WO2020258140A1 - Fpc板以及应用该fpc板的发声装置 - Google Patents

Fpc板以及应用该fpc板的发声装置 Download PDF

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Publication number
WO2020258140A1
WO2020258140A1 PCT/CN2019/093227 CN2019093227W WO2020258140A1 WO 2020258140 A1 WO2020258140 A1 WO 2020258140A1 CN 2019093227 W CN2019093227 W CN 2019093227W WO 2020258140 A1 WO2020258140 A1 WO 2020258140A1
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WO
WIPO (PCT)
Prior art keywords
layer
fpc board
board according
butting
substrate
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Application number
PCT/CN2019/093227
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English (en)
French (fr)
Inventor
张古清
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瑞声声学科技(深圳)有限公司
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Application filed by 瑞声声学科技(深圳)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Priority to PCT/CN2019/093227 priority Critical patent/WO2020258140A1/zh
Priority to CN201921003998.5U priority patent/CN210075567U/zh
Publication of WO2020258140A1 publication Critical patent/WO2020258140A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits

Definitions

  • the present invention relates to the technical field of acoustics, in particular to an FPC board and a sound generating device using the FPC board.
  • the speaker in the prior art includes a speaker unit and an FPC board.
  • the speaker unit includes a basin frame and a magnetic bowl arranged on the basin frame.
  • the FPC board is attached to the magnetic bowl.
  • the static electricity generated by the speaker is eliminated by grounding the FPC board.
  • the pads on the FPC board and the magnetic bowl are in poor contact, it is easy to cause the resistance between the FPC board and the magnetic bowl to increase, and even an open circuit occurs. Once an open circuit occurs, the static electricity generated by the speaker cannot be eliminated through the FPC board grounding, causing static electricity to interfere with the magnetic field conducted by the magnetic bowl, thereby affecting the performance of the speaker.
  • the purpose of the present invention is to provide an FPC board and a sound generating device using the FPC board, which solves the technical problem of poor conduction between the FPC board and the magnetic bowl in the prior art.
  • An FPC board for electrically connecting with a docking device comprising a substrate, a copper wire layer provided on the substrate, a docking layer provided on the copper wire layer to be electrically connected to the docking device, and surrounding the docking layer And the first bonding layer covering the copper wire layer and the substrate, the insulating layer surrounding the butting layer and covering the first bonding layer, and the second bonding layer surrounding the butting layer and covering the insulating layer The bonding layer, wherein the docking layer extends beyond the surface of the second bonding layer to be electrically connected to the docking device.
  • the bottom of the substrate is provided with a pattern layer.
  • the docking layer is any one of a copper-plated layer, a silver-plated layer, and a gold-plated layer.
  • the thickness of the docking layer is 85-95um.
  • the first adhesive layer is any one of adipic acid dihydrazide layer, diacetone acrylamide layer, and acrylic hot melt adhesive layer.
  • the thickness of the first adhesive layer is 13-17um.
  • the insulating layer is any one of a phenolic resin layer, a glass fiber cloth layer, a polyester film layer, and a polyimide film layer.
  • the thickness of the insulating layer is 12-13um.
  • the second adhesive layer is a pressure-sensitive adhesive layer.
  • a sounding device comprising a sounding monomer and the above-mentioned FPC board.
  • the sounding monomer includes a basin frame and a magnetic bowl arranged on the basin frame, and the second adhesive layer is partially attached to the magnetic bowl On the bottom surface facing away from the basin frame, the butting layer is in contact with the magnetic bowl to achieve grounding.
  • the invention provides an FPC board and a sound generating device using the FPC board.
  • a butting layer is added on a copper wire layer, and the butting layer extends beyond the surface of the second adhesive layer to be electrically connected to the butting device. Since the FPC board is flexible, the second adhesive layer and the magnetic bowl can be closely attached, while the butting layer and the magnetic bowl can always be in reliable contact, so that the static electricity generated by the sound device can be smoothly eliminated through the FPC board grounding, effectively Ground to ensure the performance of the sound device.
  • Figure 1 is an exploded view of a vocal monomer according to an embodiment of the present invention
  • FIG. 2 is a schematic diagram of an FPC board according to an embodiment of the present invention.
  • FIG. 3 is a schematic diagram of bonding the FPC board and the magnetic bowl according to an embodiment of the present invention.
  • Fig. 1 is an exploded view of a vocal monomer according to an embodiment of the present invention.
  • the sound-emitting unit 2 includes a basin frame 21 with a receiving space 212, a magnetic bowl 22 connected to the bottom of the basin frame 21 and forming a storage space with the basin frame 21, and a magnetic bowl contained in the receiving space 212.
  • the magnetic circuit system 23 includes a first magnet part 231 and a second magnet part 232, the second magnet part 232 is arranged around the first magnet part 231 and forms a magnetic gap with the first magnet part 231;
  • the vibration system 24 includes a diaphragm 241 fixed on the top of the basin frame 21 and a voice coil 242 whose one end is connected to the diaphragm 241 and the other end is inserted into the magnetic gap and drives the diaphragm 241 to vibrate;
  • the vibration system 24 includes a diaphragm 241 fixed on the top of the basin frame 21 The upper diaphragm 241, one end connected to the upper diaphragm 241 and a voice coil 242 inserted into the magnetic gap at the other end to drive the upper diaphragm 241 to vibrate, and a lower diaphragm 243 fixed to the frame 21 and opposed to the upper diaphragm 241 at intervals. .
  • Fig. 2 is a schematic diagram of an FPC board according to an embodiment of the present invention.
  • the FPC board 1 is used to electrically connect with the docking device.
  • the FPC board 1 includes a substrate 11, a copper wire layer 12 disposed on the substrate 11, and a copper wire layer 12 to be electrically connected to the docking device.
  • the connected butt layer 13, the first bonding layer 14 surrounding the butting layer 13 and covering the copper wire layer 12 and the substrate 11, the insulating layer 15 surrounding the butting layer 13 and covering the first bonding layer 14, and the surrounding butting layer 13 and covering The second adhesive layer 16 of the insulating layer 15, wherein the butting layer 13 extends beyond the surface of the second adhesive layer 16 to be electrically connected to the butting device.
  • the top of the second adhesive layer 16 is lower than the top of the mating layer 13.
  • the mating layer 13 and the magnetic bowl 22 are always in reliable contact , So that the FPC board 1 and the magnetic bowl 22 can achieve reliable conduction.
  • the top of the second adhesive layer 16 may also be flush with the top of the mating layer 13.
  • a pattern layer 17 is provided on the bottom of the substrate 11, and the pattern layer 17 is made of FR-4 material. Wherein, the circuit pattern on the FPC board 1 matches the pattern on the pattern layer 17.
  • the substrate 11 is a substrate made of polyimide film (PI) material. It can be understood that, in an alternative embodiment, the substrate 11 may also be a substrate made of polyester film (PET) material.
  • PI polyimide film
  • PET polyester film
  • the copper wire layer 12 is a copper foil pad.
  • the mating layer 13 is a copper-plated layer. It can be understood that, in an alternative embodiment, the mating layer 13 may also be a silver-plated layer, a gold-plated layer, or a mating layer made of other conductive materials.
  • the thickness of the docking layer 13 is 90 um. It can be understood that, in an alternative embodiment, the thickness of the docking layer 13 is not limited to 90 um, and can be selected in the range of 85-95 um.
  • the first adhesive layer 14 is an adipic acid dihydrazide layer (ADH). It can be understood that, in an alternative embodiment, the first adhesive layer 14 may also be a diacetone acrylamide layer (DAAM), an acrylic hot melt adhesive layer (AD glue), or a first adhesive layer made of other adhesive materials. Junction layer.
  • ADH adipic acid dihydrazide layer
  • DAAM diacetone acrylamide layer
  • AD glue acrylic hot melt adhesive layer
  • Junction layer a first adhesive layer made of other adhesive materials.
  • the thickness of the first adhesive layer 14 is 15 um. It can be understood that, in an alternative embodiment, the thickness of the first adhesive layer 14 is not limited to 15um, and can be selected in the range of 13-17um.
  • the insulating layer 15 is a polyimide film layer (PI layer). It can be understood that, in an alternative embodiment, the insulating layer 15 may also be a phenolic resin layer, a glass fiber cloth layer, a polyester film layer (PET layer), or an insulating layer made of other reinforcing materials.
  • PI layer polyimide film layer
  • PET layer polyester film layer
  • the thickness of the insulating layer 15 is 12.5 um. It can be understood that, in an alternative embodiment, the thickness of the insulating layer 15 is not limited to 12.5 um, and can be selected in the range of 12-13 um.
  • the second adhesive layer 16 is a pressure-sensitive adhesive layer (Pressure Sensitive Adhesive, PSA).
  • PSA Pressure Sensitive Adhesive
  • FIG. 3 is a schematic diagram of bonding the FPC board and the magnetic bowl according to an embodiment of the present invention.
  • the sounding device 10 includes a sounding monomer and the FPC board 1 as in any of the foregoing embodiments.
  • the sounding monomer includes a basin frame and a magnetic bowl 22 arranged on the basin frame, and a second adhesive layer 16 It is partially attached to the bottom surface of the magnetic bowl 22 facing away from the basin frame, and the butting layer 13 is in contact with the magnetic bowl 22 to achieve grounding.
  • a butting layer 13 is added on the copper wire layer 12, and the butting layer 13 is extended beyond the surface of the second adhesive layer 16 to be electrically connected to the butting device. Because the FPC board 1 is flexible, the second adhesive layer 16 and the magnetic bowl 22 are in close contact with each other, and the butting layer 13 and the magnetic bowl 22 are always in reliable contact, so that the static electricity generated by the sound device 10 can pass smoothly. The grounding of the FPC board 1 is eliminated, which effectively guarantees the performance of the sound generating device 10.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种FPC板（1）以及应用该FPC板（1）的发声装置，该FPC板（1）包括基板（11）、设置在所述基板（11）上的铜线层（12）、设置于所述铜线层（12）上以与对接装置电连接的对接层（13）、环绕所述对接层（13）且覆盖所述铜线层（12）与所述基板（11）的第一粘结层（14）、环绕所述对接层（13）且覆盖所述第一粘结层（14）的绝缘层（15）以及环绕所述对接层（13）且覆盖所述绝缘层（15）的第二粘结层（16），其中，所述对接层（13）延伸超出所述第二粘结层（16）的表面与对接装置电连接。由于FPC板（1）是柔性的，使得第二粘结层（16）和磁碗（22）紧密贴合的同时，能够使对接层（13）和磁碗（22）始终可靠的接触，从而使发声装置产生的静电能够顺利通过FPC板（1）接地消除，有效地保证了发声装置的性能。

Description

FPC板以及应用该FPC板的发声装置 技术领域
本发明涉及声学技术领域，尤其涉及一种FPC板以及应用该FPC板的发声装置。
 背景技术
随着移动互联网时代的到来，智能移动设备的数量不断上升。而在众多移动设备之中，手机无疑是最常见、最便携的移动终端设备。目前，手机的功能及其多样，其中之一便是高品质的音乐功能，而手机中的扬声器便是实现这个高品质音乐功能的必备条件之一。
现有技术中的扬声器包括扬声器单体和FPC板，扬声器单体包括盆架以及设置在盆架上的磁碗，FPC板贴合在磁碗上。扬声器产生的静电通过FPC板接地消除。但是，当FPC板上的焊盘和磁碗接触不良时，容易导致FPC板和磁碗之间的电阻变大，甚至出现断路的现象。一旦出现断路的现象，则扬声器产生的静电无法通过FPC板接地消除，导致静电干扰磁碗导通的磁场，从而影响扬声器的性能。
因此，有必要提供一种FPC板以及应用该FPC板的发声装置，使FPC板和磁碗始终保持可靠的导通。
 技术问题
本发明的目的在于提供一种FPC板以及应用该FPC板的发声装置，其解决了现有技术中FPC板和磁碗导通不畅的技术问题。
 技术解决方案
为了解决上述技术问题，本发明提供的技术方案为：
一种FPC板，用以与对接装置电连接，包括基板、设置在所述基板上的铜线层、设置于所述铜线层上以与对接装置电连接的对接层、环绕所述对接层且覆盖所述铜线层与所述基板的第一粘结层、环绕所述对接层且覆盖所述第一粘结层的绝缘层以及环绕所述对接层且覆盖所述绝缘层的第二粘结层，其中，所述对接层延伸超出所述第二粘结层的表面与对接装置电连接。
其中，所述基板的底部设有图案层。
其中，所述对接层为镀铜层、镀银层及镀金层中的任一种。
其中，所述对接层的厚度为85-95um。
其中，所述第一粘结层为己二酸二酰肼层、双丙酮丙烯酰胺层及丙烯酸热熔胶层中的任一种。
其中，所述第一粘结层的厚度为13-17um。
其中，所述绝缘层为酚醛树脂层、玻璃纤维布层、聚酯薄膜层及聚酰亚胺薄膜层中的任一种。
其中，所述绝缘层的厚度为12-13um。
其中，所述第二粘结层为压敏胶层。
一种发声装置，包括发声单体以及上述的FPC板，所述发声单体包括盆架以及设置在所述盆架上的磁碗，所述第二粘结层部分贴合在所述磁碗背向盆架的底面上，所述对接层和所述磁碗接触从而实现接地。
 有益效果
本发明提供了一种FPC板以及应用该FPC板的发声装置，通过在铜线层上增设一层对接层，并且使对接层延伸超出所述第二粘结层的表面与对接装置电连接。由于FPC板是柔性的，使得第二粘结层和磁碗紧密贴合的同时，能够使对接层和磁碗始终可靠的接触，从而使发声装置产生的静电能够顺利通过FPC板接地消除，有效地保证了发声装置的性能。
 附图说明
参照附图，本发明的公开内容将更加显然。应当了解，这些附图仅仅用于说明的目的，而并非意在对本发明的保护范围构成限制。图中：
图1为本发明的一个实施例的发声单体的爆炸图；
图2为本发明的一个实施例的FPC板的示意图；
图3为本发明的一个实施例的FPC板和磁碗贴合的示意图。
 本发明的实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
图1为本发明的一个实施例的发声单体的爆炸图。
从图中可以看出，该发声单体2包括具有收容空间212的盆架21、连接于盆架21的底部并与盆架21形成收纳空间的磁碗22、收容于收容空间212内的磁路系统23和振动系统24；磁路系统23包括第一磁体部231和第二磁体部232，第二磁体部232围绕第一磁体部231设置并与第一磁体部231形成磁间隙；振动系统24包括固设于盆架21的顶部的振膜241和一端连接于振膜241另一端插入磁间隙并驱动振膜241振动的音圈242；振动系统24包括固设于盆架21的顶部的上振膜241、一端连接于上振膜241另一端插入磁间隙并驱动上振膜241振动的音圈242，以及固定于盆架21并与上振膜241相对且间隔设置的下振膜243。
图2为本发明的一个实施例的FPC板的示意图。
从图中可以看出，该FPC板1用以与对接装置电连接，该FPC板1包括基板11、设置在基板11上的铜线层12、设置于铜线层12上以与对接装置电连接的对接层13、环绕对接层13且覆盖铜线层12与基板11的第一粘结层14、环绕对接层13且覆盖第一粘结层14的绝缘层15以及环绕对接层13且覆盖绝缘层15的第二粘结层16，其中，对接层13延伸超出第二粘结层16的表面与对接装置电连接。
在本实施例中，第二粘结层16的顶部低于对接层13的顶部，当第二粘结层16贴合到磁碗22上时，使得对接层13和磁碗22始终可靠的接触，从而使FPC板1和磁碗22实现可靠的导通。可以了解，在可选的实施例中，第二粘结层16的顶部也可以和对接层13的顶部齐平。
在本实施例中，基板11的底部设有图案层17，图案层17由FR-4材料制成。其中，FPC板1上的线路图案和图案层17上的图案相吻合。
在本实施例中，基板11为聚酰亚胺薄膜（PI）材料制成的基板。可以了解，在可选的实施例中，基板11也可以为聚酯薄膜（PET）材料制成的基板。
在本实施例中，铜线层12为铜箔焊盘。
在本实施例中，对接层13为镀铜层。可以了解，在可选的实施例中，对接层13也可以为镀银层、镀金层或者由其他导电材料制成的对接层等。
在实施例中，对接层13的厚度为90um。可以了解，在可选的实施例中，对接层13的厚度并不局限于90um，可以在85-95um的范围内进行选择。
在本实施例中，第一粘结层14为己二酸二酰肼层(ADH)。可以了解，在可选的实施例中，第一粘结层14也可以为双丙酮丙烯酰胺层（DAAM）、丙烯酸热熔胶层（AD胶）或者由其他粘结材料制成的第一粘结层。
在本实施例中，第一粘结层14的厚度为15um。可以了解，在可选的实施例中，第一粘结层14的厚度并不局限于15um，可以在13-17um的范围内进行选择。
在本实施例中，绝缘层15为聚酰亚胺薄膜层（PI层）。可以了解，在可选的实施例中，绝缘层15也可以为酚醛树脂层、玻璃纤维布层、聚酯薄膜层（PET层）或者由其他补强材料制成的绝缘层。
在本实施例中，绝缘层15的厚度为12.5um。可以了解，在可选的实施例中，绝缘层15的厚度并不局限于12.5um，可以在12-13um的范围内进行选择。
在本实施例中，第二粘结层16为压敏胶层(Pressure Sensitive Adhesive，PSA)。
图3为本发明的一个实施例的FPC板和磁碗贴合的示意图。
从图中可以看出，该发声装置10包括发声单体以及如前述任一实施例的FPC板1，发声单体包括盆架以及设置在盆架上的磁碗22，第二粘结层16部分贴合在磁碗22背向盆架的底面上，对接层13和磁碗22接触从而实现接地。
在本实施例中，通过在铜线层12上增设一层对接层13，并且使对接层13延伸超出第二粘结层16的表面与对接装置电连接。由于FPC板1是柔性的，使得第二粘结层16和磁碗22紧密贴合的同时，能够使对接层13和磁碗22始终可靠的接触，从而使发声装置10产生的静电能够顺利通过FPC板1接地消除，有效保证了发声装置10的性能。
以上所述的仅是本发明的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出改进，但这些均属于本发明的保护范围。

Claims (10)

  1. 一种FPC板，用以与对接装置电连接，其特征在于，包括基板、设置在所述基板上的铜线层、设置于所述铜线层上以与对接装置电连接的对接层、环绕所述对接层且覆盖所述铜线层与所述基板的第一粘结层、环绕所述对接层且覆盖所述第一粘结层的绝缘层以及环绕所述对接层且覆盖所述绝缘层的第二粘结层，其中，所述对接层延伸超出所述第二粘结层的表面与对接装置电连接。
  2. 根据权利要求1所述的FPC板，其特征在于：所述基板的底部设有图案层。
  3. 根据权利要求1所述的FPC板，其特征在于：所述对接层为镀铜层、镀银层及镀金层中的任一种。
  4. 根据权利要求1所述的FPC板，其特征在于：所述对接层的厚度为85-95um。
  5. 根据权利要求1所述的FPC板，其特征在于：所述第一粘结层为己二酸二酰肼层、双丙酮丙烯酰胺层及丙烯酸热熔胶层中的任一种。
  6. 根据权利要求1所述的FPC板，其特征在于：所述第一粘结层的厚度为13-17um。
  7. 根据权利要求1所述的FPC板，其特征在于：所述绝缘层为酚醛树脂层、玻璃纤维布层、聚酯薄膜层及聚酰亚胺薄膜层中的任一种。
  8. 根据权利要求1所述的FPC板，其特征在于：所述绝缘层的厚度为12-13um。
  9. 根据权利要求1所述的FPC板，其特征在于：所述第二粘结层为压敏胶层。
  10. 一种发声装置，其特征在于，包括发声单体以及权利要求1-9任一项所述的FPC板，所述发声单体包括盆架以及设置在所述盆架上的磁碗，所述第二粘结层部分贴合在所述磁碗背向盆架的底面上，所述对接层和所述磁碗接触从而实现接地。
PCT/CN2019/093227 2019-06-27 2019-06-27 Fpc板以及应用该fpc板的发声装置 WO2020258140A1 (zh)

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Publication number Priority date Publication date Assignee Title
CN1942015A (zh) * 2005-09-28 2007-04-04 日本电产鸽株式会社 扬声器
CN201657296U (zh) * 2010-03-29 2010-11-24 瑞声光电科技(常州)有限公司 微型发声器件
KR20180093371A (ko) * 2017-02-13 2018-08-22 에잇비트 주식회사 무선 스테레오 헤드셋 성능 개선을 위한 시스템
CN109587945A (zh) * 2018-12-26 2019-04-05 珠海超群电子科技有限公司 一种fpc板及其制作工艺

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1942015A (zh) * 2005-09-28 2007-04-04 日本电产鸽株式会社 扬声器
CN201657296U (zh) * 2010-03-29 2010-11-24 瑞声光电科技(常州)有限公司 微型发声器件
KR20180093371A (ko) * 2017-02-13 2018-08-22 에잇비트 주식회사 무선 스테레오 헤드셋 성능 개선을 위한 시스템
CN109587945A (zh) * 2018-12-26 2019-04-05 珠海超群电子科技有限公司 一种fpc板及其制作工艺

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