WO2020258544A1 - Oled显示面板及其制备方法 - Google Patents

Oled显示面板及其制备方法 Download PDF

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Publication number
WO2020258544A1
WO2020258544A1 PCT/CN2019/106922 CN2019106922W WO2020258544A1 WO 2020258544 A1 WO2020258544 A1 WO 2020258544A1 CN 2019106922 W CN2019106922 W CN 2019106922W WO 2020258544 A1 WO2020258544 A1 WO 2020258544A1
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Prior art keywords
layer
organic
inorganic
display panel
oled display
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PCT/CN2019/106922
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English (en)
French (fr)
Inventor
王俊媛
夏存军
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US16/613,465 priority Critical patent/US11342533B2/en
Publication of WO2020258544A1 publication Critical patent/WO2020258544A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the invention relates to the field of display technology, in particular to an OLED display panel and a preparation method thereof.
  • OLED Organic Light-Emitting Diode, organic light-emitting diode
  • OLED Organic Light-Emitting Diode, organic light-emitting diode
  • the OLED light-emitting material is very sensitive to water vapor, the OLED device is easily aging after being corroded by the water vapor, and the service life is shortened. Therefore, the OLED device needs to be film-encapsulated to isolate the water vapor.
  • thin-film encapsulation extends the path of water vapor intrusion through the alternate stacking of organic and inorganic layers, so that OLED devices can achieve the purpose of blocking water vapor while having flexible functions.
  • the method of stacking organic and inorganic layers is not only technological It is cumbersome, and the product production cycle is long, and the film layer of the packaging layer is also thick, which is not conducive to the development of OLED devices in the direction of flexibility and lightness.
  • the present invention provides an OLED display panel and a preparation method thereof, so as to solve the problem that in the existing OLED display panel, the packaging process of the existing OLED device is complicated, and the thickness of the packaging film is relatively thick, which is not conducive to the bending of the panel. , which is not conducive to the development of the display panel in the direction of lightness, thinness and flexibility.
  • the present invention provides an OLED display panel and a preparation method thereof, including an array substrate, an organic light-emitting layer arranged on the array substrate, and an encapsulation layer arranged on the organic light-emitting layer and covering the organic light-emitting layer; wherein
  • the encapsulation layer includes an organic-inorganic functional layer and a second organic layer disposed on the organic-inorganic functional layer.
  • the surface of the organic-inorganic functional layer away from the organic light-emitting layer is an inorganic film layer, which is close to the One side surface of the organic light-emitting layer is a first organic layer, and inorganic particles are embedded in the first organic layer.
  • the inorganic film layer is disposed on the surface of the first organic layer and covers the first organic layer.
  • the organic-inorganic functional layer is disposed on a surface of the organic light-emitting layer facing away from the array substrate.
  • the inorganic particles and the inorganic film layer are made of the same material and are prepared by the same manufacturing process.
  • the thickness of the inorganic film layer is 0.001 to 0.1 microns.
  • the present invention provides an OLED display panel, including an array substrate, an organic light-emitting layer arranged on the array substrate, and an encapsulation layer arranged on the organic light-emitting layer and covering the organic light-emitting layer; wherein the encapsulation
  • the layers include organic and inorganic functional layers.
  • the surface of the organic-inorganic functional layer on the side far away from the organic light-emitting layer is an inorganic film layer, and the surface on the side close to the organic light-emitting layer is the first organic layer, and Inorganic particles are embedded in the first organic layer.
  • the inorganic film layer is disposed on the surface of the first organic layer and covers the first organic layer.
  • the organic-inorganic functional layer is disposed on a surface of the organic light-emitting layer facing away from the array substrate.
  • the inorganic particles and the inorganic film layer are made of the same material and are prepared by the same manufacturing process.
  • the thickness of the inorganic film layer is 0.001 to 0.1 microns.
  • the material of the organic-inorganic functional layer is an organic substance containing silicon groups.
  • the encapsulation layer further includes a second organic layer disposed on the organic-inorganic functional layer.
  • the present invention also provides a method for manufacturing an OLED display panel, including the following steps:
  • the preparation method further includes: S30, forming a second organic layer on the organic-inorganic functional layer
  • the S20 includes:
  • the material of the inorganic film layer is aluminum oxide material.
  • the S202 specifically includes:
  • a patterned inorganic film layer is formed on the surface of the first organic layer.
  • the thickness of the inorganic film layer is 0.001 to 0.1 microns.
  • the inorganic film layer covers the first organic layer.
  • the material of the organic-inorganic functional layer is an organic substance containing silicon groups.
  • the beneficial effects of the present invention are: by arranging organic and inorganic functional layers, the overall thickness of the packaging film can be reduced while ensuring the packaging effect, and the bending performance of the OLED device can be improved. In addition, there is no need to use a mask in the packaging process. In turn, production costs can be effectively saved.
  • FIG. 1 is a schematic structural diagram of an OELD display panel according to an embodiment of the present invention.
  • FIG. 2 is a flowchart of steps of a method for manufacturing an OLED display panel according to an embodiment of the present invention
  • 3 to 5 are schematic structural diagrams of the manufacturing process of the OLED display panel according to the embodiment of the present invention.
  • the present invention is aimed at the existing OLED display panel. Because the packaging process of the existing OLED device is relatively complicated, and the thickness of the packaging film is thicker, it is not conducive to the bending of the panel, and further is not conducive to the display panel becoming thinner and bendable. This embodiment can solve the problem of development in the same direction.
  • an embodiment of the present invention provides an OLED display panel 100 including an array substrate 10, an organic light-emitting layer 20, and an encapsulation layer 30.
  • the organic light emitting layer 20 is disposed on the array substrate 10, the encapsulation layer 30 is disposed on the organic light emitting layer 20, and the encapsulation layer 30 covers the organic light emitting layer 20.
  • the encapsulation layer 30 includes an organic-inorganic functional layer 31. Since the encapsulation layer in the prior art adopts an inorganic layer and an organic layer to overlap, the thickness of the film layer is relatively thick, which is not conducive to the light and thin development of the panel, and affects the bending of the panel. Therefore, the embodiment of the present invention improves the encapsulation layer, embedding inorganic materials with water and oxygen barrier properties into the organic layer with excellent bending effect, which can not only reduce the thickness of the encapsulation layer, but also improve the bending of the OLED device. Fold performance.
  • the surface of the organic-inorganic functional layer 31 away from the organic light-emitting layer 20 is an inorganic film layer 312, and the surface of the organic-inorganic functional layer 31 that is close to the organic light-emitting layer 20 is a first organic layer 311 In addition, inorganic particles 313 are embedded in the first organic layer 311.
  • the inorganic film layer 312 is disposed on the surface of the first organic layer 311, and the inorganic film layer 312 covers the first organic layer 311.
  • the inorganic particles 313 and the inorganic film layer 312 are prepared through the same manufacturing process.
  • an inorganic material is deposited on the surface of the first organic layer 311 to form the endless film layer 312, the inorganic material is embedded in the first organic layer.
  • the inside of the organic layer 311 thereby forms the inorganic particles 313.
  • the materials of the inorganic particles 313 and the inorganic film layer 312 are the same, and may be aluminum oxide materials.
  • the material of the inorganic particles 313 and the inorganic film layer 312 in this embodiment may be aluminum oxide, and the aluminum oxide may be deposited on the first organic layer by using an atom injection type atomic layer deposition method.
  • the method of atomic layer deposition of aluminum oxide has the characteristics of non-porous, so aluminum oxide can be injected into the organic layer.
  • inorganic aluminum oxide film layer is formed on the surface of the organic layer 311, inorganic aluminum oxide particles are formed inside the first organic layer 311, thereby forming an organic-inorganic hybrid packaging method.
  • This packaging method not only can effectively prevent the intrusion of water and oxygen, but also can reduce the film thickness of the packaging layer, is beneficial to bending, and can simplify the packaging process and save costs.
  • the thickness of the aluminum oxide inorganic film layer is 0.001 to 0.1 microns. If the thickness is too thick, the product production cycle will be prolonged, and if the thickness is too thin, the water and oxygen barrier performance will be too poor.
  • the organic-inorganic functional layer 31 is disposed on a surface of the organic light-emitting layer 20 facing away from the array substrate 10.
  • the first organic layer 311 is disposed on the upper surface of the organic light-emitting layer 20, and the first organic layer 311 covers the organic light-emitting layer 20.
  • the encapsulation layer 30 may further include a second organic layer 32 disposed on the organic-inorganic functional layer 31 to increase the bending performance of the display panel.
  • the array substrate 10 includes a base substrate and a thin film transistor array.
  • the array substrate may be a flexible substrate or a rigid substrate.
  • the organic light emitting layer 20 includes an anode, a hole injection layer, a hole transport layer, an organic light emitting material layer, an electron transport layer, an electron injection layer, and a cathode.
  • This embodiment also provides a method for manufacturing the above-mentioned OLED display panel 100, which includes the following steps:
  • the S20 includes: S201, forming a first organic layer 311 on the organic light-emitting layer 20; S202, depositing an inorganic material on the surface of the first organic layer 311 to form an inorganic film layer 312, wherein the inorganic film layer 312 covers the first organic layer 311 and the inorganic material is partially embedded in the first organic layer 311.
  • a display substrate 10 is provided.
  • the array substrate 10 includes a base substrate and an array of thin film transistors.
  • An organic light-emitting layer 20 is prepared on the array substrate 10, and then by inkjet printing or coating,
  • a first organic layer 311 is prepared on the organic light emitting layer 20, and the first organic layer 311 covers the organic light emitting layer 20.
  • an aluminum oxide film 312' is deposited on the entire surface of the first organic layer 311 and the array substrate 10 by an atom injection type atomic layer deposition method. Due to the loose texture of the organic layer, the atomic layer The method of depositing aluminum oxide makes the aluminum oxide have the characteristics of being non-porous. Therefore, part of the aluminum oxide can be injected into the first organic layer 311 through the surface of the first organic layer 311 to form inorganic particles 313.
  • the inorganic particles 313 form an inorganic interface inside the first organic layer 311 to make up for the poor water and oxygen barrier performance of the first organic layer 311.
  • the aluminum oxide film 312' is then etched to etch away the area that does not need to be packaged, and a patterned inorganic film layer 312 is formed in the area that needs to be packaged.
  • the organic-inorganic functional layer 31 may be formed by embedding silicon material in an organic layer.
  • sol-gel method ethyltrichlorosilane and diphenylsiliconediol can be baked at high temperature in N2 for 4 hours to make a colorless and transparent oligosiloxane resin, and then the oligosiloxane resin and Nanopox E600 containing SiO2 is combined to produce a silicon-based organic substance that can block water and oxygen, and then the silicon-based organic substance is coated on the organic light-emitting layer 20 as an organic-inorganic functional layer.
  • the organic-inorganic hybrid method adopted in the embodiment of the present invention makes the encapsulation structure not only the water and oxygen barrier properties of the inorganic layer, but also the flattening and bending of the organic layer. Fold characteristics. Since it has only one layer structure, it is beneficial to reduce the thickness of the encapsulation layer, so that the OLED device develops in the direction of lightness, thinness and flexibility.
  • a second organic layer 32 can be prepared on the organic-inorganic functional layer 31 by coating or inkjet printing to enhance the bending performance of the OLED device.
  • the overall thickness of the packaging film can be reduced while ensuring the packaging effect, and the bending performance of the OLED device can be improved.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种OLED显示面板及其制备方法，包括阵列基板、有机发光层、以及封装层，所述封装层包括有机无机功能层。通过设置有机无机功能层，能够在保证封装效果的同时，降低封装薄膜的整体厚度，且能够提升OLED器件的弯折性能，另外在封装制程中无需使用到掩模板，进而能够有效节约生产成本。

Description

OLED显示面板及其制备方法 技术领域
本发明涉及显示技术领域，尤其涉及一种OLED显示面板及其制备方法。
 背景技术
OLED（Organic Light-Emitting Diode，有机发光二极管）器件由于其具有自发光性、高亮度、广视角、响应速度快及可柔性显示等优点，已成为极具竞争力和发展前景的下一代显示器。由于OLED发光材料对水汽十分敏感， OLED器件被水汽侵蚀后，极易老化，使用寿命缩短，因此需要对OLED器件进行薄膜封装，以隔绝水汽。
目前薄膜封装通过有机层和无机层多层交替叠加的方式，延长水汽入侵路径，从而使得OLED器件在具备柔性功能的同时达到阻隔水汽的目的，但采用有机层和无机层层叠的方式，不仅工艺繁琐，且产品生产周期长，封装层的膜层也较厚，不利于OLED器件向柔性和轻薄方向发展。
 技术问题
本发明提供一种OLED显示面板及其制备方法，以解决现有的OLED显示面板中，由于现有的OLED器件的封装工艺较为繁琐，且封装薄膜的膜层厚度较厚不利于面板的弯折，进而不利于显示面板向轻薄化和可弯折等方向发展的问题。
 技术解决方案
为解决上述问题，本发明提供的技术方案如下：
本发明提供一种OLED显示面板及其制备方法，包括阵列基板、设置于所述阵列基板上的有机发光层、以及设置于所述有机发光层上且覆盖所述有机发光层的封装层；其中，所述封装层包括有机无机功能层和设置于所述有机无机功能层上的第二有机层，所述有机无机功能层远离所述有机发光层的一侧表面为无机膜层，其靠近所述有机发光层的一侧表面为第一有机层，且所述第一有机层内部嵌入有无机颗粒。
在本发明的一种实施例中，所述无机膜层设置于所述第一有机层表面且覆盖所述第一有机层。
在本发明的一种实施例中，所述有机无机功能层设置于所述有机发光层背离所述阵列基板的一侧表面。
在本发明的一种实施例中，所述无机颗粒和所述无机膜层的材料相同且通过同一制程制备。
在本发明的一种实施例中，所述无机膜层的厚度为0.001~0.1微米。
本发明提供一种OLED显示面板，包括阵列基板、设置于所述阵列基板上的有机发光层、以及设置于所述有机发光层上且覆盖所述有机发光层的封装层；其中，所述封装层包括有机无机功能层。
在本发明的一种实施例中，所述有机无机功能层的远离所述有机发光层的一侧表面为无机膜层，其靠近所述有机发光层的一侧表面为第一有机层，且所述第一有机层内部嵌入有无机颗粒。
在本发明的一种实施例中，所述无机膜层设置于所述第一有机层表面且覆盖所述第一有机层。
在本发明的一种实施例中，所述有机无机功能层设置于所述有机发光层背离所述阵列基板的一侧表面。
在本发明的一种实施例中，所述无机颗粒和所述无机膜层的材料相同且通过同一制程制备。
在本发明的一种实施例中，所述无机膜层的厚度为0.001~0.1微米。
在本发明的一种实施例中，所述有机无机功能层的材料为含有硅基团的有机物。
在本发明的一种实施例中，所述封装层还包括设置于所述有机无机功能层上的第二有机层。
本发明还提供一种OLED显示面板的制备方法，包括以下步骤：
S10，提供一阵列基板，在所述阵列基板上制备有机发光层；
S20，在所述有机发光层上形成有机无机功能层。
在本发明的一种实施例中，所述制备方法还包括：S30，在所述有机无机功能层上形成第二有机层
在本发明的一种实施例中，所述S20包括：
S201，在所述有机发光层上形成第一有机层；
S202，在所述第一有机层表面沉积无机材料以形成无机膜层，其中，所述无机膜层覆盖所述第一有机层且所述无机材料部分嵌入所述第一有机层内部。
在本发明的一种实施例中，所述无机膜层的材料为三氧化二铝材料。
在本发明的一种实施例中，所述S202具体包括：
通过原子层沉积法，在所述第一有机层表面整面沉积三氧化二铝薄膜，部分三氧化二铝嵌入所述第一有机层内部；
通过刻蚀，在所述第一有机层表面形成图案化的无机膜层。
在本发明的一种实施例中，所述无机膜层的厚度为0.001~0.1微米。
在本发明的一种实施例中，所述无机膜层覆盖所述第一有机层。
在本发明的一种实施例中，所述有机无机功能层的材料为含有硅基团的有机物。
 有益效果
本发明的有益效果为：通过设置有机无机功能层，能够在保证封装效果的同时，降低封装薄膜的整体厚度，且能够提升OLED器件的弯折性能，另外在封装制程中无需使用到掩模板，进而能够有效节约生产成本。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例的OELD显示面板的结构示意图；
图2为本发明实施例的OLED显示面板的制备方法的步骤流程图；
图3~图5为本发明实施例的OLED显示面板的制备过程的结构示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是用以相同标号表示。
本发明针对现有的OLED显示面板，由于现有的OLED器件的封装工艺较为繁琐，且封装薄膜的膜层厚度较厚不利于面板的弯折，进而不利于显示面板向轻薄化和可弯折等方向发展的问题，本实施例能够解决该缺陷。
如图1所示，本发明实施例提供一种OLED显示面板100，包括阵列基板10、有机发光层20、以及封装层30。
其中，所述有机发光层20设置于所述阵列基板10上，所述封装层30设置于所述有机发光层20上，且所述封装层30覆盖所述有机发光层20。
所述封装层30包括有机无机功能层31，由于现有技术中的封装层采用无机层和有机层交叠设置，膜层厚度较厚，不利于面板的轻薄化发展，且影响面板的弯折性能，因此本发明的实施例对封装层进行改进，将具有阻隔水氧性能的无机材料嵌入到弯折效果优良的有机层中，既能够减薄封装层的厚度，也能够提高OLED器件的弯折性能。
所述有机无机功能层31的远离所述有机发光层20的一侧表面为无机膜层312，所述有机无机功能层31的靠近所述有机发光层20的一侧表面为第一有机层311，且所述第一有机层311的内部嵌入有无机颗粒313。
所述无机膜层312设置于所述第一有机层311表面，且所述无机膜层312覆盖所述第一有机层311。所述无机颗粒313和所述无机膜层312经过同一制程制备而成，将无机材料沉积在所述第一有机层311表面形成所述无尽膜层312的同时，该无机材料嵌入所述第一有机层311的内部从而形成所述无机颗粒313。
所述无机颗粒313和所述无机膜层312的材料相同，可为三氧化二铝材料。
例如本实施例中的所述无机颗粒313和所述无机膜层312的材料可采用三氧化二铝，利用原子注入型的原子层沉积法将所述三氧化二铝沉积在所述第一有机层311的表面，由于有机层的质地疏松，阻隔水氧性较差，原子层沉积三氧化二铝的方式具有无孔不入的特点，因此三氧化二铝可注入到有机层中，在所述第一有机层311表面形成三氧化二铝无机膜层的同时，在所述第一有机层311内部形成三氧化二铝无机颗粒，从而形成有机-无机杂化的封装方式。此种封装方式在保证有效阻止水氧的入侵的同时，不仅能够降低封装层的膜厚，有利于弯折，且能够简化封装制程，节约成本。
所述三氧化二铝无机膜层的厚度为0.001~0.1微米，若厚度太厚则产品生产周期会延长，若厚度太薄则阻隔水氧性能太差。
在本实施例中，所述有机无机功能层31设置于所述有机发光层20背离所述阵列基板10的一侧表面。具体地，所述第一有机层311设置于所述有机发光层20的上表面，所述第一有机层311覆盖所述有机发光层20。
在本实施例的基础上，所述封装层30还可包括第二有机层32，所述第二有机层32设置于所述有机无机功能层31上，用以增加显示面板的弯折性能。
所述阵列基板10包括衬底基板和薄膜晶体管阵列，所述阵列基板可为柔性基板，也可为刚性基板。
所述有机发光层20包括阳极、空穴注入层、空穴传输层、有机发光材料层、电子传输层、电子注入层、以及阴极等器件。
本实施例还提供一种上述OLED显示面板100的制备方法，包括以下步骤：
S10，提供一阵列基板10，在所述阵列基板10上制备有机发光层20；
S20，在所述有机发光层20上形成有机无机功能层31。
如图2所示，下面详细介绍所述制备方法。
所述S20包括：S201，在所述有机发光层20上形成第一有机层311；S202，在所述第一有机层311表面沉积无机材料以形成无机膜层312，其中，所述无机膜层312覆盖所述第一有机层311且所述无机材料部分嵌入所述第一有机层311内部。
如图3所示，提供一陈列基板10，所述阵列基板10包括衬底基板和薄膜晶体管阵列，在所述阵列基板10上制备有机发光层20，再通过喷墨打印或涂布的方式，在所述有机发光层20上制备第一有机层311，所述第一有机层311覆盖所述有机发光层20。
如图4所示，通过原子注入型的原子层沉积法，在所述第一有机层311和阵列基板10上整面沉积三氧化二铝薄膜312’，由于有机层的质地疏松，而原子层沉积三氧化二铝的方式使得三氧化二铝具有无孔不入的特点，因此部分三氧化二铝可通过所述第一有机层311的表面注入到所述第一有机层311内部形成无机颗粒313，所述无机颗粒313在所述第一有机层311的内部形成一层无机界面，以用于弥补所述第一有机层311的阻隔水氧性能差的不足。
如图5所示，接着对所述三氧化二铝薄膜312’进行刻蚀，将不需要封装的区域刻蚀掉，在需要封装的区域形成图案化的无机膜层312。
在其他的实施例中，所述有机无机功能层31可采用将硅材料嵌入到有机层中形成。可通过溶胶凝胶法，将乙基三氯硅烷和二苯基硅二醇在N2 中高温烘烤4小时制成无色透明的低聚硅氧烷树脂，然后将低聚硅氧烷树脂和含SiO2的Nano pox E600结合生成含有硅基的具有阻隔水氧的有机物，然后再将该含有硅基的有机物通过涂布在所述有机发光层20上的方式作为有机无机功能层使用。
与传统的无机/有机交替沉积的封装方式相比，本发明的实施例采用的有机-无机杂化方式使得封装结构既具有无机层的阻隔水氧的性能，又具有有机层的平坦化以及弯折特性。由于仅具有一层结构，因此有利于降低封装层的厚度，使得OLED器件向轻薄化和可弯折方向发展。
在上述实施例的基础上，可通过涂布或喷墨打印的方式再在所述有机无机功能层31上制备第二有机层32，以增强OLED器件的弯折性能。
有益效果：通过设置有机无机功能层，能够在保证封装效果的同时，降低封装薄膜的整体厚度，且能够提升OLED器件的弯折性能，另外在封装制程中无需使用到掩模板，进而能够有效节约生产成本。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种OLED显示面板，包括：
    阵列基板；
    有机发光层，设置于所述阵列基板上；以及
    封装层，设置于所述有机发光层上且覆盖所述有机发光层；其中，
    所述封装层包括有机无机功能层和设置于所述有机无机功能层上的第二有机层，所述有机无机功能层远离所述有机发光层的一侧表面为无机膜层，其靠近所述有机发光层的一侧表面为第一有机层，且所述第一有机层内部嵌入有无机颗粒。
  2. 根据权利要求1所述的OLED显示面板，其中，所述无机膜层设置于所述第一有机层表面且覆盖所述第一有机层。
  3. 根据权利要求1所述的OLED显示面板，其中，所述有机无机功能层设置于所述有机发光层背离所述阵列基板的一侧表面。
  4. 根据权利要求1所述的OLED显示面板，其中，所述无机颗粒和所述无机膜层的材料相同且通过同一制程制备。
  5. 根据权利要求1所述的OLED显示面板，其中，所述无机膜层的厚度为0.001~0.1微米。
  6. 一种OLED显示面板，包括：
    阵列基板；
    有机发光层，设置于所述阵列基板上；以及
    封装层，设置于所述有机发光层上且覆盖所述有机发光层；其中，
    所述封装层包括有机无机功能层。
  7. 根据权利要求6所述的OLED显示面板，其中，所述有机无机功能层远离所述有机发光层的一侧表面为无机膜层，其靠近所述有机发光层的一侧表面为第一有机层，且所述第一有机层内部嵌入有无机颗粒。
  8. 根据权利要求7所述的OLED显示面板，其中，所述无机膜层设置于所述第一有机层表面且覆盖所述第一有机层。
  9. 根据权利要求7所述的OLED显示面板，其中，所述有机无机功能层设置于所述有机发光层背离所述阵列基板的一侧表面。
  10. 根据权利要求7所述的OLED显示面板，其中，所述无机颗粒和所述无机膜层的材料相同且通过同一制程制备。
  11. 根据权利要求7所述的OLED显示面板，其中，所述无机膜层的厚度为0.001~0.1微米。
  12. 根据权利要求6所述的OLED显示面板，其中，所述有机无机功能层的材料为含有硅基团的有机物。
  13. 根据权利要求6所述的OLED显示面板，其中，所述封装层还包括设置于所述有机无机功能层上的第二有机层。
  14. 一种OLED显示面板的制备方法，包括以下步骤：
    S10，提供一阵列基板，在所述阵列基板上制备有机发光层；
    S20，在所述有机发光层上形成有机无机功能层。
  15. 根据权利要求14所述的制备方法，其中，所述制备方法还包括：S30，在所述有机无机功能层上形成第二有机层。
  16. 根据权利要求14所述的制备方法，其中，所述S20包括：
    S201，在所述有机发光层上形成第一有机层；
    S202，在所述第一有机层表面沉积无机材料以形成无机膜层，其中，所述无机膜层覆盖所述第一有机层且所述无机材料部分嵌入所述第一有机层内部。
  17. 根据权利要求16所述的制备方法，其中，所述S202包括：
    通过原子层沉积法，在所述第一有机层表面整面沉积三氧化二铝薄膜，部分三氧化二铝嵌入所述第一有机层内部；
    通过刻蚀，在所述第一有机层表面形成图案化的无机膜层。
  18. 根据权利要求17所述的制备方法，其中，所述无机膜层的厚度为0.001~0.1微米。
  19. 根据权利要求17所述的制备方法，其中，所述无机膜层覆盖所述第一有机层。
  20. 根据权利要求14所述的制备方法，其中，所述有机无机功能层的材料为含有硅基团的有机物。
PCT/CN2019/106922 2019-06-26 2019-09-20 Oled显示面板及其制备方法 Ceased WO2020258544A1 (zh)

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