JP2017112147A - Light-emitting module, lamp fitting, and circuit board for light-emitting elements - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting module capable of mounting a plurality of LEDs in high density and improving heat dissipation, lamp fitting, and a circuit board for light-emitting elements.SOLUTION: A light-emitting module comprises a mounting substrate in which a plurality of patterns are formed on one surface and the other surface of a support base material, and a plurality of light-emitting elements mounted on a surface of a pattern mounting region. The pattern includes a first mounting region formed on one surface and mounted with a light-emitting element, a first non-mounting region formed in a position corresponding to the first mounting region on the other surface, a second mounting region formed on the other surface and mounted with a light-emitting element, and a second non-mounting region formed in the position corresponding to the second mounting region on one surface. The first non-mounting region and the second non-mounting region are formed of a material having higher thermal conductivity than the support base material. The first mounting region and the second non-mounting region are formed adjacent to each other.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a light emitting module, a lamp, and a circuit board for a light emitting element.

  In recent years, a lamp using a light emitting diode (LED) as a light source as a light source has been put into practical use. In these conventional technologies, in order to make the light from the plurality of LEDs uniform and prevent the individual LEDs from being visually recognized from the outside, the light from the LEDs mounted on the circuit board is reflected by a reflecting mirror to the front. The light is extracted (Patent Documents 1-3).

  In Patent Document 1, a plurality of LED packages are mounted on the upper and lower surfaces of a circuit board, and light from the LED package is reflected forward by reflecting mirrors provided above and below the circuit board. The light source part is made compact by making effective use of the mounting area. In Patent Document 2, an LED is mounted on a support substrate, the support substrate and the LED are mounted on a support body provided with a heat sink, and a plurality of support bodies are combined with a reflector facing upward or downward. The support and reflector are integrated. In Patent Document 3, a circuit pattern is formed on one surface of a circuit board, a plurality of LEDs are mounted, and the heat radiation efficiency is improved by increasing the area of the circuit pattern in a region where a reflector is provided.

JP 2003-100114 A JP 2013-131316 A Japanese Patent Laying-Open No. 2015-032472

  However, Patent Document 1 uses an insertion mounting type LED package in which lead pins are inserted into a substrate for mounting, and it is difficult to increase the mounting density of LEDs to secure the light quantity and to improve the heat radiation efficiency. It was. Further, in Patent Document 2, the heat sink is improved by integrating the support body provided with the heat sink and the reflector, but the LED can be mounted only on one surface of the support substrate, and the mounting density of the LED is increased. It was difficult to do. Moreover, in patent document 3, since the circuit board was mounted in the heat sink, LED was mounted only on one side of a circuit board, and it was difficult to raise a mounting density.

  Therefore, the present invention has been made in view of the above-described conventional problems, and provides a light emitting module, a lamp, and a light emitting element circuit board capable of mounting a plurality of LEDs with high density and improving heat dissipation. For the purpose.

  In order to solve the above-described problems, a light emitting module of the present invention includes a mounting substrate in which a plurality of patterns are formed on one surface and the other surface of a support base material, and a plurality of mounted on the surface of the mounting region of the pattern. A light-emitting element, and the pattern is formed on a first mounting area on the one surface where the light-emitting element is mounted, and on a position corresponding to the first mounting area on the other surface. One non-mounting area, a second mounting area formed on the other surface and mounted with the light emitting element, and a second mounting area formed at a position corresponding to the second mounting area on the one surface. A non-mounting region, wherein the first non-mounting region and the second non-mounting region are formed of a material having a higher thermal conductivity than the support base, and the first mounting region and the second non-mounting region The non-mounting area is formed adjacent to each other

  In such a light emitting module of the present invention, a mounting region and a non-mounting region are formed adjacent to each other on one surface of the mounting substrate, and a back surface side of the mounting region has a non-mounting region having a higher thermal conductivity than the support base. Therefore, it is possible to improve the heat dissipation from the non-mounting area while mounting the light emitting elements on both sides to realize high-density mounting.

  The area of the first mounting region may be larger than the area of the first non-mounting region.

  The first mounting area and the second mounting area may have lap areas that overlap each other in plan view.

  The first non-mounting region and the second non-mounting region are formed of a conductive material, and the first mounting region and the first non-mounting region are formed by a first through connection penetrating the support base material. And the second mounting region and the second non-mounting region may be electrically connected by a second through connection penetrating the support base material.

  Moreover, the lamp of the present invention is characterized by including the light emitting module.

  The circuit board for a light-emitting element of the present invention is a circuit board for a light-emitting element in which a plurality of patterns are formed on one surface and the other surface of a support base material, and the pattern is formed on the one surface. A first mounting region on which the light emitting element is mounted, a first non-mounting region formed at a position corresponding to the first mounting region on the other surface, and the light emission formed on the other surface. A second mounting region on which an element is mounted; and a second non-mounting region formed at a position corresponding to the second mounting region on the one surface, the first non-mounting region and The second non-mounting region is formed of a material having a higher thermal conductivity than the support base material, and the first mounting region and the second non-mounting region are formed adjacent to each other. .

  Even in such a circuit board for a light-emitting element of the present invention, a mounting region and a non-mounting region are formed adjacent to each other on the one surface, and the back surface side of the mounting region is a non-mounting region having a higher thermal conductivity than the support base. Therefore, it is possible to improve the heat dissipation from the non-mounting area while mounting the light emitting elements on both sides to enable high-density mounting.

  In the present invention, it is possible to provide a light emitting module, a lamp, and a circuit board for a light emitting element capable of mounting a plurality of LEDs with high density and improving heat dissipation.

It is a schematic cross section which shows the light emitting module which concerns on 1st Embodiment. It is a figure for demonstrating the pattern 12 formed in the mounting substrate 20 in detail, Fig.2 (a) shows the surface side 11a, FIG.2 (b) is a schematic top view which showed the back surface side 11b. 3 is a schematic plan view showing a positional relationship between a mounting area 12a and a non-mounting area 12b formed on the mounting substrate 20. FIG. It is a model front view which shows the outline of the vehicle lamp 2 using the light emitting module 1. FIG. It is a schematic cross section which shows the outline of the vehicle lamp 2 using the light emitting module 1, and has shown the cross section in the AA position of FIG. It is a schematic cross section which shows the light emitting module which concerns on 2nd Embodiment. It is the simulation result which compares the ultimate temperature of the mounting substrate 20 surface when the area ratio of the mounting area 12a and the non-mounting area 12b is changed. It is the graph which plotted the ultimate temperature of the mounting area | region of LED1-6 of the mounting board | substrate 20 among the simulation results shown in FIG. It is a schematic cross section which shows the light emitting module which concerns on 3rd Embodiment. It is a schematic cross section which shows the light emitting module which concerns on 4th Embodiment. It is a schematic cross section which shows the light emitting module which concerns on 5th Embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The same or equivalent components, members, and processes shown in the drawings are denoted by the same reference numerals, and repeated descriptions are omitted as appropriate.
(First embodiment)
FIG. 1 is a schematic cross-sectional view showing a light emitting module according to a first embodiment of the present invention. The light emitting module 1 of the present embodiment includes a support base 11, a pattern 12, a through connection 13, and a light emitting element 14.

  The support base material 11 has a pattern 12 formed on the front surface side 11a and the back surface side 11b to form a mounting substrate 20, and the mounting substrate 20 is a circuit substrate for mounting a light emitting element 14 to form a circuit. . The material constituting the support substrate 11 may be any material that can be used as a normal printed wiring board, such as an insulating material such as a glass epoxy resin, an insulating film formed on the front and back surfaces of a metal plate, a flexible substrate, and the like. It may be.

  The pattern 12 is a figure formed on the front surface side 11a and the back surface side 11b of the support substrate 11, and a mounting region 12a where the light emitting element 14 is mounted and a non-mounting region 12b where the light emitting element 14 is not mounted are formed. ing. Since the mounting region 12a is a conductive path for supplying a current to the light emitting element 14, it is formed of a conductive material. The non-mounting region 12b is formed of a material having a higher thermal conductivity than that of the support base 11, and may be formed of a conductive material or a non-conductive material. As will be described later, in order to use the non-mounting region 12b as a part of the power supply path to the light emitting element 14, the non-mounting region 12b is preferably formed of a conductive material.

  The mounting area 12a and the non-mounting area 12b are formed at corresponding positions on both surfaces of the support base material 11 to constitute a pair of patterns. Here, the positions corresponding to both surfaces are the mounting region 12a formed on one surface of the support base material 11 and the non-mounting region 12b formed on the other surface when the support base material 11 is viewed in plan. It sometimes means having overlapping areas. Further, the mounting region 12a and the non-mounting region 12b are formed adjacent to each other on the front surface side 11a or the back surface side 11b of the support substrate 11.

  The through connection 13 is a member for penetrating the support base material 11 to thermally connect the mounting region 12a and the non-mounting region 12b, and when the non-mounting region 12b is formed of a conductive material. Both are electrically connected. The formation position of the through connection 13 is not limited. However, as shown in FIG. 1, by forming it around the region where the light emitting element 14 is mounted, light emission can be performed without affecting the flatness of the mounting region of the light emitting element 14. Heat generated from the element 14 can be efficiently transmitted to the non-mounting region 12b side. The through connection 13 can be formed by using a known technique such as a through hole or a via in which a conductive material is formed in a hole penetrating the support base 11.

The light emitting element 14 is an element that is mounted on the mounting region 12a and emits light when supplied with a current. Examples of the light emitting element 14 include a light emitting diode, an organic EL, and a semiconductor laser. Although the light emitting element 14 may have any shape, it is preferable to use a surface mounting type in order to improve the mounting density and heat dissipation. For use in lamps and lighting applications, the light emitting element 14 preferably emits white light, but may emit light of each color of RGB or emit light of other colors.
FIG. 2 is a diagram for explaining the pattern 12 formed on the mounting substrate 20 in detail. FIG. 2A shows a front surface side 11a, and FIG. 2B shows a schematic plane showing a back surface side 11b. FIG. As shown in FIGS. 2A and 2B, mounting areas 12a and non-mounting areas 12b are alternately formed in a line on both the front surface side 11a and the back surface side 11b. The area of the mounting region 12a is formed larger than the area of the non-mounting region 12b. Here, an example in which the mounting area 12a and the non-mounting area 12b are arranged one-dimensionally is shown, but a two-dimensional arrangement such as a matrix or series-parallel connection may be used.

  As described in FIG. 1, a plurality of through connections 13 are formed in the mounting region 12 a so as to surround the light emitting element 14. A cathode land (not shown) is formed in an area of the mounting area 12a where the light emitting element 14 is mounted, and the cathode of the light emitting element 14 is electrically connected by solder or the like. The anode of the light emitting element 14 is connected to an anode land (not shown) formed in the wiring pattern 15. Further, a current is supplied to the light emitting element 14 from a drive circuit (not shown) provided outside the mounting substrate 20 in the mounting region 12a and the non-mounting region 12b. The wiring pattern 15 is a conductive pattern formed by extending from the non-mounting region 12 b on the support base material 11. In this embodiment, the through connection 13 is provided in the cathode side pattern to transfer heat from the mounting region 12a to the non-mounting region 12b. However, the heat radiation from the anode side of the light emitting element 14 to be mounted is emphasized. In this case, the through-connection 13 may be provided on the anode side after appropriately changing the pattern shape of the non-mounting region 12b.

  The non-mounting region 12b formed on the other surface corresponding to the mounting region 12a is electrically connected to the mounting region 12a by the through connection 13 and has the same potential. Therefore, by mounting the light emitting elements 14 on the anode land and the cathode land, the plurality of light emitting elements 14 are connected in series. Further, the light emitting elements can be connected in parallel by appropriately combining the conductive patterns.

  FIG. 3 is a schematic plan view showing the positional relationship between the mounting region 12a and the non-mounting region 12b formed on the mounting substrate 20. As shown in FIG. FIG. 3 is a view as seen from the front surface side 11a of the mounting substrate 20. The mounting region 12a, the non-mounting region 12b and the wiring pattern 15 formed on the front surface side 11a are represented by solid lines, and the mounting region formed on the back surface side 11b. 12a, the non-mounting region 12b, and the wiring pattern 15 are represented by broken lines. Since the area of the mounting area 12a is larger than that of the non-mounting area 12b, the mounting areas 12a formed on the front side 11a and the back side 11b are hatched in FIG. It overlaps in the region 12c.

  When a current and a drive signal are supplied from the outside of the light emitting module 1, the drive circuit supplies the current through the wiring pattern 15 to cause the light emitting element 14 to emit light. In the light emitting element 14, heat is generated with light emission, but the generated heat is transmitted to the entire mounting region 12a and is radiated from the surface. Further, since the non-mounting region 12b formed at a position corresponding to the mounting region 12a is formed of a material having a higher thermal conductivity than the support base material 11, the heat transmitted through the through connection 13 is supported. It is transmitted to the entire non-mounting region 12b and dissipated better than transmitting the base material 11. Thereby, it is possible to improve heat dissipation by dissipating heat from both surfaces while mounting the light emitting elements 14 on both the front surface side 11a and the back surface side 11b of the mounting substrate 20 to improve the mounting density.

  At this time, heat radiation from the mounting region 12 a close to the light emitting element 14 is more effective than heat radiation from the non-mounting region 12 b where heat is transmitted to the back surface side of the mounting substrate 20 through the through connection 13. Therefore, the heat dissipation efficiency from the light emitting element 14 can be further improved by making the area of the mounting region 12a larger than that of the non-mounting region 12b. Further, in the peripheral area of the non-mounting area 12b, the heat transfer path from the light emitting element 14 becomes long, and the degree of contribution to heat dissipation becomes relatively small. Therefore, the weight of the entire pattern 12 is reduced by removing the peripheral part. be able to. Further, the mounting surface 12a formed on the front surface side 11a and the back surface side 11b is overlapped in plan view in the wrap region 12c, so that the same surface of the mounting substrate 20 can be obtained rather than a positional relationship that does not overlap in the wrap region 12c. Thus, the distance between the mounting region 12a and the non-mounting region 12b can be reduced, and the heat dissipation can be improved while improving the mounting density of the light-emitting elements 14. The mounting substrate 20 and the light emitting module 1 can be downsized by improving the mounting density and heat dissipation of the light emitting elements 14.

  As a lamp using the light emitting module 1 described above, an example used for a vehicle lamp is shown in FIGS. FIG. 4 is a schematic front view showing an outline of the vehicular lamp 2 using the light emitting module 1. FIG. 5 is a schematic cross-sectional view showing an outline of the vehicular lamp 2 using the light emitting module 1, and shows a cross section at the position AA in FIG. In addition, although the vehicle lamp is shown here as an example, it can also be used as various lighting fixtures such as a ceiling lamp and a flashlight.

  As shown in FIG. 4, the vehicular lamp 2 is a headlamp including a plurality of light source units such as a high beam unit 21, a low beam unit 22, a side turn signal lamp 23, and a clearance lamp 24. In the present embodiment, an example in which the above-described light emitting module 1 is used for the low beam unit 22 is shown, and a cross-sectional view at the AA position in FIG. 4 is shown in FIG. In the present embodiment, an example in which the light emitting module 1 is used as the low beam unit 22 is shown, but the application is not limited to the low beam unit 22 and may be used for other light source units such as the high beam unit 21.

  As shown in FIG. 5, the low beam unit 22 includes a lamp body 31, an outer cover 32, an adjusting screw 33, a bracket 34, an upper reflector 35a, a lower reflector 35b, a mounting rib 35c, an extension 36, and a drive circuit 37. Yes. Further, the light emitting module 1 having the mounting substrate 20 and the light emitting element 14 is accommodated therein.

  The lamp body 31 is a housing that forms the outer shape of the low beam unit 22. The lamp body 31 accommodates a member drawn inside and an outer cover 32 is attached to the front surface. The outer cover 32 is a member for taking out the light from the light emitting element 14 to the outside front, and is made of a translucent material and covers the front surface of the lamp body 31 to protect the inside. The adjusting screw 33 is inserted into a hole provided on the rear surface of the lamp body 31, and a bracket 34 is attached to the tip of the adjusting screw 33 inside the lamp body 31.

  A mounting rib 35c of the upper reflector 35a, a mounting rib 35c of the lower reflector 35b, and the mounting board 20 are attached to the bracket 34. The upper reflector 35 a is formed with a reflection surface 35 d for reflecting light from the light emitting element 14 mounted on the upper side of the mounting substrate 20 forward, and the lower reflector 35 b is mounted on the lower side of the mounting substrate 20. A reflection surface 35e for reflecting light from the light emitting element 14 forward is formed.

  As described above, the drive circuit provided outside the mounting substrate 20 causes the light emitting element 14 to emit light in response to an external current supply and a control signal. Light from the light emitting elements 14 mounted on both surfaces of the mounting substrate 20 is reflected by the upper reflector 35a and the lower reflector 35b, and is irradiated forward from the outer cover 32.

  In the low beam unit 22, the direction of the bracket 34 is adjusted inside the low beam unit 22 by rotating the adjusting screw 33 attached to the rear of the lamp body 31 from the outside so that the directions of the upper reflector 35 a and the lower reflector 35 b are adjusted. Adjust and fine-tune the direction of light irradiation. In the present embodiment, an example of a structure using the bracket 34 is shown, but a structure without a conventionally known bracket may be used.

In the vehicular lamp 2 according to the present embodiment, since the light-emitting element 14 is mounted on both sides with a single mounting board 20, the weight can be reduced at the same time as cost reduction. In addition, since the process of assembling a plurality of mounting boards is eliminated, the assembly process can be reduced to shorten the manufacturing process, and the assembly error can be eliminated to improve the accuracy of the light distribution pattern. In addition, heat dissipation can be improved while improving the mounting density of the light emitting elements 14. Further, since the light emitting elements 14 are mounted on both surfaces of the mounting substrate 20, heat generated in the light emitting elements 14 can be dissipated and dissipated on both surfaces of the mounting substrate 20, and the warpage of the substrate can be reduced. Thereby, the position shift of the light emitting element 14 in the vehicular lamp 2 can be prevented, and the shift of the positional relationship with the optical member can be reduced, so that an appropriate light distribution can be projected.
(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIGS. In the present embodiment, the area ratio of the mounting region 12a and the non-mounting region 12b is different from that of the first embodiment, and the other configuration is the same as that of the first embodiment, so that the duplicate description is omitted. FIG. 6 is a schematic cross-sectional view showing a light emitting module according to a second embodiment of the present invention.

  As shown in FIG. 6, the light emitting module 3 of the present embodiment also has a mounting region 12a and a non-mounting region 12b formed at positions corresponding to the front surface side 11a and the back surface side 11b of the support substrate 11, respectively. In FIG. 2, the mounting areas 12a and the non-mounting areas 12b are alternately provided adjacent to each other. In the present embodiment, the areas of the mounting area 12a and the non-mounting area 12b are approximately the same, and the shape and arrangement are also substantially the same. Accordingly, a lap region that overlaps when viewed in plan is not formed.

  FIG. 7 is a simulation result comparing the reached temperatures of the front surface and the back surface of the mounting substrate 20 when the area ratio of the mounting region 12a and the non-mounting region 12b is changed. FIG. 7A shows a case where the area ratio a: b of the mounting region 12a and the non-mounting region 12b is 5: 5, and FIG. 7B shows a case where a: b = 6: 4. 7 (c) shows a: b = 7: 3, FIG. 7 (d) shows a case where a: b = 8: 2, and FIG. 7 (e) shows a case where a: b = 10: 0. Is shown. Here, 10: 0 in FIG. 7E is an example in which the non-mounting region 12b and the through connection 13 are not formed. In the thermal fluid simulation, the calculation is performed by matching the conditions other than the area ratio in each example. In any result, the front surface side 11a of the mounting substrate 20 is shown in the upper stage and the back surface side 11b is shown in the lower stage. The example which used LED1 to LED6 as the light emitting element 14 in order from the lower left side was calculated.

  FIG. 8 is a graph in which the reached temperatures Tb1 to Tb6 in the region where the LEDs 1 to 6 of the mounting substrate 20 are mounted are plotted among the simulation results shown in FIG. As shown in FIGS. 7 and 8, the reached temperatures of the LEDs 1 and 6 located at both ends of the mounting substrate 20 are the lowest, and the reached temperatures of the LEDs 3 and 4 located at the center are the highest and are located between them. The LEDs 2 and 5 have an intermediate temperature. In any of the examples, it can be seen that heat is conducted well throughout the mounting region 12a and the non-mounting region 12b, and heat dissipation is improved.

  Since the light emitting element 14 tends to change the light emission wavelength and the light emission efficiency depending on the temperature, it is preferable that the temperature distribution difference in the light emitting module 1 is small. As shown in FIGS. 7 and 8, the difference between the ultimate temperatures of the LEDs 1 and 6 and the ultimate temperatures of the LEDs 3 and 4 decreases as the area ratio a: b increases. The difference is also small. In addition, it can be seen that as the difference in the area ratio a: b increases, the ultimate temperature of the LEDs 2 to 5 decreases, and the heat dissipation performance of the light emitting module 1 as a whole improves.

However, in the example of 10: 0 shown in FIG. 7E, it is necessary to always maximize the area of the mounting region 12a, and this cannot always be realized with an actual wiring pattern. Therefore, by providing the non-mounting region 12b, the front and back surfaces of the mounting substrate 20 can be used effectively for heat dissipation, and at least the area of the non-mounting region 12b such that the area ratio a: b is about 8: 2. As described above, even when the area ratio of the mounting region 12a and the non-mounting region 12b shown in FIG. 6 of this embodiment is 5: 5, the light emitting element 14 emits light. The generated heat is transmitted to the entire mounting region 12a and radiated from the surface, and the heat transmitted through the through connection 13 is radiated well in the entire non-mounting region 12b. Thereby, it is possible to improve heat dissipation by dissipating heat from both surfaces while mounting the light emitting elements 14 on both the front surface side 11a and the back surface side 11b of the mounting substrate 20 to improve the mounting density.

  Further, if the area of the mounting region 12a is made larger than that of the non-mounting region 12b, the heat dissipation efficiency from the light emitting element 14 can be further improved. In this case, the peripheral portion having a small contribution to heat dissipation can be removed from the non-mounting region 12b, and the weight of the entire pattern 12 can be reduced. The mounting area 12a formed on the front surface side 11a and the back surface side 11b is overlapped in plan view in the wrapping area 12c, thereby reducing the distance between the mounting area 12a and the non-mounting area 12b on the same surface of the mounting substrate 20. Therefore, heat dissipation can be improved while improving the mounting density of the light-emitting elements 14. The mounting substrate 20 and the light emitting module 1 can be downsized by improving the mounting density and heat dissipation of the light emitting elements 14.

Further, since the light emitting elements 14 are mounted on both surfaces of the mounting substrate 20, heat generated in the light emitting elements 14 can be dissipated and dissipated on both surfaces of the mounting substrate 20, and the warpage of the substrate can be reduced. Thereby, the position shift of the light emitting element 14 in the vehicular lamp 2 can be prevented, and the shift of the positional relationship with the optical member can be reduced, so that an appropriate light distribution can be projected.
(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIG. In this embodiment, arrangement | positioning of the mounting area | region 12a and the non-mounting area | region 12b provided in the surface side 11a and the back surface side 11b of the support base material 11 differs from 1st Embodiment, and another structure is the same as 1st Embodiment. Therefore, the overlapping description is omitted. FIG. 9 is a schematic cross-sectional view showing a light emitting module according to a third embodiment of the present invention.

  As shown in FIG. 9, the light emitting module 4 of the present embodiment also has a mounting region 12a and a non-mounting region 12b formed on the front surface 11a and the back surface 11b of the mounting substrate 20 at positions corresponding to the mounting region 12a. An arrangement in which the non-mounting areas 12b are adjacent to each other and an arrangement in which the mounting areas 12a and the non-mounting areas 12b are adjacent to each other are mixed. In the present embodiment, the area of the mounting region 12a is larger than the area of the non-mounting region 12b, and a wrap region is formed in which the mounting regions 12a overlap each other in plan view.

  Also in this embodiment, the heat generated by the light emission from the light emitting element 14 is transmitted to the entire mounting region 12a and radiated from the surface, and the heat transmitted through the through connection 13 is the entire non-mounting region 12b. Heat dissipation. Thereby, it is possible to improve heat dissipation by dissipating heat from both surfaces while mounting the light emitting elements 14 on both the front surface side 11a and the back surface side 11b of the mounting substrate 20 to improve the mounting density.

  Further, since the area of the mounting region 12a is larger than that of the non-mounting region 12b, the peripheral portion having a small contribution to heat dissipation can be removed from the non-mounting region 12b, and the weight of the entire pattern 12 can be reduced. In addition, the mounting area 12a and the non-mounting area 12b are provided adjacent to each other at least at one location so that the mounting areas 12a overlap each other in a plan view in the wrap area 12c. The distance between the region 12a and the non-mounting region 12b can be reduced, and the heat dissipation can be improved while improving the mounting density of the light emitting elements 14. The mounting substrate 20 and the light emitting module 1 can be downsized by improving the mounting density and heat dissipation of the light emitting elements 14.

Further, since the light emitting elements 14 are mounted on both surfaces of the mounting substrate 20, heat generated in the light emitting elements 14 can be dissipated and dissipated on both surfaces of the mounting substrate 20, and the warpage of the substrate can be reduced. Thereby, the position shift of the light emitting element 14 in the vehicular lamp 2 can be prevented, and the shift of the positional relationship with the optical member can be reduced, so that an appropriate light distribution can be projected.
(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described with reference to FIG. This embodiment is different from the second embodiment in that the through connection 13 is not provided between the mounting region 12a and the non-mounting region 12b provided on the front surface side 11a and the back surface side 11b of the support base material 11, Since the configuration is the same as that of the second embodiment, redundant description is omitted. FIG. 10 is a schematic cross-sectional view showing a light emitting module according to the fourth embodiment of the present invention.

  As shown in FIG. 10, the light emitting module 5 of the present embodiment also has a mounting area 12a and a non-mounting area 12b formed on the front surface 11a and the back surface 11b of the mounting substrate 20 at positions corresponding to each other. The mounting area 12a and the non-mounting area 12b are alternately provided adjacent to each other. In the present embodiment, heat is transferred by the mounting substrate 20 between the mounting region 12a and the non-mounting region 12b formed at corresponding positions on the front surface side 11a and the back surface side 11b.

  As shown in the present embodiment, even when the through connection 13 is not formed between the mounting region 12a and the non-mounting region 12b, the mounting region 12a and the non-mounting region 12b have the front side 11a and the back side 11b. Therefore, the heat generated in the light emitting element 14 is transmitted to the non-mounting region 12b and dissipated. Since the non-mounting region 12b is formed of a material having a higher thermal conductivity than the support base material 11, the heat dissipation efficiency is improved as compared with the case where heat is radiated from the back side of the light emitting element 14 with only the mounting substrate 20. Thereby, it is possible to improve heat dissipation by dissipating heat from both surfaces while mounting the light emitting elements 14 on both the front surface side 11a and the back surface side 11b of the mounting substrate 20 to improve the mounting density.

Further, since the light emitting elements 14 are mounted on both surfaces of the mounting substrate 20, heat generated in the light emitting elements 14 can be dissipated and dissipated on both surfaces of the mounting substrate 20, and the warpage of the substrate can be reduced. Thereby, the position shift of the light emitting element 14 in the vehicular lamp 2 can be prevented, and the shift of the positional relationship with the optical member can be reduced, so that an appropriate light distribution can be projected.
(Fifth embodiment)
Next, a fifth embodiment of the present invention will be described with reference to FIG. This embodiment is different from the first embodiment in that the non-mounting region 12b and the through connection 13 are not provided, and the area ratio a: b shown in FIG. 7E in the second embodiment is 10: 0. It corresponds to the case. FIG. 11 is a schematic cross-sectional view showing a light emitting module according to a fifth embodiment of the present invention.

  As shown in FIG. 11, also in the light emitting module 6 of this embodiment, the mounting area 12a is formed in the surface side 11a and the back surface side 11b of the support base material 11, and the wrap area | region where the mounting area 12a overlaps planarly is shown. Is formed. As shown in FIG. 11, the mounting region 12 a extends to a position immediately below the light emitting element 14 mounted on the back surface side. In the fourth embodiment, since the through-connection 13 is not formed, the non-mounting region 12b is electrically floated. In the present embodiment, the mounting area has the same pattern area as that in the case of forming the non-mounting region 12b. 12a can be secured, and the electrically floating region can be reduced while maintaining the heat dissipation efficiency.

  Also in this embodiment, since the mounting region 12a and the non-mounting region 12b are formed in a wrap region where the mounting regions 12a overlap each other in plan view, the distance between the mounting regions 12a on the same surface of the mounting substrate 20 may be reduced. In addition, heat dissipation can be improved while improving the mounting density of the light-emitting elements 14. The mounting substrate 20 and the light emitting module 1 can be downsized by improving the mounting density and heat dissipation of the light emitting elements 14.

  Further, the through connection 13 is unnecessary, and the pattern 12 formed on the mounting substrate 20 can be simplified, so that the manufacturing process can be simplified and the cost can be reduced. Further, as shown in FIGS. 7E and 8 of the second embodiment, the temperature of the light emitting element 14 mounted on the mounting substrate 20 can be made uniform, and when used in the vehicular lamp 2 In addition, uneven distribution of light on the road surface can be reduced.

  Further, since the light emitting elements 14 are mounted on both surfaces of the mounting substrate 20, heat generated in the light emitting elements 14 can be dissipated and dissipated on both surfaces of the mounting substrate 20, and the warpage of the substrate can be reduced. Thereby, the position shift of the light emitting element 14 in the vehicular lamp 2 can be prevented, and the shift of the positional relationship with the optical member can be reduced, so that an appropriate light distribution can be projected. The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

DESCRIPTION OF SYMBOLS 1, 3, 4, 5, 6 ... Light emitting module 11 ... Support base material 11a ... Front side 11b ... Back side 12 ... Pattern 12a ... Mounting area 12b ... Non-mounting area 12c ... Lap area 20 ... Mounting board 13 ... Through-connection 14 Light-emitting element 15 Wiring pattern 2 Vehicle lamp 21 High beam unit 22 Low beam unit 23 Side turn signal lamp 24 Clearance lamp 31 Lamp body 32 Outer cover 33 Adjusting screw 34 Bracket 35a Upper reflector 35b ... Lower reflector 35c ... Mounting rib 35d ... Reflective surface 35e ... Reflective surface 36 ... Extension 37 ... Drive circuit

Claims (6)

A mounting substrate on which a plurality of patterns are formed on one surface and the other surface of the support substrate, and a plurality of light emitting elements mounted on the surface of the mounting region of the pattern,
The pattern is formed on the one surface and the first mounting region on which the light emitting element is mounted, and the first non-mounting region formed on the other surface at a position corresponding to the first mounting region. And a second mounting region formed on the other surface where the light emitting element is mounted, and a second non-mounting region formed at a position corresponding to the second mounting region on the one surface. Have
The first non-mounting region and the second non-mounting region are formed of a material having a higher thermal conductivity than the support substrate,
The light emitting module, wherein the first mounting area and the second non-mounting area are formed adjacent to each other. The light emitting module according to claim 1,
The area of the first mounting area is larger than the area of the first non-mounting area. The light emitting module according to claim 1 or 2,
The light emitting module, wherein the first mounting region and the second mounting region have a wrap region that overlaps each other in plan view. The light emitting module according to any one of claims 1 to 3,
The first non-mounting region and the second non-mounting region are formed of a conductive material,
The first mounting region and the first non-mounting region are electrically connected by a first through connection penetrating the support substrate,
The light emitting module, wherein the second mounting region and the second non-mounting region are electrically connected by a second through connection penetrating the support substrate.   The lamp provided with the light emitting module in any one of Claims 1 thru | or 4. A circuit board for a light-emitting element in which a plurality of patterns are formed on one side and the other side of a support substrate,
The pattern includes a first mounting region formed on the one surface and mounted with a light emitting element, and a first non-mounting region formed at a position corresponding to the first mounting region on the other surface. A second mounting area formed on the other surface on which the light emitting element is mounted, and a second non-mounting area formed at a position corresponding to the second mounting area on the one surface. And
The first non-mounting region and the second non-mounting region are formed of a material having a higher thermal conductivity than the support substrate,
The circuit board for a light emitting element, wherein the first mounting area and the second non-mounting area are formed adjacent to each other.