CN113167463A - Circuit board and vehicle lamp - Google Patents

Circuit board and vehicle lamp Download PDF

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Publication number
CN113167463A
CN113167463A CN201980076991.2A CN201980076991A CN113167463A CN 113167463 A CN113167463 A CN 113167463A CN 201980076991 A CN201980076991 A CN 201980076991A CN 113167463 A CN113167463 A CN 113167463A
Authority
CN
China
Prior art keywords
region
substrate
substrate portion
wiring
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980076991.2A
Other languages
Chinese (zh)
Inventor
铃木哲也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koito Manufacturing Co Ltd
Original Assignee
Koito Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koito Manufacturing Co Ltd filed Critical Koito Manufacturing Co Ltd
Publication of CN113167463A publication Critical patent/CN113167463A/en
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/32—Optical layout thereof
    • F21S41/36—Combinations of two or more separate reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/60—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution
    • F21S41/65—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources
    • F21S41/663—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources by switching light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/42—Forced cooling
    • F21S45/43—Forced cooling using gas
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/70—Prevention of harmful light leakage
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

Abstract

The invention provides a circuit board and a vehicle lamp, which can save space and ensure long-term reliability. The circuit board is provided with a first substrate part (11), a second substrate part (12) which is formed separately and independently from the first substrate part (11), and a wiring substrate (30) which has flexibility and is provided with a wiring pattern on the surface, wherein the wiring substrate (30) is provided with: a first region (31) having a back surface bonded to the first substrate section (11); a second region (32) having a back surface bonded to the second substrate section (12); and a third region (33) provided between the first region (31) and the second region (32).

Description

Circuit board and vehicle lamp
Technical Field
The invention relates to a circuit board and a vehicle lamp.
Background
In the field of vehicle lighting, Light Emitting Diodes (LEDs) are widely used as Light Emitting parts. In addition, a light distribution variable headlamp (ADB) in which a plurality of LEDs are arranged in one or two dimensions and the on/off of each LED is switched according to the positions of a oncoming vehicle and a preceding vehicle has also been put into practical use. In addition, a marker lamp or the like has been proposed which uses an organic EL (Electro Luminescence) element as a light emitting portion and performs complicated display (for example, see patent document 1).
In a vehicle headlamp and a marker lamp using an organic EL element using the ADB technology, it is necessary to individually control a large number of light emitting portions, such as dozens to dozens, to be turned on and off, and wiring for lighting control tends to increase depending on the number of light emitting portions. Conventionally, in a wire harness used in the field of vehicle lighting, it has been difficult to electrically connect a large number of wires with high density, and it has been difficult to reduce the size and weight of the wiring harness due to the increase in the number of leads.
In view of the above, in the field of vehicle lighting devices, there has been proposed a technique of forming high-density Printed wiring on a substrate and electrically connecting the substrates with a Flexible high-density Flexible Cable such as an FPC (Flexible Printed Circuit) or an FFC (Flexible Cable Flat Cable) (for example, see patent document 1).
In such a conventional technique, the flexible cable is inserted into a connection portion mounted on the substrate, whereby the flexible cable can be attached and detached. However, when the flexible cable does not need to be attached and detached, since an attachment area of the connection portion is required, it is difficult to achieve space saving. In view of the above, a method of directly connecting a flexible cable to a terminal between substrates by a reflow process has been proposed.
Fig. 6 is a schematic diagram showing connection between substrates using a conventional flexible cable, in which fig. 6 (a) shows two substrates before connection, and fig. 6 (b) shows a state where the flexible cable is connected.
As shown in fig. 6 (a), a wiring pattern 3 and lands 4a and 4b are formed on the substrate 1 and the substrate 2, respectively. When the flexible cable 5 is arranged between the lands 4a and 4b coated with the solder and heated in the reflow process, the flexible cable 5 is connected between the lands 4a and 4 b. By electrically connecting the two substrates 1 and 2 by the flexible cable 5 in this manner, the flexible cable 5 has flexibility, and therefore the substrate sections 12 can be mounted on different planes.
Documents of the prior art
Patent document 1: japanese patent laid-open publication No. 2017-027661
However, in the conventional configuration in which the flexible cable 5 is connected to the lands 4a and 4b in the reflow process, the lands 4a and 4b have to have a large area, and it is difficult to achieve further space saving. Further, since a solder is used for connection of the flexible cable 5, if stress such as thermal shock is applied, cracks or the like occur, and it is difficult to secure long-term reliability.
Further, since the polyimide layer and the copper foil layer constituting the flexible cable 5 are bonded with an adhesive, there are the following problems: the heat resistance of the adhesive affects the heat resistance of the flexible cable 5, and the environmental temperature of the post-process is limited.
Disclosure of Invention
The present invention has been made in view of the above-described conventional problems, and an object of the present invention is to provide a circuit board and a vehicle lamp that can achieve space saving and ensure long-term reliability.
In order to solve the above problem, a circuit board according to the present invention includes: a first substrate section; a second substrate portion formed separately and independently from the first substrate portion; and a wiring substrate having flexibility and having a wiring pattern formed on a surface thereof, the wiring substrate including: a first region having a back surface bonded to the first substrate portion; a second region having a back surface bonded to the second substrate portion; and a third region disposed between the first region and the second region.
In the circuit board of the present invention, the first region and the second region of the wiring board are bonded to the first substrate portion and the second substrate portion, respectively, and the first substrate portion and the second substrate portion are connected to each other through the third region.
In one aspect of the present invention, the first region has substantially the same shape as the first substrate portion.
In one embodiment of the present invention, no adhesive layer is formed on the back surface of the third region.
In one embodiment of the present invention, the wiring board is made of glass epoxy resin.
In one embodiment of the present invention, the thickness of the wiring substrate is in a range of 0.1mm to 0.3 mm.
Further, a vehicle lamp according to the present invention includes: the circuit board according to any one of the above aspects; and a light emitting element mounted on the circuit substrate, the first substrate portion and the second substrate portion being mounted on different planes.
The invention can provide a circuit board and a vehicle lamp, which can save space and ensure long-term reliability.
Drawings
Fig. 1 is a schematic perspective view showing a circuit board 100 according to a first embodiment.
Fig. 2 is an exploded perspective view schematically showing the structure of the circuit board 100.
Fig. 3 is a plan view schematically showing an example of the arrangement of the wiring board 30 when the circuit board 100 is manufactured.
Fig. 4 is a schematic perspective view showing a state where the circuit board 100 is mounted on the heat sink 60.
Fig. 5 is a schematic cross-sectional view showing a structure of a vehicle lamp 200 using the circuit board 100.
Fig. 6 is a schematic diagram showing connection between substrates using a conventional flexible cable, in which fig. 6 (a) shows two substrates before connection, and fig. 6 (b) shows a state where the flexible cable is connected.
Detailed Description
(first embodiment)
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The same or equivalent constituent elements, members, and processes shown in the respective drawings are given the same reference numerals, and overlapping descriptions are appropriately omitted. Fig. 1 is a schematic perspective view showing a circuit board 100 according to the present embodiment. The circuit board 100 includes a first substrate portion 11, a second substrate portion 12, a wiring substrate 30, and a protective layer 40.
The first substrate portion 11 and the second substrate portion 12 are substantially flat plate-shaped members formed of a material having good thermal conductivity, and are formed separately and independently from each other. Wiring board 30 is bonded to one surface of first substrate portion 11 and second substrate portion 12, and a plurality of light emitting elements 51 and 52 are mounted thereon. The material constituting the first substrate portion 11 and the second substrate portion 12 is not limited, but a metal having good thermal conductivity such as copper or aluminum is preferably used.
The wiring substrate 30 is a substrate having a wiring pattern 34 formed on a surface thereof, and has flexibility. The wiring board 30 is bonded to the first substrate portion 11 and the second substrate portion 12 with an adhesive layer 20 described later. The wiring board 30 is integrally formed with three regions, i.e., a first region 31, a second region 32, and a third region 33, and a wiring pattern 34 is continuously formed in the three regions.
Although the material constituting the wiring substrate 30 is not limited, it is preferable since the use of a glass epoxy resin may have flexibility and mechanical strength. The thickness of the wiring board 30 is preferably in the range of 0.1mm to 0.3 mm. If the thickness is more than 0.3mm, the flexibility is insufficient and the bending radius becomes large, and if the thickness is less than 0.1mm, the mechanical strength cannot be sufficiently secured and handling becomes difficult.
The first region 31 is a region formed in an outer shape corresponding to the first substrate portion 11, and the back surface side is bonded to the first substrate portion 11 by an adhesive layer 20 described later. An opening 31a is formed in a predetermined region of the first region 31, and the surface of the first substrate 11 is exposed in the opening 31 a.
The second region 32 is a region formed in an outer shape corresponding to the second substrate portion 12, and the back surface side is bonded to the second substrate portion 12 by an adhesive layer 20 described later. An opening 32a is formed in a predetermined region of the second region 32, and the surface of the second substrate portion 12 is exposed in the opening 32 a.
The third region 33 is a region disposed between the first region 31 and the second region 32. Since neither the first substrate section 11 nor the second substrate section 12 is present on the back side of the third region 33, the adhesive layer 20 is not attached, and the structure is formed so as to bridge between the first substrate section 11 and the second substrate section 12.
The wiring pattern 34 is a conductive pattern formed on the surface of the wiring substrate 30, and is used to ensure electrical connection between the respective regions in the circuit substrate 100. As shown in the drawing, the wiring pattern 34 is formed continuously over three regions, i.e., the first region 31, the second region 32, and the third region 33, and forms one circuit between the first substrate portion 11 and the second substrate portion 12. In addition, a protective layer 40 is formed so as to cover the wiring pattern 34.
The openings 31a and 32a are openings formed in the first region 31 and the second region 32, respectively. The surfaces of the first substrate portion 11 and the second substrate portion 12 are exposed from the openings 31a and 32a, respectively, and the light emitting elements 51 and 52 are mounted thereon.
The protective layer 40 is an insulating film-like member formed on the front surface side of the wiring substrate 30 so as to cover the wiring pattern 34. The protective layer 40 is formed in a region except for a portion where the light emitting elements 51 and 52 are connected by a metal wire and a portion where electrical connection is made from the outside. Although the material constituting the protective layer 40 is not limited, in order to suppress stray light caused by a difference in light reflectance between the surface of the wiring substrate 30 and the wiring pattern 34, it is preferable to use a light reflective material or a light absorptive material so that the light reflectance in the region where the protective layer 40 is formed is uniform.
The light emitting elements 51 and 52 emit light when a voltage is applied thereto, and are formed by combining an LED chip and a phosphor material. Although not shown in fig. 1 to 5, the light emitting elements 51 and 52 are electrically connected to the wiring patterns 34 in the first region 31 and the second region 32, respectively, by metal wires or the like. A known compound semiconductor material such as GaN which emits primary light having a wavelength of cyan, violet, or ultraviolet light can be used as the LED chip. As the phosphor material, a known material excited by primary light and irradiated with desired secondary light may be used, a phosphor material which obtains white by mixing color with the primary light from the LED chip may be used, or a phosphor material which obtains white by mixing color of a plurality of secondary lights with a plurality of phosphor materials may be used.
The circuit board 100 of the present embodiment electrically and mechanically connects the first substrate portion 11 and the second substrate portion 12 via the third region 33 of the wiring substrate 30. Since the wiring board 30 is made of a flexible material, even when the first substrate portion 11 and the second substrate portion 12 are mounted on different surfaces, the third region 33 is bent to maintain electrical connection therebetween. In addition, since it is not necessary to form a land for connecting an FPC with solder on the circuit substrate 100, space saving can be achieved. In addition, when a glass epoxy resin is used as the wiring board 30, the heat resistance can be improved to 150 ℃. Further, since the glass epoxy resin has rigidity as compared with a conventional FPC, handling in a mounting process or the like is facilitated.
Fig. 2 is an exploded perspective view schematically showing the structure of the circuit board 100. As shown in fig. 2, the circuit board 100 has a structure in which the heat dissipation portion 10 including the first substrate portion 11 and the second substrate portion 12, the adhesive layer 20 including the first adhesive sheet 21 and the second adhesive sheet 22, and the wiring board 30 are laminated.
The adhesive layer 20 is a sheet-like adhesive material disposed between the front surface of the heat sink member 10 and the back surface of the wiring substrate 30. As shown in fig. 2, the adhesive layer 20 is separated and formed into two first and second adhesive sheets 21 and 22. The material constituting the pressure-sensitive adhesive layer 20 is not particularly limited, and for example, a sheet-like prepreg formed in a thickness of 20 to 200 μm can be used.
The first adhesive sheet 21 is formed in a sheet shape having an outer shape corresponding to the first substrate portion 11, and has a back surface side contacting the first substrate portion 11 and a front surface side contacting the first region 31. In addition, an opening 21a is formed in a region corresponding to the opening 31a in a shape corresponding to the opening 31 a.
The second adhesive sheet 22 is a sheet-like member formed in an outer shape corresponding to the second substrate portion 12, and has a back surface side contacting the second substrate portion 12 and a front surface side contacting the second region 32. In addition, the opening 22a is formed in a region corresponding to the opening 32a in a shape corresponding to the opening 32 a.
The heat dissipation portion 10 and the adhesive layer 20 may be formed in a plurality of shapes at a time from one plate-like member by punching or the like. Similarly, in the wiring board 30, the wiring pattern 34 may be patterned on a single glass epoxy sheet, and then the protective layer 40 may be formed in a predetermined region on the wiring pattern 34 and the outline may be formed by punching.
As a method for manufacturing the circuit board 100, a large-sized heat dissipation portion 10, an adhesive layer 20, and a wiring board 30 are stacked, and heating and pressing are performed in a stacking and pressing step, thereby obtaining a stacked structure in which the wiring board 30 is bonded to the heat dissipation portion 10 via the adhesive layer 20. The obtained laminated structure is subjected to punching processing at one time, thereby obtaining an outer shape of the circuit board 100. The openings 21a, 31a, 22a, and 32a may be formed before the lamination press working or may be formed by cutting after the lamination press working. The step of forming the wiring pattern 34 on the wiring substrate 30 may be performed before the laminating and pressing step, or may be performed after the laminating and pressing step.
Then, light emitting element 51 is mounted on the surface of first substrate portion 11 exposed in openings 21a and 31a, and light emitting element 52 is mounted on the surface of second substrate portion 12 exposed in openings 22a and 32 a. Finally, the light emitting elements 51 and 52 and the wiring pattern 34 are wire-bonded by metal wires, thereby obtaining the circuit board 100 of the present invention.
Fig. 3 is a plan view schematically showing an example of the arrangement of the wiring board 30 when the circuit board 100 is manufactured. As shown in fig. 1 and 2, in the circuit board 100 of the present embodiment, the third region 33 is provided at only one location at a position shifted to one side from the center of the first region 31 and the second region 32. Therefore, as shown in fig. 3, the two circuit boards 100 can be arranged on one glass epoxy sheet so as to be rotated 180 degrees from each other, and the other first region 31 can be located beside one third region 33. This enables a plurality of circuit boards 100 to be efficiently formed from a single glass epoxy resin sheet.
Fig. 4 is a schematic perspective view showing a state where the circuit board 100 is mounted on the heat sink 60. The heat sink 60 is a member having good thermal conductivity and disposed in contact with the back surface of the circuit board 100, and for example, aluminum or the like can be used. The first surface 61 and the second surface 62 are formed in front of the heat sink 60, and the plurality of fins 63 are formed on the rear surface side.
The first surface 61 is a substantially flat surface formed in front of the heat sink 60, and is a region where the first substrate portion 11 is mounted. The second surface 62 is a substantially flat surface formed in front of the heat sink 60, and is a region where the second substrate portion 12 is mounted. The first surface 61 and the second surface 62 intersect each other at a predetermined angle and have a substantially V-shape. Here, although an example is shown in which the first surface 61 and the second surface 62 intersect in a substantially V-shape, the relative positional relationship is not limited as long as the first surface 61 and the second surface 62 are different surfaces.
As shown in fig. 4, in the circuit board 100, since the wiring board 30 is made of a material having flexibility, even if the first substrate portion 11 and the second substrate portion 12 are mounted on the first surface 61 and the second surface 62 which are different surfaces, the third region 33 can be bent and maintain electrical connection therebetween. Further, since the first region 31, the second region 32, and the third region 33 are formed in a single sheet shape integrally, they are high in mechanical and thermal stability and excellent in long-term reliability.
Fig. 5 is a schematic cross-sectional view showing a structure of a vehicle lamp 200 using the circuit board 100. The vehicle lamp 200 includes a circuit board 100, a heat sink 60, a reflector 71, a cover portion 72, a lens 80, a lens holder 81, and a cooling fan 90, and the components are positioned and fixed by a fixing mechanism not shown. In the circuit board 100, the adhesive layer 20 is not formed on the back surface side of the third region 33, and the third region 33 is spaced apart from the heat sink 60 by a gap between the first region 31 and the second region 32.
The reflector 71 is disposed in front of the wiring board 30 and reflects light from the light emitting elements 51 and 52 forward. The cover portion 72 is a member for covering an unnecessary portion in the vehicle lamp 200 when viewed from the front of the lens 80 and for preventing stray light.
The lens 80 is a member made of a light-transmitting material and configured to irradiate light from the light-emitting elements 51 and 52 forward so as to have a predetermined light distribution. The lens holder 81 is a member that holds the lens 80 while maintaining the relative positional relationship between the wiring board 30 and the mirror 71.
The cooling fan 90 is disposed on the back side of the heat sink 60, and generates an air flow between the plurality of fins 63 when power is supplied thereto.
In the vehicle lamp 200, if power and a signal are supplied from the outside, the light emitting elements 51 and 52 mounted on the wiring board 30 emit light in accordance with the power and the signal, and the light reflected forward by the reflector 71 passes through the inside of the lens holder 81 and the lens 80 and is irradiated forward. The heat generated by the light emission of the wiring board 30 is dissipated into the air by the heat sink 60, and is cooled by the air blown from the cooling fan 90.
The vehicle lamp 200 according to the present invention is configured such that the light emitting elements 51 and 52 to which power is selectively supplied are turned on from the outside through the wiring pattern 34 and the metal lead. The lighting of the selected light emitting elements 51 and 52 determines the light distribution of the entire vehicle lamp 200, and the light distribution pattern is irradiated to the front of the vehicle lamp 200 by the ADB technique through the reflector 71 and the lens 80.
As described above, in the circuit board 100 and the vehicle lamp 200 according to the present embodiment, even when the first substrate portion 11 and the second substrate portion 12 are mounted on the first surface 61 and the second surface 62 which are different surfaces, the third region 33 is bent and maintains the electrical connection therebetween. Further, since the first region 31, the second region 32, and the third region 33 are formed in a single sheet shape integrally, they are high in mechanical and thermal stability and excellent in long-term reliability. In addition, since it is not necessary to form a land for connecting an FPC with solder on the circuit substrate 100, space saving can be achieved.
(second embodiment)
Next, a second embodiment of the present invention will be explained. Description of the overlapping contents with the first embodiment will be omitted. In the first embodiment, the example in which the first surface 61 and the second surface 62 intersecting each other are formed on the block-shaped heat sink 60 is illustrated, but the first surface 61 and the second surface 62 may be formed by bending after the first substrate portion 11 and the second substrate portion 12 are mounted on one flat metal plate. In this method, the mounting work can be simplified as compared with mounting the first substrate portion 11 and the second substrate portion 12 on the surfaces intersecting each other.
In the first embodiment, the example in which only one third region 33 is provided is illustrated, but a plurality of third regions 33 may be provided between the first region 31 and the second region 32. Accordingly, even if the number of wiring patterns 34 connecting the first region 31 and the second region 32 is increased, the area for forming the wiring patterns 34 can be sufficiently secured, and the required flexibility can be obtained.
In the first embodiment, the third region 33 is provided between the first region 31 and the second region 32, but the wiring substrate 30 may be further divided into a plurality of regions, and the third regions 33 may be provided between the regions.
Further, although the examples using the light emitting diodes as the light emitting elements 51 and 52 have been described, an organic EL element or another optical element may be provided, and another electronic component may be mounted.
Although fig. 4 illustrates an example in which the first substrate portion 11 and the second substrate portion 12 are accommodated in the first surface 61 and the second surface 62, respectively, a part of the substrate may protrude outside the heat sink 60. In particular, the terminal portion may be protruded as a shape for connecting the terminal portion for electrical connection with the outside to the connector. The structure of electrical connection to the outside is not limited to a card edge (card edge) type, and a surface mount connector may be used.
The present invention is not limited to the above embodiments, and various modifications can be made within the scope of the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments are also included in the technical scope of the present invention.
The present invention claims priority based on japanese patent application No. 2018-231632, filed 12, 11, 2018, the entire contents of No. 2018-231632, which is the japanese application, are incorporated herein by reference.
The foregoing descriptions of specific embodiments of the present invention are presented for purposes of illustration and description. The description is not intended to be exhaustive or to limit the invention to the precise form disclosed. It will be apparent to those skilled in the art that many modifications and variations can be made in light of the above teaching.
Description of the reference numerals
100 … circuit board
200 … vehicle lamp
10 … Heat sink
11 … first base plate part
12 … second base plate part
20 … adhesive layer
21 … first adhesive sheet
22 … second adhesive sheet
21a, 22a, 31a, 32a … opening part
30 … wiring board
31 … first area
32 … second area
33 … third region
34 … wiring pattern
40 … protective layer
51. 52 … light emitting element
60 … radiator
61 … first side
62 … second side
63 … Heat sink
71 … reflecting mirror
72 … cover portion
80 … lens
81 … lens holder
90 … Cooling Fan

Claims (6)

1. A circuit board is characterized in that a plurality of circuit boards are arranged,
the circuit board includes:
a first substrate section;
a second substrate portion formed separately and independently from the first substrate portion; and
a wiring board having flexibility and having a wiring pattern formed on a surface thereof,
the wiring substrate includes: a first region having a back surface bonded to the first substrate portion; a second region having a back surface bonded to the second substrate portion; and a third region disposed between the first region and the second region.
2. The circuit substrate of claim 1,
the first region has substantially the same shape as the first substrate portion.
3. The circuit substrate according to claim 1 or 2,
no adhesive layer is formed on the back of the third region.
4. The circuit substrate according to any one of claims 1 to 3,
the wiring substrate is made of glass epoxy resin.
5. The circuit substrate according to any one of claims 1 to 4,
the thickness of the wiring substrate ranges from 0.1mm to 0.3 mm.
6. A lamp for a vehicle, characterized in that,
the vehicle lamp includes:
the circuit substrate according to any one of claims 1 to 5; and
a light emitting element mounted on the circuit substrate,
the first substrate portion and the second substrate portion are mounted on different planes.
CN201980076991.2A 2018-12-11 2019-12-06 Circuit board and vehicle lamp Pending CN113167463A (en)

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JP2018-231632 2018-12-11
JP2018231632A JP7297431B2 (en) 2018-12-11 2018-12-11 Circuit board and vehicle lamp
PCT/JP2019/047793 WO2020121961A1 (en) 2018-12-11 2019-12-06 Circuit board and vehicle light

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CN113167463A true CN113167463A (en) 2021-07-23

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WO (1) WO2020121961A1 (en)

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JP7447698B2 (en) * 2020-06-24 2024-03-12 市光工業株式会社 Vehicle lights

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