WO2020119289A1 - 指纹识别装置和电子设备 - Google Patents

指纹识别装置和电子设备 Download PDF

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Publication number
WO2020119289A1
WO2020119289A1 PCT/CN2019/113720 CN2019113720W WO2020119289A1 WO 2020119289 A1 WO2020119289 A1 WO 2020119289A1 CN 2019113720 W CN2019113720 W CN 2019113720W WO 2020119289 A1 WO2020119289 A1 WO 2020119289A1
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WO
WIPO (PCT)
Prior art keywords
fingerprint
support plate
identification device
display screen
fingerprint identification
Prior art date
Application number
PCT/CN2019/113720
Other languages
English (en)
French (fr)
Inventor
曾凡洲
刘相英
Original Assignee
深圳市汇顶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/CN2018/120922 external-priority patent/WO2020118631A1/zh
Priority claimed from PCT/CN2018/125425 external-priority patent/WO2020133378A1/zh
Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to CN202110367804.5A priority Critical patent/CN113065472B/zh
Priority to KR1020207027909A priority patent/KR102440709B1/ko
Priority to CN201980004221.7A priority patent/CN111133443B/zh
Priority to EP19896224.3A priority patent/EP3786834B1/en
Publication of WO2020119289A1 publication Critical patent/WO2020119289A1/zh
Priority to US17/024,154 priority patent/US11917763B2/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14678—Contact-type imagers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14621—Colour filter arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14623—Optical shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Definitions

  • the present application relates to the technical field of optical fingerprints, and more particularly, to a fingerprint identification device and electronic equipment.
  • fingerprint recognition sensors are widely used in mobile terminal devices, smart homes, automotive electronics and other fields, and consumers are increasingly applying fingerprint sensors.
  • TFT Thin Film Transistor
  • LCD Liquid Crystal Display
  • TFD Thin Film Diode
  • UFB Ultra Bright
  • STN Super Twisted Nematic
  • OLED Organic Light-Emitting Diode
  • Embodiments of the present application provide a fingerprint identification device and electronic equipment, which can be used to be installed under a variety of different display screens to reduce the installation space of the fingerprint identification device under the screen.
  • a fingerprint identification device for being disposed under a display screen of an electronic device, including: a support plate;
  • At least one fingerprint sensor chip the at least one fingerprint sensor chip is disposed on the upper surface of the support plate;
  • the support plate is used to be installed on the upper surface of the middle frame of the electronic device, so that the at least one fingerprint sensor chip is located below the display screen of the electronic device;
  • the at least one fingerprint sensor chip is used to receive a fingerprint detection signal returned by reflection or scattering of a human finger above the display screen, wherein the fingerprint detection signal is used to detect fingerprint information of the finger.
  • the support plate is installed on the upper surface of the middle frame of the electronic device, so that at least one fingerprint sensor chip above the support plate is located below the display screen.
  • the fingerprint recognition device does not It is fixedly connected to the display screen, but fixedly installed in the middle frame of the electronic device, which is convenient for the installation and removal of the fingerprint sensor chip, and is suitable for any kind of display screen, and can be installed at any position below the display screen.
  • the thickness of the fingerprint recognition device is relatively thin. By being installed on the upper surface of the middle frame of the electronic device, the thickness space occupied by the fingerprint recognition device below the display screen is saved.
  • the upper surface of the middle frame extends downwardly with a groove or a through hole
  • a step structure is formed on the edge of the groove or the edge of the through hole
  • the edge of the support plate overlaps The upper surface of the step structure.
  • the edge of the support plate is bent upward to form an inverted step structure, and the inverted step structure is attached to the step structure.
  • the support plate by designing the support plate as a special-shaped structure, the inverted step structure at the edge is lap fixed on the step structure of the middle frame, while fixing the support plate on the middle frame, the center of the support plate The area sinks, and at least one fingerprint sensor chip is provided above the center area.
  • the solution of the embodiment of the present application utilizes the thickness of the middle frame to embed the fingerprint recognition device in the middle frame to a greater extent, further saving The thickness of the space where the fingerprint recognition device below the screen is installed.
  • the upper surface of the middle frame extends downward with a groove or a through hole, and the edge of the support plate overlaps the edge of the groove or the through hole.
  • the edge of the support plate is bent upward to form an inverted step structure, and the inverted step structure is attached to the edge of the groove or the edge of the through hole.
  • the inverted step structure is a right angle L shape or a rounded L shape, and the length of the inverted step structure is greater than 0.5 mm.
  • the upper surface of the inverted step structure and the upper surface of the peripheral area of the inverted step structure are on the same plane.
  • foam is provided between the inverted step structure and the at least one fingerprint sensor chip.
  • foam is provided between the upper surface of the edge of the support plate and the lower surface of the display screen.
  • the upper surface of the middle frame extends downward with a groove, and the support plate is fixed on the upper surface of the groove.
  • the support plate is a reinforced steel sheet.
  • the support board is a reinforcing steel sheet of a flexible circuit board, and the flexible circuit board is electrically connected to the at least one fingerprint sensor chip.
  • the fingerprint identification device further includes: the flexible circuit board, and the flexible circuit board is electrically connected to the at least one fingerprint sensor chip through a gold wire.
  • the distance between the at least one fingerprint sensor and the lower surface of the light-emitting layer of the display screen is 150 ⁇ m to 2000 ⁇ m.
  • the at least one fingerprint sensor chip includes a plurality of optical fingerprint sensor chips, and the plurality of optical fingerprint sensor chips are arranged side by side on the upper surface of the support plate to be spliced into an optical fingerprint sensor chip assembly.
  • each fingerprint sensor chip in the at least one fingerprint sensor chip includes: a micro lens array, at least one light blocking layer and a light detection array;
  • the at least one light blocking layer is disposed under the microlens array, wherein the at least one light blocking layer is provided with a plurality of light passing holes, and the light detection array is disposed under the at least one light blocking layer;
  • the microlens array is used for condensing the fingerprint detection signal to a plurality of light passing holes of the at least one light blocking layer, and the fingerprint detection signal is transmitted to the light detection array through the plurality of light passing holes.
  • the fingerprint identification device further includes: an optical filter for filtering the optical signal in the non-target band and transmitting the optical signal in the target band.
  • the filter is fixed above the at least one fingerprint sensor chip through an adhesive layer, or integrated in the at least one fingerprint sensor chip.
  • the support plate and/or the middle frame are made of metal or plastic structure.
  • the display screen is an organic light-emitting diode OLED screen, a liquid crystal display LCD, or a flexible display screen.
  • an electronic device including a display screen, a middle frame, and a fingerprint identification device in the first aspect or any possible implementation manner of the first aspect, wherein the fingerprint identification device is provided on the display Under the screen, and installed on the upper surface of the middle frame.
  • the upper surface of the middle frame is downwardly provided with a groove, and the fingerprint identification device is fixed in the groove.
  • a groove or a through hole is extended downward on the upper surface of the middle frame, a step structure is formed on the edge of the groove or the edge of the through hole, and the fingerprint identification device includes a support plate, The edge of the support plate overlaps the upper surface of the step structure.
  • the upper surface of the middle frame is downwardly extended with a groove or a through hole
  • the fingerprint identification device includes a support plate, and the edge of the support plate overlaps the edge of the groove or the through hole the edge of.
  • the display screen is an organic light-emitting diode OLED screen, a liquid crystal display LCD, or a flexible display screen.
  • the middle frame is a metal or plastic structure.
  • the space under the screen of the electronic device is reduced, which is conducive to the development of thin and thin electronic devices.
  • FIG. 1 is a schematic structural diagram of a terminal device to which an embodiment of this application is applicable.
  • FIG. 2 is a schematic structural diagram of a fingerprint identification device according to an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a fingerprint sensor chip according to an embodiment of the present application.
  • FIG. 4 is a schematic plan view of a fingerprint identification device according to an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of another fingerprint identification device according to an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of another fingerprint recognition device according to an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of another fingerprint recognition device according to an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of another fingerprint recognition device according to an embodiment of the present application.
  • 9a to 9c are schematic top views of a support plate according to an embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of another fingerprint recognition device according to an embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of another fingerprint identification device according to an embodiment of the present application.
  • FIG. 12 is a schematic structural diagram of another fingerprint recognition device according to an embodiment of the present application.
  • FIG. 13 is a schematic diagram of a single explosion of a fingerprint identification device according to an embodiment of the present application.
  • FIG. 14 is a schematic block diagram of an electronic device according to an embodiment of the present application.
  • embodiments of the present application can be applied to optical fingerprint systems, including but not limited to optical fingerprint recognition systems and products based on optical fingerprint imaging.
  • the embodiments of the present application only use the optical fingerprint system as an example for description, but should not be implemented in the present application
  • the examples constitute any limitation, and the embodiments of the present application are also applicable to other systems that use optical imaging technology.
  • the fingerprint identification device provided in the embodiments of the present application may be applied to smart phones, tablet computers, and other mobile terminals with display screens or other electronic devices; more specifically, in the above electronic devices, fingerprint identification
  • the device may be specifically a fingerprint identification device, which may be provided in a partial area or all areas below the display screen, thereby forming an under-display optical fingerprint system.
  • the fingerprint identification device may be partially or fully integrated into the display screen of the electronic device, thereby forming an in-display optical fingerprint system.
  • FIG. 1 it is a schematic structural diagram of a terminal device to which an embodiment of the present application can be applied.
  • the terminal device 100 includes a display screen 120 and a fingerprint recognition device 130.
  • the fingerprint recognition device 130 is disposed in a partial area below the display screen 120.
  • the fingerprint recognition device 130 includes an optical fingerprint sensor.
  • the optical fingerprint sensor includes a sensing array 133 having a plurality of optical sensing units 131. The area where the sensing array 133 is located or its sensing area is the fingerprint detection area 103 of the fingerprint recognition device 130. As shown in FIG. 1, the fingerprint detection area 103 is located in the display area of the display screen 120.
  • the fingerprint recognition device 130 may also be disposed at other positions, such as the side of the display screen 120 or the non-transparent area of the edge of the terminal device 100, and at least part of the display area of the display screen 120 is designed through the design of the optical path The optical signal of is directed to the fingerprint recognition device 130, so that the fingerprint detection area 103 is actually located in the display area of the display screen 120.
  • the area of the fingerprint detection area 103 may be different from the area of the sensing array of the fingerprint recognition device 130.
  • optical path design such as lens imaging, reflective folding optical path design, or other optical convergence or reflection
  • optical path design may enable fingerprint identification
  • the area of the fingerprint detection area 103 of the device 130 is larger than the area of the sensing array of the fingerprint recognition device 130.
  • the fingerprint detection area 103 of the fingerprint identification device 130 may also be designed to be substantially the same as the area of the sensor array of the fingerprint identification device 130.
  • the terminal device 100 adopting the above structure does not require a special reserved space on the front to set the fingerprint button (such as the Home button), so that a full screen solution can be adopted, that is, the display area of the display screen 120 can be basically Expand to the front of the entire terminal device 100.
  • the fingerprint recognition device 130 includes a light detection part 134 and an optical component 132, and the light detection part 134 includes a sensor array and a reading circuit electrically connected to the sensor array and Other auxiliary circuits, which can be fabricated on a chip (Die) through a semiconductor process, such as an optical imaging chip or an optical fingerprint sensor, the sensing array is specifically a photodetector array, which includes a plurality of array-like distributions A photodetector, which can serve as the above-mentioned optical sensing unit; the optical assembly 132 can be disposed above the sensing array of the light detecting portion 134, which can specifically include a light guide layer or an optical path guide structure and other optical elements, the The light guide layer or light path guide structure is mainly used to guide the reflected light reflected from the finger surface to the sensing array for optical detection.
  • the optical component 132 may be packaged in the same optical fingerprint component as the light detection portion 134.
  • the optical component 132 may be packaged in the same optical fingerprint chip as the optical detection portion 134, or the optical component 132 may be disposed outside the chip where the light detection portion 134 is located, such as attaching the optical component 132 to the Above the chip, or integrate some elements of the optical assembly 132 into the above chip.
  • the light guide layer may be specifically a collimator layer made of semiconductor silicon wafers, which has multiple collimators Unit or micro-hole array
  • the collimating unit may be specifically a small hole, in the reflected light reflected from the finger, the light incident perpendicularly to the collimating unit may pass through and be received by the optical sensing unit below, and the angle of incidence
  • each optical sensing unit can only basically receive the reflected light reflected by the fingerprint lines directly above it, so that the sensing array can detect the Fingerprint image.
  • the light guide layer or the light path guide structure may also be an optical lens (Lens) layer, which has one or more lens units, such as a lens group composed of one or more aspheric lenses, which is used for The reflected light reflected from the finger is condensed to the sensing array of the light detecting portion 134 below it, so that the sensing array can perform imaging based on the reflected light, thereby obtaining a fingerprint image of the finger.
  • the optical lens layer may also be formed with pinholes in the optical path of the lens unit. The pinholes may cooperate with the optical lens layer to expand the field of view of the fingerprint recognition device to improve the fingerprint imaging effect of the fingerprint recognition device 130.
  • the light guiding layer or the light path guiding structure may also specifically adopt a micro-lens (Micro-Lens) layer, the micro-lens layer having a micro-lens array formed by a plurality of micro-lenses, which may be through a semiconductor growth process or other The process is formed above the sensing array of the light detecting portion 134, and each microlens may correspond to one of the sensing units of the sensing array, respectively.
  • other optical film layers such as a dielectric layer or a passivation layer, may be formed between the microlens layer and the sensing unit. More specifically, a light blocking layer with micro holes may be included between the microlens layer and the sensing unit.
  • the micro hole is formed between the corresponding micro lens and the sensing unit, and the light blocking layer can block the optical interference between the adjacent micro lens and the sensing unit, and cause the light corresponding to the sensing unit to converge into the micro hole through the micro lens And transmitted to the sensing unit via the micro-hole for optical fingerprint imaging.
  • a microlens layer may be further provided under the collimator layer or the optical lens layer.
  • the collimator layer or the optical lens layer is used in combination with the microlens layer, its specific laminated structure or optical path may need to be adjusted according to actual needs.
  • the display screen 120 may use a display screen with a self-luminous display unit, such as an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display screen or a micro-LED display screen.
  • a self-luminous display unit such as an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display screen or a micro-LED display screen.
  • OLED Organic Light-Emitting Diode
  • the fingerprint recognition device 130 may use the display unit (ie, OLED light source) of the OLED display screen 120 located in the fingerprint detection area 103 as an excitation light source for optical fingerprint detection.
  • OLED light source ie, OLED light source
  • the above-mentioned reflected light and scattered light are collectively referred to as reflected light. Since the ridge and valley of the fingerprint have different light reflection capabilities, the reflected light 151 from the fingerprint ridge and the reflected light 152 from the fingerprint ridge have different light intensities. After the reflected light passes through the optical component 132, Received by the sensor array 134 in the fingerprint recognition device 130 and converted into a corresponding electrical signal, that is, a fingerprint detection signal; based on the fingerprint detection signal, fingerprint image data can be obtained, and fingerprint matching verification can be further performed, so that the terminal device 100 Realize the optical fingerprint recognition function.
  • the fingerprint recognition device 130 may also use an internal light source or an external light source to provide an optical signal for fingerprint detection.
  • the fingerprint recognition device 130 can be applied to non-self-luminous display screens, such as liquid crystal display screens or other passive light-emitting display screens.
  • the optical fingerprint system of the terminal device 100 may further include an excitation light source for optical fingerprint detection.
  • the fingerprint recognition device 130 may be specifically an infrared light source or a light source with a specific wavelength and invisible light, which may be provided under the backlight module of the liquid crystal display or the edge area under the protective cover of the terminal device 100, and the fingerprint recognition device 130 may be provided with an LCD panel or Beneath the edge area of the protective cover and guided by the optical path so that the fingerprint detection light can reach the fingerprint recognition device 130; or, the fingerprint recognition device 130 can also be arranged under the backlight module, and the backlight module passes the diffusion sheet, the brightness enhancement sheet, Film layers such as reflective sheets are subjected to openings or other optical designs to allow fingerprint detection light to pass through the liquid crystal panel and the backlight module and reach the fingerprint recognition device 130.
  • the fingerprint identification device 130 uses an internal light source or an external light source to provide an optical signal for fingerprint detection, the detection principle is consistent with the content described above.
  • the terminal device 100 further includes a transparent protective cover, which may be a glass cover or a sapphire cover, which is located above the display screen 120 and covers the front of the terminal device 100.
  • a transparent protective cover which may be a glass cover or a sapphire cover, which is located above the display screen 120 and covers the front of the terminal device 100.
  • the terminal device 100 may further include a circuit board 150 that is disposed below the fingerprint recognition device 130.
  • the fingerprint recognition device 130 may be adhered to the circuit board 150 by adhesive, and electrically connected to the circuit board 150 by bonding pads and wire bonding.
  • the fingerprint recognition device 130 can realize electrical interconnection and signal transmission with other peripheral circuits or other elements of the terminal device 100 through the circuit board 150.
  • the fingerprint recognition device 130 may receive the control signal of the processing unit of the terminal device 100 through the circuit board 150, and may also output the fingerprint detection signal from the fingerprint recognition device 130 to the processing unit or control unit of the terminal device 100 through the circuit board 150 Wait.
  • the fingerprint recognition device 130 may include only one optical fingerprint sensor.
  • the fingerprint detection area 103 of the fingerprint recognition device 130 has a small area and a fixed position, so the user needs to input fingerprints Press the finger to a specific position of the fingerprint detection area 103, otherwise the fingerprint recognition device 130 may fail to collect the fingerprint image and cause a poor user experience.
  • the fingerprint recognition device 130 may specifically include multiple optical fingerprint sensors; the multiple optical fingerprint sensors may be arranged side by side under the display screen 120 by stitching, and the sensing areas of the multiple optical fingerprint sensors are common The fingerprint detection area 103 constituting the fingerprint recognition device 130 is constituted.
  • the fingerprint detection area 103 of the fingerprint recognition device 130 may include a plurality of sub-areas, and each sub-area corresponds to the sensing area of one of the optical fingerprint sensors, thereby extending the fingerprint collection area 103 of the fingerprint recognition device 130 to the display
  • the main area of the lower half of the screen which is extended to the area where fingers are used to pressing, realizes the blind-press fingerprint input operation.
  • the fingerprint detection area 103 can also be extended to half a display area or even the entire display area, thereby realizing half-screen or full-screen fingerprint detection.
  • the sensing array in the fingerprint identification device may also be referred to as a pixel array
  • the optical sensing unit or sensing unit in the sensing array may also be referred to as a pixel unit.
  • the fingerprint identification device in the embodiment of the present application may also be referred to as an optical fingerprint identification module, an optical fingerprint identification device, a fingerprint identification module, a fingerprint module, a fingerprint collection device, etc.
  • the above terms may be replaced with each other.
  • the embodiment shown in FIG. 1 takes the optical fingerprint recognition device as an example of the under-screen optical fingerprint recognition device, in other embodiments, the fingerprint recognition device of the terminal device 100 may also use an ultrasonic fingerprint recognition device Or other types of fingerprint recognition devices instead.
  • This application does not specifically limit the type and specific structure of the fingerprint recognition device, as long as the above fingerprint recognition device can meet the performance requirements for fingerprint recognition inside the display screen of the terminal device.
  • the fingerprint identification device in the embodiment of the present application can reduce the thickness space occupied by the fingerprint identification device, and is suitable for use under various display screens, which further improves the overall performance and user experience of the fingerprint identification device and the electronic device where it is located.
  • FIG. 2 is a schematic structural diagram of a fingerprint identification device 200 provided by an embodiment of the present application.
  • the fingerprint identification device 200 is used to be disposed below a display screen of an electronic device, where the display screen may be any type of display screen, for example , Liquid crystal display LCD, organic light-emitting diode display OLED or flexible display.
  • the fingerprint identification device 200 includes:
  • At least one fingerprint sensor chip 220 the at least one fingerprint sensor 220 chip is disposed on the upper surface of the support plate 210;
  • the supporting plate 210 is used to be installed on the upper surface of the middle frame 300 of the electronic device, so that at least one fingerprint sensor chip 220 is located below the display screen 120 of the electronic device;
  • the at least one fingerprint sensor chip 220 is used to receive a fingerprint detection signal returned by reflection or scattering of a human finger above the display screen 120, wherein the fingerprint detection signal is used to detect fingerprint information of the finger.
  • the support plate 210 may be various materials that are not easily deformed.
  • the support plate 210 may be a metal support plate, or an alloy support plate, or may also be a plastic package
  • the supporting plate made of material only needs to have a supporting and fixing function as long as its shape is fixed, which is not limited in the embodiments of the present application.
  • the support plate 210 may be a regular shape structure such as a polygon, a circle, or other irregular shape structures, which is not specifically limited in this embodiment of the present application.
  • the surface roughness of the support plate 210 is measured by a contour arithmetic mean deviation (Ra), and the Ra of the support plate 210 is greater than a certain threshold, such as 0.25 ⁇ m, to improve the imaging effect; specifically When the surface roughness of the support plate 210 is greater than a certain threshold, the surface can scatter light signals, which can effectively reduce the light signals emitted by the display screen 120 and reflected inside the fingerprint recognition device 200, thereby avoiding light reflection It has an effect on imaging; in addition, when the surface roughness of the support plate 210 is greater than a certain threshold, the reliability of the connection between the support plate 210 and other components can be increased. For example, the connection reliability of the support plate 210 and at least one fingerprint sensor chip 220.
  • a contour arithmetic mean deviation
  • the thickness of the support plate 210 ranges from 0.15 mm to 0.30 mm to control the thickness of the fingerprint recognition device 200.
  • the flatness of the support plate 210 is less than a certain threshold, for example, 0.03 mm.
  • the flatness of the connection area between at least one fingerprint sensor chip 220 and the support plate 210 is less than 0.03 mm, so as to ensure at least one fingerprint sensor chip 220 Reliability of connection with the support plate 210.
  • each fingerprint sensor chip 220 in the at least one fingerprint sensor chip 220 may include: a microlens array 221, at least one light blocking layer 222, and a light detection array 223;
  • the at least one light-blocking layer 222 is disposed under the microlens array 221, wherein at least one light-blocking layer is provided with a plurality of light passing holes, and the light detection array 223 is disposed under the at least one light-blocking layer 222;
  • the microlens array 221 is used for condensing the fingerprint detection signal to the plurality of light-passing holes of the at least one light-blocking layer 222, and the fingerprint detection signal is transmitted to the light detection array 223 through the plurality of light-passing holes.
  • the above-mentioned light detection array 223 includes a plurality of sensing units.
  • the sensing unit is used to receive the fingerprint optical signal returned after being reflected or scattered by the finger and process the optical signal to obtain a fingerprint image unit.
  • the fingerprint image unit is a unit pixel in the fingerprint image.
  • the sensing unit may include a photodiode (Photo Diode, PD), a metal oxide semiconductor field effect tube (Metal Oxide Semiconductor Field Effect Transistor, MOSFET) and other devices.
  • the sensing unit has higher photosensitivity and higher quantum efficiency for light of a specific wavelength, so as to detect optical signals of corresponding wavelengths.
  • the light detection array 223 in FIG. 3 may also be the sensing array 133 in FIG. 1, and for related functions and structure descriptions, reference may be made to the foregoing related description.
  • the at least one light-blocking layer 222 can block the optical interference between the adjacent microlens and the sensing unit, and cause the fingerprint detection signal corresponding to the sensing unit to converge through the microlens inside the light-passing aperture and It is transmitted to the sensing unit through the light-passing small hole for optical fingerprint imaging.
  • the light detection array 223 is separated from the at least one light blocking layer 222 and between the multiple light blocking layers 222 by a transparent dielectric layer.
  • the above microlens array 221 is formed by a plurality of microlenses, which may be formed on at least one light blocking layer 222 through a semiconductor growth process or other processes, and each microlens may correspond to one of the sensing units of the light detection array 223, respectively.
  • the thickness of the optical fingerprint recognition sensor is reduced, thereby improving the performance of the optical fingerprint recognition device.
  • the at least one fingerprint sensor chip 220 may be disposed on the upper surface of the support plate through an adhesive layer, for example, the adhesive layer is a die attach film (Die Attach Film, DAF), which may implement at least one fingerprint sensor chip 220 Ultra-thin connection with the support plate 210.
  • DAF Die Attach Film
  • At least one fingerprint sensor chip 220 above the support plate 210 is located below the display screen 120. Specifically, a part of the laminated structure in the display screen 120 is opened so that the fingerprint detection signal above the display screen can enter at least one fingerprint sensor chip 220 through the window, and the at least one fingerprint sensor chip 220 is located below the window .
  • FIG. 2 shows a schematic structural diagram of an OLED display screen.
  • the display screen 120 may include a light emitting layer 124 and a light-shielding heat dissipation buffer layer 125.
  • the light-shielding heat-dissipating protective layer 125 is disposed below the display assembly 124, and a window is provided therein.
  • the light-shielding heat dissipation protective layer may be a black sheet layer or a printed layer for shielding light, which includes at least a part of a metal material for heat dissipation, and may also include a foam layer to serve as a buffer and protection.
  • the gap may be an air gap that is not filled with any auxiliary materials, to ensure that the fingerprint sensor chip 220 does not contact the light-emitting layer 124 when the display is pressed or the electronic device falls or crashes, affecting the display The display effect, as well as the stability and performance of the fingerprint recognition of the fingerprint sensor chip 220.
  • the light-emitting layer 124 may be an OLED organic light-emitting panel made of low-temperature poly-silicon (LTPS) technology. Its ultra-thin thickness, light weight, and low power consumption can be used to provide clearer images.
  • LTPS low-temperature poly-silicon
  • the gap may be less than or equal to a preset threshold, and the preset threshold may be between 150 ⁇ m and 2000 ⁇ m.
  • the display screen 120 may further include a polarizer (POL) 123, which is disposed above the light emitting layer and used to generate polarized light.
  • a touch sensor layer (Touch, Sensor, TP Sensor) 122 is provided above the polarizer 123 for sensing and detecting the touch of a finger on the display screen.
  • the display screen 120 may further include a cover glass 121, For protecting the display screen 120, the touch sensor layer 122 specifically detects the touch of the finger above the cover glass 121.
  • an optically clear adhesive (OCA) 122 may be used for bonding.
  • the LCD display screen 120 when the display screen 120 is an LCD display screen, the LCD display screen also includes its corresponding light-emitting layer and a light-shielding heat-dissipating protective layer, wherein the light-emitting layer of the LCD display screen is a liquid crystal light-emitting layer, which is light-shielding
  • the protective layer is a light-shielding protection structure under the LCD screen.
  • the flexible display screen 120 when the display screen 120 is a flexible display screen, the flexible display screen may be a flexible LCD display screen or a flexible OLED display screen.
  • the flexible display screen may be a flexible LCD display screen or a flexible OLED display screen.
  • the support plate 210 is installed on the upper surface of the middle frame 300 of the electronic device, so that at least one fingerprint sensor chip 220 above the support plate 210 is located below the display screen 120, in this case,
  • the fingerprint recognition device 200 is not fixedly connected to the display screen 120, but is fixedly installed in the middle frame 300 of the electronic device, which is convenient for the installation and removal of the fingerprint sensor chip 220, and is suitable for any kind of display screen 120, and can be installed on the display screen Any position below 120.
  • the thickness of the fingerprint identification device 200 is relatively thin.
  • the thickness space occupied by the fingerprint identification device 200 under the display screen is saved.
  • At least one fingerprint sensor chip 220 may be a single fingerprint sensor chip, or may also include multiple fingerprint sensor chips, and the fingerprint sensor chip may include the above-mentioned optical component 132 and the light detection portion 134, It is used to receive and transmit the fingerprint optical signal reflected or scattered by the finger, and convert the fingerprint optical signal into a fingerprint electrical signal.
  • the fingerprint optical signal and the fingerprint electrical signal are both fingerprint detection signals for fingerprint identification.
  • a fingerprint sensor array composed of 4 fingerprint sensor chips can be arranged side by side under the middle area of the display screen 120 by splicing and on the upper surface of the support plate 210, An optical fingerprint sensor chip assembly is formed, and the sensing areas of the four optical fingerprint sensor chips together constitute a fingerprint detection area of the fingerprint recognition device 200.
  • the number, size, and arrangement of the fingerprint sensor chips shown in the figure are only examples, and can be adjusted according to actual needs.
  • the number of the plurality of fingerprint sensor chips may be any number such as 2, 3, or 5, and the plurality of fingerprint sensor chips may be distributed in any manner such as square or circular distribution. No limitation.
  • the upper surface of the middle frame 300 extends downward with a groove 311, and the support plate 210 is provided on the surface of the groove 311.
  • the depth of the groove 311 is greater than or equal to the thickness of the support plate 210, and the fingerprint recognition device 200 is wholly or partially embedded in the middle frame 300, thereby utilizing the thickness of the middle frame 300 to further reduce the occupation of the fingerprint recognition device 200 Thickness space under the screen.
  • the support plate 210 may be installed and fixed in the groove through an adhesive layer or a mechanical fixing device, or other types of fixing devices, for example, the support plate 210 is connected to the support plate 210 by means of module printing double-sided tape (Fingerprint Module) With the groove 311 of the middle frame, the two surfaces of the module attached with double-sided adhesive are respectively adhered to the upper surface of the groove 311 and the lower surface of the support plate 210.
  • module printing double-sided tape Fingerprint Module
  • the support plate 210 may also be bonded to the groove 311 of the support plate 210 and the middle frame by using water glue, solid glue, or foam with an adhesive layer.
  • FIG. 5 shows an installation structure diagram of another fingerprint identification device 200 under the display screen 120.
  • the edge of the groove 311 is formed with a step structure 312, and the edge of the support plate 210 overlaps the upper surface of the step structure 312.
  • the depth of the groove 311 is greater than the thickness of the support plate 210, and the height of the step structure 312 is greater than or equal to the thickness of the support plate 210.
  • the upper surface of the support plate 210 may be on the same horizontal plane as the upper surface of the other area in the middle frame 300 except for the groove.
  • the height h of the step structure 312 may be equal to the support plate 210 Thickness d.
  • the overlap between the lower surface of the edge of the support plate 210 and the upper surface of the step structure 312 is connected and fixed by an adhesive layer 230.
  • the adhesive layer 230 can also be attached to a module
  • the double-sided adhesive, water adhesive, foam layer with adhesive layer of solid adhesive tape, or other types of adhesive layer are not limited in the embodiments of the present application.
  • the gap distance can be used to accommodate parts of other electronic devices, and improve the utilization of the space under the screen .
  • the middle frame is not required to provide support for the entire area of the support plate, and only the edge of the support plate needs to be partially supported and fixed, thereby facilitating the installation and disassembly of the fingerprint identification device 200, and also reducing the fingerprint identification device
  • the thickness of the lower middle frame further reduces the under-screen space of the electronic device, which is conducive to the development of thin and light electronic devices.
  • a foam 240 is provided between the upper surface of the edge of the support plate 210 and the lower surface of the display screen.
  • the foam 240 may be provided in all or part of the peripheral edges of the support plate 210.
  • the foam 240 may be frame-shaped, strip-shaped, block-shaped, or any other shape.
  • the lower surface of the foam 240 is attached with foam bonding glue 241, and the foam 240 is pasted on the upper surface of the support plate 210 through the foam bonding glue 241.
  • the upper surface of the foam 240 is close to the lower surface of the display screen 120, and may be in contact with the lower surface of the display screen 120, or there may be a certain air gap between the lower surface of the display screen 120.
  • the foam bonding glue 241 may also be provided on the upper surface of the foam 240, and the foam 240 is pasted on the lower surface of the display screen 120 through the foam bonding glue 241, for example, in the display screen 120 The lower surface of the light emitting layer 124.
  • the lower surface of the foam 240 is close to the upper surface of the support plate 210, and may contact the upper surface of the support plate 210, or there may be a certain air gap with the upper surface of the support plate 210.
  • the foam bonding glue may also be provided on the upper surface and the lower surface of the foam 240, and the foam 240 bonds the display screen 120 and the support plate 210 through the foam bonding glue 241.
  • the display screen 120 is a flexible display screen
  • the foam 240 can be used for buffering when a finger is pressed on the flexible display screen
  • the pressing force of the finger plays a certain supporting role on the flexible display screen, thereby reducing the influence of the finger pressing on the display effect of the flexible display screen.
  • a through hole 314 is formed on the middle frame 300, and a step structure 312 is formed on the edge of the through hole 314.
  • the edge of the support plate 210 overlaps the upper surface of the step structure 312.
  • the overlap between the lower surface of the edge of the support plate 210 and the upper surface of the step structure 312 can be connected and fixed by the adhesive layer 230.
  • a foam 240 may also be provided between the upper surface of the edge of the support plate 210 and the lower surface of the display screen.
  • a foam 240 may also be provided between the upper surface of the edge of the support plate 210 and the lower surface of the display screen.
  • the fingerprint recognition device 200 occupies only a small area of the middle frame for fixing, and the area below the fingerprint recognition device can be used to accommodate other components in the electronic device, such as a battery, a motherboard, a camera, a flat cable, and each Sensors, microphones, earpieces and other components. And at this time, the thickness of the middle frame under the fingerprint identification device can be minimized.
  • FIG. 7 shows an installation structure diagram of another fingerprint identification device 200 under the display screen 120.
  • the support plate 210 is a special-shaped support plate whose edges are bent upward to form an inverted step structure 211 that overlaps the step structure 312 of the middle frame 300.
  • the upper surface of the inverted step structure 211 is higher than the upper surface of the central area of the support plate 210.
  • the lower surface of the inverted step structure 211 is in contact with the upper surface of the step structure 311 in the middle frame 300.
  • the lower surface of the inverted step structure 211 and the upper surface of the step structure 311 may be fixed by adhesive layer 230.
  • At least one fingerprint sensor chip 220 is disposed in the center area of the support plate 210 instead of the edge area. In other words, at least one fingerprint sensor chip 220 is not located on the upper surface of the inverted step structure 211 of the support plate 210.
  • the height of the inverted step structure 211 that is, the distance A between the upper surface of the inverted step structure 211 and the lower surface of the support plate 210 is less than or equal to the depth of the groove 311 of the middle frame.
  • the lower surface of the support plate 210 other than the inverted step structure 211 may fit the upper surface of the groove 311 in the middle frame .
  • the lower surface of the central area of the supporting plate, or the projection area of the at least one fingerprint sensor chip 220 on the supporting plate 210 may be attached to the upper surface of the groove 311.
  • the lower surfaces of other areas may also be bonded to the upper surface of the groove 311 in the middle frame through the adhesive layer 230.
  • the lower surface of the support plate 210 other than the inverted step structure 211 may also be concave with the middle frame There is a certain air gap on the upper surface of the groove 311.
  • the lower surface of the projection area of the at least one fingerprint sensor chip 220 on the support plate 210 may have a certain air gap with the upper surface of the groove 311.
  • the upper surface of the inverted step structure 211 may be lower than the upper surface of the other area except the groove 311 in the middle frame, or the upper surface of the inverted step structure 211 may be the same as the other area of the middle frame except the groove 311
  • the upper surface of the peripheral area of the step structure 311 in the middle frame is located on the same horizontal plane.
  • the upper surface of the at least one fingerprint sensor chip 220 above the support plate may also be on the same horizontal plane as the upper surface of the other area except the groove 311 in the middle frame, or lower than the other area except the groove 311 in the middle frame Upper surface.
  • the length L of the inverted step structure 211 is greater than a certain threshold to achieve stable support for the fingerprint recognition device 200.
  • the length L of the inverted step structure 211 may be greater than 0.5 mm.
  • the The length L of the inverted step structure 211 is 1 mm.
  • the length of the inverted step structure 211 is related to the thickness of the support plate 210 and the material strength in actual products.
  • the design of the inverted step structure 211 is intended to stably support the support plate 210 and at least one fingerprint sensor chip 220 above it On the middle frame 300.
  • the length of the inverted step structure 211 is longer, so as to provide more stable support.
  • the strength of the support plate 210 is stronger, the length of the inverted step structure 211 can be appropriately reduced, and on the premise of providing stable support, the space occupied by it can be further reduced.
  • the support plate 210 by designing the support plate 210 as a special-shaped structure, the inverted step structure of the edge is lapped and fixed on the step structure of the middle frame, while fixing the support plate on the middle frame, the center of the support plate
  • the area that is, the area where at least one fingerprint sensor is provided on the upper surface is located inside the middle frame, in other words, the solution of the embodiment of the present application utilizes the thickness of the middle frame to embed the fingerprint recognition device 200 in the middle frame to a greater extent , Further saving the thickness of the space below the screen.
  • the through hole 314 may also be formed with a stepped structure 312 on the edge of the upper surface of the middle frame, the shaped support plate
  • the inverted step structure 211 at the edge of 210 can also be overlapped on the step structure 312 of the middle frame 300, and the lower surface of the inverted step structure 211 and the upper surface of the step structure 311 are adhesively fixed by the adhesive layer 230.
  • the upper surface of the inverted step structure 211 may be lower than the upper surface of the middle frame except the through hole 314, or the upper surface of the inverted step structure 211 may be the same as the other area of the middle frame except the through hole 314 The upper surface is located at the same level.
  • the upper surface of the at least one fingerprint sensor chip 220 above the support plate may also be on the same horizontal plane as the upper surface of the other area except the through hole 314 in the middle frame, or lower than the other area except the through hole 314 in the middle frame Upper surface.
  • the thickness of the middle frame can be minimized.
  • a foam 240 is provided between the upper surface of the edge of the shaped support plate 210 and the lower surface of the display screen.
  • the foam may be disposed on the upper surface of the inverted step structure 211 at the edge of the support plate 210, or may be disposed on the upper surface of the non-inverted step structure 211 area at the edge of the support plate 210.
  • the entire area of the peripheral edge of the support plate 210 is upwardly warped to form an inverted step structure 211, or a partial area of the peripheral edge of the support plate 210 is upwardly warped to form an inverted step structure 211.
  • FIG. 9a to 9c show three schematic structural views of the support plate 210.
  • the edges of all four sides are warped to form an inverted step structure 211.
  • the step structure 312 in the middle frame 300 may also be correspondingly formed on the periphery of the quadrilateral groove or quadrilateral through hole.
  • the edges on opposite sides of the support plate 210 are upwardly warped to form an inverted step structure 211, while the edges on the other sides are not profiled to ensure that the edges on the other sides of the support plate and the center of the support plate At the same level.
  • the step structure 312 in the middle frame 300 may be formed on the peripheral edges of the quadrilateral groove or quadrilateral through hole, or may be formed on both sides of the quadrilateral groove or quadrilateral through hole, corresponding to the receiving The inverted step structure in the support plate.
  • the partial regions of the edges on opposite sides of the support plate 210 are upwardly warped to form a plurality of partial inverted step structures 211. Except for the partial area where the inverted step structure 211 is formed in the figure, the other partial areas are at the same horizontal plane as the center of the support plate.
  • any partial area in the surrounding area of the support plate 210 may form an inverted step structure. There are no restrictions.
  • the step structure 312 in the middle frame 300 may be formed at the peripheral edge of the quadrilateral groove or quadrilateral through hole, or may be correspondingly formed in a partial area of the quadrilateral groove or quadrilateral through hole for Undertake the inverted step structure in the support plate.
  • the supporting plate 210 may also be a circular or other shape of supporting plate.
  • the shape of the groove or through hole in the middle frame may be similar to or the same as the shape of the supporting plate, so that the concave The groove or the through-hole can accommodate the support plate.
  • FIG. 10 shows an installation structure diagram of another fingerprint identification device 200 under the display screen 120.
  • the support plate 210 is a special-shaped support plate, which may be similar to or the same as the special-shaped support plate in FIG. 7 or FIG. 8, and its edge is bent upward to form an inverted step structure 211.
  • a groove 311 is formed in the middle frame 300, and the above-mentioned inverted step structure 211 overlaps around the groove 311.
  • the lower surface of the inverted step structure 211 and the upper surface of the area around the groove 311 may be fixed by adhesive layer 230.
  • At least one fingerprint sensor chip 220 is also disposed in the center area of the support plate 210 instead of the edge area. In other words, at least one fingerprint sensor chip 220 is not located in the inverted step structure 211 of the support plate 210 Upper surface.
  • the lower surface of the support plate 210 other than the inverted step structure 211 may be attached to the upper surface of the groove 311 in the middle frame.
  • the lower surfaces of other areas may also be bonded to the upper surface of the groove 311 in the middle frame through the adhesive layer 230.
  • the lower surface of the support plate 210 other than the inverted step structure 211 may also have an air gap with the upper surface of the groove 311.
  • the inverted step structure of the edge is lapped and fixed on the middle frame, while fixing the support plate on the middle frame, by using the groove of the middle frame Or through holes, sink the central area of the support plate, and set at least one fingerprint sensor chip above the central area.
  • the solution of the embodiment of the present application utilizes the thickness of the middle frame to make the fingerprint recognition device 200 more Embedded in the middle frame, further saving the thickness of the space below the screen.
  • the inverted step structure 211 at the edge of the shaped support plate 210 can also overlap the edge area of the through hole 314,
  • the lower surface of the inverted step structure 211 and the upper surface of the step structure 311 are fixed by the adhesive layer 230.
  • the thickness of the middle frame can be minimized.
  • the top view of the support plate 210 may be the same as any one of FIGS. 9a to 9c, and the entire area of the surrounding edges is upwardly warped to form an inverted step structure 211, or the surrounding edges A part of the area is warped upward to form an inverted step structure 211.
  • a foam 240 is provided between the upper surface of the edge of the shaped support plate 210 and the lower surface of the display screen.
  • the foam may be disposed on the upper surface of the inverted step structure 211 at the edge of the support plate 210, or may be disposed on the upper surface of the non-inverted step structure 211 area at the edge of the support plate 210.
  • the support plate 210 may be a kind of reinforced steel sheet.
  • the support plate 210 may be a reinforced steel sheet in a flexible printed circuit (Flexible Printed Circuit, FPC).
  • FPC Flexible Printed Circuit
  • FIG. 12 shows an installation structure diagram of another fingerprint identification device 200 under the display screen 120.
  • At least one fingerprint sensor chip 220 may be electrically connected to the flexible circuit board 250, and electrically interconnect and signal with other peripheral circuits or other elements of electronic devices through the flexible circuit board 250 transmission.
  • at least one fingerprint sensor chip 220 may receive the control signal of the processing unit of the electronic device through the flexible circuit board 250, and may also output the fingerprint signal to the processing unit or control unit of the electronic device through the flexible circuit board 250.
  • the above-mentioned flexible circuit board 250 may include a chip on film (FPC, COF) layer and a plurality of electronic components.
  • the COF layer can be used as a carrier to directly package electronic components on the COF layer to form a chip package product.
  • the COF layer may also be referred to as a COF flexible packaging substrate.
  • the COF flexible packaging substrate refers to a packaged flexible substrate without chips or components installed, which is an important part of a printed circuit board (PCB).
  • the flexible circuit board 250 may be provided with an image processor.
  • the image processor may be specifically a microprocessor (micro processing unit, MCU) for receiving a fingerprint detection signal (such as a fingerprint image) sent from at least one fingerprint sensor chip 220 through the flexible circuit board 250 and based on the fingerprint detection signal Perform fingerprint recognition.
  • MCU microprocessor
  • the flexible circuit board 250 may also be provided with at least one capacitor for optimizing the fingerprint detection signal collected by the at least one fingerprint sensor chip 220.
  • the at least one capacitor is used to filter the fingerprint detection signal collected by the at least one fingerprint sensor chip 220.
  • the flexible circuit board 250 may also be provided with at least one storage unit for storing fingerprint signals processed by the microprocessor.
  • the at least one storage unit is a flash memory (flash).
  • FIG. 13 is a schematic diagram of a single explosion of a fingerprint identification device 200 provided by an embodiment of the present application.
  • the flexible circuit board 250 may include a reinforcement layer (stiffener) 210 (that is, an example of the support plate 210 described above) and a circuit layer 260.
  • the reinforcement layer 210 is disposed on the circuit layer 260 Below the circuit layer 260, a window 261 is provided, at least one fingerprint sensor chip 220 is provided in the window 261, and is connected to the reinforcement layer 210 through the adhesive layer 201, and at least one fingerprint sensor chip 220 is connected to the circuit through the electrical connection device 202 Layer 260 is electrically connected.
  • the reinforcing layer 210 is a reinforcing plate.
  • the material of the reinforcing plate may be a stainless steel reinforcing plate, an aluminum foil reinforcing plate, a glass fiber reinforcing plate, or other organic material reinforcing plate. Examples are not limited to this.
  • the reinforcing layer 210 is a metal reinforcing steel sheet.
  • At least one fingerprint sensor chip 220 is adhered to the reinforcing layer 210 through a die attach film (DAF) 201 to implement the optical fingerprint sensor 210 at least one fingerprint sensor chip 220 and the reinforcing layer 221's ultra-thin connection.
  • DAF die attach film
  • the electrical connection device 202 is any device that realizes electrical connection, and may be a wire bonding (WB) device.
  • the electrical connection device 202 may be a bonding wire made of gold (Au).
  • the foregoing electrical connection device may also be a miniature metal connection post or connector and other electrical connection methods, as long as the electrical connection between the two electrical modules can be achieved, which is not limited in the embodiments of the present application .
  • the fingerprint recognition device 200 further includes: a filter 270, and the filter 270 is disposed between at least one fingerprint sensor chip 220 and the display screen 120. It is used to filter out the optical signal in the non-target band and transmit the optical signal in the target band.
  • the area of the filter 270 is larger than the area of the fingerprint detection area of at least one fingerprint sensor chip 220.
  • the filter 270 is located below the fingerprint detection area, and the orthographic projection of the filter 270 on the display screen 120 covers the fingerprint detection area.
  • the filter 270 may include one or more optical filters, and the one or more optical filters may be configured as, for example, a band-pass filter to allow transmission of light emitted by the OLED display or fingerprint recognition in the LCD display The transmission of light emitted by the auxiliary light source also blocks infrared light and other light components in sunlight.
  • the filter 270 is used to reduce undesired ambient light in fingerprint sensing, so as to improve the optical sensing of at least one fingerprint sensor chip 220 to the received light.
  • the filter 270 may be specifically used to filter out light of a specific wavelength, for example, near infrared light and part of red light.
  • the light reflectance of the filter 270 is less than 1%, so as to ensure that at least one fingerprint sensor chip 220 can receive a sufficient optical signal, thereby improving the fingerprint recognition effect.
  • an adhesive layer 271 is further provided on the flexible circuit board 260 for connecting the flexible circuit board 260 and the optical filter 270.
  • the adhesive layer 271 is a hollow square or a circle, and is disposed on the non-circuit area on the circuit layer 260.
  • the glue width of the glue layer 271 is greater than 0.6 mm to ensure that the flexible circuit board 260 and the filter 270 are connected and fixed.
  • the filter 270 and the at least one fingerprint sensor chip 220 may be an air gap not filled with any auxiliary materials, or may be filled with a glue material having a refractive index lower than a preset refractive index, for example, a preset refraction Rates include but are not limited to 1.3.
  • the filter 270 when the filter 270 is filled with optical glue and is attached to the upper surface of at least one fingerprint sensor chip 220, once the upper surface of the fingerprint sensor chip 220 is covered with uneven thickness, there will be a Newton ring phenomenon, which affects Fingerprint recognition effect.
  • an air layer or a low-refractive index glue between the filter 270 and at least one fingerprint sensor chip 220 is an air layer or a low-refractive index glue, which can avoid the problem of Newton ring and improve the fingerprint recognition effect.
  • the above-mentioned filter 270 is disposed above the at least one fingerprint sensor chip 220 through an adhesive layer.
  • it can also be grown in the fingerprint sensor chip by a semiconductor process to form an optical signal for passing the target band, and filtering the optical signal for the target band
  • the filter layer 270 is integrated with the fingerprint sensor chip.
  • the filter layer 270 is grown on the surface of the sensor chip 220 and integrated in the sensor chip 220, and the filter layer 270 completely covers the light detection array 223 in the sensor chip 220.
  • the above-mentioned filter layer 270 may be formed on the photodetection array 223 of the fingerprint sensor chip 220 by an evaporation process, for example, by atomic layer deposition, sputter coating, electron beam evaporation coating, ion beam coating, etc.
  • a multi-layer filter material film is prepared above the sensor chip 220.
  • the filter layer 270 includes a multilayer oxide film, wherein the multilayer oxide film includes a silicon oxide film and a titanium oxide film, the silicon oxide film and the titanium oxide Films are sequentially grown alternately to form the filter layer 270; or the multilayer oxide film includes a silicon oxide film and a niobium oxide film, and the silicon oxide film and the niobium oxide film are sequentially grown alternately to form the filter layer 270.
  • the thickness of the filter layer 270 is between 1 ⁇ m and 10 ⁇ m.
  • the filter layer 270 is used to pass the optical signal in the wavelength range of 400 nm to 650 nm.
  • the wavelength range of the target wavelength band includes 400 nm to 650 nm.
  • the fingerprint recognition device 200 in FIG. 13 may be applicable to any of the installation methods of the off-screen fingerprint recognition device in FIGS. 5 to 11, which is not limited in the embodiments of the present application.
  • an embodiment of the present application further provides an electronic device 20.
  • the electronic device 20 may include the above-mentioned display screen 120, a middle frame 300, and the fingerprint recognition apparatus 200 of the above-mentioned application embodiment, wherein the fingerprint recognition apparatus 20 is set below the display 120.
  • the electronic device may be any electronic device with a display screen.
  • the display screen is an organic light emitting diode OLED screen, a liquid crystal display LCD or a flexible display screen.
  • the upper surface of the middle frame 300 extends downward with a groove, and the fingerprint identification device is fixed in the groove.
  • the upper surface of the middle frame 300 extends downward with a groove or a through hole, and a step structure is formed on the edge of the groove or the edge of the through hole, and the fingerprint
  • the identification device includes a support plate 210 whose edge overlaps the upper surface of the stepped structure.
  • the upper surface of the middle frame 300 extends downward with a groove or a through hole
  • the fingerprint recognition device includes a support plate 210, and an edge of the support plate overlaps the The edge of the groove or the edge of the through hole.
  • the middle frame 300 is a metal or plastic structure.
  • the disclosed system and device may be implemented in other ways.
  • the device embodiments described above are only schematic.
  • the division of the units is only a division of logical functions.
  • there may be other divisions for example, multiple units or components may be combined or Can be integrated into another system, or some features can be ignored, or not implemented.
  • the displayed or discussed mutual couplings or direct couplings or communication connections may be indirect couplings or communication connections through some interfaces, devices, or units, and may also be electrical, mechanical, or other forms of connection.
  • the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the objectives of the solutions of the embodiments of the present application.
  • the functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
  • the above integrated unit may be implemented in the form of hardware or software functional unit.
  • the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it may be stored in a computer-readable storage medium.
  • the technical solution of the present application essentially or part of the contribution to the existing technology, or all or part of the technical solution can be embodied in the form of a software product
  • the computer software product is stored in a storage medium
  • several instructions are included to enable a computer device (which may be a personal computer, server, or network device, etc.) to perform all or part of the steps of the methods described in the embodiments of the present application.
  • the aforementioned storage media include: U disk, mobile hard disk, read-only memory (Read-only Memory, ROM), random access memory (Random Access Memory, RAM), magnetic disk or optical disk and other media that can store program code .

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Abstract

一种指纹识别装置和电子设备，能够用于设置在多种不同的显示屏下，减小屏幕下方指纹识别装置安装的厚度空间。该指纹识别装置用于设置在电子设备的显示屏下方，包括：支撑板；至少一个指纹传感器芯片，该至少一个指纹传感器芯片设置于该支撑板的上表面；其中，该支撑板用于安装在该电子设备的中框的上表面，以使该至少一个指纹传感器芯片位于该电子设备的显示屏下方；该至少一个指纹传感器芯片用于接收经由该显示屏上方的人体手指反射或散射而返回的指纹检测信号，其中该指纹检测信号用于检测该手指的指纹信息。

Description

指纹识别装置和电子设备
本申请要求以下申请的优先权，其全部内容通过应用结合在本申请中：
2018年12月13日提交国际局、申请号为PCT/CN2018/120922、发明名称为“指纹识别装置和电子设备”的国际申请；
2018年12月29日提交国际局、申请号为PCT/CN2018/125425、发明名称为“指纹识别装置和电子设备”的国际申请。
技术领域
本申请涉及光学指纹技术领域，并且更具体地，涉及一种指纹识别装置和电子设备。
背景技术
目前，随着生物识别传感器的发展，尤其指纹识别传感器的迅猛发展，指纹识别传感器广泛应用于移动终端设备，智能家居，汽车电子等领域，消费者对指纹传感器的应用也越来越普遍。
随着移动终端设备和手机显示屏技术的不断提升，移动终端显示器屏幕的材质也越来越多元化，大致有薄膜场效应晶体管(Thin Film Transistor，TFT)液晶显示屏(Liquid Crystal Display，LCD)、薄膜二极管半透式(Thin Film Diode，TFD)液晶显示屏、超亮度(Ultra Fine Bright，UFB)液晶显示屏、超扭曲向列型(Super Twisted Nematic，STN)液晶显示屏，有机发光二极管(Organic Light-Emitting Diode，OLED)显示屏，柔性折叠屏幕这几种类型。此外，消费者对于移动终端的尺寸厚度等要求越来越严格。
因此，移动终端中的指纹识别装置如何同时适应多元化的屏幕，且减小屏幕下方指纹识别装置安装的厚度空间以满足移动终端的需求，是一项亟待解决的问题。
发明内容
本申请实施例提供了一种指纹识别装置和电子设备，能够用于设置在多种不同的显示屏下，减小屏幕下方指纹识别装置安装的厚度空间。
第一方面，提供了一种指纹识别装置，用于设置在电子设备的显示屏下 方，包括：支撑板；
至少一个指纹传感器芯片，该至少一个指纹传感器芯片设置于该支撑板的上表面；
其中，该支撑板用于安装在该电子设备的中框的上表面，以使该至少一个指纹传感器芯片位于该电子设备的显示屏下方；
该至少一个指纹传感器芯片用于接收经由该显示屏上方的人体手指反射或散射而返回的指纹检测信号，其中该指纹检测信号用于检测该手指的指纹信息。
通过本申请实施例的方案，将支撑板安装在电子设备的中框的上表面，从而使得该支撑板上方的至少一个指纹传感器芯片位于显示屏的下方，在此情况下，该指纹识别装置不与显示屏固定连接，而是固定安装于电子设备的中框中，便于指纹传感器芯片的安装拆卸，且适用于任何种类的显示屏，可以安装于显示屏下方的任意位置。此外，在本申请实施例中，指纹识别装置的厚度较薄，通过安装于电子设备的中框上表面，节约显示屏下方指纹识别装置占用的厚度空间。
在一种可能的实现方式中，该中框的上表面向下延伸设有凹槽或者通孔，该凹槽的边缘或者该通孔的边缘形成有台阶结构，该支撑板的边缘搭接在该台阶结构的上表面。
在一种可能的实现方式中，该支撑板的边缘向上弯曲，形成倒台阶结构，该倒台阶结构贴合在该台阶结构上。
在本申请实施例中，通过将支撑板设计为异形结构，其边缘的倒台阶结构搭接固定在中框的台阶结构上，在将支撑板固定在中框上的同时，将支撑板的中心区域下沉，并在中心区域上方设置至少一个指纹传感器芯片，换言之，本申请实施例的方案，利用了中框的厚度，将指纹识别装置更大程度的内嵌于中框中，进一步节约了屏幕下方的指纹识别装置安装的空间厚度。
在一种可能的实现方式中，该中框的上表面向下延伸设有凹槽或者通孔，该支撑板的边缘搭接在该凹槽的边缘或者通孔的边缘。
在一种可能的实现方式中，该支撑板的边缘向上弯曲，形成倒台阶结构，该倒台阶结构贴合在该凹槽的边缘或者通孔的边缘。
在一种可能的实现方式中，该倒台阶结构为直角L型或者圆角L型，该倒台阶结构的长度大于0.5mm。
在一种可能的实现方式中，该倒台阶结构的上表面与该倒台阶结构的外围区域的上表面位于同一平面。
在一种可能的实现方式中，该倒台阶结构与该至少一个指纹传感器芯片之间设置有泡棉。
在一种可能的实现方式中，该支撑板的中心区域的下表面与该凹槽的上表面有空气间隙。
在一种可能的实现方式中，该支撑板的边缘的上表面与该显示屏的下表面之间设置有泡棉。
在一种可能的实现方式中，该中框的上表面向下延伸设有凹槽，该支撑板固定在该凹槽的上表面。
在一种可能的实现方式中，该支撑板通过水胶、固态胶或者泡棉固定在该中框上。
在一种可能的实现方式中，该支撑板为补强钢片。
在一种可能的实现方式中，该支撑板为柔性电路板的补强钢片，该柔性电路板与该至少一个指纹传感器芯片电连接。
在一种可能的实现方式中，该指纹识别装置还包括：该柔性电路板，该柔性电路板通过金线与该至少一个指纹传感器芯片电连接。
在一种可能的实现方式中，该至少一个指纹传感器与该显示屏的发光层下表面的距离为150μm至2000μm。
在一种可能的实现方式中，该至少一个指纹传感器芯片包括多个光学指纹传感器芯片，该多个光学指纹传感器芯片并排设置在该支撑板的上表面，以拼接成一个光学指纹传感器芯片组件。
在一种可能的实现方式中，该至少一个指纹传感器芯片中每个指纹传感器芯片包括：微透镜阵列，至少一阻光层和光检测阵列；
该至少一阻光层设置于该微透镜阵列下方，其中，该至少一阻光层设置有多个通光小孔，该光检测阵列设置于该至少一阻光层下方；
其中，该微透镜阵列用于将该指纹检测信号汇聚至该至少一阻光层的多个通光小孔，该指纹检测信号通过该多个通光小孔传输至该光检测阵列。
在一种可能的实现方式中，该指纹识别装置还包括：滤光片，用于滤除非目标波段的光信号，透过目标波段的光信号。
在一种可能的实现方式中，该滤光片通过胶层固定于该至少一个指纹传 感器芯片的上方，或者集成在该至少一个指纹传感器芯片中。
在一种可能的实现方式中，该支撑板和/或该中框为金属材质或塑胶结构件。
在一种可能的实现方式中，该显示屏为有机发光二极管OLED屏、液晶显示屏LCD或者柔性显示屏。
第二方面，提供了一种电子设备，包括显示屏、中框以及，如第一方面或第一方面的任一可能的实现方式中的指纹识别装置，其中，该指纹识别装置设置于该显示屏下方，并安装于该中框的上表面。
在一种可能的实现方式中，该中框的上表面向下延伸设有凹槽，该指纹识别装置固定于该凹槽内。
在一种可能的实现方式中，该中框的上表面向下延伸设有凹槽或者通孔，该凹槽的边缘或者该通孔的边缘形成有台阶结构，该指纹识别装置包括支撑板，该支撑板的边缘搭接在该台阶结构的上表面。
在一种可能的实现方式中，该中框的上表面向下延伸设有凹槽或者通孔，该指纹识别装置包括支撑板，该支撑板的边缘搭接在该凹槽的边缘或者通孔的边缘。
在一种可能的实现方式中，该显示屏为有机发光二极管OLED屏、液晶显示屏LCD或者柔性显示屏。
在一种可能的实现方式中，该中框为金属或塑胶结构件。
通过在电子设备中设置上述指纹识别装置，减小电子设备的屏下空间，有利于电子设备的轻薄化发展。
附图说明
图1是本申请实施例所适用的终端设备的结构示意图。
图2是根据本申请实施例的一种指纹识别装置的示意性结构图。
图3是根据本申请实施例的一种指纹传感器芯片的示意性结构图。
图4是根据本申请实施例的一种指纹识别装置的示意性俯视图。
图5是根据本申请实施例的另一指纹识别装置的示意性结构图。
图6是根据本申请实施例的另一指纹识别装置的示意性结构图。
图7是根据本申请实施例的另一指纹识别装置的示意性结构图。
图8是根据本申请实施例的另一指纹识别装置的示意性结构图。
图9a至图9c是根据本申请实施例的支撑板的示意性俯视图。
图10是根据本申请实施例的另一指纹识别装置的示意性结构图。
图11是根据本申请实施例的另一指纹识别装置的示意性结构图。
图12是根据本申请实施例的另一指纹识别装置的示意性结构图。
图13是根据本申请实施例的一种指纹识别装置的单体爆炸示意图。
图14是根据本申请实施例的一种电子设备的示意性框图。
具体实施方式
下面将结合附图，对本申请实施例中的技术方案进行描述。
应理解，本申请实施例可以应用于光学指纹系统，包括但不限于光学指纹识别系统和基于光学指纹成像的产品，本申请实施例仅以光学指纹系统为例进行说明，但不应对本申请实施例构成任何限定，本申请实施例同样适用于其他采用光学成像技术的系统等。
作为一种常见的应用场景，本申请实施例提供的指纹识别装置可以应用在智能手机、平板电脑以及其他具有显示屏的移动终端或者其他电子设备；更具体地，在上述电子设备中，指纹识别装置可以具体为指纹识别装置，其可以设置在显示屏下方的局部区域或者全部区域，从而形成屏下(Under-display)光学指纹系统。或者，该指纹识别装置也可以部分或者全部集成至电子设备的显示屏内部，从而形成屏内(In-display)光学指纹系统。
如图1所示为本申请实施例可以适用的终端设备的结构示意图，该终端设备100包括显示屏120和指纹识别装置130，其中，该指纹识别装置130设置在显示屏120下方的局部区域。该指纹识别装置130包括光学指纹传感器，该光学指纹传感器包括具有多个光学感应单元131的感应阵列133，该感应阵列133所在区域或者其感应区域为指纹识别装置130的指纹检测区域103。如图1所示，指纹检测区域103位于显示屏120的显示区域之中。在一种替代实施例中，指纹识别装置130还可以设置在其他位置，比如显示屏120的侧面或者终端设备100的边缘非透光区域，并通过光路设计来将显示屏120的至少部分显示区域的光信号导引到指纹识别装置130，从而使得指纹检测区域103实际上位于显示屏120的显示区域。
应当理解，指纹检测区域103的面积可以与指纹识别装置130的感应阵列的面积不同，例如通过例如透镜成像的光路设计、反射式折叠光路设计或 者其他光线汇聚或者反射等光路设计，可以使得指纹识别装置130的指纹检测区域103的面积大于指纹识别装置130感应阵列的面积。在其他替代实现方式中，如果采用例如光线准直方式进行光路引导，指纹识别装置130的指纹检测区域103也可以设计成与该指纹识别装置130的感应阵列的面积基本一致。
因此，使用者在需要对电子设备进行解锁或者其他指纹验证的时候，只需要将手指按压在位于显示屏120的指纹检测区域103，便可以实现指纹输入。由于指纹检测可以在屏内实现，因此采用上述结构的终端设备100无需其正面专门预留空间来设置指纹按键(比如Home键)，从而可以采用全面屏方案，即显示屏120的显示区域可以基本扩展到整个终端设备100的正面。
作为一种可选的实现方式，如图1所示，指纹识别装置130包括光检测部分134和光学组件132，该光检测部分134包括感应阵列以及与该感应阵列电性连接的读取电路及其他辅助电路，其可以在通过半导体工艺制作在一个芯片(Die)，比如光学成像芯片或者光学指纹传感器，该感应阵列具体为光探测器(Photo detector)阵列，其包括多个呈阵列式分布的光探测器，该光探测器可以作为上述的光学感应单元；该光学组件132可以设置在光检测部分134的感应阵列的上方，其可以具体包括导光层或光路引导结构以及其他光学元件，该导光层或光路引导结构主要用于从手指表面反射回来的反射光导引至感应阵列进行光学检测。
在具体实现上，光学组件132可以与光检测部分134封装在同一个光学指纹部件。比如，该光学组件132可以与该光学检测部分134封装在同一个光学指纹芯片，也可以将该光学组件132设置在该光检测部分134所在的芯片外部，比如将该光学组件132贴合在该芯片上方，或者将该光学组件132的部分元件集成在上述芯片之中。
其中，光学组件132的导光层或者光路引导结构有多种实现方案，比如，该导光层可以具体为在半导体硅片制作而成的准直器(Collimator)层，其具有多个准直单元或者微孔阵列，该准直单元可以具体为小孔，从手指反射回来的反射光中，垂直入射到该准直单元的光线可以穿过并被其下方的光学感应单元接收，而入射角度过大的光线在该准直单元内部经过多次反射被衰减掉，因此每一个光学感应单元基本只能接收到其正上方的指纹纹路反射回来的反射光，从而感应阵列便可以检测出手指的指纹图像。
在另一种实施例中，导光层或者光路引导结构也可以为光学透镜(Lens)层，其具有一个或多个透镜单元，比如一个或多个非球面透镜组成的透镜组，其用于将从手指反射回来的反射光汇聚到其下方的光检测部分134的感应阵列，以使得该感应阵列可以基于该反射光进行成像，从而得到该手指的指纹图像。可选地，该光学透镜层在该透镜单元的光路中还可以形成有针孔，该针孔可以配合该光学透镜层扩大指纹识别装置的视场，以提高指纹识别装置130的指纹成像效果。
在其他实施例中，导光层或者光路引导结构也可以具体采用微透镜(Micro-Lens)层，该微透镜层具有由多个微透镜形成的微透镜阵列，其可以通过半导体生长工艺或者其他工艺形成在光检测部分134的感应阵列上方，并且每一个微透镜可以分别对应于感应阵列的其中一个感应单元。并且，微透镜层和感应单元之间还可以形成其他光学膜层，比如介质层或者钝化层，更具体地，微透镜层和感应单元之间还可以包括具有微孔的挡光层，其中该微孔形成在其对应的微透镜和感应单元之间，挡光层可以阻挡相邻微透镜和感应单元之间的光学干扰，并使得感应单元所对应的光线通过微透镜汇聚到微孔内部并经由该微孔传输到该感应单元以进行光学指纹成像。应当理解，上述光路引导结构的几种实现方案可以单独使用也可以结合使用，比如，可以在准直器层或者光学透镜层下方进一步设置微透镜层。当然，在准直器层或者光学透镜层与微透镜层结合使用时，其具体叠层结构或者光路可能需要按照实际需要进行调整。
作为一种可选的实施例，显示屏120可以采用具有自发光显示单元的显示屏，比如有机发光二极管(Organic Light-Emitting Diode，OLED)显示屏或者微型发光二极管(Micro-LED)显示屏。以采用OLED显示屏为例，指纹识别装置130可以利用OLED显示屏120位于指纹检测区域103的显示单元(即OLED光源)来作为光学指纹检测的激励光源。当手指140按压在指纹检测区域103时，显示屏120向指纹检测区域103上方的目标手指140发出一束光111，该光111在手指140的表面发生反射形成反射光或者经过手指140内部散射而形成散射光，在相关专利申请中，为便于描述，上述反射光和散射光统称为反射光。由于指纹的嵴(ridge)与峪(valley)对于光的反射能力不同，因此，来自指纹嵴的反射光151和来自指纹峪的反射光152具有不同的光强，反射光经过光学组件132后，被指纹识别装置130中的感 应阵列134所接收并转换为相应的电信号，即指纹检测信号；基于该指纹检测信号便可以获得指纹图像数据，并且可以进一步进行指纹匹配验证，从而在终端设备100实现光学指纹识别功能。
在其他实施例中，指纹识别装置130也可以采用内置光源或者外置光源来提供用于进行指纹检测的光信号。在这种情况下，该指纹识别装置130可以适用于非自发光显示屏，比如液晶显示屏或者其他的被动发光显示屏。以应用在具有背光模组和液晶面板的液晶显示屏为例，为支持液晶显示屏的屏下指纹检测，终端设备100的光学指纹系统还可以包括用于光学指纹检测的激励光源，该激励光源可以具体为红外光源或者特定波长非可见光的光源，其可以设置在液晶显示屏的背光模组下方或者设置在终端设备100的保护盖板下方的边缘区域，而指纹识别装置130可以设置液晶面板或者保护盖板的边缘区域下方并通过光路引导以使得指纹检测光可以到达指纹识别装置130；或者，指纹识别装置130也可以设置在背光模组下方，且背光模组通过对扩散片、增亮片、反射片等膜层进行开孔或者其他光学设计以允许指纹检测光穿过液晶面板和背光模组并到达指纹识别装置130。当采用指纹识别装置130采用内置光源或者外置光源来提供用于进行指纹检测的光信号时，其检测原理与上面描述内容是一致的。
应当理解的是，在具体实现上，终端设备100还包括透明保护盖板，该盖板可以为玻璃盖板或者蓝宝石盖板，其位于显示屏120的上方并覆盖终端设备100的正面。因为，本申请实施例中，所谓的手指按压在显示屏120实际上是指按压在显示屏120上方的盖板或者覆盖该盖板的保护层表面。
还应当理解，终端设备100还可以包括电路板150，该电路板设置在指纹识别装置130的下方。指纹识别装置130可以通过背胶粘接在电路板150上，并通过焊盘及金属线焊接与电路板150实现电性连接。指纹识别装置130可以通过电路板150实现与其他外围电路或者终端设备100的其他元件的电性互连和信号传输。比如，指纹识别装置130可以通过电路板150接收终端设备100的处理单元的控制信号，并且还可以通过电路板150将来自指纹识别装置130的指纹检测信号输出给终端设备100的处理单元或者控制单元等。
另一方面，在某些实施例中，指纹识别装置130可以仅包括一个光学指纹传感器，此时指纹识别装置130的指纹检测区域103的面积较小且位置固 定，因此用户在进行指纹输入时需要将手指按压到指纹检测区域103的特定位置，否则指纹识别装置130可能无法采集到指纹图像而造成用户体验不佳。在其他替代实施例中，指纹识别装置130可以具体包括多个光学指纹传感器；该多个光学指纹传感器可以通过拼接方式并排设置在显示屏120的下方，且该多个光学指纹传感器的感应区域共同构成指纹识别装置130的指纹检测区域103。也即是说，指纹识别装置130的指纹检测区域103可以包括多个子区域，每个子区域分别对应于其中一个光学指纹传感器的感应区域，从而将指纹识别装置130的指纹采集区域103可以扩展到显示屏的下半部分的主要区域，即扩展到手指惯常按压区域，从而实现盲按式指纹输入操作。可替代地，当光学指纹传感器数量足够时，指纹检测区域103还可以扩展到半个显示区域甚至整个显示区域，从而实现半屏或者全屏指纹检测。
还应理解，在本申请实施例中，指纹识别装置中的感应阵列也可以称为像素阵列，感应阵列中的光学感应单元或感应单元也可称为像素单元。
需要说明的是，本申请实施例中的指纹识别装置也可以称为光学指纹识别模组、光学指纹识别装置、指纹识别模组、指纹模组、指纹采集装置等，上述术语可相互替换。
应当理解，虽然在图1所示的实施例中以光学指纹识别装置为屏下光学指纹识别装置为例，但是，在其他实施例中，终端设备100的指纹识别装置也可以采用超声波指纹识别装置或者其他类型的指纹识别装置代替。本申请对指纹识别装置的类型和具体结构不作特殊限制，只要上述指纹识别装置可以满足在终端设备的显示屏内部进行指纹识别的性能要求便可。
本申请实施例中的指纹识别装置，能够减小指纹识别装置占用的厚度空间，且适用于各种显示屏下方，进一步提高了指纹识别装置及其所在电子设备的整体性能以及用户体验。
以下，结合图2至图13，详细介绍本申请实施例的指纹识别装置。
需要说明的是，为便于理解，在以下示出的实施例中，相同的结构采用相同的附图标记，并且为了简洁，省略对相同结构的详细说明。
图2是本申请实施例提供的一种指纹识别装置200的示意性结构图，该指纹识别装置200用于设置在电子设备的显示屏下方，其中该显示屏可以为任意种类的显示屏，例如，液晶显示屏LCD，有机发光二极管显示屏OLED或者柔性显示屏。
如图2所示，该指纹识别装置200包括：
支撑板210；
至少一个指纹传感器芯片220，所述至少一个指纹传感器220芯片设置于该支撑板210的上表面；
其中，该支撑板210用于安装在电子设备的中框300的上表面，以使至少一个指纹传感器芯片220位于电子设备的显示屏120下方；
该至少一个指纹传感器芯片220用于接收经由显示屏120上方的人体手指反射或散射而返回的指纹检测信号，其中该指纹检测信号用于检测手指的指纹信息。
可选地，在本申请实施例中，该支撑板210可以为各种不易变形的材料，例如，该支撑板210可以为金属材质的支撑板，或者合金材质的支撑板，或者也可以是塑封材质的支撑板，只要其形状固定具有支撑和固定功能即可，本申请实施例对此不作限定。
可选地，该支撑板210可以为多边形，圆形等规则的形状结构，也可以为其它不规则的形状结构，本申请实施例对此不做具体限定。
可选地，该支撑板210的表面粗糙度(surface roughness)采用轮廓算术平均偏差(Ra)来度量，该支撑板210的Ra大于某一阈值，例如0.25μm，以提高成像效果；具体而言，该支撑板210的表面粗糙度大于某一阈值时，其表面可以将光信号进行散射，能够有效减少显示屏120发出的并在指纹识别装置200的内部发生反射的光信号，进而避免光反射对成像造成影响；此外，该支撑板210的表面粗糙度大于某一阈值时，可以增加该支撑板210与其他部件之间的连接可靠度。比如该支撑板210和至少一个指纹传感器芯片220的连接可靠度。
可选地，该支撑板210的厚度范围为0.15mm～0.30mm，以控制指纹识别装置200的厚度。
可选地，该支撑板210的平面度小于某一阈值，例如0.03mm，具体地，至少一个指纹传感器芯片220与支撑板210连接区域的平面度小于0.03mm，以保证至少一个指纹传感器芯片220与支撑板210连接的可靠性。
可选地，如图3所示，该至少一个指纹传感器芯片220中的每一个指纹传感器芯片220可以包括：微透镜阵列221，至少一阻光层222和光检测阵列223；
该至少一阻光层222设置于微透镜阵列221下方，其中，至少一阻光层种设置有多个通光小孔，光检测阵列223设置于该至少一阻光层222下方；
其中，上述微透镜阵列221用于将指纹检测信号汇聚至至少一阻光层222的多个通光小孔，且该指纹检测信号通过多个通光小孔传输至光检测阵列223。
上述光检测阵列223包括多个感应单元。该感应单元用于接收经过手指反射或散射后返回的指纹光信号并将所述光信号处理得到一个指纹图像单元，该指纹图像单元为指纹图像中一个单元像素。可选地，感应单元可以包括光电二极管(Photo Diode，PD)、金属氧化物半导体场效应管(Metal Oxide Semiconductor Field Effect Transistor，MOSFET)等器件。可选地，该感应单元对于特定波长光具有较高的光灵敏度和较高的量子效率，以便于检测相应波长的光信号。应理解，图3中的光检测阵列223也可以为图1中的感应阵列133，其相关功能和结构说明可以参考前述相关描述。
在本申请实施例中，上述至少一阻光层222可以阻挡相邻微透镜和感应单元之间的光学干扰，并使得感应单元所对应的指纹检测信号通过微透镜汇聚到通光小孔内部并经由通光小孔传输到感应单元以进行光学指纹成像。可选地，光检测阵列223与至少一阻光层222之间，以及多层阻光层222之间通过透明介质层进行隔离。
上述微透镜阵列221由多个微透镜形成，其可以通过半导体生长工艺或者其他工艺形成在至少一阻光层222上方，并且每一个微透镜可以分别对应于光检测阵列223的其中一个感应单元。
采用本申请实施例的指纹传感器芯片，在实现大面积高分辨率的识别指纹图像的同时，减小光学指纹识别传感器的厚度，从而提升光学指纹识别装置的性能。
可选地，该至少一个指纹传感器芯片220可以通过胶层设置在该支撑板的上表面，例如，该胶层为芯片粘接薄膜(Die Attach Film，DAF)，可以实现至少一个指纹传感器芯片220与支撑板210的超薄连接。
进一步的，通过将支撑板210安装在电子设备的中框300的上表面，从而使得该支撑板210上方的至少一个指纹传感器芯片220位于显示屏120的下方。具体地，对显示屏120中的部分叠层结构进行开窗，使得显示屏上方的指纹检测信号能够通过该开窗进入至少一个指纹传感器芯片220，该至少 一个指纹传感器芯片220位于该开窗下方。
具体地，图2中示出了一种OLED显示屏的示意性结构图，如图2所示，显示屏120可以包括发光层124和遮光散热缓冲层125。
该遮光散热保护层125设置于显示组件124的下方，其中设置有开窗。该遮光散热保护层可以是用于遮蔽光的黑色片状层或者印刷层，其中包括至少一部分金属材料用于散热，且还可以包括泡棉层以起到缓冲以及保护的作用。
指纹识别装置200中的至少一个指纹传感器芯片220和发光层124的下表面可以存在间隙。该间隙可以是不填充任何辅助材料的空气间隙(air gap)，可保证在当显示屏受到按压或者电子设备出现跌落或碰撞时均不会使指纹传感器芯片220接触到发光层124，影响显示屏的显示效果，以及指纹传感器芯片220的指纹识别的稳定性和性能。
该发光层124可以是采用低温多晶硅技术(low temperature poly-silicon，LTPS)制成的OLED有机发光面板，其厚度超薄、重量轻、低耗电，可以用于提供较为清晰的影像。指纹传感器芯片220和发光层124之间存在间隙时，该间隙可以小于或等于预设阈值，该预设阈值可以在150μm至2000μm之间。
可选地，如图2所示，所述显示屏120还可以包括是偏光片(polarizer，POL)123，设置于发光层上方，用于产生偏振光。偏光片123上方设置有触摸传感器层(Touch Panel Sensor，TP Sensor)122，用于感应检测显示屏上手指的触摸，具体地，如图2所示，显示屏120还可以包括盖板玻璃121，用于保护显示屏120，触摸传感器层122具体检测盖板玻璃121上方手指的触摸。
可选地，盖板玻璃121和触摸传感器层122之间，和/或触摸传感器层122与偏振片123之间可以通过光学透明胶(optically clear adhesive，OCA)122进行贴合。
应此处需要说明的是，当显示屏120为LCD显示屏时，LCD显示屏中同样包括其对应的发光层以及遮光散热保护层，其中，LCD显示屏的发光层为液晶发光层，遮光散热保护层为LCD显示屏下方的遮光保护结构，当指纹识别装置设置在LCD显示屏下方是，同样需要将LCD显示屏中的遮光保护结构进行开窗以通过显示屏上方的光信号。
同样的，当显示屏120为柔性显示屏时，该柔性显示屏可以为柔性LCD显示屏或者为柔性OLED显示屏，具体方案可以参考上面描述，此处不再赘述。
通过本申请实施例的方案，将支撑板210安装在电子设备的中框300的上表面，从而使得该支撑板210上方的至少一个指纹传感器芯片220位于显示屏120的下方，在此情况下，该指纹识别装置200不与显示屏120固定连接，而是固定安装于电子设备的中框300中，便于指纹传感器芯片220的安装拆卸，且适用于任何种类的显示屏120，可以安装于显示屏120下方的任意位置。
此外，在本申请实施例中，指纹识别装置200的厚度较薄，通过安装于电子设备的中框300上表面，节约显示屏下方指纹识别装置200占用的厚度空间。
可选地，在本申请实施例中，至少一个指纹传感器芯片220可以为单个指纹传感器芯片，或者也可以包括多个指纹传感器芯片，该指纹传感器芯片可以包括上述光学组件132以及光检测部分134，用于接收并传导经过手指反射或散射后的指纹光信号，并将该指纹光信号转换为指纹电信号，该指纹光信号以及指纹电信号均为指纹检测信号，用于进行指纹识别。
例如，图4所示的由4个指纹传感器芯片构成的指纹传感器阵列，4个指纹传感器芯片可以通过拼接方式并排设置在显示屏120的中间区域的下方，并设置在支撑板210的上表面，形成一个光学指纹传感器芯片组件，该4个光学指纹传感器芯片的感应区域共同构成指纹识别装置200的指纹检测区域。
应理解，图中所示的指纹传感器芯片的数量、尺寸和排布情况仅为示例，可以根据实际需求进行调整。例如，该多个指纹传感器芯片的个数可以为2个、3个或5个等任意数量，该多个指纹传感器芯片可以呈方形或圆形分布等任意方式分布，本申请实施例对此均不做限定。
可选地，在一种可能的实施方式中，如图2所示，该中框300的上表面向下延伸设有凹槽311，该支撑板210设置在该凹槽311的表面。可选地，该凹槽311的深度大于等于该支撑板210的厚度，指纹识别装置200全部或者部分内嵌于中框300中，从而利用中框300的厚度，进一步减小指纹识别装置200占用的屏下厚度空间。
可选地，可以通过胶层或者机械固定装置，或者其它类型的固定装置将支撑板210安装固定在凹槽中，例如，通过模组贴合双面胶(Fingerprint Module Tape)连接该支撑板210与中框的凹槽311，该模组贴合双面胶的两面分别与凹槽311的上表面和支撑板210的下表面粘接。
又例如，该支撑板210还可以通过水胶、固态胶、或者带有胶层的泡棉粘接支撑板210以及中框的的凹槽311。
图5示出了另一种指纹识别装置200位于显示屏120下的安装结构图。
如图5所示，凹槽311的边缘形成有台阶结构312，支撑板210的边缘搭接在台阶结构312的上表面。
可选地，在本申请实施例中，凹槽311的深度大于该支撑板210的厚度，台阶结构312的高度大于等于支撑板210的厚度。
可选地，如图5所示，支撑板210的上表面可以与中框300中除凹槽外其它区域的上表面位于同一水平面上，此时，台阶结构312的高度h可以等于支撑板210的厚度d。
可选地，如图5所示，支撑板210的边缘的下表面与台阶结构312的上表面的搭接处通过胶层230连接固定，可选地，该胶层230同样可以为模组贴合双面胶、水胶、固态胶带有胶层的泡棉层、或者其它类型的胶层，本申请实施例对此不做限定。
可选地，在此情况下，该支撑板210的中心区域的下表面与凹槽的上表面存在一定的距离，该空隙距离可以用于容纳其它电子设备的零件，提高屏下空间的利用率。且采用该实施方式，不需要中框为支撑板的全部区域提供支撑，只需要为支撑板的边缘局部提供支撑和固定，从而便于指纹识别装置200的安装和拆卸，也可以减小指纹识别装置下方中框的厚度，进一步减小电子设备的屏下空间，有利于电子设备的轻薄化发展。
可选地，如图5所示，支撑板210的边缘的上表面与显示屏的下表面之间设置有泡棉240。
可选地，该泡棉240可以设置于支撑板210的四周边缘的全部区域或者局部区域。可选地，该泡棉240可以为框型，条形，块型或者其它任意形状。
可选地，如图5所示，该泡棉240的下表面附有泡棉贴合胶241，泡棉240通过泡棉贴合胶241粘贴于支撑板210的上表面。在此情况下，该泡棉240的上表面靠近于显示屏120的下表面，可以与显示屏120的下表面接触， 也可以与显示屏120的下表面之间存在一定的空气间隙。
可选地，该泡棉贴合胶241还可以设置于泡棉240的上表面，泡棉240通过该泡棉贴合胶241粘贴于显示屏120的下表面，例如，粘贴于显示屏120中发光层124的下表面。在此情况下，该泡棉240的下表面靠近于支撑板210的上表面，可以与支撑板210的上表面接触，也可以与支撑板210的上表面之间存在一定的空气间隙。
可选地，该泡棉贴合胶还可以同时设置于泡棉240的上表面以及下表面，泡棉240通过该泡棉贴合胶241粘连显示屏120以及支撑板210。
当显示屏120为柔性显示屏时，通过在支撑板210的边缘的上表面与显示屏的下表面之间设置泡棉240，当手指按压在柔性显示屏上，该泡棉240可以用于缓冲手指的按压力，并对柔性显示屏起到一定的支撑作用，从而减小手指按压对柔性显示屏的显示效果的影响。
可选地，在另一种可能的实施方式中，如图6所示，在中框300上形成有通孔314，在该通孔314的边缘形成有台阶结构312。支撑板210的边缘搭接在该台阶结构312的上表面。同样的，支撑板210的边缘的下表面与台阶结构312的上表面的搭接处可以通过胶层230连接固定。
可选地，如图6所示，支撑板210的边缘的上表面与显示屏的下表面之间同样可以设置有泡棉240，与该泡棉240相关的技术方案可以参见上述图5中泡棉240的相关描述，此处不再赘述。
在本申请实施例中，指纹识别装置200仅占用中框局部小区域进行固定，指纹识别装置下方的区域可以用于容纳电子设备中的其它部件，例如放置电池、主板，摄像头，排线，各种感应器，话筒，听筒等等零部件。且此时，指纹识别装置下方的中框的厚度可以做到最小。
图7示出了另一种指纹识别装置200位于显示屏120下的安装结构图。
如图7所示，支撑板210为一种异形支撑板，其边缘向上弯曲，形成一种倒台阶结构211，该倒台阶结构211搭接在中框300的台阶结构312上。其中，该倒台阶结构211的上表面高于支撑板210中心区域的上表面，该倒台阶结构211的下表面与中框300中的台阶结构311的上表面贴合。
可选地，如图7所示，可以通过胶层230粘接固定上述倒台阶结构211的下表面与台阶结构311的上表面。
在本申请实施例中，至少一个指纹传感器芯片220设置于该支撑板210 的中心区域而非边缘区域，换言之，至少一个指纹传感器芯片220不位于该支撑板210的倒台阶结构211的上表面。
可选地，如图7所示，倒台阶结构211的高度，即倒台阶结构211的上表面至支撑板210的下表面之间的距离A，小于等于中框的凹槽311的深度。
可选地，当倒台阶结构211的高度A等于凹槽311的深度时，该支撑板210中除倒台阶结构211外的其它区域的下表面可以与中框中凹槽311的上表面贴合。例如，该支撑板中心区域，或者为至少一个指纹传感器芯片220在支撑板210上的投影区域的下表面可以与凹槽311的上表面贴合。可选地，其它区域的下表面还可以通过胶层230与中框中凹槽311的上表面粘接。
可选地，如图7所示，当倒台阶结构211的高度A小于凹槽311的深度时，该支撑板210中除倒台阶结构211外的其它区域的下表面也可以与中框中凹槽311的上表面存在一定的空气间隙，例如，该至少一个指纹传感器芯片220在支撑板210上的投影区域的下表面可以与凹槽311的上表面存在一定的空气间隙。
可选地，该倒台阶结构211的上表面可以低于中框中除凹槽311外其它区域的上表面，或者该倒台阶结构211的上表面可以与中框中除凹槽311外其它区域，例如中框中的台阶结构311的外围区域的上表面位于同一水平面。
进一步地，支撑板上方的至少一个指纹传感器芯片220的上表面也可以与中框中除凹槽311外其它区域的上表面位于同一水平面，或者低于该中框中除凹槽311外其它区域的上表面。
可选地，如图7所示，该倒台阶结构211的长度L大于一定阈值，以实现指纹识别装置200的稳定支撑，例如，该倒台阶结构211的长度L可以大于0.5mm，例如，该倒台阶结构211的长度L为1mm。
具体地，该倒台阶结构211的长度与实际产品中支撑板210的厚度以及材料强度相关，该倒台阶结构211的设计旨在能够将支撑板210以及其上方的至少一个指纹传感器芯片220稳定支撑在中框300上。可选地，当支撑板210的厚度越大，该倒台阶结构211的长度越长，以便提供更加稳定的支撑。可选地，当支撑板210的强度越强，该倒台阶结构211的长度可以适当减小，在提供稳定支撑的前提下，进一步减小其占用的空间。
在本申请实施例中，通过将支撑板210设计为异形结构，其边缘的倒台阶结构搭接固定在中框的台阶结构上，在将支撑板固定在中框上的同时，支 撑板的中心区域，即其上表面设置有至少一个指纹传感器的区域位于中框内部，换言之，本申请实施例的方案，利用了中框的厚度，将指纹识别装置200更大程度的内嵌于中框中，进一步节约了屏幕下方的空间厚度。
特别地，如图8所示，当中框300中不设置凹槽312，而设置有通孔314时，该通孔314在中框上表面的边缘同样可以形成有台阶结构312，该异形支撑板210边缘的倒台阶结构211同样可以搭接在中框300的台阶结构312上，通过胶层230粘接固定上述倒台阶结构211的下表面与台阶结构311的上表面。
可选地，该倒台阶结构211的上表面可以低于中框中除通孔314外其它区域的上表面，或者该倒台阶结构211的上表面可以与中框中除通孔314外其它区域的上表面位于同一水平面。
进一步地，支撑板上方的至少一个指纹传感器芯片220的上表面也可以与中框中除通孔314外其它区域的上表面位于同一水平面，或者低于该中框中除通孔314外其它区域的上表面。
此时，在将指纹识别装置200更大程度的内嵌于中框中，减小屏幕下方的空间厚度的同时，中框的厚度可以做到最小。
可选地，如图7和图8所示，异形支撑板210的边缘的上表面与显示屏的下表面之间设置有泡棉240。具体地，该泡棉可以设置在支撑板210边缘的倒台阶结构211的上表面，也可以设置在支撑板210边缘的非倒台阶结构211区域的上表面。
同样的，与该泡棉240相关的技术方案可以参见上述图5中泡棉240的相关描述，此处不再赘述。
可选地，在本申请实施例中，支撑板210的四周边缘的全部区域向上翘曲形成倒台阶结构211，或者支撑板210的四周边缘的部分区域向上翘曲形成倒台阶结构211。
图9a至图9c示出了支撑板210的三种俯视结构示意图。如图9a所示，支撑板210为四边形时，其四条边的边缘均翘曲形成倒台阶结构211。可选地，在该情况下，中框300内台阶结构312也可以对应的形成在四边形凹槽或者四边形通孔的四周边缘。
如图9b所示，支撑板210的相对两侧的边缘向上翘曲形成倒台阶结构211，而另外两侧的边缘则不做异形处理，保证支撑板的另外两侧的边缘与 支撑板的中心处于同一水平面。可选地，在该情况下，中框300内台阶结构312可以形成在四边形凹槽或者四边形通孔的四周边缘，或者也可以形成在四边形凹槽或者四边形通孔的其中两侧，对应于承接支撑板中的倒台阶结构。
如图9c所示，支撑板210的相对两侧的边缘的局部区域向上翘曲形成多个局部的倒台阶结构211。除图中形成倒台阶结构211的局部区域外，其它局部区域与支撑板的中心处于同一水平面。可选地，除图9c中所示的支撑板210的相对两侧的局部区域形成倒台阶结构外，支撑板210的四周区域中的任意局部区域均可以形成倒台阶结构，本申请实施例对此不做任何限定。可选地，在该情况下，中框300内台阶结构312可以形成在四边形凹槽或者四边形通孔的四周边缘，或者也可以对应的形成在四边形凹槽或者四边形通孔的部分区域，用于承接支撑板中的倒台阶结构。
应理解，支撑板210除四边形结构外，还可以为圆形或者其它形状的支撑板，对应的，中框中的凹槽或者通孔的形状可以与该支撑板形状相近或相同，使得该凹槽或者通孔可以将支撑板容纳其中即可。
图10示出了另一种指纹识别装置200位于显示屏120下的安装结构图。
可选地，在本申请实施例中，该支撑板210位异形支撑板，可以与图7或者图8中的异形支撑板近似或者相同，其边缘向上弯曲，形成倒台阶结构211。
具体地，在本申请实施例中，中框300中形成有凹槽311，上述倒台阶结构211搭接于凹槽311四周。可选地，如图10所示，可以通过胶层230粘接固定上述倒台阶结构211的下表面与凹槽311四周区域的上表面。
具体地，在本申请实施例中，至少一个指纹传感器芯片220同样设置于该支撑板210的中心区域而非边缘区域，换言之，至少一个指纹传感器芯片220不位于该支撑板210的倒台阶结构211的上表面。
可选地，该支撑板210中除倒台阶结构211外的其它区域的下表面可以与中框中凹槽311的上表面贴合。可选地，其它区域的下表面还可以通过胶层230与中框中凹槽311的上表面粘接。
可选地，如图10所示，该支撑板210中除倒台阶结构211外的其它区域的下表面也可以与凹槽311的上表面存在一定的空气间隙。
在本申请实施例中，通过将支撑板设计为异形结构，其边缘的倒台阶结 构搭接固定在中框上，在将支撑板固定在中框上的同时，通过利用中框中的凹槽或者通孔，将支撑板的中心区域下沉，并在中心区域上方设置至少一个指纹传感器芯片，换言之，本申请实施例的方案，利用了中框的厚度，将指纹识别装置200更大程度的内嵌于中框中，进一步节约了屏幕下方的空间厚度。
特别地，如图11所示，当中框300中不设置凹槽312，而设置有通孔314时，该异形支撑板210边缘的倒台阶结构211同样可以搭接在通孔314的边缘区域，通过胶层230粘接固定上述倒台阶结构211的下表面与台阶结构311的上表面。
此时，在将指纹识别装置200更大程度的内嵌于中框中，减小屏幕下方的空间厚度的同时，中框的厚度可以做到最小。
可选地，在本申请实施例中，支撑板210的俯视图可以与图9a至图9c中的任意一种情况相同，其四周边缘的全部区域向上翘曲形成倒台阶结构211，或者其四周边缘的部分区域向上翘曲形成倒台阶结构211。
可选地，如图10和图11所示，异形支撑板210的边缘的上表面与显示屏的下表面之间设置有泡棉240。具体地，该泡棉可以设置在支撑板210边缘的倒台阶结构211的上表面，也可以设置在支撑板210边缘的非倒台阶结构211区域的上表面。
同样的，与该泡棉240相关的技术方案可以参见上述图5中泡棉240的相关描述，此处不再赘述。
可选地，上述支撑板210可以为一种补强钢片。
可选地，在一种可能的实施方式中，该支撑板210可以为柔性电路板(Flexible Printed Circuit，FPC)中的补强钢片。
图12示出了另一种指纹识别装置200位于显示屏120下的安装结构图。
可选地，如图12所示，至少一个指纹传感器芯片220可以电连接到柔性电路板250上，并通过柔性电路板250实现与其他外围电路或者电子设备的其他元件的电性互连和信号传输。比如，至少一个指纹传感器芯片220可以通过柔性电路板250接收电子设备的处理单元的控制信号，并且还可以通过柔性电路板250将指纹信号输出给电子设备的处理单元或者控制单元等。
可选地，上述柔性电路板250可以包括覆晶薄膜(chip on FPC，COF)层和多个电子元器件。可选地，可以利用COF层作载体，将电子元器件直 接封装在COF层上以形成芯片封装产品。其中，该COF层也可以称为COF柔性封装基板，COF柔性封装基板指未安装芯片、元器件的封装型柔性基板，其作为印刷电路板(printed circuit board，PCB)的重要组成部分。
可选地，柔性电路板250上可以设置有图像处理器。所述图像处理器可以具体为微处理器(micro processing unit，MCU)，用于接收来自至少一个指纹传感器芯片220通过柔性电路板250发送的指纹检测信号(例如指纹图像)，并基于指纹检测信号进行指纹识别。
可选地，柔性电路板250上还可以设置有至少一个电容器，用于优化至少一个指纹传感器芯片220采集的指纹检测信号。例如，该至少一个电容器用于对至少一个指纹传感器芯片220采集的指纹检测信号进行滤波处理。
可选地，柔性电路板250上还可以设置有至少一个存储单元，用于存储所述微处理器处理得到的指纹信号。例如，所述至少一个存储单元为闪存(flash)。
图13为本申请实施例提供的一种指纹识别装置200的单体爆炸示意图。
可选地，如图12和图13所示，柔性电路板250可以包括补强层(stiffener)210(即上述支撑板210的一例)和电路层260，该补强层210设置于电路层260的下方，该电路层260中设置窗口261，至少一个指纹传感器芯片220设置于窗口261中，通过胶层201与补强层210连接，至少一个指纹传感器芯片220通过电连接装置202与所述电路层260电连接。
可选地，补强层210为补强板，应理解，该补强板的材料可以为不锈钢补强板、铝箔补强板、玻璃纤维补强板或者其它有机材料补强板，本申请实施例对此并不限定。优选地，补强层210为金属补强钢片。
可选地，至少一个指纹传感器芯片220通过芯片粘接薄膜(die attach film，DAF)201粘接在补强层210上，以实现所述光学指纹传感器210至少一个指纹传感器芯片220与补强层221的超薄连接。
可选地，电连接装置202为任意的实现电气连接的装置，可以为引线键合(wire bonding，WB)装置。例如，电连接装置202可以为材料为金(Au)的绑定线(bonding wire)。
应理解，上述电连接装置也可以为一种微型的金属连接柱或者连接器等其他电连接方式，只要能够实现两个电气模块之间的电连接即可，本申请实施例对此并不限定。
可选地，如图12和图13所示，指纹识别装置200还包括：滤光片270，该滤光片270设置于至少一个指纹传感器芯片220和显示屏120之间。用于滤掉非目标波段的光信号，透过目标波段的光信号。
可选地，滤光片270的面积大于至少一个指纹传感器芯片220的指纹检测区域面积。
可选地，滤光片270位于指纹检测区域的下方，滤光片270在显示屏120上的正投影覆盖指纹检测区域。
可选地，滤光片270可以包括一个或多个光学过滤器，一个或多个光学过滤器可以配置为例如带通过滤器，以允许OLED显示屏发射的光的传输或者LCD显示屏中指纹识别辅助的光源发射的光的传输，同时阻挡太阳光中的红外光等其他光组分。
本申请实施例中，滤光片270用于来减少指纹感应中的不期望的环境光，以提高至少一个指纹传感器芯片220对接收到的光的光学感应。滤光片270具体可以用于过滤掉特定波长的光，例如，近红外光和部分的红光等。
可选地，所述滤光片270对光的反射率小于1％，从而能够保证至少一个指纹传感器芯片220能够接收到足够的光信号，进而提升指纹识别效果。
可选地，如图12和图13所示，柔性电路板260上还设置有胶层271，用于连接柔性电路板260与滤光片270。
可选地，如图13所示，该胶层271为空心方形或圆形，设置于电路层260上非电路区域。
可选地，该胶层271的胶宽度大于0.6mm，以保证柔性电路板260与滤光片270连接固定。
可选地，滤光片270与至少一个指纹传感器芯片220之间可以是不填充任何辅助材料的空气间隙，也可以填充一种折射率低于预设折射率的胶材，例如，预设折射率包括但不限于1.3。
需要注意的是，滤光片270通过光学胶填充贴合在至少一个指纹传感器芯片220的上表面时，一旦指纹传感器芯片220的上表面覆盖的胶厚不均匀，会存在牛顿环现象，从而影响指纹识别效果。本申请实施例中，滤光片270与至少一个指纹传感器芯片220之间是空气层或者为低折射率胶，可以避免出现牛顿环问题，以提高指纹识别效果。
上述滤光片270通过胶层设置在至少一个指纹传感器芯片220上方，可 选地，还可以通过半导体工艺生长在指纹传感器芯片中生长形成用于通过目标波段光信号，并滤除非目标波段光信号的滤光层270，该滤光层270与指纹传感器芯片集成在一起。
可选地，该滤光层270生长于传感器芯片220的表面，并集成在该传感器芯片220中，该滤光层270完全覆盖传感器芯片220中的光检测阵列223。
具体地，可以采用蒸镀工艺在指纹传感器芯片220的光检测阵列223上进行镀膜形成上述滤光层270，例如，通过原子层沉积、溅射镀膜、电子束蒸发镀膜、离子束镀膜等方法在传感器芯片220上方制备多层滤光材料薄膜。
可选地，在本申请实施例中，滤光层270包括多层氧化物薄膜，其中，该多层氧化物薄膜包括硅氧化物薄膜和钛氧化物薄膜，该硅氧化物薄膜和钛氧化物薄膜依次交替生长形成该滤光层270；或者该多层氧化物薄膜包括硅氧化物薄膜和铌氧化物薄膜，该硅氧化物薄膜和铌氧化物薄膜依次交替生长形成该滤光层270。
可选地，本申请实施例中，滤光层270的厚度在1μm至10μm之间。
可选地，滤光层270用于通过400nm至650nm波段范围的光信号，换言之，上述目标波段的波长范围包括400nm至650nm。
应理解，图13中的指纹识别装置200可以适用于图5至图11中任意一种屏下指纹识别装置的安装方式，本申请实施例对此不做限制。
如图14所示，本申请实施例还提供了一种电子设备20，该电子设备20可以包括上述显示屏120、中框300以及上述申请实施例的指纹识别装置200，其中，该指纹识别装置20设置于显示屏120下方。
该电子设备可以为任何具有显示屏的电子设备。该显示屏为有机发光二极管OLED屏、液晶显示屏LCD或者柔性显示屏。
可选地，在一种可能的实施方式中，该中框300的上表面向下延伸设有凹槽，该指纹识别装置固定于该凹槽内。
可选地，在另一种可能的实施方式中，该中框300的上表面向下延伸设有凹槽或者通孔，该凹槽的边缘或者该通孔的边缘形成有台阶结构，该指纹识别装置包括支撑板210，该支撑板的边缘搭接在该台阶结构的上表面。
可选地，在另一种可能的实施方式中，该中框300的上表面向下延伸设有凹槽或者通孔，该指纹识别装置包括支撑板210，该支撑板的边缘搭接在该凹槽的边缘或者通孔的边缘。
可选地，该中框300为金属或塑胶结构件。
应理解，本申请实施例中的具体的例子只是为了帮助本领域技术人员更好地理解本申请实施例，而非限制本申请实施例的范围。
应理解，在本申请实施例和所附权利要求书中使用的术语是仅仅出于描述特定实施例的目的，而非旨在限制本申请实施例。例如，在本申请实施例和所附权利要求书中所使用的单数形式的“一种”、“上述”和“该”也旨在包括多数形式，除非上下文清楚地表示其他含义。
本领域普通技术人员可以意识到，结合本文中所公开的实施例描述的各示例的单元，能够以电子硬件、计算机软件或者二者的结合来实现，为了清楚地说明硬件和软件的可互换性，在上述说明中已经按照功能一般性地描述了各示例的组成及步骤。这些功能究竟以硬件还是软件方式来执行，取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能，但是这种实现不应认为超出本申请的范围。
在本申请所提供的几个实施例中，应该理解到，所揭露的系统、装置，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另外，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口、装置或单元的间接耦合或通信连接，也可以是电的，机械的或其它的形式连接。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本申请实施例方案的目的。
另外，在本申请各个实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以是两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现，也可以采用软件功能单元的形式实现。
所述集成的单元如果以软件功能单元的形式实现并作为独立的产品销售或使用时，可以存储在一个计算机可读取存储介质中。基于这样的理解， 本申请的技术方案本质上或者说对现有技术做出贡献的部分，或者该技术方案的全部或部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质中，包括若干指令用以使得一台计算机设备(可以是个人计算机，服务器，或者网络设备等)执行本申请各个实施例所述方法的全部或部分步骤。而前述的存储介质包括：U盘、移动硬盘、只读存储器(Read-only Memory，ROM)、随机存取存储器(Random Access Memory，RAM)、磁碟或者光盘等各种可以存储程序代码的介质。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (28)

  1. 一种指纹识别装置，其特征在于，用于设置在电子设备的显示屏下方，包括：
    支撑板；
    至少一个指纹传感器芯片，所述至少一个指纹传感器芯片设置于所述支撑板的上表面；
    其中，所述支撑板用于安装在所述电子设备的中框的上表面，以使所述至少一个指纹传感器芯片位于所述电子设备的显示屏下方；
    所述至少一个指纹传感器芯片用于接收经由所述显示屏上方的人体手指反射或散射而返回的指纹检测信号，其中所述指纹检测信号用于检测所述手指的指纹信息。
  2. 根据权利要求1所述的指纹识别装置，其特征在于，所述中框的上表面向下延伸设有凹槽或者通孔，所述凹槽的边缘或者所述通孔的边缘形成有台阶结构，所述支撑板的边缘搭接在所述台阶结构的上表面。
  3. 根据权利要求2所述的指纹识别装置，其特征在于，所述支撑板的边缘向上弯曲，形成倒台阶结构，所述倒台阶结构贴合在所述台阶结构上。
  4. 根据权利要求1所述的指纹识别装置，其特征在于，所述中框的上表面向下延伸设有凹槽或者通孔，所述支撑板的边缘搭接在所述凹槽的边缘或者所述通孔的边缘。
  5. 根据权利要求4所述的指纹识别装置，其特征在于，所述支撑板的边缘向上弯曲，形成倒台阶结构，所述倒台阶结构贴合在所述凹槽的边缘或者所述通孔的边缘。
  6. 根据权利要求3或5所述的指纹识别装置，其特征在于，所述倒台阶结构为直角L型或者圆角L型，所述倒台阶结构的长度大于0.5mm。
  7. 根据权利要求3或5所述的指纹识别装置，其特征在于，所述倒台阶结构的上表面与所述倒台阶结构的外围区域的上表面位于同一平面。
  8. 根据权利要求3或5所述的指纹识别装置，其特征在于，所述倒台阶结构与所述至少一个指纹传感器芯片之间设置有泡棉。
  9. 根据权利要求2-8中任一项所述的指纹识别装置，其特征在于，所述支撑板的中心区域的下表面与所述凹槽的上表面有空气间隙。
  10. 根据权利要求1-9中任一项所述的指纹识别装置，其特征在于，所 述支撑板的边缘的上表面与所述显示屏的下表面之间设置有泡棉。
  11. 根据权利要求1所述的指纹识别装置，其特征在于，所述中框的上表面向下延伸设有凹槽，所述支撑板固定在所述凹槽的上表面。
  12. 根据权利要求1-11中任一项所述的指纹识别装置，其特征在于，所述支撑板通过水胶、固态胶或者泡棉固定在所述中框上。
  13. 根据权利要求1-12中任一项所述的指纹识别装置，其特征在于，所述支撑板为补强钢片。
  14. 根据权利要求1-13中任一项所述的指纹识别装置，其特征在于，所述支撑板为柔性电路板的补强钢片，所述柔性电路板与所述至少一个指纹传感器芯片电连接。
  15. 根据权利要求14所述的指纹识别装置，其特征在于，所述指纹识别装置还包括：所述柔性电路板，所述柔性电路板通过金线与所述至少一个指纹传感器芯片电连接。
  16. 根据权利要求1-15中任一项所述的指纹识别装置，其特征在于，所述至少一个指纹传感器与所述显示屏的发光层下表面的距离为150μm至2000μm。
  17. 根据权利要求1-16中任一项所述的指纹识别装置，其特征在于，所述至少一个指纹传感器芯片包括多个光学指纹传感器芯片，所述多个光学指纹传感器芯片并排设置在所述支撑板的上表面，以拼接成一个光学指纹传感器芯片组件。
  18. 根据权利要求1-17中任一项所述的指纹识别装置，其特征在于，所述至少一个指纹传感器芯片中每个指纹传感器芯片包括：微透镜阵列，至少一阻光层和光检测阵列；
    所述至少一阻光层设置于所述微透镜阵列下方，其中，所述至少一阻光层设置有多个通光小孔，所述光检测阵列设置于所述至少一阻光层下方；
    其中，所述微透镜阵列用于将所述指纹检测信号汇聚至所述至少一阻光层的多个通光小孔，所述指纹检测信号通过所述多个通光小孔传输至所述光检测阵列。
  19. 根据权利要求1-18中任一项所述的指纹识别装置，其特征在于，所述指纹识别装置还包括：
    滤光片，用于滤除非目标波段的光信号，透过目标波段的光信号。
  20. 根据权利要求19所述的指纹识别装置，其特征在于，所述滤光片通过胶层固定于所述至少一个指纹传感器芯片的上方，或者集成在所述至少一个指纹传感器芯片中。
  21. 根据权利要求1-20中任一项所述的指纹识别装置，其特征在于，所述支撑板和/或所述中框为金属材质或塑胶结构件。
  22. 根据权利要求1-21中任一项所述的指纹识别装置，其特征在于，所述显示屏为有机发光二极管OLED屏、液晶显示屏LCD或者柔性显示屏。
  23. 一种电子设备，其特征在于，包括：显示屏、中框以及，
    如权利要求1至22中任一项所述的指纹识别装置；
    其中，所述指纹识别装置设置于所述显示屏下方，并安装于所述中框的上表面。
  24. 根据权利要求23所述的电子设备，其特征在于，所述中框的上表面向下延伸设有凹槽，所述指纹识别装置固定于所述凹槽内。
  25. 根据权利要求23或24所述的电子设备，其特征在于，所述中框的上表面向下延伸设有凹槽或者通孔，所述凹槽的边缘或者所述通孔的边缘形成有台阶结构，所述指纹识别装置包括支撑板，所述支撑板的边缘搭接在所述台阶结构的上表面。
  26. 根据权利要求23或24所述的电子设备，其特征在于，所述中框的上表面向下延伸设有凹槽或者通孔，所述指纹识别装置包括支撑板，所述支撑板的边缘搭接在所述凹槽的边缘或者通孔的边缘。
  27. 根据权利要求23-26中任一项所述的电子设备，其特征在于，所述显示屏为有机发光二极管OLED屏、液晶显示屏LCD或者柔性显示屏。
  28. 根据权利要求23-27中任一项所述的电子设备，其特征在于，所述中框为金属或塑胶结构件。
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