WO2020207241A1 - 电子设备壳体及其制作方法和电子设备 - Google Patents

电子设备壳体及其制作方法和电子设备 Download PDF

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Publication number
WO2020207241A1
WO2020207241A1 PCT/CN2020/080974 CN2020080974W WO2020207241A1 WO 2020207241 A1 WO2020207241 A1 WO 2020207241A1 CN 2020080974 W CN2020080974 W CN 2020080974W WO 2020207241 A1 WO2020207241 A1 WO 2020207241A1
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WO
WIPO (PCT)
Prior art keywords
area
layer
electronic device
housing
device housing
Prior art date
Application number
PCT/CN2020/080974
Other languages
English (en)
French (fr)
Inventor
贾玉虎
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Priority to EP20786729.2A priority Critical patent/EP3930431A4/en
Publication of WO2020207241A1 publication Critical patent/WO2020207241A1/zh
Priority to US17/467,897 priority patent/US20210400829A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44F—SPECIAL DESIGNS OR PICTURES
    • B44F1/00—Designs or pictures characterised by special or unusual light effects
    • B44F1/02—Designs or pictures characterised by special or unusual light effects produced by reflected light, e.g. matt surfaces, lustrous surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
    • B05D1/322—Removable films used as masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/22—Removing surface-material, e.g. by engraving, by etching
    • B44C1/221—Removing surface-material, e.g. by engraving, by etching using streams of abrasive particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/22—Removing surface-material, e.g. by engraving, by etching
    • B44C1/227—Removing surface-material, e.g. by engraving, by etching by etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/22—Removing surface-material, e.g. by engraving, by etching
    • B44C1/228—Removing surface-material, e.g. by engraving, by etching by laser radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44F—SPECIAL DESIGNS OR PICTURES
    • B44F1/00—Designs or pictures characterised by special or unusual light effects
    • B44F1/02—Designs or pictures characterised by special or unusual light effects produced by reflected light, e.g. matt surfaces, lustrous surfaces
    • B44F1/04—Designs or pictures characterised by special or unusual light effects produced by reflected light, e.g. matt surfaces, lustrous surfaces after passage through surface layers, e.g. pictures with mirrors on the back
    • B44F1/045—Designs or pictures characterised by special or unusual light effects produced by reflected light, e.g. matt surfaces, lustrous surfaces after passage through surface layers, e.g. pictures with mirrors on the back having mirrors or metallic or reflective layers at the back side
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0279—Improving the user comfort or ergonomics
    • H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H05K5/0243—Mechanical details of casings for decorative purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
    • B05D1/322—Removable films used as masks
    • B05D1/325—Masking layer made of peelable film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/60—Deposition of organic layers from vapour phase
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2203/00—Other substrates
    • B05D2203/30—Other inorganic substrates, e.g. ceramics, silicon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/06—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/50—Multilayers
    • B05D7/52—Two layers
    • B05D7/53—Base coat plus clear coat type

Definitions

  • This application relates to the technical field of electronic equipment, and in particular to an electronic equipment housing, a manufacturing method thereof, and electronic equipment.
  • This application aims to solve one of the technical problems in the related technology at least to a certain extent.
  • the inventor conducted in-depth research and found that the appearance of the shadow is mainly because the casing body 1 has a certain transmittance.
  • the graphic layer 2 produces a reflection 4 under the illumination of the light source 3, and the reflection 4 passes through the bottom surface 12 of the casing body. After reflection, the shadow 5 appears on the surface 11 of the shell body again. Refer to FIG. 1 for the specific principle diagram. Based on this discovery, the inventor proposed that the reflection conditions around the graphic layer can be changed, thereby destroying the optical conditions for shadow formation, that is, eliminating the shadow effect from the principle of shadow formation.
  • the purpose of the present application is to provide an electronic device housing with no shadow on the graphic layer and better appearance effect, and a manufacturing method and electronic device thereof.
  • this application provides an electronic device housing.
  • the electronic device housing includes: a housing body having a first surface and a second surface opposite to each other, and the first surface has a first area and a second surface that are adjacently arranged Two areas, the second area is located around the first area, and the surface roughness of the second area is greater than the surface roughness of the first area; and a graphic layer, the graphic layer is arranged on On the first surface, the orthographic projection of the graphic layer on the first surface overlaps the first area.
  • the present application provides a method for preparing an electronic device housing.
  • the method includes: forming a graphic layer on a first surface of the housing body, wherein the first surface has a first area and a second area adjacently disposed, and the graphic The orthographic projection of the layer on the first surface overlaps the first area, and the second area is located around the first area; and the second area is roughened.
  • an electronic device housing with better appearance can be prepared conveniently and quickly, with simple steps, convenient operation, easy industrial production, and when external light is irradiated to the first surface of the prepared electronic device housing, Compared with the first area, the light irradiated to the second area is more diffusely reflected, so that the imaging ability of the light irradiated to the second area is significantly weakened, so that the shadow effect can be effectively eliminated, and the user can see clear and clear graphics.
  • the boundary is clear, which improves the appearance of the electronic device housing
  • the electronic device includes a housing in which an accommodating space is defined; and a display screen, the display screen is arranged in the accommodating space, and the light-emitting surface of the display screen faces away from One side of the housing; wherein the housing includes: a housing body having a first surface and a second surface opposite to each other, and the first surface has a first area adjacent to it And a second area, and are arranged in a direction away from the containing space, the second area is located around the first area, and the surface roughness of the second area is greater than the surface roughness of the first area And a graphic layer, the graphic layer is disposed on the first surface, and the orthographic projection of the graphic layer on the first surface overlaps the first area.
  • the housing in the electronic device can effectively eliminate the shadow effect of the graphic layer, and the graphic layer viewed by the user is clear and the boundary is clear, which obviously improves the appearance effect of the electronic device.
  • Figure 1 is a schematic diagram of the principle of shadowing in the related art.
  • Fig. 2a is a schematic plan view of a housing of an electronic device according to an embodiment of the present application.
  • FIG. 3 is a schematic cross-sectional structure diagram of an electronic device housing according to an embodiment of the present application.
  • FIG. 4 is a schematic flowchart of a method for preparing an electronic device housing according to an embodiment of the present application.
  • FIG. 5 is a schematic flowchart of a method for preparing an electronic device housing according to another embodiment of the present application.
  • FIG. 6 is a schematic flowchart of a method for preparing an electronic device housing according to another embodiment of the present application.
  • Fig. 7 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • Fig. 8 is a photograph of the graphic layer of the housing obtained in Example 1 of the present application.
  • Fig. 9 is a photograph of the graphic layer of the housing obtained in Comparative Example 1 of the present application.
  • the electronic device housing 100 includes a housing body 10 having a first surface 11 and a second surface 12 opposite to each other.
  • the surface 11 has a first area 112 and a second area 114 adjacent to each other.
  • the second area 114 is located around the first area 112, and the surface roughness of the second area 114 is greater than that of the first area.
  • the surface roughness of the region 112; and the graphic layer 20, the graphic layer 20 is disposed on the first surface 11, and the orthographic projection of the graphic layer 20 on the first surface 11 is the same as the The first area 112 overlaps.
  • the electronic device housing by making the surface roughness of the second area greater than the surface roughness of the first area, when external light irradiates the first surface, compared with the first area, the light irradiated to the second area is more Diffuse reflection occurs frequently, which greatly weakens the imaging ability of the light irradiated to the second area, thereby effectively eliminating the shadow effect.
  • the graphics and text layers viewed by the user are clear and the boundaries are clear, which significantly improves the appearance of the electronic device housing.
  • the terms “first” and “second” are only used for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features.
  • the description method adopted in this application “the second area is located around the first area” refers to the side far from the first area at any edge position of the first area, if the edge line of the first area is connected end to end The circumference refers to the side of the edge line away from the first area.
  • FIG. 2a is only an exemplary illustration of the structure and shape of the electronic device housing of the present application, and cannot be construed as a limitation of the present application. Other alternative structures and shapes are also within the protection scope of the present application. .
  • the transmittance of the shell body is large, the light reflected to form shadows is less, and the imaging ability is weak, the shadow effect is relatively not very obvious at this time; if the transmittance of the shell body is small, the light from the first There is also very little light irradiated into the shell body from one surface, and even less light is further reflected by the second surface of the shell body to form shadows. At this time, the shadow effect is relatively insignificant; If the transmittance is not particularly large or small, a certain amount of light can form a shadow, and the effect on the appearance is more obvious.
  • the transmittance of the housing body can be 2%-50% Specifically, it can be 2%-20%, such as 2%, 5%, 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, etc. Therefore, the effect of improving the shadow is better.
  • the material of the housing body may be ceramic.
  • ceramics usually have a certain transmittance, and external light irradiates the ceramic shell body to transmit and reflect. Therefore, the graphic layer is very prone to shadow problems, and by setting the second area with a larger surface roughness , Can cause diffuse reflection of external light after irradiating the second area, thereby destroying the shadow forming conditions and effectively eliminating the shadow effect.
  • the surface roughness of the first area and the second area can be adjusted according to actual usage requirements.
  • the first area may be a mirror surface.
  • the surface roughness Ra of the first area may be less than 0.03 microns (such as 0.03 microns, 0.025 microns, 0.02 microns, 0.015 microns, 0.012 microns, 0.01 microns, 0.006 microns, etc.), Therefore, the appearance effect of the graphic layer is better, and the user experience is better; and the second area can be a matte surface.
  • the surface roughness Ra of the second area can be 0.03 to 0.1 microns (such as 0.03 microns, 0.04 Micrometers, 0.05 micrometers, 0.06 micrometers, 0.07 micrometers, 0.08 micrometers, 0.09 micrometers, 0.1 micrometers, etc.), as a result, external light is diffusely reflected in the second area and cannot be imaged, which can effectively eliminate edge shadows and has a matte transformation The effect, the visual impact is stronger, and the appearance effect is better.
  • the graphic layer can be a decorative pattern layer used to decorate the appearance.
  • the specific shape can be flexibly selected according to needs, such as geometry Graphics, decorative lines, character patterns, animal patterns, cartoon patterns, landscape patterns, plant patterns, etc., can also be the identification information layer (such as manufacturer's logo, model logo, etc.), and its size, material and color can be based on the electronic device shell Choose the size, material and appearance effect you want to achieve, so I won’t repeat them here.
  • the graphic layer can be a single-layer structure or a multi-layer structure, and the specific materials forming the graphic layer can be selected according to needs.
  • a silver film can be used to form the graphic layer, and the silver film includes The zirconium dioxide layer and the chromium layer are stacked, wherein the thickness of the zirconium dioxide layer can be 10-15 nanometers (for example, 10 nanometers, 11 nanometers, 12 nanometers, 13 nanometers, 14 nanometers, 15 nanometers, etc.), the chromium layer The thickness can be 20-60 nanometers (specifically, 20 nanometers, 25 nanometers, 30 nanometers, 35 nanometers, 40 nanometers, 45 nanometers, 50 nanometers, 55 nanometers, 60 nanometers, etc.); a golden film can also be used to form the graphic layer
  • the golden film system includes a first silicon dioxide layer, a titanium dioxide layer, and a second silicon dioxide layer that are stacked, wherein the thickness of the first silicon dioxide layer may
  • the specific shape and size of the second area can be selected according to the shape and size of the first area, as long as the second area can cover the shadowed area of the graphic layer on the first area, and the specific size can be selected according to the shell
  • the optical parameters such as the refractive index of the body are determined.
  • the second area may only be a range of a predetermined width around the first area, and the predetermined width may be the theoretical width beyond the first area that can be irradiated by the light used to form the shadow. , It can also be slightly wider than the theoretical width mentioned above, or it can be all areas on the first surface except the first area.
  • the electronic device housing may further include an anti-fingerprint layer 30, and the anti-fingerprint layer 30 is disposed on the first surface 11 and covers the graphic layer 20.
  • the slippery feel of the housing of the electronic device can be increased, and the user's hand feeling can be improved while avoiding fingerprint stains.
  • the above-mentioned anti-fingerprint layer may be a conventional anti-fingerprint layer in the art, for example, a perfluoropolyether anti-fingerprint layer, etc., and its thickness may be 10-30 nm (specifically, 10 nm, 15 nm, 20 nm, 25 nm). Nanometer, 30 nanometer, etc.), the specific preparation process can be carried out according to conventional technology, and will not be repeated here.
  • the present application provides a method for preparing an electronic device housing. According to an embodiment of the present application, referring to FIG. 4, the method includes:
  • a graphic layer is formed on the first surface of the housing body, wherein the first surface has a first area and a second area adjacently arranged, and the graphic layer is on the first surface
  • the orthographic projection of is overlapped with the first area, and the second area is located around the first area.
  • the step of forming a graphic layer may be: forming a shielding layer 40 on the first surface, the shielding layer 40 does not cover the first area 112 and the second area 114; A coating layer 50 is formed on the first region 112 and the second region 114; the coating layer on the second region 114 is removed, and the coating layer on the first region 112 constitutes the graphic layer 20 ; Remove the shielding layer 40.
  • the housing body can be cleaned before the shielding layer is formed. Specifically, the housing body can be subjected to ultrasonic cleaning and drying treatments in sequence. Therefore, the surface stains of the casing body can be effectively removed, the cleanliness of the surface of the casing body can be improved, and the adhesion of the shielding layer can be improved.
  • the shielding layer may be an ink layer, specifically an aqueous ink layer.
  • a water-based ink layer can be screen-printed on the first surface except the first area and the second area as the shielding layer, and the thickness of the ink layer can be 5-20 microns or 8-15 microns (specifically, 5 micrometers, 8 micrometers, 10 micrometers, 12 micrometers, 15 micrometers, 18 micrometers, 20 micrometers, etc.), after silk screen printing at 100-150 degrees Celsius (specifically, 100 degrees Celsius, 110 degrees Celsius, 120 degrees Celsius, 130 degrees Celsius, 140 degrees Celsius, 150 degrees Celsius Bake under the conditions of 20-40 minutes (specifically, 20 minutes, 25 minutes, 30 minutes, 35 minutes, 40 minutes, etc.).
  • the coating layer can be coated by a vacuum coating method (vacuum coating generally refers to the use of high-temperature evaporation of compounds in a vacuum equipment to make the compounds adhere to the base material to achieve molecular-level substance stacking, or through high-energy particles impacting elemental targets to make the target
  • the material escapes elemental atoms and meets the target gas near the base material to generate compounds, which are formed by controlling the gas content to control the product.
  • the shell body forming the shielding layer can be placed in the vacuum coating equipment, as required Design the film system for coating, for example, you can select different materials for multiple coatings to obtain a coating layer with multiple layers of different materials.
  • the specific operation steps and coating parameters can be carried out in accordance with conventional techniques. Detailed description.
  • a graphic layer with a target shape and size can be obtained.
  • the coating layer can be patterned by at least one of dry etching, wet etching and laser laser engraving, that is, the coating layer on the second area is removed by the above method.
  • the specific operation steps and parameters are all It can be carried out according to the conventional process, and there is no special restriction requirement here.
  • a laser engraving method can be used to remove the coating layer on the second area. This method has better fineness, and the obtained graphic layer is more refined and the appearance effect is better.
  • a picosecond laser (a laser with a pulse width of picoseconds) can be used for laser laser engraving, because the picosecond laser has the characteristics of picosecond ultra-short pulse width, adjustable repetition frequency, and high pulse energy, which can damage brittle materials. Small, no chipping and cracks, can obtain higher precision and clearer graphics layer.
  • the depth of laser engraving can be 5-10 microns (specifically, 5 microns, 6 microns, 7 microns, 8 microns, 9 microns, 10 microns, etc.), so that clear and better appearance images can be obtained. If the depth of the laser engraving is too deep, it will waste cutting energy and reduce the production efficiency. If the depth of the laser engraving is too shallow, the coating film may remain and affect the appearance.
  • the masking layer can be removed by peeling, etching, cleaning, etc., specifically, when the masking layer is a water-soluble ink layer, the masking layer can be removed by ultrasonic cleaning. Therefore, the operation is simple, convenient, fast, and low in cost.
  • this step can be performed by at least one of sandblasting, wet etching and laser engraving.
  • the sandblasting method can place the sand in the sandblasting equipment, adjust the appropriate sandblasting pressure, so that the surface of the second area has a suitable surface roughness (for example, the surface roughness Ra is within 0.03 to 0.1 microns, specifically Such as 0.03 microns, 0.04 microns, 0.05 microns, 0.06 microns, 0.07 microns, 0.08 microns, 0.09 microns, 0.1 microns, etc.), where sand materials include but are not limited to SiO 2 material, SiC material, Al 2 O 3 material, etc.
  • the mesh number of sand can range from 4000 mesh to 8000 mesh (specifically, such as 4000 mesh, 5000 mesh, 6000 mesh, 7000 mesh, 8000 mesh, etc.), and the blasting pressure can be about 0.1 MPa to 5 MPa (specifically, 0.1 MPa, 1 MPa, 2 MPa, 3MPa, 4MPa, 5MPa, etc.); wet etching can use an acidic solution containing HF to corrode the second area, where the concentration of HF in the acidic solution can be 0.5%wt to 20%wt (for example, 0.5%wt, 1 %Wt, 2%wt, 3%wt, 4%wt, 5%wt, 6%wt, 7%wt, 8%wt, 9%wt, 10%wt, 11%wt, 12%wt, 13%wt , 14%wt, 15%wt, 16%wt, 17%wt, 18%wt, 19%wt, 20%wt, etc.), the contact time between the
  • the method further includes forming an anti-fingerprint layer 30 on the first surface 11.
  • the anti-fingerprint layer can be formed by vacuum coating, and the specific operation steps and parameters can be performed by conventional methods, which will not be repeated here.
  • a transition layer can be formed before forming the anti-fingerprint layer, first to increase the bonding strength between the anti-fingerprint layer and the housing body, and to enhance the wear resistance of the anti-fingerprint layer.
  • silicon dioxide can be used to form a transition layer with a thickness of 10-30 nanometers (specifically, 10 nanometers, 15 nanometers, 20 nanometers, 25 nanometers, 30 nanometers, etc.), and then an anti-fingerprint layer is formed on the transition layer. It can be 10-30 nanometers (specifically, 10 nanometers, 15 nanometers, 20 nanometers, 25 nanometers, 30 nanometers, etc.).
  • the material of the anti-fingerprint layer can be a conventional anti-fingerprint layer material, such as perfluoropolyether. Go into details one by one.
  • an electronic device housing with better appearance can be prepared conveniently and quickly, with simple steps, convenient operation, easy industrial production, and when external light is irradiated to the first surface of the prepared electronic device housing, Compared with the first area, the light irradiated to the second area is more diffusely reflected, so that the imaging ability of the light irradiated to the second area is significantly weakened, so that the shadow effect can be effectively eliminated, and the user can see clear and clear graphics. The boundary is clear, and the appearance effect of the electronic device housing is improved. It can be understood that this method can be used to prepare the aforementioned electronic device housing. It can be understood that this method can be effectively used to prepare the aforementioned electronic device housing.
  • the electronic device includes a housing 100 having an accommodation space therein; a display screen 200, the display screen 200 is disposed in the accommodation space, and the display The light-emitting surface of the screen 200 (that is, the surface on which the user views the display screen) faces away from the side of the housing 100.
  • the housing 100 includes a housing body 10, and the housing The body 10 has a first surface 11 and a second surface 12 opposite to each other.
  • the first surface 11 has a first area 112 and a second area 114 adjacent to each other, and the second area 114 is located in the first area.
  • the housing in the electronic device can effectively eliminate the shadow effect of the graphics and text layers, and the graphics and text layers viewed by the user are clear with clear boundaries, which significantly improves the appearance of the electronic device. It can be understood that the housing in the electronic device may be the aforementioned electronic device housing.
  • FIG. 7 exemplifies the structure of the electronic device with a mobile phone as an example, and it cannot be understood as a limitation of the application.
  • the specific type of the electronic device is not particularly limited, such as including but not Limited to mobile phones, laptops, tablets, game consoles, wearable devices, etc.
  • the electronic device may also include structures and components necessary for conventional electronic devices. For example, taking a mobile phone as an example, it may also include a CPU. , Touch screen, front cover, camera module, fingerprint module, battery, electro-acoustic module and other structures and components of conventional mobile phones, so I won’t repeat them here.
  • the coating layer on the first area that has not been removed constitutes the graphic layer.
  • the depth of the laser engraving is 5-10 microns. You can control the laser laser engraving parameters.
  • the surface roughness Ra of the second area exposed after laser laser engraving can be 0.03 ⁇ 0.1 ⁇ m without additional roughening treatment. That is, one-step laser laser engraving can remove the unnecessary coating layer while making the first area It is a mirror surface, and the second area is a matte surface;
  • the specific preparation method is the same as the embodiment, the difference is that in the step of forming the coating layer, the shielding layer covers the second area but not the first area. After vacuum coating, only the coating layer is formed on the first area to form the graphic layer. Carry out the steps of laser engraving. The picture of the graphic layer of the obtained shell is shown in Figure 9.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Mechanical Engineering (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

提供了电子设备壳体及其制作方法和电子设备，该电子设备壳体包括：壳体本体，所述壳体本体具有相对的第一表面和第二表面，所述第一表面上具有相邻设置的第一区域和第二区域，所述第二区域位于所述第一区域的四周，且所述第二区域的表面粗糙度大于所述第一区域的表面粗糙度；及图文层，所述图文层设置在所述第一表面上，且所述图文层在所述第一表面上的正投影与所述第一区域重叠。

Description

电子设备壳体及其制作方法和电子设备
相关申请的交叉引用
本申请要求于2019年04月10日提交的申请号为201910282817.5的中国专利申请的优先权权益，并将其全部引入本文。
技术领域
本申请涉及电子设备技术领域，具体的，涉及电子设备壳体及其制作方法和电子设备。
背景技术
目前，电子设备壳体的外观面上通常需要设置一些标识信息或装饰图案，但目前设置装饰图案或者标识信息时，容易在其周围出现阴影，使得装饰图案和标识信息外观效果不佳，影响用户体验。
因而，目前的电子设备壳体相关技术仍有待改进。
申请内容
本申请旨在至少在一定程度上解决相关技术中的技术问题之一。
本申请是基于发明人的以下发现和认识而发现的：
相关技术中，在电子设备壳体上形成图文层后，在实际使用过程中图文层的四周存在外观阴影，使得用户观看图文层时存在模糊不清、边界不清晰等问题，影响用户体验。发明人发现该问题后，进行了深入研究，发现出现外观阴影主要是因为壳体本体1具有一定透过率，图文层2在光源3照射下产生倒影4，倒影4经过壳体本体底面12反射，重新回到壳体本体表面11出现阴影5，具体原理图参照图1。基于该发现，发明人提出可以改变图文层四周的反射条件，从而破坏阴影形成的光学条件，即从形成阴影的原理上消除阴影效果。
有鉴于此，本申请的目的在于提出一种图文层不存在阴影、外观效果较佳的电子设备壳体及其制作方法和电子设备。
在本申请的一个方面，本申请提供了一种电子设备壳体。根据本申请的实施例，该电子设备壳体包括：壳体本体，所述壳体本体具有相对的第一表面和第二表面，所述第一表面上具有相邻设置的第一区域和第二区域，所述第二区域位于所述第一区域的四周，且所 述第二区域的表面粗糙度大于所述第一区域的表面粗糙度；及图文层，所述图文层设置在所述第一表面上，且所述图文层在所述第一表面上的正投影与所述第一区域重叠。该电子设备壳体中，通过使得第二区域的表面粗糙度大于第一区域的表面粗糙度，当外界光线照射到第一表面时，与第一区域相比，照射到第二区域的光线更多的发生漫反射，从而使得照射到第二区域的光线成像能力大大减弱，从而可以有效消除阴影效果，用户观看到的图文层清楚、边界清晰，明显提高了电子设备壳体的外观效果。
在本申请的第二方面，本申请提供了一种制备电子设备壳体的方法。根据本申请的实施例，该方法包括：在壳体本体的第一表面上形成图文层，其中，所述第一表面上具有相邻设置的第一区域和第二区域，所述图文层在所述第一表面上的正投影与所述第一区域重叠，所述第二区域位于所述第一区域的四周；对所述第二区域进行粗化处理。通过该方法，可以方便快速的制备得到外观效果较佳的电子设备壳体，步骤简单、操作方便，易于工业化生产，且当外界光线照射至制备获得的电子设备壳体的第一表面时，与第一区域相比，照射到第二区域的光线更多的发生漫反射，从而使得照射到第二区域的光线成像能力显著减弱，从而可以有效消除阴影效果，用户观看到的图文层清楚、边界清晰，提高了电子设备壳体的外观效果
在本申请的第三方面，本申请提供了一种电子设备。根据本申请的实施例，该电子设备包括壳体，所述壳体中限定有容纳空间；及显示屏，所述显示屏设置在所述容纳空间中，且所述显示屏的出光面朝向远离所述壳体的一侧；其中，所述壳体包括：壳体本体，所述壳体本体具有相对的第一表面和第二表面，所述第一表面上具有相邻设置的第一区域和第二区域，且朝向远离所述容纳空间的方向设置，所述第二区域位于所述第一区域的四周，且所述第二区域的表面粗糙度大于所述第一区域的表面粗糙度；及图文层，所述图文层设置在所述第一表面上，所述图文层在所述第一表面上的正投影与所述第一区域重叠。该电子设备中的壳体，可以有效消除图文层的阴影效果，用户观看到的图文层清楚、边界清晰，明显提高了电子设备的外观效果。
附图说明
图1相关技术中产生阴影的原理示意图。
图2a是本申请一个实施例的电子设备壳体的平面结构示意图。
图2b是图2a中A-A线的剖面结构示意图。
图3是本申请一个实施例的电子设备壳体的剖面结构示意图。
图4是本申请一个实施例的制备电子设备壳体的方法的流程示意图。
图5是本申请另一个实施例的制备电子设备壳体的方法的流程示意图。
图6是本申请另一个实施例的制备电子设备壳体的方法的流程示意图。
图7是本申请一个实施例的电子设备的结构示意图。
图8是本申请实施例1得到的壳体的图文层的照片。
图9是本申请对比例1得到的壳体的图文层的照片。
具体实施方式
下面详细描述本申请的实施例。下面描述的实施例是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。实施例中未注明具体技术或条件的，按照本领域内的文献所描述的技术或条件或者按照产品说明书进行。
在本申请的一个方面，本申请提供了一种电子设备壳体。根据本申请的实施例，参照图2a和图2b，该电子设备壳体100包括：壳体本体10，所述壳体本体10具有相对的第一表面11和第二表面12，所述第一表面11上具有相邻设置的第一区域112和第二区域114，所述第二区域114位于所述第一区域112的四周，且所述第二区域114的表面粗糙度大于所述第一区域112的表面粗糙度；及图文层20，所述图文层20设置在所述第一表面11上，且所述图文层20在所述第一表面11上的正投影与所述第一区域112重叠。该电子设备壳体中，通过使得第二区域的表面粗糙度大于第一区域的表面粗糙度，当外界光线照射到第一表面时，与第一区域相比，照射到第二区域的光线更多的发生漫反射，从而使得照射到第二区域的光线成像能力大大减弱，从而可以有效消除阴影效果，用户观看到的图文层清楚、边界清晰，明显提高了电子设备壳体的外观效果。
在本申请的描述中，需要理解的是，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。另外，本申请中采用的描述方式“第二区域位于所述第一区域的四周”是指第一区域任意边缘位置处远离第一区域的一侧，如果第一区域的边缘线是一条首尾相连的线，则四周是指其边缘线远离第一区域的一侧，如果第一区域的边缘线不能构成一条首尾相连的线，以图2a所示的圆环形的第一区域为例，则第一区域的四周是指圆环形的外边缘线线远离第一区域的一侧，和圆环形的内边缘线远离第一区域的一侧。本领域技术人员可以理解，图2a仅是示例性说明本申请的电子设备壳体的结构和形状，不能理解为对本申请的限制，其他可替换的结构和形状也在本申请的保护范围之内。
可以理解，如果壳体本体的透过率很大，反射形成阴影的光线较少，成像能力较弱， 此时阴影效果相对不是很明显；如果壳体本体的透过率很小，光线从第一表面照射进入壳体本体的光线也很少，进一步经壳体本体的第二表面反射回来用于形成阴影的光线则更少，此时阴影效果也相对不是很明显；而如果壳体本体的透过率不是特别大也不是特别小的情况，则有一定的光线能够形成阴影，对外观的效果影响则比较明显，因此，具体的，壳体本体的透过率可以为2％～50％，具体可以为2％～20％，例如2％、5％、10％、15％、20％、25％、30％、35％、40％、45％、50％等。由此，改善阴影的效果更佳。
可以理解，上述壳体本体的材质可以为陶瓷。具体的，陶瓷通常具有一定的透过率，外界光线照射到陶瓷壳体本体上会发生透射和反射，由此图文层极易产生阴影问题，而通过设置表面粗度更大的第二区域，可以使得外界光线照射到第二区域后发生漫反射，从而破坏阴影的形成条件，有效消除阴影效果。
可以理解，第一区域和第二区域的表面粗糙度可以根据实际使用要求进行调整。具体的，第一区域可以为镜面，具体的，第一区域的表面粗糙度Ra可以小于0.03微米(如0.03微米、0.025微米、0.02微米、0.015微米、0.012微米、0.01微米、0.006微米等)，由此，图文层的外观效果较好，用户体验较佳；而第二区域可以为哑光表面，具体的，第二区域的表面粗糙度Ra可以为0.03～0.1微米(如0.03微米、0.04微米、0.05微米、0.06微米、0.07微米、0.08微米、0.09微米、0.1微米等)，由此，外界光线在第二区域发生漫反射，无法成像，从而可以有效消除边缘阴影，且具有光哑变换的效果，视觉冲击力较强，外观效果更佳。
可以理解，图文层的具体形状、尺寸、材质、颜色等等没有特别限制要求，具体的，图文层可以是用于装饰外观的装饰图案层，具体形状可以根据需要灵活选择，具体如几何图形、装饰线条、人物图案、动物图案、卡通图案、风景图案、植物图案等等，也可以是标识信息层(如生产厂商标识、型号标识等)，其尺寸、材质和颜色可以根据电子设备壳体的尺寸、材质和想要实现的外观效果进行选择，在此不再一一赘述。
可以理解，图文层可以为单层结构也可以为多层结构，且形成图文层的具体材料可以根据需要进行选择，具体的，可以采用银色膜系形成图文层，该银色膜系包括层叠设置的二氧化锆层和铬层，其中，二氧化锆层的厚度可以为10～15纳米(具体如10纳米、11纳米、12纳米、13纳米、14纳米、15纳米等)，铬层的厚度可以为20～60纳米(具体如20纳米、25纳米、30纳米、35纳米、40纳米、45纳米、50纳米、55纳米、60纳米等)；也可以采用金色膜系形成图文层，该金色膜系包括层叠设置的第一二氧化硅层、二氧化钛层和第二二氧化硅层，其中，第一二氧化硅层的厚度可以为15纳米，二氧化钛层的厚度可以为20纳米，第二二氧化硅层的厚度可以为18纳米。
可以理解，第二区域的具体形状和尺寸可以根据第一区域的形状和尺寸进行选择，只要第二区域可以覆盖第一区域上的图文层形成阴影的区域即可，具体的尺寸可以根据壳体本体的折射率等光学参数进行确定，例如第二区域可以仅为第一区域四周预定宽度的范围，该预定宽度可以为用于形成阴影的光线恰好可以照射到的超出第一区域的理论宽度，也可以比上述理论宽度稍宽，还可以是第一表面上除了第一区域之外的其他全部区域。
可以理解，参照图3，该电子设备壳体还可以包括防指纹层30，该防指纹层30设置在所述第一表面11上，且覆盖所述图文层20。由此，可以增加电子设备壳体的爽滑感，改善用户手感的同时，避免指纹脏污。
可以理解，上述防指纹层可以为本领域常规的防指纹层，例如可以为全氟聚醚防指纹层等，其厚度可以为10～30纳米(具体如10纳米、15纳米、20纳米、25纳米、30纳米等)，具体制备工艺可根据常规技术进行，在此不再一一赘述。
在本申请的第二方面，本申请提供了一种制备电子设备壳体的方法。根据本申请的实施例，参照图4，该方法包括：
(1)在壳体本体的第一表面上形成图文层，其中，所述第一表面上具有相邻设置的第一区域和第二区域，所述图文层在所述第一表面上的正投影与所述第一区域重叠，所述第二区域位于所述第一区域的四周。
可以理解，参照图5，形成图文层的步骤可以为：在所述第一表面上形成遮蔽层40，所述遮蔽层40未覆盖所述第一区域112和所述第二区域114；在所述第一区域112和所述第二区域114上形成镀膜层50；去除所述第二区域114上的所述镀膜层，所述第一区域112上的所述镀膜层构成图文层20；去除所述遮蔽层40。
可以理解，在形成遮蔽层之前，可以对壳体本体进行清洁处理，具体的，可以将壳体本体依次进行超声清洗和烘干处理。由此，可以有效去除壳体本体的表面污渍，提高壳体本体表面清洁程度，进而提高遮蔽层的附着力。
可以理解，遮蔽层可以为油墨层，具体可以为水性油墨层。一些具体实施例中，可以在除第一区域和第二区域之外的第一表面上丝印形成水性油墨层作为遮蔽层，油墨层的厚度可以为5～20微米或8～15微米(具体如5微米、8微米、10微米、12微米、15微米、18微米、20微米等)，丝印后在100～150摄氏度(具体如100摄氏度、110摄氏度、120摄氏度、130摄氏度、140摄氏度、150摄氏度等)条件下进行烘烤20～40分钟(具体如20分钟、25分钟、30分钟、35分钟、40分钟等)。在上述厚度范围内，既能够保证较好的遮蔽效果，且利于提高加工步骤的经济性，如果厚度过薄，遮蔽效果相对较差，如果厚度过厚，则加工过程中会浪费切割能量，导致能耗和成本较高。
可以理解，镀膜层可以通过真空镀膜方法(真空镀膜一般是指在真空设备中通过高温蒸发化合物使得化合物附着于基底材料上，实现分子级别的物质堆叠，或者通过高能粒子冲击单质靶材，使得靶材逸出单质原子，在基底材料附近与目标气体相遇生成化合物，通过控制气体含量控制生成物的方法)形成，具体的，可以将形成遮蔽层的壳体本体放入真空镀膜设备中，根据需要设计膜系进行镀膜，例如可以选择不同的材质多次镀膜，得到多个材质不同的膜层层叠设置的镀膜层，具体的操作步骤和镀膜参数均可以按照常规技术进行，在此不再一一详细说明。
可以理解，可以通过对镀膜层进行图案化处理，得到具有目标形状和尺寸的图文层。具体的，可以通过干法刻蚀、湿法刻蚀和激光镭雕中的至少一种对镀膜层进行图案化，即通过上述方法去除第二区域上的镀膜层，具体的操作步骤和参数均可根据常规工艺进行，在此不做特别的限制要求。具体的，可以采用激光镭雕的方式去除第二区域上的镀膜层，该方式精细度更好，得到的图文层更加精细、外观效果更好。进一步的，可以采用皮秒激光(脉宽为皮秒的激光)进行激光镭雕，因为皮秒激光具有皮秒级超短脉宽、重复频率可调、脉冲能量高等特点，对脆性材料损伤较小，无崩口裂纹，能够获得精度更高、边缘更加清晰的图文层。可以理解，激光镭雕的深度可以为5～10微米(具体如5微米、6微米、7微米、8微米、9微米、10微米等)，由此，可以得到清晰、外观效果较佳的图文层，如果激光镭雕的深度太深浪费切割能量，降低生产效率，如果激光镭雕的深度太浅镀膜膜层可能会有残留，影响外观效果。
可以理解，可以采用剥离、刻蚀、清洗等方式去除遮蔽层，具体的，遮蔽层为水溶性油墨层时，可以通过超声清洗的方法去除遮蔽层。由此，操作简单、方便、快捷，且成本较低。
(2)对所述第二区域进行粗化处理。
可以理解，该步骤中可以通过喷砂、湿法刻蚀和激光镭雕中的至少一种进行的。具体的，喷砂的方法可以将砂置于喷砂设备中，调节合适的喷砂压力，使得第二区域的表面具有合适的表面粗糙度(例如表面粗糙度Ra在0.03～0.1微米内，具体如0.03微米、0.04微米、0.05微米、0.06微米、0.07微米、0.08微米、0.09微米、0.1微米等)，其中，砂的材质包括但不限于SiO 2材质，SiC材质，Al 2O 3材质等，砂的目数范围可以4000目～8000目(具体如4000目、5000目、6000目、7000目、8000目等)，喷砂压力可以约0.1MPa～5MPa(具体如0.1MPa、1MPa、2MPa、3MPa、4MPa、5MPa等)；湿法刻蚀可以采用含有HF的酸性溶液对第二区域进行腐蚀，其中，酸性溶液中HF的浓度可以0.5％wt～20％wt(具体如0.5％wt、1％wt、2％wt、3％wt、4％wt、5％wt、6％wt、7％wt、8％wt、9％wt、10％wt、 11％wt、12％wt、13％wt、14％wt、15％wt、16％wt、17％wt、18％wt、19％wt、20％wt等)，酸性溶液与课题本体的接触时间可以0.5h～5h(具体如0.5h、1h、1.5h、2.0h、2.5h、3.0h、3.5h、4.0h、4.5h、5.0h等)。
可以理解，当采用激光镭雕去除第二区域上的镀膜层时，由于激光镭雕的性质，可以通过一步激光镭雕同时去除第二区域上的镀膜层和对第二区域进行粗化处理，即进行一次激光镭雕，在去除了第二区域上的镀膜层的同时，第二区域经过激光镭雕的表面具有合适的粗糙度，不再需外额外的粗化处理步骤。由此，可以减少操作步骤，易于实施和降低成本。
可以理解，参照图6，该方法还包括在第一表面11上形成防指纹层30。具体的，防指纹层可以通过真空镀膜的方式形成，具体的操作步骤和参数可以通过常规方法进行，在此不再过多赘述。可以理解，在形成防指纹层之前，可以先形成过渡层，用于增加防指纹层和壳体本体的结合强度，以及增强防指纹层的耐磨性等。具体的，可以采用二氧化硅形成过渡层，厚度可以为10～30纳米(具体如10纳米、15纳米、20纳米、25纳米、30纳米等)，然后在过渡层上形成防指纹层，厚度可以为10～30纳米(具体如10纳米、15纳米、20纳米、25纳米、30纳米等)，防指纹层的材质可以为常规防指纹层材质，如全氟聚醚等，在此不再一一赘述。
通过该方法，可以方便快速的制备得到外观效果较佳的电子设备壳体，步骤简单、操作方便，易于工业化生产，且当外界光线照射至制备获得的电子设备壳体的第一表面时，与第一区域相比，照射到第二区域的光线更多的发生漫反射，从而使得照射到第二区域的光线成像能力显著减弱，从而可以有效消除阴影效果，用户观看到的图文层清楚、边界清晰，提高了电子设备壳体的外观效果。可以理解，该方法可以用于制备前面所述的电子设备壳体。可以理解，该方法可以有效用于制备前面所述的电子设备壳体。
在本申请的第三方面，本申请提供了一种电子设备。根据本申请的实施例，参照图7，该电子设备包括壳体100，所述壳体100中具有容纳空间；显示屏200，所述显示屏200设置在所述容纳空间中，且所述显示屏200的出光面(即用户观看到显示画面的表面)朝向远离所述壳体100的一侧，其中，参照图2a和图2b，所述壳体100包括：壳体本体10，所述壳体本体10具有相对的第一表面11和第二表面12，所述第一表面11上具有相邻设置的第一区域112和第二区域114，所述第二区域114位于所述第一区域112的四周，且朝向远离所述容纳空间的方向设置，所述第二区域114的表面粗糙度大于所述第一区域112的表面粗糙度；及图文层20，所述图文层20设置在所述第一表面11上，所述图文层20在所述第一表面11上的正投影与所述第一区域112重叠。该电子设备中的壳体，可以有效消 除图文层的阴影效果，用户观看到的图文层清楚、边界清晰，明显提高了电子设备的外观效果。可以理解，该电子设备中的壳体可以为前面所述的电子设备壳体。
其中，需要说明的是，图7是以手机为例对电子设备的结构进行示例性说明，并不能理解为对本申请的限制，可以理解，该电子设备的具体种类没有特别限制，例如包括但不限于手机、笔记本电脑、平板电脑、游戏机、可穿戴设备等等。且本领域技术人员还可以理解，处理前面所述的壳体和显示屏之外，该电子设备还可以包括常规电子设备所必备的结构和部件，例如以手机为例，其还可以包括CPU、触控屏、前盖板、摄像模组、指纹模组、电池、电声模组等等常规手机所具备的结构和部件，在此不再一一赘述。
下面详细描述本申请的实施例。
实施例1
具体制备步骤：
1、先对陶瓷壳本体超声清洗，烘干，以去除表面污渍，提高陶瓷表面清洁程度从而提升水溶性油墨附着力；
2、在陶瓷壳本体的第一表面上丝印厚度为8～15微米的水溶性油墨层，并将得到的油墨层在100～150℃条件下进行烘烤保温20～40min；
3、将设置有油墨层的陶瓷壳本体置于真空镀膜设备中，在第一区域和第二区域上形成金色镀膜层(具体包括层叠设置的SiO 2(15nm)+TiO 2(20nm)+SiO 2(18nm)三层结构)，然后将形成有镀膜层的陶瓷壳本体放入水中超声清洗，去除水溶性油墨层；
4、利用皮秒激光镭雕去除第二区域上的镀膜层，未被去除的第一区域上的镀膜层构成图文层，镭雕深度为5～10微米，通过控制激光镭雕的参数可以使得激光镭雕后暴露的第二区域的表面粗糙度Ra可以为0.03～0.1μm，不需要额外的粗化处理，即一步激光镭雕在去除不需要的镀膜层的同时，可以使得第一区域为镜面，而第二区域为哑光表面；
5、对陶瓷壳本体的第一表面上真空镀厚度为10～30nm的二氧化硅层作为打底层，然后在打底层的表面上真空镀厚度为10～30nm的抗指纹层(即AF膜)，以增加壳体爽滑程度和抗指纹脏污性能，得到的壳体的图文层的照片见图8。
对比例1
具体制备方法同实施例，区别在于形成镀膜层的步骤中，遮蔽层覆盖第二区域，不覆盖第一区域，真空镀膜后仅在第一区域上形成镀膜层，以构成图文层，不需要进行激光镭雕的步骤。得到的壳体的图文层的照片见图9。
通过图8和图9的对比可见，本申请通过改变图文层周围的表面粗糙度，明显降低了 周围区域(即第二区域)的镜面反射，增加了漫反射，从而有效消除了图文层的边缘阴影，使得用户观看时图文层清楚、边界清晰，且具有光哑变换的效果，具有更强的视觉冲击力，从而具有更好的观感体验。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
尽管上面已经示出和描述了本申请的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本申请的限制，本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型。

Claims (16)

  1. 一种电子设备壳体，其特征在于，包括：
    壳体本体，所述壳体本体具有相对的第一表面和第二表面，所述第一表面上具有相邻设置的第一区域和第二区域，所述第二区域位于所述第一区域的四周，且所述第二区域的表面粗糙度大于所述第一区域的表面粗糙度；及
    图文层，所述图文层设置在所述第一表面上，且所述图文层在所述第一表面上的正投影与所述第一区域重叠。
  2. 根据权利要求1所述的电子设备壳体，其特征在于，所述壳体本体的光透过率为2％～50％。
  3. 根据权利要求1或2所述的电子设备壳体，其特征在于，所述壳体本体的光透过率为2％～20％。
  4. 根据权利要求1-3中任一项所述的电子设备壳体，其特征在于，所述壳体本体的材质包括陶瓷。
  5. 根据权利要求1-4中任一项所述的电子设备壳体，其特征在于，所述第一区域为镜面，所述第二区域为哑光表面。
  6. 根据权利要求1-5中任一项所述的电子设备壳体，其特征在于，所述第一区域的表面粗糙度Ra小于0.03微米，所述第二区域的表面粗糙度Ra为0.03～0.1微米。
  7. 根据权利要求1-6中任一项所述的电子设备壳体，其特征在于，所述图文层包括装饰图案层和标识信息层中的至少一种。
  8. 根据权利要求1-7中任一项所述的电子设备壳体，其特征在于，还包括：
    防指纹层，所述防指纹层设置在所述第一表面上，且覆盖所述图文层。
  9. 一种制作电子设备壳体的方法，其特征在于，包括：
    在壳体本体的第一表面上形成图文层，其中，所述第一表面上具有相邻设置的第一区域和第二区域，所述图文层在所述第一表面上的正投影与所述第一区域重叠，所述第二区域位于所述第一区域的四周；
    对所述第二区域进行粗化处理。
  10. 根据权利要求9所述的方法，其特征在于，形成所述图文层的步骤包括：
    在所述第一表面上形成遮蔽层，所述遮蔽层未覆盖所述第一区域和所述第二区域；
    在所述第一区域和所述第二区域上形成镀膜层；
    去除所述第二区域上的所述镀膜层，所述第一区域上的所述镀膜层构成图文层；
    去除所述遮蔽层。
  11. 根据权利要求10所述的方法，其特征在于，去除所述第二区域上的所述镀膜层是通过干法刻蚀、湿法刻蚀和激光镭雕中的至少一种进行的。
  12. 根据权利要求11所述的方法，其特征在于，去除所述第二区域上的所述镀膜层和所述粗化处理是通过一步所述激光镭雕进行的。
  13. 根据权利要求9所述的方法，其特征在于，所述粗化处理是通过喷砂、湿法刻蚀和激光镭雕中的至少一种进行的。
  14. 根据权利要求11～13中任一项所述的方法，其特征在于，所述激光镭雕为皮秒激光镭雕。
  15. 根据权利要求9～14中任一项所述的方法，其特征在于，还包括：
    在所述第一表面上形成防指纹层。
  16. 一种电子设备，其特征在于，包括：
    壳体，所述壳体中限定有容纳空间；及
    显示屏，所述显示屏设置在所述容纳空间中，且所述显示屏的出光面朝向远离所述壳体的一侧；
    其中，所述壳体包括：
    壳体本体，所述壳体本体具有相对的第一表面和第二表面，所述第一表面上具有相邻设置的第一区域和第二区域，且朝向远离所述容纳空间的方向设置，所述第二区域位于所述第一区域的四周，且所述第二区域的表面粗糙度大于所述第一区域的表面粗糙度；及
    图文层，所述图文层设置在所述第一表面上，所述图文层在所述第一表面上的正投影与所述第一区域重叠。
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