WO2020194815A1 - Procédé de production d'une structure en relief et en creux - Google Patents

Procédé de production d'une structure en relief et en creux Download PDF

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Publication number
WO2020194815A1
WO2020194815A1 PCT/JP2019/041273 JP2019041273W WO2020194815A1 WO 2020194815 A1 WO2020194815 A1 WO 2020194815A1 JP 2019041273 W JP2019041273 W JP 2019041273W WO 2020194815 A1 WO2020194815 A1 WO 2020194815A1
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Prior art keywords
curable resin
pattern
pattern master
resin
filled
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PCT/JP2019/041273
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English (en)
Japanese (ja)
Inventor
裕次郎 渕上
健次 市川
崇喜 ▲桑▼原
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富士フイルム株式会社
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Priority to JP2021508702A priority Critical patent/JP7130113B2/ja
Publication of WO2020194815A1 publication Critical patent/WO2020194815A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing

Definitions

  • This disclosure relates to a method for manufacturing an uneven structure.
  • Imprint technology is known as a method for producing a molded product in which a fine uneven pattern is formed on a base material, and various studies have been conducted.
  • Japanese Patent Application Laid-Open No. 5-238196 states that at least the recesses of the roll recess are filled with an ionizing radiation curable resin, and the film substrate is brought into contact with the resin so that the resin is held between the film substrate and the roll recess.
  • a shaped sheet having an uneven pattern formed by irradiating ionizing radiation in this state to cure the resin is disclosed.
  • Japanese Patent Application Laid-Open No. 2005-53004 uses a mold having a concave pattern applied to a polygonal shape, a multifaceted shape, or a smooth substantially hemispherical fine shape, and transmits light to the concave pattern of the mold.
  • a method for producing a high-brightness molded product which includes a step of causing the resin to be formed, a step of peeling a synthetic resin sheet integrated with an ultraviolet curable resin from a mold, and a step of providing a metallic gloss layer.
  • JP-A-5-238196 and JP-A-2005-53004 when a roll intaglio having a recess or a mold having a concave pattern is filled with a curable resin, the surface of the roll intaglio or the mold is also cured. The sex resin adheres. Therefore, when the film base material or the synthetic resin sheet is pressure-bonded with the curable resin adhered to the surface of the roll recess or the mold, and the cured resin is transferred to the film base material or the synthetic resin sheet, the transfer is performed. There is a risk that a residual film will be formed that connects the convex patterns. When this residual film is generated, there is a problem that distortion due to curing shrinkage is likely to occur.
  • the present disclosure has been made in view of the above circumstances, and an object of the present disclosure is to provide a method for manufacturing a concavo-convex structure for manufacturing a concavo-convex structure in which the generation of a residual film on a base material is suppressed.
  • a curable resin is filled in the recess of the pattern master having an uneven pattern, and the meniscus of the curable resin filled in the recess exists in a state of protruding from the surface of the pattern master and the meniscus being isolated from each other.
  • the resin-filled pattern master and the base material are prepared, the curable resin is cured in a state where the meniscus and the base material are in contact with each other, and after the curable resin is cured, the pattern master is released.
  • a method for manufacturing a concavo-convex structure wherein a cured resin having a concavo-convex shape corresponding to the concavo-convex pattern is formed on the base material.
  • ⁇ 2> The method for producing an uneven structure according to ⁇ 1>, wherein the curable resin is a photocurable resin.
  • ⁇ 3> The method for manufacturing a concave-convex structure according to ⁇ 1> or ⁇ 2>, wherein the depth D of the recess satisfies D> L / 2 with respect to the width L of the recess on the surface of the pattern master.
  • ⁇ 4> Described in any one of ⁇ 1> to ⁇ 3>, wherein the height H of the meniscus satisfies L / 100 ⁇ H ⁇ L / 10 with respect to the width L of the concave portion on the surface of the pattern master. Manufacturing method of uneven structure.
  • ⁇ 5> The concavo-convex structure according to any one of ⁇ 1> to ⁇ 4>, wherein the meniscus and the base material are brought into contact with each other without contacting the pattern master and the base material in the resin-filled pattern master. How to make a body.
  • ⁇ 6> The method for producing an uneven structure according to any one of ⁇ 1> to ⁇ 5>, wherein the surface tension of the curable resin at 20 ° C. is 30 mN / m to 40 mN / m.
  • ⁇ 7> The method for producing an uneven structure according to any one of ⁇ 1> to ⁇ 6>, wherein the viscosity of the curable resin at 20 ° C. is 0.4 Pa ⁇ s to 1.2 Pa ⁇ s.
  • the curable resin is applied to the surface of the pattern master, the applied curable resin is filled in the recesses, and the recesses are not filled and remain on the surface of the pattern master having the uneven pattern.
  • the pattern master is immersed in a curable resin to fill the recesses with the curable resin, and the pattern master is pulled up from the curable resin in a direction intersecting the horizontal direction to fill the resin-filled pattern master.
  • FIG. 1 is a diagram schematically showing a cross section of a pattern master used in the method for manufacturing an uneven structure of the present disclosure.
  • FIG. 2 is a diagram schematically showing a cross section of a resin filling pattern master.
  • FIG. 3 shows a configuration in which the curable resin is irradiated with ultraviolet rays in a state where the meniscus and the base material are in contact with each other without contacting the resin filling pattern master and the base material in the method for manufacturing the concave-convex structure of the present disclosure. It is sectional drawing which shows typically.
  • FIG. 4 is a diagram schematically showing a concavo-convex structure manufactured by the method for manufacturing a concavo-convex structure of the present disclosure.
  • FIG. 4 is a diagram schematically showing a concavo-convex structure manufactured by the method for manufacturing a concavo-convex structure of the present disclosure.
  • FIG. 5 is a diagram schematically showing an example of a method of filling a recess with a curable resin in the method for manufacturing an uneven structure of the present disclosure.
  • FIG. 6 is a diagram schematically showing another example of the method of filling the concave portion with the curable resin in the method for manufacturing the concave-convex structure of the present disclosure.
  • a curable resin is filled in a recess of a pattern master having a concavo-convex pattern, and the meniscus of the curable resin filled in the recess is formed from the surface of the pattern master.
  • the curable resin is cured in a state where the meniscus and the base material are in contact with each other, and after the curable resin is cured, the pattern master is released to form a cured resin having an uneven shape corresponding to the uneven pattern.
  • meniscus of a curable resin filled in a recess of a pattern master having a concavo-convex pattern protrudes from the surface of the pattern master and mutually.
  • a resin-filled pattern master (hereinafter, also simply referred to as “resin-filled pattern master”) that exists in an isolated state is prepared. Then, by curing the curable resin in a state where the meniscus of the curable resin is in contact with the base material and then releasing the pattern master, a cured resin having a concavo-convex shape corresponding to the concavo-convex pattern is formed on the base material.
  • the formed uneven structure can be manufactured.
  • the meniscus of the curable resin filled in the recesses of the pattern master protrudes from the surface of the pattern master and exists in a state of being isolated from each other.
  • the curable resin is cured in a state where the meniscus of the curable resin is in contact with the base material, the residue that is formed on the base material and connects between the convex portions corresponding to the concave portions of the pattern master.
  • the generation of the film can be suppressed.
  • it is considered that the strain due to the curing shrinkage of the cured resin having the uneven shape corresponding to the uneven pattern formed on the base material is suppressed, and the reproducibility of the shape of the manufactured uneven structure is also improved.
  • the curable resin connecting between the adjacent meniscus does not exist in the peripheral portion of the recess.
  • the configuration can be mentioned.
  • the curable resin that connects the adjacent meniscus exists in the peripheral part of the recess, it corresponds to the configuration in which the meniscus of the curable resin filled in the recess of the pattern master exists in an isolated state from each other. do not do.
  • a pattern master having a concavo-convex pattern is used to manufacture a concavo-convex structure in which a cured resin having a concavo-convex shape corresponding to the concavo-convex pattern is formed on a base material.
  • a preferred form of the pattern master having the uneven pattern will be described with reference to FIG.
  • the pattern master 1 has a concavo-convex pattern including a plurality of recesses 2.
  • the width L of the recess 2 on the surface of the pattern master 1 is preferably 5 ⁇ m or more, more preferably 10 ⁇ m or more, still more preferably 10 ⁇ m to 100 ⁇ m, from the viewpoint of ensuring the height of the meniscus 6.
  • the width of the recess 2 may fluctuate in the depth direction.
  • the width of the recess 2 may decrease from the surface of the pattern master 1 in the depth direction.
  • the depth D of the recess 2 in the pattern master 1 is preferably 1 ⁇ m to 50 ⁇ m, more preferably 10 ⁇ m to 20 ⁇ m. Since the depth D of the recess 2 is 50 ⁇ m or less, the pattern master 1 is excellent in releasability.
  • the depth D of the recess 2 is preferably D> L / 2, and more preferably L / 2 ⁇ D ⁇ 3L, with respect to the width L of the recess 2 on the surface of the pattern master 1.
  • the pitch P of the uneven pattern is preferably P> L / 4, more preferably P> L, and further preferably P> 1.5L from the viewpoint of preferably suppressing the generation of residual film. preferable. Further, the pitch P of the uneven pattern may be P ⁇ 3L.
  • the pitch of the uneven pattern refers to the distance between the centers of the bottoms of the two adjacent recesses 2 when the bottom of the recesses 2 is flat, and when the bottoms of the recesses 2 are sharp, the two adjacent recesses 2 Refers to the distance between the tips of the bottom of the.
  • Examples of the material of the pattern master 1 include graphite (C), silicon (Si), silicon carbide (SiC), silicon nitride (SiN), nickel (Ni), tungsten (W), tantalum (Ta), and copper (Cu). ), Inorganic substances such as aluminum (Al) and quartz, and organic substances such as (meth) acrylic resin and epoxy resin.
  • the surface of the pattern master 1 having the uneven pattern is subjected to a mold release process.
  • the curable resin is less likely to adhere to the surface having the uneven pattern, and the meniscus of the curable resin filled in the concave portion is likely to exist in an isolated state from each other. Further, the pattern master 1 can be easily released after the curable resin is cured.
  • Examples of the mold release treatment include a treatment of applying a mold release agent to the surface of the pattern master 1 having the uneven pattern.
  • a known one may be used, and examples thereof include known fluorine-based resins, hydrocarbon-based lubricants, fluorine-based lubricants, and fluorine-based silane coupling agents.
  • the release agent only one type may be used, or two or more types may be used in combination.
  • the contact angle of the pattern master 1 (before the production of the concavo-convex structure) is preferably 90 ° to 180 ° with respect to water, and more preferably 90 ° to 140 °.
  • the contact angle may be measured using a fully automatic contact angle meter DM-701 (manufactured by Kyowa Interface Science Co., Ltd.).
  • the pattern master 1 having an uneven pattern can be obtained, for example, by forming an uneven pattern on the surface of a molded product made of the above-mentioned material.
  • forming the uneven pattern for example, lithography, electron beam processing, ion beam processing, anodic oxidation, or the like may be applied to the surface of the material.
  • the recess 2 of the pattern master 1 is filled with the curable resin 5. Then, a resin-filled pattern master 1A is prepared in which the meniscus 6 of the curable resin 5 filled in the recess 2 protrudes from the surface of the pattern master 1 and the meniscus 6 is isolated from each other.
  • An example of the method of preparing the resin filling pattern master 1A shown in FIG. 2 will be described later.
  • the curable resin 5 used in the method for producing an uneven structure of the present disclosure is not particularly limited as long as it is a curable resin used in the imprinting technique.
  • the curable resin 5 include an active energy ray-curable resin that cures with active energy rays, a thermosetting resin that cures with heat, and the like.
  • the active energy ray include ⁇ ray, ⁇ ray, X ray, ultraviolet ray, visible ray, infrared ray, electron beam and the like.
  • the active energy ray-curable resin a photocurable resin that is cured by light such as ultraviolet rays, visible rays, and infrared rays is preferable, and a photocurable resin that is cured by ultraviolet rays is particularly preferable.
  • Examples of the photocurable resin include resins containing at least one of a polymerizable unsaturated bond and an epoxy group, and more specifically, a (meth) acrylic resin, an epoxy resin, and the like.
  • the photocurable resin may contain a polymerizable monomer containing at least one of a polymerizable unsaturated bond and an epoxy group, a photopolymerization initiator, and the like.
  • curable resins such as photocurable resins include coupling agents, organic solvents, plasticizers, surfactants, defoamers, thickeners, thixotropy-imparting agents, leveling agents, and colorants, if necessary.
  • Inorganic filler and the like may be contained.
  • the surface tension of the curable resin 5 at 20 ° C. is preferably 30 mN / m to 40 mN / m, more preferably 31 mN / m to 38 mN / m, and preferably 31 mN / m to 35 mN / m. More preferred.
  • the surface tension of the curable resin 5 at 20 ° C. is 30 mN / m or more, the meniscus 6 protruding from the surface of the pattern master 1 tends to be easily formed.
  • the surface tension of the curable resin 5 at 20 ° C. is 40 mN / m or less, the filling property of the curable resin 5 with respect to the pattern master 1 tends to be high.
  • Surface tension is measured using a surface tension meter.
  • a surface tension meter for example, a surface tension meter (trade name: Acoustic Surface Tensiometer CBVP-Z) manufactured by Kyowa Interface Science Co., Ltd. can be preferably used.
  • the surface tension meter is not limited to this.
  • the viscosity of the curable resin 5 at 20 ° C. is preferably 0.4 Pa ⁇ s to 1.2 Pa ⁇ s, more preferably 0.4 Pa ⁇ s to 1.0 Pa ⁇ s, and 0.4 Pa ⁇ s to 1.0 Pa ⁇ s. It is more preferably s to 0.8 Pa ⁇ s.
  • the viscosity of the curable resin 5 at 20 ° C. is 0.4 Pa ⁇ s or more, the meniscus 6 protruding from the surface of the pattern master 1 tends to be easily formed.
  • the viscosity of the curable resin 5 at 20 ° C. is 1.2 Pa ⁇ s or less, the filling property of the curable resin 5 with respect to the pattern master 1 tends to be high.
  • Viscosity is measured using a viscometer.
  • a viscometer for example, a viscometer manufactured by Toki Sangyo Co., Ltd. (trade name: VISCOMETER TVE-25) can be preferably used.
  • the viscometer is not limited to this.
  • the height H of the meniscus 6 preferably satisfies L / 100 ⁇ H ⁇ L / 10, and preferably L / 20 ⁇ H ⁇ L / 10, with respect to the width L of the recess 2 on the surface of the pattern master 1. More preferred.
  • the height H of the meniscus 6 can be adjusted by adjusting the viscosity, surface tension, etc. of the curable resin 5. Specifically, the height H of the meniscus 6 tends to be increased by increasing at least one of the viscosity and the surface tension of the curable resin 5.
  • the height H of the meniscus 6 is such that the meniscus 6 is sufficiently brought into contact with the base material 10 to enhance the adhesion between the cured resin 8 and the base material 10 after curing, and the generation of a residual film is suitably suppressed. From the point of view, it is preferably 0.1 ⁇ m to 5 ⁇ m, and more preferably 0.1 ⁇ m to 1 ⁇ m.
  • the recess 2 is filled with the curable resin 5 to form the meniscus 6, and then the meniscus 6 and the base material 10 are brought into contact with each other as shown in FIG. At this time, from the viewpoint of preferably suppressing the residual film on the base material 10, it is preferable that the meniscus 6 and the base material 10 are brought into contact with each other without contacting the pattern master 1 and the base material 10.
  • the base material 10 used in the method for producing an uneven structure of the present disclosure is not particularly limited as long as it is a base material used in the imprinting technique.
  • Examples of the material of the base material include polyethylene, polypropylene, polystyrene, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, polymethylmethacrylate, polyamide, polyimide, polyethersulfone, polysulfone, polyvinyl chloride, glass and the like.
  • the curable resin 5 in which the curable resin 5 is cured by light, it is preferable that at least one of the base material 10 and the pattern master 1 has light transmission.
  • the curable resin 5 can be cured by irradiating light from the base material 10 side or the pattern master 1 side. Having light transmission means that at least one of the base material 10 and the pattern master 1 transmits light in the wavelength range absorbed by the curable resin 5.
  • the shape of the base material 10 is not particularly limited, and examples thereof include a substrate shape, a film shape, and a sheet shape.
  • the concavo-convex structure may be manufactured by a continuous process in a roll-to-roll method.
  • the surface of the base material 10 may be coated, corona-treated, or the like for the purpose of improving properties such as adhesion, antistatic property, scratch resistance, and weather resistance.
  • a pattern of light such as ultraviolet rays is applied from the side opposite to the side where the meniscus 6 and the base material 10 of the pattern master 1 are in contact with each other.
  • the curable resin 5 filled in the recess 2 of the master 1 is irradiated to cure the curable resin 5.
  • the arrows in FIG. 3 indicate the irradiation direction of ultraviolet rays.
  • Method of preparing resin filling pattern master 1A shown in FIG. 2 A method of preparing the resin filling pattern master 1A shown in FIG. 2 will be described. First, in the method 1, the curable resin 5 is applied to the surface of the pattern master 1, the applied curable resin 5 is filled in the recess 2, and the concave portion 2 is not filled but the surface having the uneven pattern of the pattern master 1 is formed. By removing the remaining curable resin 5, the resin-filled pattern master 1A can be obtained. Hereinafter, it will be described with reference to FIG.
  • a pattern master 1 having an uneven pattern is prepared.
  • the curable resin 5 is dropped onto the region of the pattern master 1 that has the uneven pattern on the surface where the uneven pattern is not formed, using the dropping means 3. Then, as shown in FIGS. 5 (c) and 5 (d), the blade 4 is moved in the arrow X direction in a state where the blade 4 is in contact with the curable resin 5 adhering to the pattern master 1 to form the pattern master 1.
  • the curable resin 5 is developed on the uneven pattern.
  • the curable resin 5 may be applied on the uneven pattern of the surface having the uneven pattern of the pattern master 1 by spray coating, bar coating, spin coating, roll coating or the like.
  • the amount of the curable resin 5 dropped or applied to the surface of the pattern master 1 having the uneven pattern is such that the meniscus 6 protruding from the surface of the pattern master 1 is preferably formed.
  • the recess 2 is filled with the sex resin 5, the recess 2 is fully filled with the curable resin, and the amount of the curable resin 5 not filled in the recess 2 adheres to the surface having the uneven pattern. Is preferable.
  • the recess 2 is filled with the curable resin 5 by exposing the pattern master 1 under reduced pressure conditions as shown in FIG. 5 (e). You may let me.
  • the depressurization condition may be, for example, an atmosphere of 0.1 Pa or less.
  • the curable resin 5 not filled in the recess 2 is adhered to the surface having the uneven pattern.
  • the blade 4 is moved in the arrow X direction in a state where the blade 4 is in contact with the curable resin 5 developed on the uneven pattern of the pattern master 1.
  • the curable resin 5 on the uneven pattern is scraped off and removed from the uneven pattern of the pattern master 1.
  • the recess 2 is filled with the curable resin 5, and the meniscus 6 protrudes from the surface of the pattern master 1.
  • the scraping speed of the blade 4 may be, for example, 1 mm / sec or less.
  • the scraping speed of the blade 4 may be appropriately adjusted according to the viscosity, surface tension, etc. of the curable resin 5. For example, the surface tension at 20 ° C. is 38 mN / m, and the viscosity at 20 ° C. is 1.
  • the curable resin 5 at .105 Pa ⁇ s is used, it is preferably 0.1 mm / sec or less, and from the viewpoint of formation and productivity of the meniscus 6, it is 0.05 mm / sec to 0.1 mm / sec. More preferably. From the viewpoint of preferably removing the curable resin 5 adhering to the surface having the uneven pattern, the blade 4 is scraped off when the viscosity of the curable resin 5 is high, the surface tension of the curable resin 5 is high, or the like. The speed may be reduced. By suitably removing the curable resin 5 adhering to the surface having the uneven pattern, the curable resin 5 having a thickness larger than the height H of the meniscus 6 is isolated from the meniscus 6 on the surface having the uneven pattern.
  • the concave-convex structure 20 can be preferably manufactured.
  • the material of the blade 4, the angle of the blade 4 when scraping the curable resin 5 on the uneven pattern, and the applied load are such that the curable resin 5 on the concave-convex pattern is scraped off and removed from the concave-convex pattern of the pattern master 1. If possible, there are no particular restrictions.
  • the curable resin 5 removed from the uneven pattern of the pattern master 1 is removed from the pattern master 1 using the adsorption means 7. As a result, the resin-filled pattern master 1A can be obtained.
  • Method 2 of preparing the resin filling pattern master Another method for preparing the resin filling pattern master 1A shown in FIG. 2 will be described.
  • the pattern master 1 is immersed in the curable resin 5, the curable resin 5 is filled in the recess 2, and the pattern master 1 is pulled up from the curable resin 5 in the direction intersecting the horizontal direction, whereby the resin filling pattern is obtained.
  • Obtain master 1A Hereinafter, it will be described with reference to FIG.
  • the pattern master 1 fixed by exposing the surface having the uneven pattern on the jig 11 is moved downward in the vertical direction and immersed in the curable resin 5 stored in the container to place the curable resin 5 in the recess 2. Fill.
  • the pattern master 1 fixed to the jig 11 is moved upward in the vertical direction (arrow Y direction) to move the pattern master 1 to the curable resin 5. Pull up from.
  • the resin-filled pattern master 1A can be obtained.
  • the direction in which the pattern master 1 is pulled up from the curable resin 5 is not limited to the upper side in the vertical direction, and may be a direction that intersects the horizontal direction.
  • the pattern master 1 is inclined by 60 ° to 90 ° in the vertical direction from the horizontal plane. You may be doing it.
  • the pattern master 1 is pulled up more than the aggregation speed of the curable resin 5 (the speed in the arrow Z direction in FIG. 6B) from the viewpoint of preferably removing the curable resin 5 adhering to the surface having the uneven pattern. It is preferable to reduce the speed (the speed in the arrow Y direction in FIG. 6B).
  • the pulling speed of the pattern master 1 may be, for example, 1 mm / sec or less.
  • the curable resin 5 may be appropriately adjusted according to the viscosity, surface tension, etc., and for example, the surface tension at 20 ° C. is 38 mN / m and the viscosity at 20 ° C. is 1.105 Pa ⁇ s.
  • the resin 5 is preferably 0.1 mm / sec or less, and more preferably 0.05 mm / sec to 0.1 mm / sec. From the viewpoint of preferably removing the curable resin 5 adhering to the surface having the uneven pattern, the pattern master 1 is pulled up when the viscosity of the curable resin 5 is high, the surface tension of the curable resin 5 is high, or the like. The speed may be reduced. By suitably removing the curable resin 5 adhering to the surface having the uneven pattern, the curable resin 5 having a thickness larger than the height H of the meniscus 6 is isolated from the meniscus 6 on the surface having the uneven pattern. It can be suppressed that it remains in.
  • the concave-convex structure 20 can be preferably manufactured.
  • the concavo-convex structure obtained by the method for producing the concavo-convex structure of the present disclosure can be used as, for example, an optical device, a reaction device, a biodevice or the like.
  • an optical device for example, a reaction device, a biodevice or the like.
  • the concave portion of the concave-convex structure as the reaction field, it can be used as a reaction device, a biodevice, or the like.
  • embodiments of the present invention will be specifically described with reference to specific examples.
  • the embodiment of the present invention is not limited to the following examples as long as the gist of the present invention is not exceeded, and the materials, amounts used, ratios, treatment contents, treatment procedures, etc. shown in the following examples are the present invention. It can be changed as appropriate as long as it does not deviate from the purpose of disclosure.
  • the pattern master and the curable resin coating liquid shown below were used.
  • Concavo-convex pattern pitch 20 ⁇ m, recess width L 10 ⁇ m, recess depth D 16 ⁇ m
  • Mold release treatment on the uneven pattern side of the pattern master Applying a mold release agent (trade name: Optool HD-1100, Daikin Industries, Ltd.)
  • Example 1 and Comparative Examples 1 to 3 Using the coating liquid A and the coating liquid B, a curable resin coating liquid showing the viscosity and surface tension shown in Table 1 below was prepared. The viscosity and surface tension of the curable resin coating liquid are values measured at 20 ° C. as described above. In Comparative Example 2 and Comparative Example 3, a curable resin coating liquid in which the mixing ratios of the coating liquid A and the coating liquid B were changed was prepared.
  • Example 1 and Comparative Examples 1 to 3 the recesses of the pattern master were filled with the curable resin coating liquid at 20 ° C. according to the procedure shown in FIG.
  • the blades used, the conditions for using the blades (conditions for using the blades when scraping the curable resin coating liquid on the uneven pattern), and the conditions for reducing the pressure are as follows. Further, in Example 1 and each Comparative Example, all the recesses were filled with the curable resin coating liquid before scraping the curable resin coating liquid with the blade, and further, the entire concave-convex pattern formation region was filled.
  • Example 1 the curable resin coating liquid on the pattern master could be removed, and positive menisci isolated from each other could be confirmed.
  • Comparative Examples 1 and 2 the curable resin coating liquid on the pattern master could be removed, but positive meniscus isolated from each other was not formed.
  • Comparative Example 3 even after the curable resin coating liquid was scraped off with a blade, the curable resin coating liquid adhering to the surface having the uneven pattern could not be sufficiently removed, and the curable resin filled in the concave portion was not sufficiently removed. The coating liquid and the curable resin coating liquid adhering to the surface having the uneven pattern were connected. Therefore, in Comparative Example 3, it was not possible to form positive menisci isolated from each other.
  • the concave-convex structure is made as follows. Manufactured. First, the alignment was performed with the surface of the pattern master in which the recess was filled with the curable resin coating solution and the main surface of the base material facing each other.
  • the curable resin coating liquid was cured by irradiating the curable resin coating liquid filled in the pattern master under the condition of an irradiation amount of 2000 mJ / cm 2 . Then, by releasing the pattern master, a concavo-convex structure in which a cured resin having a concavo-convex shape corresponding to the concavo-convex pattern of the pattern master was formed on the base material was obtained.
  • Comparative Example 1 and Comparative Example 2 the production of the concave-convex structure was attempted as follows using the pattern master in which the recesses were filled with the curable resin coating liquid and the base material used in Example 1. First, the alignment was performed with the surface of the pattern master in which the recess was filled with the curable resin coating solution and the main surface of the base material facing each other. In Comparative Examples 1 and 2, since the positive meniscus isolated from each other was not formed, the curable resin coating liquid filled in the concave portion and the base material could not be sufficiently adhered to each other.
  • the pattern master was released after the curable resin coating liquid was cured in the same manner as in Example 1 in the state where the pattern master and the base material were in contact with each other, but the cured resin was used as the base. An uneven structure could not be obtained because it did not adhere sufficiently to the material.
  • Comparative Example 3 the production of the uneven structure was attempted as follows using the pattern master in which the recesses were filled with the curable resin coating liquid and the base material used in Example 1. First, the alignment was performed with the surface of the pattern master in which the recess was filled with the curable resin coating solution and the main surface of the base material facing each other. In Comparative Example 3, the curable resin coating liquid adhered to the surface having the uneven pattern and the base material were brought into contact with each other, and the curable resin coating liquid was cured in the same manner as in Example 1, and then the pattern master was released. By molding, a concavo-convex structure in which a cured resin having an concavo-convex shape corresponding to the concavo-convex pattern of the pattern master was formed on the base material was obtained.
  • Examples 2 to 5 and Comparative Examples 4 to 6 Using the coating liquid A and the coating liquid B, a curable resin coating liquid showing the viscosity and surface tension shown in Table 2 below was prepared. The viscosity and surface tension of the curable resin coating liquid are values measured at 20 ° C. as described above. In Examples 2 to 4, Comparative Example 5 and Comparative Example 6, curable resin coating liquids in which the mixing ratios of the coating liquid A and the coating liquid B were changed were prepared.
  • the pattern master is immersed in the curable resin coating liquid so that the entire surface of the uneven pattern forming region of the pattern master is in contact with the curable resin coating liquid as shown in FIG.
  • the recesses of the pattern master were filled with the curable resin coating liquid at 20 ° C.
  • the conditions for pulling up the pattern master are as follows. ⁇ Conditions for pulling up the pattern master> Pulling direction: Vertical upper side Pulling speed: 0.1 mm / sec (aggregation speed of curable resin coating liquid> pulling speed of pattern master) or 1.0 mm / sec (aggregation speed of curable resin coating liquid ⁇ pulling of pattern master speed)
  • Example 2 After pulling up the pattern master from the curable resin coating liquid, the presence or absence of positive meniscus (meniscus protruding from the surface of the pattern master) was confirmed. The results are shown in Table 2.
  • the method for evaluating the presence or absence of meniscus is the same as in Example 1 and Comparative Examples 1 to 3 described above.
  • the curable resin coating liquid on the pattern master could be removed, and positive menisci isolated from each other could be confirmed.
  • Comparative Examples 4 and 5 the curable resin coating liquid on the pattern master could be removed, but positive meniscus isolated from each other was not formed.
  • Comparative Example 6 the curable resin coating liquid filled in the concave portion and the curable resin coating liquid adhering to the surface having the uneven pattern were connected. Therefore, in Comparative Example 6, it was not possible to form positive menisci isolated from each other.
  • Pattern master 1A Resin-filled pattern master 2 Recess 3 Dropping means 4 Blade 5 Curable resin 6 Meniscus 7 Adsorption means 8 Curing resin 10 Base material 11 Jig 20 Concavo-convex structure L Recess width D Recess depth H Meniscus height Sa

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

La présente invention concerne un procédé de production de structure en relief et en creux comprenant : la préparation d'un matériau de base et d'un gabarit de motif rempli de résine comprenant un gabarit de motif porteur d'un motif en relief et en creux dans lequel les sections en creux ont été remplies avec une résine durcissable, les ménisques de la résine durcissable remplissant les sections évidées faisant saillie à partir de la surface du gabarit de motif et étant isolés les uns des autres ; le fait d'amener le matériau de base en contact avec les ménisques et, dans cet état, le durcissement de la résine durcissable ; et après que la résine durcissable a durci, le démoulage du gabarit de motif. Il est ainsi possible de produire une structure en relief et en creux comprenant la résine durcie formée sur le matériau de base et ayant une forme en relief et en creux qui correspond au motif en relief et en creux.
PCT/JP2019/041273 2019-03-26 2019-10-21 Procédé de production d'une structure en relief et en creux WO2020194815A1 (fr)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002166432A (ja) * 2000-11-30 2002-06-11 Asahi Optical Co Ltd レンズの製造方法及びこれに使用する成形セル
JP2008207517A (ja) * 2007-02-28 2008-09-11 Seiko Epson Corp レンズアレイ用成形型、及びそれを用いたレンズアレイの製造方法
JP2012252113A (ja) * 2011-06-01 2012-12-20 Konica Minolta Advanced Layers Inc ウェハレンズの製造方法
WO2013089223A1 (fr) * 2011-12-16 2013-06-20 コニカミノルタ株式会社 Procédé de fabrication d'une mosaïque de lentilles, et châssis de moulage
JP2013123884A (ja) * 2011-12-15 2013-06-24 Konica Minolta Advanced Layers Inc 成形用型の製造方法
US20170050347A1 (en) * 2015-08-21 2017-02-23 Anteryon Wafer Optics B.V. Method of fabricating an array of optical lens elements

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002166432A (ja) * 2000-11-30 2002-06-11 Asahi Optical Co Ltd レンズの製造方法及びこれに使用する成形セル
JP2008207517A (ja) * 2007-02-28 2008-09-11 Seiko Epson Corp レンズアレイ用成形型、及びそれを用いたレンズアレイの製造方法
JP2012252113A (ja) * 2011-06-01 2012-12-20 Konica Minolta Advanced Layers Inc ウェハレンズの製造方法
JP2013123884A (ja) * 2011-12-15 2013-06-24 Konica Minolta Advanced Layers Inc 成形用型の製造方法
WO2013089223A1 (fr) * 2011-12-16 2013-06-20 コニカミノルタ株式会社 Procédé de fabrication d'une mosaïque de lentilles, et châssis de moulage
US20170050347A1 (en) * 2015-08-21 2017-02-23 Anteryon Wafer Optics B.V. Method of fabricating an array of optical lens elements

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