WO2020250879A1 - カルバモイルオキシム化合物並びに該化合物を含有する重合開始剤及び重合性組成物 - Google Patents

カルバモイルオキシム化合物並びに該化合物を含有する重合開始剤及び重合性組成物 Download PDF

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WO2020250879A1
WO2020250879A1 PCT/JP2020/022651 JP2020022651W WO2020250879A1 WO 2020250879 A1 WO2020250879 A1 WO 2020250879A1 JP 2020022651 W JP2020022651 W JP 2020022651W WO 2020250879 A1 WO2020250879 A1 WO 2020250879A1
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carbon atoms
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hydrogen atom
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French (fr)
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和貴 友田
竜也 大槻
智幸 有吉
光裕 岡田
木村　正樹
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株式会社Adeka
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Priority to JP2021526087A priority Critical patent/JPWO2020250879A1/ja
Priority to KR1020217027837A priority patent/KR20220019654A/ko
Priority to CN202080024419.4A priority patent/CN113631540A/zh
Publication of WO2020250879A1 publication Critical patent/WO2020250879A1/ja

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    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D209/00—Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom
    • C07D209/56—Ring systems containing three or more rings
    • C07D209/80—[b, c]- or [b, d]-condensed
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D209/00—Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom
    • C07D209/56—Ring systems containing three or more rings
    • C07D209/80—[b, c]- or [b, d]-condensed
    • C07D209/94—[b, c]- or [b, d]-condensed containing carbocyclic rings other than six-membered
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    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D401/00—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom
    • C07D401/02—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom containing two hetero rings
    • C07D401/12—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom containing two hetero rings linked by a chain containing hetero atoms as chain links
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    • C07D403/02—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, not provided for by group C07D401/00 containing two hetero rings
    • C07D403/12—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, not provided for by group C07D401/00 containing two hetero rings linked by a chain containing hetero atoms as chain links
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    • C07D409/00—Heterocyclic compounds containing two or more hetero rings, at least one ring having sulfur atoms as the only ring hetero atoms
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    • C07D409/00—Heterocyclic compounds containing two or more hetero rings, at least one ring having sulfur atoms as the only ring hetero atoms
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    • C07D487/02—Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, not provided for by groups C07D451/00 - C07D477/00 in which the condensed system contains two hetero rings
    • C07D487/04—Ortho-condensed systems
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    • C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02—Phosphorus compounds
    • C07F9/547—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom
    • C07F9/553—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having one nitrogen atom as the only ring hetero atom
    • C07F9/572—Five-membered rings
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    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
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    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/246—Intercrosslinking of at least two polymers
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    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C09D163/04—Epoxynovolacs
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • C—CHEMISTRY; METALLURGY
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    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C08J2363/04—Epoxynovolacs
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08J2461/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
    • C08J2461/04—Condensation polymers of aldehydes or ketones with phenols only
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    • C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2483/10—Block- or graft-copolymers containing polysiloxane sequences
    • C08J2483/12—Block- or graft-copolymers containing polysiloxane sequences containing polyether sequences

Definitions

  • the present invention relates to a carbamoyloxime compound.
  • a polymerizable composition such as a photosensitive resin composition is obtained by adding a photopolymerization initiator to a polymerizable compound such as a photosensitive resin, and can be polymerized and cured or developed by irradiation with energy rays (light). Therefore, it is used in photocurable inks, photosensitive printing plates, various photoresists, photocurable adhesives, and the like.
  • Photopolymerization initiators are classified into photoradical generators, photoacid generators, and photobase generators, depending on the active species generated by energy ray (light) irradiation.
  • the photoradical generator has advantages such as a high curing rate and no active species remaining after curing, but has a disadvantage that a layer or the like that blocks oxygen must be provided in the curing of the thin film because the curing is inhibited by oxygen.
  • the photoacid generator has an advantage that it is not inhibited by oxygen, but has a disadvantage that the residual active acid causes the metal substrate to be corroded and the cured resin to be modified.
  • Photobase generators are attracting attention because they are less likely to cause problems such as inhibition of curing by oxygen and corrosion by residual active species, but generally have a problem of low sensitivity (low curability) as compared with photoacid generators. Photobase generators are described, for example, in Patent Documents 1 and 2.
  • an object of the present invention is to provide a compound having high photobase generation efficiency.
  • the present inventor conducted diligent studies and found that a compound having a specific structure has a high photobase generation efficiency and is useful as a polymerization initiator. That is, the present invention is a carbamoyloxime compound represented by the following general formula (I).
  • R 1 is a divalent hydrogen atom, a halogen atom, a nitro group, a cyano group, a hydrocarbon group having 1 to 20 carbon atoms, or a methylene group in the hydrocarbon group selected from the following ⁇ Group A>.
  • Represents a group having 1 to 20 carbon atoms substituted with a group of R 2 is a hydrogen atom, a C 1 -C 20 hydrocarbon group, or a methylene group in the hydrocarbon group is below ⁇ group A> from divalent groups have been 1 to 20 carbon atoms substituted by selected
  • R 10 is a divalent group in which a hydrogen atom, a hydrocarbon group having 1 to 20 carbon atoms, a heterocyclic group containing 2 to 20 carbon atoms, or a methylene group in the hydrocarbon group is selected from the following ⁇ Group A>. It represents a group having 1 to 20 carbon atoms substituted with a group, and when a plurality of R 10s are present in the molecule, they may be the same or different.
  • X 1 represents ⁇ NR 21 R 22 or a group represented by the following general formula (a) or the following general formula (b).
  • R 21 and R 22 the hydrogen atom, the hydrocarbon group having 1 to 20 carbon atoms, or the methylene group in the hydrocarbon group was independently substituted with a divalent group selected from the following ⁇ Group A>.
  • the above may be a group having 1 to 20 carbon atoms substituted with a halogen atom, a cyano group, a nitro group, a hydroxyl group, -OR 11 , -COOR 11 , -CO-R 11 or -SR 11 .
  • R 11 is a group having 1 to 20 carbon atoms in which a hydrogen atom, a hydrocarbon group having 1 to 20 carbon atoms, and a methylene group in the hydrocarbon group are substituted with a divalent group selected from the following ⁇ Group A>.
  • R 11 in a molecule is more If present, they may be the same or different, ⁇ Group A> is, -O -, - CO -, - COO -, - NR 12 -, - NR 12 CO- and is -S-, R 12 represents a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms, and when a plurality of R 12s are present in the molecule, they may be the same or different.
  • R 3 and R 4 , R 6 and R 7 , R 7 and R 8 and R 8 and R 9 are independently connected to each other to form a ring consisting of a hydrogen atom and a carbon atom having 3 to 10 carbon atoms. May be formed, At least one set of R 3 and R 4 , R 6 and R 7 , R 7 and R 8 and R 8 and R 9 are linked to each other to form a benzene ring.
  • R 21 and R 22 are connected to each other and have a ring having 2 to 10 carbon atoms consisting of a hydrogen atom, a nitrogen atom and a carbon atom, or a ring having 2 to 10 carbon atoms consisting of a hydrogen atom, an oxygen atom, a nitrogen atom and a carbon atom. It may form 10 rings, n represents 0 or 1. )
  • R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 , R 38 , R 39 and R 40 are independently carbonized with a hydrogen atom and 1 to 20 carbon atoms, respectively.
  • one or more of the hydrogen atoms in the hydrocarbon group are halogen atoms.
  • R 41 represents a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms, and when a plurality of R 41s are present in the group, they may be the same or different.
  • ⁇ Group B> is, -O -, - CO -, - COO -, - NR 42 -, - NR 42 CO- and are -S-,
  • R 42 represents a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms, and when a plurality of R 42s are present in the group, they may be the same or different.
  • R 31 and R 32 , R 33 and R 34 , R 35 and R 36 , R 37 and R 38 , and R 39 and R 40 are independently linked to each other and are derived from hydrogen, nitrogen and carbon atoms, respectively. It may form a ring having 2 to 10 carbon atoms, or a ring having 2 to 10 carbon atoms composed of hydrogen atom, oxygen atom, nitrogen atom and carbon atom. * Represents a bond. )
  • the carbamoyloxime compound of the present invention is represented by the above general formula (I).
  • the carbamoyl oxime compound represented by the general formula (I) has geometric isomers due to a double bond of oxime, but these are not distinguished. That is, in the present specification, the carbamoyloxime compound represented by the above general formula (I), and the compound which is a preferable form of the compound described later and the exemplified compound represent a mixture of isomers or one of them. It is not limited to the isomer of the structure shown.
  • the carbamoyloxime compound represented by the general formula (I) is also simply referred to as "a compound represented by the general formula (I)" or "a compound of the present invention".
  • halogen atom in the general formula (I), the general formula (a) and the general formula (b) examples include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom.
  • hydrocarbon groups having 1 to 20 carbon atoms in the general formula (I), the general formula (a), and the general formula (b) include aliphatic hydrocarbon groups having 1 to 20 carbon atoms and carbon atoms. 6 to 20 aromatic hydrocarbon groups can be mentioned.
  • Examples of the aliphatic hydrocarbon group having 1 to 20 carbon atoms include methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, s-butyl group, t-butyl group, amyl group and isoamyl.
  • t-amyl group hexyl group, heptyl group, octyl group, isooctyl group, 2-ethylhexyl group, t-octyl group, nonyl group, isononyl group, decyl group, isodecyl group, undecyl group, dodecyl group, tetradecyl group, Alkyl groups such as hexadecyl group, octadecyl group and icosyl group; cycloalkyl groups such as cyclopentyl group and cyclohexyl group; and cycloalkylalkyl groups such as cyclohexylmethyl group, and carbon-carbon single bond of these groups are carbon-carbon di Examples thereof include an unsaturated aliphatic hydrocarbon group having a structure substituted with a heavy bond or a carbon-carbon triple bond.
  • Examples of the aromatic hydrocarbon group having 6 to 20 carbon atoms include a phenyl group, a tolyl group, a xsilyl group, a mesityl group, a benzyl group, a naphthyl group, a phenanthryl group, a pyrenyl group and a biphenyl group.
  • One or more of the hydrogen atoms in the hydrocarbon group represented by R 1 to R 10 , R 21 and R 22 are halogen atoms, cyano groups, nitro groups, hydroxyl groups, -OR 11 , -COOR 11
  • the group having 1 to 20 carbon atoms substituted with -CO-R 11 or -SR 11 one or two or more hydrogen atoms in the above-mentioned hydrocarbon group having 1 to 20 carbon atoms are halogen atoms.
  • Cyano group, nitro group, hydroxyl group, -OR 11 , -COOR 11 , -CO-R 11 or -SR 11 and the total number of carbon atoms is 1 to 20.
  • a group having 1 to 20 carbon atoms in which one or two or more hydrogen atoms in the hydrocarbon group represented by R 11 are substituted with a halogen atom, a cyano group, a nitro group, or a hydroxyl group The structure is such that one or two or more hydrogen atoms in the hydrocarbon group having 1 to 20 carbon atoms are substituted with halogen atoms, cyano groups, nitro groups, and hydroxyl groups, and the total number of carbon atoms is 1 to 20. There is a group that is.
  • One or more of the hydrogen atoms in the hydrocarbon group represented by R 31 to R 40 are halogen atom, cyano group, nitro group, hydroxyl group, -OR 41 , -COOR 41 , -CO-R 41.
  • the group having 1 to 20 carbon atoms substituted with -SR 41 one or two or more hydrogen atoms in the above-mentioned hydrocarbon group having 1 to 20 carbon atoms are a halogen atom, a cyano group, or a nitro group.
  • Hydrocarbon, -OR 41 , -COOR 41 , -CO-R 41 or -SR 41 Hydrocarbon, -OR 41 , -COOR 41 , -CO-R 41 or -SR 41 , and the total number of carbon atoms is 1 to 20.
  • the above-mentioned carbon atom number 1 is used. or one or two methylene groups in the hydrocarbon group having to 20, -O -, - CO -, - COO -, - NR 42 -, - NR 42 CO- or -S- in substituted structure
  • a group having a total number of carbon atoms of 1 to 20 can be mentioned.
  • heterocyclic group having 2 to 20 carbon atoms in the general formula (I) examples include a tetrahydrofuranyl group, a dioxolanyl group, a tetrahydropyranyl group, a morpholic group, a furanyl group, a thiophenyl group, a methylthiophenyl group and a hexylthio.
  • the heterocyclic group having 2 to 20 carbon atoms has a substituent such as a halogen atom, a cyano group, a nitro group, a hydroxyl group, -OR 50 , -COOR 50 , -CO-R 50 or -SR 50. even if well, -O -, - CO -, - COO -, - NR 51 -, - NR 51 CO- or -S- like structure may include a.
  • R 50 and R 51 each independently represent a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms.
  • the hydrocarbon groups having 1 to 20 carbon atoms represented by R 50 and R 51 are the hydrocarbons having 1 to 20 carbon atoms in the general formula (I), the general formula (a) and the general formula (b). Similar to the hydrogen group.
  • the ring 10 include a benzene ring, a cyclohexene ring, a cyclohexane ring, a cyclopentadiene ring, a cyclopentane ring and the like. Further, these rings may have a substituent, and examples of the substituent include the above-mentioned heterocyclic ring-containing group having 2 to 20 carbon atoms.
  • R 39 and R 40 are connected to each other, and the ring consisting of hydrogen atom, nitrogen atom and carbon atom having 2 to 10 carbon atoms is a pyrrol ring as a ring including the bonded nitrogen atom.
  • These rings may have a substituent, and examples of the substituent include the substituents that the heterocyclic ring-containing group having 2 to 20 carbon atoms may have.
  • And R 39 and R 40 are connected to each other to form a ring consisting of a hydrogen atom, an oxygen atom, a nitrogen atom and a carbon atom having 2 to 10 carbon atoms, as a ring including a bonded nitrogen atom.
  • These rings may have a substituent, and examples of the substituent include the substituents that the heterocyclic ring-containing group having 2 to 20 carbon atoms may have.
  • the carbamoyl oxime compound in which R 1 in the general formula (I) is an aromatic hydrocarbon group having 6 to 20 carbon atoms is preferable because the obtained polymerizable composition is cured at a low exposure amount, and particularly contains a benzene ring.
  • a carbamoyloxime compound which is an aromatic hydrocarbon group having 6 to 20 carbon atoms is preferable. It is also preferable that R 1 is an aliphatic hydrocarbon group having 1 to 20 carbon atoms because the obtained polymerizable composition can be cured with a low exposure amount.
  • R 2 is preferably carbamoyl oxime compound is an aliphatic hydrocarbon group having 1 to 10 carbon atoms in the (I), in particular carbon atoms 1 It is preferably an alkyl group having up to 10 branches.
  • the obtained polymerizable composition is cured at a low exposure amount. It is preferable to do so.
  • X 1 in the general formula (I) is ⁇ NR 21 R 22 , and R 21 and R 22 are connected to each other to form a ring or hydrogen having 2 to 10 carbon atoms consisting of a hydrogen atom, a nitrogen atom and a carbon atom.
  • a carbamoyloxime compound having a ring of 2 to 10 carbon atoms composed of an atom, an oxygen atom, a nitrogen atom and a carbon atom is preferable because of its high base generation efficiency, and a carbon atom composed of a hydrogen atom, a nitrogen atom and a carbon atom.
  • a ring having the number of 2 to 6 or a ring having 2 to 6 carbon atoms composed of hydrogen atom, oxygen atom, nitrogen atom and carbon atom it is preferable that R 21 and R 22 are connected to each other to form a ring having 2 to 6 carbon atoms composed of a hydrogen atom, a nitrogen atom and a carbon atom, and form a piperidine ring or a pyrrolidine ring. It is more preferable to have.
  • R 21 is a hydrogen atom and R 22 is an aromatic hydrocarbon group having 6 to 20 carbon atoms.
  • both R 21 and R 22 are aliphatic hydrocarbon groups having 1 to 20 carbon atoms because of their high base generation efficiency.
  • R 3 , R 4 , R 5 , R 6 , R 7 , R 8 and R 9 one or more are -CO-R 10 , and R 10 is an aromatic hydrocarbon group having 6 to 20 carbon atoms.
  • the carbamoyl oxime compound is preferable because the obtained polymerizable composition is cured at a low exposure amount, and R 7 is -CO-R 10 , and R 10 is an aromatic having 6 to 20 carbon atoms containing a benzene ring.
  • Carbomoyloxime compounds, which are group hydrocarbon groups, are particularly preferred.
  • the carbamoyloxime compound in which n in the general formula (I) is 0 is preferable because it has high heat stability.
  • the carbamoyloxime compound in which n in the general formula (I) is 1 is preferable because the obtained polymerizable composition is cured with a low exposure amount.
  • R 1 in the general formula (I) is an aromatic hydrocarbon group having 6 to 20 carbon atoms
  • R 2 is an alkyl group having a branch having 1 to 10 carbon atoms.
  • R 8 and R 9 are linked to each other to form a benzene ring
  • X 1 is -NR 21 R 22
  • R 21 and R 22 are linked to each other from hydrogen, nitrogen and carbon atoms.
  • R 10 being an aromatic hydrocarbon group having 6 to 20 carbon atoms
  • n being 0. It is an oxime compound.
  • carbamoyloxime compound represented by the general formula (I) include compounds represented by the following chemical formulas (1) to (52). However, the present invention is not limited by the following compounds.
  • the method for producing the carbamoyloxime compound of the present invention represented by the above general formula (I) is not particularly limited, but for example, R 8 and R 9 are linked to each other to form a benzene ring, and X 1 is ⁇ .
  • R 8 and R 9 are linked to each other to form a benzene ring, and X 1 is ⁇ .
  • NR 21 R 22 and n 0, it can be produced by the following method according to the following reaction formula 1. That is, an oxime compound is obtained by reacting a known ketone compound with hydroxylamine hydrochloride in the presence of a base such as pyridine. Subsequently, the oxime compound is reacted with 4-nitrophenyl chloroformate and then with an amine to obtain the carbamoyl oxime compound of the present invention.
  • R 1 to R 7 , R 21 and R 22 are the same as the above general formula (I).
  • the above reaction formula 1 shows the case where X 1 is ⁇ NR 21 R 22 , but by changing the amine used, X 1 is represented by the above general formula (a) or the above general formula (b).
  • the base compound can also be produced.
  • the oxime compound can also be produced by the method described in Japanese Patent No. 4223071.
  • the carbamoyloxime compound of the present invention is useful as a latent base generator and a polymerization initiator because it efficiently generates bases and radicals by irradiation with light such as ultraviolet rays or heating, and is particularly useful as a polymerization initiator. ..
  • the latent base generator of the present invention means a composition containing a compound having a function of efficiently generating a base by irradiating with light such as ultraviolet rays, and its use is as a pH adjuster.
  • Examples include a catalyst using a base.
  • the carbamoyloxime compound of the present invention is useful as a photobase generator and a photoradical polymerization initiator because of its high efficiency of generating bases and radicals by light irradiation among the above-mentioned polymerization initiators, and has a high base generation efficiency. Since it is very expensive, it is particularly useful as a photobase generator.
  • the polymerization initiator of the present invention contains at least one carbamoyloxime compound represented by the above general formula (I).
  • the polymerization initiator that can be used in combination with the carbamoyloxime compound represented by the general formula (I) is not particularly limited, and examples thereof include conventionally known photobase generators and photoradical polymerization initiators. ..
  • the content of the compound represented by the general formula (I) in the polymerization initiator is preferably 1 to 100% by mass, more preferably 50, because the obtained polymerizable composition is cured at a low exposure amount. ⁇ 100% by mass.
  • the polymerizable composition of the present invention contains a polymerization initiator (A) containing at least one carbamoyloxime compound represented by the above general formula (I), and a polymerizable compound (B).
  • the content of the polymerization initiator (A) is preferably 1 to 20 parts by mass, more preferably 1 to 20 parts by mass, because the obtained polymerizable composition is cured at a low exposure amount with respect to 100 parts by mass of the polymerizable compound (B). Is 1 to 10 parts by mass.
  • the content of the polymerization initiator (A) is 1 part by mass or more, it is easy to prevent curing failure due to insufficient curing sensitivity. Therefore, when it is 20 parts by mass or less, it volatilizes during light irradiation or heating. It is preferable because it can suppress objects.
  • Examples of the polymerizable compound (B) used in the present invention include a compound having an anionic polymerizable functional group, a compound that is cured by a reaction in which a base acts as a catalyst or a reaction in which a base is added, and a radically polymerizable compound.
  • a photosensitive resin that polymerizes and cures by irradiating with energy rays such as ultraviolet rays or a cured resin that lowers the curing temperature is preferable because the obtained polymerizable composition cures with a low exposure amount.
  • the anion-polymerizable functional group means a functional group that can be polymerized by a base generated from a photobase generator by an active energy ray such as ultraviolet rays, and for example, an epoxy group, an episulfide group, or a cyclic monomer ( ⁇ -valerolactone, ⁇ -Caprolactam), malonic acid ester and the like.
  • Reactions in which a base acts as a catalyst or a base is added include a urethane bond formation reaction between isocyanate and alcohol, an addition reaction between an epoxy resin and a compound containing a hydroxyl group, and an addition reaction between an epoxy resin and a compound containing a carboxylic acid group.
  • Addition reaction of epoxy resin and thiol compound Michael addition reaction of (meth) acrylic group, dehydration condensation reaction of polyamic acid, hydrolysis / polycondensation reaction of alkoxysilane and the like.
  • Examples of the compound having an anionic polymerizable functional group include epoxy resin, oxetane resin, episulfide resin, cyclic amide (lactam compound), cyclic ester (lactone compound), cyclic carbonate compound, malonic acid ester and the like.
  • Examples of compounds that are cured by a reaction in which a base acts as a catalyst or a reaction in which a base is added include a polyamide resin (polynitation reaction by dehydration cyclization), an epoxy / hydroxyl group (ring-opening addition reaction), and an epoxy / carboxylic acid system.
  • Examples of the compound polymerized by radicals include ethylenically unsaturated compounds. Since it has high reactivity, it is preferable to use a compound that undergoes radical polymerization. These resins may be used alone or in combination of two or more. As a preferable combination, a combination of an epoxy resin and a phenol resin is excellent in that the reaction proceeds quickly and the adhesiveness is good, and a combination of an epoxy resin and a thiol compound and a high reactivity because of excellent low-temperature curability. Therefore, a combination of an ethylenically unsaturated compound and a thiol compound can be mentioned.
  • the epoxy resin may have an epoxy group, but the carbamoyloxime compound of the present invention is excluded.
  • the epoxy resin include polyglycidyl ether compounds of mononuclear polyvalent phenol compounds such as hydroquinone, resorcin, pyrocatechol, and fluorocurxinol; dihydroxynaphthalene, biphenol, methylenebisphenol (bisphenol F), methylenebis (orthocresol), and the like.
  • Echiliden bisphenol isopropyridene bisphenol (bisphenol A), 4,4'-dihydroxybenzophenone, isopropyridenebis (orthocresol), tetrabromobisphenol A, 1,3-bis (4-hydroxycumylbenzene), 1,4- Bis (4-hydroxycumylbenzene), 1,1,3-tris (4-hydroxyphenyl) butane, 1,1,2,2-tetra (4-hydroxyphenyl) ethane, thiobisphenol, sulfobisphenol, oxybisphenol Polyglycidyl ether compounds of polynuclear polyvalent phenolic compounds such as phenol novolac, orthocresol novolac, ethylphenol novolac, butylphenol novolak, octylphenol novolac, resorcin novolac, terpenphenol; ethylene glycol, propylene glycol, butylene glycol, hexanediol, polyglycol.
  • Polyglycidyl ethers of polyhydric alcohols such as thiodiglycol, glycerin, trimethylolpropane, pentaerythritol, sorbitol, bisphenol A-ethylene oxide adduct; maleic acid, fumaric acid, itaconic acid, succinic acid, glutaric acid, sveric acid , Adipic acid, azelaic acid, sebacic acid, dimer acid, trimeric acid, phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, trimesic acid, pyromellitic acid, tetrahydrophthalic acid, hexahydrophthalic acid, endomethylenetetrahydrophthalic acid
  • Glycidyl esters of aliphatic, aromatic or alicyclic polybasic acids such as, and homopolymers or copolymers of glycidyl methacrylate; N, N-diglycidylaniline, bis
  • these epoxy resins may be those internally crosslinked by a prepolymer of terminal isocyanate or those having a high molecular weight with a polyvalent active hydrogen compound (polyhydric phenol, polyamine, carbonyl group-containing compound, polyphosphate ester, etc.). ..
  • a polyvalent active hydrogen compound polyhydric phenol, polyamine, carbonyl group-containing compound, polyphosphate ester, etc.
  • those having a glycidyl group are preferable, and those having a bifunctional or higher functional glycidyl group are more preferable, because the obtained polymerizable composition is excellent in curability.
  • the phenol resin may have a phenolic hydroxyl group, but the carbamoyl oxime compound and the epoxy resin are excluded.
  • a phenol resin having two or more hydroxy groups in one molecule is preferable because the obtained polymerizable composition is excellent in curability, and generally known ones can be used.
  • the phenol resin include bisphenol A type phenol resin, bisphenol E type phenol resin, bisphenol F type phenol resin, bisphenol S type phenol resin, phenol novolac resin, bisphenol A novolak type phenol resin, glycidyl ester type phenol resin, and aralkyl novolac.
  • the thiol compound may have a thiol group, but the carbamoyloxime compound, epoxy resin and phenol resin are excluded.
  • the thiol compounds those having two or more thiol groups in one molecule are preferable because the obtained polymerizable composition is excellent in curability.
  • Preferred specific examples of the thiol compound are bis (2-mercaptoethyl) sulfide, 2,5-dimercaptomethyl-1,4-ditian, 1,3-bis (mercaptomethyl) benzene, and 1,4-bis (mercapto).
  • Methyl) benzene 4-mercaptomethyl-1,8-dimercapto-3,6-dithiaoctane, 4,8-dimercaptomethyl-1,11-dimercapto-3,6,9-trithiaundecane, 4,7-di Mercaptomethyl-1,11-dimercapto-3,6,9-trichiaundecan, 5,7-dimercaptomethyl-1,11-dimercapto-3,6,9-trithiaundecane, 1,2,6,7 -Tetramercapto-4-thiaheptan, pentaerythrithiol, 1,1,3,3-tetrakis (mercaptomethylthio) propane, pentaerythritol tetrakis mercaptopropionate, pentaerythritol tetrakisthioglycolate, trimethylolpropane tristhioglycolate , And trimethylolpropanthris mercap
  • Particularly preferred compounds are 1,2,6,7-tetramercapto-4-thiaheptan, pentaerythrithiol, bis (2-mercaptoethyl) sulfide, 2,5-dimercaptomethyl-1,4-dithiane, and 4 -Mercaptomethyl-1,8-dimercapto-3,6-dithiane octane.
  • the thiol compound may be used alone or in combination of two or more.
  • the polyamide resin includes ethylenetetracarboxylic dianhydride, 1,2,3,4-benzenetetracarboxylic dianhydride, 1,2,3,4-cyclohexanetetracarboxylic dianhydride as acid dianhydride. , 2,2', 3,3'-benzophenonetetracarboxylic dianhydride, 2,2,3,3-biphenyltetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride Etc.
  • diamines as diamines, (o-, m- or p-) phenylenediamine, (3,3'-or 4,4'-) diaminodiphenyl ether, diaminobenzophenonone, (3,3'-or 4,4' -)
  • diamines (o-, m- or p-) phenylenediamine, (3,3'-or 4,4'-) diaminodiphenyl ether, diaminobenzophenonone, (3,3'-or 4,4' -)
  • diamines o-, m- or p-
  • diaminodiphenyl ether diaminobenzophenonone
  • diaminobenzophenonone 3,3'-or 4,4' -
  • resins made from diaminodiphenylmethane or the like examples thereof include resins made from diaminodiphenylmethane or the like.
  • polyurethane resin examples include resins made from polyfunctional isocyanates such as tolylene diisocyanate, hexamethylene diisocyanate, diphenylmethane diisocyanate and isophorone diisocyanate, and polyols (polyfunctional alcohols) such as polyether polyols, polyester polyols and polycarbonate polyols.
  • polyfunctional isocyanates such as tolylene diisocyanate, hexamethylene diisocyanate, diphenylmethane diisocyanate and isophorone diisocyanate
  • polyols polyfunctional alcohols
  • nylon resin examples include resins made from cyclic monomers such as ⁇ -caprolactam and lauryl lactam.
  • polyester resin examples include resins made from cyclic monomers such as ⁇ -valerolactone and ⁇ -propiolactone.
  • the ethylenically unsaturated compound may have an ethylenically unsaturated bond, but the carbamoyloxime compound, epoxy resin, phenol resin and thiol compound are excluded.
  • the ethylenically unsaturated compound include unsaturated aliphatic hydrocarbons such as ethylene, propylene, butylene, isobutylene, vinyl chloride, vinylidene chloride, vinylidene fluoride, and tetrafluoroethylene; (meth) acrylic acid and ⁇ -chloroacrylic acid.
  • Acids itaconic acid, maleic acid, citraconic acid, fumaric acid, hymic acid, crotonic acid, isocrotonic acid, vinyl acetic acid, allylacetic acid, cinnamic acid, sorbic acid, mesaconic acid, mono-succinic acid [2- (meth) acrylic acid Ethyl], mono (2- (meth) acrylicyloxyethyl] phthalate, ⁇ -carboxypolycaprolactone mono (meth) acrylate, and other mono (meth) acrylates of polymers having carboxy groups and hydroxyl groups at both ends; hydroxyethyl Unsaturation of (meth) acrylate malate, hydroxypropyl (meth) acrylate malate, dicyclopentadiene malate or polyfunctional (meth) acrylate having one carboxyl group and two or more (meth) acryloyl groups.
  • Polybasic acid -2-hydroxyethyl (meth) acrylate, -2-hydroxypropyl (meth) acrylate, glycidyl (meth) acrylate, methyl (meth) acrylate, butyl (meth) acrylate, (meth) Isobutyl acrylate, -t-butyl (meth) acrylate, cyclohexyl (meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, stearyl (meth) acrylate , (Meta) lauryl acrylate, (meth) methoxyethyl acrylate, (meth) dimethylaminomethyl acrylate, (meth) dimethylaminoethyl acrylate, (meth) aminopropyl acrylate, (meth) dimethylaminopropyl acryl
  • Macropolymers Vinyl chloride, vinylidene chloride, divinyl succinate, diallyl phthalate, triallyl phosphate, triallyl isocyanurate, vinyl thioether, vinyl imidazole, vinyl oxazoline, vinyl carbazole, vinyl pyrrolidone, vinyl pyridine, hydroxyl group
  • vinyl urethane compounds of vinyl monomers and polyisocyanate compounds vinyl epoxy compounds of hydroxyl group-containing vinyl monomers and polyepoxy compounds.
  • the ethylenically unsaturated compound can be used alone or in combination of two or more.
  • Kayarad DPHA, DPEA-12, PEG400DA, THE-330, RP-1040, NPGDA, PET30, R-684 all manufactured by Nippon Kayaku.
  • Aronix M-215, M-350 above, manufactured by Toagosei
  • NK ester A-DPH, A-TMPT, A-DCP, A-HD-N, TMPT, DCP, NPG and HD-N aboveve, Shin-Nakamura Chemical Industry Co., Ltd.
  • SPC-1000, SPC-3000 all manufactured by Showa Denko); etc.
  • the content of the polymerizable composition (B) may be an amount suitable for the purpose of use, but in order to prevent curing failure, it is included in the solid content (all components other than the solvent) in the polymerizable composition. , 50 parts by mass or more is preferable, 60 parts by mass or more is more preferable, and 70 parts by mass or more is particularly preferable.
  • additives such as an inorganic compound, a coloring material, a latent epoxy curing agent, a chain transfer agent, a sensitizer, and a solvent can be used as optional components.
  • the inorganic compound examples include metal oxides such as nickel oxide, iron oxide, iridium oxide, titanium oxide, zinc oxide, magnesium oxide, calcium oxide, potassium oxide, silica and alumina; layered clay minerals, miloli blue and calcium carbonate.
  • metal oxides such as nickel oxide, iron oxide, iridium oxide, titanium oxide, zinc oxide, magnesium oxide, calcium oxide, potassium oxide, silica and alumina; layered clay minerals, miloli blue and calcium carbonate.
  • These inorganic compounds are used as, for example, fillers, antireflection agents, conductive materials, stabilizers, flame retardants, mechanical strength improvers, special wavelength absorbers, ink generators and the like.
  • coloring material examples include pigments, dyes, and natural pigments. These coloring materials can be used alone or in combination of two or more.
  • Examples of the pigment include nitroso compounds; nitro compounds; azo compounds; diazo compounds; xanthene compounds; quinoline compounds; anthraquinone compounds; coumarin compounds; phthalocyanine compounds; isoindolinone compounds; isoindolin compounds; quinacridone compounds; antanthurone compounds; perinone.
  • a commercially available pigment may be used, for example, Pigment Red 1, 2, 3, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48, 49, 88, 90, 97, 112, 119, 122, 123, 144, 149, 166, 168, 169, 170, 171, 177, 179, 180, 184, 185, 192, 200, 202, 209, 215, 216, 217, 220, 223, 224, 226, 227, 228, 240, 254; Pigment Orange 13, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64, 65, 71; Pigment Yellow 1, 3, 12, 13, 14, 16, 17, 20, 24, 55, 60, 73, 81, 83, 86, 93, 95, 97, 98, 100, 109, 110, 113, 114, 117, 120, 125, 126, 127, 129, 137, 138, 139, 147,
  • Examples of the above dyes include azo dyes, anthraquinone dyes, indigoid dyes, triarylmethane dyes, xanthene dyes, alizarin dyes, acrydin dyes, stillben dyes, thiazole dyes, naphthol dyes, quinoline dyes, nitro dyes, indamine dyes, oxazine dyes, and phthalocyanine dyes.
  • Dyes such as cyanine dyes, and the like, and a plurality of these may be mixed and used.
  • latent epoxy curing agent examples include dicyandiamide, modified polyamines, hydrazides, 4,4'-diaminodiphenylsulfone, boron trifluoride amine complex salts, imidazoles, guanamines, imidazoles, ureas and melamines. Can be mentioned.
  • a sulfur atom-containing compound is generally used as the chain transfer agent or sensitizer.
  • Alkyliodated compounds such as, trimethylolpropanetris (3-mercaptoisobutyrate), butanediol bis (3-mercaptoisobutyrate), hexanedithiol, decandithiol, 1,4-dimethylmercaptobenzene, butanediol bisthio.
  • Propionate Butanediol Bisthioglycolate, Ethethylene Glycol Bisthioglycolate, Trimethylol Propanetristhioglycolate, Butanediol Bisthiopropionate, Trimethylol Propanetristhiopropionate, Trimethylol Propanetristhioglycolate , Pentaerythritol tetrakisthiopropionate, pentaerythritol tetrakisthioglycolate, trishydroxyethyl tristhiopropionate, diethylthioxanthone, diisopropylthioxanthone, the following compound No. Examples thereof include aliphatic polyfunctional thiol compounds such as C1, tris (2-hydroxyethyl) trimercaptopropionate, isocyanurate, and Karenz MT BD1, PE1, NR1 manufactured by Showa Denko.
  • the solvent is usually a solvent capable of dissolving or dispersing each of the above components (polymerization initiator (A), polymerizable compound (B), etc.), for example, methyl ethyl ketone, methyl amyl ketone, diethyl ketone, acetone, methyl isopropyl.
  • Ketones such as ketone, methylisobutylketone, cyclohexanone, 2-heptanone; ether solvents such as ethyl ether, dioxane, tetrahydrofuran, 1,2-dimethoxyethane, 1,2-diethoxyethane, dipropylene glycol dimethyl ether; methyl acetate , Ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, cyclohexyl acetate, ethyl lactate, dimethyl succinate, texanol and other ester solvents; ⁇ -caprolactone, ⁇ -caprolactone, ⁇ -butyrolactone and other lactone solvents.
  • ether solvents such as ethyl ether, dioxane, tetrahydrofuran, 1,2-dimethoxyethane, 1,2-diethoxyethane, di
  • Solvents such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; alcohol solvents such as methanol, ethanol, iso- or n-propanol, iso- or n-butanol, amyl alcohol; ethylene glycol monomethyl acetate, ethylene Ether ester solvents such as glycol monoethyl acetate, propylene glycol-1-monomethyl ether-2-acetate, dipropylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, ethoxyethyl propionate; BTX such as benzene, toluene, xylene Solvents; aliphatic hydrocarbon solvents such as hexane, heptane, octane, cyclohexane; terpene hydrocarbons such as terepine oil, D-lymonen, pinen; mineral spirit, swazole #
  • solvents can be used alone or as a mixed solvent of two or more.
  • ketones or ether ester-based solvents particularly propylene glycol-1-monomethyl ether-2-acetate (hereinafter, also referred to as "PGMEA") from the viewpoint of alkali developability, patterning property, film forming property, and solubility.
  • PGMEA propylene glycol-1-monomethyl ether-2-acetate
  • cyclohexanone is preferably used.
  • the content of the solvent is not particularly limited, each component is uniformly dispersed or dissolved, and the polymerizable composition of the present invention exhibits a liquid or paste suitable for each application.
  • the amount may be any amount, but usually, it is a uniform cured product that the solvent is contained in the range where the amount of the solid content (all components other than the solvent) in the polymerizable composition of the present invention is 10 to 90% by mass. Is preferable because
  • the polymerizable composition of the present invention can also improve the characteristics of the cured product by using an organic polymer.
  • organic polymer include polystyrene, polymethylmethacrylate, methylmethacrylate-ethylacrylate copolymer, poly (meth) acrylic acid, styrene- (meth) acrylic acid copolymer, and (meth) acrylic acid-methylmethacrylate.
  • Copolymer ethylene-vinyl chloride copolymer, ethylene-vinyl copolymer, polyvinyl chloride resin, ABS resin, nylon 6, nylon 66, nylon 12, urethane resin, polycarbonate polyvinyl butyral, cellulose ester, polyacrylamide, saturated Examples thereof include polyester, phenol resin, and phenoxy resin.
  • the content thereof is preferably 10 to 500 parts by mass with respect to 100 parts by mass of the polymerizable compound (B) from the viewpoint that the obtained polymerizable composition has excellent curability. ..
  • a surfactant a silane coupling agent, a melamine compound and the like can be used in combination with the polymerizable composition of the present invention.
  • the surfactant examples include fluorine-based surfactants such as perfluoroalkyl phosphate and perfluoroalkyl carboxylate; anionic surfactants such as higher fatty acid alkali salts, alkyl sulfonates and alkyl sulfates; higher grades. Cationic surfactants such as amine halides and quaternary ammonium salts; nonionic surfactants such as polyethylene glycol alkyl ethers, polyethylene glycol fatty acid esters, sorbitan fatty acid esters, fatty acid monoglycerides; amphoteric surfactants; silicone-based surfactants Surfactants such as activators can be used, and these may be used in combination.
  • fluorine-based surfactants such as perfluoroalkyl phosphate and perfluoroalkyl carboxylate
  • anionic surfactants such as higher fatty acid alkali salts, alkyl sulfonates and alkyl sulfates; higher
  • silane coupling agent for example, a silane coupling agent manufactured by Shin-Etsu Chemical Co., Ltd. can be used, among which it has an isocyanate group, a methacryloyl group or an epoxy group such as KBE-9007, KBM-502 and KBE-403.
  • a silane coupling agent is preferably used.
  • Examples of the melamine compound include all or a part of active methylol groups (CH 2 OH groups) in nitrogen compounds such as (poly) methylol melamine, (poly) methylol glycol uryl, (poly) methylolbenzoguanamine, and (poly) methylol urea.
  • nitrogen compounds such as (poly) methylol melamine, (poly) methylol glycol uryl, (poly) methylolbenzoguanamine, and (poly) methylol urea.
  • examples thereof include compounds in which (at least two) are alkyl etherified.
  • examples of the alkyl group constituting the alkyl ether include a methyl group, an ethyl group and a butyl group, which may be the same as each other or different from each other.
  • the methylol group which has not been alkyl etherized may be self-condensed in one molecule, or may be condensed between two molecules to form an oligomer component as a result.
  • hexamethoxymethylmelamine, hexabutoxymethylmelamine, tetramethoxymethylglycol uryl, tetrabutoxymethyl glycol uryl and the like can be used.
  • alkyl etherified melamines such as hexamethoxymethylmelamine and hexabutoxymethylmelamine are preferable from the viewpoint of solubility in a solvent and difficulty in crystal precipitation from the polymerizable composition.
  • the content of optional components (excluding inorganic compounds, coloring materials, and solvents) other than the polymerization initiator (A) and the polymerizable compound (B) depends on the purpose of use thereof.
  • the content is appropriately selected and is not particularly limited, but is preferably 50 parts by mass or less in total with respect to 100 parts by mass of the polymerizable compound (B) from the viewpoint that the obtained polymerizable composition is excellent in curability.
  • the polymerizable composition of the present invention can be made into a cured product by irradiating it with energy rays.
  • the cured product is formed into an appropriate shape according to the application.
  • the polymerizable composition of the present invention is a soda by a known means such as a spin coater, a roll coater, a bar coater, a die coater, a curtain coater, various types of printing, and immersion. It can be applied on a supporting substrate such as glass, quartz glass, a semiconductor substrate, metal, paper, or plastic. Further, once applied on a support substrate such as a film, it can be transferred onto another support substrate, and there is no limitation on the application method.
  • an ultra-high pressure mercury lamp such as electromagnetic energy and electron beam, X-ray, radiation, etc. having a wavelength of 2000 angstrom to 7000 angstrom obtained from lamps, metal halide lamps, fluorescent lamps, tungsten lamps, excimer lamps, sterilization lamps, light emitting diodes, CRT light sources, etc.
  • the obtained polymerizable composition is excellent in curability, it is preferable to use an ultra-high pressure mercury lamp, a mercury vapor lamp, a carbon arc lamp, or a xenon arc that emits light having a wavelength of 300 to 450 nm. Lights and the like are used.
  • the laser direct drawing method which forms an image directly from digital information of a computer or the like without using a mask, improves not only productivity but also resolution and position accuracy.
  • the laser light light having a wavelength of 340 to 430 nm is preferably used, but an excimer laser, a nitrogen laser, an argon ion laser, a helium cadmium laser, a helium neon laser, and a krypton ion laser are useful.
  • Various semiconductor lasers, YAG lasers and the like that emit light in the visible to infrared region can also be used. When these laser beams are used, a sensitizing dye that absorbs the visible to infrared region is preferably added because the obtained polymerizable composition has excellent curability.
  • the polymerizable composition of the present invention it is usually necessary to heat after irradiation with the above energy rays, and heating at about 40 to 150 ° C. is preferable in terms of the curing rate.
  • the polymerizable composition of the present invention is a photocurable paint or varnish; a photocurable adhesive; a coating agent for metals; a printed circuit board; a color display liquid crystal display element for a color television, a PC monitor, a mobile information terminal, a digital camera, or the like.
  • Composition for encapsulating parts solder resist; magnetic recording material; micromechanical parts; waveguide; optical switch; plating mask; etching mask; color test system; glass fiber cable coating; screen printing stencil; stereolithography Materials for manufacturing three-dimensional objects by; Holography recording materials; Image recording materials; Microelectronic circuits; Decolorizing materials; Decolorizing materials for image recording materials; Decolorizing materials for image recording materials using microcapsules; Printing Photoresist material for wiring boards; Photoresist material for UV and visible laser direct imaging systems; Photoresist material used for forming dielectric layers in sequential lamination of printed circuit boards, or protective film, etc. It can be used, and its use is not particularly limited.
  • the polymerizable composition of the present invention can also be used for the purpose of forming a spacer for a liquid crystal display panel and for forming a protrusion for a vertically oriented liquid crystal display element.
  • it is useful as a photosensitive resin composition for simultaneously forming protrusions and spacers for a vertically oriented liquid crystal display element.
  • the above spacers for liquid crystal display panels include (1) a step of forming a coating film of the polymerizable composition of the present invention on a substrate, and (2) energy rays (2) through a mask having a predetermined pattern shape on the coating film. It is preferably formed by a step of irradiating (light), (3) a baking step after exposure, (4) a step of developing a film after exposure, and (5) a step of heating the film after development.
  • the polymerizable composition of the present invention to which a coloring material is added is suitably used as a resist that constitutes each pixel such as RGB in a color filter and a resist for a black matrix that forms a partition wall of each pixel. Further, in the case of a black matrix resist to which an ink repellent is added, it is preferably used for a partition wall for an inkjet color filter having a profile angle of 50 ° or more.
  • a composition containing a fluorine-based surfactant and a fluorine-based surfactant is preferably used.
  • the partition wall formed from the polymerizable composition of the present invention partitions on the transferred body, and droplets are applied to the recesses on the partitioned partition by the inkjet method.
  • the optical element is manufactured by the method of forming an image region. At this time, it is preferable that the droplets contain a colorant and the image region is colored. In that case, the optical element manufactured by the above manufacturing method is formed from a plurality of colored regions on the substrate. It has at least a partition wall that separates the pixel group and each colored region of the pixel group.
  • the polymerizable composition of the present invention can also be used as a protective film or insulating film composition.
  • it can contain an ultraviolet absorber, an alkylation-modified melamine and / or an acrylic-modified melamine, a mono- or bifunctional (meth) acrylate monomer and / or a silica sol containing an alcoholic hydroxyl group in the molecule.
  • the insulating film is used for the insulating resin layer in a laminated body in which an insulating resin layer is provided on a peelable supporting base material, and the laminated body can be developed with an alkaline aqueous solution and is an insulating resin layer.
  • the thickness of the film is preferably 10 to 100 ⁇ m.
  • the polymerizable composition of the present invention can be used as a photosensitive paste composition by containing an inorganic compound.
  • the photosensitive paste composition can be used to form a fired product pattern such as a partition wall pattern, a dielectric pattern, an electrode pattern and a black matrix pattern of a plasma display panel.
  • Example 2 and Comparative Example 1 Preparation of polymerizable composition
  • the formulation shown in Table 2 was carried out to obtain a polymerizable composition 1 and a comparative polymerizable composition 1.
  • the compounding values in the table indicate parts by mass.
  • the reference numerals of the respective components in the table represent the following components.
  • A-1 Compound 1 A'-2: Comparative compound 1 B-1: EPPN-201 (phenol novolac type epoxy resin, epoxy equivalent 193 g / eq., Manufactured by Nippon Kayaku Co., Ltd.) B-2: H-3M (phenolic resin, hydroxyl group equivalent 105-109 g / eq., Manufactured by Meiwa Kasei Co., Ltd.) C-1: FZ-2122 (polyether-modified polysiloxane, manufactured by Toray Dow Corning, 1 wt% PGMEA solution) D-1: Cyclopentanone (solvent)
  • a step tablet (33-stage type, OD value 0 to 3, Table 3) having a gradation in which the transmittance changes continuously is masked, and UV-LED (365 nm) is used to expose ultraviolet light.
  • a fixed amount of irradiation was performed (illuminance 20 mW / cm 2 , exposure time 150 seconds, integrated exposure 3000 mJ / cm 2 ).
  • After the exposure it was post-baked (100 ° C. ⁇ 20 minutes) in an oven, developed (PGMEA, 30 seconds) and rinsed (isopropyl alcohol, 10 seconds).
  • the number of remaining stages of the obtained cured film sample was visually confirmed. The number of remaining stages means the maximum number of stages in which the cured film remains.
  • the transmittance was determined from the number of remaining stages according to Table 3, and the conversion sensitivity was calculated by using the following formula.
  • Conversion sensitivity (mJ / cm 2 ) Integrated exposure (3000 mJ / cm 2 ) x Transmittance (%)
  • Table 4 shows the number of remaining stages and the conversion sensitivity.
  • the polymerizable composition containing the carbamoyloxime compound of the present invention has a large number of remaining stages (high curability) as compared with the comparative polymerizable composition, and therefore has a high photobase generation efficiency. It can be cured with a low exposure and is highly sensitive to UV-LED light sources. Therefore, it is clear that the compound of the present invention is excellent as a polymerization initiator.
  • the carbamoyloxime compound of the present invention has a high photobase generation efficiency, and when used as a polymerization initiator, it can generate a base more efficiently than a conventional photobase generator, so that the exposure amount is low. Also, the polymerizable compound can be cured. In particular, when used in a curable resin composition containing an epoxy resin or a phenol resin, it exhibits high curability.

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PCT/JP2020/022651 2019-06-11 2020-06-09 カルバモイルオキシム化合物並びに該化合物を含有する重合開始剤及び重合性組成物 WO2020250879A1 (ja)

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