CN101629705A - 发光二极管元件的封装结构及其制造方法 - Google Patents
发光二极管元件的封装结构及其制造方法 Download PDFInfo
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- CN101629705A CN101629705A CN200810135793A CN200810135793A CN101629705A CN 101629705 A CN101629705 A CN 101629705A CN 200810135793 A CN200810135793 A CN 200810135793A CN 200810135793 A CN200810135793 A CN 200810135793A CN 101629705 A CN101629705 A CN 101629705A
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Cited By (10)
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CN102412345A (zh) * | 2010-09-23 | 2012-04-11 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及其制造方法 |
CN102447040A (zh) * | 2010-10-14 | 2012-05-09 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及其制造方法 |
CN102997105A (zh) * | 2011-03-18 | 2013-03-27 | 3M创新有限公司 | Led台灯 |
CN103035828A (zh) * | 2011-09-30 | 2013-04-10 | 展晶科技(深圳)有限公司 | Led封装结构 |
CN103050583A (zh) * | 2011-10-14 | 2013-04-17 | 展晶科技(深圳)有限公司 | 发光二极管的封装方法 |
CN103682046A (zh) * | 2013-12-23 | 2014-03-26 | 中山市秉一电子科技有限公司 | 一种led用陶瓷基板 |
CN103730567A (zh) * | 2012-10-12 | 2014-04-16 | 清华大学 | 一种led器件及其制备方法 |
CN110085525A (zh) * | 2014-06-08 | 2019-08-02 | 联测总部私人有限公司 | 半导体封装和封装半导体装置的方法 |
CN110098179A (zh) * | 2019-06-11 | 2019-08-06 | 郑州胜龙信息技术股份有限公司 | 发出偏振光的贴片led灯珠及其批量制作方法 |
CN110856355A (zh) * | 2019-10-08 | 2020-02-28 | 湖南维胜科技电路板有限公司 | 一种具有高散热性能的led电路板制作方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2002170997A (ja) * | 2000-09-21 | 2002-06-14 | Rohm Co Ltd | 保護素子付半導体発光装置 |
KR100962650B1 (ko) * | 2003-03-05 | 2010-06-11 | 삼성전자주식회사 | 광학시트 및 이를 사용하는 액정표시장치 |
KR100518408B1 (ko) * | 2003-08-22 | 2005-09-29 | 엘지.필립스 엘시디 주식회사 | 듀얼 프론트 라이트를 이용한 듀얼 액정표시장치 |
CN2828876Y (zh) * | 2004-12-08 | 2006-10-18 | 哈尔滨电影机械厂 | 偏振光光电耦合器 |
US20060187650A1 (en) * | 2005-02-24 | 2006-08-24 | 3M Innovative Properties Company | Direct lit backlight with light recycling and source polarizers |
CN1956231A (zh) * | 2005-10-28 | 2007-05-02 | 财团法人工业技术研究院 | 偏极化发光元件 |
JP2008122618A (ja) * | 2006-11-10 | 2008-05-29 | Ricoh Co Ltd | 偏光光源ユニット |
-
2008
- 2008-07-14 CN CN2008101357932A patent/CN101629705B/zh not_active Expired - Fee Related
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102412345A (zh) * | 2010-09-23 | 2012-04-11 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及其制造方法 |
CN102447040A (zh) * | 2010-10-14 | 2012-05-09 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及其制造方法 |
CN102997105A (zh) * | 2011-03-18 | 2013-03-27 | 3M创新有限公司 | Led台灯 |
CN103035828A (zh) * | 2011-09-30 | 2013-04-10 | 展晶科技(深圳)有限公司 | Led封装结构 |
CN103050583A (zh) * | 2011-10-14 | 2013-04-17 | 展晶科技(深圳)有限公司 | 发光二极管的封装方法 |
CN103730567A (zh) * | 2012-10-12 | 2014-04-16 | 清华大学 | 一种led器件及其制备方法 |
CN103682046A (zh) * | 2013-12-23 | 2014-03-26 | 中山市秉一电子科技有限公司 | 一种led用陶瓷基板 |
CN103682046B (zh) * | 2013-12-23 | 2017-12-29 | 广州市鸿利秉一光电科技有限公司 | 一种led用陶瓷基板 |
CN110085525A (zh) * | 2014-06-08 | 2019-08-02 | 联测总部私人有限公司 | 半导体封装和封装半导体装置的方法 |
CN110098179A (zh) * | 2019-06-11 | 2019-08-06 | 郑州胜龙信息技术股份有限公司 | 发出偏振光的贴片led灯珠及其批量制作方法 |
WO2020248470A1 (zh) * | 2019-06-11 | 2020-12-17 | 郑州胜龙信息技术股份有限公司 | 发出偏振光的贴片led灯珠及其批量制作方法 |
CN110098179B (zh) * | 2019-06-11 | 2024-04-26 | 郑州胜龙信息技术股份有限公司 | 发出偏振光的贴片led灯珠及其批量制作方法 |
CN110856355A (zh) * | 2019-10-08 | 2020-02-28 | 湖南维胜科技电路板有限公司 | 一种具有高散热性能的led电路板制作方法 |
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CN101629705B (zh) | 2011-05-18 |
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