WO2020121961A1 - Carte de circuit imprimé et phare de véhicule - Google Patents

Carte de circuit imprimé et phare de véhicule Download PDF

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Publication number
WO2020121961A1
WO2020121961A1 PCT/JP2019/047793 JP2019047793W WO2020121961A1 WO 2020121961 A1 WO2020121961 A1 WO 2020121961A1 JP 2019047793 W JP2019047793 W JP 2019047793W WO 2020121961 A1 WO2020121961 A1 WO 2020121961A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
region
board
wiring
area
Prior art date
Application number
PCT/JP2019/047793
Other languages
English (en)
Japanese (ja)
Inventor
鈴木　哲也
Original Assignee
株式会社小糸製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社小糸製作所 filed Critical 株式会社小糸製作所
Priority to CN201980076991.2A priority Critical patent/CN113167463A/zh
Publication of WO2020121961A1 publication Critical patent/WO2020121961A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/32—Optical layout thereof
    • F21S41/36—Combinations of two or more separate reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/60—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution
    • F21S41/65—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources
    • F21S41/663—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources by switching light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/42—Forced cooling
    • F21S45/43—Forced cooling using gas
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/70—Prevention of harmful light leakage
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

Definitions

  • the present invention relates to a circuit board and a vehicle lamp.
  • a light emitting diode (LED: Light Emitting Diode) is widely used in the light emitting section.
  • ADB Adaptive Driving Beam
  • ADB Adaptive Driving Beam
  • puts a plurality of LEDs in a one-dimensional or two-dimensional array and switches between turning on and off each LED according to the position of an oncoming vehicle or a preceding vehicle has been put into practical use.
  • a marker lamp that performs a complicated display using an organic EL (Electro Luminescence) element in a light emitting portion (see, for example, Patent Document 1).
  • a high-density printed wiring is formed on a substrate, and a flexible high-density flexible cable such as FPC (Flexible Printed Circuit) or FFC (Flexible Flat Cable) is used. It has been proposed to electrically connect the substrates (see, for example, Patent Document 1).
  • the flexible cable can be attached and detached by inserting the flexible cable into the connector part mounted on the board.
  • the flexible cable can be attached and detached by inserting the flexible cable into the connector part mounted on the board.
  • a method of directly connecting the flexible cable to the terminal between the boards in the reflow process has also been proposed.
  • FIG. 6 is a schematic view showing a connection between boards using a conventional flexible cable
  • FIG. 6(a) shows two boards before connection
  • FIG. 6(b) shows a state in which a flexible cable is connected. Shows.
  • the wiring pattern 3 and the lands 4a and 4b are formed on the substrate 1 and the substrate 2, respectively.
  • the flexible cable 5 is arranged between the lands 4a and 4b coated with the solder material and heated in the reflow process, the flexible cable 5 is connected between the lands 4a and 4b.
  • the flexible cable 5 has flexibility, so that the substrate portions 12 are mounted on different planes. It is possible to
  • the area of the lands 4a and 4b is essential, and it has been difficult to achieve further space saving.
  • a solder material is used for connecting the flexible cable 5, it is difficult to ensure long-term reliability such as cracking when stress such as thermal shock is applied.
  • the heat resistance of the adhesive affects the heat resistance of the flexible cable 5, and the environmental temperature of the post process is increased. There was also the problem of being restricted.
  • the present invention has been made in view of the above conventional problems, and an object of the present invention is to provide a circuit board and a vehicular lamp that can secure long-term reliability while achieving space saving.
  • a circuit board of the present invention has a first board portion, a second board portion formed separately from the first board portion, and has flexibility, and wiring on the surface.
  • the first area and the second area of the wiring board are adhered to the first board section and the second board section, respectively, and the third area is provided between the first board section and the second board section. Since they are connected, lands and flexible cables are not required, and long-term reliability can be ensured while saving space.
  • the first region has substantially the same shape as the first substrate portion.
  • the adhesive layer is not formed on the back surface of the third region.
  • the wiring board is made of glass epoxy resin.
  • the wiring board has a thickness in the range of 0.1 mm to 0.3 mm.
  • a vehicle lamp of the present invention includes the circuit board according to any one of the above, and a light emitting element mounted on the circuit board, wherein the first board portion and the second board portion include: It is characterized by being mounted on different planes.
  • FIG. 3 is an exploded perspective view schematically showing the structure of the circuit board 100.
  • FIG. 6 is a plan view schematically showing an arrangement example of the wiring board 30 when manufacturing the circuit board 100.
  • FIG. 3 is a schematic perspective view showing a state where the circuit board 100 is mounted on the heat sink 60.
  • FIG. 3 is a schematic cross-sectional view showing the structure of a vehicular lamp 200 using the circuit board 100.
  • FIG.6(a) shows two boards before a connection
  • FIG.6(b) has shown the state which connected the flexible cable.
  • FIG. 1 is a schematic perspective view showing a circuit board 100 according to this embodiment.
  • the circuit board 100 includes a first board portion 11, a second board portion 12, a wiring board 30, and a resist layer 40.
  • the first substrate portion 11 and the second substrate portion 12 are substantially flat plate members made of a material having good thermal conductivity, and are formed separately.
  • a wiring board 30 is bonded to one surface of each of the first board portion 11 and the second board portion 12, and a plurality of light emitting elements 51, 52 are mounted.
  • the material forming the first substrate portion 11 and the second substrate portion 12 is not limited, it is preferable to use a metal having good thermal conductivity such as copper or aluminum.
  • the wiring board 30 is a board having a wiring pattern 34 formed on the surface thereof and has flexibility.
  • the wiring board 30 is adhered to the first board portion 11 and the second board portion 12 with an adhesive layer 20 described later. Further, the wiring board 30 is integrally formed with three regions, that is, a first region 31, a second region 32, and a third region 33, and a wiring pattern 34 is continuously formed over the three regions.
  • the material forming the wiring board 30 is not limited, but it is preferable to use a glass epoxy resin because it has flexibility and mechanical strength.
  • the thickness of the wiring board 30 is preferably in the range of 0.1 mm to 0.3 mm. If the thickness is larger than 0.3 mm, the flexibility is not sufficient and the bending radius becomes large, and if the thickness is smaller than 0.1 mm, the mechanical strength cannot be sufficiently secured and the handling becomes difficult.
  • the first region 31 is a region formed in an outer shape corresponding to the first substrate portion 11, and the back surface side is bonded to the first substrate portion 11 with an adhesive layer 20 described later. Further, an opening 31a is formed in a predetermined area of the first area 31, and the surface of the first substrate portion 11 is exposed in the opening 31a.
  • the second region 32 is a region formed in an outer shape corresponding to the second substrate portion 12, and the back surface side is bonded to the second substrate portion 12 with an adhesive layer 20 described later. Further, an opening 32a is formed in a predetermined area of the second area 32, and the surface of the second substrate portion 12 is exposed inside the opening 32a.
  • the third area 33 is an area provided between the first area 31 and the second area 32. There is neither the first substrate portion 11 nor the second substrate portion 12 on the back surface side of the third region 33, and therefore, the adhesive layer 20 is not attached, and the first substrate portion 11 and the second substrate portion 12 are It has a structure that bridges the spaces.
  • the wiring pattern 34 is a conductive pattern formed on the surface of the wiring board 30, and is for ensuring electrical connection between the respective regions in the circuit board 100. As shown in the figure, the wiring pattern 34 is continuously formed over three regions of the first region 31, the second region 32, and the third region 33, and the first substrate portion 11 and the second substrate portion 12 are formed. A single circuit is constructed between the and. A resist layer 40 is formed so as to cover the wiring pattern 34.
  • the openings 31a and 32a are openings formed in the first region 31 and the second region 32, respectively.
  • the surfaces of the first substrate portion 11 and the second substrate portion 12 are exposed from the openings 31a and 32a, respectively, and the light emitting elements 51 and 52 are mounted therein.
  • the resist layer 40 is an insulating film-like member formed on the front surface side of the wiring board 30 so as to cover the wiring pattern 34.
  • the resist layer 40 is formed in a region excluding a portion for bonding the light emitting elements 51 and 52 with a metal wire and a portion for electrically connecting from the outside.
  • the material forming the resist layer 40 is not limited, but in order to suppress stray light due to the difference in light reflectance between the surface of the wiring board 30 and the wiring pattern 34, the light reflectance in the region where the resist layer 40 is formed is adjusted. It is preferable to use a light-reflecting material or a light-absorbing material so as to be uniform.
  • the light emitting elements 51 and 52 are members that emit light when a voltage is applied, and are composed of a combination of an LED chip and a phosphor material. Although not shown in FIGS. 1 to 5, the light emitting elements 51 and 52 are electrically connected to the wiring patterns 34 in the first region 31 and the second region 32, respectively, using metal wires or the like.
  • a known compound semiconductor material such as a GaN-based compound that emits blue, violet, or ultraviolet wavelengths as primary light can be used.
  • the phosphor material a known material that is excited by primary light and emits desired secondary light can be used, and a material that obtains white color by mixing with the primary light from the LED chip or a plurality of phosphor materials can be used. It is possible to use one that obtains a white color by mixing a plurality of secondary lights.
  • the first board portion 11 and the second board portion 12 are electrically and mechanically connected to each other by the third region 33 of the wiring board 30. Since the wiring substrate 30 is made of a flexible material, even if the first substrate portion 11 and the second substrate portion 12 are mounted on different surfaces, the third region 33 bends and electrical connection is made between them. Is maintained. Further, since it is not necessary to form the land for connecting the FPC with the solder on the circuit board 100, the space can be saved. When a glass epoxy resin is used as the wiring board 30, the heat resistance can be improved to 150° C. or higher. Further, the glass epoxy resin is more rigid than the conventional FPC, so that the handling in the mounting process becomes easy.
  • FIG. 2 is an exploded perspective view schematically showing the structure of the circuit board 100.
  • the circuit board 100 includes the heat dissipation portion 10 including the first substrate portion 11 and the second substrate portion 12, the adhesive layer 20 including the first adhesive sheet 21 and the second adhesive sheet 22, and the above-described.
  • the wiring board 30 and the wiring board 30 are laminated.
  • the adhesive layer 20 is a sheet-shaped adhesive material arranged between the front surface of the heat dissipation portion 10 and the back surface of the wiring board 30. As shown in FIG. 2, the adhesive layer 20 is separately formed into a first adhesive sheet 21 and a second adhesive sheet 22.
  • the material forming the adhesive layer 20 is not particularly limited, but for example, a prepreg formed in a sheet shape with a thickness of 20 to 200 ⁇ m can be used.
  • the first adhesive sheet 21 has a sheet shape formed in an outer shape corresponding to the first substrate portion 11, and the back surface side contacts the first substrate portion 11 and the front surface side contacts the first region 31. Further, the opening 21a is formed in a region and shape corresponding to the opening 31a.
  • the second adhesive sheet 22 is a sheet formed in an outer shape corresponding to the second substrate portion 12, and the back surface side contacts the second substrate portion 12 and the front surface side contacts the second region 32. Further, the opening 22a is formed in a region and shape corresponding to the opening 32a.
  • the heat dissipation part 10 and the adhesive layer 20 described above can be collectively formed into a plurality of outer shapes from a single plate-shaped member by punching or the like.
  • the resist layer 40 is formed in a predetermined region on the wiring pattern 34, and the outer shape can be formed by punching. ..
  • the heat dissipation portion 10 As a method of manufacturing the circuit board 100, the heat dissipation portion 10, the adhesive layer 20, and the wiring board 30 having a large size are stacked, and the wiring board 30 is adhered onto the heat dissipation portion 10 by applying heat and pressure in a lamination pressing process. A layered structure adhered with layer 20 is obtained.
  • the outer shape of the circuit board 100 can be obtained by collectively punching the obtained laminated structure.
  • the openings 21a, 31a, 22a, 32a may be formed before the laminating press working or may be formed by cutting after the laminating press working.
  • the step of forming the wiring pattern 34 on the wiring board 30 may be performed before or after the lamination pressing step.
  • the light emitting element 51 is mounted on the surface of the first substrate portion 11 exposed in the openings 21a and 31a, and the light emitting element 52 is mounted on the surface of the second substrate portion 12 exposed in the openings 22a and 32a.
  • the light emitting elements 51 and 52 and the wiring pattern 34 are wire-bonded with a metal wire to obtain the circuit board 100 of the present invention.
  • FIG. 3 is a plan view schematically showing an arrangement example of the wiring board 30 when manufacturing the circuit board 100.
  • the two circuit boards 100 are rotated 180 degrees with respect to each other on one glass epoxy resin sheet so that the other first area 31 is located next to one third area 33.
  • FIG. 4 is a schematic perspective view showing a state in which the circuit board 100 is mounted on the heat sink 60.
  • the heat sink 60 is a member having good thermal conductivity, which is arranged in contact with the back surface of the circuit board 100, and may be made of aluminum or the like.
  • a first surface 61 and a second surface 62 are formed in front of the heat sink 60, and a plurality of heat radiation fins 63 are formed on the back surface side.
  • the first surface 61 is a substantially flat surface formed in front of the heat sink 60, and is an area where the first board portion 11 is mounted.
  • the second surface 62 is a substantially flat surface formed in front of the heat sink 60, and is an area on which the second substrate unit 12 is mounted.
  • the first surface 61 and the second surface 62 intersect each other at a predetermined angle to form a substantially V shape.
  • an example is shown in which the first surface 61 and the second surface 62 intersect in a substantially V shape, but it is sufficient if the first surface 61 and the second surface 62 are different surfaces, and their relative positional relationship is Not limited.
  • the wiring board 30 is made of a flexible material, the first board portion 11 and the second board portion 12 are different surfaces, that is, the first surface 61. Even when mounted on the second surface 62, the third region 33 bends and the electrical connection between the two is maintained. Further, since the first region 31, the second region 32, and the third region 33 are integrally formed as a single sheet, they are mechanically and thermally stable and excellent in long-term reliability. ..
  • FIG. 5 is a schematic cross-sectional view showing the structure of a vehicle lighting device 200 using the circuit board 100.
  • the vehicular lamp 200 includes a circuit board 100, a heat sink 60, a reflector 71, a concealing portion 72, a lens 80, a lens holder 81, and a cooling fan 90. Each member is positioned relative to each other and is not shown in the figure. It is fixed by means.
  • the adhesive layer 20 is not formed on the back surface side of the third region 33, and the third region 33 bridges the first region 31 and the second region 32 with a gap from the heat sink 60. ing.
  • the reflector 71 is a member that is arranged in front of the wiring board 30 and reflects the light from the light emitting elements 51 and 52 forward.
  • the concealment portion 72 is a member for concealing unnecessary portions in the vehicle lighting device 200 and preventing stray light when viewed from the front of the lens 80.
  • the lens 80 is a member that is made of a translucent material and irradiates the light from the light emitting elements 51 and 52 forward so as to have a predetermined light distribution.
  • the lens holder 81 is a member for holding the lens 80 while maintaining the relative positional relationship among the lens 80, the wiring board 30, and the reflector 71.
  • the cooling fan 90 is a member that is disposed on the back side of the heat sink 60 and that causes an air flow between the plurality of radiating fins 63 when power is supplied.
  • the light emitting elements 51 and 52 mounted on the wiring board 30 emit light according to the power and the signal, and the light reflected forward by the reflector 71 is a lens. It is irradiated forward through the inside of the holder 81 and the lens 80. Further, the heat generated by the light emission of the wiring board 30 is radiated into the air through the heat sink 60 and cooled by the air blown from the cooling fan 90.
  • the light emitting elements 51, 52 to which power is selectively supplied from the outside via the wiring pattern 34 and the metal wire are turned on.
  • the light distribution distribution in the entire vehicle lighting device 200 is determined, and a light distribution pattern is radiated to the front of the vehicle lighting device 200 by the ADB technique via the reflector 71 and the lens 80. ..
  • the circuit board 100 and the vehicular lamp 200 of the present embodiment even if the first board portion 11 and the second board portion 12 are mounted on different surfaces, that is, the first surface 61 and the second surface 62,
  • the third region 33 bends to maintain the electrical connection between them. Further, since the first region 31, the second region 32, and the third region 33 are integrally formed as a single sheet, they are mechanically and thermally stable and excellent in long-term reliability. .. Further, since it is not necessary to form the land for connecting the FPC with the solder on the circuit board 100, the space can be saved.
  • first surface 61 and the second surface 62 that intersect with each other are formed on the block-shaped heat sink 60 has been shown.
  • the first surface 61 and the second surface 62 may be formed by bending after mounting the substrate unit 12. According to this method, the mounting work can be simplified as compared with mounting the first substrate unit 11 and the second substrate unit 12 on the surfaces intersecting with each other.
  • the wiring board 30 is further divided into a plurality of third regions 33.
  • the area 33 may be provided.
  • an organic EL element or other optical element may be provided, and other electronic parts may be mounted.
  • FIG. 4 shows an example in which the first substrate portion 11 and the second substrate portion 12 are accommodated in the first surface 61 and the second surface 62, respectively, a part thereof may be projected to the outside of the heat sink 60. ..
  • the terminal portion may be projected so that the terminal portion for electrical connection with the outside is connected to the connector.
  • the electrical connection structure to the outside is not limited to the card edge method, and a surface mount connector may be used.
  • Circuit board 200 Vehicle lamp 10... Heat dissipation part 11... First board part 12... Second board part 20... Adhesive layer 21... First adhesive sheet 22... Second adhesive sheet 21a, 22a, 31a, 32a... Opening 30... Wiring substrate 31... First area 32... Second area 33... Third area 34... Wiring pattern 40... Resist layers 51, 52... Light emitting element 60... Heat sink 61... First surface 62... Second surface 63... Radiating fin 71... Reflector 72... Concealing section 80... Lens 81... Lens holder 90... Cooling fan

Abstract

L'invention concerne une carte de circuit imprimé et un phare de véhicule qui permettent de sécuriser une fiabilité à long terme tout en économisant de l'espace. La carte de circuit imprimé est pourvue d'une première partie de substrat (11), d'une seconde partie de substrat (12) formée séparément de la première partie de substrat (11), et d'un substrat souple (30) ayant un motif de câblage formé sur la surface, le substrat (30) comprenant une première région (31) collée sur le côté arrière à la première partie de substrat (11), une deuxième région (32) collée sur le côté arrière à la seconde partie de substrat (12), et une troisième région (33) disposée entre la première région (31) et la deuxième région (32).
PCT/JP2019/047793 2018-12-11 2019-12-06 Carte de circuit imprimé et phare de véhicule WO2020121961A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201980076991.2A CN113167463A (zh) 2018-12-11 2019-12-06 电路基板及车辆用灯具

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-231632 2018-12-11
JP2018231632A JP7297431B2 (ja) 2018-12-11 2018-12-11 回路基板及び車両用灯具

Publications (1)

Publication Number Publication Date
WO2020121961A1 true WO2020121961A1 (fr) 2020-06-18

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PCT/JP2019/047793 WO2020121961A1 (fr) 2018-12-11 2019-12-06 Carte de circuit imprimé et phare de véhicule

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JP (1) JP7297431B2 (fr)
CN (1) CN113167463A (fr)
WO (1) WO2020121961A1 (fr)

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Publication number Priority date Publication date Assignee Title
JP7447698B2 (ja) * 2020-06-24 2024-03-12 市光工業株式会社 車両用灯具

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