WO2020220960A1 - 一种终端 - Google Patents

一种终端 Download PDF

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Publication number
WO2020220960A1
WO2020220960A1 PCT/CN2020/083895 CN2020083895W WO2020220960A1 WO 2020220960 A1 WO2020220960 A1 WO 2020220960A1 CN 2020083895 W CN2020083895 W CN 2020083895W WO 2020220960 A1 WO2020220960 A1 WO 2020220960A1
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WO
WIPO (PCT)
Prior art keywords
pcb board
thermally conductive
pcb
terminal
heat
Prior art date
Application number
PCT/CN2020/083895
Other languages
English (en)
French (fr)
Inventor
段海涛
宋刚
Original Assignee
上海众链科技有限公司
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Application filed by 上海众链科技有限公司 filed Critical 上海众链科技有限公司
Publication of WO2020220960A1 publication Critical patent/WO2020220960A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties

Definitions

  • the present invention relates to the field of electronic communication technology, in particular to a terminal.
  • the battery is the core component of the mobile phone.
  • the energy storage of the mobile phone becomes the key.
  • the higher the battery capacity the more likely it is to cause safety problems such as battery instability or even explosion, so the capacity of a single battery cannot be large.
  • some mobile phone manufacturers will adopt a built-in dual-cell structure, that is, two batteries are connected in parallel to form a large-capacity battery, thereby improving the battery life of the mobile phone.
  • the current dual-cells are generally placed in an L shape
  • the PCB board is placed in the area enclosed by the dual-cells (as shown in Figure 1), or the dual-cells are placed side by side, the PCB board is divided into two and distributed At both ends of the dual cell (as shown in Figure 2), however, these two layout methods cannot solve the problem of thermal accumulation in the PCB board area, which eventually causes the shell to become hot, the grip feels uncomfortable, and the performance experience of the user changes. difference.
  • the purpose of the present invention is to provide a terminal to solve the technical problem of terminal thermal accumulation.
  • a terminal includes a housing and a PCB board arranged in the housing, the PCB board is arranged in the middle of the housing, and the terminal further includes:
  • Two electric cores are arranged in the housing and distributed on both sides of the PCB board and close to the PCB board;
  • the heat-conducting component is arranged in the casing, the middle part is connected to the PCB board, and the two ends respectively extend to the area of the electric core.
  • terminal according to the above-mentioned embodiment of the present invention may also have the following additional technical features:
  • a baseband module and a radio frequency module are provided on the PCB board, and the heat conducting component is respectively connected with the baseband module and the radio frequency module.
  • the baseband module and the radio frequency module are each close to one of the two batteries.
  • thermally conductive component is connected to the PCB board through a thermally conductive interface material.
  • thermally conductive interface material is any one of thermally conductive paste, thermally conductive silicone grease, liquid metal, thermally conductive glue or thermally conductive tape.
  • thermally conductive interface material is filled between the thermally conductive component and the PCB board.
  • the heat conducting component is a water cooling plate.
  • the heat-conducting component is connected to the top of the PCB board, and the end of the heat-conducting component extends to the upper area of the electric core and crosses the central area of the electric core.
  • the arrangement of the battery core and the PCB board is any one of the following situations:
  • the battery core and the PCB board are arranged on the same straight line along the length direction of the housing; or
  • the battery core and the PCB board are arranged in an "L" shape.
  • the end of the heat conducting component is close to the top of the battery core, and the gap between the two is between 0 mm and 2.5 mm.
  • the dual cells are placed on both sides of the PCB board, and the heat conduction components are arranged between the PCB board and the dual cells.
  • the PCB board generates heat, so the battery core is a cold zone relative to the PCB board.
  • the heat generated by the PCB board will be conducted to the battery core area on both sides through the thermally conductive component to avoid heat accumulation in the PCB board area and ensure that the shell is not easy to generate It is hot and has a good grip to ensure the performance experience of the user.
  • FIG. 1 is a layout diagram of the PCB board and the battery core of the terminal in the prior art
  • FIG. 2 is another layout diagram of the PCB board and the battery core of the terminal in the prior art
  • FIG. 3 is a three-dimensional exploded view of the internal structure of the terminal in the first embodiment of the present invention.
  • FIG. 4 is a perspective view of the internal structure of the terminal in the first embodiment of the present invention.
  • FIG. 5 is a three-dimensional exploded view of the internal structure of the terminal in the second embodiment of the present invention.
  • FIG. 6 is a diagram of the internal structure of a terminal in the third embodiment of the present invention.
  • FIGS. 3 to 4 show a terminal in the first embodiment of the present invention, which includes a housing 10, and a PCB board 20, two batteries 30, and a Heat-conducting component 40.
  • the PCB board 20 is arranged in the middle of the housing 10, the two batteries 30 are distributed on both sides of the PCB board 20, and are close to the PCB board 20, and the battery core 30 and the The PCB boards 20 are arranged on the same straight line along the length direction of the casing 10.
  • the PCB board 20 is provided with a baseband module 21 and a radio frequency module 22, and the baseband module 21 and the radio frequency module 22 are respectively close to one of the two batteries 30.
  • the middle part of the thermally conductive component 40 is connected to the top of the PCB board through a thermally conductive interface material A, specifically connected to the baseband module 21 and the radio frequency module 22, respectively. Both ends of the thermally conductive component 40 extend to On the upper area of the battery cell 30.
  • the middle portion of the thermally conductive component 40 can also be connected to the bottom or outer peripheral surface of the PCB board 20, and its two ends still extend to the area of the battery core 30
  • the middle portion of the heat-conducting component 40 is preferably arranged on the bottom or top of the PCB board 20, so that the heat-conducting component 40 can be provided with a sufficient width to increase the heat dissipation area.
  • the distance between the PCB board 20 and the battery core 30 is between 0 mm and 8 mm, preferably 0.8 mm, to ensure that there is a heat dissipation gap between the PCB board 20 and the battery core 30.
  • the end of the heat conducting component 40 crosses the central area of the cell 30 and is close to the top of the cell 30, and the gap between the end of the heat conducting component 40 and the cell 30 is between 0 mm and Between 30mm, preferably 2mm.
  • the baseband module 21 is also called a baseband AP (application processor) module, such as a CPU and GPU module.
  • the baseband module 21 and the radio frequency module 22 are the modules with the most serious heat generation among the PCB boards 20.
  • the thermally conductive interface material A is filled between the thermally conductive component 40 and the PCB board 30, that is, between the baseband module 21 and the thermally conductive component 40, and between the radio frequency module 22 and the thermally conductive component 40. Interface material with low thermal resistance.
  • the thermally conductive interface material A is any one of thermally conductive paste, thermally conductive silicone grease, liquid metal, thermally conductive glue or thermally conductive tape.
  • the heat-conducting component 40 is a water-cooled plate, which is a heat-dissipating component that has a capillary channel structure and a liquid heat transfer medium and is vacuum-sealed by a heat-conducting shell.
  • the heat conduction efficiency is extremely high. Dozens or even hundreds of times as much as heat dissipation media such as mobile phone metal structures and graphite sheets.
  • the heat-conducting component 40 may also adopt other heat-dissipating components with high heat conduction efficiency, such as heat-dissipating fins, ceramic sheets, etc.
  • the PCB board 20 is laid out in the middle of the housing 10, and the dual cells 30 are laid out on both sides of the PCB board 20, and the baseband module 21 and the radio frequency module 22 that are seriously heated are divided into regions and close to each other.
  • the electric core 30 is arranged, and a water-cooling board 40 is arranged between the PCB board 20 and the two modules. In this way, when the electric core 30 is used in the terminal, the heat generated by the electric core 30 is much lower than that of the baseband module 21 and the radio frequency module 22. Therefore, the battery core is a cold zone relative to the PCB board.
  • the heat generated by the baseband module 21 and the radio frequency module 22 will be conducted to the battery core 30 areas on both sides through the water-cooled board 40 to avoid heat accumulation in the PCB board 20 area to ensure The shell is not easy to be hot, and the grip feels good, ensuring the user's performance experience when using it.
  • FIG. 5 shows the terminal in the second embodiment of the present invention.
  • the difference between the terminal in this embodiment and the terminal in the first embodiment is:
  • the heat-conducting component 40 is two water-cooled plates, the baseband module 21 is connected to the cell 30 on the nearest side through one of the water-cooled plates, and the radio frequency module 22 is connected to the cell 30 on the other side through the other water-cooled plate.
  • the electric core 30 is connected.
  • the terminal in this embodiment is compared with the terminal in the first embodiment, because the baseband module 21 and the radio frequency module 22 both use independent heat dissipation components to dissipate heat to the cell 30 area close to one side, so that the baseband module 21 and the radio frequency module 22 The heat conduction between them does not cause interference.
  • FIG. 6 shows the terminal in the third embodiment of the present invention.
  • the difference between the terminal in this embodiment and the terminal in the first embodiment is:
  • the battery core 30 and the PCB board 20 are arranged in an "L"-shaped arrangement, and the heat-conducting component 40 is also correspondingly "L"-shaped.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Secondary Cells (AREA)

Abstract

本发明提供一种终端，包括壳体及设于所述壳体内的PCB板，所述PCB板设置在所述壳体的中部，所述终端还包括：两个电芯，设置在所述壳体内，且分布在所述PCB板的两侧，并靠近所述PCB板；以及导热部件，设置在所述壳体内，中部连接于所述PCB板上，且两端分别延伸至所述电芯的区域上。本发明中的终端，通过将PCB板布局在壳体中间，双电芯布局在PCB板两侧，并在PCB板和双电芯之间布局导热部件，终端使用时，由于电芯发热量远远低于PCB板发热量，因此电芯相对于PCB板来说就是冷区，PCB板产生的热量将通过该导热部件传导至两侧的电芯区域上，避免PCB板区域形成热堆积，确保外壳不易发烫，握持手感好，确保用户使用时的性能体验感。

Description

一种终端
本申请要求在2019年04月29日提交中国专利局、申请号为201910357565.8的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本发明涉及电子通讯技术领域，特别涉及一种终端。
背景技术
随着移动通信技术及集成电路技术的飞速发展，手机等终端产业走向真正的巅峰时代。近几年，手机不断呈现在眼前，且应竞争需求还在不断更新换代，以力求给用户最大的体验感，以博得销售市场。
众所周知，电池是手机的核心部件，为了使手机能够超长待机，手机储电量成为关键。由于电池容量越高越容易引起电池不稳定甚至爆炸等安全问题，因此单个电池的容量无法做到很大。为了增大储电量，一些手机厂商会采用内置双电芯结构，即两个电芯并联成一个大容量电池，从而提高手机的续航能力。
现有技术当中，目前双电芯一般呈L形放置，PCB板置于双电芯围成的区域内(如图1所示)，或者双电芯并列放置，PCB板一分为二且分布在双电芯的两端(如图2所示)，然而这两件布局方式都无法解决PCB板区域热堆积的问题，最终导致外壳发烫，握持手感不适，用户使用时的性能体验变差。
发明内容
基于此，本发明的目的是提供一种终端，以解决终端热堆积的技术问题。
根据本发明一实施例当中的一种终端，包括壳体及设于所述壳体内的PCB板，所述PCB板设置在所述壳体的中部，所述终端还包括：
两个电芯，设置在所述壳体内，且分布在所述PCB板的两侧，并靠近所述PCB板；以及
导热部件，设置在所述壳体内，中部连接于所述PCB板上，且两端分别延 伸至所述电芯的区域上。
另外，根据本发明上述实施例当中的终端，还可以具有以下附加技术特征：
进一步地，所述PCB板上设有基带模块及射频模块，所述导热部件分别与所述基带模块和所述射频模块连接。
进一步地，所述基带模块及所述射频模块各自靠近所述两个电芯当中的其中一个。
进一步地，所述导热部件通过导热界面材料与所述PCB板连接。
进一步地，所述导热界面材料为导热膏、散热硅脂、液态金属、导热胶水或导热胶带当中的任意一种。
进一步地，所述导热界面材料填充在所述导热部件和所述PCB板之间。
进一步地，所述导热部件为水冷板。
进一步地，所述导热部件与所述PCB板的顶部连接，所述导热部件的端部延伸至所述电芯的上方区域上，且越过所述电芯的中心区域。
进一步地，所述电芯和所述PCB板的布置方式为以下情况当中的任意一种：
所述电芯和所述PCB板沿所述壳体的长度方向排列布置在同一直线上；或
所述电芯和所述PCB板呈“L”形排列布置。
进一步地，所述导热部件的端部贴近所述电芯的顶部，且两者间隙位于0mm至2.5mm之间。
上述终端，通过将PCB板布局在壳体中间，双电芯布局在PCB板两侧，并在PCB板和双电芯之间布局导热部件，终端使用时，由于电芯发热量远远低于PCB板发热量，因此电芯相对于PCB板来说就是冷区，PCB板产生的热量将通过该导热部件传导至两侧的电芯区域上，避免PCB板区域形成热堆积，确保外壳不易发烫，握持手感好，确保用户使用时的性能体验感。
附图说明
图1为现有技术当中的终端的PCB板与电芯的一种排布图；
图2为现有技术当中的终端的PCB板与电芯的另一种排布图；
图3为本发明第一实施例中的终端的内部结构的立体分解图；
图4为本发明第一实施例中的终端的内部结构的立体图；
图5为本发明第二实施例中的终端的内部结构的立体分解图；
图6为本发明第三实施例中的终端的内部结构图。
主要元件符号说明：
壳体 10 PCB板 20
电芯 30 导热部件 40
基带模块 21 射频模块 22
导热界面材料 A    
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
为了便于理解本发明，下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的若干实施例。但是，本发明可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本发明的公开内容更加透彻全面。
需要说明的是，当元件被称为“固设于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
请参阅图3至4，所示为本发明第一实施例中的一种终端，包括一壳体10、以及设于所述壳体10内的一PCB板20、两个电芯30和一导热部件40。
所述PCB板20设置在所述壳体10的中部，两个所述电芯30分布在所述PCB板20的两侧，并靠近所述PCB板20，且所述电芯30和所述PCB板20沿所述壳体10的长度方向排列布置在同一直线上。所述PCB板20上设有基带模 块21及射频模块22，所述基带模块21及所述射频模块22各自靠近所述两个电芯30当中的其中一个。所述导热部件40的中部通过导热界面材料A连接于所述PCB板的顶部上，具体为分别与所述基带模块21及所述射频模块22连接，所述导热部件40的两端分别延伸至所述电芯30的上方区域上。
作为一种替代的实施方式，根据本发明的发明精神，所述导热部件40的中部还可以连接在所述PCB板20的底部或外周表面上，其两端依然延伸至电芯30的区域上，作为优选实施方式，所述导热部件40的中部优选设置在所述PCB板20的底部或顶部上，这样所述导热部件40就可以设置足够的宽度，提高散热面积。
优选地，所述PCB板20与所述电芯30之间的的间距位于0mm-8mm之间，优选为0.8mm，以确保所述PCB板20和所述电芯30之间存在散热间隙。除此之外，所述PCB板20和所述电芯30的外周与所述壳体10内壁之间均存在一定的散热间隙。同时，所述导热部件40的端部越过所述电芯30的中心区域，并贴近所述电芯30的顶部，且所述导热部件40的端部与所述电芯30的间隙位于0mm至30mm之间，优选为2mm。
其中，所述基带模块21又称基带AP(application processor)模块，如CPU、GPU模块。所述基带模块21和所述射频模块22为所述PCB板20当中发热最为严重的模块。
具体地，所述导热界面材料A填充在所述导热部件40和所述PCB板30之间，即基带模块21与导热部件40之间、以及射频模块22与导热部件40之间均填充一层低热阻的界面材料。其中，所述导热界面材料A为导热膏、散热硅脂、液态金属、导热胶水或导热胶带当中的任意一种。
在本实施例当中，所述导热部件40为一块水冷板，水冷板是一种具有毛细通道结构体和液态传热介质且被导热壳体真空密封起来的散热构件，其热传导效率极高，是手机金属结构件及石墨片等散热介质的几十甚至上百倍。在其它实施例当中，所述导热部件40也可以采用其它热传导效率高的散热构件，如散热鳍片、陶瓷片等。
综上，本实施例当中的终端，通过将PCB板20布局在壳体10中间，双电 芯30布局在PCB板20两侧，且将发热严重的基带模块21和射频模块22分区域且靠近电芯30布置，并在PCB板20与这两个模块之间布局一水冷板40，这样在终端使用时，由于电芯30发热量远远低于基带模块21及射频模块22的发热量，因此电芯相对于PCB板来说就是冷区，基带模块21及射频模块22产生的热量将通过该水冷板40传导至两侧的电芯30区域上，避免PCB板20区域形成热堆积，确保外壳不易发烫，握持手感好，确保用户使用时的性能体验感。
请参阅图5，所示为本发明第二实施例当中的终端，本实施例当中的终端与第一实施例当中的终端的不同之处在于：
所述导热部件40为两块水冷板，所述基带模块21通过其中一水冷板与最近一侧的所述电芯30连接，所述射频模块22通过另一水冷板与另一侧的所述电芯30连接。
本实施例当中的终端相较于第一实施例当中的终端，由于基带模块21和射频模块22均采用独立的散热构件向靠近一侧的电芯30区域散热，使得基带模块21和射频模块22之间的热传导不产生干扰。
本实施例所提供的终端，其实现原理及产生的技术效果和第一实施例相同，为简要描述，本实施例未提及之处，可参考第一实施例中相应内容。
请参阅图6，所示为本发明第三实施例当中的终端，本实施例当中的终端与第一实施例当中的终端的不同之处在于：
所述电芯30和所述PCB板20呈“L”形排列布置，所述导热部件40也相应地呈“L”形。
本实施例所提供的终端，其实现原理及产生的技术效果和第一实施例相同，为简要描述，本实施例未提及之处，可参考第一实施例中相应内容。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对本发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (10)

  1. 一种终端，包括壳体及设于所述壳体内的PCB板，其特征在于，所述PCB板设置在所述壳体的中部，所述终端还包括：
    两个电芯，设置在所述壳体内，且分布在所述PCB板的两侧，并靠近所述PCB板；以及
    导热部件，设置在所述壳体内，中部连接于所述PCB板上，且两端分别延伸至所述电芯的区域上。
  2. 根据权利要求1所述的终端，其特征在于，所述PCB板上设有基带模块及射频模块，所述导热部件分别与所述基带模块和所述射频模块连接。
  3. 根据权利要求2所述的终端，其特征在于，所述基带模块及所述射频模块各自靠近所述两个电芯当中的其中一个。
  4. 根据权利要求1或2所述的终端，其特征在于，所述导热部件通过导热界面材料与所述PCB板连接。
  5. 根据权利要求4所述的终端，其特征在于，所述导热界面材料为导热膏、散热硅脂、液态金属、导热胶水或导热胶带当中的任意一种。
  6. 根据权利要求4所述的终端，其特征在于，所述导热界面材料填充在所述导热部件和所述PCB板之间。
  7. 根据权利要求1所述的终端，其特征在于，所述导热部件为水冷板。
  8. 根据权利要求1或2所述的终端，其特征在于，所述导热部件与所述PCB板的顶部连接，所述导热部件的端部延伸至所述电芯的上方区域上，且越过所述电芯的中心区域。
  9. 根据权利要求1所述的终端，其特征在于，所述电芯和所述PCB板的布置方式为以下情况当中的任意一种：
    所述电芯和所述PCB板沿所述壳体的长度方向排列布置在同一直线上；或
    所述电芯和所述PCB板呈“L”形排列布置。
  10. 根据权利要求8所述的终端，其特征在于，所述导热部件的端部贴近所述电芯的顶部，且两者间隙位于0mm至2.5mm之间。
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