WO2020133378A1 - 指纹识别装置和电子设备 - Google Patents

指纹识别装置和电子设备 Download PDF

Info

Publication number
WO2020133378A1
WO2020133378A1 PCT/CN2018/125425 CN2018125425W WO2020133378A1 WO 2020133378 A1 WO2020133378 A1 WO 2020133378A1 CN 2018125425 W CN2018125425 W CN 2018125425W WO 2020133378 A1 WO2020133378 A1 WO 2020133378A1
Authority
WO
WIPO (PCT)
Prior art keywords
fingerprint
fingerprint sensor
identification device
fingerprint identification
sensor chip
Prior art date
Application number
PCT/CN2018/125425
Other languages
English (en)
French (fr)
Inventor
郭益平
Original Assignee
深圳市汇顶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to PCT/CN2018/125425 priority Critical patent/WO2020133378A1/zh
Priority to EP18933732.2A priority patent/EP3699809A4/en
Priority to CN201880003069.6A priority patent/CN109791610B/zh
Priority to CN202110367804.5A priority patent/CN113065472B/zh
Priority to CN202010858839.4A priority patent/CN111967417B/zh
Priority to PCT/CN2019/113720 priority patent/WO2020119289A1/zh
Priority to KR1020207027909A priority patent/KR102440709B1/ko
Priority to CN201980004221.7A priority patent/CN111133443B/zh
Priority to CN201921829124.5U priority patent/CN210605745U/zh
Priority to EP19896224.3A priority patent/EP3786834B1/en
Priority to US16/825,604 priority patent/US11232317B2/en
Publication of WO2020133378A1 publication Critical patent/WO2020133378A1/zh
Priority to US17/024,154 priority patent/US11917763B2/en

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing

Definitions

  • Embodiments of the present application relate to the field of electronics, and more specifically, to a fingerprint recognition device and electronic equipment.
  • the off-screen fingerprint recognition solution refers to attaching the optical or ultrasonic fingerprint recognition module to the bottom of the organic light-emitting diode (OLED) screen, that is, regardless of the optical fingerprint recognition module or the ultrasonic fingerprint recognition module All need to be closely bonded with the light emitting layer at the bottom of the screen.
  • OLED organic light-emitting diode
  • the OLED screen due to the high cost and fragility of the OLED screen, it is easy to damage the OLED screen when the fingerprint recognition module is directly attached to the OLED screen. In addition, since the fingerprint recognition module and the OLED screen are completely stuck together, if the fingerprint recognition module is damaged, it is easy to damage the OLED screen when the fingerprint recognition module is disassembled. Moreover, the bonding process of directly bonding the fingerprint recognition module to the OLED screen is relatively complicated.
  • a fingerprint identification device and electronic equipment are provided, which can reduce the cost and complexity of electronic equipment and improve maintainability. Especially for the scenario of multiple fingerprint sensor chips, the cost and complexity of electronic equipment can be effectively reduced, and the maintainability is greatly improved.
  • a fingerprint identification device which is applied to an electronic device with a display screen.
  • the fingerprint identification device includes:
  • At least one fingerprint sensor chip the at least one fingerprint sensor chip is disposed on the upper surface of the support plate;
  • the support plate is used to be installed in the middle frame of the electronic device, so that the at least one fingerprint sensor chip is located below the display screen of the electronic device; the at least one fingerprint sensor chip is used to receive the A fingerprint detection signal returned by a human finger above the display screen reflected or scattered, wherein the fingerprint detection signal is used to detect fingerprint information of the finger.
  • the middle frame of the electronic device has a groove on the upper surface, and the at least one fingerprint sensor chip is disposed in the groove of the middle frame through the support plate.
  • it also includes:
  • a circuit board at least a part of the circuit board is connected to an edge position of an upper surface of the support board, and the circuit board is connected to the at least one fingerprint sensor chip.
  • At least a part of the circuit board is connected to an edge position of the upper surface of the support board near a long side.
  • the support plate is a flexible reinforcing plate, and the flexible reinforcing plate is provided with a first positioning hole in an edge area of the lower surface near the short side.
  • the first positioning hole includes two positioning holes, and the shape of the opening of each positioning hole is circular.
  • the at least one fingerprint sensor chip includes a plurality of optical fingerprint sensor chips arranged along the long side direction of the upper surface of the flexible reinforcing plate, the flexible reinforcing plate is located in the The spacing area of each pair of adjacent chips in the plurality of optical fingerprint sensor chips is provided with a second positioning hole.
  • the shape of the opening of the second positioning hole is oblong or elliptical.
  • the at least one fingerprint sensor chip includes a plurality of optical fingerprint sensor chips, and the plurality of optical fingerprint sensor chips are arranged side by side on the upper surface of the support plate to be spliced into one optical fingerprint sensor chip Components.
  • the circuit board is provided with at least one bending groove at an end close to the plurality of optical fingerprint sensor chips, and one bending groove in the at least one bending groove corresponds to the plurality of The space area between a pair of adjacent chips in the optical fingerprint sensor chip.
  • the bending groove is U-shaped.
  • the fingerprint identification device further includes:
  • optical filter the optical filter is disposed above the at least one fingerprint sensor chip.
  • the light entrance surface of the filter is provided with an optical inorganic coating or an organic blackened coating.
  • the filter and the at least one fingerprint sensor chip are fixed by dispensing in the non-photosensitive area of the at least one fingerprint sensor chip, and the filter and the at least one fingerprint There is a gap between the photosensitive regions of the sensor chip; or the lower surface of the filter is fixed to the upper surface of the at least one fingerprint sensor chip by glue with a refractive index lower than a preset refractive index.
  • the circuit board is connected to the at least one fingerprint sensor chip through a gold wire, and the height of the gold wire and the height of the sealant of the gold wire are respectively lower than that of the filter height.
  • the surface roughness of the support plate is greater than 0.25um.
  • the circuit board is a T-shaped flexible circuit board, and a plurality of capacitors are provided above the T-shaped flexible circuit board, and the plurality of capacitors are correspondingly connected to the at least one fingerprint Sensor chip.
  • an electronic device including:
  • the fingerprint identification device is provided below the display screen to realize the off-screen fingerprint detection.
  • the display screen includes:
  • a light-shielding layer the light-shielding layer is disposed below the display assembly, the light-shielding layer is provided with a window, and the fingerprint recognition device receives light formed by the display assembly after being reflected by a human finger through the window opening Signal, the optical signal is used for fingerprint identification;
  • the fingerprint identification device is in contact with the lower surface of the display assembly, or there is a gap between the fingerprint identification device and the lower surface of the display assembly.
  • the electronic device further includes:
  • a middle frame the middle frame is used to support the display screen
  • a groove is formed on the upper surface of the middle frame, and the fingerprint identification device is disposed in the groove and has a predetermined gap with the display screen.
  • the support plate of the fingerprint identification device has at least one positioning hole, and at least one positioning column corresponding to the at least one positioning hole of the fingerprint identification device is provided in the groove.
  • the shape of the cross section of each positioning post in the at least one positioning post is circular.
  • the electronic device further includes:
  • At least one foam the at least one foam is disposed between the support plate and the middle frame.
  • the thickness of each foam in the at least one foam and the distance between the middle frame and the display screen and at least one fingerprint sensor chip and all The distance between the display screens is related.
  • the relationship between the at least one foam and the at least one fingerprint sensor chip is a one-to-one correspondence.
  • the support plate can be directly fixedly installed on the internal components such as the middle frame of the electronic device, which can reduce the installation difficulty of the at least one fingerprint sensor chip and Complexity improves maintainability.
  • the multiple chips can be fixedly installed under the display screen at one time, which can reduce the installation complexity and improve the installation efficiency.
  • FIG. 1 is a schematic plan view of an electronic device to which this application can be applied.
  • FIG. 2 is a schematic side sectional view of the electronic device shown in FIG. 1.
  • FIG. 3 is a schematic block diagram of a fingerprint identification device according to an embodiment of the present application.
  • FIG. 4 is a schematic side cross-sectional view of an electronic device having the fingerprint identification device shown in FIG. 3 according to an embodiment of the present application.
  • FIG. 5 is a schematic diagram of an electronic device with the fingerprint identification device shown in FIG. 3 after being disassembled according to an embodiment of the present application.
  • portable or mobile computing devices such as smartphones, laptops, tablets, gaming devices, and other electronic devices such as electronic databases, automobiles, and bank automated teller machines (Automated Teller Machine, ATM).
  • portable or mobile computing devices such as smartphones, laptops, tablets, gaming devices, and other electronic devices such as electronic databases, automobiles, and bank automated teller machines (Automated Teller Machine, ATM).
  • ATM Automated Teller Machine
  • biometrics recognition technologies include but are not limited to fingerprint recognition, palmprint recognition, iris recognition, face recognition, and living body recognition.
  • fingerprint identification technology uses fingerprint identification technology as an example for description.
  • the off-screen fingerprint recognition technology refers to installing the fingerprint recognition module under the display screen, so as to realize the fingerprint recognition operation in the display area of the display screen, and there is no need to set a fingerprint collection area on the front of the electronic device except the display area.
  • the fingerprint recognition module uses light returned from the top surface of the display assembly of the electronic device to perform fingerprint sensing and other sensing operations. This returned light carries information of objects (such as fingers) that are in contact with the top surface of the display component, and the fingerprint recognition module located below the display component collects and detects this returned light to realize off-screen fingerprint recognition.
  • the design of the fingerprint recognition module may be to achieve the desired optical imaging by appropriately configuring the optical elements for collecting and detecting the returned light.
  • in-display fingerprint identification technology refers to installing the fingerprint identification module or part of the fingerprint identification module inside the display screen, so as to realize the fingerprint identification operation in the display area of the display screen, without the need for electronic
  • the area on the front of the device except the display area is set with a fingerprint collection area.
  • FIG. 1 and 2 are schematic diagrams of an electronic device 100 to which the off-screen fingerprint recognition technology can be applied.
  • FIG. 1 is a schematic front view of the electronic device 100
  • FIG. 2 is a schematic diagram of a partial cross-sectional structure of the electronic device 100 shown in FIG.
  • the electronic device 100 may include a display screen 120 and a fingerprint recognition module 140.
  • the display screen 120 may be a self-luminous display screen, which uses a display unit with self-luminous as display pixels.
  • the display screen 120 may be an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display screen or a micro-LED display screen.
  • OLED Organic Light-Emitting Diode
  • the display screen 120 may also be a liquid crystal display (Liquid Crystal Display, LCD) or other passive light-emitting display screen, which is not limited in the embodiments of the present application.
  • the display screen 120 may also be specifically a touch display screen, which can not only display images, but also detect a user's touch or press operation, thereby providing a human-computer interaction interface for the user.
  • the electronic device 100 may include a touch sensor, and the touch sensor may specifically be a touch panel (Touch Panel, TP), which may be provided on the surface of the display screen 120, or may be partially integrated or The whole is integrated into the display screen 120 to form the touch display screen.
  • Touch Panel Touch Panel
  • the fingerprint recognition module 140 may be an optical fingerprint recognition module, such as an optical fingerprint sensor.
  • the fingerprint identification module 140 may include a fingerprint sensor chip (hereinafter also referred to as an optical fingerprint sensor) having an optical sensing array.
  • the optical sensing array includes multiple optical sensing units, and each optical sensing unit may specifically include a photodetector or a photoelectric sensor.
  • the fingerprint recognition module 140 may include a photodetector array (or called photodetector array, photoelectric sensor array), which includes a plurality of photodetectors distributed in an array.
  • the fingerprint recognition module 140 may be disposed in a partial area below the display screen 120, so that the fingerprint collection area (or detection area) 130 of the fingerprint recognition module 140 is at least partially located on the display screen 120 Within the display area 102.
  • the fingerprint recognition module 140 may also be disposed at other positions, such as the side of the display screen 120 or the non-light-transmissive area of the edge of the electronic device 100.
  • the optical signal of at least part of the display area of the display screen 120 can be guided to the fingerprint recognition module 140 through the optical path design, so that the fingerprint collection area 130 is actually located in the display area of the display screen 120 .
  • the fingerprint recognition module 140 may include only one fingerprint sensor chip.
  • the fingerprint collection area 130 of the fingerprint recognition module 140 has a small area and a fixed position. Therefore, the user needs to input fingerprints Press the finger to a specific position of the fingerprint collection area 130, otherwise the fingerprint recognition module 140 may fail to collect the fingerprint image and cause a poor user experience.
  • the fingerprint recognition module 140 may specifically include multiple fingerprint sensor chips; the multiple fingerprint sensor chips may be arranged side by side under the display screen 120 by splicing, and the multiple The sensing areas of the two fingerprint sensor chips together constitute the fingerprint collection area 130 of the fingerprint identification module 140. That is to say, the fingerprint collection area 130 of the fingerprint identification module 140 may include a plurality of sub-areas, and each sub-area corresponds to the sensing area of one of the fingerprint sensor chips, thereby collecting the fingerprints of the optical fingerprint module 130
  • the area 130 may be extended to the main area of the lower half of the display screen, that is, to the area where the finger is usually pressed, so as to realize the blind-press fingerprint input operation.
  • the fingerprint detection area 130 may also be extended to a half display area or even the entire display area, thereby realizing half-screen or full-screen fingerprint detection.
  • the plurality of fingerprint sensor chips may be independently packaged fingerprint sensor chips, or may be multiple chips (Die) packaged in the same chip package body.
  • the multiple fingerprint sensor chips may also be formed on different regions of the same chip (Die) through a semiconductor process.
  • the area or light sensing area of the optical sensing array of the fingerprint recognition module 140 corresponds to the fingerprint collection area 130 of the fingerprint recognition module 140.
  • the fingerprint collection area 130 of the fingerprint recognition module 140 may be equal to or not equal to the area or light sensing range of the area where the optical sensing array of the fingerprint recognition module 140 is located, which is not specifically limited in the embodiments of the present application.
  • the fingerprint collection area 130 of the fingerprint identification module 140 may be designed to be substantially the same as the area of the sensing array of the fingerprint identification module 140.
  • the design of the optical path for converging light or the optical path for reflecting light can make the area of the fingerprint collection area 130 of the fingerprint identification module 140 larger than the area of the sensing array of the fingerprint identification module 140.
  • the optical path design of the fingerprint identification module 140 will be exemplarily described below.
  • the optical collimator may be specifically a collimator layer made on a semiconductor silicon wafer , Which has a plurality of collimating units or micro holes, the collimating unit may specifically be a small hole, in the reflected light reflected from the finger, the light incident perpendicularly to the collimating unit may pass through and be
  • the fingerprint sensor chip receives, and the light with an excessive incident angle is attenuated by multiple reflections inside the collimating unit, so each fingerprint sensor chip can only receive the reflected light reflected by the fingerprint lines directly above it, Can effectively improve the image resolution, and thus improve the fingerprint recognition effect.
  • a collimating unit can be configured for one optical sensing unit in the optical sensing array of each fingerprint sensor chip, and the collimating unit can be attached to the corresponding optical sensing Above the unit.
  • the multiple optical sensing units may also share one collimating unit, that is, the one collimating unit has a sufficiently large aperture to cover the multiple optical sensing units. Since one collimating unit can correspond to multiple optical sensing units, the correspondence between the spatial period of the display screen 120 and the spatial period of the fingerprint sensor chip is destroyed.
  • the spatial structure of the light-emitting display array of the display screen 120 and the fingerprint sensor chip is similar, which can effectively prevent the fingerprint identification module 140 from using the optical signal passing through the display screen 120 to generate fingerprint moiré, which effectively improves the fingerprint identification effect of the fingerprint identification module 140.
  • the optical lens may include an optical lens (Lens) layer, which has one or more lens units, such as one or more aspheric lenses
  • the lens group is used to collect the reflected light reflected from the finger to the sensing array of the fingerprint sensor chip below it, so that the sensing array can perform imaging based on the reflected light, thereby obtaining a fingerprint image of the finger.
  • the optical lens layer may also be formed with a pinhole in the optical path of the lens unit, and the pinhole may cooperate with the optical lens layer to expand the field of view of the fingerprint recognition module 140 to improve the fingerprint recognition module 140 Fingerprint imaging effect.
  • an optical lens can be configured for each fingerprint sensor chip to perform fingerprint imaging, or an optical lens can be configured for multiple fingerprint sensor chips to achieve light convergence and fingerprint imaging . Even when a fingerprint sensor chip has two sensing arrays (Dual Array) or multiple sensing arrays (Multi-Array), it is also possible to configure two or more optical lenses for the fingerprint sensor chip to cooperate with the two sensors Arrays or multiple sensing arrays perform optical imaging to reduce the imaging distance and enhance the imaging effect.
  • the micro-lens layer may have a micro-lens array formed by a plurality of micro-lenses, which may be through a semiconductor growth process or other The process is formed above the sensing array of the fingerprint sensor chip, and each microlens may correspond to one of the sensing units of the sensing array, respectively.
  • optical film layers may also be formed between the microlens layer and the sensing unit, such as a dielectric layer or a passivation layer, more specifically, there may be micropores between the microlens layer and the sensing unit
  • Light blocking layer wherein the micro-hole is formed between its corresponding micro lens and the sensing unit, the light blocking layer can block the optical interference between the adjacent micro lens and the sensing unit, and allow light to pass through the micro
  • the lens is condensed into the micro hole and transmitted to the sensing unit corresponding to the micro lens through the micro hole to perform optical fingerprint imaging.
  • a microlens layer may be further provided under the collimator layer or the optical lens layer.
  • the collimator layer or the optical lens layer is used in combination with the microlens layer, its specific laminated structure or optical path may need to be adjusted according to actual needs.
  • the fingerprint recognition module 140 may be used to collect user fingerprint information (such as fingerprint image information).
  • the display 120 may use a display with a self-luminous display unit, such as an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display or a micro light-emitting diode (Micro-LED) display Screen.
  • the fingerprint recognition module 140 may use the display unit (ie, OLED light source) of the OLED display located in the fingerprint collection area 130 as an excitation light source for optical fingerprint detection.
  • the display screen 120 When a finger touches, presses, or approaches (for ease of description, collectively referred to as pressing in this application) in the fingerprint collection area 130, the display screen 120 emits a beam of light to the finger above the fingerprint collection area 130. Reflection occurs on the surface to form reflected light or scattered light after internal finger scattering. In related patent applications, for convenience of description, the above-mentioned reflected light and scattered light are collectively referred to as reflected light. Since the ridge and valley of the fingerprint have different light reflection capabilities, the reflected light from the fingerprint ridge and the fingerprint ridge have different light intensities.
  • the fingerprint sensor chip in the identification module 140 receives and converts it into a corresponding electrical signal, that is, a fingerprint detection signal; based on the fingerprint detection signal, fingerprint image data can be obtained, and fingerprint matching verification can be further performed, so that the electronic
  • the device 100 implements an optical fingerprint recognition function.
  • the electronic device 100 when the user needs to perform fingerprint unlocking or other fingerprint verification on the electronic device 100, he only needs to press his finger on the fingerprint collection area 130 located on the display screen 120, and then the fingerprint feature input operation can be realized. Since the collection of fingerprint features can be implemented inside the display area 102 of the display screen 120, the electronic device 100 adopting the above structure does not need a special reserved space on the front of it to set fingerprint buttons (such as the Home button), so a full-screen solution can be adopted. Therefore, the display area 102 of the display screen 120 can be substantially extended to the entire front surface of the electronic device 100.
  • the fingerprint identification module 140 may also use an internal light source or an external light source to provide an optical signal for fingerprint detection and identification.
  • the fingerprint recognition module 140 can be applied not only to self-luminous display screens such as OLED display screens, but also to non-self-luminous display screens, such as liquid crystal display screens or other passive light-emitting display screens.
  • the optical fingerprint system of the electronic device 100 may further include an excitation light source for optical fingerprint detection.
  • the light source may specifically be an infrared light source or a light source of a non-visible light of a specific wavelength, which may be provided under the backlight module of the liquid crystal display or the edge area under the protective cover of the electronic device 100, and the fingerprint recognition module 140 may
  • the liquid crystal panel or the protective cover is positioned under the edge area and guided by the optical path so that the fingerprint detection light can reach the fingerprint recognition module 140; or, the fingerprint recognition module 140 can also be disposed under the backlight module, and the The backlight module performs openings or other optical designs on the film layers such as the diffusion sheet, the brightness enhancement sheet, and the reflection sheet to allow fingerprint detection light to pass through the liquid crystal panel and the backlight module and reach the fingerprint recognition module 140.
  • the fingerprint recognition module 140 is used to provide an optical signal for fingerprint detection using an internal light source
  • the electronic device 100 may further include a protective cover 110.
  • the cover plate 110 may be a transparent cover plate, such as a glass cover plate or a sapphire cover plate, which is located above the display screen 120 and covers the front surface of the electronic device 100, and a protective layer may be provided on the surface of the cover plate 110. Therefore, in the embodiment of the present application, the so-called finger pressing on the display screen 120 may actually mean that the finger presses on the cover plate 110 above the display screen 120 or covers the surface of the protective layer of the cover plate 110.
  • a circuit board 150 such as a flexible printed circuit (FPC) may also be provided under the fingerprint identification module 140.
  • FPC flexible printed circuit
  • the fingerprint recognition module 140 may be soldered to the circuit board 150 through the pads, and realize electrical interconnection and signal transmission with other peripheral circuits or other elements of the electronic device 100 through the circuit board 150.
  • the fingerprint recognition module 140 may receive the control signal of the processing unit of the electronic device 100 through the circuit board 150, and may also output the fingerprint detection signal from the fingerprint recognition module 140 to the processing unit of the electronic device 100 through the circuit board 150 or Control unit, etc.
  • the fingerprint recognition device 140 can be directly fixed on the lower surface of the display screen 120.
  • the fingerprint recognition module 140 and the display screen 120 are completely stuck together, if the fingerprint recognition module 140 is damaged, it is easy to damage the display screen 120 when the fingerprint recognition module 140 is removed.
  • the bonding process of directly bonding the fingerprint identification module 140 to the display screen 120 is relatively complicated.
  • the present application provides a fingerprint identification device, which can reduce the cost and complexity of the electronic device 100 and improve the maintainability.
  • FIG. 3 is a schematic block diagram of a fingerprint identification device 200 according to an embodiment of the present application.
  • 4 is a schematic side cross-sectional view of an electronic device 300 having the fingerprint identification device 200 shown in FIG. 3 according to an embodiment of the present application.
  • FIG. 5 is a schematic diagram of the electronic device 300 with the fingerprint identification device 200 shown in FIG. 3 after being disassembled according to an embodiment of the present application.
  • the fingerprint identification device 200 and the electronic device 300 of the embodiment of the present application will be described in detail below with reference to FIGS. 3 to 5.
  • the fingerprint recognition device 200 may include four fingerprint sensor chips 210 and a support plate 230.
  • the four fingerprint sensor chips 210 may be disposed on the upper surface of the support plate 230.
  • the four fingerprint sensor chips 210 may be arranged side by side on the upper surface of the support plate to splice into an optical fingerprint sensor chip assembly.
  • each fingerprint sensor chip 210 may be attached to the upper surface of the support plate 230 through chip fixing glue 211.
  • the chip fixing glue 211 may be solid glue or liquid glue.
  • the chip fixing adhesive 211 may be double-sided adhesive or glue.
  • the support plate 230 is used to be installed in the middle frame 330 of the electronic device 300, so that each fingerprint sensor chip 210 is located below the display screen of the electronic device 300;
  • the fingerprint sensor chip 210 is used to receive a fingerprint detection signal returned by reflection or scattering of a human finger above the display screen, wherein the fingerprint detection signal is used to detect fingerprint information of the finger.
  • the middle frame 330 of the electronic device 300 has a groove on the upper surface, and the at least one fingerprint sensor chip 210 is disposed in the groove of the middle frame 330 through the support plate 230.
  • the support plate 230 can be directly fixedly mounted on the internal components such as the middle frame of the electronic device 300, which can reduce the at least one fingerprint sensor The difficulty and complexity of chip installation improves maintainability.
  • the four fingerprint sensor chips 210 can be fixedly installed under the display screen through the support plate 230 at a time, which can reduce the installation complexity and improve the installation efficiency.
  • the fingerprint sensor chip 210 shown in FIG. 3 may be the fingerprint sensor chip in the fingerprint recognition device 140 shown in FIG. 1 and FIG. 2, and the related functions and structure descriptions may refer to the foregoing related descriptions. Repeat again.
  • the fingerprint identification device 200 may further include a circuit board 220.
  • the circuit board 220 may be attached to the upper surface of the support board 230 through the circuit board fixing glue 221.
  • the circuit board fixing glue 221 may be solid glue or liquid glue.
  • the circuit board fixing adhesive 221 may be double-sided adhesive or glue.
  • At least a part of the circuit board 200 may be connected to an edge position of the upper surface of the support board 230, and the circuit board 220 is connected to the at least one fingerprint sensor chip 210.
  • the circuit board 220 is connected to the edge of the upper surface of the support board 230 near the long side, so as to increase the contact area between the circuit board 220 and the support board 230, thereby improving connection reliability.
  • the upper surface of the support plate 230 is rectangular, and four fingerprint sensor chips 210 are located along the long side of the upper surface of the support plate 230 near the first long side of the support plate 230.
  • the regions are arranged in a row, and the circuit board 220 may be fixedly disposed near the second long side of the support board 230.
  • the first long side and the second long side are respectively two long sides of the support plate 230.
  • the four fingerprint sensor chips 210 may also be arranged side by side along the short side of the upper surface of the support plate 230. At this time, at least a part of the circuit board 220 may be connected to The edge of the upper surface of the support plate 230 near the long side or near the short side.
  • circuit board 220 shown in FIG. 3 may be the circuit board 150 shown in FIG. 1 and FIG. 2.
  • circuit board 150 shown in FIG. 1 and FIG. 2.
  • the support plate 230 may be provided with at least one positioning hole.
  • the at least one positioning hole may correspond to at least one positioning post on any component of the electronic device. Therefore, in the assembly process, it is only necessary to press at least one positioning post on any part of the electronic device and at least one positioning hole on the support plate 230 to fix the fingerprint recognition device 200 on the electronic The interior of the device.
  • the support plate 230 may be provided with a first positioning hole in an edge area of the lower surface near the short side.
  • the first positioning hole includes two positioning holes, and the shape of the opening of each positioning hole is circular. Any one of the at least two positioning holes may penetrate the upper surface and the lower surface of the support plate 230, or may not penetrate the upper surface and the lower surface of the support plate 230. Further, the shape of the opening of each of the two positioning holes may be the same as the cross-sectional shape of the positioning column on any part of the electronic device corresponding to the two positioning holes, so as to increase the connection reliability.
  • the upper surface of the support plate 230 is rectangular, and the support plate 230 may be provided with two positioning holes 231 at the left edge.
  • the two positioning holes 231 on the left edge of the supporting plate 230 are only an example of the present application, and should not be construed as limiting the present application.
  • the support plate 230 may also be provided with two positioning holes at the right edge position, or the support plate 230 may be provided with one or more than two at the edge position where the short side is located At least one positioning hole on the lower surface of the supporting plate 230 near the long edge.
  • the support plate 230 when the support plate 230 is provided with a plurality of optical fingerprint sensor chips along the long side direction of the upper surface of the support plate 230, the support plate 230 may be The spacing area of each pair of adjacent chips in the is provided with a second positioning hole.
  • the support plate 230 is provided with the second positioning hole in the middle of the spaced region of each pair of adjacent chips in the plurality of optical fingerprint sensor chips.
  • the second positioning hole includes only one positioning hole.
  • the shape of the opening of the second positioning hole is oblong or oval.
  • the shape of the opening of the second positioning hole is different from the cross-sectional shape of the positioning column on any component of the electronic device corresponding to the second positioning hole, so as to reduce the difficulty of installation.
  • the shape of the opening of the second positioning hole is oblong or oval, and the cross-sectional shape of the positioning column on any component of the electronic device corresponding to the second positioning hole is circular.
  • the upper surface of the support plate 230 is rectangular, and the upper surface of the support plate 230 is provided with four fingerprint sensor chips.
  • the support plate 230 is among the four fingerprint sensor chips 210.
  • Each pair of adjacent fingerprint sensor chips 210 is provided with a positioning hole 231 in the middle of the interval area.
  • the supporting plate 230 is provided with a positioning hole 231 in the spaced area of each pair of adjacent chips in the four optical fingerprint sensor chips 210 is only an example of the present application, and should not be construed as limiting the present application .
  • the support plate 230 may be provided with a positioning hole in a spaced region of at least a pair of adjacent chips among the plurality of chips.
  • the supporting plate 230 only has one positioning hole in the spaced region of the pair of adjacent chips in the middle of the plurality of chips.
  • the circuit board 220 may be provided with at least one bending groove at an end close to the plurality of optical fingerprint sensor chips.
  • one bending groove in the at least one bending groove corresponds to a space area between a pair of adjacent chips in the plurality of optical fingerprint sensor chips. Therefore, when the supporting board 230 is mounted on a certain component of an electronic device, the circuit board 230 can be prevented from affecting performance due to bending, or even being damaged.
  • the shape of the bending groove is U-shaped to prevent the circuit board from breaking at the position of the bending groove.
  • the fingerprint identification device 200 may further include a filter 270, and the filter 270 is disposed above the at least one fingerprint sensor chip.
  • the filter 270 may include one or more optical filters, and the one or more optical filters may be configured, for example, as a band-pass filter to allow transmission of light emitted by the OLED pixels while blocking infrared light in sunlight And other light components. When using the fingerprint recognition device 200 under the screen outdoors, this optical filtering can effectively reduce the background light caused by sunlight.
  • the one or more optical filters may be implemented as, for example, optical filter coatings formed on one or more continuous interfaces, or may be implemented on one or more discrete interfaces. It should be understood that the filter 270 may be fabricated on the surface of any optical component or along the optical path from the reflected light formed by finger reflection to the at least one fingerprint sensor chip.
  • the filter 270 is used to reduce undesired ambient light in fingerprint sensing, so as to improve the optical sensing of the received light by at least one fingerprint sensor chip.
  • the filter 270 can be specifically used to filter out light of a specific wavelength, for example, near infrared light and part of red light. For example, human fingers absorb most of the energy of light with wavelengths below ⁇ 580nm. If one or more optical filters or optical filter layers are designed to filter light with wavelengths from 580nm to infrared, the ambient light pair can be greatly reduced The impact of optical detection in fingerprint sensing.
  • the light entrance surface of the filter 270 may also be provided with an optical inorganic coating or an organic blackened coating, so that the reflectance of the light entrance surface of the filter 270 is lower than the first threshold, for example, 1%, thereby It can be ensured that the at least one fingerprint sensor chip can receive enough to further improve the fingerprint recognition effect.
  • the filter 270 and the at least one fingerprint sensor chip may be glued and fixed in a non-photosensitive area of the at least one fingerprint sensor chip, and the filter 270 and the at least one There is a gap between the photosensitive regions of the fingerprint sensor chip; or the lower surface of the filter 270 is fixed to the upper surface of the at least one fingerprint sensor chip by glue with a refractive index lower than a preset refractive index.
  • the lower surface of the filter 270 is fixed to the upper surface of the at least one fingerprint sensor chip by glue with a refractive index lower than 1.3.
  • the fingerprint identification device 200 may further include a gold wire 260, and the circuit board 220 is connected to the at least one fingerprint sensor chip through the gold wire 260.
  • the gold wire 260 is used to implement communication between at least one fingerprint sensor chip and the circuit board 220, and to realize communication with other peripheral circuits or electronic devices as shown in FIG. 1 or FIG. 2 through the circuit board 220. Electrical interconnection and signal transmission of other components.
  • the at least one fingerprint sensor chip may receive a control signal of a processing unit of an electronic device through the gold wire 260, and may also output a fingerprint detection signal (such as a fingerprint image) to the fingerprint recognition through the gold wire 260
  • the image processor of the device 200 or the processor of the electronic device 300 may be used to implement communication between at least one fingerprint sensor chip and the circuit board 220, and to realize communication with other peripheral circuits or electronic devices as shown in FIG. 1 or FIG. 2 through the circuit board 220. Electrical interconnection and signal transmission of other components.
  • the at least one fingerprint sensor chip may receive a control signal of a processing unit of an electronic device through the gold wire 260, and may also output a fingerprint detection signal (such as a fingerprint image) to the fingerprint recognition through the gold wire
  • the height of the gold wire 260 and the height of the sealant of the gold wire 260 may be respectively lower than the height of the filter 270, so as to reduce the thickness of the fingerprint recognition device 200 and reduce its installation difficulty .
  • the fingerprint identification device 200 may further include an image processor 250, and the image processor 250 is disposed on the circuit board 220.
  • the image processor 250 may be specifically a microprocessor (Micro Processing Unit, MCU), and the image processor 250 is used to receive a fingerprint detection signal (such as a fingerprint image) sent from the at least one sensor through the circuit board 220, And fingerprint identification based on fingerprint detection signal.
  • MCU Micro Processing Unit
  • the at least one fingerprint sensor chip first receives the reflected light reflected from the user's finger and performs imaging based on the received optical signal to generate a fingerprint image; then, the fingerprint image is sent to the image processor through the circuit board 220 250, so that the image processor 250 performs image processing and obtains a fingerprint signal; finally, fingerprint identification is performed on the fingerprint signal through an algorithm.
  • the fingerprint identification device 200 may further include at least one capacitor 240, and the at least one capacitor 240 is disposed on the circuit board 220 for optimizing at least one fingerprint sensor chip Collected fingerprint detection signal.
  • the at least one capacitor 240 is used to filter the fingerprint detection signal collected by the at least one fingerprint sensor chip.
  • each fingerprint sensor chip in the at least one fingerprint sensor chip may correspond to one or more capacitors 240.
  • FIGS. 3 and 4 are only an example of the present application, and should not be construed as a limitation to the embodiments of the present application.
  • the fingerprint identification device 200 may only include less than 4 or more than 4 fingerprint sensor chips 210.
  • the thickness of the support plate 230 ranges from 0.075 mm to 0.30 mm to control the thickness of the fingerprint identification device 200.
  • the flexible reinforcing plate includes but is not limited to a polyimide reinforcing plate, so as to improve the heat dissipation performance of the fingerprint recognition device 200.
  • the surface roughness (Ra) of the support plate 230 is greater than a certain threshold, such as 0.25um, to improve the imaging effect; specifically, when the surface roughness of the support plate 230 is greater than a certain threshold, the surface can emit light signals Scattering can effectively reduce the light signal emitted by the display screen and reflected inside the fingerprint recognition device 200, thereby avoiding the impact of light reflection on imaging; in addition, when the surface roughness of the support plate 230 is greater than a certain threshold, it can be increased The reliability of the connection between the support plate 230 and other components. For example, the reliability of the connection between the support plate 230 and the at least one sensor and the circuit board 220 and the reliability of the connection between the support plate 230 and the component for fixing the support plate 230.
  • a certain threshold such as 0.25um
  • the color of the support plate 230 is dark, so as to increase the light absorption effect of the support plate 230, thereby preventing the light reflected upward by the support plate 230 from interfering with the light received by the at least one fingerprint sensor chip.
  • the lower surface of the support plate 230 is square or rectangular, so that the support plate 230 is installed inside the electronic device 300.
  • the embodiment of the present application does not limit the type, shape, and other parameters of the circuit board 220.
  • the shape of the circuit board may be an irregular shape or a regular shape. For example, rectangular or square.
  • the shape of the circuit board 220 is T-shaped.
  • the shape of the circuit board 220 may also be a T-shaped deformed structure.
  • An embodiment of the present application also provides an electronic device 300, and the electronic device 300 may include the fingerprint recognition apparatus 200 and the display screen as described in various embodiments of the present application.
  • the fingerprint identification device 200 is disposed below the display screen, and is used for receiving an optical signal reflected by a finger and passing through the display screen for fingerprint detection.
  • the fingerprint identification module 200 can be fixed to the internal components such as the middle frame of the electronic device through the support plate 230, so that the fingerprint identification device 200 can be fixed under the display screen of the electronic device .
  • the fingerprint identification device 200 may be disposed below the display screen of the electronic device through the support plate 230, and specifically may be disposed below the middle area of the display screen, which conforms to the user's usage habits and is convenient for the user to hold.
  • the electronic device 300 may include a display screen and a fingerprint recognition device 200.
  • the display screen may include a display component 310 and a light shielding layer 320 of the display component 310.
  • the light shielding layer 320 may be provided with a window opening 321 through which the fingerprint recognition device 200 receives an optical signal generated by the display assembly 310 and reflected by a human finger, the optical signal Used for fingerprint identification.
  • the fingerprint recognition device 200 of the electronic device 300 and the display screen of the electronic device 300 are designed separately, but in the embodiment of the present application, between the fingerprint recognition device 200 and the display screen of the electronic device The relative distance is not limited.
  • the fingerprint recognition device 200 may contact the lower surface of the display assembly 310, or there may be a gap between the upper surface of the fingerprint recognition device 200 and the lower surface of the display assembly 310.
  • the distance between the upper surface of the fingerprint recognition device 200 and the lower surface of the display screen may be less than or equal to a certain threshold, such as 600 ⁇ m, so as to ensure that sufficient light signals are incident on the photosensitive area of at least one fingerprint sensor chip.
  • the gap may be an air gap (air gap) that is not filled with any auxiliary materials, which can ensure When the display screen is pressed or the electronic device falls or crashes, the fingerprint recognition device 200 will not touch the lower surface of the display screen, nor will it affect the stability and performance of the fingerprint recognition of the fingerprint recognition device 200.
  • the light-shielding layer 320 may also be used as a heat dissipation layer and/or a buffer layer, wherein the light-shielding layer is used to block other areas than the fingerprint detection area, so as to prevent light signals in the other areas from entering the fingerprint sensor The chip affects the fingerprint detection effect.
  • the light shielding layer 320 is used as a heat dissipation layer, it can also be used to dissipate heat generated by the light emitting unit in the display screen.
  • the light shielding layer 320 is used as a buffer layer, it can be used to buffer the compression or the electronic device Collisions to reduce damage to the display.
  • the electronic device 300 may further include a middle frame 330, and the middle frame 330 is used to support the display screen.
  • the middle frame 330 may be a frame of the electronic device 300 disposed between the display screen and the battery for carrying various internal components.
  • the various internal components include but are not limited to a motherboard, a camera, a flat cable, and various sensors , Microphones, earpieces and other parts.
  • the fingerprint identification device 200 is fixed on the middle frame 330 as an example for description. In other alternative embodiments, the fingerprint identification device 200 may be fixedly connected to the electronic device 300 with a support In other functional structures, the fingerprint recognition device 200 is installed below the display screen. That is, as long as it can be ensured that the fingerprint identification device 200 can be fixedly disposed below the display screen in a separated manner.
  • the fingerprint recognition device 200 may be fixed to a structure or device having a supporting function such as a back cover of an electronic device, a main board, and a battery, and further fixedly arranged below the display screen.
  • a groove is formed on the upper surface of the middle frame 330, and a groove corresponding to at least one positioning hole of the fingerprint identification device 200 is provided in the groove At least one positioning column 331.
  • the cross-sectional shape of each positioning post in the at least one positioning post 331 may be circular.
  • the electronic device 300 may further include at least one foam 340, and the at least one foam 340 is disposed between the support plate 230 and the middle frame 330.
  • Part or all of the at least one foam is double-sided adhesive foam to improve the reliability of the connection between the support plate 230 and the middle frame 330.
  • the relationship between the at least one foam sensor 340 and the at least one fingerprint sensor chip 210 in the fingerprint identification device is a one-to-one relationship.
  • the electronic device 300 may include four foams corresponding to the four fingerprint sensor chips 210, wherein each fingerprint sensor The size of the lower surface of the chip 210 is the same as the size of the upper surface of the corresponding foam 340.
  • each foam 340 in the at least one foam 340 and the distance between the middle frame 330 and the display screen and at least one fingerprint sensor chip 210 in the fingerprint identification device 200 It is related to the distance between the display screen (for example, the display component 310).
  • the thickness of each foam 340 in the at least one foam 340 is the distance between the middle frame 330 and the display screen and at least one fingerprint sensor chip 210 and the fingerprint recognition device 200
  • the distance between the displays is inversely proportional.
  • the thickness of each foam 340 in the at least one foam 340 is such that the distance between the upper surface of the at least one fingerprint sensor chip 210 and the lower surface of the display screen is less than or equal to 600 ⁇ m.
  • FIG. 5 is only an example of the present application, and should not be understood as a limitation to the embodiments of the present application.
  • the electronic device 300 may include only one piece of foam, and the piece of foam is provided with a through hole corresponding to at least one positioning hole on the support plate 230.
  • the disclosed system and device may be implemented in other ways.
  • the device embodiments described above are only schematic.
  • the division of the units is only a logical function division, and there may be other divisions in actual implementation, for example, multiple units or components may be combined or Can be integrated into another system, or some features can be ignored, or not implemented.
  • the displayed or discussed mutual couplings or direct couplings or communication connections may be indirect couplings or communication connections through some interfaces, devices, or units, and may also be electrical, mechanical, or other forms of connection.
  • the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or may be distributed on multiple network units. Part or all of the units may be selected according to actual needs to achieve the objectives of the solutions of the embodiments of the present application.
  • the functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
  • the above integrated unit can be implemented in the form of hardware or software function unit.
  • the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it may be stored in a computer-readable storage medium.
  • the technical solutions of the present application essentially or part of the contribution to the existing technology, or all or part of the technical solutions can be embodied in the form of software products, the computer software products are stored in a
  • the storage medium includes several instructions to enable a computer device (which may be a personal computer, server, or network device, etc.) to perform all or part of the steps of the methods described in the embodiments of the present application.
  • the aforementioned storage media include: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disk or optical disk and other media that can store program code .

Abstract

提供了一种指纹识别装置和电子设备，所述指纹识别装置应用在具有显示屏的电子设备，其特征在于，所述指纹识别装置包括：支撑板；至少一个指纹传感器芯片，所述至少一个指纹传感器芯片设置于所述支撑板的上表面；其中，所述支撑板用于安装在所述电子设备的中框，以使所述至少一个指纹传感器芯片位于所述电子设备的显示屏下方。本申请实施例中，通过所述支撑板能够降低电子设备的成本和复杂度，提高了可维修性。特别地针对所述至少一个指纹传感器芯片包括多个芯片的场景下，能够有效降低电子设备的成本和复杂度，大大提高了可维修性。

Description

指纹识别装置和电子设备 技术领域
本申请实施例涉及电子领域，并且更具体地，涉及指纹识别装置和电子设备。
背景技术
目前，屏下指纹识别方案是指将光学或超声波指纹识别模组贴合在有机发光二极管(Organic Light-Emitting Diode，OLED)屏幕的底部，也就是不管光学指纹识别模组还是超声波指纹识别模组都需要和屏幕底部发光层紧密粘结在一起。
但是，由于OLED屏幕成本很高，且很脆弱，因此将指纹识别模组直接贴合至OLED屏幕时很容易弄坏OLED屏幕。此外，由于指纹识别模组和OLED屏幕完全粘在一起，如出现指纹识别模组损坏，在拆卸指纹识别模组时很容易损坏OLED屏幕。而且，将指纹识别模组直接贴合到OLED屏幕的贴合工艺也比较复杂。
由于以上问题，大大增加了电子设备的成本和复杂度，可维修性低。
发明内容
提供了一种指纹识别装置和电子设备，能够降低电子设备的成本和复杂度，提高了可维修性。特别地针对多个指纹传感器芯片的场景下，能够有效降低电子设备的成本和复杂度，大大提高了可维修性。
第一方面，提供了一种指纹识别装置，应用在具有显示屏的电子设备，在一些可能的实现方式中，所述指纹识别装置包括：
支撑板；
至少一个指纹传感器芯片，所述至少一个指纹传感器芯片设置于所述支撑板的上表面；
其中，所述支撑板用于安装在所述电子设备的中框，以使所述至少一个指纹传感器芯片位于所述电子设备的显示屏下方；所述至少一个指纹传感器芯片用于接收经由所述显示屏上方的人体手指反射或散射而返回的指纹检测信号，其中所述指纹检测信号用来检测所述手指的指纹信息。
在一些可能的实现方式中，所述电子设备的中框具有位于上表面的凹槽，且所述至少一个指纹传感器芯片通过所述支撑板设置在所述中框的凹槽内。
在一些可能的实现方式中，还包括：
电路板，所述电路板的至少一部分连接在所述支撑板的上表面的边缘位置，所述电路板和所述至少一个指纹传感器芯片相连。
在一些可能的实现方式中，所述电路板的至少一部分连接在所述支撑板的上表面的靠近长边的边缘位置。
在一些可能的实现方式中，所述支撑板为挠性补强板，所述挠性补强板在下表面的靠近短边的边缘区域设置有第一定位孔。
在一些可能的实现方式中，所述第一定位孔包括两个定位孔，且每个定位孔的孔口形状为圆形。
在一些可能的实现方式中，所述至少一个指纹传感器芯片包括沿所述挠性补强板的上表面的长边方向设置的多个光学指纹传感器芯片，所述挠性补强板在所述多个光学指纹传感器芯片中的每对相邻芯片的间隔区域设置有第二定位孔。
在一些可能的实现方式中，所述第二定位孔的孔口形状为长圆形或者椭圆形。
在一些可能的实现方式中，所述至少一个指纹传感器芯片包括多个光学指纹传感器芯片，所述多个光学指纹传感器芯片并排设置在所述支撑板的上表面，以拼接成一个光学指纹传感器芯片组件。
在一些可能的实现方式中，所述电路板在靠近所述多个光学指纹传感器芯片的一端设置有至少一个折弯槽，所述至少一个折弯槽中的一个折弯槽对应所述多个光学指纹传感器芯片中的一对相邻芯片之间的间隔区域。
在一些可能的实现方式中，所述折弯槽的形状为U形。
在一些可能的实现方式中，所述指纹识别装置还包括：
滤光片，所述滤光片设置在所述至少一个指纹传感器芯片的上方。
在一些可能的实现方式中，所述滤光片的进光面设置有光学无机镀膜或有机黑化涂层。
在一些可能的实现方式中，所述滤光片和所述至少一个指纹传感器芯片在所述至少一个指纹传感器芯片的非感光区域进行点胶固定，且所述滤光片 和所述至少一个指纹传感器芯片的感光区域之间存在间隙；或者所述滤光片的下表面通过折射率低于预设折射率的胶水固定在所述至少一个指纹传感器芯片的上表面。
在一些可能的实现方式中，所述电路板通过金线与所述至少一个指纹传感器芯片相连，所述金线的高度和所述金线的封胶的高度分别低于所述滤光片的高度。
在一些可能的实现方式中，所述支撑板的表面粗糙度大于0.25um。
在一些可能的实现方式中，所述电路板为T型软性电路板，且所述T型软性电路板的上方设置有多个电容器，所述多个电容器对应连接到所述至少一个指纹传感器芯片。
第二方面，提供了一种电子设备，包括：
显示屏以及第一方面所述的指纹识别装置，所述指纹识别装置设置在所述显示屏的下方以实现屏下指纹检测。
在一些可能的实现方式中，所述显示屏包括：
显示组件；
遮光层，所述遮光层设置于所述显示组件的下方，所述遮光层设置有开窗，所述指纹识别装置通过所述开窗接收所述显示组件发出的经由人体手指反射后形成的光信号，所述光信号用于指纹识别；
其中，所述指纹识别装置接触于所述显示组件的下表面，或者，所述指纹识别装置和所述显示组件的下表面存在间隙。
在一些可能的实现方式中，所述电子设备还包括：
中框，所述中框用于支撑所述显示屏；
其中，所述中框的上表面向下延伸形成有凹槽，所述指纹识别装置设置在所述凹槽内并与所述显示屏具有预定间隙。
在一些可能的实现方式中，所述指纹识别装置的支撑板具有至少一个定位孔，且所述凹槽内设置有与所述指纹识别装置的至少一个定位孔对应的至少一个定位柱。
在一些可能的实现方式中，所述至少一个定位柱中每个定位柱的横截面的形状为圆形。
在一些可能的实现方式中，所述电子设备还包括：
至少一个泡棉，所述至少一个泡棉设置于所述支撑板和所述中框之间。
在一些可能的实现方式中，所述至少一个泡棉中每个泡棉的厚度与所述中框和所述显示屏之间的距离以及所述指纹识别装置中的至少一个指纹传感器芯片和所述显示屏之间的距离有关。
在一些可能的实现方式中，所述至少一个泡棉所述至少一个指纹传感器芯片之间的关系是一一对应的关系。
基于以上技术方案，所述至少一个指纹传感器芯片固定安装于支撑板后，可以直接将支撑板固定安装于电子设备的中框等内部部件上，能够降低所述至少一个指纹传感器芯片的安装难度和复杂度，提高了可维修性。
此外，针对所述至少一个指纹传感器芯片包括多个芯片的场景下，可以将所述多个芯片一次性固定安装于显示屏的下方，能够降低安装复杂度，并提高安装效率。
附图说明
图1是本申请可以适用的电子设备的平面示意图。
图2是图1所示的电子设备的侧剖面示意图。
图3是本申请实施例的指纹识别装置的示意性框图。
图4是本申请实施例的具有图3所示的指纹识别装置的电子设备的侧剖面示意图。
图5是本申请实施例的具有图3所示的指纹识别装置的电子设备拆卸后的示意图。
具体实施方式
下面将结合附图，对本申请实施例中的技术方案进行描述。
本申请实施例的技术方案可以应用于各种电子设备。
例如，智能手机、笔记本电脑、平板电脑、游戏设备等便携式或移动计算设备，以及电子数据库、汽车、银行自动柜员机(Automated Teller Machine，ATM)等其他电子设备。但本申请实施例对此并不限定。
本申请实施例的技术方案可以用于生物特征识别技术。其中，生物特征识别技术包括但不限于指纹识别、掌纹识别、虹膜识别、人脸识别以及活体识别等识别技术。为了便于说明，下文以指纹识别技术为例进行说明。
本申请实施例的技术方案可以用于屏下指纹识别技术和屏内指纹识别 技术。
屏下指纹识别技术是指将指纹识别模组安装在显示屏下方，从而实现在显示屏的显示区域内进行指纹识别操作，不需要在电子设备正面除显示区域外的区域设置指纹采集区域。具体地，指纹识别模组使用从电子设备的显示组件的顶面返回的光来进行指纹感应和其他感应操作。这种返回的光携带与显示组件的顶面接触的物体(例如手指)的信息，位于显示组件下方的指纹识别模组通过采集和检测这种返回的光以实现屏下指纹识别。其中，指纹识别模组的设计可以为通过恰当地配置用于采集和检测返回的光的光学元件来实现期望的光学成像。
相应的，屏内(In-display)指纹识别技术是指将指纹识别模组或者部分指纹识别模组安装在显示屏内部，从而实现在显示屏的显示区域内进行指纹识别操作，不需要在电子设备正面除显示区域外的区域设置指纹采集区域。
图1和图2示出了屏下指纹识别技术可以适用的电子设备100的示意图，其中图1为电子设备100的正面示意图，图2为图1所示的电子设备100的部分剖面结构示意图。
如图1和图2所示，电子设备100可以包括显示屏120和指纹识别模组140。
显示屏120可以为自发光显示屏，其采用具有自发光的显示单元作为显示像素。比如显示屏120可以为有机发光二极管(Organic Light-Emitting Diode，OLED)显示屏或者微型发光二极管(Micro-LED)显示屏。在其他可替代实施例中，显示屏120也可以为液晶显示屏(Liquid Crystal Display,LCD)或者其他被动发光显示屏，本申请实施例对此不做限制。
此外，显示屏120还可以具体为触控显示屏，其不仅可以进行画面显示，还可以检测用户的触摸或者按压操作，从而为用户提供一个人机交互界面。比如，在一种实施例中，电子设备100可以包括触摸传感器，所述触摸传感器可以具体为触控面板(Touch Panel,TP)，其可以设置在所述显示屏120表面，也可以部分集成或者整体集成到所述显示屏120内部，从而形成所述触控显示屏。
指纹识别模组140可以为光学指纹识别模组，比如光学指纹传感器。
具体来说，指纹识别模组140可以包括具有光学感应阵列的指纹传感器芯片(后面也称为光学指纹传感器)。其中，光学感应阵列包括多个光学感 应单元，每个光学感应单元可以具体包括光探测器或者光电传感器。或者说，指纹识别模组140可以包括光探测器(Photo detector)阵列(或称为光电探测器阵列、光电传感器阵列)，其包括多个呈阵列式分布的光探测器。
如图1所示，指纹识别模组140可以设置在所述显示屏120的下方的局部区域，从而使得指纹识别模组140的指纹采集区域(或检测区域)130至少部分位于所述显示屏120的显示区域102内。
当然，在其他可替代实施例中，指纹识别模组140也可以设置在其他位置，比如显示屏120的侧面或者电子设备100的边缘非透光区域。这种情况下，可以通过光路设计将显示屏120的至少部分显示区域的光信号导引到指纹识别模组140，从而使得所述指纹采集区域130实际上位于所述显示屏120的显示区域内。
在本申请的一些实施例中，指纹识别模组140可以仅包括一个指纹传感器芯片，此时指纹识别模组140的指纹采集区域130的面积较小且位置固定，因此用户在进行指纹输入时需要将手指按压到所述指纹采集区域130的特定位置，否则指纹识别模组140可能无法采集到指纹图像而造成用户体验不佳。
在本申请的另一些实施例中，指纹识别模组140可以具体包括多个指纹传感器芯片；所述多个指纹传感器芯片可以通过拼接方式并排设置在所述显示屏120的下方，且所述多个指纹传感器芯片的感应区域共同构成所述指纹识别模组140的指纹采集区域130。也即是说，所述指纹识别模组140的指纹采集区域130可以包括多个子区域，每个子区域分别对应于其中一个指纹传感器芯片的感应区域，从而将所述光学指纹模组130的指纹采集区域130可以扩展到所述显示屏的下半部分的主要区域，即扩展到手指惯常按压区域，从而实现盲按式指纹输入操作。可替代地，当所述指纹传感器芯片数量足够时，所述指纹检测区域130还可以扩展到半个显示区域甚至整个显示区域，从而实现半屏或者全屏指纹检测。
应理解，本申请实施例对所述多个指纹传感器芯片的具体形式不做限定。
例如，所述多个指纹传感器芯片可以分别是独立封装的指纹传感器芯片，也可以是封装在同一个芯片封装体内的多个芯片(Die)。
又例如，还可以通过半导体工艺在同一个芯片(Die)的不同区域上制作形成所述多个指纹传感器芯片。
如图2所示，指纹识别模组140的光学感应阵列的所在区域或者光感应范围对应所述指纹识别模组140的指纹采集区域130。其中，指纹识别模组140的指纹采集区域130可以等于或不等于指纹识别模组140的光学感应阵列的所在区域的面积或者光感应范围，本申请实施例对此不做具体限定。
例如，通过光线准直的光路设计，指纹识别模组140的指纹采集区域130可以设计成与所述指纹识别模组140的感应阵列的面积基本一致。
又例如，通过汇聚光线的光路设计或者反射光线的光路设计，可以使得所述指纹识别模组140的指纹采集区域130的面积大于所述指纹识别模组140感应阵列的面积。
下面对指纹识别模组140的光路设计进行示例性说明。
以指纹识别模组140的光路设计采用具有高深宽比的通孔阵列的光学准直器为例，所述光学准直器可以具体为在半导体硅片制作而成的准直器(Collimator)层，其具有多个准直单元或者微孔，所述准直单元可以具体为小孔，从手指反射回来的反射光中，垂直入射到所述准直单元的光线可以穿过并被其下方的指纹传感器芯片接收，而入射角度过大的光线在所述准直单元内部经过多次反射被衰减掉，因此每一个指纹传感器芯片基本只能接收到其正上方的指纹纹路反射回来的反射光，能够有效提高图像分辨率，进而提高指纹识别效果。
进一步地，当指纹识别模组140包括多个指纹传感器芯片时，可以为每个指纹传感器芯片的光学感应阵列中的一个光学感应单元配置一个准直单元，并贴合设置在其对应的光学感应单元的上方。当然，所述多个光学感应单元也可以共享一个准直单元，即所述一个准直单元具有足够大的孔径以覆盖多个光学感应单元。由于一个准直单元可以对应多个光学感应单元，破坏了显示屏120的空间周期和指纹传感器芯片的空间周期的对应性，因此，即使显示屏120的发光显示阵列的空间结构和指纹传感器芯片的光学感应阵列的空间结构类似，也能够有效避免指纹识别模组140利用经过显示屏120的光信号进行指纹成像生成莫尔条纹，有效提高了指纹识别模组140的指纹识别效果。
以指纹识别模组140的光路设计采用光学镜头的光路设计为例，所述光学镜头可以包括光学透镜(Lens)层，其具有一个或多个透镜单元，比如一个或多个非球面透镜组成的透镜组，其用于将从手指反射回来的反射光汇聚 到其下方的指纹传感器芯片的感应阵列，以使得所述感应阵列可以基于所述反射光进行成像，从而得到所述手指的指纹图像。所述光学透镜层在所述透镜单元的光路中还可以形成有针孔，所述针孔可以配合所述光学透镜层扩大指纹识别模组140的视场，以提高所述指纹识别模组140的指纹成像效果。
进一步地，当指纹识别模组140包括多个指纹传感器芯片时，可以为每一个指纹传感器芯片配置一个光学镜头进行指纹成像，或者为多个指纹传感器芯片配置一个光学镜头来实现光线汇聚和指纹成像。甚至于，当一个指纹传感器芯片具有两个感应阵列(Dual Array)或多个感应阵列(Multi-Array)时，也可以为这个指纹传感器芯片配置两个或多个光学镜头配合所述两个感应阵列或多个感应阵列进行光学成像，从而减小成像距离并增强成像效果。
以指纹识别模组140的光路设计采用微透镜(Micro-Lens)层的光路设计为例，所述微透镜层可以具有由多个微透镜形成的微透镜阵列，其可以通过半导体生长工艺或者其他工艺形成在所述指纹传感器芯片的感应阵列上方，并且每一个微透镜可以分别对应于所述感应阵列的其中一个感应单元。所述微透镜层和所述感应单元之间还可以形成其他光学膜层，比如介质层或者钝化层，更具体地，所述微透镜层和所述感应单元之间还可以包括具有微孔的挡光层，其中所述微孔形成在其对应的微透镜和感应单元之间，所述挡光层可以阻挡相邻微透镜和感应单元之间的光学干扰，并使光线通过所述微透镜汇聚到所述微孔内部并经由所述微孔传输到所述微透镜对应的感应单元，以进行光学指纹成像。
应当理解，上述光路引导结构的几种实现方案可以单独使用也可以结合使用，比如，可以在所述准直器层或者所述光学透镜层下方进一步设置微透镜层。当然，在所述准直器层或者所述光学透镜层与所述微透镜层结合使用时，其具体叠层结构或者光路可能需要按照实际需要进行调整。
指纹识别模组140可以用于采集用户的指纹信息(比如指纹图像信息)。
以显示屏120采用OLED显示屏为例，显示屏120可以采用具有自发光显示单元的显示屏，比如有机发光二极管(Organic Light-Emitting Diode，OLED)显示屏或者微型发光二极管(Micro-LED)显示屏。指纹识别模组140可以利用OLED显示屏的位于指纹采集区域130的显示单元(即OLED光源)来作为光学指纹检测的激励光源。
当手指触摸、按压或者接近(为便于描述，在本申请中统称为按压)在 指纹采集区域130时，显示屏120向指纹采集区域130上方的手指发出一束光，这一束光在手指的表面发生反射形成反射光或者经过手指的内部散射后而形成散射光，在相关专利申请中，为便于描述，上述反射光和散射光统称为反射光。由于指纹的嵴(ridge)与峪(vally)对于光的反射能力不同，因此，来自指纹嵴的反射光和来自指纹峪的发生过具有不同的光强，反射光经过显示屏120后，被指纹识别模组140中的指纹传感器芯片所接收并转换为相应的电信号，即指纹检测信号；基于所述指纹检测信号便可以获得指纹图像数据，并且可以进一步进行指纹匹配验证，从而在所述电子设备100实现光学指纹识别功能。
由此可见，用户需要对电子设备100进行指纹解锁或者其他指纹验证的时候，只需要将手指按压在位于显示屏120的指纹采集区域130，便可以实现指纹特征的输入操作。由于指纹特征的采集可以在显示屏120的显示区域102的内部实现，采用上述结构的电子设备100无需其正面专门预留空间来设置指纹按键(比如Home键)，因而可以采用全面屏方案。因此，所述显示屏120的显示区域102可以基本扩展到所述电子设备100的整个正面。
当然，在其他替代方案中，指纹识别模组140也可以采用内置光源或者外置光源来提供用于进行指纹检测识别的光信号。在这种情况下，指纹识别模组140不仅可以适用于如OLED显示屏等自发光显示屏，还可以适用于非自发光显示屏，比如液晶显示屏或者其他的被动发光显示屏。
以应用在具有背光模组和液晶面板的液晶显示屏为例，为支持液晶显示屏的屏下指纹检测，电子设备100的光学指纹系统还可以包括用于光学指纹检测的激励光源，所述激励光源可以具体为红外光源或者特定波长非可见光的光源，其可以设置在所述液晶显示屏的背光模组下方或者设置在电子设备100的保护盖板下方的边缘区域，而指纹识别模组140可以设置液晶面板或者保护盖板的边缘区域下方并通过光路引导以使得指纹检测光可以到达所述指纹识别模组140；或者，指纹识别模组140也可以设置在所述背光模组下方，且所述背光模组通过对扩散片、增亮片、反射片等膜层进行开孔或者其他光学设计以允许指纹检测光穿过液晶面板和背光模组并到达指纹识别模组140。当采用所述指纹识别模组140采用内置光源或者外置光源来提供用于进行指纹检测的光信号时，其检测原理可以相同。
如图1所示，电子设备100还可以包括保护盖板110。
盖板110可以具体为透明盖板，比如玻璃盖板或者蓝宝石盖板，其位于显示屏120的上方并覆盖所述电子设备100的正面，且盖板110表面还可以设置有保护层。因此，本申请实施例中，所谓的手指按压显示屏120实际上可以是指手指按压在显示屏120上方的盖板110或者覆盖所述盖板110的保护层表面。
如图1所示，指纹识别模组140的下方还可以设置有电路板150，比如软性电路板(Flexible Printed Circuit，FPC)。
指纹识别模组140可以通过焊盘焊接到电路板150，并通过电路板150实现与其他外围电路或者电子设备100的其他元件的电性互连和信号传输。比如，指纹识别模组140可以通过电路板150接收电子设备100的处理单元的控制信号，并且还可以通过电路板150将来自指纹识别模组140的指纹检测信号输出给电子设备100的处理单元或者控制单元等。
在某些实施例中，指纹识别装置140可以直接固定贴合在显示屏120的下表面。
但是，由于显示屏120成本很高，且很脆弱，因此将指纹识别模组140直接贴合至显示屏120时很容易弄坏显示屏120。
此外，由于指纹识别模组140和显示屏120完全粘在一起，如出现指纹识别模组140损坏，在拆卸指纹识别模组140时很容易损坏显示屏120。
并且，将指纹识别模组140直接贴合到显示屏120的贴合工艺也比较复杂。
由于以上问题，大大增加了电子设备100的成本和复杂度，可维修性低。
本申请提供了一种指纹识别装置，能够降低电子设备100的成本和复杂度，提高了可维修性。
图3是本申请实施例的指纹识别装置200的示意性框图。图4是本申请实施例的具有图3所示的指纹识别装置200的电子设备300的侧剖面示意图。图5是本申请实施例的具有图3所示的指纹识别装置200的电子设备300拆卸后的示意图。
下面结合图3至图5详细说明本申请实施例的指纹识别装置200以及电子设备300。
需要说明的是，为便于说明，在本申请实施例中，相同的附图标记用于表示相同的部件，并且为了简洁，在不同实施例中，省略对相同部件的详细 说明。
如图3所示，指纹识别装置200可以包括4个指纹传感器芯片210和支撑板230。
所述4个指纹传感器芯片210可以设置于支撑板230的上表面。
例如，所述4个指纹传感器芯片210可以并排设置在所述支撑板的上表面，以拼接成一个光学指纹传感器芯片组件。
具体地，如图4所示，每个指纹传感器芯片210可以通过芯片固定胶211贴合在所述支撑板230的上表面。可选地，所述芯片固定胶211可以是固态胶或者液态胶。例如，所述芯片固定胶211可以为双面胶或者胶水。
本申请实施例中，所述支撑板230用于安装在所述电子设备300的中框330，以使所述每个指纹传感器芯片210位于所述电子设备300的显示屏下方；所述每个指纹传感器芯片210用于接收经由所述显示屏上方的人体手指反射或散射而返回的指纹检测信号，其中所述指纹检测信号用来检测所述手指的指纹信息。例如，所述电子设备300的中框330具有位于上表面的凹槽，所述至少一个指纹传感器芯片210通过所述支撑板230设置在所述中框330的凹槽内。
本申请实施例中，所述4个指纹传感器芯片210固定安装于支撑板230后，可以直接将支撑板230固定安装于电子设备300的中框等内部部件上，能够降低所述至少一个指纹传感器芯片的安装难度和复杂度，提高了可维修性。此外，针对所述4个指纹传感器芯片210，通过所述支撑板230可以将所述4个指纹传感器芯片210一次性固定安装于显示屏的下方，能够降低安装复杂度，并提高安装效率。
应理解，图3所示的指纹传感器芯片210可以是图1和图2所示的指纹识别装置140中的指纹传感器芯片，其相关功能和结构说明可以参考前述相关描述，为了简洁，在此不再赘述。
可选地，如图3所示，所述指纹识别装置200还可以包括电路板220。
如图4所示，所述电路板220的至少一部分设置可以通过电路板固定胶221贴合在支撑板230的上表面。可选地，所述电路板固定胶221可以是固态胶或者液态胶。例如，所述电路板固定胶221可以为双面胶或者胶水。
进一步地，电路板200的至少一部分可以连接在所述支撑板230的上表面的边缘位置，所述电路板220和所述至少一个指纹传感器芯片210相连。 例如，所述电路板220的至少一部分连接在所述支撑板230的上表面的靠近长边的边缘位置，以增大电路板220和支撑板230之间的接触面积，进而提高连接可靠度。
结合图3来说，所述支撑板230的上表面为长方形，4个指纹传感器芯片210沿所述支撑板230的上表面的长边方向，在靠近所述支撑板230的第一长边的区域排列成一行，所述电路板220可以固定设置在靠近所述支撑板230的第二长边的区域。其中，所述第一长边和所述第二长边分别为所述支撑板230的两个长边。
当然，在其他可替代实施例中，所述4个指纹传感器芯片210也可以沿所述支撑板230的上表面的短边方向并排设置，此时，所述电路板220的至少一部分可以连接在所述支撑板230的上表面的靠近长边或者靠近短边的边缘位置。
应理解，图3所示的电路板220可以是图1和图2所示的电路板150，其相关功能和结构说明可以参考前述相关描述，为了简洁，在此不再赘述。
可选地，如图3所示，所述支撑板230可以设置有至少一个定位孔。
进一步地，所述至少一个定位孔可以对应于电子设备的任一部件上的至少一个定位柱。由此，在装配过程中，只需要将电子设备的任一部件上的至少一个定位柱和支撑板230上的至少一个定位孔进行压合，即可将指纹识别装置200固定安装在所述电子设备的内部。
作为一个实施例，所述支撑板230可以在下表面的靠近短边的边缘区域设置有第一定位孔。可选地，所述第一定位孔包括两个定位孔，且每个定位孔的孔口形状为圆形。所述至少两个定位孔中的任一定位孔可以贯通所述支撑板230的上表面和下表面，也可以不贯通所述支撑板230的上表面和下表面。进一步地，所述两个定位孔中每个定位孔的孔口形状可以与所述两个定位孔对应的电子设备的任一部件上的定位柱的横截面形状相同，以增加连接可靠度。
结合图3来说，所述支撑板230的上表面为长方形，所述支撑板230可以在左侧边缘位置设置两个定位孔231。
当然，所述支撑板230在左侧边缘位置设置两个定位孔231仅为本申请的一种示例，不应理解为对本申请的限制。例如，在其他可替代实施例中，所述支撑板230也可以在右侧边缘位置设置两个定位孔，或者所述支撑板 230可以在短边所在的边缘位置设置有一个或多于两个的定位孔，或者所述支撑板230可以在所述支撑板230的下表面靠近长边的边缘位置设置至少一个定位孔。
作为另一个实施例，所述支撑板230在沿所述支撑板230的上表面的长边方向设置有多个光学指纹传感器芯片时，所述支撑板230可以在所述多个光学指纹传感器芯片中的每对相邻芯片的间隔区域设置有第二定位孔。例如，所述支撑板230在所述多个光学指纹传感器芯片中的每对相邻芯片的间隔区域的中间位置设置有所述第二定位孔。可选地，所述第二定位孔仅包括一个定位孔。所述第二定位孔的孔口形状为长圆形或者椭圆形。进一步地，所述第二定位孔的孔口形状与所述第二定位孔对应的电子设备的任一部件上的定位柱的横截面形状不相同，以降低安装难度。例如，所述第二定位孔的孔口形状为长圆形或者椭圆形，与所述第二定位孔对应的电子设备的任一部件上的定位柱的横截面形状为圆形。
结合图3来说，所述支撑板230的上表面为长方形，所述支撑板230的上表面设置有4个指纹传感器芯片，所述支撑板230在所述这4个指纹传感器芯片210中的每对相邻指纹传感器芯片210的间隔区域的中间位置分别设置一个定位孔231。
当然，所述支撑板230在所述4个光学指纹传感器芯片210中的每对相邻芯片的间隔区域设置有一个定位孔231仅为本申请的一种示例，不应理解为对本申请的限制。例如，在其他可替代实施例中，所述支撑板230可以在所述多个芯片中的特定的至少一对相邻芯片的间隔区域设置一个定位孔。例如，所述支撑板230仅在所述多个芯片中的最中间的一对相邻芯片的间隔区域设置一个定位孔。
可选地，如图3所示，所述电路板220在靠近所述多个光学指纹传感器芯片的一端可以设置有至少一个折弯槽。
进一步地，所述至少一个折弯槽中的一个折弯槽对应所述多个光学指纹传感器芯片中的一对相邻芯片之间的间隔区域。由此，将所述支撑板230安装于电子设备的某一部件时，可以避免所述电路板230由于发生弯折而影响性能，甚至发生折损。所述折弯槽的形状为U形，以避免所述电路板在所述折弯槽的位置发生断裂。
可选地，如图3所示，所述指纹识别装置200还可以包括滤光片270， 所述滤光片270设置在所述至少一个指纹传感器芯片的上方。
具体地，滤光片270可以包括一个或多个光学过滤器，一个或多个光学过滤器可以配置为例如带通过滤器，以允许OLED像素发射的光的传输，同时阻挡太阳光中的红外光等其他光组分。当在室外使用屏下所述指纹识别装置200时，这种光学过滤可以有效地减少由太阳光造成的背景光。一个或多个光学过滤器可以实现为例如光学过滤涂层，光学过滤涂层形成在一个或多个连续界面上，或可以实现为一个或多个离散的界面上。应理解，滤光片270可以制作在任何光学部件的表面上，或者沿着到经由手指反射形成的反射光至成所述至少一个指纹传感器芯片的光学路径上。
本申请实施例中，滤光片270用于来减少指纹感应中的不期望的环境光，以提高至少一个指纹传感器芯片对接收到的光的光学感应。滤光片270具体可以用于过滤掉特定波长的光，例如，近红外光和部分的红光等。例如，人类手指吸收波长低于～580nm的光的能量中的大部分，如果一个或多个光学过滤器或光学过滤层被设计为过滤波长从580nm至红外的光，则可以大大减少环境光对指纹感应中的光学检测的影响。
此外，所述滤光片270的进光面还可以设置有光学无机镀膜或有机黑化涂层，以使得滤光片270的进光面的反射率低于第一阈值，例如1％，从而能够保证所述至少一个指纹传感器芯片能够接收到足够的，进而提升指纹识别效果。
本申请实施例中，所述滤光片270可以和所述至少一个指纹传感器芯片在所述至少一个指纹传感器芯片的非感光区域进行点胶固定，且所述滤光片270和所述至少一个指纹传感器芯片的感光区域之间存在间隙；或者所述滤光片270的下表面通过折射率低于预设折射率的胶水固定在所述至少一个指纹传感器芯片的上表面。例如，所述滤光片270的下表面通过折射率低于1.3的胶水固定在所述至少一个指纹传感器芯片的上表面。
可选地，如图3和图4所示，所述指纹识别装置200还可以包括金线260，所述电路板220通过金线260与所述至少一个指纹传感器芯片相连。
具体而言，所述金线260用于实现至少一个指纹传感器芯片和电路板220之间的通信，并通过电路板220实现与其他外围电路或者如图1或图2所示的电子设备中的其他元件的电性互连和信号传输。比如，所述至少一个指纹传感器芯片可以通过所述金线260接收电子设备的处理单元的控制信 号，并且还可以通过所述金线260将指纹检测信号(例如指纹图像)输出给所述指纹识别装置200的图像处理器或者电子设备300的处理器。
进一步地，所述金线260的高度和所述金线260的封胶的高度可以分别低于所述滤光片270的高度，以减小所述指纹识别装置200的厚度以及降低其安装难度。
可选地，如图3和图4所示，所述指纹识别装置200还可以包括图像处理器250，图像处理器250设置于电路板220上。所述图像处理器250可以具体为微处理器(Micro Processing Unit，MCU)，图像处理器250用于接收来自所述至少一个传感器通过所述电路板220发送的指纹检测信号(例如指纹图像)，并基于指纹检测信号进行指纹识别。具体地，所述至少一个指纹传感器芯片首先接收从用户手指反射回来的反射光并基于接收的光信号进行成像，以生成指纹图像；然后，将指纹图像通过所述电路板220发送给图像处理器250，以便图像处理器250进行图像处理并得到指纹信号；最后，通过算法对指纹信号进行指纹识别。
可选地，如图3和图4所示，所述指纹识别装置200还可以包括至少一个电容器240，所述至少一个电容器240设置在所述电路板220上，用于优化至少一个指纹传感器芯片采集的指纹检测信号。例如，所述至少一个电容器240用于对所述至少一个指纹传感器芯片采集的指纹检测信号进行滤波处理。其中，所述至少一个指纹传感器芯片中的每个指纹传感器芯片可以对应一个或者多个电容器240。
应理解，图3和图4仅为本申请的一种示例，不应理解为对本申请实施例的限制。
例如，在其他可替代的实施例中，所述指纹识别装置200可以仅包括少于4个或者多于4个的指纹传感器芯片210。
还应理解，本申请实施例对所述支撑板230的材料、形状以及尺寸等参数不做具体限定。
例如，支撑板230的厚度范围为0.075mm-0.30mm，以控制所述指纹识别装置200的厚度。
又例如，支撑板230为挠性补强板时，所述挠性补强板包括但不限于聚酰亚胺补强板，以使提高所述指纹识别装置200的散热性能。
又例如，支撑板230的表面粗糙度(Ra)大于某一阈值，比如0.25um， 以提高成像效果；具体而言，支撑板230的表面粗糙度大于某一阈值时，其表面可以将光信号进行散射，能够有效减少显示屏发出的并在指纹识别装置200的内部发生反射的光信号，进而避免光反射对成像造成影响；此外，支撑板230的表面粗糙度大于某一阈值时，可以增加所述支撑板230与其他部件之间的连接可靠度。比如所述支撑板230与所述至少一个传感器和所述电路板220之间的连接可靠度以及所述支撑板230与用于固定所述支撑板230的部件之间的连接可靠度。
又例如，支撑板230的颜色为深色，以增加所述支撑板230的吸光效果，进而避免所述支撑板230向上反射的光线对所述至少一个指纹传感器芯片接收到的光线产生干扰。比如黑色或深棕色。
又例如，支撑板230的下表面为正方形或长方形，以便于将所述支撑板230安装在所述电子设备300的内部。
还应理解，本申请实施例对所述电路板220的类型以及形状等参数也不做限定，可选地，所述电路板的形状可以为不规则形状或者规则形状。例如，长方形或者正方形。
例如，如图3，所述电路板220的形状为T型。
又例如，在其他可替代实施例中，所述电路板220的形状还可以为T形的变形结构。
本申请实施例还提供了一种电子设备300，所述电子设备300可以包括如上述本申请各种实施例中的指纹识别装置200和显示屏。其中，所述指纹识别装置200设置于所述显示屏的下方，用于接收经由手指反射的并经过所述显示屏的光信号进行指纹检测。
具体地，所述指纹识别模组200可以通支撑板230可以固定到所述电子设备的中框等内部部件上，进而使得所述指纹识别装置200可以固定在所述电子设备的显示屏的下方。例如，所述指纹识别装置200可以通过支撑板230设置在电子设备的显示屏的下方，具体可以设置在显示屏的中间区域的下方，符合用户的使用习惯，便于用户握持。
如图4和图5所示，所述电子设备300可以包括显示屏以及指纹识别装置200。其中，所述显示屏可以包括显示组件310和所述显示组件310的遮光层320。可选地，所述遮光层320可以设置有开窗321，所述指纹识别装置200通过所述开窗321接收所述显示组件310发出的经由人体手指反射后 形成的光信号，所述光信号用于指纹识别。
本申请实施例中，电子设备300的指纹识别装置200和所述电子设备300的显示屏是分离设计的，但本申请实施例对所述指纹识别装置200和所述电子设备的显示屏之间的相对距离不做限定。
具体地，所述指纹识别装置200可以接触于所述显示组件310的下表面，或者，所述指纹识别装置200的上表面和所述显示组件310的下表面之间可以存在间隙。例如，指纹识别装置200的上表面可以与显示屏的下表面的之间的距离可以小于或等于特定阈值，例如600μm，从而保证有足够的光信号入射到至少一个指纹传感器芯片的感光区域。
本申请实施例中，若指纹识别装置200和显示屏的下表面不接触，二者之间保留固定的间隙，间隙可以是不填充任何辅助材料的空气间隙(air gap)，其可保证在当显示屏受到按压或者电子设备出现跌落或碰撞时均不会出现指纹识别装置200接触到显示屏的下表面，也不会影响指纹识别装置200的指纹识别的稳定性和性能。
应理解，图4和图5所示的显示组件310可以参考可以参照前述关于显示屏120的描述，为了简洁，在此不再赘述。
应理解，所述遮光层320还可以用作散热层和/或缓冲层，其中，该遮光层用于遮挡指纹检测区域之外的其他区域，以避免所述其他区域中的光信号进入指纹传感器芯片，影响指纹检测效果。所述遮光层320用作散热层时，还可以用于对显示屏中的发光单元产生的热量进行散热，所述遮光层320用作缓冲层时，可以用于缓冲电子设备受到的挤压或碰撞，以降低对显示屏的损伤。
可选地，如图4和图5所示，所述电子设备300还可以包括中框330，所述中框330用于支撑所述显示屏。具体地，中框330可以为电子设备300的设置于显示屏和电池之间用于承载内部各种组件的框架，其内部各种组件包括但不限于主板，摄像头，排线，各种感应器，话筒，听筒等等零部件。
可以理解的是，本申请实施例中仅以将指纹识别装置200固定在中框330上为例进行描述，在其他替代实施例中，指纹识别装置200可以通过固定连接在电子设备300的具有支撑功能的其他结构上来实现将指纹识别装置200安装在显示屏的下方。即只要能够保证上述指纹识别装置200能够以分离方式固定设置在显示屏的下方便可。
例如，可以将指纹识别装置200固定到电子设备的后盖、主板以及电池等具有支撑功能的结构或器件上，进一步地使其固定设置在显示屏的下方。
可选地，如图4和图5所示，所述中框330的上表面向下延伸形成有凹槽，所述凹槽内设置有与所述指纹识别装置200的至少一个定位孔对应的至少一个定位柱331。所述至少一个定位柱331中每个定位柱的横截面的形状可以为圆形。
可选地，如图4和图5所示，所述电子设备300还可以包括至少一个泡棉340，所述至少一个泡棉340设置于所述支撑板230和所述中框330之间。所述至少一个泡棉中的部分或全部泡棉为双面背胶泡棉，以提高所述支撑板230和所述中框330之间的连接可靠性。
进一步地，所述至少一个泡棉340所述指纹识别装置中的至少一个指纹传感器芯片210之间的关系是一一对应的关系。
结合图5来说，所述指纹识别装置200包括4个指纹传感器芯片210时，所述电子设备300可以包括与所述4个指纹传感器芯片210对应的4块泡棉，其中，每个指纹传感器芯片210的下表面的尺寸和其对应的泡棉340的上表面的尺寸相同。
更进一步地，所述至少一个泡棉340中每个泡棉340的厚度与将所述中框330和所述显示屏之间的距离以及所述指纹识别装置200中的至少一个指纹传感器芯片210和所述显示屏(例如所述显示组件310)之间的距离有关。所述至少一个泡棉340中每个泡棉340的厚度分别与将所述中框330和所述显示屏之间的距离以及所述指纹识别装置200中的至少一个指纹传感器芯片210和所述显示屏之间的距离成反比。例如，所述至少一个泡棉340中每个泡棉340的厚度使得所述至少一个指纹传感器芯片210的上表面和所述显示屏的下表面之间的距离小于或等于600μm。
应理解，图5仅为本申请的一种示例，不应理解为对本申请实施例的限制。例如，在其他可替代的实施例中，所述电子设备300可以仅包括一块泡棉，所述一块泡棉设置有与所述支撑板230上的至少一个定位孔对应的通孔。
应理解，本申请实施例中的具体的例子只是为了帮助本领域技术人员更好地理解本申请实施例，而非限制本申请实施例的范围。
应理解，在本申请实施例和所附权利要求书中使用的术语是仅仅出于描述特定实施例的目的，而非旨在限制本申请实施例。例如，在本申请实施例 和所附权利要求书中所使用的单数形式的“一种”、“上述”和“所述”也旨在包括多数形式，除非上下文清楚地表示其他含义。
本领域普通技术人员可以意识到，结合本文中所公开的实施例描述的各示例的单元，能够以电子硬件、计算机软件或者二者的结合来实现，为了清楚地说明硬件和软件的可互换性，在上述说明中已经按照功能一般性地描述了各示例的组成及步骤。这些功能究竟以硬件还是软件方式来执行，取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能，但是这种实现不应认为超出本申请的范围。
在本申请所提供的几个实施例中，应所述理解到，所揭露的系统、装置，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另外，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口、装置或单元的间接耦合或通信连接，也可以是电的，机械的或其它的形式连接。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本申请实施例方案的目的。
另外，在本申请各个实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以是两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现，也可以采用软件功能单元的形式实现。
所述集成的单元如果以软件功能单元的形式实现并作为独立的产品销售或使用时，可以存储在一个计算机可读取存储介质中。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分，或者所述技术方案的全部或部分可以以软件产品的形式体现出来，所述计算机软件产品存储在一个存储介质中，包括若干指令用以使得一台计算机设备(可以是个人计算机，服务器，或者网络设备等)执行本申请各个实施例所述方法的全部或部分步骤。而前述的存储介质包括：U盘、移动硬盘、只读存储器(ROM， Read-Only Memory)、随机存取存储器(RAM，Random Access Memory)、磁碟或者光盘等各种可以存储程序代码的介质。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (25)

  1. 一种指纹识别装置，应用在具有显示屏的电子设备，其特征在于，所述指纹识别装置包括：
    支撑板；
    至少一个指纹传感器芯片，所述至少一个指纹传感器芯片设置于所述支撑板的上表面；
    其中，所述支撑板用于安装在所述电子设备的中框，以使所述至少一个指纹传感器芯片位于所述电子设备的显示屏下方；所述至少一个指纹传感器芯片用于接收经由所述显示屏上方的人体手指反射或散射而返回的指纹检测信号，其中所述指纹检测信号用来检测所述手指的指纹信息。
  2. 根据权利要求1所述的指纹识别装置，其特征在于，所述电子设备的中框具有位于上表面的凹槽，且所述至少一个指纹传感器芯片通过所述支撑板设置在所述中框的凹槽内。
  3. 根据权利要求1所述的指纹识别装置，其特征在于，还包括：
    电路板，所述电路板的至少一部分连接在所述支撑板的上表面的边缘位置，所述电路板和所述至少一个指纹传感器芯片相连。
  4. 根据权利要求3所述的指纹识别装置，其特征在于，所述电路板的至少一部分连接在所述支撑板的上表面的靠近长边的边缘位置。
  5. 根据权利要求1至4中任一项所述的指纹识别装置，其特征在于，所述支撑板为挠性补强板，所述挠性补强板在下表面的靠近短边的边缘区域设置有第一定位孔。
  6. 根据权利要求5所述的指纹识别装置，其特征在于，所述第一定位孔包括两个定位孔，且每个定位孔的孔口形状为圆形。
  7. 根据权利要求6所述的指纹识别装置，其特征在于，所述至少一个指纹传感器芯片包括沿所述挠性补强板的上表面的长边方向设置的多个光学指纹传感器芯片，所述挠性补强板在所述多个光学指纹传感器芯片中的每对相邻芯片的间隔区域设置有第二定位孔。
  8. 根据权利要求7所述的指纹识别装置，其特征在于，所述第二定位孔的孔口形状为长圆形或者椭圆形。
  9. 根据权利要求1至8中任一项所述的指纹识别装置，其特征在于，所 述至少一个指纹传感器芯片包括多个光学指纹传感器芯片，所述多个光学指纹传感器芯片并排设置在所述支撑板的上表面，以拼接成一个光学指纹传感器芯片组件。
  10. 根据权利要求9所述的指纹识别装置，其特征在于，所述电路板在靠近所述多个光学指纹传感器芯片的一端设置有至少一个折弯槽，所述至少一个折弯槽中的一个折弯槽对应所述多个光学指纹传感器芯片中的一对相邻芯片之间的间隔区域。
  11. 根据权利要求10所述的指纹识别装置，其特征在于，所述折弯槽的形状为U形。
  12. 根据权利要求1至11中任一项所述的指纹识别装置，其特征在于，所述指纹识别装置还包括：
    滤光片，所述滤光片设置在所述至少一个指纹传感器芯片的上方。
  13. 根据权利要求12所述的指纹识别装置，其特征在于，所述滤光片的进光面设置有光学无机镀膜或有机黑化涂层。
  14. 根据权利要求12所述的指纹识别装置，其特征在于，所述滤光片和所述至少一个指纹传感器芯片在所述至少一个指纹传感器芯片的非感光区域进行点胶固定，且所述滤光片和所述至少一个指纹传感器芯片的感光区域之间存在间隙；或者所述滤光片的下表面通过折射率低于预设折射率的胶水固定在所述至少一个指纹传感器芯片的上表面。
  15. 根据权利要求12所述的指纹识别装置，其特征在于，所述电路板通过金线与所述至少一个指纹传感器芯片相连，所述金线的高度和所述金线的封胶的高度分别低于所述滤光片的高度。
  16. 根据权利要求1至15中任一项所述的指纹识别装置，光信号其特征在于，所述支撑板的表面粗糙度大于0.25um。
  17. 根据权利要求1至16中任一项所述的指纹识别装置，其特征在于，所述电路板为T型软性电路板，且所述T型软性电路板的上方设置有多个电容器，所述多个电容器对应连接到所述至少一个指纹传感器芯片。
  18. 一种电子设备，其特征在于，包括：
    显示屏以及如权利要求1至17中任一项所述的指纹识别装置，所述指纹识别装置设置在所述显示屏的下方以实现屏下指纹检测。
  19. 如权利要求18所述的电子设备，其特征在于，所述显示屏包括：
    显示组件；
    遮光层，所述遮光层设置于所述显示组件的下方，所述遮光层设置有开窗，所述指纹识别装置通过所述开窗接收所述显示组件发出的经由人体手指反射后形成的光信号，所述光信号用于指纹识别；
    其中，所述指纹识别装置接触于所述显示组件的下表面，或者，所述指纹识别装置和所述显示组件的下表面存在间隙。
  20. 根据权利要求18或19所述的电子设备，其特征在于，所述电子设备还包括：
    中框，所述中框用于支撑所述显示屏；
    其中，所述中框的上表面向下延伸形成有凹槽，所述指纹识别装置设置在所述凹槽内并与所述显示屏具有预定间隙。
  21. 根据权利要求20所述的电子设备，其特征在于，所述指纹识别装置的支撑板具有至少一个定位孔，且所述凹槽内设置有与所述指纹识别装置的至少一个定位孔对应的至少一个定位柱。
  22. 根据权利要求21所述的电子设备，其特征在于，所述至少一个定位柱中每个定位柱的横截面的形状为圆形。
  23. 根据权利要求18至22中任一项所述的电子设备，其特征在于，所述电子设备还包括：
    至少一个泡棉，所述至少一个泡棉设置于所述支撑板和所述中框之间。
  24. 根据权利要求23所述的电子设备，其特征在于，所述至少一个泡棉中每个泡棉的厚度与所述中框和所述显示屏之间的距离以及所述指纹识别装置中的至少一个指纹传感器芯片和所述显示屏之间的距离有关。
  25. 根据权利要求24所述的电子设备，其特征在于，所述至少一个泡棉所述至少一个指纹传感器芯片之间的关系是一一对应的关系。
PCT/CN2018/125425 2018-12-13 2018-12-29 指纹识别装置和电子设备 WO2020133378A1 (zh)

Priority Applications (12)

Application Number Priority Date Filing Date Title
PCT/CN2018/125425 WO2020133378A1 (zh) 2018-12-29 2018-12-29 指纹识别装置和电子设备
EP18933732.2A EP3699809A4 (en) 2018-12-29 2018-12-29 FINGERPRINT IDENTIFICATION DEVICE AND ELECTRONIC DEVICE
CN201880003069.6A CN109791610B (zh) 2018-12-29 2018-12-29 指纹识别装置和电子设备
PCT/CN2019/113720 WO2020119289A1 (zh) 2018-12-13 2019-10-28 指纹识别装置和电子设备
CN202010858839.4A CN111967417B (zh) 2018-12-13 2019-10-28 指纹识别装置和电子设备
CN202110367804.5A CN113065472B (zh) 2018-12-13 2019-10-28 指纹识别装置和电子设备
KR1020207027909A KR102440709B1 (ko) 2018-12-13 2019-10-28 지문 식별 장치 및 전자 기기
CN201980004221.7A CN111133443B (zh) 2018-12-13 2019-10-28 指纹识别装置和电子设备
CN201921829124.5U CN210605745U (zh) 2018-12-13 2019-10-28 指纹识别装置和电子设备
EP19896224.3A EP3786834B1 (en) 2018-12-13 2019-10-28 Fingerprint recognition device and electronic apparatus
US16/825,604 US11232317B2 (en) 2018-12-29 2020-03-20 Fingerprint identification apparatus and electronic device
US17/024,154 US11917763B2 (en) 2018-12-13 2020-09-17 Fingerprint identification apparatus and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/125425 WO2020133378A1 (zh) 2018-12-29 2018-12-29 指纹识别装置和电子设备

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US16/825,604 Continuation-In-Part US11232317B2 (en) 2018-12-29 2020-03-20 Fingerprint identification apparatus and electronic device

Publications (1)

Publication Number Publication Date
WO2020133378A1 true WO2020133378A1 (zh) 2020-07-02

Family

ID=66500801

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/125425 WO2020133378A1 (zh) 2018-12-13 2018-12-29 指纹识别装置和电子设备

Country Status (4)

Country Link
US (1) US11232317B2 (zh)
EP (1) EP3699809A4 (zh)
CN (1) CN109791610B (zh)
WO (1) WO2020133378A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115828331A (zh) * 2023-02-20 2023-03-21 深圳市米尔电子有限公司 计算机数据采集卡

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020133378A1 (zh) 2018-12-29 2020-07-02 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN210605745U (zh) 2018-12-13 2020-05-22 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN110770746B (zh) 2019-05-29 2021-06-11 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN111801685A (zh) * 2019-05-29 2020-10-20 深圳市汇顶科技股份有限公司 指纹检测装置和电子设备
CN111164609B (zh) * 2019-06-14 2023-10-13 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN110389626B (zh) * 2019-07-29 2021-07-30 Oppo广东移动通信有限公司 电子设备
CN110674699A (zh) * 2019-08-30 2020-01-10 华为技术有限公司 一种指纹装置、电子设备及其制造方法
TWI704485B (zh) * 2019-09-27 2020-09-11 速博思股份有限公司 指紋偵測裝置
CN110780746B (zh) 2019-10-09 2021-08-24 维沃移动通信有限公司 一种按键结构、按键的控制方法及电子设备
WO2021081763A1 (zh) * 2019-10-29 2021-05-06 深圳市汇顶科技股份有限公司 屏下指纹识别装置及电子设备
KR102374723B1 (ko) 2019-11-04 2022-03-14 선전 구딕스 테크놀로지 컴퍼니, 리미티드 광학 지문 장치 및 전자 기기
CN111801687B (zh) * 2020-02-25 2024-02-06 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
WO2022056940A1 (zh) * 2020-09-21 2022-03-24 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
WO2022056936A1 (zh) * 2020-09-21 2022-03-24 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
WO2022056938A1 (zh) * 2020-09-21 2022-03-24 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN112183396B (zh) * 2020-09-30 2024-03-08 京东方科技集团股份有限公司 显示组件和显示装置
EP4332720A1 (en) * 2021-07-13 2024-03-06 Samsung Electronics Co., Ltd. Electronic device including fingerprint sensor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107241468A (zh) * 2017-05-12 2017-10-10 广东欧珀移动通信有限公司 显示装置及移动终端
CN107918450A (zh) * 2016-10-05 2018-04-17 三星电子株式会社 包括生物测量学传感器的电子装置
CN108737643A (zh) * 2017-04-18 2018-11-02 三星电子株式会社 获取生物识别信息的方法和支持该方法的电子设备
CN109075141A (zh) * 2018-07-26 2018-12-21 深圳市汇顶科技股份有限公司 芯片封装结构、方法和终端设备

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1557891A3 (en) * 2004-01-20 2006-10-04 LG Electronics Inc. Organic electroluminescent device and fabrication method thereof
KR101165087B1 (ko) 2011-10-27 2012-07-12 (주)뉴마드 보강판을 구비한 지문인식 카드
KR20140079960A (ko) 2012-12-20 2014-06-30 크루셜텍 (주) 지문 인식 이용한 애플리케이션을 실행하기 위한 방법, 장치 및 컴퓨터 판독 가능 기록 매체
CN104182727B (zh) 2014-05-16 2021-07-30 深圳印象认知技术有限公司 超薄型指纹、掌纹采集装置及指纹、掌纹图像采集方法
KR20160071262A (ko) 2014-12-11 2016-06-21 엘지전자 주식회사 이동 단말기
KR101634067B1 (ko) 2014-10-01 2016-06-30 주식회사 네패스 반도체 패키지 및 그 제조방법
CN105046190B (zh) * 2015-05-08 2017-12-19 苏州迈瑞微电子有限公司 指纹识别模组
US10064276B2 (en) * 2015-10-21 2018-08-28 Adventive Ipbank 3D bendable printed circuit board with redundant interconnections
US10635878B2 (en) * 2015-10-23 2020-04-28 Shenzhen GOODIX Technology Co., Ltd. Optical fingerprint sensor with force sensing capability
CN105825165B (zh) 2015-11-20 2019-02-15 维沃移动通信有限公司 一种指纹识别模组、终端设备及装配方法
US20170206644A1 (en) 2016-01-15 2017-07-20 Abl Ip Holding Llc Light fixture fingerprint detection for position estimation
CN205334502U (zh) 2016-01-18 2016-06-22 宸盛光电有限公司 指纹识别模组及具有该指纹识别模组的电子装置
CN111124048A (zh) 2016-04-19 2020-05-08 三星电子株式会社 支持指纹验证的电子装置
US20180101718A1 (en) * 2016-10-11 2018-04-12 Zwipe As Fingerprint authorisable device
KR102483072B1 (ko) 2016-11-25 2023-01-04 엘지디스플레이 주식회사 표시장치
KR20180085288A (ko) 2017-01-18 2018-07-26 삼성전자주식회사 지문 인식 기능을 가지는 전자 장치
CN107066946B (zh) 2017-03-13 2019-10-01 Oppo广东移动通信有限公司 指纹模组、显示屏及移动终端
KR102016932B1 (ko) * 2017-04-14 2019-09-02 주식회사 리딩유아이 지문센서모듈 및 이를 갖는 지문인식장치
CN106993072A (zh) 2017-05-12 2017-07-28 广东欧珀移动通信有限公司 壳体及移动终端
CN107169452B (zh) 2017-05-12 2020-04-10 Oppo广东移动通信有限公司 指纹模组、显示装置及移动终端
CN206921061U (zh) 2017-06-29 2018-01-23 南昌欧菲显示科技有限公司 电子设备及其指纹识别压力感应触摸屏
CN107451579A (zh) 2017-08-23 2017-12-08 江西合力泰科技有限公司 一种内嵌于面板的生物识别模组及其生产工艺
CN207182349U (zh) * 2017-09-15 2018-04-03 南昌欧菲生物识别技术有限公司 光学指纹识别组件和电子装置
KR102534712B1 (ko) * 2017-11-30 2023-05-22 삼성전자주식회사 지문 센서를 구비한 웨어러블 전자 장치
CN207557977U (zh) 2017-12-05 2018-06-29 深圳市为通博科技有限责任公司 光路调制器、指纹识别装置和终端设备
CN107910344B (zh) 2017-12-18 2021-02-23 苏州晶方半导体科技股份有限公司 一种光学指纹识别芯片的封装结构以及封装方法
JP6770082B2 (ja) 2018-02-06 2020-10-14 シェンチェン グディックス テクノロジー カンパニー，リミテッド アンダースクリーンバイオメトリクス認証装置、バイオメトリクス認証ユニット及び端末装置
CN208283964U (zh) * 2018-04-04 2018-12-25 维沃移动通信有限公司 一种光学指纹模组、显示屏和终端设备
CN108615003B (zh) 2018-04-20 2019-06-11 Oppo广东移动通信有限公司 指纹识别组件、显示装置及电子装置
CN108596080B (zh) 2018-04-20 2021-05-14 Oppo广东移动通信有限公司 指纹识别组件、显示装置及电子装置
CN108734119A (zh) 2018-05-14 2018-11-02 维沃移动通信有限公司 一种显示模组和电子设备
CN208156697U (zh) 2018-05-23 2018-11-27 深圳汉德霍尔科技有限公司 移动采集终端
CN108962025A (zh) 2018-06-05 2018-12-07 京东方科技集团股份有限公司 显示模组及制备方法、显示装置
CN108810207A (zh) 2018-06-22 2018-11-13 昆山丘钛微电子科技有限公司 一种全面屏光学指纹解锁终端以及全面屏光学指纹解锁方法
WO2020029021A1 (zh) * 2018-08-06 2020-02-13 深圳市汇顶科技股份有限公司 屏下光学指纹识别装置及电子设备
WO2020133378A1 (zh) 2018-12-29 2020-07-02 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN212135449U (zh) 2018-12-13 2020-12-11 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN209460780U (zh) 2018-12-29 2019-10-01 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107918450A (zh) * 2016-10-05 2018-04-17 三星电子株式会社 包括生物测量学传感器的电子装置
CN108737643A (zh) * 2017-04-18 2018-11-02 三星电子株式会社 获取生物识别信息的方法和支持该方法的电子设备
CN107241468A (zh) * 2017-05-12 2017-10-10 广东欧珀移动通信有限公司 显示装置及移动终端
CN109075141A (zh) * 2018-07-26 2018-12-21 深圳市汇顶科技股份有限公司 芯片封装结构、方法和终端设备

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3699809A4 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115828331A (zh) * 2023-02-20 2023-03-21 深圳市米尔电子有限公司 计算机数据采集卡
CN115828331B (zh) * 2023-02-20 2023-05-23 深圳市米尔电子有限公司 计算机数据采集卡

Also Published As

Publication number Publication date
EP3699809A4 (en) 2020-11-04
EP3699809A1 (en) 2020-08-26
US20200218920A1 (en) 2020-07-09
CN109791610A (zh) 2019-05-21
US11232317B2 (en) 2022-01-25
CN109791610B (zh) 2021-04-27

Similar Documents

Publication Publication Date Title
WO2020133378A1 (zh) 指纹识别装置和电子设备
CN209895353U (zh) 指纹识别装置和电子设备
WO2020151159A1 (zh) 指纹识别的装置和电子设备
US11663846B2 (en) Fingerprint identification apparatus and electronic device
KR102440709B1 (ko) 지문 식별 장치 및 전자 기기
WO2020186523A1 (zh) 指纹识别装置和电子设备
WO2020191596A1 (zh) 指纹识别装置和电子设备
WO2020133344A1 (zh) 指纹识别装置和电子设备
CN210052176U (zh) 指纹检测装置和电子设备
WO2020150939A1 (zh) 指纹识别装置和电子设备
WO2020220305A1 (zh) 屏下指纹识别装置和电子设备
KR102374723B1 (ko) 광학 지문 장치 및 전자 기기
WO2021051737A1 (zh) 指纹识别装置、背光模组、液晶显示屏和电子设备
CN212135452U (zh) 指纹识别装置和电子设备
WO2020177032A1 (zh) 指纹识别装置和电子设备
WO2021007730A1 (zh) 指纹检测装置和电子设备
CN210864756U (zh) 光学指纹装置和电子设备
WO2021007964A1 (zh) 指纹检测装置和电子设备
CN209911987U (zh) 指纹识别装置和电子设备
CN209460780U (zh) 指纹识别装置和电子设备
CN211087274U (zh) 指纹检测装置和电子设备
WO2021138781A1 (zh) 指纹检测装置和电子设备

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2018933732

Country of ref document: EP

Effective date: 20200325

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18933732

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE