WO2020121961A1 - Circuit board and vehicle light - Google Patents

Circuit board and vehicle light Download PDF

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Publication number
WO2020121961A1
WO2020121961A1 PCT/JP2019/047793 JP2019047793W WO2020121961A1 WO 2020121961 A1 WO2020121961 A1 WO 2020121961A1 JP 2019047793 W JP2019047793 W JP 2019047793W WO 2020121961 A1 WO2020121961 A1 WO 2020121961A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
region
board
wiring
area
Prior art date
Application number
PCT/JP2019/047793
Other languages
French (fr)
Japanese (ja)
Inventor
鈴木　哲也
Original Assignee
株式会社小糸製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社小糸製作所 filed Critical 株式会社小糸製作所
Priority to CN201980076991.2A priority Critical patent/CN113167463A/en
Publication of WO2020121961A1 publication Critical patent/WO2020121961A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/32—Optical layout thereof
    • F21S41/36—Combinations of two or more separate reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/60—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution
    • F21S41/65—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources
    • F21S41/663—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources by switching light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/42—Forced cooling
    • F21S45/43—Forced cooling using gas
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/70—Prevention of harmful light leakage
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

Definitions

  • the present invention relates to a circuit board and a vehicle lamp.
  • a light emitting diode (LED: Light Emitting Diode) is widely used in the light emitting section.
  • ADB Adaptive Driving Beam
  • ADB Adaptive Driving Beam
  • puts a plurality of LEDs in a one-dimensional or two-dimensional array and switches between turning on and off each LED according to the position of an oncoming vehicle or a preceding vehicle has been put into practical use.
  • a marker lamp that performs a complicated display using an organic EL (Electro Luminescence) element in a light emitting portion (see, for example, Patent Document 1).
  • a high-density printed wiring is formed on a substrate, and a flexible high-density flexible cable such as FPC (Flexible Printed Circuit) or FFC (Flexible Flat Cable) is used. It has been proposed to electrically connect the substrates (see, for example, Patent Document 1).
  • the flexible cable can be attached and detached by inserting the flexible cable into the connector part mounted on the board.
  • the flexible cable can be attached and detached by inserting the flexible cable into the connector part mounted on the board.
  • a method of directly connecting the flexible cable to the terminal between the boards in the reflow process has also been proposed.
  • FIG. 6 is a schematic view showing a connection between boards using a conventional flexible cable
  • FIG. 6(a) shows two boards before connection
  • FIG. 6(b) shows a state in which a flexible cable is connected. Shows.
  • the wiring pattern 3 and the lands 4a and 4b are formed on the substrate 1 and the substrate 2, respectively.
  • the flexible cable 5 is arranged between the lands 4a and 4b coated with the solder material and heated in the reflow process, the flexible cable 5 is connected between the lands 4a and 4b.
  • the flexible cable 5 has flexibility, so that the substrate portions 12 are mounted on different planes. It is possible to
  • the area of the lands 4a and 4b is essential, and it has been difficult to achieve further space saving.
  • a solder material is used for connecting the flexible cable 5, it is difficult to ensure long-term reliability such as cracking when stress such as thermal shock is applied.
  • the heat resistance of the adhesive affects the heat resistance of the flexible cable 5, and the environmental temperature of the post process is increased. There was also the problem of being restricted.
  • the present invention has been made in view of the above conventional problems, and an object of the present invention is to provide a circuit board and a vehicular lamp that can secure long-term reliability while achieving space saving.
  • a circuit board of the present invention has a first board portion, a second board portion formed separately from the first board portion, and has flexibility, and wiring on the surface.
  • the first area and the second area of the wiring board are adhered to the first board section and the second board section, respectively, and the third area is provided between the first board section and the second board section. Since they are connected, lands and flexible cables are not required, and long-term reliability can be ensured while saving space.
  • the first region has substantially the same shape as the first substrate portion.
  • the adhesive layer is not formed on the back surface of the third region.
  • the wiring board is made of glass epoxy resin.
  • the wiring board has a thickness in the range of 0.1 mm to 0.3 mm.
  • a vehicle lamp of the present invention includes the circuit board according to any one of the above, and a light emitting element mounted on the circuit board, wherein the first board portion and the second board portion include: It is characterized by being mounted on different planes.
  • FIG. 3 is an exploded perspective view schematically showing the structure of the circuit board 100.
  • FIG. 6 is a plan view schematically showing an arrangement example of the wiring board 30 when manufacturing the circuit board 100.
  • FIG. 3 is a schematic perspective view showing a state where the circuit board 100 is mounted on the heat sink 60.
  • FIG. 3 is a schematic cross-sectional view showing the structure of a vehicular lamp 200 using the circuit board 100.
  • FIG.6(a) shows two boards before a connection
  • FIG.6(b) has shown the state which connected the flexible cable.
  • FIG. 1 is a schematic perspective view showing a circuit board 100 according to this embodiment.
  • the circuit board 100 includes a first board portion 11, a second board portion 12, a wiring board 30, and a resist layer 40.
  • the first substrate portion 11 and the second substrate portion 12 are substantially flat plate members made of a material having good thermal conductivity, and are formed separately.
  • a wiring board 30 is bonded to one surface of each of the first board portion 11 and the second board portion 12, and a plurality of light emitting elements 51, 52 are mounted.
  • the material forming the first substrate portion 11 and the second substrate portion 12 is not limited, it is preferable to use a metal having good thermal conductivity such as copper or aluminum.
  • the wiring board 30 is a board having a wiring pattern 34 formed on the surface thereof and has flexibility.
  • the wiring board 30 is adhered to the first board portion 11 and the second board portion 12 with an adhesive layer 20 described later. Further, the wiring board 30 is integrally formed with three regions, that is, a first region 31, a second region 32, and a third region 33, and a wiring pattern 34 is continuously formed over the three regions.
  • the material forming the wiring board 30 is not limited, but it is preferable to use a glass epoxy resin because it has flexibility and mechanical strength.
  • the thickness of the wiring board 30 is preferably in the range of 0.1 mm to 0.3 mm. If the thickness is larger than 0.3 mm, the flexibility is not sufficient and the bending radius becomes large, and if the thickness is smaller than 0.1 mm, the mechanical strength cannot be sufficiently secured and the handling becomes difficult.
  • the first region 31 is a region formed in an outer shape corresponding to the first substrate portion 11, and the back surface side is bonded to the first substrate portion 11 with an adhesive layer 20 described later. Further, an opening 31a is formed in a predetermined area of the first area 31, and the surface of the first substrate portion 11 is exposed in the opening 31a.
  • the second region 32 is a region formed in an outer shape corresponding to the second substrate portion 12, and the back surface side is bonded to the second substrate portion 12 with an adhesive layer 20 described later. Further, an opening 32a is formed in a predetermined area of the second area 32, and the surface of the second substrate portion 12 is exposed inside the opening 32a.
  • the third area 33 is an area provided between the first area 31 and the second area 32. There is neither the first substrate portion 11 nor the second substrate portion 12 on the back surface side of the third region 33, and therefore, the adhesive layer 20 is not attached, and the first substrate portion 11 and the second substrate portion 12 are It has a structure that bridges the spaces.
  • the wiring pattern 34 is a conductive pattern formed on the surface of the wiring board 30, and is for ensuring electrical connection between the respective regions in the circuit board 100. As shown in the figure, the wiring pattern 34 is continuously formed over three regions of the first region 31, the second region 32, and the third region 33, and the first substrate portion 11 and the second substrate portion 12 are formed. A single circuit is constructed between the and. A resist layer 40 is formed so as to cover the wiring pattern 34.
  • the openings 31a and 32a are openings formed in the first region 31 and the second region 32, respectively.
  • the surfaces of the first substrate portion 11 and the second substrate portion 12 are exposed from the openings 31a and 32a, respectively, and the light emitting elements 51 and 52 are mounted therein.
  • the resist layer 40 is an insulating film-like member formed on the front surface side of the wiring board 30 so as to cover the wiring pattern 34.
  • the resist layer 40 is formed in a region excluding a portion for bonding the light emitting elements 51 and 52 with a metal wire and a portion for electrically connecting from the outside.
  • the material forming the resist layer 40 is not limited, but in order to suppress stray light due to the difference in light reflectance between the surface of the wiring board 30 and the wiring pattern 34, the light reflectance in the region where the resist layer 40 is formed is adjusted. It is preferable to use a light-reflecting material or a light-absorbing material so as to be uniform.
  • the light emitting elements 51 and 52 are members that emit light when a voltage is applied, and are composed of a combination of an LED chip and a phosphor material. Although not shown in FIGS. 1 to 5, the light emitting elements 51 and 52 are electrically connected to the wiring patterns 34 in the first region 31 and the second region 32, respectively, using metal wires or the like.
  • a known compound semiconductor material such as a GaN-based compound that emits blue, violet, or ultraviolet wavelengths as primary light can be used.
  • the phosphor material a known material that is excited by primary light and emits desired secondary light can be used, and a material that obtains white color by mixing with the primary light from the LED chip or a plurality of phosphor materials can be used. It is possible to use one that obtains a white color by mixing a plurality of secondary lights.
  • the first board portion 11 and the second board portion 12 are electrically and mechanically connected to each other by the third region 33 of the wiring board 30. Since the wiring substrate 30 is made of a flexible material, even if the first substrate portion 11 and the second substrate portion 12 are mounted on different surfaces, the third region 33 bends and electrical connection is made between them. Is maintained. Further, since it is not necessary to form the land for connecting the FPC with the solder on the circuit board 100, the space can be saved. When a glass epoxy resin is used as the wiring board 30, the heat resistance can be improved to 150° C. or higher. Further, the glass epoxy resin is more rigid than the conventional FPC, so that the handling in the mounting process becomes easy.
  • FIG. 2 is an exploded perspective view schematically showing the structure of the circuit board 100.
  • the circuit board 100 includes the heat dissipation portion 10 including the first substrate portion 11 and the second substrate portion 12, the adhesive layer 20 including the first adhesive sheet 21 and the second adhesive sheet 22, and the above-described.
  • the wiring board 30 and the wiring board 30 are laminated.
  • the adhesive layer 20 is a sheet-shaped adhesive material arranged between the front surface of the heat dissipation portion 10 and the back surface of the wiring board 30. As shown in FIG. 2, the adhesive layer 20 is separately formed into a first adhesive sheet 21 and a second adhesive sheet 22.
  • the material forming the adhesive layer 20 is not particularly limited, but for example, a prepreg formed in a sheet shape with a thickness of 20 to 200 ⁇ m can be used.
  • the first adhesive sheet 21 has a sheet shape formed in an outer shape corresponding to the first substrate portion 11, and the back surface side contacts the first substrate portion 11 and the front surface side contacts the first region 31. Further, the opening 21a is formed in a region and shape corresponding to the opening 31a.
  • the second adhesive sheet 22 is a sheet formed in an outer shape corresponding to the second substrate portion 12, and the back surface side contacts the second substrate portion 12 and the front surface side contacts the second region 32. Further, the opening 22a is formed in a region and shape corresponding to the opening 32a.
  • the heat dissipation part 10 and the adhesive layer 20 described above can be collectively formed into a plurality of outer shapes from a single plate-shaped member by punching or the like.
  • the resist layer 40 is formed in a predetermined region on the wiring pattern 34, and the outer shape can be formed by punching. ..
  • the heat dissipation portion 10 As a method of manufacturing the circuit board 100, the heat dissipation portion 10, the adhesive layer 20, and the wiring board 30 having a large size are stacked, and the wiring board 30 is adhered onto the heat dissipation portion 10 by applying heat and pressure in a lamination pressing process. A layered structure adhered with layer 20 is obtained.
  • the outer shape of the circuit board 100 can be obtained by collectively punching the obtained laminated structure.
  • the openings 21a, 31a, 22a, 32a may be formed before the laminating press working or may be formed by cutting after the laminating press working.
  • the step of forming the wiring pattern 34 on the wiring board 30 may be performed before or after the lamination pressing step.
  • the light emitting element 51 is mounted on the surface of the first substrate portion 11 exposed in the openings 21a and 31a, and the light emitting element 52 is mounted on the surface of the second substrate portion 12 exposed in the openings 22a and 32a.
  • the light emitting elements 51 and 52 and the wiring pattern 34 are wire-bonded with a metal wire to obtain the circuit board 100 of the present invention.
  • FIG. 3 is a plan view schematically showing an arrangement example of the wiring board 30 when manufacturing the circuit board 100.
  • the two circuit boards 100 are rotated 180 degrees with respect to each other on one glass epoxy resin sheet so that the other first area 31 is located next to one third area 33.
  • FIG. 4 is a schematic perspective view showing a state in which the circuit board 100 is mounted on the heat sink 60.
  • the heat sink 60 is a member having good thermal conductivity, which is arranged in contact with the back surface of the circuit board 100, and may be made of aluminum or the like.
  • a first surface 61 and a second surface 62 are formed in front of the heat sink 60, and a plurality of heat radiation fins 63 are formed on the back surface side.
  • the first surface 61 is a substantially flat surface formed in front of the heat sink 60, and is an area where the first board portion 11 is mounted.
  • the second surface 62 is a substantially flat surface formed in front of the heat sink 60, and is an area on which the second substrate unit 12 is mounted.
  • the first surface 61 and the second surface 62 intersect each other at a predetermined angle to form a substantially V shape.
  • an example is shown in which the first surface 61 and the second surface 62 intersect in a substantially V shape, but it is sufficient if the first surface 61 and the second surface 62 are different surfaces, and their relative positional relationship is Not limited.
  • the wiring board 30 is made of a flexible material, the first board portion 11 and the second board portion 12 are different surfaces, that is, the first surface 61. Even when mounted on the second surface 62, the third region 33 bends and the electrical connection between the two is maintained. Further, since the first region 31, the second region 32, and the third region 33 are integrally formed as a single sheet, they are mechanically and thermally stable and excellent in long-term reliability. ..
  • FIG. 5 is a schematic cross-sectional view showing the structure of a vehicle lighting device 200 using the circuit board 100.
  • the vehicular lamp 200 includes a circuit board 100, a heat sink 60, a reflector 71, a concealing portion 72, a lens 80, a lens holder 81, and a cooling fan 90. Each member is positioned relative to each other and is not shown in the figure. It is fixed by means.
  • the adhesive layer 20 is not formed on the back surface side of the third region 33, and the third region 33 bridges the first region 31 and the second region 32 with a gap from the heat sink 60. ing.
  • the reflector 71 is a member that is arranged in front of the wiring board 30 and reflects the light from the light emitting elements 51 and 52 forward.
  • the concealment portion 72 is a member for concealing unnecessary portions in the vehicle lighting device 200 and preventing stray light when viewed from the front of the lens 80.
  • the lens 80 is a member that is made of a translucent material and irradiates the light from the light emitting elements 51 and 52 forward so as to have a predetermined light distribution.
  • the lens holder 81 is a member for holding the lens 80 while maintaining the relative positional relationship among the lens 80, the wiring board 30, and the reflector 71.
  • the cooling fan 90 is a member that is disposed on the back side of the heat sink 60 and that causes an air flow between the plurality of radiating fins 63 when power is supplied.
  • the light emitting elements 51 and 52 mounted on the wiring board 30 emit light according to the power and the signal, and the light reflected forward by the reflector 71 is a lens. It is irradiated forward through the inside of the holder 81 and the lens 80. Further, the heat generated by the light emission of the wiring board 30 is radiated into the air through the heat sink 60 and cooled by the air blown from the cooling fan 90.
  • the light emitting elements 51, 52 to which power is selectively supplied from the outside via the wiring pattern 34 and the metal wire are turned on.
  • the light distribution distribution in the entire vehicle lighting device 200 is determined, and a light distribution pattern is radiated to the front of the vehicle lighting device 200 by the ADB technique via the reflector 71 and the lens 80. ..
  • the circuit board 100 and the vehicular lamp 200 of the present embodiment even if the first board portion 11 and the second board portion 12 are mounted on different surfaces, that is, the first surface 61 and the second surface 62,
  • the third region 33 bends to maintain the electrical connection between them. Further, since the first region 31, the second region 32, and the third region 33 are integrally formed as a single sheet, they are mechanically and thermally stable and excellent in long-term reliability. .. Further, since it is not necessary to form the land for connecting the FPC with the solder on the circuit board 100, the space can be saved.
  • first surface 61 and the second surface 62 that intersect with each other are formed on the block-shaped heat sink 60 has been shown.
  • the first surface 61 and the second surface 62 may be formed by bending after mounting the substrate unit 12. According to this method, the mounting work can be simplified as compared with mounting the first substrate unit 11 and the second substrate unit 12 on the surfaces intersecting with each other.
  • the wiring board 30 is further divided into a plurality of third regions 33.
  • the area 33 may be provided.
  • an organic EL element or other optical element may be provided, and other electronic parts may be mounted.
  • FIG. 4 shows an example in which the first substrate portion 11 and the second substrate portion 12 are accommodated in the first surface 61 and the second surface 62, respectively, a part thereof may be projected to the outside of the heat sink 60. ..
  • the terminal portion may be projected so that the terminal portion for electrical connection with the outside is connected to the connector.
  • the electrical connection structure to the outside is not limited to the card edge method, and a surface mount connector may be used.
  • Circuit board 200 Vehicle lamp 10... Heat dissipation part 11... First board part 12... Second board part 20... Adhesive layer 21... First adhesive sheet 22... Second adhesive sheet 21a, 22a, 31a, 32a... Opening 30... Wiring substrate 31... First area 32... Second area 33... Third area 34... Wiring pattern 40... Resist layers 51, 52... Light emitting element 60... Heat sink 61... First surface 62... Second surface 63... Radiating fin 71... Reflector 72... Concealing section 80... Lens 81... Lens holder 90... Cooling fan

Abstract

A circuit board and a vehicle light are provided which enable securing long-term reliability while saving space. The circuit board is provided with a first substrate part (11), a second substrate part (12) formed separately from the first substrate part (11), and a flexible substrate (30) having a wiring pattern formed on the surface, wherein the substrate (30) comprises a first region (31) bonded on the back side to the first substrate part (11), a second region (32) bonded on the back side to the second substrate part (12), and a third region (33) provided between the first region (31) and the second region (32).

Description

回路基板及び車両用灯具Circuit board and vehicle lamp
　本発明は、回路基板及び車両用灯具に関する。 The present invention relates to a circuit board and a vehicle lamp.
　車両用灯具の技術分野において、発光部に発光ダイオード（ＬＥＤ：Ｌｉｇｈｔ　Ｅｍｉｔｔｉｎｇ　Ｄｉｏｄｅ）を用いるものが普及している。また、複数のＬＥＤを一次元または二次元的に配列し、対向車両や前走車両の位置に応じて各ＬＥＤの点灯と消灯を切り替える配光可変ヘッドランプ（ＡＤＢ：Ａｄａｐｔｉｖｅ　Ｄｒｉｖｉｎｇ　Ｂｅａｍ）も実用化されてきている。また、発光部に有機ＥＬ（Ｅｌｅｃｔｒｏ　Ｌｕｍｉｎｅｓｃｅｎｃｅ）素子を用いて複雑な表示を行う標識灯なども提案されている（例えば特許文献１を参照）。 In the technical field of vehicle lighting, a light emitting diode (LED: Light Emitting Diode) is widely used in the light emitting section. Also, a light distribution variable headlamp (ADB: Adaptive Driving Beam) that puts a plurality of LEDs in a one-dimensional or two-dimensional array and switches between turning on and off each LED according to the position of an oncoming vehicle or a preceding vehicle has been put into practical use. Has been done. In addition, there has also been proposed a marker lamp that performs a complicated display using an organic EL (Electro Luminescence) element in a light emitting portion (see, for example, Patent Document 1).
　このようなＡＤＢ技術を用いた車両用前照灯や、有機ＥＬ素子を用いた標識灯では、十数個～数十個のように多数の発光部を個別に点灯及び消灯の制御をする必要があり、点灯制御用の配線も発光部の個数に応じて増大する傾向にある。従来から車両用灯具の技術分野において用いられてきたワイヤハーネスでは、このように多数の配線を高密度で電気的に接続することは困難であり、ワイヤ本数の増加によって小型化や軽量化も困難であった。 In such a vehicle headlight that uses the ADB technology and a marker light that uses an organic EL element, it is necessary to individually control the turning on and off of a large number of light emitting parts, such as ten to several tens. Therefore, the wiring for lighting control tends to increase according to the number of light emitting units. With a wire harness that has been used in the technical field of vehicular lamps in the past, it is difficult to electrically connect a large number of wirings with high density in this way, and it is also difficult to reduce the size and weight by increasing the number of wires. Met.
　そこで、車両用灯具の技術分野においても、基板上に高密度なプリント配線を形成して、ＦＰＣ（Ｆｌｅｘｉｂｌｅ　Ｐｒｉｎｔｅｄ　Ｃｉｒｃｕｉｔ）やＦＦＣ（Ｆｌｅｘｉｂｌｅ　Ｆｌａｔ　Ｃａｂｌｅ）等の可撓性のある高密度なフレキシブルケーブルで基板間を電気的に接続することが提案されている（例えば、特許文献１を参照）。 Therefore, even in the technical field of vehicle lighting, a high-density printed wiring is formed on a substrate, and a flexible high-density flexible cable such as FPC (Flexible Printed Circuit) or FFC (Flexible Flat Cable) is used. It has been proposed to electrically connect the substrates (see, for example, Patent Document 1).
　このような従来技術では、基板上に搭載されたコネクタ部にフレキシブルケーブルを挿入することで、フレキシブルケーブルの着脱を可能にしている。しかし、フレキシブルケーブルの着脱をする必要がない場合には、コネクタ部の搭載領域を必要とするため省スペース化を図ることが困難であった。そこで、基板間の端子にフレキシブルケーブルをリフロー工程で直接接続する方法も提案されている。 In such conventional technology, the flexible cable can be attached and detached by inserting the flexible cable into the connector part mounted on the board. However, when it is not necessary to attach or detach the flexible cable, it is difficult to save space because a mounting area for the connector is required. Therefore, a method of directly connecting the flexible cable to the terminal between the boards in the reflow process has also been proposed.
　図６は、従来のフレキシブルケーブルを用いた基板間の接続を示す模式図であり、図６（ａ）は接続前の二つの基板を示し、図６（ｂ）はフレキシブルケーブルを接続した状態を示している。 FIG. 6 is a schematic view showing a connection between boards using a conventional flexible cable, FIG. 6(a) shows two boards before connection, and FIG. 6(b) shows a state in which a flexible cable is connected. Shows.
　図６（ａ）に示すように、基板１と基板２にはそれぞれ配線パターン３とランド４ａ，４ｂが形成されている。ハンダ材を塗布したランド４ａ，４ｂ間にフレキシブルケーブル５を配置してリフロー工程で加熱すると、ランド４ａ，４ｂ間にフレキシブルケーブル５が接続される。このように、二つの基板１と基板２の間をフレキシブルケーブル５で電気的に接続することで、フレキシブルケーブル５が可撓性を有しているため、基板部１２をそれぞれ別平面上に搭載することが可能である。 As shown in FIG. 6A, the wiring pattern 3 and the lands 4a and 4b are formed on the substrate 1 and the substrate 2, respectively. When the flexible cable 5 is arranged between the lands 4a and 4b coated with the solder material and heated in the reflow process, the flexible cable 5 is connected between the lands 4a and 4b. In this way, by electrically connecting the two substrates 1 and 2 with the flexible cable 5, the flexible cable 5 has flexibility, so that the substrate portions 12 are mounted on different planes. It is possible to
特開２０１７－０２７６６１号公報JP, 2017-027661, A
　しかし、リフロー工程でフレキシブルケーブル５をランド４ａ，４ｂに接続する従来の構造では、ランド４ａ，４ｂの面積が必須であり、さらなる省スペース化を図ることが困難であった。また、フレキシブルケーブル５の接続にはハンダ材を用いるため、熱衝撃等のストレスが加わるとクラックが発生する等、長期信頼性を確保することが困難であった。 However, in the conventional structure in which the flexible cable 5 is connected to the lands 4a and 4b in the reflow process, the area of the lands 4a and 4b is essential, and it has been difficult to achieve further space saving. In addition, since a solder material is used for connecting the flexible cable 5, it is difficult to ensure long-term reliability such as cracking when stress such as thermal shock is applied.
　また、フレキシブルケーブル５を構成しているポリイミド層と銅箔層とは、接着剤で接着されているため、接着剤の耐熱性がフレキシブルケーブル５の耐熱性に影響して、後工程の環境温度が制限されてしまうという問題もあった。 Further, since the polyimide layer and the copper foil layer forming the flexible cable 5 are adhered by an adhesive, the heat resistance of the adhesive affects the heat resistance of the flexible cable 5, and the environmental temperature of the post process is increased. There was also the problem of being restricted.
　そこで本発明は、上記従来の問題点に鑑みなされたものであり、省スペース化を図りつつ、長期信頼性を確保することができる回路基板及び車両用灯具を提供することを目的とする。 Therefore, the present invention has been made in view of the above conventional problems, and an object of the present invention is to provide a circuit board and a vehicular lamp that can secure long-term reliability while achieving space saving.
　上記課題を解決するために、本発明の回路基板は、第１基板部と、前記第１基板部とは別体に形成された第２基板部と、可撓性を有し、表面に配線パターンが形成された配線基板を備え、前記配線基板は、裏面が前記第１基板部に接着された第１領域と、裏面が前記第２基板部に接着された第２領域と、前記第１領域及び前記第２領域の間に設けられた第３領域とを有することを特徴とする。 In order to solve the above problems, a circuit board of the present invention has a first board portion, a second board portion formed separately from the first board portion, and has flexibility, and wiring on the surface. A wiring board having a pattern formed thereon, wherein the wiring board has a first area whose back surface is adhered to the first board section, a second area whose back surface is adhered to the second board section, and the first area. It has a 3rd area|region provided between the area|region and the said 2nd area|region, It is characterized by the above-mentioned.
　このような本発明の回路基板では、配線基板の第１領域と第２領域がそれぞれ第１基板部と第２基板部に接着され、第１基板部と第２基板部間が第３領域で接続されるため、ランドやフレキシブルケーブルが不要であり、省スペース化を図りつつ、長期信頼性を確保することができる。 In such a circuit board of the present invention, the first area and the second area of the wiring board are adhered to the first board section and the second board section, respectively, and the third area is provided between the first board section and the second board section. Since they are connected, lands and flexible cables are not required, and long-term reliability can be ensured while saving space.
　また本発明の一態様では、前記第１領域は、前記第１基板部と略同形状である。 Moreover, in one aspect of the present invention, the first region has substantially the same shape as the first substrate portion.
　また本発明の一態様では、前記第３領域の裏面には、接着剤層が形成されていない。 In one aspect of the present invention, the adhesive layer is not formed on the back surface of the third region.
　また本発明の一態様では、前記配線基板は、ガラスエポキシ樹脂からなる。 In one aspect of the present invention, the wiring board is made of glass epoxy resin.
　また本発明の一態様では、前記配線基板は、厚さが０．１ｍｍ～０．３ｍｍの範囲である。 In one aspect of the present invention, the wiring board has a thickness in the range of 0.1 mm to 0.3 mm.
　また、本発明の車両用灯具は、上述した何れか一つに記載の回路基板と、前記回路基板上に搭載された発光素子を備え、前記第１基板部と前記第２基板部とが、異なる平面上に搭載されたことを特徴とする。 Further, a vehicle lamp of the present invention includes the circuit board according to any one of the above, and a light emitting element mounted on the circuit board, wherein the first board portion and the second board portion include: It is characterized by being mounted on different planes.
　本発明では、省スペース化を図りつつ、長期信頼性を確保することができる回路基板及び車両用灯具を提供することができる。 According to the present invention, it is possible to provide a circuit board and a vehicle lighting device that can secure long-term reliability while saving space.
第１実施形態に係る回路基板１００を示す模式斜視図である。It is a schematic perspective view which shows the circuit board 100 which concerns on 1st Embodiment. 回路基板１００の構造を模式的に示す分解斜視図である。3 is an exploded perspective view schematically showing the structure of the circuit board 100. FIG. 回路基板１００上を製造する際の配線基板３０の配置例を模式的に示す平面図である。6 is a plan view schematically showing an arrangement example of the wiring board 30 when manufacturing the circuit board 100. FIG. 回路基板１００をヒートシンク６０に搭載した状態を示す模式斜視図である。3 is a schematic perspective view showing a state where the circuit board 100 is mounted on the heat sink 60. FIG. 回路基板１００を用いた車両用灯具２００の構造を示す模式断面図である。FIG. 3 is a schematic cross-sectional view showing the structure of a vehicular lamp 200 using the circuit board 100. 従来のフレキシブルケーブルを用いた基板間の接続を示す模式図であり、図６（ａ）は接続前の二つの基板を示し、図６（ｂ）はフレキシブルケーブルを接続した状態を示している。It is a schematic diagram which shows the connection between the boards using the conventional flexible cable, FIG.6(a) shows two boards before a connection, and FIG.6(b) has shown the state which connected the flexible cable.
　（第１実施形態）
　以下、本発明の実施の形態について、図面を参照して詳細に説明する。各図面に示される同一または同等の構成要素、部材、処理には、同一の符号を付すものとし、適宜重複した説明は省略する。図１は、本実施形態に係る回路基板１００を示す模式斜視図である。回路基板１００は、第１基板部１１と、第２基板部１２と、配線基板３０と、レジスト層４０とを備えている。 (First embodiment)
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The same or equivalent constituent elements, members, and processes shown in each drawing will be denoted by the same reference numerals, and duplicated description will be appropriately omitted. FIG. 1 is a schematic perspective view showing a circuit board 100 according to this embodiment. The circuit board 100 includes a first board portion 11, a second board portion 12, a wiring board 30, and a resist layer 40.
　第１基板部１１と第２基板部１２は、熱伝導性が良好な材料で形成された略平板状の部材であり、それぞれ別体に形成されている。第１基板部１１と第２基板部１２には、一方の表面に配線基板３０が接着され、複数の発光素子５１，５２が搭載されている。第１基板部１１、第２基板部１２を構成する材料は限定されないが、銅やアルミニウム等の熱伝導性が良好な金属を用いることが好ましい。 The first substrate portion 11 and the second substrate portion 12 are substantially flat plate members made of a material having good thermal conductivity, and are formed separately. A wiring board 30 is bonded to one surface of each of the first board portion 11 and the second board portion 12, and a plurality of light emitting elements 51, 52 are mounted. Although the material forming the first substrate portion 11 and the second substrate portion 12 is not limited, it is preferable to use a metal having good thermal conductivity such as copper or aluminum.
　配線基板３０は、表面に配線パターン３４が形成された基板であり、可撓性を有している。配線基板３０は、後述する接着剤層２０で第１基板部１１及び第２基板部１２に接着されている。また配線基板３０は、第１領域３１、第２領域３２、第３領域３３の３つの領域が一体に形成されており、３つの領域にわたって連続して配線パターン３４が形成されている。 The wiring board 30 is a board having a wiring pattern 34 formed on the surface thereof and has flexibility. The wiring board 30 is adhered to the first board portion 11 and the second board portion 12 with an adhesive layer 20 described later. Further, the wiring board 30 is integrally formed with three regions, that is, a first region 31, a second region 32, and a third region 33, and a wiring pattern 34 is continuously formed over the three regions.
　配線基板３０を構成する材料は限定されないが、ガラスエポキシ樹脂を用いることが可撓性と機械的強度を備えるため好ましい。また配線基板３０の厚さは、０．１ｍｍ～０．３ｍｍの範囲であることが好ましい。厚さが０．３ｍｍよりも大きいと可撓性が十分ではなく曲げ半径が大きくなり、０．１ｍｍよりも小さいと機械的強度を十分に確保できず取り扱いが難しくなる。 The material forming the wiring board 30 is not limited, but it is preferable to use a glass epoxy resin because it has flexibility and mechanical strength. The thickness of the wiring board 30 is preferably in the range of 0.1 mm to 0.3 mm. If the thickness is larger than 0.3 mm, the flexibility is not sufficient and the bending radius becomes large, and if the thickness is smaller than 0.1 mm, the mechanical strength cannot be sufficiently secured and the handling becomes difficult.
　第１領域３１は、第１基板部１１と対応した外形に形成された領域であり、裏面側が第１基板部１１に後述する接着剤層２０で接着されている。また、第１領域３１の所定領域には開口部３１ａが形成されており、開口部３１ａ内では第１基板部１１の表面が露出している。 The first region 31 is a region formed in an outer shape corresponding to the first substrate portion 11, and the back surface side is bonded to the first substrate portion 11 with an adhesive layer 20 described later. Further, an opening 31a is formed in a predetermined area of the first area 31, and the surface of the first substrate portion 11 is exposed in the opening 31a.
　第２領域３２は、第２基板部１２と対応した外形に形成された領域であり、裏面側が第２基板部１２に後述する接着剤層２０で接着されている。また、第２領域３２の所定領域には開口部３２ａが形成されており、開口部３２ａ内では第２基板部１２の表面が露出している。 The second region 32 is a region formed in an outer shape corresponding to the second substrate portion 12, and the back surface side is bonded to the second substrate portion 12 with an adhesive layer 20 described later. Further, an opening 32a is formed in a predetermined area of the second area 32, and the surface of the second substrate portion 12 is exposed inside the opening 32a.
　第３領域３３は、第１領域３１及び第２領域３２の間に設けられた領域である。第３領域３３の裏面側には第１基板部１１も第２基板部１２も存在せず、したがって接着剤層２０も貼り付けられておらず、第１基板部１１と第２基板部１２の間を橋渡しする構造となっている。 The third area 33 is an area provided between the first area 31 and the second area 32. There is neither the first substrate portion 11 nor the second substrate portion 12 on the back surface side of the third region 33, and therefore, the adhesive layer 20 is not attached, and the first substrate portion 11 and the second substrate portion 12 are It has a structure that bridges the spaces.
　配線パターン３４は、配線基板３０の表面に形成された導電性パターンであり、回路基板１００内での各領域間での電気的接続を確保するためのものである。図に示したように、配線パターン３４は、第１領域３１、第２領域３２、第３領域３３の３つの領域にわたって連続して形成されており、第１基板部１１と第２基板部１２との間で一つの回路を構成している。また配線パターン３４を覆うようにレジスト層４０が形成されている。 The wiring pattern 34 is a conductive pattern formed on the surface of the wiring board 30, and is for ensuring electrical connection between the respective regions in the circuit board 100. As shown in the figure, the wiring pattern 34 is continuously formed over three regions of the first region 31, the second region 32, and the third region 33, and the first substrate portion 11 and the second substrate portion 12 are formed. A single circuit is constructed between the and. A resist layer 40 is formed so as to cover the wiring pattern 34.
　開口部３１ａ，３２ａは、それぞれ第１領域３１と第２領域３２に形成された開口である。開口部３１ａ，３２ａからはそれぞれ第１基板部１１と第２基板部１２の表面が露出しており、発光素子５１，５２が搭載されている。 The openings 31a and 32a are openings formed in the first region 31 and the second region 32, respectively. The surfaces of the first substrate portion 11 and the second substrate portion 12 are exposed from the openings 31a and 32a, respectively, and the light emitting elements 51 and 52 are mounted therein.
　レジスト層４０は、配線基板３０の表面側に配線パターン３４を覆うように形成された絶縁性の膜状部材である。レジスト層４０は、発光素子５１，５２との間を金属ワイヤでボンディングする部分と、外部からの電気的接続をする部分を除いた領域に形成されている。レジスト層４０を構成する材料は限定されないが、配線基板３０の表面と配線パターン３４での光反射率が異なることによる迷光を抑制するために、レジスト層４０を形成した領域内の光反射率を均一化するように光反射性材料または光吸収性材料を用いることが好ましい。 The resist layer 40 is an insulating film-like member formed on the front surface side of the wiring board 30 so as to cover the wiring pattern 34. The resist layer 40 is formed in a region excluding a portion for bonding the light emitting elements 51 and 52 with a metal wire and a portion for electrically connecting from the outside. The material forming the resist layer 40 is not limited, but in order to suppress stray light due to the difference in light reflectance between the surface of the wiring board 30 and the wiring pattern 34, the light reflectance in the region where the resist layer 40 is formed is adjusted. It is preferable to use a light-reflecting material or a light-absorbing material so as to be uniform.
　発光素子５１，５２は、電圧が印加されると発光する部材であり、ＬＥＤチップと蛍光体材料との組み合わせによって構成されている。図１～図５では図示を省略しているが、発光素子５１，５２は、金属ワイヤ等を用いてそれぞれ第１領域３１及び第２領域３２の配線パターン３４と電気的に接続されている。ＬＥＤチップとしては青色や紫色、紫外光の波長を一次光として出射するＧａＮ系などの公知の化合物半導体材料を用いることができる。蛍光体材料としては、一次光により励起されて所望の二次光を照射する公知の材料を用いることができ、ＬＥＤチップからの一次光と混色により白色を得るものや、複数の蛍光体材料を用いて複数の二次光の混色により白色を得るものを用いることができる。 The light emitting elements 51 and 52 are members that emit light when a voltage is applied, and are composed of a combination of an LED chip and a phosphor material. Although not shown in FIGS. 1 to 5, the light emitting elements 51 and 52 are electrically connected to the wiring patterns 34 in the first region 31 and the second region 32, respectively, using metal wires or the like. For the LED chip, a known compound semiconductor material such as a GaN-based compound that emits blue, violet, or ultraviolet wavelengths as primary light can be used. As the phosphor material, a known material that is excited by primary light and emits desired secondary light can be used, and a material that obtains white color by mixing with the primary light from the LED chip or a plurality of phosphor materials can be used. It is possible to use one that obtains a white color by mixing a plurality of secondary lights.
　本実施形態の回路基板１００は、第１基板部１１と第２基板部１２の間は、配線基板３０の第３領域３３で電気的にも機械的にも接続されている。配線基板３０は可撓性を有する材料で構成されているため、第１基板部１１と第２基板部１２を異なる面に搭載しても、第３領域３３が曲がって両者間の電気的接続が維持される。また、ＦＰＣをハンダで接続するためのランドを回路基板１００上に形成する必要が無いため、省スペース化を図ることができる。また、配線基板３０としてガラスエポキシ樹脂を用いる場合には、耐熱性を１５０℃以上まで向上させることができる。また、ガラスエポキシ樹脂は従来のＦＰＣよりも剛性があるため、取り付け工程などでのハンドリングが容易になる。 In the circuit board 100 of the present embodiment, the first board portion 11 and the second board portion 12 are electrically and mechanically connected to each other by the third region 33 of the wiring board 30. Since the wiring substrate 30 is made of a flexible material, even if the first substrate portion 11 and the second substrate portion 12 are mounted on different surfaces, the third region 33 bends and electrical connection is made between them. Is maintained. Further, since it is not necessary to form the land for connecting the FPC with the solder on the circuit board 100, the space can be saved. When a glass epoxy resin is used as the wiring board 30, the heat resistance can be improved to 150° C. or higher. Further, the glass epoxy resin is more rigid than the conventional FPC, so that the handling in the mounting process becomes easy.
　図２は、回路基板１００の構造を模式的に示す分解斜視図である。図２に示すように回路基板１００は、第１基板部１１と第２基板部１２からなる放熱部１０と、第１接着シート２１と第２接着シート２２からなる接着剤層２０と、上述した配線基板３０とを積層した構造を有している。 FIG. 2 is an exploded perspective view schematically showing the structure of the circuit board 100. As shown in FIG. 2, the circuit board 100 includes the heat dissipation portion 10 including the first substrate portion 11 and the second substrate portion 12, the adhesive layer 20 including the first adhesive sheet 21 and the second adhesive sheet 22, and the above-described. The wiring board 30 and the wiring board 30 are laminated.
　接着剤層２０は、放熱部１０の表面と配線基板３０の裏面の間に配置されたシート状の接着材料である。図２に示したように、接着剤層２０は第１接着シート２１と第２接着シート２２の二つに分離して形成されている。接着剤層２０を構成する材料は特に限定されないが、例えばプリプレグを２０～２００μｍの厚さでシート状に形成したものを用いることができる。 The adhesive layer 20 is a sheet-shaped adhesive material arranged between the front surface of the heat dissipation portion 10 and the back surface of the wiring board 30. As shown in FIG. 2, the adhesive layer 20 is separately formed into a first adhesive sheet 21 and a second adhesive sheet 22. The material forming the adhesive layer 20 is not particularly limited, but for example, a prepreg formed in a sheet shape with a thickness of 20 to 200 μm can be used.
　第１接着シート２１は、第１基板部１１と対応した外形に形成されたシート状であり、裏面側が第１基板部１１に接触し、表面側が第１領域３１に接触する。また、開口部３１ａに対応する領域と形状で開口部２１ａが形成されている。 The first adhesive sheet 21 has a sheet shape formed in an outer shape corresponding to the first substrate portion 11, and the back surface side contacts the first substrate portion 11 and the front surface side contacts the first region 31. Further, the opening 21a is formed in a region and shape corresponding to the opening 31a.
　第２接着シート２２は、第２基板部１２と対応した外形に形成されたシート状であり、裏面側が第２基板部１２に接触し、表面側が第２領域３２に接触する。また、開口部３２ａに対応する領域と形状で開口部２２ａが形成されている。 The second adhesive sheet 22 is a sheet formed in an outer shape corresponding to the second substrate portion 12, and the back surface side contacts the second substrate portion 12 and the front surface side contacts the second region 32. Further, the opening 22a is formed in a region and shape corresponding to the opening 32a.
　上述した放熱部１０及び接着剤層２０は、それぞれ打ち抜き加工等で一枚の板状部材から複数個の外形を一括して形成することができる。同様に配線基板３０も、一枚のガラスエポキシ樹脂シート上に、配線パターン３４をパターニングした後、レジスト層４０を配線パターン３４上の所定領域に形成し、打ち抜き加工で外形を形成することができる。 The heat dissipation part 10 and the adhesive layer 20 described above can be collectively formed into a plurality of outer shapes from a single plate-shaped member by punching or the like. Similarly, in the wiring board 30, after patterning the wiring pattern 34 on one glass epoxy resin sheet, the resist layer 40 is formed in a predetermined region on the wiring pattern 34, and the outer shape can be formed by punching. ..
　回路基板１００の製造方法としては、大きなサイズの放熱部１０、接着剤層２０及び配線基板３０をそれぞれ重ね、積層プレス工程で加熱及び加圧することで、放熱部１０上に配線基板３０が接着剤層２０で接着された積層構造を得る。得られた積層構造を一括して打ち抜き加工することで、回路基板１００の外形が得られる。開口部２１ａ，３１ａ，２２ａ，３２ａは積層プレス加工前に形成してもよく、積層プレス加工後に切削加工することで形成してもよい。また、配線基板３０上に配線パターン３４を形成する工程は、積層プレス工程の前に実施してもよく、後に実施してもよい。 As a method of manufacturing the circuit board 100, the heat dissipation portion 10, the adhesive layer 20, and the wiring board 30 having a large size are stacked, and the wiring board 30 is adhered onto the heat dissipation portion 10 by applying heat and pressure in a lamination pressing process. A layered structure adhered with layer 20 is obtained. The outer shape of the circuit board 100 can be obtained by collectively punching the obtained laminated structure. The openings 21a, 31a, 22a, 32a may be formed before the laminating press working or may be formed by cutting after the laminating press working. The step of forming the wiring pattern 34 on the wiring board 30 may be performed before or after the lamination pressing step.
　その後、開口部２１ａ，３１ａ内で露出した第１基板部１１の表面に発光素子５１を搭載し、開口部２２ａ，３２ａ内で露出した第２基板部１２の表面に発光素子５２を搭載する。最後に、発光素子５１，５２と配線パターン３４を金属ワイヤでワイヤボンドすることで、本発明における回路基板１００が得られる。 After that, the light emitting element 51 is mounted on the surface of the first substrate portion 11 exposed in the openings 21a and 31a, and the light emitting element 52 is mounted on the surface of the second substrate portion 12 exposed in the openings 22a and 32a. Finally, the light emitting elements 51 and 52 and the wiring pattern 34 are wire-bonded with a metal wire to obtain the circuit board 100 of the present invention.
　図３は、回路基板１００上を製造する際の配線基板３０の配置例を模式的に示す平面図である。図１，２に示したように、本実施形態の回路基板１００では、第１領域３１と第２領域３２の中央から一方に偏った位置に一箇所だけ第３領域３３が設けられている。したがって図３に示したように、一方の第３領域３３の横に他方の第１領域３１が位置するように、一枚のガラスエポキシ樹脂シートに二つの回路基板１００が互いに１８０度回転した位置となるような配置とすることができる。これにより、一枚のガラスエポキシ樹脂シートから、複数の回路基板１００を効率よく形成することができる。 FIG. 3 is a plan view schematically showing an arrangement example of the wiring board 30 when manufacturing the circuit board 100. As shown in FIGS. 1 and 2, in the circuit board 100 of this embodiment, only one third region 33 is provided at a position deviated from the center of the first region 31 and the second region 32 to the one side. Therefore, as shown in FIG. 3, the two circuit boards 100 are rotated 180 degrees with respect to each other on one glass epoxy resin sheet so that the other first area 31 is located next to one third area 33. Can be arranged as follows. Thereby, the plurality of circuit boards 100 can be efficiently formed from one glass epoxy resin sheet.
　図４は、回路基板１００をヒートシンク６０に搭載した状態を示す模式斜視図である。ヒートシンク６０は、回路基板１００の背面に接触して配置された熱伝導性の良好な部材であり、例えばアルミニウム等を用いることができる。ヒートシンク６０の前方には第１面６１と第２面６２が形成されており、背面側には複数の放熱フィン６３が形成されている。 FIG. 4 is a schematic perspective view showing a state in which the circuit board 100 is mounted on the heat sink 60. The heat sink 60 is a member having good thermal conductivity, which is arranged in contact with the back surface of the circuit board 100, and may be made of aluminum or the like. A first surface 61 and a second surface 62 are formed in front of the heat sink 60, and a plurality of heat radiation fins 63 are formed on the back surface side.
　第１面６１は、ヒートシンク６０の前方に形成された略平坦な面であり、第１基板部１１が搭載される領域である。第２面６２は、ヒートシンク６０の前方に形成された略平坦な面であり、第２基板部１２が搭載される領域である。第１面６１と第２面６２とは、互いに所定角度で交差して略Ｖ字形状をなしている。ここでは第１面６１と第２面６２が略Ｖ字形状で交差する例を示したが、第１面６１と第２面６２とが異なる面であればよく、その相対的な位置関係は限定されない。 The first surface 61 is a substantially flat surface formed in front of the heat sink 60, and is an area where the first board portion 11 is mounted. The second surface 62 is a substantially flat surface formed in front of the heat sink 60, and is an area on which the second substrate unit 12 is mounted. The first surface 61 and the second surface 62 intersect each other at a predetermined angle to form a substantially V shape. Here, an example is shown in which the first surface 61 and the second surface 62 intersect in a substantially V shape, but it is sufficient if the first surface 61 and the second surface 62 are different surfaces, and their relative positional relationship is Not limited.
　図４に示したように、回路基板１００は、配線基板３０が可撓性を有する材料で構成されているため、第１基板部１１と第２基板部１２を異なる面である第１面６１と第２面６２に搭載しても、第３領域３３が曲がって両者間の電気的接続が維持される。また、第１領域３１、第２領域３２及び第３領域３３は一体に形成された一枚のシート状であるため、機械的にも熱的にも安定性が高く長期信頼性に優れている。 As shown in FIG. 4, in the circuit board 100, since the wiring board 30 is made of a flexible material, the first board portion 11 and the second board portion 12 are different surfaces, that is, the first surface 61. Even when mounted on the second surface 62, the third region 33 bends and the electrical connection between the two is maintained. Further, since the first region 31, the second region 32, and the third region 33 are integrally formed as a single sheet, they are mechanically and thermally stable and excellent in long-term reliability. ..
　図５は、回路基板１００を用いた車両用灯具２００の構造を示す模式断面図である。車両用灯具２００は、回路基板１００と、ヒートシンク６０と、リフレクタ７１と、隠蔽部７２と、レンズ８０と、レンズホルダ８１と冷却ファン９０とを備え、各部材が相互に位置決めされて図示しない固定手段で固定されている。回路基板１００では、第３領域３３の裏面側には接着剤層２０が形成されておらず、第３領域３３はヒートシンク６０とは間隙を空けて第１領域３１と第２領域３２を橋渡ししている。 FIG. 5 is a schematic cross-sectional view showing the structure of a vehicle lighting device 200 using the circuit board 100. The vehicular lamp 200 includes a circuit board 100, a heat sink 60, a reflector 71, a concealing portion 72, a lens 80, a lens holder 81, and a cooling fan 90. Each member is positioned relative to each other and is not shown in the figure. It is fixed by means. In the circuit board 100, the adhesive layer 20 is not formed on the back surface side of the third region 33, and the third region 33 bridges the first region 31 and the second region 32 with a gap from the heat sink 60. ing.
　リフレクタ７１は、配線基板３０の前方に配置されて発光素子５１，５２からの光を前方に反射する部材である。隠蔽部７２は、レンズ８０の前方から視認した際に、車両用灯具２００内の不要な個所を隠蔽するとともに、迷光を防止するための部材である。 The reflector 71 is a member that is arranged in front of the wiring board 30 and reflects the light from the light emitting elements 51 and 52 forward. The concealment portion 72 is a member for concealing unnecessary portions in the vehicle lighting device 200 and preventing stray light when viewed from the front of the lens 80.
　レンズ８０は、透光性材料で構成されて発光素子５１，５２からの光を所定の配光分布となるように前方に照射するための部材である。レンズホルダ８１は、レンズ８０と配線基板３０及びリフレクタ７１との相対的位置関係を維持した状態で保持するための部材である。 The lens 80 is a member that is made of a translucent material and irradiates the light from the light emitting elements 51 and 52 forward so as to have a predetermined light distribution. The lens holder 81 is a member for holding the lens 80 while maintaining the relative positional relationship among the lens 80, the wiring board 30, and the reflector 71.
　冷却ファン９０は、ヒートシンク６０の背面側に配置されて、電力が供給されることで複数の放熱フィン６３の間に空気の流れを生じさせる部材である。 The cooling fan 90 is a member that is disposed on the back side of the heat sink 60 and that causes an air flow between the plurality of radiating fins 63 when power is supplied.
　車両用灯具２００では、外部から電力及び信号が供給されると、配線基板３０に搭載された発光素子５１，５２が電力と信号に応じて発光し、リフレクタ７１で前方に反射された光がレンズホルダ８１内及びレンズ８０を介して前方に照射される。また、配線基板３０の発光に伴う熱はヒートシンク６０を介して空気中に放熱され、冷却ファン９０からの送風によって冷却される。 In the vehicular lamp 200, when power and a signal are supplied from the outside, the light emitting elements 51 and 52 mounted on the wiring board 30 emit light according to the power and the signal, and the light reflected forward by the reflector 71 is a lens. It is irradiated forward through the inside of the holder 81 and the lens 80. Further, the heat generated by the light emission of the wiring board 30 is radiated into the air through the heat sink 60 and cooled by the air blown from the cooling fan 90.
　本発明の車両用灯具２００を用いた車両用灯具では、外部から配線パターン３４、金属ワイヤを介して、選択的に電力が供給された発光素子５１，５２が点灯する。選択された発光素子５１，５２が点灯することで車両用灯具２００全体での配光分布が決定され、リフレクタ７１及びレンズ８０を介してＡＤＢ技術により車両用灯具２００前方に配光パターンを照射する。 In the vehicle lamp using the vehicle lamp 200 of the present invention, the light emitting elements 51, 52 to which power is selectively supplied from the outside via the wiring pattern 34 and the metal wire are turned on. By lighting the selected light emitting elements 51, 52, the light distribution distribution in the entire vehicle lighting device 200 is determined, and a light distribution pattern is radiated to the front of the vehicle lighting device 200 by the ADB technique via the reflector 71 and the lens 80. ..
　上述したように、本実施形態の回路基板１００及び車両用灯具２００では、第１基板部１１と第２基板部１２を異なる面である第１面６１と第２面６２に搭載しても、第３領域３３が曲がって両者間の電気的接続が維持される。また、第１領域３１、第２領域３２及び第３領域３３は一体に形成された一枚のシート状であるため、機械的にも熱的にも安定性が高く長期信頼性に優れている。また、ＦＰＣをハンダで接続するためのランドを回路基板１００上に形成する必要が無いため、省スペース化を図ることができる。 As described above, in the circuit board 100 and the vehicular lamp 200 of the present embodiment, even if the first board portion 11 and the second board portion 12 are mounted on different surfaces, that is, the first surface 61 and the second surface 62, The third region 33 bends to maintain the electrical connection between them. Further, since the first region 31, the second region 32, and the third region 33 are integrally formed as a single sheet, they are mechanically and thermally stable and excellent in long-term reliability. .. Further, since it is not necessary to form the land for connecting the FPC with the solder on the circuit board 100, the space can be saved.
　（第２実施形態）
　次に、本発明の第２実施形態について説明する。第１実施形態と重複する内容は説明を省略する。第１実施形態では、互いに交差する第１面６１と第２面６２をブロック状のヒートシンク６０上に形成した例を示したが、一枚の平坦な金属板に第１基板部１１と第２基板部１２を搭載した後に、折り曲げ加工で第１面６１と第２面６２を形成するとしてもよい。この方法では、互いに交差する面上に第１基板部１１と第２基板部１２を搭載するよりも、搭載作業を簡便化することができる。 (Second embodiment)
Next, a second embodiment of the present invention will be described. Description of contents overlapping with those of the first embodiment will be omitted. In the first embodiment, an example in which the first surface 61 and the second surface 62 that intersect with each other are formed on the block-shaped heat sink 60 has been shown. The first surface 61 and the second surface 62 may be formed by bending after mounting the substrate unit 12. According to this method, the mounting work can be simplified as compared with mounting the first substrate unit 11 and the second substrate unit 12 on the surfaces intersecting with each other.
　また第１実施形態では、第３領域３３を一つだけ設けた例を示したが、第１領域３１と第２領域３２の間に複数の第３領域３３を設けるとしてもよい。これにより、第１領域３１と第２領域３２の間を接続する配線パターン３４の本数が増加しても、十分に配線パターン３４を形成する面積を確保するとともに、必要な可撓性を得ることができる。 Also, in the first embodiment, an example in which only one third region 33 is provided is shown, but a plurality of third regions 33 may be provided between the first region 31 and the second region 32. As a result, even if the number of wiring patterns 34 connecting the first region 31 and the second region 32 increases, a sufficient area for forming the wiring patterns 34 can be ensured and necessary flexibility can be obtained. You can
　また第１実施形態では、第１領域３１と第２領域３２の二つの間に第３領域３３を設けた例を示したが、配線基板３０をさらに多数に分割してそれぞれの間に第３領域３３を設けるとしてもよい。 Further, in the first embodiment, an example in which the third region 33 is provided between the first region 31 and the second region 32 has been shown, but the wiring board 30 is further divided into a plurality of third regions 33. The area 33 may be provided.
　また、発光素子５１，５２として発光ダイオードを用いる例を示したが、有機ＥＬ素子やその他の光素子を設けるとしてもよく、他の電子部品を搭載するとしてもよい。 Further, although an example in which light emitting diodes are used as the light emitting elements 51 and 52 is shown, an organic EL element or other optical element may be provided, and other electronic parts may be mounted.
　また、図４では第１基板部１１と第２基板部１２がそれぞれ第１面６１と第２面６２内に収まった例を示したが、一部がヒートシンク６０外に突出しているとしてもよい。特に、外部との電気的接続を行うための端子部をコネクタに接続する形状として、端子部を突出させるとしてもよい。また外部との電気的接続構造は、カードエッジ方式に限らず、表面実装コネクタを用いてもよい。 Further, although FIG. 4 shows an example in which the first substrate portion 11 and the second substrate portion 12 are accommodated in the first surface 61 and the second surface 62, respectively, a part thereof may be projected to the outside of the heat sink 60. .. In particular, the terminal portion may be projected so that the terminal portion for electrical connection with the outside is connected to the connector. The electrical connection structure to the outside is not limited to the card edge method, and a surface mount connector may be used.
　本発明は上述した各実施形態に限定されるものではなく、請求項に示した範囲で種々の変更が可能であり、異なる実施形態にそれぞれ開示された技術的手段を適宜組み合わせて得られる実施形態についても本発明の技術的範囲に含まれる。 The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and the embodiments obtained by appropriately combining the technical means disclosed in the different embodiments. Is also included in the technical scope of the present invention.
　本国際出願は、２０１８年１２月１１日に出願された日本国特許出願である特願２０１８－２３１６３２号に基づく優先権を主張するものであり、当該日本国特許出願である特願２０１８－２３１６３２号の全内容は、本国際出願に援用される。 This international application claims priority based on Japanese Patent Application No. 2018-231632 filed on Dec. 11, 2018, and Japanese Patent Application No. 2018-231632, which is the Japanese patent application. The entire content of the issue is incorporated into this international application.
　本発明の特定の実施の形態についての上記説明は、例示を目的として提示したものである。それらは、網羅的であったり、記載した形態そのままに本発明を制限したりすることを意図したものではない。数多くの変形や変更が、上記の記載内容に照らして可能であることは当業者に自明である。 The above description of specific embodiments of the present invention has been presented for purposes of illustration. They are not intended to be exhaustive or to limit the invention to the exact form described. It will be apparent to those skilled in the art that many variations and modifications are possible in light of the above description.
１００…回路基板
２００…車両用灯具
１０…放熱部
１１…第１基板部
１２…第２基板部
２０…接着剤層
２１…第１接着シート
２２…第２接着シート
２１ａ，２２ａ，３１ａ，３２ａ…開口部
３０…配線基板
３１…第１領域
３２…第２領域
３３…第３領域
３４…配線パターン
４０…レジスト層
５１，５２…発光素子
６０…ヒートシンク
６１…第１面
６２…第２面
６３…放熱フィン
７１…リフレクタ
７２…隠蔽部
８０…レンズ
８１…レンズホルダ
９０…冷却ファン

  100... Circuit board 200... Vehicle lamp 10... Heat dissipation part 11... First board part 12... Second board part 20... Adhesive layer 21... First adhesive sheet 22... Second adhesive sheet 21a, 22a, 31a, 32a... Opening 30... Wiring substrate 31... First area 32... Second area 33... Third area 34... Wiring pattern 40... Resist layers 51, 52... Light emitting element 60... Heat sink 61... First surface 62... Second surface 63... Radiating fin 71... Reflector 72... Concealing section 80... Lens 81... Lens holder 90... Cooling fan

Claims (6)

  1. 　第１基板部と、
    　前記第１基板部とは別体に形成された第２基板部と、
    　可撓性を有し、表面に配線パターンが形成された配線基板を備え、
    　前記配線基板は、裏面が前記第１基板部に接着された第１領域と、裏面が前記第２基板部に接着された第２領域と、前記第１領域及び前記第２領域の間に設けられた第３領域とを有することを特徴とする回路基板。     A first substrate portion,
    A second substrate portion formed separately from the first substrate portion;
    Having a wiring board having flexibility and a wiring pattern formed on the surface,
    The wiring board is provided between the first area having the back surface adhered to the first board portion, the second area having the back surface adhered to the second board portion, and between the first area and the second area. A printed circuit board having a third region formed therein.
  2. 　請求項１に記載の回路基板であって、
    　前記第１領域は、前記第１基板部と略同形状であることを特徴とする回路基板。     The circuit board according to claim 1, wherein
    The circuit board, wherein the first region has substantially the same shape as the first board portion.
  3. 　請求項１または２に記載の回路基板であって、
    　前記第３領域の裏面には、接着剤層が形成されていないことを特徴とする回路基板。     The circuit board according to claim 1 or 2, wherein
    An adhesive layer is not formed on the back surface of the third region.
  4. 　請求項１から３の何れか一つに記載の回路基板であって、
    　前記配線基板は、ガラスエポキシ樹脂からなることを特徴とする回路基板。     The circuit board according to any one of claims 1 to 3,
    The circuit board is characterized in that the wiring board is made of glass epoxy resin.
  5. 　請求項１から４の何れか一つに記載の回路基板であって、
    　前記配線基板は、厚さが０．１ｍｍ～０．３ｍｍの範囲であることを特徴とする回路基板。     The circuit board according to any one of claims 1 to 4,
    The circuit board is characterized in that the wiring board has a thickness in a range of 0.1 mm to 0.3 mm.
  6. 　請求項１から５の何れか一つに記載の回路基板と、
    　前記回路基板上に搭載された発光素子を備え、
    　前記第１基板部と前記第２基板部とが、異なる平面上に搭載されたことを特徴とする車両用灯具。

          A circuit board according to any one of claims 1 to 5,
    A light emitting device mounted on the circuit board,
    The vehicular lamp, wherein the first board portion and the second board portion are mounted on different planes.

PCT/JP2019/047793 2018-12-11 2019-12-06 Circuit board and vehicle light WO2020121961A1 (en)

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JP7447698B2 (en) * 2020-06-24 2024-03-12 市光工業株式会社 Vehicle lights

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