WO2020238098A1 - 显示面板、其制备方法及显示装置 - Google Patents

显示面板、其制备方法及显示装置 Download PDF

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Publication number
WO2020238098A1
WO2020238098A1 PCT/CN2019/120946 CN2019120946W WO2020238098A1 WO 2020238098 A1 WO2020238098 A1 WO 2020238098A1 CN 2019120946 W CN2019120946 W CN 2019120946W WO 2020238098 A1 WO2020238098 A1 WO 2020238098A1
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WIPO (PCT)
Prior art keywords
electrode
conductive block
array substrate
emitting device
display panel
Prior art date
Application number
PCT/CN2019/120946
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English (en)
French (fr)
Inventor
夏继业
董小彪
Original Assignee
云谷（固安）科技有限公司
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Publication date
Application filed by 云谷（固安）科技有限公司 filed Critical 云谷（固安）科技有限公司
Priority to KR1020217035343A priority Critical patent/KR102586602B1/ko
Publication of WO2020238098A1 publication Critical patent/WO2020238098A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/179—Interconnections, e.g. wiring lines or terminals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0421—Structural details of the set of electrodes
    • G09G2300/0426—Layout of electrodes and connections

Definitions

  • the present disclosure relates to the field of display technology, and in particular to a display panel, a preparation method thereof, and a display device.
  • micro light emitting diodes are gradually applied to various display devices with their higher brightness and longer service life.
  • the display panel includes an array substrate and a light emitting device composed of micro light emitting diodes.
  • the array substrate is provided with a first metal pillar and a second metal pillar at intervals, and the light emitting device is provided with a first electrode and a second electrode at intervals.
  • the column is connected to the first electrode by welding, and the second metal column is also connected to the second electrode by welding, so as to realize the mechanical connection between the light emitting device and the array substrate based on the electrical connection between the array substrate and the light emitting device. connection.
  • the cross-sectional area of the first metal pillar and the second metal pillar is small, and the connection force between the light emitting device and the array substrate is insufficient, which easily causes the light emitting device to be separated from the array substrate.
  • the embodiments of the present disclosure provide a display panel and a display device to solve the problem that the cross-sectional area of the first metal pillar and the second metal pillar is small, and the connection force between the light emitting device and the array substrate is insufficient, which may easily cause the light emitting device The technical problem of separation from the array substrate.
  • the embodiment of the present disclosure provides a display panel, including a light emitting device and an array substrate, wherein the array substrate has a first conductive block and a second conductive block insulated from each other, the first conductive block, the second conductive block
  • the two conductive blocks and the array substrate are surrounded by a glue-containing groove; a connecting glue is arranged in the glue-containing groove, and the connecting glue is used for bonding the light-emitting device;
  • An electrode and a second electrode the first electrode is connected to the first conductive block, and the second electrode is connected to the second conductive block.
  • An embodiment of the present disclosure further provides a display device, including a housing and the display panel as described above, and the display panel is disposed on the housing.
  • the array substrate has a first conductive block and a second conductive block that are insulated from each other.
  • the first conductive block, the second conductive block, and the array substrate constitute a glue container, and the glue container A connecting glue is provided; a first electrode and a second electrode are provided on the light-emitting device; during installation, the light-emitting device is attached to the array substrate, and the first conductive block is connected to the first electrode, and the second conductive block is connected to the second electrode Connect, at this time the connecting glue glues the light-emitting device to the array substrate; the light-emitting device is connected to the array substrate through the first conductive block and the first electrode, and the second conductive block and the second electrode, and is also bonded by the connecting glue On the array substrate, compared with only the connection between the first metal pillar and the first electrode and between the second metal pillar and the second electrode, the connection strength between the light emitting device and the array substrate is improved, and the The
  • the embodiment of the present disclosure also provides a method for preparing a display panel, including
  • Heating is performed to melt the first conductive block and the second conductive block to complete the welding between the first conductive block and the first electrode, and the second conductive block and the Welding between the second electrodes;
  • the light emitting device and the array substrate are illuminated to cure the connecting glue in the glue container.
  • the display panel prepared by the method of the embodiment of the present disclosure has improved connection strength between the light emitting device and the array substrate, and prevents the light emitting device from being separated from the array substrate.
  • FIG. 1 is a first schematic diagram of the connection between a light emitting device and an array substrate in a display panel provided by an embodiment of the disclosure
  • FIG. 2 is a top view of an array substrate in a display panel provided by an embodiment of the disclosure
  • FIG. 3 is a second schematic diagram of the connection between the light emitting device and the array substrate in the display panel provided by the embodiment of the disclosure.
  • FIG. 1 is a first schematic diagram of the connection between a light emitting device and an array substrate in a display panel provided by an embodiment of the disclosure
  • FIG. 2 is a top view of the array substrate in a display panel provided by an embodiment of the disclosure.
  • this embodiment provides a display panel, including: a light emitting device 10 and an array substrate 20; the array substrate 20 has a first conductive block 201 and a second conductive block 202 insulated from each other, the first conductive block The block 201, the second conductive block 202, and the array substrate 20 are surrounded by a glue containing groove; a connecting glue 30 is provided in the glue containing groove, and the connecting glue 30 is used for bonding the light emitting device 10; An electrode 104 and a second electrode 105, the first electrode 104 and the second electrode 105 are not in contact with each other, the first electrode 104 is connected to the first conductive block 201, and the second electrode 105 is connected to the second conductive block 202.
  • the light-emitting device 10 in this embodiment may be an organic light-emitting device or an inorganic light-emitting device. This embodiment does not limit the light-emitting device 10, as long as the light-emitting device 10 can emit light when power is supplied to the light-emitting device 10;
  • the shape of the light-emitting device 10 is also not limited.
  • the cross-sectional shape of the light-emitting device 10 perpendicular to the electrode layer and the light-emitting layer 102 may be an inverted trapezoid, a rectangle or other possible shapes.
  • the light emitting device 10 may include an insulating layer 106, and a first electrode layer 101, a light emitting layer 102, and a second electrode layer 103 that are stacked; the insulating layer 106 is wrapped around the first electrode layer 101, the light emitting layer 102, and the second electrode layer.
  • the first electrode 104 may be mainly composed of metal materials such as copper and silver. Of course, the first electrode 104 may also be mainly composed of non-metallic materials such as graphite, as long as the first electrode 104 is electrically conductive.
  • the material of the second electrode 105 can be as described for the first electrode 104, and the two materials can be the same or different.
  • the first electrode 104 and the second electrode 105 may be disposed on the bottom surface of the insulating layer 106 close to the array substrate 20, and the first electrode layer 101 is closer to the second electrode layer 103 The array substrate 20 is provided.
  • the first electrode 104 can be electrically connected to the first electrode layer 101 through the first via hole on the insulating layer 106; accordingly, the second electrode 105 can pass through the insulating layer 106 and the first electrode layer 101.
  • the second via hole of the light-emitting layer 102 is electrically connected to the second electrode layer 103.
  • the first electrode layer 101 is disposed closer to the array substrate 20 than the second electrode layer 103.
  • the first electrode 104 is disposed on the surface of the insulating layer 106 facing the array substrate 20, and the first electrode 104 has a through
  • the conductive portion of the insulating layer 106 is electrically connected to the first electrode layer 101; accordingly, the second electrode 105 can be arranged outside the insulating layer 106, and the second electrode 105 directly contacts the second electrode layer 103 to achieve the first The electrical connection between the second electrode 105 and the second electrode layer 103.
  • thin film transistors are provided in the array substrate 20, and the thin film transistors are electrically connected to the first conductive block 201 and the second conductive block 202 to control the first conductive block 201 and the second conductive block 202 to be charged or uncharged. Power is supplied to the light emitting device 10 through the first conductive block 201 and the second conductive block 202, so that the light emitting device 10 emits light and realizes the display of the display panel.
  • the first conductive block 201 and the second conductive block 202 are arranged on the surface of the array substrate 20 facing the light emitting device 10; taking the orientation shown in FIG. 1 as an example, the first conductive block 201 and the second conductive block 202 are arranged on the array On the upper surface of the substrate 20.
  • the first conductive block 201 can be made of multiple materials, as long as the first conductive block 201 can conduct electricity.
  • the first conductive block 201 can be a metal block mainly composed of metal materials such as copper and silver.
  • the block may also be a non-metallic block mainly composed of non-metallic materials such as graphite.
  • the materials of the second conductive block 202 and the first conductive block 201 are as described for the first conductive block 201, and the materials of the two can be the same or different.
  • the first electrode 104 is connected to the first conductive block 201, as long as the electrical connection between the first electrode 104 and the first conductive block 201 is ensured, for example, the first electrode 104 is in contact with the first conductive block 201.
  • the second electrode 105 is connected to the second conductive block 202, as long as the electrical connection between the second electrode 105 and the second conductive block 202 is ensured, for example, the second electrode 105 is in contact with the second conductive block 202.
  • the first electrode 104, the second electrode 105, the first conductive block 201, and the second conductive block 202 are all made of metal.
  • the first electrode 104 and the first conductive block 201 are connected by welding.
  • the two electrodes 105 and the second conductive block 202 are also connected by welding, so as to improve the connection force between the light emitting device 10 and the array substrate 20 on the basis of the electrical connection.
  • the first electrode 104, the second electrode 105, the first conductive block 201, and the second conductive block 202 are all made of metal
  • the first electrode 104, the second electrode 105, the first conductive block 201 and the second The conductive blocks 202 may all be composed of indium. Since indium has a low melting point and a low soldering temperature, it can prevent the light-emitting device 10 and the array substrate 20 from being overheated and damaged during soldering.
  • the first conductive block 201 and the second conductive block 202 are insulated from each other.
  • a gap can be provided between the first conductive block 201 and the second conductive block 202 forming the glue tank, so as to avoid the first There is contact between the conductive block 201 and the second conductive block 202.
  • a sealant 40 may be provided in the gap between the first conductive block 201 and the second conductive block 202 constituting the side wall of the glue container.
  • the sealant 40 can ensure the insulated connection between the first conductive block 201 and the second conductive block 202, and can also block the sidewalls of the glue container to prevent the connecting glue 30 in the glue container from being separated from the first conductive block 201 and the second conductive block 201.
  • the gap between the two conductive blocks 202 flows out to avoid insufficient connection glue 30 in the glue container.
  • the sealant 40 may be mainly composed of epoxy resin, acrylic ester, and the like.
  • the first conductive block 201 and the second conductive block 202 and the array substrate 20 are enclosed as a glue containing groove.
  • the first conductive block 201 and the second conductive block 202 are enclosed as the side wall of the glue containing groove.
  • the array substrate 20 serves as the bottom wall of the glue container; taking the orientation shown in FIG. 1 as an example, the connecting glue 30 can enter the glue container through the opening at the top of the glue container.
  • the connecting glue 30 there can be many kinds of connecting glue 30 arranged in the glue container, as long as the light emitting device 10 can be bonded when the light emitting device 10 is mounted on the array substrate 20, thereby preventing the light emitting device 10 from being separated from the array substrate 20 OK.
  • the connecting glue 30 may be an optical glue.
  • the connecting glue 30 is an optical glue
  • the optical glue needs to be patterned first to form a glue block with the same shape as the glue container, and then the glue block is placed in the glue container.
  • the connecting glue 30 is a photosensitive glue.
  • the photosensitive glue is liquid before curing, and the liquid photosensitive glue can flow into the glue container, and then the photosensitive glue is cured by light; compared with optical glue, it does not need to be patterned in advance, which simplifies the operation difficulty.
  • the connecting glue 30 is an ultraviolet curing glue (UV curing glue), which can be cured by ultraviolet light irradiation. Compared with the connection of only metal pillars and electrodes by welding, it can reduce the light emitting device and the array. Under the temperature condition when the substrate is connected, the problem of insufficient connection force between the light-emitting device and the array substrate caused by the incomplete melting of the metal column at a lower temperature is solved.
  • the display panel processing process provided in this embodiment is as follows: an array substrate 20 and a light emitting device 10 are provided, and a first conductive block 201 and a second conductive block 202 made of metal are formed on the array substrate 20, so that the first conductive block 201 and the second conductive block 202
  • the two conductive blocks 202 and the array substrate 20 are enclosed as a glue container; the gap between the first conductive block 201 and the second conductive block 202 enclosed as the side wall of the glue container is filled with sealant 40, and then the glue Fill the groove with the connecting glue 30; then attach the light-emitting device 10 to the array substrate 20, and make the first conductive block 201 contact the first electrode 104 on the light-emitting device 10, and the second conductive block 202 is connected to the light-emitting device 10
  • the second electrode 105 is in contact; then heating is performed to melt the first conductive block 201 and the second conductive block 202, thereby completing the welding between the first conductive block 201 and the first electrode 104,
  • connecting glue 30 When filling the connecting glue 30 into the glue container, it is necessary to ensure that there is enough connecting glue 30 in the glue container, so that after the connecting glue 30 is cured, one side of the connecting glue 30 is bonded to the array substrate 20 and the other side of the connecting glue 30 Bond the light emitting device 10.
  • the array substrate 20 has a first conductive block 201 and a second conductive block 202 insulated from each other.
  • the first conductive block 201, the second conductive block 202, and the array substrate 20 form a glue-tolerant groove.
  • a connecting glue 30 is arranged in the groove; a first electrode 104 and a second electrode 105 are arranged on the light-emitting device 10; during installation, the light-emitting device 10 is attached to the array substrate 20, and the first conductive block 201 and the first electrode 104 Connect, the second conductive block 202 is connected to the second electrode 105.
  • the connecting glue 30 adheres the light emitting device 10 to the array substrate 20; the light emitting device 10 passes through the first conductive block 201 and the first electrode 104, and the second The conductive block 202 and the second electrode 105 are connected to the array substrate 20, and are also bonded to the array substrate 20 by the connecting glue 30, and only pass between the first metal pillar and the first electrode, and the second metal pillar and the second metal pillar.
  • the connection strength between the light emitting device 10 and the array substrate 20 is improved, and the separation of the light emitting device 10 and the array substrate 20 is avoided.
  • the light emitting device 10 has a contact surface facing the array substrate 20 and a side surface adjacent to the contact surface;
  • the first electrode 104 includes a first contact portion 1041 on the contact surface and a side surface
  • the first extension portion 1042, the first conductive block 201 is connected to the first contact portion 1041 and the first extension portion 1042.
  • the area of the first electrode 104 is increased, thereby increasing the contact area between the first conductive block 201 and the first electrode 104, and reducing the first conductive block 201
  • the contact resistance between the first electrode 104 and the first electrode 104 prevents poor contact between the first conductive block 201 and the first electrode 104.
  • connection force between the first conductive block 201 and the first electrode 104 can also be improved, so as to further improve the light emitting device 10 and the array substrate.
  • the cross-sectional area of the glue tank along the direction parallel to the array substrate 20 can be increased as much as possible on the premise that the first conductive block 201 and the first electrode 104 are well connected.
  • the contact area between the connecting glue 30 and the light-emitting device 10 and the array substrate 20 can be increased, and the connection force between the light-emitting device 10 and the array substrate 20 can be improved.
  • it can avoid the first conductive block during soldering. 201 and the second conductive block 202 are deformed and contact each other.
  • the light emitting device 10 may be trapezoidal in a direction perpendicular to the array substrate 20, and the bottom surface of the light emitting device 10 with a smaller cross-sectional area is the contact surface.
  • the first contact portion 1041 of the first electrode 104 is located On the contact surface
  • the first extension 1042 of the first electrode 104 is located on the side surface between the two bottom surfaces of the light emitting device 10.
  • the first extension portion 1042 is electrically connected to the first contact portion 1041.
  • the first extension portion 1042 and the first contact portion 1041 may be integrally formed, or the first contact portion 1041 and the first extension portion 1042 are connected through a via hole.
  • the light emitting device 10 in this embodiment may also be cylindrical or prismatic. In this case, one end surface of the light emitting device 10 is a contact surface, and the surface adjacent to the end surface is a side surface.
  • the second electrode 105 includes a second contact portion 1051 on the contact surface and a second extension portion 1052 on the side surface.
  • the second conductive block 202 is connected to the second contact portion 1051 and the second The extension 1052 is connected.
  • the area of the second electrode 105 is increased, thereby increasing the contact area between the second conductive block 202 and the second electrode 105, and reducing the second conductive block 202
  • the contact resistance between the second electrode 105 and the second electrode 105 prevents poor contact between the second conductive block 202 and the second electrode 105.
  • connection force between the second conductive block 202 and the second electrode 105 can also be improved, so as to further improve the light emitting device 10 and the array substrate.
  • the width of the glue tank along the direction parallel to the array substrate 20 can be further increased.
  • the cross-sectional area on the one hand, can further increase the contact area between the connecting glue 30 and the light-emitting device 10 and the array substrate 20, and improve the connection force between the light-emitting device 10 and the array substrate 20. On the other hand, it can further avoid the welding process.
  • the first conductive block 201 and the second conductive block 202 are deformed and contact each other.
  • the first electrode 104 may include a first contact portion 1041 on the contact surface and a first extension portion 1042 on the side surface.
  • the first conductive block 201 is connected to the first contact portion 1041 and the first extension portion 1042, and the second electrode 105 is only located on the contact surface of the light-emitting device 10; it is also possible that the second electrode 105 includes a second contact portion 1051 located on the contact surface and a second extension portion 1052 located on the side surface.
  • the second conductive block 202 is connected to the second contact portion 1051 and The second extension 1052 is connected, and the first electrode 104 is only located on the contact surface of the light emitting device 10.
  • FIG. 3 is a second schematic diagram of the connection between the light emitting device and the array substrate in the display panel provided by the embodiment of the disclosure.
  • a first protruding portion 1043 is provided on the first electrode 104, and the first protruding portion 1043 is embedded in the first conductive block 201.
  • the contact area between the first electrode 104 and the first conductive block 201 can be increased, thereby increasing the connection force between the first electrode 104 and the first conductive block 201, and at the same time, it can also avoid the first electrode 104 and the first conductive block 201.
  • the contact between a conductive block 201 is poor.
  • first protrusions 1043 there are a plurality of first protrusions 1043, and the plurality of first protrusions 1043 are sequentially arranged on the first electrode 104 to further improve the connection force between the first electrode 104 and the first conductive block 201, and at the same time further To avoid poor contact between the first electrode 104 and the first conductive block 201.
  • the first protrusion 1043 can have various shapes.
  • the first protrusion 1043 can have a regular shape such as a cylindrical shape or a prismatic shape.
  • the first protrusion 1043 can also have other irregular shapes.
  • a first recessed part that matches with the first protrusion 1043 can be pre-made on the first conductive block 201, and when the first conductive block 201 contacts the first protrusion 1043, the first protrusion 1043 is embedded Into the first depression.
  • the first conductive block 201 is a metal block, there is no need to pre-dispose a first recess on the first conductive block 201.
  • the first conductive block 201 melts At this time, the first protruding portion 1043 can be embedded in the melted first conductive block 201.
  • a second protruding portion 1053 is provided on the second electrode 105, and the second protruding portion 1053 is embedded in the second conductive block 202 to improve the relationship between the second electrode 105 and the second conductive block 202 The connection force between the second electrode 105 and the second conductive block 202 is avoided at the same time.
  • the second protrusion 1053 can have various shapes.
  • the second protrusion 1053 can have a regular shape such as a cylindrical shape or a prismatic shape.
  • the second protrusion 1053 can also have other irregular shapes.
  • a second concave portion that matches with the second protrusion 1053 can be prefabricated on the second conductive block 202.
  • the second protrusion is embedded in the first Two depressions.
  • the second conductive block 202 is a metal block, there is no need to pre-set a second recess on the second conductive block 202.
  • the second conductive block 202 melts At this time, the second protruding portion 1053 can be embedded in the molten second conductive block 202.
  • first protruding portion 1043 on the first electrode 104, the first protruding portion 1043 is embedded in the first conductive block 201, and the second protruding portion is not provided on the second electrode 105; or
  • the second protruding portion 1053 is only provided on the second electrode 105, the second protruding portion 1053 is embedded in the second conductive block 202, and the first protruding portion is not provided on the first electrode 104.
  • first protruding portion 1043 may be disposed on the first extension portion 1042 and/or the first contact portion 1041 of the first electrode 104.
  • second protruding portion 1053 may be provided on the second extension portion 1052 and/or the second contact portion 1051 of the second electrode 105.
  • a display device including a housing and the display panel as described above, and the display panel is disposed on the housing.
  • the display device may be a product or component with a display function such as a mobile phone, a tablet computer, a television, a display, an e-book, an e-paper, a smart watch, a notebook computer, a digital photo frame, or a navigator.
  • a display function such as a mobile phone, a tablet computer, a television, a display, an e-book, an e-paper, a smart watch, a notebook computer, a digital photo frame, or a navigator.
  • the array substrate 20 has a first conductive block 201 and a second conductive block 202 insulated from each other.
  • the first conductive block 201, the second conductive block 202, and the array substrate 20 form a glue container.
  • a connecting glue 30 is arranged in the groove; a first electrode 104 and a second electrode 105 are arranged on the light-emitting device 10; during installation, the light-emitting device 10 is attached to the array substrate 20, and the first conductive block 201 and the first electrode 104 Connect, the second conductive block 202 is connected to the second electrode 105.
  • the connecting glue 30 adheres the light emitting device 10 to the array substrate 20; the light emitting device 10 passes through the first conductive block 201 and the first electrode 104, and the second The conductive block 202 and the second electrode 105 are connected to the array substrate 20, and are also bonded to the array substrate 20 by the connecting glue 30, and only pass between the first metal pillar and the first electrode, and the second metal pillar and the second metal pillar.
  • the connection strength between the light emitting device 10 and the array substrate 20 is improved, and the separation of the light emitting device 10 and the array substrate 20 is avoided.

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Abstract

本公开提供一种显示面板、其制备方法及显示装置，该显示面板包括：发光器件以及阵列基板，其中阵列基板上具有互相绝缘的第一导电块和第二导电块，第一导电块、第二导电块以及阵列基板围设成容胶槽；容胶槽内设置有连接胶，连接胶用于粘接发光器件；发光器件上设置有互相绝缘的第一电极和第二电极，第一电极与第一导电块连接，第二电极与第二导电块连接。发光器件除了通过第一导电块和第一电极、以及第二导电块与第二电极与阵列基板连接外，还通过连接胶粘接在阵列基板上，提高了发光器件与阵列基板之间的连接强度，避免了发光器件与阵列基板分离。

Description

显示面板、其制备方法及显示装置 技术领域
本公开涉及显示技术领域，尤其涉及一种显示面板、其制备方法及显示装置。
背景技术
随着显示设备技术的逐渐发展，微发光二极管以其较高的亮度以及较长的使用寿命逐渐应用在各类显示装置上。
显示面板包括阵列基板以及由微发光二极管构成的发光器件，阵列基板上间隔的设置有第一金属柱和第二金属柱，发光器件上间隔的设置有第一电极和第二电极，第一金属柱与第一电极通过焊接的方式连接，第二金属柱也通过焊接的方式与第二电极连接，以在实现阵列基板与发光器件电连接的基础上，实现发光器件与阵列基板之间的机械连接。
然而，第一金属柱和第二金属柱的截面面积较小，发光器件与阵列基板之间的连接力不足，容易导致发光器件与阵列基板分离。
发明内容
有鉴于此，本公开实施例提供一种显示面板及显示装置，以解决第一金属柱和第二金属柱的截面面积较小，发光器件与阵列基板之间的连接力不足，容易导致发光器件与阵列基板分离的技术问题。
本公开实施例提供了一种显示面板，包括：发光器件以及阵列基板，其中，所述阵列基板上具有互相绝缘的第一导电块和第二导电块，所述第一导电块、所述第二导电块以及所述阵列基板围设成容胶槽；所述容胶槽内设置有连接胶，所述连接胶用于粘接所述发光器件；所述发光器件上设置有互相绝缘的第一电极和第二电极，所述第一电极与所述第一导电块连接，所述第二电极与所述第二导电块连接。
本公开实施例还提供一种显示装置，包括壳体以及如上所述的显示面板，所述显示面板设置在所述壳体上。
本公开实施例提供的显示面板及显示装置，阵列基板上具有互相绝缘的第一导电块和第二导电块，第一导电块、第二导电块以及阵列基板构成容胶槽，容胶槽内设置有连接胶；发光器件上设置有第一电极和第二电极；安装时，将发光器件贴附在阵列基板上，并且第一导电块与第一电极连接，第二导电块与第二电极连接，此时连接胶将发光器件粘接在阵列基板上；发光器件除了通过第一导电块和第一电极、以及第二导电块与第二电极与阵列基板连接外，还通过连接胶粘接在阵列基板上，与只通过第一金属柱与第一电极之间、以及第二金属柱与第二电极之间的连接相比，提高了发光器件与阵列基板之间的连接强度，避免了发光器件与阵列基板分离。
本公开实施例还提供一种制备显示面板的方法，包括
提供阵列基板以及发光器件；
在所述阵列基板上形成由金属构成的第一导电块和第二导电块，使所述第一导电块、所述第二导电块以及所述阵列基板围设成容胶槽；
在围设成所述容胶槽侧壁的所述第一导电块和所述第二导电块之间的间隙内填充密封胶，之后在所述容胶槽内填充连接胶；
将发光器件贴附在所述阵列基板上，并且使所述第一导电块与所述发光器件上的第一电极接触，所述第二导电块与所述发光器件上的第二电极接触；
进行加热，以使所述第一导电块和所述第二导电块发生熔化，以完成所述第一导电块与所述第一电极之间的焊接、以及所述第二导电块与所述第二电极之间的焊接；
对所述发光器件和所述阵列基板进行光照，使所述容胶槽内的连接胶固化。
本公开实施例的方法制备的显示面板具有提高的发光器件与阵列基板之间的连接强度，避免了发光器件与阵列基板分离。
附图说明
为了更清楚地说明本公开实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍，显而易见地，下面描述中的附图是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本公开实施例提供的显示面板中发光器件与阵列基板之间的连接示意图一；
图2为本公开实施例提供的显示面板中阵列基板的俯视图；
图3为本公开实施例提供的显示面板中发光器件与阵列基板之间的连接示意图二。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
图1为本公开实施例提供的显示面板中发光器件与阵列基板之间的连接示意图一，图2为本公开实施例提供的显示面板中阵列基板的俯视图。
请参照图1和图2，本实施例提供一种显示面板，包括：发光器件10以及阵列基板20；阵列基板20上具有互相绝缘的第一导电块201和第二导电块202，第一导电块201、第二导电块202以及阵列基板20围设成容胶槽；容胶槽内设置有连接胶30，连接胶30用于粘接发光器件10；发光器件10上设置有互相绝缘的第一电极104和第二电极105，第一电极104和第二电极105相互之间不接触，第一电极104与第一导电块201连接，第二电极105与第二导电块202连接。
本实施例中的发光器件10可以为有机发光器件或者无机发光器件，本实施例对发光器件10不做限制，只要能够在向发光器件10供电时，发光器件10发光即可；本实施例对发光器件10的形状也不做限制，发光器件10的垂 直于电极层和发光层102的截面形状可以为倒梯形，也可以为矩形或其他可能的形状。示例性地，发光器件10可以包括绝缘层106、以及层叠设置的第一电极层101、发光层102、第二电极层103；绝缘层106包裹在第一电极层101、发光层102以及第二电极层103的外侧；第一电极104与第一电极层101电连接，第二电极105与第二电极层103电连接，以在对第一电极104和第二电极105供电时，驱动发光层102发光。
其中，第一电极104可以为主要由铜、银等金属材质构成，当然，第一电极104还可以主要由石墨等非金属材质构成，只要保证第一电极104导电即可。第二电极105的材质可以如针对第一电极104所述，并且两者材质可以相同或不同。
继续参照图1，在一个可以实现的方式中，第一电极104和第二电极105可以设置在绝缘层106的靠近阵列基板20的底面上，第一电极层101相对第二电极层103更靠近阵列基板20设置，此时第一电极104可以通过贯穿绝缘层106上的第一过孔与第一电极层101电连接；相应地，第二电极105通过贯穿绝缘层106、第一电极层101以及发光层102的第二过孔与第二电极层103电连接。
在其他的实现方式中，第一电极层101相对第二电极层103更靠近阵列基板20设置，此时第一电极104设置在绝缘层106朝向阵列基板20的面上，第一电极104具有贯穿绝缘层106的导电部，导电部与第一电极层101电连接；相应地，第二电极105可以设置在绝缘层106外侧，并且第二电极105直接与第二电极层103接触，以实现第二电极105与第二电极层103之间的电连接。
本实施例中，阵列基板20内设置有薄膜晶体管，薄膜晶体管与第一导电块201和第二导电块202电连接，以控制第一导电块201和第二导电块202带电或者不带电，进而通过第一导电块201和第二导电块202向发光器件10供电，以使发光器件10发光，实现显示面板的显示。
具体地，第一导电块201和第二导电块202设置在阵列基板20朝向发光器件10的面上；以图1所示方位为例，第一导电块201和第二导电块202设 置在阵列基板20的上表面上。第一导电块201的材质可以有多种，只要保证第一导电块201可以导电即可，例如，第一导电块201可以为主要由铜、银等金属材质构成的金属块，当然第一导电块还可以为主要由石墨等非金属材质构成的非金属块。第二导电块202与第一导电块201的材质如针对第一导电块201所述，并且两者材质可以相同或不同。
本实施例中，第一电极104与第一导电块201连接，只要保证第一电极104与第一导电块201之间电连接即可，例如，第一电极104与第一导电块201接触。同样地，第二电极105与第二导电块202连接，只要保证第二电极105与第二导电块202之间电连接即可，例如，第二电极105与第二导电块202接触。
优选地，第一电极104、第二电极105、第一导电块201以及第二导电块202均由金属构成，此时第一电极104和第一导电块201之间通过焊接的方式连接，第二电极105与第二导电块202之间也通过焊接的方式连接，以在实现电连接的基础上，提高发光器件10与阵列基板20的之间的连接力。
示例性地，当第一电极104、第二电极105、第一导电块201以及第二导电块202均由金属构成时，第一电极104、第二电极105、第一导电块201以及第二导电块202可以均由铟构成，由于铟的熔点较低，焊接温度较低，可以避免焊接时发光器件10和阵列基板20过热而被损坏。
本实施例中第一导电块201与第二导电块202之间互相绝缘，示例性地，可以使构成容胶槽的第一导电块201和第二导电块202之间具有间隙，以免第一导电块201和第二导电块202之间接触。
进一步地，可以在构成容胶槽侧壁的第一导电块201和第二导电块202之间的间隙内设置有密封胶40。密封胶40可以保证第一导电块201和第二导电块202之间绝缘连接，还可以将容胶槽的侧壁封堵，避免容胶槽内的连接胶30由第一导电块201和第二导电块202之间的间隙流出，避免容胶槽内的连接胶30不足。其中有密封胶40可以主要由环氧树脂、丙烯酸酯等构成。
本实施例中，第一导电块201和第二导电块202以及阵列基板20围设成容胶槽，具体地，第一导电块201和第二导电块202围设成容胶槽的侧壁， 阵列基板20作为容胶槽的底壁；以图1所示方位为例，连接胶30可以由容胶槽顶端的开口进入容胶槽。
本实施例中设置在容胶槽内的连接胶30可以有多种，只要在将发光器件10安装在阵列基板20上时，能够粘接发光器件10，进而阻止发光器件10与阵列基板20分离即可。例如，连接胶30可以为光学胶。当连接胶30为光学胶时，首先需要对光学胶进行图形化，以形成形状与容胶槽形状相同的胶块，之后将胶块放置在容胶槽内。
本实施例优选地，连接胶30为光敏胶。光敏胶在固化前呈液态，可以使液态的光敏胶流入到容胶槽内，之后通过光照的方式使光敏胶固化；与光学胶相比，不需预先进行图形化，简化了操作难度。更优选地，连接胶30为紫外光固化胶(UV固化胶)，使用紫外光照射即可使其固化，与只通过金属柱与电极通过焊接的方式连接相比，可以在降低发光器件与阵列基板连接时的温度情况下，解决金属柱在较低温度不能完全熔融导致的发光器件与阵列基板连接力不足的问题。
本实施例提供的显示面板加工过程为：提供阵列基板20以及发光器件10，在阵列基板20上形成由金属构成的第一导电块201和第二导电块202，使第一导电块201、第二导电块202以及阵列基板20围设成容胶槽；在围设成容胶槽侧壁的第一导电块201和第二导电块202之间的间隙内填充密封胶40，之后在容胶槽内填充连接胶30；再将发光器件10贴附在阵列基板20上，并且使第一导电块201与发光器件10上的第一电极104接触，第二导电块202与发光器件10上的第二电极105接触；之后进行加热，以使第一导电块201和第二导电块202发生熔化，进而完成第一导电块201与第一电极104之间的焊接、以及第二导电块202与第二电极105之间的焊接；之后对发光器件10和阵列基板20进行光照，使容胶槽内的连接胶30固化，固化后的连接胶30可以将发光器件10粘接在阵列基板20上。
在向容胶槽内填充连接胶30时，需要保证容胶槽内具有足够的连接胶30，以在连接胶30固化后，连接胶30一个面粘接阵列基板20，连接胶30的另一面粘接发光器件10。
本实施例提供的显示面板，阵列基板20上具有互相绝缘的第一导电块201和第二导电块202，第一导电块201、第二导电块202以及阵列基板20构成容胶槽，容胶槽内设置有连接胶30；发光器件10上设置有第一电极104和第二电极105；安装时，将发光器件10贴附在阵列基板20上，并且第一导电块201与第一电极104连接，第二导电块202与第二电极105连接，此时连接胶30将发光器件10粘接在阵列基板20上；发光器件10除了通过第一导电块201和第一电极104、以及第二导电块202与第二电极105与阵列基板20连接外，还通过连接胶30粘接在阵列基板20上，与只通过第一金属柱与第一电极之间、以及第二金属柱与第二电极之间的连接相比，提高了发光器件10与阵列基板20之间的连接强度，避免了发光器件10与阵列基板20分离。
继续参照图1，本实施例中，发光器件10具有朝向阵列基板20的接触面、以及与接触面相邻的侧面；第一电极104包括位于接触面上的第一接触部1041以及位于侧面上的第一延伸部1042，第一导电块201与第一接触部1041和第一延伸部1042连接。与第一电极104只位于发光器件10的接触面相比，增大了第一电极104的面积，进而提高了第一导电块201与第一电极104的接触面积，减小了第一导电块201与第一电极104之间的接触电阻，进而避免第一导电块201与第一电极104之间接触不良。另外，当第一导电块201与第一电极104之间通过焊接的方式连接时，还可以提高第一导电块201与第一电极104之间的连接力，以进一步提高发光器件10与阵列基板20之间的连接力。
此外，由于提高了第一电极104的面积，可以在保证第一导电块201与第一电极104连接良好的前提下，尽可能的增大容胶槽的沿平行于阵列基板20方向的截面面积，一方面可以增大连接胶30与发光器件10和阵列基板20的接触面积，提高发光器件10与阵列基板20之间的连接力，另一方面，可以避免在进行焊接时，第一导电块201和第二导电块202发生变形而互相接触。
具体地，继续参照图1，发光器件10沿垂直于阵列基板20的方向可以 呈梯形，并且发光器件10截面面积较小的底面为接触面，此时第一电极104的第一接触部1041位于接触面上，第一电极104的第一延伸部1042位于发光器件10两个底面之间的侧面上。第一延伸部1042与第一接触部1041电连接，具体地，第一延伸部1042和第一接触部1041可以一体成型、或者第一接触部1041与第一延伸部1042通过过孔连接。当然，本实施例中发光器件10还可以呈圆柱状或者棱柱状，此时发光器件10的一个端面为接触面，与该端面相邻的面为侧面。
继续参照图1，本实施例中，第二电极105包括位于接触面上的第二接触部1051以及位于侧面上的第二延伸部1052，第二导电块202与第二接触部1051和第二延伸部1052连接。与第二电极105只位于发光器件10的接触面相比，增大了第二电极105的面积，进而提高了第二导电块202与第二电极105的接触面积，减小了第二导电块202与第二电极105之间的接触电阻，进而避免第二导电块202与第二电极105之间接触不良。另外，当第二导电块202与第二电极105之间通过焊接的方式连接时，还可以提高第二导电块202与第二电极105之间的连接力，以进一步提高发光器件10与阵列基板20之间的连接力。
在其他方面，由于提高了第二电极105的面积，此时可以在保证第二导电块202与第二电极105连接良好的前提下，进一步增大容胶槽的沿平行于阵列基板20方向的截面面积，一方面可以进一步增大连接胶30与发光器件10和阵列基板20的接触面积，提高发光器件10与阵列基板20之间的连接力，另一方面，可以进一步避免在进行焊接时，第一导电块201和第二导电块202发生变形而互相接触。
可以第一电极104包括位于接触面上的第一接触部1041以及位于侧面上的第一延伸部1042，第一导电块201与第一接触部1041和第一延伸部1042连接，而第二电极105只位于发光器件10的接触面；也可以第二电极105包括位于接触面上的第二接触部1051以及位于侧面上的第二延伸部1052，第二导电块202与第二接触部1051和第二延伸部1052连接，而第一电极104只位于发光器件10的接触面。
图3为本公开实施例提供的显示面板中发光器件与阵列基板之间的连接示意图二。参照图1-图3，本实施例中，第一电极104上设置有第一凸出部1043，第一凸出部1043嵌入到第一导电块201内。如此设置，可以提高接第一电极104与第一导电块201之间的接接触面积，进而提高第一电极104与第一导电块201之间连接力，同时还可以避免第一电极104与第一导电块201之间接触不良。
优选地，第一凸出部1043为多个，多个第一凸出部1043在第一电极104上依次设置，以进一步提高第一电极104与第一导电块201之间连接力，同时进一步避免第一电极104与第一导电块201之间接触不良。
第一凸出部1043的形状可以有多种，例如，第一凸出部1043可以呈圆柱状、棱柱状等规则形状，当然第一凸出部1043还可以呈其他的不规则形状。
具体地，可以在第一导电块201上预先制作与第一凸出部1043配合的第一凹陷部，在第一导电块201与第一凸出部1043接触时，第一凸出部1043嵌入到第一凹陷部内。
当第一导电块201为金属块时，无需在第一导电块201上预先设置第一凹陷部，在进行第一导电块201与第一电极104的焊接过程中，第一导电块201发生熔化，此时第一凸出部1043即可嵌入到熔化的第一导电块201内。
继续参照图3，进一步地，第二电极105上设置有第二凸出部1053，第二凸出部1053嵌入到第二导电块202内，以提高第二电极105与第二导电块202之间连接力，同时避免第二电极105与第二导电块202之间接触不良。
其中，第二凸出部1053的形状可以有多种，例如，第二凸出部1053可以呈圆柱状、棱柱状等规则形状，当然第二凸出部1053还可以呈其他的不规则形状。
具体地，可以在第二导电块202上预先制作与第二凸出部1053配合的第二凹陷部，在第二导电块202与第二凸出部1053接触时，第二凸出嵌入到第二凹陷部内。
当第二导电块202为金属块时，无需在第二导电块202上预先设置第二凹陷部，在进行第二导电块202与第二电极105的焊接过程中，第二导电块 202发生熔化，此时第二凸出部1053即可嵌入到熔化的第二导电块202内。
当然，也可以只在第一电极104上设置有第一凸出部1043，第一凸出部1043嵌入到第一导电块201内，而第二电极105上不设置第二凸出部；或者只在第二电极105上设置有第二凸出部1053，第二凸出部1053嵌入到第二导电块202内，而第一电极104上不设置第一凸出部。
本实施例中，第一凸出部1043可以设置在第一电极104的第一延伸部1042和/或第一接触部1041上。同样地，第二凸出部1053可以设置在第二电极105的第二延伸部1052和/或第二接触部1051上。
继续参照图1-图3。在其他实施例中，还提供一种显示装置，包括壳体以及如上所述的显示面板，显示面板设置壳体上。
其中显示装置可以为手机、平板电脑、电视机、显示器、电子书、电子纸、智能手表、笔记本电脑、数码相框或导航仪等具有显示功能的产品或部件。
本实施例提供的显示装置，阵列基板20上具有互相绝缘的第一导电块201和第二导电块202，第一导电块201、第二导电块202以及阵列基板20构成容胶槽，容胶槽内设置有连接胶30；发光器件10上设置有第一电极104和第二电极105；安装时，将发光器件10贴附在阵列基板20上，并且第一导电块201与第一电极104连接，第二导电块202与第二电极105连接，此时连接胶30将发光器件10粘接在阵列基板20上；发光器件10除了通过第一导电块201和第一电极104、以及第二导电块202与第二电极105与阵列基板20连接外，还通过连接胶30粘接在阵列基板20上，与只通过第一金属柱与第一电极之间、以及第二金属柱与第二电极之间的连接相比，提高了发光器件10与阵列基板20之间的连接强度，避免了发光器件10与阵列基板20分离。
最后应说明的是：以上各实施例仅用以说明本公开的技术方案，而非对其限制；尽管参照前述各实施例对本公开进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并 不使相应技术方案的本质脱离本公开各实施例技术方案的范围。

Claims (16)

  1. 一种显示面板，包括：
    发光器件，所述发光器件上设置有互相绝缘的第一电极和第二电极；以及
    阵列基板，所述阵列基板上具有互相绝缘的第一导电块和第二导电块，所述第一电极与所述第一导电块连接，所述第二电极与所述第二导电块连接，所述第一导电块、所述第二导电块以及所述阵列基板围设成容胶槽，所述容胶槽内设置有连接胶，所述连接胶用于连接所述发光器件和所述阵列基板。
  2. 根据权利要求1所述的显示面板，其中，
    所述发光器件具有朝向所述阵列基板的接触面、以及与所述接触面相邻的侧面；
    所述第一电极包括位于所述接触面上的第一接触部以及位于所述侧面上的第一延伸部，所述第一导电块与所述第一接触部和所述第一延伸部连接；和/或
    所述第二电极包括位于所述接触面上的第二接触部以及位于所述侧面上的第二延伸部，所述第二导电块与所述第二接触部和所述第二延伸部连接。
  3. 根据权利要求2所述的显示面板，其中，
    所述第一电极上设置有第一凸出部，所述第一凸出部嵌入到所述第一导电块内；和/或
    所述第二电极上设置有第二凸出部，所述第二凸出部嵌入到所述第二导电块内。
  4. 根据权利要求3所述的显示面板，其中，
    所述第一凸出部设置在所述第一接触部和/或所述第一延伸部上；和/或
    所述第二凸出部设置在所述第二接触部和/或所述第二延伸部上。
  5. 根据权利要求4所述的显示面板，其中，
    所述第一凸出部为多个，多个所述第一凸出部在所述第一电极上依次设置；和/或
    所述第二凸出部为多个，多个所述第二凸出部在所述第二电极上依次设 置。
  6. 根据权利要求1所述的显示面板，其中，构成所述容胶槽侧壁的所述第一导电块和所述第二导电块之间具有间隙，所述间隙内设置有密封胶。
  7. 根据权利要求1-6任一项所述的显示面板，其中，所述连接胶为光敏胶。
  8. 根据权利要求1-6任一项所述的显示面板，其中，所述第一导电块和所述第二导电块为金属块。
  9. 根据权利要求8所述的显示面板，其中，所述第一导电块与所述第一电极焊接，所述第二导电块与所述第二电极焊接。
  10. 根据权利要求1所述的显示面板，其中，所述发光器件包括绝缘层，以及层叠设置的第一电极层、发光层和第二电极层，所述绝缘层包裹在所述第一电极层、所述发光层以及所述第二电极层的外侧。
  11. 根据权利要求10所述的显示面板，其中，所述发光器件的垂直于所述第一电极层、所述发光层以及所述第二电极层的截面形状为倒梯形并且所述发光器件截面面积较小的底面为所述接触面。
  12. 根据权利要求10所述的显示面板，其中，所述第一电极和所述第二电极设置在所述绝缘层的靠近所述阵列基板的底面上，所述第一电极层相对所述第二电极层更靠近所述阵列基板设置。
  13. 根据权利要求12所述的显示面板，其中，所述第一电极可以通过贯穿所述绝缘层上的第一过孔与所述第一电极层电连接，所述第二电极通过贯穿所述绝缘层、所述第一电极层以及所述发光层的第二过孔与所述第二电极层电连接。
  14. 一种显示装置，包括壳体以及权利要求1-13任一项所述的显示面板，所述显示面板设置在所述壳体上。
  15. 一种制备显示面板的方法，包括
    提供阵列基板以及发光器件；
    在所述阵列基板上形成由金属构成的第一导电块和第二导电块，使所述第一导电块、所述第二导电块以及所述阵列基板围设成容胶槽；
    在所述容胶槽内填充连接胶；
    将发光器件贴附在所述阵列基板上，并且使所述第一导电块与所述发光器件上的第一电极接触，所述第二导电块与所述发光器件上的第二电极接触；
    焊接所述第一导电块与所述第一电极、并焊接所述第二导电块与所述第二电极；
    对所述发光器件和所述阵列基板进行光照，使所述容胶槽内的连接胶固化。
  16. 根据权利要求15所述的制备显示面板的方法，其中在所述容胶槽内填充连接胶之前，还包括在围设成所述容胶槽侧壁的所述第一导电块和所述第二导电块之间的间隙内填充密封胶。
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102842666A (zh) * 2011-06-22 2012-12-26 展晶科技(深圳)有限公司 Led覆晶结构及其制造方法
CN106941108A (zh) * 2017-05-23 2017-07-11 深圳市华星光电技术有限公司 微发光二极管显示面板及其制作方法
US20170352646A1 (en) * 2016-06-01 2017-12-07 X-Celeprint Limited Micro-transfer-printed light-emitting diode device
WO2019097893A1 (ja) * 2017-11-20 2019-05-23 ソニー株式会社 発光装置および表示装置
CN109801925A (zh) * 2019-01-17 2019-05-24 京东方科技集团股份有限公司 一种微led显示面板及其制备方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105742469A (zh) * 2016-04-15 2016-07-06 深圳大道半导体有限公司 半导体发光芯片
CN107123718B (zh) * 2017-04-21 2019-03-26 中国科学院福建物质结构研究所 一种倒装大功率led封装结构及其制备方法和用途

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102842666A (zh) * 2011-06-22 2012-12-26 展晶科技(深圳)有限公司 Led覆晶结构及其制造方法
US20170352646A1 (en) * 2016-06-01 2017-12-07 X-Celeprint Limited Micro-transfer-printed light-emitting diode device
CN106941108A (zh) * 2017-05-23 2017-07-11 深圳市华星光电技术有限公司 微发光二极管显示面板及其制作方法
WO2019097893A1 (ja) * 2017-11-20 2019-05-23 ソニー株式会社 発光装置および表示装置
CN109801925A (zh) * 2019-01-17 2019-05-24 京东方科技集团股份有限公司 一种微led显示面板及其制备方法

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