WO2020124815A1 - 显示器封装结构及其制造方法 - Google Patents
显示器封装结构及其制造方法 Download PDFInfo
- Publication number
- WO2020124815A1 WO2020124815A1 PCT/CN2019/078046 CN2019078046W WO2020124815A1 WO 2020124815 A1 WO2020124815 A1 WO 2020124815A1 CN 2019078046 W CN2019078046 W CN 2019078046W WO 2020124815 A1 WO2020124815 A1 WO 2020124815A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- light
- cover plate
- film layer
- substrate
- Prior art date
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 53
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 38
- 239000010409 thin film Substances 0.000 claims abstract description 25
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical group O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 68
- 239000000758 substrate Substances 0.000 claims description 58
- 239000010408 film Substances 0.000 claims description 50
- 238000007789 sealing Methods 0.000 claims description 41
- 238000005538 encapsulation Methods 0.000 claims description 40
- 239000004408 titanium dioxide Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 28
- 239000002904 solvent Substances 0.000 claims description 16
- 229920006280 packaging film Polymers 0.000 claims description 15
- 239000012785 packaging film Substances 0.000 claims description 15
- 239000002243 precursor Substances 0.000 claims description 15
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 10
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 10
- 239000002274 desiccant Substances 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 239000013039 cover film Substances 0.000 claims description 8
- 238000005137 deposition process Methods 0.000 claims description 6
- 238000001523 electrospinning Methods 0.000 claims description 6
- 230000000717 retained effect Effects 0.000 claims description 6
- 239000002270 dispersing agent Substances 0.000 claims description 5
- 239000003995 emulsifying agent Substances 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000000231 atomic layer deposition Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
Definitions
- the invention relates to a display packaging structure and a manufacturing method thereof, in particular to a display packaging structure and a manufacturing method thereof to improve luminous efficiency.
- OLEDs organic light-emitting diodes
- the packaging structure of the organic light emitting diode is usually carried out by thin film packaging.
- ultraviolet curing frame glue and an atomic layer deposition film layer are finally formed for overall comprehensive packaging, so that the inside of the display device is completely isolated from the outside.
- a film layer will be formed on the side and upper surfaces of the entire panel. Therefore, a film layer is also deposited on the light exit surface of the display panel. This part of the film layer will have a certain effect on the appearance or light output of the display panel.
- the present invention provides a display packaging structure and a manufacturing method thereof, to solve the problem of the existing technology of the light emitting surface of the display panel due to the deposited film layer affecting the appearance or light output of the display panel.
- the main object of the present invention is to provide a display packaging structure and a manufacturing method thereof, which can improve the problem of the appearance of the display panel or the light output caused by the deposited film layer on the light exit surface of the display panel.
- the secondary object of the present invention is to provide a display packaging structure and a manufacturing method thereof, which can be provided on a transparent cover of a display panel by providing a sacrificial layer, and when removing the sacrificial layer, a And remove the encapsulating film layer provided on the transparent cover plate, and retain the encapsulating film layer on one side of the display device and one side of the transparent cover plate, so as to avoid the encapsulating film layer from affecting the light output efficiency, thereby Improve the luminous efficiency of the display panel including the display packaging structure.
- an embodiment of the present invention provides a method for manufacturing a display package structure, including steps:
- a display device package is provided, wherein the display device package includes:
- a plurality of light-emitting elements arranged on the substrate;
- An encapsulation layer disposed on the substrate, and encapsulating the plurality of light-emitting elements
- the sacrificial layer is removed to expose the light-transmitting cover plate, and the encapsulating film layer on the side of the display device package and the side of the light-transmitting cover plate remains.
- the encapsulating film layer is continuously disposed on a first side of the substrate, a second side of the sealing layer, a third side of the transparent cover plate and Describe an upper surface of the sacrificial layer;
- the encapsulation film layer provided on the upper surface of the sacrificial layer is removed together, and the first side of the substrate and the sealing layer are retained.
- the encapsulating film layer of the second side and the third side of the light-transmitting cover plate is removed.
- the encapsulation film layer is formed by an atomic deposition process.
- the sacrificial layer is a titanium dioxide thin film layer, wherein the titanium dioxide thin film layer is formed by a screen electrospinning process.
- the titanium dioxide thin film layer is formed by a titanium dioxide precursor solution, wherein the titanium dioxide precursor solution includes a solvent, an emulsifier, and a dispersant, wherein the solvent is selected from the group consisting of The group: water, ethanol and isopropanol; and a solid content of the titanium dioxide precursor solution accounts for 20% to 40% of the entire volume.
- the titanium dioxide precursor solution includes a solvent, an emulsifier, and a dispersant, wherein the solvent is selected from the group consisting of The group: water, ethanol and isopropanol; and a solid content of the titanium dioxide precursor solution accounts for 20% to 40% of the entire volume.
- the method for manufacturing a display package structure further includes:
- the sacrificial layer is torn off along the interface of the light-transmissive cover plate and the sacrificial layer.
- the transparent cover plate includes a cover film layer, when the sacrificial layer is torn along the interface between the transparent cover plate and the sacrificial layer, the The cover film layer is torn away with the sacrificial layer.
- Another method for manufacturing a display packaging structure according to another embodiment of the present invention includes the steps of:
- the light-transmitting cover plate being disposed on the display device package
- the sacrificial layer is removed to expose the light-transmitting cover plate, and the encapsulating film layer on the side of the display device package and the side of the light-transmitting cover plate remains.
- the display device package includes:
- a plurality of light-emitting elements are provided on the substrate;
- An encapsulation layer disposed on the substrate, and encapsulating the plurality of light-emitting elements
- a sealing layer disposed on the substrate and around the packaging layer, wherein the light-transmitting cover plate is disposed on the packaging layer and the sealing layer;
- a desiccant layer is provided in a space between the substrate, the sealing layer and the light-transmitting cover plate, and covers the encapsulation layer.
- the encapsulating film layer is continuously disposed on a first side of the substrate, a second side of the sealing layer, a third side of the transparent cover plate and Describe an upper surface of the sacrificial layer;
- the encapsulation film layer provided on the upper surface of the sacrificial layer is removed together, and the first side of the substrate and the sealing layer are retained.
- the encapsulating film layer of the second side and the third side of the light-transmitting cover plate is removed.
- the encapsulation film layer is formed by an atomic deposition process.
- the sacrificial layer is a titanium dioxide thin film layer, wherein the titanium dioxide thin film layer is formed by a screen electrospinning process.
- the titanium dioxide thin film layer is formed by a titanium dioxide precursor solution, wherein the titanium dioxide precursor solution includes a solvent, an emulsifier, and a dispersant, wherein the solvent is selected from the group consisting of The group: water, ethanol and isopropanol; and a solid content of the titanium dioxide precursor solution accounts for 20% to 40% of the entire volume.
- the titanium dioxide precursor solution includes a solvent, an emulsifier, and a dispersant, wherein the solvent is selected from the group consisting of The group: water, ethanol and isopropanol; and a solid content of the titanium dioxide precursor solution accounts for 20% to 40% of the entire volume.
- a thickness of the titanium dioxide thin film layer is 5 microns to 10 microns, and a thickness of the encapsulating thin film layer is 0.5 microns to 10 microns.
- the method for manufacturing a display package structure further includes:
- the sacrificial layer is torn off along the interface of the light-transmissive cover plate and the sacrificial layer.
- the transparent cover plate includes a cover film layer, when the sacrificial layer is torn along the interface between the transparent cover plate and the sacrificial layer, the The cover film layer is torn away with the sacrificial layer.
- another embodiment of the present invention further provides a display package structure, which is manufactured by the above-mentioned display package structure manufacturing method.
- a display packaging structure including:
- a packaging film layer is disposed on one side of the display device package and one side of the light-transmitting cover plate, and exposes an upper surface of the light-transmitting cover plate.
- the display device package includes:
- a plurality of light-emitting elements are provided on the substrate;
- An encapsulation layer disposed on the substrate, and encapsulating the plurality of light-emitting elements
- a sealing layer disposed on the substrate and around the packaging layer, wherein the light-transmitting cover plate is disposed on the packaging layer and the sealing layer;
- a desiccant layer is provided in a space between the substrate, the sealing layer and the light-transmitting cover plate, and covers the encapsulation layer.
- the packaging film layer is continuously disposed on a first side of the substrate, a second side of the sealing layer, and a third side of the light-transmitting cover plate.
- the packaging film layer is not provided on the upper surface of the light-transmitting cover plate.
- the display packaging structure and the manufacturing method of the present invention can be provided on a transparent cover of a display panel by providing a sacrificial layer, and when removing the sacrificial layer, Remove the encapsulating film layer provided on the light-transmitting cover plate, and keep the encapsulating film layer on one side of the display device and one side of the light-transmitting cover plate, so as to improve the light output of the display panel to face the display panel
- the effect of the appearance or the light output of the light source is to prevent the packaging film layer from affecting the light output efficiency, thereby improving the luminous efficiency of the display panel including the display packaging structure.
- FIG. 1 is a schematic block diagram of a method for manufacturing a display package structure according to an embodiment of the present invention.
- 2A-2D are schematic flow charts of a display packaging structure according to an embodiment of the invention.
- an embodiment of the present invention provides a display packaging structure and a manufacturing method thereof.
- the manufacturing method of the display packaging structure includes the steps of: (S11) providing a display device package 20 and a light-transmitting cover plate 21, the light-transmitting cover plate 21 is disposed on the display device package 20; (S12) providing A sacrificial layer 22 is provided on the light-transmitting cover plate 21; (S13) provides a packaging film layer 23, which is provided on one side of the display device package 20 and one side of the light-transmitting cover plate 21 And an upper surface of the sacrificial layer 22; and (S14) removing the sacrificial layer 22 to expose the light-transmitting cover plate 21, and retaining the side surface of the display device package 20 and The encapsulating film layer 23 on the side of the light-transmitting cover plate 21.
- the display device package 20 includes a substrate 201, a plurality of light emitting elements 202, a packaging layer 203, and a sealing layer 204.
- the plurality of light-emitting elements 202 are provided on the substrate 201.
- the encapsulation layer 203 is disposed on the substrate 201 and encapsulates the plurality of light emitting elements 202.
- the sealing layer 204 is disposed on the substrate 201 and around the encapsulation layer 203, wherein the light-transmitting cover plate 21 is disposed on the encapsulation layer 203 and the sealing layer 204.
- the display device package 20 further includes a desiccant layer 205 disposed in a space between the substrate 201, the sealing layer 204, and the light-transmitting cover plate 21, and covering the Encapsulation layer 203.
- the substrate 201 is a flexible substrate, such as a polyimide substrate.
- the plurality of light-emitting elements 202 are a plurality of OLED light-emitting elements or alternatively a plurality of thin-film transistor elements, which are provided on the substrate 201.
- the encapsulation layer 203 may be an organic encapsulation layer, an inorganic encapsulation layer, or an organic encapsulation layer and an inorganic encapsulation layer stacked in sequence to encapsulate the plurality of light-emitting elements 202, thereby blocking water and oxygen from the plurality of light-emitting elements 202 Impact.
- the sealing layer 204 may be an ultraviolet curable glue or glass glue.
- the sealing layer 204 is a sealant frame, which is disposed in a non-display area around the plurality of light-emitting elements 202 and surrounds the plurality of light-emitting elements 202.
- the desiccant layer 205 is a filled colloid, which fills the space between the substrate 201, the sealing layer 204 and the light-transmitting cover plate 21.
- a plurality of desiccant particles are provided in the filled colloid to protect the plurality of light emitting elements 202 from being damaged by water and oxygen.
- a sacrificial layer 22 is provided, which is disposed on the transparent cover plate 21.
- the sacrificial layer 22 is a titanium dioxide film layer, wherein the titanium dioxide film layer is formed by a screen electrospinning process.
- the titania thin film layer is formed by a titania precursor solution, wherein the titania precursor solution includes a solvent, an emulsifier, and a dispersant, where the solvent may be a polar solvent.
- the solvent may be selected from the group consisting of water, ethanol, and isopropanol.
- a solid content of the titanium dioxide precursor solution accounts for 20% to 40% of the entire volume.
- a thickness of the titanium dioxide thin film layer is 5 microns to 10 microns.
- the titanium dioxide thin film layer formed by the wire mesh electrospinning process has a voltage of 10 kV to 30 kV.
- the sacrificial layer 22 has been provided on the light-transmitting cover plate 21 in advance.
- a packaging film layer 23 disposed on a side of the display device package 20, a side of the transparent cover 21 and the sacrificial layer 22 The upper surface of the.
- the packaging film layer 23 is continuously disposed on a first side 201A of the substrate 201, a second side 204A of the sealing layer 204, a third side 21A of the light-transmitting cover plate 21 and the An upper surface of the sacrificial layer 22.
- a thickness of the encapsulating film layer 23 is 0.5 microns to 10 microns.
- the encapsulating thin film layer 23 is formed using an atomic deposition process.
- the material of the encapsulating film layer 23 is aluminum oxide.
- the sacrificial layer 22 is removed to expose the light-transmitting cover plate 21, and the side and the transparent of the display device package 20 are retained
- the encapsulating film layer 23 provided on the upper surface of the sacrificial layer 22 is removed together, and the first side 201A of the substrate 201 remains.
- the sacrificial layer 22 is removed by using a hydrophilic solvent to infiltrate from an edge at an interface between the transparent cover 21 and the sacrificial layer 22 and along The sacrificial layer 22 is torn off at the interface between the transparent cover 21 and the sacrificial layer 22.
- the display packaging structure includes: a display device package 20 and a light-transmitting cover plate 21, the light-transmitting cover plate 21 is disposed on the display device package 20; a packaging film layer 23 is disposed on the display A side surface of the device package 20 and a side surface of the transparent cover plate 21 expose an upper surface of the transparent cover plate 21.
- the encapsulating thin film layer 23 is formed using an atomic deposition process.
- a thickness of the encapsulating film layer 23 is 0.5 ⁇ m to 10 ⁇ m.
- the display device package 20 includes: a substrate 201; a plurality of light emitting elements 202 disposed on the substrate 201; and a packaging layer 203 disposed on the substrate 201 and encapsulating the plurality Light emitting element 202; a sealing layer 204, disposed on the substrate 201 and around the packaging layer 203, wherein the light-transmitting cover plate 21 is disposed on the packaging layer 203 and the sealing layer 204; and a dry
- the agent layer 205 is disposed in a space between the substrate 201, the sealing layer 204, and the light-transmitting cover plate 21, and covers the encapsulation layer 203.
- the encapsulating film layer 23 is continuously disposed on a first side 201A of the substrate 201, a second side 204A of the sealing layer 204, and a third side 21A of the light-transmitting cover plate 21.
- the encapsulating film layer 23 is not provided on the upper surface of the light-transmitting cover plate 21.
- the display packaging structure and manufacturing method of the present invention provide a sacrificial layer on the light-transmitting cover of the display panel, and when the sacrificial layer is removed, the light-transmitting cover is also removed.
- the encapsulation film layer on the board, and the encapsulation film layer on one side of the display device and the side of the light-transmitting cover plate are retained to avoid the encapsulation film layer affecting the light output efficiency but at the same time have the ability to block water and oxygen, thereby improving The luminous efficiency of a display panel including a display packaging structure.
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Packages (AREA)
Abstract
本发明公开一种显示器封装结构及其制造方法。所述制造方法包含步骤:提供一可牺牲层、一显示装置封装件及一透光盖板上;提供一封装薄膜层;及移除所述可牺牲层,以暴露出所述透光盖板。本发明通过在移除所述可牺牲层的同时移除所述透光盖板上的所述封装薄膜层,以达到避免封装薄膜层影响出光效率,从而提升显示器封装结构的发光效率。
Description
本发明是有关于一种显示器封装结构及其制造方法,特别是有关于一种提升发光效率的显示器封装结构及其制造方法。
近年来,有机发光二极管(organic light-emitting diodes, OLEDs)柔性显示器由于可挠、轻薄且自发光的特性,越来越多的产品使用此种显示技术。而目前有机发光二极管封装结构通常是采用薄膜封装的方式进行。但是由于薄膜封装层较薄,且存在膜层间的应力。因此,对于阻隔水氧的能力并没有达到需要的效果。
为了加强封装效果,目前都会增加紫外光固化框胶及在最后形成一层原子层沉积膜层以进行整体的全面封装,使得显示器件内部完全与外界隔绝。但是由于原子层沉积时,除了与载台的接触面之外,会在整个面板的侧面及上表面都形成膜层。因此,显示面板的出光面也会沉积膜层。这部分的膜层会对显示面板的外观或出光有一定的影响。
故,有必要提供一种显示器封装结构及其制造方法,以解决现有技术所存在的问题。
有鉴于此,本发明提供一种显示器封装结构及其制造方法,以解决现有技术所存在的显示面板的出光面因沉积膜层对显示面板的外观或出光造成影响的问题。
本发明的主要目的在于提供一种显示器封装结构及其制造方法,其可以改善显示面板的出光面因沉积膜层对显示面板的外观或出光造成影响的问题。
本发明的次要目的在于提供一种显示器封装结构及其制造方法,其可以通过提供一可牺牲层,设置于显示面板的透光盖板上,并于移除所述可牺牲层时,一并移除设置于所述透光盖板上的封装薄膜层,并保留显示装置的一侧面、所述透光盖板的一侧面的封装薄膜层,以达到避免封装薄膜层影响出光效率,从而提升包含显示器封装结构的显示面板的发光效率。
为达成本发明的前述目的,本发明一实施例提供一种显示器封装结构制造方法,包含步骤:
提供一显示装置封装件,其中所述显示装置封装件包含:
一基板;
多个发光元件,设置在所述基板上;及
一封装层,设置于所述基板上,并封装所述多个发光元件;
提供一密封层,设置于所述基板上及所述封装层周围;
提供一干燥剂层,设置于所述基板、所述密封层之间的一空间,并包覆所述封装层;
提供一透光盖板,设置于所述封装层及所述密封层上;
提供一可牺牲层,设置于所述透光盖板上;
提供一封装薄膜层,设置于所述显示装置封装件的一侧面、所述透光盖板的一侧面及所述可牺牲层的一上表面;及
移除所述可牺牲层,以暴露出所述透光盖板,且保留所述显示装置封装件的所述侧面及所述透光盖板的所述侧面的所述封装薄膜层。
在本发明的一实施例中,所述封装薄膜层连续地设置于所述基板的一第一侧面、所述密封层的一第二侧面、所述透光盖板的一第三侧面及所述可牺牲层的一上表面;及
所述可牺牲层被移除后,设置于所述可牺牲层的所述上表面的所述封装薄膜层一起被移除,且保留所述基板的所述第一侧面、所述密封层的所述第二侧面、所述透光盖板的所述第三侧面的所述封装薄膜层。
在本发明的一实施例中,所述封装薄膜层为利用一原子沉积工艺形成。
在本发明的一实施例中,所述可牺牲层为一层二氧化钛薄膜层,其中所述二氧化钛薄膜层通过一丝网电纺工艺形成。
在本发明的一实施例中,所述二氧化钛薄膜层通过一种二氧化钛前驱体溶液形成,其中所述二氧化钛前驱体溶液包含一溶剂、一乳化剂及一分散剂,其中所述溶剂选自由以下组成的群组:水、乙醇及异丙醇;及所述二氧化钛前驱体溶液的一固体含量占整体积的20%至40%。
在本发明的一实施例中,所述显示器封装结构制造方法更包含:
对所述可牺牲层使用一亲水性溶剂,以从所述透光盖板及所述可牺牲层的一界面处的一边缘开始侵润;及
沿所述透光盖板及所述可牺牲层的所述界面撕除所述可牺牲层。
在本发明的一实施例中,所述透光盖板包含一盖板膜层,当所述可牺牲层沿所述透光盖板及所述可牺牲层的所述界面撕除时,所述盖板膜层随着所述可牺牲层撕除。
另外,本发明另一实施例另一种显示器封装结构制造方法,包含步骤:
提供一显示装置封装件及一透光盖板,所述透光盖板设置于所述显示装置封装件上;
提供一可牺牲层,设置于所述透光盖板上;
提供一封装薄膜层,设置于所述显示装置封装件的一侧面、所述透光盖板的一侧面及所述可牺牲层的一上表面;及
移除所述可牺牲层,以暴露出所述透光盖板,且保留所述显示装置封装件的所述侧面及所述透光盖板的所述侧面的所述封装薄膜层。
在本发明的一实施例中,所述显示装置封装件包含:
一基板;
多个发光元件,设置在所述基板上;
一封装层,设置于所述基板上,并封装所述多个发光元件;
一密封层,设置于所述基板上及所述封装层周围,其中所述透光盖板设置于所述封装层及所述密封层上;及
一干燥剂层,设置于所述基板、所述密封层及所述透光盖板之间的一空间,并包覆所述封装层。
在本发明的一实施例中,所述封装薄膜层连续地设置于所述基板的一第一侧面、所述密封层的一第二侧面、所述透光盖板的一第三侧面及所述可牺牲层的一上表面;及
所述可牺牲层被移除后,设置于所述可牺牲层的所述上表面的所述封装薄膜层一起被移除,且保留所述基板的所述第一侧面、所述密封层的所述第二侧面、所述透光盖板的所述第三侧面的所述封装薄膜层。
在本发明的一实施例中,封装薄膜层为利用一原子沉积工艺形成。
在本发明的一实施例中,所述可牺牲层为一层二氧化钛薄膜层,其中所述二氧化钛薄膜层通过一丝网电纺工艺形成。
在本发明的一实施例中,所述二氧化钛薄膜层通过一种二氧化钛前驱体溶液形成,其中所述二氧化钛前驱体溶液包含一溶剂、一乳化剂及一分散剂,其中所述溶剂选自由以下组成的群组:水、乙醇及异丙醇;及所述二氧化钛前驱体溶液的一固体含量占整体积的20%至40%。
在本发明的一实施例中,所述二氧化钛薄膜层的一厚度为5微米至10微米,及所述封装薄膜层的一厚度为0.5微米至10微米。
在本发明的一实施例中,所述显示器封装结构制造方法更包含:
对所述可牺牲层使用一亲水性溶剂,以从所述透光盖板及所述可牺牲层的一界面处的一边缘开始侵润;及
沿所述透光盖板及所述可牺牲层的所述界面撕除所述可牺牲层。
在本发明的一实施例中,所述透光盖板包含一盖板膜层,当所述可牺牲层沿所述透光盖板及所述可牺牲层的所述界面撕除时,所述盖板膜层随着所述可牺牲层撕除。
再者,本发明另一实施例另提供一种显示器封装结构,通过如上所述的显示器封装结构制造方法制作而成。
另外,本发明又一实施例提供一种显示器封装结构,包含:
一显示装置封装件及一透光盖板,所述透光盖板设置于所述显示装置封装件上;及
一封装薄膜层,设置于所述显示装置封装件的一侧面、所述透光盖板的一侧面,并暴露出所述透光盖板的一上表面。
在本发明的一实施例中,所述显示装置封装件包含:
一基板;
多个发光元件,设置在所述基板上;
一封装层,设置于所述基板上,并封装所述多个发光元件;
一密封层,设置于所述基板上及所述封装层周围,其中所述透光盖板设置于所述封装层及所述密封层上;及
一干燥剂层,设置于所述基板、所述密封层及所述透光盖板之间的一空间,并包覆所述封装层。
在本发明的一实施例中,所述封装薄膜层连续地设置于所述基板的一第一侧面、所述密封层的一第二侧面及所述透光盖板的一第三侧面。
在本发明的一实施例中,所述封装薄膜层不设置于所述透光盖板的所述上表面。
与现有技术相比较,本发明的显示器封装结构及其制造方法,可以通过提供一可牺牲层,设置于显示面板的透光盖板上,并于移除所述可牺牲层时,一并移除设置于所述透光盖板上的封装薄膜层,并保留显示装置的一侧面、所述透光盖板的一侧面的封装薄膜层,以这样可改善显示面板的出光面对显示面板的外观或出光造成影响的问题,进而达到避免封装薄膜层影响出光效率,从而提升包含显示器封装结构的显示面板的发光效率。
为让本发明的上述内容能更明显易懂,下文特举优选实施例,并配合所附图式,作详细说明如下:
图1是本发明实施例的显示器封装结构制造方法示意方框图。
图2A-2D是本发明实施例的显示器封装结构流程示意图。
以下各实施例的说明是参考附加的图式,用以例示本发明可用以实施的特定实施例。再者,本发明所提到的方向用语,例如上、下、顶、底、前、后、左、右、内、外、侧面、周围、中央、水平、横向、垂直、纵向、轴向、径向、最上层或最下层等,仅是参考附加图式的方向。因此,使用的方向用语是用以说明及理解本发明,而非用以限制本发明。
请参照图1所示,本发明实施例为达成本发明的前述目的,提供一种显示器封装结构及其制造方法。所述显示器封装结构制造方法包含步骤:(S11)提供一显示装置封装件20及一透光盖板21,所述透光盖板21设置于所述显示装置封装件20上;(S12)提供一可牺牲层22,设置于所述透光盖板21上;(S13)提供一封装薄膜层23,设置于所述显示装置封装件20的一侧面、所述透光盖板21的一侧面及所述可牺牲层22的一上表面;及(S14)移除所述可牺牲层22,以暴露出所述透光盖板21,且保留所述显示装置封装件20的所述侧面及所述透光盖板21的所述侧面的所述封装薄膜层23。
请参照图1的步骤S11及图2A所示,提供一显示装置封装件20及一透光盖板21,所述透光盖板21设置于所述显示装置封装件20上。所述显示装置封装件20包含一基板201、多个发光元件202、一封装层203及一密封层204。所述多个发光元件202,设置在所述基板201上。所述封装层203,设置于所述基板201上,并封装所述多个发光元件202。所述密封层204,设置于所述基板201上及所述封装层203周围,其中所述透光盖板21设置于所述封装层203及所述密封层204上。可选地,所述显示装置封装件20还包含一干燥剂层205,设置于所述基板201、所述密封层204及所述透光盖板21之间的一空间,并包覆所述封装层203。优选地,所述基板201为一柔性可挠基板,例如为一聚酰亚胺基板。所述多个发光元件202为多个OLED发光元件或替代地为多个薄膜晶体管元件,设置在所述基板201上。所述封装层203可以为一有机封装层、一无机封装层或依次层叠的有机封装层及无机封装层,以封装所述多个发光元件202,进而阻隔水氧对所述多个发光元件202的影响。可选地,所述密封层204可以为一紫外光可固化胶或玻璃胶。优选地,所述密封层204为一密封胶框,设置于所述多个发光元件202周围的一非显示区,并包围所述多个发光元件202。优选地,所述干燥剂层205为一填充胶体,填充在所述基板201、所述密封层204及所述透光盖板21之间的所述空间。所述填充胶体中设置有多个干燥剂粒子,以保护所述多个发光元件202受到水氧的破坏。
接着,请参照图1的步骤S12及图2B所示,提供一可牺牲层22,设置于所述透光盖板21上。优选地,所述可牺牲层22为一层二氧化钛薄膜层,其中所述二氧化钛薄膜层通过一丝网电纺工艺形成。可选地,所述二氧化钛薄膜层通过一种二氧化钛前驱体溶液形成,其中所述二氧化钛前驱体溶液包含一溶剂、一乳化剂及一分散剂,其中所述溶剂可以为一极性溶剂。可选地,所述溶剂可以选自由以下组成的群组:水、乙醇及异丙醇。可选地,所述二氧化钛前驱体溶液的一固体含量占整体积的20%至40%。优选地,所述二氧化钛薄膜层的一厚度为5微米至10微米。所述二氧化钛薄膜层通过所述丝网电纺工艺形成的一电压为10千伏特至30千伏特。替代地,在所述透光盖板21设置于所述显示装置封装件20上之前,所述可牺牲层22已事先设置于所述透光盖板21上。
请参照图1的步骤S13及图2C所示,提供一封装薄膜层23,设置于所述显示装置封装件20的一侧面、所述透光盖板21的一侧面及所述可牺牲层22的一上表面。所述封装薄膜层23连续地设置于所述基板201的一第一侧面201A、所述密封层204的一第二侧面204A、所述透光盖板21的一第三侧面21A及所述可牺牲层22的一上表面。优选地,所述封装薄膜层23的一厚度为0.5微米至10微米。可选地,所述封装薄膜层23为利用一原子沉积工艺形成。可选地,所述封装薄膜层23的材料为三氧化二铝。
请参照图1的步骤S14及图2D所示,移除所述可牺牲层22,以暴露出所述透光盖板21,且保留所述显示装置封装件20的所述侧面及所述透光盖板21的所述侧面的所述封装薄膜层23。所述可牺牲层22被移除后,设置于所述可牺牲层22的所述上表面的所述封装薄膜层23一起被移除,且保留所述基板201的所述第一侧面201A、所述密封层204的所述第二侧面204A、所述透光盖板21的所述第三侧面21A的所述封装薄膜层23。可选地,移除所述可牺牲层22为使用一亲水性溶剂,以从所述透光盖板21及所述可牺牲层22的一界面处的一边缘开始侵润,及沿所述透光盖板21及所述可牺牲层22的所述界面撕除所述可牺牲层22。
再者,本发明另一实施例另提供一种显示器封装结构,通过如上所述的显示器封装结构制造方法制作而成。所述显示器封装结构包含:一显示装置封装件20及一透光盖板21,所述透光盖板21设置于所述显示装置封装件20上;一封装薄膜层23,设置于所述显示装置封装件20的一侧面及所述透光盖板21的一侧面并暴露出所述透光盖板21的一上表面。可选地,所述封装薄膜层23为利用一原子沉积工艺形成。可选地,所述封装薄膜层23的一厚度为0.5微米至10微米。可选地,所述显示装置封装件20包含:一基板201;多个发光元件202,设置在所述基板201上;一封装层203,设置于所述基板201上,并封装所述多个发光元件202;一密封层204,设置于所述基板201上及所述封装层203周围,其中所述透光盖板21设置于所述封装层203及所述密封层204上;及一干燥剂层205,设置于所述基板201、所述密封层204及所述透光盖板21之间的一空间,并包覆所述封装层203。优选地,所述封装薄膜层23连续地设置于所述基板201的一第一侧面201A、所述密封层204的一第二侧面204A及所述透光盖板21的一第三侧面21A。特别地,所述封装薄膜层23不设置于所述透光盖板21的所述上表面。
如上所述,相较于现有显示面板的出光面也会沉积膜层,而导致所述膜层会对显示面板的外观或出光有一定的影响的问题。本发明的显示器封装结构及其制造方法通过提供一可牺牲层,设置于显示面板的透光盖板上,并于移除所述可牺牲层时,一并移除设置于所述透光盖板上的封装薄膜层,并保留显示装置的一侧面、所述透光盖板的一侧面的封装薄膜层,以达到避免封装薄膜层影响出光效率但同时可具备阻隔水氧的能力,从而提升包含显示器封装结构的显示面板的发光效率。
本发明已由上述相关实施例加以描述,然而上述实施例仅为实施本发明的范例。必需指出的是,已公开的实施例并未限制本发明的范围。相反地,包含于权利要求书的精神及范围的修改及均等设置均包括于本发明的范围内。
Claims (20)
- 一种显示器封装结构制造方法,包含步骤:提供一显示装置封装件,其中所述显示装置封装件包含:一基板;多个发光元件,设置在所述基板上;及一封装层,设置于所述基板上,并封装所述多个发光元件;提供一密封层,设置于所述基板上及所述封装层周围;提供一干燥剂层,设置于所述基板、所述密封层之间的一空间,并包覆所述封装层;提供一透光盖板,设置于所述封装层及所述密封层上;提供一可牺牲层,设置于所述透光盖板上;提供一封装薄膜层,设置于所述显示装置封装件的一侧面、所述透光盖板的一侧面及所述可牺牲层的一上表面;及移除所述可牺牲层,以暴露出所述透光盖板,且保留所述显示装置封装件的所述侧面及所述透光盖板的所述侧面的所述封装薄膜层。
- 如权利要求1所述的显示器封装结构制造方法,其中所述封装薄膜层连续地设置于所述基板的一第一侧面、所述密封层的一第二侧面、所述透光盖板的一第三侧面及所述可牺牲层的一上表面;及所述可牺牲层被移除后,设置于所述可牺牲层的所述上表面的所述封装薄膜层一起被移除,且保留所述基板的所述第一侧面、所述密封层的所述第二侧面、所述透光盖板的所述第三侧面的所述封装薄膜层。
- 如权利要求1所述的显示器封装结构制造方法,其中所述封装薄膜层为利用一原子沉积工艺形成。
- 如权利要求1所述的显示器封装结构制造方法,其中所述可牺牲层为一层二氧化钛薄膜层,其中所述二氧化钛薄膜层通过一丝网电纺工艺形成。
- 如权利要求4所述的显示器封装结构制造方法,其中所述二氧化钛薄膜层通过一种二氧化钛前驱体溶液形成,其中所述二氧化钛前驱体溶液包含一溶剂、一乳化剂及一分散剂,其中所述溶剂选自由以下组成的群组:水、乙醇及异丙醇;及所述二氧化钛前驱体溶液的一固体含量占整体积的20%至40%。
- 如权利要求1所述的显示器封装结构制造方法,其中所述显示器封装结构制造方法更包含:对所述可牺牲层使用一亲水性溶剂,以从所述透光盖板及所述可牺牲层的一界面处的一边缘开始侵润;及沿所述透光盖板及所述可牺牲层的所述界面撕除所述可牺牲层。
- 如权利要求6所述的显示器封装结构制造方法,其中所述透光盖板包含一盖板膜层,当所述可牺牲层沿所述透光盖板及所述可牺牲层的所述界面撕除时,所述盖板膜层随着所述可牺牲层撕除。
- 一种显示器封装结构制造方法,包含步骤:提供一显示装置封装件及一透光盖板,所述透光盖板设置于所述显示装置封装件上;提供一可牺牲层,设置于所述透光盖板上;提供一封装薄膜层,设置于所述显示装置封装件的一侧面、所述透光盖板的一侧面及所述可牺牲层的一上表面;及移除所述可牺牲层,以暴露出所述透光盖板,且保留所述显示装置封装件的所述侧面及所述透光盖板的所述侧面的所述封装薄膜层。
- 如权利要求8所述的显示器封装结构制造方法,其中所述显示装置封装件包含:一基板;多个发光元件,设置在所述基板上;一封装层,设置于所述基板上,并封装所述多个发光元件;一密封层,设置于所述基板上及所述封装层周围,其中所述透光盖板设置于所述封装层及所述密封层上;及一干燥剂层,设置于所述基板、所述密封层及所述透光盖板之间的一空间,并包覆所述封装层。
- 如权利要求9所述的显示器封装结构制造方法,其中所述封装薄膜层连续地设置于所述基板的一第一侧面、所述密封层的一第二侧面、所述透光盖板的一第三侧面及所述可牺牲层的一上表面;及所述可牺牲层被移除后,设置于所述可牺牲层的所述上表面的所述封装薄膜层一起被移除,且保留所述基板的所述第一侧面、所述密封层的所述第二侧面、所述透光盖板的所述第三侧面的所述封装薄膜层。
- 如权利要求8所述的显示器封装结构制造方法,其中所述封装薄膜层为利用一原子沉积工艺形成。
- 如权利要求8所述的显示器封装结构制造方法,其中所述可牺牲层为一层二氧化钛薄膜层,其中所述二氧化钛薄膜层通过一丝网电纺工艺形成。
- 如权利要求12所述的显示器封装结构制造方法,其中所述二氧化钛薄膜层通过一种二氧化钛前驱体溶液形成,其中所述二氧化钛前驱体溶液包含一溶剂、一乳化剂及一分散剂,其中所述溶剂选自由以下组成的群组:水、乙醇及异丙醇;及所述二氧化钛前驱体溶液的一固体含量占整体积的20%至40%。
- 如权利要求12所述的显示器封装结构制造方法,其中所述二氧化钛薄膜层的一厚度为5微米至10微米,及所述封装薄膜层的一厚度为0.5微米至10微米。
- 如权利要求8所述的显示器封装结构制造方法,其中所述显示器封装结构制造方法更包含:对所述可牺牲层使用一亲水性溶剂,以从所述透光盖板及所述可牺牲层的一界面处的一边缘开始侵润;及沿所述透光盖板及所述可牺牲层的所述界面撕除所述可牺牲层。
- 如权利要求15所述的显示器封装结构制造方法,其中所述透光盖板包含一盖板膜层,当所述可牺牲层沿所述透光盖板及所述可牺牲层的所述界面撕除时,所述盖板膜层随着所述可牺牲层撕除。
- 一种显示器封装结构,包含:一显示装置封装件及一透光盖板,所述透光盖板设置于所述显示装置封装件上;及一封装薄膜层,设置于所述显示装置封装件的一侧面、所述透光盖板的一侧面,并暴露出所述透光盖板的一上表面。
- 如权利要求17所述的显示器封装结构,其中所述显示装置封装件包含:一基板;多个发光元件,设置在所述基板上;一封装层,设置于所述基板上,并封装所述多个发光元件;一密封层,设置于所述基板上及所述封装层周围,其中所述透光盖板设置于所述封装层及所述密封层上;及一干燥剂层,设置于所述基板、所述密封层及所述透光盖板之间的一空间,并包覆所述封装层。
- 如权利要求17所述的显示器封装结构,其中所述封装薄膜层连续地设置于所述基板的一第一侧面、所述密封层的一第二侧面及所述透光盖板的一第三侧面。
- 如权利要求19所述的显示器封装结构,其中所述封装薄膜层不设置于所述透光盖板的所述上表面。
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