WO2020238417A1 - 壳体、壳体组件和电子设备 - Google Patents

壳体、壳体组件和电子设备 Download PDF

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Publication number
WO2020238417A1
WO2020238417A1 PCT/CN2020/083529 CN2020083529W WO2020238417A1 WO 2020238417 A1 WO2020238417 A1 WO 2020238417A1 CN 2020083529 W CN2020083529 W CN 2020083529W WO 2020238417 A1 WO2020238417 A1 WO 2020238417A1
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WO
WIPO (PCT)
Prior art keywords
housing
metal layer
metal
band gap
gap structure
Prior art date
Application number
PCT/CN2020/083529
Other languages
English (en)
French (fr)
Inventor
杨帆
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2020238417A1 publication Critical patent/WO2020238417A1/zh

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering

Definitions

  • This application relates to the field of electronic technology, and in particular to a housing, a housing assembly and an electronic device.
  • the shell structure of the folding screen electronic device can rotate around a rotation axis, and the flexible screen provided on the shell structure can be bent and folded to realize the electronic device in Use in the folded state and open state.
  • the folding screen electronic device can control the radiator to transmit signals through its main board.
  • the folding screen electronic device has the problem of low signal transmission efficiency of the radiator.
  • the embodiments of the present application provide a housing, a housing assembly, and an electronic device, which can improve the efficiency of signal transmission by the electronic device.
  • an embodiment of the present application provides a housing, which includes an electromagnetic band gap structure, and the electromagnetic band gap structure includes:
  • a plurality of metal sheets arranged on the dielectric layer at intervals, the plurality of metal sheets, the dielectric layer, and the metal layer are stacked in sequence, and each of the metal sheets is electrically connected to the metal layer;
  • the first non-metal layer is connected to the dielectric layer, and the first non-metal layer limits the plurality of metal sheets between the dielectric layer and the first non-metal layer.
  • an embodiment of the present application provides a housing assembly, which includes:
  • the first housing includes a first surface and a second surface disposed opposite to each other;
  • the second housing includes a third surface and a fourth surface disposed opposite to each other;
  • a rotating shaft, the rotating shaft is respectively connected with the first housing and the second housing, and the second housing and the first housing are rotatable relative to the rotating shaft to realize a folded state and an open state;
  • the first surface and the third surface are located between the first housing and the second housing, and the first housing At least one of one surface and the third surface is provided with an electromagnetic band gap structure.
  • an embodiment of the present application also provides an electronic device, which includes:
  • the first housing includes a first surface and a second surface disposed opposite to each other;
  • the second housing includes a third surface and a fourth surface disposed opposite to each other;
  • a rotating shaft, the rotating shaft is respectively connected with the first housing and the second housing, and the second housing and the first housing are rotatable relative to the rotating shaft to realize a folded state and an open state;
  • the first surface and the third surface are located between the first housing and the second housing, and the first housing At least one of one surface and the third surface is provided with an electromagnetic band gap structure.
  • FIG. 1 is a schematic diagram of a first structure of an electronic device provided by an embodiment of the application.
  • FIG. 2 is a schematic diagram of a second structure of an electronic device provided by an embodiment of the application.
  • FIG. 3 is a schematic diagram of a third structure of an electronic device provided by an embodiment of the application.
  • Fig. 4 is a first cross-sectional view of the electromagnetic band gap structure shown in Fig. 3 along the P-P direction.
  • FIG. 5 is a comparison diagram of electric field distribution and radiation efficiency of the electronic device provided in an embodiment of the application in a folded state without an electromagnetic band gap structure and an electromagnetic band gap structure.
  • Fig. 6 is a second cross-sectional view of the electromagnetic band gap structure shown in Fig. 3 along the P-P direction.
  • FIG. 7 is a schematic structural diagram of the electromagnetic band gap structure in the electronic device shown in FIG. 3.
  • Fig. 8 is a third cross-sectional view of the electromagnetic band gap structure shown in Fig. 3 along the P-P direction.
  • Fig. 9 is a fourth cross-sectional view of the electromagnetic band gap structure shown in Fig. 3 along the P-P direction.
  • FIG. 10 is a schematic diagram of a fourth structure of an electronic device provided by an embodiment of the application.
  • FIG. 11 is a cross-sectional view of an electronic device in a folded state according to an embodiment of the application.
  • FIG. 1 is a schematic diagram of a first structure of an electronic device according to an embodiment of the application.
  • An electronic device such as the electronic device 20 of FIG. 1 may include a first housing such as the first housing 100, a second housing such as the second housing 200, a rotating shaft such as the rotating shaft 300, and a display screen such as the display screen 500.
  • the first housing 100 may be formed of plastic, glass, ceramic, fiber composite material, metal (for example, stainless steel, aluminum, etc.), other suitable materials, or a combination of any two or more of these materials.
  • the first housing 100 may be formed using an integral configuration in which some or all of the first housing 100 is processed or molded into a single structure, or multiple structures (for example, inner frame structure, forming One or more structures on the outer shell surface, etc.) are formed.
  • the first housing 100 includes a first surface and a second surface 120 disposed opposite to each other.
  • the first housing 100 may have a plurality of sides, such as a first side, a second side, a third side, and a fourth side.
  • the first side, the second side, the third side and the fourth side can be connected in sequence.
  • the first side and the third side can be arranged oppositely, the second side and the fourth side can be arranged oppositely, the second side can be connected between the first side and the third side, and the fourth side can be connected Between the first side and the third side.
  • the shapes of the first side, the second side, the third side, and the fourth side can be elongated, arced, wavy, etc. structures.
  • the shapes of the first side, the second side, the third side, and the fourth side may be the same or different, or some of the sides may have the same shape.
  • the dimensions of the first side, the second side, the third side and the fourth side can be equal or unequal, or two or three of them can be equal.
  • the length of the first side is equal to the third
  • the length of the side and the length of the second side are equal to the length of the fourth side.
  • the structure of the first housing 100 is not limited to this.
  • the first housing 100 has three sides connected in sequence, and for example, the first housing 100 has five sides connected in sequence. It is understandable Yes, the sides of the first housing 100 are not limited to this.
  • first side, the second side and the third side can all be provided with a radiator.
  • the fourth side can be connected to the rotating shaft 300, the first housing 100 and the rotating shaft 300 can be connected by a pin, and the first housing 100 and the rotating shaft 300 can also be connected by a hinge.
  • first housing 100 and the rotating shaft 300 may also be connected in other rotatable ways.
  • the rotating shaft 300 is connected between the first housing 100 and the second housing 200.
  • the rotating shaft 300 may be made of metal materials, and the rotating shaft 300 may also be made of plastic materials.
  • the rotating shaft 300 may have a cylindrical structure, and the rotating shaft 300 may also have other structures.
  • the second housing 200 may be formed of plastic, glass, ceramic, fiber composite material, metal (for example, stainless steel, aluminum, etc.), other suitable materials, or a combination of any two or more of these materials.
  • the second housing 200 may be formed using a one-piece configuration in which some or all of the second housing 200 is processed or molded into a single structure, or multiple structures (eg, inner frame structure, forming One or more structures on the outer shell surface, etc.) are formed.
  • the second housing 200 may include a third surface and a fourth surface 220 disposed opposite to each other.
  • the second housing 200 may have multiple sides, such as a fifth side, a sixth side, a seventh side, and an eighth side.
  • the fifth side, the sixth side, the seventh side and the eighth side can be connected in sequence.
  • the fifth side and the seventh side can be opposite to each other, the sixth side and the eighth side can be opposite to each other, the sixth side can be connected between the fifth side and the seventh side, and the eighth side can be connected Between the fifth side and the seventh side.
  • the shape of the fifth side, the sixth side, the seventh side, and the eighth side may be a long strip, an arc, a wave, and the like.
  • the shapes of the fifth side, the sixth side, the seventh side, and the eighth side may be the same or different, and part of the sides may have the same shape.
  • the dimensions of the fifth side, the sixth side, the seventh side, and the eighth side can be equal or unequal, or two or three of them can be equal.
  • the length of the fifth side is equal to the seventh
  • the length of the side and the length of the sixth side are equal to the length of the eighth side.
  • the structure of the second housing 200 is not limited to this.
  • the second housing 200 has three sides connected in sequence, and for example, the second housing 200 has five sides connected in sequence. It is understandable Yes, the side of the second housing 200 is not limited to this.
  • the fifth side, the sixth side and the seventh side can all be provided with radiators.
  • the eighth side can be connected to the rotating shaft 300, the second housing 200 and the rotating shaft 300 can be connected by a pin, and the second housing 200 and the rotating shaft 300 can also be connected by a hinge. It should be noted that the second housing 200 and the rotating shaft 300 can also be connected in other rotatable ways.
  • first housing 100 and the second housing 200 can form different states during the rotation around the rotating shaft 300.
  • first housing 100 and the second housing 200 are in an open state.
  • the open state means that the first housing 100 and the second housing 200 are arranged side by side with each other, and the first housing 100 and the second housing There is no overlap between the bodies 200, and the first housing 100 and the second housing 200 are respectively located on both sides of the rotating shaft 300.
  • FIG. 2 is a schematic diagram of a second structure of an electronic device provided by an embodiment of the application.
  • FIG. 2 shows a state where the first housing 100 and the second housing 200 are folded with each other.
  • the first housing 100 and the second housing 200 form a folded state, which indicates that the first housing 100 and the second housing 200 are stacked together, and the first housing 100 and the second housing 200 overlap each other.
  • the first housing 100 and the second housing 200 may completely overlap, and the first housing 100 and the second housing 200 may also partially overlap.
  • the first side and the fifth side can overlap
  • the second side and the sixth side can overlap
  • the third side and the seventh side can overlap
  • the fourth side and the eighth side can overlap.
  • first housing 100 and the sides of the second housing 200 may not overlap. It should be noted that, in FIG. 2, the first housing 100 and the second housing 200 are mutually rotated by the rotating shaft 300 to form a folded state, and the first housing 100 covers the second housing 200.
  • the shapes of the first housing 100 and the second housing 200 can be set to be the same, for example, the first housing 100 and the second housing 200 are both rectangular parallelepiped structures. It should be noted that the shapes of the first housing 100 and the second housing 200 can also be set differently. Wherein, the sizes of the first housing 100 and the second housing 200 can be set to be the same or different. The size of the first housing 100 may be set larger than the size of the second housing 200, or the size of the first housing 100 may be set smaller than the size of the second housing 200.
  • first housing 100 and the second housing 200 are connected by the rotating shaft 300 to form a housing assembly.
  • the electronic device 20 may further include a display screen such as a display screen 500.
  • the display screen 500 can be electrically connected to the circuit board 600.
  • the display screen 500 may be a touch screen display incorporating a conductive capacitive touch sensor electrode layer or other touch sensor components (for example, resistive touch sensor components, acoustic touch sensor components, force-based touch sensor components, light-based touch sensor components, etc.) , Or it can be a non-touch sensitive display.
  • Capacitive touch screen electrodes can be formed by indium tin oxide pads or arrays of other transparent conductive structures.
  • the display screen 500 may include a display pixel array formed by liquid crystal display (LCD) components, an electrophoretic display pixel array, a plasma display pixel array, an organic light emitting diode display pixel array, an electrowetting display pixel array, or a display based on other display technologies Pixels.
  • LCD liquid crystal display
  • electrophoretic display pixel array a plasma display pixel array
  • organic light emitting diode display pixel array a plasma display pixel array
  • electrowetting display pixel array or a display based on other display technologies Pixels.
  • a display screen cover layer such as a transparent glass layer, light-transmitting plastic, sapphire, or other transparent dielectric layer may be used to protect the display screen 500.
  • the display screen 500 may include a first display part 510, a second display part 520, and a connection display part 530.
  • the first display portion 510 and the second display portion 520 are connected by a connecting display portion 530, the first display portion 510, the second display portion 520, and the connecting display portion 530 may be an integrated structure, the first display portion 510, the second display portion 520
  • the connection display unit 530 can display images, texts and other information together to form the display surface of the electronic device 20.
  • the display screen 500 may be a flexible screen, and the connection display part 530 may be a flexible structure.
  • the connecting display portion 530 may be deformed, and the connecting display portion 530 may be folded, so that the positions of the first display portion 510 and the second display portion 520 are changed.
  • the first display portion 510 may be disposed on one side of the first housing 100, such as the second side 120.
  • the first display portion 510 may cover a partial area of one side of the first housing 100, and a non-display area of the electronic device 20 may be formed on the first housing 100, and the radiator of the electronic device 20 may be arranged in the non-display area .
  • the first display portion 510 may also cover the entire area of one side of the first housing 100 to realize full-screen display on one side of the first housing 100.
  • the first display part 510 may move following the movement of the first housing 100.
  • the second display portion 520 may be provided on one side of the second housing 200, such as the fourth side 220.
  • the second display portion 520 may cover a partial area of one side of the second housing 200, and a non-display area of the electronic device 20 may be formed on the second housing 200, and the radiator of the electronic device 20 may be arranged in the non-display area .
  • the second display portion 520 may also cover the entire area of one side of the second housing 200 to realize full-screen display on one side of the second housing 200.
  • the second display part 520 may move following the movement of the second housing 200.
  • the first display portion 510 and the second display portion 520 may be located on the same surface to jointly display images and jointly form a display surface.
  • the display screen 500 is located on the outer surface of the electronic device 20.
  • connection display part 530 may cover the outer surface of the rotating shaft 300.
  • first housing 100 and the second housing 200 of the electronic device 20 are in a folded state, a cavity is formed between the first housing 100 and the second housing 200, and the first housing 100 and The cavity or space formed between the second housings 200 is easy to enter electromagnetic waves, and the electromagnetic waves will affect the signals transmitted by the radiator of the electronic device 20.
  • an electromagnetic band gap structure is provided between the first housing 100 and the second housing 200, so that the electromagnetic band gap structure can be used when the first housing 100 and the second housing 200 are in a folded state.
  • the electromagnetic waves are prevented from entering the cavity formed by the folding of the first housing 100 and the second housing 200.
  • FIG. 3 is a schematic diagram of a third structure of an electronic device according to an embodiment of the application.
  • the electronic device 20 may also include an electromagnetic band gap structure such as the electromagnetic band gap structure 400.
  • the electromagnetic band gap structure 400 may be disposed on the first surface 110 of the first housing 100. It should be noted that the electromagnetic band gap structure 400 may also be provided on the second housing 200, such as on the third surface 210 of the second housing 200.
  • the electromagnetic band gap structure 400 is used to prevent electromagnetic waves from entering the cavity formed by the folding of the first housing 100 and the second housing 200 when the first housing 100 and the second housing 200 are in a folded state.
  • the electromagnetic band gap structure 400 may include a metal layer 410, a dielectric member 420, a plurality of metal sheets 430, and a plurality of conductive members 440.
  • the metal layer 410 may serve as a carrier for the dielectric layer 420, the plurality of metal sheets 430, and the plurality of conductive members.
  • the metal layer 410 may be connected to the first surface 110 of the first housing 100.
  • the metal layer 410 may be fixedly connected to the battery cover of the first housing 100, and the battery cover of the first housing 100 may be a plastic material. It can be understood that the metal layer 410 can directly serve as the battery cover of the first housing 100.
  • the metal layer 410 may be connected to the third surface 210 of the second housing 200, such as the metal layer 410 and the battery of the second housing 200
  • the cover is fixedly connected, and the battery cover of the second housing 200 may be a plastic material. It can be understood that the metal layer can also serve as the battery cover of the second housing 200.
  • the dielectric layer 420 is connected to the metal layer 410.
  • the dielectric layer 420 is disposed on the metal layer 410, and the metal layer 410 is located between the dielectric layer 420 and the first housing 100.
  • the dielectric layer 420 is made of non-metallic materials, such as plastic.
  • a plurality of connecting holes 421 may be provided on the dielectric layer 420, and the connecting holes 421 are arranged at intervals, such as evenly arranged. Each connection hole 421 penetrates the dielectric layer 420 in the thickness direction of the dielectric layer 420.
  • the connecting hole 421 is used to place a conductive element 440, a conductive element 440 is placed in a connecting hole 421, and the conductive element 440 is used to connect the metal layer 410 and the metal sheet 430.
  • the conductive member 440 is made of conductive material.
  • the conductive member 440 is made of a metal material, which may be metal such as aluminum or copper.
  • the metal sheets 430 are disposed on the dielectric layer 420, and a plurality of metal sheets 430 are arranged on the dielectric layer 420 at intervals, and the plurality of metal sheets 430 may be arranged on the dielectric layer 420 at even intervals. For example, a plurality of metal sheets 430 are arranged periodically, and may be arranged in an array. A gap such as a gap 470 is formed between the respective metal sheets 430.
  • the dielectric layer 420 is located between the metal sheet 430 and the metal layer 410.
  • Each metal sheet 430 is provided at a position corresponding to a connecting hole 421, and a conductive member 440 connects a metal sheet 430 to the metal layer 410, thereby forming an electromagnetic band gap structure 400.
  • the metal sheet 430 may be circular, rectangular or other shapes.
  • the metal sheet 430 can also have an elliptical structure, and the elliptical structure can obtain different obstruction effects in two directions to obstruct the frequency band and amplitude.
  • electromagnetic band gap structure 400 can also be directly embedded in the back cover of the non-metallic material or the battery cover of the first housing 100, or the electromagnetic band gap structure 400 can be provided outside the first housing 100. surface.
  • FIG. 5 is a comparison diagram of electric field distribution and radiation efficiency of the electronic device provided in an embodiment of the application in a folded state without an electromagnetic band gap structure and an electromagnetic band gap structure.
  • S1 is the electric field distribution and radiation efficiency of the electronic device 20 without the electromagnetic band gap structure in the folded state.
  • S2 is the electric field distribution and radiation efficiency of the electronic device 20 with the electromagnetic band gap structure 400 in the folded state.
  • the metal between the first housing 100 and the second housing 200 will generate an electric field such as a longitudinal electric field, which will face the first
  • the position propagation between a housing 100 and a second housing 200 depending on the operating frequency and the size of the cavity between the first housing 100 and the second housing 200, the part that enters the cavity will have different degrees of attenuation , Resulting in a drop in efficiency.
  • the electromagnetic band gap structure 400 disposed between the first housing 100 and the second housing 200 at the cavity position can effectively prevent electromagnetic waves from entering the cavity, so as to improve the signal transmission efficiency of the radiator of the electronic device 20.
  • FIG. 5 shows that when the electronic device 20 is provided with the electromagnetic band gap structure 400, the transmission efficiency of medium and high frequency signals can be increased by about 5 dB, and the transmission efficiency of low frequency signals can be increased by about 1 dB.
  • the structure of the electromagnetic band gap structure 400 is not limited to this.
  • FIG. 6 is a second cross-sectional view of the electromagnetic band gap structure shown in FIG. 3 along the P-P direction.
  • the difference between the electromagnetic band gap structure 400 shown in FIG. 6 and the electromagnetic band gap structure shown in FIG. 4 is that each metal sheet 430 in the electromagnetic band gap structure 400 shown in FIG. 6 can be provided with a through hole 431.
  • FIG. 7 is a schematic structural diagram of the electromagnetic band gap structure in the electronic device shown in FIG. 3.
  • the through hole 431 may communicate with the connecting hole 421, and the conductive member 440 may also be disposed in the through hole 431, so that the metal sheet 430 and the metal layer 410 are connected through the through hole 431 and the connecting hole 421.
  • the through hole 431 may be located at the center of the metal sheet 430 or may be located at other positions of the metal sheet 430.
  • the provision of the through hole 431 facilitates the connection between the metal sheet 430 and the metal layer 410 during processing.
  • FIG. 8 is a third cross-sectional view of the electromagnetic band gap structure shown in FIG. 3 along the P-P direction.
  • the electromagnetic band gap structure 400 may further include a first non-metal layer 450, and the first non-metal layer 450 may be disposed on the plurality of metal sheets 430 to limit the plurality of metal sheets 430 between the first non-metal layer 450 and the dielectric layer. Between 420.
  • the first non-metallic layer 450 uses a non-metallic material, such as glass.
  • the first non-metallic layer 450 can also be made of other non-metallic materials, such as plastic.
  • FIG. 9 is a fourth cross-sectional view of the electromagnetic band gap structure shown in FIG. 3 along the P-P direction.
  • the electromagnetic band gap structure 400 may further include a second non-metal layer 460, and the second non-metal layer 460 may be connected to the metal layer 410, and the metal layer 410 is located between the second non-metal layer 460 and the dielectric layer 420.
  • the second non-metal layer 460 may be connected to the first surface 110 of the first casing 100, such as the second non-metal layer 460 is connected to the battery cover of the first casing 100.
  • the second non-metallic layer 460 can also be embedded in the battery cover of the first housing 100, or the second non-metallic layer 460 can be used as the battery cover of the first housing 100.
  • the second non-metal layer 460 uses a non-metal material, such as glass.
  • the second non-metal layer 460 can also be made of other non-metal materials, such as plastic.
  • the manner in which the electronic device 20 configures the electromagnetic band gap structure 400 is not limited to this.
  • the first housing 100 is provided with an electromagnetic band gap structure
  • the second housing 200 is also provided with an electromagnetic band gap structure.
  • the electromagnetic band gap structure 400 in the electronic device 20 may include a first electromagnetic band gap structure 401 and a second electromagnetic band gap structure 402.
  • the first electromagnetic band gap structure 401 is disposed on the first surface 110 of the first housing 100
  • the second electromagnetic band gap structure 402 is disposed on the third surface 210 of the second housing 200.
  • the first electromagnetic band gap structure 401 and the second electromagnetic band gap structure 402 can jointly prevent the electromagnetic wave signal from propagating toward the cavity formed by the folding of the first housing 100 and the second housing 200.
  • FIG. 11 is a cross-sectional view of the electronic device in a folded state according to an embodiment of the application.
  • FIG. 11 may be a cross-sectional view of the electronic device 20 shown in FIG. 10 being switched from the opened state to the folded state.
  • the electronic device 20 may further include a first back cover 101 and a second back cover 201, the first back cover 101 may be connected to the first housing 100, and the first back cover 101 may be disposed on the first surface 110 of the first housing 100 .
  • the second back cover 102 may be connected to the second housing 200, and the second back cover 201 may be disposed on the third surface 210 of the second housing 200.
  • the first electromagnetic band gap structure 401 may be disposed on the first back cover 101, and the second electromagnetic band gap structure 402 may be disposed on the second back cover 201.
  • the first display portion 510, the first housing 100, the first back cover 101, and the first electromagnetic band gap structure 401 may be stacked in sequence.
  • the second display portion 520, the second housing 200, the second back cover 201, and the second electromagnetic band gap structure 402 may be stacked in sequence.
  • the electromagnetic band gap structure 400 is not limited to being provided on a housing assembly or electronic device 20 in a folded state, and the electromagnetic band gap structure 400 can also be provided on a housing or electronic device that does not have a folded state. It can also play a blocking role.
  • Example 1 A housing including an electromagnetic band gap structure, the electromagnetic band gap structure including:
  • a plurality of metal sheets arranged on the dielectric layer at intervals, the plurality of metal sheets, the dielectric layer, and the metal layer are stacked in sequence, and each of the metal sheets is electrically connected to the metal layer;
  • the first non-metal layer is connected to the dielectric layer, and the first non-metal layer limits the plurality of metal sheets between the dielectric layer and the first non-metal layer.
  • Example 2 The housing according to Example 1, wherein the electromagnetic band gap structure further includes:
  • the second non-metal layer is connected to the metal layer, and the second non-metal layer, the metal layer and the dielectric layer are stacked in sequence.
  • Example 3 The housing according to Example 1 or 2, wherein the dielectric layer is provided with a plurality of connecting holes, each of the metal sheets is provided with a through hole, the through hole is communicated with the connecting hole, and the through hole
  • the hole and the connecting hole are provided in a conductive member, and the conductive member is used to electrically connect the metal sheet and the metal layer.
  • Example 4 A housing, which includes:
  • the first housing includes a first surface and a second surface disposed opposite to each other;
  • the second housing includes a third surface and a fourth surface disposed opposite to each other;
  • a rotating shaft, the rotating shaft is respectively connected with the first housing and the second housing, and the second housing and the first housing are rotatable relative to the rotating shaft to realize a folded state and an open state;
  • the first surface and the third surface are located between the first housing and the second housing, and the first housing At least one of one surface and the third surface is provided with an electromagnetic band gap structure.
  • Example 5 The housing assembly according to Example 4, wherein the electromagnetic band gap structure includes:
  • a metal layer connected to the first surface of the first housing
  • a dielectric layer connected to the metal layer A dielectric layer connected to the metal layer
  • a plurality of metal sheets are arranged on the dielectric layer at intervals, and the plurality of metal sheets, the dielectric layer and the metal layer are stacked in sequence, and each of the metal sheets is electrically connected to the metal layer.
  • Example 6 The housing assembly according to Example 5, wherein the electromagnetic band gap structure further includes a first non-metallic layer, the first non-metallic layer is disposed on a metal sheet, and the first non-metallic layer connects the multiple A metal sheet is limited between the dielectric layer and the first non-metal layer.
  • Example 7 The housing assembly according to example 5 or 6, wherein the electromagnetic band gap structure further includes a second non-metal layer, the second non-metal layer is connected to the metal layer, and the second non-metal layer , The metal layer and the dielectric layer are stacked in sequence.
  • Example 7 The housing assembly according to at least one of Examples 5-7, wherein the dielectric layer is provided with a plurality of connecting holes, each of the metal sheets is provided with a through hole, and the through hole is connected to the connecting hole A conductive member is arranged in the through hole and the connecting hole, and the conductive member is used to electrically connect the metal sheet and the metal layer.
  • Example 9 The housing assembly according to at least one of Examples 5-8, wherein the first surface is provided with an electromagnetic band gap structure, and the third surface is not provided with an electromagnetic band gap structure.
  • Example 10 The housing assembly according to at least one of Examples 5-8, wherein both the first surface and the third surface are provided with an electromagnetic band gap structure.
  • Example 11 The housing assembly according to at least one of Examples 4-10, wherein the shape of the first housing is the same as the shape of the second housing, and the size of the first housing is the same as that of the second housing.
  • the sizes of the casings are equal, and when the first casing and the second casing are in a folded state, the first casing and the second casing overlap.
  • Example 12 An electronic device, which includes:
  • the first housing includes a first surface and a second surface disposed opposite to each other;
  • the second housing includes a third surface and a fourth surface disposed opposite to each other;
  • a rotating shaft, the rotating shaft is respectively connected with the first housing and the second housing, and the second housing and the first housing are rotatable relative to the rotating shaft to achieve a folded state and an open state;
  • the first surface and the third surface are located between the first housing and the second housing, and the first housing At least one of one surface and the third surface is provided with an electromagnetic band gap structure.
  • Example 13 The electronic device according to Example 12, wherein the electronic device further includes a display screen, and the display screen includes:
  • the first display part is arranged on the second surface
  • the second display part is arranged on the fourth side.
  • the connecting display portion is arranged at the position of the rotating shaft, the first display portion and the second display portion are connected by the connecting display portion, and the first display portion and the second display portion are foldable relative to the connecting display portion .
  • Example 14 The electronic device according to example 12 or 13, wherein the first surface is provided with an electromagnetic band gap structure, and the third surface is not provided with an electromagnetic band gap structure.
  • Example 15 The electronic device according to example 12 or 13, wherein both the first surface and the third surface are provided with an electromagnetic band gap structure.
  • Example 16 The electronic device according to at least one of Examples 12-15, wherein the electromagnetic band gap structure includes:
  • a metal layer connected to the first surface of the first housing
  • a dielectric layer connected to the metal layer A dielectric layer connected to the metal layer
  • a plurality of metal sheets are arranged on the dielectric layer at intervals, and the plurality of metal sheets, the dielectric layer and the metal layer are stacked in sequence, and each metal sheet is electrically connected to the metal layer.
  • Example 17 The electronic device according to Example 16, wherein the electromagnetic band gap structure further includes a first non-metallic layer, the first non-metallic layer is disposed on a metal sheet, and the first non-metallic layer connects the plurality of The metal sheet is limited between the dielectric layer and the first non-metal layer.
  • Example 18 The electronic device according to example 16 or 17, wherein the electromagnetic band gap structure further includes a second non-metal layer, the second non-metal layer is connected to the metal layer, and the second non-metal layer, The metal layer and the dielectric layer are stacked in sequence.
  • Example 19 The electronic device according to at least one of Examples 16-18, wherein the dielectric layer is provided with a plurality of connection holes, each of the metal sheets is provided with a through hole, and the through hole is in communication with the connection hole,
  • the through hole and the connecting hole are provided with a conductive member, and the conductive member is used to electrically connect the metal sheet and the metal layer.
  • Example 20 The electronic device according to at least one of Examples 12-19, wherein the shape of the first housing is the same as the shape of the second housing, and the size of the first housing is the same as that of the second housing The sizes of the bodies are equal, and when the first shell and the second shell are in a folded state, the first shell and the second shell overlap.

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Abstract

一种壳体、壳体组件和电子设备（20），电子设备（20）包括第一壳体（100）、第二壳体（200）和转轴（300），第一壳体（100）包括第一面（110）和第二面（120）；第二壳体（200）包括第三面（210）和第四面（220）；第二壳体（200）和第一壳体（100）可相对于转轴（300）转动以实现折叠状态和打开状态；当第一壳体（100）和第二壳体（200）处于折叠状态时，第一面（110）和第三面（210）位于第一壳体（100）和第二壳体（200）之间，第一面（110）和第三面（210）至少有一面设置有电磁带隙结构（400）。

Description

壳体、壳体组件和电子设备
本申请要求于2019年05月31日提交中国专利局、申请号为201910472204.8、申请名称为“壳体、壳体组件和电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子技术领域，特别涉及一种壳体、壳体组件和电子设备。
背景技术
随着通信技术的发展，诸如智能手机等电子设备越来越普及。电子设备的类型越来越多，对于折叠屏电子设备而言，折叠屏电子设备的壳体结构可以围绕一转轴转动，设置在壳体结构上的柔性屏可以弯曲、折叠，以实现电子设备在折叠状态下、打开状态下使用。
在折叠屏电子设备的使用过程中，折叠屏电子设备可通过其主板控制辐射体传输信号。然而，当折叠屏电子设备处于折叠状态时，折叠屏电子设备存在辐射体传输信号效率低的问题。
发明内容
本申请实施例提供一种壳体、壳体组件和电子设备，可以提高电子设备传输信号的效率。
第一方面，本申请实施例提供一种壳体，其包括电磁带隙结构，所述电磁带隙结构包括：
金属层；
介质层，与所述金属层连接；
多个金属片，间隔设置在所述介质层上，所述多个金属片、所述介质层和所述金属层依次层叠设置，每一所述金属片与所述金属层电连接；以及
第一非金属层，与所述介质层连接，所述第一非金属层将所述多个金属片限位在所述介质层和所述第一非金属层之间。
第二方面，本申请实施例提供一种壳体组件，其包括：
第一壳体，包括相背设置的第一面和第二面；
第二壳体，包括相背设置的第三面和第四面；以及
转轴，所述转轴分别与所述第一壳体、所述第二壳体连接，所述第二壳体和所述第一壳体可相对于所述转轴转动以实现折叠状态和打开状态；
当所述第一壳体和所述第二壳体处于折叠状态时，所述第一面和所述第三面位于所述第一壳体和所述第二壳体之间，所述第一面和所述第三面至少有一面设置有电磁带隙结构。
第三方面，本申请实施例还提供一种电子设备，其包括：
第一壳体，包括相背设置的第一面和第二面；
第二壳体，包括相背设置的第三面和第四面；以及
转轴，所述转轴分别与所述第一壳体、所述第二壳体连接，所述第二壳体和所述第一壳体可相对于所述转轴转动以实现折叠状态和打开状态；
当所述第一壳体和所述第二壳体处于折叠状态时，所述第一面和所述第三面位于所述第一壳体和所述第二壳体之间，所述第一面和所述第三面至少有一面设置有电磁带隙结构。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍。显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的电子设备的第一结构示意图。
图2为本申请实施例提供的电子设备的第二结构示意图。
图3为本申请实施例提供的电子设备的第三结构示意图。
图4为图3所示电磁带隙结构沿P-P方向的第一剖视图。
图5为本申请实施例提供的电子设备处于折叠状态下未设置电磁带隙结构和设置电磁带隙结构的电场分布和辐射效率对比图。
图6为图3所示电磁带隙结构沿P-P方向的第二剖视图。
图7为图3所示电子设备中电磁带隙结构的一种结构示意图。
图8为图3所示电磁带隙结构沿P-P方向的第三剖视图。
图9为图3所示电磁带隙结构沿P-P方向的第四剖视图。
图10为本申请实施例提供的电子设备的第四结构示意图。
图11为本申请实施例提供的电子设备处于折叠状态的剖视图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有付出创造性劳动前提下所获得的所有其他实施例，都属于本申请的保护范围。
请参阅图1，图1为本申请实施例提供的电子设备的第一结构示意图。电子设备诸如图1的电子设备20可包括第一壳体诸如第一壳体100、第二壳体诸如第二壳体200、转轴诸如转轴300以及显示屏诸如显示屏500。
第一壳体100可由塑料、玻璃、陶瓷、纤维复合材料、金属(例如，不锈钢、铝等)、其他合适的材料、或这些材料的任意两种或更多种的组合形成。第一壳体100可使用一体式配置形成，在该一体式配置中，一些或全部第一壳体100被加工或模制成单一结构，或者可使用多个结构(例如，内框架结构、形成外部外壳表面的一种或多种结构等)形成。
第一壳体100包括相背设置的第一面和第二面120。
第一壳体100可具有多个侧边，诸如具有第一边侧、第二边侧、第三边侧和第四边侧。第一边侧、第二边侧、第三边侧和第四边侧可依次连接。第一边侧和第三边侧可相对设置，第二边侧和第四边侧可相对设置，第二边侧可连接第一边侧和第三边侧之间，第四边侧可连接在第一边侧和第三边侧之间。第一边侧、第二边侧、第三边侧和第四边侧的形状可以是长条形、弧形、波浪形等结构。第一边侧、第二边侧、第三边侧和第四边侧的形状可以相同，也可以不同，也可以部分边侧形状相同。第一边侧、第二边侧、第三边侧和第四边侧的尺寸可以相等、也可以不相等，也可以其中两个或其中三个相等，比如第一边侧的长度等于第三边侧的长度、第二边侧的长度等于第四边侧的长度。
需要说明的是，第一壳体100的结构并不限于此，比如第一壳体100具有三个依次连接的边侧，再比如第一壳体100具有五个依次连接边侧，可以理解的是，第一壳体100的边侧并不限于此。
其中，第一边侧、第二边侧和第三边侧均可以设置辐射体。第四边侧可与 转轴300连接，第一壳体100和转轴300可以通过销轴连接，第一壳体100和转轴300也可以通过铰链连接。需要说明书的是，第一壳体100和转轴300也可以通过其他可以转动的方式进行连接。转轴300连接在第一壳体100和第二壳体200之间。转轴300可以采用金属材料制成，转轴300也可以采用塑料材料制成。其中，转轴300可以为圆柱体结构，转轴300也可以为其他结构。
第二壳体200可由塑料、玻璃、陶瓷、纤维复合材料、金属(例如，不锈钢、铝等)、其他合适的材料、或这些材料的任意两种或更多种的组合形成。第二壳体200可使用一体式配置形成，在该一体式配置中，一些或全部第二壳体200被加工或模制成单一结构，或者可使用多个结构(例如，内框架结构、形成外部外壳表面的一种或多种结构等)形成。
第二壳体200可包括相背设置的第三面和第四面220。
第二壳体200可具有多个侧边，诸如具有第五边侧、第六边侧、第七边侧和第八边侧。第五边侧、第六边侧、第七边侧和第八边侧可依次连接。第五边侧和第七边侧可相对设置，第六边侧和第八边侧可相对设置，第六边侧可连接第五边侧和第七边侧之间，第八边侧可连接在第五边侧和第七边侧之间。第五边侧、第六边侧、第七边侧和第八边侧的形状可以是长条形、弧形、波浪形等结构。第五边侧、第六边侧、第七边侧和第八边侧的形状可以相同，也可以不同，也可以部分边侧形状相同。第五边侧、第六边侧、第七边侧和第八边侧的尺寸可以相等、也可以不相等，也可以其中两个或其中三个相等，比如第五边侧的长度等于第七边侧的长度、第六边侧的长度等于第八边侧的长度。
需要说明的是，第二壳体200的结构并不限于此，比如第二壳体200具有三个依次连接的边侧，再比如第二壳体200具有五个依次连接边侧，可以理解的是，第二壳体200的边侧并不限于此。
其中，第五边侧、第六边侧和第七边侧均可以设置辐射体。第八边侧可与转轴300连接，第二壳体200和转轴300可以通过销轴连接，第二壳体200和转轴300也可以通过铰链连接。需要说明书的是，第二壳体200和转轴300也可以通过其他可以转动的方式进行连接。
需要说明的是，第一壳体100和第二壳体200在围绕转轴300转动过程中，可以形成不同的状态。比如：如图1所示，第一壳体100和第二壳体200形成 打开状态，打开状态表示第一壳体100和第二壳体200相互并排排列，第一壳体100和第二壳体200之间无重叠，第一壳体100和第二壳体200分别位于转轴300两侧。
请参阅图2，图2为本申请实施例提供的电子设备的第二结构示意图。图2示出第一壳体100和第二壳体200相互折叠的状态。第一壳体100和第二壳体200形成折叠状态，折叠状态表示第一壳体100和第二壳体200层叠在一起，第一壳体100和第二壳体200相互形成重叠。需要说明的是，第一壳体100和第二壳体200可以完全重叠，第一壳体100和第二壳体200也可以部分重叠。比如，第一边侧和第五边侧可以重叠，第二边侧和第六边侧可以重叠，第三边侧和第七边侧可以重叠，第四边侧和第八边侧可以重叠。需要说明的是，第一壳体100的各个边侧和第二壳体200的各个边侧也可以不重叠。需要说明的是，在图2中，第一壳体100和第二壳体200通过转轴300相互转动以形成折叠状态，第一壳体100将第二壳体200遮挡住。
其中，第一壳体100和第二壳体200的形状可以设置相同，比如第一壳体100和第二壳体200均为长方体结构。需要说明的是，第一壳体100和第二壳体200的形状也可以设置不同。其中，第一壳体100和第二壳体200的尺寸可以设置相同，也可以设置不同。可以将第一壳体100的尺寸设置大于第二壳体200的尺寸，也可以将第一壳体100的尺寸设置小于第二壳体200的尺寸。
需要说明的是，第一壳体100和第二壳体200通过转轴300连接可形成壳体组件。
请继续参阅图1和图2，电子设备20还可以包括显示屏诸如显示屏500。显示屏500可与电路板600电性连接。其中，显示屏500可为结合导电电容触摸传感器电极层或者其他触摸传感器部件(例如，电阻触摸传感器部件、声学触摸传感器部件、基于力的触摸传感器部件、基于光的触摸传感器部件等)的触摸屏显示器，或者可为非触敏的显示器。电容触摸屏电极可由氧化铟锡焊盘或者其他透明导电结构的阵列形成。
显示屏500可包括由液晶显示器(LCD)部件形成的显示器像素阵列、电泳显示器像素阵列、等离子体显示器像素阵列、有机发光二极管显示器像素阵列、电润湿显示器像素阵列、或者基于其他显示器技术的显示器像素。
可使用显示屏覆盖层诸如透明玻璃层、透光塑料、蓝宝石、或其他透明电介质层来保护显示屏500。
显示屏500可包括第一显示部510、第二显示部520和连接显示部530。第一显示部510和第二显示部520通过连接显示部530连接，第一显示部510、第二显示部520和连接显示部530可以是一体结构，第一显示部510、第二显示部520和连接显示部530可以共同显示图像、文本等信息，共同构成电子设备20的显示面。显示屏500可以是柔性屏，连接显示部530可以是柔性结构。连接显示部530可以产生形变，连接显示部530可以折叠，以使得第一显示部510和第二显示部520的位置产生变化。
其中，第一显示部510可以设置在第一壳体100的一面，诸如第二面120。第一显示部510可以覆盖在第一壳体100的一面的部分区域上，可以在第一壳体100上形成电子设备20的非显示区域，可以在该非显示区域设置电子设备20的辐射体。第一显示部510也可以覆盖在第一壳体100的一面的全部区域上，实现在第一壳体100的一面的全屏显示。第一显示部510可以跟随第一壳体100的运动而运动。
其中，第二显示部520可以设置在第二壳体200的一面，诸如第四面220。第二显示部520可以覆盖在第二壳体200的一面的部分区域上，可以在第二壳体200上形成电子设备20的非显示区域，可以在该非显示区域设置电子设备20的辐射体。第二显示部520也可以覆盖在第二壳体200的一面的全部区域上，实现在第二壳体200的一面的全屏显示。第二显示部520可以跟随第二壳体200的运动而运动。需要说明的是，当第一壳体100和第二壳体200形成打开状态时，第一显示部510和第二显示部520可以位于同一面，以共同显示画面，共同形成一显示面。当第一壳体100和第二壳体200形成折叠状态时，显示屏500位于电子设备20的外表面位置。
其中，连接显示部530可以覆盖在转轴300外表面。
需要说明的是，当电子设备20的第一壳体100和第二壳体200处于折叠状态时，第一壳体100和第二壳体200之间会形成空腔，第一壳体100和第二壳体200之间形成的空腔或者说是空间容易进入电磁波，电磁波会影响电子设备20的辐射体传输的信号。
因此，本申请实施例在第一壳体100和第二壳体200之间设置电磁带隙结构，以使得该电磁带隙结构在第一壳体100和第二壳体200处于折叠状态下可以阻碍电磁波进入到第一壳体100和第二壳体200由于折叠而形成的空腔。
请参阅图3，图3为本申请实施例提供的电子设备的第三结构示意图。电子设备20还可以包括电磁带隙结构诸如电磁带隙结构400。电磁带隙结构400可设置在第一壳体100的第一面110。需要说明的是，电磁带隙结构400也可以设置在第二壳体200的上，诸如设置在第二壳体200的第三面210。电磁带隙结构400用于阻碍第一壳体100和第二壳体200处于折叠状态下电磁波进入到第一壳体100和第二壳体200由于折叠而形成的空腔。
请参阅图4，图4为图3所示电磁带隙结构沿P-P方向的第一剖视图。电磁带隙结构400可包括金属层410、介质成420、多个金属片430和多个导通件440。
金属层410可以作为介质层420、多个金属片430和多个导通件的载体。金属层410可以与第一壳体100的第一面110连接，诸如金属层410与第一壳体100的电池盖固定连接，第一壳体100的电池盖可以为塑胶材料。可以理解的是，金属层410可以直接作为第一壳体100的电池盖。
需要说明的是，当电磁带隙结构400设置在第二壳体200上时，金属层410可以与第二壳体200的第三面210连接，诸如金属层410与第二壳体200的电池盖固定连接，第二壳体200的电池盖可以为塑胶材料。可以理解的是，金属层也可以作为第二壳体200的电池盖。
介质层420与金属层410连接，诸如介质层420设置在金属层410上，金属层410位于介质层420和第一壳体100之间。介质层420采用非金属材料，诸如塑胶等。介质层420上可设置多个连接孔421，各个连接孔421间隔设置，诸如均匀间隔设置。每一个连接孔421在介质层420的厚度方向上贯穿介质层420。连接孔421用于放置导通件440，一个导通件440放置在一个连接孔421内，导通件440用于将金属层410和金属片430连接。导通件440采用导电性材料，诸如导通件440采用金属材料，可以是铝、铜等金属。
金属片430设置在介质层420上，多个金属片430间隔设置在介质层420上，多个金属片430可均匀间隔设置在介质层420上。诸如多个金属片430 呈周期性排布，可以是阵列排布。各个金属片430之间形成间隙诸如间隙470。介质层420位于金属片430和金属层410之间。每一个金属片430对应一个连接孔421的位置设置，一个导通件440将一个金属片430连接到金属层410，从而形成电磁带隙结构400。
其中，金属片430可以为圆形、矩形或其他形状。金属片430还可以为椭圆形结构，椭圆形结构可以在两个方向上获得不同的阻碍效果，以阻碍频段和幅度。
需要说明的是，电磁带隙结构400也可以直接嵌设在第一壳体100的非金属材料的后盖或电池盖内，也可以将电磁带隙结构400设置在第一壳体100的外表面。
请参阅图5，图5为本申请实施例提供的电子设备处于折叠状态下未设置电磁带隙结构和设置电磁带隙结构的电场分布和辐射效率对比图。其中，S1为电子设备20在折叠状态下未设置电磁带隙结构的电场分布和辐射效率。其中，S2为电子设备20在折叠状态下设置电磁带隙结构400的电场分布和辐射效率。
可以理解的是，电子设备20在折叠状态下，且在电子设备20的辐射体工作时，第一壳体100和第二壳体200之间的金属会产生电场诸如纵向电场，其会朝向第一壳体100和第二壳体200之间的位置传播，根据工作频率以及第一壳体100和第二壳体200之间空腔尺寸不同，其进入空腔的部分会有不同程度的衰减，导致效率下降。本申请实施例在空腔位置的第一壳体100和第二壳体200之间设置电磁带隙结构400可以有效阻碍电磁波进入空腔，以提高电子设备20辐射体传输信号的效率。其中，图5示出电子设备20在设置电磁带隙结构400时，中高频信号传输效率可提升5dB左右，低频信号传输效率可提升1dB左右。
需要说明的是，电磁带隙结构400的结构并不限于此。
请参阅图6，图6为图3所示电磁带隙结构沿P-P方向的第二剖视图。图6所示电磁带隙结构400与图4所示电磁带隙结构的区别在于：图6所示电磁带隙结构400中的每一金属片430均可设置一通孔431。请参阅图7，图7为图3所示电子设备中电磁带隙结构的一种结构示意图。通孔431可与连接孔 421连通，导通件440还可以设置在通孔431内，从而通过通孔431以及连接孔421将金属片430和金属层410连接。该通孔431可以位于金属片430的中心位置，也可以设置在金属片430的其他位置。设置该通孔431便于在加工过程中金属片430与金属层410连接。
请参阅图8，图8为图3所示电磁带隙结构沿P-P方向的第三剖视图。电磁带隙结构400还可以包括第一非金属层450，第一非金属层450可设置在多个金属片430上，以将多个金属片430限位在第一非金属层450和介质层420之间。第一非金属层450采用非金属材料，诸如玻璃。当然，第一非金属层450也可以采用其他非金属材料，诸如塑胶。
请参阅图9，图9为图3所示电磁带隙结构沿P-P方向的第四剖视图。电磁带隙结构400还可以包括第二非金属层460，第二非金属层460可与金属层410连接，金属层410位于第二非金属层460和介质层420之间。第二非金属层460可与第一壳体100的第一面110连接，诸如第二非金属层460与第一壳体100的电池盖连接。当然，第二非金属层460也可以嵌设在第一壳体100的电池盖内，或者第二非金属层460作为第一壳体100的电池盖。第二非金属层460采用非金属材料，诸如玻璃。当然，第二非金属层460也可以采用其他非金属材料，诸如塑胶。
需要说明的是，电子设备20设置电磁带隙结构400的方式并不限于此。诸如第一壳体100设置有电磁带隙结构，第二壳体200上也设置有电磁带隙结构。
请参阅图10，图10为本申请实施例提供的电子设备的第四结构示意图。电子设备20中的电磁带隙结构400可包括第一电磁带隙结构401和第二电磁带隙结构402。第一电磁带隙结构401设置在第一壳体100的第一面110，第二电磁带隙结构402设置在第二壳体200的第三面210。第一电磁带隙结构401和第二电磁带隙结构402可共同阻碍电磁波信号朝向第一壳体100和第二壳体200折叠所形成的空腔传播。
请参阅图11，图11为本申请实施例提供的电子设备处于折叠状态的剖视图。图11可以是图10所示电子设备20从打开状态切换到折叠状态的剖视图。电子设备20还可以包括第一后盖101和第二后盖201，第一后盖101可以与 第一壳体100连接，第一后盖101可以设置在第一壳体100的第一面110。第二后盖102可以与第二壳体200连接，第二后盖201可以设置在第二壳体200的第三面210。其中第一电磁带隙结构401可以设置在第一后盖101上，第二电磁带隙结构402可以设置在第二后盖201上。
在图11所示的电子设备10折叠状态下，第一显示部510、第一壳体100、第一后盖101、第一电磁带隙结构401可以依次层叠设置。第二显示部520、第二壳体200、第二后盖201、第二电磁带隙结构402可以依次层叠设置。
需要说明的是，该电磁带隙结构400并不限于设置在具有折叠状态的壳体组件或电子设备20上，也可以将该电磁带隙结构400设置在不具有折叠状态的壳体或电子设备上，也可以起到阻碍作用。
以上对本申请实施例提供的壳体、壳体组件和电子设备进行了详细介绍。本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请。同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。
下面给出一些示例性实施例。
示例1：一种壳体，其包括电磁带隙结构，所述电磁带隙结构包括：
金属层；
介质层，与所述金属层连接；
多个金属片，间隔设置在所述介质层上，所述多个金属片、所述介质层和所述金属层依次层叠设置，每一所述金属片与所述金属层电连接；以及
第一非金属层，与所述介质层连接，所述第一非金属层将所述多个金属片限位在所述介质层和所述第一非金属层之间。
示例2：根据示例1的壳体，其中，所述电磁带隙结构还包括：
第二非金属层，与所述金属层连接，所述第二非金属层、所述金属层和所述介质层依次层叠设置。
示例3：根据示例1或2的壳体，其中，所述介质层设置有多个连接孔，每一所述金属片设置有一通孔，所述通孔和所述连接孔连通，所述通孔和所述连接孔内设置在导通件，所述导通件用于将所述金属片和所述金属层电连接。
示例4：一种壳体，其包括：
第一壳体，包括相背设置的第一面和第二面；
第二壳体，包括相背设置的第三面和第四面；以及
转轴，所述转轴分别与所述第一壳体、所述第二壳体连接，所述第二壳体和所述第一壳体可相对于所述转轴转动以实现折叠状态和打开状态；
当所述第一壳体和所述第二壳体处于折叠状态时，所述第一面和所述第三面位于所述第一壳体和所述第二壳体之间，所述第一面和所述第三面至少有一面设置有电磁带隙结构。
示例5：根据示例4的壳体组件，其中，所述电磁带隙结构包括：
金属层，连接到所述第一壳体的第一面；
介质层，与所述金属层连接；以及
多个金属片，间隔设置在所述介质层上，所述多个金属片、所述介质层和所述金属层依次层叠设置，每一所述金属片与所述金属层电连接。
示例6：根据示例5的壳体组件，其中，所述电磁带隙结构还包括第一非金属层，所述第一非金属层设置在金属片上，所述第一非金属层将所述多个金属片限位在所述介质层和所述第一非金属层之间。
示例7：根据示例5或6的壳体组件，其中，所述电磁带隙结构还包括第二非金属层，所述第二非金属层与所述金属层连接，所述第二非金属层、所述金属层和所述介质层依次层叠设置。
示例7：根据示例5-7中至少一个的壳体组件，其中，所述介质层设置有多个连接孔，每一所述金属片设置有一通孔，所述通孔和所述连接孔连通，所述通孔和所述连接孔内设置在导通件，所述导通件用于将所述金属片和所述金属层电连接。
示例9：根据示例5-8中至少一个的壳体组件，其中，所述第一面设置有电磁带隙结构，所述第三面未设置电磁带隙结构。
示例10：根据示例5-8中至少一个的壳体组件，其中，所述第一面和所述第三面均设置有电磁带隙结构。
示例11：根据示例4-10中至少一个的壳体组件，其中，所述第一壳体的形状和所述第二壳体的形状相同，所述第一壳体的尺寸和所述第二壳体的尺寸 相等，当所述第一壳体和所述第二壳体处于折叠状态时，所述第一壳体和所述第二壳体重叠。
示例12：一种电子设备，其包括：
第一壳体，包括相背设置的第一面和第二面；
第二壳体，包括相背设置的第三面和第四面；以及
转轴，所述转轴分别与所述第一壳体、所述第二壳体连接，所述第二壳体和所述第一壳体可相对于所述转轴转动以实现折叠状态和打开状态；
当所述第一壳体和所述第二壳体处于折叠状态时，所述第一面和所述第三面位于所述第一壳体和所述第二壳体之间，所述第一面和所述第三面至少有一面设置有电磁带隙结构。
示例13：根据示例12的电子设备，其中，所述电子设备还包括显示屏，所述显示屏包括：
第一显示部，设置在所述第二面；
第二显示部，设置在所述第四面；以及
连接显示部，设置在所述转轴位置，所述第一显示部和第二显示部通过所述连接显示部连接，所述第一显示部和第二显示部相对于所述连接显示部可折叠。
示例14：根据示例12或13的电子设备，其中，所述第一面设置有电磁带隙结构，所述第三面未设置电磁带隙结构。
示例15：根据示例12或13的电子设备，其中，所述第一面和所述第三面均设置有电磁带隙结构。
示例16：根据示例12-15中至少一个的电子设备，其中，所述电磁带隙结构包括：
金属层，连接到所述第一壳体的第一面；
介质层，与所述金属层连接；以及
多个金属片，间隔设置在所述介质层上，所述多个金属片、所述介质层和所述金属层依次层叠设置，每一所述金属片与所述金属层电连接。
示例17：根据示例16的电子设备，其中，所述电磁带隙结构还包括第一非金属层，所述第一非金属层设置在金属片上，所述第一非金属层将所述多个 金属片限位在所述介质层和所述第一非金属层之间。
示例18：根据示例16或17的电子设备，其中，所述电磁带隙结构还包括第二非金属层，所述第二非金属层与所述金属层连接，所述第二非金属层、所述金属层和所述介质层依次层叠设置。
示例19：根据示例16-18中至少一个的电子设备，其中，所述介质层设置有多个连接孔，每一所述金属片设置有一通孔，所述通孔和所述连接孔连通，所述通孔和所述连接孔内设置在导通件，所述导通件用于将所述金属片和所述金属层电连接。
示例20：根据示例12-19中至少一个的电子设备，其中，所述第一壳体的形状和所述第二壳体的形状相同，所述第一壳体的尺寸和所述第二壳体的尺寸相等，当所述第一壳体和所述第二壳体处于折叠状态时，所述第一壳体和所述第二壳体重叠。

Claims (20)

  1. 一种壳体，其包括电磁带隙结构，所述电磁带隙结构包括：
    金属层；
    介质层，与所述金属层连接；
    多个金属片，间隔设置在所述介质层上，所述多个金属片、所述介质层和所述金属层依次层叠设置，每一所述金属片与所述金属层电连接；以及
    第一非金属层，与所述介质层连接，所述第一非金属层将所述多个金属片限位在所述介质层和所述第一非金属层之间。
  2. 根据权利要求1所述的壳体，其中，所述电磁带隙结构还包括：
    第二非金属层，与所述金属层连接，所述第二非金属层、所述金属层和所述介质层依次层叠设置。
  3. 根据权利要求1所述的壳体，其中，所述介质层设置有多个连接孔，每一所述金属片设置有一通孔，所述通孔和所述连接孔连通，所述通孔和所述连接孔内设置在导通件，所述导通件用于将所述金属片和所述金属层电连接。
  4. 一种壳体组件，其包括：
    第一壳体，包括相背设置的第一面和第二面；
    第二壳体，包括相背设置的第三面和第四面；以及
    转轴，所述转轴分别与所述第一壳体、所述第二壳体连接，所述第二壳体和所述第一壳体可相对于所述转轴转动以实现折叠状态和打开状态；
    当所述第一壳体和所述第二壳体处于折叠状态时，所述第一面和所述第三面位于所述第一壳体和所述第二壳体之间，所述第一面和所述第三面至少有一面设置有电磁带隙结构。
  5. 根据权利要求4所述的壳体组件，其中，所述电磁带隙结构包括：
    金属层，连接到所述第一壳体的第一面；
    介质层，与所述金属层连接；以及
    多个金属片，间隔设置在所述介质层上，所述多个金属片、所述介质层和所述金属层依次层叠设置，每一所述金属片与所述金属层电连接。
  6. 根据权利要求5所述的壳体组件，其中，所述电磁带隙结构还包括第一非金属层，所述第一非金属层设置在金属片上，所述第一非金属层将所述多个金属片限位在所述介质层和所述第一非金属层之间。
  7. 根据权利要求5所述的壳体组件，其中，所述电磁带隙结构还包括第二非金属层，所述第二非金属层与所述金属层连接，所述第二非金属层、所述金属层和所述介质层依次层叠设置。
  8. 根据权利要求5所述的壳体组件，其中，所述介质层设置有多个连接孔，每一所述金属片设置有一通孔，所述通孔和所述连接孔连通，所述通孔和所述连接孔内设置在导通件，所述导通件用于将所述金属片和所述金属层电连接。
  9. 根据权利要求4所述的壳体组件，其中，所述第一面设置有电磁带隙结构，所述第三面未设置电磁带隙结构。
  10. 根据权利要求4所述的壳体组件，其中，所述第一面和所述第三面均设置有电磁带隙结构。
  11. 根据权利要求4所述的壳体组件，其中，所述第一壳体的形状和所述第二壳体的形状相同，所述第一壳体的尺寸和所述第二壳体的尺寸相等，当所述第一壳体和所述第二壳体处于折叠状态时，所述第一壳体和所述第二壳体重叠。
  12. 一种电子设备，其包括：
    第一壳体，包括相背设置的第一面和第二面；
    第二壳体，包括相背设置的第三面和第四面；以及
    转轴，所述转轴分别与所述第一壳体、所述第二壳体连接，所述第二壳体和所述第一壳体可相对于所述转轴转动以实现折叠状态和打开状态；
    当所述第一壳体和所述第二壳体处于折叠状态时，所述第一面和所述第三面位于所述第一壳体和所述第二壳体之间，所述第一面和所述第三面至少有一面设置有电磁带隙结构。
  13. 根据权利要求12所述的电子设备，其中，所述电子设备还包括显示屏，所述显示屏包括：
    第一显示部，设置在所述第二面；
    第二显示部，设置在所述第四面；以及
    连接显示部，设置在所述转轴位置，所述第一显示部和第二显示部通过所述连接显示部连接，所述第一显示部和第二显示部相对于所述连接显示部可折叠。
  14. 根据权利要求13所述的电子设备，其中，所述第一面设置有电磁带隙结构，所述第三面未设置电磁带隙结构。
  15. 根据权利要求13所述的电子设备，其中，所述第一面和所述第三面均设置有电磁带隙结构。
  16. 根据权利要求13所述的电子设备，其中，所述电磁带隙结构包括：
    金属层，连接到所述第一壳体的第一面；
    介质层，与所述金属层连接；以及
    多个金属片，间隔设置在所述介质层上，所述多个金属片、所述介质层和所述金属层依次层叠设置，每一所述金属片与所述金属层电连接。
  17. 根据权利要求16所述的电子设备，其中，所述电磁带隙结构还包括第一非金属层，所述第一非金属层设置在金属片上，所述第一非金属层将所述多个金属片限位在所述介质层和所述第一非金属层之间。
  18. 根据权利要求16所述的电子设备，其中，所述电磁带隙结构还包括第二非金属层，所述第二非金属层与所述金属层连接，所述第二非金属层、所述金属层和所述介质层依次层叠设置。
  19. 根据权利要求16所述的电子设备，其中，所述介质层设置有多个连接孔，每一所述金属片设置有一通孔，所述通孔和所述连接孔连通，所述通孔和所述连接孔内设置在导通件，所述导通件用于将所述金属片和所述金属层电连接。
  20. 根据权利要求13所述的电子设备，其中，所述第一壳体的形状和所述第二壳体的形状相同，所述第一壳体的尺寸和所述第二壳体的尺寸相等，当所述第一壳体和所述第二壳体处于折叠状态时，所述第一壳体和所述第二壳体重叠。
PCT/CN2020/083529 2019-05-31 2020-04-07 壳体、壳体组件和电子设备 WO2020238417A1 (zh)

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