WO2020134879A1 - 摄像组件及电子设备 - Google Patents

摄像组件及电子设备 Download PDF

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Publication number
WO2020134879A1
WO2020134879A1 PCT/CN2019/122354 CN2019122354W WO2020134879A1 WO 2020134879 A1 WO2020134879 A1 WO 2020134879A1 CN 2019122354 W CN2019122354 W CN 2019122354W WO 2020134879 A1 WO2020134879 A1 WO 2020134879A1
Authority
WO
WIPO (PCT)
Prior art keywords
module
camera
transmitting
receiving module
circuit board
Prior art date
Application number
PCT/CN2019/122354
Other languages
English (en)
French (fr)
Inventor
唐玮
王娜
郦光丰
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to ES19903664T priority Critical patent/ES2944660T3/es
Priority to JP2021536810A priority patent/JP7169453B2/ja
Priority to AU2019413221A priority patent/AU2019413221B9/en
Priority to BR112021012344-0A priority patent/BR112021012344B1/pt
Priority to CN201980084673.0A priority patent/CN113647086A/zh
Priority to EP19903664.1A priority patent/EP3886422B1/en
Priority to KR1020217020696A priority patent/KR102519255B1/ko
Priority to US17/417,665 priority patent/US11489993B2/en
Publication of WO2020134879A1 publication Critical patent/WO2020134879A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/06—Systems determining position data of a target
    • G01S17/08—Systems determining position data of a target for measuring distance only
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/88—Lidar systems specially adapted for specific applications
    • G01S17/89—Lidar systems specially adapted for specific applications for mapping or imaging
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/38—Transmitter circuitry for the transmission of television signals according to analogue transmission standards
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly

Definitions

  • the present application relates to the technical field of electronic products, in particular to a camera component and an electronic device using the camera component.
  • the main component of the electronic device to realize the imaging function is the camera module.
  • the time of flight (TOF) module is a commonly used depth camera module that can be used to measure depth of field information.
  • the time-of-flight module includes a transmitting module and a receiving module. In order to ensure the detection performance of the time-of-flight module, it is generally required that the transmitting module and the receiving module are sufficiently close together so that the field of view of the transmitting module and the field of view of the receiving module have a high degree of coincidence.
  • the traditional time-of-flight module fixes its transmitting module and receiving module on the same printed circuit board to meet the need for the proximity of the transmitting module and the receiving module.
  • the position of the interaction hole of the transmitting module and the receiving module facing the cover plate of the electronic device applying the time-of-flight module is also It is fixed, so that the time-of-flight module can only be applied to electronic devices of a certain appearance form, and it is difficult to apply to electronic devices of other appearance forms, and has poor applicability.
  • the embodiments of the present application provide a camera component with better applicability and an electronic device using the camera component.
  • an embodiment of the present application provides a camera assembly, including a time-of-flight module and a circuit board.
  • the circuit board is provided with an escape space.
  • the time-of-flight module includes a transmitting module and a receiving module.
  • the transmitting module is used to emit a detection light signal.
  • the receiving module is used to receive the induced optical signal formed after the detected optical signal is reflected by the object to be measured.
  • the sensing light signal carries depth information of the object to be measured.
  • the receiving module may be a camera module.
  • the receiving module and the transmitting module are packaged independently of each other.
  • the receiving module is located in the avoidance space, and the connecting end of the receiving module is fixed to the circuit board.
  • the receiving module is electrically connected to the circuit board via its connection end.
  • the transmitting module is located around the receiving module and fixed to the circuit board.
  • the receiving module and the transmitting module are packaged independently of each other.
  • the receiving module has a receiving field of view receiving axis, and the receiving axis is a central axis of the receiving field of view.
  • the transmission module has a transmission field of view and a transmission axis, and the transmission axis is a central axis of the transmission field of view. Since the receiving module is located in the avoidance space, and the connecting end of the receiving module is fixed to the circuit board, the receiving module and the transmitting module can be close to each other, and the receiving axis and the transmitting axis The distance between them is sufficiently small, and the coverage of the receiving field of view and the transmitting field of view is high to meet the performance requirements of the time-of-flight module.
  • the arrangement of the transmitting module and the receiving module is more flexible and can form a variety of rows
  • the cloth structure enables the electronic device to which the camera module is applied to have various appearances.
  • the camera module can be applied to a variety of electronic devices with different appearances, and the camera module has strong applicability. Since a variety of electronic devices with different appearances can use the camera module in common, there is no need to repeatedly develop different time-of-flight modules due to different appearances, thereby reducing the development cost and manufacturing cost of electronic devices.
  • the avoidance space may be a through hole or a groove provided on the circuit board.
  • the receiving module is located in the avoidance space, so that the receiving module can reuse part or all of the thickness of the circuit board, so that the arrangement of the camera assembly is more compact, and the camera assembly is in the electronic device
  • the dimension in the thickness direction Z is smaller.
  • the camera assembly further includes one or more camera modules.
  • the camera module may be a color camera, a black-and-white camera, a wide-angle camera, or a zoom camera.
  • the one or more camera modules are located in the escape space, and the connection end of the one or more camera modules is fixed to the circuit board.
  • the one or more camera modules may cooperate with the time-of-flight module to improve the performance of the electronic device. For example, when the image captured by the time-of-flight module is combined with the image captured by a color camera, the three-dimensional contour of the object to be measured can be presented in a graphical manner in which different colors represent different distances. This embodiment is described by taking an example in which the camera component includes a camera module.
  • the camera assembly further includes a camera support located in the sheltered space.
  • the camera bracket has a plurality of accommodating grooves spaced apart from each other. The opening directions of the plurality of accommodating grooves are the same.
  • the receiving module and the one or more camera modules are partially received in the plurality of receiving slots in a one-to-one correspondence.
  • the receiving module and the one or more camera modules are spaced apart from each other to avoid collision and damage due to accidental impact.
  • the receiving module and the one or more camera modules are accommodated in the plurality of accommodating slots of the camera assembly to be fixed relative to the camera bracket.
  • the camera bracket is located in the avoidance space, so that the receiving module and the one or more camera modules are located in the avoidance space.
  • the receiving module, the one or more camera modules and the camera bracket can be modularized through a separate assembly process before participating in the overall assembly process of the camera assembly, thereby simplifying the overall assembly of the camera assembly Process steps reduce assembly difficulty.
  • the receiving module and the one or more camera modules can be bonded to the bottom walls of the plurality of receiving grooves by an adhesive member to be fixed relative to the camera bracket.
  • the camera support can be made of materials with high thermal conductivity, such as copper, aluminum foil, stainless steel and other metal materials.
  • the bonding member may be doped with thermally conductive particles (such as graphite particles or metal particles) or use thermally conductive adhesive materials.
  • the heat dissipated by the receiving module and the one or more camera modules can be conducted to the camera bracket via an adhesive member, and the camera bracket dissipates heat to ensure the camera assembly Work reliability.
  • the camera bracket also has multiple connection gaps.
  • the plurality of connection notches communicate the plurality of accommodating grooves to the outside of the camera bracket in a one-to-one correspondence.
  • the connection ends of the receiving module and the connection ends of the one or more camera modules extend out of the plurality of accommodating grooves through the plurality of connection gaps in one-to-one correspondence, so as to be fixed to the circuit board.
  • the camera assembly further includes a fixed bracket.
  • the circuit board is fixed to the fixing bracket.
  • the circuit board may be fixed to the fixing bracket by a fastener.
  • the fixing bracket includes a first surface and a second surface that are disposed opposite to each other.
  • the fixing bracket has a mounting boss and a mounting hole.
  • the mounting boss is convexly arranged on the first surface.
  • the mounting hole is recessed from a top end of the mounting boss away from the first surface toward a direction closer to the second surface.
  • the circuit board can resist the top surface of the mounting boss.
  • the circuit board is provided with a connection hole corresponding to the installation hole. The fastener passes through the connecting hole and extends into the mounting hole to lock the circuit board on the fixing bracket.
  • the fastener, the connection hole structure and the installation hole structure constitute a locking structure.
  • Multiple sets of locking structures can be formed between the circuit board and the fixed bracket. Multiple sets of locking structures can be dispersed in the peripheral area of the circuit board to more stably fix the circuit board to the fixing bracket.
  • the fixing bracket has a mounting groove.
  • the mounting groove is recessed from the first face toward the second face.
  • the camera bracket is fixed to the mounting groove.
  • the bottom surface of the camera bracket facing away from the accommodating groove can bear against the bottom wall of the mounting groove to achieve mutual positioning of the two.
  • a concave-convex matching structure may be provided between the bottom wall of the mounting groove and the bottom surface of the camera bracket.
  • a convex bump may be provided on the bottom wall of the mounting groove.
  • the bottom surface of the camera bracket may be provided with a concave groove.
  • the convex block extends into the groove to fix the camera bracket relative to the fixed bracket.
  • the bottom wall of the mounting groove is provided with a groove
  • the bottom surface of the camera bracket is provided with a protrusion, and the protrusion extends into the groove to fix the camera bracket relative to the fixed bracket.
  • the circuit board is fixed to the fixing bracket, and the camera bracket is also fixed to the fixing bracket, the circuit board and the camera bracket are positioned with each other by the fixing bracket , So that the receiving module mounted on the camera bracket and the transmitting module fixed on the circuit board are positioned relative to each other, and the relative position between the transmitting field of view and the receiving field of view is stable, thereby ensuring that The reliable operation of the time-of-flight module and the performance of the camera assembly are better.
  • the camera assembly further includes a decorative piece.
  • the decoration piece is located on a side of the receiving module that receives the induced light signal.
  • the decorative piece includes a decorative ring and a protective plate.
  • the decorative ring has a top surface and a bottom surface that are opposite to each other.
  • a concave limiting groove is provided on the top surface of the decorative ring.
  • the protection plate is installed in the limiting groove and resists the bottom wall of the limiting groove.
  • the decoration piece is provided with a plurality of installation spaces. The plurality of installation spaces are provided in the decorative ring. The installation space communicates the limiting groove to the bottom surface of the decorative ring.
  • the receiving module and the one or more camera modules are partially accommodated in the plurality of installation spaces.
  • the receiving module and the one or more camera modules are partially accommodated in different installation spaces in a one-to-one correspondence.
  • the transmitting module is located around the decoration. In short, the receiving module and the one or more camera modules are located inside the decoration, surrounded by the decoration, and the transmitting module is located outside the decoration.
  • the transmitting module and the receiving module can be packaged separately from each other, the positional relationship between the two can be flexibly arranged, so the decoration piece can be used to decorate the receiving module and the one Or multiple camera modules without surrounding the transmitting module, so the arrangement of the decoration, the receiving module, the one or more camera modules and the transmitting module is more diversification.
  • the decorative part Since the decorative part is partially exposed outside the electronic device, the appearance of the receiving module decorated by the decorative part and the one or more camera modules are similar or even the same. Therefore, the decorative part, the The receiving module and the one or more camera modules can be distributed substantially symmetrically in the appearance of the electronic device, so that the appearance of the electronic device is highly coordinated and more beautiful.
  • the decorative part can also avoid problems such as a decrease in structural strength and easy deformation due to too much volume due to too many surrounding devices.
  • the receiving module and the one or more camera modules are arranged in a first direction
  • the receiving module and the transmitting module are arranged in a second direction
  • the first The second direction is the same as the first direction, or the second direction is perpendicular to the first direction.
  • the first direction and the second direction are both the width direction of the electronic device or the length direction of the electronic device.
  • one of the first direction and the second direction is the width direction of the electronic device, and the other is the length direction of the electronic device.
  • the receiving module, the one or more camera modules, and the transmitting module have a variety of arrangements, which enables the electronic device to be designed in a variety of appearances and has a high degree of flexibility .
  • the extending direction of the connection end of the receiving module (that is, the outlet direction of the receiving module) can be flexibly set according to the position of the transmitting module and the position of components on the circuit board.
  • the extending direction of the connecting end of the receiving module may be perpendicular to the second direction.
  • the connection end of the receiving module and the transmitting module are fixed on the same surface of the circuit board.
  • the extending direction of the connecting end of the receiving module may be the same as the second direction.
  • the connection end of the receiving module and the transmitting module may be fixed on two opposite surfaces of the circuit board.
  • the extending direction of the connecting end of the one or more camera modules may be the same as or different from the extending direction of the connecting end of the receiving module, which is not strictly limited in this application.
  • the distance between the receiving axis of the receiving module and the transmitting axis of the transmitting module is in the range of 0.5 mm to 30 mm.
  • the receiving axis and the transmitting axis are as close as possible to ensure a high coverage of the transmitting field of view and the receiving field of view, so that the working performance of the time-of-flight module is better.
  • the time-of-flight module further includes a driver chip.
  • the driving chip is fixed on a side of the circuit board facing away from the transmitting module.
  • the projection of the driving chip on the circuit board and the projection of the transmitting module on the circuit board partially overlap or overlap completely. Wherein, the projection of the driving chip on the circuit board and the projection of the transmitting module on the circuit board all overlap, which means that one of them completely falls within the range of the other.
  • the driving chip and the transmitting module on the circuit board are substantially in phase It is fixed on the opposite sides of the circuit board, so that the wiring between the driving chip and the transmitting module is short and the parasitic inductance is small, so that the detection optical signal emitted by the transmitting module can be guaranteed
  • the quality of the pulse waveform is better to improve the signal-to-noise ratio.
  • the time-of-flight module also includes multiple matching electronic components.
  • the plurality of matching electronic components include but are not limited to capacitors, inductors, resistors and the like.
  • the plurality of matching electronic components can reduce the parasitic inductance between the driving chip and the transmitting module to ensure the waveform integrity of the detection optical signal sent by the transmitting module.
  • the plurality of matching electronic components are fixed on a side of the circuit board facing away from the transmitting module.
  • the plurality of matching electronic components are arranged around the driving chip.
  • the projections of the plurality of matching electronic components on the circuit board may partially overlap or completely overlap the projections of the transmitting module on the circuit board.
  • the transmitting module includes a base, an emitter, and a diffusion plate.
  • the base has top and bottom surfaces disposed opposite to each other. The bottom surface of the base faces the circuit board.
  • the base forms a launch cavity.
  • the launch cavity is located inside the base.
  • the base also has a positioning groove.
  • the positioning groove is recessed from the top surface of the base toward the bottom surface of the base. The positioning groove communicates with the launch cavity.
  • the transmitter is used to emit the detection light signal.
  • the launcher is received in the launch cavity and fixed to the base.
  • the emitter may be a vertical cavity surface emitting laser. At this time, there is no need to add a collimating mirror inside the transmitting module, so that the cost of the transmitting module is lower and the manufacturing technology is less difficult.
  • the diffusion plate is fixed to the base and covers the emission cavity. The diffusion plate is located in the positioning groove. The diffusion plate is used to increase the angle of view of the detection light signal.
  • the field of view of the transmitter's field of view may be in the range of 15° to 25°.
  • the field angle of the transmitter's field of view may be designed to be 21° ⁇ 3°.
  • the transmitting module may expand the field of view of the transmitting field of view of the transmitter through a diffusion plate, so that the transmitting field of view of the transmitting module has a larger field of view. That is, the diffusion plate can diffuse the laser beam of a small angle to the angle of view required by the time-of-flight module.
  • the transmitting module Since the transmitting module has a large angle of view, it can be avoided that the distance between the transmitting axis of the transmitting module and the receiving axis of the receiving module is far, resulting in the transmitting field of view and the receiving field of view
  • the problem of reduced coverage rate makes the distance between the transmitting axis of the transmitting module and the receiving axis of the receiving module larger than the traditional time-of-flight module, further increasing the flexibility of the arrangement of the transmitting module and the receiving module Sex.
  • the base is made of aluminum nitride ceramic material. Because the thermal conductivity of aluminum nitride ceramic material is better than other ceramic materials, the coefficient of thermal expansion (CTE) is smaller than that of the transmitter, so it can still maintain The transmitter has a good matching degree and strength to ensure the working reliability of the flight time module.
  • CTE coefficient of thermal expansion
  • the transmitting module further includes a connecting glue.
  • the connecting glue is connected between the base and the diffusion plate.
  • the connecting glue is provided with one or more air escape holes.
  • the one or more air escape holes communicate the launch cavity to the outside of the launch module. Since the launch module needs to withstand a high temperature baking of about 260°C when soldered to the circuit board, the one or more escape holes can enable the gas in the launch cavity to expand to the outside of the launch module In order to prevent the gas in the launch cavity from pushing up the diffusion plate during the welding process and damaging the structure of the launch module.
  • an embodiment of the present application provides an electronic device, including a controller and the above camera component.
  • the controller is electrically connected to the circuit board.
  • the receiving module, the transmitting module, and the controller are all electrically connected to the circuit board, so that signal transmission can be realized through the circuits on the circuit board.
  • the controller may obtain the time difference between the object to be measured and the time-of-flight module by calculating the time difference or phase difference between the detection light signal emitted by the time-of-flight module and the reception of the induced light signal. distance.
  • the time-of-flight module can be used in environments such as ranging, face recognition, avatar unlocking, gesture recognition, object modeling, 3D games, and smart home.
  • FIG. 1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application in the first embodiment
  • FIG. 2 is a schematic diagram of the positional relationship between the camera component and the frame of the electronic device shown in FIG. 1 in an embodiment
  • FIG. 3 is a schematic diagram of the positional relationship between the camera assembly and the frame of the electronic device shown in FIG. 1 in another embodiment
  • FIG. 4 is a schematic diagram of the positional relationship between the camera assembly and the frame of the electronic device shown in FIG. 1 in still another embodiment
  • FIG. 5 is a schematic diagram of the positional relationship between the camera assembly and the frame of the electronic device shown in FIG. 1 in still another embodiment
  • FIG. 6 is a schematic structural diagram of an electronic device provided in an embodiment of the present application in a second embodiment
  • FIG. 7 is a schematic structural diagram of a camera module and a frame of the electronic device shown in FIG. 6 in an embodiment
  • FIG. 8 is a cross-sectional view of a part of the structure of the electronic device shown in FIG. 6 taken along line A-A in an embodiment
  • FIG. 9 is a partially exploded schematic view of the structure shown in Figure 8.
  • FIG. 10 is an exploded schematic view of the partial structure of the camera assembly of the electronic device shown in FIG.
  • FIG. 11 is a rear view of the electronic device shown in FIG. 6 in an embodiment
  • FIG. 12 is a rear view of the electronic device shown in FIG. 6 in another embodiment
  • FIG. 13 is a rear view of the electronic device shown in FIG. 6 in still another embodiment
  • FIG. 14 is a rear view of the electronic device shown in FIG. 6 in still another embodiment
  • FIG. 15 is a partial exploded schematic view of the transmitting module in the structure shown in FIG. 8;
  • FIG. 16 is a bottom view of the transmitting module shown in FIG. 10;
  • FIG. 17 is a top view of the transmitting module shown in FIG.
  • FIG. 1 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present application in the first embodiment.
  • the electronic device 100 involved in the present application may be a mobile phone, a tablet computer, an e-reader, a notebook computer, an in-vehicle device, or a wearable device.
  • the electronic device 100 is a mobile phone as an example. It is defined that the width direction of the electronic device 100 is X, the length direction of the electronic device 100 is Y, the thickness direction of the electronic device 100 is Z, and the width direction X, the length direction Y, and the thickness direction Z are perpendicular to each other.
  • the electronic device 100 includes a housing 10 and a display screen 20.
  • the housing 10 may include a back cover 101 and a frame 102.
  • the frame 102 is connected to the periphery of the back cover 101.
  • the frame 102 can be integrally formed with the rear cover 101 or can be assembled to form an integrated structure.
  • the display screen 20 is installed on a side of the frame 102 facing away from the rear cover 101.
  • the display screen 20 integrates display and touch functions.
  • the display screen 20 includes a display panel and a front cover covering the display panel.
  • the display panel may be a liquid crystal display panel (Liquid Crystal Display, LCD), an organic light-emitting diode (OLED) display panel or a micro light-emitting diode (micro LED) display panel.
  • the front cover may be a cover glass (CG).
  • the electronic device 100 further includes a controller 30 and a camera component 40.
  • the controller 30 is housed inside the casing 10.
  • the camera assembly 40 is mounted on the casing 10.
  • the camera assembly 40 is all contained in the housing 10 or most of it is contained in the housing 10.
  • the camera component 40 is used to collect images to form corresponding image signals.
  • the controller 30 is electrically connected to the camera assembly 40, and the controller 30 is used to process the image signal of the camera assembly 40.
  • the controller 30 may be a main chip on the motherboard of the electronic device 100.
  • the front cover plate faces the front of the electronic device 100
  • the rear cover 101 faces the rear of the electronic device 100.
  • the camera component 40 can capture the image behind the electronic device 100. In other embodiments, the camera component 40 can collect images in front of the electronic device 100.
  • FIG. 2 is a schematic diagram of the positional relationship between the camera assembly 40 and the frame 102 of the electronic device 100 shown in FIG. 1 in one embodiment
  • FIG. 3 is the camera of the electronic device 100 shown in FIG. 1
  • FIG. 4 is a schematic diagram of the positional relationship between the component 40 and the frame 102 in another embodiment
  • FIG. 4 is a schematic diagram of the positional relationship between the camera component 40 and the frame 102 of the electronic device 100 shown in FIG. 1 in another embodiment
  • FIG. 5 is a diagram 1 is a schematic diagram of the positional relationship between the camera assembly 40 and the frame 102 of the electronic device 100 in yet another embodiment.
  • the camera assembly 40 includes a time of flight (TOF) module 1 and a circuit board 2.
  • the circuit board 2 is provided with an escape space 21.
  • the circuit board 2 may be the main board of the electronic device 100 or a part of the main board of the electronic device 100.
  • the circuit board 2 may be a rigid printed circuit board or a combination of soft and hard printed circuit boards.
  • the time-of-flight module 1 includes a transmitting module 11 and a receiving module 12.
  • the transmitting module 11 is used to emit a detection light signal.
  • the detection light signal may be infrared light.
  • the receiving module 12 is configured to receive the induced optical signal formed after the detected optical signal is reflected by the object to be measured.
  • the sensing light signal carries depth information of the object to be measured.
  • the receiving module 12 may be a camera module.
  • the receiving module 12 and the transmitting module 11 are packaged independently from each other.
  • the receiving module 12 is located in the escape space 21, and the connecting end 121 of the receiving module 12 is fixed to the circuit board 2.
  • the receiving module 12 is electrically connected to the circuit board 2 via its connecting end 121.
  • the transmitting module 11 is located around the receiving module 12 and is fixed to the circuit board 2.
  • the receiving module 12, the transmitting module 11 and the controller 30 are all electrically connected to the circuit board 2, so that signal transmission can be realized through the circuits on the circuit board 2.
  • the controller 30 may obtain the object to be measured and the time-of-flight module 1 by calculating the time difference or phase difference between the detection light signal transmitted by the time-of-flight module 1 and the reception of the induced light signal. the distance between.
  • a digital signal processing (DSP) module in the controller 30 can process the data output by the time-of-flight module 1, so as to output a depth map that is ultimately needed.
  • the time-of-flight module 1 can be applied to environments such as ranging, face recognition, avatar unlocking, gesture recognition, object modeling, 3D games, and smart home.
  • the receiving module 12 and the transmitting module 11 are packaged independently of each other.
  • the receiving module 12 has a receiving field of view (not shown in the figure) and a receiving axis 122, and the receiving axis 122 is a central axis of the receiving field of view.
  • the transmission module 11 has a transmission field of view (not shown in the figure) and a transmission axis 111, and the transmission axis 111 is a central axis of the transmission field of view.
  • the distance between the receiving axis 122 of the receiving module 12 and the transmitting axis 111 of the transmitting module 11 is in the range of 0.5 millimeters (mm) to 30 millimeters.
  • the receiving axis 122 and the transmitting axis 111 are as close as possible to ensure a high coverage of the transmitting field of view and the receiving field of view, so that the working performance of the time-of-flight module 1 is better.
  • the receiving module 12 since the receiving module 12 is located in the avoidance space 21, and the connecting end 121 of the receiving module 12 is fixed to the circuit board 2, the receiving module 12 and the transmitting module 11 can be approached With respect to each other, the distance between the receiving axis 122 and the transmitting axis 111 is sufficiently small to meet the performance requirements of the time-of-flight module 1.
  • the receiving module 12 and the transmitting module 11 are separately packaged, and there is no direct installation or direct connection between them, the arrangement of the transmitting module 11 and the receiving module 12 is more flexible and can be Form a variety of arrangements, for example:
  • the transmitting axis 111 of the transmitting module 11 and the receiving axis 122 of the receiving module 12 are arranged in the width direction X of the electronic device 100.
  • the transmitting module 11 is located on the right side of the receiving module 12.
  • the transmitting axis 111 of the transmitting module 11 and the receiving axis 122 of the receiving module 12 are arranged in the width direction X of the electronic device 100.
  • the transmitting module 11 is located on the left side of the receiving module 12.
  • the transmitting axis 111 of the transmitting module 11 and the receiving axis 122 of the receiving module 12 are arranged in the length direction Y of the electronic device 100.
  • the transmitting module 11 is located on the top side of the receiving module 12.
  • the transmitting axis 111 of the transmitting module 11 and the receiving axis 122 of the receiving module 12 are arranged in the length direction Y of the electronic device 100.
  • the transmitting module 11 is located on the bottom side of the receiving module 12.
  • the rear cover 101 has a transmitting area 1011 corresponding to the transmitting module 11 and a receiving area 1012 corresponding to the receiving module 12. Since the transmitting module 11 and the receiving module 12 have multiple arrangements, the transmitting area 1011 and the receiving area 1012 have multiple arrangements corresponding to each other, so that the electronics using the camera assembly 40
  • the device 100 can have various appearances (also known as Industrial Design, ID) forms.
  • the camera module 40 can be applied to a variety of electronic devices with different appearances, and the camera module 40 has strong applicability.
  • the camera assembly 40 can be shared by a variety of electronic devices with different appearances, there is no need to repeatedly develop different time-of-flight modules 1 due to different appearances, thereby reducing the development cost and manufacturing cost of the electronic device.
  • the structured light module includes a transmitting end and a receiving end. According to the detection principle of the structured light module, the center distance between the transmitting end and the receiving end should be at least greater than 25 mm to ensure the structured light module to work normally. Because the detection accuracy of the structured light module's distance mainly depends on the brightness of the light spot, its depth ranging accuracy is relatively high at close range. For example, the accuracy can reach less than 1% when it is about 40 cm away from the object. The accuracy will be greatly reduced, so the structured light module can only be used to detect the object to be measured closer to the front of the electronic device (such as the user's face), and the depth measurement will not exceed 1 meter.
  • the range of the detection distance of the time-of-flight module 1 is much larger than the detection distance of the structured light module.
  • the time-of-flight module 1 can be used to detect the object to be measured at a short distance, and can also be used to detect The object to be measured far away.
  • the time-of-flight module 1 is used to detect a short-distance object or a long-distance object to be measured behind the electronic device 100.
  • the electronic device 100 may have a structured light module at the same time, which is used to detect a short-distance object to be measured in front of the electronic device 100.
  • the time-of-flight module 1 is used to detect the distance to the object to be measured or the object to be measured at a distance in front of the electronic device 100. Then, the electronic device 100 is no longer provided with a structured light module.
  • the escape space 21 may be a through hole or a groove provided on the circuit board 2.
  • the receiving module 12 is located in the avoidance space 21, so that the receiving module 12 can reuse part or all of the thickness space of the circuit board 2, so that the arrangement of the camera assembly 40 is more compact, and the camera assembly The size of 40 in the thickness direction Z of the electronic device 100 is smaller.
  • FIG. 6 is a schematic structural diagram of an electronic device 100 provided in an embodiment of the present application in a second embodiment.
  • FIG. 7 is a camera of the electronic device 100 shown in FIG. 6 in an implementation manner. Schematic diagram of the module 3 and the frame 102. Among them, some technical contents in this embodiment that are the same as those in the first embodiment will not be described in detail. The specific detailed structure of the camera assembly 40 described in this application is mainly explained by the second embodiment. The technical solutions and related technical features in the second embodiment can be combined with the first embodiment without conflict.
  • the camera assembly 40 further includes one or more camera modules 3.
  • the camera module 3 may be a color camera (also called an RGB camera), a black-and-white camera, a wide-angle camera, or a zoom camera.
  • the one or more camera modules 3 are located in the escape space 21, and the connection end 31 of the one or more camera modules 3 is fixed to the circuit board 2.
  • the one or more camera modules 3 can cooperate with the time-of-flight module 1. For example, when the image captured by the time-of-flight module 1 is combined with the image captured by a color camera, the three-dimensional contour of the object to be measured can be presented in a graphical manner in which different colors represent different distances.
  • the camera assembly 40 includes a camera module 3 as an example for illustration.
  • the one or more camera modules 3 may be placed side by side with the receiving module 12.
  • the receiving module 12 and the one or more camera modules 3 are arranged in a first direction.
  • the receiving module 12 and the transmitting module 11 are arranged in the second direction.
  • the second direction is the same as the first direction.
  • the first direction and the second direction are both the width direction X of the electronic device 100 or the length direction Y of the electronic device 100.
  • the first direction is the width direction X of the electronic device 100
  • the second direction is also the width direction X of the electronic device 100.
  • the second direction may be perpendicular to the first direction.
  • one of the first direction and the second direction is the width direction X of the electronic device 100, and the other is the length direction Y of the electronic device 100.
  • the one or more camera modules 3 and the receiving modules 12 may also have other arrangements, such as matrix arrangement, triangle arrangement, four-corner arrangement, or circular arrangement.
  • the extending direction of the connection end 121 of the receiving module 12 may be based on the transmitting module 11 And the position of the components on the circuit board 2 are flexibly set.
  • the extending direction of the connecting end 121 of the receiving module 12 may be perpendicular to the second direction.
  • the connection end 121 of the receiving module 12 and the transmitting module 11 are fixed on the same surface of the circuit board 2.
  • the extending direction of the connecting end 121 of the receiving module 12 may be the same as the second direction.
  • connection end 121 of the receiving module 12 and the transmitting module 11 may be fixed on two opposite surfaces of the circuit board 2.
  • the extension direction of the connection end of the one or more camera modules 3 may be the same as or different from the extension direction of the connection end 121 of the receiving module 12, which is not strictly limited in this application.
  • the rear cover 101 further has an acquisition area 1013 corresponding to the one or more camera modules 3.
  • the receiving module 12 and the transmitting module 11 are separately packaged, the receiving module 12, the transmitting module 11, and the camera module 3 have various arrangements, and the rear The emitting area 1011, the receiving area 1012, and the collecting area 1013 on the cover 101 also have corresponding arrangements, so that the electronic device 100 to which the camera assembly 40 is applied can have various appearances.
  • the camera module 40 can be applied to a variety of electronic devices with different appearances, and the camera module 40 has strong applicability.
  • FIG. 8 is a cross-sectional view of a part of the structure of the electronic device 100 shown in FIG. 6 taken along line AA in an embodiment
  • FIG. 9 is a partially exploded schematic view of the structure shown in FIG. 8.
  • FIG. 10 is an exploded schematic view of a partial structure of the camera assembly 40 of the electronic device 100 shown in FIG. 6.
  • the embodiment shown in FIG. 8 corresponds to the embodiment shown in FIG. 7.
  • the camera assembly 40 further includes a camera support 4 located in the escape space 21.
  • the camera bracket 4 has a plurality of accommodating grooves 41 spaced apart from each other. The opening directions of the plurality of accommodating grooves 41 are the same.
  • the receiving module 12 and the one or more camera modules 3 are partially accommodated in the plurality of accommodating slots 41 in a one-to-one correspondence.
  • the receiving module 12 and the one or more camera modules 3 are spaced apart from each other to avoid collision and damage due to accidental impact.
  • the receiving module 12 and the one or more camera modules 3 are accommodated in the plurality of accommodating grooves 41 of the camera assembly 40 to be fixed relative to the camera bracket 4.
  • the camera bracket 4 is located in the escape space 21, so that the receiving module 12 and the one or more camera modules 3 are located in the escape space 21.
  • the receiving module 12, the one or more camera modules 3 and the camera bracket 4 can be modularized through a separate assembly process before participating in the overall assembly process of the camera assembly 40, thereby simplifying the camera The overall assembly process steps of the assembly 40 reduce assembly difficulty.
  • the receiving module 12 and the one or more camera modules 3 can be bonded to the bottom walls 411 of the plurality of receiving slots 41 by an adhesive member to be fixed relative to the camera bracket 4.
  • the camera support 4 can be made of materials with high thermal conductivity, such as copper, aluminum foil, stainless steel and other metal materials.
  • the bonding member may be doped with thermally conductive particles (such as graphite particles or metal particles) or use thermally conductive adhesive materials.
  • the heat dissipated by the receiving module 12 and the one or more camera modules 3 can be conducted to the camera bracket 4 via the adhesive, and the camera bracket 4 can dissipate heat to ensure that The working reliability of the camera assembly 40.
  • the camera bracket 4 also has a plurality of connection gaps 42.
  • the plurality of connection notches 42 communicate the plurality of accommodating grooves 41 to the outside of the camera bracket 4 in one-to-one correspondence.
  • the connection end 121 of the receiving module 12 and the connection end 31 of the one or more camera modules 3 extend out of the plurality of accommodating grooves 41 through the plurality of connection gaps 42 one by one, so as to be fixed to The circuit board 2.
  • the camera assembly 40 further includes a fixing bracket 5.
  • the fixing bracket 5 may be used as a middle plate of the electronic device 100 or a part of the middle plate of the electronic device 100.
  • the fixing bracket 5 is fixed relative to the frame 102 of the electronic device 100 (see FIG. 6 ).
  • the fixing bracket 5 may be integrally formed with the frame 102, or may be formed into an integrated structure with the frame 102 by assembling.
  • the circuit board 2 is fixed to the fixing bracket 5.
  • the circuit board 2 may be fixed to the fixing bracket 5 by fasteners 6.
  • the fixing bracket 5 includes a first surface 51 and a second surface 52 that are opposite to each other.
  • the fixing bracket 5 has a mounting boss 53 and a mounting hole 54.
  • the mounting boss 53 protrudes from the first surface 51.
  • the mounting hole 54 is recessed toward the second surface 52 from the top surface 531 of the first surface 51 away from the mounting boss 53.
  • the circuit board 2 can resist the top surface 531 of the mounting boss 53.
  • the circuit board 2 is provided with a connection hole 22 corresponding to the mounting hole 54.
  • the fastener 6 passes through the connecting hole 22 and extends into the mounting hole 54 to lock the circuit board 2 on the fixing bracket 5.
  • the fastener 6, the connection hole 22 structure and the installation hole 54 structure form a locking structure.
  • Multiple sets of locking structures can be formed between the circuit board 2 and the fixing bracket 5. Multiple sets of locking structures can be dispersed in the peripheral area of the circuit board 2 to fix the circuit board 2 to the fixing bracket 5 more stably.
  • the fixing bracket 5 has a mounting groove 55.
  • the mounting groove 55 is recessed from the first surface 51 toward the second surface 52.
  • the camera bracket 4 is fixed to the mounting groove 55.
  • the bottom surface 43 of the camera bracket 4 facing away from the accommodating groove 41 can bear against the bottom wall 551 of the mounting groove 55 to achieve mutual positioning of the two.
  • a concave-convex matching structure may be provided between the bottom wall 551 of the mounting groove 55 and the bottom surface 43 of the camera bracket 4.
  • the bottom wall 551 of the mounting groove 55 may be provided with a convex bump 56.
  • the bottom surface 43 of the camera bracket 4 may be provided with a concave groove 44.
  • the projection 56 extends into the groove 44 to fix the camera bracket 4 relative to the fixing bracket 5.
  • the bottom wall 551 of the mounting groove 55 is provided with a groove
  • the bottom surface 43 of the camera support 4 is provided with a protrusion
  • the protrusion extends into the groove to fix the camera support 4 relative to the The bracket 5 is fixed.
  • the circuit board 2 is fixed to the fixed bracket 5 and the camera bracket 4 is also fixed to the fixed bracket 5
  • the circuit board 2 and the camera bracket 4 pass through
  • the fixing bracket 5 realizes the positioning of each other, so that the receiving module 12 installed on the camera bracket 4 and the transmitting module 11 fixed on the circuit board 2 realize the positioning of each other, the transmitting field of view and the receiving view
  • the relative position between the fields is stable, so that the reliable operation of the time-of-flight module 1 can be ensured, and the performance of the camera assembly 40 is better.
  • the camera assembly 40 further includes a decoration 7.
  • the decoration member 7 is installed on the rear cover 101 (see FIG. 7 ).
  • the decoration 7 is located on the side of the receiving module 12 that receives the induced light signal.
  • the decorative member 7 includes a decorative ring 71 and a protective plate 72.
  • the decorative ring 71 has a top surface 711 and a bottom surface 712 which are opposite to each other.
  • the top surface 711 of the decorative ring 71 is provided with a concave limiting groove 713.
  • the protection plate 72 is installed in the limiting groove 713 and resists the bottom wall 7131 of the limiting groove 713.
  • the decoration member 7 is provided with a plurality of installation spaces 714.
  • the plurality of installation spaces 714 are provided in the decorative ring 71.
  • the installation space 714 communicates the limiting groove 713 to the bottom surface 712 of the decorative ring 71.
  • the protection plate 72 may have a plurality of light-transmitting regions 721 spaced apart from each other and a light-shielding region 722 disposed around the plurality of light-transmitting regions 721.
  • the plurality of light-transmitting areas 721 correspond to the plurality of installation spaces 714 in one-to-one correspondence.
  • the protection plate 72 is an integrated composite plate, and includes a light-transmitting plate body forming the plurality of light-transmitting areas 721 and a light-shielding plate body forming the light-shielding area 722.
  • the protection plate 72 includes a glass substrate and a light-shielding coating on the bottom wall 7131 of the glass substrate facing the limiting groove 713.
  • the light-shielding coating is partially hollowed out in the plurality of light-transmitting regions 721.
  • the protective plate 72 is made of light-transmitting material as a whole.
  • the bottom wall 7131 of the limiting groove 713 is provided with a plurality of notches communicating with the installation space 714, the plurality of notches corresponding to the light-transmitting area 721.
  • the non-notched area of the bottom wall 7131 of the limiting groove 713 is made of a light-shielding material or a light-shielding layer is attached to correspond to the light-shielding area 722.
  • the receiving module 12 and the one or more camera modules 3 are partially accommodated in the plurality of installation spaces 714.
  • the receiving module 12 and the one or more camera modules 3 are partially accommodated in different installation spaces 714 in a one-to-one correspondence.
  • the receiving module 12 and the one or more camera modules 3 collect light through the corresponding light-transmitting area 721.
  • the transmitting module 11 is located around the decoration 7. In short, the receiving module 12 and the one or more camera modules 3 are located inside the decoration 7, surrounded by the decoration 7, and the transmitting module 11 is located outside the decoration 7.
  • the receiving area 1012 and the collecting area 1013 of the rear cover 101 may be merged into one area 1014, and the area 1014 may be a through hole (hereinafter referred to as reference numeral 1014).
  • the decoration 7 is installed in the through hole 1014.
  • the decorative ring 71 includes a main body 715 and a limiting portion 716.
  • the plurality of installation spaces 714 are provided in the main body 715.
  • the limiting portion 716 is connected to the periphery of the main body 715.
  • the decoration 7 is installed on the rear cover 101.
  • the limiting portion 716 is located on the side of the rear cover 101 facing the circuit board 2.
  • the body portion 715 is located in the through hole 1014 and the body portion 715 protrudes from the outer surface 1015 of the circuit board 2 relative to the rear cover 101.
  • the decoration member 7 can reuse the space of the back cover 101 in the thickness direction Z of the electronic device 100, and the receiving module 12 and the one or more camera modules 3 can also be reused
  • the space of the back cover 101 in the thickness direction Z of the electronic device 100 is beneficial to reduce the size of the electronic device 100 in the thickness direction Z, so that the thickness of the electronic device 100 is thinner.
  • the transmitting module 11 and the receiving module 12 can be separately packaged with each other, the positional relationship between the two can be flexibly arranged, so the decoration 7 can be used to decorate the receiving module 12 And the one or more camera modules 3, instead of surrounding the transmitting module 11, so the decoration 7, the receiving module 12, the one or more camera modules 3 and all
  • the arrangement of the transmitting modules 11 is more diversified.
  • FIG. 11 is a rear view of the electronic device 100 shown in FIG. 6 in one embodiment
  • FIG. 12 is a rear view of the electronic device 100 shown in FIG. 6 in another embodiment
  • 13 is a rear view of the electronic device 100 shown in FIG. 6 in yet another embodiment
  • FIG. 14 is a rear view of the electronic device 100 shown in FIG. 6 in yet another embodiment.
  • the decorative member 7 extends in the width direction X of the electronic device 100. That is to say, the through holes 1014 and the decorative pieces 7 are arranged horizontally.
  • the plurality of light-transmitting regions 721 of the protection plate 72 are arranged in the width direction X of the electronic device 100.
  • the one or more camera modules 3 and the receiving module 12 are arranged in the width direction X of the electronic device 100.
  • the receiving module 12 is located on the right side of the one or more camera modules 3.
  • the emitting area 1011 is located on the right side of the decoration 7 and in the arrangement direction of the plurality of light-transmitting areas 721.
  • the position of the transmitting module 11 corresponds to the transmitting area 1011.
  • the transmitting module 11 is located on the right side of the receiving module 12 and in the arrangement direction of the receiving module 12 and the one or more camera modules 3.
  • the emitting area (shown by the dot-and-dash line) may also be arranged on the top side or the bottom side of the decoration member 7.
  • the emitting area and the light transmitting area 721 opposite to the receiving module 12 are arranged in the length direction Y of the electronic device 100.
  • the relative positions of the transmitting module 11, the receiving module 12, and the one or more camera modules 3 are defined as the central axis aligned with the field of view (eg, receiving axis or transmitting axis) The relative position is limited.
  • the emitting area 1011 of the back cover 101 can be formed in various ways.
  • the back cover 101 includes a glass substrate and a light-shielding coating on the side of the glass substrate facing the circuit board 2. At least part of the area of the light-shielding coating layer allows invisible light to pass through to form the emission area 1011.
  • the shading coating may use a material that blocks visible light and allows invisible light to pass through.
  • the light-shielding coating may also use a material that blocks invisible light, and the emission region 1011 is formed by thinning a part of the coating.
  • the light-shielding coating may also use a composite coating, for example, a material that allows invisible light to pass through is used to form the emission area 1011, and other materials are used to form other areas.
  • the back cover 101 may be made of a metal material, a through hole is formed in the emitting area 1011, and a light-transmitting plate is provided in the through hole to allow invisible light to pass through.
  • the decoration 7 extends in the width direction X of the electronic device 100. That is to say, the through holes 1014 and the decorative pieces 7 are arranged horizontally.
  • the plurality of light-transmitting regions 721 of the protection plate 72 are arranged in the width direction X of the electronic device 100.
  • the one or more camera modules 3 and the receiving module 12 are arranged in the width direction X of the electronic device 100.
  • the receiving module 12 is located on the left side of the one or more camera modules 3.
  • the emitting area 1011 is located on the left side of the decoration 7 and in the arrangement direction of the plurality of light-transmitting areas 721.
  • the position of the transmitting module 11 corresponds to the transmitting area 1011.
  • the transmitting module 11 is located on the left side of the receiving module 12 and in the direction of arrangement of the receiving module 12 and the one or more camera modules 3.
  • the emitting area (shown by the dot-and-dash line) may also be arranged on the top side or the bottom side of the decoration member 7.
  • the emitting area and the light transmitting area 721 opposite to the receiving module 12 are arranged in the length direction Y of the electronic device 100.
  • the decorative member 7 extends in the longitudinal direction Y of the electronic device 100. That is, the through holes 1014 and the decorative pieces 7 are arranged longitudinally.
  • the plurality of light-transmitting regions 721 of the protection plate 72 are arranged in the longitudinal direction Y of the electronic device 100.
  • the one or more camera modules 3 and the receiving module 12 are arranged in the longitudinal direction Y of the electronic device 100.
  • the receiving module 12 is located on the bottom side of the one or more camera modules 3.
  • the emitting area 1011 is located on the bottom side of the decoration member 7 and in the arrangement direction of the plurality of light-transmitting areas 721.
  • the position of the transmitting module 11 corresponds to the transmitting area 1011.
  • the transmitting module 11 is located on the bottom side of the receiving module 12 and in the direction of arrangement of the receiving module 12 and the one or more camera modules 3.
  • the emitting area (shown as a dot-and-dash line) may also be arranged on the left side or the right side of the decorative member 7.
  • the emitting area and the light transmitting area 721 opposite to the receiving module 12 are arranged in the width direction X of the electronic device 100.
  • the decorative member 7 extends in the longitudinal direction Y of the electronic device 100. That is, the through holes 1014 and the decorative pieces 7 are arranged longitudinally.
  • the plurality of light-transmitting regions 721 of the protection plate 72 are arranged in the longitudinal direction Y of the electronic device 100.
  • the one or more camera modules 3 and the receiving module 12 are arranged in the longitudinal direction Y of the electronic device 100.
  • the receiving module 12 is located on the top side of the one or more camera modules 3.
  • the emitting area 1011 is located on the top side of the decorative member 7 and in the arrangement direction of the plurality of light-transmitting areas 721.
  • the position of the transmitting module 11 corresponds to the transmitting area 1011.
  • the transmitting module 11 is located on the top side of the receiving module 12 and in the direction of arrangement of the receiving module 12 and the one or more camera modules 3.
  • the emitting area (shown as a dot-and-dash line) may also be arranged on the left side or the right side of the decorative member 7.
  • the emitting area and the light transmitting area 721 opposite to the receiving module 12 are arranged in the width direction X of the electronic device 100.
  • the receiving module 12 decorated by the decoration member 7 has a similar appearance to the one or more camera modules 3, Even the same, therefore, the decoration 7, the receiving module 12, and the one or more camera modules 3 can be substantially symmetrically distributed in the appearance of the electronic device 100, thereby making the appearance of the electronic device 100 High coordination and more beautiful.
  • the decorative member 7 can also avoid problems such as a reduction in structural strength and easy deformation due to too much volume due to too many surrounding devices.
  • the camera assembly 40 further includes a buffer member 8.
  • the buffer member 8 is pressed between the decorative member 7 and the camera bracket 4. Specifically, the buffer member 8 is located between the limiting portion 716 of the decorative ring 71 and the top surface 45 of the camera bracket 4 (which is disposed opposite to the bottom surface 43 ).
  • the rear cover 101 presses the camera bracket 4 against the fixing bracket 5 through the limiting portion 716 and the buffer member 8 so that the bottom surface 43 of the camera bracket 4 firmly bears
  • the bottom wall 551 of the mounting groove 55, the camera bracket 4 and the one or more camera modules 3 and the receiving module 12 mounted on the camera bracket 4 can be fixed inside the housing 10, To avoid damage to the device due to frequent shaking.
  • the time-of-flight module 1 further includes a driver chip 13.
  • the driving chip 13 is fixed on a side of the circuit board 2 facing away from the transmitting module 11.
  • the projection of the driving chip 13 on the circuit board 2 partially overlaps or entirely overlaps with the projection of the transmitting module 11 on the circuit board 2.
  • the projection of the driving chip 13 on the circuit board 2 and the projection of the transmitting module 11 on the circuit board 2 all overlap, which means that one of them completely falls within the range of the other.
  • the driving chip 13 and all The transmitting module 11 is fixed on opposite sides of the circuit board 2 substantially opposite to each other, so that the wiring between the driving chip 13 and the transmitting module 11 is short, and the parasitic inductance is small, thereby ensuring the transmission
  • the pulse waveform of the detection optical signal transmitted by the module 11 has better quality to improve the signal-to-noise ratio.
  • the inductance value between the driving chip 13 and the transmitting module 11 in this embodiment is less than or equal to 0.3 nanohenry (nH), which can meet the usage requirements of the time-of-flight module 1.
  • the receiving module 12 includes a lens and a photosensitive chip (also called an image sensor).
  • the photosensitive chip is used to convert an optical signal into an image signal.
  • the photosensitive chip can transmit a signal to the driving chip 13 so that the driving chip 13 drives the transmitting module 11 to emit the sensing light signal.
  • the controller 30 includes a processing chip and a memory chip.
  • the memory chip stores a plurality of instructions that can be executed by the processor.
  • the multiple commands correspond to multiple operating modes of the time-of-flight module 1.
  • Each of the operating modes is provided with an operating state of the sensing optical signal (for example, pulsed light wave), including the frequency of the pulse wave (such as 20 MHz, 50 MHz, or 100 MHz, etc.), pulse wave integration time, pulse Wave duty ratio and corresponding frame rate.
  • the processor When the processor receives the activation signal, the processor invokes the corresponding instruction in the memory according to the activation signal, and writes the instruction into the register of the photosensitive chip.
  • the photosensitive chip sends a corresponding emission signal to the driving chip 13 according to the instruction, and the driving chip 13 drives the emission module 11 to emit the corresponding sensing light signal according to the emission signal.
  • the working state of the sensing light signal corresponds to the start signal.
  • the start signal corresponds to a large aperture photographing effect
  • the corresponding instruction is a first instruction
  • the processor will call the first instruction and write it into a register of the photosensitive chip.
  • a corresponding transmission signal is sent to the driving chip 13, and the driving chip 13 drives the transmission module 11 to emit a sensing light signal corresponding to a large aperture photograph according to the transmission signal.
  • the fixing bracket 5 further has an escape groove 57.
  • the escape groove 57 is recessed from the first surface 51 toward the second surface 52.
  • the driving chip 13 may be partially or entirely contained in the escape slot 57.
  • the time-of-flight module 1 further includes a plurality of matching electronic components 14.
  • the plurality of matching electronic components 14 include but are not limited to capacitors, inductors, resistors and the like.
  • the plurality of matching electronic components 14 can reduce the parasitic inductance between the driving chip 13 and the transmitting module 11 to ensure the waveform integrity of the detection optical signal sent by the transmitting module 11.
  • the plurality of matching electronic components 14 are fixed on a side of the circuit board 2 facing away from the transmitting module 11.
  • the plurality of matching electronic components 14 are arranged around the driving chip 13.
  • the projections of the plurality of matching electronic components 14 on the circuit board 2 may partially overlap or completely overlap the projections of the transmitting module 11 on the circuit board 2.
  • the plurality of matching electronic components 14 may be partially or entirely contained in the escape groove 57.
  • FIG. 15 is an exploded schematic view of the transmitting module in the structure shown in FIG. 8.
  • the transmitting module 11 includes a base 112, a transmitter 113 and a diffuser 114.
  • the base 112 has a top surface 1121 and a bottom surface 1122 disposed opposite to each other.
  • the bottom surface 1122 of the base 112 faces the circuit board 2.
  • the base 112 forms a launch cavity 1123.
  • the launch cavity 1123 is located inside the base 112.
  • the base 112 also has a positioning groove 1124.
  • the positioning groove 1124 is recessed from the top surface 1121 of the base 112 toward the bottom surface 1122 of the base 112. The positioning groove 1124 communicates with the launch cavity 1123.
  • the transmitter 113 is used to emit the detection light signal.
  • the transmitter 113 is received in the launch cavity 1123 and fixed to the base 112.
  • the emitter 113 may be a vertical cavity surface emitting laser (VCSEL). At this time, there is no need to add a collimating lens inside the transmitting module 11, so that the cost of the transmitting module 11 is lower and the manufacturing technology is less difficult.
  • VCSEL vertical cavity surface emitting laser
  • the diffusion plate 114 is fixed to the base 112 and covers the emission cavity 1123.
  • the diffusion plate 114 is located in the positioning groove 1124.
  • the diffusion plate 114 is used to increase the angle of view of the detection light signal.
  • the field of view of the transmitter 113 may be in the range of 15° to 25°.
  • the field angle of the transmitting field of view of the transmitter 113 may be designed to be 21° ⁇ 3°.
  • the transmitting module 11 may expand the viewing angle of the transmitting field of view of the transmitter 113 through the diffusion plate 114, so that the transmitting viewing field of the transmitting module 11 has a larger viewing angle. That is, the diffusion plate 114 can diffuse the laser beam of a small angle to the angle of view required by the time-of-flight module 1.
  • the transmitting module 11 Since the transmitting module 11 has a large angle of view, it can be avoided that the distance between the transmitting axis 111 of the transmitting module 11 and the receiving axis 122 of the receiving module 12 causes the transmitting field of view and The problem that the coverage of the receiving field of view decreases, so that the distance between the transmitting axis 111 of the transmitting module 11 and the receiving axis 122 of the receiving module 12 can be greater than that of the conventional time-of-flight module, further increasing the transmitting module 11 and the arrangement flexibility of the receiving module 12.
  • the field of view of the transmitting field of view of the transmitting module 11 may be slightly larger than the field of view of the receiving field of view of the receiving module 12.
  • the angle of view of the receiving field of view of the receiving module 12 is 64° ⁇ 50°
  • the angle of view of the transmitting field of view of the transmitting module 11 is 68° ⁇ 54°.
  • the diffusion plate 114 has a rectangular shape. The diffusion plate 114 can diffuse the 21° field of view of the transmitter 113 into a 68° ⁇ 54° square cone field of view.
  • the transmitting module 11 may be soldered on the circuit board 2 by surface mount technology (SMT).
  • SMT surface mount technology
  • circuit traces may be formed on the base 112, the transmitter 113 is welded on the base 112, and the base 112 is welded on the circuit board 2 to allow the transmitter 113 to pass through
  • the circuit trace is electrically connected to the circuit board 2.
  • FIG. 16 which is a bottom view of the transmitting module 11 shown in FIG. 10.
  • a plurality of pads 1127 are provided on the bottom surface 1122 of the base 112.
  • the plurality of pads 1127 solder the circuit board 2.
  • the plurality of pads 1127 can be used to transmit different signals.
  • the base 112 may be an integrated ceramic structure.
  • the base 112 may be made of aluminum nitride (ALN) material. Since the thermal conductivity of the aluminum nitride ceramic material is better than other ceramic materials, the coefficient of thermal expansion (CTE) is smaller than that of the emitter 113, so it can still be used under the condition of repeated heating of the emitter 113 Maintain a good matching degree and strength with the transmitter 113 to ensure the working reliability of the time-of-flight module 1.
  • APN aluminum nitride
  • the transmitting module 11 may further include a photodiode (PD) 115.
  • the photodiode 115 is accommodated in the emission cavity 1123 and fixed to the base 112.
  • the photodiode 115 is a monitoring device for human eye safety and skin safety, and is also responsible for automatic power control.
  • the photodiode 115 is used to monitor the light change in the emission cavity 1123 of the emission module 11 and convert the received light into a corresponding current signal and transmit it to the driving chip 13. If the diffusion plate 114 is lost or broken, it will cause the light in the emitting cavity 1123 to change.
  • the light received by the photodiode 115 changes, and the photodiode 115 converts the received light into a current signal in time and transmits it to the driving chip 13.
  • the driving chip 13 is also used to compare the current signal with the set threshold. When the current signal is greater than the set threshold, the time-of-flight module 1 is turned off to prevent the light emitted by the transmitting module 11 from exceeding the standard and causing damage to human eyes.
  • the transmitting module 11 may further include a negative temperature coefficient (NTC) device (not shown in the figure).
  • NTC negative temperature coefficient
  • the negative temperature coefficient device is accommodated in the launch cavity 1123 and fixed to the base 112.
  • the negative temperature coefficient device is used to monitor the real-time temperature of the transmitter 113 and transmit the data to the driving chip 13 in real time. Because when the temperature of the transmitter 113 exceeds a certain set temperature (for example, 70° C.), the light efficiency will be greatly attenuated and the depth accuracy will be greatly lost, so the system must monitor it in real time.
  • the driving chip 13 receives the signal detected by the negative temperature coefficient device and learns that the temperature is about to reach the set temperature, it will control the temperature rise by some means. For example, when the current output is reduced, or when the temperature detected by the negative temperature coefficient device reaches a predetermined temperature (this temperature is usually higher than the set temperature) through a preset program, the time-of-flight module 1 is turned off.
  • FIG. 17 is a top view of the transmitting module 11 shown in FIG. 10.
  • the transmitting module 11 may further include a connecting glue 116.
  • the connecting glue 116 is connected between the base 112 and the diffusion plate 114.
  • the connecting glue 116 is adhered between the diffusion plate 114 and the groove wall 1125 of the positioning groove 1124.
  • the connecting glue 116 is used to increase the firmness of the connection between the diffusion plate 114 and the base 112.
  • the connecting glue 116 is provided with one or more vent holes 1161.
  • the one or more air escape holes 1161 communicate the launch cavity 1123 to the outside of the launch module 11.
  • the one or more escape holes 1161 can enable the heated and expanding gas in the launching chamber 1123 to flow to all The outside of the launching module 11, so as to prevent the gas in the launching chamber 1123 from pushing up the diffusion plate 114 during the welding process and damaging the structure of the launching module 11.
  • a concave region 1128 is formed on the wall surface of the emitting cavity 1123.
  • the recessed area 1128 communicates with the positioning groove 1124 and the emitting cavity 1123.
  • the recessed area 1128 communicates with the one or more vent holes 1161 to enable the launch cavity 1123 to flow to the outside of the launch module 11.
  • the top surface 1121 of the base 112 is provided with one or more marking areas 1126.
  • the shape of the marking area 1126 may be square, round, or scribed, etc., which is not strictly limited in this application.
  • the supplier or model number of the transmitting module 11 may be determined according to the number of the marked areas 1126 to avoid confusion due to the small size of the transmitting module and the similar appearance of the main body.

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Abstract

本申请实施方式公开了一种摄像组件，包括飞行时间模组和电路板，电路板设有避让空间，飞行时间模组包括发射模块和接收模块，发射模块用于发出检测光信号，接收模块用于接收检测光信号被待测对象反射后形成的感应光信号，接收模块位于避让空间，且接收模块的连接端固定于电路板，发射模块位于接收模块的周边且固定于电路板。上述摄像组件的实用性较佳。本申请实施方式还公开一种应用上述摄像组件的电子设备。

Description

摄像组件及电子设备
本申请要求在2018年12月24日提交中国国家知识产权局、申请号为201811584395.9、发明名称为“摄像组件及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子产品技术领域，尤其涉及一种摄像组件及一种应用该摄像组件的电子设备。
背景技术
电子设备实现成像功能的主要部件是摄像模组。飞行时间(time of flight，TOF)模组是一种常用的深度摄像机模组，可以用于测量景深信息。飞行时间模组包括发射模块和接收模块。为了保证飞行时间模组的检测性能，通常需要发射模块与接收模块足够靠近，以使发射模块的视场与接收模块的视场的重合度较高。传统飞行时间模组将其发射模块和接收模块固定于同一块印刷电路板上，以满足发射模块与接收模块的靠近需求。如此一来，由于发射模块和接收模块的相对位置及印刷电路板的出线方向已经固定，因此应用该飞行时间模组的电子设备的盖板上正对发射模块和接收模块的交互孔的位置也被固定，导致该飞行时间模组只能适用于某种特定外观形态的电子设备，难以适用于其他外观形态的电子设备，适用性差。
发明内容
本申请实施例提供一种适用性较佳的摄像组件及应用该摄像组件的电子设备。
第一方面，本申请实施例提供一种摄像组件，包括飞行时间模组和电路板。所述电路板设有避让空间。所述飞行时间模组包括发射模块和接收模块。所述发射模块用于发出检测光信号。所述接收模块用于接收所述检测光信号被待测对象反射后形成的感应光信号。所述感应光信号携带有所述待测对象的景深信息。所述接收模块可以是摄像头模组。所述接收模块与所述发射模块彼此独立封装。所述接收模块位于所述避让空间，且所述接收模块的连接端固定于所述电路板。所述接收模块经其连接端电连接所述电路板。所述发射模块位于所述接收模块的周边且固定于所述电路板。
在本实施例中，所述接收模块与所述发射模块彼此独立封装。所述接收模块具有接收视场接收轴，所述接收轴为所述接收视场的中心轴。所述发射模块具有发射视场及发射轴，所述发射轴为所述发射视场的中心轴。由于所述接收模块位于所述避让空间，且所述接收模块的连接端固定于所述电路板，使得所述接收模块与所述发射模块能够靠近彼此，所述接收轴与所述发射轴之间的间距得以足够小，所述接收视场与所述发射视场的覆盖率高，以满足所述飞行时间模组的性能需求。同时，由于所述接收模块与所述发射模块单独封装，两者之间没有直接安装或直接连接关系，因此所述发射模块与所述接收模块的排布方式更为灵活，可以形成多种排布结构，使得应用所述摄像组件的电子设备能够具有多种外观形态。换言之，所述摄像组件能够适用于具有不同外观形态的多种电子设备中，所述摄像组件的适用性强。由于多种不同外观形态的电子设备能够通用所述摄像组件，无需因不同的外观形态重复开发 不同形态的飞行时间模组，从而能够降低电子设备的开发成本和制作成本。
其中，所述避让空间可以为设于所述电路板上的通孔或凹槽。所述接收模块位于所述避让空间，使得所述接收模块能够复用所述电路板的部分或全部厚度空间，使得所述摄像组件的排布更为紧凑，所述摄像组件在所述电子设备的厚度方向Z上的尺寸更小。
一种实施方式中，所述摄像组件还包括一个或多个摄像模组。所述摄像模组可以为彩色摄像头、黑白摄像头、广角摄像头或变焦摄像头。所述一个或多个摄像模组位于所述避让空间，且所述一个或多个摄像模组的连接端固定于所述电路板。所述一个或多个摄像模组可以与所述飞行时间模组协同作用，以提高所述电子设备的性能。例如，当所述飞行时间模组所捕获图像与彩色摄像头所捕获图像相结合时，可以将所述待测对象的三维轮廓以不同颜色代表不同距离的图形方式呈现出来。本实施例以所述摄像组件包括一个摄像模组为例进行说明。
一种实施方式中，所述摄像组件还包括位于所述避让空间的摄像支架。所述摄像支架具有彼此间隔设置的多个容纳槽。所述多个容纳槽的开口方向相同。所述接收模块和所述一个或多个摄像模组一一对应地部分收容于所述多个容纳槽中。所述接收模块和所述一个或多个摄像模组彼此间隔，以避免因受到意外撞击而彼此冲撞、损坏。
在本实施例中，所述接收模块和所述一个或多个摄像模组收容于所述摄像组件的所述多个容纳槽，以相对所述摄像支架固定。所述摄像支架位于所述避让空间，从而使所述接收模块和所述一个或多个摄像模组位于所述避让空间。所述接收模块、所述一个或多个摄像模组及所述摄像支架可以先通过单独的组装工序实现模块化，再参与所述摄像组件的整体组装工序，从而简化所述摄像组件的整体组装工序步骤，降低组装难度。
其中，所述接收模块和所述一个或多个摄像模组可通过粘接件粘接所述多个容纳槽的底壁，以相对所述摄像支架固定。所述摄像支架可采用具有高导热率的材料，例如铜、铝箔、不锈钢等金属材料。所述粘接件可掺杂导热颗粒(例如石墨颗粒或金属颗粒)或采用导热胶材料。
在本实施例中，所述接收模块和所述一个或多个摄像模组所散发的热量能够经粘接件传导至所述摄像支架，通过所述摄像支架进行散热，从而保证所述摄像组件的工作可靠性。
其中，所述摄像支架还具有多个连接缺口。所述多个连接缺口一一对应地连通所述多个容纳槽至所述摄像支架的外部。所述接收模块的连接端和所述一个或多个摄像模组的连接端一一对应地经所述多个连接缺口伸出所述多个容纳槽，从而得以固定至所述电路板。
一种实施方式中，所述摄像组件还包括固定支架。所述电路板固定于所述固定支架。所述电路板可以通过紧固件固定至所述固定支架。例如，所述固定支架包括相背设置的第一面和第二面。所述固定支架具有安装凸台和安装孔。所述安装凸台凸设于所述第一面。所述安装孔自安装凸台远离所述第一面的顶端面向靠近所述第二面的方向凹陷。所述电路板可抵持所述安装凸台的顶端面。所述电路板上设有与安装孔相对应的连接孔。所述紧固件穿过所述连接孔并伸入所述安装孔，以将所述电路板锁紧在所述固定支架上。所述紧固件、所述连接孔结构及所述安装孔结构构成锁紧结构。所述电路板与所述固定支架之间可以形成多组锁紧结构。多组锁紧结构可以分散于所述电路板的周缘区域，以将所述电路板更稳定地固定于所述固定支架。
所述固定支架具有安装槽。所述安装槽自所述第一面向靠近所述第二面的方向凹陷。所述摄像支架固定于所述安装槽。所述摄像支架背向所述容纳槽的底面可以抵持所述安装槽的底壁，以实现两者的相互定位。其中，所述安装槽的底壁与所述摄像支架的底面之间可设有 凹凸配合结构。例如，所述安装槽的底壁上可以设有凸起的凸块。所述摄像支架的底面可设有凹陷的凹槽。所述凸块伸入所述凹槽，以使所述摄像支架相对所述固定支架固定。其他实施例中，所述安装槽的底壁设有凹槽，所述摄像支架的底面设有凸块，凸块伸入凹槽，以使所述摄像支架相对所述固定支架固定。
在本实施例中，由于所述电路板固定至所述固定支架，所述摄像支架也固定至所述固定支架，因此所述电路板与所述摄像支架之间通过所述固定支架实现彼此定位，使得安装于所述摄像支架的所述接收模块与固定于所述电路板的所述发射模块实现彼此定位，所述发射视场与所述接收视场之间的相对位置稳定，从而能够保证所述飞行时间模组的可靠工作，所述摄像组件的性能较佳。
一种实施方式中，所述摄像组件还包括装饰件。所述装饰件位于所述接收模块的接收所述感应光信号的一侧。所述装饰件包括装饰圈和保护板。所述装饰圈具有相背设置的顶面和底面。所述装饰圈的顶面设有凹陷的限位槽。所述保护板安装于所述限位槽且抵持所述限位槽的底壁。所述装饰件设有多个安装空间。所述多个安装空间设于所述装饰圈。所述安装空间连通所述限位槽至所述装饰圈的底面。
所述接收模块和所述一个或多个摄像模组部分收容于所述多个安装空间。所述接收模块和所述一个或多个摄像模组一一对应地部分收容于不同的所述安装空间。所述发射模块位于所述装饰件的周边。简言之，所述接收模块和所述一个或多个摄像模组位于所述装饰件内侧，被所述装饰件环绕，所述发射模块位于所述装饰件外侧。
在本实施例中，由于所述发射模块与所述接收模块能够彼此单独封装，两者之间的位置关系可以灵活排布，因此所述装饰件可以用于装饰所述接收模块和所述一个或多个摄像模组，而不再将所述发射模块环绕在内，故而所述装饰件、所述接收模块、所述一个或多个摄像模组及所述发射模块的排布方式更为多样化。
由于所述装饰件部分外露在所述电子设备的外部，所述装饰件装饰的所述接收模块与所述一个或多个摄像模组的外观相似、甚至相同，因此所述装饰件、所述接收模块及所述一个或多个摄像模组在所述电子设备的外观上能够大体呈对称分布，从而使所述电子设备的外观协调性高，更为美观。所述装饰件也能够避免因为需要环绕的器件过多而导致体积太大，进而发生结构强度降低、容易变形等问题。
一种实施方式中，所述接收模块和所述一个或多个所述摄像模组在第一方向上排布，所述接收模块和所述发射模块在第二方向上排布，所述第二方向与所述第一方向相同，或者，所述第二方向垂直于所述第一方向。例如，所述第一方向和所述第二方向均为电子设备的宽度方向或电子设备的长度方向。或者，所述第一方向和所述第二方向中的一者为电子设备的宽度方向，另一者为电子设备的长度方向。
在本实施例中，所述接收模块、所述一个或多个所述摄像模组及所述发射模块有多种排布方式，使得所述电子设备能够设计成多种外观形态，灵活度高。
其中，所述接收模块的连接端的延伸方向(也即所述接收模块的出线方向)可以依据所述发射模块的位置及所述电路板上元器件的位置灵活设置。例如，所述接收模块的连接端的延伸方向可以与所述第二方向垂直。此时，所述接收模块的连接端和所述发射模块固定在所述电路板的同一面上。或者，所述接收模块的连接端的延伸方向可以与所述第二方向相同。此时，所述接收模块的连接端和所述发射模块可以固定在所述电路板的相背的两个面上。其中，所述一个或多个摄像模组的连接端的延伸方向可以与所述接收模块的连接端的延伸方向 相同或不同，本申请对此不作严格限定。
一种实施方式中，所述接收模块的接收轴与所述发射模块的发射轴之间的间距在0.5毫米至30毫米范围内。此时，所述接收轴与所述发射轴尽量靠近，以保证所述发射视场与所述接收视场覆盖率较高，使得所述飞行时间模组的工作性能较佳。
一种实施方式中，所述飞行时间模组还包括驱动芯片。所述驱动芯片固定于所述电路板背离所述发射模块的一侧。所述驱动芯片在所述电路板上的投影与所述发射模块在所述电路板上的投影部分重叠或全部重叠。其中，所述驱动芯片在所述电路板上的投影与所述发射模块在所述电路板上的投影全部重叠，是指其中一者完全落入另一者的范围内。
在本实施例中，由于所述驱动芯片在所述电路板上的投影与所述发射模块在所述电路板上的投影部分重叠或全部重叠，因此所述驱动芯片与所述发射模块大致相背地固定在所述电路板的相背两侧，从而使得驱动芯片与所述发射模块之间的走线较短、寄生电感较小，从而能够保证所述发射模块所发射的所述检测光信号的脉冲波形质量较佳，以提高信噪比。
可选的，所述飞行时间模组还包括多个匹配电子元器件。所述多个匹配电子元器件包括但不限于电容器、电感器、电阻器等。所述多个匹配电子元器件能够降低驱动芯片与所述发射模块之间的寄生电感，以保证所述发射模块所发出的所述检测光信号的波形完整性。所述多个匹配电子元器件固定于所述电路板背离所述发射模块的一侧。所述多个匹配电子元器件排布于所述驱动芯片的周边。所述多个匹配电子元器件在所述电路板上的投影可以与所述发射模块在所述电路板上的投影部分重叠或全部重叠。
一种实施方式中，所述发射模块包括基座、发射器及扩散板。所述基座具有相背设置的顶面和底面。所述基座的底面朝向所述电路板。所述基座形成发射腔。所述发射腔位于所述基座的内部。所述基座还具有定位槽。所述定位槽自所述基座的顶面向靠近所述基座的底面的方向凹陷。所述定位槽连通所述发射腔。所述发射器用于发出所述检测光信号。所述发射器收容于所述发射腔且固定于所述基座。所述发射器可以为垂直腔面发射激光器。此时，所述发射模块内部无需增加准直镜，使得所述发射模块的成本更低、制作技术难度更小。所述扩散板固定于所述基座且覆盖所述发射腔。所述扩散板位于所述定位槽。所述扩散板用于增加所述检测光信号的视场角。
在本实施例中，所述发射器的发射视场的视场角可以在15°至25°范围内。例如，所述发射器的发射视场的视场角可设计为21°±3°。所述发射模块可通过扩散板将所述发射器的发射视场的视场角扩大，以使所述发射模块的发射视场具有较大的视场角。即，所述扩散板能够以将小角度的激光光束扩散到所述飞行时间模组所需要的视场角度。由于发射模块具有较大的视场角，因此能够避免发生因所述发射模块的发射轴和所述接收模块的接收轴之间的间距较远而导致所述发射视场和所述接收视场的覆盖率下降的问题，使得所述发射模块的发射轴和所述接收模块的接收轴之间的间距可以大于传统飞行时间模组，进一步增加所述发射模块和所述接收模块的排布灵活性。
一种实施方式中，所述基座采用氮化铝陶瓷材料。由于氮化铝陶瓷材料的热导率优于其他陶瓷材料，热膨胀系数(coefficient of thermal expansion，CTE)与所述发射器的差别更小，因此在所述发射器反复发热状况下仍能保持与所述发射器良好的匹配度和强度，以保证所述飞行时间模组的工作可靠性。
一种实施方式中，所述发射模块还包括连接胶。所述连接胶连接于所述基座与所述扩散板之间。所述连接胶设有一个或多个逃气孔。所述一个或多个逃气孔连通所述发射腔至所述 发射模块的外部。由于所述发射模块在焊接至所述电路板时，需要经受260℃左右的高温烘烤，所述一个或多个逃气孔能够使所述发射腔中受热膨胀的气体流动至所述发射模块外部，从而避免所述发射腔中的气体在焊接过程中顶起所述扩散板而破坏所述发射模块的结构。
第二方面，本申请实施例提供一种电子设备，包括控制器和上述摄像组件。所述控制器电连接所述电路板。在本实施例中，所述接收模块、所述发射模块及所述控制器均电连接所述电路板，从而能够通过所述电路板上的电路实现信号传输。所述控制器可以通过计算所述飞行时间模组发射所述检测光信号和接收所述感应光信号之间的时间差或相位差，获得所述待测对象与所述飞行时间模组之间的距离。在本申请中，所述飞行时间模组能够应用于测距、人脸识别、头像解锁、手势识别、物体建模、3D游戏、智能家居等环境中。
附图说明
图1是本申请实施例提供的电子设备在第一实施例中的结构示意图；
图2是图1所示电子设备的摄像组件和边框在一种实施方式中的位置关系示意图；
图3是图1所示电子设备的摄像组件和边框在另一种实施方式中的位置关系示意图；
图4是图1所示电子设备的摄像组件和边框在再一种实施方式中的位置关系示意图；
图5是图1所示电子设备的摄像组件和边框在再一种实施方式中的位置关系示意图；
图6是本申请实施例提供的电子设备在第二实施例中的结构示意图；
图7是图6所示电子设备在一种实施方式中的摄像模组和边框的结构示意图；
图8是图6所示电子设备的部分结构在一种实施方式中沿A-A线剖开的剖视图；
图9是图8所示结构的部分分解示意图；
图10是图6所示电子设备的摄像组件的部分结构分解示意图；
图11是图6所示电子设备在一种实施方式中的后视图；
图12是图6所示电子设备在另一种实施方式中的后视图；
图13是图6所示电子设备在再一种实施方式中的后视图；
图14是图6所示电子设备在再一种实施方式中的后视图；
图15是图8所示结构中发射模块的部分分解示意图；
图16是图10所示发射模块的仰视图；
图17是图10所示发射模块的俯视图。
具体实施方式
下面结合本申请实施方式中的附图对本申请实施方式进行描述。
请参阅图1，图1是本申请实施例提供的电子设备100在第一实施例中的结构示意图。本申请涉及的电子设备100可以是手机、平板电脑、电子阅读器、笔记本电脑、车载设备或可穿戴设备等。本实施例以电子设备100是手机为例进行说明。定义电子设备100的宽度方向为X，电子设备100的长度方向为Y，电子设备100的厚度方向为Z，宽度方向X、长度方向Y及厚度方向Z彼此垂直。
所述电子设备100包括壳体10和显示屏20。所述壳体10可以包括后盖101与边框102。所述边框102连接于所述后盖101的周缘。所述边框102能够与所述后盖101一体成型，也可以通过组装形成一体式结构。所述显示屏20安装于所述边框102背离所述后盖101的一侧。所述显示屏20集成显示和触控功能。所述显示屏20包括显示面板和覆盖所述显示面板的前 盖板。所述显示面板可以为液晶显示面板(Liquid Crystal Display，LCD)、有机发光二极管(organic light-emitting diode，OLED)显示面板或微晶发光二极管(micro light-emitting diode，micro LED)显示面板。前盖板可以为玻璃盖板(cover glass，CG)。
所述电子设备100还包括控制器30和摄像组件40。所述控制器30收容于所述壳体10内部。所述摄像组件40安装于所述壳体10。所述摄像组件40全部收容于所述壳体10内部，或者大部分收容于所述壳体10内部。所述摄像组件40用于采集图像以形成对应的图像信号。所述控制器30电连接所述摄像组件40，所述控制器30用于处理所述摄像组件40的所述图像信号。控制器30可以为所述电子设备100的主板上的主芯片。
在所述电子设备100的使用环境中，定义所述前盖板朝向所述电子设备100的前方，所述后盖101朝向所述电子设备100的后方。在本实施例中，所述摄像组件40能够采集所述电子设备100后方的图像。其他实施例中，所述摄像组件40能够采集所述电子设备100前方的图像。
请一并参阅图2至图5，图2是图1所示电子设备100的摄像组件40和边框102在一种实施方式中的位置关系示意图；图3是图1所示电子设备100的摄像组件40和边框102在另一种实施方式中的位置关系示意图；图4是图1所示电子设备100的摄像组件40和边框102在再一种实施方式中的位置关系示意图；图5是图1所示电子设备100的摄像组件40和边框102在再一种实施方式中的位置关系示意图。
所述摄像组件40包括飞行时间(time of flight，TOF)模组1和电路板2。所述电路板2设有避让空间21。所述电路板2可以是所述电子设备100的主板，或者是所述电子设备100的主板的一部分。所述电路板2可以是刚性印刷电路板，也可是软硬结合印刷电路板。所述飞行时间模组1包括发射模块11和接收模块12。所述发射模块11用于发出检测光信号。所述检测光信号可以是红外光线。所述接收模块12用于接收所述检测光信号被待测对象反射后形成的感应光信号。所述感应光信号携带有所述待测对象的景深信息。所述接收模块12可以是摄像头模组。所述接收模块12与所述发射模块11彼此独立封装。所述接收模块12位于所述避让空间21，且所述接收模块12的连接端121固定于所述电路板2。所述接收模块12经其连接端121电连接所述电路板2。所述发射模块11位于所述接收模块12的周边且固定于所述电路板2。
所述接收模块12、所述发射模块11及所述控制器30均电连接所述电路板2，从而能够通过所述电路板2上的电路实现信号传输。所述控制器30可以通过计算所述飞行时间模组1发射所述检测光信号和接收所述感应光信号之间的时间差或相位差，获得所述待测对象与所述飞行时间模组1之间的距离。例如，控制器30中的数字信号处理(digital signal processing，DSP)模块可对所述飞行时间模组1输出的数据进行处理，从而输出最终需要的深度图。在本申请中，所述飞行时间模组1能够应用于测距、人脸识别、头像解锁、手势识别、物体建模、3D游戏、智能家居等环境中。
在本实施例中，所述接收模块12与所述发射模块11彼此独立封装。所述接收模块12具有接收视场(图中未示出)及接收轴122，所述接收轴122为所述接收视场的中心轴。所述发射模块11具有发射视场(图中未示出)及发射轴111，所述发射轴111为所述发射视场的中心轴。可选的，所述接收模块12的接收轴122与所述发射模块11的发射轴111之间的间距在0.5毫米(mm)至30毫米范围内。所述接收轴122与所述发射轴111尽量靠近，以保证所述发射视场与所述接收视场覆盖率较高，使得所述飞行时间模组1的工作性能较佳。
本实施例中，由于所述接收模块12位于所述避让空间21，且所述接收模块12的连接端121固定于所述电路板2，使得所述接收模块12与所述发射模块11能够靠近彼此，所述接收轴122与所述发射轴111之间的间距得以足够小，以满足所述飞行时间模组1的性能需求。同时，由于所述接收模块12与所述发射模块11单独封装，两者之间没有直接安装或直接连接关系，因此所述发射模块11与所述接收模块12的排布方式更为灵活，可以形成多种排布结构，例如：
如图2所示，所述发射模块11的所述发射轴111与所述接收模块12的所述接收轴122在所述电子设备100的宽度方向X上排布。所述发射模块11位于所述接收模块12的右侧。如图3所示，所述发射模块11的所述发射轴111与所述接收模块12的所述接收轴122在所述电子设备100的宽度方向X上排布。所述发射模块11位于所述接收模块12的左侧。如图4所示，所述发射模块11的所述发射轴111与所述接收模块12的所述接收轴122在所述电子设备100的长度方向Y上排布。所述发射模块11位于所述接收模块12的顶侧。如图5所示，所述发射模块11的所述发射轴111与所述接收模块12的所述接收轴122在所述电子设备100的长度方向Y上排布。所述发射模块11位于所述接收模块12的底侧。
结合参阅图1，在图2至图3所示实施方式中，所述后盖101上具有对应于所述发射模块11的发射区域1011和对应于所述接收模块12的接收区域1012。由于所述发射模块11与所述接收模块12有多种排布方式，因此所述发射区域1011与所述接收区域1012对应地具有多种排布方式，从而使得应用所述摄像组件40的电子设备100能够具有多种外观(也称工业设计，Industrial Design，ID)形态。换言之，所述摄像组件40能够适用于具有不同外观形态的多种电子设备中，所述摄像组件40的适用性强。由于多种不同外观形态的电子设备能够通用所述摄像组件40时，无需因不同的外观形态重复开发不同形态的飞行时间模组1，从而能够降低电子设备的开发成本和制作成本。
可以理解的，目前部分电子设备采用结构光模组作为其深度摄像模组。结构光模组包括发射端和接收端。依据结构光模组的检测原理，其发射端和接收端之间的中心距离至少要大于25毫米，以保证结构光模组正常工作。由于结构光模组对距离的检测精度主要依赖于光斑的亮度，因此其在近距离时深度测距的精度较高，如距离物体40厘米左右时，精度可以达到1％以内，而远距离应用精度会大幅下降，故而结构光模组只能用于检测电子设备前方较近的待测对象(例如用户脸部)，深度测距不会超过1米。在本申请中，所述飞行时间模组1的检测距离的范围远大于结构光模组的检测距离，所述飞行时间模组1即可用于检测距离近的待测对象，也可以用于检测距离远的待测对象。一种实施例中，所述飞行时间模组1用于检测电子设备100后方的近距离待测对象或远距离待测对象。则，电子设备100可同时具有结构光模组，用以检测电子设备100前方的近距离待测对象。另一种实施例中，所述飞行时间模组1用于检测电子设备100前方的距离待测对象或远距离待测对象。则，电子设备100不再设置结构光模组。
可选的，所述避让空间21可以为设于所述电路板2上的通孔或凹槽。所述接收模块12位于所述避让空间21，使得所述接收模块12能够复用所述电路板2的部分或全部厚度空间，使得所述摄像组件40的排布更为紧凑，所述摄像组件40在所述电子设备100的厚度方向Z上的尺寸更小。
请一并参阅图6和图7，图6是本申请实施例提供的电子设备100在第二实施例中的结构示意图，图7是图6所示电子设备100在一种实施方式中的摄像模组3和边框102的结构 示意图。其中，本实施例中与第一实施例相同的部分技术内容不再赘述。本申请所述摄像组件40的具体细节结构主要通过第二实施例进行阐述，第二实施例中的技术方案及相关技术特征在不冲突的情况下，可以与第一实施例相结合。
所述摄像组件40还包括一个或多个摄像模组3。所述摄像模组3可以为彩色摄像头(又称RGB摄像头)、黑白摄像头、广角摄像头或变焦摄像头。所述一个或多个摄像模组3位于所述避让空间21，且所述一个或多个摄像模组3的连接端31固定于所述电路板2。所述一个或多个摄像模组3可以与所述飞行时间模组1协同作用。例如，当所述飞行时间模组1所捕获图像与彩色摄像头所捕获图像相结合时，可以将所述待测对象的三维轮廓以不同颜色代表不同距离的图形方式呈现出来。本申请附图以所述摄像组件40包括一个摄像模组3为例进行示意。
在本实施例中，所述一个或多个摄像模组3可以与所述接收模块12并排放置。可选的，所述接收模块12和所述一个或多个所述摄像模组3在第一方向上排布。所述接收模块12和所述发射模块11在第二方向上排布。所述第二方向与所述第一方向相同。例如，所述第一方向和所述第二方向均为所述电子设备100的宽度方向X或所述电子设备100的长度方向Y。如图7所示，所述第一方向为所述电子设备100的宽度方向X，所述第二方向也为所述电子设备100的宽度方向X。其他实施例中，所述第二方向可以垂直于所述第一方向。例如，所述第一方向和所述第二方向中的一者为所述电子设备100的宽度方向X，另一者为所述电子设备100的长度方向Y。
其他实施例中，所述一个或多个摄像模组3与所述接收模块12也可以有其他排布方式，例如呈矩阵排布、呈三角排布、四角排布或圆形排布等。
可选的，所述接收模块12的连接端121的延伸方向(也即所述接收模块12的出线方向，即所述接收模块12的感光芯片向连接器的方向)可以依据所述发射模块11的位置及所述电路板2上元器件的位置灵活设置。例如，所述接收模块12的连接端121的延伸方向可以与所述第二方向垂直。此时，所述接收模块12的连接端121和所述发射模块11固定在所述电路板2的同一面上。或者，所述接收模块12的连接端121的延伸方向可以与所述第二方向相同。此时，所述接收模块12的连接端121和所述发射模块11可以固定在所述电路板2的相背的两个面上。其中，所述一个或多个摄像模组3的连接端的延伸方向可以与所述接收模块12的连接端121的延伸方向相同或不同，本申请对此不作严格限定。
可选的，所述后盖101上还具有对应于所述一个或多个摄像模组3的采集区域1013。在本实施例中，由于所述接收模块12与所述发射模块11分开封装，因此所述接收模块12、所述发射模块11及所述摄像模组3有多种排布方式，所述后盖101上的所述发射区域1011、所述接收区域1012及所述采集区域1013也对应地有多种排布方式，从而使得应用所述摄像组件40的电子设备100能够具有多种外观形态。换言之，所述摄像组件40能够适用于具有不同外观形态的多种电子设备中，所述摄像组件40的适用性强。
请一并参阅图8至图10，图8是图6所示电子设备100的部分结构在一种实施方式中沿A-A线剖开的剖视图，图9是图8所示结构的部分分解示意图，图10是图6所示电子设备100的摄像组件40的部分结构分解示意图。图8所示实施方式与图7所示实施方式相对应。
可选的，所述摄像组件40还包括位于所述避让空间21的摄像支架4。所述摄像支架4具有彼此间隔设置的多个容纳槽41。所述多个容纳槽41的开口方向相同。所述接收模块12和所述一个或多个摄像模组3一一对应地部分收容于所述多个容纳槽41中。所述接收模块 12和所述一个或多个摄像模组3彼此间隔，以避免因受到意外撞击而彼此冲撞、损坏。
在本实施例中，所述接收模块12和所述一个或多个摄像模组3收容于所述摄像组件40的所述多个容纳槽41，以相对所述摄像支架4固定。所述摄像支架4位于所述避让空间21，从而使所述接收模块12和所述一个或多个摄像模组3位于所述避让空间21。所述接收模块12、所述一个或多个摄像模组3及所述摄像支架4可以先通过单独的组装工序实现模块化，再参与所述摄像组件40的整体组装工序，从而简化所述摄像组件40的整体组装工序步骤，降低组装难度。
其中，所述接收模块12和所述一个或多个摄像模组3可通过粘接件粘接所述多个容纳槽41的底壁411，以相对所述摄像支架4固定。所述摄像支架4可采用具有高导热率的材料，例如铜、铝箔、不锈钢等金属材料。所述粘接件可掺杂导热颗粒(例如石墨颗粒或金属颗粒)或采用导热胶材料。
在本实施例中，所述接收模块12和所述一个或多个摄像模组3所散发的热量能够经粘接件传导至所述摄像支架4，通过所述摄像支架4进行散热，从而保证所述摄像组件40的工作可靠性。
其中，所述摄像支架4还具有多个连接缺口42。所述多个连接缺口42一一对应地连通所述多个容纳槽41至所述摄像支架4的外部。所述接收模块12的连接端121和所述一个或多个摄像模组3的连接端31一一对应地经所述多个连接缺口42伸出所述多个容纳槽41，从而得以固定至所述电路板2。
可选的，所述摄像组件40还包括固定支架5。所述固定支架5可以作为所述电子设备100的中板，也可以是所述电子设备100的中板的一部分。所述固定支架5相对所述电子设备100的边框102(参阅图6)固定。所述固定支架5可以与所述边框102一体成型，也可以通过组装方式与所述边框102形成一体式结构。
所述电路板2固定于所述固定支架5。所述电路板2可以通过紧固件6固定至所述固定支架5。例如，所述固定支架5包括相背设置的第一面51和第二面52。所述固定支架5具有安装凸台53和安装孔54。所述安装凸台53凸设于所述第一面51。所述安装孔54自安装凸台53远离所述第一面51的顶端面531向靠近所述第二面52的方向凹陷。所述电路板2可抵持所述安装凸台53的顶端面531。所述电路板2上设有与安装孔54相对应的连接孔22。所述紧固件6穿过所述连接孔22并伸入所述安装孔54，以将所述电路板2锁紧在所述固定支架5上。所述紧固件6、所述连接孔22结构及所述安装孔54结构构成锁紧结构。所述电路板2与所述固定支架5之间可以形成多组锁紧结构。多组锁紧结构可以分散于所述电路板2的周缘区域，以将所述电路板2更稳定地固定于所述固定支架5。
所述固定支架5具有安装槽55。所述安装槽55自所述第一面51向靠近所述第二面52的方向凹陷。所述摄像支架4固定于所述安装槽55。所述摄像支架4背向所述容纳槽41的底面43可以抵持所述安装槽55的底壁551，以实现两者的相互定位。其中，所述安装槽55的底壁551与所述摄像支架4的底面43之间可设有凹凸配合结构。例如，所述安装槽55的底壁551上可以设有凸起的凸块56。所述摄像支架4的底面43可设有凹陷的凹槽44。所述凸块56伸入所述凹槽44，以使所述摄像支架4相对所述固定支架5固定。其他实施例中，所述安装槽55的底壁551设有凹槽，所述摄像支架4的底面43设有凸块，凸块伸入凹槽，以使所述摄像支架4相对所述固定支架5固定。
在本实施例中，由于所述电路板2固定至所述固定支架5，所述摄像支架4也固定至所 述固定支架5，因此所述电路板2与所述摄像支架4之间通过所述固定支架5实现彼此定位，使得安装于所述摄像支架4的所述接收模块12与固定于所述电路板2的所述发射模块11实现彼此定位，所述发射视场与所述接收视场之间的相对位置稳定，从而能够保证所述飞行时间模组1的可靠工作，所述摄像组件40的性能较佳。
可选的，所述摄像组件40还包括装饰件7。所述装饰件7安装于所述后盖101(参阅图7)。所述装饰件7位于所述接收模块12的接收所述感应光信号的一侧。所述装饰件7包括装饰圈71和保护板72。所述装饰圈71具有相背设置的顶面711和底面712。所述装饰圈71的顶面711设有凹陷的限位槽713。所述保护板72安装于所述限位槽713且抵持所述限位槽713的底壁7131。所述装饰件7设有多个安装空间714。所述多个安装空间714设于所述装饰圈71。所述安装空间714连通所述限位槽713至所述装饰圈71的底面712。其中，所述保护板72可以具有彼此间隔设置的多个透光区721和围绕所述多个透光区721设置的遮光区722。所述多个透光区721与所述多个安装空间714一一对应设置。一种实施例中，所述保护板72为一体式复合板，包括形成所述多个透光区721的透光板体和形成所述遮光区722的遮光板体。另一种实施例中，所述保护板72包括玻璃基板及位于所述玻璃基板朝向所述限位槽713的底壁7131的遮光涂层。所述遮光涂层位于多个透光区721的部分镂空设置。再一种实施例中，所述保护板72整体采用透光材料。所述限位槽713的底壁7131设有连通所述安装空间714的多个缺口，所述多个缺口与所述透光区721相对应。所述限位槽713的底壁7131的非缺口区域采用遮光材料或附着有遮光层，以与所述遮光区722相对应。
所述接收模块12和所述一个或多个摄像模组3部分收容于所述多个安装空间714。所述接收模块12和所述一个或多个摄像模组3一一对应地部分收容于不同的所述安装空间714。所述接收模块12和所述一个或多个摄像模组3通过对应的透光区721采集光线。所述发射模块11位于所述装饰件7的周边。简言之，所述接收模块12和所述一个或多个摄像模组3位于所述装饰件7内侧，被所述装饰件7环绕，所述发射模块11位于所述装饰件7外侧。
其中，所述后盖101的所述接收区域1012与采集区域1013可以合并成一个区域1014，该区域1014可以是通孔(后文用标号1014标示)。装饰件7安装于通孔1014。所述装饰圈71包括主体部715和限位部716。所述多个安装空间714设于所述主体部715。所述限位部716连接于所述主体部715的周缘。所述装饰件7安装于所述后盖101。所述限位部716位于所述后盖101朝向所述电路板2的一侧。所述主体部715位于所述通孔1014且所述主体部715相对所述后盖101背离所述电路板2的外表面1015凸出。此时，所述装饰件7能够复用所述后盖101在所述电子设备100的厚度方向Z上的空间，所述接收模块12和所述一个或多个摄像模组3也能够复用所述后盖101在所述电子设备100的厚度方向Z上的空间，有利于减小所述电子设备100在其厚度方向Z上的尺寸，使得所述电子设备100的厚度更薄。
在本实施例中，由于所述发射模块11与所述接收模块12能够彼此单独封装，两者之间的位置关系可以灵活排布，因此所述装饰件7可以用于装饰所述接收模块12和所述一个或多个摄像模组3，而不再将所述发射模块11环绕在内，故而所述装饰件7、所述接收模块12、所述一个或多个摄像模组3及所述发射模块11的排布方式更为多样化。
例如：
请一并参阅图11至图14，图11是图6所示电子设备100在一种实施方式中的后视图；图12是图6所示电子设备100在另一种实施方式中的后视图；图13是图6所示电子设备100在再一种实施方式中的后视图；图14是图6所示电子设备100在再一种实施方式中的后视图。
如图11所示，所述装饰件7在所述电子设备100的宽度方向X上延伸。也即所述通孔1014及所述装饰件7横向排布。所述保护板72的所述多个透光区721在所述电子设备100的宽度方向X上排布。对应的，所述一个或多个摄像模组3及所述接收模块12在所述电子设备100的宽度方向X上排布。所述接收模块12位于所述一个或多个摄像模组3的右侧。在本实施方式中，所述发射区域1011位于所述装饰件7的右侧，且位于所述多个透光区721的排列方向上。所述发射模块11的位置与所述发射区域1011相对应。所述发射模块11位于所述接收模块12的右侧，且位于所述接收模块12和所述一个或多个摄像模组3的排列方向上。其他实施例中，所述发射区域(如圆形点画线所示)也可以排布于所述装饰件7的顶侧或底侧。所述发射区域和与所述接收模块12相对的所述透光区721在所述电子设备100的长度方向Y上排列。在本申请中，对所述发射模块11、所述接收模块12及所述一个或多个摄像模组3的相对位置的限定即为对齐视场角的中心轴(例如接收轴或发射轴)的相对位置限定。
在本申请中，所述后盖101的所述发射区域1011有多种形成方式。例如，所述后盖101包括玻璃基板及位于所述玻璃基板朝向所述电路板2一侧的遮光涂层。所述遮光涂层的至少部分区域允许不可见光穿过，以形成所述发射区域1011。所述遮光涂层可采用遮挡可见光，且允许不可见光通过的材料。所述遮光涂层也可以采用遮挡不可见光的材料，并通过减薄部分涂层的方式形成所述发射区域1011。所述遮光涂层也可采用复合涂层，例如允许不可见光通过的材料形成所述发射区域1011，采用其他材料形成其他区域。或者，所述后盖101可采用金属材料，在所述发射区域1011形成通孔，并在该通孔中设置透光板，以允许不可见光穿过。
如图12所示，所述装饰件7在所述电子设备100的宽度方向X上延伸。也即所述通孔1014及所述装饰件7横向排布。所述保护板72的所述多个透光区721在所述电子设备100的宽度方向X上排布。对应的，所述一个或多个摄像模组3及所述接收模块12在所述电子设备100的宽度方向X上排布。所述接收模块12位于所述一个或多个摄像模组3的左侧。在本实施方式中，所述发射区域1011位于所述装饰件7的左侧，且位于所述多个透光区721的排列方向上。所述发射模块11的位置与所述发射区域1011相对应。所述发射模块11位于所述接收模块12的左侧，且位于所述接收模块12和所述一个或多个摄像模组3的排列方向上。其他实施例中，所述发射区域(如圆形点画线所示)也可以排布于所述装饰件7的顶侧或底侧。所述发射区域和与所述接收模块12相对的所述透光区721在所述电子设备100的长度方向Y上排列。
如图13所示，所述装饰件7在所述电子设备100的长度方向Y上延伸。也即所述通孔1014及所述装饰件7纵向排布。所述保护板72的所述多个透光区721在所述电子设备100的长度方向Y上排布。对应的，所述一个或多个摄像模组3及所述接收模块12在所述电子设备100的长度方向Y上排布。所述接收模块12位于所述一个或多个摄像模组3的底侧。在本实施方式中，所述发射区域1011位于所述装饰件7的底侧，且位于所述多个透光区721的排列方向上。所述发射模块11的位置与所述发射区域1011相对应。所述发射模块11位于所述接收模块12的底侧，且位于所述接收模块12和所述一个或多个摄像模组3的排列方向上。其他实施例中，所述发射区域(如圆形点画线所示)也可以排布于所述装饰件7的左侧或右侧。所述发射区域和与所述接收模块12相对的所述透光区721在所述电子设备100的宽度方向X上排列。
如图14所示，所述装饰件7在所述电子设备100的长度方向Y上延伸。也即所述通孔 1014及所述装饰件7纵向排布。所述保护板72的所述多个透光区721在所述电子设备100的长度方向Y上排布。对应的，所述一个或多个摄像模组3及所述接收模块12在所述电子设备100的长度方向Y上排布。所述接收模块12位于所述一个或多个摄像模组3的顶侧。在本实施方式中，所述发射区域1011位于所述装饰件7的顶侧，且位于所述多个透光区721的排列方向上。所述发射模块11的位置与所述发射区域1011相对应。所述发射模块11位于所述接收模块12的顶侧，且位于所述接收模块12和所述一个或多个摄像模组3的排列方向上。其他实施例中，所述发射区域(如圆形点画线所示)也可以排布于所述装饰件7的左侧或右侧。所述发射区域和与所述接收模块12相对的所述透光区721在所述电子设备100的宽度方向X上排列。
在本实施例中，由于所述装饰件7部分外露在所述电子设备100的外部，所述装饰件7装饰的所述接收模块12与所述一个或多个摄像模组3的外观相似、甚至相同，因此所述装饰件7、所述接收模块12及所述一个或多个摄像模组3在所述电子设备100的外观上能够大体呈对称分布，从而使所述电子设备100的外观协调性高，更为美观。所述装饰件7也能够避免因为需要环绕的器件过多而导致体积太大，进而发生结构强度降低、容易变形等问题。
可选的，请一并参阅图8和图9，所述摄像组件40还包括缓冲件8。所述缓冲件8被压紧在所述装饰件7与所述摄像支架4之间。具体的，所述缓冲件8位于所述装饰圈71的所述限位部716与所述摄像支架4的顶面45(与底面43相背设置)之间。此时，所述后盖101通过所述限位部716和所述缓冲件8将所述摄像支架4压紧在所述固定支架5上，使得所述摄像支架4的底面43牢固抵持所述安装槽55的底壁551，所述摄像支架4及安装于所述摄像支架4的所述一个或多个摄像模组3及所述接收模块12能够固定在所述壳体10的内部，以避免因频繁晃动而导致器件损坏。
可选的，请一并参阅图8和图9，所述飞行时间模组1还包括驱动芯片13。所述驱动芯片13固定于所述电路板2背离所述发射模块11的一侧。所述驱动芯片13在所述电路板2上的投影与所述发射模块11在所述电路板2上的投影部分重叠或全部重叠。其中，所述驱动芯片13在所述电路板2上的投影与所述发射模块11在所述电路板2上的投影全部重叠，是指其中一者完全落入另一者的范围内。
在本实施例中，由于所述驱动芯片13在所述电路板2上的投影与所述发射模块11在所述电路板2上的投影部分重叠或全部重叠，因此所述驱动芯片13与所述发射模块11大致相背地固定在所述电路板2的相背两侧，从而使得驱动芯片13与所述发射模块11之间的走线较短、寄生电感较小，从而能够保证所述发射模块11所发射的所述检测光信号的脉冲波形质量较佳，以提高信噪比。
经验证，本实施例所述驱动芯片13与所述发射模块11之间的电感值小于等于0.3纳亨(nH)，能够满足所述飞行时间模组1的使用需求。
在本申请中，所述接收模块12包括镜头(lens)及感光芯片(又称图像传感器)。所述感光芯片用于将光学信号转换成图像信号。所述感光芯片能够传输信号至所述驱动芯片13，以使所述驱动芯片13驱动所述发射模块11发出所述感测光信号。
在本申请中，所述控制器30包括处理芯片和存储芯片。所述存储芯片中存储有多个能够被所述处理器执行的指令。所述多个指令对应于所述飞行时间模组1的多种工作模式。每一种所述工作模式中设置有一种所述感测光信号(例如脉冲光波)的工作状态，包括脉冲波的频率(如20兆赫、50兆赫或100兆赫等)、脉冲波积分时间、脉冲波占空比及对应的帧率等。
当所述处理器接收到启动信号时，所述处理器依据所述启动信号调用所述存储器中对应的指令，并将所述指令写入所述感光芯片的寄存器中。所述感光芯片依据所述指令向所述驱动芯片13发送对应的发射信号，所述驱动芯片13依据所述发射信号驱动所述发射模块11发出对应的所述感测光信号。此时，所述感测光信号的工作状态与所述启动信号相对应。例如，所述启动信号对应于大光圈拍照效果，所对应的指令为第一指令，所述处理器会调用所述第一指令并写入所述感光芯片的寄存器中。寄存器开关打开后会发送对应的发射信号至所述驱动芯片13，所述驱动芯片13依据所述发射信号驱动所述发射模块11发出与大光圈拍照相对应的感应光信号。
可选的，所述固定支架5还具有避让槽57。所述避让槽57自所述第一面51向靠近所述第二面52的方向凹陷。所述驱动芯片13可部分收容于或全部收容于所述避让槽57。
可选的，所述飞行时间模组1还包括多个匹配电子元器件14。所述多个匹配电子元器件14包括但不限于电容器、电感器、电阻器等。所述多个匹配电子元器件14能够降低驱动芯片13与所述发射模块11之间的寄生电感，以保证所述发射模块11所发出的所述检测光信号的波形完整性。所述多个匹配电子元器件14固定于所述电路板2背离所述发射模块11的一侧。所述多个匹配电子元器件14排布于所述驱动芯片13的周边。所述多个匹配电子元器件14在所述电路板2上的投影可以与所述发射模块11在所述电路板2上的投影部分重叠或全部重叠。其中，所述多个匹配电子元器件14可部分收容于或全部收容于所述避让槽57。
可选的，请一并参阅图8和图15，图15是图8所示结构中发射模块的分解示意图。
所述发射模块11包括基座112、发射器113及扩散板(diffuser)114。所述基座112具有相背设置的顶面1121和底面1122。所述基座112的底面1122朝向所述电路板2。所述基座112形成发射腔1123。所述发射腔1123位于所述基座112的内部。所述基座112还具有定位槽1124。所述定位槽1124自所述基座112的顶面1121向靠近所述基座112的底面1122的方向凹陷。所述定位槽1124连通所述发射腔1123。
所述发射器113用于发出所述检测光信号。所述发射器113收容于所述发射腔1123且固定于所述基座112。所述发射器113可以为垂直腔面发射激光器(vertical cavity surface emitting Laser，VCSEL)。此时，所述发射模块11内部无需增加准直镜，使得所述发射模块11的成本更低、制作技术难度更小。
所述扩散板114固定于所述基座112且覆盖所述发射腔1123。所述扩散板114位于所述定位槽1124。所述扩散板114用于增加所述检测光信号的视场角。
在本实施例中，所述发射器113的发射视场的视场角可以在15°至25°范围内。例如，所述发射器113的发射视场的视场角可设计为21°±3°。所述发射模块11可通过扩散板114将所述发射器113的发射视场的视场角扩大，以使所述发射模块11的发射视场具有较大的视场角。即，所述扩散板114能够以将小角度的激光光束扩散到所述飞行时间模组1所需要的视场角度。由于发射模块11具有较大的视场角，因此能够避免发生因所述发射模块11的发射轴111和所述接收模块12的接收轴122之间的间距较远而导致所述发射视场和所述接收视场的覆盖率下降的问题，使得所述发射模块11的发射轴111和所述接收模块12的接收轴122之间的间距可以大于传统飞行时间模组，进一步增加所述发射模块11和所述接收模块12的排布灵活性。
其中，所述发射模块11的发射视场的视场角可以略大于所述接收模块12的接收视场的视场角。一种实施例中，所述接收模块12的接收视场的视场角为64°×50°，所述发射模 块11的发射视场的视场角为68°×54°。所述扩散板114呈矩形。所述扩散板114能够将所述发射器113的21°的视场扩散成68°×54°的方锥形视场。
可选的，所述发射模块11可通过表面组装技术(surface mount technology，SMT)焊接在所述电路板2上。其中，所述基座112上可形成电路走线，所述发射器113焊接在所述基座112上，所述基座112焊接于所述电路板2，以使所述发射器113通过所述电路走线电连接至所述电路板2。请参阅图16，图16是图10所示发射模块11的仰视图。所述基座112的底面1122设有多个焊盘1127。所述多个焊盘1127焊接所述电路板2。所述多个焊盘1127可用于传输不同的信号。
其中，所述基座112可以为一体式陶瓷结构。所述基座112可采用氮化铝陶瓷(Aluminum nitride，ALN)材料。由于氮化铝陶瓷材料的热导率优于其他陶瓷材料，热膨胀系数(coefficient of thermal expansion，CTE)与所述发射器113的差别更小，因此在所述发射器113反复发热状况下仍能保持与所述发射器113良好的匹配度和强度，以保证所述飞行时间模组1的工作可靠性。
其中，所述发射模块11还可包括光电二极管(photo diode，PD)115。所述光电二极管115收容于所述发射腔1123且固定于所述基座112。所述光电二极管115为人眼安全和皮肤安全的监控器件，同时负责自动功率控制。所述光电二极管115用于监控所述发射模块11的所述发射腔1123内的光线变化，并将接收到的光线转换为对应的电流信号后传输至所述驱动芯片13。若所述扩散板114出现丢失或者破裂，则会导致所述发射腔1123内的光线出现变化。此时，所述光电二极管115接收到的光线出现变化，所述光电二极管115会及时将接收光线转化为电流信号，并传输至所述驱动芯片13。所述驱动芯片13还用于比对所述电流信号与设定的阈值。当所述电流信号大于设定的阈值时，则关闭所述飞行时间模组1，以避免所述发射模块11发出的光线超标而对人眼安全有损伤。
其中，所述发射模块11还可包括负温度系数(negative temperature coefficient，NTC)器件(图中未示出)。所述负温度系数器件收容于所述发射腔1123且固定于所述基座112。所述负温度系数器件用于监控所述发射器113的实时温度，并将数据实时传送给所述驱动芯片13。因为所述发射器113在温度超过某个设定温度(例如70℃)时，光效率会大幅衰减，对深度精度损失很大，因此系统必须对其实时进行监控。当所述驱动芯片13收到所述负温度系数器件检测的信号，得知温度将要达到设定温度时，会通过一些手段控制温度的上升。例如降低电流输出，或者通过预设程序，使所述负温度系数器件所检测的温度达到预定温度(该温度通常高于设定温度)时，关闭所述飞行时间模组1。
可选的，请一并参阅图9、图15及图17，图17是图10所示发射模块11的俯视图。所述发射模块11还可包括连接胶116。所述连接胶116连接于所述基座112与所述扩散板114之间。例如，所述连接胶116粘接在所述扩散板114与所述定位槽1124的槽壁1125之间。所述连接胶116用于增加所述扩散板114与所述基座112之间的连接牢固度。所述连接胶116设有一个或多个逃气孔1161。所述一个或多个逃气孔1161连通所述发射腔1123至所述发射模块11的外部。由于所述发射模块11在焊接至所述电路板2时，需要经受260℃左右的高温烘烤，所述一个或多个逃气孔1161能够使所述发射腔1123中受热膨胀的气体流动至所述发射模块11外部，从而避免所述发射腔1123中的气体在焊接过程中顶起所述扩散板114而破坏所述发射模块11的结构。
其中，所述发射腔1123的壁面上形成凹陷区1128。凹陷区1128连通所述定位槽1124 和所述发射腔1123。所述凹陷区1128连通所述一个或多个逃气孔1161，以使所述发射腔1123能够流动至所述发射模块11的外部。
其中，所述基座112的顶面1121设有一个或多个标示区1126。所述标示区1126的形状可以是方形、圆形或者刻线等，本申请对此不作严格限定。此时，可依据所述标示区1126的数量判断所述发射模块11的供应商或型号，以避免因所述发射模组的尺寸较小且外观主体形态相似而发生混淆。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内；在不冲突的情况下，本申请的实施方式及实施方式中的特征可以相互组合。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (12)

  1. 一种摄像组件，其特征在于，包括飞行时间模组和电路板，所述电路板设有避让空间，所述飞行时间模组包括发射模块和接收模块，所述发射模块用于发出检测光信号，所述接收模块用于接收所述检测光信号被待测对象反射后形成的感应光信号，所述接收模块位于所述避让空间，且所述接收模块的连接端固定于所述电路板，所述发射模块位于所述接收模块的周边且固定于所述电路板。
  2. 如权利要求1所述的摄像组件，其特征在于，所述摄像组件还包括一个或多个摄像模组，所述一个或多个摄像模组位于所述避让空间，且所述一个或多个摄像模组的连接端固定于所述电路板。
  3. 如权利要求2所述的摄像组件，其特征在于，所述摄像组件还包括位于所述避让空间的摄像支架，所述摄像支架具有彼此间隔设置的多个容纳槽，所述接收模块和所述一个或多个摄像模组一一对应地部分收容于所述多个容纳槽中。
  4. 如权利要求3所述的摄像组件，其特征在于，所述摄像组件还包括固定支架，所述电路板固定于所述固定支架，所述固定支架具有安装槽，所述摄像支架固定于所述安装槽。
  5. 如权利要求2所述的摄像组件，其特征在于，所述摄像组件还包括装饰件，所述装饰件位于所述接收模块的接收所述感应光信号的一侧，所述装饰件设有多个安装空间，所述接收模块和所述一个或多个摄像模组部分收容于所述多个安装空间，所述发射模块位于所述装饰件的周边。
  6. 如权利要求2至5中任一项所述的摄像组件，其特征在于，所述接收模块和所述一个或多个所述摄像模组在第一方向上排布，所述接收模块和所述发射模块在第二方向上排布，所述第二方向与所述第一方向相同，或者，所述第二方向垂直于所述第一方向。
  7. 如权利要求1至5中任一项所述的摄像组件，其特征在于，所述接收模块的接收轴与所述发射模块的发射轴之间的间距在0.5毫米至30毫米范围内。
  8. 如权利要求1至5中任一项所述的摄像组件，其特征在于，所述飞行时间模组还包括驱动芯片，所述驱动芯片固定于所述电路板背离所述发射模块的一侧，所述驱动芯片在所述电路板上的投影与所述发射模块在所述电路板上的投影部分重叠或全部重叠。
  9. 如权利要求1至5中任一项所述的摄像组件，其特征在于，所述发射模块包括基座、发射器及扩散板，所述基座形成发射腔，所述发射器用于发出所述检测光信号，所述发射器收容于所述发射腔且固定于所述基座，所述扩散板固定于所述基座且覆盖所述发射腔，所述扩散板用于增加所述检测光信号的视场角。
  10. 如权利要求9所述的摄像组件，其特征在于，所述基座采用氮化铝陶瓷材料。
  11. 如权利要求9所述的摄像组件，其特征在于，所述发射模块还包括连接胶，所述连接胶连接于所述基座与所述扩散板之间，所述连接胶设有一个或多个逃气孔，所述一个或多个逃气孔连通所述发射腔至所述发射模块的外部。
  12. 一种电子设备，其特征在于，包括控制器和权利要求1至11中任一项所述的摄像组件，所述控制器电连接所述电路板。
PCT/CN2019/122354 2018-12-24 2019-12-02 摄像组件及电子设备 WO2020134879A1 (zh)

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