WO2021088464A1 - 光学指纹装置及其制备方法、电子设备 - Google Patents

光学指纹装置及其制备方法、电子设备 Download PDF

Info

Publication number
WO2021088464A1
WO2021088464A1 PCT/CN2020/110091 CN2020110091W WO2021088464A1 WO 2021088464 A1 WO2021088464 A1 WO 2021088464A1 CN 2020110091 W CN2020110091 W CN 2020110091W WO 2021088464 A1 WO2021088464 A1 WO 2021088464A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
optical fingerprint
shielding layer
optical
chip
Prior art date
Application number
PCT/CN2020/110091
Other languages
English (en)
French (fr)
Inventor
黄维强
刘凯
Original Assignee
深圳市汇顶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Publication of WO2021088464A1 publication Critical patent/WO2021088464A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14621—Colour filter arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14623—Optical shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14636—Interconnect structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14665—Imagers using a photoconductor layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Definitions

  • the embodiments of the present application relate to the technical field of fingerprint identification, and more specifically, to an optical fingerprint device, a preparation method thereof, and electronic equipment.
  • the common under-screen optical fingerprint recognition on the market is a lens-type optical fingerprint device.
  • the lens-type optical fingerprint device uses a lens holder to block the stray light on the side of the optical fingerprint chip, as shown in Figure 3.
  • the filter filters the stray light above the optical fingerprint chip, but the lens-type lens holder The volume is large and the space requirement is high.
  • the embodiments of the present application provide an optical fingerprint device, a preparation method thereof, and electronic equipment, which can improve fingerprint recognition performance.
  • an optical fingerprint device which is applied to an electronic device with a display screen.
  • the optical fingerprint device is used to be arranged under the display screen.
  • the optical fingerprint device includes: an optical fingerprint chip, including a The sensing array of the sensing unit, the sensing array is used to receive the fingerprint light signal returned from the finger above the display screen, and the fingerprint light signal is used to obtain the fingerprint image of the finger; the light shielding layer is formed on the edge area of the optical fingerprint chip
  • the upper surface of the optical fingerprint chip and at least part of the side surface from top to bottom of the optical fingerprint chip are used to shield the stray light entering the sensing array from the upper surface of the edge area and the at least part of the side surface, wherein the light shielding layer does not shield The sensing area of the optical fingerprint chip.
  • the light-shielding layer is formed on the upper surface of the edge region and the at least part of the side surface by a pad printing and light-shielding process.
  • At least part of the bottom-up side surface of the optical fingerprint chip is covered with a glue layer, and the light shielding layer covers the glue layer to cover the entire side surface of the optical fingerprint chip.
  • the thickness of the adhesive layer is not less than 40 ⁇ m.
  • the thickness of the adhesive layer is not greater than the thickness of the optical fingerprint chip.
  • the thickness of the light shielding layer is not greater than 20 ⁇ m.
  • the distance between the first inner side of the light shielding layer formed on the upper surface of the edge region and the outer side of the sensing area close to the first inner side is not less than 30 ⁇ m.
  • the distance between the second inner side of the light shielding layer formed on the upper surface of the edge area and the outer side of the optical fingerprint chip close to the second inner side is not less than 80 ⁇ m.
  • the optical fingerprint device further includes: a filter layer disposed on the upper surface of the optical fingerprint chip, wherein the filter layer at least covers the sensing area.
  • the light shielding layer covers the edge area of the filter layer.
  • the optical fingerprint device further includes: a circuit board arranged below the optical fingerprint chip, the circuit board is electrically connected to the optical fingerprint chip through a gold wire, wherein the light shielding layer covers the circuit The area on the board not covered by the optical fingerprint chip and the gold wire.
  • a first foam structure and a second foam structure are provided on the periphery of the optical fingerprint chip, wherein the first foam structure is provided above the second foam structure, and the second foam structure The foam structure is arranged above the circuit board, and the upper surface of the second foam structure is not lower than the upper surface of the light shielding layer.
  • the upper surface of the second foam structure is not lower than the arc height of the gold wire.
  • the width of the first foam structure is greater than the width of the second foam structure to form a shielding portion at one end of the first foam structure close to the optical fingerprint chip, and the shielding portion partially shields The edge area of the optical fingerprint chip does not block the sensing area of the optical fingerprint chip.
  • the light shielding layer is ink.
  • the optical fingerprint device further includes: an optical component, arranged above the optical fingerprint chip, for guiding the optical signal returned from the finger above the display to the optical fingerprint chip to perform Optical fingerprint detection.
  • the optical assembly includes: a microlens array formed by a plurality of microlenses and at least one light blocking layer, the at least one light blocking layer is located under the microlens array, and each light blocking layer is provided with A plurality of light-passing holes, and the sensing array is used for receiving light signals condensed to the plurality of light-passing holes through the microlens array and passing through the plurality of light-passing holes.
  • the middle frame of the electronic device is provided with a slot or an opening, and the optical fingerprint device is used to be disposed in the slot or the opening.
  • an electronic device including: a display screen; such as the optical fingerprint device in the first aspect or any possible implementation of the first aspect, the optical fingerprint device is disposed under the display screen.
  • the display screen is an organic light emitting diode OLED display screen, and the display screen includes a plurality of OLED light sources, wherein the optical fingerprint device uses at least part of the OLED light sources as excitation light sources for optical fingerprint detection.
  • a method for preparing an optical fingerprint device includes: determining a position of a light-shielding layer, the position of the light-shielding layer includes the upper surface of the edge area of the optical fingerprint chip and the top surface of the optical fingerprint chip Preparing the light-shielding layer at the position of the light-shielding layer, and the light-shielding layer is used to shield the stray light entering the sensing area of the optical fingerprint chip from the upper surface of the edge area and the at least part of the side surface, The light shielding layer does not shield the sensing area of the optical fingerprint chip.
  • the method further includes: dispensing a glue layer on at least a part of the bottom-up side surface of the light-shielding layer; preparing the light-shielding layer at the position of the light-shielding layer, including: The light-shielding layer is prepared on the outer surface so that the light-shielding layer covers the entire side surface of the optical fingerprint chip.
  • preparing the light-shielding layer at the position of the light-shielding layer includes: obtaining a pattern of the light-shielding layer according to the position of the light-shielding layer; The light-shielding material is removed to form an intaglio plate by removing the light-shielding material in the blank part; the light-shielding material at the intaglio plate is transferred to the position of the light-shielding layer.
  • transferring the light-shielding material at the intaglio plate to the position of the light-shielding layer includes: transferring the light-shielding material at the intaglio plate to the position of the light-shielding layer through the adjustment and positioning of the module adjusting device. The position of the light-shielding layer.
  • the module adjustment device is a motor servo platform.
  • determining the position of the light-shielding layer includes: determining the position of the light-shielding layer according to the photograph recognition of the charge-coupled device CCD.
  • the thickness of the adhesive layer is not less than 40 ⁇ m.
  • the thickness of the adhesive layer is not greater than the thickness of the optical fingerprint chip.
  • the thickness of the light shielding layer is not greater than 20 ⁇ m.
  • the distance between the first inner side of the light shielding layer formed on the upper surface of the edge area and the outer side of the sensing area close to the first inner side is not less than 30 ⁇ m.
  • the distance between the second inner side of the light shielding layer formed on the upper surface of the edge region and the outer side of the optical fingerprint chip close to the second inner side is not less than 80 ⁇ m.
  • the rubber head has at least one of the following characteristics: anti-static, dirt-resistant, and soft material.
  • the rubber head is a silicone head.
  • the light shielding layer is ink.
  • Fig. 1A is a directional view of an electronic device according to an embodiment of the present application.
  • Fig. 1B is a schematic diagram of a partial cross-sectional structure of the electronic device shown in Fig. 1A along A-A'.
  • Fig. 2 is a schematic diagram of the structure of an optical fingerprint device.
  • Fig. 3 is a working principle diagram of the optical fingerprint device shown in Fig. 2.
  • FIG. 4 is a schematic structural diagram of an optical fingerprint device provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of another optical fingerprint device provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of still another optical fingerprint device provided by an embodiment of the present application.
  • Fig. 7 is a top view of the optical fingerprint device shown in Figs. 5 and 6.
  • Fig. 8 is a schematic block diagram of a method for preparing an optical fingerprint device according to an embodiment of the present application.
  • Fig. 9 is a schematic block diagram of an electronic device according to an embodiment of the present application.
  • Fig. 10 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • portable or mobile computing devices such as smartphones, notebook computers, tablet computers, and gaming devices, as well as other electronic devices such as electronic databases, automobiles, and bank automated teller machines (ATM).
  • ATM bank automated teller machines
  • the embodiments of the present application are not limited to this.
  • biometric recognition technologies include but are not limited to fingerprint recognition, palmprint recognition, iris recognition, face recognition, and living body recognition.
  • fingerprint recognition technology uses fingerprint recognition technology as an example for description.
  • the technical solutions of the embodiments of the present application can be used in the under-screen fingerprint identification technology.
  • the under-screen fingerprint recognition technology refers to the installation of the fingerprint recognition module below the display screen, so as to realize the fingerprint recognition operation in the display area of the display screen. There is no need to set a fingerprint collection area on the front of the electronic device except for the display area.
  • the fingerprint identification module uses light returned from the top surface of the display assembly of the electronic device to perform fingerprint sensing and other sensing operations. This returned light carries information about objects (for example, fingers) in contact with the top surface of the display assembly.
  • the fingerprint recognition module located below the display assembly collects and detects this returned light to realize fingerprint recognition under the screen.
  • the fingerprint recognition module can be designed to achieve desired optical imaging by appropriately configuring optical elements for collecting and detecting the returned light.
  • FIG. 1A and 1B show a schematic diagram of an electronic device 100 to which under-screen fingerprint recognition technology can be applied, wherein FIG. 1A is a front schematic diagram of the electronic device 100, and FIG. 1B is a schematic diagram of the electronic device 100 shown in FIG. 1A along A-A' Schematic diagram of partial cross-sectional structure.
  • the electronic device 100 may include a display screen 120 and an optical fingerprint device 140.
  • the display screen 120 may be a self-luminous display screen, which uses a self-luminous display unit as display pixels.
  • the display screen 120 may be an Organic Light-Emitting Diode (OLED) display screen or a Micro-LED (Micro-LED) display screen.
  • the display screen 120 may also be a liquid crystal display (LCD) or other passive light-emitting display, which is not limited in the embodiment of the present application.
  • the display screen 120 may also be specifically a touch-sensitive display screen, which can not only perform screen display, but also detect a user's touch or pressing operation, thereby providing a user with a human-computer interaction interface.
  • the electronic device 100 may include a touch sensor, and the touch sensor may specifically be a touch panel (TP), which may be provided on the surface of the display screen 120, or may be partially integrated or The whole is integrated into the display screen 120 to form the touch display screen.
  • TP touch panel
  • the optical fingerprint device 140 may include a fingerprint sensor chip with an optical sensing array (hereinafter also referred to as an optical fingerprint sensor or an optical fingerprint chip).
  • the optical sensing array includes multiple optical sensing units, and each optical sensing unit may specifically include a photodetector or a photoelectric sensor.
  • the optical fingerprint device 140 may include a photodetector array (or called a photodetector array, a photoelectric sensor array, an optical sensor array, or a sensing array), which includes a plurality of photodetectors distributed in an array. .
  • the optical fingerprint device 140 can be arranged in a partial area below the display screen 120, so that the fingerprint collection area (or fingerprint detection area) 130 of the optical fingerprint device 140 is at least partially located on the display screen 120. Display area 102.
  • the optical fingerprint device 140 may also be arranged in other positions, such as the side of the display screen 120 or the non-transparent area of the edge of the electronic device 100.
  • the optical signal of at least a part of the display area of the display screen 120 can be guided to the optical fingerprint device 140 through an optical path design, so that the fingerprint collection area 130 is actually located in the display area of the display screen 120.
  • the optical fingerprint device 140 may only include one fingerprint sensor chip. At this time, the fingerprint collection area 130 of the optical fingerprint device 140 has a small area and a fixed position. Therefore, the user needs to input the fingerprint Press to a specific position of the fingerprint collection area 130, otherwise the optical fingerprint device 140 may not be able to collect fingerprint images, resulting in poor user experience.
  • the optical fingerprint device 140 may specifically include a plurality of fingerprint sensor chips; the plurality of fingerprint sensor chips may be arranged side by side under the display screen 120 in a splicing manner, and the plurality of fingerprint sensor chips
  • the sensing area of the fingerprint sensor chip collectively constitutes the fingerprint collection area 130 of the optical fingerprint device 140.
  • the fingerprint collection area 130 of the optical fingerprint device 140 may include multiple sub-areas, and each sub-area corresponds to the sensing area of one of the fingerprint sensor chips, so that the fingerprint collection area 130 of the optical fingerprint module 130 It can be extended to the main area of the lower half of the display screen, that is, to the area where the finger is habitually pressed, so as to realize the blind fingerprint input operation.
  • the fingerprint detection area 130 can also be extended to half of the display area or even the entire display area, thereby realizing half-screen or full-screen fingerprint detection.
  • the embodiment of the present application does not limit the specific form of the multiple fingerprint sensor chips.
  • the multiple fingerprint sensor chips may be individually packaged fingerprint sensor chips, or multiple chips (Die) packaged in the same chip package.
  • the multiple fingerprint sensor chips can also be fabricated on different regions of the same chip (Die) through a semiconductor process.
  • the area or light sensing range of the optical sensing array of the optical fingerprint device 140 corresponds to the fingerprint collection area 130 of the optical fingerprint device 140.
  • the fingerprint collection area 130 of the optical fingerprint device 140 may be equal to or not equal to the area or light sensing range of the optical sensing array of the optical fingerprint device 140, which is not specifically limited in the embodiment of the present application.
  • the fingerprint collection area 130 of the optical fingerprint device 140 can be designed to be substantially the same as the area of the sensing array of the optical fingerprint device 140.
  • the area of the fingerprint collection area 130 of the optical fingerprint device 140 can be larger than the area of the sensing array of the optical fingerprint device 140 through the design of the optical path of convergent light or the design of the reflected light of light.
  • the optical fingerprint device 140 may further include an optical component, and the optical component may be disposed above the sensing array, which may specifically include a filter layer, a light guide layer, or an optical path. Guide structure and other optical elements.
  • the filter layer can be used to filter ambient light penetrating the finger, such as infrared light that interferes with imaging, while the light guide layer or light path guide structure is mainly used to reflect back from the finger surface The reflected light is guided to the sensing array for optical detection.
  • optical path design of the optical fingerprint device 140 is exemplarily described below.
  • the optical fingerprint device 140 may adopt an optical collimator with a through hole array with a high aspect ratio, and the optical collimator may be specifically a collimator made on a semiconductor silicon wafer (Collimator).
  • Layer which has a plurality of collimating units or micro-holes, the collimating unit may be specifically a small hole, among the reflected light reflected from the finger, the light that is perpendicularly incident on the collimating unit can pass through and be underneath
  • the fingerprint sensor chip receives the light, and the light with too large incident angle is attenuated by multiple reflections inside the collimating unit. Therefore, each fingerprint sensor chip can basically only receive the reflected light reflected by the fingerprint lines directly above it. , Can effectively improve the image resolution, and then improve the fingerprint recognition effect.
  • a collimating unit may be configured for one optical sensing unit in the optical sensing array of each fingerprint sensor chip, and the collimating unit may be attached to the corresponding optical sensing unit.
  • the multiple optical sensing units may also share one collimating unit, that is, the one collimating unit has an aperture large enough to cover the multiple optical sensing units. Since one collimating unit can correspond to multiple optical sensing units, the correspondence between the spatial period of the display screen 120 and the spatial period of the fingerprint sensor chip is destroyed.
  • the spatial structure of the light-emitting display array of the display screen 120 and the fingerprint sensor chip are The spatial structure of the optical sensor array is similar, and it can also effectively prevent the optical fingerprint device 140 from using the light signal passing through the display screen 120 to perform fingerprint imaging to generate moiré fringes, which effectively improves the fingerprint recognition effect of the optical fingerprint device 140.
  • the optical fingerprint device 140 may adopt an optical path design based on an optical lens
  • the optical lens may include an optical lens (Lens) layer, which has one or more lens units, such as one or more aspherical surfaces.
  • a lens group composed of lenses which is used to converge the reflected light reflected from the finger to the sensing array of the fingerprint sensor chip below it, so that the sensing array can perform imaging based on the reflected light, thereby obtaining the fingerprint of the finger Fingerprint image.
  • the optical lens layer may further have a pinhole formed in the optical path of the lens unit, and the pinhole may cooperate with the optical lens layer to expand the field of view of the optical fingerprint device 140, so as to improve the fingerprint of the optical fingerprint device 140. Imaging effect.
  • the optical fingerprint device 140 when the optical fingerprint device 140 includes multiple fingerprint sensor chips, one optical lens may be configured for each fingerprint sensor chip to perform fingerprint imaging, or multiple fingerprint sensor chips may be configured with one optical lens to achieve light convergence and fingerprint imaging. Even when a fingerprint sensor chip has two sensor arrays (Dual Array) or multiple sensor arrays (Multi-Array), the fingerprint sensor chip can also be equipped with two or more optical lenses to cooperate with the two sensors. The array or multiple sensing arrays perform optical imaging, thereby reducing the imaging distance and enhancing the imaging effect.
  • the optical fingerprint device 140 may adopt a micro-lens (Micro-Lens) layer optical path design
  • the micro-lens layer may have a micro-lens array formed by a plurality of micro-lens, which can be through a semiconductor growth process Or other processes are formed above the sensing array of the fingerprint sensor chip, and each microlens may correspond to one of the sensing units of the sensing array.
  • Other optical film layers may be formed between the micro lens layer and the sensing unit, such as a dielectric layer or a passivation layer. More specifically, the micro lens layer and the sensing unit may also include micro holes.
  • the light-blocking layer wherein the micro-hole is formed between the corresponding micro-lens and the sensing unit, the light-blocking layer can block the optical interference between the adjacent micro-lens and the sensing unit, and allow light to pass through the micro-lens
  • the lens converges into the microhole and is transmitted to the sensing unit corresponding to the microlens through the microhole to perform optical fingerprint imaging.
  • a microlens layer can be further provided under the collimator layer or the optical lens layer.
  • the collimator layer or the optical lens layer is used in combination with the microlens layer, its specific laminated structure or optical path may need to be adjusted according to actual needs.
  • the optical fingerprint device 140 may be used to collect user fingerprint information (such as fingerprint image information).
  • the display screen 120 may be a display screen with a self-luminous display unit, such as an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display or a micro-LED (Micro-LED) display Screen.
  • OLED Organic Light-Emitting Diode
  • Micro-LED Micro-LED
  • the optical fingerprint device 140 may use the display unit (ie, the OLED light source) of the OLED display screen located in the fingerprint collection area 130 as the excitation light source for optical fingerprint detection.
  • the display screen 120 When a finger touches, presses, or approaches (for the sake of description, collectively referred to as pressing in this application) in the fingerprint collection area 130, the display screen 120 emits a beam of light to the finger above the fingerprint collection area 130. The surface is reflected to form reflected light or scattered light is scattered inside the finger. In related patent applications, for ease of description, the above-mentioned reflected light and scattered light are collectively referred to as reflected light. Since the ridge and valley of the fingerprint have different light reflection capabilities, the reflected light from the fingerprint ridge and the fingerprint ridge have different light intensities. After the reflected light passes through the display screen 120, it is optically affected.
  • the fingerprint sensor chip in the fingerprint device 140 receives and converts it into a corresponding electrical signal, that is, a fingerprint detection signal; based on the fingerprint detection signal, fingerprint image data can be obtained, and fingerprint matching verification can be further performed, so that the electronic device 100 realizes the optical fingerprint recognition function.
  • the electronic device 100 when the user needs to perform fingerprint unlocking or other fingerprint verification on the electronic device 100, he only needs to press his finger on the fingerprint collection area 130 located on the display screen 120 to realize the fingerprint feature input operation. Since the fingerprint feature collection can be implemented inside the display area 102 of the display screen 120, the electronic device 100 adopting the above structure does not need to reserve a special space on the front to set a fingerprint button (such as a Home button), so a full-screen solution can be adopted. Therefore, the display area 102 of the display screen 120 can be substantially extended to the entire front surface of the electronic device 100.
  • the optical fingerprint device 140 may also use a built-in light source or an external light source to provide an optical signal for fingerprint detection and identification.
  • the optical fingerprint device 140 can be applied not only to self-luminous displays such as OLED displays, but also to non-self-luminous displays, such as liquid crystal displays or other passive light-emitting displays.
  • the optical fingerprint system of the electronic device 100 may also include an excitation light source for optical fingerprint detection.
  • the light source may specifically be an infrared light source or a light source of invisible light of a specific wavelength, which may be arranged under the backlight module of the liquid crystal display or arranged in the edge area under the protective cover of the electronic device 100, and the optical fingerprint device 140 may be arranged Under the edge area of the liquid crystal panel or the protective cover and guided by the light path so that the fingerprint detection light can reach the optical fingerprint device 140; alternatively, the optical fingerprint device 140 can also be arranged under the backlight module, and the backlight module
  • the group opens holes or other optical designs on film layers such as diffusion sheets, brightness enhancement sheets, and reflective sheets to allow fingerprint detection light to pass through the liquid crystal panel and the backlight module and reach the optical fingerprint device 140.
  • the optical fingerprint device 140 adopts a built-in light source or an external light source
  • the electronic device 100 may also include a transparent protective cover 110, such as a glass cover or a sapphire cover, which is located above the display screen 120 and covers the front of the electronic device 100, and the surface of the cover 110 is also Can be provided with a protective layer. Therefore, in the embodiment of the present application, the so-called finger pressing the display screen 120 may actually refer to the finger pressing the cover 110 above the display 120 or covering the surface of the protective layer of the cover 110.
  • a transparent protective cover 110 such as a glass cover or a sapphire cover
  • a circuit board 150 such as a flexible printed circuit (FPC) may also be provided under the optical fingerprint device 140.
  • FPC flexible printed circuit
  • the optical fingerprint device 140 can be soldered to the circuit board 150 through pads.
  • the fingerprint sensor chip in the optical fingerprint device 140 can be connected to the circuit board 150 through pads, and can be connected to other peripheral circuits or electronics through the circuit board 150. Electrical interconnection and signal transmission of other components of the device 100.
  • the optical fingerprint device 140 can receive the control signal of the processing unit of the electronic device 100 through the circuit board 150, and can also output the fingerprint detection signal from the optical fingerprint device 140 to the processing unit or the control unit of the electronic device 100 through the circuit board 150 Wait.
  • the optical fingerprint device 140 includes the circuit board 150.
  • a filter can be set above the sensing array of the fingerprint sensor chip to filter out stray light that affects fingerprint imaging.
  • a lens holder is set above the optical fingerprint device to filter out stray light that affects fingerprint imaging, see Figures 2 and 3, so as to ensure that the optical signals entering the sensing array are all useful optical signals containing fingerprint information.
  • the structural space that can be left for the optical fingerprint device is getting smaller and smaller, and the size of the lens holder is large, which cannot meet the size requirements. Higher demand for electronic equipment.
  • the embodiments of the present application provide an optical fingerprint device, which can not only meet the requirements of electronic devices with high size requirements, but also filter out certain stray light that affects fingerprint imaging.
  • optical fingerprint device 30 according to an embodiment of the present application will be described in detail with reference to FIGS. 4 to 7.
  • the optical fingerprint device 30 is used to be arranged below the display screen of the electronic device, and the optical fingerprint device 30 is used to be arranged above the middle frame of the electronic device, and the lower part of the middle frame can contain internal components such as batteries.
  • the framework of this component for the processing of stray light, the stray light above can be solved by coating a filter film in the form of coating on the optical fingerprint chip.
  • the stray light on the side is limited by the structural space and cannot be like lens-type optics.
  • the fingerprint device is also blocked by the lens holder, and it needs to be realized by making an additional light-shielding layer.
  • the optical fingerprint device 30 provided by the embodiment of the present application includes:
  • the optical fingerprint chip 310 includes a sensing array with a plurality of optical sensing units, the sensing array is used to receive the fingerprint light signal returned from the finger above the display screen, and the fingerprint light signal is used to obtain the fingerprint of the finger image;
  • the light shielding layer 321 is formed on the upper surface of the edge area of the optical fingerprint chip 310, wherein the light shielding layer 321 partially shields the edge area of the optical fingerprint chip 310 and does not shield the sensing area of the optical fingerprint chip 310
  • the light shielding layer 321 is used to shield stray light entering the sensing array from the edge area of the optical fingerprint chip 310.
  • the sensing area includes the area where the sensing array is located.
  • the area where the sensing array is not provided on the optical fingerprint chip 310 may be referred to as a non-sensing area, and the sensing area is usually the In the middle area of the optical fingerprint chip, the non-sensing area is usually the edge area of the optical fingerprint chip.
  • the edge area of the optical fingerprint chip 310 in the embodiment of the present application may include part or all of the non-sensing area on the optical fingerprint chip 310.
  • the light-shielding layer 321 is a hollow structure, and the hole in the middle of the light-shielding layer 321 is used to expose the sensing array to facilitate the return of useful light signals from the finger above the display screen. Enter the sensing array.
  • the embodiment of the present application does not limit the shape of the light-shielding layer 321.
  • the end surface of the light-shielding layer 321 may be a rectangle with a hole in the middle, and the shape of the hole may also be a rectangle, or it may be determined according to the shape of the sensing array. .
  • the light shielding layer 321 may be prepared on the upper surface of the edge area of the optical fingerprint chip 310 by a screen printing process.
  • the light shielding layer 321 may be prepared on the upper surface of the edge area of the optical fingerprint chip 310 by a spraying process.
  • the light shielding layer 321 in the embodiment of the present application may also be provided on at least part of the side surface of the optical fingerprint chip 310.
  • it may be at least part of the side surface from top to bottom.
  • the light-shielding layer 321 may be prepared on the upper surface of the edge area of the optical fingerprint chip 310 and at least part of the side surface of the optical fingerprint chip 310 from top to bottom through a pad printing shading process.
  • the pad printing shading process can print the shading layer on the front and side of the optical fingerprint chip, and can meet the required accuracy requirements, so as to block the front And the entry of stray light from the side can improve the performance of optical fingerprint recognition.
  • the pad printing shading process also has certain limitations. That is, when the thickness of the optical fingerprint chip is greater than or equal to 50 ⁇ m, the pad printing head (usually hemispherical) cannot be pressed down to the side surface of the optical fingerprint chip 310 under the influence of the support of the bottom substrate. 1/3 of the bottom, especially the corner where the pad printing rubber head cannot touch the bottom substrate and the chip, so there will still be some stray light entering the sensor array from the side surface that has not been pad printed, which will reduce the overall The performance of optical fingerprint recognition.
  • the light-shielding layer 321 can be made of ink, or other light-shielding materials can also be used.
  • the side surface of the optical fingerprint chip 310 may be covered with an adhesive layer 391, and the light shielding layer 321 may cover the adhesive layer 391 so that the light shielding layer 321 can cover the entire side of the optical fingerprint chip 310 surface.
  • the adhesive layer 391 may be arranged from bottom to top along the side surface of the optical fingerprint chip 310.
  • a layer of glue is applied around the side surface of the optical fingerprint chip, which can effectively support the bottom, so that the light shielding layer provided on the side surface of the optical fingerprint chip can not be affected by the thickness of the optical fingerprint chip and the interference of the bottom substrate.
  • the light shielding layer can cover the entire side surface of the optical fingerprint chip.
  • the adhesive layer 391 cannot be too thin or too thick. If it is too thin, it may not function as a bottom support. If it is too thick, it may contaminate the sensing area of the optical fingerprint chip due to its fluidity. Therefore, the thickness of the adhesive layer 391 needs to be limited. For example, the thickness of the adhesive layer 391 may be greater than or equal to 40 ⁇ m, and the thickness of the adhesive layer 391 may also be less than or equal to the thickness of the optical fingerprint chip 310.
  • the optical fingerprint device 30 further includes a circuit board 340 for transmitting signals (such as the fingerprint detection signal described above), for example, a flexible printed circuit (FPC). ).
  • the circuit board 340 can be arranged under the optical fingerprint chip 310, as shown in FIGS. 4-6.
  • the circuit board 340 can also be arranged around the optical fingerprint chip 310.
  • the circuit board 340 can be a hollow structure, and the opening in the middle can be used to set the optical fingerprint chip 310.
  • the shape of the opening can be based on the optical fingerprint chip 310.
  • the shape of the fingerprint chip 310 is determined.
  • the optical fingerprint chip 310 can be connected to the circuit board 340 through a gold wire 314, and can be connected to other peripheral circuits or other electronic devices as shown in FIG. 1A and FIG. 1B through the circuit board 340. Electrical interconnection and signal transmission of components.
  • the optical fingerprint chip 310 may receive the control signal of the processing unit of the electronic device through the circuit board 340, and may also output a fingerprint detection signal (such as a fingerprint image) to the electronic device through the circuit board 340.
  • a fingerprint detection signal such as a fingerprint image
  • the glue layer 390 may completely cover the gold wire 314 to play the role of insulation and fixation.
  • the glue layer 390 and the glue layer 391 are different.
  • the glue layer 390 is the glue layer for covering the gold wire 314, and its height is usually higher than the thickness of the optical fingerprint chip 310 for complete covering.
  • Gold wire 314; and the glue layer 391 is used to assist the light-shielding layer 321, so that the light-shielding layer 321 can cover the entire side surface of the optical fingerprint chip. Therefore, its height does not need to be higher than the thickness of the optical fingerprint chip 310.
  • the distance d1 between the two as shown in FIG. 7 is greater than or equal to a certain threshold, for example, 30 ⁇ m, so as to prevent the light shielding layer 321 from blocking the useful light signal for fingerprint imaging. It should be noted that the distance d1 in both the length direction and the width direction of the optical fingerprint chip 310 can be greater than or equal to a certain threshold.
  • the first inner side of the light shielding layer formed on the upper surface of the edge area of the optical fingerprint chip 310 and the outer side of the sensing area of the optical fingerprint chip 310 away from the first inner side may also be defined.
  • the distance between them is greater than or equal to a certain threshold to ensure the above safety distance.
  • the threshold may be the sum of the length of the sensing area and 30 ⁇ m. The embodiment of the application does not limit this.
  • the distance d2 between the second inner side of the light shielding layer formed on the upper surface of the edge area of the optical fingerprint chip 310 and the outer side of the optical fingerprint chip 310 close to the second inner side should be greater than Or equal to a certain threshold.
  • the distance d2 between the two as shown in FIG. 7 is greater than or equal to a certain threshold, for example, 80 ⁇ m. If the distance is too small, the light shielding layer may not be formed on the upper surface of the edge area of the optical fingerprint chip. It should be noted that the distance d2 in either the length direction or the width direction of the optical fingerprint chip 310 can be greater than or equal to a certain threshold.
  • first inner side and the second inner side of the light shielding layer formed on the upper surface of the edge area of the optical fingerprint chip 310 may be the same inner side or different inner sides.
  • FIG. 7 does not show all the structures of FIG. 5 or FIG. 6, for example, the filter layer 350 and the first foam structure 331 located above the optical fingerprint chip 310.
  • a first foam structure 330 and a second foam structure are provided between the circuit board 340 and the display screen, and on the periphery of the optical fingerprint chip.
  • the first foam structure 330 may be in contact with the bottom of the display screen.
  • the first foam structure 330 and the second foam structure 331 are arranged on the periphery of the optical fingerprint chip 310, which can also play a role in shielding stray light to a certain extent.
  • the first foam structure 330 and the second foam structure 331 may further include a heat dissipation layer and a buffer layer.
  • the heat dissipation layer may be used for heat dissipation of the optical fingerprint chip
  • the buffer layer may be used for buffering the electronic device from being pressed. Or damage to the display during a collision.
  • the first foam structure and the second foam structure may include foam.
  • the second foam structure 331 may also include a PET material, so as to be able to A foam structure 330 and the display screen play a certain supporting role.
  • the first foam structure may include foam
  • the second foam structure 331 may include PET material, so as to have a certain effect on the first foam structure 330 and the display screen. Supporting role.
  • the first foam structure 330 and the second foam structure 331 are both hollow structures, and the openings in the first foam structure 330 and the second foam structure 331 The holes are used to pass useful light signals for fingerprint recognition.
  • the width of the first foam structure 330 may be greater than the width of the second foam structure, so as to form a shielding portion at one end of the first foam structure 330, and the shielding portion may The edge area of the optical fingerprint chip is partially blocked, and the sensing area of the optical fingerprint chip is not blocked, or only the area of the gold wire 314 may be blocked, so as to further block stray light.
  • the arc height or package height of the gold wire 314 used to connect the circuit board 340 and the optical fingerprint chip 310 may be designed to be lower than or parallel to the second
  • the upper surface of the foam structure 331 is to prevent the shielding portion at one end of the first foam structure 330 from damaging the gold wire 314.
  • first foam structure 330 and the second foam structure 331 in the embodiment of the present application may belong to the structure of the optical fingerprint device 30, or may be a structure provided separately from the optical fingerprint device 30.
  • the implementation of this application The example does not constitute a limitation.
  • each structural member can be fixed by glue.
  • the optical fingerprint chip 310 can be fixed on the upper surface of the circuit board 340 by double-sided glue.
  • the first foam structure 330 may be fixed under the display screen by glue.
  • the optical fingerprint device may further include a filter layer 350 that covers at least the sensing area and is used to filter stray light entering the sensing array that affects fingerprint imaging.
  • a filter layer 350 that covers at least the sensing area and is used to filter stray light entering the sensing array that affects fingerprint imaging.
  • FIGS. 4 to 6 only take the filter 350 provided on the upper surface of the optical fingerprint chip 310 as an example, but the present application is not limited to this.
  • the filter 350 may be provided with an optical fingerprint chip. internal.
  • the light-shielding layer 321 covers the edge area of the filter layer 350 to avoid the formation of gaps between the light-shielding layer 321 and the filter layer 350, causing stray light to enter the sensing array and affect fingerprint imaging .
  • the filter layer 350 can be prepared on the upper surface of the optical fingerprint chip 310 by an evaporation or sputtering process, so that the optical fingerprint chip 310 can serve as a support for the filter layer 350
  • the structure can save a large thickness of the glass substrate, which is beneficial to reduce the thickness of the optical fingerprint device.
  • the filter layer 350 may include multiple stacked layers, and the embodiment of the present application does not specifically limit the number of layers of the stacked structure of the filter layer.
  • the multiple stacks are between 10 and 200 layers.
  • the plurality of stacks includes an oxide layer of silicon and an oxide layer of titanium.
  • the reflectance of the light entrance surface of the filter layer 350 is lower than a first threshold, for example 1%, so as to ensure that sufficient light signals are incident on the optical fingerprint chip 310, and thus Improve fingerprint recognition rate.
  • a first threshold for example 1%
  • the light entrance surface of the filter layer may be subjected to an optical inorganic coating treatment, or an organic blackening layer may be coated to reduce the reflectivity of the light entrance surface of the filter layer.
  • the filter layer 350 is used to reduce undesired background light in fingerprint sensing, so as to improve the optical sensing of the optical fingerprint chip 310 to the received light.
  • the filter layer 350 can specifically be used to filter out wavelengths of ambient light, for example, near-infrared light and part of red light. For example, human fingers absorb most of the energy of light with a wavelength below ⁇ 580nm. If the filter layer is designed to filter light with a wavelength from 580nm to infrared, it can greatly reduce the impact of ambient light on optical fingerprint detection in fingerprint sensing. influences.
  • the light shielding layer 321 is formed on the upper surface of the edge area of the optical fingerprint chip 310 means that the light shielding layer 321 is in direct contact with the edge area of the optical fingerprint chip 310. That is, the light shielding layer 321 may use the optical fingerprint chip 310 as a supporting structure, and no additional supporting structure is required, so that the thickness of the optical fingerprint device can be reduced.
  • the thickness of the light-shielding layer formed on the upper surface of the optical fingerprint chip 310 may be less than or equal to 20 ⁇ m, and the light-shielding layer may also be referred to as a light-shielding film or a light-shielding film layer.
  • the optical fingerprint device 30 further includes an optical component, which may be arranged above the optical fingerprint chip for the optical signal returned from the finger above the display screen. Guide to the optical fingerprint chip for optical fingerprint detection.
  • optical assembly can be implemented by any optical path guide structure in the embodiment shown in FIG. 1B.
  • optical path guide structure in the embodiment shown in FIG. 1B.
  • FIG. 1B For specific description, refer to the description of the embodiment shown in FIG. 1B. For brevity, details are not repeated here.
  • the optical assembly includes: a microlens array formed by a plurality of microlenses and at least one light-blocking layer, the at least one light-blocking layer is located under the microlens array, and each light-blocking layer is provided with A plurality of light-passing holes, and the sensing array is used for receiving light signals that are condensed to the plurality of light-passing holes through the microlens array and passed through the plurality of light-passing holes.
  • the optical fingerprint device 30 may further include an image processor, for example, a microprocessor (Micro Processing Unit, MCU), and the image processor is configured to receive fingerprints sent from the circuit board 340 A signal (for example, a fingerprint image) is detected, and fingerprint recognition is performed based on the fingerprint detection signal.
  • an image processor for example, a microprocessor (Micro Processing Unit, MCU)
  • MCU Micro Processing Unit
  • the method 40 for preparing the above-mentioned optical fingerprint device according to an embodiment of the present application will be described in detail below with reference to FIG. 8. Specifically, as shown in FIG. 8, the method 40 includes:
  • S41 Determine the position of the light shielding layer, where the position of the light shielding layer includes the upper surface of the edge area of the optical fingerprint chip and at least part of the side surface of the optical fingerprint chip from top to bottom;
  • the light-shielding layer is used to shield stray light entering the sensing area of the optical fingerprint chip from the upper surface of the edge area and the at least part of the side surface , The light-shielding layer does not block the sensing area.
  • the above-mentioned pad printing shading process can be used to prepare the light-shielding layer.
  • the above-mentioned pad printing shading process can be used to prepare the light-shielding layer.
  • the steel plate etched with the pattern of the light-shielding layer can be coated with light-shielding material, for example, ink. Then, a squeegee can be used to remove the light-shielding material in the blank portion (that is, without pattern) to make an intaglio plate. Further, the light-shielding material at the intaglio plate may be transferred to the upper surface of the edge area of the optical fingerprint chip and at least part of the side surface of the optical fingerprint chip from the top to the bottom via the glue head.
  • light-shielding material for example, ink.
  • a charge coupled device (CCD) grasping device and a module adjustment device such as a motor servo platform
  • CCD charge coupled device
  • a module adjustment device such as a motor servo platform
  • a photograph is taken to identify the position of the light-shielding layer, and then X-axis and Y-axis adjustment and positioning are performed through a motor servo platform, and the light-shielding material at the intaglio plate is transferred to the position of the light-shielding layer via a rubber head.
  • the rubber head used for pad printing has at least the characteristics of anti-static, dirt-resistant, and soft materials.
  • the rubber head may be a silicone head.
  • the method further includes:
  • Preparing the light-shielding layer at the position of the light-shielding layer includes:
  • the light-shielding layer is prepared on the outer surface of the adhesive layer, so that the light-shielding layer covers the entire side surface of the optical fingerprint chip.
  • the front and side surfaces of the optical fingerprint chip can be completely combined Ink wrapping can completely block the stray light from the front and side of the optical fingerprint chip, thereby further optimizing and improving the performance of optical fingerprint recognition.
  • optical fingerprint device 30 described in the embodiment of the present application can be manufactured by the method for preparing the optical fingerprint device provided in the embodiment of the present application.
  • the method for preparing the optical fingerprint device provided in the embodiment of the present application.
  • the electronic device 700 may include a display screen 710 and an optical fingerprint device 720, wherein the optical fingerprint device 720 is arranged below the display screen 710 .
  • the optical fingerprint device 720 may be the optical fingerprint device 30 in the foregoing embodiment. For specific implementation, refer to the relevant description of the foregoing embodiment, and details are not described herein again.
  • the display screen 710 may correspond to the display screen 120 in the embodiment shown in FIG. 1B.
  • details are not repeated here.
  • the display screen 710 may be any display screen described above.
  • the display screen 710 may specifically be a self-luminous display (such as an OLED display), and it includes a plurality of self-luminous display units (such as an OLED pixel or an OLED light source).
  • a part of the self-luminous display unit in the display screen can be used as an excitation light source for the optical fingerprint device to perform optical fingerprint detection, and is used to emit light signals to the fingerprint detection area on the display screen for optical fingerprint detection.
  • the electronic device 700 may further include a middle frame 730, which is used to provide the electronic device 700 between the display screen 710 and the battery 740 for carrying internal
  • the frame of various components, the internal components include but are not limited to the motherboard, camera, cable, various sensors, microphones, earpieces and other components.
  • the middle frame 730 may be connected to the bottom of the display screen 710 of the electronic device 700 through a foam 750 to realize the under-screen optical fingerprint detection.
  • the middle frame 730 may be made of metal or alloy material, or may be made of plastic material, which is not limited in the embodiment of the present application.
  • a groove may be provided on the upper surface of the middle frame 730, the optical fingerprint device 720 is arranged in the groove, and the optical fingerprint device is fixed to the groove through the middle frame 730. Below the display screen 710 to realize the under-screen optical fingerprint detection.
  • the middle frame 730 may also be provided with an opening, and the optical fingerprint device 720 is provided in the opening.
  • the optical fingerprint chip in the optical fingerprint device 720 may be fixed on a flexible support plate, and the flexible support plate may be curved to fix the optical fingerprint device 720 in the opening.
  • the flexible support plate can be in a "U" shape, or it can be Type, the embodiment of the present application does not limit this.
  • the disclosed system, device, and method may be implemented in other ways.
  • the device embodiments described above are merely illustrative, for example, the division of the units is only a logical function division, and there may be other divisions in actual implementation, for example, multiple units or components may be combined or It can be integrated into another system, or some features can be ignored or not implemented.
  • the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may be in electrical, mechanical or other forms.
  • the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the objectives of the solutions of the embodiments.
  • the functional units in the various embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units may be integrated into one unit.
  • the function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer readable storage medium.
  • the technical solution of the present application essentially or the part that contributes to the existing technology or the part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including Several instructions are used to make a computer device (which may be a personal computer, a server, or a network device, etc.) execute all or part of the steps of the method described in each embodiment of the present application.
  • the aforementioned storage media include: U disk, mobile hard disk, read-only memory (Read-Only Memory, ROM), random access memory (Random Access Memory, RAM), magnetic disks or optical disks and other media that can store program codes. .

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Image Input (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

一种光学指纹装置（30）及其制备方法、电子设备（100），该光学指纹装置（30）应用在具有显示屏（120）的电子设备（100），该光学指纹装置（30）用于设置在该显示屏（120）的下方，该光学指纹装置（30）包括：光学指纹芯片（310），包括具有多个光学感应单元的感应阵列，该感应阵列用于接收从该显示屏（120）上方的手指返回的指纹光信号，该指纹光信号用于获取该手指的指纹图像；遮光层（321），形成在该光学指纹芯片（310）的边缘区域的上表面以及该光学指纹芯片（310）的由上自下的至少部分侧表面，用于遮挡从该边缘区域的上表面以及该至少部分侧表面进入该感应阵列的杂散光，其中，该遮光层（321）不遮挡该光学指纹芯片（310）的感应区域。光学指纹装置（30）能够提升指纹识别的性能。

Description

光学指纹装置及其制备方法、电子设备
本申请要求于2019年11月4日提交中国专利局、申请号为PCT/CN2019/115439、发明名称为“光学指纹装置和电子设备”的PCT申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及指纹识别技术领域，并且更具体地，涉及一种光学指纹装置及其制备方法、电子设备。
背景技术
伴随着消费者对移动终端屏幕占比要求越来越高，屏下指纹识别技术的实用化已成为大众所需。
目前市面上常见的屏下光学指纹识别为镜头式的光学指纹装置，如图2所示，由于光学指纹芯片对光的敏感性，故需要将芯片利用不到的杂散光阻挡或过滤掉，从而实现指纹识别性能的提升，其中镜头式光学指纹装置是通过镜头支架来阻挡光学指纹芯片侧边的杂散光，如图3，滤光片过滤光学指纹芯片上方的杂散光，但是镜头式的镜头支架体积较大，对空间要求较高。
发明内容
本申请实施例提供一种光学指纹装置及其制备方法、电子设备，能够提升指纹识别性能。
第一方面，提供了一种光学指纹装置，应用于具有显示屏的电子设备，该光学指纹装置用于设置在该显示屏的下方，该光学指纹装置包括：光学指纹芯片，包括具有多个光学感应单元的感应阵列，该感应阵列用于接收从该显示屏上方的手指返回的指纹光信号，该指纹光信号用于获取该手指的指纹图像；遮光层，形成在该光学指纹芯片的边缘区域的上表面以及该光学指纹芯片的由上自下的至少部分侧表面，用于遮挡从该边缘区域的上表面以及该至少部分侧表面进入该感应阵列的杂散光，其中，该遮光层不遮挡该光学指纹芯片的感应区域。
在一些可能的实现方式中，该遮光层通过移印遮光工艺形成在该边缘区 域的上表面以及该至少部分侧表面。
在一些可能的实现方式中，该光学指纹芯片的自下而上的至少部分侧表面包覆有胶层，该遮光层包覆该胶层以覆盖该光学指纹芯片的整个侧表面。
在一些可能的实现方式中，该胶层的厚度不小于40μm。
在一些可能的实现方式中，该胶层的厚度不大于该光学指纹芯片的厚度。
在一些可能的实现方式中，该遮光层的厚度不大于20μm。
在一些可能的实现方式中，形成在该边缘区域的上表面的该遮光层的第一内侧与靠近该第一内侧的感应区域的外侧的距离不小于30μm。
在一些可能的实现方式中，形成在该边缘区域的上表面的该遮光层的第二内侧与靠近该第二内侧的光学指纹芯片的外侧的距离不小于80μm。
在一些可能的实现方式中，该光学指纹装置还包括：滤光层，设置在该光学指纹芯片的上表面，其中，该滤光层至少覆盖该感应区域。
在一些可能的实现方式中，该遮光层包覆该滤光层的边缘区域。
在一些可能的实现方式中，该光学指纹装置还包括：电路板，设置在该光学指纹芯片的下方，该电路板通过金线与该光学指纹芯片电连接，其中，该遮光层包覆该电路板上未被该光学指纹芯片覆盖的区域以及该金线。
在一些可能的实现方式中，该光学指纹芯片的外围设置有第一泡棉结构和第二泡棉结构，其中，该第一泡棉结构设置在该第二泡棉结构的上方，该第二泡棉结构设置在该电路板的上方，该第二泡棉结构的上表面不低于该遮光层的上表面。
在一些可能的实现方式中，该第二泡棉结构的上表面不低于该金线的弧高。
在一些可能的实现方式中，该第一泡棉结构的宽度大于该第二泡棉结构的宽度以在该第一泡棉结构的靠近该光学指纹芯片的一端形成遮挡部，该遮挡部部分遮挡该光学指纹芯片的边缘区域，并且不遮挡该光学指纹芯片的感应区域。
在一些可能的实现方式中，该遮光层为油墨。
在一些可能的实现方式中，该光学指纹装置还包括：光学组件，设置在该光学指纹芯片的上方，用于将从该显示屏上方的手指返回的光信号引导至该光学指纹芯片，以进行光学指纹检测。
在一些可能的实现方式中，该光学组件包括：多个微透镜形成的微透镜 阵列和至少一挡光层，该至少一挡光层位于该微透镜阵列下方，每个挡光层中设置有多个通光小孔，该感应阵列用于接收经由该微透镜阵列会聚到该多个通光小孔的并通过该多个通光小孔的光信号。
在一些可能的实现方式中，该电子设备的中框设置有开槽或开孔，该光学指纹装置用于设置在该开槽或该开孔中。
第二方面，提供了一种电子设备，包括：显示屏；如第一方面或第一方面的任一可能的实现方式中的光学指纹装置，该光学指纹装置设置在该显示屏的下方。
在一些可能的实现方式中，该显示屏为有机发光二极管OLED显示屏，该显示屏包括多个OLED光源，其中该光学指纹装置采用至少部分OLED光源作为光学指纹检测的激励光源。
第三方面，提供了一种制备光学指纹装置的方法，该方法包括：确定遮光层的位置，该遮光层的位置包括该光学指纹芯片的边缘区域的上表面以及该光学指纹芯片的自上而下的至少部分侧表面；在该遮光层的位置上制备该遮光层，该遮光层用于遮挡从该边缘区域的上表面以及该至少部分侧表面进入该光学指纹芯片的感应区域的杂散光，该遮光层不遮挡该光学指纹芯片的感应区域。
在一些可能的实现方式中，该方法还包括：在该遮光层的自下而上的至少部分侧表面点胶层；在该遮光层的位置上制备该遮光层，包括：在该胶层的外表面制备该遮光层，以使得该遮光层覆盖该光学指纹芯片的整个侧表面。
在一些可能的实现方式中，该在该遮光层的位置上制备该遮光层，包括：根据该遮光层的位置，获取该遮光层的图案；将蚀刻有该遮光层的图案的钢板上涂满遮光材料，并通过去除空白部分的遮光材料以制成凹版；将该凹版处的遮光材料转印到该遮光层的位置上。
在一些可能的实现方式中，该将该凹版处的遮光材料转印到该遮光层的位置上，包括：通过模组调节装置的调节定位，将该凹版处的遮光材料经由胶头转印到该遮光层的位置上。
在一些可能的实现方式中，该模组调节装置是电机伺服平台。
在一些可能的实现方式中，该确定遮光层的位置，包括：根据电荷耦合器件CCD的拍照识别，确定该遮光层的位置。
在一些可能的实现方式中，该胶层的厚度不小于40μm。
在一些可能的实现方式中，该胶层的厚度不大于该光学指纹芯片的厚度。
在一些可能的实现方式中，该遮光层的厚度不大于20μm。
在一些可能的实现方式中，形成在该边缘区域的上表面的该遮光层的第一内侧与靠近该第一内侧的该感应区域的外侧的距离不小于30μm。
在一些可能的实现方式中，形成在该边缘区域的上表面的该遮光层的第二内侧与靠近该第二内侧的该光学指纹芯片的外侧的距离不小于80μm。
在一些可能的实现方式中，该胶头至少具有以下一种特性：防静电、耐脏污以及软性材料。
在一些可能的实现方式中，该胶头为硅胶头。
在一些可能的实现方式中，该遮光层为油墨。
附图说明
图1A是根据本申请一实施例的电子设备的定向视图。
图1B是图1A所示的电子设备沿A-A’的部分剖面结构示意图。
图2是一种光学指纹装置的结构示意性图。
图3为图2所示的光学指纹装置的工作原理图。
图4是本申请实施例提供的一种光学指纹装置的结构示意图。
图5是本申请实施例提供的另一光学指纹装置的结构示意图。
图6是本申请实施例提供的再一光学指纹装置的结构示意图。
图7是图5和图6所示的光学指纹装置的俯视图。
图8是根据本申请实施例的制备光学指纹装置的方法的示意性框图。
图9是根据本申请实施例的电子设备的示意性框图。
图10是根据本申请实施例的电子设备的结构示意图。
具体实施方式
下面将结合附图，对本申请实施例中的技术方案进行描述。
本申请实施例的技术方案可以应用于各种电子设备。
例如，智能手机、笔记本电脑、平板电脑、游戏设备等便携式或移动计算设备，以及电子数据库、汽车、银行自动柜员机(Automated Teller Machine，ATM)等其他电子设备。但本申请实施例对此并不限定。
本申请实施例的技术方案可以用于生物特征识别技术。其中，生物特征 识别技术包括但不限于指纹识别、掌纹识别、虹膜识别、人脸识别以及活体识别等识别技术。为了便于说明，下文以指纹识别技术为例进行说明。
本申请实施例的技术方案可以用于屏下指纹识别技术。屏下指纹识别技术是指将指纹识别模组安装在显示屏下方，从而实现在显示屏的显示区域内进行指纹识别操作，不需要在电子设备正面除显示区域外的区域设置指纹采集区域。具体地，指纹识别模组使用从电子设备的显示组件的顶面返回的光来进行指纹感应和其他感应操作。这种返回的光携带与显示组件的顶面接触的物体(例如手指)的信息，位于显示组件下方的指纹识别模组通过采集和检测这种返回的光以实现屏下指纹识别。其中，指纹识别模组的设计可以为通过恰当地配置用于采集和检测返回的光的光学元件来实现期望的光学成像。
图1A和图1B示出了屏下指纹识别技术可以适用的电子设备100的示意图，其中图1A为电子设备100的正面示意图，图1B为图1A所示的电子设备100沿A-A’的部分剖面结构示意图。
如图1A和图1B所示，电子设备100可以包括显示屏120和光学指纹装置140。
显示屏120可以为自发光显示屏，其采用具有自发光的显示单元作为显示像素。比如显示屏120可以为有机发光二极管(Organic Light-Emitting Diode，OLED)显示屏或者微型发光二极管(Micro-LED)显示屏。在其他可替代实施例中，显示屏120也可以为液晶显示屏(Liquid Crystal Display,LCD)或者其他被动发光显示屏，本申请实施例对此不做限制。
此外，显示屏120还可以具体为触控显示屏，其不仅可以进行画面显示，还可以检测用户的触摸或者按压操作，从而为用户提供一个人机交互界面。比如，在一种实施例中，电子设备100可以包括触摸传感器，所述触摸传感器可以具体为触控面板(Touch Panel,TP)，其可以设置在所述显示屏120表面，也可以部分集成或者整体集成到所述显示屏120内部，从而形成所述触控显示屏。
具体来说，光学指纹装置140可以包括具有光学感应阵列的指纹传感器芯片(后面也称为光学指纹传感器或光学指纹芯片)。其中，光学感应阵列包括多个光学感应单元，每个光学感应单元可以具体包括光探测器或者光电传感器。或者说，光学指纹装置140可以包括光探测器(Photo detector)阵 列(或称为光电探测器阵列、光电传感器阵列、光学传感器阵列，感应阵列)，其包括多个呈阵列式分布的光探测器。
如图1A所示，光学指纹装置140可以设置在所述显示屏120的下方的局部区域，从而使得光学指纹装置140的指纹采集区域(或指纹检测区域)130至少部分位于所述显示屏120的显示区域102内。
当然，在其他可替代实施例中，光学指纹装置140也可以设置在其他位置，比如显示屏120的侧面或者电子设备100的边缘非透光区域。这种情况下，可以通过光路设计将显示屏120的至少部分显示区域的光信号导引到光学指纹装置140，从而使得所述指纹采集区域130实际上位于所述显示屏120的显示区域内。
在本申请的一些实施例中，光学指纹装置140可以仅包括一个指纹传感器芯片，此时光学指纹装置140的指纹采集区域130的面积较小且位置固定，因此用户在进行指纹输入时需要将手指按压到所述指纹采集区域130的特定位置，否则光学指纹装置140可能无法采集到指纹图像而造成用户体验不佳。
在本申请的另一些实施例中，光学指纹装置140可以具体包括多个指纹传感器芯片；所述多个指纹传感器芯片可以通过拼接方式并排设置在所述显示屏120的下方，且所述多个指纹传感器芯片的感应区域共同构成所述光学指纹装置140的指纹采集区域130。也就是说，所述光学指纹装置140的指纹采集区域130可以包括多个子区域，每个子区域分别对应于其中一个指纹传感器芯片的感应区域，从而将所述光学指纹模组130的指纹采集区域130可以扩展到所述显示屏的下半部分的主要区域，即扩展到手指惯常按压区域，从而实现盲按式指纹输入操作。可替代地，当所述指纹传感器芯片数量足够时，所述指纹检测区域130还可以扩展到半个显示区域甚至整个显示区域，从而实现半屏或者全屏指纹检测。
应理解，本申请实施例对所述多个指纹传感器芯片的具体形式不做限定。例如，所述多个指纹传感器芯片可以分别是独立封装的指纹传感器芯片，也可以是封装在同一个芯片封装体内的多个芯片(Die)。又例如，还可以通过半导体工艺在同一个芯片(Die)的不同区域上制作形成所述多个指纹传感器芯片。
如图1B所示，光学指纹装置140的光学感应阵列的所在区域或者光感应范围对应所述光学指纹装置140的指纹采集区域130。其中，光学指纹装 置140的指纹采集区域130可以等于或不等于光学指纹装置140的光学感应阵列的所在区域的面积或者光感应范围，本申请实施例对此不做具体限定。
例如，通过光线准直的光路设计，光学指纹装置140的指纹采集区域130可以设计成与所述光学指纹装置140的感应阵列的面积基本一致。
又例如，通过汇聚光线的光路设计或者反射光线的光路设计，可以使得所述光学指纹装置140的指纹采集区域130的面积大于所述光学指纹装置140感应阵列的面积。
在本申请一些实施例中，所述光学指纹装置140还可以包括光学组件，所述光学组件可以设置在所述感应阵列的上方，其可以具体包括滤光层(Filter)、导光层或光路引导结构以及其他光学元件，所述滤光层可以用于滤除穿透手指的环境光，例如，干扰成像的红外光，而所述导光层或光路引导结构主要用于从手指表面反射回来的反射光引导至所述感应阵列进行光学检测。
下面对光学指纹装置140的光路设计进行示例性说明。
作为一个实施例，所述光学指纹装置140可以采用具有高深宽比的通孔阵列的光学准直器，所述光学准直器可以具体为在半导体硅片制作而成的准直器(Collimator)层，其具有多个准直单元或者微孔，所述准直单元可以具体为小孔，从手指反射回来的反射光中，垂直入射到所述准直单元的光线可以穿过并被其下方的指纹传感器芯片接收，而入射角度过大的光线在所述准直单元内部经过多次反射被衰减掉，因此每一个指纹传感器芯片基本只能接收到其正上方的指纹纹路反射回来的反射光，能够有效提高图像分辨率，进而提高指纹识别效果。
进一步地，当光学指纹装置140包括多个指纹传感器芯片时，可以为每个指纹传感器芯片的光学感应阵列中的一个光学感应单元配置一个准直单元，并贴合设置在其对应的光学感应单元的上方。当然，所述多个光学感应单元也可以共享一个准直单元，即所述一个准直单元具有足够大的孔径以覆盖多个光学感应单元。由于一个准直单元可以对应多个光学感应单元，破坏了显示屏120的空间周期和指纹传感器芯片的空间周期的对应性，因此，即使显示屏120的发光显示阵列的空间结构和指纹传感器芯片的光学感应阵列的空间结构类似，也能够有效避免光学指纹装置140利用经过显示屏120的光信号进行指纹成像生成莫尔条纹，有效提高了光学指纹装置140的指纹识 别效果。
作为另一个实施例，所述光学指纹装置140可以采用基于光学镜头的光路设计，所述光学镜头可以包括光学透镜(Lens)层，其具有一个或多个透镜单元，比如一个或多个非球面透镜组成的透镜组，其用于将从手指反射回来的反射光汇聚到其下方的指纹传感器芯片的感应阵列，以使得所述感应阵列可以基于所述反射光进行成像，从而得到所述手指的指纹图像。所述光学透镜层在所述透镜单元的光路中还可以形成有针孔，所述针孔可以配合所述光学透镜层扩大光学指纹装置140的视场，以提高所述光学指纹装置140的指纹成像效果。
进一步地，当光学指纹装置140包括多个指纹传感器芯片时，可以为每一个指纹传感器芯片配置一个光学镜头进行指纹成像，或者为多个指纹传感器芯片配置一个光学镜头来实现光线汇聚和指纹成像。甚至于，当一个指纹传感器芯片具有两个感应阵列(Dual Array)或多个感应阵列(Multi-Array)时，也可以为这个指纹传感器芯片配置两个或多个光学镜头配合所述两个感应阵列或多个感应阵列进行光学成像，从而减小成像距离并增强成像效果。
作为再一个实施例，所述光学指纹装置140可以采用微透镜(Micro-Lens)层的光路设计，所述微透镜层可以具有由多个微透镜形成的微透镜阵列，其可以通过半导体生长工艺或者其他工艺形成在所述指纹传感器芯片的感应阵列上方，并且每一个微透镜可以分别对应于所述感应阵列的其中一个感应单元。所述微透镜层和所述感应单元之间还可以形成其他光学膜层，比如介质层或者钝化层，更具体地，所述微透镜层和所述感应单元之间还可以包括具有微孔的挡光层，其中所述微孔形成在其对应的微透镜和感应单元之间，所述挡光层可以阻挡相邻微透镜和感应单元之间的光学干扰，并使光线通过所述微透镜汇聚到所述微孔内部并经由所述微孔传输到所述微透镜对应的感应单元，以进行光学指纹成像。
应当理解，上述光路引导结构的几种实现方案可以单独使用也可以结合使用，比如，可以在所述准直器层或者所述光学透镜层下方进一步设置微透镜层。当然，在所述准直器层或者所述光学透镜层与所述微透镜层结合使用时，其具体叠层结构或者光路可能需要按照实际需要进行调整。
所述光学指纹装置140可以用于采集用户的指纹信息(比如指纹图像信息)。
作为一种可选的实施例，所述显示屏120可以采用具有自发光显示单元的显示屏，比如有机发光二极管(Organic Light-Emitting Diode，OLED)显示屏或者微型发光二极管(Micro-LED)显示屏。以采用OLED显示屏为例，光学指纹装置140可以利用OLED显示屏的位于指纹采集区域130的显示单元(即OLED光源)来作为光学指纹检测的激励光源。
当手指触摸、按压或者接近(为便于描述，在本申请中统称为按压)在指纹采集区域130时，显示屏120向指纹采集区域130上方的手指发出一束光，这一束光在手指的表面发生反射形成反射光或者经过手指的内部散射后而形成散射光，在相关专利申请中，为便于描述，上述反射光和散射光统称为反射光。由于指纹的嵴(ridge)与峪(vally)对于光的反射能力不同，因此，来自指纹嵴的反射光和来自指纹峪的发生过具有不同的光强，反射光经过显示屏120后，被光学指纹装置140中的指纹传感器芯片所接收并转换为相应的电信号，即指纹检测信号；基于所述指纹检测信号便可以获得指纹图像数据，并且可以进一步进行指纹匹配验证，从而在所述电子设备100实现光学指纹识别功能。
由此可见，用户需要对电子设备100进行指纹解锁或者其他指纹验证的时候，只需要将手指按压在位于显示屏120的指纹采集区域130，便可以实现指纹特征的输入操作。由于指纹特征的采集可以在显示屏120的显示区域102的内部实现，采用上述结构的电子设备100无需其正面专门预留空间来设置指纹按键(比如Home键)，因而可以采用全面屏方案。因此，所述显示屏120的显示区域102可以基本扩展到所述电子设备100的整个正面。
在其他替代实施例中，所述光学指纹装置140也可以采用内置光源或者外置光源来提供用于进行指纹检测识别的光信号。在这种情况下，光学指纹装置140不仅可以适用于如OLED显示屏等自发光显示屏，还可以适用于非自发光显示屏，比如液晶显示屏或者其他的被动发光显示屏。
以应用在具有背光模组和液晶面板的液晶显示屏为例，为支持液晶显示屏的屏下指纹检测，电子设备100的光学指纹系统还可以包括用于光学指纹检测的激励光源，所述激励光源可以具体为红外光源或者特定波长非可见光的光源，其可以设置在所述液晶显示屏的背光模组下方或者设置在电子设备100的保护盖板下方的边缘区域，而光学指纹装置140可以设置液晶面板或者保护盖板的边缘区域下方并通过光路引导以使得指纹检测光可以到达所 述光学指纹装置140；或者，光学指纹装置140也可以设置在所述背光模组下方，且所述背光模组通过对扩散片、增亮片、反射片等膜层进行开孔或者其他光学设计以允许指纹检测光穿过液晶面板和背光模组并到达光学指纹装置140。当采用所述光学指纹装置140采用内置光源或者外置光源来提供用于进行指纹检测的光信号时，其检测原理可以相同。
如图1A所示，电子设备100还可以包括透明保护盖板110，比如玻璃盖板或者蓝宝石盖板，其位于显示屏120的上方并覆盖所述电子设备100的正面，且盖板110表面还可以设置有保护层。因此，本申请实施例中，所谓的手指按压显示屏120实际上可以是指手指按压在显示屏120上方的盖板110或者覆盖所述盖板110的保护层表面。
如图1B所示，光学指纹装置140的下方还可以设置有电路板150，比如软性电路板(Flexible Printed Circuit，FPC)。
光学指纹装置140可以通过焊盘焊接到电路板150，具体地，所述光学指纹装置140中的指纹传感器芯片可以通过焊盘连接到电路板150，并通过电路板150实现与其他外围电路或者电子设备100的其他元件的电性互连和信号传输。比如，光学指纹装置140可以通过电路板150接收电子设备100的处理单元的控制信号，并且还可以通过电路板150将来自光学指纹装置140的指纹检测信号输出给电子设备100的处理单元或者控制单元等。
在一些实施例中，也可以认为所述光学指纹装置140包括所述电路板150。
在本申请实施例中，可以在所述指纹传感器芯片的感应阵列上方设置滤光片滤除影响指纹成像的杂散光，在一些实施例中，对于通过光学镜头实现的光学指纹装置，还可以在光学指纹装置的上方设置镜头支架，以滤除影响指纹成像的杂散光，参见图2和图3，从而保证进入感应阵列的光信号皆为包含指纹信息的有用光信号。但是，随着电子设备的其他功能功耗不断提高，对电池的容量需求的日益增长，能够留给光学指纹装置的结构空间越来越小，而镜头支架的体积较大，不能满足对尺寸要求较高的电子设备的需求。
因此，本申请实施例提供了一种光学指纹装置，即能满足对尺寸要求较高的电子设备的需求，又能够滤除一定的影响指纹成像的杂散光。
以下，结合图4至图7，详细说明根据本申请实施例的光学指纹装置30。
具体地，该光学指纹装置30用于设置在电子设备的显示屏的下方，并 且该光学指纹装置30用于设置在电子设备的中框的上方，而中框的下方可以容纳有电池等内部各种组件的框架。其中，对于杂散光的处理上，上方的杂散光可通过对光学指纹芯片上方镀膜的形式镀上滤光膜层来解决，侧方的杂散光由于受到结构空间的限制，无法像镜头式的光学指纹装置一样由镜头支架来阻挡，则需要通过额外制作遮光层来实现。
需要说明的是，为便于说明，在本申请的实施例中，相同的附图标记表示相同的部件，并且为了简洁，在不同实施例中，省略对相同部件的详细说明。应理解，附图示出的本申请实施例中的各种部件的厚度、长宽等尺寸，以及集成装置的整体厚度、长宽等尺寸仅为示例性说明，而不应对本申请构成任何限定。
如图4所示，本申请实施例提供的光学指纹装置30包括：
光学指纹芯片310，包括具有多个光学感应单元的感应阵列，所述感应阵列用于接收从所述显示屏上方的手指返回的指纹光信号，所述指纹光信号用于获取所述手指的指纹图像；
遮光层321，形成在所述光学指纹芯片310的边缘区域的上表面，其中，所述遮光层321部分遮挡所述光学指纹芯片310的边缘区域，并且不遮挡所述光学指纹芯片310的感应区域，所述遮光层321用于遮挡从所述光学指纹芯片310的边缘区域进入所述感应阵列的杂散光。
应理解，在本申请实施例中，所述感应区域包括所述感应阵列所在区域，所述光学指纹芯片310上未设置感应阵列的区域可以称为非感应区域，所述感应区域通常为所述光学指纹芯片的中间区域，所述非感应区域通常为所述光学指纹芯片的边缘区域。
本申请实施例中的所述光学指纹芯片310的边缘区域可以包括所述光学指纹芯片310上的非感应区域中的部分或全部。
应理解，在本申请实施例中，所述遮光层321为中空结构，所述遮光层321中间的孔用于露出所述感应阵列，以便于从所述显示屏上方的手指返回的有用光信号进入所述感应阵列。
本申请实施例对于所述遮光层321的形状不作限定，例如，所述遮光层321的端面可以是中间开孔的矩形，该开孔的形状也可以是矩形，或者根据该感应阵列的形状确定。
作为一个实施例，可以通过丝网印刷工艺在所述光学指纹芯片310的边 缘区域的上表面制备所述遮光层321。
作为另一实施例，可以通过喷涂工艺在所述光学指纹芯片310的边缘区域的上表面制备所述遮光层321。
可选地，如图5所示，本申请实施例中的遮光层321还可以设置在所述光学指纹芯片310的至少部分侧表面。例如，可以是自上而下的至少部分侧表面。
作为一实施例，可以通过移印遮光工艺在所述光学指纹芯片310的边缘区域的上表面以及所述光学指纹芯片310自上而下的至少部分侧表面制备所述遮光层321。
相比于传统的遮光工艺，如丝网印刷工艺或喷涂工艺，移印遮光工艺可以做到在光学指纹芯片的正面和侧面都印刷遮光层，并且能够达到所需的精度要求，从而可以遮挡正面和侧面的杂散光的进入，即可以提升光学指纹识别的性能。
但移印遮光工艺也有一定的局限，即当光学指纹芯片的厚度大于或等于50μm，受底部基板支撑的影响，移印胶头(通常为半球形)无法下压到光学指纹芯片310侧表面最底部的1/3处，尤其是移印胶头无法接触到底部基板与芯片连接的拐角处，因此仍会有部分杂散光从该未移印到的侧表面进入感应阵列，从而会适当降低整体光学指纹识别的性能。
可选地，遮光层321可以采用油墨，或者也可以采用其他遮光材料。
可选地，如图6所示，所述光学指纹芯片310的侧表面可以包覆有胶层391，遮光层321可以包覆胶层391以使得遮光层321可以覆盖光学指纹芯片310的整个侧表面。可选地，该胶层391可以是沿着光学指纹芯片310的侧表面自下而上设置。
先在光学指纹芯片的侧表面四周点一层胶水，可以有效起到底部支撑作用，从而使得在光学指纹芯片侧表面设置的遮光层能够不受光学指纹芯片的厚度以及底部基板干涉的影响。进而可以使得遮光层能够覆盖光学指纹芯片的整个侧表面。
通常，该胶层391不能太薄也不能太厚，如果太薄的话，可能起不到底部支撑的作用，而如果太厚的话，由于其流动性，则可能会污染光学指纹芯片的感应区域。因此，需要对胶层391的厚度做一定限制。例如，该胶层391的厚度可以大于或等于40μm，该胶层391的厚度也可以小于或等于光学指 纹芯片310的厚度。
可选地，在本申请一些实施例中，所述光学指纹装置30还包括用于传输信号(例如前文所述的指纹检测信号)的电路板340，例如，柔性电路板(Flexible Printed Circuit，FPC)。该电路板340可以设置在所述光学指纹芯片310的下方，如图4-图6所示。可替代地，该电路板340也可以设置在光学指纹芯片310的四周，例如，电路板340可以是一个中空结构，其中间的开口可以用于设置光学指纹芯片310，该开口的形状可以根据光学指纹芯片310的形状确定。
可选地，所述光学指纹芯片310可以通过金线314连接到所述电路板340，并通过所述电路板340实现与其他外围电路或者如图1A和图1B所示的电子设备中的其他元件的电性互连和信号传输。比如，所述光学指纹芯片310可以通过所述电路板340接收所述电子设备的处理单元的控制信号，并且还可以通过所述电路板340将指纹检测信号(例如指纹图像)输出给所述电子设备的处理单元或者控制单元等。
可选地，在本申请一个实施例中，胶层390可以完全包覆金线314，以起到绝缘和固定的作用。
需要说明的是胶层390和胶层391是不同的，胶层390是用于包覆金线314的胶层，通常其高度是高于光学指纹芯片310的厚度的，以用于完全包覆金线314；而胶层391则是用来辅助遮光层321的，是为了使得遮光层321能够覆盖光学指纹芯片的整个侧表面。因此，其高度不需要高于光学指纹芯片310的厚度。
在一个实施例中，如图7所示，形成在光学指纹芯片310的边缘区域的上表面的遮光层的第一内侧与靠近该第一内侧的光学指纹芯片310的感应区域的外侧之间需要有一定的安全距离。即如图7所示的二者之间的距离d1大于或等于一定阈值，例如，30μm，以防止遮光层321遮挡到用于指纹成像的有用光信号。需要说明的是，无论是光学指纹芯片310的长度方向还是宽度方向上的距离d1都可以大于或等于一定阈值。
可选地，在本申请实施例中，也可以通过限定形成在光学指纹芯片310的边缘区域的上表面的遮光层的第一内侧与远离该第一内侧的光学指纹芯片310的感应区域的外侧之间的距离大于或等于一定阈值来保证上述安全距离。例如，该阈值可以是感应区域的长度与30μm之和。本申请实施例对此 不作限定。
在另一实施例中，如图7所示，形成在光学指纹芯片310的边缘区域的上表面的遮光层的第二内侧与靠近该第二内侧的光学指纹芯片310的外侧的距离d2应大于或等于一定阈值。如图7所示的二者之间的距离d2大于或等于一定阈值，例如，80μm。如果距离过小，可能会导致遮光层无法形成在光学指纹芯片的边缘区域的上表面。需要说明的是，无论是光学指纹芯片310的长度方向还是宽度方向上的距离d2都可以大于或等于一定阈值。
需要说明的是，在本申请实施例中，形成在光学指纹芯片310的边缘区域的上表面的遮光层的第一内侧和第二内侧可以是同一内侧，也可以是不同内侧。
另外，图7并未示出图5或图6的全部结构，例如，位于光学指纹芯片310上方的滤光层350以及第一泡棉结构331。
在本申请一些实施例中，如图4-图6所示，在所述电路板340和所述显示屏之间，且在所述光学指纹芯片的外围设置有第一泡棉结构330和第二泡棉结构331，其中，所述第一泡棉结构330设置在所述第二泡棉结构331的上方。可选地，所述第一泡棉结构330可以与显示屏的下方接触。
在本申请实施例中，所述第一泡棉结构330和第二泡棉结构331设置在所述光学指纹芯片310的外围，也可以起到一定程度的遮挡杂散光的作用，可选地，所述第一泡棉结构330和第二泡棉结构331还可以包括散热层和缓冲层，其中，该散热层可以用于光学指纹芯片的散热，该缓冲层可以用于缓冲电子设备受到挤压或碰撞时对显示屏的损伤。
在本申请一些实施例中，所述第一泡棉结构和所述第二泡棉结构可以包括泡棉，可选地，所述第二泡棉结构331还可以包括PET材料，从而能够对第一泡棉结构330和显示屏起到一定的支撑作用。
在本申请另一些实施例中，所述第一泡棉结构可以包括泡棉，所述第二泡棉结构331可以包括PET材料，从而能够对第一泡棉结构330和显示屏起到一定的支撑作用。
在本申请一些实施例中，所述第一泡棉结构330和所述第二泡棉结构331皆为中空结构，所述第一泡棉结构330和所述第二泡棉结构331中的开孔用于通过用于指纹识别的有用光信号。
在一些实施例中，可以设置所述第一泡棉结构330的宽度大于所述第二 泡棉结构的宽度，以在所述第一泡棉结构330的一端形成遮挡部，所述遮挡部可以部分遮挡所述光学指纹芯片的边缘区域，并且不遮挡所述光学指纹芯片的感应区域，或者也可以仅遮挡所述金线314的区域，从而能够起到进一步遮挡杂散光的作用。
可选地，在本申请一个实施例中，用于连接所述电路板340和所述光学指纹芯片310的金线314的弧高或封装高度可以被设计为低于或平行于所述第二泡棉结构331的上表面，以避免第一泡棉结构330一端的遮挡部损伤该金线314。
需要说明的是，本申请实施例中的第一泡棉结构330和第二泡棉结构331可以是属于光学指纹装置30的结构，也可以是单独于光学指纹装置30设置的结构，本申请实施例对此不构成限定。
需要说明的是，在本申请实施例中，除非特别说明，各个结构件之间都可以通过胶进行固定，例如，光学指纹芯片310可以通过双面胶固定在所述电路板340的上表面，所述第一泡棉结构330可以通过胶固定在显示屏的下方等。
在本申请实施例中，所述光学指纹装置还可以包括滤光层350，所述滤光层350至少覆盖感应区域，用于滤除进入感应阵列的影响指纹成像的杂散光。应理解，图4-图6仅以所述滤光片350设置在所述光学指纹芯片310的上表面作为示例，但本申请不限于此，例如，所述滤光片350可以设置光学指纹芯片的内部。
在本申请一些实施例中，所述遮光层321包覆所述滤光层350的边缘区域，以避免遮光层321和滤光层350之间形成空隙，导致杂散光进入感应阵列，影响指纹成像。
在一些实施例中，可以通过蒸镀或溅射工艺将所述滤光层350制备在所述光学指纹芯片310的上表面，这样，所述光学指纹芯片310可以作为该滤光层350的支撑结构，从而能够省掉厚度较大的玻璃基底，有利于降低光学指纹装置的厚度。
可选地，在本申请一些实施例中，所述滤光层350可以包括多个叠层，本申请实施例对于滤光层的叠层结构的层数不作具体限定。
在一些实施例中，所述多个叠层在10层到200层之间。
在一些实施例中，所述多个叠层包括硅的氧化层和钛的氧化层。
可选地，在本申请一个实施例中，该滤光层350的进光面的反射率低于第一阈值，例如1％，从而能够保证足够的光信号入射到光学指纹芯片310，进而能够提升指纹识别率。例如，可以对滤光层的进光面进行光学无机镀膜处理，或者涂覆有机黑化图层以降低所述滤光层的进光面的反射率。
滤光层350用于来减少指纹感应中的不期望的背景光，以提高光学指纹芯片310对接收到的光的光学感应。所述滤光层350具体可以用于过滤掉环境光波长，例如，近红外光和部分的红光等。例如，人类手指吸收波长低于～580nm的光的能量中的大部分，如果该过滤层被设计为过滤波长从580nm至红外的光，则可以大大减少环境光对指纹感应中的光学指纹检测的影响。
应理解，在本申请实施例中，所述遮光层321形成在所述光学指纹芯片310的边缘区域的上表面指的是所述遮光层321和所述光学指纹芯片310的边缘区域直接接触，即所述遮光层321可以以所述光学指纹芯片310为支撑结构，不需要设置额外的支撑结构，从而能够降低光学指纹装置的厚度。
作为一个示例，形成在所述光学指纹芯片310的上表面的遮光层的厚度可以小于或等于20μm，所述遮光层也可以称为遮光膜，或者遮光膜层。
可选地，在本申请一个实施例中，所述光学指纹装置30还包括光学组件，其可以设置在所述光学指纹芯片的上方，用于将从所述显示屏上方的手指返回的光信号引导至所述光学指纹芯片，以进行光学指纹检测。
应理解，该光学组件可以采用图1B所示实施例中的任一光路引导结构实现，具体说明参考图1B所示实施例的描述，为了简洁，这里不再赘述。
作为一个实施例，所述光学组件包括：多个微透镜形成的微透镜阵列和至少一挡光层，所述至少一挡光层位于所述微透镜阵列下方，每个挡光层中设置有多个通光小孔，所述感应阵列用于接收经由所述微透镜阵列会聚到所述多个通光小孔的并通过所述多个通光小孔的光信号。
具体实现参考图1B所示实施例中的微透镜(Micro-Lens)层的光路设计的相关说明，为了简洁，这里不再赘述。
可选地，在本申请一个实施例中，光学指纹装置30还可以包括图像处理器，例如，微处理器(Micro Processing Unit，MCU)，所述图像处理器用于接收来自电路板340发送的指纹检测信号(例如指纹图像)，并基于所述指纹检测信号进行指纹识别。
以上，描述了本申请实施例的光学指纹装置的具体结构。下面将结合图 8详细描述本申请实施例的制备上述光学指纹装置的方法40。具体地，如图8所示，该方法40包括：
S41，确定遮光层的位置，所述遮光层的位置包括光学指纹芯片的边缘区域的上表面以及所述光学指纹芯片的自上而下的至少部分侧表面；
S42，在所述遮光层的位置上制备所述遮光层，所述遮光层用于遮挡从所述边缘区域的上表面以及所述至少部分侧表面进入所述光学指纹芯片的感应区域的杂散光，所述遮光层不遮挡所述感应区域。
可选地，制备所述遮光层可以采用上述提及的移印遮光工艺。具体地，
首先可以先将蚀刻有所述遮光层的图案的钢板上涂满遮光材料，例如，油墨。然后可以采用刮刀清除空白部分(即没有图案)的遮光材料以制成凹版。进一步地，可以将凹版处的遮光材料经由胶头转印到所述光学指纹芯片的边缘区域的上表面以及所述光学指纹芯片的自上而下的至少部分侧表面。
可选地，为了提高移印工艺印刷精度，可以在传统的移印机台上加装电荷耦合器件(charge coupled device，CCD)抓点设备以及模组调节装置，例如电机伺服平台，可以通过CCD拍照识别所述遮光层的位置，然后再通过电机伺服平台进行X轴、Y轴调节定位，将凹版处的遮光材料经由胶头转印到所述遮光层的位置上。
可选地，移印所采用的胶头至少具有防静电、耐脏污以及软性材料等特性。可选地，胶头可以是硅胶头。
在一个实施例中，所述方法还包括：
在所述遮光层的自下而上的至少部分侧表面点胶层；
在所述遮光层的位置上制备所述遮光层，包括：
在所述胶层的外表面制备所述遮光层，以使得所述遮光层覆盖所述光学指纹芯片的整个侧表面。
先在光学指纹芯片侧面周围点一层胶水，可以有效起到底部支撑作用，让之后移印的油墨不受光学指纹芯片的厚度与底部基板干涉的影响；可以彻底将光学指纹芯片的正面与侧面进行油墨包裹，可以完全遮挡光学指纹芯片正面与侧面的杂散光进入，从而进一步优化提升光学指纹识别的性能。
需要说明的是，通过本申请实施例提供的制备光学指纹装置的方法可以制作本申请实施例所描述的光学指纹装置30，具体实现参考前述实施例的相关描述，这里不再赘述。
本申请实施例还提供了一种电子设备，如图9所示，所述电子设备700可以包括显示屏710和光学指纹装置720，其中，该光学指纹装置720设置在所述显示屏710的下方。其中，该光学指纹装置720可以为前述实施例中的光学指纹装置30，具体实现参考前述实施例的相关描述，这里不再赘述。
应理解，该显示屏710可以对应于图1B所示实施例中的显示屏120，其相关说明可以参考可以参照前述关于显示屏120的描述，为了简洁，在此不再赘述。
在一些实施例中，所述显示屏710可以是前文描述的任一种显示屏。
作为一个实施例，所述显示屏710可以具体为自发光显示屏(比如OLED显示屏)，且其包括多个自发光显示单元(比如OLED像素或者OLED光源)。所述显示屏中的部分自发光显示单元可以作为所述光学指纹装置进行光学指纹检测的激励光源，用于向显示屏上的指纹检测区域发射光信号，以用于光学指纹检测。
可选地，如图10所示，在本申请实施例中，所述电子设备700还可以包括中框730，用于为电子设备700的设置于显示屏710和电池740之间用于承载内部各种组件的框架，其内部各种组件包括但不限于主板，摄像头，排线，各种感应器，话筒，听筒等等零部件。其中，中框730可以通过泡棉750连接到所述电子设备700的显示屏710的下方以实现屏下光学指纹检测。
可选地，中框730可以由金属或者合金材料制成，或者也可以由塑胶材料制成，本申请实施例对此不作限定。
可选地，在一些实施例中，所述中框730的上表面可以设置开槽，所述光学指纹装置720设置在所述开槽中，所述光学指纹装置通过中框730固定至所述显示屏710的下方以实现屏下光学指纹检测。
可替代地，所述中框730也可以设置开孔，所述光学指纹装置720设置在所述开孔中。例如，所述光学指纹装置720中的光学指纹芯片可以固定在柔性支撑板上，该柔性支撑板可以呈弯曲状将光学指纹装置720固定在所述开孔中。具体地，柔性支撑板可以是呈“U”型，或者也可以是
Figure PCTCN2020110091-appb-000001
型，本申请实施例对此并不作限定。
本领域普通技术人员可以意识到，结合本文中所公开的实施例描述的各示例的单元及算法步骤，能够以电子硬件、或者计算机软件和电子硬件的结合来实现。这些功能究竟以硬件还是软件方式来执行，取决于技术方案的特 定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能，但是这种实现不应认为超出本申请的范围。
所属领域的技术人员可以清楚地了解到，为描述的方便和简洁，上述描述的系统、装置和单元的具体工作过程，可以参考前述方法实施例中的对应过程，在此不再赘述。
在本申请所提供的几个实施例中，应该理解到，所揭露的系统、装置和方法，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另一点，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口，装置或单元的间接耦合或通信连接，可以是电性，机械或其它的形式。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。
另外，在本申请各个实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个单元中。
所述功能如果以软件功能单元的形式实现并作为独立的产品销售或使用时，可以存储在一个计算机可读取存储介质中。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分或者该技术方案的部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质中，包括若干指令用以使得一台计算机设备(可以是个人计算机，服务器，或者网络设备等)执行本申请各个实施例所述方法的全部或部分步骤。而前述的存储介质包括：U盘、移动硬盘、只读存储器(Read-Only Memory，ROM)、随机存取存储器(Random Access Memory，RAM)、磁碟或者光盘等各种可以存储程序代码的介质。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护 范围应所述以权利要求的保护范围为准。

Claims (32)

  1. 一种光学指纹装置，应用于具有显示屏的电子设备，其特征在于，所述光学指纹装置用于设置在所述显示屏的下方，所述光学指纹装置包括：
    光学指纹芯片，包括具有多个光学感应单元的感应阵列，所述感应阵列用于接收从所述显示屏上方的手指返回的指纹光信号，所述指纹光信号用于获取所述手指的指纹图像；
    遮光层，形成在所述光学指纹芯片的边缘区域的上表面以及所述光学指纹芯片的由上自下的至少部分侧表面，用于遮挡从所述边缘区域的上表面以及所述至少部分侧表面进入所述感应阵列的杂散光，其中，所述遮光层不遮挡所述光学指纹芯片的感应区域。
  2. 根据权利要求1所述的光学指纹装置，其特征在于，所述遮光层通过移印遮光工艺形成在所述边缘区域的上表面以及所述至少部分侧表面。
  3. 根据权利要求1或2所述的光学指纹装置，其特征在于，所述光学指纹芯片的自下而上的至少部分侧表面包覆有胶层，所述遮光层包覆所述胶层以覆盖所述光学指纹芯片的整个侧表面。
  4. 根据权利要求3述的光学指纹装置，其特征在于，所述胶层的厚度不小于40μm。
  5. 根据权利要求3所述的光学指纹装置，其特征在于，所述胶层的厚度不大于所述光学指纹芯片的厚度。
  6. 根据权利要求1至5中任一项所述的光学指纹装置，其特征在于，所述遮光层的厚度不大于20μm。
  7. 根据权利要求1至6中任一项所述的光学指纹装置，其特征在于，形成在所述边缘区域的上表面的所述遮光层的第一内侧与靠近所述第一内侧的所述感应区域的外侧的距离不小于30μm。
  8. 根据权利要求1至7中任一项所述的光学指纹装置，其特征在于，形成在所述边缘区域的上表面的所述遮光层的第二内侧与靠近所述第二内侧的所述光学指纹芯片的外侧的距离不小于80μm。
  9. 根据权利要求1至8中任一项所述的光学指纹装置，其特征在于，所述光学指纹装置还包括：
    滤光层，设置在所述光学指纹芯片的上表面，其中，所述滤光层至少覆盖所述感应区域。
  10. 根据权利要求9所述的光学指纹装置，其特征在于，所述遮光层包覆所述滤光层的边缘区域。
  11. 根据权利要求1至10中任一项所述的光学指纹装置，其特征在于，所述光学指纹装置还包括：
    电路板，所述电路板通过金线与所述光学指纹芯片电连接，其中，所述遮光层包覆所述电路板上未被所述光学指纹芯片覆盖的区域以及所述金线。
  12. 根据权利要求11所述的光学指纹装置，其特征在于，所述光学指纹芯片的外围设置有第一泡棉结构和第二泡棉结构，其中，所述第一泡棉结构设置在所述第二泡棉结构的上方，所述第二泡棉结构设置在所述电路板的上方，所述第二泡棉结构的上表面不低于所述遮光层的上表面。
  13. 根据权利要求12所述的光学指纹装置，其特征在于，所述第二泡棉结构的上表面不低于所述金线的弧高。
  14. 根据权利要求12或13所述的光学指纹装置，其特征在于，所述第一泡棉结构的宽度大于所述第二泡棉结构的宽度以在所述第一泡棉结构的靠近所述光学指纹芯片的一端形成遮挡部，所述遮挡部部分遮挡所述光学指纹芯片的边缘区域，并且不遮挡所述光学指纹芯片的感应区域。
  15. 根据权利要求1至14中任一项所述的光学指纹装置，其特征在于，所述遮光层为油墨。
  16. 根据权利要求1至15中任一项所述的光学指纹装置，其特征在于，所述光学指纹装置还包括：
    光学组件，设置在所述光学指纹芯片的上方，用于将从所述显示屏上方的手指返回的光信号引导至所述光学指纹芯片，以进行光学指纹检测。
  17. 根据权利要求16所述的光学指纹装置，其特征在于，所述光学组件包括：多个微透镜形成的微透镜阵列和至少一挡光层，所述至少一挡光层位于所述微透镜阵列下方，每个挡光层中设置有多个通光小孔，所述感应阵列用于接收经由所述微透镜阵列会聚到所述多个通光小孔的并通过所述多个通光小孔的光信号。
  18. 根据权利要求1至17中任一项所述的光学指纹装置，其特征在于，所述电子设备的中框设置有开槽或开孔，所述光学指纹装置用于设置在所述开槽或所述开孔中。
  19. 一种电子设备，其特征在于，包括：
    显示屏；
    如权利要求1至18中任一项所述的光学指纹装置，所述光学指纹装置设置在所述显示屏的下方。
  20. 一种制备光学指纹装置的方法，其特征在于，所述方法包括：
    确定遮光层的位置，所述遮光层的位置包括光学指纹芯片的边缘区域的上表面以及所述光学指纹芯片的自上而下的至少部分侧表面；
    在所述遮光层的位置上制备所述遮光层，所述遮光层用于遮挡从所述边缘区域的上表面以及所述至少部分侧表面进入所述光学指纹芯片的感应区域的杂散光，所述遮光层不遮挡所述感应区域。
  21. 根据权利要求20所述的方法，其特征在于，所述方法还包括：
    在所述遮光层的自下而上的至少部分侧表面点胶层；
    在所述遮光层的位置上制备所述遮光层，包括：
    在所述胶层的外表面制备所述遮光层，以使得所述遮光层覆盖所述光学指纹芯片的整个侧表面。
  22. 根据权利要求20或21所述的方法，其特征在于，所述在所述遮光层的位置上制备所述遮光层，包括：
    根据所述遮光层的位置，获取所述遮光层的图案；
    将蚀刻有所述遮光层的图案的钢板上涂满遮光材料，并通过去除空白部分的遮光材料以制成凹版；
    将所述凹版处的遮光材料转印到所述遮光层的位置上。
  23. 根据权利要求22所述的方法，其特征在于，所述将所述凹版处的遮光材料转印到所述遮光层的位置上，包括：
    通过模组调节装置的调节定位，将所述凹版处的遮光材料经由胶头转印到所述遮光层的位置上。
  24. 根据权利要求23所述的方法，其特征在于，所述模组调节装置为电机伺服平台。
  25. 根据权利要求20至24中任一项所述的方法，其特征在于，所述确定遮光层的位置，包括：
    根据电荷耦合器件CCD的拍照识别，确定所述遮光层的位置。
  26. 根据权利要求21所述的方法，其特征在于，所述胶层的厚度不小于40μm。
  27. 根据权利要求21所述的方法，其特征在于，所述胶层的厚度不大于所述光学指纹芯片的厚度。
  28. 根据权利要求20至27中任一项所述的方法，其特征在于，所述遮光层的厚度不大于20μm。
  29. 根据权利要求20至28中任一项所述的方法，其特征在于，形成在所述边缘区域的上表面的所述遮光层的第一内侧与靠近所述第一内侧的所述感应区域的外侧的距离不小于30μm。
  30. 根据权利要求20至29中任一项所述的方法，其特征在于，形成在所述边缘区域的上表面的所述遮光层的第二内侧与靠近所述第二内侧的所述光学指纹芯片的外侧的距离不小于80μm。
  31. 根据权利要求23所述的方法，其特征在于，所述胶头为硅胶头。
  32. 根据权利要求20至31中任一项所述的方法，其特征在于，所述遮光层为油墨。
PCT/CN2020/110091 2019-11-04 2020-08-19 光学指纹装置及其制备方法、电子设备 WO2021088464A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNPCT/CN2019/115439 2019-11-04
PCT/CN2019/115439 WO2021087695A1 (zh) 2019-11-04 2019-11-04 光学指纹装置和电子设备

Publications (1)

Publication Number Publication Date
WO2021088464A1 true WO2021088464A1 (zh) 2021-05-14

Family

ID=70400267

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/CN2019/115439 WO2021087695A1 (zh) 2019-11-04 2019-11-04 光学指纹装置和电子设备
PCT/CN2020/110091 WO2021088464A1 (zh) 2019-11-04 2020-08-19 光学指纹装置及其制备方法、电子设备

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/115439 WO2021087695A1 (zh) 2019-11-04 2019-11-04 光学指纹装置和电子设备

Country Status (5)

Country Link
US (1) US11194988B2 (zh)
EP (1) EP3842991B1 (zh)
KR (1) KR102374723B1 (zh)
CN (2) CN111095277B (zh)
WO (2) WO2021087695A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI729951B (zh) * 2020-06-07 2021-06-01 神盾股份有限公司 電子裝置
CN112183320A (zh) * 2020-09-27 2021-01-05 北京奕斯伟计算技术有限公司 指纹识别方法、指纹识别装置和指纹识别显示装置
US11682684B2 (en) * 2020-10-08 2023-06-20 Advanced Semiconductor Engineering, Inc. Optical package structure
CN112272249B (zh) * 2020-10-28 2022-02-11 业泓科技(成都)有限公司 屏下指纹识别装置及其制备方法、电子设备
CN112326204B (zh) * 2020-10-29 2023-01-20 歌尔光学科技有限公司 波导片的光学性能测试装置
CN114582905A (zh) 2021-05-18 2022-06-03 友达光电股份有限公司 光学感测装置及包含其的电子装置
TWI807560B (zh) * 2021-12-28 2023-07-01 同欣電子工業股份有限公司 感測器封裝結構
CN116543422A (zh) 2022-01-26 2023-08-04 群创光电股份有限公司 光学感测模块及电子装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106022261A (zh) * 2016-05-19 2016-10-12 信利光电股份有限公司 一种盖板在识别传感器的应用、识别模块及盖板
CN108090480A (zh) * 2018-02-01 2018-05-29 上海天马有机发光显示技术有限公司 显示面板、显示装置及显示面板的制作方法
CN108491761A (zh) * 2018-02-26 2018-09-04 维沃移动通信有限公司 指纹感光识别装配结构及电子设备
CN109074477A (zh) * 2017-11-09 2018-12-21 深圳市汇顶科技股份有限公司 光学模组及其加工方法、及终端设备
CN109494201A (zh) * 2017-09-11 2019-03-19 原相科技股份有限公司 光学感测封装模块及其制造方法
US20190180072A1 (en) * 2017-12-12 2019-06-13 Synaptics Incorporated Optical sensor with ambient light filter

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005319294A (ja) * 2005-04-25 2005-11-17 Nec Corp 指紋入力装置
US9904837B2 (en) * 2015-12-03 2018-02-27 Keycore Technology Corp. Touch device with fingerprint identification function
US10229316B2 (en) * 2016-01-29 2019-03-12 Synaptics Incorporated Compound collimating system using apertures and collimators
CN206931604U (zh) * 2017-04-12 2018-01-26 深圳市汇顶科技股份有限公司 光学指纹传感器
CN110825171B (zh) * 2017-04-27 2023-06-20 Oppo广东移动通信有限公司 显示屏、显示装置及移动终端
US10331939B2 (en) * 2017-07-06 2019-06-25 Shenzhen GOODIX Technology Co., Ltd. Multi-layer optical designs of under-screen optical sensor module having spaced optical collimator array and optical sensor array for on-screen fingerprint sensing
CN207182346U (zh) * 2017-09-15 2018-04-03 南昌欧菲生物识别技术有限公司 光学指纹识别组件和电子装置
EP3534292A4 (en) 2017-11-09 2020-07-22 Shenzhen Goodix Technology Co., Ltd. OPTICAL MODULE AND PROCESSING METHOD THEREFOR AND TERMINAL DEVICE
KR20190066433A (ko) * 2017-12-05 2019-06-13 삼성전자주식회사 마이크로 홀이 형성된 차광 부재를 포함하는 전자 장치
CN207780668U (zh) * 2018-01-17 2018-08-28 广东欧珀移动通信有限公司 显示装置及电子设备
JP2021523502A (ja) * 2018-05-07 2021-09-02 ウェーブタッチ リミテッド 指紋検出用のコンパクトな光学センサ
CN109690566B (zh) * 2018-12-04 2023-05-12 深圳市汇顶科技股份有限公司 一种光学指纹识别模组及电子装置
EP3699809A4 (en) * 2018-12-29 2020-11-04 Shenzhen Goodix Technology Co., Ltd. FINGERPRINT IDENTIFICATION DEVICE AND ELECTRONIC DEVICE
KR102611843B1 (ko) * 2019-10-21 2023-12-07 선전 구딕스 테크놀로지 컴퍼니, 리미티드 지문 인식 장치 및 전자 장치
CN210864756U (zh) * 2019-11-04 2020-06-26 深圳市汇顶科技股份有限公司 光学指纹装置和电子设备

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106022261A (zh) * 2016-05-19 2016-10-12 信利光电股份有限公司 一种盖板在识别传感器的应用、识别模块及盖板
CN109494201A (zh) * 2017-09-11 2019-03-19 原相科技股份有限公司 光学感测封装模块及其制造方法
CN109074477A (zh) * 2017-11-09 2018-12-21 深圳市汇顶科技股份有限公司 光学模组及其加工方法、及终端设备
US20190180072A1 (en) * 2017-12-12 2019-06-13 Synaptics Incorporated Optical sensor with ambient light filter
CN108090480A (zh) * 2018-02-01 2018-05-29 上海天马有机发光显示技术有限公司 显示面板、显示装置及显示面板的制作方法
CN108491761A (zh) * 2018-02-26 2018-09-04 维沃移动通信有限公司 指纹感光识别装配结构及电子设备

Also Published As

Publication number Publication date
CN111095277B (zh) 2021-06-11
US11194988B2 (en) 2021-12-07
EP3842991B1 (en) 2024-05-15
WO2021087695A1 (zh) 2021-05-14
KR102374723B1 (ko) 2022-03-14
CN111095277A (zh) 2020-05-01
US20210133420A1 (en) 2021-05-06
EP3842991A4 (en) 2021-06-30
CN111967402A (zh) 2020-11-20
EP3842991A1 (en) 2021-06-30
KR20210057702A (ko) 2021-05-21

Similar Documents

Publication Publication Date Title
WO2021088464A1 (zh) 光学指纹装置及其制备方法、电子设备
US11455823B2 (en) Under-screen fingerprint identification apparatus and electronic device
CN209962265U (zh) 指纹识别装置和电子设备
WO2020238383A1 (zh) 指纹检测装置和电子设备
WO2020133378A1 (zh) 指纹识别装置和电子设备
WO2020186523A1 (zh) 指纹识别装置和电子设备
WO2020151159A1 (zh) 指纹识别的装置和电子设备
WO2020133344A1 (zh) 指纹识别装置和电子设备
WO2020150939A1 (zh) 指纹识别装置和电子设备
WO2020147018A1 (zh) 光学图像采集系统和电子设备
WO2020177032A1 (zh) 指纹识别装置和电子设备
CN210864756U (zh) 光学指纹装置和电子设备
CN212135452U (zh) 指纹识别装置和电子设备
WO2021051737A1 (zh) 指纹识别装置、背光模组、液晶显示屏和电子设备
WO2021007730A1 (zh) 指纹检测装置和电子设备
WO2021007964A1 (zh) 指纹检测装置和电子设备
WO2021022560A1 (zh) 指纹检测装置和电子设备
WO2021174423A1 (zh) 指纹识别装置、显示屏和电子设备
WO2021077368A1 (zh) 指纹识别装置和电子设备
WO2021007953A1 (zh) 指纹检测装置和电子设备
WO2020210954A1 (zh) 用于校准图像的方法、装置和电子设备
CN211087274U (zh) 指纹检测装置和电子设备
WO2021248496A1 (zh) 指纹检测装置和电子设备
WO2021138781A1 (zh) 指纹检测装置和电子设备
WO2021248497A1 (zh) 指纹检测装置和电子设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20884368

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20884368

Country of ref document: EP

Kind code of ref document: A1