WO2020248470A1 - 发出偏振光的贴片led灯珠及其批量制作方法 - Google Patents

发出偏振光的贴片led灯珠及其批量制作方法 Download PDF

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Publication number
WO2020248470A1
WO2020248470A1 PCT/CN2019/113267 CN2019113267W WO2020248470A1 WO 2020248470 A1 WO2020248470 A1 WO 2020248470A1 CN 2019113267 W CN2019113267 W CN 2019113267W WO 2020248470 A1 WO2020248470 A1 WO 2020248470A1
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Prior art keywords
led lamp
light
lamp bead
polarizing film
film
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PCT/CN2019/113267
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English (en)
French (fr)
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王鹏
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郑州胜龙信息技术股份有限公司
王鹏
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Priority to US17/532,189 priority Critical patent/US20230261155A1/en
Publication of WO2020248470A1 publication Critical patent/WO2020248470A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0025—Processes relating to coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination

Definitions

  • the invention relates to an LED lamp bead and a manufacturing method thereof, in particular to a patch LED lamp bead emitting polarized light and a batch manufacturing method thereof.
  • LED display screens have been widely used in all aspects of people's work and life, bringing people a rich and colorful visual enjoyment.
  • the performance of the three-dimensional LED display is particularly outstanding, and the three-dimensional LED display can bring people to life.
  • the experience of its environment is especially suitable for playing videos of various natural landscapes and science fiction.
  • One of the polarization stereo LED displays divides the display dot matrix of the LED display into several rows (columns), among which all odd rows (columns) are used Display one image in the stereo image, all even rows (columns) are used to display another image in the stereo image, all odd rows (columns) are pasted with the polarizing film of the same polarization direction on the surface of the LEDs, all even rows (columns) ) The surface of the LED is pasted with a polarizing film with the polarization direction opposite to the odd row (column); there is also a three-dimensional LED display screen.
  • the polarization direction of the display dot matrix is in the odd and even matrix format, or checkerboard, that is, the first row is "left-biased” Right, left, right, .", the second line “right, left, right, left, ## and so on, this kind of three-dimensional LED display needs to display dot matrix Polarizing films with different polarization directions are pasted on the upper interval; the above-mentioned two three-dimensional LED display screens can display images with two different polarization directions at the same time when working, and the viewer can see the realistic three-dimensional images with the corresponding stereo glasses.
  • the technical problem to be solved by the present invention is to provide a patch LED lamp bead that emits polarized light and a batch production method thereof.
  • the patch LED lamp bead can emit polarized light, which reduces the manufacturing process of a three-dimensional LED display.
  • the batch production method of chip LED lamp beads can braid SMD LED lamp beads with the same polarization direction in the same position direction, which is convenient for welding SMD LED lamp beads with the same polarization direction in the same row when making a three-dimensional LED display. (Column) Welding in the middle or interval improves the production efficiency of the three-dimensional LED display.
  • a patch LED lamp bead that emits polarized light. It contains a patch LED lamp bead bracket and N LED light-emitting chips, where N is a natural number greater than or equal to 1, and N LED light-emitting chips are placed on the patch LED lamp bead. On the inner bottom surface of the bracket, a layer of polarizing film is horizontally arranged above the N LED light-emitting chips, and the gap between the inner bottom surface of the SMD LED lamp bead bracket and the lower surface of the polarizing film is filled with cured first light-transmitting glue.
  • a layer of cured second light-transmitting glue or light-transmitting film is arranged on the upper surface of the polarizing film.
  • the material of the second light-transmitting glue is epoxy resin, silica gel, UV glue or other light-transmitting filling media; the light-transmitting film is AGAR film.
  • N LED light-emitting chips are fixed on the inner bottom surface of the SMD LED lamp bead holder by conductive glue or insulating glue, between the N LED light-emitting chips and the inner bottom surface of the SMD LED lamp bead holder Connected with wires, the wires are located under the polarizing film; the conductive glue is silver glue; the wires are gold wires, alloy wires, copper wires or other metal wires;
  • the LED light-emitting chip is a flip chip
  • N LED light-emitting chips are welded on the inner bottom of the SMD LED lamp bead holder.
  • N is 1 ⁇ 3;
  • the material of the first light-transmitting glue is epoxy resin, silica gel or other light-transmitting filling medium;
  • the polarizing film is left-handed polarizing film, right-handed polarizing film or linear polarizing film; the polarizing film is located in the chip LED lamp beads Inside or outside the stent.
  • a method for mass production of the above-mentioned polarized patch LED lamp beads includes the following steps:
  • Step 1 Install N LED luminous chips on the inner bottom surface of each SMD LED lamp bead bracket in the SMD LED lamp bead bracket matrix, and make the electrodes of the N LED luminous chips and the inner bottom surface of the SMD LED lamp bead bracket The conductive areas are connected together to form an electrical path, and N is a natural number greater than or equal to 1.
  • Each SMD LED lamp bead bracket in the SMD LED lamp bead bracket matrix is connected to each other, and each SMD LED lamp bead bracket All have signs to identify the direction;
  • Step 2 Preheat the semi-finished product formed in Step 1;
  • the preheating is completed by an oven or an oven, so that the semi-finished product formed in step 1 is preheated to a suitable temperature, which facilitates the better combination of the first light-transmitting glue and the SMD LED lamp bead bracket, and avoids bubbles and other impurities during the packaging process;
  • Step 3 Use a dispenser to fill the first light-transmitting glue into each LED lamp bead holder, so that the N LED light-emitting chips are immersed in the first light-transmitting glue, and the surface of the first light-transmitting glue is level ;
  • Step 4 Bake the semi-finished product formed in step 3 to cure the first light-transmitting glue filled in each SMD LED lamp bead holder;
  • Step 5 Use the placement machine to extract each small piece of polarizing film in the polarizing film matrix, and paste it on the surface of the first light-transmitting glue in each LED lamp bead holder to form the first light-transmitting glue surface ⁇ polarizing film;
  • the polarizing film matrix is made of a whole polarizing film with a first base film.
  • the whole polarizing film is pasted with the first base film through the adhesive on its lower surface.
  • the method of making the polarizing film matrix is: The entire polarizing film of the first base film is put into the cutting machine, and the entire polarizing film is cut into small pieces of polarizing film arranged in rows and columns according to the preset procedure to form a polarizing film matrix, each of the polarizing film matrixes
  • the shape and size of the small piece of polarizing film (the small piece of polarizing film can be square, rectangular, circular or polygonal, and the surface area of the small piece of polarizing film ranges from about 0.1 square millimeters to a dozen square millimeters) and SMD LED lamp beads
  • the shape and size of the bracket are matched, the first base film is not cut, and the polarizing film matrix is pasted on the upper surface of the first base film;
  • the first base film with too strong adhesion to the entire polarizing film should not be used to affect the extraction of small pieces of polarizing film;
  • Step 6 Separate each SMD LED lamp bead bracket to form an independent SMD LED lamp bead
  • Step 7 Use a spectrometer to divide the SMD LED lamp beads into different types
  • the SMD LED lamp beads can be divided into multiple levels and models;
  • Step 8 Use a taping machine to tap different types of SMD LED lamp beads.
  • the SMD LED lamp bead holder is provided with a mark for identifying the direction, the polarization direction of each SMD LED lamp bead that is braided is consistent.
  • the first base film is an expansion film.
  • the expansion film is uniformly expanded by an expansion machine, so that the small pieces of polarizing film attached to the surface of the expansion film are evenly separated; this is more conducive to small Extraction of block polarizing film.
  • step 5 and step 6 use a dispenser to cover the polarizing film in each SMD LED lamp bead holder with a layer of second light-transmitting glue, and then perform baking or ultraviolet irradiation to make each The second transparent glue in the SMD LED lamp bead holder is cured.
  • the second light-transmitting glue not only transmits light, but also protects the polarizing film.
  • the material of the second translucent glue is epoxy resin, silica gel or UV glue; epoxy resin and silica gel are cured by baking, and UV glue is cured by ultraviolet radiation.
  • the temperature of the polarizing film exceeds a certain value, the "depolarization" will occur, that is, the polarization function will be lost. Therefore, the temperature and time during baking must be accurately controlled according to the characteristics of the polarizing film, and cannot exceed the temperature and resistance of the polarizing film. time;
  • step 5 use the placement machine to extract each small light-transmitting film in the light-transmitting film matrix one by one, and paste the polarizing film on each of the LED lamp bead holders On top, forming a light-transmitting film on the surface of the polarizing film;
  • the light-transmitting film matrix is made of a whole light-transmitting film with a second base film.
  • the whole light-transmitting film is pasted with the second base film through the adhesive on its lower surface.
  • the method of making the light-transmitting film matrix is : Put the entire light-transmitting film with the second base film into the cutting machine, and cut the entire light-transmitting film into small pieces of light-transmitting film neatly arranged in rows and columns according to the preset procedure to form a light-transmitting film matrix ,
  • the shape and size of each small light-transmitting film in the light-transmitting film matrix match the shape and size of the SMD LED lamp bead holder, the second base film is not cut, and the light-transmitting film matrix is pasted on the second base film On the upper surface.
  • the second base film that has too strong adhesion to the entire light-transmitting film should not be used to affect the extraction of small light-transmitting films.
  • the light-transmitting film not only transmits light, but also protects the polarizing film.
  • the transparent film is AGAR film.
  • step 1 When the LED light-emitting chip is a formal mounting chip, the specific method of step 1 is:
  • Step 1.1 Perform preparation work first, which includes crystal expansion, cleaning and baking, and temperature recovery;
  • the surface of the LED light-emitting chip film provided by the LED light-emitting chip manufacturer is densely arranged with thousands of LED light-emitting chips; LED light-emitting chips The distance between them is too small, it is very difficult to extract and use a single LED light-emitting chip.
  • the LED light-emitting chip film is uniformly expanded by a crystal expander, so that the tightly arranged LED light-emitting chip attached to the surface of the LED light-emitting chip film is evenly separated for easy extraction Use;
  • the crystal expander is also called the chip expander or the chip expander, which is widely used in the wafer expansion process in the production of light-emitting diodes, small and medium power transistors, backlights, integrated circuits and some special semiconductor devices. It uses LED light-emitting wafer film heating Plasticity, using dual cylinders to control up and down, spread a single LED light-emitting chip film evenly around, and automatically form after reaching a satisfactory chip gap, the diaphragm is tight and does not deform;
  • Cleaning and baking Use a plasma cleaning machine to perform plasma cleaning on the SMD LED lamp bead bracket matrix, and use the arc formed by hydrogen and oxygen inside the plasma cleaning machine to remove the residual organic matter on the surface of the SMD LED lamp bead bracket matrix , Improve the bonding force of the LED light-emitting chip, and then use the oven to bake the SMD LED lamp bead bracket matrix to remove the residual water vapor on the surface of the SMD LED lamp bead bracket matrix during the injection molding process;
  • Rewarming Take out the conductive glue or insulating glue stored in the refrigerator and put it in the air statically to return to room temperature;
  • the conductive glue is silver glue;
  • Step 1.2 Bonding also known as chip mounting, the LED light-emitting chip on the LED light-emitting chip film is fixed to each chip LED lamp bead in the chip LED lamp bead bracket matrix through conductive glue or insulating glue using a bonding machine At the designated position on the inner bottom surface of the bracket, a thermal or electrical path is formed to provide conditions for subsequent wire bonding;
  • Step 1.3 solid crystal baking: use an oven or oven to bake the semi-finished product formed in step 1.2, and dry the conductive glue or insulating glue to form a good bond between the LED light-emitting chip and the SMD LED lamp bead bracket;
  • Step 1.4 Use a wire bonding machine to weld wires (also called bonding or wire bonding) in each SMD LED lamp bead holder, and connect the electrodes of the N LED light-emitting chips to the conductive bottom surface of the SMD LED lamp bead holder. The areas are connected together to form an electrical path, and the wires are gold wires, alloy wires, copper wires or other metal wires;
  • step 1 N LED light-emitting chips are directly soldered on the inner bottom surface of the SMD LED lamp bead holder, and the electrodes of the N LED light-emitting chips and the SMD LED lamp bead holder The conductive areas on the inner bottom surface are welded together to form an electrical path;
  • step 3 the wire is also immersed in the first transparent glue
  • step 6 Before performing step 6, use an LED tester to check and test the function of the SMD LED lamp beads;
  • Step 6 is completed by die cutter or punch
  • step 8 vacuum packaging the braided SMD LED lamp beads with a vacuum packaging machine
  • the cutting machine is a laser cutting machine or a mechanical cutting machine
  • the material of the first light-transmitting glue is epoxy resin, silica gel or other light-transmitting filling medium, and the polarizing film is left-handed polarizing film, right-handed polarizing film or linear polarizing film;
  • N 1 ⁇ 3.
  • a method for mass production of the above-mentioned polarized patch LED lamp beads includes the following steps:
  • Step 21 Install N LED luminous chips on the inner bottom surface of each SMD LED lamp bead bracket in the SMD LED lamp bead bracket matrix, and make the electrodes of the N LED luminous chips and the inner bottom surface of the SMD LED lamp bead bracket
  • the conductive areas are connected together to form an electrical path, and N is a natural number greater than or equal to 1.
  • Each SMD LED lamp bead bracket in the SMD LED lamp bead bracket matrix is connected to each other, and each SMD LED lamp bead bracket All have signs to identify the direction;
  • Step 22 preheat the semi-finished product formed in step 21;
  • Step 23 Use the glue dispenser to fill the first light-transmitting glue into each SMD LED lamp bead holder, so that the N LED light-emitting chips are immersed in the first light-transmitting glue, and the surface of the first light-transmitting glue is level ;
  • Step 24 Use the placement machine to place each small piece of polarizing film in the braided polarizing film on the surface of the first light-transmitting glue in each LED lamp bead holder to form a polarizing film on the surface of the first light-transmitting glue ,
  • the surface height of the first light-transmitting glue makes the polarizing film located inside the SMD LED lamp bead holder;
  • the production method of the braided polarizing film is: put the whole polarizing film without adhesive on the front and back sides into the cutting machine, and cut the whole polarizing film into small pieces of the same size according to the preset procedure.
  • Polarizing film, the shape and size of each polarizing film small polarizing film can be square, rectangular, circular or polygonal, and the surface area of the polarizing film ranges from about 0.1 square millimeters to a dozen square millimeters
  • Matching with the shape and size of the SMD LED lamp bead bracket each small piece of polarizing film is cut with a direction mark for identifying the direction, and then all small pieces of polarizing film are braided with a braiding machine to form a braided polarizing film;
  • the direction mark can ensure that the polarization direction of all the polarizing films are the same when taping, so that the direction of the polarizing film attached to each SMD LED lamp bead holder is the same;
  • Step 25 Use a dispenser to cover the polarizing film in each SMD LED lamp bead with a layer of second light-transmitting glue, and then bake or irradiate it with ultraviolet rays to make the The second light-transmitting glue is cured; the second light-transmitting glue not only transmits light, but also plays a role in fixing and protecting the polarizing film;
  • the temperature of the polarizing film exceeds a certain value, the "depolarization" will occur, that is, the polarization function will be lost. Therefore, the temperature and time during baking must be accurately controlled according to the characteristics of the polarizing film, and cannot exceed the temperature and resistance of the polarizing film. time;
  • Step 26 Separate each SMD LED lamp bead bracket to form an independent SMD LED lamp bead
  • Step 27 Use a spectroscope to divide the SMD LED lamp beads into different types
  • the SMD LED lamp beads can be divided into multiple levels and models;
  • Step 28 Use a taping machine to tap different types of SMD LED lamp beads.
  • step 21 When the LED light-emitting chip is a formal mounting chip, the specific method of step 21 is:
  • Step 21.1 Perform preparation work first, which includes crystal expansion, cleaning and baking, and temperature recovery;
  • Crystal expansion Use a crystal expander to expand the LED light-emitting chip film uniformly, so that the tightly arranged LED light-emitting chips attached to the surface of the LED light-emitting chip film are evenly separated;
  • Cleaning and baking Use a plasma cleaning machine to clean the SMD LED lamp bead bracket matrix, remove the residual organic matter on the surface of the SMD LED lamp bead bracket matrix, and then use an oven to bake the SMD LED lamp bead bracket matrix Bake, remove the moisture on the surface of the SMD LED lamp bead bracket matrix;
  • Rewarming Take out the conductive glue or insulating glue stored in the refrigerator and put it in the air statically to return to room temperature;
  • the conductive glue is silver glue;
  • Step 21.2 Bonding Use a bonding machine to fix the LED light-emitting chip on the LED light-emitting chip film with conductive glue or insulating glue to the designated on the inner bottom surface of each chip LED lamp bead bracket in the chip LED lamp bead bracket matrix Location
  • Step 21.3 solid crystal baking: use an oven or oven to bake the semi-finished product formed in step 21.2, and dry the conductive glue or insulating glue to form a good bond between the LED light-emitting chip and the SMD LED lamp bead bracket;
  • Step 21.4 Use a wire bonding machine to weld wires in each SMD LED lamp bead holder, and connect the electrodes of the N LED light-emitting chips with the conductive area on the inner bottom surface of the SMD LED lamp bead holder to form an electrical path.
  • step 21 N LED light-emitting chips are directly soldered on the inner bottom surface of the SMD LED lamp bead holder, and the electrodes of the N LED light-emitting chips and the SMD LED lamp bead holder The conductive areas on the inner bottom surface are welded together to form an electrical path;
  • step 23 the wire is also immersed in the first transparent glue
  • step 24 the direction on the small piece of polarizing film is marked as a through hole or/and a gap
  • step 26 use the LED tester to perform functional inspection and test on the SMD LED lamp beads
  • Step 26 is completed by die cutter or punch
  • step 28 use a vacuum packaging machine to vacuum package the braided SMD LED lamp beads
  • the cutting machine is a laser cutting machine or a mechanical cutting machine
  • the material of the first light-transmitting glue is epoxy resin, silica gel or other light-transmitting filling medium, and the polarizing film is left-handed polarizing film, right-handed polarizing film or linear polarizing film;
  • the first light-transmitting glue does not need to be baked and can be cured naturally for a long time
  • the material of the second translucent glue is epoxy resin, silica gel, UV glue or other translucent filling media; epoxy resin and silica gel are cured by baking, and UV glue is cured by ultraviolet radiation;
  • N 1 ⁇ 3.
  • the patch LED lamp bead of the present invention is equipped with a polarizing film, which can emit polarized light when working.
  • a polarizing film which can emit polarized light when working.
  • SMD LED lamp beads in the present invention first fill the first light-transmitting glue in the SMD LED lamp bead holder, and then use the placement machine to sequentially extract the polarizing film matrix cut from a whole piece of polarizing film Each small piece of polarizing film is pasted on the surface of the first light-transmitting glue in each SMD LED lamp bead holder, or, using a placement machine, each small piece of polarizing film in the braided polarizing film is placed on each The surface of the first light-transmitting glue in the SMD LED lamp bead holder; therefore, the SMD LED lamp beads produced in the same batch of the present invention have the same polarization direction, and the same polarization direction can be pasted in the later tape
  • the pieces of LED lamp beads are braided together in the same position direction, which is convenient for welding the SMD LED lamp beads with the same polarization direction in the same row (column) or at intervals when making a three-dimensional LED display screen, which improves the three-dimensional
  • the batch production method of SMD LED lamp beads of the present invention adopts production line production, which has high production efficiency and good product quality.
  • Figure 1 is one of the structural schematic diagrams of a patch LED lamp bead emitting polarized light
  • Figure 2 is the second structural diagram of the patch LED lamp beads emitting polarized light
  • Figure 3 is the third structural diagram of the patch LED lamp beads emitting polarized light
  • Figure 4 is the fourth structural diagram of the patch LED lamp bead emitting polarized light
  • Figure 5 is the fifth structural diagram of the patch LED lamp beads emitting polarized light
  • Fig. 6 is a sixth structural diagram of a patch LED lamp bead emitting polarized light
  • Figure 7 is the seventh structural diagram of the patch LED lamp bead emitting polarized light
  • Figure 8 is the eighth structural diagram of the patch LED lamp bead emitting polarized light
  • Fig. 9 is a ninth structural diagram of a patch LED lamp bead emitting polarized light.
  • the polarized SMD LED lamp bead (TOP type) contains a SMD LED lamp bead holder 1 and an LED light-emitting chip 2.
  • the LED light-emitting chip 2 is set on the SMD LED lamp bead holder 1.
  • a layer of polarizing film 6 is horizontally arranged above the LED light-emitting chip 2, and the gap between the inner bottom surface of the SMD LED lamp bead holder 1 and the lower surface of the polarizing film 6 is filled with cured first light-transmitting glue 5 .
  • the LED light-emitting chip 2 is a formal mounting chip, and the LED light-emitting chip 2 is fixed on the inner bottom surface of the SMD LED lamp bead holder 1 by insulating glue 3. There are two connections between the LED light-emitting chip 2 and the inner bottom surface of the SMD LED lamp bead holder 1. Two wires 4 are located under the polarizing film 6; the wires 4 are gold wires; the two electrodes of the LED light-emitting chip 2 are connected to the inner bottom surface of the SMD LED lamp bead holder 1 through two wires 4 respectively.
  • the material of the first light-transmitting glue 5 is epoxy resin; the polarizing film 6 is a left-handed polarizing film; the polarizing film 6 is located outside the patch LED lamp bead holder 1.
  • the mass production method of the polarized SMD LED lamp beads includes the following steps:
  • Step 1 Install an LED light-emitting chip 2 on the inner bottom surface of each SMD LED lamp bead bracket 1 in the SMD LED lamp bead bracket matrix, and make the electrode of the LED light-emitting chip 2 and the SMD LED lamp bead bracket 1
  • the conductive areas on the bottom surface are connected together to form an electrical path; each SMD LED lamp bead bracket 1 in the SMD LED lamp bead bracket matrix is connected to each other, and each SMD LED lamp bead bracket 1 is provided with an identification Direction mark
  • Step 2 Preheat the semi-finished product formed in Step 1;
  • the preheating is done by an oven or an oven, so that the semi-finished product formed in step 1 is preheated to a suitable temperature, so that the first light-transmitting glue 5 and the SMD LED lamp bead holder 1 can be better combined, and air bubbles during the packaging process are avoided.
  • Step 3 Use a dispenser to fill each SMD LED lamp bead holder 1 with the first light-transmitting glue 5, so that the LED light-emitting chips 2 are immersed in the first light-transmitting glue 5, and make the first light-transmitting glue 5 Surface level;
  • Step 4 Bake the semi-finished product formed in step 3 to cure the first light-transmitting glue 5 filled in each SMD LED lamp bead holder 1;
  • Step 5 Use the placement machine to extract each small piece of polarizing film in the polarizing film matrix one by one, and paste it on the surface of the first light-transmitting glue 5 in each LED lamp bead holder 1 to form the first light-transmitting Polarizing film 6 on the glue surface;
  • the polarizing film matrix is made of a whole polarizing film with a first base film.
  • the whole polarizing film is pasted with the first base film through the adhesive on its lower surface.
  • the method of making the polarizing film matrix is: The entire polarizing film of the first base film is put into the cutting machine, and the entire polarizing film is cut into small pieces of polarizing film arranged in rows and columns according to the preset procedure to form a polarizing film matrix, each of the polarizing film matrixes
  • the shape and size of the small piece of polarizing film (the small piece of polarizing film is square, and the surface area of the small piece of polarizing film is 2 square millimeters) matches the shape and size of the SMD LED lamp bead holder 1.
  • the first bottom film is not cut, The polarizing film matrix is pasted on the upper surface of the first base film;
  • the first base film with too strong adhesion to the entire polarizing film should not be used to affect the extraction of small pieces of polarizing film;
  • Step 6 Separate each SMD LED lamp bead bracket 1 to form independent SMD LED lamp beads
  • Step 7 Use a spectrometer to divide the SMD LED lamp beads into different types
  • the SMD LED lamp beads can be divided into multiple levels and models;
  • Step 8 Use a taping machine to tap different types of SMD LED lamp beads.
  • the polarization direction of each patch LED lamp bead out of the braid is the same.
  • the first base film is an expansion film.
  • the expansion film is uniformly expanded by an expansion machine, so that the small pieces of polarizing film attached to the surface of the expansion film are evenly separated; this is more conducive to small Extraction of block polarizing film.
  • step 1 The specific method of step 1 is:
  • Step 1.1 Perform preparation work first, which includes crystal expansion, cleaning and baking, and temperature recovery;
  • the LED light-emitting chip film is uniformly expanded by a crystal expander to make the LED light-emitting chip 2 closely arranged on the surface of the LED light-emitting chip film. Evenly separated for easy extraction and use;
  • Cleaning and baking Use a plasma cleaning machine to perform plasma cleaning on the SMD LED lamp bead bracket matrix, and use the arc formed by hydrogen and oxygen inside the plasma cleaning machine to remove the residual organic matter on the surface of the SMD LED lamp bead bracket matrix , To improve the bonding force of the LED light-emitting chip 2, and then use an oven to bake the SMD LED lamp bead bracket matrix to remove the residual water vapor on the surface of the SMD LED lamp bead bracket matrix during the injection molding process;
  • Rewarming Take out the insulating glue 3 stored in the refrigerator and put it in the air statically to return to room temperature;
  • Step 1.2 Bonding also known as chip mounting, the LED light-emitting chip 2 on the LED light-emitting chip film is fixed to each chip LED lamp bead bracket in the chip LED lamp bead bracket matrix through the insulating glue 3 using a bonding machine 1 At the designated position on the inner bottom surface, a thermal path or an electrical path is formed to provide conditions for the subsequent wire bonding;
  • Step 1.3 solid crystal baking: use an oven or oven to bake the semi-finished product formed in step 1.2, and dry the insulating glue 3 to form a good bond between the LED light-emitting chip 2 and the SMD LED lamp bead holder 1;
  • Step 1.4 Use a wire bonding machine to weld wires 4 (also called bonding or wire bonding) in each SMD LED lamp bead holder 1, and connect the electrodes of the LED light-emitting chip 2 to the inner bottom surface of the SMD LED lamp bead holder 1.
  • the conductive areas are connected together to form an electrical path, and the wire 4 is a gold wire;
  • step 3 the wire 4 is also immersed in the first transparent glue 5;
  • step 6 Before performing step 6, use an LED tester to check and test the function of the SMD LED lamp beads;
  • Step 6 is completed by die cutter
  • step 8 vacuum packaging the braided SMD LED lamp beads with a vacuum packaging machine
  • the cutting machine is a laser cutting machine
  • the material of the first transparent glue 5 is epoxy resin, and the polarizing film 6 is a left-handed polarizing film.
  • a layer of cured second light-transmitting glue 7 is provided on the upper surface of the polarizing film 6.
  • the material of the second translucent glue 7 is epoxy resin, and the polarizing film 6 is located inside the chip LED lamp bead holder 1.
  • the mass production method of the polarized SMD LED lamp beads includes the following steps:
  • Step 21 Install an LED light emitting chip 2 on the inner bottom surface of each of the SMD LED lamp bead bracket 1 in the SMD LED lamp bead bracket matrix, and make the electrode of the LED light emitting chip 2 and the SMD LED lamp bead bracket 1
  • the conductive areas on the inner bottom surface are connected together to form an electrical path; each SMD LED lamp bead bracket 1 in the SMD LED lamp bead bracket matrix is connected to each other, and each SMD LED lamp bead bracket 1 is provided with Marks to identify the direction;
  • Step 22 preheat the semi-finished product formed in step 21;
  • Step 23 Use a dispenser to fill each SMD LED lamp bead holder 1 with the first light-transmitting glue 5, so that the LED light-emitting chip 2 is immersed in the first light-transmitting glue 5, and the first light-transmitting glue 5 Surface level
  • Step 24 Use the placement machine to place each small piece of polarizing film in the braided polarizing film on the surface of the first light-transmitting glue 5 in each of the LED lamp bead holders 1 to form the surface of the first light-transmitting glue.
  • the polarizing film 6, the surface height of the first light-transmitting glue 5 is such that the polarizing film 6 is located inside the chip LED lamp bead holder 1;
  • the production method of the braided polarizing film is: put the whole polarizing film without adhesive on the front and back sides into the cutting machine, and cut the whole polarizing film into small pieces of the same size according to the preset procedure.
  • the shape and size of each small piece of polarization film (the small piece of polarization film is square, and the surface area of the small piece of polarization film is 2 square millimeters) matches the shape and size of the SMD LED lamp bead holder 1.
  • Each piece of polarizing film is cut with a direction mark for identifying the direction, and then all small pieces of polarizing film are braided with a braiding machine to form a braided polarizing film; the direction mark can ensure the polarization direction of all polarizing films 6 when braiding They are all the same, so that the direction of the polarizing film 6 attached to each SMD LED lamp bead holder 1 is the same;
  • Step 25 Use a glue dispenser to cover the polarizing film 6 in each SMD LED lamp bead holder 1 with a layer of second light-transmitting glue 7, and then bake it to make each SMD LED lamp bead holder 1
  • the second light-transmitting glue 7 is cured; the second light-transmitting glue 7 not only transmits light, but also functions to fix and protect the polarizing film 6;
  • Step 26 Separate each SMD LED lamp bead bracket to form an independent SMD LED lamp bead
  • Step 27 Use a spectroscope to divide the SMD LED lamp beads into different types
  • the SMD LED lamp beads can be divided into multiple levels and models;
  • Step 28 Use a taping machine to tap different types of SMD LED lamp beads.
  • step 21 The specific method of step 21 is:
  • Step 21.1 Perform preparation work first, which includes crystal expansion, cleaning and baking, and temperature recovery;
  • Crystal expansion the LED light-emitting chip film is uniformly expanded by a crystal expansion machine to uniformly separate the LED light-emitting chips 2 attached to the surface of the LED light-emitting chip film;
  • Cleaning and baking Use a plasma cleaning machine to clean the SMD LED lamp bead bracket matrix, remove the residual organic matter on the surface of the SMD LED lamp bead bracket matrix, and then use an oven to bake the SMD LED lamp bead bracket matrix Bake, remove the moisture on the surface of the SMD LED lamp bead bracket matrix;
  • Re-warming Take out the insulating 3 glue stored in the refrigerator and put it in the air statically to return to room temperature;
  • Step 21.2 Bonding Use a bonding machine to fix the LED light-emitting chip 2 on the LED light-emitting chip film with insulating glue 3 to the designated on the inner bottom surface of each chip LED lamp bead bracket 1 in the chip LED lamp bead bracket matrix Location
  • Step 21.3 solid crystal baking: use an oven or oven to bake the semi-finished product formed in step 21.2, and bake the insulating glue 3 to make a good bond between the LED light-emitting chip 2 and the SMD LED lamp bead holder 1;
  • Step 21.4 Use a wire bonding machine to weld wires 4 in each SMD LED lamp bead holder 1, and connect the electrodes of the LED light-emitting chip 2 with the conductive area on the inner bottom surface of the SMD LED lamp holder 1 to form an electrical path , Wire 4 adopts gold wire;
  • step 23 the wire 4 is also immersed in the first transparent glue 5;
  • step 24 the direction on the small piece of polarizing film is marked as a gap
  • step 26 use the LED tester to perform functional inspection and test on the SMD LED lamp beads
  • Step 26 is completed by die cutter
  • step 28 use a vacuum packaging machine to vacuum package the braided SMD LED lamp beads
  • the cutting machine is a laser cutting machine
  • the material of the first light-transmitting glue 5 is epoxy resin, and the polarizing film 6 is a left-handed polarizing film;
  • the first light-transmitting glue 5 does not need to be baked and can be cured naturally for a long time;
  • the material of the second transparent glue 7 is epoxy resin.
  • a transparent film 9 is provided on the upper surface of the polarizing film 6.
  • the light-transmitting film 9 is an AGAR film.
  • step 5 use the placement machine to extract each small transparent film matrix one by one
  • the light film is pasted on the polarizing film 6 on each SMD LED lamp bead holder 1 to form a light-transmitting film 9 on the surface of the polarizing film 6;
  • the light-transmitting film matrix is made of a whole light-transmitting film with a second base film.
  • the whole light-transmitting film is pasted with the second base film through the adhesive on its lower surface.
  • the method of making the light-transmitting film matrix is : Put the entire light-transmitting film with the second base film into the cutting machine, and cut the entire light-transmitting film into small pieces of light-transmitting film neatly arranged in rows and columns according to the preset procedure to form a light-transmitting film matrix ,
  • the shape and size of each small light-transmitting film in the light-transmitting film matrix match the shape and size of the SMD LED lamp bead holder 1.
  • the second base film is not cut, and the light-transmitting film matrix is pasted on the second base On the upper surface of the membrane.
  • the second base film that has too strong adhesion to the entire light-transmitting film should not be used to affect the extraction of small light-transmitting films.
  • the light-transmitting film 9 not only transmits light, but also functions to protect the polarizing film 6.
  • the polarized SMD LED lamp bead contains SMD LED lamp bead holder 1 and 3 LED light-emitting chips 2 (respectively emit red, green and blue light), 3
  • the LED light-emitting chip 2 is arranged on the inner bottom surface of the SMD LED lamp bead holder 1, and a layer of polarizing film 6 is horizontally arranged above the three LED light-emitting chips 2.
  • the inner bottom surface of the SMD LED lamp bead holder 1 and the polarizing film 6 The space between the lower surfaces is filled with the cured first light-transmitting glue 5.
  • the LED light-emitting chip 2 is a formal mounting chip, and the three LED light-emitting chips 2 are fixed on the inner bottom surface of the SMD LED lamp bead holder 1 through conductive glue 12.
  • One of the three LED light-emitting chips 2 and the inner bottom surface of the SMD LED lamp bead holder 1 There are 3 wires 4 connected between them, the common electrodes of the 3 LED light-emitting chips 2 are connected to the inner bottom surface of the SMD LED lamp bead holder 1 through conductive glue 12, and the other electrode of the 3 LED light-emitting chips 2 is connected to The inner bottom surface of the SMD LED lamp bead holder 1 is connected, and the three wires 4 are located under the polarizing film 6; the conductive glue 12 is silver glue; the wire 4 is an alloy wire;
  • the material of the first light-transmitting glue 5 is silica gel; the polarizing film 6 is a right-handed polarizing film; the polarizing film 6 is located inside the SMD LED lamp bead holder 1.
  • the mass production method of the polarized SMD LED lamp beads includes the following steps:
  • Step 1 Install 3 LED light-emitting chips 2 on the inner bottom surface of each chip LED light bead bracket 1 in the chip LED lamp bead bracket matrix, and make the electrodes of the 3 LED light-emitting chips 2 and the chip LED lamp bead bracket 1
  • the conductive areas on the inner bottom surface are connected together to form an electrical path; each SMD LED lamp bead bracket 1 in the SMD LED lamp bead bracket matrix is connected to each other, and each SMD LED lamp bead bracket 1 is provided There is a mark to identify the direction;
  • Step 2 Preheat the semi-finished product formed in Step 1;
  • the preheating is done by an oven or an oven, so that the semi-finished product formed in step 1 is preheated to a suitable temperature, so that the first light-transmitting glue 5 and the SMD LED lamp bead holder 1 can be better combined, and air bubbles during the packaging process are avoided.
  • Step 3 Use a dispenser to fill each SMD LED lamp bead holder 1 with the first light-transmitting glue 5, so that all 3 LED light-emitting chips 2 are immersed in the first light-transmitting glue 5, and make the first light-transmitting The surface level of glue 5;
  • Step 4 Bake the semi-finished product formed in step 3 to cure the first light-transmitting glue 5 filled in each SMD LED lamp bead holder 1;
  • Step 5 Use the placement machine to extract each small piece of polarizing film in the polarizing film matrix one by one, and paste it on the surface of the first light-transmitting glue 5 in each LED lamp bead holder 1 to form the first light-transmitting Polarizing film 6 on the surface of glue 5;
  • the polarizing film matrix is made of a whole polarizing film with a first base film.
  • the whole polarizing film is pasted with the first base film through the adhesive on its lower surface.
  • the method of making the polarizing film matrix is: The entire polarizing film of the first base film is put into the cutting machine, and the entire polarizing film is cut into small pieces of polarizing film arranged in rows and columns according to the preset procedure to form a polarizing film matrix, each of the polarizing film matrixes
  • the shape and size of the small piece of polarizing film (the small piece of polarizing film is rectangular, and the surface area of the small piece of polarizing film is 3 square millimeters) matches the shape and size of the SMD LED lamp bead holder 1.
  • the first bottom film is not cut, The polarizing film matrix is pasted on the upper surface of the first base film;
  • the first base film with too strong adhesion to the entire polarizing film should not be used to affect the extraction of small pieces of polarizing film;
  • Step 6 Separate each SMD LED lamp bead bracket to form an independent SMD LED lamp bead
  • Step 7 Use a spectrometer to divide the SMD LED lamp beads into different types
  • the SMD LED lamp beads can be divided into multiple levels and models;
  • Step 8 Use a taping machine to tap different types of SMD LED lamp beads.
  • the polarization direction of each patch LED lamp bead out of the braid is the same.
  • the first base film is an expansion film.
  • the expansion film is uniformly expanded by an expansion machine, so that the small pieces of polarizing film attached to the surface of the expansion film are evenly separated; this is more conducive to small Extraction of block polarizing film.
  • step 1 The specific method of step 1 is:
  • Step 1.1 Perform preparation work first, which includes crystal expansion, cleaning and baking, and temperature recovery;
  • the LED light-emitting chip film is uniformly expanded by a crystal expander to make the LED light-emitting chip 2 closely arranged on the surface of the LED light-emitting chip film. Evenly separated for easy extraction and use;
  • Cleaning and baking Use a plasma cleaning machine to perform plasma cleaning on the SMD LED lamp bead bracket matrix, and use the arc formed by hydrogen and oxygen inside the plasma cleaning machine to remove the residual organic matter on the surface of the SMD LED lamp bead bracket matrix , To improve the adhesion of the LED light-emitting chip 2, and then use an oven to bake the SMD LED lamp bead bracket matrix to remove the residual water vapor on the surface of the SMD LED lamp bead bracket matrix during the injection molding process;
  • Rewarming Take out the conductive adhesive 12 stored in the refrigerator and put it in the air statically to return to room temperature; the conductive adhesive 12 is silver glue;
  • Step 1.2 Bonding also known as chip mounting, using a bonding machine to fix the 3 LED light-emitting chips 2 on the LED light-emitting chip film with conductive glue 12 to each chip LED lamp in the chip LED lamp bead bracket matrix
  • the designated position on the inner bottom surface of the bead holder 1 forms a thermal path or an electrical path to provide conditions for the subsequent wire bonding;
  • Step 1.3 solid crystal baking: use an oven or oven to bake the semi-finished product formed in step 1.2, and dry the conductive adhesive 12 to form a good bond between the LED light-emitting chip 2 and the SMD LED lamp bead holder 1;
  • Step 1.4 Use a wire bonding machine to weld wires 4 (also called bonding or wire bonding) in each SMD LED lamp bead holder 1, and connect the electrodes of the 3 LED light-emitting chips 2 to the SMD LED lamp bead holder 1.
  • the conductive areas on the bottom surface are connected together to form an electrical path, and the wire is made of alloy wire;
  • step 3 the wire 4 is also immersed in the first transparent glue 5;
  • step 6 Before performing step 6, use an LED tester to check and test the function of the SMD LED lamp beads;
  • Step 6 is completed by punching
  • step 8 vacuum packaging the braided SMD LED lamp beads with a vacuum packaging machine
  • the cutting machine is a mechanical cutting machine
  • the material of the first light-transmitting glue 5 is silica gel, and the polarizing film is a right-handed polarizing film.
  • a layer of cured second light-transmitting glue 7 is provided on the upper surface of the polarizing film 6.
  • the material of the second transparent glue 7 is UV glue.
  • the mass production method of the polarized SMD LED lamp beads includes the following steps:
  • Step 21 Install 3 LED light-emitting chips 2 on the inner bottom surface of each SMD LED lamp bead bracket 1 in the SMD LED lamp bead bracket matrix (respectively emit red, green and blue light), and make 3 LEDs
  • the electrodes of the light-emitting chip 2 are connected to the conductive area on the inner bottom surface of the SMD LED lamp bead holder 1 to form an electrical path; the SMD LED lamp bead holders 1 in the SMD LED lamp bead holder matrix are connected to each other, and Each SMD LED lamp bead holder 1 is provided with a mark to identify the direction;
  • Step 22 preheat the semi-finished product formed in step 21;
  • Step 23 Use a dispenser to fill each SMD LED lamp bead holder 1 with the first light-transmitting glue 5, so that the three LED light-emitting chips 2 are immersed in the first light-transmitting glue 5, and make the first light-transmitting The surface level of glue 5;
  • Step 24 Use the placement machine to place each small piece of polarizing film in the braided polarizing film on the surface of the first light-transmitting glue 5 in each LED lamp bead holder 1 to form the surface of the first light-transmitting glue 5
  • the polarizing film 6 of the first light-transmitting glue 5 has a surface height such that the polarizing film 6 is located inside the SMD LED lamp bead holder 1;
  • the production method of the braided polarizing film is: put the whole polarizing film without adhesive on the front and back sides into the cutting machine, and cut the whole polarizing film into small pieces of the same size according to the preset procedure.
  • the shape and size of each small piece of polarization film (the small piece of polarization film is rectangular, and the surface area of the small piece of polarization film is 3 square millimeters) matches the shape and size of the SMD LED lamp bead holder 1.
  • Each piece of polarizing film is cut with a direction mark for identifying the direction, and then all small pieces of polarizing film are braided with a braiding machine to form a braided polarizing film; the direction mark can ensure the polarization direction of all polarizing films 6 when braiding They are all the same, so that the direction of the polarizing film 6 attached to each SMD LED lamp bead holder 1 is the same;
  • Step 25 Use a dispenser to cover the polarizing film 6 in each SMD LED lamp bead holder 1 with a layer of second light-transmitting glue 7, and then irradiate it with ultraviolet rays to make each SMD LED lamp bead holder 1
  • the second light-transmitting glue 7 is cured; the second light-transmitting glue 7 not only transmits light, but also functions to fix and protect the polarizing film 6;
  • Step 26 Separate each SMD LED lamp bead bracket to form an independent SMD LED lamp bead
  • Step 27 Use a spectroscope to divide the SMD LED lamp beads into different types
  • the SMD LED lamp beads can be divided into multiple levels and models;
  • Step 28 Use a taping machine to tap different types of SMD LED lamp beads.
  • step 21 The specific method of step 21 is:
  • Step 21.1 Perform preparation work first, which includes crystal expansion, cleaning and baking, and temperature recovery;
  • Crystal expansion the LED light-emitting chip film is uniformly expanded by a crystal expansion machine to uniformly separate the LED light-emitting chips 2 attached to the surface of the LED light-emitting chip film;
  • Cleaning and baking Use a plasma cleaning machine to clean the SMD LED lamp bead bracket matrix, remove the residual organic matter on the surface of the SMD LED lamp bead bracket matrix, and then use an oven to bake the SMD LED lamp bead bracket matrix Bake, remove the moisture on the surface of the SMD LED lamp bead bracket matrix;
  • Rewarming Take out the conductive adhesive 12 stored in the refrigerator and put it in the air statically to return to room temperature; the conductive adhesive 12 is silver glue;
  • Step 21.2 Bonding Use a bonding machine to fix the LED light-emitting chip 2 on the LED light-emitting chip film with conductive glue 12 to the designated on the inner bottom surface of each chip LED lamp bead bracket 1 in the SMD LED lamp bead bracket matrix Location
  • Step 21.3 solid crystal baking: use an oven or oven to bake the semi-finished product formed in step 21.2, and dry the conductive glue 12 to form a good bond between the LED light-emitting chip 2 and the SMD LED lamp bead holder 1;
  • Step 21.4 Use a wire bonding machine to weld wires 4 in each SMD LED lamp bead holder 1, and connect the electrodes of the three LED light-emitting chips 2 to the conductive area on the inner bottom surface of the SMD LED lamp holder 1 to form
  • the wire 4 adopts alloy wire
  • step 23 the wire 4 is also immersed in the first transparent glue 5;
  • step 24 the direction on the small piece of polarizing film is marked as a through hole
  • step 26 use an LED tester to perform functional inspection and test on the SMD LED lamp beads
  • Step 26 is completed by punching
  • step 28 use a vacuum packaging machine to vacuum package the braided SMD LED lamp beads
  • the cutting machine is a mechanical cutting machine
  • the material of the first light-transmitting glue 5 is silica gel, and the polarizing film 6 is a right-handed polarizing film;
  • the first light-transmitting glue 5 does not need to be baked and can be cured naturally for a long time;
  • the material of the second transparent glue 7 is UV glue.
  • Embodiment 6 is a diagrammatic representation of Embodiment 6
  • a transparent film 9 is provided on the upper surface of the polarizing film 6.
  • the light-transmitting film 9 is an AGAR film.
  • step 5 use the placement machine to extract each small transparent film matrix one by one
  • the light film is pasted on the polarizing film 6 on each SMD LED lamp bead holder 1 to form a light-transmitting film 9 on the surface of the polarizing film 6;
  • the light-transmitting film matrix is made of a whole light-transmitting film with a second base film.
  • the whole light-transmitting film is pasted with the second base film through the adhesive on its lower surface.
  • the method of making the light-transmitting film matrix is : Put the entire light-transmitting film with the second base film into the cutting machine, and cut the entire light-transmitting film into small pieces of light-transmitting film neatly arranged in rows and columns according to the preset procedure to form a light-transmitting film matrix ,
  • the shape and size of each small light-transmitting film in the light-transmitting film matrix match the shape and size of the SMD LED lamp bead holder 1.
  • the second base film is not cut, and the light-transmitting film matrix is pasted on the second base On the upper surface of the membrane.
  • the second base film that has too strong adhesion to the entire light-transmitting film should not be used to affect the extraction of small light-transmitting films.
  • the light-transmitting film 9 not only transmits light, but also functions to protect the polarizing film 6.
  • the polarized SMD LED lamp beads (TOP type) contain SMD LED lamp bead holder 1 and 3 LED light-emitting chips 2, and 3 LED light-emitting chips 2 are set in the SMD LED lamp bead holder
  • a layer of polarizing film 6 is horizontally arranged above the three LED light-emitting chips 2.
  • the gap between the inner bottom surface of the SMD LED lamp bead holder 1 and the lower surface of the polarizing film 6 is filled with cured first Transparent glue 5.
  • the LED light-emitting chip 2 is a flip chip, and three LED light-emitting chips 2 are welded on the inner bottom of the SMD LED lamp bead holder 1.
  • the material of the first light-transmitting glue 5 is silica gel; the polarizing film 6 is a linear polarizing film; the polarizing film 6 is located inside the chip LED lamp bead holder 1.
  • the mass production method of the polarized SMD LED lamp beads includes the following steps:
  • Step 1 Install 3 LED light-emitting chips 2 on the inner bottom surface of each chip LED light bead bracket 1 in the chip LED lamp bead bracket matrix, and make the electrodes of the 3 LED light-emitting chips 2 and the chip LED lamp bead bracket 1
  • the conductive areas on the inner bottom surface are connected together to form an electrical path; each SMD LED lamp bead bracket 1 in the SMD LED lamp bead bracket matrix is connected to each other, and each SMD LED lamp bead bracket 1 is provided There is a mark to identify the direction;
  • Step 2 Preheat the semi-finished product formed in Step 1;
  • the preheating is done by an oven or an oven, so that the semi-finished product formed in step 1 is preheated to an appropriate temperature, so that the first light-transmitting glue 5 and the SMD LED lamp bead support 1 can be better combined, and air bubbles are avoided during the packaging process Other impurities
  • Step 3 Use a dispenser to fill each SMD LED lamp bead holder 1 with the first light-transmitting glue 5, so that all 3 LED light-emitting chips 2 are immersed in the first light-transmitting glue 5, and make the first light-transmitting The surface level of glue 5;
  • Step 4 Bake the semi-finished product formed in step 3 to cure the first light-transmitting glue 5 filled in each SMD LED lamp bead holder 1;
  • Step 5 Use the placement machine to extract each small piece of polarizing film in the polarizing film matrix one by one, and paste it on the surface of the first light-transmitting glue 5 in each LED lamp bead holder 1 to form the first light-transmitting Polarizing film 6 on the surface of glue 5;
  • the polarizing film matrix is made of a whole polarizing film with a first base film.
  • the whole polarizing film is pasted with the first base film through the adhesive on its lower surface.
  • the method of making the polarizing film matrix is: The entire polarizing film of the first base film is put into the cutting machine, and the entire polarizing film is cut into small pieces of polarizing film arranged in rows and columns according to the preset procedure to form a polarizing film matrix, each of the polarizing film matrixes
  • the shape and size of the small piece of polarizing film (the small piece of polarizing film is round, and the surface area of the small piece of polarizing film is 4 square millimeters) matches the shape and size of the SMD LED lamp bead holder 1, and the first base film is not cut ,
  • the polarizing film matrix is pasted on the upper surface of the first base film;
  • the first base film with too strong adhesion to the entire polarizing film should not be used to affect the extraction of small pieces of polarizing film;
  • Step 6 Separate each SMD LED lamp bead bracket to form an independent SMD LED lamp bead
  • Step 7 Use a spectrometer to divide the SMD LED lamp beads into different types
  • the SMD LED lamp beads can be divided into multiple levels and models;
  • Step 8 Use a taping machine to tap different types of SMD LED lamp beads.
  • the polarization direction of each patch LED lamp bead out of the braid is the same.
  • step 1 3 LED light-emitting chips 2 are directly welded on the inner bottom surface of the SMD LED lamp bead holder 1, and the electrodes of the three LED light-emitting chips 2 are connected to the conductive area on the inner bottom surface of the SMD LED lamp bead holder 1. Solder together to form an electrical path;
  • step 6 Before performing step 6, use an LED tester to check and test the function of the SMD LED lamp beads;
  • Step 6 is completed by die cutter
  • step 8 vacuum packaging the braided SMD LED lamp beads with a vacuum packaging machine
  • the cutting machine is a mechanical cutting machine
  • the material of the first transparent adhesive 5 is silica gel, and the polarizing film 6 is a linear polarizing film.
  • Embodiment 8 is a diagrammatic representation of Embodiment 8
  • a layer of cured second light-transmitting glue 7 is provided on the upper surface of the polarizing film 6.
  • the material of the second transparent glue 7 is silica gel.
  • step 5 Use a dispenser to apply the polarizing film in each SMD LED lamp bead holder 1 6 is covered with a layer of second light-transmitting glue 7 and then baked to cure the second light-transmitting glue 7 in each SMD LED lamp bead holder 1.
  • the second light-transmitting glue 7 not only transmits light, but also functions to protect the polarizing film 6.
  • the temperature of the polarizing film 6 exceeds a certain value, “depolarization” will occur, that is, the polarization function will be lost. Therefore, the temperature and time during baking must be accurately controlled according to the characteristics of the polarizing film 6, and the resistance of the polarizing film 6 should not exceed Subject to temperature and time.
  • a transparent film 9 is provided on the upper surface of the polarizing film 6.
  • the light-transmitting film 9 is an AGAR film.
  • step 5 use the placement machine to extract each small transparent film matrix one by one
  • the light film is pasted on the polarizing film 6 on each SMD LED lamp bead holder 1 to form a light-transmitting film 9 on the surface of the polarizing film 6;
  • the light-transmitting film matrix is made of a whole light-transmitting film with a second base film.
  • the whole light-transmitting film is pasted with the second base film through the adhesive on its lower surface.
  • the method of making the light-transmitting film matrix is : Put the entire light-transmitting film with the second base film into the cutting machine, and cut the entire light-transmitting film into small pieces of light-transmitting film neatly arranged in rows and columns according to the preset procedure to form a light-transmitting film matrix ,
  • the shape and size of each small light-transmitting film in the light-transmitting film matrix match the shape and size of the SMD LED lamp bead holder 1.
  • the second base film is not cut, and the light-transmitting film matrix is pasted on the second base On the upper surface of the membrane.
  • the second base film that has too strong adhesion to the entire light-transmitting film should not be used to affect the extraction of small light-transmitting films.
  • the light-transmitting film 9 not only transmits light, but also functions to protect the polarizing film 6.

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Abstract

本发明涉及一种发出偏振光的贴片LED灯珠及其批量制作方法；LED灯珠含有贴片LED灯珠支架和其内底面上的N个LED发光晶片，LED发光晶片的上方设有一层偏振膜，支架的内底面和偏振膜的下表面之间充满第一透光胶；LED灯珠的批量制作方法如下： 1﹑在贴片LED灯珠支架矩阵中的每个支架内底面上安装N个LED发光晶片； 2﹑向每个支架内填充第一透光胶，并烘烤； 3﹑提取偏振膜矩阵中的小块偏振膜，粘贴在每个支架内的第一透光胶上； 4﹑将各支架分离，形成独立的灯珠； 5﹑将灯珠分光﹑编带；本发明的LED灯珠可发出偏振光，减少了立体LED显示屏的制作工序，批量制作方法可将相同偏振方向的灯珠按相同的位置方向编带在一起，方便立体LED显示屏的制作。

Description

发出偏振光的贴片LED灯珠及其批量制作方法 (一)、技术领域：
本发明涉及一种LED灯珠及其制作方法，特别涉及一种发出偏振光的贴片LED灯珠及其批量制作方法。
(二)、背景技术：
目前，LED显示屏已广泛应用于人们工作和生活的各个方面，给人们带来了丰富多彩的视觉享受，其中，立体LED显示屏的表现尤为突出，立体LED显示屏能给人们带来身临其境的感受，特别适用于播放各种自然景观﹑科幻等方面的视频。现有立体LED显示屏显示立体图像的方式有多种，其中一种偏振型立体LED显示屏是将LED显示屏的显示点阵分成若干行(列)，其中，所有奇数行(列)用来显示立体图像中的一幅图像，所有偶数行(列)用来显示立体图像中的另一幅图像，所有奇数行(列)LED的表面贴同一种偏振方向的偏振膜，所有偶数行(列)LED的表面贴与奇数行(列)相反偏振方向的偏振膜；还有一种立体LED显示屏的显示点阵的偏振方向是奇偶阵格式的，或者叫棋盘格，即第一行“左偏﹑右偏﹑左偏﹑右偏﹑….”，第二行“右偏﹑左偏﹑右偏﹑左偏﹑…”,如此循环往复，对该种立体LED显示屏，需要在显示点阵上间隔贴不同偏振方向的偏振膜；上述两种立体LED显示屏工作时可同时显示两种不同偏振方向的图像，观看者带上相应的立体眼镜就可看到逼真的立体图像了。实际制作立体LED显示屏时，要在显示屏表面逐行(列)或逐个粘贴偏振膜，而且还要保证不能弄错偏振膜的偏振方向，工作量非常大，生产效率很低(尤其是对于棋盘格型的立体LED显示屏，几乎不可实现)，且产品的良品率低，质量难以保证。
(三)、发明内容：
本发明要解决的技术问题是：提供了一种发出偏振光的贴片LED灯珠及其批量制作方法，该贴片LED灯珠可发出偏振光，减少了立体LED显示屏的制作工序，贴片LED灯珠的批量制作方法可将相同偏振方向的贴片LED灯珠按相同的位置方向编带在一起，方便立体LED显示屏制作时将相同偏振方向 的贴片LED灯珠焊接在同一行(列)中或间隔焊接，提高了立体LED显示屏的生产效率。
本发明的技术方案：
一种发出偏振光的贴片LED灯珠(TOP型)，含有贴片LED灯珠支架和N个LED发光晶片，N为大于等于1的自然数，N个LED发光晶片设在贴片LED灯珠支架的内底面上，在N个LED发光晶片的上方水平设有一层偏振膜，贴片LED灯珠支架的内底面和偏振膜的下表面之间的空隙处充满固化的第一透光胶。
偏振膜的上表面上设有一层固化的第二透光胶或透光膜。
第二透光胶的材质为环氧树脂﹑硅胶﹑UV胶或其它透光填充介质；透光膜为AGAR膜。
当LED发光晶片为正装晶片时，N个LED发光晶片通过导电胶或绝缘胶固定在贴片LED灯珠支架的内底面上，N个LED发光晶片和贴片LED灯珠支架的内底面之间连接有导线，导线位于偏振膜的下方；导电胶为银胶；导线为金线、合金线、铜线或其它金属线；
当LED发光晶片为倒装晶片时，N个LED发光晶片焊接在贴片LED灯珠支架的内底上。
N为1～3；第一透光胶的材质为环氧树脂、硅胶或其它透光填充介质；偏振膜为左旋偏振膜﹑右旋偏振膜或线偏振膜；偏振膜位于贴片LED灯珠支架内部或外部。
一种上述发出偏振光的贴片LED灯珠(TOP型)的批量制作方法，含有下列步骤：
步骤1﹑在贴片LED灯珠支架矩阵中的每个贴片LED灯珠支架内底面上安装N个LED发光晶片，并使N个LED发光晶片的电极与贴片LED灯珠支架内底面上的导电区域连接在一起，形成电通路，N为大于等于1的自然数；贴片LED灯珠支架矩阵中的各贴片LED灯珠支架相互连接在一起，且每个贴片LED灯珠支架上都设有识别方向的标记；
步骤2﹑对步骤1形成的半成品进行预热；
预热通过烤箱或烘箱来完成，以使步骤1形成的半成品预先加热到适宜的温度，便于第一透光胶与贴片LED灯珠支架更好地结合，避免封装过程中产生气泡等杂质；
步骤3﹑使用点胶机向每个贴片LED灯珠支架内填充第一透光胶，使N个LED发光晶片都浸没在第一透光胶中，并使第一透光胶的表面水平；
步骤4﹑对步骤3形成的半成品进行烘烤，使每个贴片LED灯珠支架内填充的第一透光胶固化；
步骤5﹑使用贴片机一一提取偏振膜矩阵中的每个小块偏振膜，并粘贴在每个贴片LED灯珠支架内的第一透光胶的表面，形成第一透光胶表面的偏振膜；
偏振膜矩阵采用带有第一底膜的整张偏振膜制作而成，整张偏振膜通过其下表面的粘胶与第一底膜粘贴在一起，偏振膜矩阵的制作方法为：将带有第一底膜的整张偏振膜放入裁切机中，按照预先设定的程序将整张偏振膜裁成行列整齐排列的小块偏振膜，形成偏振膜矩阵，偏振膜矩阵中的每个小块偏振膜的形状和尺寸(小块偏振膜可以是正方形﹑长方形、圆形或多边形，小块偏振膜的表面积从0.1平方毫米左右到十几个平方毫米不等)与贴片LED灯珠支架的形状和尺寸匹配，第一底膜没有被裁切，偏振膜矩阵粘贴在第一底膜的上表面上；
选用带有第一底膜的整张偏振膜时，不应选用与整张偏振膜之间的粘贴力太强的第一底膜，以影响小块偏振膜的提取；
裁切整张偏振膜时，控制裁切机的裁切深度，使其不裁到第一底膜，保持第一底膜的完整；
步骤6﹑将各贴片LED灯珠支架分离，形成一个个独立的贴片LED灯珠；
步骤7﹑采用分光机将贴片LED灯珠分成不同类型；
通过在分光机上设置各类不同的参数(亮度、电压、色温、光通量等)，可以将贴片LED灯珠分成多个等级和型号；
步骤8﹑采用编带机将不同类型的贴片LED灯珠分别编带。
由于贴片LED灯珠支架上设有识别方向的标记，因此，编带出来的各贴 片LED灯珠的偏振方向均一致。
步骤5中，第一底膜为扩张膜，偏振膜矩阵制作好后，再采用扩张机将扩张膜均匀扩张，使附着在扩张膜表面紧密排列的小块偏振膜均匀分开；这样更加有利于小块偏振膜的提取。
在步骤5和步骤6之间增加以下操作：使用点胶机向每个贴片LED灯珠支架内的偏振膜上覆盖一层第二透光胶，然后进行烘烤或紫外线照射，使每个贴片LED灯珠支架内的第二透光胶固化。第二透光胶不仅透光，还起到保护偏振膜的作用。
第二透光胶的材质为环氧树脂﹑硅胶或UV胶；环氧树脂和硅胶通过烘烤固化，UV胶通过紫外线照射固化。
由于偏振膜的温度超过一定值时会发生“失偏”，即失去偏振功能，因此，烘烤时的温度和时间要跟据偏振膜的特性进行精确控制，不能超过偏振膜的耐受温度和时间；
或者，在步骤5和步骤6之间增加以下操作：使用贴片机一一提取透光膜矩阵中的每个小块透光膜，并粘贴在每个贴片LED灯珠支架上的偏振膜上，形成偏振膜表面的透光膜；
透光膜矩阵采用带有第二底膜的整张透光膜制作而成，整张透光膜通过其下表面的粘胶与第二底膜粘贴在一起，透光膜矩阵的制作方法为：将带有第二底膜的整张透光膜放入裁切机中，按照预先设定的程序将整张透光膜裁成行列整齐排列的小块透光膜，形成透光膜矩阵，透光膜矩阵中的每个小块透光膜的形状和尺寸与贴片LED灯珠支架的形状和尺寸匹配，第二底膜没有被裁切，透光膜矩阵粘贴在第二底膜的上表面上。
选用带有第二底膜的整张透光膜时，不应选用与整张透光膜之间的粘贴力太强的第二底膜，以影响小块透光膜的提取。
裁切整张透光膜时，控制裁切机的裁切深度，使其不裁到第二底膜，保持第二底膜的完整；
透光膜不仅透光，还起到保护偏振膜的作用。
透光膜为AGAR膜。
当LED发光晶片为正装晶片时，步骤1的具体方法为：
步骤1.1﹑先进行准备工作，准备工作中含有扩晶﹑清洗和烘烤﹑回温；
扩晶：由于LED发光晶片的尺寸非常小(如4μm*6μm)，因此，由LED发光晶片生产厂家提供的LED发光晶片薄膜表面都是紧密排列着成千上万个LED发光晶片；LED发光晶片之间的间距太小，提取使用单个LED发光晶片时非常困难，因此，采用扩晶机将LED发光晶片薄膜均匀扩张，使附着在LED发光晶片薄膜表面紧密排列的LED发光晶片均匀分开，便于提取使用；扩晶机也叫晶片扩张机或扩片机，广泛应用于发光二极管、中小功率三极管、背光源、集成电路和一些特殊半导体器件生产中的晶片扩张工序，它利用LED发光晶片薄膜的加热可塑性，采用双气缸上下控制，将单张LED发光晶片薄膜均匀地向四周扩散，达到满意的晶片间隙后自动成型，膜片紧绷不变形；
清洗和烘烤：使用电浆清洗机对贴片LED灯珠支架矩阵进行电浆清洗，利用电浆清洗机内部由氢气和氧气形成的电弧，将贴片LED灯珠支架矩阵表面残留的有机物去除，提高LED发光晶片的粘接力，然后使用烤箱对贴片LED灯珠支架矩阵进行烘烤，将贴片LED灯珠支架矩阵表面在注塑过程中残留的水汽去除；
回温：将放在冰箱中冷藏保存的导电胶或绝缘胶取出，静态放置于空气中回复到室温；导电胶为银胶；
步骤1.2﹑固晶：也称为装片，采用固晶机将LED发光晶片薄膜上的LED发光晶片通过导电胶或绝缘胶固定在贴片LED灯珠支架矩阵中的每个贴片LED灯珠支架内底面上的指定位置上，形成热通路或电通路，为后序的打线连接提供条件；
步骤1.3﹑固晶烘烤：使用烤箱或烘箱烘烤步骤1.2形成的半成品，将导电胶或绝缘胶烘烤干，使LED发光晶片和贴片LED灯珠支架之间形成良好的粘接；
也可自然固化，但需要较长时间；
步骤1.4﹑采用焊线机在每个贴片LED灯珠支架内焊接导线(也称为邦定或者打线)，将N个LED发光晶片的电极与贴片LED灯珠支架内底面上的导电 区域连接在一起，形成电通路，导线采用金线、合金线、铜线或其它金属线；
当LED发光晶片为倒装晶片时，步骤1的具体方法为：N个LED发光晶片直接焊接在贴片LED灯珠支架的内底面上，N个LED发光晶片的电极与贴片LED灯珠支架内底面上的导电区域焊接在一起，形成电通路；
步骤3中，导线也浸没在第一透光胶中；
步骤6执行之前，先采用LED测试机对贴片LED灯珠进行功能检查和测试；
步骤6通过刀模或者冲床来完成；
步骤8完成后，采用真空包装机将完成编带的贴片LED灯珠进行真空封装；
裁切机为激光裁切机或机械裁切机；
第一透光胶的材质为环氧树脂﹑硅胶或其它透光填充介质，偏振膜为左旋偏振膜﹑右旋偏振膜或线偏振膜；
N为1～3。
或者，一种上述发出偏振光的贴片LED灯珠(TOP型)的批量制作方法，含有下列步骤：
步骤21﹑在贴片LED灯珠支架矩阵中的每个贴片LED灯珠支架内底面上安装N个LED发光晶片，并使N个LED发光晶片的电极与贴片LED灯珠支架内底面上的导电区域连接在一起，形成电通路，N为大于等于1的自然数；贴片LED灯珠支架矩阵中的各贴片LED灯珠支架相互连接在一起，且每个贴片LED灯珠支架上都设有识别方向的标记；
步骤22﹑对步骤21形成的半成品进行预热；
步骤23﹑使用点胶机向每个贴片LED灯珠支架内填充第一透光胶，使N个LED发光晶片都浸没在第一透光胶中，并使第一透光胶的表面水平；
步骤24﹑使用贴片机将编带偏振膜中的每个小块偏振膜放置在每个贴片LED灯珠支架内的第一透光胶的表面，形成第一透光胶表面的偏振膜，第一透光胶的表面高度使偏振膜位于贴片LED灯珠支架内部；
编带偏振膜的制作方法为：将正﹑反两面均不含粘胶的整张偏振膜放入 裁切机中，按照预先设定的程序将整张偏振膜裁成一个个大小相同的小块偏振膜，每个小块偏振膜的形状和尺寸(小块偏振膜可以是正方形﹑长方形、圆形或多边形，小块偏振膜的表面积从0.1平方毫米左右到十几个平方毫米不等)与贴片LED灯珠支架的形状和尺寸匹配，每个小块偏振膜上均裁切有识别方向的方向标记，然后用编带机将所有小块偏振膜编带，形成编带偏振膜；方向标记可以保证在编带时，所有偏振膜的偏振方向都一致，从而使贴片机贴在每个贴片LED灯珠支架内的偏振膜方向一致；
步骤25﹑使用点胶机向每个贴片LED灯珠支架内的偏振膜上覆盖一层第二透光胶，然后进行烘烤或紫外线照射，使每个贴片LED灯珠支架内的第二透光胶固化；第二透光胶不仅透光，还起到固定和保护偏振膜的作用；
由于偏振膜的温度超过一定值时会发生“失偏”，即失去偏振功能，因此，烘烤时的温度和时间要跟据偏振膜的特性进行精确控制，不能超过偏振膜的耐受温度和时间；
步骤26﹑将各贴片LED灯珠支架分离，形成一个个独立的贴片LED灯珠；
步骤27﹑采用分光机将贴片LED灯珠分成不同类型；
通过在分光机上设置各类不同的参数(亮度、电压、色温、光通量等)，可以将贴片LED灯珠分成多个等级和型号；
步骤28﹑采用编带机将不同类型的贴片LED灯珠分别编带。
当LED发光晶片为正装晶片时，步骤21的具体方法为：
步骤21.1﹑先进行准备工作，准备工作中含有扩晶﹑清洗和烘烤﹑回温；
扩晶：采用扩晶机将LED发光晶片薄膜均匀扩张，使附着在LED发光晶片薄膜表面紧密排列的LED发光晶片均匀分开；
清洗和烘烤：使用电浆清洗机对贴片LED灯珠支架矩阵进行电浆清洗，将贴片LED灯珠支架矩阵表面残留的有机物去除，然后使用烤箱对贴片LED灯珠支架矩阵进行烘烤，将贴片LED灯珠支架矩阵表面的水汽去除；
回温：将放在冰箱中冷藏保存的导电胶或绝缘胶取出，静态放置于空气中回复到室温；导电胶为银胶；
步骤21.2﹑固晶：采用固晶机将LED发光晶片薄膜上的LED发光晶片通 过导电胶或绝缘胶固定在贴片LED灯珠支架矩阵中的每个贴片LED灯珠支架内底面上的指定位置上；
步骤21.3﹑固晶烘烤：使用烤箱或烘箱烘烤步骤21.2形成的半成品，将导电胶或绝缘胶烘烤干，使LED发光晶片和贴片LED灯珠支架之间形成良好的粘接；
步骤21.4﹑采用焊线机在每个贴片LED灯珠支架内焊接导线，将N个LED发光晶片的电极与贴片LED灯珠支架内底面上的导电区域连接在一起，形成电通路，导线采用金线、合金线、铜线或其它金属线；
当LED发光晶片为倒装晶片时，步骤21的具体方法为：N个LED发光晶片直接焊接在贴片LED灯珠支架的内底面上，N个LED发光晶片的电极与贴片LED灯珠支架内底面上的导电区域焊接在一起，形成电通路；
步骤23中，导线也浸没在第一透光胶中；
步骤24中，小块偏振膜上的方向标记为通孔或/和缺口；
步骤26执行之前，先采用LED测试机对贴片LED灯珠进行功能检查和测试；
步骤26通过刀模或者冲床来完成；
步骤28完成后，采用真空包装机将完成编带的贴片LED灯珠进行真空封装；
裁切机为激光裁切机或机械裁切机；
第一透光胶的材质为环氧树脂﹑硅胶或其它透光填充介质，偏振膜为左旋偏振膜﹑右旋偏振膜或线偏振膜；
第一透光胶不需要烘烤，可使其长时间自然固化；
第二透光胶的材质为环氧树脂﹑硅胶﹑UV胶或其它透光填充介质；环氧树脂和硅胶通过烘烤固化，UV胶通过紫外线照射固化；
N为1～3。
本发明的有益效果：
1﹑本发明的贴片LED灯珠上设有偏振膜，工作时可自行发出偏振光，使用该贴片LED灯珠制作立体LED显示屏时，不用再在LED灯珠表面贴偏振膜， 减少了制作工序，制作简单方便，有效提高了立体LED显示屏的生产效率，而且还大大提高了产品的质量和良品率。
2﹑本发明在制作贴片LED灯珠时，先在贴片LED灯珠支架内填充第一透光胶，再使用贴片机按顺序提取由一整张偏振膜裁成的偏振膜矩阵中的每个小块偏振膜，粘贴在每个贴片LED灯珠支架内的第一透光胶的表面，或者，使用贴片机将编带偏振膜中的每个小块偏振膜放置在每个贴片LED灯珠支架内的第一透光胶的表面；因此，本发明同一批次中生产出来的贴片LED灯珠具有相同的偏振方向，后期编带时可将同一偏振方向的贴片LED灯珠按相同的位置方向编带在一起，方便以后制作立体LED显示屏时将相同偏振方向的贴片LED灯珠焊接在同一行(列)中或间隔焊接，提高了立体LED显示屏的生产效率，尤其是对于“棋盘格”式偏振的立体LED显示屏的生产来说，使原来几乎不可能的事成为可能。
3﹑本发明的贴片LED灯珠的批量制作方法采用生产线流水制作，生产效率高﹑产品质量好。
(四)、附图说明：
图1为发出偏振光的贴片LED灯珠的结构示意图之一；
图2为发出偏振光的贴片LED灯珠的结构示意图之二；
图3为发出偏振光的贴片LED灯珠的结构示意图之三；
图4为发出偏振光的贴片LED灯珠的结构示意图之四；
图5为发出偏振光的贴片LED灯珠的结构示意图之五；
图6为发出偏振光的贴片LED灯珠的结构示意图之六；
图7为发出偏振光的贴片LED灯珠的结构示意图之七；
图8为发出偏振光的贴片LED灯珠的结构示意图之八；
图9为发出偏振光的贴片LED灯珠的结构示意图之九。
(五)、具体实施方式：
实施例一：
参见图1，图中，发出偏振光的贴片LED灯珠(TOP型)含有贴片LED灯 珠支架1和1个LED发光晶片2，LED发光晶片2设在贴片LED灯珠支架1的内底面上，在LED发光晶片2的上方水平设有一层偏振膜6，贴片LED灯珠支架1的内底面和偏振膜6的下表面之间的空隙处充满固化的第一透光胶5。
LED发光晶片2为正装晶片，LED发光晶片2通过绝缘胶3固定在贴片LED灯珠支架1的内底面上，LED发光晶片2和贴片LED灯珠支架1的内底面之间连接有两根导线4，两根导线4位于偏振膜6的下方；导线4为金线；LED发光晶片2的两个电极分别通过两根导线4与贴片LED灯珠支架1内底面连接。
第一透光胶5的材质为环氧树脂；偏振膜6为左旋偏振膜；偏振膜6位于贴片LED灯珠支架1外部。
该发出偏振光的贴片LED灯珠(TOP型)的批量制作方法含有下列步骤：
步骤1﹑在贴片LED灯珠支架矩阵中的每个贴片LED灯珠支架1内底面上安装1个LED发光晶片2，并使LED发光晶片2的电极与贴片LED灯珠支架1内底面上的导电区域连接在一起，形成电通路；贴片LED灯珠支架矩阵中的各贴片LED灯珠支架1相互连接在一起，且每个贴片LED灯珠支架1上都设有识别方向的标记；
步骤2﹑对步骤1形成的半成品进行预热；
预热通过烤箱或烘箱来完成，以使步骤1形成的半成品预先加热到适宜的温度，便于第一透光胶5与贴片LED灯珠支架1更好地结合，避免封装过程中产生气泡等杂质；
步骤3﹑使用点胶机向每个贴片LED灯珠支架1内填充第一透光胶5，使LED发光晶片2都浸没在第一透光胶5中，并使第一透光胶5的表面水平；
步骤4﹑对步骤3形成的半成品进行烘烤，使每个贴片LED灯珠支架1内填充的第一透光胶5固化；
步骤5﹑使用贴片机一一提取偏振膜矩阵中的每个小块偏振膜，并粘贴在每个贴片LED灯珠支架1内的第一透光胶5的表面，形成第一透光胶表面的偏振膜6；
偏振膜矩阵采用带有第一底膜的整张偏振膜制作而成，整张偏振膜通过其下表面的粘胶与第一底膜粘贴在一起，偏振膜矩阵的制作方法为：将带有 第一底膜的整张偏振膜放入裁切机中，按照预先设定的程序将整张偏振膜裁成行列整齐排列的小块偏振膜，形成偏振膜矩阵，偏振膜矩阵中的每个小块偏振膜的形状和尺寸(小块偏振膜为正方形，小块偏振膜的表面积为2平方毫米)与贴片LED灯珠支架1的形状和尺寸匹配，第一底膜没有被裁切，偏振膜矩阵粘贴在第一底膜的上表面上；
选用带有第一底膜的整张偏振膜时，不应选用与整张偏振膜之间的粘贴力太强的第一底膜，以影响小块偏振膜的提取；
裁切整张偏振膜时，控制裁切机的裁切深度，使其不裁到第一底膜，保持第一底膜的完整；
步骤6﹑将各贴片LED灯珠支架1分离，形成一个个独立的贴片LED灯珠；
步骤7﹑采用分光机将贴片LED灯珠分成不同类型；
通过在分光机上设置各类不同的参数(亮度、电压、色温、光通量等)，可以将贴片LED灯珠分成多个等级和型号；
步骤8﹑采用编带机将不同类型的贴片LED灯珠分别编带。
由于贴片LED灯珠支架1上设有识别方向的标记，因此，编带出来的各贴片LED灯珠的偏振方向均一致。
步骤5中，第一底膜为扩张膜，偏振膜矩阵制作好后，再采用扩张机将扩张膜均匀扩张，使附着在扩张膜表面紧密排列的小块偏振膜均匀分开；这样更加有利于小块偏振膜的提取。
步骤1的具体方法为：
步骤1.1﹑先进行准备工作，准备工作中含有扩晶﹑清洗和烘烤﹑回温；
扩晶：由于LED发光晶片2的尺寸非常小(如4μm*6μm)，因此，由LED发光晶片生产厂家提供的LED发光晶片薄膜表面都是紧密排列着成千上万个LED发光晶片2；LED发光晶片2之间的间距太小，提取使用单个LED发光晶片2时非常困难，因此，采用扩晶机将LED发光晶片薄膜均匀扩张，使附着在LED发光晶片薄膜表面紧密排列的LED发光晶片2均匀分开，便于提取使用；
清洗和烘烤：使用电浆清洗机对贴片LED灯珠支架矩阵进行电浆清洗， 利用电浆清洗机内部由氢气和氧气形成的电弧，将贴片LED灯珠支架矩阵表面残留的有机物去除，提高LED发光晶片2的粘接力，然后使用烤箱对贴片LED灯珠支架矩阵进行烘烤，将贴片LED灯珠支架矩阵表面在注塑过程中残留的水汽去除；
回温：将放在冰箱中冷藏保存的绝缘胶3取出，静态放置于空气中回复到室温；
步骤1.2﹑固晶：也称为装片，采用固晶机将LED发光晶片薄膜上的LED发光晶片2通过绝缘胶3固定在贴片LED灯珠支架矩阵中的每个贴片LED灯珠支架1内底面上的指定位置上，形成热通路或电通路，为后序的打线连接提供条件；
步骤1.3﹑固晶烘烤：使用烤箱或烘箱烘烤步骤1.2形成的半成品，将绝缘胶3烘烤干，使LED发光晶片2和贴片LED灯珠支架1之间形成良好的粘接；
步骤1.4﹑采用焊线机在每个贴片LED灯珠支架1内焊接导线4(也称为邦定或者打线)，将LED发光晶片2的电极与贴片LED灯珠支架1内底面上的导电区域连接在一起，形成电通路，导线4采用金线；
步骤3中，导线4也浸没在第一透光胶5中；
步骤6执行之前，先采用LED测试机对贴片LED灯珠进行功能检查和测试；
步骤6通过刀模来完成；
步骤8完成后，采用真空包装机将完成编带的贴片LED灯珠进行真空封装；
裁切机为激光裁切机；
第一透光胶5的材质为环氧树脂，偏振膜6为左旋偏振膜。
实施例二：
参见图2，图中编号与实施例一相同的，代表的意义也相同，相同之处不重述，不同之处如下：
发出偏振光的贴片LED灯珠(TOP型)中，偏振膜6的上表面上设有一层固化的第二透光胶7。
第二透光胶7的材质为环氧树脂，偏振膜6位于贴片LED灯珠支架1内部。
该发出偏振光的贴片LED灯珠(TOP型)的批量制作方法含有下列步骤：
步骤21﹑在贴片LED灯珠支架矩阵中的每个贴片LED灯珠支架1内底面上安装1个LED发光晶片2，并使该LED发光晶片2的电极与贴片LED灯珠支架1内底面上的导电区域连接在一起，形成电通路；贴片LED灯珠支架矩阵中的各贴片LED灯珠支架1相互连接在一起，且每个贴片LED灯珠支架1上都设有识别方向的标记；
步骤22﹑对步骤21形成的半成品进行预热；
步骤23﹑使用点胶机向每个贴片LED灯珠支架1内填充第一透光胶5，使LED发光晶片2浸没在第一透光胶5中，并使第一透光胶5的表面水平；
步骤24﹑使用贴片机将编带偏振膜中的每个小块偏振膜放置在每个贴片LED灯珠支架1内的第一透光胶5的表面，形成第一透光胶表面的偏振膜6，第一透光胶5的表面高度使偏振膜6位于贴片LED灯珠支架1内部；
编带偏振膜的制作方法为：将正﹑反两面均不含粘胶的整张偏振膜放入裁切机中，按照预先设定的程序将整张偏振膜裁成一个个大小相同的小块偏振膜，每个小块偏振膜的形状和尺寸(小块偏振膜为正方形，小块偏振膜的表面积为2平方毫米)与贴片LED灯珠支架1的形状和尺寸匹配，每个小块偏振膜上均裁切有识别方向的方向标记，然后用编带机将所有小块偏振膜编带，形成编带偏振膜；方向标记可以保证在编带时，所有偏振膜6的偏振方向都一致，从而使贴片机贴在每个贴片LED灯珠支架1内的偏振膜6方向一致；
步骤25﹑使用点胶机向每个贴片LED灯珠支架1内的偏振膜6上覆盖一层第二透光胶7，然后进行烘烤，使每个贴片LED灯珠支架1内的第二透光胶7固化；第二透光胶7不仅透光，还起到固定和保护偏振膜6的作用；
由于偏振膜6的温度超过一定值时会发生“失偏”，即失去偏振功能，因此，烘烤时的温度和时间要跟据偏振膜6的特性进行精确控制，不能超过偏振膜6的耐受温度和时间；
步骤26﹑将各贴片LED灯珠支架分离，形成一个个独立的贴片LED灯珠；
步骤27﹑采用分光机将贴片LED灯珠分成不同类型；
通过在分光机上设置各类不同的参数(亮度、电压、色温、光通量等)，可以将贴片LED灯珠分成多个等级和型号；
步骤28﹑采用编带机将不同类型的贴片LED灯珠分别编带。
步骤21的具体方法为：
步骤21.1﹑先进行准备工作，准备工作中含有扩晶﹑清洗和烘烤﹑回温；
扩晶：采用扩晶机将LED发光晶片薄膜均匀扩张，使附着在LED发光晶片薄膜表面紧密排列的LED发光晶片2均匀分开；
清洗和烘烤：使用电浆清洗机对贴片LED灯珠支架矩阵进行电浆清洗，将贴片LED灯珠支架矩阵表面残留的有机物去除，然后使用烤箱对贴片LED灯珠支架矩阵进行烘烤，将贴片LED灯珠支架矩阵表面的水汽去除；
回温：将放在冰箱中冷藏保存的绝缘3胶取出，静态放置于空气中回复到室温；
步骤21.2﹑固晶：采用固晶机将LED发光晶片薄膜上的LED发光晶片2通过绝缘胶3固定在贴片LED灯珠支架矩阵中的每个贴片LED灯珠支架1内底面上的指定位置上；
步骤21.3﹑固晶烘烤：使用烤箱或烘箱烘烤步骤21.2形成的半成品，将绝缘胶3烘烤干，使LED发光晶片2和贴片LED灯珠支架1之间形成良好的粘接；
步骤21.4﹑采用焊线机在每个贴片LED灯珠支架1内焊接导线4，将LED发光晶片2的电极与贴片LED灯珠支架1内底面上的导电区域连接在一起，形成电通路，导线4采用金线；
步骤23中，导线4也浸没在第一透光胶5中；
步骤24中，小块偏振膜上的方向标记为缺口；
步骤26执行之前，先采用LED测试机对贴片LED灯珠进行功能检查和测试；
步骤26通过刀模来完成；
步骤28完成后，采用真空包装机将完成编带的贴片LED灯珠进行真空封装；
裁切机为激光裁切机；
第一透光胶5的材质为环氧树脂，偏振膜6为左旋偏振膜；
第一透光胶5不需要烘烤，可使其长时间自然固化；
第二透光胶7的材质为环氧树脂。
实施例三：
参见图3，图中编号与实施例一相同的，代表的意义相同，相同之处不重述，不同之处如下：
发出偏振光的贴片LED灯珠(TOP型)中，偏振膜6的上表面上设有一层透光膜9。
透光膜9为AGAR膜。
该发出偏振光的贴片LED灯珠(TOP型)的批量制作方法中，在步骤5和步骤6之间增加以下操作：使用贴片机一一提取透光膜矩阵中的每个小块透光膜，并粘贴在每个贴片LED灯珠支架1上的偏振膜6上，形成偏振膜6表面的透光膜9；
透光膜矩阵采用带有第二底膜的整张透光膜制作而成，整张透光膜通过其下表面的粘胶与第二底膜粘贴在一起，透光膜矩阵的制作方法为：将带有第二底膜的整张透光膜放入裁切机中，按照预先设定的程序将整张透光膜裁成行列整齐排列的小块透光膜，形成透光膜矩阵，透光膜矩阵中的每个小块透光膜的形状和尺寸与贴片LED灯珠支架1的形状和尺寸匹配，第二底膜没有被裁切，透光膜矩阵粘贴在第二底膜的上表面上。
选用带有第二底膜的整张透光膜时，不应选用与整张透光膜之间的粘贴力太强的第二底膜，以影响小块透光膜的提取。
裁切整张透光膜时，控制裁切机的裁切深度，使其不裁到第二底膜，保持第二底膜的完整；
透光膜9不仅透光，还起到保护偏振膜6的作用。
实施例四：
参见图4，图中，发出偏振光的贴片LED灯珠(TOP型)含有贴片LED灯珠支架1和3个LED发光晶片2(分别发出红﹑绿﹑蓝三种光线)，3个LED发光晶片2设在贴片LED灯珠支架1的内底面上，在3个LED发光晶片2的上方水平设有一层偏振膜6，贴片LED灯珠支架1的内底面和偏振膜6的下表面之间的空隙处充满固化的第一透光胶5。
LED发光晶片2为正装晶片，3个LED发光晶片2通过导电胶12固定在贴片LED灯珠支架1的内底面上，3个LED发光晶片2和贴片LED灯珠支架1的内底面之间连接有3根导线4，3个LED发光晶片2的公共电极通过导电胶12与贴片LED灯珠支架1内底面连接，3个LED发光晶片2的另一个电极分别通过3根导线4与贴片LED灯珠支架1内底面连接，3根导线4位于偏振膜6的下方；导电胶12为银胶；导线4为合金线；
第一透光胶5的材质为硅胶；偏振膜6为右旋偏振膜；偏振膜6位于贴片LED灯珠支架1内部。
该发出偏振光的贴片LED灯珠(TOP型)的批量制作方法含有下列步骤：
步骤1﹑在贴片LED灯珠支架矩阵中的每个贴片LED灯珠支架1内底面上安装3个LED发光晶片2，并使3个LED发光晶片2的电极与贴片LED灯珠支架1内底面上的导电区域连接在一起，形成电通路；贴片LED灯珠支架矩阵中的各贴片LED灯珠支架1相互连接在一起，且每个贴片LED灯珠支架1上都设有识别方向的标记；
步骤2﹑对步骤1形成的半成品进行预热；
预热通过烤箱或烘箱来完成，以使步骤1形成的半成品预先加热到适宜的温度，便于第一透光胶5与贴片LED灯珠支架1更好地结合，避免封装过程中产生气泡等杂质；
步骤3﹑使用点胶机向每个贴片LED灯珠支架1内填充第一透光胶5，使3个LED发光晶片2都浸没在第一透光胶5中，并使第一透光胶5的表面水平；
步骤4﹑对步骤3形成的半成品进行烘烤，使每个贴片LED灯珠支架1内填充的第一透光胶5固化；
步骤5﹑使用贴片机一一提取偏振膜矩阵中的每个小块偏振膜，并粘贴在 每个贴片LED灯珠支架1内的第一透光胶5的表面，形成第一透光胶5表面的偏振膜6；
偏振膜矩阵采用带有第一底膜的整张偏振膜制作而成，整张偏振膜通过其下表面的粘胶与第一底膜粘贴在一起，偏振膜矩阵的制作方法为：将带有第一底膜的整张偏振膜放入裁切机中，按照预先设定的程序将整张偏振膜裁成行列整齐排列的小块偏振膜，形成偏振膜矩阵，偏振膜矩阵中的每个小块偏振膜的形状和尺寸(小块偏振膜为长方形，小块偏振膜的表面积为3平方毫米)与贴片LED灯珠支架1的形状和尺寸匹配，第一底膜没有被裁切，偏振膜矩阵粘贴在第一底膜的上表面上；
选用带有第一底膜的整张偏振膜时，不应选用与整张偏振膜之间的粘贴力太强的第一底膜，以影响小块偏振膜的提取；
裁切整张偏振膜时，控制裁切机的裁切深度，使其不裁到第一底膜，保持第一底膜的完整；
步骤6﹑将各贴片LED灯珠支架分离，形成一个个独立的贴片LED灯珠；
步骤7﹑采用分光机将贴片LED灯珠分成不同类型；
通过在分光机上设置各类不同的参数(亮度、电压、色温、光通量等)，可以将贴片LED灯珠分成多个等级和型号；
步骤8﹑采用编带机将不同类型的贴片LED灯珠分别编带。
由于贴片LED灯珠支架1上设有识别方向的标记，因此，编带出来的各贴片LED灯珠的偏振方向均一致。
步骤5中，第一底膜为扩张膜，偏振膜矩阵制作好后，再采用扩张机将扩张膜均匀扩张，使附着在扩张膜表面紧密排列的小块偏振膜均匀分开；这样更加有利于小块偏振膜的提取。
步骤1的具体方法为：
步骤1.1﹑先进行准备工作，准备工作中含有扩晶﹑清洗和烘烤﹑回温；
扩晶：由于LED发光晶片2的尺寸非常小(如4μm*6μm)，因此，由LED发光晶片生产厂家提供的LED发光晶片薄膜表面都是紧密排列着成千上万个LED发光晶片2；LED发光晶片2之间的间距太小，提取使用单个LED发光晶 片2时非常困难，因此，采用扩晶机将LED发光晶片薄膜均匀扩张，使附着在LED发光晶片薄膜表面紧密排列的LED发光晶片2均匀分开，便于提取使用；
清洗和烘烤：使用电浆清洗机对贴片LED灯珠支架矩阵进行电浆清洗，利用电浆清洗机内部由氢气和氧气形成的电弧，将贴片LED灯珠支架矩阵表面残留的有机物去除，提高LED发光晶片2的粘接力，然后使用烤箱对贴片LED灯珠支架矩阵进行烘烤，将贴片LED灯珠支架矩阵表面在注塑过程中残留的水汽去除；
回温：将放在冰箱中冷藏保存的导电胶12取出，静态放置于空气中回复到室温；导电胶12为银胶；
步骤1.2﹑固晶：也称为装片，采用固晶机将LED发光晶片薄膜上的3个LED发光晶片2通过导电胶12固定在贴片LED灯珠支架矩阵中的每个贴片LED灯珠支架1内底面上的指定位置上，形成热通路或电通路，为后序的打线连接提供条件；
步骤1.3﹑固晶烘烤：使用烤箱或烘箱烘烤步骤1.2形成的半成品，将导电胶12烘烤干，使LED发光晶片2和贴片LED灯珠支架1之间形成良好的粘接；
步骤1.4﹑采用焊线机在每个贴片LED灯珠支架1内焊接导线4(也称为邦定或者打线)，将3个LED发光晶片2的电极与贴片LED灯珠支架1内底面上的导电区域连接在一起，形成电通路，导线采用合金线；
步骤3中，导线4也浸没在第一透光胶5中；
步骤6执行之前，先采用LED测试机对贴片LED灯珠进行功能检查和测试；
步骤6通过冲床来完成；
步骤8完成后，采用真空包装机将完成编带的贴片LED灯珠进行真空封装；
裁切机为机械裁切机；
第一透光胶5的材质为硅胶，偏振膜为右旋偏振膜。
实施例五：
参见图5，图中编号与实施例四相同的，代表的意义也相同，相同之处不重述，不同之处如下：
发出偏振光的贴片LED灯珠(TOP型)中，偏振膜6的上表面上设有一层固化的第二透光胶7。
第二透光胶7的材质为UV胶。
该发出偏振光的贴片LED灯珠(TOP型)的批量制作方法，含有下列步骤：
步骤21﹑在贴片LED灯珠支架矩阵中的每个贴片LED灯珠支架1内底面上安装3个LED发光晶片2(分别发出红﹑绿﹑蓝三种光线)，并使3个LED发光晶片2的电极与贴片LED灯珠支架1内底面上的导电区域连接在一起，形成电通路；贴片LED灯珠支架矩阵中的各贴片LED灯珠支架1相互连接在一起，且每个贴片LED灯珠支架1上都设有识别方向的标记；
步骤22﹑对步骤21形成的半成品进行预热；
步骤23﹑使用点胶机向每个贴片LED灯珠支架1内填充第一透光胶5，使3个LED发光晶片2都浸没在第一透光胶5中，并使第一透光胶5的表面水平；
步骤24﹑使用贴片机将编带偏振膜中的每个小块偏振膜放置在每个贴片LED灯珠支架1内的第一透光胶5的表面，形成第一透光胶5表面的偏振膜6，第一透光胶5的表面高度使偏振膜6位于贴片LED灯珠支架1内部；
编带偏振膜的制作方法为：将正﹑反两面均不含粘胶的整张偏振膜放入裁切机中，按照预先设定的程序将整张偏振膜裁成一个个大小相同的小块偏振膜，每个小块偏振膜的形状和尺寸(小块偏振膜为长方形，小块偏振膜的表面积为3平方毫米)与贴片LED灯珠支架1的形状和尺寸匹配，每个小块偏振膜上均裁切有识别方向的方向标记，然后用编带机将所有小块偏振膜编带，形成编带偏振膜；方向标记可以保证在编带时，所有偏振膜6的偏振方向都一致，从而使贴片机贴在每个贴片LED灯珠支架1内的偏振膜6方向一致；
步骤25﹑使用点胶机向每个贴片LED灯珠支架1内的偏振膜6上覆盖一 层第二透光胶7，然后进行紫外线照射，使每个贴片LED灯珠支架1内的第二透光胶7固化；第二透光胶7不仅透光，还起到固定和保护偏振膜6的作用；
步骤26﹑将各贴片LED灯珠支架分离，形成一个个独立的贴片LED灯珠；
步骤27﹑采用分光机将贴片LED灯珠分成不同类型；
通过在分光机上设置各类不同的参数(亮度、电压、色温、光通量等)，可以将贴片LED灯珠分成多个等级和型号；
步骤28﹑采用编带机将不同类型的贴片LED灯珠分别编带。
步骤21的具体方法为：
步骤21.1﹑先进行准备工作，准备工作中含有扩晶﹑清洗和烘烤﹑回温；
扩晶：采用扩晶机将LED发光晶片薄膜均匀扩张，使附着在LED发光晶片薄膜表面紧密排列的LED发光晶片2均匀分开；
清洗和烘烤：使用电浆清洗机对贴片LED灯珠支架矩阵进行电浆清洗，将贴片LED灯珠支架矩阵表面残留的有机物去除，然后使用烤箱对贴片LED灯珠支架矩阵进行烘烤，将贴片LED灯珠支架矩阵表面的水汽去除；
回温：将放在冰箱中冷藏保存的导电胶12取出，静态放置于空气中回复到室温；导电胶12为银胶；
步骤21.2﹑固晶：采用固晶机将LED发光晶片薄膜上的LED发光晶片2通过导电胶12固定在贴片LED灯珠支架矩阵中的每个贴片LED灯珠支架1内底面上的指定位置上；
步骤21.3﹑固晶烘烤：使用烤箱或烘箱烘烤步骤21.2形成的半成品，将导电胶12烘烤干，使LED发光晶片2和贴片LED灯珠支架1之间形成良好的粘接；
步骤21.4﹑采用焊线机在每个贴片LED灯珠支架1内焊接导线4，将3个LED发光晶片2的电极与贴片LED灯珠支架1内底面上的导电区域连接在一起，形成电通路，导线4采用合金线；
步骤23中，导线4也浸没在第一透光胶5中；
步骤24中，小块偏振膜上的方向标记为通孔；
步骤26执行之前，先采用LED测试机对贴片LED灯珠进行功能检查和测 试；
步骤26通过冲床来完成；
步骤28完成后，采用真空包装机将完成编带的贴片LED灯珠进行真空封装；
裁切机为机械裁切机；
第一透光胶5的材质为硅胶，偏振膜6为右旋偏振膜；
第一透光胶5不需要烘烤，可使其长时间自然固化；
第二透光胶7的材质为UV胶。
实施例六：
参见图6，图中编号与实施例四相同的，代表的意义也相同，相同之处不重述，不同之处如下：
发出偏振光的贴片LED灯珠(TOP型)中，偏振膜6的上表面上设有一层透光膜9。
透光膜9为AGAR膜。
该发出偏振光的贴片LED灯珠(TOP型)的批量制作方法中，在步骤5和步骤6之间增加以下操作：使用贴片机一一提取透光膜矩阵中的每个小块透光膜，并粘贴在每个贴片LED灯珠支架1上的偏振膜6上，形成偏振膜6表面的透光膜9；
透光膜矩阵采用带有第二底膜的整张透光膜制作而成，整张透光膜通过其下表面的粘胶与第二底膜粘贴在一起，透光膜矩阵的制作方法为：将带有第二底膜的整张透光膜放入裁切机中，按照预先设定的程序将整张透光膜裁成行列整齐排列的小块透光膜，形成透光膜矩阵，透光膜矩阵中的每个小块透光膜的形状和尺寸与贴片LED灯珠支架1的形状和尺寸匹配，第二底膜没有被裁切，透光膜矩阵粘贴在第二底膜的上表面上。
选用带有第二底膜的整张透光膜时，不应选用与整张透光膜之间的粘贴力太强的第二底膜，以影响小块透光膜的提取。
裁切整张透光膜时，控制裁切机的裁切深度，使其不裁到第二底膜，保持第二底膜的完整；
透光膜9不仅透光，还起到保护偏振膜6的作用。
实施例七：
参见图7，图中，发出偏振光的贴片LED灯珠(TOP型)含有贴片LED灯珠支架1和3个LED发光晶片2，3个LED发光晶片2设在贴片LED灯珠支架1的内底面上，在3个LED发光晶片2的上方水平设有一层偏振膜6，贴片LED灯珠支架1的内底面和偏振膜6的下表面之间的空隙处充满固化的第一透光胶5。
LED发光晶片2为倒装晶片，3个LED发光晶片2焊接在贴片LED灯珠支架1的内底上。
第一透光胶5的材质为硅胶；偏振膜6为线偏振膜；偏振膜6位于贴片LED灯珠支架1内部。
该发出偏振光的贴片LED灯珠(TOP型)的批量制作方法含有下列步骤：
步骤1﹑在贴片LED灯珠支架矩阵中的每个贴片LED灯珠支架1内底面上安装3个LED发光晶片2，并使3个LED发光晶片2的电极与贴片LED灯珠支架1内底面上的导电区域连接在一起，形成电通路；贴片LED灯珠支架矩阵中的各贴片LED灯珠支架1相互连接在一起，且每个贴片LED灯珠支架1上都设有识别方向的标记；
步骤2﹑对步骤1形成的半成品进行预热；
预热通过烤箱或烘箱来完成，以使步骤1形成的半成品预先加热到适宜的温度，便于第一透光胶5与贴片LED灯珠支1架更好地结合，避免封装过程中产生气泡等杂质；
步骤3﹑使用点胶机向每个贴片LED灯珠支架1内填充第一透光胶5，使3个LED发光晶片2都浸没在第一透光胶5中，并使第一透光胶5的表面水平；
步骤4﹑对步骤3形成的半成品进行烘烤，使每个贴片LED灯珠支架1内填充的第一透光胶5固化；
步骤5﹑使用贴片机一一提取偏振膜矩阵中的每个小块偏振膜，并粘贴在每个贴片LED灯珠支架1内的第一透光胶5的表面，形成第一透光胶5表面的偏振膜6；
偏振膜矩阵采用带有第一底膜的整张偏振膜制作而成，整张偏振膜通过其下表面的粘胶与第一底膜粘贴在一起，偏振膜矩阵的制作方法为：将带有第一底膜的整张偏振膜放入裁切机中，按照预先设定的程序将整张偏振膜裁成行列整齐排列的小块偏振膜，形成偏振膜矩阵，偏振膜矩阵中的每个小块偏振膜的形状和尺寸(小块偏振膜为圆形，小块偏振膜的表面积为4平方毫米)与贴片LED灯珠支架1的形状和尺寸匹配，第一底膜没有被裁切，偏振膜矩阵粘贴在第一底膜的上表面上；
选用带有第一底膜的整张偏振膜时，不应选用与整张偏振膜之间的粘贴力太强的第一底膜，以影响小块偏振膜的提取；
裁切整张偏振膜时，控制裁切机的裁切深度，使其不裁到第一底膜，保持第一底膜的完整；
步骤6﹑将各贴片LED灯珠支架分离，形成一个个独立的贴片LED灯珠；
步骤7﹑采用分光机将贴片LED灯珠分成不同类型；
通过在分光机上设置各类不同的参数(亮度、电压、色温、光通量等)，可以将贴片LED灯珠分成多个等级和型号；
步骤8﹑采用编带机将不同类型的贴片LED灯珠分别编带。
由于贴片LED灯珠支架1上设有识别方向的标记，因此，编带出来的各贴片LED灯珠的偏振方向均一致。
步骤1的具体方法为：3个LED发光晶片2直接焊接在贴片LED灯珠支架1的内底面上，3个LED发光晶片2的电极与贴片LED灯珠支架1内底面上的导电区域焊接在一起，形成电通路；
步骤6执行之前，先采用LED测试机对贴片LED灯珠进行功能检查和测试；
步骤6通过刀模完成；
步骤8完成后，采用真空包装机将完成编带的贴片LED灯珠进行真空封装；
裁切机为机械裁切机；
第一透光胶5的材质为硅胶，偏振膜6为线偏振膜。
实施例八：
参见图8，图中编号与实施例七相同的，代表的意义也相同，相同之处不重述，不同之处如下：
发出偏振光的贴片LED灯珠(TOP型)中，偏振膜6的上表面上设有一层固化的第二透光胶7。
第二透光胶7的材质为硅胶。
该发出偏振光的贴片LED灯珠(TOP型)的批量制作方法中，在步骤5和步骤6之间增加以下操作：使用点胶机向每个贴片LED灯珠支架1内的偏振膜6上覆盖一层第二透光胶7，然后进行烘烤，使每个贴片LED灯珠支架1内的第二透光胶7固化。第二透光胶7不仅透光，还起到保护偏振膜6的作用。
由于偏振膜6的温度超过一定值时会发生“失偏”，即失去偏振功能，因此，烘烤时的温度和时间要跟据偏振膜6的特性进行精确控制，不能超过偏振膜6的耐受温度和时间。
实施例九：
参见图9，图中编号与实施例七相同的，代表的意义也相同，相同之处不重述，不同之处如下：
发出偏振光的贴片LED灯珠(TOP型)中，偏振膜6的上表面上设有一层透光膜9。
透光膜9为AGAR膜。
该发出偏振光的贴片LED灯珠(TOP型)的批量制作方法中，在步骤5和步骤6之间增加以下操作：使用贴片机一一提取透光膜矩阵中的每个小块透光膜，并粘贴在每个贴片LED灯珠支架1上的偏振膜6上，形成偏振膜6表面的透光膜9；
透光膜矩阵采用带有第二底膜的整张透光膜制作而成，整张透光膜通过其下表面的粘胶与第二底膜粘贴在一起，透光膜矩阵的制作方法为：将带有第二底膜的整张透光膜放入裁切机中，按照预先设定的程序将整张透光膜裁成行列整齐排列的小块透光膜，形成透光膜矩阵，透光膜矩阵中的每个小块透光膜的形状和尺寸与贴片LED灯珠支架1的形状和尺寸匹配，第二底膜没 有被裁切，透光膜矩阵粘贴在第二底膜的上表面上。
选用带有第二底膜的整张透光膜时，不应选用与整张透光膜之间的粘贴力太强的第二底膜，以影响小块透光膜的提取。
裁切整张透光膜时，控制裁切机的裁切深度，使其不裁到第二底膜，保持第二底膜的完整；
透光膜9不仅透光，还起到保护偏振膜6的作用。

Claims (12)

  1. 一种发出偏振光的贴片LED灯珠，含有贴片LED灯珠支架和N个LED发光晶片，N为大于等于1的自然数，N个LED发光晶片设在贴片LED灯珠支架的内底面上，其特征是：在N个LED发光晶片的上方水平设有一层偏振膜，贴片LED灯珠支架的内底面和偏振膜的下表面之间的空隙处充满固化的第一透光胶。
  2. 根据权利要求1所述的发出偏振光的贴片LED灯珠，其特征是：所述偏振膜的上表面上设有一层固化的第二透光胶或透光膜。
  3. 根据权利要求2所述的发出偏振光的贴片LED灯珠，其特征是：所述第二透光胶的材质为环氧树脂﹑硅胶或UV胶；透光膜为AGAR膜。
  4. 根据权利要求1或2所述的发出偏振光的贴片LED灯珠，其特征是：当所述LED发光晶片为正装晶片时，N个LED发光晶片通过导电胶或绝缘胶固定在贴片LED灯珠支架的内底面上，N个LED发光晶片和贴片LED灯珠支架的内底面之间连接有导线，导线位于偏振膜的下方；
    当所述LED发光晶片为倒装晶片时，N个LED发光晶片焊接在贴片LED灯珠支架的内底上。
  5. 根据权利要求1或2所述的发出偏振光的贴片LED灯珠，其特征是：所述N为1～3；第一透光胶的材质为环氧树脂或硅胶；偏振膜为左旋偏振膜﹑右旋偏振膜或线偏振膜；偏振膜位于贴片LED灯珠支架内部或外部。
  6. 一种权利要求1所述发出偏振光的贴片LED灯珠的批量制作方法，其特征是：含有下列步骤：
    步骤1﹑在贴片LED灯珠支架矩阵中的每个贴片LED灯珠支架内底面上安装N个LED发光晶片，并使N个LED发光晶片的电极与贴片LED灯珠支架内底面上的导电区域连接在一起，形成电通路，N为大于等于1的自然数；贴片LED灯珠支架矩阵中的各贴片LED灯珠支架相互连接在一起，且每个贴片LED灯珠支架上都设有识别方向的标记；
    步骤2﹑对步骤1形成的半成品进行预热；
    步骤3﹑使用点胶机向每个贴片LED灯珠支架内填充第一透光胶，使N个LED发光晶片都浸没在第一透光胶中，并使第一透光胶的表面水平；
    步骤4﹑对步骤3形成的半成品进行烘烤，使每个贴片LED灯珠支架内填充的第一透光胶固化；
    步骤5﹑使用贴片机一一提取偏振膜矩阵中的每个小块偏振膜，并粘贴在每个贴片LED灯珠支架内的第一透光胶的表面，形成第一透光胶表面的偏振膜；
    偏振膜矩阵采用带有第一底膜的整张偏振膜制作而成，整张偏振膜通过其下表面的粘胶与第一底膜粘贴在一起，偏振膜矩阵的制作方法为：将带有第一底膜的整张偏振膜放入裁切机中，按照预先设定的程序将整张偏振膜裁成行列整齐排列的小块偏振膜，形成偏振膜矩阵，偏振膜矩阵中的每个小块偏振膜的形状和尺寸与贴片LED灯珠支架的形状和尺寸匹配，第一底膜没有被裁切，偏振膜矩阵粘贴在第一底膜的上表面上；
    步骤6﹑将各贴片LED灯珠支架分离，形成一个个独立的贴片LED灯珠；
    步骤7﹑采用分光机将贴片LED灯珠分成不同类型；
    步骤8﹑采用编带机将不同类型的贴片LED灯珠分别编带。
  7. 根据权利要求6所述的批量制作方法，其特征是：所述步骤5中，第一底膜为扩张膜，偏振膜矩阵制作好后，再采用扩张机将扩张膜均匀扩张，使附着在扩张膜表面紧密排列的小块偏振膜均匀分开。
  8. 根据权利要求6所述的批量制作方法，其特征是：在所述步骤5和步骤6之间增加以下操作：使用点胶机向每个贴片LED灯珠支架内的偏振膜上覆盖一层第二透光胶，然后进行烘烤或紫外线照射，使每个贴片LED灯珠支架内的第二透光胶固化。
  9. 根据权利要求6所述的批量制作方法，其特征是：在所述步骤5和步骤6之间增加以下操作：使用贴片机一一提取透光膜矩阵中的每个小块透光膜，并粘贴在每个贴片LED灯珠支架上的偏振膜上，形成偏振膜表面的透光膜；
    透光膜矩阵采用带有第二底膜的整张透光膜制作而成，整张透光膜通过其下表面的粘胶与第二底膜粘贴在一起，透光膜矩阵的制作方法为：将带有第二底膜的整张透光膜放入裁切机中，按照预先设定的程序将整张透光膜裁成行列整齐排列的小块透光膜，形成透光膜矩阵，透光膜矩阵中的每个小块透光膜的形状和尺寸与贴片LED灯珠支架的形状和尺寸匹配，第二底膜没有被裁切，透光膜矩阵粘贴在第二底膜的上表面上。
  10. 根据权利要求6所述的批量制作方法，其特征是：当LED发光晶片为正装晶片时，所述步骤1的具体方法为：
    步骤1.1﹑先进行准备工作，准备工作中含有扩晶﹑清洗和烘烤﹑回温；
    扩晶：采用扩晶机将LED发光晶片薄膜均匀扩张，使附着在LED发光晶片薄膜表面紧密排列的LED发光晶片均匀分开；
    清洗和烘烤：使用电浆清洗机对贴片LED灯珠支架矩阵进行电浆清洗，将贴片LED灯珠支架矩阵表面残留的有机物去除，然后对贴片LED灯珠支架矩阵进行烘烤，将贴片LED灯珠支架矩阵表面的水汽去除；
    回温：将放在冰箱中冷藏保存的导电胶或绝缘胶取出，静态放置于空气中回复到室温；
    步骤1.2﹑固晶：采用固晶机将LED发光晶片薄膜上的LED发光晶片通过导电胶或绝缘胶固定在贴片LED灯珠支架矩阵中的每个贴片LED灯珠支架内底面上的指定位置上；
    步骤1.3﹑固晶烘烤：烘烤步骤1.2形成的半成品，将导电胶或绝缘胶烘烤干，使LED发光晶片和贴片LED灯珠支架之间形成良好的粘接；
    步骤1.4﹑采用焊线机在每个贴片LED灯珠支架内焊接导线，将N个LED发光晶片的电极与贴片LED灯珠支架内底面上的导电区域连接在一起，形成电通路；
    当LED发光晶片为倒装晶片时，步骤1的具体方法为：N个LED发光晶片直接焊接在贴片LED灯珠支架的内底面上，N个LED发光晶片的电极与贴片LED灯珠支架内底面上的导电区域焊接在一起，形成电通路；
    步骤3中，导线也浸没在第一透光胶中；
    步骤6执行之前，先采用LED测试机对贴片LED灯珠进行功能检查和测试；
    步骤6通过刀模或者冲床来完成；
    步骤8完成后，采用真空包装机将完成编带的贴片LED灯珠进行真空封装；
    裁切机为激光裁切机或机械裁切机；
    第一透光胶的材质为环氧树脂或硅胶，偏振膜为左旋偏振膜﹑右旋偏振膜或线偏振膜；
    N为1～3。
  11. 一种权利要求2所述发出偏振光的贴片LED灯珠的批量制作方法，其特征是：含有下列步骤：
    步骤21﹑在贴片LED灯珠支架矩阵中的每个贴片LED灯珠支架内底面上安装N个LED发光晶片，并使N个LED发光晶片的电极与贴片LED灯珠支架内底面上的导电区域连接在一起，形成电通路，N为大于等于1的自然数；贴片LED灯珠支架矩阵中的各贴片LED灯珠支架相互连接在一起，且每个贴片LED灯珠支架上都设有识别方向的标记；
    步骤22﹑对步骤21形成的半成品进行预热；
    步骤23﹑使用点胶机向每个贴片LED灯珠支架内填充第一透光胶，使N个LED发光晶片都浸没在第一透光胶中，并使第一透光胶的表面水平；
    步骤24﹑使用贴片机将编带偏振膜中的每个小块偏振膜放置在每个贴片LED灯珠支架内的第一透光胶的表面，形成第一透光胶表面的偏振膜，第一透光胶的表面高度使偏振膜位于贴片LED灯珠支架内部；
    编带偏振膜的制作方法为：将正﹑反两面均不含粘胶的整张偏振膜放入裁切机中，按照预先设定的程序将整张偏振膜裁成一个个大小相同的小块偏振膜，每个小块偏振膜的形状和尺寸与贴片LED灯珠支架的形状和尺寸匹配，每个小块偏振膜上均裁切有识别方向的方向标记，然后用编带机将所有小块偏振膜编带，形成编带偏振膜；
    步骤25﹑使用点胶机向每个贴片LED灯珠支架内的偏振膜上覆盖一层第二透光胶，然后进行烘烤或紫外线照射，使每个贴片LED灯珠支架内的第二透光胶固化；
    步骤26﹑将各贴片LED灯珠支架分离，形成一个个独立的贴片LED灯珠；
    步骤27﹑采用分光机将贴片LED灯珠分成不同类型；
    步骤28﹑采用编带机将不同类型的贴片LED灯珠分别编带。
  12. 根据权利要求11所述的批量制作方法，其特征是：当LED发光晶片为正装晶片时，所述步骤21的具体方法为：
    步骤21.1﹑先进行准备工作，准备工作中含有扩晶﹑清洗和烘烤﹑回温；
    扩晶：采用扩晶机将LED发光晶片薄膜均匀扩张，使附着在LED发光晶片薄膜表面紧密排列的LED发光晶片均匀分开；
    清洗和烘烤：使用电浆清洗机对贴片LED灯珠支架矩阵进行电浆清洗，将贴片LED灯珠支架矩阵表面残留的有机物去除，然后对贴片LED灯珠支架矩阵进行烘烤，将贴片LED灯珠支架矩阵表面的水汽去除；
    回温：将放在冰箱中冷藏保存的导电胶或绝缘胶取出，静态放置于空气中回复到室温；
    步骤21.2﹑固晶：采用固晶机将LED发光晶片薄膜上的LED发光晶片通过导电胶或绝缘胶固定在贴片LED灯珠支架矩阵中的每个贴片LED灯珠支架内底面上的指定位置上；
    步骤21.3﹑固晶烘烤：烘烤步骤21.2形成的半成品，将导电胶或绝缘胶烘烤干，使LED发光晶片和贴片LED灯珠支架之间形成良好的粘接；
    步骤21.4﹑采用焊线机在每个贴片LED灯珠支架内焊接导线，将N个LED发光晶片的电极与贴片LED灯珠支架内底面上的导电区域连接在一起，形成电通路；
    当LED发光晶片为倒装晶片时，步骤21的具体方法为：N个LED发光晶片直接焊接在贴片LED灯珠支架的内底面上，N个LED发光晶片的电极与贴片LED灯珠支架内底面上的导电区域焊接在一起，形成电通路；
    步骤23中，导线也浸没在第一透光胶中；
    步骤24中，小块偏振膜上的方向标记为通孔或/和缺口；
    步骤26执行之前，先采用LED测试机对贴片LED灯珠进行功能检查和测试；
    步骤26通过刀模或者冲床来完成；
    步骤28完成后，采用真空包装机将完成编带的贴片LED灯珠进行真空封装；
    裁切机为激光裁切机或机械裁切机；
    第一透光胶的材质为环氧树脂或硅胶，偏振膜为左旋偏振膜﹑右旋偏振膜或线偏振膜；第一透光胶自然固化；
    第二透光胶的材质为环氧树脂﹑硅胶或UV胶；环氧树脂和硅胶通过烘烤固化，UV胶通过紫外线照射固化；
    N为1～3。
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