WO2020261682A1 - 封止用樹脂組成物、封止シートおよび有機ｅｌ素子封止構造体 - Google Patents

封止用樹脂組成物、封止シートおよび有機ｅｌ素子封止構造体 Download PDF

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WO2020261682A1
WO2020261682A1 PCT/JP2020/013302 JP2020013302W WO2020261682A1 WO 2020261682 A1 WO2020261682 A1 WO 2020261682A1 JP 2020013302 W JP2020013302 W JP 2020013302W WO 2020261682 A1 WO2020261682 A1 WO 2020261682A1
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sealing
resin composition
layer
organic
modified polyolefin
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PCT/JP2020/013302
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English (en)
French (fr)
Japanese (ja)
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栄二 宇野
志亮 耿
哲也 細谷
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綜研化学株式会社
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Priority to CN202080035135.5A priority Critical patent/CN113811567B/zh
Priority to JP2021527379A priority patent/JPWO2020261682A1/ja
Publication of WO2020261682A1 publication Critical patent/WO2020261682A1/ja

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/07—Aldehydes; Ketones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L57/00—Compositions of unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention relates to a sealing resin composition, a sealing sheet, and an organic EL element sealing structure.
  • an organic EL display has been attracting attention as a display alternative to a liquid crystal display (LCD).
  • LCD liquid crystal display
  • an organic EL element used in an organic EL display deteriorates due to moisture, and there is a problem that the emission characteristics such as emission brightness, luminous efficiency, and emission uniformity deteriorate as the organic EL element deteriorates. Occurs. Therefore, it is known that the organic EL element is sealed with a sealing material having low moisture permeation in order to prevent external moisture and the like from entering (Patent Document 1).
  • the present invention has been made in view of the above circumstances, and is a sealing sheet that stably exhibits adhesive reliability under high temperature and high humidity for a long period of time in addition to low moisture permeability and adhesion to an adherend. It is an object of the present invention to provide a sealing resin composition capable of obtaining (sealing material).
  • the sealing resin composition contains a modified polyolefin resin and an organometallic compound, and the blending amount of the organometallic compound with respect to 100 parts by mass of the modified polyolefin resin is 0.1 to 10 parts by mass.
  • Another aspect of the present invention is a sealing sheet. At least a part of the sealing sheet is formed of a cured product of the sealing resin composition of the above-described embodiment.
  • the organic EL element sealing structure includes an organic EL layer and a sealing layer for sealing the organic EL layer, and the sealing layer is formed of the sealing sheet of the above-described embodiment.
  • sealing sheet (sealing material) that stably exhibits adhesion reliability under high temperature and high humidity for a long period of time in addition to low moisture permeability and adhesion to an adherend.
  • a resin composition for sealing that can be provided can be provided.
  • the sealing resin composition according to the embodiment contains a modified polyolefin resin and an organometallic compound.
  • the modified polyolefin resin can be obtained by using an unmodified polyolefin resin as a precursor and modifying it with a compound having an acidic functional group. In the present embodiment, by using the modified polyolefin resin, low moisture permeability and adhesion to the adherend can be realized at a higher level.
  • the unmodified polyolefin resin includes ethylene, propylene, 1-butene, 1-hexene, 1-heptene, 1-octene, 1-decene, isopylene, 3-methyl-1-butene, 4-methyl-1-pentene and the like.
  • ⁇ -olefin 1,3-butadiene, isoprene, 2,3-dimethyl-1,3-butadiene, 1,3-pentadiene, 2-methyl-1,3-pentadiene, 1,3-hexadiene, 4,5- Monopolymers of conjugated diene such as diethyl-1,3-octadiene and chloroprene, copolymers such as random, block and graft of these two or more monomers, mixtures thereof, ⁇ -olefin and / or major of conjugated diene. It refers to a copolymer such as a random, block, or graft of a portion and another unsaturated monomer.
  • the unmodified polyolefin resin as the precursor is preferably a polyisobutylene polymer or an isobutylene / isoprene copolymer from the viewpoint of achieving a higher level of low moisture permeability.
  • polyisobutylene polymers include OPPANOL N50, OPPANOL N80, OPPANOL N100, OPPANOL B50, OPPANOL B80, and OPPANOL B100 (manufactured by BASF Japan).
  • examples of commercially available isobutylene / isoprene copolymers include JSR BUTYL 065, JSR BUTYL 268, and JSR BUTYL 365 (manufactured by JSR).
  • the compound having an acidic functional group include maleic acid, fumaric acid, itaconic acid, citraconic acid, crotonic acid, phthalic anhydride, maleic anhydride, acrylic acid, methacrylic acid and the like.
  • the modified polyolefin resin can be obtained by reacting the above-mentioned unmodified polyolefin resin with a compound having an acidic functional group.
  • the amount of the compound having an acidic functional group to react with the unmodified polyolefin resin is preferably 0.05 to 8 parts by mass, more preferably 0.1 to 5 parts by mass with respect to 100 parts by mass of the unmodified polyolefin resin. It is preferably 0.5 to 3 parts by mass, and more preferably 0.5 to 3 parts by mass.
  • the sealing resin composition of the present embodiment may contain an unreacted unmodified polyolefin resin remaining in the process of modifying the unmodified polyolefin resin.
  • the unmodified polyolefin resin relative to the total amount of the unmodified polyolefin resin and the modified polyolefin resin
  • the content is preferably 90% by mass or more, more preferably 95% by mass or more.
  • the lower limit of the weight average molecular weight of the modified polyolefin resin is preferably 50,000 or more, more preferably 80,000 or more.
  • the upper limit of the weight average molecular weight of the modified polyolefin resin is preferably 800,000 or less, more preferably 600,000 or less, still more preferably 450,000 or less.
  • the weight average molecular weight of the modified polyolefin resin is a value obtained by polystyrene conversion using gel permeation chromatography (GPC).
  • the modified polyolefin resin can be produced by a known method, but is preferably produced by solution polymerization. Specifically, an unmodified polyolefin resin, a compound having an acidic functional group, and a polymerization solvent are charged in the reaction vessel, a polymerization initiator is added in an atmosphere of an inert gas such as nitrogen gas, and the reaction temperature is about 50 to 90 ° C. And react for 2 to 20 hours. Further, a polymerization initiator, a chain transfer agent, a compound having an acidic functional group, and a polymerization solvent may be additionally added during the polymerization reaction as appropriate.
  • polymerization initiator examples include ordinary organic polymerization initiators such as peroxides and azo compounds, and among these, peroxides are preferable.
  • peroxide examples include 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, t-hexylperoxy-2-ethylhexanoate, and t-amylperoxy-2-ethylhexanoate.
  • t-butylperoxy-2-ethylhexanoate cumylperoxyneodecanoate, 1,1,3,3-tetramethylbutylperoxyneodecanoate, t-hexylperoxyneodecanoate, t-butylperoxy Neodecanoate, t-butylperoxyneoheptanoate, t-hexylperoxypivalate, t-butylperoxypivalate, 2,5-dimethyl-2,5-di (2-ethylhexanoylperoxy) hexane, 2 , 5-Dimethyl-2,5-di (2-benzoylperoxy) hexane, t-butylperoxy-3,5,5-trimethylhexanoate, t-butylperoxylaurate, t-hexylperoxybenzoate, benzoyl peroxide Can be mentioned.
  • the polymerization initiator may be used alone or in combination of two or more.
  • the amount of the polymerization initiator used is usually 0.01 to 5 parts by mass with respect to 100 parts by mass of the unmodified polyolefin resin.
  • the weight average molecular weight of the modified polyolefin resin can be adjusted within an appropriate range.
  • examples of the polymerization solvent include aromatic hydrocarbons such as benzene, toluene and xylene; aliphatic hydrocarbons such as n-pentane, n-hexane, n-heptane and n-octane; cyclopentane and cyclohexane.
  • the above-mentioned modified polyolefin resin forms a crosslinked structure, and the cohesive force can be further improved.
  • the organometallic compound include an organoaluminum compound, an organoziryl compound, and an organotitanium compound, and the organometallic compound may be used alone or in combination of two or more.
  • an organoaluminum compound can be preferably used from the viewpoint of improving compatibility with the modified polyolefin resin.
  • the organoaluminum compound preferably has one or more substituents selected from an alkoxy group and an alkylacetate acetate group.
  • organoaluminum compound When the organoaluminum compound has one or more substituents selected from an alkoxy group and an alkylacetate acetate group, it is applied to an adherend of a sealing layer (adhesive layer) obtained from a sealing resin composition. Adhesive strength is improved. More specifically, as organoaluminum compounds, aluminum tris (acetylacetonate), aluminumtris (ethylacetacetate), aluminum monoacetylacetonatobis (ethylacetate acetate), aluminum ethylacetacetate diisopropyrate, aluminum isopropyrate. One or more selected from.
  • the sealing layer (adhesive layer) obtained from the sealing resin composition
  • the above-mentioned organoaluminum compounds aluminum ethylacetate acetate diisopropylate and aluminum isopropylate It is preferable to use.
  • the lower limit of the blending amount of the organometallic compound with respect to 100 parts by mass of the modified polyolefin resin is preferably 0.1 part by mass or more, more preferably 0.2 parts by mass or more, and 0. More than 3 parts by mass is more preferable.
  • the adhesive strength of the sealing layer (adhesive layer) obtained from the sealing resin composition can be made practically sufficient.
  • the upper limit of the blending amount of the organometallic compound with respect to 100 parts by mass of the modified polyolefin resin is preferably 10 parts by mass or less, more preferably 9 parts by mass or less, still more preferably 7 parts by mass or less.
  • the compatibility with the modified polyolefin resin is improved, and when the sealing resin composition is used as the sealing layer (adhesive layer), the coating film is coated. Smoothness can be maintained.
  • a tackifier resin may be added to the sealing resin composition of the present embodiment.
  • the tackifier resin include one or more selected from terpene-based resins and petroleum-based resins.
  • the terpene resin include terpene resins and modified terpene resins such as hydrogenated terpene resins, terpene phenol copolymer resins, and aromatic-modified terpene resins.
  • Petroleum-based resins include alicyclic petroleum resins such as aliphatic petroleum resins (C5 petroleum resins), aromatic petroleum resins (C9 petroleum resins), and dicyclopentadiene petroleum resins (DCPD petroleum resins). , Alicyclic / aromatic copolymerized petroleum resin, alicyclic / aromatic copolymerized petroleum resin, aliphatic / alicyclic copolymerized petroleum resin, hydrogenated petroleum obtained by hydrogenating the above-exemplified petroleum resin. Petroleum resins such as resins can be mentioned.
  • the softening point of the tackifier resin in the sealing resin composition of the present embodiment is preferably 80 to 180 ° C., preferably 90 to 150 ° C., from the viewpoint of durability and adhesive physical properties of the obtained sealing layer (adhesive layer). Is more preferable, and 95 to 140 ° C. is even more preferable.
  • the blending amount of the tackifier resin in the sealing resin composition of the present embodiment is from the viewpoint of increasing the adhesive strength without impairing the low moisture permeability of the sealing layer (adhesive layer) obtained from the sealing resin composition. Therefore, it is preferably 5 to 50 parts by mass, more preferably 10 to 35 parts by mass, and even more preferably 15 to 30 parts by mass with respect to 100 parts by mass of the modified polyolefin resin.
  • the sealing resin composition of the present embodiment is, if necessary, a curing agent, an antioxidant, a wettability improving agent, a surfactant, a silane coupling agent, and an ultraviolet absorbing agent, as long as the object of the present invention is not impaired. It may contain agents, antistatic agents, light stabilizers, fillers, pigments and the like.
  • the sealing resin composition of the present embodiment preferably contains an organic solvent in order to adjust its coatability. Examples of the organic solvent include the polymerization solvent described in the description of the method for producing a modified polyolefin resin, and one type may be used alone or two or more types may be used.
  • the content of the organic solvent is usually 20 to 90% by mass, preferably 30 to 90% by mass.
  • the sealing resin composition of the present embodiment is obtained by mixing each of the above-mentioned components, stirring at a temperature of 20 to 80 ° C. using a stirrer or the like, and sufficiently dispersing each component.
  • the sealing resin composition described above exhibits a good balance of low moisture permeability, adhesion to an adherend, and adhesion reliability under high temperature and high humidity. Therefore, the sealing resin composition of the present embodiment can be suitably used as a sealing material for an organic EL element.
  • the sealing sheet according to the embodiment is formed of at least a part of the cured product of the sealing resin composition of the above-described embodiment.
  • the sealing sheet of the present embodiment may be a single-layer pressure-sensitive adhesive layer made of a sealing layer obtained from a sealing resin composition, or may be a pressure-sensitive adhesive layer made of a sealing layer obtained from a sealing resin composition. It may have a multi-layer structure composed of other layers laminated on the pressure-sensitive adhesive layer. Examples of the other layer laminated with the pressure-sensitive adhesive layer include a release sheet such as a PET film that has been peeled off, a base material, and a barrier film.
  • the sealing sheet may have a sealing layer formed on one side or both sides of the base material.
  • the release sheet When the sealing layer is formed on one surface of the base material, the release sheet may be attached to the surface of the sealing layer opposite to the base material. Further, the sealing sheet may have a sealing layer formed on one side or both sides of the barrier film. When the sealing layer is formed on one surface of the barrier film, the release sheet may be attached to the surface of the sealing layer opposite to the barrier film.
  • the sealing layer of the present embodiment is formed, for example, as follows.
  • the sealing resin composition of the present invention is applied on the peeling surface of the release sheet, on the base material, or on the gas barrier film, and varies depending on the type of solvent, but is usually 50 to 150 ° C, preferably 60 to 130.
  • the solvent is removed by drying at ° C. for usually 1 to 10 minutes, preferably 2 to 7 minutes to form a coating film.
  • the film thickness of the dry coating film is not particularly limited and is adjusted depending on the object to be sealed, but is usually 0.5 to 200 ⁇ m.
  • the sealing sheet is usually 3 days or more, preferably 7 to 10 days, usually 5 to 60 ° C., preferably 15 to 40 ° C., usually 30 to 30 to 3 days or more after the release sheet is attached on the coating film formed under the above conditions. It is aged (cured) in an environment of 70% RH, preferably 40 to 70% RH.
  • a coating method of the sealing resin composition a known coating method such as a spin coating method, a knife coating method, a roll coating method, a bar coating method, a blade coating method, a die coating method, or a gravure coating method is used. , A method of applying and drying to a predetermined thickness can be used.
  • the base material and the release sheet include polycarbonate (PC), polymethylmethacrylate (PMMA), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), polyethylene (PE), and polypropylene (PP). ), Polyethylene-propylene copolymer, ethylene-vinyl acetate copolymer, acrylonitrile-butadiene-styrene copolymer (ABS), polyamide (nylon), polyimide, polyvinyl chloride (PVC) and other plastic films.
  • the gas barrier film is a laminate in which a gas barrier layer is provided on one or both sides of the base material.
  • the material of the gas barrier layer is not particularly limited, but for example, a silicon compound such as a polysilazane compound, a polycarbosilane compound, a polysilane compound, a polyorganosiloxane compound, a tetraorganosilane compound, silicon oxide, and silicon nitride.
  • a silicon compound such as a polysilazane compound, a polycarbosilane compound, a polysilane compound, a polyorganosiloxane compound, a tetraorganosilane compound, silicon oxide, and silicon nitride.
  • Metals such as zinc and tin. These may be used alone or in combination
  • FIG. 1 is a schematic cross-sectional view of the organic EL element sealing structure 10 according to the embodiment.
  • the organic EL element sealing structure 10 shown in FIG. 1 is a top emission type organic EL element sealing structure, and a substrate 20, a reflective electrode 30, an organic EL layer 40, and a transparent electrode 50 are laminated in this order. It has a laminated body. The side surface and the upper surface of the laminate are sealed by the sealing layer 60, and the transparent substrate 70 is installed on the upper surface of the sealing layer 60.
  • the substrate 20 may be transparent or opaque.
  • the material used for the substrate 20 include semiconductors such as metal, ceramics, glass, and silicon, and resins.
  • the resin include polyethylene terephthalate, polymethylmethacrylate, polyolefin, acrylic resin, polyester resin, polyimide resin and the like. Of these, by using polyolefin, acrylic resin, polyester resin, polyimide resin, or the like, the substrate can be made flexible. Further, by using a semiconductor such as silicon for the substrate 20 and forming a plurality of switching elements such as TFTs on the surface thereof, an active matrix drive type organic EL element sealing structure can be obtained.
  • the reflective electrode 30 is made of a material having light reflectivity and functions as an anode.
  • the material used for the reflective electrode 30 include metals, amorphous alloys, and microcrystalline alloys.
  • the metal include Al, Ag, Mo, W, Ni, Cr and the like.
  • the amorphous alloy include NiP, NiB, CrP and CrB.
  • the microcrystalline alloy include NiAl and the like.
  • the organic EL layer 40 has a hole transport layer 42, a light emitting layer 44, an electron transport layer 46, and an electron injection layer 48 in this order from the substrate 20 side.
  • the hole transport layer 42 is a layer that has a function of transporting holes, and examples of the material thereof include a triazole derivative, an oxadiazole derivative, and an imidazole derivative.
  • a hole injection layer having a hole injection property may be provided between the reflection electrode 30 and the hole transport layer 42.
  • the light emitting layer 44 is a layer in which excitons are generated and emit light by recombination of injected holes and electrons, and as the material thereof, fluorescent whitening agents such as benzothiazole type, benzimidazole type, and benzoxazole type are used. And metal chelated oxynoid compounds.
  • the electron transport layer 46 is a layer that has a function of transporting electrons, and its material is a heterocyclic tetra such as a nitro-substituted fluorenone derivative, an anthracinodimethane derivative, a diphenylquinone derivative, a thiopyrandioxide derivative, and naphthalene perylene. Examples thereof include carboxylic acid anhydride.
  • the electron injecting layer 48 is a layer having an electron injecting property, and examples of the material thereof include an alkali metal, an alkaline earth metal or an alloy containing them, and an electron injecting material such as alkali metal fluoride.
  • the transparent electrode 50 is formed by using a conductive metal oxide such as SnO 2 , In 2 O 3 , ITO, IZO, and ZnO: Al.
  • a conductive metal oxide such as SnO 2 , In 2 O 3 , ITO, IZO, and ZnO: Al.
  • the transparent electrode 50 is used as a cathode, it is preferable to use the uppermost layer of the organic EL layer 40 as the above-mentioned electron injection layer 48 to improve the electron injection efficiency.
  • the sealing layer 60 is formed by the sealing sheet of the above-described embodiment.
  • the sealing layer 60 is formed by using the sealing sheet described above, the protective layer and the like are peeled off, and then the laminated body including the organic EL layer 40 is covered with the adhesive layer.
  • crimping is performed using a press machine or the like to bring the sealing layer 60 into close contact with the substrate 20, the organic EL layer 40, and the transparent substrate 70.
  • the pressure during the crimping process may be appropriately adjusted within a range in which the substrate 20, the organic EL layer 40, and the transparent substrate 70 are not damaged. As a result, a sealing layer 60 for sealing the organic EL layer 40 and the like can be obtained.
  • the transparent substrate 70 is made of a material that is transparent to the light emitted from the organic EL layer 40.
  • the material of the transparent substrate 70 include glass such as borosilicate glass or blue plate glass, and resins such as polyethylene terephthalate, polymethylmethacrylate, polyolefin, acrylic resin, polyester resin and polyimide resin.
  • the transparent substrate 70 can be made flexible by forming the transparent substrate 70 using polyolefin, acrylic resin, polyester resin, or polyimide resin.
  • the organic EL element sealing structure 10 of the present embodiment seals the organic EL layer 40 with a sealing layer 60 formed by using the sealing sheet of the above-described embodiment, thereby sealing the organic EL layer 40 with moisture. It is possible to improve the reliability for a long period of time by surely protecting from the above and ensuring the adhesion under high temperature and high humidity more surely.
  • the organic EL element sealing structure of the present embodiment can be used for various light emitting devices such as an organic EL display and an organic EL lighting.
  • the organic EL element sealing structure is a top emission type, but the substrate 20 is made transparent to the light emitted from the organic EL layer 40, and the reflective electrode 30 and the transparent electrode 50 are provided. It is also possible to make it a bottom emission type by exchanging the arrangement of.
  • Mw Weight average molecular weight
  • GPC method a gel permeation chromatography method
  • the weight average molecular weight of the obtained acid-modified polyolefin resin 1 was 250,000.
  • An acid-modified polyolefin resin solution 2 was obtained in the same manner as in Production Example 1 except that the amount of t-butylperoxy-2-ethylhexanoate used was 1.5 parts by mass.
  • the weight average molecular weight of the obtained acid-modified polyolefin resin 2 was 130,000.
  • Example 1 The acid-modified polyolefin resin obtained in Production Example 1 was placed in a container so that the solid content was 100 parts by mass, and then an organometallic compound (ALCH: aluminum ethylacetate diisopropirate; manufactured by Kawaken Fine Chemicals) 0.5.
  • a solution containing a sealing resin composition was obtained by blending parts by mass and toluene. The amount of toluene blended was adjusted so that the solid content concentration of the solution was 30%.
  • the solution containing the obtained sealing resin composition is applied to a PET film (thickness 38 ⁇ m) that has been peeled so as to have a thickness of 50 ⁇ m after drying, and dried at 90 ° C. for 3 minutes to form an adhesive layer.
  • a PET film thickness 38 ⁇ m
  • a 25 ⁇ m-thick PET film is further bonded to the surface of the pressure-sensitive adhesive layer on the side where the peeled PET film is not bonded, and is aged for 7 days in an environment of 23 ° C. and 50% RH, and sealed.
  • a stop sheet adheresive sheet
  • Examples 2 to 10, Comparative Examples 1 to 3 A sealing resin composition and a sealing sheet were produced in the same manner as in Example 1 except that the compositions of the components used were changed as shown in Table 1.
  • ⁇ Adhesive strength> The sealing sheets obtained in Examples and Comparative Examples were cut into 25 mm width ⁇ 80 mm length to prepare test pieces.
  • the peeled PET film was peeled off from the obtained test piece, and the exposed pressure-sensitive adhesive layer was wiped with cotton moistened with ethyl acetate, and then left at 23 ° C. for 1 hour in a 50% RH environment. It was affixed to (float plate glass: manufactured by Nippon Tact), and a 2 kg roller was reciprocated three times and crimped.
  • ⁇ Holding power> The sealing sheets obtained in Examples and Comparative Examples were cut to a width of 20 mm to prepare test pieces.
  • the peeled PET film was peeled off from the obtained test piece, an exposed adhesive layer having a sticking area of 20 mm ⁇ 20 mm was stuck on the SUS, and a 2 kg roller was pressure-bonded three times. After crimping, it is left for 20 minutes in an environment of 80 ° C./dry, and then, as shown in FIG. 2, a load of 1 kg is applied in the shearing direction of the adhesive layer 100 attached to the glass plate 110 under the same environment, and the load application is started.
  • the amount of displacement of the pressure-sensitive adhesive layer 100 1 hour after the start (the amount of displacement ⁇ P of the position P1 of the end portion of the pressure-sensitive adhesive layer 100 1 hour after the start of applying the load to the initial position P0 of the end portion of the pressure-sensitive adhesive layer 100). It was measured.
  • ⁇ Adhesion to base material> The sealing sheets obtained in Examples and Comparative Examples were cut into 25 mm width ⁇ 80 mm length to prepare test pieces.
  • the peeled PET film was peeled off from the obtained test piece, and the exposed pressure-sensitive adhesive layer was wiped with cotton moistened with ethyl acetate, and then left at 23 ° C. for 1 hour in a 50% RH environment. It was affixed to (float plate glass: manufactured by Nippon Tact), and a 2 kg roller was reciprocated three times and crimped. After crimping, the mixture was left at 60 ° C. and 90% RH for 24 hours, and then left at 23 ° C. and 50% RH for 1 hour. Then, in an environment of 23 ° C.
  • the end of the sealing sheet (test piece) is pulled at an angle of 180 ° with respect to the glass plate at a speed of 300 mm / min, and the adhesion to the base material is based on the following criteria. Evaluated in. ⁇ : The sealing sheet was peeled off at the interface between the glass and the adhesive layer. ⁇ : A part of the adhesive layer was transferred to the glass. X: The sealing sheet was peeled off at the interface between the base material (PET film) and the pressure-sensitive adhesive layer.
  • ⁇ Durability test> The sealing sheets obtained in Examples and Comparative Examples were cut into a size of 50 mm ⁇ 50 mm to obtain test pieces. From the obtained test piece, the peeled PET film was peeled off, the surface was wiped with cotton moistened with ethyl acetate, and then the glass plate was left at 23 ° C. in a 50% RH environment for 1 hour (float plate glass: Nippon Tact). A 2 kg roller was reciprocated three times and crimped. After crimping, the product was left to stand in an environment of 85 ° C. and 85% RH for 500 hours, and then the durability was evaluated according to the following criteria. ⁇ : No abnormality was observed in the appearance. ⁇ : Slight appearance defects such as foaming, fishing float, and peeling were confirmed, but there is no problem in actual use. X: Poor appearance such as foaming, fishing float, and peeling was observed over a wide area.
  • the sealing sheets of Examples 1 to 10 are excellent in moisture permeability because they contain a modified polyolefin resin. As shown in Table 1, the sealing sheets of Examples 1 to 10 showed a value having a very high adhesive strength as compared with Comparative Example 2. Further, it was confirmed that the sealing sheets of Examples 1 to 10 have good holding power after passing through a high temperature and high humidity environment, substrate adhesion, and constant load test results, and also have excellent durability. It was. Further, in Examples 1 to 5 and 7 to 10, it was confirmed that the durability was good and the permeability was good.
  • Organic EL element encapsulation structure 20 substrate, 30 reflective electrode, 40 organic EL layer, 42 hole transport layer, 44 light emitting layer, 46 electron transport layer, 48 electron injection layer, 50 transparent electrode, 60 encapsulation layer, 70 transparent substrate, 100 test piece, 110 glass plate, 200 test piece, 210 glass plate, 220 weight

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  • Sealing Material Composition (AREA)
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JP2017101145A (ja) * 2015-12-01 2017-06-08 リンテック株式会社 接着剤組成物、封止シート、及び封止体
WO2018092800A1 (ja) * 2016-11-18 2018-05-24 リンテック株式会社 接着剤組成物、封止シート、及び封止体

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JP4269773B2 (ja) * 2003-05-15 2009-05-27 凸版印刷株式会社 無機ｅｌ素子封止フィルム
JP6148870B2 (ja) * 2013-01-31 2017-06-14 株式会社日本触媒 硬化性樹脂組成物、及び、硬化物
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