WO2020133794A1 - 窄边框显示屏的制作方法及显示装置 - Google Patents

窄边框显示屏的制作方法及显示装置 Download PDF

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Publication number
WO2020133794A1
WO2020133794A1 PCT/CN2019/081932 CN2019081932W WO2020133794A1 WO 2020133794 A1 WO2020133794 A1 WO 2020133794A1 CN 2019081932 W CN2019081932 W CN 2019081932W WO 2020133794 A1 WO2020133794 A1 WO 2020133794A1
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Prior art keywords
substrate
layer
glass substrate
display
flexible substrate
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PCT/CN2019/081932
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English (en)
French (fr)
Inventor
尹炳坤
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Wuhan China Star Optoelectronics Technology Co Ltd
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Wuhan China Star Optoelectronics Technology Co Ltd
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Priority to US16/483,539 priority Critical patent/US11221529B2/en
Publication of WO2020133794A1 publication Critical patent/WO2020133794A1/zh
Anticipated expiration legal-status Critical
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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136222—Colour filters incorporated in the active matrix substrate
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device

Definitions

  • the present disclosure relates to the field of liquid crystal display, and in particular to a manufacturing method and display device of a narrow-frame display screen.
  • liquid crystal display devices Liquid Crystal Display, LCD
  • Plasma Display Plasma Display Panel, PDP
  • Electro Luminescence Display ELD
  • Vacuum Fluorescent Display VFD
  • the existing display device has the problems that the border of the non-display area is wider and the screen occupation is relatively small. Therefore, it is necessary to provide a manufacturing method and display device of a narrow-frame display screen to improve this defect.
  • the present disclosure provides a method for manufacturing a narrow-frame display screen and a display device, which are used to solve the problems that the existing existing display device has a wider frame and a smaller screen occupation.
  • the present disclosure provides a method for manufacturing a narrow bezel display, including:
  • Step S10 A first glass substrate is provided, the first glass substrate includes a display portion and a non-display portion, and a flexible substrate is coated on the non-display portion;
  • Step S20 heating and baking the flexible substrate to form a flexible substrate, the flexible substrate includes a bent portion and a non-bent portion;
  • Step S30 cutting and separating the portion of the non-display portion that is attached to the bent portion
  • Step S40 Bend the bent portion to the side or back of the first glass substrate.
  • the flexible substrate is elongated and arranged in an array on the first glass substrate.
  • the flexible substrate is polyimide.
  • the step S30 further includes:
  • Step S301 a thin film transistor layer and a first alignment layer are sequentially formed on the first glass substrate, the first glass substrate, the thin film transistor layer and the first alignment layer constitute an array substrate;
  • Step S302 Form a color filter layer and a second alignment layer on the second glass substrate in sequence, the second glass substrate, the color filter layer and the second alignment layer constitute a color filter substrate;
  • Step S303 apply frame glue coating, dripping liquid crystal and vacuum bonding process to the array substrate and the color film substrate to form a liquid crystal cell;
  • Step S304 forming a plurality of liquid crystal panels through the cutting, biasing and IC chip bonding processes of the liquid crystal cell;
  • Step S305 Cut and separate the portion of the first glass substrate that is attached to the bent portion.
  • the thin film transistor layer includes a buffer layer, a gate electrode layer, a silicon island layer, a source-drain electrode layer, a passivation protection layer, and a pixel electrode layer.
  • the present disclosure provides a display device including an array substrate and a color film substrate disposed oppositely.
  • the array substrate includes:
  • a first glass substrate, the first glass substrate includes a display portion and a non-display portion
  • a flexible substrate the flexible substrate includes a folded portion and a non-folded portion, the folded portion is configured to be folded to the side or back of the first glass substrate, and the non-folded portion is provided on the non-display portion;
  • a thin film transistor layer, the thin film transistor layer is provided on the first glass substrate and the flexible substrate;
  • An integrated circuit chip the integrated circuit chip is disposed on one end of the thin film transistor layer near the folded portion.
  • the flexible substrate is made of yellow polyimide.
  • the array substrate further includes a first buffer layer, and the first buffer layer is disposed between the first glass substrate and the thin film transistor layer.
  • the color filter substrate includes a second buffer layer, and the second buffer layer is disposed between the color filter layer and the second glass substrate.
  • the display device further includes a backlight module disposed on a side of the array substrate away from the color filter substrate.
  • the present disclosure provides a method for manufacturing a narrow bezel display, including:
  • Step S10 A first glass substrate is provided, the first glass substrate includes a display portion and a non-display portion, and a flexible substrate is coated on the non-display portion;
  • Step S20 heating and baking the flexible substrate to form a flexible substrate, the flexible substrate includes a bent portion and a non-bent portion;
  • Step S30 cutting and separating the portion of the non-display portion that is attached to the bent portion
  • Step S40 Bend the bent part to the side or back of the first glass substrate
  • the flexible substrate is long and polyimide.
  • the step S30 further includes:
  • Step S301 a thin film transistor layer and a first alignment layer are sequentially formed on the first glass substrate, the first glass substrate, the thin film transistor layer and the first alignment layer constitute an array substrate;
  • Step S302 Form a color filter layer and a second alignment layer on the second glass substrate in sequence, the second glass substrate, the color filter layer and the second alignment layer constitute a color filter substrate;
  • Step S303 apply frame glue coating, dripping liquid crystal and vacuum bonding process to the array substrate and the color film substrate to form a liquid crystal cell;
  • Step S304 forming a plurality of liquid crystal panels through the cutting, biasing and IC chip bonding processes of the liquid crystal cell;
  • Step S305 Cut and separate the portion of the first glass substrate that is attached to the bent portion.
  • the thin film transistor layer includes a buffer layer, a gate electrode layer, a silicon island layer, a source-drain electrode layer, a passivation protection layer, and a pixel electrode layer.
  • the embodiment of the present disclosure replaces the non-bendable glass substrate of the non-display portion of the first glass substrate and the integrated circuit chip with a bendable flexible substrate, and utilizes the bendability of the flexible substrate.
  • the bent portion of the flexible substrate and the integrated circuit chip connected to it are bent to the side or back of the glass substrate, thereby reducing the area of the non-display portion, thereby greatly increasing the screen ratio of the display portion of the display and display device.
  • FIG. 1 is a schematic flowchart of a manufacturing method provided by an embodiment of the present disclosure
  • FIG. 2 is a schematic flowchart of a manufacturing method provided by an embodiment of the disclosure
  • FIG. 3 is a schematic diagram of the arrangement of the flexible substrate on the first glass substrate provided by the embodiment of the disclosure.
  • FIG. 4 is a schematic structural diagram of a display device provided by an embodiment of the present disclosure.
  • FIG. 5 is a schematic structural diagram of a display device provided by an embodiment of the present disclosure.
  • FIG. 6 is a schematic structural diagram of a display device provided by an embodiment of the present disclosure.
  • the present disclosure provides a method for manufacturing a narrow-frame display screen, which will be described in detail below with reference to FIGS. 1 to 5.
  • FIG. 1 is a schematic flowchart of a manufacturing method according to an embodiment of the present disclosure. The method includes:
  • Step S10 As shown in FIG. 4, a first glass substrate 301 is provided.
  • the first glass substrate 301 includes a display portion 401 and non-display portions 402 disposed on both sides of the display portion 401. Coated with a flexible substrate 302;
  • Step S20 heating and baking the flexible substrate 302 to form a flexible substrate 403, the flexible substrate 403 includes a bent portion 404 and a non-bent portion 405;
  • Step S30 As shown in FIG. 5, cut and separate the portion of the non-display portion 402 that is attached to the bent portion 404;
  • Step S40 Bend the bent portion 404 to the side or back of the first glass substrate 301.
  • step S30 further includes:
  • Step S301 A thin film transistor layer 406 and a first alignment layer (not shown in the figure) are sequentially formed on the first glass substrate 301, the first glass substrate 301 and the thin film transistor layer 406 and the first The alignment layer constitutes the array substrate 412;
  • Step S302 Form a color filter layer 409 and a second alignment layer (not shown) in sequence on the second glass substrate 410, the second glass substrate 410, the color filter layer 409 and the second The alignment layer constitutes the color film substrate 413;
  • Step S303 Perform a sealant coating process, a drop-in liquid crystal process and a vacuum bonding process on the array substrate 412 and the color film substrate 413 in sequence to form a liquid crystal cell; wherein the liquid crystal layer 408 is located on the array substrate Between 412 and the color filter substrate 413, the sealant 407 is located on both sides of the liquid crystal layer 408;
  • Step S304 forming a plurality of liquid crystal panels by cutting, biasing, and attaching integrated circuit chips to the liquid crystal cell;
  • Step S305 Cut and separate the portion of the non-display portion 402 that is attached to the bent portion 404.
  • the flexible substrate 302 is long and arranged in an array on the first glass substrate 301.
  • the flexible substrate 302 is made of polyimide.
  • yellow polyimide or other high temperature resistant polymer materials may also be used.
  • the thin film transistor layer includes a buffer layer, a gate electrode layer, a silicon island layer, a source-drain electrode layer, a passivation protection layer, and a pixel electrode layer (neither of which is shown in the figure).
  • the display device includes an array substrate 412 and a color film substrate 413 disposed oppositely.
  • the array substrate 412 includes:
  • a first glass substrate 301, the first glass substrate 301 includes a display portion 401 and non-display portions 402 disposed on both sides of the display portion 401;
  • a thin film transistor layer 406 disposed on the first glass substrate 301 and the flexible substrate 403;
  • An integrated circuit chip 411 which is disposed on the thin film transistor layer 406 near one end of the folded portion 404.
  • the thin film transistor layer 406 and the integrated circuit chip 411 on the folded portion 404 are folded to the side of the first glass substrate 301 along with the folded portion 404 of the flexible substrate 403.
  • the flexible substrate 403 is made of polyimide.
  • yellow polyimide or other high temperature resistant polymer materials may also be used.
  • the array substrate 412 further includes a first buffer layer (not shown in the figure), and the first buffer layer is disposed between the first glass substrate 301 and the thin film transistor layer 406.
  • the color filter substrate 413 includes a second buffer layer (not shown in the figure), and the second buffer layer is disposed between the color filter layer 409 and the second glass substrate 410.
  • the display device further includes a backlight module (not shown in the figure), and the backlight module is disposed on a side of the array substrate 412 away from the color filter substrate 413.
  • the display device includes an array substrate 613 and a color film substrate 614 disposed oppositely.
  • the array substrate 613 includes:
  • a first glass substrate 601, the first glass substrate 601 includes a display portion 602 and non-display portions 603 disposed on both sides of the display portion 602;
  • a flexible substrate 604, the flexible substrate 604 includes a folded portion 605 and a non-folded portion 606, the folded portion 605 can be folded to the back of the first glass substrate 601 through the side of the first glass substrate 601, the non-folded portion 606 is disposed on the non-display portion 603 of the first glass substrate 601;
  • a thin film transistor layer 607, the thin film transistor layer 607 is disposed on the first glass substrate 601 and the flexible substrate 604;
  • An integrated circuit chip 612 which is disposed on the thin film transistor layer 607 near one end of the folded portion 605.
  • the thin film transistor layer 607 on the folded portion 605 and the integrated circuit chip 612 provided on the thin film transistor layer 607 are folded together with the folded portion 605 of the flexible substrate 604 to the The back of the first glass substrate 601.
  • the flexible substrate 604 is made of polyimide.
  • yellow polyimide or other high temperature resistant polymer materials may also be used.
  • the array substrate 613 further includes a first buffer layer (not shown in the figure), and the first buffer layer is disposed between the first glass substrate 601 and the thin film transistor layer 607.
  • the color filter substrate 614 includes a second buffer layer (not shown in the figure), and the second buffer layer is disposed between the color filter layer 610 and the second glass substrate 611.
  • the display device further includes a backlight module (not shown in the figure), and the backlight module is disposed on the side of the array substrate 613 away from the color filter substrate 614.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本申请通过将第一玻璃基板非显示部分与集成电路芯片连接部分的不可弯折的玻璃基板替换成可弯折的柔性基板，并将柔性基板弯折部分以及与其连接的集成电路芯片弯折至玻璃基板的侧面或背面，以此减小了非显示部分的面积，从而大幅提升显示部分的屏占比。

Description

窄边框显示屏的制作方法及显示装置 技术领域
本揭示涉及液晶显示领域，尤其涉及一种窄边框显示屏的制作方法及显示装置。
 背景技术
随着全球信息社会的兴起增加了对各种显示装置的需求。因此，对各种平面显示装置的研究和开发投入了很大的努力，如液晶显示装置(Liquid Crystal Display, LCD)、等离子显示装置(Plasma Display Panel,PDP)、场致发光显示装置(Electro Luminescence Display, ELD)以及真空荧光显示装置(Vacuum Fluorescent Display, VFD)。
在显示装置普及的同时，用户不仅对显示装置所具备的功能种类和性能要求越来越高，而且用户对显示装置的外观上的要求也越来越高，显示装置的轻薄化以及窄边框等条件也越来越多成为用于选择的显示装置的因素。
然而，现有的显示装置中，由于各种驱动模组和电路板需要与显示面板进行绑定连接，显示面板上需要预留出足够的非显示区域以进行线路绑定，导致显示面板的非显示区域始终较大，不利于显示装置窄边框化。
综上所述，现有显示装置存在非显示区域边框较宽，屏占比较小的问题。故，有必要提供一种窄边框显示屏的制作方法及显示装置来改善这一缺陷。
 技术问题
现有的显示装置中，由于各种驱动模组和电路板需要与显示面板进行绑定连接，显示面板上需要预留出足够的非显示区域以进行线路绑定，导致显示面板的非显示区域始终较大，不利于显示装置窄边框化。
 技术解决方案
本揭示提供一种窄边框显示屏的制作方法及显示装置，用于解决现有现有显示装置边框较宽，屏占比较小的问题。
本揭示提供一种窄边框显示屏的制作方法，包括:
步骤S10：提供第一玻璃基板，所述第一玻璃基板包括显示部分和非显示部分，在所述非显示部分上涂布柔性基材；
步骤S20：加热烘烤所述柔性基材，形成柔性基板，所述柔性基板包括弯折部分和非弯折部分；
步骤S30：将所述非显示部分上与所述弯折部分贴合的部分进行切割分离；以及
步骤S40：将所述弯折部分弯折至所述第一玻璃基板的侧面或背面。
根据本揭示一实施例，所述柔性基材为长条状，并且在所述第一玻璃基板上阵列排布。
根据本揭示一实施例，所述柔性基材为聚酰亚胺。
根据本揭示一实施例，所述步骤S30还包括：
步骤S301：在所述第一玻璃基板上依次形成薄膜晶体管层以及第一配向层，所述第一玻璃基板、所述薄膜晶体管层以及所述第一配向层构成阵列基板；
步骤S302：在第二玻璃基板上依次形成彩色滤光层以及第二配向层，所述第二玻璃基板、所述彩色滤光层以及所述第二配向层构成彩膜基板；
步骤S303：对所述阵列基板和所述彩膜基板进行框胶涂布、滴入液晶以及真空贴合工艺，形成液晶盒；
步骤S304：将所述液晶盒通过切割、偏贴以及集成电路芯片贴合工艺，形成多个液晶面板；以及
步骤S305：将所述第一玻璃基板上与所述弯折部分贴合的部分进行切割分离。
根据本揭示一实施例，所述薄膜晶体管层包括缓冲层、栅电极层、硅岛层、源漏电极层、钝化保护层以及像素电极层。
本揭示提供一种显示装置，包括阵列基板和相对设置的彩膜基板，所述阵列基板包括：
第一玻璃基板，所述第一玻璃基板包括显示部分和非显示部分；
柔性基板，所述柔性基板包括折叠部分和非折叠部分，所述折叠部分配置成折叠至所述第一玻璃基板侧面或背面，所述非折叠部分设置于所述非显示部分上；
薄膜晶体管层，所述薄膜晶体管层设置于所述第一玻璃基板以及所述柔性基板上；以及
集成电路芯片，所述集成电路芯片设置于所述薄膜晶体管层上靠近所述折叠部分一端。
根据本揭示一实施例，所述柔性基板材质为黄色聚酰亚胺。
根据本揭示一实施例，所述阵列基板还包括第一缓冲层，所述第一缓冲层设置于所述第一玻璃基板与所述薄膜晶体管层之间。
根据本揭示一实施例，所述彩膜基板包括第二缓冲层，所述第二缓冲层设置于所述彩色滤光层与所述第二玻璃基板之间。
根据本揭示一实施例，所述显示装置还包括背光模组，所述背光模组设置于所述阵列基板远离所述彩膜基板一侧。
本揭示提供一种窄边框显示屏的制作方法，包括:
步骤S10：提供第一玻璃基板，所述第一玻璃基板包括显示部分和非显示部分，在所述非显示部分上涂布柔性基材；
步骤S20：加热烘烤所述柔性基材，形成柔性基板，所述柔性基板包括弯折部分和非弯折部分；
步骤S30：将所述非显示部分上与所述弯折部分贴合的部分进行切割分离；以及
步骤S40：将所述弯折部分弯折至所述第一玻璃基板的侧面或背面；
其中，所述柔性基材为长条状且为聚酰亚胺。
根据本揭示一实施例，所述步骤S30还包括：
步骤S301：在所述第一玻璃基板上依次形成薄膜晶体管层以及第一配向层，所述第一玻璃基板、所述薄膜晶体管层以及所述第一配向层构成阵列基板；
步骤S302：在第二玻璃基板上依次形成彩色滤光层以及第二配向层，所述第二玻璃基板、所述彩色滤光层以及所述第二配向层构成彩膜基板；
步骤S303：对所述阵列基板和所述彩膜基板进行框胶涂布、滴入液晶以及真空贴合工艺，形成液晶盒；
步骤S304：将所述液晶盒通过切割、偏贴以及集成电路芯片贴合工艺，形成多个液晶面板；以及
步骤S305：将所述第一玻璃基板上与所述弯折部分贴合的部分进行切割分离。
根据本揭示一实施例，所述薄膜晶体管层包括缓冲层、栅电极层、硅岛层、源漏电极层、钝化保护层以及像素电极层。
 有益效果
本揭示的有益效果：本揭示实施例通过将第一玻璃基板的非显示部分与集成电路芯片连接部分的不可弯折的玻璃基板替换成可弯折的柔性基板，并利用柔性基板的可弯折特性将柔性基板弯折部分以及与其连接的集成电路芯片弯折至玻璃基板的侧面或背面，以此减小了非显示部分的面积，从而大幅提升显示屏以及显示装置显示部分的屏占比。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是揭示的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本揭示实施例提供的制作方法的流程示意图；
图2为本揭示实施例提供的制作方法的流程示意图；
图3为本揭示实施例提供的柔性基材在第一玻璃基板上的排布示意图；
图4为本揭示实施例提供的显示装置的结构示意图；
图5为本揭示实施例提供的显示装置的结构示意图；
图6为本揭示实施例提供的显示装置的结构示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
下面结合附图和具体实施例对本揭示做进一步的说明：
实施例一
本揭示提供了一种窄边框显示屏的制作方法，下面结合图1至图5进行详细说明。
如图1所示，图1为本揭示实施例提供的制作方法的流程示意图，所述方法包括：
步骤S10：如图4所示，提供第一玻璃基板301，所述第一玻璃基板301包括显示部分401和设置于所述显示部分401两侧的非显示部分402，在所述非显示部分402上涂布柔性基材302；
步骤S20：加热烘烤所述柔性基材302，形成柔性基板403，所述柔性基板403包括弯折部分404和非弯折部分405；
步骤S30：如图5所示，将所述非显示部分402上与所述弯折部分404贴合的部分进行切割分离；
步骤S40：将所述弯折部分404弯折至所述第一玻璃基板301的侧面或背面。
在本实施例中，所述步骤S30还包括：
步骤S301：在所述第一玻璃基板301上依次形成薄膜晶体管层406以及第一配向层（图中未示出），所述第一玻璃基板301与所述薄膜晶体管层406以及所述第一配向层构成阵列基板412；
步骤S302：在第二玻璃基板410上依次形成彩色滤光层409以及第二配向层（图中未示出），所述第二玻璃基板410、所述彩色滤光层409以及所述第二配向层构成彩膜基板413；
步骤S303：对所述阵列基板412和所述彩膜基板413依次进行框胶涂布工艺、滴入液晶工艺以及真空贴合工艺，形成液晶盒；其中，所述液晶层408位于所述阵列基板412和所述彩膜基板413之间，所述框胶407位于所述液晶层408两侧；
步骤S304：将所述液晶盒通过切割、偏贴以及集成电路芯片贴合工艺，形成多个液晶面板；
步骤S305：将所述非显示部分402上与所述弯折部分404贴合的部分进行切割分离。
优选的，如图3所示，所述柔性基材302为长条状，并且在所述第一玻璃基板301上呈阵列排布。
优选的，所述柔性基材302材质为聚酰亚胺，为获得更加良好的力学性能和耐热性能还可以选用黄色聚酰亚胺或其他耐高温聚合物材料。
优选的，所述薄膜晶体管层包括缓冲层、栅电极层、硅岛层、源漏电极层、钝化保护层以及像素电极层（图中均未示出）。
实施例二
本实施例提供一种显示装置，如图5所示，所述显示装置包括阵列基板412和相对设置的彩膜基板413，所述阵列基板412包括：
第一玻璃基板301，所述第一玻璃基板301包括显示部分401和设置于所述显示部分401两侧的非显示部分402；
柔性基板403，所述柔性基板403包括折叠部分404和非折叠部分405，所述折叠部分404配置成折叠至所述第一玻璃基板301侧面，所述非折叠部分405设置于所述第一玻璃基板301的非显示部分402上；
薄膜晶体管层406，所述薄膜晶体管层406设置于所述第一玻璃基板301以及所述柔性基板403上；以及
集成电路芯片411，所述集成电路芯片411设置于所述薄膜晶体管层406上靠近所述折叠部分404一端。
在本实施例中，将位于所述折叠部分404上的薄膜晶体管层406以及集成电路芯片411跟随所述柔性基板403的折叠部分404一起折叠至所述第一玻璃基板301的侧面。
优选的，所述柔性基板403材质为聚酰亚胺,为获得更加良好的力学性能和耐热性能还可以选用黄色聚酰亚胺或其他耐高温聚合物材料。
优选的，所述阵列基板412还包括包括第一缓冲层（图中未示出），所述第一缓冲层设置于所述第一玻璃基板301与所述薄膜晶体管层406之间。
优选的，所述彩膜基板413包括第二缓冲层（图中未示出），所述第二缓冲层设置于所述彩色滤光层409与所示第二玻璃基板410之间。
优选的，所述显示装置还包括背光模组（图中未示出），所述背光模组设置于所述阵列基板412远离所述彩膜基板413一侧。
实施例三
本实施例提供一种显示装置，如图6所示，所述显示装置包括阵列基板613和相对设置的彩膜基板614，所述阵列基板613包括：
第一玻璃基板601，所述第一玻璃基板601包括显示部分602和设置于所述显示部分602两侧的非显示部分603；
柔性基板604，所述柔性基板604包括折叠部分605和非折叠部分606，所述折叠部分605可以经过所述第一玻璃基板601侧面折叠至所述第一玻璃基板601背面，所述非折叠部分606设置于所述第一玻璃基板601的非显示部分603上；
薄膜晶体管层607，所述薄膜晶体管层607设置于所述第一玻璃基板601以及所述柔性基板604上；以及
集成电路芯片612，所述集成电路芯片612设置于所述薄膜晶体管层607上靠近所述折叠部分605一端。
在本实施例中，通过将位于所述折叠部分605上的薄膜晶体管层607以及设置于所述薄膜晶体管层607上的集成电路芯片612跟随所述柔性基板604的折叠部分605一起折叠至所述第一玻璃基板601的背面。
优选的，所述柔性基板604材质为聚酰亚胺,为获得更加良好的力学性能和耐热性能还可以选用黄色聚酰亚胺或其他耐高温聚合物材料。
优选的，所述阵列基板613还包括第一缓冲层（图中未示出），所述第一缓冲层设置于所述第一玻璃基板601与所述薄膜晶体管层607之间。
优选的，所述彩膜基板614包括第二缓冲层（图中未示出），所述第二缓冲层设置于所述彩色滤光层610与所示第二玻璃基板611之间。
优选的，所述显示装置还包括背光模组（图中未示出），所述背光模组设置于所述阵列基板613远离所述彩膜基板614一侧。
本揭示实施例通过将第一玻璃基板非显示部分与集成电路芯片连接部分不可弯折的玻璃基板替换成可弯折的柔性基板，并利用柔性基板的可弯折特性将柔性基板弯折部分以及与其连接的集成电路芯片弯折至玻璃基板的侧面或背面，以此减小了非显示部分的面积，从而大幅提升显示屏以及显示装置显示部分的屏占比。
综上所述，虽然本揭示以优选实施例揭露如上，但上述优选实施例并非用以限制本揭示，本领域的普通技术人员，在不脱离本揭示的精神和范围内，均可作各种更动与润饰，因此本揭示的保护范围以权利要求界定的范围为基准。

Claims (13)

  1. 一种窄边框显示屏的制作方法，包括:
    步骤S10：提供第一玻璃基板，所述第一玻璃基板包括显示部分和非显示部分，在所述非显示部分上涂布柔性基材；
    步骤S20：加热烘烤所述柔性基材，形成柔性基板，所述柔性基板包括弯折部分和非弯折部分；
    步骤S30：将所述非显示部分上与所述弯折部分贴合的部分进行切割分离；以及
    步骤S40：将所述弯折部分弯折至所述第一玻璃基板的侧面或背面。
  2. 如权利要求1所述的制作方法，其中，所述柔性基材为长条状，并且在所述第一玻璃基板上阵列排布。
  3. 如权利要求2所述的制作方法，其中，所述柔性基材为聚酰亚胺。
  4. 如权利要求1所述的制作方法，其中，所述步骤S30还包括：
    步骤S301：在所述第一玻璃基板上依次形成薄膜晶体管层以及第一配向层，所述第一玻璃基板、所述薄膜晶体管层以及所述第一配向层构成阵列基板；
    步骤S302：在第二玻璃基板上依次形成彩色滤光层以及第二配向层，所述第二玻璃基板、所述彩色滤光层以及所述第二配向层构成彩膜基板；
    步骤S303：对所述阵列基板和所述彩膜基板进行框胶涂布、滴入液晶以及真空贴合工艺，形成液晶盒；
    步骤S304：将所述液晶盒通过切割、偏贴以及集成电路芯片贴合工艺，形成多个液晶面板；以及
    步骤S305：将所述第一玻璃基板上与所述弯折部分贴合的部分进行切割分离。
  5. 如权利要求4所述的制作方法，其中，所述薄膜晶体管层包括缓冲层、栅电极层、硅岛层、源漏电极层、钝化保护层以及像素电极层。
  6. 一种显示装置，包括阵列基板和相对设置的彩膜基板，所述阵列基板包括：
    第一玻璃基板，所述第一玻璃基板包括显示部分和非显示部分；
    柔性基板，所述柔性基板包括折叠部分和非折叠部分，所述折叠部分配置成折叠至所述第一玻璃基板侧面或背面，所述非折叠部分设置于所述非显示部分上；
    薄膜晶体管层，所述薄膜晶体管层设置于所述第一玻璃基板以及所述柔性基板上；以及
    集成电路芯片，所述集成电路芯片设置于所述薄膜晶体管层上靠近所述折叠部分一端。
  7. 如权利要求6所述的显示装置，其中，所述柔性基板材质为黄色聚酰亚胺。
  8. 如权利要求6所述的显示装置，其中，所述阵列基板还包括第一缓冲层，所述第一缓冲层设置于所述第一玻璃基板与所述薄膜晶体管层之间。
  9. 如权利要求8所述的显示装置，其中，所述彩膜基板包括第二缓冲层，所述第二缓冲层设置于所述彩色滤光层与所述第二玻璃基板之间。
  10. 如权利要求6所述的显示装置，其中，所述显示装置还包括背光模组，所述背光模组设置于所述阵列基板远离所述彩膜基板一侧。
  11. 一种窄边框显示屏的制作方法，包括:
    步骤S10：提供第一玻璃基板，所述第一玻璃基板包括显示部分和非显示部分，在所述非显示部分上涂布柔性基材；
    步骤S20：加热烘烤所述柔性基材，形成柔性基板，所述柔性基板包括弯折部分和非弯折部分；
    步骤S30：将所述非显示部分上与所述弯折部分贴合的部分进行切割分离；以及
    步骤S40：将所述弯折部分弯折至所述第一玻璃基板的侧面或背面；
    其中，所述柔性基材为长条状且为聚酰亚胺。
  12. 如权利要求11所述的制作方法，其中，所述步骤S30还包括：
    步骤S301：在所述第一玻璃基板上依次形成薄膜晶体管层以及第一配向层，所述第一玻璃基板、所述薄膜晶体管层以及所述第一配向层构成阵列基板；
    步骤S302：在第二玻璃基板上依次形成彩色滤光层以及第二配向层，所述第二玻璃基板、所述彩色滤光层以及所述第二配向层构成彩膜基板；
    步骤S303：对所述阵列基板和所述彩膜基板进行框胶涂布、滴入液晶以及真空贴合工艺，形成液晶盒；
    步骤S304：将所述液晶盒通过切割、偏贴以及集成电路芯片贴合工艺，形成多个液晶面板；以及
    步骤S305：将所述第一玻璃基板上与所述弯折部分贴合的部分进行切割分离。
  13. 如权利要求12所述的制作方法，其中，所述薄膜晶体管层包括缓冲层、栅电极层、硅岛层、源漏电极层、钝化保护层以及像素电极层。
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