WO2020262433A1 - 酸化物焼結体 - Google Patents

酸化物焼結体 Download PDF

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Publication number
WO2020262433A1
WO2020262433A1 PCT/JP2020/024740 JP2020024740W WO2020262433A1 WO 2020262433 A1 WO2020262433 A1 WO 2020262433A1 JP 2020024740 W JP2020024740 W JP 2020024740W WO 2020262433 A1 WO2020262433 A1 WO 2020262433A1
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Prior art keywords
sintered body
oxide sintered
atomic ratio
less
body according
Prior art date
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PCT/JP2020/024740
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English (en)
French (fr)
Inventor
重和 笘井
義弘 上岡
聡 勝又
佐々木 健一
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出光興産株式会社
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Application filed by 出光興産株式会社 filed Critical 出光興産株式会社
Priority to CN202410029992.4A priority Critical patent/CN117819960A/zh
Priority to JP2021527672A priority patent/JPWO2020262433A1/ja
Priority to EP20832252.9A priority patent/EP3992168A4/en
Priority to CN202080046931.9A priority patent/CN114008000B/zh
Priority to KR1020217037942A priority patent/KR20220023824A/ko
Priority to US17/622,391 priority patent/US20220356118A1/en
Publication of WO2020262433A1 publication Critical patent/WO2020262433A1/ja

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    • C04B2235/80Phases present in the sintered or melt-cast ceramic products other than the main phase

Definitions

  • the present invention relates to an oxide sintered body and a film-forming material used for forming a thin film.
  • the MgO—ZnO-based oxide has application examples to translucent ceramics for color liquid crystal projectors (Patent Document 1), oxide semiconductors (Patent Document 2), transparent electrodes (Patent Document 3), and the like.
  • a sintered body composed of the following particles (a) having a hexagonal wurtz type structure and particles (b) containing aluminum and having a spinel structure having an average particle size of 5 ⁇ m or less is disclosed.
  • the sintered body is a material that emphasizes conductivity, but since it contains ZnO as a main component, there is a problem in translucency in the ultraviolet region.
  • One of the objects of the present invention is to provide an oxide sintered body capable of obtaining a film having high translucency in the ultraviolet region and high conductivity.
  • the inventors have formed a film using an oxide sintered body in which a positive trivalent or positive tetravalent metal element is added to a Mg and Zn-based oxide at a specific concentration to allow transparency in the ultraviolet region. It has been found that a film having high photophilicity and good conductivity can be obtained.
  • the following oxide sintered bodies and the like are provided.
  • Zinc, magnesium, positive trivalent or positive tetravalent metal element X, and oxygen are contained as constituent elements, and the atomic ratio of the metal element X to the total of the zinc, the magnesium, and the metal element X [X].
  • / (Zn + Mg + X)] is 0.0001 or more and 0.6 or less, and the atomic ratio [Mg / (Zn + Mg)] of the magnesium to the total of the zinc and the magnesium is 0.25 or more and 0.8 or less.
  • Material sintered body 2.
  • the oxide sintered body according to 1, wherein the atomic ratio [Mg / (Zn + Mg)] is 0.625 or more and 0.8 or less. 3.
  • an oxide sintered body capable of obtaining a film having high translucency in the ultraviolet region and high conductivity.
  • the oxide sintered body according to the embodiment of the present invention comprises zinc (Zn), magnesium (Mg), a positive trivalent or positive tetravalent metal element (X), and oxygen (O). Included as an element.
  • the atomic ratio [X / (Zn + Mg + X)] is 0.0001 or more and 0.6 or less, and the atomic ratio [Mg / (Zn + Mg)] is 0.25 or more and 0.8 or less.
  • examples of the positive trivalent or positive tetravalent metal element X include Al, Ga, In, Sc, and Y. It is preferably Al and / or Ga, and more preferably Al.
  • Al the relative density of the oxide sintered body becomes high.
  • a high relative density means that there are few voids that can cause abnormal discharge during film formation and start points for nodule generation. Therefore, for example, when an oxide sintered body is used as a sputtering target, cracks during sputtering, etc. Is less likely to occur, and stable sputtering is possible.
  • the atomic ratio [X / (Zn + Mg + X)] is 0.0001 or more and 0.6 or less. By satisfying the above range, an oxide sintered body capable of forming a film having both translucency in the ultraviolet region and conductivity is obtained.
  • the atomic ratio [X / (Zn + Mg + X)] may be 0.006 or more, 0.007 or more, 0.008 or more, or 0.01 or more. .. Further, the atomic ratio [X / (Zn + Mg + X)] may be 0.5 or less, 0.2 or less, or 0.1 or less.
  • Atomic ratio [Mg / (Zn + Mg)] is 0.25 or more and 0.8 or less. By satisfying the above range, an oxide sintered body capable of forming a film having both translucency in the ultraviolet region and conductivity is obtained. If the atomic ratio exceeds 0.8, a highly conductive film cannot be obtained even if the film obtained from the oxide sintered body is annealed. On the other hand, if it is less than 0.25, the ultraviolet transmittance of the film becomes low.
  • the atomic ratio [Mg / (Zn + Mg)] is 0.625 or more and 0.8 or less. By satisfying the above range, an oxide sintered body can be obtained, which can obtain a film having excellent translucency mainly in the ultraviolet region.
  • the atomic ratio [Mg / (Zn + Mg)] may be 0.626 or more, or 0.628 or more. Further, the atomic ratio [Mg / (Zn + Mg)] may be 0.75 or less, 0.70 or less, or 0.67 or less.
  • the atomic ratio [Mg / (Zn + Mg)] is 0.25 or more and less than 0.625. By satisfying the above range, an oxide sintered body is obtained, which mainly provides a film having excellent conductivity.
  • the atomic ratio [Mg / (Zn + Mg)] may be 0.30 or more, or 0.40 or more. Further, the atomic ratio [Mg / (Zn + Mg)] may be 0.60 or less, or 0.55 or less.
  • the atomic ratio of zinc, magnesium and the metal element X can be controlled by adjusting the atomic ratio of the starting material.
  • the ratio of zinc is higher than the atomic ratio of the starting material, and the atomic ratio of the metal element X tends to be almost the same.
  • the atomic ratio of each element contained in the oxide sintered body can be obtained by analyzing the contained element with an inductively coupled plasma emission spectrometer (ICP-AES). Specifically, when the solution sample is atomized with a nebulizer and introduced into argon plasma (about 5000 to 8000 ° C), the elements in the sample are excited by absorbing thermal energy, and the orbital electrons are high energy levels from the ground state. After moving to the orbit of the higher energy level, it moves to the orbit of the lower energy level. At this time, the difference in energy is radiated as light to emit light. Since this light shows the wavelength (spectral line) peculiar to the element, the existence of the element can be confirmed by the presence or absence of the spectral line (qualitative analysis).
  • ICP-AES inductively coupled plasma emission spectrometer
  • the sample concentration can be obtained by comparing with a standard solution having a known concentration (quantitative analysis). After identifying the elements contained in the qualitative analysis, the content is determined by the quantitative analysis, and the atomic ratio of each element is determined from the result.
  • the constituent elements of the oxide sintered body of the present embodiment may essentially consist of Mg, Zn, metal elements X and O (consisting essentially of).
  • 70 mol% or more, 80 mol% or more, or 90 mol% or more of the constituent elements of the oxide sintered body of the present embodiment may be Mg, Zn, metal elements X and O.
  • the constituent elements of the oxide sintered body of the present embodiment may consist only of Mg, Zn, metal elements X and O (consisting of). In this case, unavoidable impurities may be contained.
  • the oxide sintered body is a cubic MgO in which Zn is solid-solved and MgX 2 O 4 (X) in which Zn is solid-solved. Is a positive trivalent metal element.).
  • the oxide sintered body contains cubic MgO in which Zn is solid-solved, hexagonal ZnO in which Mg is dissolved, and It contains Mg X 2 O 4 in which Zn is dissolved (where X is a positive trivalent metal element). This makes it possible to obtain a high-density sintered body even if it is a relatively light metal oxide.
  • each of the above oxides in the oxide sintered body is to collate the XRD chart obtained by the X-ray diffraction (XRD) method with the database (PDF: Power Diffraction File) of the ICDD (International Center for Diffraction Data). Can be confirmed by. Further, it can be determined that each crystal has a solid solution of other metal elements by comparing the lattice constant (actual measurement value) obtained by XRD and the lattice constant (PDF value) described in PDF. For example, in the case of a crystal in which Zn is solid-solved, the measured value becomes larger than the PDF value.
  • XRD X-ray diffraction
  • the oxide sintered body of the present embodiment can be produced, for example, by a step of mixing raw material powders to prepare a mixed powder, a step of molding the mixed powder into a molded body, and a step of firing the molded body.
  • a powder of a compound containing Mg a powder of a compound containing Zn, and a powder of a compound containing a metal element X can be used.
  • the compound is preferably an oxide.
  • MgO, ZnO, Al 2 O 3 , and Ga 2 O 3 can be mentioned.
  • the mixing ratio of the raw material powder can be prepared, for example, in consideration of the atomic ratio of the oxide sintered body to be obtained.
  • the average particle size of the raw material powder is preferably 0.1 to 1.2 ⁇ m, more preferably 0.5 to 1.0 ⁇ m.
  • the average particle size of the raw material powder can be measured with a laser diffraction type particle size distribution device or the like.
  • the method of mixing and molding the raw materials is not particularly limited, and a known method can be adopted. Moreover, you may add a binder at the time of mixing.
  • the raw materials can be mixed by using a known device such as a ball mill, a bead mill, a jet mill or an ultrasonic device.
  • the mixing time may be adjusted as appropriate, but is preferably about 6 to 100 hours.
  • the mixed powder can be pressure-molded to form a molded body. By this step, it can be molded into the shape of the product (for example, a shape suitable as a sputtering target).
  • a molded product can be obtained by filling a mold with the mixed powder and pressurizing it with a mold press or a cold hydrostatic press (CIP), for example, at 1000 kg / cm 2 or more.
  • a molding aid such as polyvinyl alcohol, polyethylene glycol, methyl cellulose, polywax, oleic acid, or stearic acid may be used.
  • the obtained molded body can be heated at a temperature of, for example, 1200 to 1650 ° C. for 2 hours or more to obtain an oxide sintered body.
  • the heating temperature is preferably 1350 to 1600 ° C, more preferably 1400 to 1600 ° C, and even more preferably 1450 to 1500 ° C.
  • the heating time is preferably 2 to 72 hours, more preferably 3 to 48 hours, still more preferably 4 to 24 hours.
  • the molded body is usually heated in an air atmosphere or an oxygen gas atmosphere.
  • the oxygen gas atmosphere is preferably an atmosphere having an oxygen concentration of, for example, 10 to 50% by volume.
  • the oxide sintered body of the present embodiment is used as a film forming material for forming a thin film having the composition of the oxide sintered body, for example, when forming a film by a vacuum vapor deposition method or an ion plating method. It can be suitably used as a tablet and a sputtering target.
  • the thin film obtained from the film-forming material of the present embodiment can be used as a transparent conductive film used for an electrode substrate such as an ultraviolet light emitting diode and an ultraviolet light emitting laser diode.
  • the ultraviolet transmittance and conductivity of the film are improved.
  • the film is in a state where zinc oxide, magnesium oxide and the like are uniformly mixed.
  • oxide aggregation, separation, etc. occur, and as a result, zinc oxide forms a network to develop conductivity, while magnesium in the gaps between the zinc oxide networks. It is presumed that ultraviolet rays are transmitted by the aggregation of oxides.
  • the heat treatment temperature of the electrode layer is preferably 750 ° C. or higher, more preferably 900 ° C. or higher.
  • the tablet can be produced, for example, by cutting or polishing an oxide sintered body obtained by molding a raw material into a desired shape and firing it.
  • the sputtering target can be produced, for example, by cutting or polishing an oxide sintered body and bonding it to a backing plate.
  • the uneven surface can be removed by cutting. It can also be made to a specified size.
  • the surface may be polished with # 200, # 400, or even # 800. As a result, it is possible to suppress abnormal discharge and generation of particles during sputtering.
  • a sputtering target can be obtained by cleaning the polished oxide sintered body as necessary, applying a bonding material such as metal indium solder to the bonding surface, and bonding with the backing plate.
  • Example 1 (A) Preparation of oxide sintered body Zinc oxide (ZnO) powder having an average grain diameter of 1 ⁇ m or less, magnesium oxide (MgO) powder having an average grain diameter of 1 ⁇ m or less, and gallium oxide (Ga) having an average particle diameter of 1 ⁇ m or less. 2 O 3 powder) was weighed and mixed so that the atomic ratio of each metal became the value shown in Table 1. The mass fraction of the mixed powder is 43.9% by mass for ZnO, 40.8% by mass for MgO, and 15.3% by mass for Ga 2 O 3 . After putting the mixed powder in a resin pot, water was added, and the mixture was mixed in a wet ball mill for 20 hours using a hard ZrO 2 ball as a pulverizing medium. The resulting mixed slurry was taken out, filtered, dried and granulated. The obtained granules were placed in a mold and pressed to 3 ton / cm 2 with a cold hydrostatic press for molding.
  • ZnO Zinc
  • the obtained molded body was placed in a sintering furnace, and the molded body was fired while inflowing oxygen at a ratio of 5 L / min per 0.1 m 3 of the furnace volume.
  • the temperature in the sintering furnace was raised at 1 ° C./min from room temperature to 1000 ° C., raised at 3 ° C./min from 1000 ° C. to 1470 ° C., and fired at 1470 ° C. for 5 hours.
  • the inflow of oxygen was stopped, and the temperature inside the furnace was lowered from 1470 ° C. to 1300 ° C. at 10 ° C./min.
  • while flowing Ar at a rate of furnace capacity 0.1 m 3 per 10L / min and held for 3 hours in the furnace temperature at 1300 ° C.. Then, it was allowed to cool to obtain an oxide sintered body.
  • the evaluation method is as follows. (1) Atomic Ratio of Metal Elements in Oxide Sintered A part of the obtained oxide sintered body was cut out, dissolved in an acid, and then analyzed by an inductively coupled plasma emission spectrometer. (2) Relative density The relative density was calculated by measuring the actual density of the oxide sintered body by the Archimedes method using water and dividing by the theoretical density calculated from the composition. The theoretical density was calculated from the mass fractions of MgO crystals without oxygen defects, Zn oxides, and oxides of X (Ga or Al).
  • the crystal structure and lattice constant contained in the oxide sintered body were determined by analyzing the results of the XRD measurement with integrated powder X-ray analysis software (PDXL2, manufactured by Rigaku Co., Ltd.). The crystal structure was confirmed with the following ICDD (PDF) card.
  • ZnO: 01-079-0205 (hexagonal crystal)
  • ZnO: 01-077-0191 (cubic crystal)
  • MgO: 01-071-1176 cubic crystal)
  • MgAl 2 O 4 01-084-0377 MgGa 2 O 4 : 01-073-1721
  • the measured value was 8.3116 and the PDF value was 8.26. From this result, it was confirmed that the difference between the lattice constants a of MgO and MgGa 2 O 4 was large, and it was determined that Zn was solid-solved in these crystals. When the lattice constant changed by 0.01 or more, it was determined that the solid solution was formed.
  • Table 3 In the table, the case of including is marked with ⁇ , and the case of not including is marked with x.
  • a thin film was actually formed and evaluated using a sputtering target prepared from an oxide sintered body.
  • the film forming conditions were as follows.
  • the sapphire substrate (thickness 0.5 mm) was placed in an ultrasonic cleaner and washed with trichlorethylene for 5 minutes, acetone for 5 minutes, methanol for 5 minutes, and finally distilled water for 5 minutes.
  • This substrate was set in a sputtering apparatus (manufactured by ULVAC: ACS-4000), Ar was used as a sputtering gas, and a film was formed at 25 ° C. to form a film having a thickness of 100 nm on the substrate.
  • Examples 2 to 6, Comparative Example 1 The raw materials were weighed and mixed so that the atomic ratio of each metal element became the value shown in Table 1, and an oxide sintered body and a sputtering target were prepared and evaluated in the same manner as in Example 1. The results are shown in Tables 2-4.
  • the metal element X was Al
  • aluminum oxide (Al 2 O 3 powder) having an average particle size of 1 ⁇ m or less was used.
  • FIG. 2 shows the analysis results of the XRD chart of the oxide sintered body of Example 2.
  • FIG. 3 shows the analysis results of the XRD chart of the oxide sintered body of Comparative Example 1.
  • Example 7 (A) Preparation of oxide sintered body Zinc oxide (ZnO) powder having an average grain diameter of 1 ⁇ m or less, magnesium oxide (MgO) powder having an average grain diameter of 1 ⁇ m or less, and gallium oxide (Ga) having an average particle diameter of 1 ⁇ m or less. 2 O 3 powder) was weighed and mixed so that the atomic ratio of each metal became the value shown in Table 5. The mass fraction of the mixed powder is 48.9% by mass for ZnO, 36.3% by mass for MgO, and 14.8% by mass for Ga 2 O 3 . After putting the mixed powder in a resin pot, water was added, and the mixture was mixed in a wet ball mill for 20 hours using a hard ZrO 2 ball as a pulverizing medium. The resulting mixed slurry was taken out, filtered, dried and granulated. The obtained granules were placed in a mold and pressed to 3 ton / cm 2 with a cold hydrostatic press for molding.
  • ZnO Zinc
  • the obtained molded body was placed in a sintering furnace, and the molded body was fired while inflowing oxygen at a ratio of 5 L / min per 0.1 m 3 of the furnace volume.
  • the temperature in the sintering furnace was raised at 1 ° C./min from room temperature to 1000 ° C., raised at 3 ° C./min from 1000 ° C. to 1470 ° C., and fired at 1470 ° C. for 5 hours.
  • the inflow of oxygen was stopped, and the temperature inside the furnace was lowered from 1470 ° C. to 1300 ° C. at 10 ° C./min.
  • while flowing Ar at a rate of furnace capacity 0.1 m 3 per 10L / min and held for 3 hours in the furnace temperature at 1300 ° C.. Then, it was allowed to cool to obtain an oxide sintered body.
  • composition and relative density of the obtained oxide sintered body were evaluated in the same manner as in Example 1. The results are shown in Table 6.
  • ZnO hexagonal crystal
  • MgGa 2 O 4 Ga 2 O 3
  • the measured value was 4.2307 and the PDF value was 4.217.
  • the measured value was 3.2482 and the PDF value was 3.242.
  • the lattice constant a of MgGa 2 O 4 the measured value was 8.3121 and the PDF value was 8.26. Since the lattice constant has changed in this way, it was determined that Mg was dissolved in ZnO and Zn was dissolved in MgO and MgGa 2 O 4 .
  • the results are shown in Table 7. In the table, the case of including is marked with ⁇ , and the case of not including is marked with x.
  • Examples 8 to 13, Comparative Example 2 The raw materials were weighed and mixed so that the atomic ratio of each metal element became the value shown in Table 5, and an oxide sintered body and a sputtering target were prepared and evaluated in the same manner as in Example 7. The results are shown in Tables 6-8.
  • the metal element X was Al
  • aluminum oxide (Al 2 O 3 powder) having an average particle size of 1 ⁇ m or less was used.
  • FIG. 5 shows the analysis results of the XRD chart of the oxide sintered body of Example 8.
  • FIG. 6 shows the analysis results of the XRD chart of the oxide sintered body of Comparative Example 2.

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Abstract

亜鉛と、マグネシウムと、正3価又は正4価の金属元素Xと、酸素とを、構成元素として含み、亜鉛、マグネシウム及び金属元素Xの合計に対する金属元素Xの原子比[X/(Zn+Mg+X)]が0.0001以上0.6以下であり、亜鉛及びマグネシウムの合計に対するマグネシウムの原子比[Mg/(Zn+Mg)]が0.25以上0.8以下である、酸化物焼結体。

Description

酸化物焼結体
 本発明は、酸化物焼結体、及び薄膜の形成に用いる成膜用材料に関する。
 MgO-ZnO系酸化物は、カラー液晶プロジェクター用透光性セラミックス(特許文献1)、酸化物半導体(特許文献2)、透明電極(特許文献3)等への応用例がある。例えば、特許文献3は原子比が、Al/(Zn+Al+Mg)=0.005~0.1、Mg/(Zn+Al+Mg)=0.001~0.05であり、酸化亜鉛を含有し平均粒径が10μm以下の六方晶系ウルツ型構造を有する粒子(a)と、アルミニウムを含有し平均粒径が5μm以下のスピネル構造を有する粒子(b)からなる焼結体を開示している。
 上記焼結体は、導電性を重視した材料であるが、ZnOを主成分とするため、紫外線領域の透光性に課題があった。
特開2009-184898号公報 特開2012-066968号公報 特開2011-063866号公報
 本発明の目的の1つは、紫外線領域の透光性が高く、かつ、導電性も高い膜を得ることが可能な酸化物焼結体を提供することである。
 発明者らは、Mg及びZn系の酸化物に、正3価又は正4価の金属元素を特定の濃度で添加した酸化物焼結体を使用して成膜することにより、紫外線領域の透光性が高く、かつ、導電性も良好な膜が得られることを見出した。
 本発明によれば、以下の酸化物焼結体等が提供される。
1.亜鉛と、マグネシウムと、正3価又は正4価の金属元素Xと、酸素とを、構成元素として含み、前記亜鉛、前記マグネシウム及び前記金属元素Xの合計に対する前記金属元素Xの原子比[X/(Zn+Mg+X)]が0.0001以上0.6以下であり、前記亜鉛及び前記マグネシウムの合計に対する前記マグネシウムの原子比[Mg/(Zn+Mg)]が0.25以上0.8以下である、酸化物焼結体。
2.前記原子比[Mg/(Zn+Mg)]が0.625以上0.8以下である、1に記載の酸化物焼結体。
3.前記原子比[Mg/(Zn+Mg)]が0.626以上0.75以下である、1に記載の酸化物焼結体。
4.前記原子比[Mg/(Zn+Mg)]が0.628以上0.74以下である、1に記載の酸化物焼結体。
5.Znを固溶した立方晶のMgO、及びZnを固溶したMgX(Xは正3価の金属元素である。)を含む、2~4のいずれかに記載の酸化物焼結体。
6.前記原子比[Mg/(Zn+Mg)]が0.25以上0.625未満である、1に記載の酸化物焼結体。
7.前記原子比[Mg/(Zn+Mg)]が0.30以上0.60以下である、1に記載の酸化物焼結体。
8.前記原子比[Mg/(Zn+Mg)]が0.40以上0.59以下である、1に記載の酸化物焼結体。
9.Znを固溶した立方晶のMgO、Mgを固溶した六方晶のZnO及びZnを固溶したMgX(ここでXは正3価の金属元素である。)を含む、6~8のいずれかに記載の酸化物焼結体。
10.前記原子比[X/(Zn+Mg+X)]が0.003以上0.6以下である、1~9のいずれかに記載の酸化物焼結体。
11.前記原子比[X/(Zn+Mg+X)]が0.007以上0.5以下である、1~9のいずれかに記載の酸化物焼結体。
12.前記原子比[X/(Zn+Mg+X)]が0.008以上0.5以下である、1~9のいずれかに記載の酸化物焼結体。
13.前記原子比[X/(Zn+Mg+X)]が0.01以上0.5以下である、1~9のいずれかに記載の酸化物焼結体。
14.前記XがAl及びGaの少なくとも一方である、1~13のいずれかに記載の酸化物焼結体。
15.前記XがAlである、14に記載の酸化物焼結体。
16.前記XがGaである、14に記載の酸化物焼結体。
17.1~16のいずれかに記載の酸化物焼結体を含む、成膜用材料。
18.成膜用タブレットである、17に記載の成膜用材料。
19.スパッタリングターゲットである、17に記載の成膜用材料。
20.17~19のいずれかに記載の成膜用材料を使用して得られる薄膜。
 本発明によれば、紫外線領域の透光性が高く、かつ、導電性も高い膜を得ることが可能な酸化物焼結体を提供することができる。
実施例1の酸化物焼結体のXRDチャートの解析結果を示す図である。 実施例2の酸化物焼結体のXRDチャートの解析結果を示す図である。 比較例1の酸化物焼結体のXRDチャートの解析結果を示す図である。 実施例7の酸化物焼結体のXRDチャートの解析結果を示す図である。 実施例8の酸化物焼結体のXRDチャートの解析結果を示す図である。 比較例2の酸化物焼結体のXRDチャートの解析結果を示す図である。
 本発明の一実施形態に係る酸化物焼結体は、亜鉛(Zn)と、マグネシウム(Mg)と、正3価又は正4価の金属元素(X)と、酸素(O)とを、構成元素として含む。そして、原子比[X/(Zn+Mg+X)]が0.0001以上0.6以下であり、原子比[Mg/(Zn+Mg)]が0.25以上0.8以下である。
 本実施形態において、正3価又は正4価の金属元素Xとしては、Al、Ga、In、Sc、Yが挙げられる。好ましくは、Al及び/又はGaであり、より好ましくはAlである。Alを含むことにより、酸化物焼結体の相対密度が高くなる。相対密度が高いことは、成膜時の異常放電の原因やノジュール発生の起点となりうる空隙が少ないことを意味するため、例えば、酸化物焼結体をスパッタリングターゲットとした場合、スパッタリング時の割れ等の発生が少なく、安定したスパッタリングが可能となる。
 原子比[X/(Zn+Mg+X)]が0.0001以上0.6以下である。該範囲を満たすことにより、紫外線領域の透光性と、導電性を両立する膜を形成できる酸化物焼結体となる。
 原子比[X/(Zn+Mg+X)]は、0.006以上であってもよく、0.007超であってもよく、0.008以上であってもよく、0.01以上であってもよい。また、原子比[X/(Zn+Mg+X)]は、0.5以下であってもよく、0.2以下であってもよく、0.1以下であってもよい。
 原子比[Mg/(Zn+Mg)]は0.25以上0.8以下である。該範囲を満たすことにより、紫外線領域の透光性と、導電性を両立する膜を形成できる酸化物焼結体となる。なお、原子比が0.8を超える場合、酸化物焼結体から得られる膜をアニールしても、導電性の高い膜を得ることができない。一方、0.25未満の場合、膜の紫外線透過率が低くなる。
 一実施形態において、原子比[Mg/(Zn+Mg)]が0.625以上0.8以下である。該範囲を満たすことにより、主に紫外線領域の透光性に優れる膜が得られる酸化物焼結体となる。
 原子比[Mg/(Zn+Mg)]は、0.626以上であってもよく、0.628以上であってもよい。また、原子比[Mg/(Zn+Mg)]は、0.75以下であってもよく、0.70以下であってもよく、0.67以下であってもよい。
 一実施形態において、原子比[Mg/(Zn+Mg)]が0.25以上0.625未満である。該範囲を満たすことにより、主に導電性に優れる膜が得られる酸化物焼結体となる。
 原子比[Mg/(Zn+Mg)]は、0.30以上であってもよく、0.40以上であってもよい。また、原子比[Mg/(Zn+Mg)]は、0.60以下であってもよく、0.55以下であってもよい。
 亜鉛、マグネシウム及び金属元素Xの原子比は、出発原料の原子比を調製することにより制御できる。酸化物焼結体の原子比は、出発原料の原子比と比べ、亜鉛の比率が高くなり、金属元素Xの原子比は、ほぼ同じになる傾向がある。
 酸化物焼結体に含まれる各元素の原子比は、誘導結合プラズマ発光分析装置(ICP-AES)により、含有元素を分析して求めることができる。具体的に、溶液試料をネブライザーで霧状にして、アルゴンプラズマ(約5000~8000℃)に導入すると、試料中の元素は熱エネルギーを吸収して励起され、軌道電子が基底状態から高いエネルギー準位の軌道に移った後、より低いエネルギー準位の軌道に移る。この際にエネルギーの差を光として放射し発光する。この光は元素固有の波長(スペクトル線)を示すため、スペクトル線の有無により元素の存在を確認できる(定性分析)。また、スペクトル線の大きさ(発光強度)は試料中の元素数に比例するため、既知濃度の標準液と比較することで試料濃度を求めることができる(定量分析)。定性分析で含有されている元素を特定後、定量分析で含有量を求め、その結果から各元素の原子比を求める。
 本実施形態の酸化物焼結体の構成元素は、本質的に、Mg、Zn、金属元素X及びOからなってもよい(consisting essentially of)。本実施形態の酸化物焼結体の構成元素の、例えば、70mol%以上、80mol%以上、又は90mol%以上が、Mg、Zn、金属元素X及びOであってもよい。また、本実施形態の酸化物焼結体の構成元素は、Mg、Zn、金属元素X及びOのみからなってもよい(consisting of)。この場合、不可避不純物を含んでもよい。
 原子比[Mg/(Zn+Mg)]が0.625以上0.8以下である場合、酸化物焼結体はZnを固溶した立方晶のMgO、及びZnを固溶したMgX(Xは正3価の金属元素である。)を含む。また、原子比[Mg/(Zn+Mg)]が0.25以上0.625未満である場合、酸化物焼結体はZnを固溶した立方晶のMgO、Mgを固溶した六方晶のZnO及びZnを固溶したMgX(ここでXは正3価の金属元素である。)を含む。これにより、比較的軽金属の酸化物であっても高密度の焼結体を得ることが可能となる。
 酸化物焼結体が上記の各酸化物を含むことは、X線回折(XRD)法により得られるXRDチャートと、ICDD(国際回折データセンター)のデータベース(PDF:Powder Diffraction File)を照合することにより確認できる。また、各結晶が他の金属元素を固溶していることは、XRDにより求めた格子定数(実測値)とPDFに記載されている格子定数(PDF値)を比較することにより判断できる。例えば、Znを固溶している結晶の場合、実測値がPDF値よりも大きくなる。
 本実施形態の酸化物焼結体は、例えば、原料粉末を混合して、混合粉末を調製する工程、混合粉末を成型して成型体とする工程、及び成型体を焼成する工程により製造できる。
 出発原料としては、Mgを含む化合物の粉末、Znを含む化合物の粉末、及び金属元素Xを含む化合物の粉末が使用できる。化合物は、好ましくは酸化物である。例えば、MgO、ZnO、Al、Gaが挙げられる。
 原料粉末の混合比は、例えば、得ようとする酸化物焼結体の原子比を考慮して調製することができる。
 原料粉末の平均粒径は、好ましくは0.1~1.2μmであり、より好ましくは0.5~1.0μmである。原料粉末の平均粒径はレーザー回折式粒度分布装置等で測定することができる。
 原料の混合、成型方法は特に限定されず、公知の方法が採用できる。また、混合する際にはバインダーを添加してもよい。
 原料の混合は、例えば、ボールミル、ビーズミル、ジェットミル又は超音波装置等の公知の装置を用いて行うことができる。混合時間は、適宜調整すればよいが、6~100時間程度が好ましい。
 成型方法は、例えば、混合粉末を加圧成型して成型体とすることができる。この工程により、製品の形状(例えば、スパッタリングターゲットとして好適な形状)に成型することができる。
 混合粉末を型に充填し、通常、金型プレス又は冷間静水圧プレス(CIP)により、例えば1000kg/cm以上で加圧することにより、成型体を得ることができる。
 なお、成型時には、ポリビニルアルコール、ポリエチレングリコール、メチルセルロース、ポリワックス、オレイン酸、ステアリン酸等の成型助剤を用いてもよい。
 得られた成型体を、例えば1200~1650℃の温度で2時間以上加熱して酸化物焼結体を得ることができる。
 加熱温度は、好ましくは1350~1600℃、より好ましくは1400~1600℃、さらに好ましくは1450~1500℃である。加熱時間は好ましくは2~72時間、より好ましくは3~48時間、さらに好ましくは4~24時間である。
 焼成は、通常、成型体を大気雰囲気、又は酸素ガス雰囲気にて加熱する。酸素ガス雰囲気は、酸素濃度が、例えば10~50体積%の雰囲気であることが好ましい。
 本実施形態の酸化物焼結体は、酸化物焼結体の組成を有する薄膜を形成するための成膜用材料、例えば、真空蒸着法やイオンプレーティング法で成膜する際に使用されるタブレット、スパッタリングターゲットとして、好適に使用できる。本実施形態の成膜用材料から得られる薄膜は、紫外発光ダイオード、紫外発光レーザーダイオード等の電極基板に用いられる透明導電膜として使用できる。
 なお、成膜後に膜を高温で熱処理することにより、膜の紫外線透過率及び導電性が向上する。成膜直後の膜は、亜鉛酸化物とマグネシウム酸化物等が均一に混合した状態である。該状態の膜を熱処理することにより、酸化物の凝集、分離等が生じ、結果として亜鉛酸化物がネットワークを形成することで導電性が発現し、一方で、亜鉛酸化物のネットワークの間隙にマグネシウム酸化物が凝集することで、紫外線が透過するものと推定する。
 電極層の熱処理温度は、750℃以上が好ましく、900℃以上がより好ましい。
 タブレットは、例えば、原料を所望の形状に成型し焼成して得られた酸化物焼結体を切削又は研磨加工することにより作製することができる。スパッタリングターゲットは、例えば、酸化物焼結体を切削又は研磨加工し、バッキングプレートにボンディングすることにより作製することができる。
 切削加工することで凸凹した面を除くことができる。また、指定の大きさにすることができる。表面を#200番、もしくは#400番、さらには#800番の研磨を行ってもよい。これにより、スパッタリング中の異常放電やパーティクルの発生を抑えることができる。
 研磨した酸化物焼結体を、必要に応じて洗浄した後、接合面に金属インジウム半田等の接合材料を塗布し、バッキングプレートと接合することにより、スパッタリングターゲットを得ることができる。
実施例1
(A)酸化物焼結体の作製
 平均粒経が1μm以下の酸化亜鉛(ZnO)粉末、及び平均粒経が1μm以下の酸化マグネシウム(MgO)粉末、平均粒径が1μm以下の酸化ガリウム(Ga粉末)を、各金属の原子比が表1に示す値となるように秤量し、混合した。なお、混合粉末の質量分率は、ZnOが43.9質量%、MgOが40.8質量%、Gaが15.3質量%である。
 混合粉末を樹脂製ポットに入れた後、水を加え、粉砕メディアとして硬質ZrOボールを用いて、湿式ボールミルにて20時間混合した。得られた混合スラリーを取り出し、濾過、乾燥及び造粒した。得られた造粒物を型に入れ、冷間静水圧プレスで3ton/cmに加圧して成型した。
 得られた成型体を焼結炉内に載置し、炉内容積0.1m当たり5L/分の割合で酸素を流入しながら、成型体を焼成した。
 焼結炉内の温度を、室温から1000℃までは1℃/分で昇温し、1000℃から1470℃までは3℃/分で昇温し、1470℃で5時間焼成した。その後、酸素の流入を止め、炉内温度を1470℃から1300℃まで10℃/分で降温した。次いで、炉内容積0.1m当たり10L/分の割合でArを流入しながら、炉内温度を1300℃で3時間保持した。その後、放冷することにより酸化物焼結体を得た。
 得られた酸化物焼結体について、組成と相対密度を評価した。結果を表2に示す。
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000002
 評価法は以下のとおりである。
(1)酸化物焼結体における金属元素の原子比
 得られた酸化物焼結体の一部を切り出し、酸に溶解した後、誘導結合プラズマ発光分析装置により分析した。
(2)相対密度
 相対密度は、水を用いたアルキメデス法により酸化物焼結体の実際の密度を測定し、組成から算出される理論密度で除することにより算出した。なお、理論密度は、酸素欠陥のないMgO結晶と、Zn酸化物と、X(Ga又はAl)の酸化物の質量分率より算出した。
(3)XRD測定
 下記の装置及び条件で測定した。
・装置:(株)リガク製Ultima-III
・X線:Cu-Kα線(波長1.5406Å、グラファイトモノクロメータにて単色化)
・2θ-θ反射法、連続スキャン(1.0°/分)
・サンプリング間隔:0.02°
・スリットDS、SS:2/3°、RS:0.6mm
 XRD測定の結果を、統合粉末X線解析ソフトウェア(株式会社リガク製、PDXL2)にて解析することにより、酸化物焼結体に含まれる結晶構造及び格子定数を求めた。なお、結晶構造は下記のICDD(PDF)カードで確認した。
 ZnO:01-079-0205(六方晶)
 ZnO:01-077-0191(立方晶)
 MgO:01-071-1176(立方晶)
 MgAl:01-084-0377
 MgGa:01-073-1721
 図1にXRDチャートの解析結果を示す。図1から、酸化物焼結体には結晶構造として、ZnO、MgO及びMgGaが含まれていることが確認できた。
 格子定数の実測値とPDF値から、Znを固溶したMgO、及びZnを固溶したMgX(X=Ga又はAl)の存在について評価した。
 MgOの格子定数aについて、実測値は4.2314であり、PDF値は4.217であった。ZnOの格子定数aについて、実測値は3.2423であり、PDF値は3.242であった。MgGaの格子定数aについて、実測値は8.3116であり、PDF値は8.26であった。この結果から、MgO及びMgGaの格子定数aの差が大きいことが確認でき、これら結晶にZnが固溶していると判断した。なお、格子定数が0.01以上変化した場合に、固溶していると判断した。
 結果を表3に示す。表中、含む場合を○、含まない場合を×とした。
Figure JPOXMLDOC01-appb-T000003
(B)スパッタリングターゲットの作製
 得られた酸化物焼結体について、スパッタ面となる面をカップ砥石で磨き、直径100mm、厚さ5mmに加工した。In系合金を用いて、研磨した酸化物焼結体にバッキングプレートを貼り合わせて、スパッタリングターゲットを作製した。
 酸化物焼結体から作製したスパッタリングターゲットを用いて、実際に薄膜を形成し、評価した。成膜条件は以下の通りとした。
 サファイア基板(厚さ0.5mm)を、超音波洗浄器中に入れ、トリクロロエチレンで5分間、アセトンで5分間、メタノールで5分間、最後に蒸留水で5分間洗浄した。
 この基板をスパッタリング装置(ULVAC製:ACS-4000)にセットし、スパッタガスにArを用い、25℃で成膜し、基板上に厚さ100nmの膜を形成した。
(2)熱処理
 上記(1)で膜を形成した基板を、窒素雰囲気にて950℃で5分間熱処理(活性化アニール)した。熱処理後の膜について、三菱化学製ロレスタFPを用いて表面抵抗を測定した。また、分光光度計(島津製作所製:UV-2600)を使用し、紫外線透過率を評価した。
 評価結果を表4に示す。
Figure JPOXMLDOC01-appb-T000004
実施例2~6、比較例1
 各金属元素の原子比が表1に示す値となるように原料を秤量し、混合した他は、実施例1と同様にして、酸化物焼結体及びスパッタリングターゲットを作製し、評価した。結果を表2~4に示す。なお、金属元素XがAlである実施例では、平均粒径が1μm以下の酸化アルミニウム(Al粉末)を使用した。
 図2に実施例2の酸化物焼結体のXRDチャートの解析結果を示す。図3に比較例1の酸化物焼結体のXRDチャートの解析結果を示す。
実施例7
(A)酸化物焼結体の作製
 平均粒経が1μm以下の酸化亜鉛(ZnO)粉末、及び平均粒経が1μm以下の酸化マグネシウム(MgO)粉末、平均粒径が1μm以下の酸化ガリウム(Ga粉末)を、各金属の原子比が表5に示す値となるように秤量し、混合した。なお、混合粉末の質量分率は、ZnOが48.9質量%、MgOが36.3質量%、Gaが14.8質量%である。
 混合粉末を樹脂製ポットに入れた後、水を加え、粉砕メディアとして硬質ZrOボールを用いて、湿式ボールミルにて20時間混合した。得られた混合スラリーを取り出し、濾過、乾燥及び造粒した。得られた造粒物を型に入れ、冷間静水圧プレスで3ton/cmに加圧して成型した。
 得られた成型体を焼結炉内に載置し、炉内容積0.1m当たり5L/分の割合で酸素を流入しながら、成型体を焼成した。
 焼結炉内の温度を、室温から1000℃までは1℃/分で昇温し、1000℃から1470℃までは3℃/分で昇温し、1470℃で5時間焼成した。その後、酸素の流入を止め、炉内温度を1470℃から1300℃まで10℃/分で降温した。次いで、炉内容積0.1m当たり10L/分の割合でArを流入しながら、炉内温度を1300℃で3時間保持した。その後、放冷することにより酸化物焼結体を得た。
 得られた酸化物焼結体について、実施例1と同様にして組成と相対密度を評価した。結果を表6に示す。
Figure JPOXMLDOC01-appb-T000005
Figure JPOXMLDOC01-appb-T000006
 図4にXRDチャートの解析結果を示す。図4から、酸化物焼結体には結晶構造として、ZnO(六方晶)、MgO(立方晶)、MgGa及びGa(ZnO)が含まれていることが確認できた。なお、Ga(ZnO)についてはフィッティング率が悪かったため、存在は推定である。
 格子定数の実測値とPDF値から、Znを固溶したMgO(立方晶)、Mgを固溶したZnO(六方晶)及びZnを固溶したMgX(X=Ga又はAl)の存在について評価した。
 MgOの格子定数aについて、実測値は4.2307であり、PDF値は4.217であった。ZnOの格子定数aについて、実測値は3.2482であり、PDF値は3.242であった。MgGaの格子定数aについて、実測値は8.3121であり、PDF値は8.26であった。このように、格子定数が変化していることから、ZnOにMgが固溶し、また、MgO及びMgGaにZnが固溶していると判断した。
 結果を表7に示す。表中、含む場合を○、含まない場合を×とした。
Figure JPOXMLDOC01-appb-T000007
(B)スパッタリングターゲットの作製
 実施例7の酸化物焼結体を使用した他は、実施例1と同様にしてスパッタリングターゲットを作製し、評価した。結果を表8に示す。
Figure JPOXMLDOC01-appb-T000008
実施例8~13、比較例2
 各金属元素の原子比が表5に示す値となるように原料を秤量し、混合した他は、実施例7と同様にして、酸化物焼結体及びスパッタリングターゲットを作製し、評価した。結果を表6~8に示す。なお、金属元素XがAlである実施例では、平均粒径が1μm以下の酸化アルミニウム(Al粉末)を使用した。
 図5に実施例8の酸化物焼結体のXRDチャートの解析結果を示す。図6に比較例2の酸化物焼結体のXRDチャートの解析結果を示す。
 上記に本発明の実施形態及び/又は実施例を幾つか詳細に説明したが、当業者は、本発明の新規な教示及び効果から実質的に離れることなく、これら例示である実施形態及び/又は実施例に多くの変更を加えることが容易である。従って、これらの多くの変更は本発明の範囲に含まれる。
 この明細書に記載の文献、及び本願のパリ条約による優先権の基礎となる出願の内容を全て援用する。

Claims (20)

  1.  亜鉛と、マグネシウムと、正3価又は正4価の金属元素Xと、酸素とを、構成元素として含み、
     前記亜鉛、前記マグネシウム及び前記金属元素Xの合計に対する前記金属元素Xの原子比[X/(Zn+Mg+X)]が0.0001以上0.6以下であり、
     前記亜鉛及び前記マグネシウムの合計に対する前記マグネシウムの原子比[Mg/(Zn+Mg)]が0.25以上0.8以下である、酸化物焼結体。
  2.  前記原子比[Mg/(Zn+Mg)]が0.625以上0.8以下である、請求項1に記載の酸化物焼結体。
  3.  前記原子比[Mg/(Zn+Mg)]が0.626以上0.75以下である、請求項1に記載の酸化物焼結体。
  4.  前記原子比[Mg/(Zn+Mg)]が0.628以上0.74以下である、請求項1に記載の酸化物焼結体。
  5.  Znを固溶した立方晶のMgO、及びZnを固溶したMgX(Xは正3価の金属元素である。)を含む、請求項2~4のいずれかに記載の酸化物焼結体。
  6.  前記原子比[Mg/(Zn+Mg)]が0.25以上0.625未満である、請求項1に記載の酸化物焼結体。
  7.  前記原子比[Mg/(Zn+Mg)]が0.30以上0.60以下である、請求項1に記載の酸化物焼結体。
  8.  前記原子比[Mg/(Zn+Mg)]が0.40以上0.59以下である、請求項1に記載の酸化物焼結体。
  9.  Znを固溶した立方晶のMgO、Mgを固溶した六方晶のZnO及びZnを固溶したMgX(ここでXは正3価の金属元素である。)を含む、請求項6~8のいずれかに記載の酸化物焼結体。
  10.  前記原子比[X/(Zn+Mg+X)]が0.003以上0.6以下である、請求項1~9のいずれかに記載の酸化物焼結体。
  11.  前記原子比[X/(Zn+Mg+X)]が0.007以上0.5以下である、請求項1~9のいずれかに記載の酸化物焼結体。
  12.  前記原子比[X/(Zn+Mg+X)]が0.008以上0.5以下である、請求項1~9のいずれかに記載の酸化物焼結体。
  13.  前記原子比[X/(Zn+Mg+X)]が0.01以上0.5以下である、請求項1~9のいずれかに記載の酸化物焼結体。
  14.  前記XがAl及びGaの少なくとも一方である、請求項1~13のいずれかに記載の酸化物焼結体。
  15.  前記XがAlである、請求項14に記載の酸化物焼結体。
  16.  前記XがGaである、請求項14に記載の酸化物焼結体。
  17.  請求項1~16のいずれかに記載の酸化物焼結体を含む、成膜用材料。
  18.  成膜用タブレットである、請求項17に記載の成膜用材料。
  19.  スパッタリングターゲットである、請求項17に記載の成膜用材料。
  20.  請求項17~19のいずれかに記載の成膜用材料を使用して得られる薄膜。
PCT/JP2020/024740 2019-06-27 2020-06-24 酸化物焼結体 WO2020262433A1 (ja)

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