WO2021058008A1 - 一种用于发声装置的导电膜以及发声装置 - Google Patents

一种用于发声装置的导电膜以及发声装置 Download PDF

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Publication number
WO2021058008A1
WO2021058008A1 PCT/CN2020/118505 CN2020118505W WO2021058008A1 WO 2021058008 A1 WO2021058008 A1 WO 2021058008A1 CN 2020118505 W CN2020118505 W CN 2020118505W WO 2021058008 A1 WO2021058008 A1 WO 2021058008A1
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layer
conductive layer
conductive
conductive film
substrate
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PCT/CN2020/118505
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English (en)
French (fr)
Inventor
郭晓冬
夏永丰
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歌尔股份有限公司
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Publication of WO2021058008A1 publication Critical patent/WO2021058008A1/zh

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06Loudspeakers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00Diaphragms for electromechanical transducers; Cones
    • H04R7/02Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04Plane diaphragms
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02Details
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2207/00Details of diaphragms or cones for electromechanical transducers or their suspension covered by H04R7/00 but not provided for in H04R7/00 or in H04R2307/00
    • H04R2207/021Diaphragm extensions, not necessarily integrally formed, e.g. skirts, rims, flanges
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00Loudspeakers
    • H04R2400/11Aspects regarding the frame of loudspeaker transducers

Definitions

  • the present invention relates to the field of electro-acoustic conversion technology, and more specifically, the present invention relates to a conductive film for a sound emitting device and a sound emitting device.
  • the sounding device generally includes a diaphragm and a voice coil combined on one side of the diaphragm, and also includes an electrical connection that electrically connects the internal circuit and the external circuit of the sounding device.
  • the voice coil includes two voice coil leads.
  • the two voice coil leads are electrically connected to the two pads of the electrical connector by spot welding.
  • the electrical connector is electrically connected to the external circuit at the same time to pass the electrical signal of the terminal product. Control the electrical signal in the voice coil.
  • the lead wire of the voice coil needs to run a certain length of thread, and then it is suspended in the air to realize the electrical connection with the electrical connector.
  • the floating lead structure can achieve higher sensitivity, due to the limitation of the lead floating, the amplitude cannot be too large, and the risk of disconnection is high, the low frequency effect is not significant enough, and it cannot provide a better user hearing experience.
  • An object of the present invention is to provide a conductive film for a sound emitting device and a new technical solution for the sound emitting device.
  • a conductive film for a sound emitting device comprising a conductive layer and a first substrate layer and a second substrate layer located on both sides of the conductive layer, the conductive film including An inner side portion of the inner side, a bent deformed portion provided on the outer side of the inner portion, and an outer side portion provided on the outer side of the deformed portion;
  • the conductive layer includes a first conductive layer provided on the inner portion, a second conductive layer provided on the deformed portion, and a third conductive layer provided on the outer portion, the second conductive layer Two ends of the layer are respectively electrically connected to the first conductive layer and the third conductive layer, and the first conductive layer, the second conductive layer and the third conductive layer are connected to form at least one conductive circuit;
  • Both the first conductive layer and the third conductive layer are made of metal foil, and the Young's modulus of the second conductive layer is smaller than the Young's modulus of the metal foil;
  • the first substrate layer is a thermoplastic elastomer layer.
  • both ends of the second conductive layer extend to the first conductive layer and the third conductive layer, respectively.
  • the second conductive layer is a conductive layer formed by coating or printing.
  • the second conductive layer is a conductive adhesive layer.
  • the conductive adhesive layer is conductive silver adhesive.
  • the second conductive layer is a conductive ink layer.
  • the first conductive layer and the third conductive layer are both copper foils.
  • the substrate layer includes a first substrate layer and a second substrate layer directly attached to the conductive layer, and the first conductive layer and the third conductive layer are formed by hot pressing or bonding. Connected with the first substrate layer in a manner;
  • the second conductive layer is coated or printed with the first substrate layer and the first conductive layer. Layer and the third conductive layer are connected together;
  • the second substrate layer and the first substrate layer, the first conductive layer, the second conductive layer, and the third conductive layer are connected together by hot pressing or bonding.
  • the first conductive layer and the third conductive layer are connected to the first substrate layer by hot pressing;
  • the second conductive layer is coated or printed with the first substrate layer and the first conductive layer.
  • the layer and the third conductive layer are connected together.
  • the second substrate layer is a thermoplastic elastomer layer
  • the second substrate layer and the first substrate layer, the first conductive layer, the second conductive layer, and the third The conductive layers are connected together by hot pressing.
  • thermoplastic elastomer is TPU material or TPEE material.
  • the conductive film further includes a third substrate layer, and the third substrate layer is attached to the surface of the first substrate layer and/or the second substrate layer away from the conductive layer on.
  • the material of the third substrate layer is plastic, thermoplastic elastomer or rubber.
  • the material of the third substrate layer is any one of PEEK, PAR, PEI, PI, PPS, PEN, PET, TPEE, and TPU.
  • a glue layer is provided between the third substrate layer and the first substrate layer and/or the third substrate layer.
  • an inner pad is provided on the first conductive layer
  • an outer pad is provided on the third conductive layer
  • the inner pad is configured to be connected to a voice coil
  • the outer pad Configured as: used to connect with external circuits
  • Both the inner pad and the outer pad are exposed from the substrate layer.
  • the first conductive layer, the second conductive layer, and the third conductive layer each include at least two parts that are independent of each other.
  • the first conductive layer, the second conductive layer, and the third conductive layer At least two independent conductive lines are formed.
  • a sound generating device including a vibration system and a magnetic circuit system matched with the vibration system;
  • the vibration system includes a sounding diaphragm and a voice coil combined on one side of the sounding diaphragm, and the sounding diaphragm adopts the conductive film described above.
  • a sound generating device including a vibration system and a magnetic circuit system matched with the vibration system;
  • the vibration system includes a sounding diaphragm, a voice coil coupled to one side of the sounding diaphragm, and a supporting diaphragm for elastically supporting the voice coil, and the supporting diaphragm adopts the conductive film as described above.
  • the conductive layer is compounded inside the substrate layer, the first conductive layer and the third conductive layer on the inner and outer sides are made of metal foil, and the second conductive layer is located on the deformed part Using a material with a Young’s modulus smaller than the above-mentioned metal foil, the above-mentioned structure is arranged, the conductive film is connected with the voice coil, and the voice coil lead can be extended for a short length to be connected to the first conductive layer, and then the third conductive layer is electrically connected The layer is connected with the external circuit, and the voice coil lead does not need to be provided with a suspended structure, so the risk of disconnection can be avoided.
  • the vibration system of the sound device can have large amplitude and high sensitivity, which improves low-frequency performance.
  • the conductive film of the present invention overcomes the problems of difficulty and low reliability of the conductive film in the prior art, and can realize mass production.
  • the first conductive layer and the third conductive layer use metal foils with a high Young's modulus, which can improve the structural strength of the inner and outer parts, and make the two parts less likely to be deformed.
  • the carrier for the voice coil lead welding, the third conductive layer is used as the carrier for welding with the external circuit.
  • metal foil can withstand high temperature during welding without scalding the base layer of the conductive film; and the second conductive layer adopts Young's modulus Smaller materials, such as conductive adhesive, make the second conductive layer adapt to repeated bending and deformation without breaking, and prevent the conductive layer from being broken due to frequent deformation of the deformed part during the reciprocating vibration of the conductive film.
  • Fig. 1 is a schematic structural diagram of a sound emitting device in an embodiment of the present invention.
  • Fig. 2 is a schematic diagram of the structure of a conductive film in an embodiment of the present invention.
  • FIG 3 is a schematic plan view of the first conductive layer and the third conductive layer in the conductive film in an embodiment of the present invention.
  • Fig. 4 is a schematic plan view of a second conductive layer in a conductive film in an embodiment of the present invention.
  • Fig. 5 is a schematic plan view of a conductive layer in a conductive film in an embodiment of the present invention.
  • Fig. 6 is a cross-sectional view of part A in Fig. 5.
  • Fig. 7 is a cross-sectional view of part B in Fig. 5.
  • Fig. 8 is a schematic structural diagram of a sound generating device in another embodiment of the present invention.
  • Fig. 9 is an exploded schematic diagram of the sound generating device in the embodiment of Fig. 8.
  • FIG. 10 is a schematic diagram of the structure of the conductive film in the embodiment of FIG. 8.
  • the sound-producing device applied to electronic equipment capable of sounding such as earphones and mobile phones generally includes a housing 10, a vibration system 20 and a magnetic circuit system 30 mounted on the housing 10, where all
  • the vibration system 20 includes a sounding diaphragm 201 and a voice coil 202 combined with the sounding diaphragm 201.
  • the magnetic circuit system 30 includes a magnetic yoke and a central magnetic circuit part provided on the bottom wall of the magnetic yoke. And the side magnetic circuit part, a magnetic gap is formed between the central magnetic circuit part and the side magnetic circuit part, and the voice coil 202 extends into the magnetic gap. After the current is applied to the voice coil 202, the voice coil 202 The force is vibrated under the action of the magnetic field of the magnetic circuit system 30, which in turn drives the sound diaphragm 201 to vibrate and produce sound.
  • an elastic support structure is further provided in the vibration system 20, such as a support diaphragm 203.
  • the support diaphragm 203 can be combined with either end or outer side of the voice coil 202 and the housing 10. Meanwhile, under the action of supporting the diaphragm 203, the vibration system 20 can have a larger amplitude, which improves the low frequency performance of the product.
  • the embodiment of the present invention provides a conductive film used for the above-mentioned sound emitting device.
  • the conductive film can be used for the sound emitting diaphragm 201 and can also be used for supporting the diaphragm 203.
  • the conductive film includes a conductive layer and a substrate layer located on both sides of the conductive layer.
  • the substrate layers on both sides wrap the conductive layer to prevent the conductive layer from contacting other parts and causing short circuits. phenomenon.
  • the conductive film includes an inner portion 1 located on the inner side, a bent deformed portion 2 provided on the outer side of the inner portion 1, and an outer portion 3 provided on the outer side of the deformed portion 2.
  • the voice coil 202 is connected to the inner part 1, and the outer part 3 is generally connected to a fixed part such as the housing 10.
  • the conductive layer includes a first conductive layer 11 provided on the inner portion 1, a second conductive layer 21 provided on the deformed portion 2, and a third conductive layer 31 provided on the outer portion 3 , Both ends of the second conductive layer 21 are electrically connected to the first conductive layer 11 and the third conductive layer 31, the first conductive layer 11, the second conductive layer 21 and the third conductive layer 31 The connection forms at least one conductive line.
  • the conductive layer in the embodiment of the present invention is made of different materials
  • the first conductive layer 11 and the third conductive layer 31 are both made of metal foil
  • the second conductive layer 21 has a Young’s mold. The amount is less than the Young's modulus of the metal foil.
  • an inner pad 7 is provided on the first conductive layer 11
  • an outer pad 8 is provided on the third conductive layer 31, and the inner pad 7 is configured to be connected to the voice coil 202,
  • the outer pad 8 is configured to connect with an external circuit; both the inner pad 7 and the outer pad 8 are exposed from the base material layer to facilitate electrical connection.
  • the conductive film is connected to the voice coil 202, and the lead wire of the voice coil 202 can extend a short length to connect to the first conductive layer 11, and then connect to the external circuit through the electrically connected third conductive layer 31,
  • the lead wire of the voice coil 202 does not need to be provided with a suspended structure, so the risk of disconnection can be avoided.
  • the vibration system 20 of the sound device can have a large amplitude and high sensitivity, which improves the low frequency performance.
  • the conductive film of the present invention overcomes the problems of difficulty and low reliability of the conductive film in the prior art, and can realize mass production.
  • the first conductive layer 11 and the third conductive layer 31 use metal foils with a high Young's modulus, which can improve the structural strength of the inner part 1 and the outer part 3, so that the two parts are not easily deformed, and the first The conductive layer 11 is used as a carrier for welding with the lead wires of the voice coil 202, and the third conductive layer 31 is used as a carrier for welding with an external circuit.
  • the use of metal foil can withstand high temperatures during welding and will not scald the substrate layer of the conductive film; and the second The conductive layer 21 is made of a material with a small Young's modulus, such as conductive glue, so that the second conductive layer 21 can adapt to repeated bending and deformation without breaking, and avoid the frequent deformation of the deformed part 2 during the reciprocating vibration of the conductive film, which leads to conduction. Fracture of the layer.
  • the conductive film in the present invention can also be used in other scenarios, as long as the conductive film itself is based on the structure and function of the conductive film. Further having the above-defined conductive layer structure should be within the scope of protection of this patent.
  • the conductive film when a metal layer is attached to the conductive film as a movable plate of the capacitor, the conductive film The conductive layer can be used to achieve electrical connection with the movable electrode plate.
  • Both the first conductive layer 11 and the third conductive layer 31 of the present invention use metal foils.
  • the thickness of the metal foil can be controlled within 5-36 ⁇ m.
  • the first conductive layer 11 and the third conductive layer 31 are both copper foils. Copper foil is a thin sheet-like structure with low surface oxidation characteristics and can be easily attached to the surface of a variety of substrates of different materials. In addition, the copper material has better conductivity, which enables the formed conductive film to have good conductivity.
  • the first conductive layer 11 and the third conductive layer 31 can be formed into a predetermined circuit pattern by etching, corrosion, etc., which are well known to those skilled in the art.
  • the first conductive layer 11 and the third conductive layer 31 are rolled copper foil, for example, RA copper foil or HA copper foil.
  • the rolled copper foil has excellent tensile strength and high elongation, and has good ductility when combined with the base layer of the conductive film.
  • the first conductive layer 11 and the third conductive layer 31 are not limited to be made of the same material, and can be made of metal foils of different materials according to specific needs.
  • the two ends of the second conductive layer 21 respectively extend to the first conductive layer 11 and the third conductive layer 31, and the two ends of the second conductive layer 21 may partially or completely cover the first conductive layer 11 and the third conductive layer 31.
  • the first conductive layer 11 and the third conductive layer 31 ensure the reliability of the connection between the two and realize a good conductive connection. During the vibration process of the conductive film, there will be no separation of the connection between the two.
  • the second conductive layer 21 is a conductive layer formed by coating or printing.
  • the second conductive layer 21 is a conductive adhesive layer or a conductive ink layer.
  • the second conductive layer 21 formed by the conductive adhesive layer or the conductive ink layer has a small Young's modulus, has good flexibility and fatigue resistance, and is resistant to damage. The stronger the capacity, the second conductive layer 21 will not have the risk of fracture when the vibration system 20 vibrates in a large amplitude state.
  • the second conductive layer 21 is a coated or printed conductive adhesive layer
  • Conductive adhesives are mainly composed of conductive particles, adhesives, solvents, additives, etc. High-temperature conductive adhesives will also be doped with glass powder. Among them, the adhesive generally chooses epoxy, acrylic, polyurethane, and silicone adhesives. After curing, the adhesive forms the molecular skeleton structure of the conductive adhesive layer, which provides mechanical and adhesive performance guarantees, and Make conductive particles form channels.
  • the solvent is butyl anhydride acetate, diethylene glycol butyl ether acetate, diethylene glycol ethyl ether acetate, and isophorone. Due to the high amount of conductive particles added, the viscosity of the conductive adhesive is greatly increased, which often affects the process performance of the adhesive. In order to reduce the viscosity and achieve good manufacturability and rheology, it is also necessary to add a solvent or reactive diluent to the conductive adhesive.
  • the conductive particles may specifically be at least one of gold, silver, copper, aluminum, zinc, nickel powder or alloy powder.
  • the conductive adhesive layer is conductive silver adhesive, and the conductive particles in the conductive adhesive layer are silver particles.
  • the price of silver is relatively cheap, the resistance is low, the conductivity is good, and it is not easy to oxidize.
  • the particle size of the silver particles is less than or equal to 1 ⁇ m.
  • the filling ratio of the silver particles is constant and the conductive adhesive layer has the same thickness, there are more silver particles, and the gap between the silver particles is smaller, and the conductivity is obtained.
  • the particle size of the silver particles is less than or equal to 100 nm, the nano-scale silver particles can further improve the conductivity of the second conductive layer 21, and the printing methods of the conductive silver glue are diverse and flexible, and the nanoimprinting process can be used to improve the printing accuracy. It can be upgraded from the micron level of screen printing to the nano level.
  • the thickness of the conductive adhesive layer is 6 ⁇ m-15 ⁇ m, which is compounded in the substrate layer with high reliability and low resistance. If the thickness of the conductive adhesive layer exceeds 15 ⁇ m, it is easy to crack and fall off after curing. If the thickness is less than 6 ⁇ m, the electrical resistance of the conductive adhesive layer will be relatively high, which will affect the conductivity.
  • the conductive adhesive layer has a cured resistance of 10-30m ⁇ /mm 2 /mil. If the square resistance is too small, it is difficult to make it. If the square resistance is too large, the thickness or width needs to be increased to compensate. The square resistance has been determined and the thickness has been determined. Next, the impedance of the finished product can be reduced by increasing the width, but in actual use, the width will not be increased indefinitely, so the smaller the square resistance, the better. The square resistance of the conductive adhesive layer is less than 30m ⁇ /mm 2 /mil, which can ensure the second conductive layer 21 has a smaller impedance.
  • the hardness of the conductive adhesive layer after curing is less than or equal to 3H, the conductive film formed by the conductive adhesive layer and the substrate layer has good compliance, good resilience and toughness, and the sound device has better transient response and lower THD distortion .
  • the conductive adhesive layer After the cured conductive adhesive layer has a hardness greater than 3H, the conductive adhesive layer will affect the compliance of the vibration system 20 and increase the THD distortion of the product.
  • the above-mentioned first conductive layer 11, second conductive layer 21, and third conductive layer 31 each include at least two parts that are independent of each other.
  • the first conductive layer 11 and the second conductive layer 21 And the third conductive layer 31 form at least two independent conductive lines.
  • the first conductive layer 11 includes two parts that are independent of each other, and the third conductive layer 31 also includes two parts that are independent of each other.
  • the second conductive layer 21 includes two parts located between the two sets of the first conductive layer 11 and the third conductive layer 31, and each part of the second conductive layer 21 may include two or more electrical connection arms 211.
  • An inner pad 7 electrically connected to the first conductive layer 11 is provided on the first conductive layer 11, and an outer pad 8 electrically connected to the third conductive layer 31 is provided on the third conductive layer 31.
  • the inner pad 7 on the conductive film is electrically connected to the voice coil 202, and the outer pad 8 on the conductive film is electrically connected to an external circuit.
  • the outer pad 8 may be directly electrically connected to an external circuit, or may be electrically connected to an external circuit through an elastic piece provided on the housing 10 of the sound device.
  • the base material layer includes a first base material layer 4 and a second base material layer 5 directly attached to the conductive layer, and the first conductive layer 11 and the third conductive layer 31 are heated by hot pressing Or bonding with the first base material layer 4; when the first conductive layer 11 and the third conductive layer 31 are etched to form conductive lines, the second conductive layer 21
  • the first substrate layer 4, the first conductive layer 11, and the third conductive layer 31 are connected together by coating or printing; the second substrate layer 5 is connected to the first substrate The material layer 4 and the first conductive layer 11, the second conductive layer 21, and the third conductive layer 31 are connected together by hot pressing or bonding.
  • the materials of the first base material layer 4 and the second base material layer 5 may be the same or different, and may be selected from plastics, thermoplastic elastomers and silica gels in common materials for diaphragms, such as PEEK, PAR, PEI, PI, PPS, PEN, PET, etc., thermoplastic elastomers such as TPEE, TPU, etc.
  • the thickness of the first substrate layer 4 and the second substrate layer 5 can be flexibly adjusted by those skilled in the art as required.
  • the thickness of the first base material layer 4 and the second base material layer 5 can be controlled within 3-50 ⁇ m, respectively, and the first base material layer 4 and the second base material layer 5 Can play a good protective effect on the conductive layer located in the middle.
  • the substrate layer includes a first substrate layer 4 and a second substrate layer 5 directly attached to the conductive layer, and the first substrate layer 4 is a thermoplastic elastomer layer;
  • the first conductive layer 11 and the third conductive layer 31 are connected to the first substrate layer 4 by hot pressing; when the first conductive layer 11 and the third conductive layer 31 After the conductive lines are formed by etching, the second conductive layer 21 is connected to the first substrate layer 4, the first conductive layer 11, and the third conductive layer 31 by coating or printing. .
  • the material of the first substrate layer 4 is a thermoplastic polyurethane elastomer TPU material or a thermoplastic polyester elastomer TPEE material.
  • the thermoplastic polyurethane elastomer TPU or the thermoplastic polyester elastomer TPEE all belong to the thermoplastic elastomer TPE, and both have high adhesion at high temperatures. Therefore, when the first substrate layer 4 adopts the thermoplastic polyurethane elastomer TPU or the thermoplastic polyester elastomer TPEE, the first substrate layer 4 can be connected to the first conductive layer 11 in the hot pressing mode without using an adhesive. It is well connected to the third conductive layer 31. It has the characteristics of simple combination, good firmness and not easy to separate.
  • the hot pressing temperature is relatively high, usually around 110°C.
  • the first substrate layer 4 is based on the thermoplastic elastomer TPE based on the material used, which can form a viscous fluid state, at this time, the bonding force is strong, and it can be firmly connected with the two conductive layers.
  • the two conductive layers and the first substrate layer 4 need to be subjected to a rolling process.
  • the rolling treatment is usually carried out at room temperature. At room temperature, the thermoplastic elastomer TPE has no adhesive force and will not cause impurities such as dust to adhere to the first substrate layer 4 and the two conductive layers, thereby avoiding the influence on the subsequent molding process.
  • the second base material layer 5 is also a thermoplastic elastomer layer, the second base material layer 5 and the first base material layer 4, the first conductive layer 11, the second conductive layer The layer 21 and the third conductive layer 31 are connected together by hot pressing.
  • the second base material layer 5 also uses a thermoplastic elastomer, and is compounded by hot pressing. There is no need to use an adhesive between the second base material layer 5 and the first base material layer 4.
  • the first base material layer 4 and the second base material layer 5 have no adhesive force at room temperature, and the second base material layer 5 and Before the first base material layer 4 is hot pressed, if the alignment between the second base material layer 5 and the first base material layer 4 is not accurate, the position can be corrected again without adhesion, and the alignment of the two can be ensured Accuracy:
  • the inner pads 7 and outer pads 8 on the first conductive layer 11 and the second conductive layer 21 can be accurately exposed from the reserved hollow positions of the base material layer, ensuring the reliability of the electrical connection.
  • the materials of the first substrate layer 4 and the second substrate layer 5 can be the same or different, and those skilled in the art can flexibly adjust according to actual needs.
  • the first substrate layer 4 uses thermoplastic polyurethane elastomer TPU
  • the second substrate layer 5 uses thermoplastic polyester elastomer TPEE.
  • both the first substrate layer 4 and the second substrate layer 5 are made of thermoplastic polyurethane elastomer TPU, and the two substrate layers are attached to the two surfaces of the conductive layer.
  • the two substrate layers are made of thermoplastic polyester elastomer TPEE, and the two substrate layers are attached to the two surfaces of the conductive layer.
  • the base material layer may also include a third base material layer 6, and the third base material layer 6 is attached to the first base material layer 4 and/or the second base material layer 5 far away from each other.
  • the surface of the conductive layer may be compounded only on the first substrate layer 4, or the third substrate layer 6 may be compounded only on the second substrate layer 5, or, on the first substrate layer 4 and the second substrate layer 6
  • the third substrate layer 6 is compounded on the material layer 5, and those skilled in the art can flexibly choose according to actual needs, and there is no restriction on this.
  • the material of the third substrate layer 6 is plastic, thermoplastic elastomer or rubber. Specifically, the material of the third substrate layer 6 is any one of PEEK, PAR, PEI, PI, PPS, PEN, PET, TPEE, and TPU.
  • the third base material layer 6 can be combined with the first base material layer 4 or the second base material layer 5 by hot pressing.
  • the first base material layer 4 and the second base material layer 5 are made of thermoplastic elastomers, which have good adhesion at high temperatures and can be firmly combined with the surface of the third base material layer 6, and No additional special adhesive is required, the bonding method is relatively simple, and the bonding fastness is better.
  • the third base material layer 6 can be connected to the first base material layer 4 by thermal compression first, and then a conductive layer is formed on the first base material layer 4.
  • the third substrate layer 6 can be connected to the second substrate layer 5 by thermal compression first, and then connected to the first substrate layer 4 and the conductive layer by thermal compression.
  • the present invention is not limited to the above-mentioned forming steps.
  • a glue layer is provided between the third substrate layer 6 and the first substrate layer 4 and/or the third substrate layer 6.
  • the third substrate layer 6 may be connected to the first substrate layer 4 through an adhesive layer first, and then a conductive layer is formed on the first substrate layer 4.
  • the third substrate layer 6 can be connected to the second substrate layer 5 through an adhesive layer first, and then connected to the first substrate layer 4 and the conductive layer by thermal compression.
  • the present invention is not limited to the above-mentioned forming steps.
  • an embodiment of the present invention provides a sound generating device.
  • the sound device includes a vibration system 20 and a magnetic circuit system 30 that cooperates with the vibration system 20.
  • the sound generating device further includes a housing 10 having a receiving cavity, and both the vibration system 20 and the magnetic circuit system 30 are accommodated in the receiving cavity.
  • the vibration system 20 includes a sounding diaphragm 201 and a voice coil 202 combined on one side of the sounding diaphragm 201.
  • the sounding diaphragm 201 adopts the conductive film in the above-mentioned embodiment.
  • the voice coil 202 with electrical signals interacts with the magnetic circuit system 30 to generate up and down vibrations, which can drive the sounding diaphragm 201 to produce sound.
  • the sound emitting device may have a circular structure or a rectangular structure. This embodiment illustrates a sound emitting device with a circular structure, and the corresponding sound emitting diaphragm 201 is circular.
  • the first conductive layer 11 and the second conductive layer 21 are made of copper foil, the first conductive layer 11 has a ring structure, and the first conductive layer 11 is located on the edge of the inner side 1 of the conductive film Close to the deformed portion 2, the first conductive layer 11 can be used to form an electrical connection with the voice coil 202.
  • the voice coil 202 usually has two leads of the voice coil 202, for the first conductive layer 11, in order to form two independent conductive lines electrically connected to the two leads of the voice coil 202.
  • first partition 111 is designed to provide a first partition 111 at two opposite positions of the ring-shaped first conductive layer 11, and no conductive layer is provided at the position where the first partition 111 is located, so that the first conductive layer 11 Is divided into two independent parts.
  • an inner pad 7 electrically connected to the first conductive layer 11 is provided inside the first conductive layer 11.
  • the number of the inner pads 7 is set to at least two, which can be used for electrical connection with the two leads of the voice coil 202.
  • an inner pad 7 is provided corresponding to each conductive circuit, and the lead of the voice coil 202 can be electrically connected to any one of the two inner pads 7 of the corresponding conductive circuit.
  • the number of inner pads 7 can also be set to more, for example, four, six, etc., and those skilled in the art can flexibly adjust according to actual needs, and there is no limitation on this.
  • the third conductive layer 31 has a ring structure.
  • the third conductive layer 31 is located at the edge position of the conductive film, that is, the position of the outer portion 3, and is used for connecting with an external circuit.
  • it is designed to provide a second partition 311 at two opposite positions of the ring-shaped second conductive layer 21.
  • the second partition 311 is not located at the position where the second partition 311 is located.
  • the conductive layer is provided so that the third conductive layer 31 can be composed of two independent parts.
  • outer pads 8 are respectively provided on the third conductive layer 31.
  • the outer pad 8 is used to electrically connect with the electrical connector on the housing 10 of the sounding device by welding or the like.
  • the first base material layer 4 and the second base material layer 5 corresponding to the upper and lower parts of the outer pad 8 are both provided with avoiding areas for avoiding the outer pad 8 so that the outer pad 8 It can be properly exposed from the substrate layer to facilitate electrical connection with external circuits.
  • a metal protective layer can also be provided on the surfaces of the inner pad 7 and the outer pad 8.
  • the metal protection layer can be formed by electroplating, for example, and of course, a metal protection layer can also be attached to it, which is not limited.
  • the second conductive layer 21 in this embodiment is a bent strip structure printed with conductive glue.
  • the second conductive layer 21 in this embodiment includes two parts, each of which includes two strip-shaped electrical connection arms. 211.
  • the four electrical connection arms 211 are arranged symmetrically at the center, which can ensure the symmetry of the vibration of the sounding diaphragm 201 and is not easy to produce polarization.
  • the conductive film of the present invention when used as the sound-emitting diaphragm 201, it may also include a rigid reinforcement part 9, and the reinforcement part 9 is bonded to the inner side 1 of the conductive film.
  • a rigid reinforcing part 9 is provided on the conductive film of the present invention, the reinforcing part 9 and the conductive film can be joined together in a manner known to those skilled in the art (for example, bonding).
  • the high frequency characteristics of the conductive film can be effectively improved by adding the rigid reinforcement 9 on the conductive film.
  • a person skilled in the art can choose to provide or not provide the reinforcing part 9 on it according to actual needs, and there is no limitation on this.
  • an embodiment of the present invention also provides a sound generating device, which includes a vibration system 20 and a magnetic circuit system 30 matched with the vibration system 20.
  • the vibration system 20 includes a sounding diaphragm 201, a voice coil 202 coupled to one side of the sounding diaphragm 201, and a supporting diaphragm 203 for elastically supporting the voice coil 202.
  • the supporting diaphragm 203 adopts the conductive film in the above-mentioned embodiment of the present invention.
  • the sound emitting device may be a circular structure or a rectangular structure.
  • the illustration in this embodiment provides a rectangular structure of the sound emitting device, and the corresponding sounding diaphragm 201 and the voice coil 202 are both rectangular.
  • the voice coil 202 includes two opposite long sides and two opposite short sides, and a supporting diaphragm 203 is provided on each short side of the voice coil 202.
  • a supporting diaphragm 203 is a conductive film of the present invention.
  • the conductive film of the present invention it has the advantage of stable vibration, can be used to prevent the internal vibration system 20 from being polarized, can increase the loudness of the sound device and reduce nonlinear distortion.
  • the conductive layer includes a first conductive layer 11 distributed on the inner portion 1, a second conductive layer 21 distributed on the deformed portion 2, and a third conductive layer 31 distributed on the outer portion 3 .
  • the second conductive layer 21 is connected to the first conductive layer 11 and the third conductive layer 31, and the first conductive layer 11, the second conductive layer 21 and the third conductive layer 31 are connected to form two independent conductive layers.
  • the first conductive layer 11 is provided with two inner pads 7 electrically connected to the two conductive lines, and the third conductive layer 31 is provided with two outer solders corresponding to the two conductive lines.
  • Disk 8. the inner pad 7 can be used for electrical connection with the voice coil 202, and the outer pad 8 can be used for electrical connection with an external circuit, so that the lead of the voice coil 202 does not need to run out a long thread.
  • the realization of the electrical connection between the voice coil 202 and the conductive film can effectively avoid the disconnection of the leads of the voice coil 202 during operation, and improve the stability of the product.
  • an embodiment of the present invention also provides an electronic device, which includes the above-mentioned sound emitting device.
  • the electronic device may be, but is not limited to, a mobile phone, a tablet computer, a smart wearable device, a smart watch, a walkie-talkie, a TV, a smart speaker, etc.
  • the electronic device may include a casing and the sound emitting device of the embodiment of the present disclosure, and the sound emitting device is housed and fixed in the casing.

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Abstract

本发明公开了一种用于发声装置的导电膜以及发声装置,其中导电膜包括导电层和位于所述导电层两侧的第一基材层和第二基材层,所述导电膜包括内侧部、形变部以及外侧部;所述导电层包括设于所述内侧部上的第一导电层,设于所述形变部上的第二导电层,以及设于所述外侧部上的第三导电层,所述第一导电层、第二导电层和第三导电层连接形成至少一条导电线路;所述第一导电层和所述第三导电层均采用金属箔片,所述第二导电层的杨氏模量小于所述金属箔片的杨氏模量,所述第一基材层为热塑性弹性体层。本发明的一个技术效果在于:该导电膜具有导电性,不仅可以作为发声振膜使用,还可以作为支撑振膜使用。

Description

一种用于发声装置的导电膜以及发声装置 技术领域
本发明涉及电声转换技术领域,更具体地,本发明涉及一种用于发声装置的导电膜以及发声装置。
背景技术
发声装置一般包括振膜和结合在该振膜一侧的音圈,还包括电连接发声装置内部电路和外部电路的电连接件。其中,音圈包括两条音圈引线,两条音圈引线通过点焊等方式分别与电连接件的两个焊盘电连接,电连接件同时电连接外部电路,以通过终端产品的电信号控制音圈中的电信号。
通常来说,音圈的引线需要顺出一定长度的线程,悬空后实现与电连接件的电连接。悬空引线结构虽然可实现较高的灵敏度,但由于引线悬空的限制,振幅不能太大,且断线风险较高,低频效果不够显著,不能提供更好的用户听觉体验。
近年来,很多研究者们开始研发具有导电功能的振膜,这使得导电膜在发声装置中得到了较为广泛的应用。对于导电膜来说,目前主要的采用方式为在振膜中电泳导体、电镀导体、注塑导体、增加导电涂层、增加导电油墨层以及激光蚀刻等。但是,上述的这些方法均不同程度的存在技术实现难度大、可量产性低、成本较高、可靠性和声学性能低的缺陷。
发明内容
本发明的一个目的是提供一种用于发声装置的导电膜以及发声装置的新技术方案。
根据本发明的第一方面,提供了一种用于发声装置的导电膜,包括导电层和位于所述导电层两侧的第一基材层和第二基材层,所述导电膜包括位于内侧的内侧部,设于所述内侧部外侧的弯折状的形变部,以及设于所 述形变部外侧的外侧部;
所述导电层包括设于所述内侧部上的第一导电层,设于所述形变部上的第二导电层,以及设于所述外侧部上的第三导电层,所述第二导电层的两端分别与所述第一导电层和所述第三导电层电连接,所述第一导电层、第二导电层和第三导电层连接形成至少一条导电线路;
所述第一导电层和所述第三导电层均采用金属箔片,所述第二导电层的杨氏模量小于所述金属箔片的杨氏模量;
所述第一基材层为热塑性弹性体层。
优选的,所述第二导电层的两端分别延伸至所述第一导电层和所述第三导电层上。
优选的,所述第二导电层为涂覆或印刷方式成型的导电层。
优选的,所述第二导电层为导电胶层。
优选的,所述导电胶层为导电银胶。
优选的,所述第二导电层为导电油墨层。
优选的,所述第一导电层和第三导电层均为铜箔。
优选的,所述基材层包括直接与所述导电层贴合的第一基材层和第二基材层,所述第一导电层和所述第三导电层通过热压或粘接的方式与所述第一基材层连接在一起;
当在所述第一导电层和所述第三导电层上经蚀刻形成导电线路后,所述第二导电层通过涂覆或印刷的方式与所述第一基材层、所述第一导电层和所述第三导电层连接在一起;
所述第二基材层与所述第一基材层以及所述第一导电层、所述第二导电层、所述第三导电层通过热压或粘接的方式连接在一起。
优选的,所述第一导电层和所述第三导电层通过热压的方式与所述第一基材层连接在一起;
当在所述第一导电层和所述第三导电层上经蚀刻形成导电线路后,所述第二导电层通过涂覆或印刷的方式与所述第一基材层、所述第一导电层和所述第三导电层连接在一起。
优选的,所述第二基材层为热塑性弹性体层,所述第二基材层与所述 第一基材层以及所述第一导电层、所述第二导电层、所述第三导电层通过热压的方式连接在一起。
优选的,所述热塑性弹性体为TPU材料或者TPEE材料。
优选的,所述导电膜还包括第三基材层,所述第三基材层贴合在所述第一基材层和/或所述第二基材层的远离所述导电层的表面上。
优选的,所述第三基材层的材质为塑料、热塑性弹性体或者橡胶。
优选的,所述第三基材层的材质为PEEK、PAR、PEI、PI、PPS、PEN、PET、TPEE、TPU中的任意一种。
优选的,所述第三基材层与所述第一基材层和/或所述第三基材层之间设有胶层。
优选的,所述第一导电层上设置有内焊盘,所述第三导电层上设有外焊盘,所述内焊盘被配置为:用于与音圈连接,所述外焊盘被配置为:用于与外部电路连接;
所述内焊盘和所述外焊盘均从所述基材层中露出。
优选的,所述第一导电层、所述第二导电层和第三导电层均包括至少相互独立的两部分,所述第一导电层、所述第二导电层和所述第三导电层形成至少两个独立的导电线路。
根据本发明的第二方面,提供了一种发声装置,包括振动系统和与所述振动系统相配合的磁路系统;
所述振动系统包括发声振膜和结合在所述发声振膜一侧的音圈,所述发声振膜采用如上所述的导电膜。
根据本发明的第三方面,提供了一种发声装置,包括振动系统和与所述振动系统相配合的磁路系统;
所述振动系统包括发声振膜、结合在所述发声振膜一侧的音圈以及用于弹性支撑所述音圈的支撑振膜,所述支撑振膜采用如上所述的导电膜。
本发明实施例提供的导电膜,导电层复合于基材层的内部,位于内侧部和外侧部上的第一导电层和第三导电层采用金属箔片,位于形变部上的第二导电层采用杨氏模量小于上述金属箔片的材料,上述结构设置,导电膜与音圈连接在一起,音圈引线可以伸出较短长度与第一导电层连接,然 后通过电连接的第三导电层与外部电路实现连接,音圈引线不需要设置悬空结构,因此可以避免断线风险,发声装置的振动系统可以拥有大振幅和高灵敏度,提升了低频性能。
并且,本发明导电膜,克服现有技术中的导电膜实现难度大、可靠性低的问题,能够实现批量化生产。具体的,第一导电层和第三导电层采用杨氏模量较高的金属箔片,可以提高内侧部和外侧部的结构强度,使这两部分不易产生变形,并且第一导电层作为与音圈引线焊接的载体,第三导电层作为与外部电路焊接的载体,采用金属箔片可以在焊接时耐高温,不会烫伤导电膜的基材层;而第二导电层采用杨氏模量较小的材料例如导电胶等制作,使得第二导电层能够适应反复弯折变形不会产生断裂,避免导电膜往复振动过程中,形变部频繁变形导致导电层的断裂。
通过以下参照附图对本发明的示例性实施例的详细描述,本发明的其它特征及其优点将会变得清楚。
附图说明
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实施例,并且连同其说明一起用于解释本发明的原理。
图1是本发明一种实施例中发声装置的结构示意图。
图2是本发明一种实施例中导电膜的结构示意图。
图3是本发明一种实施例中导电膜中的第一导电层和第三导电层的平面展开示意图。
图4是本发明一种实施例中导电膜中的第二导电层的平面展开示意图。
图5是本发明一种实施例中导电膜中的导电层的平面展开示意图。
图6是图5中A部分的剖视图。
图7是图5中B部分的剖视图。
图8是本发明另一种实施例中发声装置的结构示意图。
图9是图8实施例中发声装置的分解示意图。
图10是图8实施例中导电膜的结构示意图。
图中:10、外壳;20、振动系统;201、发声振膜;202、音圈;203、支撑振膜;30、磁路系统;1、内侧部;11、第一导电层;111、第一分隔部;2、形变部;21、第二导电层;211、电连接臂;3、外侧部;31、第三导电层;311、第二分隔部;4、第一基材层;5、第二基材层;6、第三基材层;7、内焊盘;8、外焊盘;9、增强部。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到:除非另外具体说明,否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的,决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论,但在适当情况下,所述技术、方法和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中,任何具体值应被解释为仅仅是示例性的,而不是作为限制。因此,示例性实施例的其它例子可以具有不同的值。
应注意到:相似的标号和字母在下面的附图中表示类似项,因此,一旦某一项在一个附图中被定义,则在随后的附图中不需要对其进行进一步讨论。
结合图1至图7所示,应用于耳机、手机等能够发声的电子设备中的发声装置,一般包括外壳10、安装于所述外壳10上的振动系统20和磁路系统30,其中,所述振动系统20包括发声振膜201和与所述发声振膜201结合的音圈202,所述磁路系统30包括导磁轭和设于所述导磁轭的底壁上的中心磁路部分和边磁路部分,所述中心磁路部分和所述边磁路部分之间形成磁间隙,所述音圈202伸入所述磁间隙中,音圈202中通入电流后,音圈202在磁路系统30的磁场的作用下受力振动,进而带动发声振膜201振动发声。
在一些情况下,为了避免振动系统20产生偏振,会进一步在振动系统 20中设置弹性支撑结构,例如支撑振膜203,支撑振膜203可以结合在音圈202的任意一端或外侧面与外壳10之间,在支撑振膜203的作用下,振动系统20可以有较大的振幅,提升产品低频性能。
本发明实施例提供一种用于上述发声装置的导电膜,该导电膜可以用于发声振膜201,也可以用于支撑振膜203。
结合图2至图7所示,导电膜包括导电层和位于所述导电层两侧的基材层,两侧基材层将导电层包裹起来,以防止导电层与其他部件接触而发生短路的现象。
进一步的,所述导电膜包括位于内侧的内侧部1,设于所述内侧部1外侧的弯折状的形变部2,以及设于所述形变部2外侧的外侧部3。其中,音圈202与内侧部1连接,外侧部3一般与外壳10等固定部件实现连接。
所述导电层包括设于所述内侧部1上的第一导电层11,设于所述形变部2上的第二导电层21,以及设于所述外侧部3上的第三导电层31,所述第二导电层21的两端分别与所述第一导电层11和所述第三导电层31电连接,所述第一导电层11、第二导电层21和第三导电层31连接形成至少一条导电线路。
特别的,本发明实施例中的导电层采用不同的材料来制作,所述第一导电层11和所述第三导电层31均采用金属箔片,所述第二导电层21的杨氏模量小于所述金属箔片的杨氏模量。
其中,所述第一导电层11上设置有内焊盘7,所述第三导电层31上设有外焊盘8,所述内焊盘7被配置为:用于与音圈202连接,所述外焊盘8被配置为:用于与外部电路连接;所述内焊盘7和所述外焊盘8均从所述基材层中露出,以便于实现电连接。
上述设置,一方面,导电膜与音圈202连接在一起,音圈202引线可以伸出较短长度与第一导电层11连接,然后通过电连接的第三导电层31与外部电路实现连接,音圈202引线不需要设置悬空结构,因此可以避免断线风险,发声装置的振动系统20可以拥有大振幅和高灵敏度,提升了低频性能。
并且,本发明导电膜,克服现有技术中的导电膜实现难度大、可靠性 低的问题,能够实现批量化生产。具体的,第一导电层11和第三导电层31采用杨氏模量较高的金属箔片,可以提高内侧部1和外侧部3的结构强度,使这两部分不易产生变形,并且第一导电层11作为与音圈202引线焊接的载体,第三导电层31作为与外部电路焊接的载体,采用金属箔片可以在焊接时耐高温,不会烫伤导电膜的基材层;而第二导电层21采用杨氏模量较小的材料例如导电胶等制作,使得第二导电层21能够适应反复弯折变形不会产生断裂,避免导电膜往复振动过程中,形变部2频繁变形导致导电层的断裂。
上述提供了导电膜与音圈202实现电连接的一种实施例,但是本领域技术人员应该了解,本发明中的导电膜还可以用于其他场景,只要在导电膜本身结构功能的基础上,进一步具有上述限定的导电层结构,都应该在本专利的保护范围内,例如在其他的一种实施例中,导电膜上附设金属层作为电容器的一个可动极板的情况下,导电膜的导电层可以用于与该可动极板实现电连接。
本发明的第一导电层11和第三导电层31均采用金属箔片。金属箔片的厚度可以控制在5-36μm。例如所述第一导电层11和第三导电层31均为铜箔。铜箔为较薄的片状结构,其具有低表面氧化特性,可以很容易的附着在多种不同材质的基材表面上。并且,铜材料的导电性较佳,能使形成的导电膜具有良好的导电性。第一导电层11和第三导电层31可以采用本领域技术人员熟知的蚀刻、腐蚀等方式形成预定的电路图样。
在本发明的一个例子中,所述第一导电层11和第三导电层31采用压延铜箔,例如采用RA铜箔或者HA铜箔。压延铜箔具有优良的抗拉强度和高伸长率,在与导电膜的基材层结合时具有良好的延展性。另外需要说明的是,第一导电层11和第三导电层31并不限定于采用同一种材料制作,可以根据具体需要采用不同材料的金属箔片制作。
进一步的,所述第二导电层21的两端分别延伸至所述第一导电层11和所述第三导电层31上,第二导电层21的两个端部可以部分或者全部覆盖住第一导电层11和第三导电层31,保证两两之间连接可靠性,实现良好的导电连接作用,导电膜的振动过程中,不会出现两两之间连接处的分 离。
具体的,所述第二导电层21为涂覆或印刷方式成型的导电层。第二导电层21选择导电胶层,或者选择导电油墨层,导电胶层或导电油墨层形成的第二导电层21杨氏模量较小,具有良好的柔性和抗疲劳性,其抵抗破坏的能力越强,振动系统20大振幅状态振动时,第二导电层21也不会产生断裂风险。
作为一种具体的实施例,所述第二导电层21为涂覆或印刷的导电胶层,
导电胶主要由导电粒子、粘合剂、溶剂、助剂等组成,高温导电胶还会掺杂玻璃粉。其中,粘合剂一般选择环氧型、丙烯酸型、聚氨酯型、硅胶型粘结剂,粘合剂在固化后形成了导电胶层的分子骨架结构,提供了力学性能和粘接性能保障,并使导电粒子形成通道。溶剂为丁基溶酐乙酸酯、二乙二醇丁醚醋酸酯、二甘醇乙醚醋酸酯、异佛尔酮一种。由于导电粒子的加入量很高,所以导电胶的粘合剂的黏度大幅度增加,常常影响了粘合剂的工艺性能。为了降低黏度,实现良好的工艺性和流变性,还需要在导电胶中加入溶剂或者活性稀释剂。
其中导电粒子具体可以是金、银、铜、铝、锌、镍的粉末或合金粉末的至少一种。本具体实施例中,所述导电胶层为导电银胶,导电胶层中的导电粒子选择银粒子,银的价格相对便宜,电阻低,导电性好,且不易氧化。
在一个具体实施例中,银粒子的粒径小于等于1μm,在银粒子填充比例一定以及导电胶层同样厚度的情况下,银粒子颗粒更多,银粒子之间的间隙更小,导电率得到提升。进一步的,银粒子的粒径小于等于100nm,纳米级银粒子能够进一步提升第二导电层21的导电率,并且导电银胶的印刷方式多样灵活,可以使用纳米压印工艺提升印刷精度,其公差可以从丝网印刷的微米级提升到纳米级。
具体的,导电胶层的厚度为6μm-15μm,复合在基材层中可靠性高且电阻较小。导电胶层的厚度超过15μm,固化后容易龟裂脱落,厚度小于6μm,则导电胶层的电阻会比较高,均会影响导电性能。
具体的,导电胶层固化后方阻为10-30mΩ/mm 2/mil,方阻太小很难实 现制作,方阻太大需要增加厚度或宽度来弥补,方阻已定和厚度已定的情况下,可以通过增加宽度来降低成品阻抗,但是实际使用中不会无限的增加宽度,所以方阻越小越好,导电胶层的方阻小于30mΩ/mm 2/mil,能够保证第二导电层21的具有较小的阻抗。
导电胶层固化后硬度小于等于3H,导电胶层与基材层复合而成的导电膜顺性较好,回弹性能和韧性好,发声装置具有较好的瞬态响应和较低的THD失真。导电胶层固化后硬度大于3H,则导电胶层会影响振动系统20顺性,使得产品THD失真升高。
在一个具体实施例中,上述的第一导电层11、第二导电层21和第三导电层31均包括至少相互独立的两部分,所述第一导电层11、所述第二导电层21和所述第三导电层31形成至少两个独立的导电线路。
在本具体实施例中,所述第一导电层11包括相互独立的两部分,所述第三导电层31也包括相互独立的两部分。所述第二导电层21包括位于两组第一导电层11和第三导电层31之间的两部分,每一部分第二导电层21可以包括两个或更多个电连接臂211。第一导电层11上设置有与所述第一导电层11电连接的内焊盘7,第三导电层31上设置有与所述第三导电层31电连接的外焊盘8。
将导电膜上的内焊盘7与音圈202电连接,将导电膜上的外焊盘8与外部电路电连接。其中,外焊盘8可以直接与外部电路电连接,也可以通过发声装置的外壳10上设置的弹片与外部电路电连接。本领域技术人员可以根据实际需要灵活调整,对此不作限制。
进一步的,所述基材层包括直接与所述导电层贴合的第一基材层4和第二基材层5,所述第一导电层11和所述第三导电层31通过热压或粘接的方式与所述第一基材层4连接在一起;当在所述第一导电层11和所述第三导电层31上经蚀刻形成导电线路后,所述第二导电层21通过涂覆或印刷的方式与所述第一基材层4、所述第一导电层11和所述第三导电层31连接在一起;所述第二基材层5与所述第一基材层4以及所述第一导电层11、所述第二导电层21、所述第三导电层31通过热压或粘接的方式连接在一起。
其中,第一基材层4和第二基材层5的材料可以相同也可以不同,可以选自振膜常用材料中的塑料、热塑性弹性体和硅胶,塑料例如PEEK、PAR、PEI、PI、PPS、PEN、PET等,热塑性弹性体例如TPEE、TPU等。
对于所述第一基材层4和第二基材层5的厚度,本领域技术人员可以根据需要灵活调整。在本发明的一个例子中,所述第一基材层4和所述第二基材层5的厚度可以分别控制在3-50μm,所述第一基材层4和第二基材层5可以对位于中间的导电层起到良好的保护作用。通过对两侧基材层和导电层厚度的合理调整,还能保证导电膜整体具有适宜的刚性和柔韧性,可以使导电膜在振动时更加平稳。
作为一种具体实施例,所述基材层包括直接与所述导电层贴合的第一基材层4和第二基材层5,所述第一基材层4为热塑性弹性体层;所述第一导电层11和所述第三导电层31通过热压的方式与所述第一基材层4连接在一起;当在所述第一导电层11和所述第三导电层31上经蚀刻形成导电线路后,所述第二导电层21通过涂覆或印刷的方式与所述第一基材层4、所述第一导电层11和所述第三导电层31连接在一起。
作为优选方案,第一基材层4的材质为热塑性聚氨酯弹性体TPU材料或者热塑性聚酯弹性体TPEE材料。其中,热塑性聚氨酯弹性体TPU或者热塑性聚酯弹性体TPEE均属于热塑性弹性体TPE,在高温下均具有较高的粘结力。因此,当第一基材层4采用热塑性聚氨酯弹性体TPU或者热塑性聚酯弹性体TPEE时,在热压的方式下,无需使用黏合剂,第一基材层4即可与第一导电层11和第三导电层31良好的连接在一起。具有结合方式简单、牢固性好、不易分离的特点。
需要说明的是,第一导电层11和第三导电层31的金属箔片与第一基材层4之间通过热压的方式连接在一起时,热压温度较高,通常在110℃左右,此时第一基材层4基于所采用的材料为热塑性弹性体TPE,其可以形成粘流态,此时粘结力较强,能与两个导电层牢固的连接在一起。而当在两个导电层上蚀刻出导电线路后,需要对两个导电层和第一基材层4实施滚压处理工序。而该滚压处理通常是在室温下进行的。在室温下,热塑性弹性体TPE没有粘结力,不会使灰尘等杂质粘接在第一基材层4和两个 导电层上,避免对后续成型工艺的影响。
再进一步的,所述第二基材层5也为热塑性弹性体层,所述第二基材层5与所述第一基材层4以及所述第一导电层11、所述第二导电层21、所述第三导电层31通过热压的方式连接在一起。
第二基材层5也采用热塑性弹性体,并且采用热压复合。第二基材层5与第一基材层4之间不需要使用粘结剂,第一基材层4和第二基材层5在室温下没有粘结力,第二基材层5与第一基材层4热压之前,第二基材层5与第一基材层4之间对位不准确的情况下,可以再修正位置,而不会产生黏连,保证两者对位准确性,第一导电层11和第二导电层21上的内焊盘7和外焊盘8能够准确的从基材层预留镂空位置露出,保证电连接的可靠性。
需要说明的是,本发明实施例提供的导电膜,第一基材层4和第二基材层5的材质可以相同,也可以不同,本领域技术人员可以根据实际需要灵活调整。例如,其中第一基材层4采用热塑性聚氨酯弹性体TPU,第二基材层5采用热塑性聚酯弹性体TPEE。又例如,第一基材层4和第二基材层5均采用热塑性聚氨酯弹性体TPU,将这两个基材层贴合在导电层的两个表面上。再例如,两个基材层均采用热塑性聚酯弹性体TPEE,将这两个基材层贴合在导电层的两个表面上。
另外,所述基材层还可以包括第三基材层6,所述第三基材层6贴合在所述第一基材层4和/或所述第二基材层5的远离所述导电层的表面上。可以仅在第一基材层4上复合第三基材层6,或者仅在第二基材层5上复合第三基材层6,再或者,在第一基材层4和第二基材层5上均复合第三基材层6,本领域技术人员可以根据实际需要灵活选择,对此不作限制。
所述第三基材层6的材质为塑料、热塑性弹性体或者橡胶。具体的,所述第三基材层6的材质为PEEK、PAR、PEI、PI、PPS、PEN、PET、TPEE、TPU中的任意一种。
在第一基材层4与第二基材层5为热塑性弹性体的情况下,第三基材层6可以通过热压与第一基材层4或第二基材层5结合,由于第一基材层4和第二基材层5采用的是热塑性弹性体,在高温下具有较好的粘结力, 其能与所述第三基材层6的表面牢固的结合在一起,而无需额外采用专门的黏合剂,结合方式较为简单,结合牢度比较好。作为优先的实施方式,第三基材层6可以先与第一基材层4热压连接在一起,再在第一基材层4上形成导电层。第三基材层6可以先与第二基材层5热压连接在一起,再与第一基材层4和导电层热压连接。但本发明中并不限于上述形成步骤。
作为不同的实施例,所述第三基材层6与所述第一基材层4和/或所述第三基材层6之间设有胶层。具体的,第三基材层6可以先与第一基材层4通过胶层连接在一起,再在第一基材层4上形成导电层。第三基材层6可以先与第二基材层5通过胶层连接在一起,再与第一基材层4和导电层热压连接。但本发明中并不限于上述形成步骤。
结合图1至图7所示,本发明实施例提供了一种发声装置。如前述介绍,该发声装置包括振动系统20以及与振动系统20相配合的磁路系统30。发声装置还包括具有收容腔的外壳10,振动系统20和所述磁路系统30均收容在收容腔内。其中,振动系统20包括发声振膜201和结合在发声振膜201一侧的音圈202。发声振膜201采用上述实施例中的导电膜。在该发声装置工作过程中,通有电信号的音圈202与磁路系统30相互作用,产生上下振动,从而可以带动发声振膜201产生声音。
发声装置可以是圆形结构,也可以是矩形结构,本实施例图示提供一种圆形结构的发声装置,相对应的发声振膜201为圆形。
作为一个具体的实施例,第一导电层11和第二导电层21采用铜箔,所述第一导电层11呈环状结构,所述第一导电层11位于导电膜的内侧部1边缘上靠近形变部2的位置,所述第一导电层11可用于与音圈202形成电连接。具体来说,音圈202通常具有两条音圈202引线,对于第一导电层11而言,为了形成与音圈202的两条引线电连接的两个独立导电线路。本实施例中设计在环状第一导电层11的两个相对位置上各开设一个第一分隔部111,在第一分隔部111所在的位置均不设置导电层,这样使第一导电层11被分为相互独立的两部分。并且,在所述第一导电层11的内侧设置有与所述第一导电层11电连接的内焊盘7。其中,所述内焊盘7的数量至少设置为两个,可用于与音圈202的两个引线进行电连接。
其中,对应每个导电线路均设置有内焊盘7,音圈202的引线可以与对应导电线路的两个内焊盘7中的任意一个进行电连接。当然,所述内焊盘7也可以设置为更多个,例如四个、六个等,本领域技术人员可以根据实际需要灵活调整,对此不作限制。
进一步的,所述第三导电层31为环状结构。所述第三导电层31位于导电膜的边缘位置,即外侧部3的位置,用于与外部电路连接。同样地,为了形成两个独立的导电线路,本实施例中设计在环状第二导电层21的两个相对位置上各开设一个第二分隔部311,在第二分隔部311所在的位置不设置导电层,这样可以使第三导电层31由相互独立的两部分构成。
并且,在所述第三导电层31上分别设置有外焊盘8。所述外焊盘8用于与发声装置的外壳10上的电连接件通过焊接等方式电连接。其中,在对应于所述外焊盘8的上部和下部的第一基材层4和第二基材层5上均设置有用于避让外焊盘8的避让区域,这样可以使外焊盘8能从基材层中适当的露出,以便于实现与外部电路的电连接。
此外,还可以在所述内焊盘7和所述外焊盘8的表面上设置金属保护层。该金属保护层例如可以采用电镀的方式形成,当然,也可以在其上贴合金属保护层,对此不作限制。
本实施例中的第二导电层21为采用导电胶印刷而成的弯折条状结构,本实施例中的第二导电层21包括两个部分,每部分包括两个条状的电连接臂211,四个电连接臂211中心对称设置,可以保证发声振膜201振动的对称性,不易产生偏振。
此外,本发明的导电膜作为发声振膜201时,还可以包括刚性的增强部9,且该增强部9结合在导电膜的内侧部1上。当在本发明的导电膜上设置刚性的增强部9时,增强部9与导电膜之间可以采用本领域技术人员熟知的方式(例如粘接)结合在一起。通过在导电膜上加设刚性的增强部9能够有效提升导电膜的高频特性。但需要说明的是,对于本发明的导电膜而言,本领域技术人员可以根据实际需要选择在其上设置或者不设置增强部9,对此不作限制。
结合图8至图10所示,本发明实施例还提供了一种发声装置,其包括 振动系统20和与振动系统20相配合的磁路系统30。所述振动系统20包括发声振膜201、结合在所述发声振膜201一侧的音圈202以及用于弹性支撑音圈202的支撑振膜203。其中,该支撑振膜203采用本发明上述实施例中的导电膜。
发声装置可以是圆形结构,也可以是矩形结构,本实施例图示提供一种矩形结构的发声装置,相对应的发声振膜201和音圈202均为矩形。
作为一个具体实施例,音圈202包括两个相对设置的长边和两个相对设置的短边,且在音圈202的每个短边上均设置有支撑振膜203。例如,支撑振膜203中至少一个为本发明的导电膜。将本发明的导电膜用作支撑振膜203时,具有振动平稳的优点,能用于防止内部的振动系统20发生偏振的情况,能提升发声装置的响度以及降低非线性失真。
本发明的导电膜用作支撑振膜203时,支撑振膜203上分布有外侧部3、内侧部1以及形变部2。其中,所述外侧部3被配置为:用于与外壳10连接,所述内侧部1被配置为:用于与音圈202连接。所述导电层包括分布在所述内侧部1上的第一导电层11,分布在所述形变部2上的第二导电层21,以及分布在所述外侧部3上的第三导电层31。并且,所述第二导电层21连接所述第一导电层11和第三导电层31,所述第一导电层11、第二导电层21和第三导电层31连接形成两个独立的导电线路,并且所述第一导电层11上设置有与两条导电线路对应电连接的两个内焊盘7,第三导电层31上设置有与两条导电线路对应电连接的两个外焊盘8。其中,所述内焊盘7可用于与音圈202实现电连接,所述外焊盘8可用于与外部电路电连接,可以使音圈202的引线不需要顺出很长的线程,即可实现音圈202与导电膜的电连接,能有效避免音圈202引线在工作中发生断线的现象,提高了产品的稳定性。
另一方面,本发明实施例还提供了一种电子设备,其包括上述的发声装置。其中,所述电子设备可以是但不局限于手机、平板电脑、智能穿戴设备、智能手表、对讲机、电视机和智能音箱等。所述电子设备可以包括壳体以及本公开实施例的发声装置,该发声装置被收容固定在所述壳体内。
虽然已经通过例子对本发明的一些特定实施例进行了详细说明,但是 本领域的技术人员应该理解,以上例子仅是为了进行说明,而不是为了限制本发明的范围。本领域的技术人员应该理解,可在不脱离本发明的范围和精神的情况下,对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (18)

  1. 一种用于发声装置的导电膜,包括导电层和位于所述导电层两侧的第一基材层和第二基材层,其特征在于,
    所述导电膜包括位于内侧的内侧部,设于所述内侧部外侧的弯折状的形变部,以及设于所述形变部外侧的外侧部;
    所述导电层包括设于所述内侧部上的第一导电层,设于所述形变部上的第二导电层,以及设于所述外侧部上的第三导电层,所述第二导电层的两端分别与所述第一导电层和所述第三导电层电连接,所述第一导电层、第二导电层和第三导电层连接形成至少一条导电线路;
    所述第一导电层和所述第三导电层均采用金属箔片,所述第二导电层的杨氏模量小于所述金属箔片的杨氏模量;
    所述第一基材层为热塑性弹性体层。
  2. 根据权利要求1所述的用于发声装置的导电膜,其特征在于,所述第二导电层的两端分别延伸至所述第一导电层和所述第三导电层上。
  3. 根据权利要求1所述的用于发声装置的导电膜,其特征在于,所述第二导电层为涂覆或印刷方式成型的导电层。
  4. 根据权利要求3所述的用于发声装置的导电膜,其特征在于,所述第二导电层为导电胶层。
  5. 根据权利要求4所述的用于发声装置的导电膜,其特征在于,所述导电胶层为导电银胶。
  6. 根据权利要求3所述的用于发声装置的导电膜,其特征在于,所述第二导电层为导电油墨层。
  7. 根据权利要求1所述的用于发声装置的导电膜,其特征在于,所述第一导电层和第三导电层均为铜箔。
  8. 根据权利要求1所述的用于发声装置的导电膜,其特征在于,
    所述第一导电层和所述第三导电层通过热压的方式与所述第一基材层连接在一起;
    当在所述第一导电层和所述第三导电层上经蚀刻形成导电线路后,所述第二导电层通过涂覆或印刷的方式与所述第一基材层、所述第一导电层和所述第三导电层连接在一起。
  9. 根据权利要求8所述的用于发声装置的导电膜,其特征在于,所述第二基材层为热塑性弹性体层,所述第二基材层与所述第一基材层以及所述第一导电层、所述第二导电层、所述第三导电层通过热压的方式连接在一起。
  10. 根据权利要求9所述的用于发声装置的导电膜,其特征在于,所述热塑性弹性体为TPU材料或者TPEE材料。
  11. 根据权利要求1所述的用于发声装置的导电膜,其特征在于,所述导电膜还包括第三基材层,所述第三基材层贴合在所述第一基材层和/或所述第二基材层的远离所述导电层的表面上。
  12. 根据权利要求11所述的用于发声装置的导电膜,其特征在于,所述第三基材层的材质为塑料、热塑性弹性体或者橡胶。
  13. 根据权利要求12所述的用于发声装置的导电膜,其特征在于,所述第三基材层的材质为PEEK、PAR、PEI、PI、PPS、PEN、PET、TPEE、TPU中的任意一种。
  14. 根据权利要求11所述的用于发声装置的导电膜,其特征在于,所述第三基材层与所述第一基材层和/或所述第三基材层之间设有胶层。
  15. 根据权利要求1所述的用于发声装置的导电膜,其特征在于,所述第一导电层上设置有内焊盘,所述第三导电层上设有外焊盘,所述内焊盘被配置为:用于与音圈连接,所述外焊盘被配置为:用于与外部电路连接;
    所述内焊盘和所述外焊盘均从所述基材层中露出。
  16. 根据权利要求1所述的用于发声装置的导电膜,其特征在于,所述第一导电层、所述第二导电层和第三导电层均包括至少相互独立的两部分,所述第一导电层、所述第二导电层和所述第三导电层形成至少两个独立的导电线路。
  17. 一种发声装置,其特征在于,包括振动系统和与所述振动系统相配合的磁路系统;
    所述振动系统包括发声振膜和结合在所述发声振膜一侧的音圈,所述发声振膜采用如权利要求1-16任意一项所述的导电膜。
  18. 一种发声装置,其特征在于,包括振动系统和与所述振动系统相配合的磁路系统;
    所述振动系统包括发声振膜、结合在所述发声振膜一侧的音圈以及用于弹性支撑所述音圈的支撑振膜,所述支撑振膜采用如权利要求1-16任意一项所述的导电膜。
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