WO2020192725A1 - 阵列基板及其制造方法、显示装置 - Google Patents

阵列基板及其制造方法、显示装置 Download PDF

Info

Publication number
WO2020192725A1
WO2020192725A1 PCT/CN2020/081361 CN2020081361W WO2020192725A1 WO 2020192725 A1 WO2020192725 A1 WO 2020192725A1 CN 2020081361 W CN2020081361 W CN 2020081361W WO 2020192725 A1 WO2020192725 A1 WO 2020192725A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrates
display units
array substrate
stretchable
connection
Prior art date
Application number
PCT/CN2020/081361
Other languages
English (en)
French (fr)
Inventor
隋凯
薛金祥
孙中元
董超
王小芬
靳倩
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US17/059,231 priority Critical patent/US11776971B2/en
Publication of WO2020192725A1 publication Critical patent/WO2020192725A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate

Definitions

  • the present disclosure relates to the field of display technology, and in particular to an array substrate, a manufacturing method thereof, and a display device.
  • an array substrate including: a plurality of substrates arranged separately; a plurality of display units respectively provided on the plurality of substrates; and a plurality of connection lines configured as Connecting two adjacent ones of the plurality of display units; a plurality of stretchable connecting bridges configured to connect two adjacent ones of the plurality of substrates, wherein the connecting line The length of is greater than the length of the stretchable connecting bridge.
  • a hollow area is formed between the plurality of display units through the connecting line and the stretchable connecting bridge.
  • two adjacent substrates in the plurality of substrates are connected by at least one stretchable connection bridge among the plurality of stretchable connection bridges.
  • the length of the stretchable connecting bridge is greater than or equal to the distance between two adjacent substrates.
  • the straight line formed by connecting the stretchable connection bridge between two adjacent substrates to the connection points on the two adjacent substrates is different from the The connecting line between the two display units is parallel to the straight line formed by connecting the connection points on the two display units.
  • the cross-sectional area of the connecting line gradually increases near the display unit, and the cross-sectional area of the stretchable connecting bridge gradually increases near the substrate.
  • the Young's modulus of any one of the plurality of substrates is greater than the Young's modulus of the stretchable connecting bridge.
  • the connecting line includes a first straight portion, a first arc portion, a second straight portion, a second arc portion, and a third straight portion that are sequentially connected.
  • connection line includes a conductive material.
  • the conductive material includes at least one of molybdenum, silver, copper, aluminum, magnesium, neodymium, indium tin oxide, indium gallium zinc oxide, and indium zinc oxide.
  • the material of the stretchable connecting bridge includes polydimethylsiloxane, polyethylene naphthalate, polyimide, polyetherimide, and polyethylene terephthalate. Either glycol ester or polyphenylene sulfide.
  • any one of optically transparent adhesive, acrylic adhesive, silicon adhesive, and polyurethane adhesive is used between any one of the plurality of substrates and the display unit disposed thereon. Pick up.
  • the shape of any one of the plurality of substrates is any one of a square, an ellipse, a circle, a rectangle, a parallelogram, and a hexagon.
  • the array substrate further includes a thin film encapsulation layer located on a side of the plurality of display units away from the plurality of substrates.
  • a display device including the above-mentioned array substrate and an integrated circuit connected to the array substrate.
  • a method for manufacturing an array substrate including:
  • the two display units correspond one to one for box matching.
  • forming a plurality of substrates arranged separately and a plurality of stretchable connecting bridges connecting two adjacent substrates of the plurality of substrates includes: using etching or laser cutting technology to adjust the flexibility The film is processed to form a plurality of substrates arranged in a separate array and a plurality of stretchable connection bridges connecting adjacent two of the plurality of substrates.
  • forming a plurality of substrates arranged separately and a plurality of stretchable connecting bridges connecting two adjacent ones of the plurality of substrates further includes: performing Heating or laser treatment.
  • forming a plurality of display units and a plurality of connecting lines connecting two adjacent display units of the plurality of display units includes: forming a plurality of display units arranged separately on a substrate and connecting the plurality of display units. Multiple connection lines of two adjacent display units of a display unit, wherein the substrate on which the multiple display units and the multiple connection lines are formed includes a display unit area and a non-display unit area; etching or laser cutting technology is adopted The non-display unit area is cut out and the multiple connection lines are retained.
  • the plurality of substrates and the plurality of display units are arranged in a one-to-one correspondence with the transfer technology
  • the plurality of substrates are combined with the plurality of display units.
  • the units are glued together one by one.
  • FIG. 1 shows a schematic structural diagram of an array substrate according to an embodiment of the present disclosure
  • FIG. 2 shows a schematic structural diagram of an array substrate according to an embodiment of the present disclosure
  • Fig. 3 shows a schematic diagram of a force analysis of a connection line according to an embodiment of the present disclosure
  • Fig. 4 shows a schematic structural diagram of a connection line provided according to an embodiment of the present disclosure
  • Fig. 5 shows a schematic structural diagram of a connection line provided according to an embodiment of the present disclosure
  • FIG. 6 shows a schematic diagram of a force analysis of a connection line according to an embodiment of the present disclosure
  • Fig. 7 shows a schematic diagram of a connection between a connection line and a display unit according to an embodiment of the present disclosure
  • FIG. 8 shows a schematic diagram of the internal structure of a display device according to an embodiment of the present disclosure
  • Figure 9 shows a schematic diagram of a transfer cartridge provided according to an embodiment of the present disclosure.
  • Fig. 10 shows a schematic diagram of a stretching simulation provided according to an embodiment of the present disclosure
  • FIG. 11 shows a flowchart of a method for manufacturing an array substrate according to an embodiment of the present disclosure
  • FIG. 12 shows a schematic diagram of a substrate and a stretchable connection bridge according to an embodiment of the present disclosure.
  • FIG. 13 shows a schematic diagram of a substrate and a stretchable connection bridge according to an embodiment of the present disclosure.
  • TFT Thin Film Transistor connection circuit graphic design and material selection.
  • One of the TFT connection lines uses metal wire connection.
  • the metal wire is rigid and cannot be stretched by itself, so pattern it and use patterning to release the stress to achieve a certain stretching effect.
  • Another TFT connection line uses conductive rubber.
  • Conductive rubber is rubber doped with silver nanowires or other metal conductive particles.
  • the conductive rubber connection circuit itself has the ability to stretch, but the preparation process is immature and is currently in the development stage.
  • the stress of the metal connecting line is large, and geometric deformation will occur after repeated stretching, which makes it difficult to completely reset the connecting line after repeated stretching, and the phase shift between adjacent display units (island area) will cause a certain or Some display units cannot be completely reset. Because one or part of the display unit cannot be completely reset, the angle between the display unit that cannot be reset and the adjacent display unit is shifted, which causes the phase of the two adjacent display units to shift, which affects the display effect, and even Cause the picture to be distorted.
  • Some embodiments of the present disclosure provide an array substrate.
  • the array substrate may include: a plurality of substrates 150 arranged separately, for example, the plurality of substrates 150 may be arranged in an array; a plurality of display units 130 are respectively arranged on the plurality of substrates 150 A plurality of connecting lines 140, which are configured to connect two adjacent display units 130 in the plurality of display units 130; a plurality of stretchable connecting bridges 120, which are configured to connect adjacent ones of the plurality of substrates 150 The two substrates 150.
  • the length of the connection line 140 is greater than the length of the stretchable connection bridge 120.
  • connection line 140 is greater than the length of the stretchable connection bridge 120, during the long-term stretching of the substrate 150, the stretchable connection bridge 120 can reduce the deformation of the connection line 140, and avoid the occurrence of phases in adjacent display units. Offset, to ensure that the display screen is clear and undistorted after the display device is stretched for a long time.
  • a hollow area 110 is formed between a plurality of display units through a connecting line and the stretchable connecting bridge.
  • the hollow area 110 can be completed by etching technology or etching and laser cutting technology. Specifically, it will be described in detail in the following preparation process, and will not be repeated here.
  • two adjacent substrates 150 among the plurality of substrates 150 may be connected by at least one stretchable connecting bridge 120 (as shown in FIGS. 1 and 2).
  • the connecting line 140 can be formed in a special pattern, so that the connecting line 140 can achieve a larger stretch.
  • the specific stress analysis process of the connecting line 140 can be referred to as shown in FIG. 3.
  • FIG. 3 a schematic diagram of a force analysis of a connection line provided by an embodiment of the present disclosure is shown.
  • a tensile force F three component forces F1, F2, and F3 can be generated respectively, and the three component forces are all along the direction of the radius of curvature of the bend and point to the center of curvature.
  • the bend can be made flat, thereby improving the stretching ability of the connecting line 140.
  • connection line 140 can be determined according to actual conditions.
  • FIG. 4 there is shown a schematic structural diagram of a connection line 140 provided by an embodiment of the present disclosure.
  • the connection line may also be a connection line having the shape shown in FIG.
  • the shape of the connecting line can be set according to actual conditions, which is not limited in the embodiment of the present disclosure.
  • two adjacent substrates 150 may also be connected by two stretchable connecting bridges 120.
  • FIG. 2 there is shown a schematic structural diagram of an array substrate provided by an embodiment of the present disclosure. As shown in FIG. 2, two adjacent substrates 150 are connected by two stretchable connecting bridges 120.
  • connection line 140 may include a first straight portion 141, a first arc portion 142, and a The two straight portions 143, the second arc-shaped portion 144 and the third straight portion 145 adopt this structure to enable the connecting line 140 to have a good stretching effect, and to ensure that the phases of adjacent display units 130 do not shift. .
  • connection line 140 may also be the structure of the connection line shown in FIG. 6.
  • the structure of the connection line 140 may be determined according to actual conditions, which is not limited in the embodiment of the present disclosure.
  • FIG. 6 a schematic diagram of a force analysis of a connection line provided by an embodiment of the present disclosure is shown.
  • a tensile force F centripetal forces F1 and F2 are generated at the first arc-shaped portion 141 and the second arc-shaped portion 142, so that the first arc-shaped portion 141 and the second arc-shaped portion The stress at the part 142 is released and the stretch is increased.
  • the force analysis is shown in Figure 6.
  • connection manner of the connection between the connection line 120 and the display unit 130 can be described as follows using FIG. 7.
  • connection between the connecting line 120 and the display unit 130 can be connected as shown in FIG. 7, that is, at the connection between the connecting line and the display unit, the cross-sectional area of the connecting line 120 is close to the display unit.
  • the point 130 gradually increases, that is, the connection line can be arranged in a semi-arc-like structure at the connection point. This connection mode is beneficial to protect the connection point.
  • the cross-sectional area of the stretchable connection bridge 140 can also be gradually increased near the substrate 150, which is beneficial to protect the connection point between the stretchable connection bridge 140 and the substrate 150.
  • the length of the stretchable connecting bridge 140 is greater than the distance between two adjacent substrates 150. 12 and FIG. 13, the length of the stretchable connecting bridge 140 is equal to the distance between two adjacent substrates 150, which can save the stretchable connecting bridge 140 material, and can also reduce the connection line 120 bear Stretching force.
  • the straight line formed by connecting the stretchable connecting bridge 140 between the two adjacent substrates 150 at the connection point on the two substrates 150, and The straight lines formed by the connecting lines 120 between the two display units 130 on the two adjacent substrates 150 and the connection points on the two display units 130 are parallel. This can effectively ensure that after the display device is stretched, the phase of the display unit will not shift, so that the picture is clear and undistorted.
  • the Young's modulus of the substrate 150 is greater than the Young's modulus of the stretchable connecting bridge 140, that is, the tensile deformation of the substrate 150 is smaller than that of the stretchable connecting bridge 140. In this way, it can be ensured that during the stretching process of the display unit 130, the connecting lines inside the display unit 130 are not affected by the stretching force.
  • the range of the Young's modulus of the substrate 150 may be set to: 0.5-2GP, and the range of the Young's modulus of the stretchable connecting bridge 140 may be set to: 4-15 Gpa.
  • the Young's modulus of the substrate 150 and the stretchable connecting bridge 140 may be determined according to actual conditions.
  • the embodiment of the present disclosure does not limit the specific values of the Young's modulus of the substrate and the stretchable connecting bridge.
  • connection line 120 may include a conductive material.
  • the conductive material can be one or more of metal materials such as molybdenum, silver, copper, aluminum, magnesium, neodymium, indium tin oxide (ITO), indium gallium zinc oxide (IGZO), indium zinc oxide (IZO), etc.
  • metal materials such as molybdenum, silver, copper, aluminum, magnesium, neodymium, indium tin oxide (ITO), indium gallium zinc oxide (IGZO), indium zinc oxide (IZO), etc.
  • ITO indium tin oxide
  • IGZO indium gallium zinc oxide
  • IZO indium zinc oxide
  • connection line 120 may also be composed of multiple wires, specifically, it may be determined according to actual conditions, which is not limited in the embodiment of the present disclosure.
  • the material of the stretchable connecting bridge 140 may include polydimethylsiloxane ((PDMS), polyethylene naphthalate (PEN), polyimide (PI), polyetherimide (PEI), polyethylene terephthalate (PET), polyphenylene sulfide (PPS) and other highly stretchable materials.
  • PDMS polydimethylsiloxane
  • PEN polyethylene naphthalate
  • PI polyimide
  • PEI polyetherimide
  • PET polyethylene terephthalate
  • PPS polyphenylene sulfide
  • an optically clear (OCA) adhesive acrylic-based adhesive, or silicon-based adhesive may be used between any one of the plurality of substrates 150 and the display unit 130 disposed thereon.
  • OCA optically clear
  • Acrylic-based adhesive acrylic-based adhesive
  • silicon-based adhesive may be used between any one of the plurality of substrates 150 and the display unit 130 disposed thereon.
  • Polyurethane glue and other glue system for bonding The shape of any one of the plurality of substrates 150 can be any shape of a square, an ellipse, a circle, a rectangle, a parallelogram, a hexagon, etc., which is not limited in the embodiment of the present disclosure.
  • the array substrate may further include a thin film encapsulation layer, and the thin film encapsulation layer may be encapsulated on a side of each display unit 130 away from the substrate 150.
  • the display unit 130 may be a single package structure to package each display unit 130 separately, or a whole package structure to package all the display units 130, as shown in FIG. 8. Specifically, it may be determined according to the actual situation, which is not limited in the embodiments of the present disclosure.
  • the preparation method of the array substrate mainly includes the following three steps.
  • Step S110 forming a plurality of substrates arranged separately and a plurality of stretchable connecting bridges connecting two adjacent ones of the plurality of substrates.
  • Step S120 forming a plurality of separately arranged display units and a plurality of connecting lines connecting two adjacent display units of the plurality of display units, wherein the length of the connecting line is greater than the length of the stretchable connecting bridge.
  • step S130 a transfer technology is used to map the separated substrates and the display units in a one-to-one correspondence for box alignment.
  • step S120 and step S120 can be interchanged. For specific implementation, the following process can be used.
  • FIG. 8 a schematic diagram of the internal structure of a display device provided by an embodiment of the present disclosure is shown.
  • FIG. 8 is a schematic diagram of a longitudinal cut interface along the section line AA' shown in FIG. 1, and the hollow area 110 and the display unit 130 can be seen.
  • a substrate 201 including PI material (not limited to PI, but one of PPS, PEN, PEI, PET, PDMS), and then fabricate a buffer layer 202 and connection lines 208 (such as thin film transistors and signal lines) .
  • the pixel defining layer 204, the light emitting layer 206, the anode 207, the cathode 210, the encapsulation layer 205, the peripheral dam area 209, an inorganic layer 203 is filled between the buffer layer 202 and the PDL 204, the anode 207 and part of the cathode 120 are located between the inorganic layer 203
  • the display substrate is divided into a display unit area and a non-display unit area.
  • the display substrate is patterned by etching or laser cutting technology to form an island-shaped display unit, a connection line connecting two adjacent display units, and a hollow area located in the non-display unit area except for the connection line.
  • the display substrate can be divided into a display unit area where the display unit is located and a non-display unit area where no display unit is provided, and multiple connection lines connecting two adjacent display units of the multiple display units are also provided between the display units.
  • the sequence of etching and laser cutting can be after the light-emitting layer and the encapsulation layer are produced, or before the light-emitting layer and the encapsulation layer are produced. Specifically, it can be determined according to the actual situation. This is not restricted.
  • the flexible film is processed by etching or laser cutting technology to form a plurality of substrates in a separate arrangement (for example, an array arrangement) and a plurality of stretchable connecting bridges connecting two adjacent substrates of the plurality of substrates .
  • each of the plurality of substrates corresponds to a display unit area.
  • heating or laser processing may be performed on multiple substrates, so that the stretching force of the substrate is less than the stretching force of the stretchable connecting bridge .
  • FIG. 9 there is shown a schematic diagram of a transfer cassette provided by an embodiment of the present disclosure. As shown in FIG. 9, multiple substrates arranged in an array and two adjacent substrates of the multiple substrates are connected. The stretchable connecting bridge and the patterned display substrate are transferred to the box and bonded together by an adhesive to form an array substrate.
  • the stretch simulation is performed on the array substrate, specifically, the following description is made with reference to FIG. 10.
  • FIG. 10 a schematic diagram of a stretching simulation provided by an embodiment of the present disclosure is shown.
  • the left half of the picture shows the array substrate before stretching
  • the right half of the picture shows the array substrate with phase shift after stretching.
  • a display device that includes a plurality of display units that are not attached to an elastic stretched substrate, after being stretched, due to the effect of the connecting lines, the problem of twisting and deflection will occur, and the display unit will have a phase shift. phenomenon.
  • the elastic stretchable substrate is designed under the display device component, the stress generated by the connecting line after the stretching action can be shared, so as to ensure that the phase of the display unit is basically not shifted, and the display effect is basically not affected by the stretching.
  • the simulation test shows that the stretch rate of the display device can reach 6.8%, while the strain is only 1.2%, showing very excellent stretch performance.
  • the array substrate provided by the embodiment of the present disclosure is provided with a plurality of substrates arranged separately, and a display unit is formed on each substrate, and a connecting line is connected between two adjacent display units to realize two adjacent displays
  • a non-metallic stretchable connection bridge is connected between two adjacent substrates.
  • the stretchable connecting bridge and the connecting line are arranged side by side, and the length of the connecting line is greater than the length of the stretchable connecting bridge.
  • a display device which may include the array substrate of any one of the foregoing embodiment 1 and an integrated circuit connected to the array substrate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Theoretical Computer Science (AREA)

Abstract

一种阵列基板及其制造方法、显示装置。阵列基板包括：分隔排列的多个衬底（150）；多个显示单元（130），其分别设置在多个衬底（150）上；多条连接线路（140），其被配置为连接相邻两个显示单元（130）；多条可拉伸连接桥（120），其被配置为连接多个衬底（150）中的相邻两个衬底（150）。连接线路（140）的长度大于可拉伸连接桥（120）的长度。

Description

阵列基板及其制造方法、显示装置
相关申请的交叉引用
本申请要求于2019年3月27日在中国知识产权局提交的申请号为201910239616.7的中国专利申请的优先权，该中国专利申请的全部内容通过引用合并于此。
技术领域
本公开涉及显示技术领域，特别是涉及一种阵列基板及其制造方法、显示装置。
背景技术
在5月23日至25于美国洛杉矶会展中心举办的2017美国显示周(SID 2017)期间，三星显示(Samsung Display)展示了一款9.1英寸可拉伸AMOLED(Active-matrix organic light emitting diode)原型。在显示时，这块显示屏可以拉伸到12mm，同时保持高分辨率。这款酷炫的拉伸显示吸引着无数人的眼球，颠覆传统显示观念，这款酷炫显示隐藏诸多的科技含量。
发明内容
根据本公开的一个方面，提供了一种阵列基板，包括：分隔排列的多个衬底；多个显示单元，其分别设置在所述多个衬底上；多条连接线路，其被配置为连接所述多个显示单元中的相邻两个显示单元；多条可拉伸连接桥，其被配置为连接所述多个衬底中的相邻两个衬底，其中，所述连接线路的长度大于所述可拉伸连接桥的长度。
在一些实施例中，所述多个显示单元之间通过所述连接线路和所述可拉伸连接桥形成镂空区域。
在一些实施例中，所述多个衬底中的相邻两个衬底通过所述多条可拉伸连接桥中的至少一条可拉伸连接桥连接。
在一些实施例中，所述可拉伸连接桥的长度大于或等于相邻两个衬底之 间的距离。
在一些实施例中，将相邻两个衬底之间的可拉伸连接桥在该相邻两个衬底上的连接点连接所形成的直线，与将该相邻两个衬底上的两个显示单元之间的连接线路在该两个显示单元上的连接点连接所形成的直线平行。
在一些实施例中，所述连接线路的横截面积在靠近所述显示单元处逐渐增大，所述可拉伸连接桥的横截面积在靠近所述衬底处逐渐增大。
在一些实施例中，所述多个衬底中任一个的杨氏模量大于所述可拉伸连接桥的杨氏模量。
在一些实施例中，所述连接线路包括依次连接的第一直线部、第一弧形部、第二直线部、第二弧形部和第三直线部。
在一些实施例中，所述连接线路包括导电材料。
在一些实施例中，所述导电材料包括钼、银、铜、铝、镁、钕、氧化铟锡、铟镓锌氧化物、铟锌氧化物中的至少一种。
在一些实施例中，所述可拉伸连接桥的材料包括聚二甲基硅氧烷、聚萘二甲酸乙二醇酯、聚酰亚胺、聚醚酰亚胺、聚对苯二甲酸乙二醇酯、聚苯硫醚中的任意一种。
在一些实施例中，所述多个衬底中的任一个与设置在其上的显示单元之间采用光学透明粘合剂、亚克力系胶、硅系胶、聚氨酯系胶中的任意一种粘接。
在一些实施例中，所述多个衬底中的任一个的形状为正方形、椭圆形、圆形、长方形、平行四边形、六边形中的任一种。
在一些实施例中，所述阵列基板还包括薄膜封装层，所述薄膜封装层位于所述多个显示单元远离所述多个衬底的一侧。
根据本公开的一个方面，提供了一种显示装置，其包括以上所述的阵列基板和与所述阵列基板连接的集成电路。
根据本公开的一个方面，提供了一种用于制造阵列基板的方法，包括：
形成分隔排列的多个衬底以及连接所述多个衬底中的相邻两个衬底的多条可拉伸连接桥；形成分隔排列的多个显示单元以及连接所述多个显示单 元的相邻两个显示单元的多条连接线路，其中，所述连接线路的长度大于所述可拉伸连接桥的长度；采用转印技术将分隔排布的所述多个衬底与所述多个显示单元一一对应以进行对盒。
在一些实施例中，形成分隔排布的多个衬底以及连接所述多个衬底中的相邻两个衬底的多条可拉伸连接桥包括：采用刻蚀或激光切割技术对柔性膜进行处理以形成分隔阵列排布的多个衬底以及连接所述多个衬底中的相邻两个衬底的多条可拉伸连接桥。
在一些实施例中，形成分隔排布的多个衬底以及连接所述多个衬底中的相邻两个衬底的多条可拉伸连接桥还包括：对所述多个衬底进行加热或激光处理。
在一些实施例中，形成多个显示单元以及连接所述多个显示单元的相邻两个显示单元的多条连接线路包括：在基底上形成分隔排布的多个显示单元以及连接所述多个显示单元的相邻两个显示单元的多条连接线路，其中，形成有所述多个显示单元和多条连接线路的基底包括显示单元区域和非显示单元区域；采用刻蚀或者激光切割技术切除所述非显示单元区域而保留其中的所述多条连接线路。
在一些实施例中，采用转印技术将分隔排布的所述多个衬底与所述多个显示单元一一对应以进行对盒时，将所述多个衬底与所述多个显示单元一一对应粘接在一起。
附图说明
图1示出了根据本公开的实施例提供的一种阵列基板的结构示意图；
图2示出了根据本公开的实施例提供的一种阵列基板的结构示意图；
图3示出了根据本公开的实施例提供的一种连接线路受力分析的示意图；
图4示出了根据本公开的实施例提供的一种连接线路的结构示意图；
图5示出了根据本公开的实施例提供的一种连接线路的结构示意图；
图6示出了根据本公开的实施例提供的一种连接线路受力分析的示意图；
图7示出了根据本公开的实施例提供的一种连接线路与显示单元连接处的示意图；
图8示出了根据本公开的实施例提供的一种显示装置件内部构造的示意图；
图9示出了根据本公开的实施例提供的一种转印对盒的示意图；
图10示出了根据本公开的实施例提供的一种拉伸模拟的示意图；
图11示出了根据本公开的实施例的制造阵列基板的方法流程图；
图12示出了根据本公开的实施例的衬底以及可拉伸连接桥的示意图；以及
图13示出了根据本公开的实施例的衬底以及可拉伸连接桥的示意图。
具体实施方式
为使本公开的上述目的、特征和优点能够更加明显易懂，下面结合附图和具体实施方式对本公开作进一步详细的说明。
在拉伸显示装置中，TFT(Thin Film Transistor，薄膜晶体管)连接线路图形化设计和材料的选择包括两种。其中一种TFT连接线路采用金属线连接方式。金属线具有刚性，本身不能够拉伸，将其图案化，利用图案化释放应力，达到一定拉伸效果。另外一种TFT连接线路采用导电橡胶。导电橡胶是橡胶里面掺杂银纳米线或其他金属导电颗粒。该导电橡胶连接线路本身具有拉伸能力，但制备工艺不成熟，目前正处于研发阶段。
发明人发现，拉伸显示装置在长期拉伸的过程中，采用金属线连接的方式，连接部分在应力集中点容易破损。金属连接线应力较大，多次拉伸后会出现几何变形，导致连接线路多次拉伸后难以完全复位，进而相邻的显示单元(岛区)之间发生相位偏移，导致某个或部分显示单元无法完全复位。由于某个或部分显示单元无法完全复位，造成无法复位的显示单元与相邻的显示单元之间的角度产生偏移，导致相邻两个显示单元的相位发生了偏移，影响显示效果，甚至导致画面失真。
为至少解决可拉伸显示装置中采用金属连接容易导致连接线路多次拉伸后难以完全复位，临近的显示单元发生相位偏移，影响显示效果，甚至导致画面失真的问题。本公开的一些实施例提供了一种阵列基板。
如图1所示，该阵列基板可以包括：分隔排列的多个衬底150，例如， 多个衬底150可呈阵列排布；多个显示单元130，其分别设置在多个衬底150上；多条连接线路140，其被配置为连接多个显示单元130中的相邻两个显示单元130；多条可拉伸连接桥120，其被配置为连接多个衬底150中的相邻的两个衬底150。连接线路140的长度大于可拉伸连接桥120的长度。由于连接线路140的长度大于可拉伸连接桥120的长度，在长期拉伸衬底150的过程中，可拉伸连接桥120可以减轻连接线路140产生的形变，避免了临近的显示单元发生相位偏移，保证显示装置长时间拉伸后显示画面清晰、不失真。
在本公开的实施例中，采用上述连接结构之后，多个显示单元之间通过连接线路和所述可拉伸连接桥形成镂空区域110。镂空区域110可以采用刻蚀技术或刻蚀加激光切割技术配合完成，具体地，将在下述制备过程中进行详细描述，在此不再加以赘述。
在本公开的实施例的一种方案中，多个衬底150中的相邻两个衬底150可以通过至少一条可拉伸连接桥120连接(如图1和图2所示)。在相邻两个衬底150之间通过一条可拉伸连接桥120连接时(如图1所示)，连接线路140可以采用特殊图案形成，可以使连接线路140可以达到较大的拉伸量。在施加拉伸力时，连接线路140具体的受力分析过程可以参照图3所示。
参照图3，示出了本公开实施例提供的一种连接线路受力分析的示意图。如图3所示，在连接线路140两端受到拉力F的作用后，可以分别产生F1、F2、F3三个分力，三个分力都是沿着弯曲处曲率半径方向，指向曲率中心，可以使弯曲处趋向平坦，进而提高了连接线路140的拉伸能力。
当然，在具体实现中，对于连接线路140的结构可以根据实际情况而定。例如，参照图4，示出了本公开实施例提供的一种连接线路140的结构示意图，连接线路也可以采用如图4所示形状的连接线路等等。具体地，对于连接线路的形状可以根据实际情况进行设定，本公开实施例对此不加以限制。
在本公开实施例的另一种方案中，在相邻两个衬底150之间也可以通过两条可拉伸连接桥120连接。例如，参照图2，示出了本公开实施例提供的一种阵列基板的结构示意图。如图2所示，相邻两个衬底150之间通过两条 可拉伸连接桥120连接。
参照图5，示出了本公开实施例提供的一种连接线路的结构示意图。如图5所示，相邻两个衬底150之间通过两条可拉伸连接桥120连接时，连接线路140可以包括依次连接的第一直线部141、第一弧形部142、第二直线部143、第二弧形部144和第三直线部145，采用的这种结构可以使连接线路140可以有良好的拉伸效果，且能够保证相邻显示单元130的相位不发生偏移。
当然，对于连接线路140的结构除了可以采用图5所示的结构之外，还可以采用图6所示的连接线路的结构。在具体实现中，连接线路140的结构可以根据实际情况而定，本公开实施例对此不加以限制。
以下结合附图对于连接线路140的受力分析进行如下分析。
参照图6，示出了本公开实施例提供的一种连接线路受力分析的示意图。如图6所示，连接线路120在受到拉力F的作用后，第一弧形部141和第二弧形部142处分别产生向心力F1和F2，使第一弧形部141和第二弧形部142处应力释放，增加拉伸量，受力分析如图6所示。
而对于连接线路120与显示单元130连接处的连接方式可以采用图7进行如下描述。
参照图7，示出了本公开实施例提供的一种连接线路与显示单元连接处的示意图。如图7所示，连接线路120与显示单元130的连接处都可以采用如图7所示的连接方式，即在连接线路与显示单元的连接处，连接线路120的横截面积在靠近显示单元130处逐渐增大，即在连接处可以将连接线路设置成类似半弧形的结构，这种连接方式有利于保护连接点。当然，也可使得可拉伸连接桥140的横截面积在靠近衬底150处逐渐增大，有利于保护可拉伸连接桥140与衬底150之间的连接点。
当然，在具体实现中，也可以采用其它连接方式，本公开实施例对此不加以限制。
参照图1和图2所示，可拉伸连接桥140的长度大于相邻两个衬底150之间的距离。参照图12和图13所示，可拉伸连接桥140的长度等于相邻两 个衬底150之间的距离，这样可以节省可拉伸连接桥140材料，并且也可以减轻连接线路120承受的拉伸力。
参照图1、图2、图12和图13所示，将相邻两个衬底150之间的可拉伸连接桥140在两个衬底150上的连接点连接所形成的直线，与将该相邻两个衬底150上的两个显示单元130之间的连接线路120在该两个显示单元130上的连接点连接所形成的直线平行。这样可以有效保障显示装置件拉伸后，显示单元相位不会发生偏移，使得画面清晰、不失真。
在本公开的一种实施例中，衬底150的杨氏模量大于可拉伸连接桥140的杨氏模量，即衬底150的拉伸形变量小于可拉伸连接桥140的拉伸形变量，从而可以保证在显示单元130拉伸过程中，显示单元130内部的连接线路不受拉伸力的影响。
在本公开中，衬底150的杨氏模量范围可以设定为：0.5～2GP，可拉伸连接桥140的杨氏模量范围可以设定为：4～15Gpa。对于衬底150和可拉伸连接桥140的杨氏模量可以根据实际情况而定，本公开实施例对于衬底和可拉伸连接桥的杨氏模量的具体数值不加以限定。
在本公开的另一种实施例中，连接线路120可以包括导电材料。
导电材料可以采用钼、银、铜、铝、镁、钕、氧化铟锡(ITO)、铟镓锌氧化物(IGZO)、铟锌氧化物(IZO)等金属材料中的一种或多种材料制成，而对于具体采用何种采用，本公开实施例不加以限制。
当然，连接线路120还可以是由多条导线组成的，具体地，可以根据实际情况而定，本公开实施例对此不加以限制。
在本公开的另一种实施例中，可拉伸连接桥140的材料可以包括聚二甲基硅氧烷((PDMS)、聚萘二甲酸乙二醇酯(PEN)、聚酰亚胺(PI)、聚醚酰亚胺(PEI)、聚对苯二甲酸乙二醇酯(PET)、聚苯硫醚(PPS)等高伸缩性材料中的至少一种，本公开实施例对此不加以限制。
在本公开的另一种实施例中，在多个衬底150中的任一个与设置在其上的显示单元130之间可以采用光学透明(OCA)粘合剂、亚克力系胶、硅系胶、聚氨酯系胶等胶系中的任意一种进行粘接。多个衬底150中的任一个的 形状可以为正方形、椭圆形、圆形、长方形、平行四边形、六边形等形状中的任一种形状，本公开实施例对此也不加以限制。
在本公开的另一种实施例中，阵列基板还可以包括薄膜封装层，薄膜封装层可以封装于各显示单元130远离衬底150的一侧。在具体实现中，显示单元130可以为单个的封装结构，以分别对各显示单元130进行封装，或者为一个整体的封装结构，以将全部的显示单元130进行封装，如图8所示。具体地，可以根据实际情况而定，本公开实施例对此不加以限制。
接下来，结合说明书附图11，对本公开实施例提供的阵列基板的制备过程进行如下描述。该阵列基板的制备方法主要包括以下三个步骤。步骤S110，形成分隔排布的多个衬底以及连接多个衬底中的相邻两个衬底的多条可拉伸连接桥。步骤S120，形成分隔排布的多个显示单元以及连接多个显示单元的相邻两个显示单元的多条连接线路，其中，所述连接线路的长度大于所述可拉伸连接桥的长度。步骤S130，采用转印技术将分隔排布的多个衬底与多个显示单元一一对应以进行对盒。其中步骤S120和步骤S120可以互换。具体实现时，可以采用以下过程。
1、制备显示基板
参照图8，示出了本公开实施例提供的一种显示装置件内部构造的示意图。图8为沿图1所示剖线AA’的纵切界面示意，可以看到镂空区域110，显示单元130。提供包括PI材质的(并不限于PI，也可以选自PPS、PEN、PEI、PET、PDMS之一)衬底201，依次制作缓冲层202、连接线路208(如薄膜晶体管以及信号线等元件)、像素界定层204、发光层206、阳极207、阴极210、封装层205、周边坝区209，在缓冲层202和PDL204之间填充有无机层203，阳极207和部分阴极120位于无机层203之上，以形成显示基板。其中显示基板被划分为显示单元区和非显示单元区。
2、采用刻蚀或者激光切割技术对显示基板进行图案化
采用刻蚀或者激光切割技术对显示基板进行图案化，以形成岛状的显示单元，连接相邻两个显示单元的连接线路，以及除连接线路外位于非显示单元区的镂空区域。这样，显示基板可被划分为显示单元所在的显示单元区域 和未设置显示单元的非显示单元区域，显示单元之间还设置有连接多个显示单元的相邻两个显示单元的多条连接线路。可以理解的是，刻蚀和激光切割的顺序可以在制作完发光层、封装层之后，也可以是在制作发光层、封装层之前，具体地，可以根据实际情况而定，本公开实施例对此不加以限制。
3、采用刻蚀或激光切割技术对柔性膜进行刻蚀或激光切割
采用刻蚀或激光切割技术对柔性膜进行处理，形成分隔排布(例如，阵列排布)的多个衬底和连接多个衬底中相邻两个衬底的多条可拉伸连接桥。其中，多个衬底中的每个对应显示单元区。并且，为使得衬底与可拉伸连接桥之间的拉伸力不同，可以对多个衬底进行加热或激光处理，以使得衬底的拉伸力小于可拉伸连接桥的拉伸力。
4、采用转印技术对盒柔性衬底与显示基板
参照图9，示出了本公开实施例提供的一种转印对盒的示意图，如图9所示，将阵列排布的多个衬底和连接多个衬底中相邻两个衬底的可拉伸连接桥和图案化的显示基板通过转印对盒，通过粘合剂粘结在一起，形成阵列基板。
对阵列基板进行拉伸模拟，具体地，结合图10进行如下描述。
参照图10，示出了本公开实施例提供的一种拉伸模拟的示意图。
如图10所示，左半部分图为拉伸之前所示的阵列基板，右半部分图为拉伸之后发生相位偏移的阵列基板。
如图10所示，包括未附着在弹性拉伸衬底的多个显示单元的显示装置件，在受到拉伸后，由于连接线路的作用，会发生扭曲偏转问题，显示单元会出现相位偏移现象。在显示装置件下方设计弹性可拉伸的衬底之后，可以分担拉伸动作后连接线路产生的应力，确保显示单元相位基本不发生偏移，显示效果基本不会受到拉伸的影响。模拟测试表明，显示装置件的拉伸率可以达到6.8％，而应变量只有1.2％，表现出了非常优异的拉伸性能。
本公开实施例提供的阵列基板，通过设置分隔排列的多个衬底，每个衬底上形成有一显示单元，在相邻两个显示单元之间连接有连接线路，以实现相邻两个显示单元之间的电连接，在相邻两个衬底之间连接有非金属的可拉 伸连接桥。在同一方向上，可拉伸连接桥与连接线路并排设置，且连接线路的长度大于可拉伸连接桥的长度。本公开实施例通过采用非金属的可拉伸连接桥可以确保拉伸显示装置更长的拉伸寿命，并且显示装置不同显示单元拉伸时相对位置不会出现偏移现象，保证长时间拉伸后显示画面清晰，不失真。
在本公开的另一种实施例中，还提供了一种显示装置，可以包括上述实施例一中任一项的阵列基板以及与该阵列基板相连的集成电路。

Claims (20)

  1. 一种阵列基板，包括：
    分隔排列的多个衬底；
    多个显示单元，其分别设置在所述多个衬底上；
    多条连接线路，其被配置为连接所述多个显示单元中的相邻两个显示单元；
    多条可拉伸连接桥，其被配置为连接所述多个衬底中的相邻两个衬底，其中，所述连接线路的长度大于所述可拉伸连接桥的长度。
  2. 根据权利要求1所述的阵列基板，其中，所述多个显示单元之间通过所述连接线路和所述可拉伸连接桥形成镂空区域。
  3. 根据权利要求2所述的阵列基板，其中，所述多个衬底中的相邻两个衬底通过所述多条可拉伸连接桥中的至少一条可拉伸连接桥连接。
  4. 根据权利要求3所述的阵列基板，其中，所述可拉伸连接桥的长度大于或等于相邻两个衬底之间的距离。
  5. 根据权利要求4所述的阵列基板，其中，将相邻两个衬底之间的可拉伸连接桥在该相邻两个衬底上的连接点连接所形成的直线，与将该相邻两个衬底上的两个显示单元之间的连接线路在该两个显示单元上的连接点连接所形成的直线平行。
  6. 根据权利要求1-5中任一项所述的阵列基板，其中，所述连接线路的横截面积在靠近所述显示单元处逐渐增大，所述可拉伸连接桥的横截面积在靠近所述衬底处逐渐增大。
  7. 根据权利要求6所述的阵列基板，其中，所述多个衬底中任一个的杨氏模量大于所述可拉伸连接桥的杨氏模量。
  8. 根据权利要求7所述的阵列基板，其中，所述连接线路包括依次连接的第一直线部、第一弧形部、第二直线部、第二弧形部和第三直线部。
  9. 根据权利要求8所述的阵列基板，其中，所述连接线路包括导电材料。
  10. 根据权利要求9所述的阵列基板，其中，所述导电材料包括钼、银、铜、铝、镁、钕、氧化铟锡、铟镓锌氧化物、铟锌氧化物中的至少一种。
  11. 根据权利要求10所述的阵列基板，其中，所述可拉伸连接桥的材料包括聚二甲基硅氧烷、聚萘二甲酸乙二醇酯、聚酰亚胺、聚醚酰亚胺、聚对苯二甲酸乙二醇酯、聚苯硫醚中的任意一种。
  12. 根据权利要求1-11中任一项所述的阵列基板，其中，所述多个衬底中的任一个与设置在其上的显示单元之间采用光学透明粘合剂、亚克力系胶、硅系胶、聚氨酯系胶中的任意一种粘接。
  13. 根据权利要求12所述的阵列基板，其中，所述多个衬底中的任一个的形状为正方形、椭圆形、圆形、长方形、平行四边形、六边形中的任一种。
  14. 根据权利要求13所述的阵列基板，还包括薄膜封装层，所述薄膜封装层位于所述多个显示单元远离所述多个衬底的一侧。
  15. 一种显示装置，包括权利要求1-14中任一项所述的阵列基板和与所述阵列基板连接的集成电路。
  16. 一种用于制造阵列基板的方法，包括：
    形成分隔排列的多个衬底以及连接所述多个衬底中的相邻两个衬底的多条可拉伸连接桥；
    形成分隔排列的多个显示单元以及连接所述多个显示单元的相邻两个显示单元的多条连接线路，其中，所述连接线路的长度大于所述可拉伸连接桥的长度；
    采用转印技术将分隔排布的所述多个衬底与所述多个显示单元一一对应以进行对盒。
  17. 根据权利要求16所述的方法，其中，形成分隔排布的多个衬底以及连接所述多个衬底中的相邻两个衬底的多条可拉伸连接桥包括：采用刻蚀或激光切割技术对柔性膜进行处理以形成分隔阵列排布的多个衬底以及连接所述多个衬底中的相邻两个衬底的多条可拉伸连接桥。
  18. 根据权利要求17所述的方法，其中，形成分隔排布的多个衬底以 及连接所述多个衬底中的相邻两个衬底的多条可拉伸连接桥还包括：对所述多个衬底进行加热或激光处理。
  19. 根据权利要求16所述的方法，其中，形成多个显示单元以及连接所述多个显示单元的相邻两个显示单元的多条连接线路包括：
    在基底上形成分隔排布的多个显示单元以及连接所述多个显示单元的相邻两个显示单元的多条连接线路，其中，形成有所述多个显示单元和多条连接线路的基底包括显示单元区域和非显示单元区域；
    采用刻蚀或者激光切割技术切除所述非显示单元区域而保留其中的所述多条连接线路。
  20. 根据权利要求16所述的方法，其中，采用转印技术将分隔排布的所述多个衬底与所述多个显示单元一一对应以进行对盒时，将所述多个衬底与所述多个显示单元一一对应粘接在一起。
PCT/CN2020/081361 2019-03-27 2020-03-26 阵列基板及其制造方法、显示装置 WO2020192725A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US17/059,231 US11776971B2 (en) 2019-03-27 2020-03-26 Array substrate, manufacturing method thereof and display apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910239616.7A CN109920334B (zh) 2019-03-27 2019-03-27 一种阵列基板及显示装置
CN201910239616.7 2019-03-27

Publications (1)

Publication Number Publication Date
WO2020192725A1 true WO2020192725A1 (zh) 2020-10-01

Family

ID=66967252

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/081361 WO2020192725A1 (zh) 2019-03-27 2020-03-26 阵列基板及其制造方法、显示装置

Country Status (3)

Country Link
US (1) US11776971B2 (zh)
CN (1) CN109920334B (zh)
WO (1) WO2020192725A1 (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109920334B (zh) * 2019-03-27 2021-04-27 京东方科技集团股份有限公司 一种阵列基板及显示装置
CN110350014B (zh) * 2019-07-17 2021-10-26 京东方科技集团股份有限公司 显示基板、显示装置及显示基板的制备方法
CN110444577B (zh) * 2019-08-14 2021-08-27 京东方科技集团股份有限公司 一种柔性显示面板及显示装置
CN110518150B (zh) * 2019-09-06 2022-04-26 京东方科技集团股份有限公司 显示基板及其制造方法、显示装置
CN110767088B (zh) * 2019-10-28 2022-01-11 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置
KR20210052723A (ko) * 2019-10-30 2021-05-11 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 검사 방법
CN110957330B (zh) * 2019-12-17 2022-10-11 京东方科技集团股份有限公司 基板、显示装置和制作方法
CN113594206A (zh) * 2020-04-30 2021-11-02 深圳市柔宇科技有限公司 柔性显示面板及其制备方法
CN113629103A (zh) * 2020-05-08 2021-11-09 深圳市柔宇科技有限公司 柔性显示面板
CN111462637B (zh) * 2020-05-29 2022-07-01 上海天马微电子有限公司 一种显示面板和显示装置
CN111682049B (zh) * 2020-06-19 2023-08-22 京东方科技集团股份有限公司 显示基板、显示装置及掩膜版
CN111710242A (zh) * 2020-06-28 2020-09-25 合肥维信诺科技有限公司 可拉伸显示屏和屏体保护膜
CN111653205B (zh) * 2020-07-15 2021-12-28 上海天马微电子有限公司 可拉伸显示面板和显示装置
CN111862815B (zh) * 2020-07-29 2022-02-25 上海天马微电子有限公司 可拉伸显示面板和柔性显示装置
CN112289193B (zh) * 2020-10-30 2022-08-19 合肥维信诺科技有限公司 显示面板和显示装置
CN113782569B (zh) * 2020-11-10 2023-05-02 友达光电股份有限公司 显示装置
CN113903257A (zh) * 2021-09-27 2022-01-07 业成科技（成都）有限公司 可拉伸电子模组及其应用的电子装置
CN114078384B (zh) * 2021-11-03 2023-06-27 武汉华星光电半导体显示技术有限公司 显示面板及移动终端
US20240284741A1 (en) * 2022-05-07 2024-08-22 Chengdu Boe Optoelectronics Technology Co., Ltd. Display substrate and driving method of the same, and display device
CN115863378A (zh) * 2022-12-16 2023-03-28 英特盛科技股份有限公司 发光二极体显示装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100233843A1 (en) * 2009-03-13 2010-09-16 Sunlight Photonics Inc. Formation of stretchable photovoltaic devices and carriers
US20150069617A1 (en) * 2008-10-07 2015-03-12 Mc10, Inc. Extremely stretchable electronics
CN105324841A (zh) * 2013-02-06 2016-02-10 伊利诺伊大学评议会 用于可拉伸的电子器件的自相似和分形设计
CN108269501A (zh) * 2018-01-25 2018-07-10 京东方科技集团股份有限公司 一种可弹性形变显示基板及其制备方法、显示装置
CN108766951A (zh) * 2018-05-30 2018-11-06 京东方科技集团股份有限公司 柔性基板及制备方法、柔性电子装置
CN108831309A (zh) * 2018-06-29 2018-11-16 上海天马微电子有限公司 一种显示装置
CN109920334A (zh) * 2019-03-27 2019-06-21 京东方科技集团股份有限公司 一种阵列基板及显示装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9613911B2 (en) 2013-02-06 2017-04-04 The Board Of Trustees Of The University Of Illinois Self-similar and fractal design for stretchable electronics
KR102224743B1 (ko) * 2014-10-21 2021-03-09 삼성디스플레이 주식회사 연신이 가능한 유기 발광 표시 장치
US10381542B2 (en) * 2015-04-30 2019-08-13 International Business Machines Corporation Trilayer Josephson junction structure with small air bridge and no interlevel dielectric for superconducting qubits
US9905654B2 (en) * 2015-07-21 2018-02-27 Electronics And Telecommunications Research Institute Bridge diode
KR102446889B1 (ko) * 2015-12-28 2022-09-26 삼성디스플레이 주식회사 플렉서블 기판 및 이를 포함하는 플렉서블 표시 장치
KR101973163B1 (ko) * 2016-03-22 2019-04-29 삼성디스플레이 주식회사 디스플레이 장치
KR101810050B1 (ko) * 2016-08-11 2017-12-19 삼성디스플레이 주식회사 스트레처블 디스플레이 장치 및 스트레처블 디스플레이 장치의 제조 방법
KR102697421B1 (ko) * 2016-08-18 2024-08-21 삼성디스플레이 주식회사 표시 패널
KR102694860B1 (ko) 2016-09-23 2024-08-13 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
KR20180045968A (ko) * 2016-10-26 2018-05-08 삼성디스플레이 주식회사 표시 장치
KR102430018B1 (ko) * 2017-12-20 2022-08-05 엘지디스플레이 주식회사 이송 헤드 어셈블리 및 발광소자 이송장치
CN109189265B (zh) 2018-08-28 2021-10-08 上海天马微电子有限公司 一种可拉伸面板和柔性显示装置
CN109064900B (zh) * 2018-09-04 2021-05-11 京东方科技集团股份有限公司 一种可拉伸显示基板及其制造方法、可拉伸显示器
CN109308851B (zh) * 2018-09-29 2020-12-22 京东方科技集团股份有限公司 可拉伸显示基板及其制造方法、显示装置
CN109346504B (zh) * 2018-09-30 2021-06-29 云谷（固安）科技有限公司 柔性显示面板及显示装置
CN109378332B (zh) * 2018-09-30 2021-01-26 昆山国显光电有限公司 柔性显示面板及显示装置
KR102664207B1 (ko) * 2018-10-08 2024-05-07 엘지디스플레이 주식회사 스트레쳐블 표시 장치 및 그 제조 방법

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150069617A1 (en) * 2008-10-07 2015-03-12 Mc10, Inc. Extremely stretchable electronics
US20100233843A1 (en) * 2009-03-13 2010-09-16 Sunlight Photonics Inc. Formation of stretchable photovoltaic devices and carriers
CN105324841A (zh) * 2013-02-06 2016-02-10 伊利诺伊大学评议会 用于可拉伸的电子器件的自相似和分形设计
CN108269501A (zh) * 2018-01-25 2018-07-10 京东方科技集团股份有限公司 一种可弹性形变显示基板及其制备方法、显示装置
CN108766951A (zh) * 2018-05-30 2018-11-06 京东方科技集团股份有限公司 柔性基板及制备方法、柔性电子装置
CN108831309A (zh) * 2018-06-29 2018-11-16 上海天马微电子有限公司 一种显示装置
CN109920334A (zh) * 2019-03-27 2019-06-21 京东方科技集团股份有限公司 一种阵列基板及显示装置

Also Published As

Publication number Publication date
US11776971B2 (en) 2023-10-03
CN109920334A (zh) 2019-06-21
US20210210523A1 (en) 2021-07-08
CN109920334B (zh) 2021-04-27

Similar Documents

Publication Publication Date Title
WO2020192725A1 (zh) 阵列基板及其制造方法、显示装置
US11424227B2 (en) Display panel, display module, and display device
US10862066B2 (en) Display panel and display apparatus
KR102362080B1 (ko) 폴더블 표시장치
CN113253871B (zh) 显示模块
US11437579B2 (en) Stretchable electronic device and method of fabricating the same
JP2017111435A (ja) フレキシブル表示装置
KR102316866B1 (ko) 신축성 디스플레이
TWI640966B (zh) 可撓式顯示裝置
US20210063610A1 (en) Optical adhesive layer, stretchable display device and preparing method for optical adhesive layer
CN111863901B (zh) 可拉伸显示面板和显示装置
WO2020113838A1 (zh) 显示面板
TW202401221A (zh) 觸控感測器及其顯示裝置
TW202127404A (zh) 顯示裝置
KR20200077402A (ko) 신축성 디스플레이
KR20220008983A (ko) 표시 장치 및 그것의 제조 방법
TWI782603B (zh) 可拉伸顯示設備
US20210408212A1 (en) Flexible display screen and display device
CN113130588B (zh) 显示设备
KR102354030B1 (ko) 전극 접속 패드 및 이를 포함하는 전자 소자
WO2023155634A1 (zh) 显示面板和电子设备
TWI814097B (zh) 導電模組及顯示裝置
EP3872562A1 (en) Display device
US20220320250A1 (en) Display panel and display device comprising same
KR20220131457A (ko) 표시 장치 및 표시 장치의 제조 방법

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20777742

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20777742

Country of ref document: EP

Kind code of ref document: A1