WO2021036667A1 - 电子设备壳体及其制作方法和电子设备 - Google Patents

电子设备壳体及其制作方法和电子设备 Download PDF

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Publication number
WO2021036667A1
WO2021036667A1 PCT/CN2020/105706 CN2020105706W WO2021036667A1 WO 2021036667 A1 WO2021036667 A1 WO 2021036667A1 CN 2020105706 W CN2020105706 W CN 2020105706W WO 2021036667 A1 WO2021036667 A1 WO 2021036667A1
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WIPO (PCT)
Prior art keywords
graphic
area
layer
electronic device
reflection film
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PCT/CN2020/105706
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English (en)
French (fr)
Inventor
晏刚
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Oppo广东移动通信有限公司
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Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2021036667A1 publication Critical patent/WO2021036667A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44F—SPECIAL DESIGNS OR PICTURES
    • B44F1/00—Designs or pictures characterised by special or unusual light effects
    • B44F1/02—Designs or pictures characterised by special or unusual light effects produced by reflected light, e.g. matt surfaces, lustrous surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H05K5/0243—Mechanical details of casings for decorative purposes

Definitions

  • This application relates to the technical field of electronic equipment, and in particular to an electronic equipment housing, a manufacturing method thereof, and an electronic equipment.
  • This application aims to solve one of the technical problems in the related technology at least to a certain extent.
  • the inventor conducted in-depth research and found that the appearance of shadows is mainly because the casing body 1 has a certain transmittance (specifically, it can be 2% to 50%), and the image and text layer 2 produces reflections under the illumination of the light source 3. 4.
  • the reflection 4 reflects on the bottom surface 12 of the casing body, and then returns to the surface 11 of the casing body to show a shadow 5.
  • FIG. 1 for the specific principle diagram. Based on this discovery, the inventor proposes that the specular reflection effect around the graphic layer can be reduced, and the shadow effect can be effectively eliminated by weakening the image.
  • the purpose of the present application is to provide an electronic device housing with no shadow on the graphic layer and better appearance effect, and a manufacturing method and electronic device thereof.
  • the present application provides an electronic device housing.
  • the electronic device housing includes: a housing body, the housing body has a graphic area and a high transmission area, the high transmission area is located around the graphic area; Layer, the graphic layer is disposed on the first surface of the housing body, and the orthographic projection of the graphic layer on the housing body and the graphic area on the housing body The orthographic projections overlap; wherein, the transmittance of the high transmission area is greater than or equal to 50%.
  • the transmittance of the high transmission area is greater than or equal to 50%, when the external light irradiates the high transmission area, the reflection effect is weak, so that the imaging ability of the light irradiated to the high transmission area It is greatly reduced, so that the shadow effect can be effectively eliminated, and the graphics and text layers viewed by the user are clear and the boundary is clear, which significantly improves the appearance effect of the electronic device housing.
  • the present application provides a method for preparing an electronic device housing.
  • the method includes: providing a housing body, the housing body having a graphic area and a high transmission area, the high transmission area is located around the graphic area; An image and text layer is formed on the first surface of the body body, and the orthographic projection of the image and text layer on the housing body overlaps the image and text area; Anti-reflection treatment is performed so that the transmittance of the high-transmittance area is greater than or equal to 50%.
  • an electronic device housing with better appearance can be prepared conveniently and quickly, with simple steps, convenient operation, easy industrial production, and when external light is irradiated to the prepared electronic device housing, the high transmission area
  • the light reflection effect is weak, so that the imaging ability of the light irradiated to the high transmission area is significantly weakened, so that the shadow effect can be effectively eliminated.
  • the graphics and text layers viewed by the user are clear and the boundary is clear, which improves the appearance of the electronic device housing.
  • this application provides an electronic device.
  • the electronic device includes the aforementioned electronic device housing, the electronic device housing defines an accommodating space, and the graphic layer is set away from the accommodating space; and a display screen, said The display screen is arranged in the accommodating space, and the light-emitting surface of the display screen faces a side away from the housing.
  • the housing in the electronic device can effectively eliminate the shadow effect of the graphic layer, and the graphic layer viewed by the user is clear and the boundary is clear, which significantly improves the appearance effect of the electronic device.
  • FIG. 1 is a schematic diagram of the principle of shadowing on the graphic layer of the electronic device casing in the related art.
  • Fig. 2a is a schematic diagram of a planar structure of an electronic device housing according to an embodiment of the present application.
  • Fig. 2b is a schematic cross-sectional structure view taken along line A-A in Fig. 2a.
  • FIG. 3 is a schematic plan view of a housing of an electronic device according to an embodiment of the present application.
  • FIG. 4 is a schematic plan view of a housing of an electronic device according to another embodiment of the present application.
  • FIG. 5 is a schematic cross-sectional structure diagram of an electronic device housing according to an embodiment of the present application.
  • FIG. 6 is a schematic cross-sectional structure diagram of an electronic device housing according to another embodiment of the present application.
  • Fig. 7a is a schematic plan view of a housing of an electronic device according to an embodiment of the present application.
  • Fig. 7b is a schematic plan view of a housing of an electronic device according to another embodiment of the present application.
  • Fig. 7c is a schematic plan view of the electronic device housing according to another embodiment of the present application.
  • FIG. 8 is a schematic diagram of a plan structure of an electronic device housing according to another embodiment of the present application.
  • FIG. 9 is a schematic cross-sectional structure diagram of an electronic device housing according to another embodiment of the present application.
  • FIG. 10 is a schematic flowchart of a method for preparing an electronic device housing according to an embodiment of the present application.
  • FIG. 11 is a schematic flowchart of a method for preparing an electronic device housing according to another embodiment of the present application.
  • FIG. 12 is a schematic flowchart of a method for preparing an electronic device housing according to another embodiment of the present application.
  • FIG. 13 is a schematic flowchart of a method for preparing an electronic device housing according to another embodiment of the present application.
  • Fig. 14 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • Fig. 15 is a photograph of the graphic layer of the housing obtained in Example 1 of the present application.
  • FIG. 16 is a photograph of the graphic layer of the casing obtained in Comparative Example 1 of the present application.
  • the present application provides an electronic device housing.
  • the electronic device housing 100 includes a housing body 10 having a graphic area 116 and a high transmission area 112, the high transmission The area 112 is located around the graphic area; the graphic layer 20 is disposed on the first surface 11 of the casing body 10, and the graphic layer 20 is on the casing body 10
  • the orthographic projection on the above overlaps with the orthographic projection of the graphic area 116 on the housing body 10; wherein the transmittance of the high transmission area 112 is greater than or equal to 50% (specifically, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, 95%, etc.).
  • the reflection effect of the high-transmission area is weak, so that the imaging ability of the light irradiated to the high-transmission area is greatly reduced, so that the shadow effect can be effectively eliminated, and the user can see the image and text layer clearly.
  • the boundary is clear, and the appearance effect of the electronic device housing is obviously improved.
  • the terms “first” and “second” are only used for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features.
  • the description method adopted in this application "the high transmittance area is located around the graphic area” refers to the side far from the graphic layer at any edge position of the graphic area, if the graphic layer includes one or more solid graphics ( There is only one edge line, and the edge line is connected end to end to form a closed loop).
  • the high transmission area is set around each circular image and text layer; and if
  • the graphic layer includes one or more hollow graphics (that is, on the basis of the solid graphics, there is at least one hollow graphics in the graphics, and the hollow graphics have at least two edge lines, and each edge line is connected end to end to form a closed loop).
  • the image and text layer of the circular ring (that is, there is a concentric hollow circle inside the solid circle) is taken as an example, the high transmission area is set at the outer edge line 22 of the circular image and text area away from One side of the graphic layer, and the inner edge line 24 of the circular graphic area away from the side of the graphic layer (that is, in the hollow circle), and the edge line 24 located in the graphic area is away from the edge of the graphic layer
  • a peripheral area 114 (refer to FIG. 4) or no peripheral area 114 (refer to FIG. 3) may be provided on the side of the high-transmittance area 112 on one side away from the graphic layer as required.
  • FIGS. 2a, 3, and 4 are only exemplary illustrations of the structure and shape of the electronic device housing of the present application, and cannot be understood as a limitation of the present application. Other alternative structures and shapes are also available. Within the scope of protection of this application.
  • the shadow effect is relatively not very obvious at this time; if the transmittance of the shell body is very small, the light from the first The light that enters the shell body from one surface is also very small, and the light that is further reflected by the second surface of the substrate to form shadows is even less. At this time, the shadow effect is relatively insignificant; and if the transparent of the shell body If the overrate is not particularly large or small, a certain amount of light can form a shadow, and the effect on the appearance is more obvious.
  • the specific when the transmittance of the shell body is less than 50%, the specific can be 2%-50%, more specifically 2%-40%, 2%-20%, etc., such as 2%, 5%, 10%, 15%, 20%, 25%, 30%, 35%, 40% , 45%, 50%, etc., the effect of improving the shadow is better.
  • the material of the housing body may be ceramic.
  • ceramics usually have a certain transmittance. When external light hits the ceramic substrate, transmission and reflection occur. Therefore, the graphic layer is prone to shadow problems. By setting a high transmission area, the external light can be irradiated. After reaching the high transmission area, the reflection effect is weaker and the transmission effect is stronger, thus destroying the shadow forming conditions and effectively eliminating the shadow effect.
  • the ceramic substrate may be a zirconia ceramic substrate, and the color may be white or the like.
  • the specific method for making the transmittance of the high-transmission area greater than or equal to 50% is not particularly limited, as long as the reflection effect of the high-transmission area can be reduced and the transmission effect can be enhanced.
  • an anti-reflection film can be provided on the substrate to reduce the reflectance of the high-transmission area and increase the transmittance.
  • the housing body 10 includes: a substrate 110; a first anti-reflection film 120, and the first anti-reflection film 120 is disposed on the substrate 110 facing the drawing.
  • the housing body 10 may further include: a second anti-reflection film 130, the second anti-reflection film 130 is disposed on the second surface, and the second anti-reflection film 130 is disposed on the second surface.
  • the orthographic projection of the film 130 on the housing body overlaps the orthographic projection of the graphic area on the housing body.
  • the first anti-reflection film can weaken the reflectivity of the high-transmission area, weaken the imaging ability of the high-transmission area, and thereby eliminate the shadow effect.
  • the first anti-reflection film and the second anti-reflection film may be a single-layer anti-reflection film or a multilayer anti-reflection film independently of each other.
  • the first anti-reflection film and the second anti-reflection film may each independently be a multilayer anti-reflection film, and the materials of the first anti-reflection film and the second anti-reflection film may independently include but are not limited to silicon , Silicon dioxide, silicon monoxide, titanium dioxide, etc., specifically may be silicon layers and silicon dioxide layers alternately stacked, and the specific thickness of each layer can be adjusted according to the desired reflectivity.
  • both the first anti-reflection film and the second anti-reflection film include a silicon dioxide layer with a thickness of 37.1 nm, a silicon layer with a thickness of 42.7 nm, and a silicon dioxide layer with a thickness of 11.1 nm, which are sequentially stacked.
  • the reflectivity of the high-transmission area where the first anti-reflection film is formed can be adjusted according to actual usage requirements. Specifically, the reflectivity of the high transmission area may be less than 10% (specifically, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1%, 0%, etc.) . As a result, the external light is less reflected in the high-transmission area, and more transmitted, and cannot be imaged, thereby effectively eliminating edge shadows.
  • the specific size of the high-transmittance area only needs to be such that the human eye can see the boundary of the graphic layer clearly, and it can be flexibly adjusted according to the reflectance of the housing body.
  • the high transmission area on the outside of the graphic layer can expand outward according to the outer edge line of the graphic layer
  • the high transmission area in the hollowed-out graphics in the graphic layer can shrink inward according to the edge line of the hollowed-out graphics
  • the specific size that expands outward or shrinks inward may be a predetermined size that allows human eyes to clearly distinguish the boundary of the graphic layer, or may be slightly larger than the foregoing predetermined size.
  • the graphic layer 20 may include a solid graphic 22, the high transmission area 112 is arranged around the solid graphic 22, and the high transmission area 112 is away from the solid graphic
  • the first pattern 1122 formed by the outer edge line 1121 of the 22 is similar to the solid pattern 22, and the area of the first pattern 1122 is 110%-120% of the area of the solid pattern 22.
  • the graphic layer 20 may include a hollow pattern 24, and the high transmission area 112 includes a first sub-area 115 and a second sub-area 116, wherein the first sub-area The area 115 is arranged around the hollow figure 24, the first sub-region 115 is far away from the second figure 1152 formed by the outer edge line 1151 of the hollow figure 24, and the hollow figure 24 is close to the outside of the first sub-region 115
  • the third pattern 242 formed by the edge line 241 is a similar pattern, and the area of the second pattern 1152 is 110% to 120% of the area of the third pattern 242; the second sub-region 116 is located in the hollow pattern 24
  • the fourth pattern 1162 formed by the second sub-region 116 away from the inner edge line 1161 of the hollow pattern 24 and the hollow pattern 243 are similar patterns, and the area of the hollow pattern 243 is 110% to 120% of the area of the fourth pattern 1162.
  • the graphic layer 20 may include a hollow pattern 24, and the high transmission area 112 includes a first sub-area 115 and a second sub-area 116, wherein the first sub-area The area 115 is arranged around the hollow figure 24, the first sub-region 115 is far away from the second figure 1152 formed by the outer edge line 1151 of the hollow figure 24, and the hollow figure 24 is close to the outside of the first sub-region 115
  • the third pattern 242 formed by the edge line 241 is a similar pattern, and the area of the second pattern 1152 is 110% to 120% of the area of the third pattern 242; the second sub-region 116 is in the housing body
  • the orthographic projection on 10 overlaps with the orthographic projection of the hollow pattern 24 on the housing body 10.
  • the high transmission area can only be set at the adjacent position of the graphic layer, that is, at least part of it.
  • the reflectivity of the peripheral area can be greater than or equal to 2% and less than or equal to 20% (specifically, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19%, 20%, etc.), so that two appearance effects can be shown at the positions corresponding to the high transmission area and the peripheral area on the electronic device housing, and the boundaries are clear and there is no tactile difference.
  • the visual impact is strong, which can meet the increasingly high appearance requirements of users.
  • other areas of the housing body may be the high permeability area, that is, the housing body is composed of the graphic area and the high transmission area. Refer to FIG. 8 for the schematic diagram of the structure.
  • the graphic layer can be a decorative pattern layer used to decorate the appearance.
  • the specific shape can be flexibly selected according to needs, such as geometry.
  • Graphics, decorative lines, character patterns, animal patterns, cartoon patterns, landscape patterns, plant patterns, etc. can also be the identification information layer (such as manufacturer's logo, model logo, etc.), and its size, material and color can be based on the electronic device shell Choose the size, material and appearance effect you want to achieve, so I won’t repeat them here.
  • the graphic layer can be a single-layer structure or a multi-layer structure, and the specific materials forming the graphic layer can be selected according to needs.
  • a silver film can be used to form the graphic layer, and the silver film includes The zirconium dioxide layer and the chromium layer are laminated, wherein the thickness of the zirconium dioxide layer can be 10-15 nanometers (for example, 10 nanometers, 11 nanometers, 12 nanometers, 13 nanometers, 14 nanometers, 15 nanometers, etc.), and the chromium layer The thickness can be 20-60 nanometers (specifically, 20 nanometers, 25 nanometers, 30 nanometers, 35 nanometers, 40 nanometers, 45 nanometers, 50 nanometers, 55 nanometers, 60 nanometers, etc.);
  • a golden film system can also be used to form the graphic layer
  • the golden film system includes a first silicon dioxide layer, a titanium dioxide layer, and a second silicon dioxide layer that are stacked, wherein the thickness of the first silicon dioxide
  • the electronic device housing may further include an anti-fingerprint layer 30, and the anti-fingerprint layer 30 is disposed on the housing body 10 and covers the graphic layer 20.
  • the slippery feel of the housing of the electronic device can be increased, and the user's hand feel can be improved while avoiding fingerprint stains.
  • the above-mentioned anti-fingerprint layer can be a conventional anti-fingerprint layer in the art, for example, a perfluoropolyether anti-fingerprint layer, etc., and its thickness can be 10-30 nanometers (specifically, 10 nanometers, 15 nanometers, 20 nanometers, 25 nanometers, etc.). Nanometer, 30 nanometer, etc.), the specific preparation process can be carried out according to conventional technology, and will not be repeated here.
  • the present application provides a method for preparing an electronic device housing. According to an embodiment of the present application, referring to Fig. 10, the method includes:
  • a housing body is provided, the housing body has a graphic area and a high transmission area, and the high transmission area is located around the graphic area.
  • a graphic layer is formed on the first surface of the housing body, and the orthographic projection of the graphic layer on the housing body overlaps the graphic area.
  • the step of forming the graphic layer may be: forming a shielding layer on the first surface of the housing body, the shielding layer having an opening; and forming the graphic and text on the surface of the housing body exposed by the opening. Layer and then remove the masking layer.
  • the housing body may be cleaned. Specifically, the housing body may be subjected to ultrasonic cleaning and drying treatments in sequence.
  • the surface stains of the casing body can be effectively removed, the cleanliness of the surface of the casing body can be improved, and the adhesion of the shielding layer can be improved.
  • the shielding layer may be an ink layer, and specifically may be an aqueous ink layer.
  • the shielding layer can be formed by silk-screening water-based ink, and the thickness of the silk-screening ink can be 5-20 microns or 8-15 microns (specifically, 5 microns, 8 microns, 10 microns, 12 microns, 15 microns, 18 microns). , 20 microns, etc.), and bake at 100-150 degrees Celsius (specifically, 100 degrees Celsius, 110 degrees Celsius, 120 degrees Celsius, 130 degrees Celsius, 140 degrees Celsius, 150 degrees Celsius, etc.) for 20-40 minutes (specifically, 20 minutes, 25 minutes, 30 minutes, 35 minutes, 40 minutes, etc.).
  • the specific forming method of the image and text layer can be selected according to actual needs, including but not limited to vacuum coating method.
  • the vacuum coating method refers to the high temperature evaporation of the compound in the vacuum equipment to make the compound adhere to the base material to realize the molecular level substance. Stack, or use high-energy particles to impact the elemental target material, so that the target material escapes elemental atoms, meets the target gas near the base material to generate compounds, and controls the product by controlling the gas content.
  • the housing body with the shielding layer can be placed in the vacuum coating equipment, and the film system can be designed for coating as required. For example, different materials can be selected for multiple coatings to obtain a picture of multiple layers of different materials.
  • the text, specific operation steps and coating parameters can all be carried out in accordance with conventional techniques, and will not be described in detail here.
  • the shielding layer can be removed by peeling, etching, cleaning, etc., specifically, when the shielding layer is a water-soluble ink layer, the shielding layer can be removed by ultrasonic cleaning. As a result, the operation is simple, convenient, and fast, and the cost is low.
  • the anti-reflection treatment can be performed by providing an anti-reflection film.
  • an anti-reflection film may be provided on the surface of the high transmission area of the housing body.
  • the anti-reflection film can be formed by methods such as coating, vacuum coating, sputtering, etc. The specific operation steps and parameters can be performed according to conventional techniques, and will not be repeated here.
  • the housing body 10 includes a substrate 110 and a first anti-reflection film 120 disposed on the second surface of the substrate 110.
  • the method for preparing an electronic device housing can be Including: forming a first shielding layer 40 on the first surface of the housing body, the first shielding layer having a first opening 42, the orthographic projection of the first opening 42 on the housing body 10 and The orthographic projections of the high transmission area 112 on the housing body 10 overlap; a first anti-reflection film 120 is formed on the second surface exposed by the first opening, and the first shield is removed Layer 40; forming a second shielding layer 50 on the surface of the housing body on which the first anti-reflection film is formed facing the graphic layer, the second shielding layer 50 having a second opening 52, the The orthographic projection of the second opening 52 on the housing body 10 overlaps with the orthographic projection of the graphic layer 20 on the housing body 10; the second surface exposed by the second opening 52 The graphic layer 20 is formed on 11, and the second shielding layer 50
  • the housing body 10 includes a substrate 110 and a first anti-reflection film 120 and a second anti-reflection film 130 disposed on the second surface 11 of the substrate 110.
  • the method for preparing an electronic device housing may include: forming a third shielding layer 60 on the second surface, the third shielding layer 60 has a third opening 62, and the third opening 62 is formed in the housing body 10.
  • the orthographic projection on is overlapped with the sum of the high transmission area 112 and the orthographic projection of the graphic layer 20 on the housing body 10; on the second surface exposed by the third opening 62
  • the first anti-reflection film 120 and the second anti-reflection film 130 are formed, and the third shielding layer 60 is removed.
  • the orthographic projection of the first anti-reflection film on the housing body and the high transmittance The orthographic projection of the area on the housing body overlaps, the orthographic projection of the second anti-reflection film on the housing body overlaps the orthographic projection of the graphic area on the housing body;
  • a fourth shielding layer 70 is formed on the surface of the housing body with the first anti-reflection film and the second anti-reflection film facing the graphic layer, and the fourth shielding layer 70 has a fourth opening 72 ,
  • the orthographic projection of the fourth opening 72 on the housing body 10 overlaps with the orthographic projection of the graphic layer 20 on the housing body 10;
  • the graphic layer 20 is formed on the second anti-reflection film 130, and the fourth shielding layer 70 is removed.
  • the method further includes forming an anti-fingerprint layer 30 on the casing body 10, and the square fingerprint layer 30 covers the graphic layer 20.
  • the anti-fingerprint layer can be formed by vacuum coating, and the specific operation steps and parameters can be performed by conventional methods, which will not be repeated here.
  • a transition layer can be formed first to increase the bonding strength of the anti-fingerprint layer and the housing body, and to enhance the wear resistance of the anti-fingerprint layer.
  • silicon dioxide can be used to form a transition layer with a thickness of 10-30 nanometers (specifically, 10 nanometers, 15 nanometers, 20 nanometers, 25 nanometers, 30 nanometers, etc.), and then an anti-fingerprint layer is formed on the transition layer with a thickness It can be 10-30 nanometers (specifically, 10 nanometers, 15 nanometers, 20 nanometers, 25 nanometers, 30 nanometers, etc.).
  • the material of the anti-fingerprint layer can be conventional anti-fingerprint layer materials, such as perfluoropolyether. Go into details one by one.
  • an electronic device housing with better appearance can be prepared conveniently and quickly, with simple steps, convenient operation, easy industrial production, and when external light is irradiated to the prepared electronic device housing, it has high transmittance. More light in the area is transmitted and less light is reflected, so that the imaging ability of the light irradiated to the high transmission area is significantly weakened, so that the shadow effect can be effectively eliminated, and the user can see clear graphics and clear boundaries, which improves The appearance effect of the electronic device housing is improved. It can be understood that this method can be used to prepare the aforementioned electronic device housing.
  • the electronic device includes a housing 100 having a housing space therein, and the graphic layer in the housing 100 is set away from the housing space; a display screen 200, The display screen 200 is disposed in the accommodation space, and the light-emitting surface of the display screen 200 (that is, the surface on which the user views the display screen) faces a side away from the housing 100.
  • the housing in the electronic device can effectively eliminate the shadow effect of the graphic layer, and the graphic layer viewed by the user is clear and the boundary is clear, which significantly improves the appearance effect of the electronic device.
  • FIG. 14 exemplifies the structure of the electronic device with a mobile phone as an example, and it should not be construed as a limitation on the application. It is understandable that the specific type of the electronic device is not particularly limited, such as including but not Limited to mobile phones, laptops, tablets, game consoles, wearable devices, etc. And those skilled in the art can also understand that, in addition to processing the housing and display screen described above, the electronic device may also include structures and components necessary for conventional electronic devices. For example, taking a mobile phone as an example, it may also include a CPU. , Touch screen, front cover, camera module, fingerprint module, battery, electro-acoustic module and other structures and components of conventional mobile phones, so I won’t repeat them here.
  • the ceramic shell body provided with the ink layer is placed in a vacuum coating equipment, and an anti-reflection film is formed on the surface of the ceramic shell body exposed by the third opening (specifically, a silicon dioxide layer with a thickness of 37.1 nm and a thickness A silicon layer with a thickness of 42.7nm, a silicon dioxide layer with a thickness of 11.1nm, a silicon layer with a thickness of 85.8nm, a silicon dioxide layer with a thickness of 19.7nm, a silicon layer with a thickness of 28nm and a silicon dioxide layer with a thickness of 109.4nm Layer), and then put the ceramic shell body with the anti-reflection film into the water for ultrasonic cleaning to remove the water-soluble ink layer;
  • the specific preparation method is the same as in Example 1, the difference is that the step of forming the anti-reflection film is omitted, and the obtained picture of the graphic layer of the casing is shown in FIG. 16.

Abstract

本申请公开了一种电子设备壳体及其制作方法和电子设备，该电子设备壳体包括：壳体本体，所述壳体本体具有图文区域和高透过区域，所述高透过区域位于所述图文区域的四周；图文层，所述图文层设置在所述壳体本体的第一表面上，且所述图文层在所述壳体本体上的正投影与所述图文区域在所述壳体本体上的正投影重叠；其中，所述高透过区域的透过率大于等于50%。

Description

电子设备壳体及其制作方法和电子设备 技术领域
本申请涉及电子设备技术领域，具体的，涉及电子设备壳体及其制作方法和电子设备。
背景技术
目前，电子设备壳体的外观面上通常需要设置一些标识信息或装饰图案，但目前设置装饰图案或者标识信息时，容易在其周围出现阴影，使得装饰图案和标识信息外观效果不佳，影响用户体验。
因而，目前的电子设备壳体相关技术仍有待改进。
申请内容
本申请旨在至少在一定程度上解决相关技术中的技术问题之一。
本申请是基于发明人的以下发现和认识而发现的：
相关技术中，在电子设备壳体上形成图文层后，在实际使用过程中图文层的四周存在外观阴影，使得用户观看图文层时存在模糊不清、边界不清晰等问题，影响用户体验。发明人发现该问题后，进行了深入研究，发现出现外观阴影主要是因为壳体本体1具有一定透过率(具体可以为2％～50％)，图文层2在光源3照射下产生倒影4，倒影4经过壳体本体底面12反射，重新回到壳体本体表面11出现阴影5，具体原理图参照图1。基于该发现，发明人提出可以降低图文层四周的镜面反射效果，削弱成像则可有效消除阴影效果。
有鉴于此，本申请的目的在于提出一种图文层不存在阴影、外观效果较佳的电子设备壳体及其制作方法和电子设备。
在本申请的一个方面，本申请提供了一种电子设备壳体。根据本申请的实施例，该电子设备壳体包括：壳体本体，所述壳体本体具有图文区域和高透过区域，所述高透过区域位于所述图文区域的四周；图文层，所述图文层设置在所述壳体本体的第一表面上，且所述图文层在所述壳体本体上的正投影与所述图文区域在所述壳体本体上的正投影重叠；其中，所述高透过区域的透过率大于等于50％。该电子设备壳体中，通过使得高透过区域的透过率大于或等于50％，当外界光线照射到高透过区域时，反射作用较弱，使得照射到高透过区域的光线成像能力大大减弱，从而可以有效消除阴影效果，用户观看到的图文层清楚、边界清晰，明显提高了电子设备壳体的外观效果。
在本申请的第二方面，本申请提供了一种制备电子设备壳体的方法。根据本申请的实施例，该方法包括：提供壳体本体，所述壳体本体具有图文区域和高透过区域，所述高透过区域位于所述图文区域的四周；在所述壳体本体的第一表面上形成图文层，所述图文层在所述壳体本体上的正投影与所述图文区域重叠；对位于所述高透过区域中的所述第一表面进行减反射处理，使得所述高透过区域的透过率大于等于50％。通过该方法，可以方便快速的制备得到外观效果较佳的电子设备壳体，步骤简单、操作方便，易于工业化生产，且当外界光线照射至制备获得的电子设备壳体时，高透过区域的光线反射作用弱，从而使得照射到高透过区域的光线成像能力显著减弱，从而可以有效消除阴影效果，用户观看到的图文层清楚、边界清晰，提高了电子设备壳体的外观效果。
在本申请的第三方面，本申请提供了一种电子设备。根据本申请的实施例，该电子设备包括前面所述的电子设备壳体，所述电子设备壳体中限定有容纳空间，所述图文层背离所述容纳空间设置；及显示屏，所述显示屏设置在所述容纳空间中，且所述显示屏的出光面朝向远离所述壳体的一侧。该电子设备中的壳体，可以有效消除图文层的阴影效果，用户观看到的图文层清楚、边界清晰，明显提高了电子设备的外观效果。
附图说明
图1是相关技术中电子设备壳体的图文层产生阴影的原理示意图。
图2a是本申请一个实施例的电子设备壳体的平面结构示意图。
图2b是图2a中A-A线的剖面结构示意图。
图3是本申请一个实施例的电子设备壳体的平面结构示意图。
图4是本申请另一个实施例的电子设备壳体的平面结构示意图。
图5是本申请一个实施例的电子设备壳体的剖面结构示意图。
图6是本申请另一个实施例的电子设备壳体的剖面结构示意图。
图7a是本申请一个实施例的电子设备壳体的平面结构示意图。
图7b是本申请另一个实施例的电子设备壳体的平面结构示意图。
图7c是本申请另一个实施例的电子设备壳体的平面结构示意图。
图8是本申请另一个实施例的电子设备壳体的平面结构示意图。
图9是本申请另一个实施例的电子设备壳体的剖面结构示意图。
图10是本申请一个实施例的制备电子设备壳体的方法的流程示意图。
图11是本申请另一个实施例的制备电子设备壳体的方法的流程示意图。
图12是本申请另一个实施例的制备电子设备壳体的方法的流程示意图。
图13是本申请另一个实施例的制备电子设备壳体的方法的流程示意图。
图14是本申请一个实施例的电子设备的结构示意图。
图15是本申请实施例1得到的壳体的图文层的照片。
图16是本申请对比例1得到的壳体的图文层的照片。
具体实施方式
下面详细描述本申请的实施例。下面描述的实施例是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。实施例中未注明具体技术或条件的，按照本领域内的文献所描述的技术或条件或者按照产品说明书进行。
在本申请的一个方面，本申请提供了一种电子设备壳体。根据本申请的实施例，参照图2a和图2b，该电子设备壳体100包括：壳体本体10，所述壳体本体10具有图文区域116和高透过区域112，所述高透过区域112位于所述图文区域的四周；图文层20，所述图文层设置在所述壳体本体10的第一表面11上，且所述图文层20在所述壳体本体10上的正投影与所述图文区域116在所述壳体本体10上的正投影重叠；其中，所述高透过区域112的透过率大于等于50％(具体如50％、55％、60％、65％、70％、75％、80％、85％、90％、95％等)。该电子设备壳体，接受外界光线照射时，高透过区域反射作用较弱，使得照射到高透过区域的光线成像能力大大减弱，从而可以有效消除阴影效果，用户观看到的图文层清楚、边界清晰，明显提高了电子设备壳体的外观效果。
在本申请的描述中，需要理解的是，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。另外，本申请中采用的描述方式“高透过区域位于图文区域的四周”是指图文区域任意边缘位置处远离图文层的一侧，如果图文层包括一个或者多个实心图形(仅存在一条边缘线，且该边缘线首尾相连，构成封闭的环线)，以图2a所示的圆形图文层为例，则高透过区域围绕每个圆形图文层设置；而如果图文层包括一个或者多个空心图形(即在实心图形的基础上，图形中存在至少一个镂空图形，空心图形存在至少两条边缘线，每条边缘线首尾相连构成封闭的环线)，以图3所示的圆环形(即在实心圆形的内部具有一个同心的镂空圆形)的图文层为例，则高透过区域设置在圆环形的图文区域的外边缘线22远离图文层的一侧，和圆环形的图文区域的内边缘线24远离图文层的一侧(即位于镂空圆形中)，而位于图文区域内边缘线24远离图文层的一侧的高透过区域112远离图文层的一侧可以根据需要设置外围区域114(参照图4)，或者不设置外围区域114(参照图3)。而本领域技术人员可以理解，图2a、图3和图4仅 是示例性说明本申请的电子设备壳体的结构和形状，不能理解为对本申请的限制，其他可替换的结构和形状也在本申请的保护范围之内。
可以理解，如果壳体本体的透过率很大，反射形成阴影的光线较少，成像能力较弱，此时阴影效果相对不是很明显；如果壳体本体的透过率很小，光线从第一表面照射进入壳体本体的光线也很少，进一步经基材的第二表面反射回来用于形成阴影的光线则更少，此时阴影效果也相对不是很明显；而如果壳体本体的透过率不是特别大也不是特别小的情况，则有一定的光线能够形成阴影，对外观的效果影响则比较明显，因此，具体的，当壳体本体的透过率小于50％，具体可以为2％～50％，更具体可以为2％～40％、2％～20％等，例如2％、5％、10％、15％、20％、25％、30％、35％、40％、45％、50％等，改善阴影的效果更佳。
可以理解，上述壳体本体的材质可以为陶瓷。具体的，陶瓷通常具有一定的透过率，外界光线照射到陶瓷基材上会发生透射和反射，由此图文层极易产生阴影问题，而通过设置高透过区域，可以使得外界光线照射到高透过区域后，反射作用较弱，透射作用较强，从而破坏阴影的形成条件，有效消除阴影效果。具体的，陶瓷基材可以为氧化锆陶瓷基材，颜色可以白色等。
可以理解，使得高透过区域的透过率大于等于50％的具体方法没有特别限制，只要能够减弱高透过区域的反射作用、增强透射作用即可。一些具体实施例中，可以通过在基材上设置减反射膜使得高透过区域的反射率降低，透射率提高。具体的，一些实施例中，参照图5，所述壳体本体10包括：基材110；第一减反射膜120，所述第一减反射膜120设置在所述基材110朝向所述图文层20的第二表面上，所述第一减反射膜120在所述壳体本体10上的正投影与所述高透过区域112在所述壳体本体10上的正投影重叠。另一些实施例中，参照图6，所述壳体本体10还可以包括：第二减反射膜130，所述第二减反射膜130设置在所述第二表面上，所述第二减反射膜130在所述壳体本体上的正投影与所述图文区域在所述壳体本体上的正投影重叠。由此，第一减反射膜可以减弱高透过区域的反射率，削弱高透过区域的成像能力，进而消除阴影效果。
具体的，第一减反射膜和第二减反射膜可以各自独立的为单层减反射膜也可以为多层减反射膜。一些具体实施例中，第一减反射膜和第二减反射膜可以各自独立的为多层减反射膜，第一减反射膜和第二减反射膜的材料可以各自独立的包括但不限于硅、二氧化硅、一氧化硅、二氧化钛等，具体可以为交替层叠设置的硅层和二氧化硅层，每层的具体厚度可以根据想要达到的反射率进行调整。一个具体实施例中，第一减反射膜和第二减反射膜均包括依次层叠设置的厚度为37.1nm的二氧化硅层、厚度为42.7nm的硅层、厚度为11.1nm 的二氧化硅层、厚度为85.8nm的硅层、厚度为19.7nm的二氧化硅层、厚度为28nm的硅层和厚度为109.4nm的二氧化硅层。由此，减反射的效果较佳，图文层的边界更加清晰，电子设备壳体的外观效果更佳。
可以理解，形成有第一减反射膜的高透过区域的反射率可以根据实际使用要求进行调整。具体的，所述高透过区域的反射率可以小于10％(具体如9％、8％、7％、6％、5％、4％、3％、2％、1％、0％等)。由此，外界光线在高透过区域反射较少，透射较多，无法成像，从而可以有效消除边缘阴影。
可以理解，高透过区域的具体尺寸只要可以使得人眼能够看到图文层边界清晰即可，可以根据壳体本体的反射率等灵活调整。例如，位于图文层外侧的高透过区域可以根据图文层的外边缘线向外扩展，而位于图文层中镂空图形中的高透过区域则可以根据镂空图形的边缘线向内收缩，而向外扩展或向内收缩的具体尺寸可以为恰好使得人眼可以清晰分辨图文层的边界的预定尺寸，也可以比上述预定尺寸稍大。具体的，可以根据图文层为基准，向内收缩或向外扩展10％～20％，(具体如10％、11％、12％、13％、14％、15％、16％、17％、18％、19％、20％等)，在该范围内，人眼可以清晰分辨图文层的边界，没有边缘阴影效果。
一些具体实施例中，参照图7a，所述图文层20可以包括实心图形22，所述高透过区域112围绕所述实心图形22设置，且所述高透过区域112远离所述实心图形22的外边缘线1121构成的第一图形1122与所述实心图形22为相似图形，且所述第一图形1122的面积为所述实心图形22的面积的110％～120％。
另一些具体实施例中，参照图7b，所述图文层20可以包括空心图形24，所述高透过区域112包括第一子区域115和第二子区域116，其中，所述第一子区域115围绕所述空心图形24设置，所述第一子区域115远离所述空心图形24的外边缘线1151构成的第二图形1152和所述空心图形24靠近所述第一子区域115的外边缘线241构成的第三图形242为相似图形，所述第二图形1152的面积是所述第三图形242的面积的110％～120％；所述第二子区域116位于所述空心图形24中的镂空图形243中，所述第二子区域116远离所述空心图形24的内边缘线1161构成的第四图形1162和所述镂空图形243为相似图形，且所述镂空图形243的面积为所述第四图形1162的面积的110％～120％。
另一些具体实施例中，参照图7c，所述图文层20可以包括空心图形24，所述高透过区域112包括第一子区域115和第二子区域116，其中，所述第一子区域115围绕所述空心图形24设置，所述第一子区域115远离所述空心图形24的外边缘线1151构成的第二图形1152和所述空心图形24靠近所述第一子区域115的外边缘线241构成的第三图形242为相似图形，所述第二图形1152的面积是所述第三图形242的面积的110％～120％；所述第二 子区域116在所述壳体本体10上的正投影与所述镂空图形24在所述壳体本体10上的正投影重叠。
可以理解，只要图文层边界位置的壳体本体的透过率较高，即可破坏阴影的形成条件，因此，高透过区域可以仅设置在图文层的邻近位置处，即至少部分所述高透过区域的四周具有外围区域，如前文所述的情形；此时，高透过区域和外围区域的反射率存在差异，具体的，外围区域的反射率可以大于等于2％且小于等于20％(具体如2％、3％、4％、5％、6％、7％、8％、9％、10％、11％、12％、13％、14％、15％、16％、17％、18％、19％、20％等)，由此可以使得该电子设备壳体上高透过区域和外围区域对应的位置处表现出两种外观效果，且界限清晰，无触觉段差，视觉冲击力较强，可以满足用户越来越高的外观要求。当然，也可以除了图文区域之外，壳体本体的其他区域即为高透过区域，即壳体本体由图文区域和高透过区域构成，结构示意图参照图8。
可以理解，图文层的具体形状、尺寸、材质、颜色等等没有特别限制要求，具体的，图文层可以是用于装饰外观的装饰图案层，具体形状可以根据需要灵活选择，具体如几何图形、装饰线条、人物图案、动物图案、卡通图案、风景图案、植物图案等等，也可以是标识信息层(如生产厂商标识、型号标识等)，其尺寸、材质和颜色可以根据电子设备壳体的尺寸、材质和想要实现的外观效果进行选择，在此不再一一赘述。
可以理解，图文层可以为单层结构也可以为多层结构，且形成图文层的具体材料可以根据需要进行选择，具体的，可以采用银色膜系形成图文层，该银色膜系包括层叠设置的二氧化锆层和铬层，其中，二氧化锆层的厚度可以为10～15纳米(具体如10纳米、11纳米、12纳米、13纳米、14纳米、15纳米等)，铬层的厚度可以为20～60纳米(具体如20纳米、25纳米、30纳米、35纳米、40纳米、45纳米、50纳米、55纳米、60纳米等)；也可以采用金色膜系形成图文层，该金色膜系包括层叠设置的第一二氧化硅层、二氧化钛层和第二二氧化硅层，其中，第一二氧化硅层的厚度可以为15纳米，二氧化钛层的厚度可以为20纳米，第二二氧化硅层的厚度可以为18纳米。
可以理解，参照图9，该电子设备壳体还可以包括防指纹层30，该防指纹层30设置在所述壳体本体10上，且覆盖所述图文层20。由此，可以增加电子设备壳体的爽滑感，改善用户手感的同时，避免指纹脏污。
可以理解，上述防指纹层可以为本领域常规的防指纹层，例如可以为全氟聚醚防指纹层等，其厚度可以为10～30纳米(具体如10纳米、15纳米、20纳米、25纳米、30纳米等)，具体制备工艺可根据常规技术进行，在此不再一一赘述。
在本申请的第二方面，本申请提供了一种制备电子设备壳体的方法。根据本申请的实 施例，参照图10，该方法包括：
(1)提供壳体本体，所述壳体本体具有图文区域和高透过区域，所述高透过区域位于所述图文区域的四周。
(2)在所述壳体本体的第一表面上形成图文层，所述图文层在所述壳体本体上的正投影与所述图文区域重叠。
可以理解，形成图文层的步骤可以为：在所述壳体本体的第一表面上形成遮蔽层，所述遮蔽层具有开口；在所述开口暴露出的壳体本体的表面上形成图文层，然后去除遮蔽层。
可以理解，在形成遮蔽层之前，可以对壳体本体进行清洁处理，具体的，可以将壳体本体依次进行超声清洗和烘干处理。由此，可以有效去除壳体本体的表面污渍，提高壳体本体表面清洁程度，进而提高遮蔽层的附着力。
可以理解，遮蔽层可以为油墨层，具体可以为水性油墨层。一些具体实施例中，遮蔽层可以通过丝印水性油墨形成，丝印油墨的厚度可以为5～20微米或8～15微米(具体如5微米、8微米、10微米、12微米、15微米、18微米、20微米等)，丝印后在100～150摄氏度(具体如100摄氏度、110摄氏度、120摄氏度、130摄氏度、140摄氏度、150摄氏度等)条件下进行烘烤20～40分钟(具体如20分钟、25分钟、30分钟、35分钟、40分钟等)。在上述厚度范围内，既能够保证较好的遮蔽效果，且利于提高加工步骤的经济性，如果厚度过薄，遮蔽效果相对较差，如果厚度过厚，则加工过程中会浪费能量，导致能耗和成本较高。
可以理解，图文层的具体形成方法可以根据实际需要选择，包括但不限于真空镀膜方法，真空镀膜方法是指在真空设备中通过高温蒸发化合物使得化合物附着于基底材料上，实现分子级别的物质堆叠，或者通过高能粒子冲击单质靶材，使得靶材逸出单质原子，在基底材料附近与目标气体相遇生成化合物，通过控制气体含量控制生成物的方法。具体的，可以将形成有遮蔽层的壳体本体放入真空镀膜设备中，根据需要设计膜系进行镀膜，例如可以选择不同的材质多次镀膜，得到多个材质不同的膜层层叠设置的图文层，具体的操作步骤和镀膜参数均可以按照常规技术进行，在此不再一一详细说明。
可以理解，可以采用剥离、刻蚀、清洗等方式去除遮蔽层，具体的，遮蔽层为水溶性油墨层时，可以通过超声清洗的方法去除遮蔽层。由此，操作简单、方便、快捷，且成本较低。
(3)对位于所述高透过区域中的所述第一表面进行减反射处理，使得所述高透过区域的透过率大于等于50％。
可以理解，减反射处理可以通过设置减反射膜进行。具体的，壳体本体的高透过区域 的表面上可以设置有减反射膜。该减反射膜可以通过涂覆、真空镀膜、溅射等方法形成，具体的操作步骤和参数均可以根据常规技术进行，在此不再一一赘述。
一些具体实施例中，参照图11，所述壳体本体10包括基材110和设置在所述基材110的第二表面上的第一减反射膜120，该制备电子设备壳体的方法可以包括：在所述壳体本体的第一表面上形成第一遮蔽层40，所述第一遮蔽层具有第一开口42，所述第一开口42在所述壳体本体10上的正投影与所述高透过区域112在所述壳体本体10上的正投影重叠；在所述第一开口暴露出的所述第二表面上形成第一减反射膜120，并去除所述第一遮蔽层40；在形成有所述第一减反射膜的所述壳体本体朝向所述图文层的表面上形成第二遮蔽层50，所述第二遮蔽层50具有第二开口52，所述第二开口52在所述壳体本体10上的正投影与所述图文层20在所述壳体本体10上的正投影重叠；在所述第二开口52暴露出的所述第二表面11上形成所述图文层20，并去除所述第二遮蔽层50。
一些具体实施例中，参照图12，所述壳体本体10包括基材110和设置在所述基材110的第二表面11上的第一减反射膜120和第二减反射膜130，该制备电子设备壳体的方法可以包括：在所述第二表面上形成第三遮蔽层60，所述第三遮蔽层60具有第三开口62，所述第三开口62在所述壳体本体10上的正投影与所述高透过区域112和所述图文层20在所述壳体本体10上的正投影之和重叠；在所述第三开口62暴露出的所述第二表面上形成第一减反射膜120和第二减反射膜130，并去除所述第三遮蔽层60，其中，所述第一减反射膜在所述壳体本体上的正投影与所述高透过区域在所述壳体本体上的正投影重叠，所述第二减反射膜在所述壳体本体上的正投影与所述图文区域在所述壳体本体上的正投影重叠；在形成有所述第一减反射膜和所述第二减反射膜的所述壳体本体朝向所述图文层的表面上形成第四遮蔽层70，所述第四遮蔽层70具有第四开口72，所述第四开口72在所述壳体本体10上的正投影与所述图文层20在所述壳体本体10上的正投影重叠；在所述第四开口72暴露出的所述第二减反射膜130上形成所述图文层20，并去除所述第四遮蔽层70。
可以理解，参照图13，该方法还包括在所述壳体本体10上形成防指纹层30，所述方指纹层30覆盖所述图文层20。具体的，防指纹层可以通过真空镀膜的方式形成，具体的操作步骤和参数可以通过常规方法进行，在此不再过多赘述。可以理解，在形成防指纹层之前，可以先形成过渡层，用于增加防指纹层和壳体本体的结合强度，以及增强防指纹层的耐磨性等。具体的，可以采用二氧化硅形成过渡层，厚度可以为10～30纳米(具体如10纳米、15纳米、20纳米、25纳米、30纳米等)，然后在过渡层上形成防指纹层，厚度可以为10～30纳米(具体如10纳米、15纳米、20纳米、25纳米、30纳米等)，防指纹层的材质可以为常规防指纹层材质，如全氟聚醚等，在此不再一一赘述。
通过该方法，可以方便快速的制备得到外观效果较佳的电子设备壳体，步骤简单、操作方便，易于工业化生产，且当外界光线照射至制备获得的电子设备壳体时，照射到高透过区域的光线更多的发生透射，反射的光线较少，从而使得照射到高透过区域的光线成像能力显著减弱，从而可以有效消除阴影效果，用户观看到的图文层清楚、边界清晰，提高了电子设备壳体的外观效果。可以理解，该方法可以用于制备前面所述的电子设备壳体。
在本申请的第三方面，本申请提供了一种电子设备。根据本申请的实施例，参照图14，该电子设备包括壳体100，所述壳体100中具有容纳空间，所述壳体100中的图文层背离所述容纳空间设置；显示屏200，所述显示屏200设置在所述容纳空间中，且所述显示屏200的出光面(即用户观看到显示画面的表面)朝向远离所述壳体100的一侧。该电子设备中的壳体，可以有效消除图文层的阴影效果，用户观看到的图文层清楚、边界清晰，明显提高了电子设备的外观效果。
其中，需要说明的是，图14是以手机为例对电子设备的结构进行示例性说明，并不能理解为对本申请的限制，可以理解，该电子设备的具体种类没有特别限制，例如包括但不限于手机、笔记本电脑、平板电脑、游戏机、可穿戴设备等等。且本领域技术人员还可以理解，处理前面所述的壳体和显示屏之外，该电子设备还可以包括常规电子设备所必备的结构和部件，例如以手机为例，其还可以包括CPU、触控屏、前盖板、摄像模组、指纹模组、电池、电声模组等等常规手机所具备的结构和部件，在此不再一一赘述。
下面详细描述本申请的实施例。
实施例1
具体制备步骤(参照图12)：
1、先对陶瓷壳本体超声清洗，烘干，以去除表面污渍，提高陶瓷表面清洁程度从而提升水溶性油墨附着力；
2、在陶瓷壳本体的第一表面上丝印厚度为8～15微米的水溶性油墨层，并将得到的油墨层在100～150℃条件下进行烘烤保温20～40min，得到具有第三开口的第三遮蔽层；
3、将设置有油墨层的陶瓷壳本体置于真空镀膜设备中，在第三开口暴露的陶瓷壳本体表面上形成减反射膜(具体的，依次形成厚度为37.1nm的二氧化硅层、厚度为42.7nm的硅层、厚度为11.1nm的二氧化硅层、厚度为85.8nm的硅层、厚度为19.7nm的二氧化硅层、厚度为28nm的硅层和厚度为109.4纳米的二氧化硅层)，然后将形成有减反射膜的陶瓷壳本体放入水中超声清洗，去除水溶性油墨层；
4、在形成有减反射膜的陶瓷壳本体上丝印厚度为8～15微米的水溶性油墨层，并将得 到的油墨层在100～150℃条件下进行烘烤保温20～40min，得到具有第四开口的第四遮蔽层；
5、将设置有油墨层的陶瓷壳本体置于真空镀膜设备中，在第四开口暴露的陶瓷壳本体表面上形成图文层(具体包括层叠设置的SiO 2(15nm)+TiO 2(20nm)+SiO 2(18nm)三层结构)，然后将形成有图文层的陶瓷壳本体放入水中超声清洗，去除水溶性油墨层；
6、对形成有图文层的陶瓷壳本体上真空镀厚度为10～30nm的二氧化硅层作为打底层，然后在打底层的表面上真空镀厚度为10～30nm的抗指纹层(即AF膜)，以增加壳体爽滑程度和抗指纹脏污性能，得到的壳体结构示意图参照图9，图文层的照片见图15，其中，得到的壳体中减反射膜对应位置处的反射率为7％-9％，未形成减反射膜的陶瓷壳本体的反射率为14％～16％，其中，反射率采用上海善可精密仪器有限公司，日本岛津紫外可见分光光度计UV1800进行测试，具体测试方法参照设备说明书进行。
对比例1
具体制备方法同实施例1，区别在于省略形成减反射膜的步骤，得到的壳体的图文层的照片见图16。
通过图15和图16的对比可见，本申请通过改变图文层四周的反射率，明显降低了反射，增加了透射，从而有效消除了图文层的边缘阴影，使得用户观看时图文层清楚、边界清晰，且具有更强的视觉冲击力，从而具有更好的观感体验。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
尽管上面已经示出和描述了本申请的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本申请的限制，本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型。

Claims (20)

  1. 一种电子设备壳体，其特征在于，包括：
    壳体本体，所述壳体本体具有图文区域和高透过区域，所述高透过区域位于所述图文区域的四周；
    图文层，所述图文层设置在所述壳体本体的第一表面上，且所述图文层在所述壳体本体上的正投影与所述图文区域在所述壳体本体上的正投影重叠；
    其中，所述高透过区域的透过率大于等于50％。
  2. 根据权利要求1所述的电子设备壳体，其特征在于，所述高透过区域的反射率小于10％。
  3. 根据权利要求1或2所述的电子设备壳体，其特征在于，所述壳体本体包括：
    基材；
    第一减反射膜，所述第一减反射膜设置在所述基材朝向所述图文层的第二表面上，所述第一减反射膜在所述壳体本体上的正投影与所述高透过区域在所述壳体本体上的正投影重叠。
  4. 根据权利要求3所述的电子设备壳体，其特征在于，还包括：
    第二减反射膜，所述第二减反射膜设置在所述第二表面上，所述第二减反射膜在所述壳体本体上的正投影与所述图文区域在所述壳体本体上的正投影重叠。
  5. 根据权利要求4所述的电子设备壳体，其特征在于，所述第一减反射膜和所述第二减反射膜各自独立的包括多个交替层叠设置的硅层和二氧化硅层。
  6. 根据权利要求4或5所述的电子设备壳体，其特征在于，所述第一减反射膜和所述第二减反射膜一体成型。
  7. 根据权利要求1～6中任一项所述的电子设备壳体，其特征在于，所述图文层包括实心图形，所述高透过区域围绕所述实心图形设置，且所述非图文区域远离所述实心图形的外边缘线构成的第一图形与所述实心图形为相似图形，且所述第一图形的面积为所述实心图形的面积的110％～120％。
  8. 根据权利要求1～6中任一项所述的电子设备壳体，其特征在于，所述图文层包括空心图形，所述非图文区域包括第一子区域和第二子区域，其中，
    所述第一子区域围绕所述空心图形设置，所述第一子区域远离所述空心图形的外边缘线构成的第二图形和所述空心图形靠近所述第一子区域的外边缘线构成的第三图形为相似 图形，所述第二图形的面积是所述第三图形的面积的110％～120％；
    所述第二子区域位于所述空心图形中的镂空图形中，所述第二子区域远离所述空心图形的内边缘线构成的第四图形和所述镂空图形为相似图形，且所述镂空图形的面积为所述第四图形的面积的110％～120％。
  9. 根据权利要求1～6中任一项所述的电子设备壳体，其特征在于，所述图文层包括空心图形，所述非图文区域包括第一子区域和第二子区域，其中，
    所述第一子区域围绕所述空心图形设置，所述第一子区域远离所述空心图形的外边缘线构成的第二图形和所述空心图形靠近所述第一子区域的外边缘线构成的第三图形为相似图形，所述第二图形的面积是所述第三图形的面积的110％～120％；
    所述第二子区域在所述壳体本体上的正投影与所述镂空图形在所述壳体本体上的正投影重叠。
  10. 根据权利要求1～9中任一项所述的电子设备壳体，其特征在于，所述壳体本体由所述图文区域和所述高透过区域构成；或者
    所述壳体本体还包括外围区域，所述外围区域位于至少部分所述高透过区域的四周。
  11. 根据权利要求10所述的电子设备壳体，其特征在于，所述外围区域和所述高透过区域的反射率不同。
  12. 根据权利要求10或11所述的电子设备壳体，其特征在于，所述外围区域的反射率大于等于2％且小于等于20％。
  13. 根据权利要求2～12中任一项所述的电子设备壳体，其特征在于，所述基材的透过率为2％～40％。
  14. 根据权利要求2～13中任一项所述的电子设备壳体，其特征在于，所述基材的材质包括陶瓷。
  15. 根据权利要求1～14中任一项所述的电子设备壳体，其特征在于，还包括：
    防指纹层，所述防指纹层设置在所述壳体本体上，且覆盖所述图文层。
  16. 一种制作电子设备壳体的方法，其特征在于，包括：
    提供壳体本体，所述壳体本体具有图文区域和高透过区域，所述高透过区域位于所述图文区域的四周；
    在所述壳体本体的第一表面上形成图文层，所述图文层在所述壳体本体上的正投影与所述图文区域重叠；
    对位于所述高透过区域中的所述第一表面进行减反射处理，使得所述高透过区域的透过率大于等于50％。
  17. 根据权利要求16所述的方法，其特征在于，所述壳体本体包括基材和设置在所述基材朝向所述图文层的第二表面上的第一减反射膜，所述方法包括：
    在所述第二表面上形成第一遮蔽层，所述第一遮蔽层具有第一开口，所述第一开口在所述壳体本体上的正投影与所述高透过区域在所述壳体本体上的正投影重叠；
    在所述第一开口暴露出的所述第二表面上形成所述第一减反射膜，并去除所述第一遮蔽层；
    在形成有所述第一减反射膜的所述壳体本体朝向所述图文层的表面上形成第二遮蔽层，所述第二遮蔽层具有第二开口，所述第二开口在所述壳体本体上的正投影与所述图文层在所述壳体本体上的正投影重叠；
    在所述第二开口暴露出的所述第二表面上形成所述图文层，并去除所述第二遮蔽层。
  18. 根据权利要求16所述的方法，其特征在于，所述壳体本体包括基材和设置在所述基材朝向所述图文层的第二表面上的第一减反射膜和第二减反射膜，所述方法包括：
    在所述第二表面上形成第三遮蔽层，所述第三遮蔽层具有第三开口，所述第三开口在所述壳体本体上的正投影与所述高透过区域和所述图文区域在所述壳体本体上的正投影之和重叠；
    在所述第三开口暴露出的所述第二表面上形成所述第一减反射膜和第二减反射膜，并去除所述第三遮蔽层，其中，所述第一减反射膜在所述壳体本体上的正投影与所述高透过区域在所述壳体本体上的正投影重叠，所述第二减反射膜在所述壳体本体上的正投影与所述图文区域在所述壳体本体上的正投影重叠；
    在形成有所述第一减反射膜和所述第二减反射膜的所述壳体本体朝向所述图文层的表面上形成第四遮蔽层，所述第四遮蔽层具有第四开口，所述第四开口在所述壳体本体上的正投影与所述图文层在所述壳体本体上的正投影重叠；
    在所述第四开口暴露出的所述第二减反射膜上形成所述图文层，并去除所述第四遮蔽层。
  19. 根据权利要求16～18中任一项所述的方法，其特征在于，还包括：
    在所述壳体本体上形成防指纹层，所述方指纹层覆盖所述图文层。
  20. 一种电子设备，其特征在于，包括：
    权利要求1～15中任一项所述的电子设备壳体，所述电子设备壳体中限定有容纳空间，所述图文层背离所述容纳空间设置；及
    显示屏，所述显示屏设置在所述容纳空间中，且所述显示屏的出光面朝向远离所述壳体的一侧。
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