所述吸水叠膜层上表面形成有机层。所述有机层的材质可以为六甲基二甲硅醚（HMDSO），铝基有机无机复合物（Alucone），环氧树脂，亚克力体系，含硅有机物。因此，所述有机层可以包裹沉积过程中出现的异物，缓解所述第一无机层产生的应力，进而提升显示面板封装的柔性性能。
S215第二无机层制备步骤，在所述有机层的上表面制备一第二无机层。采用化学气相沉积（CVD）、物理气相沉积（PVD）等方法在所述有机层的上表面沉积第二无机层。所述第二无机层的厚度小于2μm，其材质可以为氮化硅（SiN），氮氧化硅（SiON），一氧化硅（SiO）等无机化合物。所述第二无机层可以阻隔外界入侵的水氧，并能提高显示面板的性能。
如图7所示，在其他实施例中，S212吸水叠膜层的制备步骤可以包括如下步骤S2221~ S2222。
S2221吸水膜层沉积步骤，在所述第一无机层的上表面沉积一吸水膜层。S2222致密膜层沉积步骤，在所述吸水膜层的上表面沉积一致密膜层。S2221吸水膜层沉积步骤与S2222致密膜层沉积步骤至少被执行一次，使得吸水叠膜层具有良好吸水的效果，可以防止水氧入侵所述有机层，提升薄膜封装层的阻水氧性能。
如图8所示，本实施提供的第一薄膜封装层10的水蒸气透过率（water vapor transmission rate，WVTR）与现有技术的第二薄膜封装层20的水蒸气透过率相比较，可以明显看出本实施例的第一薄膜封装层10的水蒸气透过率显著提升，使得薄膜封装层具有良好的阻隔水氧的效果，提高显示面板的封装效果。
实施例2
如图9所示，本实施例提供一种显示面板，包括实施例1所述显示面板的大部分技术特征，其区别特征在于，实施例2中，吸水叠膜层211设于第二无机层210与有机层212之间，而不是设于第一无机层210与有机层212之间。
如图9所示，显示面板中的薄膜封装层2从下到上依次包括第一无机层210、有机层212、吸水叠膜层211以及第二无机层213。
每一吸水叠膜层211包括致密膜层2111与吸水膜层2112。致密膜层2111设于有机层212的上表面，吸水膜层2112设于致密膜层2111的上表面，使吸水叠膜层211表面形成高致密性的偏铝酸盐，提升薄膜封装层阻水氧性能。
在其他实施例中，吸水膜层2112还可以设于有机层212的上表面，致密膜层2111可以设于吸水膜层2112的上表面，与本实施例技术效果相同。
在本实施例的改进实施例中，在第二无机层213与有机层212之间设有多个吸水叠膜层211，多层致密膜层2111与多层吸水膜层2112交错设置。
同时使用多个吸水叠膜层的技术方案，使吸水叠膜层表面形成高致密性的偏铝酸盐，使得吸水叠膜层具有良好吸水的效果，相对于仅使用一个吸水叠膜层的技术方案，并进一步地提升薄膜封装层阻水氧性能。
本实施例还提供一种显示面板的制备方法，包括如下步骤S1~S2，参照图4。S1衬底基板提供步骤，提供一衬底基板。S2薄膜封装层制备步骤，在所述衬底基板上表面制备一薄膜封装层。
如图10所示，S2薄膜封装层制备步骤包括如下步骤S221~S224。
S221第一无机层制备步骤，在所述衬底基板的上表面制备一第一无机层。
S222有机层制备步骤，在所述第一无机层的上表面沉积有机层。
S223吸水叠膜层制备步骤，在所述有机层的上表面沉积至少一吸水叠膜层。
S224第二无机层制备步骤，在所述吸水叠膜层的上表面制备一第二无机层。
所述步骤S221~S224与实施例1所述步骤S211~214相比，其区别特征在于，实施例2所述显示面板的制备方法，在有机层制备步骤后，执行吸水叠膜层制备步骤。各个步骤的技术效果与实施例1中相应步骤的技术效果基本相同，在此不做赘述。
本实施例提供显示面板及其制备方法可以使显示面板具有良好的阻水氧性能、柔性弯折性能并能提升显示面板的透光率。
实施例3
如图11所示，本实施提供一种显示面板，包括实施例1所述显示面板的全部技术特征，其区别特征在于，实施例3中，所述吸水叠膜层不仅设于第一无机层210与有机层212之间，还设于第二无机层210与有机层212之间。
如图11所示，吸水叠膜层211包括第一吸水叠膜层221与第二吸水叠膜层231。显示面板中的薄膜封装层2从下到上依次包括无机层210、第一吸水叠膜层221、有机层212、第二吸水叠膜层231以及第二无机层213。
每一吸水叠膜层包括致密膜层2111与吸水膜层2112。在第一无机层210与有机层212的上表面分别设有致密膜层2111，吸水膜层2112设于致密膜层2111的上表面，使吸水叠膜层211表面形成高致密性的偏铝酸盐，提升薄膜封装层阻水氧性能。
在其他实施例中，在第一无机层210与有机层212的上表面分别设有吸水膜层2112，致密膜层2111可以设于吸水膜层2112的上表面，与本实施例的技术效果相同。
在本实施例的改进实施例中，在第一无机层210与有机层212之间或者第二无机层213与有机层212之间设有多个吸水叠膜层211，多层致密膜层2111与多层吸水膜层2112交错设置。
同时使用多个吸水叠膜层的技术方案，使吸水叠膜层表面形成高致密性的偏铝酸盐，使得吸水叠膜层具有良好吸水的效果，相对于仅使用一个吸水叠膜层的技术方案，并进一步地提升薄膜封装层阻水氧性能。
本实施例还提供一种显示面板的制备方法，包括如下步骤S1~S2，参照图4。S1衬底基板提供步骤，提供一衬底基板。S2薄膜封装层制备步骤，在所述衬底基板上表面制备一薄膜封装层。
如图12所示，S2薄膜封装层制备步骤包括如下步骤S231~S235。
S231第一无机层制备步骤，在衬底基板的上表面制备一第一无机层。
S232第一吸水叠膜层制备步骤，在所述第一无机层的上表面沉积至少一第一吸水叠膜层。
S233有机层制备步骤，在所述第一吸水叠膜层的上表面沉积有机层。
S234第二吸水叠膜层制备步骤，在所述有机层的上表面制备一吸水叠膜层。
S235第二无机层制备步骤，在所述第二吸水叠膜层的上表面制备一第二无机层。
所述步骤S231~S235与实施例1所述步骤S211~214相比，其区别特征在于，实施例3所述显示面板的制备方法，在有机层制备步骤前后，执行吸水叠膜层制备步骤。各个步骤的技术效果与实施例1中相应步骤的技术效果基本相同，在此不做赘述。
本实施例提供的显示面板及其制备方法，在第一无机层与有机层之间和第二无机层与第二无机层之间设置吸水叠膜层的技术方案，相对于实施例1或实施例2的技术方案，设置两个以上吸水叠膜层的吸水的效果更加优良，可以防止水氧入侵有机层，提升薄膜封装层的阻水氧性能。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (16)

  1. 一种显示面板，其中，包括：
    衬底基板；以及
    薄膜封装层，设于所述衬底基板一侧的表面；
    其中，所述薄膜封装层包括：
    第一无机层，设于所述衬底基板一侧的表面；
    有机层，设于所述第一无机层远离所述衬底基板一侧的表面；
    第二无机层，设于所述有机层远离所述第一无机层一侧的表面；以及
    至少一吸水叠膜层，设于所述有机层与所述第一无机层之间和/或所述有机层与所述第二无机层之间。
  2. 权利要求1所述的显示面板，其中，每一所述吸水叠膜层包括
    致密膜层；以及
    吸水膜层，贴附于所述致密膜层一侧表面。
  3. 如权利要求2所述的显示面板，其中，
    当所述吸水叠膜层的层数为两层以上时，
    一吸水叠膜层的致密膜层贴附另一吸水叠膜层的吸水膜层。
  4. 如权利要求2所述的显示面板，其中，
    所述致密膜层的厚度为1~1000nm，且折射率大于1.6；
    所述吸水膜层的厚度为1~3000nm。
  5. 如权利要求2所述的显示面板，其中，
    所述致密膜层的材质包括铝氧化物、钛氧化物或锆氧化物中的任一种；
    所述吸水膜层的材质包括硅氧化物、锌氧化物镁氧化物或铝基有机无机复合物中的任一种。
  6. 一种显示面板的制备方法，其中，包括如下步骤：
    衬底基板提供步骤，提供一衬底基板；以及
    薄膜封装层制备步骤，在所述衬底基板上表面制备一薄膜封装层；
    其中，所述薄膜封装层制备步骤包括如下步骤：
    第一无机层制备步骤，在所述衬底基板的上表面制备一第一无机层；
    有机层制备步骤，在所述一无机层上方制备一有机层；以及
    第二无机层制备步骤，在所述有机层上方制备一第二无机层；
    其中，所述薄膜封装层制备步骤还包括：
    吸水叠膜层制备步骤，在所述有机层与所述第一无机层之间和/或所述有机层与所述第二无机层之间制备至少一吸水叠膜层。
  7. 如权利要求6所述的显示面板的制备方法，其中，
    在所述吸水叠膜层制备步骤中，
    在所述第一无机层的上表面沉积至少一吸水叠膜层；
    在所述有机层制备步骤中，
    在所述吸水叠膜层的上表面制备一有机层。
  8. 如权利要求7所述的显示面板的制备方法，其中，
    所述吸水叠膜层制备步骤包括如下步骤：
    致密膜层沉积步骤，在所述第一无机层的上表面沉积一致密膜层；以及
    吸水膜层沉积步骤，在所述致密膜层的上表面沉积一吸水膜层；
    其中，所述致密膜层沉积步骤与所述吸水膜层沉积步骤被执行至少一次。
  9. 如权利要求7所述的显示面板的制备方法，其中，
    所述吸水叠膜层制备步骤包括如下步骤：
    吸水膜层沉积步骤，在所述第一无机层的上表面沉积一吸水膜层；以及
    致密膜层沉积步骤，在所述吸水膜层的上表面沉积一致密膜层；
    其中，所述吸水膜层沉积步骤与所述致密膜层沉积步骤被执行至少一次。
  10. 如权利要求6所述的显示面板的制备方法，其中，
    在所述吸水叠膜层制备步骤中，
    在所述有机层的上表面沉积至少一吸水叠膜层；
    在所述第二无机层制备步骤中，
    在所述吸水叠膜层上表面制备一第二无机层。
  11. 如权利要求10所述的显示面板的制备方法，其中，
    所述吸水叠膜层制备步骤包括如下步骤：
    致密膜层沉积步骤，在所述有机层的上表面沉积一致密膜层；以及
    吸水膜层沉积步骤，在所述致密膜层的上表面沉积一吸水膜层；
    其中，所述致密膜层沉积步骤与所述吸水膜层沉积步骤被执行至少一次。
  12. 如权利要求10所述的显示面板的制备方法，其中，
    所述吸水叠膜层制备步骤包括如下步骤：
    吸水膜层沉积步骤，在所述有机层的上表面沉积一吸水膜层；以及
    致密膜层沉积步骤，在所述吸水膜层的上表面沉积一致密膜层；
    其中，所述吸水膜层沉积步骤与所述致密膜层沉积步骤被执行至少一次。
  13. 如权利要求8所述的显示面板的制备方法，其中，
    在所述致密膜层沉积步骤中，
    采用原子沉积方法沉积铝氧化物、钛氧化物或锆氧化物；
    在所述吸水膜层沉积步骤中，
    采用化学气相沉积方法、原子沉积方法或物理气相沉积方法沉积硅氧化物、锌氧化物、镁氧化物或铝基有机无机复合物。
  14. 如权利要求9所述的显示面板的制备方法，其中，
    在所述致密膜层沉积步骤中，
    采用原子沉积方法沉积铝氧化物、钛氧化物或锆氧化物；
    在所述吸水膜层沉积步骤中，
    采用化学气相沉积方法、原子沉积方法或物理气相沉积方法沉积硅氧化物、锌氧化物、镁氧化物或铝基有机无机复合物。
  15. 如权利要求11所述的显示面板的制备方法，其中，
    在所述致密膜层沉积步骤中，
    采用原子沉积方法沉积铝氧化物、钛氧化物或锆氧化物；
    在所述吸水膜层沉积步骤中，
    采用化学气相沉积方法、原子沉积方法或物理气相沉积方法沉积硅氧化物、锌氧化物、镁氧化物或铝基有机无机复合物。
  16. 如权利要求12所述的显示面板的制备方法，其中，
    在所述致密膜层沉积步骤中，
    采用原子沉积方法沉积铝氧化物、钛氧化物或锆氧化物；
    在所述吸水膜层沉积步骤中，
    采用化学气相沉积方法、原子沉积方法或物理气相沉积方法沉积硅氧化物、锌氧化物、镁氧化物或铝基有机无机复合物。
PCT/CN2019/110832 2019-07-30 2019-10-12 一种显示面板及其制备方法 Ceased WO2021017172A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US16/761,427 US11482691B2 (en) 2019-07-30 2019-10-12 Display panel and manufacturing method thereof
JP2020541369A JP7048749B2 (ja) 2019-07-30 2019-10-12 表示パネル及びその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910693009.8 2019-07-30
CN201910693009.8A CN110473981A (zh) 2019-07-30 2019-07-30 一种显示面板及其制备方法

Publications (1)

Publication Number Publication Date
WO2021017172A1 true WO2021017172A1 (zh) 2021-02-04

Family

ID=68509867

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/110832 Ceased WO2021017172A1 (zh) 2019-07-30 2019-10-12 一种显示面板及其制备方法

Country Status (4)

Country Link
US (1) US11482691B2 (zh)
JP (1) JP7048749B2 (zh)
CN (1) CN110473981A (zh)
WO (1) WO2021017172A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111697160B (zh) * 2020-06-22 2022-11-29 云谷（固安）科技有限公司 显示面板及显示装置
CN112736204B (zh) * 2020-12-30 2021-08-06 山东永聚医药科技有限公司 金属诱导非晶结晶化转变超高阻隔膜及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070164666A1 (en) * 2006-01-19 2007-07-19 Tetsuo Oosono Organic electroluminescent element and the manufacturing method
CN103904230A (zh) * 2012-12-25 2014-07-02 海洋王照明科技股份有限公司 一种有机电致发光器件及其制备方法
CN108511629A (zh) * 2018-05-31 2018-09-07 京东方科技集团股份有限公司 Oled显示基板及其制作方法、显示装置
CN108878686A (zh) * 2018-07-02 2018-11-23 昆山国显光电有限公司 封装薄膜及制备方法、有机发光显示面板及显示装置
CN109728191A (zh) * 2018-11-27 2019-05-07 云谷（固安）科技有限公司 封装薄膜、封装结构、有机电致发光显示面板和显示装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9831468B2 (en) * 2013-02-14 2017-11-28 Samsung Display Co., Ltd. Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same
KR102100763B1 (ko) * 2013-08-08 2020-04-16 삼성디스플레이 주식회사 플렉서블 표시 장치
CN104505468B (zh) * 2014-12-16 2017-12-05 昆山国显光电有限公司 发光器件及其封装方法
US20160365538A1 (en) 2015-06-15 2016-12-15 Shenzhen China Star Optoelectronics Technology Co., Ltd. Packaging structure of oled device and packaging method thereof
CN105098090A (zh) * 2015-06-15 2015-11-25 深圳市华星光电技术有限公司 Oled器件的封装结构及其封装方法
CN106328825B (zh) * 2016-10-31 2019-01-15 武汉华星光电技术有限公司 Oled显示器
CN107068904A (zh) * 2017-04-18 2017-08-18 京东方科技集团股份有限公司 无机封装薄膜、oled封装薄膜的制作方法及相应装置
CN107425136B (zh) * 2017-05-11 2020-02-18 京东方科技集团股份有限公司 一种oled显示面板及其制备方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070164666A1 (en) * 2006-01-19 2007-07-19 Tetsuo Oosono Organic electroluminescent element and the manufacturing method
CN103904230A (zh) * 2012-12-25 2014-07-02 海洋王照明科技股份有限公司 一种有机电致发光器件及其制备方法
CN108511629A (zh) * 2018-05-31 2018-09-07 京东方科技集团股份有限公司 Oled显示基板及其制作方法、显示装置
CN108878686A (zh) * 2018-07-02 2018-11-23 昆山国显光电有限公司 封装薄膜及制备方法、有机发光显示面板及显示装置
CN109728191A (zh) * 2018-11-27 2019-05-07 云谷（固安）科技有限公司 封装薄膜、封装结构、有机电致发光显示面板和显示装置

Also Published As

Publication number Publication date
US20210408468A1 (en) 2021-12-30
JP7048749B2 (ja) 2022-04-05
CN110473981A (zh) 2019-11-19
US11482691B2 (en) 2022-10-25
JP2021535536A (ja) 2021-12-16

Similar Documents

Publication Publication Date Title
KR102290118B1 (ko) Oled 디스플레이 및 그 제작 방법
US9324776B2 (en) Organic light-emitting device including barrier layer including silicon oxide layer and silicon nitride layer
WO2021026996A1 (zh) 一种显示面板及其制备方法
CN105206753B (zh) 有机发光元件
US20110193067A1 (en) Organic light-emitting device including barrier layer including silicon oxide layer and silicon-rich silicon nitride layer
WO2019205426A1 (zh) Oled显示面板及其制作方法
WO2018094801A1 (zh) Oled显示装置及其制作方法
WO2018086191A1 (zh) Oled显示器及其制作方法
WO2016101395A1 (zh) 柔性oled显示器件及其制造方法
WO2018113007A1 (zh) Oled封装方法与oled封装结构
CN103035663B (zh) 显示器件
WO2020237830A1 (zh) 柔性有机发光二极管显示面板及其制造方法
WO2020206980A1 (zh) 柔性oled显示装置及制备方法
WO2020029351A1 (zh) 一种复合膜层及制作方法、oled显示面板的制作方法
US11374196B2 (en) Organic light emitting diode display panel with organic material structure on upper and lower portions of an inorganic layer and lower portion of second substrate
CN107644947B (zh) 阵列基板及其制备方法、显示装置
WO2021017172A1 (zh) 一种显示面板及其制备方法
WO2023004839A1 (zh) 封装结构、显示面板及显示面板的制作方法
CN1444422A (zh) 显示装置
WO2020124805A1 (zh) 显示屏及显示装置
WO2021134923A1 (zh) 有机发光二极管器件及其制作方法
CN105957978B (zh) 封装结构及其制造方法
CN111162188A (zh) 薄膜封装结构及其制备方法和显示面板
CN110112311A (zh) 一种显示面板及显示模组
CN107293650A (zh) 一种有机发光二极管显示器件及其制作方法、显示装置

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2020541369

Country of ref document: JP

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19939353

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19939353

Country of ref document: EP

Kind code of ref document: A1