WO2020186523A1 - 指纹识别装置和电子设备 - Google Patents

指纹识别装置和电子设备 Download PDF

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Publication number
WO2020186523A1
WO2020186523A1 PCT/CN2019/079107 CN2019079107W WO2020186523A1 WO 2020186523 A1 WO2020186523 A1 WO 2020186523A1 CN 2019079107 W CN2019079107 W CN 2019079107W WO 2020186523 A1 WO2020186523 A1 WO 2020186523A1
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WO
WIPO (PCT)
Prior art keywords
fingerprint
identification device
fingerprint identification
window
sensor chip
Prior art date
Application number
PCT/CN2019/079107
Other languages
English (en)
French (fr)
Inventor
刘凯
龙卫
郭益平
Original Assignee
深圳市汇顶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to PCT/CN2019/079107 priority Critical patent/WO2020186523A1/zh
Priority to CN201980002465.1A priority patent/CN110770749B/zh
Priority to EP19886055.3A priority patent/EP3739508B1/en
Priority to CN202020350817.2U priority patent/CN211349388U/zh
Priority to US16/886,773 priority patent/US20200302142A1/en
Publication of WO2020186523A1 publication Critical patent/WO2020186523A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/30—Authentication, i.e. establishing the identity or authorisation of security principals
    • G06F21/31—User authentication
    • G06F21/32—User authentication using biometric data, e.g. fingerprints, iris scans or voiceprints
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1643—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being associated to a digitizer, e.g. laptops that can be used as penpads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G06F1/1658—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to the mounting of internal components, e.g. disc drive or any other functional module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/042—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
    • G06F3/0421—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means by interrupting or reflecting a light beam, e.g. optical touch-screen
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/047—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using sets of wires, e.g. crossed wires
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/12—Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion

Definitions

  • the embodiments of the present application relate to the field of electronics, and more specifically, to fingerprint identification devices and electronic equipment.
  • the under-screen fingerprint recognition solution refers to attaching the optical or ultrasonic fingerprint recognition module to the bottom of the Organic Light-Emitting Diode (OLED) screen, that is, regardless of the optical fingerprint recognition module or the ultrasonic fingerprint recognition module Both need to be tightly bonded to the light-emitting layer at the bottom of the screen.
  • OLED Organic Light-Emitting Diode
  • the OLED screen is very costly and fragile, it is easy to damage the OLED screen when the fingerprint recognition module is directly attached to the OLED screen.
  • the fingerprint recognition module and the OLED screen are completely glued together, if the fingerprint recognition module is damaged, it is easy to damage the OLED screen when the fingerprint recognition module is removed.
  • the bonding process for directly bonding the fingerprint recognition module to the OLED screen is also complicated.
  • a fingerprint identification device and electronic equipment are provided, which can reduce the cost and complexity of the electronic equipment and improve the maintainability. Especially for the scenario of multiple fingerprint sensor chips, the cost and complexity of the electronic device can be effectively reduced, and the maintainability is greatly improved. In addition, the thickness of the fingerprint identification device can be effectively reduced.
  • a fingerprint identification device which is applied to an electronic device with a display screen, and the fingerprint identification device includes:
  • At least one fingerprint sensor chip At least one fingerprint sensor chip
  • a support plate the support plate is provided with a first window, and the at least one fingerprint sensor chip is fixedly arranged in the first window;
  • the support plate is used to be installed on the middle frame of the electronic device, so that the at least one fingerprint fingerprint sensor chip is located under the display screen of the electronic device, and the at least one fingerprint fingerprint sensor chip is used to receive A fingerprint detection signal returned by reflection or scattering of a human finger above the display screen, and the fingerprint detection signal is used to detect fingerprint information of the finger.
  • the at least one fingerprint sensor chip after the at least one fingerprint sensor chip is fixedly installed on the supporting plate, the at least one fingerprint sensor chip can be fixedly installed under the display screen of the electronic device through the supporting plate, which avoids The at least one fingerprint sensor chip is directly attached to the display screen of the electronic device, which can reduce the installation difficulty and complexity of the at least one fingerprint sensor chip and improve the maintainability.
  • the at least one fingerprint sensor chip includes multiple chips, the multiple chips can be fixedly installed below the display screen at one time, which can reduce installation complexity and improve installation efficiency.
  • the thickness of the fingerprint identification device can be effectively reduced.
  • an electronic device including:
  • Figure 1 is a schematic plan view of an electronic device to which this application can be applied.
  • Fig. 2 is a schematic side sectional view of the electronic device shown in Fig. 1.
  • 3 to 7 are schematic structural diagrams of a fingerprint identification device according to an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram formed after the fingerprint identification device is installed in the middle frame of an electronic device according to an embodiment of the present application.
  • Fig. 9 is a schematic structural diagram formed after the structure shown in Fig. 8 is installed on a display screen of an electronic device.
  • portable or mobile computing devices such as smartphones, notebook computers, tablet computers, and gaming devices, as well as other electronic devices such as electronic databases, automobiles, and bank automated teller machines (ATM).
  • ATM bank automated teller machines
  • the embodiments of the present application are not limited thereto.
  • biometric recognition technologies include but are not limited to fingerprint recognition, palmprint recognition, iris recognition, face recognition, and living body recognition.
  • fingerprint recognition technology uses fingerprint recognition technology as an example.
  • the under-screen fingerprint recognition technology refers to the installation of the fingerprint recognition module below the display screen, so as to realize the fingerprint recognition operation in the display area of the display screen. There is no need to set a fingerprint collection area on the front of the electronic device except for the display area.
  • the fingerprint recognition module uses the light returned from the top surface of the display assembly of the electronic device to perform fingerprint sensing and other sensing operations. This returned light carries information about objects (for example, fingers) in contact with the top surface of the display assembly, and the fingerprint recognition module located below the display assembly collects and detects this returned light to realize fingerprint recognition under the screen.
  • the fingerprint recognition module can be designed to achieve desired optical imaging by appropriately configuring optical elements for collecting and detecting the returned light.
  • in-display fingerprint recognition technology refers to the installation of fingerprint recognition modules or part of fingerprint recognition modules inside the display screen, so as to realize fingerprint recognition operations in the display area of the display screen without the need for electronic
  • the fingerprint collection area is set on the front of the device except the display area.
  • FIG. 1 and 2 show schematic diagrams of an electronic device 100 to which under-screen fingerprint recognition technology can be applied.
  • FIG. 1 is a front schematic diagram of the electronic device 100
  • FIG. 2 is a partial cross-sectional structure diagram of the electronic device 100 shown in FIG.
  • the electronic device 100 may include a display screen 120 and a fingerprint recognition module 140.
  • the display screen 120 may be a self-luminous display, which uses a self-luminous display unit as display pixels.
  • the display screen 120 may be an Organic Light-Emitting Diode (OLED) display screen or a Micro-LED (Micro-LED) display screen.
  • the display screen 120 may also be a liquid crystal display (LCD) or other passive light-emitting display, which is not limited in the embodiment of the present application.
  • the display screen 120 may also be specifically a touch display screen, which can not only perform screen display, but also detect a user's touch or pressing operation, thereby providing a user with a human-computer interaction interface.
  • the electronic device 100 may include a touch sensor, and the touch sensor may specifically be a touch panel (TP), which may be provided on the surface of the display screen 120, or may be partially integrated or The whole is integrated into the display screen 120 to form the touch display screen.
  • TP touch panel
  • the fingerprint recognition module 140 may be an optical fingerprint recognition module, such as an optical fingerprint sensor.
  • the fingerprint identification module 140 may include a fingerprint sensor chip with an optical sensing array (hereinafter also referred to as an optical fingerprint sensor).
  • the optical sensing array includes multiple optical sensing units, and each optical sensing unit may specifically include a photodetector or a photoelectric sensor.
  • the fingerprint identification module 140 may include a photodetector array (or called a photodetector array, a photodetector array), which includes a plurality of photodetectors distributed in an array.
  • the fingerprint recognition module 140 may be arranged in a partial area below the display screen 120, so that the fingerprint collection area (or detection area) 130 of the fingerprint recognition module 140 is at least partially located on the display screen 120. ⁇ display area 102.
  • the fingerprint identification module 140 can also be arranged in other positions, such as the side of the display screen 120 or the non-transparent area of the edge of the electronic device 100.
  • the optical signal of at least part of the display area of the display screen 120 can be guided to the fingerprint recognition module 140 through the optical path design, so that the fingerprint collection area 130 is actually located in the display area of the display screen 120 .
  • the fingerprint recognition module 140 may include only one fingerprint sensor chip. At this time, the fingerprint collection area 130 of the fingerprint recognition module 140 has a small area and a fixed position. Therefore, the user needs to input fingerprints. Press the finger to a specific position of the fingerprint collection area 130, otherwise the fingerprint recognition module 140 may not be able to collect the fingerprint image, resulting in poor user experience.
  • the fingerprint identification module 140 may specifically include a plurality of fingerprint sensor chips; the plurality of fingerprint sensor chips may be arranged side by side under the display screen 120 in a splicing manner, and the plurality of fingerprint sensor chips The sensing areas of the two fingerprint sensor chips together constitute the fingerprint collection area 130 of the fingerprint identification module 140.
  • the fingerprint collection area 130 of the fingerprint identification module 140 may include multiple sub-areas, and each sub-area corresponds to the sensing area of one of the fingerprint sensor chips, so that the fingerprint of the optical fingerprint module 130 is collected
  • the area 130 can be extended to the main area of the lower half of the display screen, that is, to the area where the finger is habitually pressed, so as to realize the blind fingerprint input operation.
  • the fingerprint detection area 130 can also be extended to half of the display area or even the entire display area, thereby realizing half-screen or full-screen fingerprint detection.
  • the multiple fingerprint sensor chips may be individually packaged fingerprint sensor chips, or multiple chips (Die) packaged in the same chip package.
  • the multiple fingerprint sensor chips can also be fabricated on different regions of the same chip (Die) through a semiconductor process.
  • the area or light sensing range of the optical sensing array of the fingerprint identification module 140 corresponds to the fingerprint collection area 130 of the fingerprint identification module 140.
  • the fingerprint collection area 130 of the fingerprint recognition module 140 may be equal to or not equal to the area or the light sensing range of the optical sensing array of the fingerprint recognition module 140, which is not specifically limited in the embodiment of the present application.
  • the fingerprint collection area 130 of the fingerprint identification module 140 can be designed to be substantially the same as the area of the sensing array of the fingerprint identification module 140.
  • the area of the fingerprint collection area 130 of the fingerprint recognition module 140 can be larger than the area of the fingerprint recognition module 140 sensing array through the design of the light path of convergent light or the design of the light path of reflected light.
  • the optical path design of the fingerprint identification module 140 is exemplified below.
  • the optical collimator may be specifically a collimator layer made on a semiconductor silicon wafer. , It has a plurality of collimating units or micro-holes.
  • the collimating unit may be specifically a small hole.
  • the reflected light reflected from the finger the light that is perpendicularly incident on the collimating unit can pass through and be
  • the fingerprint sensor chip receives, and the light whose incident angle is too large is attenuated by multiple reflections inside the collimating unit. Therefore, each fingerprint sensor chip can basically only receive the reflected light reflected by the fingerprint lines directly above it. It can effectively improve the image resolution, thereby improving the fingerprint recognition effect.
  • a collimating unit may be configured for one optical sensor unit in the optical sensor array of each fingerprint sensor chip, and the collimating unit may be attached to the corresponding optical sensor.
  • the multiple optical sensing units can also share one collimating unit, that is, the one collimating unit has an aperture large enough to cover the multiple optical sensing units. Since one collimating unit can correspond to multiple optical sensing units, the correspondence between the spatial period of the display screen 120 and the spatial period of the fingerprint sensor chip is destroyed.
  • the spatial structure of the light-emitting display array of the display screen 120 and the fingerprint sensor chip are The spatial structure of the optical sensor array is similar, and it can also effectively prevent the fingerprint identification module 140 from using the light signal passing through the display screen 120 to perform fingerprint imaging to generate moiré fringes, which effectively improves the fingerprint identification effect of the fingerprint identification module 140.
  • the optical lens may include an optical lens (Lens) layer, which has one or more lens units, such as one or more aspheric lenses.
  • the lens group is used to converge the reflected light reflected from the finger to the sensing array of the fingerprint sensor chip below it, so that the sensing array can perform imaging based on the reflected light, thereby obtaining a fingerprint image of the finger.
  • the optical lens layer may also be formed with a pinhole in the optical path of the lens unit, and the pinhole may cooperate with the optical lens layer to expand the field of view of the fingerprint recognition module 140 to improve the fingerprint recognition module 140 Fingerprint imaging effect.
  • each fingerprint sensor chip may be configured with an optical lens for fingerprint imaging, or multiple fingerprint sensor chips may be configured with an optical lens to achieve light convergence and fingerprint imaging.
  • the fingerprint sensor chip can also be equipped with two or more optical lenses to cooperate with the two sensors. The array or multiple sensing arrays perform optical imaging, thereby reducing the imaging distance and enhancing the imaging effect.
  • the micro-lens layer may have a micro-lens array formed by a plurality of micro-lenses, which may be obtained through a semiconductor growth process or other The process is formed above the sensing array of the fingerprint sensor chip, and each microlens can correspond to one of the sensing units of the sensing array.
  • Other optical film layers may be formed between the microlens layer and the sensing unit, such as a dielectric layer or a passivation layer. More specifically, the microlens layer and the sensing unit may also include micropores.
  • the light blocking layer wherein the micro holes are formed between the corresponding micro lens and the sensing unit, the light blocking layer can block the optical interference between the adjacent micro lens and the sensing unit, and allow light to pass through the micro lens
  • the lens is converged into the microhole and is transmitted to the sensing unit corresponding to the microlens through the microhole to perform optical fingerprint imaging.
  • a microlens layer can be further provided under the collimator layer or the optical lens layer.
  • the collimator layer or the optical lens layer is used in combination with the micro lens layer, its specific laminated structure or optical path may need to be adjusted according to actual needs.
  • the fingerprint identification module 140 can be used to collect user fingerprint information (such as fingerprint image information).
  • the display screen 120 can adopt a display screen with a self-luminous display unit, such as an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display or a micro-LED (Micro-LED) display Screen.
  • the fingerprint recognition module 140 can use the display unit (ie, the OLED light source) of the OLED display screen located in the fingerprint collection area 130 as an excitation light source for optical fingerprint detection.
  • the display screen 120 When a finger touches, presses, or approaches (for ease of description, collectively referred to as pressing in this application) in the fingerprint collection area 130, the display screen 120 emits a beam of light to the finger above the fingerprint collection area 130. The surface is reflected to form reflected light or is scattered inside the finger to form scattered light. In related patent applications, for ease of description, the above-mentioned reflected light and scattered light are collectively referred to as reflected light. Because the ridge and valley of the fingerprint have different light reflection capabilities, the reflected light from the fingerprint ridge and the fingerprint ridge have different light intensities. After the reflected light passes through the display screen 120, it is affected by the fingerprint.
  • the fingerprint sensor chip in the identification module 140 receives and converts it into a corresponding electrical signal, that is, a fingerprint detection signal; fingerprint image data can be obtained based on the fingerprint detection signal, and fingerprint matching verification can be further performed, so that the electronic The device 100 implements an optical fingerprint recognition function.
  • the electronic device 100 adopting the above structure does not need to reserve a special space on the front of the fingerprint button (such as the Home button), so a full screen solution can be adopted. Therefore, the display area 102 of the display screen 120 can be substantially extended to the entire front surface of the electronic device 100.
  • the fingerprint identification module 140 may also use a built-in light source or an external light source to provide an optical signal for fingerprint detection and identification.
  • the fingerprint identification module 140 can be applied not only to self-luminous displays such as OLED displays, but also to non-self-luminous displays, such as liquid crystal displays or other passive light-emitting displays.
  • the optical fingerprint system of the electronic device 100 may also include an excitation light source for optical fingerprint detection.
  • the light source may specifically be an infrared light source or a light source of non-visible light of a specific wavelength, which may be arranged under the backlight module of the liquid crystal display or in the edge area under the protective cover of the electronic device 100, and the fingerprint recognition module 140 may
  • the liquid crystal panel or the protective cover is arranged under the edge area and guided by the light path so that the fingerprint detection light can reach the fingerprint identification module 140; or, the fingerprint identification module 140 can also be arranged under the backlight module, and
  • the backlight module is designed to allow the fingerprint detection light to pass through the liquid crystal panel and the backlight module and reach the fingerprint recognition module 140 by opening holes or other optical designs on the film layers such as the diffusion sheet, the brightness enhancement sheet, and the reflection sheet.
  • the fingerprint recognition module 140 adopts a built-in light source or
  • the electronic device 100 may further include a protective cover 110.
  • the cover 110 may be specifically a transparent cover, such as a glass cover or a sapphire cover, which is located above the display screen 120 and covers the front of the electronic device 100, and the surface of the cover 110 may also be provided with a protective layer. Therefore, in the embodiment of the present application, the so-called finger pressing the display screen 120 may actually refer to the finger pressing the cover 110 above the display 120 or covering the surface of the protective layer of the cover 110.
  • a circuit board 150 such as a flexible printed circuit (FPC) (Flexible Printed Circuit, FPC), may also be provided under the fingerprint identification module 140.
  • FPC Flexible Printed Circuit
  • the fingerprint recognition module 140 can be soldered to the circuit board 150 through pads, and realize electrical interconnection and signal transmission with other peripheral circuits or other components of the electronic device 100 through the circuit board 150.
  • the fingerprint recognition module 140 can receive the control signal of the processing unit of the electronic device 100 through the circuit board 150, and can also output the fingerprint detection signal from the fingerprint recognition module 140 to the processing unit of the electronic device 100 through the circuit board 150. Control unit, etc.
  • the fingerprint identification device 140 may be directly fixed and attached to the lower surface of the display screen 120.
  • the display screen 120 is expensive and fragile, it is easy to damage the display screen 120 when the fingerprint identification module 140 is directly attached to the display screen 120.
  • the fingerprint identification module 140 and the display screen 120 are completely glued together, if the fingerprint identification module 140 is damaged, the display screen 120 is easily damaged when the fingerprint identification module 140 is removed.
  • the bonding process of directly bonding the fingerprint identification module 140 to the display screen 120 is also complicated.
  • the present application provides a fingerprint identification device, which can reduce the cost and complexity of the electronic device 100 and improve maintainability.
  • the fingerprint identification device may include at least one fingerprint sensor chip and a support plate, the support plate is provided with a first window, and the at least one fingerprint sensor chip is fixedly arranged in the first window;
  • the support plate is used to be installed on the middle frame of the electronic device, so that the at least one fingerprint fingerprint sensor chip is located under the display screen of the electronic device, and the at least one fingerprint fingerprint sensor chip is used to receive A fingerprint detection signal returned by reflection or scattering of a human finger above the display screen, and the fingerprint detection signal is used to detect fingerprint information of the finger.
  • the supporting board may include a circuit board or a substrate provided with a wiring layer, thereby enabling the at least one fingerprint sensor chip to be connected to the circuit board, or enabling the at least one sensor chip to pass through the substrate
  • the wiring layer is connected to an external circuit board, thereby realizing the function of the at least one fingerprint sensor chip.
  • the fingerprint identification device 200 and the electronic device 300 of the embodiment of the present application will be described in detail below with reference to FIGS. 3 to 9.
  • 3 and 4 are schematic structural diagrams of a fingerprint identification device according to an embodiment of the present application.
  • the fingerprint identification device 200 includes a fingerprint sensor chip 201, a reinforcement board 211 and a circuit board 212.
  • the circuit board 212 is fixedly arranged under the reinforcing plate 211, and the reinforcing plate 211 and the circuit board 212 form a supporting plate for supporting the fingerprint sensor chip 201.
  • the reinforcing plate 211 is provided with a second window.
  • the circuit board 212 is provided with a third window.
  • the second opening of the reinforcing plate 211 and the third opening of the circuit board 212 constitute the first opening of the support plate.
  • the second opening and the third opening are not only used to provide an accommodation space for the fingerprint sensor chip 201, but also used to fix the fingerprint sensor chip 201.
  • the fingerprint sensor chip 201 is electrically connected to the circuit board 212, that is, the fingerprint sensor chip 201 can be connected to an external device or component through the circuit board 212.
  • the lower surface of the reinforcing plate 211 and the upper surface of the circuit board 212 are fixedly connected.
  • a first adhesive layer 213 may be provided between the lower surface of the reinforcing plate 211 and the upper surface of the circuit board 212 for fixedly connecting the reinforcing plate 211 and the circuit board 212.
  • the first glue layer 213 can be any solid glue or liquid glue with adhesive properties.
  • the circuit board 212 is configured to be installed under the display screen of an electronic device, for example, the upper surface of the middle frame of the electronic device, so that the fingerprint sensor chip 201 is located under the display screen.
  • the fingerprint sensor chip 201 is used to receive a fingerprint detection signal returned by reflection or scattering from a human finger above the display screen, and the fingerprint detection signal is used to detect fingerprint information of the finger.
  • the fingerprint sensor chip 201 may be arranged under the middle area of the display screen of the electronic device through the circuit board 212 to conform to the user's usage habits and facilitate the user to hold.
  • the fingerprint sensor chip 201 may include one or more optical fingerprint sensor chips. Each optical fingerprint sensor chip may include one or more optical fingerprint sensors or optical fingerprint sensor arrays.
  • the fingerprint sensor chip 201 includes a plurality of optical fingerprint sensor chips
  • the plurality of optical fingerprint sensor chips can be arranged side by side in the first opening of the support plate to form an optical fingerprint sensor chip assembly.
  • the reinforcing plate 211 includes, but is not limited to, a metal reinforcing plate, and the thickness of the reinforcing plate 211 may range from 0.075 mm to 0.3 mm.
  • the metal reinforcement plate may be a rigid reinforcement plate, and the thickness of the reinforcement plate 211 is 0.1 mm to control the thickness of the fingerprint identification device 200.
  • the surface roughness (Ra) of the reinforcing plate 211 is greater than a certain threshold, such as 0.25um, to improve the imaging effect. Specifically, when the surface roughness of the reinforcing plate 211 is greater than a certain threshold, its surface can scatter light signals, which can effectively reduce the light signals emitted by the display screen and reflected inside the fingerprint identification device 200, thereby avoiding light. Reflection affects imaging. In addition, when the surface roughness of the reinforcing plate 211 is greater than a certain threshold, the reliability of the connection between the reinforcing plate 211 and other components can be increased. For example, the reliability of the connection between the reinforcing plate 211 and the circuit board 211 and the reliability of the connection between the reinforcing plate 211 and the sensor chip 201.
  • a certain threshold such as 0.25um
  • the color of the reinforcing plate 211 may be dark to increase the light absorption effect of the reinforcing plate 211, thereby preventing the upward reflected light of the reinforcing plate 211 from interfering with the light received by the fingerprint sensor chip 201 . Such as black or dark brown.
  • the window size of the second window of the reinforcing plate 211 may be larger than the window size of the third window of the circuit board 212 to expose the position of the third window.
  • the window position is provided with pins of the circuit board, and the pins of the circuit board are connected to the fingerprint sensor chip 201 through a gold wire 214.
  • the fingerprint sensor chip 201 is fixedly installed in the second window and/or the first window through the first fixing glue 215.
  • the first fixing glue 215 includes but is not limited to thermosetting glue.
  • the first fixing glue 215 is not only used to fix the fingerprint sensor chip 201 but also used to encapsulate the gold wire 214.
  • the arc height or package height of the gold wire 214 is smaller than the upper surface of the circuit board 212.
  • the arc height or package height of the gold wire 214 is less than a certain threshold, for example, the arc height or package height of the gold wire is less than 70 um.
  • the upper surface of the fingerprint identification chip 201 is lower than the upper surface of the reinforcing plate 211, thereby providing a mounting space for the gold wire 214 on the fingerprint sensor chip 201.
  • the lower surface of the fingerprint sensor chip 201 may also be provided with a coating or film 204 with a dielectric constant greater than a preset threshold for protecting the fingerprint sensor chip 201.
  • the fingerprint sensor chip 201 may be in direct contact with the upper surface of the middle frame, thereby damaging the fingerprint sensor chip 201
  • the lower surface of the circuit board 212 and the lower surface of the circuit board 212 can be on the same plane. Therefore, when the circuit board 212 is mounted on the upper surface of the middle frame, the coating or film 204 can also be It is fixedly installed on the upper surface of the middle frame. For example, as shown in FIG. 3, both the circuit board 212 and the coating or film 204 can be fixedly mounted on the upper surface of the middle frame by solid glue or liquid glue.
  • the coating or film 204 may be a coating or film with a strength greater than a certain threshold.
  • the upper surface 202 of the fingerprint sensor chip 201 is the light entrance surface of the fingerprint sensor chip 201.
  • An optical path stack 203 may be provided above the upper surface 202.
  • the optical path stack 203 includes, but is not limited to, a microlens array, which includes at least one microlens distributed in an array, and the microlens array is arranged above the fingerprint sensor chip 201 for collecting the Reflected or scattered fingerprint detection signal.
  • the microlens array is used for fingerprint detection signals whose reflection angle or scattering angle is greater than a certain threshold.
  • the fingerprint identification device 200 may also include a filter structure.
  • the filter structure may be a filter, and the filter may be disposed above the upper surface 202 of the fingerprint sensor 201.
  • the optical filter may be disposed between the upper surface 202 and the optical path stack 203, or may be disposed inside or above the optical path stack, which is not specifically limited in this application.
  • the filter may include one or more optical filters, and the one or more optical filters may be configured as, for example, a band-pass filter to allow the transmission of light emitted by the OLED screen, while blocking infrared light in sunlight and other Light components. When the fingerprint identification device 200 is used outdoors, this kind of optical filtering can effectively reduce the background light caused by sunlight.
  • One or more optical filters may be implemented as, for example, an optical filter coating formed on one or more continuous interfaces, or may be implemented as one or more discrete interfaces. It should be understood that the optical filter can be fabricated on the surface of any optical component, or along the optical path from the reflected light formed by the reflection of the finger to the fingerprint sensor chip 201.
  • the optical filter is used to reduce undesired ambient light in fingerprint sensing, so as to improve the optical sensing of the fingerprint sensor chip 201 to the received light.
  • the filter can specifically be used to filter out light of a specific wavelength, for example, near-infrared light and part of red light. For example, human fingers absorb most of the energy of light with a wavelength below 580nm. If one or more optical filters or optical filter layers are designed to filter light with wavelengths from 580nm to infrared, it can greatly reduce the impact of ambient light on fingerprints. The influence of optical detection in induction.
  • the light entrance surface of the filter may be provided with an optical inorganic coating or an organic blackened coating, so that the reflectance of the light entrance surface of the filter is lower than a first threshold, for example, 1%, so as to ensure that the The fingerprint sensor chip 201 can receive enough light signals to improve the fingerprint recognition effect.
  • a first threshold for example, 1%
  • the filter is fixed on the upper surface of the fingerprint sensor chip 201 as an example.
  • the filter and the fingerprint sensor chip 201 can be glued and fixed on the non-sensitivity area of the fingerprint sensor chip 201, and there is a gap between the filter and the photosensitive area of the fingerprint sensor chip 201.
  • the lower surface of the filter is fixed on the upper surface of the fingerprint sensor chip 201 by glue with a refractive index lower than a preset refractive index.
  • the preset refractive index includes but is not limited to 1.3.
  • the periphery of the filter and the circuit board 212 are glued and fixed.
  • the filter structure may be a filter coating, and the filter coating may be disposed on the upper surface 202 of the fingerprint sensor chip 201, or may be disposed on the optical path stack 203.
  • This application does not specifically limit it.
  • the filter coating when the filter structure is a filter, when the filter structure is a filter coating, the filter coating (Coating) can be plated on the fingerprint sensor chip 201 by a coating process
  • the upper surface 202 of the optical path stack 203 or the upper surface of the optical path stack 203 avoids the use of filters such as blue glass or white glass substrate, which not only avoids the phenomenon of Newton’s ring, thereby improving the fingerprint recognition effect, but also effectively reducing the The thickness of the fingerprint identification device 200.
  • the fingerprint identification device 200 may further include a foam layer 222 fixedly disposed on the upper surface of the circuit board 212.
  • the foam layer 222 may be fixedly arranged on the upper surface of the circuit board 212 through the second adhesive layer 223.
  • the second adhesive layer 223 is a double-sided adhesive tape. It should be understood that in other alternative embodiments, the foam layer 222 and the second adhesive layer 223 may be combined into one layer.
  • a glue layer may be formed on the lower surface of the foam layer 222 at the same time.
  • the foam layer 222 when the foam layer 222 is fixed on the upper surface of the circuit board by the double-sided adhesive, the foam layer 222 may also be provided with a fourth window, the fourth window being aligned with the first One window setting.
  • the window size of the fourth window may be smaller than or equal to the window size of the second window of the reinforcing plate 211.
  • the window size of the fourth window may be smaller than the size of the second window, and greater than or equal to the size of the light entrance surface of the fingerprint sensor chip 201 in the second window.
  • the fingerprint identification device 200 may further include a first protective layer 221.
  • the first protective layer 221 is detachably disposed on the upper surface of the foam layer 222, and the first protective layer 221 is used to protect the foam layer 222 before mounting the circuit board 212 on the middle frame. After the circuit board 212 is installed on the middle frame, the first protective layer 221 can be removed first, and then the middle frame is installed under the display screen, so that the foam layer 222 The upper surface of the display is in direct contact with the lower surface of the light-emitting layer of the display screen.
  • the first protection layer 221 may be a release film, and the release film includes but is not limited to polyethylene terephthalate (PET). Since the heavy release PET release film has better adhesion than the light release PET release film on a peelable basis, after the foam layer 222 is attached to the heavy release PET release film, It will not fall off during processing and production, which is convenient for mass production.
  • PET polyethylene terephthalate
  • the fingerprint identification device 200 may further include a second protective layer 231.
  • the second protective layer 231 is detachably disposed on the lower surface of the circuit board 212, and the second protective layer is used to carry and protect the circuit board 212 before mounting the circuit board 212 on the middle frame . After the circuit board 212 is installed on the middle frame, the second protective layer 231 can be removed first, and then the lower surface of the circuit board 212 is directly fixedly mounted on the upper surface of the middle frame.
  • the second protection layer 231 may be fixed on the lower surface of the circuit board 212 through a third adhesive layer 232 (for example, double-sided tape). Further, the second protective layer 231 can also be fixed on the lower surface of the coating or film layer 204 through the third adhesive layer 232 to increase stability, so that it will not fall off during processing and production. , Convenient for mass production. Further, the second protective layer 231 is fixed on the lower surface of the circuit board 212 or the lower surface of the coating or film layer 204 by the third adhesive layer 232 only in the middle position, so that the circuit board When the 212 is installed in the middle frame, it is convenient to peel off the second protective layer 231.
  • a third adhesive layer 232 for example, double-sided tape
  • Fig. 4 is a schematic diagram of the fingerprint shown in Fig. 3 as a disassembled part obtained after disassembly of the device.
  • the reinforcing plate 211 may also be provided with at least one through hole 2110 penetrating the reinforcing plate in the surrounding area of the second window, and the at least one through hole 2110 is used to expose the
  • the positioning mark on the circuit board is used for positioning the position of the fingerprint sensor chip 201 in the third opening.
  • the location identifier is a specific pattern or a specific structure on the circuit board 212.
  • the fingerprint sensor can be determined by the position of the specific pattern or the specific structure. The position of the chip 201 further improves the mounting accuracy of the fingerprint sensor chip 201.
  • the fingerprint identification device 200 may further include an image processor 240.
  • the circuit board 212 is electrically connected to the image processor 240.
  • the image processor 240 may be specifically a microprocessor (Micro Processing Unit, MCU) for receiving fingerprint detection signals (for example, fingerprint images) sent from the fingerprint sensor chip 201 through the circuit board 212, and checking The fingerprint detection signal is simply processed.
  • MCU Micro Processing Unit
  • the image processor 240 may include at least one capacitor, and the at least one capacitor is disposed on the image processor 240 for optimizing the fingerprint detection signal collected by the fingerprint sensor chip 201.
  • the at least one capacitor is used to filter the fingerprint detection signal collected by the fingerprint sensor chip 201.
  • the fingerprint sensor chip 201 may correspond to one or more capacitors.
  • the fingerprint identification device 200 may also include a connector 250 for connecting with an external device or other components of the electronic device where the fingerprint identification device 200 is located, so as to realize the The communication of the external device or the communication of other components of the electronic device.
  • the connector 250 may be used to connect the processor of the electronic device, so that the processor of the electronic device receives the fingerprint detection signal processed by the image processor 240, and based on the processed signal Fingerprint detection signal for fingerprint identification.
  • FIG. 3 and FIG. 4 are only an example of the present application, and should not be construed as a limitation to the embodiment of the present application.
  • the reinforcing plate 211, the first adhesive layer 213, and the circuit board 212 can be replaced with other types of components.
  • FIG. 5 is another schematic diagram of the fingerprint identification device of the embodiment of the present application.
  • the reinforcing plate 211, the first adhesive layer 213, and the circuit board 212 shown in FIG. 4 can be replaced with a substrate 216.
  • the substrate 216 can be used as a supporting plate.
  • the fingerprint sensor 201 can be located after the substrate 216 is mounted on the middle frame of the electronic device. Below the display screen of the electronic device, the fingerprint recognition under the screen is realized.
  • the fingerprint sensor chip 201 may be fixed in the first opening window by a second fixing glue 219.
  • the second fixing glue 219 includes, but is not limited to, plastic molding glue.
  • a wiring layer may be provided inside the substrate 216, and the fingerprint sensor chip 201 may be connected to the wiring layer through a gold wire 214.
  • the arc height or package height of the gold wire is smaller than a certain threshold, for example, the arc height or package height of the gold wire may be less than 70um.
  • the fingerprint identification device 200 may further include a circuit board 218.
  • the circuit board 218 may be fixedly connected to the substrate 216 through an electroconductive adhesive 217.
  • the conductive adhesive 217 may be an adhesive that has certain conductivity after curing or drying.
  • the circuit board 218 may be a circuit board of any component, for example, a circuit board of the display screen or a circuit board of the fingerprint sensor chip 201.
  • the circuit board 218 may share a circuit board for the display screen and the fingerprint sensor chip 201 to simplify the structure of the electronic device.
  • the substrate 216 is formed with a first groove extending upward at the position of the window on the lower surface of the first window, and the first groove is used to expose the wiring layer of the substrate 216, so
  • the fingerprint sensor chip 201 may be electrically connected to the wiring layer of the substrate 216 through the first groove.
  • the wiring layer exposed in the first groove may be provided with pads or solder balls for electrical connection to the fingerprint sensor chip 201.
  • the first groove is a groove formed by extending upward from the position of the window of the substrate 216 on the lower surface of the first window, therefore, the fingerprint sensor chip
  • the pins of 201 are arranged on the lower surface of the fingerprint sensor chip 201 so as to be electrically connected to the substrate 216.
  • the fingerprint sensor chip 201 may be provided with Through Silicon Via (TSV) and/or Redistribution Layer (RDL), and the TSV and/or RDL are used for The pins of the fingerprint sensor chip 201 are guided from the upper surface to the lower surface.
  • TSV Through Silicon Via
  • RDL Redistribution Layer
  • a wiring layer 205 may be formed on the lower surface of the fingerprint sensor chip 201.
  • the wiring layer 205 can be electrically connected to the wiring layer in the first groove of the substrate 216 through a gold wire 214.
  • the fingerprint sensor chip 201 may also form a protective layer 206 on the surface of the wiring layer to protect and insulate the fingerprint sensor chip 201.
  • Fig. 6 is a schematic diagram of the fingerprint shown in Fig. 5 being a disassembled part obtained by disassembling the device.
  • a step 2161 extending downward is formed on the edge of the upper surface of the substrate 216, and a pin 2162 of the substrate 216 is provided on the step 2161.
  • the pins 2162 of the substrate 216 can be electrically connected to the pins of the circuit board 218 through the conductive glue 217, so as to realize the communication between the circuit board 218 and the substrate 216.
  • the positioning mark of the substrate 216 can be directly used to locate the fingerprint sensor chip 201 The position within the first window.
  • FIG. 7 is another schematic structural diagram of a fingerprint identification device 200 according to an embodiment of the present application.
  • the fingerprint identification device may include a substrate 216, and the fingerprint sensor chip 201 may be fixed in the first opening window by a third fixing glue 2110.
  • the third fixing glue 2110 includes but is not limited to thermosetting glue and molding glue.
  • the substrate 216 is formed with a second groove extending downward at the position of the window on the upper surface of the first window, and the second groove is used to expose the wiring layer of the substrate 216, and the fingerprint sensor chip 201 It is electrically connected to the wiring layer of the substrate 216. Furthermore, the lower surface of the fingerprint sensor chip 201 is provided with a coating or film 204 with a dielectric constant greater than a preset threshold value to protect the fingerprint sensor chip 201.
  • the fingerprint sensor chip 201 may also be fixed on the back cover of the electronic device or other components such as the battery through the support plate, so that the fingerprint sensor chip 201 is disposed on the electronic device. Below the display.
  • the positions of the reinforcing plate 211 and the circuit board 212 can also be interchanged, that is, the reinforcing plate 211 can pass through the first adhesive layer 213 Fixed under the circuit board.
  • the embodiment of the present application also provides an electronic device with a display screen.
  • the electronic device may include the fingerprint identification device 200 described above.
  • the fingerprint identification device 200 may be located under the display screen for performing screen Fingerprint recognition.
  • FIG. 8 and 9 are schematic diagrams of an electronic device 300 including the fingerprint identification device 200 of FIG. 3.
  • the electronic device 300 may include a middle frame 310.
  • the middle frame 310 is used to support the display screen of the electronic device.
  • a third groove is formed on the upper surface of the middle frame 310 extending downward, and the third groove is used to accommodate the fingerprint identification device 200.
  • the second protective layer 231 of the fingerprint identification device 200 is peeled off, so that the circuit board 212 passes through the third adhesive layer 232 (for example, double The surface glue) is fixed on the upper surface of the middle frame.
  • the third adhesive layer 232 for example, double The surface glue
  • the display screen may include a light emitting layer 320 and a light shielding plate 330.
  • the light-shielding plate 330 is arranged under the light-emitting layer 320, and the light-shielding plate 330 is provided with an opening.
  • the fingerprint identification device 200 receives the light-emitting layer 320 through the opening and is formed after being reflected by a human finger The optical signal is used for fingerprint identification.
  • the gap can be an air gap that is not filled with any auxiliary materials, which can ensure that the fingerprint sensor 201 does not touch the bottom surface of the display when the display is pressed or the electronic device falls or collides. The stability and performance of fingerprint recognition of the fingerprint sensor 201 will not be affected.
  • the light-emitting layer 320 may be the light-emitting layer of the display screen.
  • the light-emitting layer 320 may be an OLED organic light-emitting panel made by low temperature poly-silicon (LTPS) technology. Light weight, low power consumption, can be used to provide clearer images.
  • LTPS low temperature poly-silicon
  • the gap may be less than or equal to a preset threshold, and the preset threshold includes but is not limited to 600um.
  • the light-shielding plate 330 can also be used as a screen print layer or an embossing layer.
  • the screen print layer can have graphics and text, and the graphics and text can be used as logos such as trademark patterns.
  • the light shielding plate 330 may be a black sheet layer or a printed layer for shielding light.
  • the display screen may also include a protective layer for protecting the display screen. Similar to the light-shielding plate 330, the protective layer is also provided with a window through which the fingerprint identification device 200 receives the light signal emitted by the light-emitting layer 320 and is reflected by a human finger. The signal is used for fingerprint identification.
  • the protective layer may also be referred to as a cushion layer or a rear panel, or the shading plate 330 and the protective layer may be combined into one layer.
  • the protective layer may further include a heat dissipation layer.
  • the protective layer may include at least a part of the heat dissipation layer formed of a metal material.
  • the display screen may further include a wiring layer, which may include wiring for electrical connection of the fingerprint sensor chip 201 and/or the display screen.
  • the display screen may also include a polarizer (Polarizer, POL). Polarizers can also be called polarizers and are used to generate polarized light. The polarized light is used for optical signal imaging.
  • the display screen may further include a cover glass for protecting the display screen. The cover glass and the polarizer may be bonded by optically clear adhesive (OCA).
  • OCA optically clear adhesive
  • the OCA can be a double-sided adhesive tape without a matrix material formed by making optical acrylic glue without a substrate, and then laminating a release film on the upper and lower bottom layers. That is, the OCA can be an optical Transparent layer of double-sided adhesive without substrate.
  • the display screen may be a soft screen or a hard screen, and the display screen may include laminated layers such as a screen print layer and a protective layer.
  • the OLED screen will leak light downwards after opening the holes in the above-mentioned layers.
  • the finger When a finger is placed above the bright OLED screen, the finger will reflect the light emitted by the OLED screen, and this reflected light will penetrate the OLED screen to the bottom of the OLED screen.
  • the filter structure located below the OLED screen can be used to filter out the infrared signal components in the leaked light. Since the fingerprint is a diffuse reflector, the light signal formed by the reflection or diffusion of the finger will exist in all directions.
  • a microlens array (Microlens Array) arranged between the bottom of the OLED screen and the fingerprint sensor chip can collect the light signals leaking from the top of the OLED screen.
  • the fingerprint sensor chip 201 performs imaging of a fingerprint image by receiving a light signal that filters out red light.
  • the light signals leaking from the top of the OLED screen include fingerprint signals and internal structure signals of the screen, and the internal structure signals of the screen will affect the imaging of the fingerprint image, for example, moiré fringes are generated when imaging the fingerprint image.
  • the distance between the fingerprint sensor chip 201 and the OLED screen (for example, the lower surface of the light-emitting layer 320) can be within 600um, so that the screen
  • the imaging of the structure is blurred, but the imaging of the fingerprint structure is not affected. Since the smaller the distance between the fingerprint sensor chip 201 and the OLED screen, the better the fingerprint recognition performance. Therefore, under the premise of reliability and process capability, the gap between the fingerprint sensor chip 201 and the OLED screen can be minimized as much as possible. distance.
  • the units can be implemented by electronic hardware, computer software, or a combination of both, in order to clearly illustrate the interchangeability of hardware and software.
  • the composition and steps of each example have been described generally in terms of function. Whether these functions are executed by hardware or software depends on the specific application and design constraint conditions of the technical solution. Professionals and technicians can use different methods for each specific application to implement the described functions, but such implementation should not be considered beyond the scope of this application.
  • the disclosed system and device may be implemented in other ways.
  • the device embodiments described above are only illustrative.
  • the division of the units is only a logical function division, and there may be other divisions in actual implementation, for example, multiple units or components can be combined or It can be integrated into another system, or some features can be ignored or not implemented.
  • the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may also be electrical, mechanical or other forms of connection.
  • the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the objectives of the solutions of the embodiments of the present application.
  • the functional units in the various embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units may be integrated into one unit.
  • the above-mentioned integrated unit can be implemented in the form of hardware or software functional unit.
  • the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer readable storage medium.
  • the technical solution of the present application is essentially or the part that contributes to the existing technology, or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a
  • the storage medium includes several instructions to enable a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present application.
  • the aforementioned storage media include: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disk or optical disk and other media that can store program code .

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Abstract

提供了一种指纹识别装置和电子设备，所述指纹识别装置应用在具有显示屏的电子设备，所述指纹识别装置包括：至少一个指纹传感器芯片；支撑板，所述支撑板设置有第一开窗，所述至少一个指纹传感器芯片固定设置在所述第一开窗内。本申请实施例中，通过将所述至少一个指纹传感器芯片设置在所述支撑板的第一开窗内，不仅能够降低电子设备的成本和复杂度，提高了可维修性。尤其针对多个指纹传感器芯片的场景下，能够有效降低电子设备的成本和复杂度，大大提高了可维修性。此外，能够有效降低所述指纹识别装置的厚度。

Description

指纹识别装置和电子设备 技术领域
本申请实施例涉及电子领域，并且更具体地，涉及指纹识别装置和电子设备。
背景技术
目前，屏下指纹识别方案是指将光学或超声波指纹识别模组贴合在有机发光二极管(Organic Light-Emitting Diode，OLED)屏幕的底部，也就是不管光学指纹识别模组还是超声波指纹识别模组都需要和屏幕底部发光层紧密粘结在一起。
但是，由于OLED屏幕成本很高，且很脆弱，因此将指纹识别模组直接贴合至OLED屏幕时很容易弄坏OLED屏幕。此外，由于指纹识别模组和OLED屏幕完全粘在一起，如出现指纹识别模组损坏，在拆卸指纹识别模组时很容易损坏OLED屏幕。而且，将指纹识别模组直接贴合到OLED屏幕的贴合工艺也比较复杂。
由于以上问题，大大增加了电子设备的成本和复杂度，可维修性低。
发明内容
提供了一种指纹识别装置和电子设备，能够降低电子设备的成本和复杂度，提高了可维修性。特别地针对多个指纹传感器芯片的场景下，能够有效降低电子设备的成本和复杂度，大大提高了可维修性。此外，能够有效降低所述指纹识别装置的厚度。
第一方面，提供了一种指纹识别装置，应用在具有显示屏的电子设备，所述指纹识别装置包括：
至少一个指纹传感器芯片；
支撑板，所述支撑板设置有第一开窗，所述至少一个指纹传感器芯片固定设置在所述第一开窗内；
其中，所述支撑板用于安装在所述电子设备的中框，以使所述至少一个指纹指纹传感器芯片位于所述电子设备的显示屏的下方，所述至少一个指纹指纹传感器芯片用于接收经由所述显示屏上方的人体手指反射或散射而返 回的指纹检测信号，所述指纹检测信号用来检测所述手指的指纹信息。
本申请实施例中，所述至少一个指纹传感器芯片固定安装于所述支撑板后，可以通过所述支撑板将所述至少一个指纹传感器芯片固定安装于电子设备的显示屏的下方，避免了将所述至少一个指纹传感器芯片直接贴合在所述电子设备的显示屏上，能够降低所述至少一个指纹传感器芯片的安装难度和复杂度，并提高可维修性。尤其针对所述至少一个指纹传感器芯片包括多个芯片的场景下，可以将所述多个芯片一次性固定安装于显示屏的下方，能够降低安装复杂度，并提高安装效率。此外，通过在所述支撑板设置所述第一开窗，并将所述至少一个指纹传感器芯片安装在所述第一开窗内，能够有效减低所述指纹识别装置的厚度。
第二方面，提供了一种电子设备，包括：
显示屏和第一方面所述的指纹识别装置；其中，所述指纹识别装置设置在所述显示屏的下方以实现屏下指纹检测。
附图说明
图1是本申请可以适用的电子设备的平面示意图。
图2是图1所示的电子设备的侧剖面示意图。
图3至图7是本申请实施例的指纹识别装置的示意性结构图。
图8是本申请实施例的将指纹识别装置安装在电子设备的中框后形成的示意性结构图。
图9是将图8所示的结构安装在电子设备的显示屏后形成的示意性结构图。
具体实施方式
下面将结合附图，对本申请实施例中的技术方案进行描述。
本申请实施例的技术方案可以应用于各种电子设备。
例如，智能手机、笔记本电脑、平板电脑、游戏设备等便携式或移动计算设备，以及电子数据库、汽车、银行自动柜员机(Automated Teller Machine，ATM)等其他电子设备。但本申请实施例对此并不限定。
本申请实施例的技术方案可以用于生物特征识别技术。其中，生物特征识别技术包括但不限于指纹识别、掌纹识别、虹膜识别、人脸识别以及活体 识别等识别技术。为了便于说明，下文以指纹识别技术为例进行说明。
本申请实施例的技术方案可以用于屏下指纹识别技术和屏内指纹识别技术。
屏下指纹识别技术是指将指纹识别模组安装在显示屏下方，从而实现在显示屏的显示区域内进行指纹识别操作，不需要在电子设备正面除显示区域外的区域设置指纹采集区域。具体地，指纹识别模组使用从电子设备的显示组件的顶面返回的光来进行指纹感应和其他感应操作。这种返回的光携带与显示组件的顶面接触的物体(例如手指)的信息，位于显示组件下方的指纹识别模组通过采集和检测这种返回的光以实现屏下指纹识别。其中，指纹识别模组的设计可以为通过恰当地配置用于采集和检测返回的光的光学元件来实现期望的光学成像。
相应的，屏内(In-display)指纹识别技术是指将指纹识别模组或者部分指纹识别模组安装在显示屏内部，从而实现在显示屏的显示区域内进行指纹识别操作，不需要在电子设备正面除显示区域外的区域设置指纹采集区域。
图1和图2示出了屏下指纹识别技术可以适用的电子设备100的示意图，其中图1为电子设备100的正面示意图，图2为图1所示的电子设备100的部分剖面结构示意图。
如图1和图2所示，电子设备100可以包括显示屏120和指纹识别模组140。
显示屏120可以为自发光显示屏，其采用具有自发光的显示单元作为显示像素。比如显示屏120可以为有机发光二极管(Organic Light-Emitting Diode，OLED)显示屏或者微型发光二极管(Micro-LED)显示屏。在其他可替代实施例中，显示屏120也可以为液晶显示屏(Liquid Crystal Display,LCD)或者其他被动发光显示屏，本申请实施例对此不做限制。
此外，显示屏120还可以具体为触控显示屏，其不仅可以进行画面显示，还可以检测用户的触摸或者按压操作，从而为用户提供一个人机交互界面。比如，在一种实施例中，电子设备100可以包括触摸传感器，所述触摸传感器可以具体为触控面板(Touch Panel,TP)，其可以设置在所述显示屏120表面，也可以部分集成或者整体集成到所述显示屏120内部，从而形成所述触控显示屏。
指纹识别模组140可以为光学指纹识别模组，比如光学指纹传感器。
具体来说，指纹识别模组140可以包括具有光学感应阵列的指纹传感器芯片(后面也称为光学指纹传感器)。其中，光学感应阵列包括多个光学感应单元，每个光学感应单元可以具体包括光探测器或者光电传感器。或者说，指纹识别模组140可以包括光探测器(Photo detector)阵列(或称为光电探测器阵列、光电传感器阵列)，其包括多个呈阵列式分布的光探测器。
如图1所示，指纹识别模组140可以设置在所述显示屏120的下方的局部区域，从而使得指纹识别模组140的指纹采集区域(或检测区域)130至少部分位于所述显示屏120的显示区域102内。
当然，在其他可替代实施例中，指纹识别模组140也可以设置在其他位置，比如显示屏120的侧面或者电子设备100的边缘非透光区域。这种情况下，可以通过光路设计将显示屏120的至少部分显示区域的光信号导引到指纹识别模组140，从而使得所述指纹采集区域130实际上位于所述显示屏120的显示区域内。
在本申请的一些实施例中，指纹识别模组140可以仅包括一个指纹传感器芯片，此时指纹识别模组140的指纹采集区域130的面积较小且位置固定，因此用户在进行指纹输入时需要将手指按压到所述指纹采集区域130的特定位置，否则指纹识别模组140可能无法采集到指纹图像而造成用户体验不佳。
在本申请的另一些实施例中，指纹识别模组140可以具体包括多个指纹传感器芯片；所述多个指纹传感器芯片可以通过拼接方式并排设置在所述显示屏120的下方，且所述多个指纹传感器芯片的感应区域共同构成所述指纹识别模组140的指纹采集区域130。也即是说，所述指纹识别模组140的指纹采集区域130可以包括多个子区域，每个子区域分别对应于其中一个指纹传感器芯片的感应区域，从而将所述光学指纹模组130的指纹采集区域130可以扩展到所述显示屏的下半部分的主要区域，即扩展到手指惯常按压区域，从而实现盲按式指纹输入操作。可替代地，当所述指纹传感器芯片数量足够时，所述指纹检测区域130还可以扩展到半个显示区域甚至整个显示区域，从而实现半屏或者全屏指纹检测。
应理解，本申请实施例对所述多个指纹传感器芯片的具体形式不做限定。
例如，所述多个指纹传感器芯片可以分别是独立封装的指纹传感器芯片，也可以是封装在同一个芯片封装体内的多个芯片(Die)。
又例如，还可以通过半导体工艺在同一个芯片(Die)的不同区域上制作形成所述多个指纹传感器芯片。
如图2所示，指纹识别模组140的光学感应阵列的所在区域或者光感应范围对应所述指纹识别模组140的指纹采集区域130。其中，指纹识别模组140的指纹采集区域130可以等于或不等于指纹识别模组140的光学感应阵列的所在区域的面积或者光感应范围，本申请实施例对此不做具体限定。
例如，通过光线准直的光路设计，指纹识别模组140的指纹采集区域130可以设计成与所述指纹识别模组140的感应阵列的面积基本一致。
又例如，通过汇聚光线的光路设计或者反射光线的光路设计，可以使得所述指纹识别模组140的指纹采集区域130的面积大于所述指纹识别模组140感应阵列的面积。
下面对指纹识别模组140的光路设计进行示例性说明。
以指纹识别模组140的光路设计采用具有高深宽比的通孔阵列的光学准直器为例，所述光学准直器可以具体为在半导体硅片制作而成的准直器(Collimator)层，其具有多个准直单元或者微孔，所述准直单元可以具体为小孔，从手指反射回来的反射光中，垂直入射到所述准直单元的光线可以穿过并被其下方的指纹传感器芯片接收，而入射角度过大的光线在所述准直单元内部经过多次反射被衰减掉，因此每一个指纹传感器芯片基本只能接收到其正上方的指纹纹路反射回来的反射光，能够有效提高图像分辨率，进而提高指纹识别效果。
进一步地，当指纹识别模组140包括多个指纹传感器芯片时，可以为每个指纹传感器芯片的光学感应阵列中的一个光学感应单元配置一个准直单元，并贴合设置在其对应的光学感应单元的上方。当然，所述多个光学感应单元也可以共享一个准直单元，即所述一个准直单元具有足够大的孔径以覆盖多个光学感应单元。由于一个准直单元可以对应多个光学感应单元，破坏了显示屏120的空间周期和指纹传感器芯片的空间周期的对应性，因此，即使显示屏120的发光显示阵列的空间结构和指纹传感器芯片的光学感应阵列的空间结构类似，也能够有效避免指纹识别模组140利用经过显示屏120的光信号进行指纹成像生成莫尔条纹，有效提高了指纹识别模组140的指纹识别效果。
以指纹识别模组140的光路设计采用光学镜头的光路设计为例，所述光 学镜头可以包括光学透镜(Lens)层，其具有一个或多个透镜单元，比如一个或多个非球面透镜组成的透镜组，其用于将从手指反射回来的反射光汇聚到其下方的指纹传感器芯片的感应阵列，以使得所述感应阵列可以基于所述反射光进行成像，从而得到所述手指的指纹图像。所述光学透镜层在所述透镜单元的光路中还可以形成有针孔，所述针孔可以配合所述光学透镜层扩大指纹识别模组140的视场，以提高所述指纹识别模组140的指纹成像效果。
进一步地，当指纹识别模组140包括多个指纹传感器芯片时，可以为每一个指纹传感器芯片配置一个光学镜头进行指纹成像，或者为多个指纹传感器芯片配置一个光学镜头来实现光线汇聚和指纹成像。甚至于，当一个指纹传感器芯片具有两个感应阵列(Dual Array)或多个感应阵列(Multi-Array)时，也可以为这个指纹传感器芯片配置两个或多个光学镜头配合所述两个感应阵列或多个感应阵列进行光学成像，从而减小成像距离并增强成像效果。
以指纹识别模组140的光路设计采用微透镜(Micro-Lens)层的光路设计为例，所述微透镜层可以具有由多个微透镜形成的微透镜阵列，其可以通过半导体生长工艺或者其他工艺形成在所述指纹传感器芯片的感应阵列上方，并且每一个微透镜可以分别对应于所述感应阵列的其中一个感应单元。所述微透镜层和所述感应单元之间还可以形成其他光学膜层，比如介质层或者钝化层，更具体地，所述微透镜层和所述感应单元之间还可以包括具有微孔的挡光层，其中所述微孔形成在其对应的微透镜和感应单元之间，所述挡光层可以阻挡相邻微透镜和感应单元之间的光学干扰，并使光线通过所述微透镜汇聚到所述微孔内部并经由所述微孔传输到所述微透镜对应的感应单元，以进行光学指纹成像。
应当理解，上述光路引导结构的几种实现方案可以单独使用也可以结合使用，比如，可以在所述准直器层或者所述光学透镜层下方进一步设置微透镜层。当然，在所述准直器层或者所述光学透镜层与所述微透镜层结合使用时，其具体叠层结构或者光路可能需要按照实际需要进行调整。
指纹识别模组140可以用于采集用户的指纹信息(比如指纹图像信息)。
以显示屏120采用OLED显示屏为例，显示屏120可以采用具有自发光显示单元的显示屏，比如有机发光二极管(Organic Light-Emitting Diode，OLED)显示屏或者微型发光二极管(Micro-LED)显示屏。指纹识别模组140可以利用OLED显示屏的位于指纹采集区域130的显示单元(即OLED 光源)来作为光学指纹检测的激励光源。
当手指触摸、按压或者接近(为便于描述，在本申请中统称为按压)在指纹采集区域130时，显示屏120向指纹采集区域130上方的手指发出一束光，这一束光在手指的表面发生反射形成反射光或者经过手指的内部散射后而形成散射光，在相关专利申请中，为便于描述，上述反射光和散射光统称为反射光。由于指纹的嵴(ridge)与峪(vally)对于光的反射能力不同，因此，来自指纹嵴的反射光和来自指纹峪的发生过具有不同的光强，反射光经过显示屏120后，被指纹识别模组140中的指纹传感器芯片所接收并转换为相应的电信号，即指纹检测信号；基于所述指纹检测信号便可以获得指纹图像数据，并且可以进一步进行指纹匹配验证，从而在所述电子设备100实现光学指纹识别功能。
由此可见，用户需要对电子设备100进行指纹解锁或者其他指纹验证的时候，只需要将手指按压在位于显示屏120的指纹采集区域130，便可以实现指纹特征的输入操作。由于指纹特征的采集可以在显示屏120的显示区域102的内部实现，采用上述结构的电子设备100无需其正面专门预留空间来设置指纹按键(比如Home键)，因而可以采用全面屏方案。因此，所述显示屏120的显示区域102可以基本扩展到所述电子设备100的整个正面。
当然，在其他替代方案中，指纹识别模组140也可以采用内置光源或者外置光源来提供用于进行指纹检测识别的光信号。在这种情况下，指纹识别模组140不仅可以适用于如OLED显示屏等自发光显示屏，还可以适用于非自发光显示屏，比如液晶显示屏或者其他的被动发光显示屏。
以应用在具有背光模组和液晶面板的液晶显示屏为例，为支持液晶显示屏的屏下指纹检测，电子设备100的光学指纹系统还可以包括用于光学指纹检测的激励光源，所述激励光源可以具体为红外光源或者特定波长非可见光的光源，其可以设置在所述液晶显示屏的背光模组下方或者设置在电子设备100的保护盖板下方的边缘区域，而指纹识别模组140可以设置液晶面板或者保护盖板的边缘区域下方并通过光路引导以使得指纹检测光可以到达所述指纹识别模组140；或者，指纹识别模组140也可以设置在所述背光模组下方，且所述背光模组通过对扩散片、增亮片、反射片等膜层进行开孔或者其他光学设计以允许指纹检测光穿过液晶面板和背光模组并到达指纹识别模组140。当采用所述指纹识别模组140采用内置光源或者外置光源来提供 用于进行指纹检测的光信号时，其检测原理可以相同。
如图1所示，电子设备100还可以包括保护盖板110。
盖板110可以具体为透明盖板，比如玻璃盖板或者蓝宝石盖板，其位于显示屏120的上方并覆盖所述电子设备100的正面，且盖板110表面还可以设置有保护层。因此，本申请实施例中，所谓的手指按压显示屏120实际上可以是指手指按压在显示屏120上方的盖板110或者覆盖所述盖板110的保护层表面。
如图1所示，指纹识别模组140的下方还可以设置有电路板150，比如软性电路板(Flexible Printed Circuit，FPC)。
指纹识别模组140可以通过焊盘焊接到电路板150，并通过电路板150实现与其他外围电路或者电子设备100的其他元件的电性互连和信号传输。比如，指纹识别模组140可以通过电路板150接收电子设备100的处理单元的控制信号，并且还可以通过电路板150将来自指纹识别模组140的指纹检测信号输出给电子设备100的处理单元或者控制单元等。
在某些实施例中，指纹识别装置140可以直接固定贴合在显示屏120的下表面。
但是，由于显示屏120成本很高，且很脆弱，因此将指纹识别模组140直接贴合至显示屏120时很容易弄坏显示屏120。
此外，由于指纹识别模组140和显示屏120完全粘在一起，如出现指纹识别模组140损坏，在拆卸指纹识别模组140时很容易损坏显示屏120。
并且，将指纹识别模组140直接贴合到显示屏120的贴合工艺也比较复杂。
由于以上问题，大大增加了电子设备100的成本和复杂度，可维修性低。
本申请提供了一种指纹识别装置，能够降低电子设备100的成本和复杂度，提高了可维修性。
在本申请中，所述指纹识别装置可以包括至少一个指纹传感器芯片和支撑板，所述支撑板设置有第一开窗，所述至少一个指纹传感器芯片固定设置在所述第一开窗内；其中，所述支撑板用于安装在所述电子设备的中框，以使所述至少一个指纹指纹传感器芯片位于所述电子设备的显示屏的下方，所述至少一个指纹指纹传感器芯片用于接收经由所述显示屏上方的人体手指反射或散射而返回的指纹检测信号，所述指纹检测信号用来检测所述手指的 指纹信息。
所述支撑板可以包括电路板或者包括设置有布线层的基板，由此，能够使得所述至少一个指纹传感器芯片连接至所述电路板，或者使得所述至少一个传感器芯片可以通过所述基板的布线层与外部的电路板相连，进而实现所述至少一个指纹传感器芯片的功能。
下面结合图3至图9详细说明本申请实施例的指纹识别装置200以及电子设备300。
需要说明的是，为便于说明，在本申请实施例中，相同的附图标记用于表示相同的部件，并且为了简洁，在不同实施例中，省略对相同部件的详细说明。
图3和图4是本申请实施例的指纹识别装置的示意性结构图。
如图3所示，指纹识别装置200包括指纹传感器芯片201、补强板211和电路板212。所述电路板212固定设置在所述补强板211的下方，所述补强板211和所述电路板212组成支撑板，用于支撑所述指纹传感器芯片201。所述补强板211设置有第二开窗。所述电路板212设置有第三开窗。所述补强板211的第二开窗和所述电路板212的第三开窗组成所述支撑板的第一开窗。所述第二开窗和所述第三开窗不仅用于为所述指纹传感器芯片201提供容纳空间，还用于固定所述指纹传感器芯片201。
此外，所述指纹传感器芯片201电连接至所述电路板212，即所述指纹传感器芯片201可以通过所述电路板212连接至外部装置或部件。
所述补强板211的下表面和所述电路板212的上表面固定连接。例如，所述补强板211的下表面和所述电路板212的上表面之间可以设置有第一胶层213，用于固定连接所述补强板211和所述电路板212。所述第一胶层213可以是任一具有粘贴性质的固体胶或液体胶。
其中，所述电路板212用于安装在电子设备显示屏的下方，例如，电子设备的中框的上表面，以使所述指纹传感器芯片201位于所述显示屏的下方。所述指纹传感器芯片201用于接收经由所述显示屏上方的人体手指反射或散射而返回的指纹检测信号，所述指纹检测信号用来检测所述手指的指纹信息。例如，所述指纹传感器芯片201可以通过所述电路板212设置在电子设备的显示屏的中间区域的下方，以符合用户的使用习惯，便于用户握持。
所述指纹传感器芯片201可以包括一个或者多个光学指纹传感器芯片。 每个光学指纹传感器芯片可以包括一个或者多个光学指纹传感器或者光学指纹传感器阵列。
所述指纹传感器芯片201包括多个光学指纹传感器芯片时，所述多个光学指纹传感器芯片可以通过并排设置的方式在所述支撑板的第一开窗内，以拼接成一个光学指纹传感器芯片组件。
所述补强板211包括但不限于金属补强板，所述补强板211的厚度范围可以为0.075mm～0.3mm。例如，所述金属补强板可以为刚性补强板，所述补强板211的厚度为0.1mm，以控制所述指纹识别装置200的厚度。
所述补强板211的表面粗糙度(Ra)大于某一阈值，比如0.25um，以提高成像效果。具体地，补强板211的表面粗糙度大于某一阈值时，其表面可以将光信号进行散射，能够有效减少显示屏发出的并在指纹识别装置200的内部发生反射的光信号，进而避免光反射对成像造成影响。此外，补强板211的表面粗糙度大于某一阈值时，可以增加所述补强板211与其他部件之间的连接可靠度。例如，所述补强板211与所述所述电路板211之间的连接可靠度以及所述补强板211所述传感器芯片201之间的连接可靠度。
所述补强板211的颜色可以为深色，以增加所述补强板211的吸光效果，进而避免所述补强板211向上反射的光线对所述指纹传感器芯片201接收到的光线产生干扰。比如黑色或深棕色。
请继续参见图3，所述补强板211的所述第二开窗的窗口尺寸可以大于所述电路板212的第三开窗的窗口尺寸，以露出所述第三开窗的窗口位置，所述窗口位置设置有所述电路板的引脚，所述电路板的引脚通过金线214连接至所述指纹传感器芯片201。
所述指纹传感器芯片201通过第一固定胶215固定安装在所述第二开窗和/或所述第一开窗内。所述第一固定胶215包括但不限于热固胶。所述第一固定胶215不仅用于固定所述指纹传感器芯片201，还用于封装所述金线214。可选地，所述金线214的弧高或者封装高度小于所述电路板212的上表面。
在一种实现方式中，所述金线214的弧高或封装高度小于某一阈值，例如所述金线的弧高或封装高度小于70um。在另一种实现方式中，所述指纹识别芯片201的上表面低于所述补强板211的上表面，由此，为所述金线214在所述指纹传感器芯片201提供安装空间。
请继续参见图3，所述指纹传感器芯片201的下表面还可以设置有介电常数大于预设阈值的涂层或膜层204，用于保护所述指纹传感器芯片201。
具体地，将所述电路板212安装至电子设备的中框的上表面时，所述指纹传感器芯片201有可能会和所述中框的上表面直接接触，进而存在损坏所述指纹传感器芯片201的风险，通过在所述指纹传感器芯片201的下表面设置介电常数大于预设阈值的涂层或膜层204，能够有效的保护所述指纹传感器芯片201，甚至所述涂层或膜层204的下表面和所述电路板212的下表面可以在同一平面上，由此，将所述电路板212安装至所述中框的上表面时，可以将所述涂层或膜层204的也固定安装在所述中框的上表面上。例如，如图3所示，所述电路板212以及所述涂层或膜层204均可以通过固态胶或液态胶固定安装在所述中框的上表面。可选地，所述涂层或膜层204可以是强度大于某一阈值的涂层或膜层。
请继续参见图3，所述指纹传感器芯片201的上表面202为所述指纹传感器芯片201的进光面。在所述上表面202的上方可以设置有光路叠层203。所述光路叠层203包括但不限于微透镜阵列，所述微透镜阵列包括成阵列分布的至少一个微透镜，所述微透镜阵列设置在所述指纹传感器芯片201的上方，用于收集经由手指反射或散射的指纹检测信号。例如，所述微透镜阵列用于反射角度或者散射角度大于某一阈值的指纹检测信号。
此外，所述指纹识别装置200还可以包括滤光结构。
在一种实现方式中，所述滤光结构可以是滤光片，所述滤光片可以设置在所述指纹传感器201的上表面202的上方。例如，所述滤光片可以设置在所述上表面202和所述光路叠层203之间，也可以设置在所述光路叠层内部或者上方，本申请对此不做具体限定。
所述滤光片可以包括一个或多个光学过滤器，一个或多个光学过滤器可以配置为例如带通过滤器，以允许OLED屏发射的光的传输，同时阻挡太阳光中的红外光等其他光组分。当在室外使用屏下所述指纹识别装置200时，这种光学过滤可以有效地减少由太阳光造成的背景光。一个或多个光学过滤器可以实现为例如光学过滤涂层，光学过滤涂层形成在一个或多个连续界面上，或可以实现为一个或多个离散的界面上。应理解，滤光片可以制作在任何光学部件的表面上，或者沿着到经由手指反射形成的反射光至成所述指纹传感器芯片201的光学路径上。
本申请实施例中，滤光片用于来减少指纹感应中的不期望的环境光，以提高所述指纹传感器芯片201对接收到的光的光学感应。滤光片具体可以用于过滤掉特定波长的光，例如，近红外光和部分的红光等。例如，人类手指吸收波长低于580nm的光的能量中的大部分，如果一个或多个光学过滤器或光学过滤层被设计为过滤波长从580nm至红外的光，则可以大大减少环境光对指纹感应中的光学检测的影响。
此外，所述滤光片的进光面可以设置有光学无机镀膜或有机黑化涂层，以使得滤光片的进光面的反射率低于第一阈值，例如1％，从而能够保证所述指纹传感器芯片201能够接收到足够的光信号，进而提升指纹识别效果。
所述滤光片固定在指纹传感器芯片201的上表面为例。所述滤光片和所述指纹传感器芯片201可以在所述指纹传感器芯片201的非感光区域进行点胶固定，且所述滤光片和所述指纹传感器芯片201的感光区域之间存在间隙。或者所述滤光片的下表面通过折射率低于预设折射率的胶水固定在所述指纹传感器芯片201的上表面，例如，所述预设折射率包括但不限于1.3。或者所述滤光片的周边和所述电路板212之间进行点胶固定。
需要注意的是，滤光片通过光学胶填充贴合在指纹传感器芯片201的上表面时，一旦指纹传感器芯片201的上表面覆盖的胶厚不均匀，会存在牛顿环现象，从而影响指纹识别效果。
在另一种实现方式中，所述滤光结构可以是滤光涂层，所述滤光涂层可以设置在所述指纹传感器芯片201的上表面202，也可以设置在所述光路叠层203的上表面，本申请对此不做具体限定。与所述滤光结构为滤光片的实现方式相比，所述滤光结构为滤光涂层时，所述滤光涂层(Coating)可以采用涂层工艺镀在所述指纹传感器芯片201的上表面202或者所述光路叠层203的上表面，避免了采用蓝玻璃或白玻璃基材等滤光片，不仅会避免牛顿环现象，进而提高指纹识别效果，还能够有效减小所述指纹识别装置200的厚度。
请继续参见图3，所述指纹识别装置200还可以包括泡棉层222，所述泡棉层222固定设置在所述电路板212的上表面。例如，所述泡棉层222可以通过第二胶层223固定设置在所述电路板212的上表面。可选地，所述第二胶层223为双面胶。应当理解，在其他可替代实施例中，所述泡棉层222和所述第二胶层223可以合并为一层。例如，在制作所述泡棉层222的过程 中，可以同时在所述泡棉层222的下表面形成有胶层。
进一步地，所述泡棉层222通过所述双面胶固定在所述电路板的上表面时，所述泡棉层222还可以设置有第四窗口，所述第四窗口对准所述第一窗口设置。由此，显示屏发出的经由手指反射或者散射的光信号可以通过所述第四窗口被所述指纹传感器芯片201接收，进而实现屏下指纹识别。更进一步地，所述第四窗口的窗口尺寸可以小于或等于所述补强板211的第二窗口的窗口尺寸。例如，所述第四窗口的窗口尺寸可以小于所述第二窗口的尺寸，且大于或等于所述第二窗口内的指纹传感器芯片201的进光面的尺寸。由此，不仅能够保证屏下指纹识别，还能够避免屏下指纹识别对显示屏的正常显示产生影响。
请继续参见图3，所述指纹识别装置200还可以包括第一保护层221。
所述第一保护层221可拆卸的设置在所述泡棉层222的上表面，所述第一保护层221用于将所述电路板212安装在中框之前保护所述泡棉层222。所述电路板212用于安装在所述中框后，可以先将所述第一保护层221去除，然后将所述中框安装在所述显示屏的下方，以使得所述泡棉层222的上表面和所述显示屏的发光层的下表面直接接触。
所述第一保护层221可以可以是重离型膜(release film)，所述重离型膜包括但不限于聚对苯二甲酸乙二醇酯(polyethylene glycol terephthalate，PET)。由于重离型PET离型膜相对于轻离型PET离型膜而言在可剥离基础上又有这较好的附着力，所述泡棉层222与重剥离PET离型膜贴合后，在加工生产过程中不会脱落，方便量产。
请继续参见图3，所述指纹识别装置200还可以包括第二保护层231。
所述第二保护层231可拆卸的设置在所述电路板212的下表面，所述第二保护层用于将所述电路板212安装在所述中框之前承载并保护所述电路板212。所述电路板212用于安装在所述中框后，可以先将所述第二保护层231去除，然后将所述电路板212的下表面直接固定安装在所述中框的上表面。
所述第二保护层231可以通过第三胶层232(例如双面胶)固定在所述电路板212的下表面。进一步地，所述第二保护层231还可以通过所述第三胶层232固定在所述涂层或膜层204的下表面，以增加稳定性，进而使得其在加工生产过程中不会脱落，方便量产。进一步地，所述第二保护层231仅在中间位置通过第三胶层232固定在所述电路板212的下表面或者所述涂层 或膜层204的下表面，以便于将所述电路板212安装在所述中框时，便于剥离所述第二保护层231。
图4是图3所示的指纹是被装置经过拆卸后得到的拆卸部件的示意图。
如图4所示，所述补强板211在所述第二开窗的周围区域还可以设置有贯通所述补强板的至少一个通孔2110，所述至少一个通孔2110用于露出所述电路板上的定位标识，所述定位标识用于定位所述指纹传感器芯片201在所述第三开窗内的位置。例如，所述定位标识为所述电路板212上的特定图案或者特定结构，在安装所述指纹传感器芯片201的过程中，通过所述特定图案或所述特定结构的位置可以确定所述指纹传感器芯片201的位置，进而提高所述指纹传感器芯片201的安装精度。
请继续参见图4，所述指纹识别装置200还可以包括图像处理器240。
所述电路板212电连接至所述所述图像处理器240。所述图像处理器240可以具体为微处理器(Micro Processing Unit，MCU)，用于接收来自所述指纹传感器芯片201通过所述电路板212发送的指纹检测信号(例如指纹图像)，并对所述指纹检测信号进行简单的处理。
例如，所述图像处理器240可以包括至少一个电容器，所述至少一个电容器设置在所述图像处理器240上，用于优化所述指纹传感器芯片201采集的指纹检测信号。例如，所述至少一个电容器用于对所述指纹传感器芯片201采集的指纹检测信号进行滤波处理。其中，所述指纹传感器芯片201可以对应一个或者多个电容器。
请继续参见图4，所述指纹识别装置200还可以包括连接器250，所述连接器250用于与外部装置或者所述指纹识别装置200所在的电子设备的其它部件进行连接，进而实现与所述外部装置的通信或者所述电子设备的其它部件的通信。例如，所述连接器250可以用于连接所述电子设备的处理器，以便于所述电子设备的处理器接收经过所述图像处理器240处理过的指纹检测信号，并基于所述处理过的指纹检测信号进行指纹识别。
应理解，图3和图4仅是本申请的一个示例，不应理解为对本申请实施例的限制。例如，在其他可替代实施例中，可以将所述补强板211、第一胶层213和电路板212替换为其它类型的部件。
图5是本申请实施例的指纹识别装置的另一示意图。
如图5所示，可以将图4中所示的补强板211、第一胶层213和电路板 212替换为基板216。
也就是说，所述基板216可以用作支撑板。通过在所述基板216上设置用于容纳并固定所述指纹传感器芯片201的所述第一开窗，可以使得将所述基板216安装在电子设备的中框上后，所述指纹传感器201位于电子设备的显示屏的下方，进而实现屏下指纹识别。
所述指纹传感器芯片201可以通过第二固定胶219固定在所述第一开窗内。所述第二固定胶219包括但不限于塑封胶。
所述基板216的内部可以设置有布线层，所述指纹传感器芯片201可以通过金线214连接至所述布线层。可选地，所述金线的弧高或封装高度小于小于某一阈值，例如所述金线的弧高或封装高度可以小于70um。
请继续参见图5，所述指纹识别装置200还可以包括电路板218。
所述电路板218可以通过导电胶(electroconductive adhesive)217固定连接至所述基板216。所述导电胶217可以是一种固化或干燥后具有一定导电性的胶粘剂。
所述电路板218可以是任意部件的电路板，例如，所述显示屏的电路板或者所述指纹传感器芯片201的电路板。又例如，所述电路板218可以为显示屏和所述指纹传感器芯片201共用电路板，以简化所述电子设备的结构。
请继续参见图5，所述基板216在所述第一开窗的下表面的窗口位置向上延伸形成有第一凹槽，所述第一凹槽用于露出所述基板216的布线层，所述指纹传感器芯片201可以通过所述第一凹槽电连接至所述基板216的布线层。例如，所述第一凹槽内露出的布线层上可以设置有焊盘或锡球，用于电连接至所述指纹传感器芯片201。
请继续参见图5，由于所述所述第一凹槽是在所述基板216在所述第一开窗的下表面的窗口位置向上延伸形成的凹槽，因此，需要将所述指纹传感器芯片201的引脚设置在所述指纹传感器芯片201的下表面，以便于电连接至所述基板216。
在本申请的一些实施例中，所述指纹传感器芯片201可以设置有硅通孔(Through Silicon Via，TSV)和/或重新布线层(Redistribution Layer，RDL)，所述TSV和/或RDL用于将所述指纹传感器芯片201的引脚从上表面引导至下表面。通过所述TSV和/或RDL，所述指纹传感器芯片201的下表面可以形成有布线层205。所述布线层205通过金线214可以电连接至所述基板216 的第一凹槽内的布线层。
所述指纹传感器芯片201还可以在所述布线层的表面形成保护层206，用于保护以及绝缘所述指纹传感器芯片201。
图6是图5所示的指纹是被装置经过拆卸后得到的拆卸部件的示意图。
如图6所示，所述基板216在上表面的边缘位置设置有向下延伸形成有台阶2161，所述台阶2161上设置有所述基板216的引脚2162。所述基板216的引脚2162可以通过所述导电胶217电连接至所述所述电路板218的引脚，进而实现所述电路板218和所述基板216之间的通信。
需要注意的是，由于所述基板216的上表面在安装所述指纹传感器芯片201之前并不会被其他部件遮挡，因此，所述基板216的定位标识可以直接用于定位所述指纹传感器芯片201在所述第一开窗内的位置。
图7是本申请实施例的指纹识别装置200的另一示意性结构图。
如图7所示，所述指纹识别装置可以包括基板216，所述指纹传感器芯片201可以通过第三固定胶2110固定在所述第一开窗内。所述第三固定胶2110包括但不限于热固胶和塑封胶。
所述基板216在所述第一开窗的上表面的窗口位置向下延伸形成有第二凹槽，所述第二凹槽用于露出所述基板216的布线层，所述指纹传感器芯片201电连接至所述基板216的布线层。更进一步地，所述指纹传感器芯片201的下表面设置有介电常数大于预设阈值的涂层或者膜层204，以保护所述指纹传感器芯片201。
还应理解，上述附图仅为本申请的示例，不应理解为对本申请的限制。
例如，在其他可替代实施例中，所述指纹传感器芯片201还可以通过所述支撑板固定在电子设备的后盖或电池等其它部件上，使得所述指纹传感器芯片201设置在所述电子设备的显示屏的下方。
又例如，在图3所示的指纹识别装置200中，所述补强板211和所述电路板212的位置也可以互换，即所述补强板211可以通过所述第一胶层213固定在所述电路板的下方。
本申请实施例还提供了一种具有显示屏的电子设备，所述电子设备可以包括上文所述的指纹识别装置200，所述指纹识别装置200可以位于所述显示屏下，用于进行屏下指纹识别。
图8和图9是包括图3的指纹识别装置200的电子设备300的示意图。
如图8所示，所述电子设备300可以包括中框310。所述中框310用于支撑所述电子设备的显示屏。所述中框310的上表面向下延伸形成有第三凹槽，所述第三凹槽用于容纳所述指纹识别装置200。具体地，将所述指纹识别装置200安装在所述中框310之前，剥离所述指纹识别装置200的第二保护层231，使得所述电路板212通过所述第三胶层232(例如双面胶)固定在所述中框的上表面。
如图9所示，所述显示屏可以包括发光层320和遮光板330。
所述遮光板330设置于所述发光层320的下方，所述遮光板330设置有开窗，所述指纹识别装置200通过所述开窗接收所述发光层320发出的经由人体手指反射后形成的光信号，所述光信号用于指纹识别。
其中，所述指纹识别装置200中的指纹传感器201与所述发光层320的下表面之间存在间隙。其间隙可以是不填充任何辅助材料的空气间隙(air gap)，其可保证在当显示屏受到按压或者电子设备出现跌落或碰撞时均不会出现指纹传感器201接触到显示屏的下表面，也不会影响指纹传感器201的指纹识别的稳定性和性能。
所述发光层320可以是所述显示屏的发光层，例如，所述发光层320可以是采用低温多晶硅技术(Low Temperature Poly-silicon，LTPS)制成的OLED有机发光面板，其厚度超薄、重量轻、低耗电，可以用于提供较为清晰的影像。所述指纹传感器芯片201和所述发光层320之间存在间隙时，所述间隙可以小于或等于预设阈值，所述预设阈值包括但不限于600um。
所述遮光板330还可以用作屏幕印刷(screen print)层或压花层，所述屏幕印刷层可以带有图文，所述图文可以用作商标图案等标识。所述遮光板330可以是用于遮蔽光的黑色片状层或者印刷层。
所述显示屏还可以包括保护层，用于保护所述显示屏。类似于所述遮光板330，所述保护层也设置有开窗，所述指纹识别装置200通过所述开窗接收所述发光层320发出的经由人体手指反射后形成的光信号，所述光信号用于指纹识别。在其他实施例中，所述保护层还可以称为缓冲(cushion)层或者后面板，或者所述遮光板330和所述保护层可以合并为一层。
所述保护层还可以包括散热层。例如，所述保护层可以包括至少一部分由金属材料形成的所述散热层。
应理解，所述显示屏还可以包括布线层，其可以包括用于所述指纹传感 器芯片201和/或所述显示屏的电气连接的布线。所述显示屏还可以包括是偏光片(Polarizer，POL)。偏光片也可以称为偏振光片，用于产生偏振光。所述偏振光用于光信号成像。所述显示屏还可以包括盖板玻璃，所述盖板玻璃用于保护所述显示屏。所述盖板玻璃和所述偏振片之间可以通过光学透明胶(Optically Clear Adhesive，OCA)进行贴合。所述OCA可以是将光学亚克力胶做成无基材，然后在上下底层各贴合一层离型薄膜后形成的一种无基体材料的双面贴合胶带，即所述OCA可以是具有光学透明性质的一层无基材双面胶。
以所述显示屏为OLED屏为例，所述显示屏可以是软屏也可以是硬屏，所述显示屏可以包括屏幕印刷(screen print)层、保护层等叠层。上述各个叠层开孔后，OLED屏会朝下方泄露光。当手指放于亮屏的OLED屏上方，手指就会反射OLED屏发出的光，此反射光会穿透OLED屏直到OLED屏下方。位于OLED屏下方的滤光结构能够用于将漏光中的红外信号成分滤除。由于指纹是一个漫反射体，因此，经由手指反射或漫射形成的光信号在各方向都会存在。在OLED屏下方和指纹传感器芯片之间设置的微透镜阵列(Micro lens Array)，能够收集OLED屏上方漏下来的光信号。由此，所述指纹传感器芯片201通过接收滤除红色光的光信号，进行指纹图像的成像。
需要注意的是，OLED屏上方漏下来的光信号包括指纹信号和屏内部结构信号，而屏内结构信号会对指纹图像的成像产生影响，例如，在进行指纹图像的成像时产生摩尔条纹。本实施例中，通过控制泡棉层222及各零件的厚度，可以使得所述指纹传感器芯片201和OLED屏(例如，所述发光层320的下表面)的距离在600um以内，进而使的屏结构的成像模糊，但指纹的结构的成像不受影响。由于所述指纹传感器芯片201和OLED屏之间的距离越小，指纹识别性能越好，因此在可靠性和制程能力允许的前提下，可以尽量缩小所述指纹传感器芯片201和OLED屏之间的距离。
应理解，本申请实施例中的具体的例子只是为了帮助本领域技术人员更好地理解本申请实施例，而非限制本申请实施例的范围。
应理解，在本申请实施例和所附权利要求书中使用的术语是仅仅出于描述特定实施例的目的，而非旨在限制本申请实施例。例如，在本申请实施例和所附权利要求书中所使用的单数形式的“一种”、“上述”和“所述”也旨在包括多数形式，除非上下文清楚地表示其他含义。
本领域普通技术人员可以意识到，结合本文中所公开的实施例描述的各示例的单元，能够以电子硬件、计算机软件或者二者的结合来实现，为了清楚地说明硬件和软件的可互换性，在上述说明中已经按照功能一般性地描述了各示例的组成及步骤。这些功能究竟以硬件还是软件方式来执行，取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能，但是这种实现不应认为超出本申请的范围。
在本申请所提供的几个实施例中，应所述理解到，所揭露的系统、装置，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另外，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口、装置或单元的间接耦合或通信连接，也可以是电的，机械的或其它的形式连接。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本申请实施例方案的目的。
另外，在本申请各个实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以是两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现，也可以采用软件功能单元的形式实现。
所述集成的单元如果以软件功能单元的形式实现并作为独立的产品销售或使用时，可以存储在一个计算机可读取存储介质中。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分，或者所述技术方案的全部或部分可以以软件产品的形式体现出来，所述计算机软件产品存储在一个存储介质中，包括若干指令用以使得一台计算机设备(可以是个人计算机，服务器，或者网络设备等)执行本申请各个实施例所述方法的全部或部分步骤。而前述的存储介质包括：U盘、移动硬盘、只读存储器(ROM，Read-Only Memory)、随机存取存储器(RAM，Random Access Memory)、磁碟或者光盘等各种可以存储程序代码的介质。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (32)

  1. 一种指纹识别装置，其特征在于，应用在具有显示屏的电子设备，所述指纹识别装置包括：
    至少一个指纹传感器芯片；
    支撑板，所述支撑板设置有第一开窗，所述至少一个指纹传感器芯片固定设置在所述第一开窗内；
    其中，所述支撑板用于安装在所述电子设备的中框，以使所述至少一个指纹指纹传感器芯片位于所述电子设备的显示屏的下方，所述至少一个指纹指纹传感器芯片用于接收经由所述显示屏上方的人体手指反射或散射而返回的指纹检测信号，所述指纹检测信号用来检测所述手指的指纹信息。
  2. 根据权利要求1所述的指纹识别装置，其特征在于，所述支撑板包括：
    补强板，所述补强板设置有第二开窗；
    电路板，所述电路板通过第一胶层固定设置在所述补强板的下方，所述电路板设置有第三开窗，所述第一开窗包括所述第二开窗和/或所述第三开窗，所述至少一个指纹传感器芯片电连接至所述电路板。
  3. 根据权利要求2所述的指纹识别装置，其特征在于，所述第二开窗的窗口尺寸大于所述第三开窗的窗口尺寸，以露出所述第三开窗的窗口位置，所述窗口位置设置有所述电路板的引脚，所述电路板的引脚通过金线连接至所述至少一个指纹传感器芯片。
  4. 根据权利要求3所述的指纹识别装置，其特征在于，所述金线的弧高或封装高度小于70um。
  5. 根据权利要求2至4中任一项所述的指纹识别装置，其特征在于，所述补强板在所述第二开窗的周围区域设置有贯通所述补强板的至少一个通孔，所述至少一个通孔用于露出所述电路板上的定位标识，所述定位标识用于定位所述至少一个指纹传感器芯片在所述第三开窗内的位置。
  6. 根据权利要求2至5中任一项所述的指纹识别装置，其特征在于，所述至少一个指纹传感器芯片的下表面设置有介电常数大于预设阈值的涂层或膜层。
  7. 根据权利要求2至6中任一项所述的指纹识别装置，其特征在于，所述至少一个指纹传感器芯片通过第一固定胶安装在所述第二开窗和/或所述 第三开窗内。
  8. 根据权利要求1所述的指纹识别装置，其特征在于，所述支撑板为基板，所述基板内部设置有布线层，所述至少一个指纹传感器芯片通过金线连接至所述布线层。
  9. 根据权利要求8所述的指纹识别装置，其特征在于，所述金线的弧高或封装高度小于70um。
  10. 根据权利要求8或9所述的指纹识别装置，其特征在于，所述指纹识别装置还包括：
    电路板，所述基板的边缘位置设置有基板的引脚，所述基板的引脚用于连接所述电路板，所述至少一个指纹传感器芯片通过所述基板的引脚连接至所述电路板。
  11. 根据权利要求10所述的指纹识别装置，其特征在于，所述基板在上表面的边缘位置设置有向下延伸形成有台阶，所述台阶上设置有所述基板的引脚。
  12. 根据权利要求8至11中任一项所述的指纹识别装置，其特征在于，所述基板在所述第一开窗的下表面的窗口位置向上延伸形成有第一凹槽，所述第一凹槽用于露出所述基板的布线层，所述至少一个指纹传感器芯片电连接至所述基板的布线层。
  13. 根据权利要求12所述的指纹识别装置，其特征在于，所述芯片设置有硅通孔TSV和/或重新布线层RDL，所述TSV和/或重RDL用于将所述指纹传感器芯片的引脚由上表面引导至下表面。
  14. 根据权利要求12所述的指纹识别装置，其特征在于，所述至少一个指纹传感器芯片通过第二固定胶固定在所述第一开窗内。
  15. 根据权利要求8至11中任一项所述的指纹识别装置，其特征在于，所述基板在所述第一开窗的上表面的窗口位置向下延伸形成有第二凹槽，所述第二凹槽用于露出所述基板的布线层，所述至少一个指纹传感器芯片电连接至所述基板的布线层。
  16. 根据权利要求15所述的指纹识别装置，其特征在于，所述至少一个指纹传感器芯片的下表面设置有介电常数大于预设阈值的涂层或者膜层。
  17. 根据权利要求15所述的指纹识别装置，其特征在于，所述至少一个指纹传感器芯片通过第三固定胶固定在所述第一开窗内。
  18. 根据权利要求1至17中任一项所述的指纹识别装置，其特征在于，所述指纹识别装置还包括：
    泡棉层，所述泡棉层固定设置在所述支撑板的上表面，所述泡棉层的下方设置有第二胶层，所述泡棉层通过所述第二胶层固定在所述支撑板的上表面。
  19. 根据权利要求18所述的指纹识别装置，其特征在于，所述泡棉层设置有第四窗口，所述第四窗口对准所述第一窗口设置。
  20. 根据权利要求19所述的指纹识别装置，其特征在于，所述第四窗口的窗口尺寸小于或等于所述第一窗口的窗口尺寸。
  21. 根据权利要求19所述的指纹识别装置，其特征在于，所述指纹识别装置还包括：
    第一保护层，所述第一保护层可拆卸的设置在所述泡棉层的上表面，所述第一保护层用于将所述支撑板安装在所述中框之前保护所述泡棉层。
  22. 根据权利要求1至21中任一项所述的指纹识别装置，其特征在于，所述指纹识别装置还包括：
    第二保护层，所述第二保护层可拆卸的设置在所述支撑板的下表面，所述第二保护层用于将所述支撑板安装在所述中框之前承载并保护所述支撑板。
  23. 根据权利要求1至22中任一项所述的指纹识别装置，其特征在于，所述至少一个指纹传感器芯片包括多个光学指纹传感器芯片，所述多个光学指纹传感器芯片通过并排设置在所述第一开窗内，以拼接成一个光学指纹传感器芯片组件。
  24. 根据权利要求1至23中任一项所述的指纹识别装置，其特征在于，所述指纹识别装置还包括：
    微透镜阵列，所述微透镜阵列包括成阵列分布的至少一个微透镜，所述微透镜阵列设置在所述至少一个传感器芯片的上方，用于收集所述指纹检测信号。
  25. 根据权利要求24所述的指纹识别装置，其特征在于，所述微透镜阵列的上方设置有滤光涂层。
  26. 根据权利要求1至25中任一项所述的指纹识别装置，其特征在于，所述中框的上表面向下延伸形成有第三凹槽，所述第三凹槽用于容纳所述指 纹识别装置。
  27. 根据权利要求1至26中任一项所述的指纹识别装置，其特征在于，所述显示屏的发光层的下表面设置有遮光板，所述遮光板设置有第五开窗，所述第五开窗的窗口尺寸大于所述支撑板的上表面尺寸。
  28. 根据权利要求1至27中任一项所述的指纹识别装置，其特征在于，所述显示屏的发光层的下表面距离所述至少一个指纹传感器芯片的上表面之间的距离小于600um。
  29. 一种电子设备，其特征在于，包括：
    显示屏；
    权利要求1至28中任一项所述的指纹识别装置；
    其中，所述指纹识别装置设置在所述显示屏的下方以实现屏下指纹检测。
  30. 如权利要求29所述的电子设备，其特征在于，所述显示屏包括：
    发光层；
    遮光板，所述遮光板设置于所述发光层的下方，所述遮光板设置有第五开窗，所述指纹识别装置通过所述第五开窗固定安装在所述发光层的下表面。
  31. 根据权利要求30所述的电子设备，其特征在于，所述发光层的下表面距离所述指纹识别模组中的至少一个指纹传感器芯片的上表面之间的距离小于600um。
  32. 根据权利要求29至31中任一项所述的电子设备，其特征在于，所述电子设备还包括：
    中框，所述中框的上表面向下延伸形成有第三凹槽，所述第三凹槽用于容纳所述指纹识别装置。
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