WO2020151071A1 - 带有立体电路的基件及其制备方法 - Google Patents

带有立体电路的基件及其制备方法 Download PDF

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Publication number
WO2020151071A1
WO2020151071A1 PCT/CN2019/078791 CN2019078791W WO2020151071A1 WO 2020151071 A1 WO2020151071 A1 WO 2020151071A1 CN 2019078791 W CN2019078791 W CN 2019078791W WO 2020151071 A1 WO2020151071 A1 WO 2020151071A1
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Prior art keywords
layer
circuit
buried
embedded
base
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PCT/CN2019/078791
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English (en)
French (fr)
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张雯蕾
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张雯蕾
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Publication of WO2020151071A1 publication Critical patent/WO2020151071A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Definitions

  • the invention relates to electrical device technology, in particular to a technology of a base piece with a three-dimensional circuit and a preparation method thereof.
  • circuits such as sensor circuits, touch circuits, and antenna circuits are usually mounted on printed circuit boards.
  • printed circuit boards can have a multilayer structure, the lines on each structure can only be tiled. There are only front and back sides available, so the area of the printed circuit board is relatively large, and it needs to occupy a large space on the electrical equipment, and the internal structure layer of the printed circuit board can only lay lines, not electronics. element.
  • the circuit on the printed circuit board is relatively thick and cannot be made very thin, which also makes the printed circuit board unable to effectively reduce the occupied space.
  • the technical problem to be solved by the present invention is to provide a substrate with a three-dimensional circuit that can save the space occupied by the circuit and a preparation method thereof.
  • the present invention provides a base with a three-dimensional circuit, including an insulated base body, characterized in that: the base body is a three-dimensional geometric body, and the base body is provided with mounting Circuit
  • the electrical connection lines in the mounted circuit are divided into two types according to the placement position.
  • One type of electrical connection lines is a surface line, and the other type of electrical connection line is an embedded line; the surface line is directly plated on the base body On the surface, the buried circuit is buried in the base body.
  • a wire groove is provided on the surface of the base body, and the surface circuit is sunk into the wire groove on the surface of the base body.
  • the surface of the base body is coated with a waterproof membrane layer covering the surface circuits.
  • the base body is a polyhedron or an irregular geometric body.
  • the base body is a geometric body with a curved surface.
  • the base body is a solid geometric body or a hollow geometric body.
  • the mounting circuit contains electronic components, and each electronic component in the mounting circuit is fixed on the surface circuit.
  • S1 Divide the embedded circuit in the mounted circuit into N layers in advance, where N is greater than or equal to 1;
  • S3 Use laser engraving method to engrave the first-layer embedded circuit slot on the surface of the first layer of substrate blank, and then use electroless plating to plate the first layer in the slot on the surface of the first layer of substrate blank.
  • Layer 1 buried circuits, and solder lead wires respectively at the positions on the 1st layer buried circuits that need to be connected to buried circuits and/or surface circuits in other layers;
  • S6 Use the laser engraving method to engrave the wire groove of the i-th layer embedded circuit on the surface of the i-th layer of substrate blank, and then use the electroless plating method to plate the first layer of wire groove on the surface of the i-th layer of substrate blank.
  • the buried circuit in the i-layer, and the lead wires of the buried circuit in each layer, the lead wires that need to be connected to the buried circuit in the i-th layer are soldered to the corresponding connection points of the buried circuit in the i-th layer, and in the i-th layer Solder lead wires at locations on buried circuits that need to be connected to buried circuits and/or surface circuits in other layers;
  • S9 Define the combined body formed by the N+1 layer of the base body as the base body, use laser engraving to engrave the surface line grooves on the surface of the base body, and then use electroless plating on the base body Surface lines are plated in the surface wire grooves, and the lead wires of the buried lines in each layer need to be connected to the corresponding connection points of the surface lines by welding.
  • step S9 after the surface circuit is plated in the wire groove on the surface of the base body, each electronic component in the mounted circuit is soldered on the surface circuit respectively.
  • the mounting circuit contains electronic components, and each electronic component in the mounting circuit is divided into two types according to the placement position, one of which is Surface components, another type of electronic components are embedded components; the surface components are fixed on the surface circuit, and the embedded components are embedded in the base body and fixed on the embedded circuit.
  • S1 Divide the embedded components and embedded circuits in the mounted circuit into N layers in advance, where N is greater than or equal to 1;
  • S3 Use laser engraving method to engrave the first-layer embedded circuit slot on the surface of the first layer of substrate blank, and then use electroless plating to plate the first layer in the slot on the surface of the first layer of substrate blank.
  • S6 Use the laser engraving method to engrave the wire groove of the i-th layer embedded circuit on the surface of the i-th layer of substrate blank, and then use the electroless plating method to plate the first layer of wire groove on the surface of the i-th layer of substrate blank.
  • the buried circuit of the i-layer, and then the buried components of the i-th layer are soldered on the buried circuit of the i-th layer respectively, and the lead wires of the buried circuit of each layer need to be connected to the lead wire of the i-th buried circuit Solder the corresponding connection points of the buried circuit in the i-th layer respectively, and solder the lead wires respectively at the positions on the buried circuit in the i-th layer that need to be connected to the buried circuits and/or surface circuits in other layers;
  • S9 Define the combined body formed by the N+1 layer of the base body as the base body, use laser engraving to engrave the surface line grooves on the surface of the base body, and then use electroless plating on the base body
  • the surface line is plated in the surface line, and then the surface components are respectively soldered on the surface line, and the lead lines of the buried lines in each layer need to be connected to the surface line by welding the corresponding connection of the surface line Point.
  • the first layer of the base body of the base body is made of thermosetting material, thermoplastic material or ceramic.
  • the base body is made of thermosetting material and/or thermoplastic material.
  • the base piece with a three-dimensional circuit and a preparation method thereof provided by the present invention adopt a three-dimensional geometric body to carry the circuit, and embed a part of the electrical connection circuit in the geometric body, and the other part of the circuit is directly plated on each surface of the geometric body.
  • a three-dimensional circuit structure is formed, which can save the space occupied by the circuit. It has the characteristics of more available surfaces for wiring.
  • Each surface of the geometric body can be wired, and each surface of the geometric body can be wired to connect other electrical modules.
  • the contacts facilitate the connection of peripheral electrical modules, and some electronic components can also be embedded in the geometric body, which can further save the space occupied by the circuit.
  • FIG. 1 is a schematic diagram of a three-dimensional structure of a base with a three-dimensional circuit according to an embodiment of the present invention
  • FIG. 2 is a cross-sectional view of the substrate with a three-dimensional circuit of the embodiment of the present invention taken along the line A-A in FIG. 1.
  • a base with a three-dimensional circuit provided by an embodiment of the present invention includes an insulated base body 1, which is characterized by:
  • the base body 1 is a hexahedron, a mounting circuit is provided on the base body 1, and the mounting circuit contains electronic components 2, and each electronic component 2 in the mounting circuit is divided into two types according to the placement position, one of which is Type 2 electronic components are surface components, and the other type 2 are embedded components;
  • the electrical connection lines 3 in the mounted circuit are divided into two types according to the placement position.
  • One type of electrical connection lines 3 is a surface line
  • the other type of electrical connection line 3 is an embedded line
  • the surface line is directly plated on the base.
  • the embedded circuit is embedded in the base body 1; the surface element is fixed on the surface circuit, and the embedded element is embedded in the base body 1 and fixed on the embedded circuit;
  • the surface of the base body 1 is provided with a wire groove, the surface lines are sunk into the wire grooves on the surface of the base body, and the surface of the base body 1 is coated with a waterproof membrane covering the surface lines Layer (not shown in the figure).
  • the waterproof membrane layer may not be provided on the surface of the base body according to specific requirements.
  • the mounting circuit may be various existing circuits such as a sensor circuit, a touch circuit, and an antenna circuit
  • the electronic components in the mounting circuit may be electronic components such as integrated circuit chips, resistors, and capacitors.
  • the base body may also be geometric bodies with other three-dimensional shapes, such as cylinders, cones, spheres, rings, irregular geometric bodies, and other polyhedrons such as tetrahedrons and pentahedrons;
  • the surface circuit can be plated on multiple faces of the base body, for example, surface circuits are plated on all six faces of the hexahedron, or only two of them are adjacent Surface circuit is plated on the surface;
  • the surface lines can be plated on the curved surfaces of the base body;
  • the base body can be a solid geometric body or a hollow geometric body.
  • both the outer surface and the inner surface of the base body can be coated with surface circuits.
  • S1 Divide the embedded components and embedded circuits in the mounted circuit into N layers in advance, where N is greater than or equal to 1;
  • the first layer substrate blank can be a geometric body of various three-dimensional shapes such as a cylinder, a sphere, a polyhedron, etc.;
  • S3 Use laser engraving method to engrave the first-layer embedded circuit slot on the surface of the first layer of substrate blank, and then use electroless plating to plate the first layer in the slot on the surface of the first layer of substrate blank.
  • S6 Use the laser engraving method to engrave the wire groove of the i-th layer embedded circuit on the surface of the i-th layer of substrate blank, and then use the electroless plating method to plate the first layer of wire groove on the surface of the i-th layer of substrate blank.
  • the buried circuit of the i-layer, and then the buried components of the i-th layer are soldered on the buried circuit of the i-th layer respectively, and the lead wires of the buried circuit of each layer need to be connected to the lead wire of the i-th buried circuit Solder the corresponding connection points of the buried circuit in the i-th layer respectively, and solder the lead wires respectively at the positions on the buried circuit in the i-th layer that need to be connected to the buried circuits and/or surface circuits in other layers;
  • S9 Define the combined body formed by the N+1 layer of the base body as the base body, use laser engraving to engrave the surface line grooves on the surface of the base body, and then use electroless plating on the base body
  • the surface line is plated in the surface line, and then the surface components are respectively soldered on the surface line, and the lead lines of the buried lines in each layer need to be connected to the surface line by welding the corresponding connection of the surface line Point;
  • a waterproof membrane layer can be coated on the surface of the base body to cover the surface circuits.
  • the base body is mainly made of thermosetting and thermoplastic materials, such as TPEE ((thermoplastic polyester elastomer), LCP (liquid crystal polymer) and other LDS (laser direct structuring) materials, etc.;
  • the one-layer substrate blank can also be made of ceramics; in other embodiments of the present invention, thermosetting materials and thermoplastic materials are mainly used (that is, all other substrate blanks except the first layer substrate Using thermosetting materials and/or thermoplastic materials), the various electronic components in the mounted circuit can also be arranged on the surface of the base body (that is, no embedded components are provided). In this case, the preparation process can also be omitted.
  • the process of soldering embedded components on the embedded circuit In other embodiments of the present invention, there may be no electronic components (only electrical connection lines) in the mounted circuit. In this case, the surface wiring and The process of soldering electronic components on embedded circuits.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

一种带有立体电路的基件及其制备方法，涉及电气器件技术领域，所解决的是减少电路占用空间的技术问题。该基件包括绝缘的基件本体，所述基件本体为立体形状的几何体，基件本体上设有搭载电路；所述搭载电路中的电气连接线路按布设位置分为两类，其中的一类电气连接线路为表面线路，另一类电气连接线路为内埋线路；所述表面线路直接镀在基件本体的表面，内埋线路埋入基件本体内。本发明提供的基件，能大幅节省电路占用空间。

Description

带有立体电路的基件及其制备方法 技术领域
本发明涉及电气器件技术，特别是涉及一种带有立体电路的基件及其制备方法的技术。
背景技术
传感器电路、触控电路、天线电路等各种现有的电路通常都搭载在印制电路板上，印制电路板虽然可以有多层结构，但是每一个结构上的线路只能平铺，其可用面也只有正反两面，因此印制电路板的面积相对较大，需要在电气设备上占用较大的空间，而且在印制电路板的内结构层上也只能铺设线路，不能布设电子元件。另外，印制电路板上的线路也相对较粗，无法做的很细，这也使得印制电路板无法有效的缩减占用空间。
发明内容
针对上述现有技术中存在的缺陷，本发明所要解决的技术问题是提供一种能节省电路占用空间的带有立体电路的基件及其制备方法。
为了解决上述技术问题，本发明所提供的一种带有立体电路的基件，包括绝缘的基件本体，其特征在于：所述基件本体为立体形状的几何体，基件本体上设有搭载电路；
所述搭载电路中的电气连接线路按布设位置分为两类，其中的一类电气连接线路为表面线路，另一类电气连接线路为内埋线路；所述表面线路直接镀在基件本体的表面，内埋线路埋入基件本体内。
进一步的，所述基件本体的表面开设有线槽，所述表面线路沉入基件本体表面的线槽内。
进一步的，所述基件本体的表面涂附有一层遮盖住表面线路的防水膜层。
进一步的，所述基件本体是多面体，或是不规则几何体。
进一步的，所述基件本体是具有曲面的几何体。
进一步的，所述基件本体是实心几何体，或是空心几何体。
本发明所提供的第一种带有立体电路的基件中，所述搭载电路中包含有电子元件，并且搭载电路中的各个电子元件都固定在表面线路上。
本发明所提供的第一种带有立体电路的基件的制备方法，其特征在于，具体步骤如下：
S1：将搭载电路中的内埋线路预先分为N层，N大于等于1；
S2：制作第1层基件坯体；
S3：采用镭射光雕方式在第1层基件坯体的表面雕刻出第1层内埋线路的线槽，再采用化学镀方式在第1层基件坯体表面的线槽内镀上第1层内埋线路，并在第1层内埋线路上的需要连接其它层内埋线路和/或表面线路的位置分别焊置引出线；
S4：在第1层基件坯体的表面浇注热固性材料或热塑性材料，并使浇注的材料覆盖住第1层基件坯体上的内埋线路，并使第1层内埋线路的引出线外露，浇注在第1层基件坯体表面的材料冷却成型后，形成第2层基件坯体；
S5：定义i＝2，如果i>N，则转至步骤S9；
S6：采用镭射光雕方式在第i层基件坯体的表面雕刻出第i层内埋线路的线槽，再采用化学镀方式在第i层基件坯体表面的线槽内镀上第i层内埋线路，并将各层内埋线路的引出线中，需要连接第i层内埋线路的引出线分别焊接在第i层内埋线路的对应连接点上，并在第i层内埋线路上的需要连接其它层内埋线路和/或表面线路的位置分别焊置引出线；
S7：在第i层基件坯体的表面浇注热固性材料或热塑性材料，并使浇注的材料覆盖住第i层基件坯体上的内埋线路，并使各层内埋线路上的引出线外露，浇注在第i层基件坯体表面的材料冷却成型后，形成第i+1层基件坯体；
S8：如果i小于N，则令i＝i+1，并转至步骤S6，反之则转至步骤S9；
S9：将N+1层基件坯体所形成的结合体定义为基件本体，采用镭射光雕方式在基件本体的表面雕刻出表面线路的线槽，再采用化学镀方式在基件本体表面的线槽内镀上表面线路，并将各层内埋线路的引出线中，需要连接表面线路的引出线分别焊接在表面线路的对应连接点上。
进一步的，在步骤S9中，在基件本体表面的线槽内镀上表面线路后，再将搭载电路中的各个电子元件分别焊置在表面线路上。
本发明所提供的第二种带有立体电路的基件中，所述搭载电路中包含有电子元件，并且搭载电路中的各个电子元件按布设位置分为两类，其中的一类电子元件为表面元件，另一类电子元件为内埋元件；所述表面元件固定在表面线路上，内埋元件埋入基件本体内，并固定在内埋线路上。
本发明所提供的第二种带有立体电路的基件的制备方法，其特征在于，具体步骤如下：
S1：将搭载电路中的内埋元件、内埋线路预先分为N层，N大于等于1；
S2：制作第1层基件坯体；
S3：采用镭射光雕方式在第1层基件坯体的表面雕刻出第1层内埋线路的线槽，再采用化学镀方式在第1层基件坯体表面的线槽内镀上第1层内埋线路，然后再将第1层内埋元件分别焊置在第1层内埋线路上，并在第1层内埋线路上的需要连接其它层内埋线路和/或表面线路的位置分别焊置引出线；
S4：在第1层基件坯体的表面浇注热固性材料或热塑性材料，并使浇注的材料覆盖住第1层基件坯体上的内埋元件、内埋线路，并使第1层内埋线路的引出线外露，浇注在第1层基件坯体表面的材料冷却成型后，形成第2层基件坯体；
S5：定义i＝2，如果i>N，则转至步骤S9；
S6：采用镭射光雕方式在第i层基件坯体的表面雕刻出第i层内埋线路的线槽，再采用化学镀方式在第i层基件坯体表面的线槽内镀上第i层内埋线路，然后再将第i层内埋元件分别焊置在第i层内埋线路上，并将各层内埋线路的引出线中，需要连接第i层内埋线路的引出线分别焊接在第i层内埋线路的对应连接点上，并在第i层内埋线路上的需要连接其它层内埋线路和/或表面线路的位置分别焊置引出线；
S7：在第i层基件坯体的表面浇注热固性材料或热塑性材料，并使浇注的材料覆盖住第i层基件坯体上的内埋元件、内埋线路，并使各层内埋线路上的引出线外露，浇注在第i层基件坯体表面的材料冷却成型后，形成第i+1层基件坯体；
S8：如果i小于N，则令i＝i+1，并转至步骤S6，反之则转至步骤S9；
S9：将N+1层基件坯体所形成的结合体定义为基件本体，采用镭射光雕方式在基件本体的表面雕刻出表面线路的线槽，再采用化学镀方式在基件本体表面的线槽内镀上表面线路，然后再将表面元件分别焊置在表面线路上，并将各层内埋 线路的引出线中，需要连接表面线路的引出线分别焊接在表面线路的对应连接点上。
进一步的，所述基件本体的第1层基件坯体采用热固性材料、热塑性材料或陶瓷制作。
进一步的，所述基件本体采用热固性材料和/或热塑性材料制作。
本发明提供的带有立体电路的基件及其制备方法，采用立体形状的几何体来搭载电路，并将电气连接线路中的一部分线路埋入几何体内，另一部分线路直接镀在几何体的各个表面，形成立体的电路结构，从而能节省电路占用空间，具有布设线路的可用面多的特点，几何体的每个面都可以布设线路，而且几何体的每个面都可以布设用于连接其它电气模块的电气接点，方便周边电气模块的连接，而且还可以把部分电子元件也埋入几何体内，能进一步节省电路占用空间。
附图说明
图1是本发明实施例的带有立体电路的基件的立体结构示意图；
图2是本发明实施例的带有立体电路的基件沿图1中的A-A线剖切后的剖面图。
具体实施方式
以下结合附图说明对本发明的实施例作进一步详细描述，但本实施例并不用于限制本发明，凡是采用本发明的相似结构及其相似变化，均应列入本发明的保护范围，本发明中的顿号均表示和的关系。
如图1-图2所示，本发明实施例所提供的一种带有立体电路的基件，包括绝缘的基件本体1，其特征在于：
所述基件本体1为六面体，基件本体1上设有搭载电路，所述搭载电路中包含有电子元件2，并且搭载电路中的各个电子元件2按布设位置分为两类，其中的一类电子元件2为表面元件，另一类电子元件2为内埋元件；
所述搭载电路中的电气连接线路3按布设位置分为两类，其中的一类电气连接线路3为表面线路，另一类电气连接线路3为内埋线路；所述表面线路直接镀在基件本体1的表面，内埋线路埋入基件本体1内；所述表面元件固定在表面线路上，内埋元件埋入基件本体1内，并固定在内埋线路上；
本发明实施例中，所述基件本体1的表面开设有线槽，所述表面线路沉入基件本体表面的线槽内，基件本体1的表面涂附有一层遮盖住表面线路的防水膜层(图中未示),本发明其它实施例中，也可以根据具体需求，在基件本体的表面不设置防水膜层。
本发明实施例中，所述搭载电路可以是传感器电路、触控电路、天线电路等各种现有的电路，搭载电路中的电子元件可以是集成电路芯片、电阻、电容等电子元件。
本发明其它实施例中，所述基件本体也可以是其它立体形状的几何体，比如圆柱体、锥柱体、球体、环体、不规则几何体，及四面体、五面体等其它多面体；
基件本体采用多面体或不规则几何体的情况下，表面线路可以镀在基件本体的多个面上，比如在六面体的六个面上都镀上表面电路，或者只在其中的两个相邻面上镀上表面电路；
基件本体采用圆柱体、锥柱体、球体、环体等具有曲面的几何体的情况下，表面线路可以镀在基件本体的曲面上；
基件本体既可以是实心几何体，也可以是空心几何体，在基件本体采用空心几何体的情况下，基件本体的外表面、内表面都可以镀表面线路。
本发明实施例的制备方法，具体步骤如下：
S1：将搭载电路中的内埋元件、内埋线路预先分为N层，N大于等于1；
S2：制作第1层基件坯体，第1层基件坯体的材质可以是热固性材料、热塑性材料，也可以是陶瓷；
第1层基件坯体可以是柱体、球体、多面体等各种立体形状的几何体；
S3：采用镭射光雕方式在第1层基件坯体的表面雕刻出第1层内埋线路的线槽，再采用化学镀方式在第1层基件坯体表面的线槽内镀上第1层内埋线路，然后再将第1层内埋元件分别焊置在第1层内埋线路上，并在第1层内埋线路上的需要连接其它层内埋线路和/或表面线路的位置分别焊置引出线；
S4：在第1层基件坯体的表面浇注热固性材料或热塑性材料，并使浇注的材料覆盖住第1层基件坯体上的内埋元件、内埋线路，并使第1层内埋线路的引出线外露，浇注在第1层基件坯体表面的材料冷却成型后，形成第2层基件坯体；
S5：定义i＝2，如果i>N，则转至步骤S9；
S6：采用镭射光雕方式在第i层基件坯体的表面雕刻出第i层内埋线路的线槽，再采用化学镀方式在第i层基件坯体表面的线槽内镀上第i层内埋线路，然后再将第i层内埋元件分别焊置在第i层内埋线路上，并将各层内埋线路的引出线中，需要连接第i层内埋线路的引出线分别焊接在第i层内埋线路的对应连接点上，并在第i层内埋线路上的需要连接其它层内埋线路和/或表面线路的位置分别焊置引出线；
S7：在第i层基件坯体的表面浇注热固性材料或热塑性材料，并使浇注的材料覆盖住第i层基件坯体上的内埋元件、内埋线路，并使各层内埋线路上的引出线外露，浇注在第i层基件坯体表面的材料冷却成型后，形成第i+1层基件坯体；
S8：如果i小于N，则令i＝i+1，并转至步骤S6，反之则转至步骤S9；
S9：将N+1层基件坯体所形成的结合体定义为基件本体，采用镭射光雕方式在基件本体的表面雕刻出表面线路的线槽，再采用化学镀方式在基件本体表面的线槽内镀上表面线路，然后再将表面元件分别焊置在表面线路上，并将各层内埋线路的引出线中，需要连接表面线路的引出线分别焊接在表面线路的对应连接点上；
然后根据需求，可在基件本体的表面涂附一层遮盖住表面线路的防水膜层。
本发明实施例中，基件本体主要采用热固性材料、热塑性材料制作，比如TPEE((热塑性聚酯弹性体)、LCP(液晶聚合物)等LDS(激光直接成型)材料等；基件本体的第1层基件坯体还可以采用陶瓷制作；本发明其它实施例中，在主要采用热固性材料、热塑性材料的方式下(即：除第1层基件坯体之外的其它基件坯体都采用热固性材料和/或热塑性材料)，搭载电路中的各个电子元件也可以全部布设在基件本体的表面(即：不设置内埋元件)，此情况下，在制备过程中也可以省去在内埋线路上焊置内埋元件的工序。本发明其它实施例中，搭载电路中也可以没有电子元件(只有电气连接线路)，此情况下，在制备过程中也可以省去在表面线路及内埋线路上焊置电子元件的工序。

Claims (13)

  1. 一种带有立体电路的基件，包括绝缘的基件本体，其特征在于：所述基件本体为立体形状的几何体，基件本体上设有搭载电路；
    所述搭载电路中的电气连接线路按布设位置分为两类，其中的一类电气连接线路为表面线路，另一类电气连接线路为内埋线路；所述表面线路直接镀在基件本体的表面，内埋线路埋入基件本体内。
  2. 根据权利要求1所述的带有立体电路的基件，其特征在于：所述搭载电路中包含有电子元件，搭载电路中的各个电子元件都固定在表面线路上。
  3. 根据权利要求1所述的带有立体电路的基件，其特征在于：所述搭载电路中包含有电子元件，搭载电路中的各个电子元件按布设位置分为两类，其中的一类电子元件为表面元件，另一类电子元件为内埋元件；所述表面元件固定在表面线路上，内埋元件埋入基件本体内，并固定在内埋线路上。
  4. 根据权利要求1所述的带有立体电路的基件，其特征在于：所述基件本体的表面开设有线槽，所述表面线路沉入基件本体表面的线槽内。
  5. 根据权利要求1所述的带有立体电路的基件，其特征在于：所述基件本体的表面涂附有一层遮盖住表面线路的防水膜层。
  6. 根据权利要求1所述的带有立体电路的基件，其特征在于：所述基件本体是多面体，或是不规则几何体。
  7. 根据权利要求1所述的带有立体电路的基件，其特征在于：所述基件本体是具有曲面的几何体。
  8. 根据权利要求1所述的带有立体电路的基件，其特征在于：所述基件本体是实心几何体，或是空心几何体。
  9. 根据权利要求1所述的带有立体电路的基件的制备方法，其特征在于，具体步骤如下：
    S1：将搭载电路中的内埋线路预先分为N层，N大于等于1；
    S2：制作第1层基件坯体；
    S3：采用镭射光雕方式在第1层基件坯体的表面雕刻出第1层内埋线路的线 槽，再采用化学镀方式在第1层基件坯体表面的线槽内镀上第1层内埋线路，并在第1层内埋线路上的需要连接其它层内埋线路和/或表面线路的位置分别焊置引出线；
    S4：在第1层基件坯体的表面浇注热固性材料或热塑性材料，并使浇注的材料覆盖住第1层基件坯体上的内埋线路，并使第1层内埋线路的引出线外露，浇注在第1层基件坯体表面的材料冷却成型后，形成第2层基件坯体；
    S5：定义i＝2，如果i>N，则转至步骤S9；
    S6：采用镭射光雕方式在第i层基件坯体的表面雕刻出第i层内埋线路的线槽，再采用化学镀方式在第i层基件坯体表面的线槽内镀上第i层内埋线路，并将各层内埋线路的引出线中，需要连接第i层内埋线路的引出线分别焊接在第i层内埋线路的对应连接点上，并在第i层内埋线路上的需要连接其它层内埋线路和/或表面线路的位置分别焊置引出线；
    S7：在第i层基件坯体的表面浇注热固性材料或热塑性材料，并使浇注的材料覆盖住第i层基件坯体上的内埋线路，并使各层内埋线路上的引出线外露，浇注在第i层基件坯体表面的材料冷却成型后，形成第i+1层基件坯体；
    S8：如果i小于N，则令i＝i+1，并转至步骤S6，反之则转至步骤S9；
    S9：将N+1层基件坯体所形成的结合体定义为基件本体，采用镭射光雕方式在基件本体的表面雕刻出表面线路的线槽，再采用化学镀方式在基件本体表面的线槽内镀上表面线路，并将各层内埋线路的引出线中，需要连接表面线路的引出线分别焊接在表面线路的对应连接点上。
  10. 1根据权利要求9所述的带有立体电路的基件的制备方法，其特征在于：所述搭载电路中包含有电子元件，在步骤S9中，在基件本体表面的线槽内镀上表面线路后，再将搭载电路中的各个电子元件分别焊置在表面线路上。
  11. 根据权利要求3所述的带有立体电路的基件的制备方法，其特征在于，具体步骤如下：
    S1：将搭载电路中的内埋元件、内埋线路预先分为N层，N大于等于1；
    S2：制作第1层基件坯体；
    S3：采用镭射光雕方式在第1层基件坯体的表面雕刻出第1层内埋线路的线 槽，再采用化学镀方式在第1层基件坯体表面的线槽内镀上第1层内埋线路，然后再将第1层内埋元件分别焊置在第1层内埋线路上，并在第1层内埋线路上的需要连接其它层内埋线路和/或表面线路的位置分别焊置引出线；
    S4：在第1层基件坯体的表面浇注热固性材料或热塑性材料，并使浇注的材料覆盖住第1层基件坯体上的内埋元件、内埋线路，并使第1层内埋线路的引出线外露，浇注在第1层基件坯体表面的材料冷却成型后，形成第2层基件坯体；
    S5：定义i＝2，如果i>N，则转至步骤S9；
    S6：采用镭射光雕方式在第i层基件坯体的表面雕刻出第i层内埋线路的线槽，再采用化学镀方式在第i层基件坯体表面的线槽内镀上第i层内埋线路，然后再将第i层内埋元件分别焊置在第i层内埋线路上，并将各层内埋线路的引出线中，需要连接第i层内埋线路的引出线分别焊接在第i层内埋线路的对应连接点上，并在第i层内埋线路上的需要连接其它层内埋线路和/或表面线路的位置分别焊置引出线；
    S7：在第i层基件坯体的表面浇注热固性材料或热塑性材料，并使浇注的材料覆盖住第i层基件坯体上的内埋元件、内埋线路，并使各层内埋线路上的引出线外露，浇注在第i层基件坯体表面的材料冷却成型后，形成第i+1层基件坯体；
    S8：如果i小于N，则令i＝i+1，并转至步骤S6，反之则转至步骤S9；
    S9：将N+1层基件坯体所形成的结合体定义为基件本体，采用镭射光雕方式在基件本体的表面雕刻出表面线路的线槽，再采用化学镀方式在基件本体表面的线槽内镀上表面线路，然后再将表面元件分别焊置在表面线路上，并将各层内埋线路的引出线中，需要连接表面线路的引出线分别焊接在表面线路的对应连接点上。
  12. 根据权利要求9或11所述的带有立体电路的基件的制备方法，其特征在于：所述基件本体的第1层基件坯体采用热固性材料、热塑性材料或陶瓷制作。
  13. 根据权利要求9或11所述的带有立体电路的基件的制备方法，其特征在于：所述基件本体采用热固性材料和/或热塑性材料制作。
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