WO2020207743A1 - Keramisches bauelement und verfahren zur herstellung des keramischen bauelements - Google Patents
Keramisches bauelement und verfahren zur herstellung des keramischen bauelements Download PDFInfo
- Publication number
- WO2020207743A1 WO2020207743A1 PCT/EP2020/057631 EP2020057631W WO2020207743A1 WO 2020207743 A1 WO2020207743 A1 WO 2020207743A1 EP 2020057631 W EP2020057631 W EP 2020057631W WO 2020207743 A1 WO2020207743 A1 WO 2020207743A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metallization
- copper
- proportion
- ceramic
- ceramic component
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 82
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000001465 metallisation Methods 0.000 claims abstract description 47
- YWJVFBOUPMWANA-UHFFFAOYSA-H [Li+].[V+5].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O Chemical compound [Li+].[V+5].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O YWJVFBOUPMWANA-UHFFFAOYSA-H 0.000 claims abstract description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229910052802 copper Inorganic materials 0.000 claims abstract description 33
- 239000010949 copper Substances 0.000 claims abstract description 33
- 239000011521 glass Substances 0.000 claims abstract description 16
- 229910019142 PO4 Inorganic materials 0.000 claims abstract description 6
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052744 lithium Inorganic materials 0.000 claims abstract description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims abstract description 5
- 239000010452 phosphate Substances 0.000 claims abstract description 5
- 229910052720 vanadium Inorganic materials 0.000 claims abstract description 5
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 238000005245 sintering Methods 0.000 claims description 8
- 239000011230 binding agent Substances 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 239000007858 starting material Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 description 4
- 238000009776 industrial production Methods 0.000 description 2
- 229910011304 Li3V2 Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/36—Selection of substances as active materials, active masses, active liquids
- H01M4/58—Selection of substances as active materials, active masses, active liquids of inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFy; of polyanionic structures, e.g. phosphates, silicates or borates
- H01M4/5825—Oxygenated metallic salts or polyanionic structures, e.g. borates, phosphates, silicates, olivines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Definitions
- the present invention relates to a ceramic component having a ceramic base body and at least one metallization which is attached to an outer surface of the ceramic base body.
- the invention also relates to a method for producing the ceramic component.
- Ceramic components are widespread components in industrial production.
- the ceramic components usually have metallizations, for example for electrical contacting.
- Metallizations have a negative influence on the ceramic base body of the ceramic component.
- the object of the present invention is therefore to provide a
- the ceramic base body and at least one metallization which is attached to an outer surface of the ceramic base body, provided.
- the metallization contains Lithium vanadium phosphate with the general empirical formula Li x Vy (PC> 4) z and copper.
- glass can also be used in the
- A is the amount of copper
- b is the amount of lithium vanadium phosphate
- c is the amount of glass that is contained in the metallization and the following applies:
- x is the amount of lithium
- y is the amount of vanadium
- z is the amount of phosphate in the
- Lithium vanadium phosphate is and the following applies:
- Lithium vanadium phosphate with the general formula Li x Vy (P04) z and copper and glass or lithium vanadium phosphate with the general formula Li x Vy (P04) z and copper are used as starting materials, whereby in general
- the metallization can be produced by applying and baking a metal-containing paste, the metal-containing paste containing copper and lithium vanadium phosphate.
- the metal-containing paste can also optionally contain glass.
- the ceramic component can be a ceramic battery. Furthermore, the metallization can serve as a connection surface for making electrical contact with the ceramic component.
- the composition of the metallization is optimally matched to the composition of the ceramic base body of the ceramic component.
- the proportion of copper in the metallization ensures that the metallization is electrically conductive, which enables the ceramic component to be built into electronic components.
- the proportion of lithium vanadium phosphate in the metallization ensures sufficient adhesion of the metallization to the
- the lithium vanadium phosphate does not interact in a negative way with the ceramic base body, which leads to negative
- the metallization can have at least one cover layer, which is at least copper and / or nickel and / or Contains tin.
- the ceramic component can be soldered as a surface mounted device through this cover layer. As a result, the ceramic component can be integrated into conventional production processes for electronic components, whereby the
- a method for producing the ceramic component can include the following sub-steps:
- Component can have the following sub-steps:
- metal-containing paste is already applied to the green body and is sintered together with the green body. Sintering turns the green body into a ceramic one Base body and the metallization from the metal-containing paste. This can be an additional
- Burn-in step to burn in the metal-containing paste can be saved. This enables a reduction in the cost of manufacturing the ceramic component.
- a paste can be applied to the ceramic base body as a metal-containing paste that contains copper,
- the paste can also contain glass. If a is the proportion of copper, b is the proportion of
- the proportion by weight of copper is 56 wt% and the proportion by weight of lithium vanadium phosphate is 12.5% by weight, the paste not containing any glass. Furthermore, the proportion of binder and solvents is 31.5 wt%. The sum of all proportions is 100 wt%.
- ceramic component at least one of the thermal processes, which is selected from a group comprising
- Sintering and baking can be carried out in a reducing atmosphere.
- a reducing atmosphere is to be understood as an atmosphere that is one
- At least one can be applied to the metallization
- Top layer the copper and / or nickel and / or tin
- the application of the top layer can be galvanic, chemical or physical
- the invention is based on a
- FIG. 1 shows a ceramic component having a ceramic base body and metallizations on outer surfaces of the ceramic base body.
- Figure 1 shows a ceramic component having a ceramic base body 1 and two metallizations 2, which are on two opposite outer surfaces 1 'of the ceramic
- the component is a ceramic battery.
- a ceramic battery For the production of the ceramic component a
- Green body (not shown) provided, in which the edges are rounded. Then a
- metal-containing paste containing 56 wt% copper, 12.5 wt%
- the green body (not shown) on which the metal-containing paste is applied is then sintered. The sintering results in the ceramic base body 1 of the ceramic component and the two metallizations 2, which each contain copper and lithium vanadium phosphate.
- Copper ensures the electrical conductivity of the metallization.
- the lithium vanadium phosphate ensures adequate adhesion of the metallization to the ceramic base body
- Lithium vanadium phosphate does not result in any negative effects on the ceramic base body 1.
- Methods of manufacturing the ceramic component can vary.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Crystallography & Structural Chemistry (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Cell Electrode Carriers And Collectors (AREA)
- Secondary Cells (AREA)
- Battery Electrode And Active Subsutance (AREA)
- Ceramic Capacitors (AREA)
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Manufacturing Of Electric Cables (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE112020000024.9T DE112020000024A5 (de) | 2019-04-09 | 2020-03-19 | Keramisches Bauelement und Verfahren zur Herstellung des keramischen Bauelements |
JP2020544285A JP7027563B2 (ja) | 2019-04-09 | 2020-03-19 | セラミック部品及びセラミック部品の製造方法 |
US17/042,718 US11916236B2 (en) | 2019-04-09 | 2020-03-19 | Ceramic component and method for manufacturing the ceramic component |
CN202080001722.2A CN112055881B (zh) | 2019-04-09 | 2020-03-19 | 陶瓷构件和制造所述陶瓷构件的方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102019109308.2A DE102019109308A1 (de) | 2019-04-09 | 2019-04-09 | Keramisches Bauelement und Verfahren zur Herstellung des keramischen Bauelements |
DE102019109308.2 | 2019-04-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2020207743A1 true WO2020207743A1 (de) | 2020-10-15 |
Family
ID=69903177
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2020/057631 WO2020207743A1 (de) | 2019-04-09 | 2020-03-19 | Keramisches bauelement und verfahren zur herstellung des keramischen bauelements |
Country Status (5)
Country | Link |
---|---|
US (1) | US11916236B2 (de) |
JP (1) | JP7027563B2 (de) |
CN (1) | CN112055881B (de) |
DE (2) | DE102019109308A1 (de) |
WO (1) | WO2020207743A1 (de) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5781402A (en) * | 1994-12-26 | 1998-07-14 | Murata Manufacturing Co., Ltd. | Conducting thick film composition, thick film electrode, ceramic electronic component and laminated ceramic capacitor |
US20020046861A1 (en) * | 1999-07-22 | 2002-04-25 | Tdk Corporation | Ceramic electronic component and process for production of the same |
US20120154977A1 (en) * | 2010-12-17 | 2012-06-21 | Samsung Electro-Mechanics Co., Ltd. | Conductive paste composition for termination electrode, multilayer ceramic capacitor including the same and method of manufacturing thereof |
US20140233149A1 (en) * | 2013-02-20 | 2014-08-21 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component |
US20170301803A9 (en) * | 2012-04-17 | 2017-10-19 | Heraeus Precious Metals North America Conshohocken Llc | Conductive thick film paste for solar cell contacts |
JP2018063997A (ja) * | 2016-10-11 | 2018-04-19 | 日立化成株式会社 | チップコンデンサ及びその製造方法 |
Family Cites Families (19)
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JPS63103886A (ja) * | 1986-10-21 | 1988-05-09 | 日本碍子株式会社 | メタライズペ−ストならびにそれを使用してなるセラミツクスのメタライズ法 |
DE19714686A1 (de) * | 1997-04-09 | 1998-10-15 | Siemens Matsushita Components | Elektro-keramisches Bauelement und Verfahren zu seiner Herstellung |
JP4762353B1 (ja) | 2010-03-31 | 2011-08-31 | ナミックス株式会社 | リチウムイオン二次電池及びその製造方法 |
FR2982084B1 (fr) * | 2011-11-02 | 2013-11-22 | Fabien Gaben | Procede de fabrication d'electrodes de batteries entierement solides |
JP2013168396A (ja) | 2012-02-14 | 2013-08-29 | Canon Inc | 静電型の荷電粒子線レンズ及び荷電粒子線装置 |
CN103253989B (zh) * | 2012-02-16 | 2016-09-07 | 比亚迪股份有限公司 | 一种陶瓷表面选择性金属化方法和一种陶瓷 |
CN103373860A (zh) | 2012-04-27 | 2013-10-30 | 比亚迪股份有限公司 | 陶瓷基体表面金属化涂层组合物、陶瓷基体表面金属化方法及其制备的涂层和陶瓷 |
JP5546074B2 (ja) | 2013-02-28 | 2014-07-09 | 株式会社日立製作所 | 導電性ペースト及びそれを用いた電極配線を具備する電子部品 |
DE102014209106A1 (de) * | 2013-06-05 | 2014-12-11 | Ceramtec Gmbh | Metallisierung auf keramischen Substraten |
US10218032B2 (en) * | 2015-03-10 | 2019-02-26 | Tdk Corporation | Li-ion conductive oxide ceramic material including garnet-type or similar crystal structure |
JP6693226B2 (ja) | 2016-03-30 | 2020-05-13 | Tdk株式会社 | 全固体型二次電池 |
US11254573B2 (en) | 2016-09-29 | 2022-02-22 | Tdk Corporation | Lithium ion-conducting solid electrolyte and solid-state lithium ion rechargeable battery |
JP6680175B2 (ja) * | 2016-10-14 | 2020-04-15 | トヨタ自動車株式会社 | フッ化物イオン電池 |
JP2020095776A (ja) | 2017-03-30 | 2020-06-18 | Tdk株式会社 | 固体電解質および全固体二次電池 |
JP7009761B2 (ja) | 2017-03-30 | 2022-01-26 | Tdk株式会社 | 全固体型二次電池 |
WO2018181812A1 (ja) | 2017-03-30 | 2018-10-04 | Tdk株式会社 | 固体電解質及び全固体二次電池 |
WO2018186449A1 (ja) | 2017-04-07 | 2018-10-11 | 株式会社村田製作所 | 二次電池 |
JP2019003757A (ja) | 2017-06-13 | 2019-01-10 | 日立金属株式会社 | 全固体電池及びその製造方法 |
DE102018200110A1 (de) * | 2018-01-05 | 2019-07-11 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Elektrochemische Zelle mit Komponenten aus einem organisch-anorganischen Hybridmaterial und weitere Verwendungen dieses Hybridmaterials |
-
2019
- 2019-04-09 DE DE102019109308.2A patent/DE102019109308A1/de not_active Withdrawn
-
2020
- 2020-03-19 CN CN202080001722.2A patent/CN112055881B/zh active Active
- 2020-03-19 JP JP2020544285A patent/JP7027563B2/ja active Active
- 2020-03-19 WO PCT/EP2020/057631 patent/WO2020207743A1/de active Application Filing
- 2020-03-19 DE DE112020000024.9T patent/DE112020000024A5/de active Pending
- 2020-03-19 US US17/042,718 patent/US11916236B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5781402A (en) * | 1994-12-26 | 1998-07-14 | Murata Manufacturing Co., Ltd. | Conducting thick film composition, thick film electrode, ceramic electronic component and laminated ceramic capacitor |
US20020046861A1 (en) * | 1999-07-22 | 2002-04-25 | Tdk Corporation | Ceramic electronic component and process for production of the same |
US20120154977A1 (en) * | 2010-12-17 | 2012-06-21 | Samsung Electro-Mechanics Co., Ltd. | Conductive paste composition for termination electrode, multilayer ceramic capacitor including the same and method of manufacturing thereof |
US20170301803A9 (en) * | 2012-04-17 | 2017-10-19 | Heraeus Precious Metals North America Conshohocken Llc | Conductive thick film paste for solar cell contacts |
US20140233149A1 (en) * | 2013-02-20 | 2014-08-21 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component |
JP2018063997A (ja) * | 2016-10-11 | 2018-04-19 | 日立化成株式会社 | チップコンデンサ及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN112055881A (zh) | 2020-12-08 |
CN112055881B (zh) | 2022-05-24 |
JP7027563B2 (ja) | 2022-03-01 |
DE112020000024A5 (de) | 2020-11-26 |
US20210135221A1 (en) | 2021-05-06 |
US11916236B2 (en) | 2024-02-27 |
DE102019109308A1 (de) | 2020-10-15 |
JP2021516653A (ja) | 2021-07-08 |
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