WO2021013050A1 - 一种壳体、壳体的制造方法以及电子装置 - Google Patents

一种壳体、壳体的制造方法以及电子装置 Download PDF

Info

Publication number
WO2021013050A1
WO2021013050A1 PCT/CN2020/102495 CN2020102495W WO2021013050A1 WO 2021013050 A1 WO2021013050 A1 WO 2021013050A1 CN 2020102495 W CN2020102495 W CN 2020102495W WO 2021013050 A1 WO2021013050 A1 WO 2021013050A1
Authority
WO
WIPO (PCT)
Prior art keywords
bonding layer
substrate
resin
mass
parts
Prior art date
Application number
PCT/CN2020/102495
Other languages
English (en)
French (fr)
Inventor
赵岩峰
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2021013050A1 publication Critical patent/WO2021013050A1/zh

Links

Images

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0279Improving the user comfort or ergonomics
    • H04M1/0283Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
    • B44CPRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/18Applying ornamental structures, e.g. shaped bodies consisting of plastic material
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus

Definitions

  • This application relates to the technical field of electronic equipment, and in particular to a housing, a method for manufacturing the housing, and an electronic device.
  • the present application provides a casing, a manufacturing method of the casing, and an electronic device, which can realize the appearance effect of the casing with rich texture.
  • the present application provides a method for manufacturing a housing.
  • the method includes the following steps: providing a substrate, and the substrate is a plastic substrate, an acrylic substrate, a glass substrate, or a sapphire substrate; Bonding layer; forming a colored paint layer on the bonding layer; wherein the base material and the bonding layer are both light-transmissive materials, and the bonding layer is wrapped with a carrier with a predetermined pattern.
  • the present application provides a housing, the housing includes: a substrate; a bonding layer disposed on the substrate; a color paint layer disposed on the bonding layer; wherein the base material and the bonding layer are both transparent Light material, a carrier with a predetermined pattern is wrapped in the bonding layer.
  • the present application provides an electronic device, wherein the electronic device includes a device main body and a casing for protecting the device main body, and the casing is the aforementioned casing.
  • the housing provided by the present application includes a light-permeable substrate and a bonding layer, wherein the bonding layer is wrapped with a carrier with a predetermined pattern. Since both the base material and the bonding layer are light-transmissive materials, in terms of appearance, users can observe the three-dimensional pattern carrier in the bonding layer through the base material, making the shell more distinctive and attractive. At the same time, the present application does not need to evaporate or etch the shell to obtain a pattern layer like the prior art. It only needs to process a carrier of various predetermined patterns and patterns in the bonding layer to meet the needs of different people and realize the shell The appearance of rich texture.
  • Fig. 1 is a schematic structural diagram of an embodiment of a housing of the present application
  • Fig. 2 is a schematic structural diagram of another embodiment of the housing of the present application.
  • FIG. 3 is a schematic structural diagram of another embodiment of the housing of the present application.
  • FIG. 4 is a schematic flowchart of an embodiment of a method for manufacturing a housing according to the present application
  • FIG. 5 is a schematic flowchart of another embodiment of the manufacturing method of the casing of the present application.
  • FIG. 6 is a schematic flowchart of step S40 in FIG. 5;
  • FIG. 7 is a schematic flowchart of step S20 in FIG. 4;
  • FIG. 8 is a schematic flowchart of step S30 in FIG. 4;
  • FIG. 9 is a schematic structural diagram of an embodiment of an electronic device of the present application.
  • the design of consumer electronic products is no longer limited to the perfection of functions. Many designers have set their sights on the appearance of consumer electronic products. Take the mobile phone as an example.
  • the back glass of the mobile phone not only protects the parts inside the mobile phone, but also plays a role in beautifying and decorating the mobile phone.
  • the design of the mobile phone cover with excellent decorative effect can not only increase the value of the mobile phone, but also improve the user's use.
  • Experience increases the user's choice of mobile phone shape, making mobile phones more popular among users.
  • the present application provides a housing 10 which includes a substrate 11, a bonding layer 12 and a color paint layer 13.
  • the bonding layer 12 is disposed on the substrate 11, and the colored paint layer 13 is disposed on the bonding layer 12.
  • the substrate 11 and the bonding layer 12 are both light-transmissive materials, and the bonding layer 12 is wrapped with a carrier 122 with a predetermined pattern.
  • the bonding layer 12 is formed by wrapping a carrier 122 with a predetermined pattern with a light-permeable polymer resin 121 and then curing it.
  • the polymer resin 121 is a thermosetting resin 121 or a photocurable resin 121. Before curing, the polymer resin 121 has fluidity. Place a carrier 122 with a predetermined pattern in the polymer resin 121, and the polymer resin 121 will wrap the polymer resin 121. A carrier 122 having a predetermined pattern. When the curing is completed, the uncured polymer resin 121 is transformed into an approximately gel shape to wrap and fix the carrier 122 with a predetermined pattern.
  • the color paint layer 13 is formed on the bonding layer 12.
  • the colored paint layer 13 may be formed on the bonding layer 12 by a spraying process.
  • the color paint layer 13 can be in various colors such as black, white, gray, red, and blue.
  • the material of the colored paint layer 13 may be an opaque material, for example, the material of the colored paint layer 13 may be a covering type colored paint.
  • the color paint layer 13 shows its own color and covers the color of the bonding layer 12. In other embodiments, the colored paint layer 13 may also be formed on the bonding layer 12 by evaporation.
  • the colored paint layer 13 may also be a baking type colored paint, that is, after the colored paint is sprayed on the bonding layer 12, it is cured by baking.
  • the user can observe the three-dimensional pattern carrier 122 in the bonding layer 12 through the substrate 11 and the colored paint layer 13 through the substrate 11 and the bonding layer 12.
  • a material with a transparency greater than or equal to 85% can be used as the material of the substrate 11.
  • the substrate 11 may be made of transparent plastic material, glass material, etc.
  • the plastic material selected in this embodiment may be transparent polycarbonate (PC) or polymethyl methacrylate (PMMA). ).
  • the housing 10 provided in this embodiment includes a light-permeable substrate 11 and a bonding layer 12, wherein the bonding layer 12 is wrapped with a carrier 122 having a predetermined pattern. Since the base material 11 and the bonding layer 12 are both light-transmissive materials, in terms of appearance, users can observe the three-dimensional pattern carrier 122 in the bonding layer 12 through the base material 11, making the housing 10 more distinctive and attractive . At the same time, in this embodiment, it is not necessary to evaporate or etch the housing 10 to obtain a pattern layer as in the prior art. It only needs to process a carrier 122 with various predetermined patterns and patterns in the bonding layer 12 to meet the needs of different people. , To achieve the appearance effect of the shell 10 with rich texture.
  • the material of the bonding layer 12 is cured thermosetting resin 121 and/or photocurable resin 121, and the bonding layer 12 is cured and wrapped with the thermosetting resin 121 and/or the carrier 122 having a predetermined pattern.
  • the photocurable resin 121 is formed, wherein the thermosetting resin 121 and/or the photocurable resin 121 at least include: 15-30 parts by mass of resin 121 and 5-10 parts by mass of curing agent.
  • thermosetting resin 121 a thermosetting resin 121 having a glass transition point (Tg) of 130 to 150°C in the atmosphere (atmospheric pressure, 50% RH) is generally used.
  • Tg glass transition point
  • the housing 10 is mainly used in a personal computer, a tablet computer or a mobile phone, and the ambient temperature for its use is not higher than 130°C.
  • thermosetting resin 121 and/or the photocurable resin 121 is a colored thermosetting resin 121 and/or a photocurable resin 121, wherein the colored thermosetting resin 121 and/or the photocuring resin 121 is at least It includes: 15-30 parts by mass of resin 121, 5-10 parts by mass of curing agent, 10-20 parts by mass of nano-color paste, and 10-20 parts by mass of solvent.
  • the material of the bonding layer 12 is colored resin paint.
  • the colored resin coating is prepared from resin 121 and nano-color paste.
  • the color of the bonding layer 12 may be black, white, gray, red, blue, etc.
  • the colored resin coating may include at least the following components: 15-30 parts by mass of resin 121, 5-10 parts by mass of curing agent, 10-20 parts by mass of nano-color paste, and 10-20 parts by mass of solvent.
  • the colored resin coating includes: 15-30 parts by mass of polyurethane, 5-10 parts by mass of curing agent, 10-20 parts by mass of nano-color paste, and 3-5 parts by mass of light Initiator, 2 to 4 parts by mass of photosensitizer, 0.5 to 1 parts by mass of leveling agent, and 10 to 20 parts by mass of organic solvent.
  • the nano-color paste is prepared by dissolving organic or inorganic pigments in a solvent and then grinding and dispersing them, and the pigment particle size is less than 100 nm.
  • thermosetting resin 121 and/or the photosetting resin 121 is epoxy resin 121.
  • the curing process of the epoxy resin 121 is as follows: by adding a curing agent to the epoxy resin 121, the curing agent of the epoxy resin 121 chemically reacts with the epoxy resin 121 to form a three-dimensional network polymer, and the material aggregate is wrapped Enclosed in the mesh body, so that the linear resin 121 becomes a tough solid body.
  • thermosetting product it becomes a thermosetting product through four ways of reaction: (1) ring-opening connection between epoxy groups; (2) epoxy group reacts with a hardener with active hydrogen functional groups to crosslink; (3) ring The oxy group reacts with the aromatic or aliphatic hydroxyl group in the hardener to crosslink; (4) the epoxy group or the hydroxyl group reacts with the group of the hardener to crosslink.
  • the substrate 11 is a plastic substrate, an acrylic substrate, a glass substrate, or a sapphire substrate.
  • the glass substrate can be float glass or overflow glass, for example, float soda lime glass, float high alumina glass or overflow high alumina glass.
  • Float glass refers to ultra-thin glass produced by the float process. This process is currently the thinnest and can be drawn to a thickness of 0.1mm.
  • As a new type of high-tech, high value-added glass it has high light transmittance, smooth surface, high hardness, good chemical stability, and wide application. advantage.
  • the plastic substrate can be a polycarbonate material, and the transparency can reach more than 90%.
  • the bonding layer 12 can also be made of polymethyl methacrylate material, which has excellent optical properties and resistance to temperature changes, and the white light penetration is as high as 92%.
  • the plastic substrate can also be a polyethylene terephthalate material, which is a milky white or light yellow highly crystalline polymer with a smooth and shiny surface and a transparency of 86%.
  • the plastic substrate can also be other plastics, which will not be listed here.
  • the carrier 122 is at least one of non-woven fabric, silk, plastic film, leather, fiber fabric, or gold, silver and aluminum foil.
  • the carrier 122 is silk.
  • Silk is usually woven from silk or synthetic fibers, man-made fibers, short filaments, etc. Silk has the advantages of smooth texture, soft and firm texture, high gloss, and static water flow effect.
  • the flow and agility of the silk are introduced into the decoration process of the housing 10 of the electronic device, showing the user Differentiated decorative effects.
  • the texture and luster of the silk are excellently reflected.
  • the colored paint layer 13 is formed by spraying paint on the surface of the bonding layer 12 facing away from the substrate 11, wherein the paint includes at least 50-60 parts by mass of varnish (for example, 50 parts by mass of varnish). Oil, 55 parts by mass of varnish or 60 parts by mass of varnish), 15 to 40 parts by mass of curing agent (for example, 15 parts by mass of curing agent, 30 parts by mass of curing agent or 40 parts by mass of diluent), and 10 ⁇ 30 parts by mass of diluent (for example, 10 parts by mass of diluent, 20 parts by mass of diluent, or 30 parts by mass of diluent).
  • the paint includes at least 50-60 parts by mass of varnish (for example, 50 parts by mass of varnish). Oil, 55 parts by mass of varnish or 60 parts by mass of varnish), 15 to 40 parts by mass of curing agent (for example, 15 parts by mass of curing agent, 30 parts by mass of curing agent or 40 parts by mass of diluent), and 10 ⁇ 30 parts by mass
  • the thickness of the substrate 11 is 50-500 micrometers (for example, 50 micrometers, 250 micrometers or 500 micrometers), and the thickness of the bonding layer 12 is 100-500 micrometers (for example 100 micrometers, 250 micrometers or 500 micrometers).
  • the thickness of the paint layer 13 is 8-15 microns (for example, 8 microns, 10 microns or 15 microns).
  • the housing 10 further includes an adhesive layer 14 disposed between the bonding layer 12 and the substrate 11 to fix the adhesive bonding layer 12 and the substrate 11.
  • the adhesive layer 14 is at least one of an OCA adhesive layer, an SGP adhesive layer, a PVB adhesive layer, a PVA adhesive layer or an EVA adhesive layer.
  • OCA glue is used for special adhesives for bonding transparent optical components (such as lenses, etc.). It is required to be colorless and transparent, light transmittance above 90%, good bonding strength, can be cured at room temperature or medium temperature, and has the characteristics of small curing shrinkage.
  • OCA optical glue is one of the important raw materials for touch screens. The optical acrylic adhesive is made into a substrate-free 11, and then a layer of release film is attached to the upper and lower bottom layers. It is a double-sided adhesive tape without a substrate. In short, OCA is an optically transparent layer of special double-sided tape without substrate 11.
  • PVB glue ie, polyvinyl butyral
  • PVB glue is a translucent film, a polymer material that is plasticized and extruded from polyvinyl butyral resin 121 with a plasticizer.
  • Appearance is a translucent film, no impurities, flat surface, certain roughness and good flexibility, good adhesion to inorganic glass, transparency, heat resistance, cold resistance, humidity resistance, high mechanical strength, etc. At present, it is the best adhesive material for manufacturing sandwich and safety glass in the world. It is also widely used in architectural fields such as building curtain walls, tents, showcases, bank counters, prison windows, steel furnace screens and various bulletproof glass.
  • the glass substrate 11 and the adhesive layer 14 are permanently bonded into a composite glass product.
  • the present application provides a method for manufacturing a housing, which includes the following steps:
  • the base material and the bonding layer are both light-transmissive materials, and the bonding layer is wrapped with a carrier with a predetermined pattern.
  • the material of the bonding layer is cured thermosetting resin and/or photocurable resin.
  • step S40 specifically includes:
  • thermosetting resin and/or the photosetting resin wrapped with the carrier having a predetermined pattern to form a bonding layer curing the thermosetting resin and/or the photosetting resin wrapped with the carrier having a predetermined pattern to form a bonding layer.
  • thermosetting resin and/or photocurable resin at least include: 15-30 parts by mass of resin (for example, 15 parts by mass of resin, 25 parts by mass of resin, or 30 parts by mass of resin) and 5-10 parts by mass of curing agent (For example, 5 parts by mass of curing agent, 8 parts by mass of curing agent, or 10 parts by mass of curing agent).
  • a carrier with a predetermined pattern is placed in the resin, and an appropriate content of curing agent is added, and stirred evenly to ensure that the silk sample is fixed in the resin in a suitable shape and curve, and the thickness of the resin is 0.1-0.5 mm. And perform CNC precision milling according to the predetermined size, and the sample is ready for use.
  • the process of this embodiment takes into account the needs of large-scale production to ensure that the sandwich structure of the shell is obtained with high efficiency, quality and quantity, and the RTM molding process is applied in the process of preparing the bonding layer. This process can significantly improve the production process, ensure quality and thus effectively reduce costs.
  • RTM resin transfer molding, resin transfer molding
  • resin transfer molding process is to extract the resin and curing agent from the storage tank by the metering equipment, mix them uniformly by a static mixer, and pour them into a sealed mold that is pre-paved with a carrier with a predetermined pattern.
  • the bonding layer is obtained by curing, demolding, and post-processing.
  • the carrier with the predetermined pattern is laid flat in the mold, and the resin is pumped into the mold with vacuum assistance. Because the curing agent and resin are mixed in the cavity, using this RTM process, the highly fluid resin can fill the cavity and completely wet the carrier, resulting in a smoother surface than the hot pressing process.
  • step S20 includes:
  • S22 Place the bonding layer on the bonding layer, wherein the edge of the bonding layer is aligned with the edge of the substrate.
  • the above-mentioned pressing process should be carried out in a clean room that meets the process requirements: the clean room is purified to a level of over 100,000 to ensure that there is no dust pollution during the filming process; the staff should have clothing compatible with the purification conditions And tools; the ambient temperature is controlled at room temperature of 25 ⁇ 2°C, and the indoor relative humidity is about 25%; the bonding layer and the substrate should be kept clean and pollution-free.
  • the pressing parameters are: the pressing vacuum is -0.05 MPa, and the pressing temperature is 60-80°C.
  • step S30 includes:
  • the paint includes at least: 50-60 parts by mass of varnish (for example, 50 parts by mass of varnish, 55 parts by mass of varnish or 60 parts by mass of varnish), 15-40 parts by mass of curing agent (for example, 15 Parts by mass of curing agent, 30 parts by mass of curing agent or 40 parts by mass of diluent) and 10-30 parts by mass of diluent (for example, 10 parts by mass of diluent, 20 parts by mass of diluent, or 30 parts by mass of diluent) Agent).
  • varnish for example, 50 parts by mass of varnish, 55 parts by mass of varnish or 60 parts by mass of varnish
  • 15-40 parts by mass of curing agent for example, 15 Parts by mass of curing agent, 30 parts by mass of curing agent or 40 parts by mass of diluent
  • 10-30 parts by mass of diluent for example, 10 parts by mass of diluent, 20 parts by mass of diluent, or 30 parts by mass of diluent
  • the spraying parameters in the above-mentioned spraying paint process are: the viscosity of the paint is 8-12 Pascal ⁇ sec (for example, 8 Pascal ⁇ sec, 10 Pascal ⁇ sec or 12 Pascal ⁇ sec), and the distance from the spray gun to the bonding layer The distance is 10 cm, the rotation speed of the bonding layer is 10-60 degrees/second (for example, 10 degrees/second, 30 degrees/second or 60 degrees/second), the spraying speed during spraying is 600 mm/m, and the ink supply pressure It is 200 Pa, the atomization pressure is 300 Pa, and the spray pressure is 350 Pa.
  • the viscosity of the paint is 8-12 Pascal ⁇ sec (for example, 8 Pascal ⁇ sec, 10 Pascal ⁇ sec or 12 Pascal ⁇ sec)
  • the distance from the spray gun to the bonding layer The distance is 10 cm
  • the rotation speed of the bonding layer is 10-60 degrees/second (for example, 10 degrees/second, 30 degrees/second or 60 degrees/second)
  • the spraying speed during spraying is 600 mm/m
  • the curing parameters in the above curing paint process are: curing temperature is 80-90°C, curing time is 50-60 minutes, and the thickness is uniformly controlled to 10-15 microns.
  • the method further includes: cutting, polishing and cleaning the substrate.
  • the substrate needs to be pre-treated: the substrate is placed in absolute ethanol for ultrasonic cleaning to remove oil stains on the surface of the substrate, and the cleaning time is 5-10 minutes. Carry out cutting, fine-tune the product plane size and shape, holes, and chamfers. Some products are polished after CNC; use ultrasonic and alkaline cleaning agents to clean CNC oil stains and coolant; use trial molds to form glass surfaces at high temperatures. Defects such as pitting and stamping caused by the bending process are polished and repaired, and the concave and convex surfaces are polished once; the polishing powder is cleaned by ultrasonic and alkaline cleaning solution; after the blank is prepared, K-Na ions replace the strengthened glass at high temperature, and then clean it . The thickness of the glass is controlled at 0.05-0.55 mm thickness, and it is ready for use.
  • the present application provides an electronic device 100.
  • the electronic device 100 includes a device main body 101 and a casing 10 for protecting the device main body 101.
  • the casing 10 is the casing 10 in the foregoing embodiment.
  • the electronic device 100 in one embodiment is a mobile phone.
  • the electronic device 100 may also include a tablet computer, a PDA (Personal Digital Assistant, personal digital assistant), and a POS (Point of Sales). Terminal), wearable devices and other electronic equipment.
  • Examples of the electronic device 100 include, but are not limited to satellites or cellular phones.
  • a personal communication system (PCS) terminal that can combine cellular radio telephones with data processing, fax, and data communication capabilities.
  • PDAs that can include radio phones, pagers, Internet/Intranet access, Web browsers, note pads, calendars, and/or global positioning system (GPS) receivers.
  • GPS global positioning system
  • the electronic device 100 may include a display screen and a housing 10, and the display screen and the housing 10 are fixedly connected.
  • the display screen and the housing 10 may enclose a cavity for accommodating electrical components such as a motherboard and a battery of the electronic device 100.

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

本申请涉及电子设备技术领域,具体公开了一种壳体、壳体的制造方法以及电子装置,该壳体包括:基材;结合层,设置于基材上;色漆层,设置于结合层上;其中,基材与结合层均为可透光材质,结合层中包裹有一具有预定图案的载体。通过上述方式,本申请能够实现壳体丰富纹理的外观效果。

Description

一种壳体、壳体的制造方法以及电子装置 【技术领域】
本申请涉及电子设备技术领域,特别是涉及一种壳体、壳体的制造方法以及电子装置。
【背景技术】
目前,随着科学技术的发展,智能手机等电子装置日渐成为人们生活的必需品,用户对电子设备(如手机)的外观要求也逐渐呈现出多元化的趋势,同时,市面上也出现各种不同视觉效果的电子设备,进而使电子设备外观更加美观精致。
【发明内容】
本申请提供一种壳体、壳体的制造方法以及电子装置,能够实现壳体丰富纹理的外观效果。
一方面,本申请提供了一种壳体的制造方法,该方法包括以下步骤:提供一基材,基材为塑料基材、亚克力基材、玻璃基材或蓝宝石基材;在基材上形成结合层;在结合层上形成色漆层;其中,基材与结合层均为可透光材质,结合层中包裹有一具有预定图案的载体。
另一方面,本申请提供了一种壳体,壳体包括:基材;结合层,设置于基材上;色漆层,设置于结合层上;其中,基材与结合层均为可透光材质,结合层中包裹有一具有预定图案的载体。
又一方面,本申请提供了一种电子装置,其中,电子装置包括装置主体和用于对装置主体进行保护的壳体,壳体为前述的壳体。
本申请的有益效果是:区别于现有技术的情况,本申请提供的壳体包括可透光的基材和结合层,其中,该结合层中包裹有一具有预定图案的载体。由于基材和结合层均为可透光材料,因此,在外观上,用户可以透过基材观察到结合层内立体的图案载体,使壳体更加具有特色和吸引力。同时,本申请不必像现有技术对壳体进行蒸镀或蚀刻以得到图案层,只需要在结合层内加工出各种预定图案和花纹的载体,即可满足不同人群的需求,实现壳体丰富纹理的外观效果。
【附图说明】
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。其中:
图1是本申请壳体一实施例的结构示意图;
图2是本申请壳体另一实施例的结构示意图;
图3是本申请壳体又一实施例的结构示意图;
图4是本申请壳体的制造方法一实施例的流程示意图;
图5是本申请壳体的制造方法另一实施例的流程示意图;
图6是图5中步骤S40的流程示意图;
图7是图4中步骤S20的流程示意图;
图8是图4中步骤S30的流程示意图;
图9是本申请电子装置一实施例的结构示意图。
【具体实施方式】
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部实施例。基于本申请中的实施例,本领域普通技术人员在没有做出创造性的劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。
目前,消费电子行业发展越来越快,各个厂家在不断寻求技术创新和功能创新来迎合环保、节能和差异化的发展趋势。消费电子产品的设计已经不仅仅局限于功能的完善,很多设计者已经将目光投向于消费电子产品外观的设计。以手机为例,手机背板玻璃既起到保护手机里面的零件的作用,也起到美化装饰手机的作用,装饰效果优秀的手机盖板设计不但可以增加手机的价值,还可以提高用户的使用体验,增加了用户对手机外形的选择范围,使得手机得到更多用户的欢迎。然而,随着智能手机、平板电脑、可穿戴式智能设备等电子装置的高度发展,这些电子装置在性能上几乎达到瓶颈,功能越来越多元化和同一化。导致目前 的用户更加倾向于追求电子装置的外观、触感等,这对电子装置的壳体提出了更高的要求。
参阅图1,本申请提供一种壳体10,壳体10包括:基材11、结合层12以及色漆层13。结合层12设置于基材11上,色漆层13设置于结合层12上,其中,基材11与结合层12均为可透光材质,结合层12中包裹有一具有预定图案的载体122。
具体地,结合层12通过可透光的高分子树脂121包裹具有预定图案的载体122后固化形成。高分子树脂121选用热固性树脂121或光固性树脂121,在固化之前,该高分子树脂121具有流动性,将具有预定图案的载体122放置到高分子树脂121中,高分子树脂121将包裹该具有预定图案的载体122。固化完成时,未固化的高分子树脂121转变为近似凝胶状,以包裹固定该具有预定图案的载体122。
色漆层13形成在结合层12上。可选地,色漆层13可以通过喷涂工艺形成在结合层12上。色漆层13可以为黑、白、灰、红、蓝等各种颜色。色漆层13的材质可以是不透光的材质,例如色漆层13的材质可以是遮盖型色漆。色漆层13显现自身的颜色且将结合层12的颜色遮盖。在其他实施例中,色漆层13也可以采用蒸镀的方式形成结合层12上。与UV转印油墨的工艺相比,通过蒸镀或者喷涂工艺使得色漆层13的形成工艺更加简单,利于提高生产效率和节约生产成本,利于壳体10的产业化制造。色漆层13也可以为烘烤型色漆,即在色漆喷涂在结合层12上之后通过烘烤进行固化。
可以理解的是,用户可以透过基材11观察到结合层12内立体的图案载体122,并透过基材11和结合层12观察到色漆层13。为提高壳体10的外观效果,使用户能够清楚观察到图案载体122的纹理,本实施例可以采用透明度大于等于85%的材料作为基材11的材料。例如,基材11可以由透明的塑料材料、玻璃材料等制成,本实施例中选取的塑料材料可以为透明的聚碳酸酯(Polycarbonate,PC)或聚甲基丙烯酸甲酯(Polymethyl Methacrylate,PMMA)。
区别于现有技术的情况,本实施例提供的壳体10包括可透光的基材11和结合层12,其中,该结合层12中包裹有一具有预定图案的载体 122。由于基材11和结合层12均为可透光材料,因此,在外观上,用户可以透过基材11观察到结合层12内立体的图案载体122,使壳体10更加具有特色和吸引力。同时,本实施例不必像现有技术对壳体10进行蒸镀或蚀刻以得到图案层,只需要在结合层12内加工出各种预定图案和花纹的载体122,即可满足不同人群的需求,实现壳体10丰富纹理的外观效果。
参阅图2,在一实施例中,结合层12的材料为固化的热固性树脂121和/或光固性树脂121,结合层12通过固化包裹有具有预定图案的载体122的热固性树脂121和/或光固性树脂121形成,其中,热固性树脂121和/或光固性树脂121至少包括:15~30质量份的树脂121以及5~10质量份的固化剂。
具体地,热固性树脂121通常使用的是大气中(大气压,50%RH)的玻璃化转换点(Tg)为130~150℃的热固性树脂121。原因在于壳体10主要用于个人电脑、平板电脑或手机中,其使用的环境温度不会高于130℃。
在一实施例中,热固性树脂121和/或光固性树脂121为带颜色的热固性树脂121和/或光固性树脂121,其中,带颜色的热固性树脂121和/或光固性树脂121至少包括:15~30质量份的树脂121、5~10质量份的固化剂、10~20质量份的纳米色浆以及10~20质量份的溶剂。
具体地,结合层12的材料为带颜色的树脂涂料。可选地,带颜色的树脂涂料由树脂121和纳米色浆调制而成。结合层12的颜色可以为黑、白、灰、红、蓝等。
带颜色的树脂涂料至少可以包括以下组分:15~30质量份的树脂121、5~10质量份的固化剂、10~20质量份的纳米色浆以及10~20质量份的溶剂。
更具体的是在实施例中,带颜色的树脂涂料包括:15~30质量份的聚氨酯、5~10质量份的固化剂、10~20质量份的纳米色浆、3~5质量份的光引发剂、2~4质量份的光敏剂、0.5~1质量份的流平剂、10~20质量份的有机溶剂。
可选地,纳米色浆为有机或者无机颜料溶于溶剂后研磨分散制得, 其颜料粒径为100纳米以下。
在一实施例中,热固性树脂121和/或光固性树脂121为环氧树脂121。
具体地,环氧树脂121的固化过程如下:通过向环氧树脂121中添加固化剂,环氧树脂121固化剂与环氧树脂121发生化学反应,形成网状立体聚合物,把材料骨材包络在网状体之中,从而使线型树脂121变成坚韧的体型固体。一般认为它通过四种途径的反应而成为热固性产物:(1)环氧基之间开环连接;(2)环氧基与带有活性氢官能团的硬化剂反应而交联;(3)环氧基与硬化剂中芳香的或脂肪的羟基的反应而交联;(4)环氧基或羟基与硬化剂所带基团发生反应而交联。
在一实施例中,基材11为塑料基材、亚克力基材、玻璃基材或蓝宝石基材。
具体地,玻璃基材可以以选用浮法玻璃或溢流玻璃,例如,浮法钠钙玻璃、浮法高铝玻璃或者溢流高铝玻璃。浮法玻璃是指利用浮法工艺生产的超薄玻璃。该工艺目前最薄已能拉制到0.1mm的厚度,它作为一种新型的高技术、高附加值玻璃,具有透光率高、表面平整、硬度高、化学稳定性好、应用面广等优点。
塑料基材可以为聚碳酸酯材料,透明度可以达到90%以上。在其他实施例中,结合层12还可以为聚甲基丙烯酸甲酯材料,其具有优良的光学特性及耐温度变化的特性,白光的穿透性高达92%。塑料基材还可以为聚对苯二甲酸乙二醇脂材料,其为乳白色或浅黄色高度结晶性的聚合物,表面平滑而有光泽,透明度达86%。塑料基材还可以为其他的塑料,此处不再一一列举。
在一实施例中,载体122为无纺布、丝绸、塑料薄膜、皮革、纤维织物或者金银铝箔中的至少一种。
优选地,载体122为丝绸。丝绸通常采用蚕丝或合成纤维、人造纤维、短丝等织成。丝绸具有质感光滑、纹折柔软又坚挺、高光多、有静态的水流效果的优点。
通过将丝绸固化在环氧树脂121当中,并将其贴合在玻璃基材11的凹面,从而将丝绸的流动感、灵动感引入到电子设备的壳体10装饰 工艺当中,向用户展现了具有差异化的装饰效果。该效果在转动角度过程中,丝绸的质感和光泽得到了优异体现。
在一实施例中,色漆层13通过在结合层12背向基材11的表面上喷涂漆料形成,其中,漆料至少包括:50~60质量份的光油(例如50质量份的光油、55质量份的光油或60质量份的光油)、15~40质量份的固化剂(例如15质量份的固化剂、30质量份的固化剂或40质量份的稀释剂)以及10~30质量份的稀释剂(例如10质量份的稀释剂、20质量份的稀释剂或30质量份的稀释剂)。
在一实施例中,基材11的厚度为50~500微米(例如50微米、250微米或500微米),结合层12的厚度为100~500微米(例如100微米、250微米或500微米),色漆层13的厚度为8~15微米(例如8微米、10微米或15微米)。
参阅图3,在一实施例中,壳体10还包括:粘接层14,设置在结合层12与基材11之间,以固定粘接结合层12与基材11。
上述粘接层14为OCA胶层、SGP胶层、PVB胶层、PVA胶层或EVA胶层中的至少一种。
具体地,OCA胶用于胶结透明光学元件(如镜头等)的特种粘胶剂。要求具有无色透明、光透过率在90%以上、胶结强度良好,可在室温或中温下固化,且有固化收缩小等特点。OCA光学胶是重要触摸屏的原材料之一。是将光学亚克力胶做成无基材11,然后在上下底层,再各贴合一层离型薄膜,是一种无基体材料的双面贴合胶带。简而言之,OCA就是具有光学透明的一层特种无基材11的双面胶。
PVB胶(即聚乙烯醇缩丁醛)是半透明的薄膜,由聚乙烯醇缩丁醛树脂121经增塑剂塑化挤压成型的一种高分子材料。外观为半透明薄膜,无杂质,表面平整,有一定的粗糙度和良好的柔软性,对无机玻璃有很好的粘结力、具有透明、耐热、耐寒、耐湿、机械强度高等特性,是当前世界上制造夹层、安全玻璃用的最佳粘合材料,同时在建筑幕墙、招罩棚、橱窗、银行柜台、监狱探视窗、炼钢炉屏幕及各种防弹玻璃等建筑领域也有广泛的应用。
经过特殊的高温预压(或抽真空)及高温高压工艺处理后,使玻 璃基材11和粘接层14永久粘合为一体的复合玻璃产品。
参阅图4,本申请提供一种壳体的制造方法,该方法包括以下步骤:
S10:提供一基材。
S20:在基材上形成结合层。
S30:在结合层上形成色漆层。
其中,基材与结合层均为可透光材质,结合层中包裹有一具有预定图案的载体。
在一实施例中,结合层的材料为固化的热固性树脂和/或光固性树脂,参阅图5,在基材上形成结合层的步骤之前,该方法还包括:
S40:制备结合层。
参阅图6,步骤S40具体包括:
S41:将具有预定图案的载体放置在热固性树脂和/或光固性树脂中。
S42:固化包裹有具有预定图案的载体的热固性树脂和/或光固性树脂,以形成结合层。
其中,热固性树脂和/或光固性树脂至少包括:15~30质量份的树脂(例如15质量份的树脂、25质量份的树脂或30质量份的树脂)以及5~10质量份的固化剂(例如5质量份的固化剂、8质量份的固化剂或10质量份的固化剂)。
具体地,将具有预定图案的载体放置在树脂中,并添加适当含量的固化剂,搅拌均匀以确保丝绸样品以适宜的形状和曲线固定在树脂中,树脂厚度为0.1-0.5mm。并按照预定尺寸进行CNC精铣外形,样品待用。
本实施例的流程考虑到大规模生成的需要、以确保高效及保质保量地得到壳体的夹层结构,将RTM成型工艺应用在制备结合层的加工过程中。这个工艺能够显著提高生产工艺,保证质量因此有效降低成本。
RTM(resin transfer molding,树脂传递模塑)工艺是将树脂及固化剂由计量设备分别从储桶内抽出,经静态混合器混合均匀,注入事先铺有具有预定图案的载体的密封模内,经固化、脱模、后加工得到结合层。先将具有预定图案的载体在模具内平铺好,加真空辅助抽入树脂成型。由于固化剂和树脂是在型腔中混合的,借用这种RTM工艺,高流动性的树脂能够充满型腔,并完全浸润载体,产生比热压工艺更加光滑的表 面。
参阅图7,在一实施例中,步骤S20包括:
S21:无尘环境下,在基材上设置一粘接层。
S22:将结合层放置在粘接层上,其中,结合层的边缘与基材的边缘对齐。
S23:压合结合层与基材,以固定粘接结合层与基材。
具体地,上述压合工艺应在符合工艺要求的无尘室内进行:无尘室内净化至十万级以上,以确保合片过程中没有灰尘的污染;工作人员应具有和净化条件相适应的服装及工具;环境温度控制在室温为25土2℃,室内相对湿度在25%左右;粘接层和基材之间应保持洁净无污染。
在符合工艺要求的无尘室内,将基材平放在模具中,将粘接层(例如PVB中间膜、OCA胶或者其他粘结材料)在基材上铺开展平,并放上固化后的结合层,在夹治具的定位下,确保固化后的结合层与基材的边缘对齐。结合层与基材铺平以后,在真空负压条件下(-0.05MPa)、60-80摄氏度条件下将基材、粘接层、结合层中的残余空气排出,并得到良好的贴合效果。
在一实施例中,压合参数为:压合真空度为:-0.05兆帕,压合温度为60~80℃。
参阅图8,在一实施例中,步骤S30包括:
S31:在结合层上喷涂漆料。
S32:使结合层上的漆料流平。
S33:固化漆料形成色漆层。
其中,漆料至少包括:50~60质量份的光油(例如50质量份的光油、55质量份的光油或60质量份的光油)、15~40质量份的固化剂(例如15质量份的固化剂、30质量份的固化剂或40质量份的稀释剂)以及10~30质量份的稀释剂(例如10质量份的稀释剂、20质量份的稀释剂或30质量份的稀释剂)。
在一实施例中,上述喷涂漆料过程中的喷涂参数为:漆料的粘度为8-12帕斯卡·秒(例如8帕斯卡·秒、10帕斯卡·秒或12帕斯卡·秒),喷枪距离结合层的距离为10厘米,结合层的自转速度为10-60度/秒(例 如10度/秒、30度/秒或60度/秒),喷涂时的喷涂速度为600毫米/米,供墨气压为200帕,雾化气压为300帕,喷出气压为350帕。
上述固化漆料过程中的固化参数为:固化温度为80-90℃,固化时间为50-60分钟,厚度均匀管控为10-15微米。
在一实施例中,在提供一基材的步骤之后,该方法还包括:对基材进行切割、抛光以及清洗处理。
具体地,需要对基材进行前处理:基材放入无水乙醇中进行超声波清洗,以去除基材表面的油污渍,清洗时间为5~10分钟。进行切割,精修产品平面尺寸外形及孔、倒角,部分产品CNC后进行侧面抛光处理;使用超声波、碱性清洗剂清洗CNC油污以及冷却液;使用试模模具在高温下玻璃曲面成型,热弯过程中造成的麻点、模印等缺陷进行抛光修复,凹凸面各抛一次;超声波配合碱性清洗液清洗抛光粉;坯料制备好以后在高温下K-Na离子置换强化玻璃,然后进行清洗。玻璃厚度控制在0.05-0.55毫米厚度,待用。
本申请提供一种电子装置100,电子装置100包括装置主体101和用于对装置主体101进行保护的壳体10,壳体10为上述实施方式中的壳体10。
如图9所示,一实施方式的电子装置100为手机,在其他实施例中,电子装置100也可以为包括平板电脑、PDA(Personal Digital Assistant,个人数字助理)、POS(Point of Sales,销售终端)、穿戴式设备等任意电子类设备。电子装置100的示例包括,但不限于卫星或蜂窝电话。可以组合蜂窝无线电电话与数据处理、传真以及数据通信能力的个人通信系统(PCS)终端。可以包括无线电电话、寻呼机、因特网/内联网接入、Web浏览器、记事簿、日历以及/或全球定位系统(GPS)接收器的PDA。以及常规膝上型和/或掌上型接收器或包括无线电电话收发器的其它电子装置100。
电子装置100可以包括显示屏和壳体10,显示屏与壳体10固定连接。显示屏与壳体10可以围成用于容纳电子装置100的主板、电池等电器元件的空腔。
以上所述仅为本申请的实施方式,并非因此限制本申请的专利范 围,凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换,或直接或间接运用在其他相关的技术领域,均同理包括在本申请的专利保护范围内。

Claims (20)

  1. 一种壳体的制造方法,其中,所述方法包括以下步骤:
    提供一基材,所述基材为塑料基材、亚克力基材、玻璃基材或蓝宝石基材;
    在所述基材上形成结合层;
    在结合层上形成色漆层;
    其中,所述基材与所述结合层均为可透光材质,所述结合层中包裹有一具有预定图案的载体。
  2. 根据权利要求1所述的方法,其中,所述结合层的材料为固化的热固性树脂和/或光固性树脂,在所述基材上形成结合层的步骤之前,所述方法还包括:制备所述结合层;
    所述制备所述结合层的步骤包括:
    将具有预定图案的载体放置在热固性树脂和/或光固性树脂中;
    固化包裹有所述具有预定图案的载体的所述热固性树脂和/或光固性树脂,以形成所述结合层;
    其中,所述热固性树脂和/或光固性树脂至少包括:15~30质量份的树脂以及5~10质量份的固化剂。
  3. 根据权利要求1所述的方法,其中,所述在所述基材上形成结合层的步骤包括:
    无尘环境下,在所述基材上设置一粘接层;
    将所述结合层放置在所述粘接层上,其中,所述结合层的边缘与所述基材的边缘对齐;
    压合所述结合层与所述基材,以固定粘接所述结合层与所述基材。
  4. 根据权利要求3所述的方法,其中,
    压合参数为:压合真空度为:-0.05兆帕,压合温度为60~80℃。
  5. 根据权利要求1所述的方法,其中,所述在结合层上形成色漆层的步骤包括:
    在所述结合层上喷涂漆料;
    使所述结合层上的漆料流平;
    固化所述漆料形成所述色漆层;
    其中,所述漆料至少包括:50~60质量份的光油、15~40质量份的固化剂以及10~30质量份的稀释剂。
  6. 根据权利要求5所述的方法,其中,
    喷涂参数为:漆料的粘度为8-12帕斯卡·秒,喷枪距离所述结合层的距离为10厘米,所述结合层的自转速度为10-60度/秒,喷涂时的喷涂速度为600毫米/米,供墨气压为200帕,雾化气压为300帕,喷出气压为350帕;
    固化参数为:固化温度为80-90℃,固化时间为50-60分钟,厚度均匀管控为10-15微米。
  7. 根据权利要求1所述的方法,其中,在所述提供一基材的步骤之后,所述方法还包括:
    对所述基材进行切割、抛光以及清洗处理。
  8. 一种壳体,其中,所述壳体包括:
    基材;
    结合层,设置于所述基材上;
    色漆层,设置于所述结合层上;
    其中,所述基材与所述结合层均为可透光材质,所述结合层中包裹有一具有预定图案的载体。
  9. 根据权利要求8所述的壳体,其中,所述结合层的材料为固化的热固性树脂和/或光固性树脂,所述结合层通过固化包裹有所述具有预定图案的载体的所述热固性树脂和/或光固性树脂形成,其中,所述热固性树脂和/或光固性树脂至少包括:15~30质量份的树脂以及5~10质量份的固化剂。
  10. 根据权利要求9所述的壳体,其中,所述热固性树脂和/或光固性树脂为带颜色的热固性树脂和/或光固性树脂,其中,所述带颜色的热固性树脂和/或光固性树脂至少包括:15~30质量份的树脂、5~10质量份的固化剂、10~20质量份的纳米色浆以及10~20质量份的溶剂。
  11. 根据权利要求9所述的壳体,其中,
    所述纳米色浆为有机颜料或者无机颜料溶于溶剂后研磨分散制得,所述 有机颜料或者所述无机颜料的粒径为100纳米以下。
  12. 根据权利要求9或10任一项所述的壳体,其中,
    所述热固性树脂和/或光固性树脂为环氧树脂。
  13. 根据权利要求8所述的壳体,其中,
    所述基材为塑料基材、亚克力基材、玻璃基材或蓝宝石基材。
  14. 根据权利要求13所述的壳体,其中,
    所述塑料材料为透明的聚碳酸酯或聚甲基丙烯酸甲酯。
  15. 根据权利要求8所述的壳体,其中,
    所述载体为无纺布、丝绸、塑料薄膜、皮革、纤维织物或者金银铝箔中的至少一种。
  16. 根据权利要求8所述的壳体,其中,
    所述色漆层通过在所述结合层背向所述基材的表面上喷涂漆料形成;其中,所述漆料至少包括:50~60质量份的光油、15~40质量份的固化剂以及10~30质量份的稀释剂。
  17. 根据权利要求8所述的壳体,其中,所述基材的厚度为50~500微米,所述结合层的厚度为100~500微米,所述色漆层的厚度为8~15微米。
  18. 根据权利要求8所述的壳体,其中,所述壳体还包括:
    粘接层,设置在所述结合层与所述基材之间,以固定粘接所述结合层与所述基材。
  19. 根据权利要求8所述的壳体,其中,
    所述粘接层为OCA胶层、SGP胶层、PVB胶层、PVA胶层或EVA胶层中的至少一种。
  20. 一种电子装置,其中,所述电子装置包括装置主体和用于对所述装置主体进行保护的壳体,所述壳体为如权利要求8-19任意一项所述的壳体。
PCT/CN2020/102495 2019-07-22 2020-07-16 一种壳体、壳体的制造方法以及电子装置 WO2021013050A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910662846.4 2019-07-22
CN201910662846.4A CN112261177A (zh) 2019-07-22 2019-07-22 一种壳体、壳体的制造方法以及电子装置

Publications (1)

Publication Number Publication Date
WO2021013050A1 true WO2021013050A1 (zh) 2021-01-28

Family

ID=74193216

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/102495 WO2021013050A1 (zh) 2019-07-22 2020-07-16 一种壳体、壳体的制造方法以及电子装置

Country Status (2)

Country Link
CN (1) CN112261177A (zh)
WO (1) WO2021013050A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114126282A (zh) * 2021-11-04 2022-03-01 Oppo广东移动通信有限公司 壳体及其制作方法、电子设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5683776A (en) * 1996-09-06 1997-11-04 Kikokaseisangyou Co., Ltd. composite film for color copying
CN101686617A (zh) * 2008-09-24 2010-03-31 比亚迪股份有限公司 电子产品外壳及其制备方法和电子产品
CN101877946A (zh) * 2009-04-30 2010-11-03 比亚迪股份有限公司 一种电子产品壳体及其成型方法
CN108337842A (zh) * 2018-04-12 2018-07-27 Oppo广东移动通信有限公司 电子装置及其壳体和壳体的制造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1087858A (zh) * 1992-12-10 1994-06-15 谢钧谟 金属丝、带增强塑料多层复合材料
CN100546443C (zh) * 2002-12-27 2009-09-30 东丽株式会社 一种电子设备的壳体及其制造方法
JP4378687B2 (ja) * 2004-02-17 2009-12-09 東レ株式会社 繊維強化樹脂およびその製造方法
CN2855733Y (zh) * 2005-11-04 2007-01-10 和成欣业股份有限公司 复合材装饰面板
US8324515B2 (en) * 2007-10-16 2012-12-04 Honeywell International Inc. Housings for electronic components
CN101254654A (zh) * 2008-04-16 2008-09-03 中兴通讯股份有限公司 碳纤维材料加工工艺、移动终端外壳制造方法及移动终端
CN101640985B (zh) * 2008-07-28 2011-11-16 比亚迪股份有限公司 电子产品外壳及其制备方法和电子产品
CN101662898B (zh) * 2008-08-28 2011-05-18 比亚迪股份有限公司 电子产品外壳及其制备方法和电子产品
KR20120088496A (ko) * 2011-01-31 2012-08-08 이와오 히시다 전자기기용 통체 및 그 제조방법, 및 전자기기
CN103978627B (zh) * 2014-06-03 2017-04-19 联想(北京)有限公司 一种外观件的注塑方法
KR20170011325A (ko) * 2015-07-22 2017-02-02 서울과학기술대학교 산학협력단 휘어지는 판자개
CN205705586U (zh) * 2016-04-11 2016-11-23 广东欧珀移动通信有限公司 透明片材以及电子设备
CN107187079A (zh) * 2017-05-18 2017-09-22 宁波市益普乐模塑有限公司 飞机机盖壳的成型方法
CN107745532A (zh) * 2017-10-31 2018-03-02 深圳市惠程电气股份有限公司 一种外壳的rtm生产方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5683776A (en) * 1996-09-06 1997-11-04 Kikokaseisangyou Co., Ltd. composite film for color copying
CN101686617A (zh) * 2008-09-24 2010-03-31 比亚迪股份有限公司 电子产品外壳及其制备方法和电子产品
CN101877946A (zh) * 2009-04-30 2010-11-03 比亚迪股份有限公司 一种电子产品壳体及其成型方法
CN108337842A (zh) * 2018-04-12 2018-07-27 Oppo广东移动通信有限公司 电子装置及其壳体和壳体的制造方法

Also Published As

Publication number Publication date
CN112261177A (zh) 2021-01-22

Similar Documents

Publication Publication Date Title
CN111614816B (zh) 壳体、壳体的制备方法及电子设备
CN201243414Y (zh) 一种外壳及使用该外壳的电子产品
CN215397458U (zh) 一种电子产品外壳
CN111901996B (zh) 壳体组件及其制备方法、电子设备
WO2022022156A1 (zh) 电子设备的壳体及其制作方法、电子设备
CN207875019U (zh) 一种适合高水滴角手机玻璃屏幕防护用的曲面保护贴
WO2021013050A1 (zh) 一种壳体、壳体的制造方法以及电子装置
CN105227705A (zh) 壳体组件成型工艺
CN111314509A (zh) 一种玻璃后盖的制作方法、玻璃后盖及移动终端
CN110406007A (zh) 一种曲面光学塑料耳机壳的制备方法
CN110381687A (zh) 装饰膜片及壳体组件和电子设备
CN111935346A (zh) 电子设备的壳体及其制造方法、电子设备
CN110895426A (zh) 一种3d玻璃盖板及其制作方法
CN206501529U (zh) 一种保护膜
CN110154473A (zh) 壳体及其制作方法和电子设备
CN102816993A (zh) 一种手机和真空镀膜制作方法
CN206510548U (zh) 光学级pe保护膜
CN109471208B (zh) 一种光学薄膜、模具及电子设备盖板
CN112117340A (zh) 一种太阳能组件制备方法
CN214646558U (zh) 一种具有pet黑膜的3d手机后盖
WO2019062800A1 (zh) 玻璃基板的制备方法、玻璃基板及智能移动终端
CN205467749U (zh) 一种玻璃微珠薄膜及使用该薄膜的电子产品外壳
CN113858760A (zh) 一种液晶板材手机背板生产工艺
CN102642357A (zh) 一种多膜层光学板的制备方法及一种多膜层光学板
CN206544356U (zh) 一种黑白遮光膜

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20845116

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20845116

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 20845116

Country of ref document: EP

Kind code of ref document: A1