WO2021016879A1 - 背板支撑结构及其制备方法、显示装置 - Google Patents

背板支撑结构及其制备方法、显示装置 Download PDF

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Publication number
WO2021016879A1
WO2021016879A1 PCT/CN2019/098421 CN2019098421W WO2021016879A1 WO 2021016879 A1 WO2021016879 A1 WO 2021016879A1 CN 2019098421 W CN2019098421 W CN 2019098421W WO 2021016879 A1 WO2021016879 A1 WO 2021016879A1
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WIPO (PCT)
Prior art keywords
area
support structure
elastic modulus
adhesive layer
backplane
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PCT/CN2019/098421
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English (en)
French (fr)
Inventor
谷朋浩
谢春燕
史世明
Original Assignee
京东方科技集团股份有限公司
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to CN201980001187.8A priority Critical patent/CN112585666A/zh
Priority to PCT/CN2019/098421 priority patent/WO2021016879A1/zh
Priority to EP19933219.8A priority patent/EP4006882A4/en
Priority to US16/955,442 priority patent/US11956906B2/en
Publication of WO2021016879A1 publication Critical patent/WO2021016879A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/14—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by a layer differing constitutionally or physically in different parts, e.g. denser near its faces
    • B32B5/142—Variation across the area of the layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/42—Polarizing, birefringent, filtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/51—Elastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/724—Permeability to gases, adsorption
    • B32B2307/7242—Non-permeable
    • B32B2307/7246—Water vapor barrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08—Polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film

Definitions

  • the embodiment of the present disclosure relates to a backplane support structure, a preparation method thereof, and a display device.
  • the display panel usually includes a display substrate, a backplane support structure provided on the non-display side of the display substrate, and a transparent cover provided on the display side of the display substrate.
  • the backplane support structure can provide support and protection for the display substrate.
  • the backplane support structure can also provide a certain mechanical buffer and mechanical protection for the bending of the flexible display panel, so as to prevent the flexible display panel from being damaged during the bending process.
  • At least one embodiment of the present disclosure provides a display device that includes a display substrate and a backplane support structure, wherein the backplane support structure includes a base support film and an adhesive layer that are stacked, and the backplane supports The structure is bonded to the non-display side of the display substrate through the adhesive layer, the backplane support structure has a first bendable area and a first non-bendable area, and the adhesive layer includes The first part of the bendable zone and the second part of the first non-bending zone; the elastic modulus of the first part is about 1Kpa-150Kpa, and the elastic modulus of the second part is about 150Kpa-250Kpa , The elastic modulus of the base support film is about 1Gpa-10Gpa; the display substrate is a foldable display substrate with a second bendable area and a second non-bendable area; wherein, the first bendable The zone and the second bendable zone are arranged in a corresponding lamination, and the first non-bending zone and the second non
  • the thickness of the base support film is about 20um-60um, and the thickness of the adhesive layer is about 10um-50um.
  • the elongation at break of the base support film is about 5% to 80%.
  • the bending strength of the substrate support film is greater than about 160 MPa.
  • the moisture absorption rate of the substrate support film is less than about 2%.
  • the material of the substrate support film includes polyimide or PET.
  • the material of the adhesive layer includes an acrylic adhesive.
  • the first non-bending area includes a first non-bending sub-area and a second non-bending sub-area, and the first bendable area is located in the first non-bending sub-area.
  • the second non-bending area includes a third non-bending sub-area and a fourth non-bending sub-area, and the second bendable area is located in the Between the third non-bending sub-area and the fourth non-bending sub-area, the first non-bending sub-area and the third non-bending sub-area are stacked correspondingly, and the second non-bending sub-area and the The fourth non-bending sub-region is arranged corresponding to the laminated layer.
  • At least one embodiment of the present disclosure provides a backplane support structure, the backplane support structure includes a base support film and an adhesive layer arranged in a stack; wherein the elastic modulus of the base support film is about 1Gpa-10Gpa, so The elastic modulus of the adhesive layer is about 1Kpa-250Kpa.
  • the thickness of the base support film is about 20um-60um, and the thickness of the adhesive layer is about 10um-50um.
  • the elongation at break of the substrate support film is about 5%-80%
  • the bending strength of the substrate support film is greater than about 160Mpa
  • the substrate support The moisture absorption rate of the film is less than about 2%.
  • the elastic modulus of the substrate support film is about 5Gpa-10Gpa, and the thickness is about 20um-40um; the elastic modulus of the adhesive layer is about 150Kpa -250Kpa, the thickness is about 10um-20um.
  • the elastic modulus of the substrate support film is about 1Gpa-5Gpa, and the thickness is about 40um-60um; the elastic modulus of the adhesive layer is about 1Kpa -150Kpa, the thickness is about 20um-50um.
  • the elastic modulus of the substrate support film is about 1Gpa-5Gpa, and the thickness is about 40um-60um; the elastic modulus of the adhesive layer is about 1Kpa -150Kpa, the thickness is about 10um-20um.
  • the elastic modulus of the base support film is about 5Gpa-10Gpa, and the thickness is about 40um-60um; the elastic modulus of the adhesive layer is about 150Kpa -250Kpa, the thickness is about 10um-20um.
  • the backplane support structure has a first bendable area and a first non-bendable area
  • the adhesive layer includes The first part of the folding zone and the second part located in the first non-bending zone; the elastic modulus of the first part is lower than the elastic modulus of the second part.
  • the elastic modulus of the first part is about 1Kpa-150Kpa
  • the elastic modulus of the second part is about 150Kpa-250Kpa
  • the backplane support structure has a main body area and a peripheral area
  • the adhesive layer includes a third part located in the main body area and located in the peripheral area.
  • the fourth part; the elastic modulus of the third part is lower than the elastic modulus of the fourth part.
  • the elastic modulus of the third part is about 1Kpa-150Kpa
  • the elastic modulus of the fourth part is about 150Kpa-250Kpa
  • the backplane support structure has a first bendable area, a first non-bending area, a main body area, and a peripheral area; the peripheral area is located in the The first non-bending area, the main body area is located in the first bendable area and the first non-bending area except the peripheral area, the adhesive layer includes the first bendable area The first part of the bending zone, the fourth part located in the peripheral zone, and parts other than the first part and the fourth part; the elastic modulus of the first part is about 1Kpa-150Kpa, the first part The elastic modulus of the four parts is about 150Kpa-250Kpa, and the elastic modulus of the part of the adhesive layer except the first part and the fourth part is about 1Kpa-250Kpa.
  • the backplane support structure has a main body area and a peripheral area, and the backplane support structure further includes a spacer layer that is attached to the Between the junction layer and the base support film, a protruding structure located in the peripheral area and protruding toward the adhesive layer is included, and the surface of the adhesive layer away from the spacer layer is a flat surface.
  • the elastic modulus of the spacer layer is about 1 Gpa-4 Gpa.
  • the substrate support film has a thickness of about 20 ⁇ m-60 ⁇ m
  • the adhesive layer has a thickness of about 20 ⁇ m-40 ⁇ m.
  • the height is about 10 ⁇ m-20 ⁇ m.
  • At least one embodiment of the present disclosure provides a display device that includes a display substrate and any of the above-mentioned backplane support structures, wherein the backplane support structure is bonded to the non-display side of the display substrate through the adhesive layer .
  • At least one embodiment of the present disclosure further provides a method for preparing a backplane support structure, including: providing a base support film, and forming an adhesive layer on the base support film, wherein the elastic modulus of the base support film is about 1Gpa-10Gpa, the elastic modulus of the adhesive layer is about 1Kpa-250Kpa.
  • the backplane support structure has a first bendable area and a first non-bendable area
  • the adhesive layer includes a first bendable area
  • the preparation method further includes: modifying at least one of the first part and the second part to make the first part
  • the modulus of elasticity is lower than the modulus of elasticity of the second part.
  • the backplane support structure further has a main body area and a peripheral area
  • the adhesive layer further includes a third part located in the main body area and located in the peripheral area.
  • the fourth part of the preparation method further comprises: modifying at least one of the third part and the fourth part so that the elastic modulus of the third part is lower than that of the fourth part The modulus of elasticity.
  • the modification treatment is performed by ultraviolet light irradiation.
  • the backplane support structure further has a main body area and a peripheral area
  • the preparation method further includes: before forming the adhesive layer, supporting the base film A spacer layer is formed thereon, the spacer layer includes a protruding structure located in the peripheral area, the adhesive layer is formed on the side of the spacer layer away from the base support film, and the adhesive The surface of the layer away from the spacer layer is formed as a flat surface.
  • the spacer layer is formed by hot pressing.
  • the temperature of the hot press molding is about 200° C.-300° C.
  • the pressure is about 0.8 N-1.0 N
  • the time is about 10 s-30 s.
  • FIG. 1A is a schematic plan view of a backplane support structure provided by at least one embodiment of the present disclosure
  • FIG. 1B is a schematic cross-sectional view of the backplane support structure in FIG. 1A along the line A-A;
  • FIG. 2A is a schematic plan view of a backplane support structure provided by at least one embodiment of the present disclosure
  • FIG. 2B is a schematic cross-sectional view of the backplane support structure in FIG. 2A along the line B-B;
  • 3A is a schematic plan view of a backplane support structure provided by at least one embodiment of the present disclosure
  • FIG. 3B is a schematic cross-sectional view of the backplane support structure in FIG. 3A along the line C-C;
  • 4A is a schematic plan view of a backplane support structure provided by at least one embodiment of the present disclosure.
  • FIG. 4B is a schematic cross-sectional view of the backplane supporting structure in FIG. 4A along the line D-D;
  • Fig. 5 is another schematic cross-sectional view of the backplane support structure in Fig. 3A along the line C-C;
  • 6A is a schematic plan view of a display device provided by at least one embodiment of the present disclosure.
  • FIG. 6B is a schematic cross-sectional view of the display device in FIG. 6A along the line E-E;
  • FIG. 7 is another schematic cross-sectional view of the display device in FIG. 6A along the line E-E;
  • FIG. 8 is a schematic cross-sectional view of the display device provided by at least one embodiment of the present disclosure after being bent;
  • Fig. 9 is another schematic cross-sectional view of the display device in Fig. 6A along the line E-E;
  • Fig. 10 is another schematic cross-sectional view of the display device in Fig. 6A along the line E-E;
  • FIG. 11 is a schematic partial cross-sectional view of a display area of a display device provided by at least one embodiment of the present disclosure
  • FIG. 12 is a schematic partial cross-sectional view of a binding area of a display device provided by at least one embodiment of the present disclosure
  • FIG. 13 is a manufacturing flow chart of the display device provided by at least one embodiment of the present disclosure.
  • the backplane support structure can provide a certain mechanical buffer and mechanical protection for the bending of the flexible display panel, so as to prevent the flexible display panel from being damaged during the bending process.
  • the backplane support structure needs to have certain mechanical properties, such as good bending recovery, deformation resistance, and bending strength, to ensure the reliability of the display panel .
  • the mechanical properties of the backplane support structure play an important role in the folding process of the folding display panel. In order to improve the reliability of the folding display panel, a reasonable design of the backplane support structure is required to fully relieve the force generated by the folding display panel during the bending process, thereby avoiding damage to the folding display panel during the bending process .
  • At least one embodiment of the present disclosure provides a backplane support structure.
  • the backplane support structure includes a base support film and an adhesive layer that are laminated.
  • the elastic modulus of the base support film is 1Gpa-10Gpa.
  • the modulus of elasticity is 1Kpa-250Kpa.
  • At least one embodiment of the present disclosure provides a display device that includes a display substrate and the above-mentioned backplane support structure, and the backplane support structure is bonded to the non-display side of the display substrate by an adhesive layer.
  • FIG. 1A is a schematic plan view of the backplane support structure
  • FIG. 1B is a schematic cross-sectional view of the backplane support structure in FIG. 1A along line A-A.
  • the backplane support structure includes a base support film 101 and an adhesive layer 102 that are arranged in layers.
  • the adhesive layer 102 is used to bond the backplane support structure to one side of a device such as a display substrate to provide support and protection.
  • the adhesive layer 102 may completely cover one surface of the base support film 101 (the adhesive layer 102 is shown in the figure to completely cover the upper surface of the base support film 101), or, in some examples, the adhesive layer 102 may also A part of the surface of the base support film 101 is covered.
  • the elastic modulus of the base support film 101 may be about 1 Gpa-10 Gpa.
  • the elastic modulus of the base support film 101 is less than about 1 Gpa, the base support film 101 will be difficult to achieve sufficient support and protection.
  • the elastic modulus of the base support film 101 is greater than about 10 Gpa, it is not conducive to the performance of the base support film 101. Operations such as bending.
  • the elastic modulus of the base support film 101 can be selected to be 2Gpa-8Gpa, such as 4Gpa, 5Gpa, 6Gpa or 7Gpa, etc. At this time, the base support film 101 can achieve a balance of various properties, thereby having Better overall performance.
  • the elastic modulus of the adhesive layer 102 may be about 1Kpa-250Kpa.
  • the elastic modulus of the adhesive layer 102 is less than about 1Kpa, the adhesive layer 102 is prone to unnecessary deformation, such as collapse, which makes it difficult to maintain the desired shape.
  • the elastic modulus of the adhesive layer 102 is high. When it is about 250Kpa, it is not conducive for the bonding layer 102 to cooperate with the base support film 101 to perform operations such as bending.
  • the elastic modulus of the adhesive layer 102 can be selected to be 10Kpa-150Kpa, such as 50Kpa, 80Kpa, 120Kpa, or 150Kpa. At this time, the adhesive layer 102 can achieve a balance of various properties, thereby having a better overall performance.
  • the backplane support structure With the cooperation of the base support film 101 and the adhesive layer 102 with the above-mentioned elastic modulus, the backplane support structure has good mechanical properties as a whole, such as good bending recovery, deformation resistance, and bending strength. Therefore, when the backplane support structure is used in a flexible display panel or a foldable display panel and other bendable devices, the backplane support structure can not only provide support and protection, but also provide certain mechanics for the bending of the display panel. Cushioning and mechanical protection, such as reducing the force on the display structure in the display panel, avoiding stress concentration in the display panel, and avoiding damage to the display panel during the bending process.
  • the backplane support structure may further include a protective film 104, which is disposed on the side of the adhesive layer 102 away from the substrate support film 101, for example, may be a release film, thereby blocking the protective film After the 104 is removed, the structure and morphology of the adhesive layer 102 are not affected. Therefore, the protective film 104 can provide a protective effect when the backplane support structure is not combined with a display panel or the like.
  • the backplane support structure is combined with a device such as a display panel, after the protective film 104 is removed, the backplane support structure can be combined with the device through the adhesive layer 102.
  • the thickness of the base support film 101 may be about 20um-60um.
  • the thickness of the base support film 101 is too large, for example, greater than about 60um, it will not be conducive to the thin design of the backplane support structure, and it is also not conducive to the operation of bending the backplane support structure.
  • the thickness of the base support film 101 is too large When it is thin, for example, less than about 20 um, the base supporting film 101 will have difficulty supporting and protecting.
  • the thickness of the base support film 101 can be selected to be 30um-50um, such as 30um, 35um, 40um, 45um, or 50um.
  • the thickness of the adhesive layer 102 can be about 10um-50um.
  • the thickness of the adhesive layer 102 can be selected to be 20um-40um, such as 20um, 25um, 30um, 35um, or 40um.
  • the base support film 101 can also be designed to further improve the overall performance of the backplane support structure.
  • the elongation at break of the base support film 101 may be about 5%-80%, such as 10%, 20%, 30%, 50%, or 70%.
  • the bending strength of the base supporting film 101 may be greater than about 160 MPa, such as 170 MPa, 180 MPa, or 190 MPa.
  • the moisture absorption rate of the base support film 101 may be less than about 2%, such as 0.5%, 1%, or 1.5%.
  • the backplane support structure can not only provide a certain degree of mechanical buffering and mechanical protection during the bending process, but also maintain a certain degree of stability, which will not be caused by bending or environmental factors (such as humidity). Qi), etc. and produce undesirable deformation.
  • the elastic modulus of the base support film 101 is about 5Gpa-10Gpa, such as 6Gpa, 7Gpa, 8Gpa or 9Gpa, and the thickness is about 20um-40um, such as 25um, 30um or 35um, etc.; the adhesive layer 102
  • the modulus of elasticity is about 150Kpa-250Kpa, such as 150Kpa, 180Kpa, 200Kpa or 230Kpa, and the thickness is about 10um-20um, such as 12um, 15um or 18um.
  • the elastic modulus of the base support film 101 is about 5Gpa-10Gpa, such as 6Gpa, 7Gpa, 8Gpa or 9Gpa, etc., and the thickness is about 40um-60um, such as 45um, 50um or 55um, etc.; the adhesive layer The elastic modulus of 102 is about 150Kpa-250Kpa, such as 150Kpa, 180Kpa, 200Kpa, or 230Kpa, and the thickness is about 10um-20um, such as 12um, 15um, or 18um.
  • the elastic modulus of the base support film 101 is about 1Gpa-5Gpa, such as 2Gpa, 3Gpa, 4Gpa or 5Gpa, etc., and the thickness is about 40um-60um, such as 45um, 50um or 55um, etc.; adhesive layer
  • the elastic modulus of 102 is about 1Kpa-150Kpa, such as 10Kpa-150Kpa, such as 10Kpa, 30Kpa, 50Kpa, 80Kpa, 100Kpa, or 120Kpa, etc., and the thickness is about 20um-50um, such as 30um, 35um or 40um.
  • the elastic modulus of the base support film 101 is about 1Gpa-5Gpa, such as 2Gpa, 3Gpa, 4Gpa or 5Gpa, etc., and the thickness is about 40um-60um, such as 45um, 50um or 55um, etc.; adhesive layer
  • the elastic modulus of 102 is about 1Kpa-150Kpa, such as 10Kpa-150Kpa, such as 10Kpa, 30Kpa, 50Kpa, 80Kpa, 100Kpa, or 120Kpa, etc., and the thickness is about 10um-20um, such as 12um, 15um, or 18um.
  • the cooperation of the above-mentioned base support film 101 and the adhesive layer 102 can make the backplane support structure have good mechanical properties as a whole, such as good bending recovery, deformation resistance and bending strength.
  • the elastic modulus of the base support film 101 is 1Gpa-5Gpa and the elastic modulus of the adhesive layer 102 is 1Kpa-150Kpa
  • the backplane support structure can be applied to the display panel. The folding provides better mechanical protection and prevents the display panel from being damaged during the bending process.
  • the material of the base support film 101 includes a polymer material, such as polyimide (for example, polyimide with more flexible segments) or polyterephthalic acid plastic (PET).
  • a polymer material such as polyimide (for example, polyimide with more flexible segments) or polyterephthalic acid plastic (PET).
  • PET polyterephthalic acid plastic
  • these materials have the above-mentioned properties, or after treatment (for example, modification), they have the above-mentioned properties.
  • the creep strain of these materials can be less than 0.5% under the holding stress, so it is not easy to produce undesired deformation.
  • polyimide may be used to form the base support film 101 having the above numerical range.
  • the elastic modulus of the polyimide used is 1Gpa-10Gpa, such as 5Gpa
  • the thickness is 20um-60um, such as 40um
  • the elongation at break is 5%-80%, such as 30%
  • the bending strength is greater than 160Mpa ,
  • 180Mpa the moisture absorption rate is less than 2%, such as 1%.
  • the used polyimide itself may have the above-mentioned properties or may be subjected to appropriate treatment, such as UV modification treatment, to make it have the above-mentioned properties.
  • PET may also be used to form the base support film 101 having the above numerical range.
  • the elastic modulus of the PET used is 1Gpa-10Gpa, such as 6Gpa
  • the thickness is 20um-60um, such as 30um
  • the elongation at break is 5%-80%, such as 30%
  • the bending strength is greater than 160Mpa, such as 170Mpa
  • the moisture absorption rate is less than 2%, such as 0.5%.
  • the used PET itself may have the above-mentioned properties or may be subjected to appropriate treatment, such as UV modification treatment, to make it have the above-mentioned properties.
  • the material of the adhesive layer 102 may include an acrylic adhesive.
  • Acrylic adhesives have good adhesion properties and can have required mechanical parameters.
  • the adhesive force of the adhesive layer 102 is above 500 gf/Inch to ensure the reliability of the backplane support structure.
  • acrylate may be used to form the adhesive layer 102 having the above numerical range.
  • the elastic modulus of the acrylate used is 1Kpa-250Kpa, such as 100Kpa
  • the thickness is 10um-50um, such as 30um
  • the adhesive force is above 500gf/Inch, such as 700gf/Inch.
  • the backplane support structure needs to be bent at certain positions, so the backplane support structure can be regionally designed to deal with the bending operations of the backplane support structure in a targeted manner.
  • FIG. 2A is a schematic plan view showing a backplane support structure provided by at least one embodiment of the present disclosure
  • FIG. 2B is a schematic cross-sectional view of the backplane support structure in FIG. 2A along the line B-B.
  • the backplane support structure has a first bendable area 10 and a first non-bendable area 20.
  • the first bendable area 10 can be provided, for example, in the middle of the backplane support structure. The position of the bend and be configured to be bendable.
  • the first non-bending area 20 includes a first non-bending sub-area 20A and a second non-bending sub-area 20B, and the first bendable area 1021 is located between the first non-bending sub-area 20A and the second non-bending sub-area 20 between.
  • the adhesive layer 102 includes a first portion 1021 located in the first bendable area 10 and a second portion 1022 located in the first non-bending area 20.
  • the elastic modulus of the first part 1021 is lower than the elastic modulus of the second part 1022. Therefore, when the first bendable area 10 is bent, since the modulus of the first portion 1021 is lower, the bending operation is easier to perform, and it can better adapt to the change of shape caused by bending; ,
  • the second portion 1022 located in the first non-bending area 20 has a relatively high modulus of elasticity, it does not need to be bent, and maintains its state when the first bendable area 10 is bent, so it can also provide better Good support and protection.
  • the elastic modulus of the first part 1021 may be about 1Kpa-150Kpa, such as 10Kpa, 50Kpa, 80Kpa, 100Kpa or 120Kpa, etc.
  • the elastic modulus of the second part 1022 may be about 150Kpa-250Kpa, for example 180Kpa, 200Kpa or 220Kpa, etc.
  • the backplane support structure can be Targeted response to bending operations, after multiple bending operations, or in the case of a small bending radius, the backplane support structure can avoid and maintain a certain degree of stability and reliability.
  • bending areas and non-bending areas of the backplane support structure there may be more bending areas and non-bending areas of the backplane support structure, and the number of bending areas and non-bending areas is not limited in the embodiments of the present disclosure. .
  • these bending areas and non-bending areas can be designed for regionalization.
  • FIG. 3A is a schematic plan view showing a backplane support structure provided by at least one embodiment of the present disclosure
  • FIG. 3B is a schematic cross-sectional view of the backplane support structure in FIG. 3A along the line C-C.
  • the backplane support structure further has a main body area 30 and a peripheral area 40.
  • the main body area 30 may correspond to the working area of the device, such as the display area of the display panel
  • the peripheral area 40 may correspond to the circuit binding area of the device, such as the display panel.
  • the binding area of the display panel for example, is used to bind a driving circuit for driving the display.
  • the main body area 30 and the peripheral area 40 of the backplane support structure can also be regionally designed to adapt to the structural design of the devices provided on the backplane support structure at different positions.
  • the adhesive layer 102 may further include a third portion 1023 located in the body area 30 and a fourth portion 1024 located in the peripheral area 40.
  • the elastic modulus of the third portion 1023 is lower than the elastic modulus of the fourth portion 1024.
  • the fourth portion 1024 of the adhesive layer 102 located in the peripheral area 40 has a higher elastic modulus, so the fourth portion 1024 has a higher mechanical strength, which can prevent the adhesive material of the fourth portion 1024 from being deformed. For example, a sinking phenomenon occurs.
  • the peripheral area 40 of the backplane support structure is correspondingly provided with the binding area of the display panel, the above-mentioned regionalized design of the backplane support structure can avoid poor circuit binding in the binding area, thereby improving the reliability of the device.
  • the elastic modulus of the third part 1023 of the adhesive layer 102 may be about 1Kpa-150Kpa, such as 10Kpa, 30Kpa, 50Kpa, 70Kpa, 80Kpa, or 100Kpa, etc.
  • the elastic modulus of the fourth part 1024 It can be about 150Kpa-250Kpa, such as 150Kpa, 180Kpa, 200Kpa, or 230Kpa.
  • FIG. 4A is a schematic plan view showing a backplane support structure provided by at least one embodiment of the present disclosure
  • FIG. 4B is a schematic cross-sectional view of the backplane support structure in FIG. 4A along the line D-D.
  • the backplane support structure also has a first bendable area 10, a first non-bendable area 20, a main body area 30, and a peripheral area 40.
  • These parts also adopt the above-mentioned regional design to further Improve the overall performance of the backplane support structure.
  • the peripheral area 40 is located in the first non-bending area 20
  • the main body area 30 is located in the first bendable area 10 and the first non-bending area 20 except the peripheral area 40
  • the adhesive layer includes the first bendable area
  • the elastic modulus of the first part is about 1Kpa-150Kpa
  • the elasticity of the fourth part The modulus is about 150Kpa-250Kpa
  • the elastic modulus of the part 1022/1023 of the adhesive layer except the first part 1021 and the fourth part 1024 is about 1Kpa-250Kpa.
  • the main body area 30 and the peripheral area 40 of the backplane support structure can also be regionally designed in other ways.
  • FIG. 5 is another schematic cross-sectional view of the backplane support structure in FIG. 3A along the line C-C.
  • the backplane support structure may also include a spacer layer 103, which is disposed between the adhesive layer 102 and the base support film 101, and includes a peripheral area 40 that protrudes toward the adhesive layer 102.
  • the convex structure 1031 at this time, the surface of the adhesive layer 102 away from the spacer layer 103 is a flat surface.
  • the thickness of the fourth portion 1024 of the adhesive layer 102 located in the peripheral region 40 can be reduced, thereby reducing the risk of deformation of the fourth portion 1024 (for example, the risk of sinking), thereby improving the reliability of the device.
  • the raised structure 1031 may have a flat surface (as shown in the figure).
  • the raised structure 1031 may also have a patterned surface, such as a concave-convex surface and a height gradient. Or a wedge-shaped surface that changes periodically, etc.
  • the embodiment of the present disclosure does not limit the specific form of the convex structure 1031.
  • the elastic modulus of the spacer layer 103 may be about 1Gpa-4Gpa, such as 2Gpa, 2.5Gpa, or 3Gpa. At this time, the elastic modulus of the spacer layer 103 is greater than the elastic modulus of the adhesive layer 102 in the fourth part 1024 of the peripheral region 40, so that the spacer layer 103 can also provide a certain mechanical strength to avoid unnecessary deformation.
  • the material of the spacer layer 103 may be polyimide, such as thermoplastic polyimide (TPI).
  • TPI thermoplastic polyimide
  • the thickness of the base support film 104 may be 20 ⁇ m-60 ⁇ m, such as 30 ⁇ m, 40 ⁇ m, or 50 ⁇ m
  • the thickness of the adhesive layer may be 20 ⁇ m-40 ⁇ m, such as 25 ⁇ m, 30 ⁇ m, or 35 ⁇ m.
  • the protrusion height L of 1031 may be about 10 ⁇ m-20 ⁇ m, such as 10 ⁇ m or 15 ⁇ m. At this time, the thickness reduction of the fourth portion 1024 of the adhesive layer 102 in the peripheral region 40 is equal to the protrusion height L of the protrusion structure 1031.
  • the adhesive layer 102 is located in the fourth portion of the peripheral region 40.
  • the thickness of the portion 1024 is 20 ⁇ m, that is, the thickness of the fourth portion 1024 is reduced by 10 ⁇ m. Therefore, the risk of deformation (for example, the risk of sinking) of the fourth portion 1024 of the adhesive layer 102 located in the peripheral region 40 can be reduced.
  • the backplane support structure provided by at least one embodiment of the present disclosure designs various properties of the base support film and the adhesive layer, and regionalizes the base support film and the adhesive layer, so that the backplane support structure can have more
  • the excellent overall performance can be applied to devices such as display panels, such as foldable display panels, to improve the stability and reliability of the device.
  • FIG. 6A is a schematic plan view of the display device
  • FIG. 6B is a schematic cross-sectional view of the display device in FIG. 6A along the line E-E.
  • the display device includes a display substrate 201 with any of the above-mentioned backplane supporting structures.
  • the backplane support structure may be bonded to the non-display side (shown as the lower side in the figure) of the display substrate 201 through the adhesive layer 102.
  • the display device also has other functional structures, which are not limited in the embodiments of the present disclosure.
  • the display side of the display substrate 201 may also be provided with structures such as a polarizer 202 and a cover plate 204.
  • the cover plate 204 is bonded to the display substrate 201 through another adhesive layer 203.
  • FIG. 7 is another schematic cross-sectional view of the display device in FIG. 6A along the line E-E.
  • the display substrate 201 may be a foldable display substrate, and has a second bendable area 2011 and a second non-bendable area 2012.
  • the backplane support structure has a first bendable area 10 and a first non-bendable area.
  • the first bendable area 10 and the second bendable area 2011 are arranged in a corresponding stack, and the first non-bending area and the second non-bending area 2012 are arranged in a corresponding stack, that is, the backplane support structure is combined with the display substrate 201
  • the first portion 1021 of the adhesive layer 102 located in the first bendable area 10 is correspondingly attached to the second bendable area 2011 of the display substrate 201
  • the second portion of the adhesive layer 102 is located in the second non-bendable area.
  • the portion 1022 is correspondingly attached to the second non-bending area 2012 of the display substrate 201.
  • the backplane support structure can provide a certain degree of mechanical buffering and mechanical protection, and relieve the force of the foldable display substrate during the bending process, such as reducing the display structure of the display substrate.
  • the force received during the bending process is uniformized to avoid stress concentration, thereby improving the stability and reliability of the display device.
  • the first non-bending area includes a first non-bending sub-area 20A and a second non-bending sub-area 20B, and the first bendable area 1021 is located between the first non-bending sub-area 20A and the second non-bending sub-area 20B ;
  • the second non-bending area 2012 includes a third non-bending sub-area 2012A and a fourth non-bending sub-area 2012B, the second bendable area 2011 is located between the third non-bending sub-area 2012A and the fourth non-bending sub-area 2012B ;
  • the first non-bending sub-region 20A and the third non-bending sub-region 2012A are correspondingly stacked, and the second non-bending sub-region 20B and the fourth non-bending sub-region 2012B are correspondingly stacked.
  • the display device can be bent in the middle.
  • the display device under the action of the backplane support structure, the display device can be bent in various directions and various dimensions, and can also maintain a certain degree of stability and reliability.
  • the display device may be bent including the backplane support structure.
  • the display device may also bend the backplane support structure outside (that is, the direction of the bending is opposite to that shown in FIG. 8).
  • the bending radius R of the display device may have a larger range.
  • the display device can be bent with a small radius to improve the bending effect of the display device.
  • FIG. 9 is another schematic cross-sectional view of the display device in FIG. 6A along the line E-E.
  • the display substrate 201 also has a display area 2013 and a binding area 2014.
  • the backplane support structure further has a main body area and a peripheral area, and the main body area and the peripheral area can be designed for regionalization as described in the above embodiments.
  • FIG. 9 shows a case where the elastic modulus of the third portion 1023 is lower than the elastic modulus of the fourth portion 1024.
  • the display area 2013 and the main body area are stacked correspondingly, and the binding area 2014 and the peripheral area are stacked correspondingly.
  • the adhesive layer 102 is located at the third position of the main body area.
  • the portion 1023 is correspondingly attached to the display area 2013 of the display substrate 201
  • the fourth portion 1024 of the adhesive layer 102 located in the peripheral area is correspondingly attached to the binding area 2014 of the display substrate 201.
  • FIG. 10 is another schematic cross-sectional view of the display device in FIG. 6A along the line E-E.
  • the backplane support structure includes the spacer layer 103
  • the main body area and the peripheral area of the backplane support structure are also correspondingly stacked in the display area 2013 and the binding area 2014 of the display substrate 201.
  • the raised structure 1031 of the spacer layer 103 corresponds to the binding area 2014 of the display substrate 201.
  • This setting can also achieve technical effects such as improving the reliability of the bonding circuit in the bonding area 2014.
  • FIG. 11 shows a schematic partial cross-sectional view of a display area of a display device provided by at least one embodiment of the present disclosure.
  • the display area of a display device includes a pixel array formed by a plurality of pixel units, and each pixel unit includes a pixel drive circuit and a light-emitting element.
  • the pixel drive circuit can drive the light-emitting element to emit light, thereby realizing the display function of the display device.
  • FIG. 11 shows a schematic cross-sectional view of a pixel unit in the display area of the display device.
  • the display substrate 201 includes a pixel driving circuit for driving the pixel unit.
  • the pixel driving circuit includes, for example, a transistor 2101 and a capacitor 2102 provided on a substrate 2018.
  • the transistor 2101 is a thin film transistor, including a gate, an active layer, and source and drain structures.
  • the display substrate 201 further includes a light-emitting element 2103, such as an organic light-emitting display device (OLED) or a quantum dot light-emitting device (QLED).
  • OLED organic light-emitting display device
  • QLED quantum dot light-emitting device
  • the light-emitting element 2103 includes a first electrode (such as a cathode), a second electrode (such as an anode), and a light-emitting layer (such as an organic light-emitting layer or a quantum dot light-emitting layer) between the first electrode and the second electrode.
  • a first electrode such as a cathode
  • a second electrode such as an anode
  • a light-emitting layer such as an organic light-emitting layer or a quantum dot light-emitting layer
  • the display substrate 201 may also include structures such as spacers 2104 and an encapsulation layer.
  • the encapsulation layer includes a multi-layer structure, for example, a first inorganic encapsulation layer 2015, a second organic encapsulation layer 2016, and a third inorganic encapsulation layer 2017 are sequentially stacked to provide a better encapsulation effect.
  • the display side of the display substrate 201 is provided with structures such as a polarizer 202 and a cover plate 204 (for example, a glass cover plate).
  • the cover plate 204 is bonded to the display substrate 201 through another adhesive layer 203.
  • the embodiments of the present disclosure do not limit the specific structure of the display device and the display substrate.
  • FIG. 12 shows a partial cross-sectional schematic diagram of a binding area of a display device provided by at least one embodiment of the present disclosure, and the schematic diagram is, for example, cut along the line F-F in FIG. 6A and obtained.
  • the bonding area of the display device includes a signal line 2019 provided on a substrate 2018, and the signal line 2019 is electrically connected to a driving circuit of the display area of the display device, etc., for transmitting electrical signals.
  • the substrate 2018 also has structures such as a buffer layer and an insulating layer, which are not limited in the embodiment of the present disclosure.
  • the bonding area of the display device may be bonded with a driver chip or a structure with a driver chip, such as a chip on film (COF) or a flexible printed circuit board (FPC).
  • the COF includes a flexible substrate 2020, a bonding signal line 2021 on the flexible substrate 2020, and a driving chip (not shown in the figure).
  • one end of the binding signal line 2021 is electrically connected to the driver chip, and the other end is bound to the signal line 2019 of the binding area of the display device, so that the driver chip can be used to bind the signal line 2021 and the signal line 2019 to the display device.
  • the display area provides driving signals.
  • the COF can be bound to the binding area of the display device by means of an adhesive (for example, anisotropic conductive adhesive) by crimping.
  • the display device provided by at least one embodiment of the present disclosure includes the backplane support structure provided by the embodiments of the present disclosure.
  • the backplane support structure can provide a certain degree of mechanical buffering and mechanical protection when the display device is bent, so as to prevent the display device from being bent. Damaged during the process, such as avoiding stress concentration on certain parts of the display substrate and damaging part of the functional structure in the display area. Therefore, the backplane support structure can improve the reliability of the stability of the display device.
  • At least one embodiment of the present disclosure provides a preparation method of a backplane support structure. As shown in FIG. 13, the preparation method includes steps S101-S102.
  • Step S101 Provide a base supporting film.
  • the elastic modulus of the substrate support film is about 1Gpa-10Gpa, such as 2Gpa, 4Gpa, 5Gpa, 6Gpa or 8Gpa, etc.;
  • the material of the substrate support film may be a polymer material, such as polyimide (for example, flexible segment More polyimide) or polyethylene terephthalate (PET).
  • these materials have the above-mentioned properties, or after treatment (for example, modification), they have the above-mentioned properties.
  • the base support film may be commercially available or obtained by preparation, which is not limited in the embodiments of the present disclosure.
  • Step S102 forming an adhesive layer on the base supporting film.
  • the elastic modulus of the adhesive layer is about 1Kpa-250Kpa, such as 10Kpa, 30Kpa, 50Kpa, 80Kpa, 120Kpa, 150Kpa or 200Kpa.
  • the material of the adhesive layer may include an acrylic adhesive. This type of adhesive has good cohesiveness and can have required mechanical parameters.
  • the adhesive force of the adhesive layer 102 is above 500 gf/Inch to ensure the reliability of the backplane support structure.
  • the adhesive layer 102 may be formed on the base support film by coating or the like.
  • the backplane support structure has a first bendable area and a first non-bendable area
  • the adhesive layer includes a first portion located in the first bendable area and The second part of the first non-bending zone.
  • the preparation method of the backplane support structure may further include: modifying at least one of the first part and the second part so that the elastic modulus of the first part is lower than The second part of the elastic modulus.
  • the second part can be modified to increase the elastic modulus of the second part.
  • the modification treatment may be performed by irradiation with ultraviolet light.
  • the second part can be irradiated with ultraviolet light to perform a UV curing enhancement treatment to increase the elastic modulus of the second part.
  • the first part may also be modified to reduce the elastic modulus of the first part.
  • the first part and the second part can also be modified differently to increase the elastic modulus of the second part and reduce the elastic modulus of the first part, thereby making the elastic modulus of the first part The amount is lower than the elastic modulus of the second part.
  • the embodiments of the present disclosure do not specifically limit the processing methods of the first part and the second part.
  • the elastic modulus of the first part may be about 1Kpa-150Kpa, such as 10Kpa, 80Kpa, 100Kpa or 120Kpa, etc.
  • the elastic modulus of the second part 1022 may be about 150Kpa-250Kpa, such as 180Kpa. , 200Kpa or 220Kpa, etc.
  • the backplane support structure further has a main body area and a peripheral area
  • the adhesive layer further includes a third portion located in the main area and a fourth portion located in the peripheral area.
  • the preparation method of the backplane support structure may further include: modifying at least one of the third part and the fourth part so that the elastic modulus of the third part is lower than the elastic modulus of the fourth part.
  • the fourth part can be modified to increase the elastic modulus of the fourth part.
  • the modification treatment may be performed by irradiation with ultraviolet light.
  • the fourth part can be irradiated with ultraviolet light to perform a UV curing enhancement treatment to increase the elastic modulus of the fourth part.
  • the third part can also be modified to reduce the elastic modulus of the third part.
  • the third part and the fourth part may also be modified differently to increase the elastic modulus of the fourth part and reduce the elastic modulus of the third part, so that the third part The modulus of elasticity is lower than that of the fourth part.
  • the embodiments of the present disclosure do not specifically limit the processing methods of the third part and the fourth part.
  • the elastic modulus of the third part 1023 may be about 1Kpa-150Kpa, such as 10Kpa, 30Kpa, 50Kpa, 70Kpa, 80Kpa or 100Kpa, etc.
  • the elastic modulus of the fourth part 1024 may be about 150Kpa-250Kpa, such as 150Kpa, 180Kpa, 200Kpa or 230Kpa.
  • the backplane support structure further has a main body area and a peripheral area, and the backplane support structure further includes a spacer layer.
  • the preparation method of the backplane support structure may further include: before forming the adhesive layer, forming a spacer layer on the base support film.
  • the spacer layer includes a protruding structure located in the peripheral area.
  • An adhesive layer is formed on one side of the base supporting film, and the surface of the adhesive layer away from the spacer layer is formed as a flat surface.
  • the elastic modulus of the spacer layer 103 may be about 1Gpa-4Gpa, such as 2Gpa, 2.5Gpa, or 3Gpa.
  • the material of the spacer layer 103 may be polyimide, such as thermoplastic polyimide (TPI), so that the spacer layer can be formed by thermocompression molding.
  • TPI thermoplastic polyimide
  • the spacer layer can be directly formed on the base support film by thermocompression molding.
  • the temperature of hot press molding can be selected to be near the glass transition temperature Tg of the thermoplastic polyimide but not exceed the glass transition temperature Tg.
  • the temperature of the hot press molding can be selected to be about 200°C to 300°C, such as 230°C, 250°C, or 280°C.
  • the pressure of the hot press molding can be selected to be, for example, about 0.8N-1.0N, such as 0.9N.
  • the time of hot pressing can be selected to be about 10-30 seconds (s), for example, 15s, 20s, or 25s.
  • the spacer layer may also be formed by other methods, such as coating and curing.
  • the specific forming method of the spacer layer is not limited in the embodiments of the present disclosure.
  • the backplane support structure prepared by the preparation method provided by the embodiments of the present disclosure has excellent comprehensive performance, and can be applied to devices such as display panels, such as foldable display panels, to improve the stability and reliability of the device.

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Abstract

一种背板支撑结构及其制备方法、显示装置。该显示装置包括显示基板(201)和背板支撑结构，背板支撑结构包括叠层设置的基底支撑膜(101)和粘结层(102)，背板支撑结构通过粘结层(102)结合在显示基板(201)的非显示侧，背板支撑结构具有第一可弯折区(10)和第一非弯折区(20)，粘结层(102)包括位于第一可弯折区(10)的第一部分(1021)和位于第一非弯折区(20)的第二部分(1022)；第一部分(1021)的弹性模量为约1Kpa-150Kpa，第二部分(1022)的弹性模量为约150Kpa-250Kpa，基底支撑膜(101)的弹性模量为约1Gpa-10Gpa；显示基板(201)为可折叠显示基板，具有第二可弯折区(2011)和第二非弯折区(2012)；第一可弯折区(10)和第二可弯折区(2011)对应叠层设置，第一非弯折区(20)和第二非弯折区(2012)对应叠层设置。该显示装置具有优异的弯折性能。

Description

背板支撑结构及其制备方法、显示装置 技术领域
本公开的实施例涉及一种背板支撑结构及其制备方法、显示装置。
背景技术
显示面板通常包括显示基板、设置在显示基板非显示侧的背板支撑结构以及设置在显示基板显示侧的透明盖板等结构。背板支撑结构可以为显示基板提供支撑与保护。当显示面板为柔性显示面板时，背板支撑结构还可以为柔性显示面板的弯曲提供一定的力学缓冲与力学保护，以避免柔性显示面板在弯曲过程中受到损坏。
发明内容
本公开至少一实施例提供一种显示装置，该显示装置包括显示基板和背板支撑结构，其中，所述背板支撑结构包括叠层设置的基底支撑膜和粘结层，所述背板支撑结构通过所述粘结层结合在所述显示基板的非显示侧，所述背板支撑结构具有第一可弯折区和第一非弯折区，所述粘结层包括位于所述第一可弯折区的第一部分和位于所述第一非弯折区的第二部分；所述第一部分的弹性模量为约1Kpa-150Kpa，所述第二部分的弹性模量为约150Kpa-250Kpa，所述基底支撑膜的弹性模量为约1Gpa-10Gpa；所述显示基板为可折叠显示基板，具有第二可弯折区和第二非弯折区；其中，所述第一可弯折区和所述第二可弯折区对应叠层设置，所述第一非弯折区和所述第二非弯折区对应叠层设置。
例如，本公开至少一实施例提供的显示装置中，所述基底支撑膜的厚度为约20um-60um，所述粘结层的厚度为约10um-50um。
例如，本公开至少一实施例提供的显示装置中，所述基底支撑膜的断裂伸长率为约5％-80％。
例如，本公开至少一实施例提供的显示装置中，所述基底支撑膜的弯曲强度大于约160Mpa。
例如，本公开至少一实施例提供的显示装置中，所述基底支撑膜的吸 湿率小于约2％。
例如，本公开至少一实施例提供的显示装置中，所述基底支撑膜的材料包括聚酰亚胺或者PET。
例如，本公开至少一实施例提供的显示装置中，所述粘结层的材料包括丙烯酸酯类粘结剂。
例如，本公开至少一实施例提供的显示装置中，所述第一非弯折区包括第一非弯折子区和第二非弯折子区，所述第一可弯折区位于所述第一非弯折子区和所述第二非弯折子区之间，所述第二非弯折区包括第三非弯折子区和第四非弯折子区，所述第二可弯折区位于所述第三非弯折子区和所述第四非弯折子区之间，所述第一非弯折子区与所述第三非弯折子区对应叠层设置，所述第二非弯折子区和所述第四非弯折子区对应叠层设置。
本公开至少一实施例提供一种背板支撑结构，该背板支撑结构包括叠层设置的基底支撑膜和粘结层；其中，所述基底支撑膜的弹性模量为约1Gpa-10Gpa，所述粘结层的弹性模量为约1Kpa-250Kpa。
例如，本公开至少一实施例提供的背板支撑结构中，所述基底支撑膜的厚度为约20um-60um，所述粘结层的厚度为约10um-50um。
例如，本公开至少一实施例提供的背板支撑结构中，所述基底支撑膜的断裂伸长率为约5％-80％，所述基底支撑膜的弯曲强度大于约160Mpa，所述基底支撑膜的吸湿率小于约2％。
例如，本公开至少一实施例提供的背板支撑结构中，所述基底支撑膜的弹性模量为约5Gpa-10Gpa，厚度为约20um-40um；所述粘结层的弹性模量为约150Kpa-250Kpa，厚度为约10um-20um。
例如，本公开至少一实施例提供的背板支撑结构中，所述基底支撑膜的弹性模量为约1Gpa-5Gpa，厚度为约40um-60um；所述粘结层的弹性模量为约1Kpa-150Kpa，厚度为约20um-50um。
例如，本公开至少一实施例提供的背板支撑结构中，所述基底支撑膜的弹性模量为约1Gpa-5Gpa，厚度为约40um-60um；所述粘结层的弹性模量为约1Kpa-150Kpa，厚度为约10um-20um。
例如，本公开至少一实施例提供的背板支撑结构中，所述基底支撑膜的弹性模量为约5Gpa-10Gpa，厚度为约40um-60um；所述粘结层的弹性模量为约150Kpa-250Kpa，厚度为约10um-20um。
例如，本公开至少一实施例提供的背板支撑结构中，所述背板支撑结构具有第一可弯折区和第一非弯折区，所述粘结层包括位于所述第一可弯折区的第一部分和位于所述第一非弯折区的第二部分；所述第一部分的弹性模量低于所述第二部分的弹性模量。
例如，本公开至少一实施例提供的背板支撑结构中，所述第一部分的弹性模量为约1Kpa-150Kpa，所述第二部分的弹性模量为约150Kpa-250Kpa。
例如，本公开至少一实施例提供的背板支撑结构中，所述背板支撑结构具有主体区和周边区，所述粘结层包括位于所述主体区的第三部分和位于所述周边区的第四部分；所述第三部分的弹性模量低于所述第四部分的弹性模量。
例如，本公开至少一实施例提供的背板支撑结构中，所述第三部分的弹性模量为约1Kpa-150Kpa，所述第四部分的弹性模量为约150Kpa-250Kpa。
例如，本公开至少一实施例提供的背板支撑结构中，所述背板支撑结构具有第一可弯折区、第一非弯折区、主体区和周边区；所述周边区位于所述第一非弯折区，所述主体区位于除所述周边区之外的所述第一可弯折区和所述第一非弯折区，所述粘结层包括位于所述第一可弯折区的第一部分、位于所述周边区的第四部分以及除所述第一部分和所述第四部分之外的部分；所述第一部分的弹性模量为约1Kpa-150Kpa，所述第四部分的弹性模量为约150Kpa-250Kpa，所述粘结层的除所述第一部分和所述第四部分之外的部分的弹性模量为约1Kpa-250Kpa。
例如，本公开至少一实施例提供的背板支撑结构中，所述背板支撑结构具有主体区和周边区，所述背板支撑结构还包括隔垫层，所述隔垫层在所述粘结层与所述基底支撑膜之间，包括位于所述周边区且朝向所述粘结层凸出的凸起结构，所述粘结层的远离所述隔垫层的表面为平坦表面。
例如，本公开至少一实施例提供的背板支撑结构中，所述隔垫层的弹性模量为约1Gpa-4Gpa。
例如，本公开至少一实施例提供的背板支撑结构中，所述基底支撑膜的厚度为约20μm-60μm，所述粘结层的厚度为约20μm-40μm，所述凸起结构的凸出高度为约10μm-20μm。
本公开至少一实施例提供显示装置，该显示装置包括显示基板以及上述任一的背板支撑结构，其中，所述背板支撑结构通过所述粘结层结合在所述 显示基板的非显示侧。
本公开至少一实施例还提供一种背板支撑结构的制备方法，包括：提供基底支撑膜，在所述基底支撑膜上形成粘结层，其中，所述基底支撑膜的弹性模量为约1Gpa-10Gpa，所述粘结层的弹性模量为约1Kpa-250Kpa。
例如，本公开至少一实施例提供的制备方法中，所述背板支撑结构具有第一可弯折区和第一非弯折区，所述粘结层包括位于所述第一可弯折区的第一部分和位于所述第一非弯折区的第二部分，所述制备方法还包括：对所述第一部分和所述第二部分中的至少一个进行改性处理，使所述第一部分的弹性模量低于所述第二部分的弹性模量。
例如，本公开至少一实施例提供的制备方法中，所述背板支撑结构还具有主体区和周边区，所述粘结层还包括位于所述主体区的第三部分和位于所述周边区的第四部分，所述制备方法还包括：对所述第三部分和所述第四部分中的至少一个进行改性处理，使所述第三部分的弹性模量低于所述第四部分的弹性模量。
例如，本公开至少一实施例提供的制备方法中，采用紫外光照射的方式进行所述改性处理。
例如，本公开至少一实施例提供的制备方法中，所述背板支撑结构还具有主体区和周边区，所述制备方法还包括：在形成所述粘结层之前，在所述基底支撑膜上形成隔垫层，所述隔垫层包括位于所述周边区的凸起结构，在所述隔垫层的远离所述基底支撑膜的一侧形成所述粘结层，并且所述粘结层的远离所述隔垫层的表面形成为平坦表面。
例如，本公开至少一实施例提供的制备方法中，采用热压成型的方式形成所述隔垫层。
例如，本公开至少一实施例提供的制备方法中，所述热压成型的温度为约200℃-300℃，压力为约0.8N-1.0N，时间为约10s-30s。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本公开的一些实施例，而非对本公开的限制。
图1A为本公开至少一实施例提供的背板支撑结构的平面示意图；
图1B为图1A中的背板支撑结构的沿A-A线的截面示意图；
图2A为本公开至少一实施例提供的背板支撑结构的平面示意图；
图2B为图2A中的背板支撑结构的沿B-B线的截面示意图；
图3A为本公开至少一实施例提供的背板支撑结构的平面示意图；
图3B为图3A中的背板支撑结构的沿C-C线的截面示意图；
图4A为本公开至少一实施例提供的背板支撑结构的平面示意图；
图4B为图4A中的背板支撑结构的沿D-D线的截面示意图；
图5为图3A中的背板支撑结构的沿C-C线的另一截面示意图；
图6A为本公开至少一实施例提供的显示装置的平面示意图；
图6B为图6A中的显示装置的沿E-E线的截面示意图；
图7为图6A中的显示装置的沿E-E线的另一截面示意图；
图8为本公开至少一实施例提供的显示装置弯折后的截面示意图；
图9为图6A中的显示装置的沿E-E线的再一截面示意图；
图10为图6A中中的显示装置的沿E-E线的再一截面示意图；
图11为本公开至少一实施例提供的显示装置的显示区的部分截面示意图；
图12为本公开至少一实施例提供的显示装置的绑定区的部分截面示意图；
图13为本公开至少一实施例提供的显示装置的制备流程图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他 元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
如上所述，当显示面板为柔性显示面板时，背板支撑结构可以为柔性显示面板的弯曲提供一定的力学缓冲与力学保护，以避免柔性显示面板在弯曲过程中受到损坏。例如，当显示面板的弯折半径比较小的情况下，背板支撑结构需要具有一定的力学性能，例如良好的弯折回复性、抗变形能力以及弯折强度等，才能保证显示面板的信赖性。类似地，当显示面板为折叠显示面板时，背板支撑结构的力学性能在折叠显示面板折叠的过程中起到重要的作用。为提高折叠显示面板的信赖性，需要对背板支撑结构进行合理的设计，以使其可充分缓解折叠显示面板在弯折过程中产生的力，进而避免折叠显示面板在弯折过程中发生损坏。
本公开至少一实施例提供一种背板支撑结构，该背板支撑结构包括叠层设置的基底支撑膜和粘结层，该基底支撑膜的弹性模量为1Gpa-10Gpa，该粘结层的弹性模量为1Kpa-250Kpa。
本公开至少一实施例提供一种显示装置，该显示装置包括显示基板以及上述背板支撑结构，该背板支撑结构通过粘结层结合在显示基板的非显示侧。
下面，通过几个具体实施例对本公开实施例提供的背板支撑结构及其制备方法、显示装置进行详细说明。
本公开至少一实施例提供一种背板支撑结构，图1A为该背板支撑结构的平面示意图，图1B为图1A中的背板支撑结构的沿A-A线的截面示意图。
如图1A和图1B所示，该背板支撑结构包括叠层设置的基底支撑膜101和粘结层102。粘结层102用于将背板支撑结构结合在例如显示基板等装置的一侧，以提供支撑与保护作用。例如，粘结层102可以完全覆盖基底支撑膜101的一个表面(图中示出为粘结层102完全覆盖基底支撑膜101的上表面)，或者，在一些示例中，粘结层102也可以覆盖基底支撑膜101表面的一部分。
例如，基底支撑膜101的弹性模量可以为约1Gpa-10Gpa。在基底支撑 膜101的弹性模量低于约1Gpa时，基底支撑膜101将难以达到足够的支撑与保护作用，在基底支撑膜101的弹性模量大于约10Gpa时，不利于基底支撑膜101进行弯折等操作。例如，在一些实施例中，基底支撑膜101的弹性模量可以选择为2Gpa-8Gpa，例如4Gpa、5Gpa、6Gpa或者7Gpa等，此时，基底支撑膜101可以达到多种性能的平衡，从而具有更好的综合性能。
例如，粘结层102的弹性模量可以为约1Kpa-250Kpa。在粘结层102的弹性模量低于约1Kpa时，粘结层102容易产生不必要的变形，例如产生坍塌现象等，从而难以维持所需的形状，在粘结层102的弹性模量高于约250Kpa时，不利于粘结层102配合基底支撑膜101进行弯折等操作。例如，在一些实施例中，粘结层102的弹性模量可以选择为10Kpa-150Kpa，例如50Kpa、80Kpa、120Kpa或者150Kpa等。此时，粘结层102可以达到多种性能的平衡，从而具有更好的综合性能。
需要注意的是，本公开实施例中的“约”表示该数值允许一定的误差范围，例如该误差范围在该数值的正负5％的范围内，例如当一个数值为约100时，95-105范围内的数值均包括在上述数值范围内。
在具有上述弹性模量的基底支撑膜101和粘结层102的配合下，该背板支撑结构整体具有良好的力学性能，例如具有良好的弯折回复性、抗变形能力以及弯折强度等。因此，当该背板支撑结构用于柔性显示面板或者可折叠显示面板等可弯折装置时，该背板支撑结构不但可以提供支撑与保护作用，还可以为显示面板的弯折提供一定的力学缓冲与力学保护，例如减小显示面板中的显示结构受到的力，避免显示面板产生应力集中现象，进而避免显示面板在弯折过程中受到损坏等。
例如，在一些实施例中，背板支撑结构还可以包括保护膜104，保护膜104设置在粘结层102的远离基底支撑膜101的一侧，例如可以为离型膜，由此挡保护膜104被揭去之后，不影响粘结层102的结构、形貌。由此，保护膜104可以在背板支撑结构未结合在显示面板等装置时提供保护作用。在将背板支撑结构结合在显示面板等装置时，可将保护膜104揭去后，将背板支撑结构通过粘结层102与该装置结合。
例如，在一些实施例中，基底支撑膜101的厚度可以为约20um-60um。当基底支撑膜101的厚度过大时，例如大于约60um时，将不利于背板支撑结构的薄型化设计，也不利于背板支撑结构进行弯折等操作，当基底支撑膜 101的厚度过薄时，例如小于约20um时，基底支撑膜101将难以达到支撑与保护的作用。例如，在一些实施例中，基底支撑膜101的厚度可以选择为30um-50um，例如30um、35um、40um、45um或者50um等。
例如，粘结层102的厚度可以为约10um-50um，当粘结层102的厚度过大时，例如大于约50um，将不利于背板支撑结构的薄型化设计，也不利于背板支撑结构进行弯折等操作，当粘结层102的厚度过薄时，例如小于约10um时，粘结层102容易出现粘结不良等现象。例如，在一些实施例中，粘结层102的厚度可以选择为20um-40um，例如20um、25um、30um、35um或者40um等。
例如，在一些实施例中，还可以对基底支撑膜101的其他性能进行设计，以进一步提高背板支撑结构的整体性能。例如，基底支撑膜101的断裂伸长率可以为约5％-80％，例如10％、20％、30％、50％或者70％等。例如，基底支撑膜101的弯曲强度可以大于约160Mpa，例如170Mpa、180Mpa或者190Mpa等。例如，基底支撑膜101的吸湿率可以小于约2％，例如0.5％、1％或者1.5％等。在基底支撑膜101具有上述性能时，背板支撑结构不但可以在弯折的过程中提供一定的力学缓冲与力学保护，还可以保持一定的稳定性，不会因为弯折或者环境因素(例如湿气)等而产生不希望的变形。
例如，在一些实施例中，基底支撑膜101的弹性模量为约5Gpa-10Gpa，例如6Gpa、7Gpa、8Gpa或者9Gpa，厚度为约20um-40um，例如25um、30um或者35um等；粘结层102的弹性模量为约150Kpa-250Kpa，例如150Kpa、180Kpa、200Kpa或者230Kpa等，厚度为约10um-20um，例如12um、15um或者18um等。
例如，在一些实施例中，基底支撑膜101的弹性模量为约5Gpa-10Gpa，例如6Gpa、7Gpa、8Gpa或者9Gpa等，厚度为约40um-60um，例如45um、50um或者55um等；粘结层102的弹性模量为约150Kpa-250Kpa，例如150Kpa、180Kpa、200Kpa或者230Kpa等，厚度为约10um-20um，例如12um、15um或者18um等。
例如，在一些实施例中，基底支撑膜101的弹性模量为约1Gpa-5Gpa，例如2Gpa、3Gpa、4Gpa或者5Gpa等，厚度为约40um-60um，例如45um、50um或者55um等；粘结层102的弹性模量为约1Kpa-150Kpa，例如10Kpa-150Kpa，例如10Kpa、30Kpa、50Kpa、80Kpa、100Kpa或者120Kpa 等，厚度为约20um-50um，例如30um、35um或者40um等。
例如，在一些实施例中，基底支撑膜101的弹性模量为约1Gpa-5Gpa，例如2Gpa、3Gpa、4Gpa或者5Gpa等，厚度为约40um-60um，例如45um、50um或者55um等；粘结层102的弹性模量为约1Kpa-150Kpa，例如10Kpa-150Kpa，例如10Kpa、30Kpa、50Kpa、80Kpa、100Kpa或者120Kpa等，厚度为约10um-20um，例如12um、15um或者18um等。
经测试，上述基底支撑膜101与粘结层102的配合均可以使背板支撑结构在整体上具有良好的力学性能，例如具有良好的弯折回复性、抗变形能力以及弯折强度等。例如，当基底支撑膜101的弹性模量为1Gpa-5Gpa，粘结层102的弹性模量为1Kpa-150Kpa的背板支撑结构应用于显示面板时，该背板支撑结构可以对显示面板的弯折提供更好的力学保护，防止显示面板在弯折过程中受到损坏。
例如，在一些实施例中，基底支撑膜101的材料包括高分子材料，例如聚酰亚胺(例如柔性链段比较多的聚酰亚胺)或者聚对苯二甲酸类塑料(PET)等。例如，这些材料具有上述性质，或者经过处理(例如改性)后具有上述性质。并且，这些材料在保载应力下蠕变应变量可小于0.5％，因此不容易产生不希望的变形。
例如，在一些示例中，可以采用聚酰亚胺来形成具有上述数值范围的基底支撑膜101。例如，所采用的聚酰亚胺的弹性模量为1Gpa-10Gpa，例如5Gpa，形成厚度为20um-60um，例如40um，断裂伸长率为5％-80％，例如30％，弯曲强度大于160Mpa，例如为180Mpa，吸湿率小于2％，例如1％。此时，所采用的聚酰亚胺本身可以具有上述性质或者可以通过适当的处理，例如UV改性处理等，以使其具有上述性质。
例如，在一些示例中，也可以采用PET来形成具有上述数值范围的基底支撑膜101。例如，所采用的PET的弹性模量为1Gpa-10Gpa，例如6Gpa，形成厚度为20um-60um，例如30um，断裂伸长率为5％-80％，例如30％，弯曲强度大于160Mpa，例如为170Mpa，吸湿率小于2％，例如0.5％。例如，所采用的PET本身可以具有上述性质或者可以通过适当的处理，例如UV改性处理等，以使其具有上述性质。
例如，在一些实施例中，粘结层102的材料可以包括丙烯酸酯类粘结剂。丙烯酸酯类粘结剂具有良好的粘结性，并且可以具有所需的力学参数。例如， 粘结层102的粘结力在500gf/Inch以上，以保证背板支撑结构的信赖性。
例如，在一些示例中，可以采用丙烯酸酯形成具有上述数值范围的粘结层102。例如，所采用的丙烯酸酯的弹性模量为1Kpa-250Kpa，例如100Kpa，形成厚度为10um-50um，例如30um，粘结力在500gf/Inch以上，例如为700gf/Inch。
例如，在一些实施例中，背板支撑结构需要在某些位置进行弯折，因此可以对背板支撑结构进行区域化设计，以有针对性地应对背板支撑结构的弯折操作。
例如，图2A为示出了本公开至少一实施例提供的一种背板支撑结构的平面示意图，图2B为图2A中的背板支撑结构的沿B-B线的截面示意图。如图2A和图2B所示，背板支撑结构具有第一可弯折区10和第一非弯折区20，第一可弯折区10例如可以设置在背板支撑结构的中间部位等需要弯折的位置，并配置为可弯折。例如，第一非弯折区20包括第一非弯折子区20A和第二非弯折子区20B，第一可弯折区1021位于第一非弯折子区20A和第二非弯折子区20之间。粘结层102包括位于第一可弯折区10的第一部分1021和位于第一非弯折区20的第二部分1022。
例如，第一部分1021的弹性模量低于第二部分1022的弹性模量。由此，在第一可弯折区10被弯折时，由于第一部分1021的模量较低，因此弯折操作更易进行，并且还能更好的适应弯折带来的形状的改变；另外，位于第一非弯折区20的第二部分1022的弹性模量相对较高，其不需要被弯折，在第一可弯折区10被弯折时保持其状态，因此还能提供较好的支撑与保护作用。
例如，在一些实施例中，第一部分1021的弹性模量可以为约1Kpa-150Kpa，例如10Kpa、50Kpa、80Kpa、100Kpa或者120Kpa等，第二部分1022的弹性模量可以为约150Kpa-250Kpa，例如180Kpa、200Kpa或者220Kpa等。由此，通过对粘结层102的位于第一可弯折区10的第一部分1021和位于第一非弯折区20的第二部分1022的弹性模量的区域化设计，背板支撑结构可以有针对性地应对弯曲操作，在多次弯曲操作后，或者在弯曲半径较小的情况下，该背板支撑结构可以避免还可以保持一定的稳定性与信赖性。
例如，在本公开的其他实施例中，背板支撑结构的弯折区和非弯折区可以为更多个，本公开的实施例对弯折区和非弯折区的设置数量不做限定。例 如，这些弯折区和非弯折区均可以进行上述区域化设计。
例如，图3A为示出了本公开至少一实施例提供的一种背板支撑结构的平面示意图，图3B为图3A中的背板支撑结构的沿C-C线的截面示意图。如图3A和图3B所示，背板支撑结构还具有主体区30和周边区40。例如，当背板支撑结构用于显示面板等装置时，该主体区30可以对应于装置的工作区，例如显示面板的显示区，周边区40可以对应于装置的电路绑定区，例如显示面板的绑定区，该显示面板的绑定区例如用于绑定用于驱动显示的驱动电路等。此时，还可以对背板支撑结构的主体区30和周边区40进行区域化设计，以适应背板支撑结构上所设置的装置在不同位置的结构设计。
例如，粘结层102还可以包括位于主体区30的第三部分1023和位于周边区40的第四部分1024。例如，第三部分1023的弹性模量低于第四部分1024的弹性模量。此时，粘结层102位于周边区40的第四部分1024的弹性模量较高，因此第四部分1024具有较高的力学强度，由此可避免第四部分1024的粘结材料产生变形，例如产生下陷现象。例如，当背板支撑结构的周边区40上对应设置显示面板的绑定区时，背板支撑结构的上述区域化设计可以避免绑定区的电路绑定不良，进而提高装置的信赖性。
例如，在一些实施例中，粘结层102的第三部分1023的弹性模量可以为约1Kpa-150Kpa，例如10Kpa、30Kpa、50Kpa、70Kpa、80Kpa或者100Kpa等，第四部分1024的弹性模量可以为约150Kpa-250Kpa，例如150Kpa、180Kpa、200Kpa或者230Kpa等。通过对粘结层102的位于主体区30的第三部分1023和位于周边区40的第四部分1024的弹性模量的区域化设计，该背板支撑结构可以更好地匹配显示面板等装置的工作区(例如显示区)以及周边区(例如电路绑定区)，从而可以有针对性地为各区域提供所需的力学性能，进而提高装置的信赖性。
例如，图4A为示出了本公开至少一实施例提供的一种背板支撑结构的平面示意图，图4B为图4A中的背板支撑结构的沿D-D线的截面示意图。如图4A和图4B所示，背板支撑结构同时具有第一可弯折区10、第一非弯折区20、主体区30和周边区40，这些部分也采用上述区域化设计，以进一步提高背板支撑结构的整体性能。例如，周边区40位于第一非弯折区20，主体区30位于除周边区40之外的第一可弯折区10和第一非弯折区20，粘结层包括位于第一可弯折区的第一部分1023、位于周边区的第四部分1024和除第一部分1021和第四部分1024之外的部分 1022/1023，第一部分的弹性模量为约1Kpa-150Kpa，第四部分的弹性模量为约150Kpa-250Kpa，粘结层的除第一部分1021和第四部分1024之外的部分1022/1023的弹性模量为约1Kpa-250Kpa。
例如，在一些实施例中，还可以通过其他方式对背板支撑结构的主体区30和周边区40进行区域化设计。
例如，图5为图3A中的背板支撑结构的沿C-C线的另一截面示意图。如图5所示，背板支撑结构还可以包括隔垫层103，隔垫层103设置在粘结层102与基底支撑膜101之间，包括位于周边区40且朝向粘结层102凸出的凸起结构1031，此时，粘结层102的远离隔垫层103的表面为平坦表面。由此，粘结层102位于周边区40的第四部分1024的厚度得以减薄，从而降低第四部分1024的变形风险(例如产生下陷的风险)，进而提高装置的信赖性。
例如，在一些实施例中，凸起结构1031可以具有平坦的表面(图中示出的情况)，在其他实施例中，凸起结构1031也可以具有图案化表面，例如具有凹凸表面、高度渐变或者呈周期变化的楔形表面等，本公开的实施例对凸起结构1031的具体形式不做限定。
例如，在一些实施例中，隔垫层103的弹性模量可以为约1Gpa-4Gpa，例如2Gpa、2.5Gpa或者3Gpa等。此时，隔垫层103的弹性模量大于粘结层102位于周边区40的第四部分1024的弹性模量，从而隔垫层103还可以提供一定的力学强度，以避免产生不必要的变形。例如，隔垫层103的材料可以为聚酰亚胺，例如热塑性聚酰亚胺(TPI)。由此，隔垫层103可以通过热压成型的方式形成在基底支撑膜101上。
例如，在一些实施例中，基底支撑膜104的厚度可以为20μm-60μm，例如30μm、40μm或者50μm等，粘结层的厚度可以为20μm-40μm，例如25μm、30μm或者35μm等，凸起结构1031的凸出高度L可以为约10μm-20μm，例如10μm或者15μm等。此时，粘结层102位于周边区40的第四部分1024的减薄厚度等于凸起结构1031的凸出高度L。
例如，在一个示例中，当凸起结构1031的凸出高度L为10μm，粘结层102位于主体区30的第三部分1023的厚度为30μm时，粘结层102位于周边区40的第四部分1024的厚度为20μm，即第四部分1024的厚度减薄10μm。由此可以降低粘结层102位于周边区40的第四部分1024的变形风险(例如产生下陷的风险)。
本公开至少一实施例提供的背板支撑结构通过对基底支撑膜和粘结层的各项性能进行设计，并且对基底支撑膜和粘结层进行区域化设计，使得背板支撑结构可以具有更优异的综合性能，可以应用于显示面板等装置，例如可折叠显示面板等装置中，以提高装置的稳定性和信赖性。
本公开至少一实施例还提供一种显示装置，图6A为该显示装置的平面示意图，图6B为图6A中的显示装置的沿E-E线的截面示意图。如图6A和图6B所示，该显示装置包括显示基板201以上述任一背板支撑结构。该背板支撑结构可以通过粘结层102结合在显示基板201的非显示侧(图中示出为下侧)。
例如，显示装置还具有其他功能结构，本公开的实施例对此不做限定，例如，显示基板201的显示侧还可以设置偏光片202、盖板204等结构。例如，盖板204通过另一粘结层203结合在显示基板201上。
例如，图7为图6A中的显示装置的沿E-E线的另一截面示意图。如图7所示，显示基板201可以为可折叠显示基板，具有第二可弯折区2011和第二非弯折区2012。例如，背板支撑结构具有第一可弯折区10和第一非弯折区。第一可弯折区10和第二可弯折区2011对应叠层设置，第一非弯折区和第二非弯折区2012对应叠层设置，即在背板支撑结构与显示基板201结合时，粘结层102的位于第一可弯折区10的第一部分1021对应贴合在显示基板201的第二可弯折区2011，粘结层102的位于第一非弯折区的第二部分1022对应贴合在显示基板201的第二非弯折区2012。由此，在可折叠显示基板进行弯折时，背板支撑结构可以提供一定的力学缓冲与力学保护，缓解可折叠显示基板在弯折过程中受到的力，例如减小显示基板的显示结构在弯折过程中受到的力，并使受力均匀化，以避免产生应力集中，由此提高显示装置的稳定性和信赖性。
例如，第一非弯折区包括第一非弯折子区20A和第二非弯折子区20B，第一可弯折区1021位于第一非弯折子区20A和第二非弯折子区20B之间；第二非弯折区2012包括第三非弯折子区2012A和第四非弯折子区2012B，第二可弯折区2011位于第三非弯折子区2012A和第四非弯折子区2012B之间；第一非弯折子区20A与第三非弯折子区2012A对应叠层设置，第二非弯折子区20B和第四非弯折子区2012B对应叠层设置。由此，显示装置可以在中部进行弯折操作。
例如，在背板支撑结构的作用下，显示装置可以进行各个方向以及各种 尺度的弯折，并还可以保持一定的稳定性和信赖性。例如，在一些实施例中，如图8所示，显示装置可以进行背板支撑结构在内的弯折。例如，在另一些实施例中，显示装置也可以进行背板支撑结构在外的弯折(即与图8示出的弯折方向相反)。例如，显示装置的弯折半径R可以具有较大的范围。例如，显示装置可以进行小半径弯折，以提高显示装置的弯折效果。
例如，图9为图6A中的显示装置的沿E-E线的再一截面示意图。如图9所示，显示基板201还具有显示区2013和绑定区2014。例如，背板支撑结构还具有主体区和周边区，该主体区和周边区可以进行如上述实施例所述的区域化设计。例如，图9示出的是第三部分1023的弹性模量低于第四部分1024的弹性模量的情况。此时，显示区2013和主体区对应叠层设置，绑定区2014和周边区对应叠层设置，即在背板支撑结构与显示基板201结合时，粘结层102的位于主体区的第三部分1023对应贴合在显示基板201的显示区2013，粘结层102的位于周边区的第四部分1024对应贴合在显示基板201的绑定区2014。由此可以提高显示基板201在绑定区2014中的绑定电路的信赖性，防止绑定电路由于粘结层102变形、下陷等导致绑定不良。
例如，图10为图6A中的显示装置的沿E-E线的再一截面示意图。如图10所示，当背板支撑结构包括隔垫层103时，背板支撑结构的主体区和周边区也分别对应叠层设置在显示基板201的显示区2013和绑定区2014，此时，隔垫层103的凸起结构1031对应显示基板201的绑定区2014。该设置同样可以达到提高绑定区2014中的绑定电路的信赖性等技术效果。
例如，显示装置还可以包括其他功能结构。例如，图11示出了本公开至少一实施例提供的显示装置的显示区的部分截面示意图。例如，显示装置的显示区包括由多个像素单元形成的像素阵列，每个像素单元包括像素驱动电路以及发光元件，该像素驱动电路可以驱动发光元件发光，从而实现显示装置的显示功能。例如，图11示出了该显示装置的显示区中一个像素单元的截面示意图。
如图11所示，显示基板201中包括用于驱动像素单元的像素驱动电路，该像素驱动电路例如包括设置在衬底2018上的晶体管2101以及电容2102等结构。例如，晶体管2101为薄膜晶体管，包括栅极、有源层以及源漏极等结构。例如，显示基板201还包括发光元件2103，该发光元件例如为有机发光显示器件(OLED)或者量子点发光器件(QLED)等。例如，发光元 件2103包括第一电极(例如阴极)、第二电极(例如阳极)和第一电极与第二电极之间的发光层(例如有机发光层或者量子点发光层)等，为第一电极和第二电极施加适当的电压后，发光层即可发光。例如，晶体管2101的一个源漏极与发光元件2103的一个电极电连接，从而可为发光元件2103传输驱动电压。例如，显示基板201还可以包括隔垫物2104以及封装层等结构。
例如，封装层包括多层结构，例如包括依次叠层设置第一无机封装层2015、第二有机封装层2016以及第三无机封装层2017，以提供更好的封装效果。例如，显示基板201的显示侧设置有偏光片202、盖板204(例如玻璃盖板)等结构。例如，盖板204通过另一粘结层203结合在显示基板201上。本公开的实施例对显示装置以及显示基板的具体结构不做限定。
例如，图12示出了本公开至少一实施例提供的显示装置的绑定区的部分截面示意图，该示意图例如是沿图6A中的F-F线剖切且得到的。如图12所示，显示装置的绑定区包括设置在衬底2018上的信号线2019，该信号线2019电连接到显示装置的显示区的驱动电路等，以用于传输电信号。例如，衬底2018上还具有缓冲层以及绝缘层等结构，本公开的实施例对此不做限定。
例如，显示装置的绑定区可以与驱动芯片或者带有驱动芯片的结构，例如覆晶薄膜(chip on film，COF)或者柔性电路板(flexible printed circuit board，FPC)等绑定。例如，在一些实施例中，如图12所示，COF包括柔性衬底2020、柔性衬底2020上的绑定信号线2021和驱动芯片(图中未示出)。例如，绑定信号线2021的一端电连接到驱动芯片，另一端与显示装置的绑定区的信号线2019绑定，从而可以利用驱动芯片通过绑定信号线2021和信号线2019为显示装置的显示区提供驱动信号。例如，在制备工艺中，COF可以借助粘结胶(例如各向异性导电胶)通过压接的方式绑定在显示装置的绑定区。
本公开至少一实施例提供的显示装置包括本公开实施例提供的背板支撑结构，该背板支撑结构可以在显示装置弯折时提供一定的力学缓冲与力学保护，避免显示装置在弯折的过程中受到损坏，例如避免显示基板的某些部位产生应力集中而使显示区中的部分功能结构受到损坏等，因此该背板支撑结构可以提高显示装置的稳定性的信赖性。
本公开至少一实施例提供一种背板支撑结构的制备方法，如图13所示， 该制备方法包括步骤S101-S102。
步骤S101：提供基底支撑膜。
例如，该基底支撑膜的弹性模量为约1Gpa-10Gpa，例如2Gpa、4Gpa、5Gpa、6Gpa或者8Gpa等；该基底支撑膜的材料可以为高分子材料，例如聚酰亚胺(例如柔性链段比较多的聚酰亚胺)或者聚对苯二甲酸类塑料(PET)等。例如，这些材料具有上述性质，或者经过处理(例如改性)后具有上述性质。例如，基底支撑膜可以为市售的或者通过制备得到的，本公开的实施例对此不做限定。
步骤S102：在基底支撑膜上形成粘结层。
例如，该粘结层的弹性模量为约1Kpa-250Kpa，例如10Kpa、30Kpa、50Kpa、80Kpa、120Kpa、150Kpa或者200Kpa等。该粘结层的材料可以包括丙烯酸酯类粘结剂。这类粘结剂具有良好的粘结性，并且可以具有所需的力学参数。例如，粘结层102的粘结力在500gf/Inch以上，以保证背板支撑结构的信赖性。例如，粘结层102可以通过涂覆等方式形成在基底支撑膜上。
例如，在一些实施例中，参考图2A和图2B，背板支撑结构具有第一可弯折区和第一非弯折区，粘结层包括位于第一可弯折区的第一部分和位于第一非弯折区的第二部分，此时，背板支撑结构的制备方法还可以包括：对第一部分和第二部分中的至少一个进行改性处理，使第一部分的弹性模量低于第二部分的弹性模量。
例如，可以通过对第二部分进行改性处理，以提高第二部分的弹性模量。例如，在一些实施例中，可以采用紫外光照射的方式进行改性处理。例如，可以对第二部分照射紫外光，以进行UV固化增强处理，提高第二部分的弹性模量。
例如，在一些示例中，也可以对第一部分进行改性处理，以降低第一部分的弹性模量。例如，在一些实施例中，也可以对第一部分和第二部分进行不同的改性处理，以提高第二部分的弹性模量，并降低第一部分的弹性模量，从而使得第一部分的弹性模量低于第二部分的弹性模量。本公开的实施例对第一部分和第二部分的处理方式不做具体限定。
例如，最终获得的粘结层中，第一部分的弹性模量可以为约1Kpa-150Kpa，例如10Kpa、80Kpa、100Kpa或者120Kpa等，第二部分1022的弹性模量可以为约150Kpa-250Kpa，例如180Kpa、200Kpa或者220Kpa 等。
例如，在一些实施例中，参考图3A和图3B，背板支撑结构还具有主体区和周边区，粘结层还包括位于主体区的第三部分和位于周边区的第四部分，此时，背板支撑结构的制备方法还可以包括：对第三部分和第四部分中的至少一个进行改性处理，使第三部分的弹性模量低于第四部分的弹性模量。
例如，可以通过对第四部分进行改性处理，以提高第四部分的弹性模量。例如，在一些实施例中，可以采用紫外光照射的方式进行改性处理。例如，可以对第四部分照射紫外光，以进行UV固化增强处理，提高第四部分的弹性模量。
例如，在一些示例中，也可以对第三部分进行改性处理，以降低第三部分的弹性模量。例如，在一些实施例中，也可以对第三部分和第四部分进行不同的改性处理，以提高第四部分的弹性模量，并降低第三部分的弹性模量，从而使得第三部分的弹性模量低于第四部分的弹性模量。本公开的实施例对第三部分和第四部分的处理方式不做具体限定。
例如，最终获得的粘结层中，第三部分1023的弹性模量可以为约1Kpa-150Kpa，例如10Kpa、30Kpa、50Kpa、70Kpa、80Kpa或者100Kpa等，第四部分1024的弹性模量可以为约150Kpa-250Kpa，例如150Kpa、180Kpa、200Kpa或者230Kpa等。
例如，在一些实施例中，参考图5，背板支撑结构还具有主体区和周边区，背板支撑结构还包括隔垫层。此时，背板支撑结构的制备方法还可以包括：在形成粘结层之前，在基底支撑膜上形成隔垫层，该隔垫层包括位于周边区的凸起结构，在隔垫层的远离基底支撑膜的一侧形成粘结层，并且粘结层的远离隔垫层的表面形成为平坦表面。
例如，隔垫层103的弹性模量可以为约1Gpa-4Gpa，例如2Gpa、2.5Gpa或者3Gpa等。例如，隔垫层103的材料可以为聚酰亚胺，例如热塑性聚酰亚胺(TPI)，从而，可以采用热压成型的方式形成隔垫层。例如，可以直接通过热压成型的方式将隔垫层形成在基底支撑膜上。
例如，在热压成型的过程中，热压成型的温度可以选择在热塑性聚酰亚胺的玻璃化温度Tg附近但不超过该玻璃化温度Tg。例如，当所选择的热塑性聚酰亚胺的玻璃化温度Tg为约500℃时，热压成型的温度可以选择为约 200℃-300℃，例如230℃、250℃或者280℃等。热压成型的压力例如可以选择为约0.8N-1.0N，例如0.9N等。热压成型的时间例如可以选择为约10-30秒(s)，例如15s、20s或者25s等。
例如，在其他实施例中，隔垫层也可以通过其他方式形成，例如采用涂覆与固化等方式形成，本公开的实施例对隔垫层的具体形成方式不做限定。
利用本公开实施例提供的制备方法制备得到的背板支撑结构具有优异的综合性能，例如可以应用于显示面板等装置，例如可折叠显示面板等装置中，以提高装置的稳定性和信赖性。
还有以下几点需要说明：
(1)本公开实施例的附图只涉及到与本公开实施例涉及到的结构，其他结构可参考通常设计。
(2)为了清晰起见，在用于描述本公开的实施例的附图中，层或区域的厚度被放大或缩小，即这些附图并非按照实际的比例绘制。可以理解，当诸如层、膜、区域或基板之类的元件被称作位于另一元件“上”或“下”时，该元件可以“直接”位于另一元件“上”或“下”或者可以存在中间元件。
(3)在不冲突的情况下，本公开的实施例及实施例中的特征可以相互组合以得到新的实施例。
以上，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，本公开的保护范围应以权利要求的保护范围为准。

Claims (30)

  1. 一种显示装置，包括显示基板和背板支撑结构，其中，所述背板支撑结构包括叠层设置的基底支撑膜和粘结层，所述背板支撑结构通过所述粘结层结合在所述显示基板的非显示侧，
    所述背板支撑结构具有第一可弯折区和第一非弯折区，所述粘结层包括位于所述第一可弯折区的第一部分和位于所述第一非弯折区的第二部分；所述第一部分的弹性模量为约1Kpa-150Kpa，所述第二部分的弹性模量为约150Kpa-250Kpa，所述基底支撑膜的弹性模量为约1Gpa-10Gpa；
    所述显示基板为可折叠显示基板，具有第二可弯折区和第二非弯折区；
    其中，所述第一可弯折区和所述第二可弯折区对应叠层设置，所述第一非弯折区和所述第二非弯折区对应叠层设置。
  2. 根据权利要求1所述的显示装置，其中，所述基底支撑膜的厚度为约20um-60um，所述粘结层的厚度为约10um-50um。
  3. 根据权利要求1或2所述的显示装置，其中，所述基底支撑膜的断裂伸长率为约5％-80％。
  4. 根据权利要求1-3任一所述的显示装置，其中，所述基底支撑膜的弯曲强度大于约160Mpa。
  5. 根据权利要求1-4任一所述的显示装置，其中，所述基底支撑膜的吸湿率小于约2％。
  6. 根据权利要求1-5任一所述的显示装置，其中，所述基底支撑膜的材料包括聚酰亚胺或者PET。
  7. 根据权利要求1-6任一所述的显示装置，其中，所述第一非弯折区包括第一非弯折子区和第二非弯折子区，所述第一可弯折区位于所述第一非弯折子区和所述第二非弯折子区之间，
    所述第二非弯折区包括第三非弯折子区和第四非弯折子区，所述第二可弯折区位于所述第三非弯折子区和所述第四非弯折子区之间，
    所述第一非弯折子区与所述第三非弯折子区对应叠层设置，所述第二非弯折子区和所述第四非弯折子区对应叠层设置。
  8. 一种背板支撑结构，包括叠层设置的基底支撑膜和粘结层；其中，所述基底支撑膜的弹性模量为约1Gpa-10Gpa，所述粘结层的弹性模量为约1Kpa-250Kpa。
  9. 根据权利要求8所述的背板支撑结构，其中，所述基底支撑膜的厚度为约20um-60um，所述粘结层的厚度为约10um-50um。
  10. 根据权利要求8或9所述的背板支撑结构，其中，所述基底支撑膜的断裂伸长率为约5％-80％，所述基底支撑膜的弯曲强度大于约160Mpa，所述基底支撑膜的吸湿率小于约2％。
  11. 根据权利要求8-10任一所述的背板支撑结构，其中，所述基底支撑膜的弹性模量为约5Gpa-10Gpa，厚度为约20um-40um；
    所述粘结层的弹性模量为约150Kpa-250Kpa，厚度为约10um-20um。
  12. 根据权利要求8-10任一所述的背板支撑结构，其中，所述基底支撑膜的弹性模量为约1Gpa-5Gpa，厚度为约40um-60um；
    所述粘结层的弹性模量为约1Kpa-150Kpa，厚度为约20um-50um。
  13. 根据权利要求8-10任一所述的背板支撑结构，其中，所述基底支撑膜的弹性模量为约1Gpa-5Gpa，厚度为约40um-60um；
    所述粘结层的弹性模量为约1Kpa-150Kpa，厚度为约10um-20um。
  14. 根据权利要求8-10任一所述的背板支撑结构，其中，所述基底支撑膜的弹性模量为约5Gpa-10Gpa，厚度为约40um-60um；
    所述粘结层的弹性模量为约150Kpa-250Kpa，厚度为约10um-20um。
  15. 根据权利要求8-10任一所述的背板支撑结构，其中，所述背板支撑结构具有第一可弯折区和第一非弯折区，所述粘结层包括位于所述第一可弯折区的第一部分和位于所述第一非弯折区的第二部分；
    所述第一部分的弹性模量低于所述第二部分的弹性模量。
  16. 根据权利要求15所述的背板支撑结构，其中，所述第一部分的弹性模量为约1Kpa-150Kpa，所述第二部分的弹性模量为约150Kpa-250Kpa。
  17. 根据权利要求8-10任一所述的背板支撑结构，其中，所述背板支撑结构具有主体区和周边区，所述粘结层包括位于所述主体区的第三部分和位于所述周边区的第四部分；
    所述第三部分的弹性模量低于所述第四部分的弹性模量。
  18. 根据权利要求17所述的背板支撑结构，其中，所述第三部分的弹性模量为约1Kpa-150Kpa，所述第四部分的弹性模量为约150Kpa-250Kpa。
  19. 根据权利要求8-10任一所述的背板支撑结构，其中，所述背板支撑结构具有第一可弯折区、第一非弯折区、主体区和周边区；
    所述周边区位于所述第一非弯折区，所述主体区位于除所述周边区之外的所述第一可弯折区和所述第一非弯折区，所述粘结层包括位于所述第一可弯折区的第一部分、位于所述周边区的第四部分以及除所述第一部分和所述第四部分之外的部分；
    所述第一部分的弹性模量为约1Kpa-150Kpa，所述第四部分的弹性模量为约150Kpa-250Kpa，所述粘结层的除所述第一部分和所述第四部分之外的部分的弹性模量为约1Kpa-250Kpa。
  20. 根据权利要求8-10任一所述的背板支撑结构，其中，所述背板支撑结构具有主体区和周边区，所述背板支撑结构还包括隔垫层，
    所述隔垫层在所述粘结层与所述基底支撑膜之间，包括位于所述周边区且朝向所述粘结层凸出的凸起结构，
    所述粘结层的远离所述隔垫层的表面为平坦表面。
  21. 根据权利要求20所述的背板支撑结构，其中，所述隔垫层的弹性模量为约1Gpa-4Gpa。
  22. 根据权利要求20或21所述的背板支撑结构，其中，所述基底支撑膜的厚度为约20μm-60μm，所述粘结层的厚度为约20μm-40μm，所述凸起结构的凸出高度为约10μm-20μm。
  23. 一种显示装置，包括显示基板以及权利要求8-22任一所述的背板支撑结构，
    其中，所述背板支撑结构通过所述粘结层结合在所述显示基板的非显示侧。
  24. 一种背板支撑结构的制备方法，包括：
    提供基底支撑膜，
    在所述基底支撑膜上形成粘结层，
    其中，所述基底支撑膜的弹性模量为约1Gpa-10Gpa，所述粘结层的弹性模量为约1Kpa-250Kpa。
  25. 根据权利要求24所述的制备方法，其中，所述背板支撑结构具有第一可弯折区和第一非弯折区，所述粘结层包括位于所述第一可弯折区的第一部分和位于所述第一非弯折区的第二部分，所述制备方法还包括：
    对所述第一部分和所述第二部分中的至少一个进行改性处理，使所述第一部分的弹性模量低于所述第二部分的弹性模量。
  26. 根据权利要求24所述的制备方法，其中，所述背板支撑结构具有主体区和周边区，所述粘结层包括位于所述主体区的第三部分和位于所 述周边区的第四部分，所述制备方法还包括：
    对所述第三部分和所述第四部分中的至少一个进行改性处理，使所述第三部分的弹性模量低于所述第四部分的弹性模量。
  27. 根据权利要求25或26所述的制备方法，其中，采用紫外光照射的方式进行所述改性处理。
  28. 根据权利要求24所述的制备方法，其中，所述背板支撑结构还具有主体区和周边区，所述制备方法还包括：
    在形成所述粘结层之前，在所述基底支撑膜上形成隔垫层，所述隔垫层包括位于所述周边区的凸起结构，
    在所述隔垫层的远离所述基底支撑膜的一侧形成所述粘结层，并且所述粘结层的远离所述隔垫层的表面形成为平坦表面。
  29. 根据权利要求28所述的制备方法，其中，采用热压成型的方式形成所述隔垫层。
  30. 根据权利要求29所述的制备方法，其中，所述热压成型的温度为约200℃-300℃，压力为约0.8N-1.0N，时间为约10s-30s。
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