WO2021248496A1 - 指纹检测装置和电子设备 - Google Patents

指纹检测装置和电子设备 Download PDF

Info

Publication number
WO2021248496A1
WO2021248496A1 PCT/CN2020/095957 CN2020095957W WO2021248496A1 WO 2021248496 A1 WO2021248496 A1 WO 2021248496A1 CN 2020095957 W CN2020095957 W CN 2020095957W WO 2021248496 A1 WO2021248496 A1 WO 2021248496A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
fingerprint detection
detection device
sensor chip
fingerprint
Prior art date
Application number
PCT/CN2020/095957
Other languages
English (en)
French (fr)
Inventor
段晓锋
刘相英
Original Assignee
深圳市汇顶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to PCT/CN2020/095957 priority Critical patent/WO2021248496A1/zh
Priority to CN202080096189.2A priority patent/CN115104139A/zh
Publication of WO2021248496A1 publication Critical patent/WO2021248496A1/zh

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition

Definitions

  • the embodiments of the present application relate to the field of fingerprint identification, and more specifically, to fingerprint detection devices and electronic equipment.
  • the under-screen fingerprint recognition solution is to attach the optical or ultrasonic fingerprint recognition module to the bottom of the Organic Light-Emitting Diode (OLED) screen, that is, regardless of the optical fingerprint recognition module or the ultrasonic fingerprint recognition module It needs to be tightly bonded to the light-emitting layer at the bottom of the screen.
  • OLED Organic Light-Emitting Diode
  • the fingerprint module needs to be installed on the bottom surface of the screen, and then the screen with the fingerprint module installed on the middle frame, so that the fingerprint module can be clamped between the screen and the middle frame. Between the middle frame. It can be seen that, in the process of installing or disassembling the fingerprint module, the existing screen sticking solutions are too complicated to install or disassemble, and the practicability is too poor.
  • a fingerprint detection device and electronic equipment are provided, which can reduce the complexity of installation or disassembly of a fingerprint module to improve practicability.
  • a fingerprint detection device which is suitable for electronic equipment with a display screen, the bottom layer of the display screen is an opaque layer, and an opening that penetrates the opaque layer is formed on the opaque layer;
  • the fingerprint detection device includes:
  • optical path layer and a first sensor chip, where the optical path layer is arranged above the first sensor chip;
  • the first sensor chip is fixed and electrically connected to the substrate
  • the fixing structure is arranged on the upper surface of the substrate and the fixing structure surrounds the first sensor chip, and the upper surface of the fixing structure passes through the
  • the pressure-sensitive adhesive is fixed to the lower surface of the display screen, so that the first sensor chip is aligned with the window opening, and the first sensor chip is used for receiving through the window opening above the display screen.
  • a fingerprint detection signal returned by a human finger and guided through the optical path layer, the fingerprint detection signal being used to detect fingerprint information of the finger;
  • the side portion of the fixing structure includes a first side portion and at least one second side portion other than the first side portion, and the substrate is provided with a gold finger at a position close to the first side portion,
  • the gold finger of the substrate can be electrically connected to the gold finger of the flexible circuit board through an anisotropic conductive adhesive film, the holding part is fixedly arranged on any one of the at least one second side part, and the holding part Used to peel off the fingerprint detection device from the display screen.
  • the optical path layer is directly arranged on the upper surface of the first sensor chip, and the lower surface of the first sensor chip is fixed on the substrate by the first fixing glue, which can avoid the optical path layer and the
  • the first sensor chip is provided with a housing, which reduces the size (for example, the thickness) of the fingerprint detection device.
  • the optical path layer is directly arranged on the upper surface of the first sensor chip, and the lower surface of the first sensor chip is fixed on the substrate by the first fixing glue, so that the components are closely matched in the thickness direction (that is, the components are The tight fit in the thickness direction does not leave a gap), which reduces the size (for example, the thickness) of the fingerprint detection device.
  • the thickness of the fingerprint detection device when the thickness of the fingerprint detection device is controlled, it can be placed between the display screen and the battery, and the fingerprint identification device is not required to be installed at a position other than the battery. Adjusting the original internal structure of the electronic device can also improve the utilization of the internal space of the electronic device. For example, the volume of the battery can be increased, and the space saved can be used to accommodate the increased volume of the battery. Accordingly, the service life and user experience of the electronic device can be increased without increasing the volume of the electronic device.
  • the grip portion by providing the grip portion, the installation complexity and the disassembly complexity of the fingerprint detection device can be reduced, and accordingly, its practicability can be improved.
  • the technical solution of the present application can not only reduce the thickness of the fingerprint detection device, but also reduce the installation complexity and disassembly complexity of the fingerprint detection device, so as to improve its practicability.
  • a curing adhesive is provided between the at least one second side portion and the pressure-sensitive adhesive, and between the holding portion and the side portion of the fixing structure to fix the fixing structure.
  • the structure and the grip are provided between the at least one second side portion and the pressure-sensitive adhesive, and between the holding portion and the side portion of the fixing structure to fix the fixing structure. The structure and the grip.
  • the thrust value of the fingerprint detection device can satisfy the end user According to the thrust test requirements, the fingerprint detection device will not be displaced during the thrust test. Based on this, the connection stability of the fingerprint detection device during use can be guaranteed, and accordingly, the fingerprint can be guaranteed The performance stability of the detection device.
  • the holding part can be fixed, and accordingly, the connection reliability of the holding part can be ensured.
  • the curing adhesive is ultraviolet curing adhesive or hot melt adhesive.
  • the opaque layer is a buffer layer
  • the upper surface of the fixing structure is fixed to the lower surface of the buffer layer by the pressure-sensitive adhesive in the surrounding area of the window.
  • the opaque layer includes a buffer layer and a copper foil layer from top to bottom, and a support film is arranged above the buffer layer; wherein the upper surface of the fixing structure passes through the pressure sensitive
  • the glue is fixed to the lower surface of the copper foil layer in the surrounding area of the window, or the upper surface of the fixing structure is fixed to the lower surface of the supporting film by the pressure-sensitive glue.
  • the fingerprint detection device is pasted to the bottom surface of the buffer layer, copper foil layer or support film of the display screen by using the first pressure-sensitive adhesive and the fixing structure of the substrate, which is compared with detecting the fingerprint
  • the device is directly attached to the display panel (ie, the OLED layer) of the display screen, which not only prevents the fingerprint detection device from being attached to the display screen and affects the performance of the display screen, but also reduces the installation of the fingerprint
  • the degree of difficulty of the detection device correspondingly, can reduce the installation complexity of the fingerprint detection device and improve the yield of the electronic equipment.
  • sticking the fingerprint detection device to the bottom surface of the buffer layer, copper foil layer or support film of the display screen can also avoid damage to the display screen during the process of disassembling the fingerprint detection device. Accordingly, The disassembly complexity of the fingerprint detection device is reduced and the yield of the electronic device is improved.
  • the fingerprint detection device is pasted to the bottom surface of the buffer layer or the copper foil layer of the display screen by using the first pressure-sensitive adhesive and the fixing structure of the substrate.
  • the display screen is pressed or When the electronic device is dropped or collided, since there is a buffer layer and/or the lower surface of the copper foil layer between the display panel and the fingerprint detection device, the display panel and the fingerprint detection device can be prevented from being squeezed This affects the performance of the display panel and the fingerprint detection device.
  • the fingerprint detection device by sticking the fingerprint detection device to the bottom surface of the buffer layer or copper foil layer of the display screen, compared to directly bonding the fingerprint detection device to the display panel or support film of the display screen, It can also avoid the size of the opening window being too large, and accordingly, the visibility of the user when viewing the fingerprint detection device from the front of the display screen can be reduced, thereby beautifying the appearance of the electronic device.
  • the lower surface of the support film is provided with a connecting portion corresponding to the upper surface of the fixing structure in the area of the window, and the connecting portion is connected to the support film by a double-sided tape.
  • the connecting portion it is possible to prevent the pressure-sensitive adhesive or the curing adhesive from forming irregular sticking traces on the supporting film, and accordingly, it is possible to ensure the aesthetics of the electronic device equipped with the fingerprint detection device.
  • the connecting portion is a rigid reinforcement plate or a polyethylene terephthalate adhesive layer.
  • the connecting portion is an opaque medium layer.
  • the substrate includes a first covering layer, a first conductive layer, a base material layer, a second conductive layer, and a second covering layer in order from top to bottom.
  • the area extends downward and penetrates the first covering layer and the first conductive layer to form a first groove, and the upper surface of the substrate extends downward and penetrates the second area connected to the first area.
  • the first covering layer to form a pad of the substrate;
  • the fingerprint detection device further includes:
  • the first fixing glue and the first gold wire are The first fixing glue and the first gold wire;
  • the lower surface of the first sensor chip is fixed in the first groove by the first fixing glue, and the first sensor chip is connected to the pad of the substrate by the first gold wire.
  • a substrate pad for electrically connecting the first sensor chip is formed, which can be used to electrically connect the first sensor chip and the first sensor chip.
  • the first gold wire of the substrate provides an accommodation space, and accordingly, the occupied space of the first gold wire above the substrate is reduced, thereby reducing the thickness of the fingerprint detection device.
  • the tight fit between the various layers in the thickness direction ensures that the thickness of the fingerprint detection device is reduced to the greatest extent.
  • the optical path layer is directly arranged on the upper surface of the first sensor chip, the image collection field of view of the fingerprint detection device is only affected by the area of the optical path layer and the corresponding area of the first sensor chip, Based on this, the area of the optical path layer and the area of the corresponding first sensor chip can be reasonably designed according to actual needs to meet the needs of different users and different customers (for example, the needs of a large-area image acquisition field of view).
  • the technical solution of the present application can not only reduce the thickness of the fingerprint detection device, but also can ensure a sufficiently large image acquisition field of view.
  • the fingerprint detection device further includes:
  • the second sensor chip, the second fixing glue and the second gold wire are connected
  • the upper surface of the substrate extends downward in a third area connected to the second area and penetrates the first covering layer and the first conductive layer to form a second groove, and the second sensor
  • the chip is fixed in the second groove by a second fixing glue, and the second sensor chip is connected to the pad of the substrate by the second gold wire, so that the second sensor chip is connected to the The first sensor chip, and the second sensor chip is used to cooperate with the first sensor chip to perform under-screen fingerprint recognition.
  • the second sensor chip provided can share the processing tasks of the first sensor chip, which is equivalent to replacing a fully functional and thicker sensor chip with a thinner first sensor chip and a thinner sensor chip arranged side by side.
  • the second sensor chip correspondingly, can reduce the thickness of the fingerprint detection device without affecting the fingerprint recognition performance.
  • the fixed structure includes:
  • the gold wire protective glue is used to encapsulate the first gold wire, and the bracket is arranged on the upper surface of the first cover film and located outside the first sensor chip.
  • the bracket is a polyethylene terephthalate adhesive layer; or the bracket is fixed on the upper surface of the first cover film by a bracket fixing glue and is located on the first sensor The outside of the chip.
  • the fixed structure further includes:
  • the optical path layer includes a lens layer and an optical path guiding layer
  • the microlens is used to converge the optical signal returned via the human finger above the display screen to the optical path guiding layer, and the optical path guiding layer condenses the
  • the light signal condensed by the microlens is guided to the first sensor chip, the light shielding layer extends from above the support to the light path guiding layer, and a gap is formed between the light shielding layer and the microlens layer,
  • the light shielding layer is used for shielding light signals incident from other positions than the incident surface of the first sensor chip.
  • the light-shielding layer is structured to extend from above the support to above the light path guide layer, which not only can effectively shield the light signal incident from the non-incident surface of the first sensor chip, but also can protect the light as much as possible.
  • the light shielding layer is tightly fixed to the optical path layer, and accordingly, the thickness of the fingerprint detection device can be reduced as much as possible.
  • the light-shielding layer is configured to extend from above the support to the light path guide layer, which can prevent the light-shielding layer from covering the lens layer to reduce the image capture area of the fingerprint detection device.
  • the light shielding layer and the holding portion are integrally formed.
  • an accommodating space is formed on a side of the light-shielding layer facing away from the display screen, and the holding portion is disposed in the accommodating space.
  • Arranging the holding part in the accommodating space of the light-shielding layer can not only reduce the thickness of the fingerprint detection device, but also ensure that the holding part and the light-shielding layer have a sufficient contact area to increase the light-shielding layer. Reliability of the connection between the layer and the grip.
  • the side of the light shielding layer on which the holding portion is provided extends outward by a preset distance, so that the user can hold the holding portion.
  • the light shielding layer is a shielding glue layer, and the arc height position of the first gold wire is covered by the light shielding glue layer.
  • the fingerprint detection device further includes the flexible circuit board, and the gold fingers of the flexible circuit board are electrically connected to the gold fingers of the substrate through the anisotropic conductive adhesive film.
  • an electronic device including:
  • the fingerprint detection device is arranged below the display screen.
  • the fingerprint detection device is the fingerprint detection device described in the first aspect or any one of the possible implementations of the first aspect, and its fingerprint collection area is at least partially located in the In the display area of the display screen.
  • the electronic device further includes a middle frame, the electronic device further includes a middle frame, the middle frame is formed with an opening that penetrates the middle frame, and the opening is used for the
  • the fingerprint detection device provides accommodation space.
  • Fig. 1 is a schematic plan view of an electronic device to which the present application can be applied.
  • Fig. 2 is a schematic side sectional view of the electronic device shown in Fig. 1.
  • 3 to 6 are schematic structural diagrams of a fingerprint detection device according to an embodiment of the present application.
  • FIG. 7 and 8 are schematic structural diagrams of a display screen of an electronic device according to an embodiment of the present application.
  • 9 to 14 are schematic structural diagrams of an electronic device equipped with a fingerprint detection device according to an embodiment of the present application.
  • Fig. 15 is a schematic structural diagram of a fingerprint detection device with a grip according to an embodiment of the present application.
  • the technical solutions of the embodiments of the present application can be applied to various electronic devices.
  • portable or mobile computing devices such as smartphones, laptops, tablet computers, and gaming devices, as well as other electronic devices such as electronic databases, automobiles, and bank automated teller machines (ATM).
  • ATM bank automated teller machines
  • the embodiments of the present application are not limited to this.
  • biometric recognition technologies include, but are not limited to, fingerprint recognition, palmprint recognition, iris recognition, face recognition, and living body recognition.
  • fingerprint recognition technology for ease of description, the following uses fingerprint recognition technology as an example for description.
  • Under-screen fingerprint recognition technology refers to the installation of a fingerprint detection device under the display screen, so as to perform fingerprint recognition operations in the display area of the display screen, without the need to set a fingerprint collection area on the front of the electronic device except for the display area.
  • the fingerprint detection device uses light returned from the top surface of the display assembly of the electronic device to perform fingerprint sensing and other sensing operations. This returned light carries information about objects (such as fingers) that are in contact with or close to the top surface of the display assembly.
  • the fingerprint detection device located below the display assembly collects and detects this returned light to realize fingerprint recognition under the screen.
  • the fingerprint detection device can be designed to achieve desired optical imaging by appropriately configuring optical elements for collecting and detecting the returned light, so as to detect the fingerprint information of the finger.
  • FIG. 1 and 2 show schematic diagrams of an electronic device 100 to which under-screen fingerprint recognition technology can be applied.
  • FIG. 1 is a front schematic diagram of the electronic device 100
  • FIG. 2 is a partial cross-sectional structure diagram of the electronic device 100 shown in FIG. 1.
  • the electronic device 100 may include a display screen 120 and a fingerprint detection device 130.
  • the display screen 120 may be a self-luminous display screen, which uses a self-luminous display unit as display pixels.
  • the display screen 120 may be an Organic Light-Emitting Diode (OLED) display screen or a Micro-LED (Micro-LED) display screen.
  • OLED Organic Light-Emitting Diode
  • Micro-LED Micro-LED
  • the display screen 120 may also be specifically a touch display screen, which can not only perform screen display, but also detect a user's touch or pressing operation, so as to provide a user with a human-computer interaction interface.
  • the electronic device 100 may include a touch sensor, and the touch sensor may specifically be a touch panel (TP), which may be provided on the surface of the display screen 120, or may be partially integrated or The whole is integrated into the display screen 120 to form the touch display screen.
  • TP touch panel
  • the fingerprint detection device 130 may be an optical fingerprint detection device.
  • the fingerprint detection device 130 may include a sensor chip (also referred to as a fingerprint sensor) having an optical sensor array.
  • the optical sensing array includes a plurality of optical sensing units, and each optical sensing unit may specifically include a photodetector or a photoelectric sensor.
  • the fingerprint detection device 130 may include a photodetector array (or called a photodetector array or a photodetector array), which includes a plurality of photodetectors distributed in an array.
  • the fingerprint detection device 130 can be arranged in a partial area below the display screen 120, so that the fingerprint collection area (or detection area) 103 of the fingerprint detection device 130 is at least partially located on the display screen 120. Within area 102.
  • the area or light sensing range of the optical sensing array of the fingerprint detection device 130 corresponds to the fingerprint collection area 103 of the fingerprint detection device 130.
  • the fingerprint collection area 103 of the fingerprint detection device 130 may be equal to or not equal to the area or the light sensing range of the optical sensing array of the fingerprint detection device 130, which is not specifically limited in the embodiment of the present application.
  • the fingerprint collection area 103 of the fingerprint detection device 130 can be designed to be substantially the same as the area of the sensing array of the fingerprint detection device 130.
  • the design of the light path for converging light or the design of the light path for reflecting light through a macro lens can make the area of the fingerprint collection area 103 of the fingerprint detection device 130 larger than the area of the sensing array of the fingerprint detection device 130.
  • the optical path design of the fingerprint detection device 130 is exemplified below.
  • the optical collimator may specifically be a collimator layer made on a semiconductor silicon wafer, It has a plurality of collimating units or micro-holes.
  • the collimating unit may be specifically a small hole.
  • the reflected light reflected from the finger the light that is perpendicularly incident on the collimating unit can pass through and be passed by the sensor below it.
  • the chip receives, and the light whose incident angle is too large is attenuated by multiple reflections inside the collimating unit. Therefore, the sensor chip can basically only receive the reflected light reflected by the fingerprint pattern directly above it, which can effectively improve Image resolution, thereby improving the fingerprint recognition effect.
  • the lens layer may have a micro-lens array formed by a plurality of micro-lenses, which may be formed by a semiconductor growth process or other processes. Above the sensing array of the sensor chip, and each microlens may correspond to one or more sensing units of the sensing array.
  • Other optical film layers may be formed between the lens layer and the sensing unit, such as a dielectric layer or a passivation layer. More specifically, a barrier with micro holes may also be formed between the lens layer and the sensing unit.
  • the light blocking layer can block the optical interference between adjacent sensing units, and make light converge to the said micro lens through the micro lens
  • the inside of the micro-hole is transmitted to the sensing unit corresponding to the micro-lens through the micro-hole, so as to perform optical fingerprint imaging.
  • a lens layer can be further provided under the collimator layer or the lens layer.
  • the collimator layer or the lens layer is used in combination with the lens layer, its specific laminated structure or optical path may need to be adjusted according to actual needs.
  • the fingerprint detection device 130 may be used to collect user fingerprint information (such as fingerprint image information).
  • the display screen 120 may adopt a display screen with a self-luminous display unit, such as an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display or a micro-LED (Micro-LED) display Screen.
  • the fingerprint detection device 130 may use the display unit (ie, the OLED light source) of the OLED display screen located in the fingerprint collection area 103 as an excitation light source for optical fingerprint detection.
  • the display screen 120 When a finger touches, presses, or approaches (for ease of description, collectively referred to as pressing in this application) in the fingerprint collection area 103, the display screen 120 emits a beam of light to the finger above the fingerprint collection area 103. The surface is reflected to form reflected light or is scattered inside the finger to form scattered light. In related patent applications, for ease of description, the above-mentioned reflected light and scattered light are collectively referred to as reflected light. Because the ridge and valley of the fingerprint have different light reflection capabilities, the reflected light from the fingerprint ridge and the fingerprint ridge have different light intensities. After the reflected light passes through the display screen 120, it is affected by the fingerprint.
  • the sensor chip in the detection device 130 receives and converts it into a corresponding electrical signal, that is, a fingerprint detection signal; based on the fingerprint detection signal, fingerprint image data can be obtained, and fingerprint matching verification can be further performed, so that the electronic device 100 Realize the optical fingerprint recognition function.
  • the fingerprint detection device 130 may also use a built-in light source or an external light source to provide an optical signal for fingerprint detection and identification.
  • the electronic device 100 may further include a protective cover 110.
  • the cover 110 may be specifically a transparent cover, such as a glass cover or a sapphire cover, which is located above the display screen 120 and covers the front surface of the electronic device 100, and the surface of the cover 110 may also be provided with a protective layer. Therefore, in the embodiments of the present application, the so-called finger pressing the display screen 120 may actually refer to the finger pressing the cover 110 above the display 120 or covering the surface of the protective layer of the cover 110.
  • a circuit board 140 such as a flexible printed circuit (FPC) (Flexible Printed Circuit, FPC), may also be provided under the fingerprint detection device 130.
  • FPC Flexible Printed Circuit
  • the fingerprint detection device 130 may be electrically connected to the circuit board 140, and realize electrical interconnection and signal transmission with other peripheral circuits or other components of the electronic device 100 through the circuit board 140.
  • the fingerprint detection device 130 can receive the control signal of the processing unit of the electronic device 100 through the circuit board 140, and can also output the fingerprint detection signal from the fingerprint detection device 130 to the processing unit or the control unit of the electronic device 100 through the circuit board 140 Wait.
  • FIG. 3 is a schematic structural diagram of a fingerprint detection device 200 including a sensor chip according to an embodiment of the present application.
  • the fingerprint detection device 200 is suitable for electronic equipment with a display screen.
  • the fingerprint detection apparatus 200 may be applicable to the electronic device 100 shown in FIG. 1 or FIG. 2.
  • the fingerprint detection device 200 includes a substrate 210, an optical path layer 220, a first sensor chip 230, a first fixing glue 240 and a first gold wire 250.
  • the substrate 210 includes a first covering layer 212, a first conductive layer 211, a base material layer 213, a second conductive layer 214, and a second covering layer 215 in order from top to bottom.
  • a region extends downward and penetrates the first covering layer 212 and the first conductive layer 211 to form a first groove, and the upper surface of the substrate 210 is downward in the second region connected to the first region. Extend and penetrate the first covering layer 212 to form the pad 2111 of the substrate 210.
  • the substrate 210 may include conductive layers other than the first conductive layer 211 and the second conductive layer 214.
  • the first conductive layer 211 or the second conductive layer 214 may be a copper layer or a copper foil layer.
  • the first covering layer 212 or the second covering layer 213 may be an insulating layer (for example, a resin layer).
  • the optical path layer 220 is disposed above the first sensor chip 230, and the lower surface of the first sensor chip 230 is fixed in the first groove by the first fixing glue 240, and the first sensor chip 230
  • the first sensor chip 230 is connected to the pad 2111 of the substrate 210 through the first gold wire 250, and the first sensor chip 230 is used to receive the fingerprint returned via the human finger above the display screen and guided by the optical path layer 220
  • a detection signal, the fingerprint detection signal is used to detect fingerprint information of the finger.
  • the lower surface of the first sensor chip 230 is pasted in the first groove by the first fixing glue 240, so that at least a part of the first sensor chip 230 is disposed in the first groove and passes through
  • the first gold wire 250 is electrically connected to the substrate 210; wherein, the first sensor chip 230 can be disposed under the display screen of the electronic device through the substrate 210.
  • the first sensor chip 230 is used to receive The fingerprint detection signal returned by the human finger above the display screen is reflected or scattered, and the fingerprint information of the finger is detected based on the fingerprint detection signal to perform fingerprint registration or identification.
  • the first sensor chip 230 may include multiple chips or one chip.
  • the first sensor chip 230 may include a plurality of optical fingerprint sensor chips, and the plurality of optical fingerprint sensor chips are arranged side by side.
  • the first groove is spliced into an optical fingerprint sensor chip assembly.
  • the optical fingerprint sensor chip assembly can be used to acquire multiple fingerprint images at the same time, and the multiple fingerprint images can be used as one fingerprint image for fingerprint registration or identification after being spliced.
  • the optical path layer 220 is directly disposed on the upper surface of the first sensor chip 230, and the lower surface of the first sensor chip 230 is fixed on the substrate 210 by the first fixing glue 240, which can avoid separate Providing a housing for the optical path layer 220 and the first sensor chip 230 reduces the size (for example, the thickness) of the fingerprint detection device 200.
  • the first groove can reduce the thickness of the fingerprint detection device 200.
  • a pad of the substrate 210 for electrically connecting the first sensor chip 230 is formed, which can be used for electrically connecting the first sensor chip 230.
  • the sensor chip 230 and the first gold wire 250 of the substrate 210 provide accommodating space.
  • the space occupied by the first gold wire 250 above the substrate 210 is reduced, thereby reducing the fingerprint detection device 200 thickness.
  • the tight fit between the various layers in the thickness direction ensures that the thickness of the fingerprint detection device 200 is reduced to the greatest extent.
  • the optical path layer 220 is directly arranged on the upper surface of the first sensor chip 230, the image collection field of view of the fingerprint detection device 200 is only affected by the area of the optical path layer 220 and the corresponding first sensor chip 230. Based on this, the area of the optical path layer 220 and the corresponding area of the first sensor chip 230 can be reasonably designed according to actual needs to meet the needs of different users and different customers (such as the needs of large-area image acquisition field of view) ).
  • the technical solution of the present application can not only reduce the thickness of the fingerprint detection device 200, but also can ensure a sufficiently large image collection field of view.
  • the gap d1 between the side wall of the first sensor chip 230 and the side wall of the first groove can not only be used as the dimensional tolerance of the first sensor chip 230 and/or as the first groove
  • the dimensional tolerance can also be used as the installation tolerance of the first sensor chip 230, and accordingly, the yield rate of the fingerprint detection device 200 can be improved.
  • the dimensional tolerance may be the size of the absolute value of the difference between the maximum allowable limit size minus the minimum limit size, or the dimensional tolerance may be the difference between the allowable upper deviation and the lower deviation.
  • Limit deviation limit size-basic size
  • upper deviation maximum limit size-basic size
  • lower deviation minimum limit size-basic size.
  • the dimensional tolerance of the first sensor chip 230 may be an allowable amount of variation in the process of cutting and processing the first sensor chip 230. In the case of the same basic size, the smaller the dimensional tolerance, the higher the dimensional accuracy.
  • the mounting tolerance of the first sensor chip 230 may refer to the allowable offset distance between the first limit mounting position and the second limit mounting position, and the first limit mounting position may be the closest allowed
  • the installation position of the first side wall of the first groove, the second limit installation position may be the allowable installation position closest to the second side wall of the first groove, and the first side wall is the same as The opposite side wall of the second side wall.
  • the width of the gap d1 between the sidewall of the first sensor chip 230 and the sidewall of the first groove is 100-300um. For example, 200um.
  • the width of the gap d1 between the side wall of the first sensor chip 230 and the side wall of the first groove can also be other values, or fall within a range of other preset values. There is no specific restriction on this.
  • the width of the gap d1 between the sidewall of the first sensor chip 230 and the sidewall of the first groove may also be 100um or 250um.
  • the sidewall of the first sensor chip 230 and The width of the gap d1 between the side walls of the first groove may also be within 100um to 400un.
  • this application does not specifically limit the thickness of each component or layer in the fingerprint detection device 200, as long as the structural relationship between the various components or layers adopts the design solution of this application and is closely matched The method to control the thickness of the fingerprint detection device falls within the protection scope of this application.
  • the thickness of the first covering layer 212 and the thickness of the second covering layer are both 10-30um, for example 20um; the thickness of the first conductive layer 211 and the thickness of the second conductive layer are both 10-20um, such as 13um; the thickness of the substrate is 40-80um, such as 64um; the thickness of the first sensor chip 230 is 50-150um, such as 60um; the thickness of the optical path layer 220 is 10-30um, For example, 21um; the maximum arc height d6 of the first gold wire 250 is 30-60um, such as 40um; the thickness of the first fixing glue 240 is 10-30um, such as 15um.
  • the thickness of, the thickness of the first fixing glue 240, or the maximum arc height d6 of the first gold wire 250 may also be other values or within a range of other preset values, which is not specifically limited in this application.
  • the fingerprint detection device 200 may further include a bracket 251 and a gold wire protective glue 252; wherein, the gold wire protective glue 252 is used to encapsulate the first gold wire.
  • the bracket 251 is arranged on the upper surface of the first covering layer 212 and located outside the first sensor chip 230.
  • the bracket 251 is fixed on the upper surface of the first covering layer 212 by a bracket fixing glue 253 and is located outside the first sensor chip 230.
  • the material of the bracket 251 includes, but is not limited to, metal, resin, glass fiber composite board, adhesive layer, and the like.
  • the bracket 251 is a polyethylene terephthalate (polyethylene glycol terephthalate, PET) glue layer.
  • the bracket 251 may be a bracket formed of foam material.
  • the bracket fixing glue may be a double-sided glue.
  • the bracket 251 may be disposed above the substrate 210 and located at the outer side or the surrounding area of the first groove and the pad 2111 of the substrate 210 (used to electrically connect the first sensor chip 230) .
  • the width of the gap d2 formed by the first sensor chip 230 and the bracket 251 is greater than or equal to the sidewall of the first sensor chip 230 and the first sensor chip 230.
  • the outer side of the bracket 251 extends a predetermined distance d3 in a direction approaching the first sensor chip 230 relative to the outer side of the first covering layer 212.
  • the width of the gap d2 formed by the first sensor chip 230 and the bracket 251 is 100-400um, such as 270um
  • the preset distance d3 is 100-400um, such as 200um.
  • the thickness of the bracket 251 is 40-100um, such as 50um or 80um.
  • the gap d2 formed by the first sensor chip 230 and the bracket 251, the preset distance d3, or the thickness of the bracket 251 may be other specific values, or may be within one Within the range of other preset values.
  • the thickness of the bracket 251 may also be 80um.
  • the stability of the electrical connection between the substrate 210 and the first sensor chip 230 can be ensured, and accordingly, the performance of the fingerprint detection device 200 can be ensured.
  • the gap d2 formed by the first sensor chip 230 and the bracket 251 can be used not only as a dimensional tolerance of the bracket 251, but also as an installation tolerance of the bracket 251. Accordingly, the fingerprint detection device can be improved A yield of 200.
  • the preset distance d3 can be used not only as a dimensional tolerance of the bracket 251, but also as an installation tolerance of the bracket 251, and accordingly, the yield rate of the fingerprint detection device 200 can be improved.
  • the thickness of the gold wire protective glue 252 is less than or equal to the sum of the thickness of the optical path layer 220, the thickness of the first sensor chip 230, and the thickness of the first fixing glue 240 .
  • the thickness of the gold wire protective glue 252 is configured to be less than or equal to the sum of the thickness of the optical path layer 220, the thickness of the first sensor chip 230, and the thickness of the first fixing glue 240, which can be used in effective packaging. While the first gold wire 250 is described, the thickness of the fingerprint detection device 200 is reduced as much as possible.
  • the thickness of the gold wire protective glue 252 may also be greater than the thickness of the light path guiding layer 222 in the light path layer 220, the thickness of the first sensor chip 230, and the thickness of the first sensor chip 230.
  • the sum of the thickness of the first fixing glue 240 is described.
  • bracket 251 other parameters can also be designed for the preparation and installation of the bracket 251.
  • the width of the gap d4 between the brackets 251 is larger than the side of the pad 2111 (used to electrically connect the first sensor chip 230) of the first sensor chip 230 away from the substrate 210 and between the bracket 251
  • the gap d2 is to reserve enough space for the bracket fixing glue 252.
  • the width of the gap d4 between the side of the pad 2111 of the first sensor chip 230 close to the substrate 210 and the bracket 251 may be 1300 um or other values.
  • the fingerprint detection device 200 further includes a light shielding layer 260.
  • the optical path layer 220 includes a lens layer 221 and an optical path guiding layer 222, and the lens layer 221 is used to converge the optical signal returned via the human finger above the display screen to the optical path guiding layer 222, and the optical path
  • the guide layer 222 guides the light signal condensed by the lens layer 221 to the first sensor chip 230
  • the light shielding layer 260 extends from above the bracket 251 to the light path guide layer 222
  • the light shielding layer 260 A gap d5 is formed between the lens layer and the lens layer 221, and the light shielding layer 260 is used to shield light signals incident from other positions than the incident surface of the first sensor chip 230.
  • the thickness of the light shielding layer 260 is 10-30 um, for example, 20 um.
  • the thickness of the light shielding layer 260 can also be other specific values or within a range of other preset values, which is not specifically limited in this application.
  • the light shielding layer 260 is configured to extend from above the support 251 to above the light path guide layer 222, which can not only effectively shield the light signal incident from the non-incident surface of the first sensor chip 230, but also It is possible to tightly fix the light shielding layer 260 to the optical path layer 220, and accordingly, the thickness of the fingerprint detection device 200 can be reduced as much as possible.
  • the light-shielding layer 260 is configured to extend from above the support 251 to above the light path guide layer 222, which can prevent the light-shielding layer 260 from covering the lens layer 221 and shrinking the fingerprint detection device. Image capture area.
  • the light shielding layer 260 is a shielding glue layer, and the arc height position of the first gold wire 250 is covered by the shielding glue layer.
  • Designing the arc height position of the first gold wire 250 to be covered by the blocking adhesive layer not only can effectively block the light signal incident from the non-incident surface of the first sensor chip 230, but also can use the first sensor chip 230
  • a gold wire protective glue of a gold wire 250 supports the shielding glue layer, and accordingly, the stability of the fingerprint detection device 200 can be improved.
  • a filter can also be used to replace the light shielding layer 260.
  • the optical filter is used to reduce undesired ambient light in fingerprint sensing, so as to improve the optical sensing of the first sensor chip 230 to the received light.
  • the filter can specifically be used to filter out light of a specific wavelength, for example, near-infrared light and part of red light. For example, a human finger absorbs most of the energy of light with a wavelength below 580nm. Based on this, the filter can be designed to filter light with a wavelength from 580nm to infrared to reduce the impact of ambient light on optical detection in fingerprint sensing. Influence.
  • the filter may include one or more optical filters, and the one or more optical filters may be configured as, for example, a band-pass filter to allow the transmission of light emitted by the OLED screen while blocking the sun. Other light components such as infrared light in the light.
  • One or more optical filters may be implemented as, for example, an optical filter coating formed on one or more continuous interfaces, or may be implemented as one or more discrete interfaces.
  • the filter may be a coating directly designed on the lens layer to avoid Newton's rings in the fingerprint image acquired by the first sensor chip 230.
  • the light entrance surface of the filter may be provided with an optical inorganic coating or an organic blackened coating, so that the reflectance of the light entrance surface of the filter is lower than a first threshold, for example, 1%, Therefore, it can be ensured that the first sensor chip 230 can receive enough light signals, thereby improving the fingerprint recognition effect.
  • a first threshold for example, 1%
  • the gold wire protective glue 252 of the first gold wire 250 is used to support the light shielding layer 260.
  • the thickness of the gold wire protective glue 252 is equal to the sum of the thickness of the light path guiding layer 222 in the light path layer 220, the thickness of the first sensor chip 230, and the thickness of the first fixing glue 240, so that The gold wire protective glue 250 supports the light shielding layer 260.
  • the fingerprint detection device 200 further includes a first double-sided adhesive layer 271, a film layer 272, and a second double-sided adhesive layer 273; wherein, the first The double-sided adhesive layer 271 is arranged above the light-shielding layer 260, the film layer 272 is arranged above the first double-sided adhesive layer 271, and the second double-sided adhesive layer 273 is arranged on the film material. Above layer 272.
  • the fingerprint detection device 200 Before installing the fingerprint detection device 200, by setting the first double-sided adhesive layer 271, the film layer 272, and the second double-sided adhesive layer 273, the fingerprint can be effectively prevented from being damaged during transportation.
  • the optical path layer 220 in the detection device 200 The optical path layer 220 in the detection device 200.
  • FIG. 4 is a schematic structural diagram of a modified structure of the fingerprint detection device 200 shown in FIG. 3.
  • the fingerprint detection device 200 may further include a second sensor chip 280, a second fixing glue 281 and a second gold wire 282.
  • the upper surface of the substrate 210 extends downward in a third area connected to the second area and penetrates the first covering layer 212 and the first conductive layer 211 to form a second groove.
  • the second sensor chip 280 is fixed in the second groove by a second fixing glue 281, and the second sensor chip 280 is connected to the pad 2111 of the substrate 210 by the second gold wire 282, so that the The second sensor chip 280 is connected to the first sensor chip 230, and the second sensor chip 280 is used to cooperate with the first sensor chip 230 to perform off-screen fingerprint recognition.
  • the third area and the first area are respectively located on two sides of the second area.
  • the processing tasks of the first sensor chip 230 can be shared, which is equivalent to replacing a fully functional and thicker sensor chip with a thinner first sensor arranged side by side
  • the chip 230 and the second sensor chip 280 correspondingly, can reduce the thickness of the fingerprint detection device 200 without affecting the fingerprint recognition performance.
  • the width of the gap d7 between the sidewall of the second sensor chip 280 and the sidewall of the second groove is 100-300um, for example 200um.
  • the thickness of the second sensor chip 280 is 50-150um, such as 60um
  • the maximum arc height of the second gold wire 282 is 30-60um, such as 40um
  • the thickness of the second fixing glue 281 is 10-30um, for example 15um.
  • the maximum arc height of 282 or the thickness of the second fixing glue 281 may also be other specific values or within a predetermined value range, which is not specifically limited in the embodiment of the present application.
  • the gap between the sidewall of the second sensor chip 280 and the sidewall of the second groove can not only serve as the dimensional tolerance of the second sensor chip 280 and/or serve as the size tolerance of the second groove
  • the dimensional tolerance can also be used as the installation tolerance of the second sensor chip 280, and accordingly, the yield rate of the fingerprint detection device 200 can be improved.
  • the fingerprint detection device 200 when installed in an electronic device, it can be connected to the main board of the electronic device through an additional flexible circuit board.
  • the substrate 210 may also include a gold finger 2122 of the substrate 210.
  • the gold finger 2122 of the substrate 210 is used to connect to a flexible circuit board. Accordingly, the substrate 210 passes through the flexible circuit.
  • the board is connected to the main board of the electronic device.
  • FIG. 6 is a schematic structural diagram of a fingerprint detection device 200 provided with a flexible circuit board according to an embodiment of the present application.
  • the fingerprint detection device 200 may further include a flexible circuit board 290 and (Anisotropic Conductive Film, ACF) 292, and the flexible circuit board 290 is formed with the flexible circuit
  • ACF Advanced Conductive Film
  • the gold finger 291 of the flexible circuit board 290 can be pressed to the gold finger 2122 of the substrate 210, which is equivalent to that the fingerprint detection device 200 can be configured with different specifications
  • the flexible circuit board makes the fingerprint detection device 200 more versatile, and accordingly, can meet the needs of different users or customers.
  • the fingerprint detection device 200 may further include a protective glue 293 including an anisotropic conductive adhesive film 292, and the protective glue 293 may be located on the anisotropic conductive adhesive film 292. Both ends of the adhesive film 292 are used to protect the anisotropic conductive adhesive film 292, and further protect the golden fingers 291 of the flexible circuit board 290 and the golden fingers 2122 of the substrate 210. As shown in FIG. 6, in some embodiments of the present application, the fingerprint detection device 200 may further include an image processor 296, and the image processor 296 is provided at one end of the flexible circuit board 290.
  • the image processor 296 may be a microprocessor (Micro Processing Unit, MCU) for receiving fingerprint detection signals (such as fingerprint images) sent from the first sensor chip 230 through the flexible circuit board 290, and correcting The fingerprint detection signal is simply processed.
  • MCU Micro Processing Unit
  • the fingerprint detection device 200 may further include at least one capacitor 295 provided at one end of the flexible circuit board 290, and the at least one capacitor 295 is used for optimization ( For example, filter processing) the fingerprint detection signal collected by the first sensor chip 230.
  • each chip in the first sensor chip 230 corresponds to one or more capacitors. As shown in FIG.
  • the fingerprint detection device 200 may further include a connector 294 provided at one end of the flexible circuit board 290, and the connector 294 may be used to communicate with an external device. Or other components of the electronic device (such as a main board) are connected to realize communication with the external device or communication with other components of the electronic device.
  • the connector 294 may be used to connect the processor of the electronic device, so that the processor of the electronic device receives the fingerprint detection signal processed by the image processor 296, and based on the processed fingerprint detection signal Fingerprint detection signal for fingerprint identification.
  • FIGS. 3 to 6 are only examples of embodiments of the present application, and should not be construed as limiting the present application.
  • the lens layer 221 is used as a device for condensing optical signals in the optical path layer 220.
  • the lens layer 221 may also use an optical collimator.
  • the optical collimator refer to the related description of the optical path design of the fingerprint detection device 130 in the foregoing content.
  • the lens layer 221 may have a microlens array formed by a plurality of microlenses
  • the light path guiding layer 222 may be a light blocking layer
  • the light blocking layer has a plurality of microholes and is disposed on the microlens layer 221
  • the micro holes correspond to the micro lenses one-to-one
  • one or more optical sensing units in the first sensor chip 230 correspond to one micro lens in the lens layer 221.
  • the optical path layer 220 may also include other optical film layers, such as a dielectric layer or a passivation layer.
  • the fingerprint detection device 200 of the embodiment of the present application is described above in conjunction with FIGS. 3 to 6, and the installation scheme of the fingerprint detection device 200 will be described in detail below.
  • the fixing structure includes at least one of the bracket 251, the bracket fixing glue 253, and the light shielding layer 260.
  • the fixing structure is disposed on the upper surface of the substrate 210 and the fixing structure surrounds the first sensor chip 230.
  • the fixing structure is a connecting part of the fingerprint detection device 200, which is used to connect and fix the fingerprint detection device 200 on the lower surface of the display screen.
  • the fingerprint detection device 200 includes a substrate 210, an optical path layer 220, a first sensor chip 230, a first fixing glue 240, and a first gold wire 250.
  • the substrate 210 includes a first covering layer 212, a first conductive layer 211 layer 212, a base layer 213, a second conductive layer 214, and a second covering layer 215 in order from top to bottom.
  • the optical path layer 220 includes a lens layer 221 and an optical path guiding layer 222 thereunder.
  • the fixing structure may include a bracket 251 and a gold wire protective glue 252.
  • the fixing structure may further include a light shielding layer 260.
  • the fingerprint detection device 200 may further include a second sensor chip 280, a second fixing glue 281, and a second gold wire 282.
  • the fingerprint detection device 200 may be applicable to electronic equipment with a display screen, the bottom layer of the display screen is an opaque layer, and an opening through the opaque layer is formed on the opaque layer .
  • the overall thickness of the fingerprint detection device is 0.15-0.6 mm. Of course, other values can also be used.
  • the fingerprint detection device 200 includes:
  • Substrate 210 fixing structure and pressure sensitive adhesive
  • the first sensor chip 230 is fixedly electrically connected to the substrate 210, the fixing structure is disposed on the upper surface of the substrate 210, and the fixing structure surrounds the first sensor chip 230.
  • the upper surface is fixed to the lower surface of the display screen by the pressure-sensitive adhesive, so that the first sensor chip 230 is aligned with the window setting, and the first sensor chip 230 is used for receiving through the window
  • a fingerprint detection signal returned via a human finger above the display screen and guided by the optical path layer 220, and the fingerprint detection signal is used to detect fingerprint information of the finger.
  • the fingerprint detection device 200 collects the light signal leaking from the upper side of the OLED screen, and performs imaging of the fingerprint image based on the received light signal.
  • the optical path layer 220 is directly disposed on the upper surface of the first sensor chip 230, and the lower surface of the first sensor chip 230 is fixed on the substrate 210 by the first fixing glue 240, which can avoid separate Providing a housing for the optical path layer 220 and the first sensor chip 230 reduces the size (for example, the thickness) of the fingerprint detection device 200.
  • the optical path layer 220 is directly disposed on the upper surface of the first sensor chip 230, and the lower surface of the first sensor chip 230 is fixed on the substrate 210 by the first fixing glue 240, so that the components are closely matched in the thickness direction. (That is, the components are tightly fitted in the thickness direction without leaving a gap), which reduces the size (for example, the thickness) of the fingerprint detection device 200.
  • the thickness of the fingerprint detection device 200 when the thickness of the fingerprint detection device 200 is controlled, it can be placed between the display screen and the battery, rather than disposing the fingerprint identification device at a position other than the battery.
  • the original internal structure of the electronic device needs to be adjusted, and the utilization rate of the internal space of the electronic device can also be improved.
  • the volume of the battery can be increased, and the space saved can be used to accommodate the increased volume of the battery. Accordingly, the service life and user experience of the electronic device can be increased without increasing the volume of the electronic device.
  • FIG. 7 is a schematic structural diagram of a display screen 310 according to an embodiment of the present application.
  • the display screen 310 may include:
  • CG Cover glass
  • OCA first optical clear adhesive
  • POL polarizer
  • display panel 316 support film 317
  • buffer layer cushion
  • copper foil layer 319
  • the touch screen 313 can also be integrated into the display panel 316, that is, the display panel 316 can also be used as a touch screen.
  • the display panel 316 is used to display images, and the display panel 316 may also be referred to as a liquid crystal panel or a display panel.
  • the display panel 316 may be made of different materials to form various types of display panels.
  • the display panel 316 may include a liquid crystal display (LCD) panel or an organic light emitting diode (OLED) display panel.
  • LCD panels include but are not limited to thin film transistor (TFT) display panels, in-plane switching (IPS) display panels, and super LCD (Super LCD, SLCD) display panels.
  • TFT thin film transistor
  • IPS in-plane switching
  • Super LCD Super LCD
  • SLCD super LCD
  • the display panel 316 may adopt different material technologies to form different panels.
  • the display panel 316 may be an OLED organic light-emitting panel made of low temperature poly-silicon (LTPS) technology, which has ultra-thin thickness, light weight, low power consumption, and can be used to provide clearer images.
  • LTPS low temperature poly-silicon
  • other material technologies can also be used to prepare the panel, the other material technologies including but not limited to amorphous silicon (A-Si) technology, indium gallium zinc oxide (IGZO) technology, and continuous granular crystalline silicon (CGS) technology.
  • the CG 311 is used to protect the display screen
  • the first OCA is used to attach the CG 311 to the touch screen 313
  • the second OCA 314 is used to connect the touch screen 313 to the POL 315
  • the POL 315 can be a kind of optical film with the function of generating polarized light, which is composited by a multi-layer polymer material.
  • the non-polarized light passes through the POL 315, it is filtered into a linear parallel to the target direction.
  • the target direction is the polarization direction of the POL 315.
  • the supporting film 317 is used to support the display panel 316.
  • the buffer layer 318 may also be referred to as a screen print layer or an embossing layer.
  • the screen print layer may have graphics and text, and the graphics and text can be used as logos such as trademark patterns.
  • the buffer layer 318 may be a black flake layer or a printed layer for shielding light.
  • the buffer layer 318 may have a layer structure formed of foam material.
  • the copper foil layer 319 may also be called a heat dissipation layer (used to reduce the temperature of the display screen) or a radiation prevention layer.
  • the buffer layer 318 and the copper foil layer 319 may be combined into the rear panel or bottom layer of the display screen 310, or the rear panel of the display screen may further include the buffer layer 318 and the copper foil layer 319.
  • FIG. 8 is another schematic structural diagram of the display screen 310 according to an embodiment of the present application.
  • the display screen 310 may include:
  • CG Cover glass
  • OCA Optical Clear Adhesive
  • POL Polarizer
  • Encapsulation layer 324 display panel 325, and cushion 326.
  • the display panel 325 can also be used as a touch screen.
  • the display screen 310 shown in FIG. 7 may also be referred to as a soft screen.
  • the display screen 310 shown in FIG. 8 may also be referred to as a hard screen.
  • the fingerprint detection device 200 of the embodiment of the present application can be applied to both a soft screen (that is, the display screen 310) and a hard screen (that is, the display screen 310).
  • FIG. 9 is a schematic side cross-sectional view of an electronic device 300 with a fingerprint detection device 200 pasted on the lower surface of the buffer layer 319 according to an embodiment of the present application.
  • Fig. 10 is a schematic bottom view of the electronic device 300 shown in Fig. 9. Among them, FIG. 9 is a schematic cross-sectional view of the electronic device 300 along the direction of the dotted line shown in FIG. 10.
  • the fingerprint detection device 200 may further include:
  • the side portion of the fixing structure includes the first side portion 297 and at least one second side portion other than the first side portion, and the substrate 210 is provided with gold at a position close to the first side portion.
  • Finger, the golden finger of the substrate 210 (for example, the golden finger 2122 of the substrate 210 shown in FIG. 6) can be electrically connected to the golden finger of the flexible circuit board (for example, the flexible circuit board shown in FIG. 6) through an anisotropic conductive adhesive film.
  • the golden finger 291 of the circuit board 290), the holding portion 420 is fixedly arranged on any one of the at least one second side portion, and the holding portion 420 is used to peel the fingerprint from the display screen 310 Detection device.
  • the holding portion 420 By providing the holding portion 420, the installation complexity and the disassembly complexity of the fingerprint detection device 200 can be reduced, and accordingly, its practicability can be improved.
  • the technical solution of the present application can not only reduce the thickness of the fingerprint detection device 200, but can also reduce the installation complexity and disassembly complexity of the fingerprint detection device 200, so as to improve its practicability.
  • the substrate 210 is provided with a gold finger near the first side portion, and the gold finger of the substrate 210 is electrically conductive through an anisotropic conductive adhesive film.
  • a gold finger connected to the flexible circuit board, the side portion of the fixing structure includes the first side portion and at least one second side portion other than the first side portion, the at least one second side portion and Curing glue 392 is set between the pressure-sensitive adhesive 391, the holding part 420 and the side part of the fixing structure to fix the fixing structure and the holding part 420.
  • the curing adhesive 392 is ultraviolet curing adhesive or hot melt adhesive.
  • ultraviolet (UV) curing adhesive can also be called UV glue, shadowless adhesive, UV light curing adhesive, etc.
  • the ultraviolet curing adhesive is a one-component, low-viscosity, high-strength acrylic adhesive.
  • the ultraviolet curable adhesive can be cured by ultraviolet light irradiation.
  • the ultraviolet curing adhesive has the characteristics of long storage period, no solvent, fast curing speed, good transparency, and good heat resistance and chemical resistance.
  • the hot melt glue (Hot Glue) is a plastic adhesive whose physical state can change with temperature changes within a certain temperature range. Based on this, the hot melt glue is used to fix the display screen relative to the display screen.
  • the pressure-sensitive adhesive can not only ensure the curing effect of the cured adhesive, but also can reduce the curing effect by heating the hot melt adhesive during the process of disassembling the fingerprint detection device 200, thereby reducing the disassembly or replacement of the hot melt adhesive. The operation complexity of the fingerprint detection device 200 is described.
  • the fingerprint detection device 200 By disposing the curing adhesive 392 between the at least one second side portion and the pressure-sensitive adhesive 391 to fix the pressure-sensitive adhesive 391 relative to the display screen, the fingerprint detection device 200 can be pushed The value meets the thrust test requirements of the end customer, that is, the fingerprint detection device 200 will not produce displacement during the thrust test process. Based on this, the connection stability of the fingerprint detection device 200 during use can be ensured, correspondingly , The performance stability of the fingerprint detection device 200 can be ensured.
  • the holding portion 420 can be fixed, and accordingly, the connection reliability of the holding portion 420 can be ensured.
  • the upper surface of the fixing structure may be fixed to the lower surface of the copper foil layer 319 by the pressure-sensitive adhesive 391 in the surrounding area of the window.
  • the curing adhesive 392 may not cover the pressure-sensitive adhesive 391.
  • the side portion of the fixing structure includes the first side portion 297 and at least one second side portion excluding the first side portion 297, wherein the curing glue 392 may be disposed at least on the fixing structure The outside of a second side.
  • the electronic device 300 may further include a middle frame 360.
  • the middle frame 360 may be used to carry or support various devices or components in the electronic device 300.
  • the device or component includes, but is not limited to, a battery, a camera, an antenna, a main board, and the display screen.
  • the middle frame 360 is formed with an opening 361 passing through the middle frame, and the opening 361 is used to provide an accommodation space for the fingerprint detection device 200.
  • the fingerprint detection device 200 is attached to the lower surface of the display screen in a hanging manner.
  • the electronic device may further include a battery located under the fingerprint detection device 200, and a gap is formed between the fingerprint detection device 200 and the battery.
  • a battery easy pull glue is arranged between the back cover of the electronic device and the battery.
  • FIG. 11 is a schematic side cross-sectional view of an electronic device 300 with a fingerprint detection device 200 pasted on the lower surface of a supporting film 317 according to an embodiment of the present application.
  • FIG. 12 is a schematic bottom view of the electronic device 300 shown in FIG. 11.
  • 11 is a schematic cross-sectional view of the electronic device 300 along the direction of the dotted line shown in FIG. 12.
  • the upper surface of the fixing structure may be fixed to the lower surface of the supporting film 317 through the pressure-sensitive adhesive 391.
  • the opening of the opaque layer may include the opening of the buffer layer 318 and the opening of the copper foil layer 319.
  • the opening of the opaque layer is used to provide an accommodation space for the fingerprint detection device 200 and the curing glue 392.
  • the curing adhesive 392 may not cover the pressure-sensitive adhesive 391 and a part of the lower surface of the supporting film 317 can be seen.
  • the side portion of the fixing structure includes the first side portion 297 and at least one second side portion excluding the first side portion 297, wherein the curing glue 392 may be disposed at least on the fixing structure The outside of a second side.
  • the fingerprint detection device 200 can be applied to electronic equipment with a soft screen. Since the bottom layer of the display screen 310 includes a buffer layer 318 and a copper foil layer 319, the opening of the opaque layer can include the opening of the buffer layer 318. The window and the opening of the copper foil layer 319. At this time, the upper surface of the fixing structure is fixed to the lower surface of the copper foil layer 319 by the pressure-sensitive adhesive in the surrounding area of the window. Alternatively, the upper surface of the fixing structure is fixed to the lower surface of the supporting film 317 by the pressure-sensitive adhesive.
  • the opaque layer (ie, the bottom layer) of the display screen includes a buffer layer and a copper foil layer from top to bottom, and a support film is provided above the buffer layer; wherein, the upper surface of the fixed structure
  • the pressure-sensitive adhesive may be fixed to the lower surface of the copper foil layer in the surrounding area of the opening, or the upper surface of the fixing structure may be fixed to the lower part of the support film by the pressure-sensitive adhesive. surface.
  • FIG. 9 to FIG. 12 are only examples of the present application, and should not be construed as limiting the present application.
  • the fingerprint detection device 200 can also be applied to electronic equipment with a hard screen, that is, the fingerprint detection device can also be applied to electronic equipment with a buffer layer as the bottom layer.
  • the fingerprint detection device 200 can be applied to an electronic device with a hard screen, since the bottom layer of the display screen 310 is the buffer layer 326, the upper surface of the fixing structure is fixed by the pressure-sensitive adhesive The lower surface of the buffer layer 326 is located in the surrounding area of the window. At this time, the opening of the buffer layer 326 is the opening of the opaque layer.
  • the opaque layer (ie, the bottom layer) of the display screen is a buffer layer
  • the upper surface of the fixing structure is fixed to the lower surface of the buffer layer by the pressure-sensitive adhesive in the surrounding area of the window.
  • the fingerprint detection device is pasted to the buffer layer of the display screen (for example, the buffer layer 326 shown in FIG. 8), the copper foil layer (for example, as shown in FIG. The copper foil layer 319 shown) or the lower surface of the supporting film (for example, the supporting film 317 as shown in FIG. 7), compared to directly attaching the fingerprint detection device to the display panel of the display screen (for example , The display panel 316 shown in FIG. 7, and another example, the display panel 325 shown in FIG. It can also reduce the difficulty of installing the fingerprint detection device, and correspondingly, can reduce the installation complexity of the fingerprint detection device and improve the yield of the electronic device.
  • sticking the fingerprint detection device to the bottom surface of the buffer layer, copper foil layer or support film of the display screen can also avoid damage to the display screen during the process of disassembling the fingerprint detection device. Accordingly, The disassembly complexity of the fingerprint detection device is reduced and the yield of the electronic device is improved.
  • the fingerprint detection device is pasted to the buffer layer (for example, the buffer layer 326 shown in FIG. 8) or the copper foil layer of the display screen by using the fixing structure of the substrate through the first pressure-sensitive adhesive (For example, the copper foil layer 319 shown in FIG. 7), when the display screen is pressed or the electronic device falls or collides, due to the presence between the display panel and the fingerprint detection device
  • the lower surface of the buffer layer and/or the copper foil layer can prevent the display panel and the fingerprint detection device from being squeezed to affect the performance of the display panel and the fingerprint detection device.
  • the fingerprint detection device by sticking the fingerprint detection device to the bottom surface of the buffer layer or the copper foil layer of the display screen, compared to directly bonding the fingerprint detection device to the display panel or support film of the display screen, It can also avoid the size of the opening window being too large, and accordingly, the visibility of the user when viewing the fingerprint detection device from the front of the display screen can be reduced, thereby beautifying the appearance of the electronic device.
  • FIG. 13 is a schematic side sectional view of an electronic device 300 having a connecting portion 432 provided by an embodiment of the present application.
  • FIG. 14 is a schematic bottom view of the electronic device 300 shown in FIG. 13. Wherein, FIG. 13 is a schematic cross-sectional view of the electronic device 300 along the direction of the dotted line shown in FIG. 14.
  • the lower surface of the support film 317 is provided with a connecting portion 432 corresponding to the upper surface of the fixing structure in the area of the window, and the connecting portion 432 It is connected to the supporting film 317 by a double-sided tape 431.
  • the connecting portion 432 is a rigid reinforcement plate or a polyethylene terephthalate glue layer.
  • the connecting portion 432 is an opaque medium layer.
  • the connecting portion 432 it is possible to prevent the pressure-sensitive adhesive 391 or the curing adhesive 392 from forming irregular sticking traces on the supporting film 317, and accordingly, the aesthetics of the electronic equipment installed with the fingerprint detection device can be ensured. sex.
  • the connecting portion 432 can be formed by any adhesive layer that can be prepared on the supporting film 317.
  • the embodiment of the present application does not limit the specific material and shape of the connecting portion 432.
  • the shape of the connecting portion may be the same as the shape of the upper surface of the fixing structure.
  • the size of the connecting portion may be larger than the size of the upper surface of the fixing structure, so as to reserve an accommodation space for the curing glue 392.
  • FIGS. 9 to 14 are only examples of the present application, and should not be construed as limiting the present application.
  • the fingerprint detection device 200 can also be fixedly arranged on the bottom surface of the copper foil layer 319 as shown in FIG. 7 or the buffer layer 326 as shown in FIG.
  • the detection device 200 can be fixedly arranged on the lower surface of the supporting film 317 as shown in FIG. 7 through a limiting structure.
  • the gripping portion 420 described in FIGS. 9 to 14 is disposed on the surface of the light shielding layer 260 close to the bracket 251.
  • the embodiments of the present application are not limited to this.
  • FIG. 15 is a schematic structural diagram of a fingerprint detection device 200 provided with a grip portion 420 according to an embodiment of the present application.
  • an accommodating space is formed on a side of the light shielding layer 260 facing away from the display screen 310, and the holding portion 420 is disposed in the accommodating space.
  • a side of the light shielding layer 260 close to the bracket 251 is provided with an accommodating space, and the holding portion 420 is provided in the accommodating space.
  • the side of the light shielding layer 260 where the holding portion 420 is arranged extends outward for a predetermined distance, so that the user can hold the holding portion 420.
  • the light shielding layer 260 and the holding portion 420 are integrally formed to increase the reliability of the connection of the holding portion 420.
  • Arranging the holding portion 420 in the accommodating space of the light shielding layer 260 can not only reduce the thickness of the fingerprint detection device 200, but also ensure that the holding portion 420 and the light shielding layer 260 have a sufficient contact area. In order to increase the reliability of the connection between the light shielding layer 260 and the holding portion 420.
  • the disclosed system, device, and method can be implemented in other ways.
  • the device embodiments described above are merely illustrative, for example, the division of the units is only a logical function division, and there may be other divisions in actual implementation, for example, multiple units or components can be combined or It can be integrated into another system, or some features can be ignored or not implemented.
  • the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may be in electrical, mechanical or other forms.
  • the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the objectives of the solutions of the embodiments.
  • the functional units in the various embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units may be integrated into one unit.
  • the function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer readable storage medium.
  • the technical solution of this application essentially or the part that contributes to the existing technology or the part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including Several instructions are used to make a computer device (which may be a personal computer, a server, or a network device, etc.) execute all or part of the steps of the methods described in the various embodiments of the present application.
  • the aforementioned storage media include: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disks or optical disks and other media that can store program codes. .

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Data Mining & Analysis (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Evolutionary Biology (AREA)
  • Evolutionary Computation (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Artificial Intelligence (AREA)
  • Image Input (AREA)

Abstract

提供一种指纹检测装置和电子设备，适用于具有显示屏的电子设备，该显示屏的底层为不透明层，该不透明层上形成有贯通该不透明层的开窗；该指纹检测装置包括：光路层和第一传感器芯片，该光路层设置在该第一传感器芯片的上方；基板、固定结构以及压敏胶；该第一传感器芯片和该固定结构设置在该基板的上表面，该固定结构的上表面通过该压敏胶固定至该显示屏的下表面；把持部；该基板的第一侧部设置有金手指，该固定结构的侧部包括该第一侧部和除该第一侧部之外的至少一个第二侧部，该把持部固定设置在该至少一个第二侧部中的任一侧部，该把持部用于从该显示屏上剥离该指纹检测装置。本申请的方案能够降低指纹模组的安装或拆卸复杂度，以提升实用性。

Description

指纹检测装置和电子设备 技术领域
本申请实施例涉及指纹识别领域，并且更具体地，涉及指纹检测装置和电子设备。
背景技术
目前，屏下指纹识别方案是将光学或超声波指纹识别模组贴合在有机发光二极管(Organic Light-Emitting Diode，OLED)屏幕的底部，也就是不管光学指纹识别模组还是超声波指纹识别模组都需要和屏幕底部发光层紧密粘结在一起。
但是，针对现有的贴屏方案，需要先将指纹模组安装在屏幕的下表面，然后再将安装有指纹模组的屏幕安装在中框上，使得指纹模组能够夹在所述屏幕和所述中框之间。可见，现有的贴屏方案，在安装或拆卸指纹模组的过程中，安装或拆卸复杂度过高，实用性过差。
因此，本领域急需一种能够降低指纹模组的安装或拆卸复杂度的方案，以提升其实用性。
发明内容
提供了一种指纹检测装置和电子设备，能够降低指纹模组的安装或拆卸复杂度，以提升实用性。
第一方面，提供了一种指纹检测装置，适用于具有显示屏的电子设备，所述显示屏的底层为不透明层，所述不透明层上形成有贯通所述不透明层的开窗；
所述指纹检测装置包括：
光路层和第一传感器芯片，所述光路层设置在所述第一传感器芯片的上方；
基板、固定结构以及压敏胶；
其中，所述第一传感器芯片固定电连接至所述基板，所述固定结构设置在所述基板的上表面且所述固定结构包围所述第一传感器芯片，所述固定结构的上表面通过所述压敏胶固定至所述显示屏的下表面，以使得所述第一传 感器芯片对准所述开窗设置，所述第一传感器芯片用于通过所述开窗接收经由所述显示屏上方的人体手指返回的并通过所述光路层引导的指纹检测信号，所述指纹检测信号用于检测所述手指的指纹信息；
把持部；
其中，所述固定结构的侧部包括第一侧部和除所述第一侧部之外的至少一个第二侧部，所述基板在靠近所述第一侧部的位置设置有金手指，所述基板的金手指通过各向异性导电胶膜可电连接至柔性电路板的金手指，所述把持部固定设置在所述至少一个第二侧部中的任一侧部，所述把持部用于从所述显示屏上剥离所述指纹检测装置。
针对所述指纹检测装置，光路层直接设置在第一传感器芯片的上表面，所述第一传感器芯片的下表面通过所述第一固定胶固定在基板上，能够避免单独为所述光路层以及所述第一传感器芯片设置外壳，降低了所述指纹检测装置的尺寸(例如厚度)。
此外，光路层直接设置在第一传感器芯片的上表面，所述第一传感器芯片的下表面通过所述第一固定胶固定在基板上，使得各部件在厚度方向上紧密配合(即各部件在厚度方向上紧密配合不预留间隙)，降低了所述指纹检测装置的尺寸(例如厚度)。
相应的，当所述指纹检测装置的厚度得到控制后，可以在所述显示屏和所述电池之间，相对于将所述指纹识别装置设置在所述电池之外的其它位置，不仅不需要调整所述电子设备的原有内部结构，还能够提升所述电子设备的内部空间的利用率。例如，可以增大电池的体积，并将节省出来的空间用来容纳增大体积后的电池，相应的，能够在不增加电子设备体积的情况下增加所述电子设备的使用寿命和用户体验。
此外，通过设置所述把持部，能够降低所述指纹检测装置的安装复杂度和拆卸复杂度，相应的，能够提升其实用性。
综上所述，本申请的技术方案不仅能够降低所述指纹检测装置的厚度，还能够降低所述指纹检测装置的安装复杂度和拆卸复杂度，以提升其实用性。
在一些可能的实现方式中，所述至少一个第二侧部和所述压敏胶之间，所述把持部和所述固定结构的侧部之间均设置有固化胶，以固定所述固定结构和所述把持部。
通过在所述至少一个第二侧部和所述压敏胶之间设置所述固化胶，以相对所述显示屏固定所述压敏胶，能够使得所述指纹检测装置的推力值满足终端客户的推力测试要求，即能够使得所述指纹检测装置在推力测试过程中不会产生位移，基于此，能够保证所述指纹检测装置在使用过程中的连接稳固性，相应的，能够保证所述指纹检测装置的性能稳定性。
此外，通过在所述把持部和所述固定结构的侧部之间设置所述固化胶，能够固定所述把持部，相应的，能够保证所述把持部的连接可靠性。
在一些可能的实现方式中，所述固化胶为紫外固化胶或热熔胶。
在一些可能的实现方式中，所述不透明层为缓冲层，所述固定结构的上表面通过所述压敏胶固定至所述缓冲层的下表面的位于所述开窗的周围区域。
在一些可能的实现方式中，所述不透明层由上至下依次包括缓冲层和铜箔层，所述缓冲层的上方设置有支撑膜；其中，所述固定结构的上表面通过所述压敏胶固定至所述铜箔层的下表面的位于所述开窗的周围区域，或者，所述固定结构的上表面通过所述压敏胶固定至所述支撑膜的下表面。
通过所述第一压敏胶利用所述基板的固定结构，将所述指纹检测装置粘贴至所述显示屏的缓冲层、铜箔层或支撑膜的下表面，相较于将所述指纹检测装置直接贴合至所述显示屏的显示面板(即OLED层)，不仅能够避免将所述指纹检测装置贴合至所述显示屏后影响所述显示屏的性能，还能够降低安装所述指纹检测装置的困难程度，相应的，能够降低所述指纹检测装置的安装复杂度并提升所述电子设备的良率。而且，将所述指纹检测装置粘贴至所述显示屏的的缓冲层、铜箔层或支撑膜的下表面，还能够避免在拆卸所述指纹检测装置的过程中损坏显示屏，相应的，能够降低所述指纹检测装置的拆卸复杂度并提升所述电子设备的良率。
此外，通过所述第一压敏胶利用所述基板的固定结构，将所述指纹检测装置粘贴至所述显示屏的缓冲层或铜箔层的下表面，当所述显示屏受到按压或者所述电子设备出现跌落或碰撞时，由于所述显示面板和所述指纹检测装置之间存在缓冲层和/或铜箔层的下表面，能够避免所述显示面板和所述指纹检测装置发生挤压而影响所述显示面板和所述指纹检测装置的性能。此外，通过将所述指纹检测装置粘贴至所述显示屏的缓冲层或铜箔层的下表面，相较于将所述指纹检测装置直接贴合至所述显示屏的显示面板或支撑膜，还能 够避免所述开窗的尺寸过大，相应的，能够减弱用户从所述显示屏的正面观看所述指纹检测装置时的可视程度，进而能够美化电子设备的外观。
在一些可能的实现方式中，所述支撑膜的下表面在所述窗口的区域设置有与所述固定结构的上表面对应的连接部，所述连接部通过双面胶连接至所述支撑膜。
通过所述连接部，可以避免所述压敏胶或固化胶在所述支撑膜上形成不规则的粘贴痕迹，相应的，能够保证安装有所述指纹检测装置的电子设备的美观性。
在一些可能的实现方式中，所述连接部为刚性补强板或为聚对苯二甲酸乙二醇酯胶层。
在一些可能的实现方式中，所述连接部为不透明的介质层。
在一些可能的实现方式中，所述基板由上至下依次包括第一覆盖层、第一导电层、基材层、第二导电层以及第二覆盖层，所述基板的上表面在第一区域向下延伸并贯通所述第一覆盖层和所述第一导电层以形成第一凹槽，所述基板的上表面在与所述第一区域相连的第二区域向下延伸并贯通所述第一覆盖层以形成所述基板的焊盘；
所述指纹检测装置还包括：
第一固定胶以及第一金线；
其中，所述第一传感器芯片的下表面通过所述第一固定胶固定至所述第一凹槽内，所述第一传感器芯片通过所述第一金线连接至所述基板的焊盘。
通过去除所述基板在所述第一区域处的第一覆盖层和所述第一导电层，形成用于容纳所述第一固定胶和所述第一传感器芯片的第一凹槽，能够降低所述指纹检测装置的厚度。
其次，通过去除所述基板的所述第二区域处的第一覆盖层，形成用于电连接所述第一传感器芯片的基板焊盘，能够为用于电连接所述第一传感器芯片和所述基板的所述第一金线提供容纳空间，相应的，降低了所述第一金线在所述基板上方的占用空间，进而能够降低所述指纹检测装置的厚度。
再次，在厚度方向上通过各个层之间的紧密配合，保证最大程度的降低所述指纹检测装置的厚度。
最后，由于所述光路层直接设置在所述第一传感器芯片的上表面，所述指纹检测装置的图像采集视场仅受到所述光路层的面积以及对应的第一传 感器芯片的面积的影响，基于此，可以根据实际需求合理设计光路层的面积及其对应的第一传感器芯片的面积，以满足不同用户以及不同客户的需求(例如大面积图像采集视场的需求)。
综上所述，本申请的技术方案不仅能够降低所述指纹检测装置的厚度，还能够保证具有足够大的图像采集视场。
在一些可能的实现方式中，所述指纹检测装置还包括：
第二传感器芯片、第二固定胶以及第二金线；
其中，所述基板的上表面在与所述第二区域相连的第三区域向下延伸并贯通所述第一覆盖层和所述第一导电层以形成第二凹槽，所述第二传感器芯片通过第二固定胶固定在所述第二凹槽内，所述第二传感器芯片通过所述第二金线连接至所述基板的焊盘，以使得所述第二传感器芯片连接至所述第一传感器芯片，所述第二传感器芯片用于配合所述第一传感器芯片进行屏下指纹识别。
通过设置的所述第二传感器芯片，可以分担所述第一传感器芯片的处理任务，相当于，将功能完整的且较厚的一个传感器芯片替换为并列设置的厚度较薄的第一传感器芯片和第二传感器芯片，相应的，能够在不影响指纹识别性能的基础上降低所述指纹检测装置的厚度。
在一些可能的实现方式中，所述固定结构包括：
支架和金线保护胶；
其中，所述金线保护胶用于封装所述第一金线，所述支架设置在所述第一覆盖膜的上表面并位于所述第一传感器芯片的外侧。
在一些可能的实现方式中，所述支架为聚对苯二甲酸乙二醇酯胶层；或所述支架通过支架固定胶固定在所述第一覆盖膜的上表面并位于所述第一传感器芯片的外侧。
在一些可能的实现方式中，所述固定结构还包括：
遮光层；
其中，所述光路层包括透镜层和光路引导层，所述微透镜用于将经由所述显示屏上方的人体手指返回的光信号会聚至所述光路引导层，所述光路引导层将所述微透镜会聚的光信号引导至所述第一传感器芯片，所述遮光层从所述支架的上方延伸至所述光路引导层上方，所述遮光层和所述微透镜层之间形成有间隙，所述遮光层用于遮挡从所述第一传感器芯片的入射面之外的 其它位置入射的光信号。
将所述遮光层构造为从所述支架的上方延伸至所述光路引导层的上方，不仅能够有效遮挡从所述第一传感器芯片的非入射面入射的光信号，还能够尽可能的将所述遮光层紧密固定至所述光路层，相应的，能够尽可能的降低所述指纹检测装置的厚度。
此外，将所述遮光层构造为从所述支架的上方延伸至所述光路引导层的上方，能够避免由于所述遮光层覆盖所述透镜层而缩小所述指纹检测装置的图像采集区域。
在一些可能的实现方式中，所述遮光层和所述把持部一体成型。
在一些可能的实现方式中，所述遮光层的背离所述显示屏的一侧形成有容纳空间，所述把持部设置在所述容纳空间内。
将所述把持部设置在所述遮光层的容纳空间内，不仅能够减小所述指纹检测装置的厚度，还保证所述把持部和所述遮光层具有足够的接触面积，以增加所述遮光层和所述把持部的连接可靠性。
在一些可能的实现方式中，所述遮光层的设置有所述把持部的一侧向外延伸预设距离，以便用户把持所述把持部。
在一些可能的实现方式中，所述遮光层为遮挡胶层，所述第一金线的弧高位置被遮光胶层覆盖。
在一些可能的实现方式中，所述指纹检测装置还包括所述柔性电路板，所述柔性电路板的金手指通过所述各向异性导电胶膜电连接至所述基板的金手指。
第二方面，提供了一种电子设备，包括：
显示屏；
指纹检测装置，设置在所述显示屏下方，所述指纹检测装置为第一方面或第一方面中任一种可能的实现方式中所述的指纹检测装置，且其指纹采集区域至少部分位于所述显示屏的显示区域之中。
在一些可能的实现方式中，所述电子设备还包括中框，所述电子设备还包括中框，所述中框形成有贯通所述中框的开孔，所述开孔用于为所述指纹检测装置提供容纳空间。
附图说明
图1是本申请可以适用的电子设备的平面示意图。
图2是图1所示的电子设备的侧剖面示意图。
图3至图6是本申请实施例的指纹检测装置的示意性结构图。
图7和图8是本申请实施例的电子设备的显示屏的示意性结构图。
图9至图14是本申请实施例的安装有指纹检测装置的电子设备的示意性结构图。
图15是本申请实施例的具有把持部的指纹检测装置的示意性结构图。
具体实施方式
下面将结合附图，对本申请实施例中的技术方案进行描述。
本申请实施例的技术方案可以应用于各种电子设备。例如，智能手机、笔记本电脑、平板电脑、游戏设备等便携式或移动计算设备，以及电子数据库、汽车、银行自动柜员机(Automated Teller Machine，ATM)等其他电子设备。但本申请实施例对此并不限定。
本申请实施例的技术方案可以用于生物特征识别技术。其中，生物特征识别技术包括但不限于指纹识别、掌纹识别、虹膜识别、人脸识别以及活体识别等识别技术。为了便于说明，下文以指纹识别技术为例进行说明。
本申请实施例的技术方案可以用于屏下指纹识别技术。
屏下指纹识别技术是指将指纹检测装置安装在显示屏下方，从而实现在显示屏的显示区域内进行指纹识别操作，不需要在电子设备正面除显示区域外的区域设置指纹采集区域。具体地，指纹检测装置使用从电子设备的显示组件的顶面返回的光来进行指纹感应和其他感应操作。这种返回的光携带与显示组件的顶面接触或者接近的物体(例如手指)的信息，位于显示组件下方的指纹检测装置通过采集和检测这种返回的光以实现屏下指纹识别。其中，指纹检测装置的设计可以为通过恰当地配置用于采集和检测返回的光的光学元件来实现期望的光学成像，从而检测出所述手指的指纹信息。
图1和图2示出了屏下指纹识别技术可以适用的电子设备100的示意图，其中图1为电子设备100的正面示意图，图2为图1所示的电子设备100的部分剖面结构示意图。
如图2所示，电子设备100可以包括显示屏120和指纹检测装置130。
显示屏120可以为自发光显示屏，其采用具有自发光的显示单元作为显 示像素。比如显示屏120可以为有机发光二极管(Organic Light-Emitting Diode，OLED)显示屏或者微型发光二极管(Micro-LED)显示屏。
此外，显示屏120还可以具体为触控显示屏，其不仅可以进行画面显示，还可以检测用户的触摸或者按压操作，从而为用户提供一个人机交互界面。比如，在一种实施例中，电子设备100可以包括触摸传感器，所述触摸传感器可以具体为触控面板(Touch Panel，TP)，其可以设置在所述显示屏120表面，也可以部分集成或者整体集成到所述显示屏120内部，从而形成所述触控显示屏。
指纹检测装置130可以为光学指纹检测装置。
具体来说，指纹检测装置130(也称为指纹识别模组或指纹检测模组)可以包括具有光学感应阵列的传感器芯片(也可称为指纹传感器)。其中，光学感应阵列包括多个光学感应单元，每个光学感应单元可以具体包括光探测器或者光电传感器。或者说，指纹检测装置130可以包括光探测器(Photo detector)阵列(或称为光电探测器阵列、光电传感器阵列)，其包括多个呈阵列式分布的光探测器。
如图1所示，指纹检测装置130可以设置在所述显示屏120的下方的局部区域，从而使得指纹检测装置130的指纹采集区域(或检测区域)103至少部分位于所述显示屏120的显示区域102内。
如图2所示，指纹检测装置130的光学感应阵列的所在区域或者光感应范围对应所述指纹检测装置130的指纹采集区域103。其中，指纹检测装置130的指纹采集区域103可以等于或不等于指纹检测装置130的光学感应阵列的所在区域的面积或者光感应范围，本申请实施例对此不做具体限定。
例如，通过光线准直的光路设计，指纹检测装置130的指纹采集区域103可以设计成与所述指纹检测装置130的感应阵列的面积基本一致。
又例如，通过微距镜头进行汇聚光线的光路设计或者反射光线的光路设计，可以使得所述指纹检测装置130的指纹采集区域103的面积大于所述指纹检测装置130感应阵列的面积。
下面对指纹检测装置130的光路设计进行示例性说明。
以指纹检测装置130的光路设计采用具有高深宽比的通孔阵列的光学准直器为例，所述光学准直器可以具体为在半导体硅片制作而成的准直器(Collimator)层，其具有多个准直单元或者微孔，所述准直单元可以具体 为小孔，从手指反射回来的反射光中，垂直入射到所述准直单元的光线可以穿过并被其下方的传感器芯片接收，而入射角度过大的光线在所述准直单元内部经过多次反射被衰减掉，因此所述传感器芯片基本只能接收到其正上方的指纹纹路反射回来的反射光，能够有效提高图像分辨率，进而提高指纹识别效果。
以指纹检测装置130的光路设计采用透镜(Micro-Lens)层的光路设计为例，所述透镜层可以具有由多个微透镜形成的微透镜阵列，其可以通过半导体生长工艺或者其他工艺形成在所述传感器芯片的感应阵列上方，并且每一个微透镜可以分别对应于所述感应阵列的其中一个或多个感应单元。所述透镜层和所述感应单元之间还可以形成其他光学膜层，比如介质层或者钝化层，更具体地，所述透镜层和所述感应单元之间还可以包括具有微孔的挡光层，其中所述微孔形成在其对应的微透镜和感应单元之间，所述挡光层可以阻挡相邻感应单元之间的光学干扰，并使光线通过所述微透镜汇聚到所述微孔内部并经由所述微孔传输到所述微透镜对应的感应单元，以进行光学指纹成像。
需要说明的是，上述光路引导结构的几种实现方案可以单独使用也可以结合使用，比如，可以在所述准直器层或者所述透镜层下方进一步设置透镜层。当然，在所述准直器层或者所述透镜层与所述透镜层结合使用时，其具体叠层结构或者光路可能需要按照实际需要进行调整。
指纹检测装置130可以用于采集用户的指纹信息(比如指纹图像信息)。
以显示屏120采用OLED显示屏为例，显示屏120可以采用具有自发光显示单元的显示屏，比如有机发光二极管(Organic Light-Emitting Diode，OLED)显示屏或者微型发光二极管(Micro-LED)显示屏。指纹检测装置130可以利用OLED显示屏的位于指纹采集区域103的显示单元(即OLED光源)来作为光学指纹检测的激励光源。
当手指触摸、按压或者接近(为便于描述，在本申请中统称为按压)在指纹采集区域103时，显示屏120向指纹采集区域103上方的手指发出一束光，这一束光在手指的表面发生反射形成反射光或者经过手指的内部散射后而形成散射光，在相关专利申请中，为便于描述，上述反射光和散射光统称为反射光。由于指纹的嵴(ridge)与峪(vally)对于光的反射能力不同，因此，来自指纹嵴的反射光和来自指纹峪的发生过具有不同的光强，反射光经 过显示屏120后，被指纹检测装置130中的传感器芯片所接收并转换为相应的电信号，即指纹检测信号；基于所述指纹检测信号便可以获得指纹图像数据，并且可以进一步进行指纹匹配验证，从而在所述电子设备100实现光学指纹识别功能。
由此可见，用户需要对电子设备100进行指纹解锁或者其他指纹验证的时候，只需要将手指按压在位于显示屏120的指纹采集区域103，便可以实现指纹特征的输入操作。
当然，指纹检测装置130也可以采用内置光源或者外置光源来提供用于进行指纹检测识别的光信号。
如图1所示，电子设备100还可以包括保护盖板110。
盖板110可以具体为透明盖板，比如玻璃盖板或者蓝宝石盖板，其位于显示屏120的上方并覆盖所述电子设备100的正面，且盖板110表面还可以设置有保护层。因此，本申请实施例中，所谓的手指按压显示屏120实际上可以是指手指按压在显示屏120上方的盖板110或者覆盖所述盖板110的保护层表面。
如图1所示，指纹检测装置130的下方还可以设置有电路板140，比如软性电路板(Flexible Printed Circuit，FPC)。
指纹检测装置130可以电连接到电路板140，并通过电路板140实现与其他外围电路或者电子设备100的其他元件的电性互连和信号传输。比如，指纹检测装置130可以通过电路板140接收电子设备100的处理单元的控制信号，并且还可以通过电路板140将来自指纹检测装置130的指纹检测信号输出给电子设备100的处理单元或者控制单元等。
图3是本申请实施例的包括一个传感器芯片的指纹检测装置200的示意性结构图。所述指纹检测装置200适用于具有显示屏的电子设备。例如所述指纹检测装置200可以适用于如图1或图2所示的电子设备100。
需要说明的是，为便于说明，在本申请实施例中，相同的附图标记用于表示相同的部件，并且为了简洁，在不同实施例中，省略对相同部件的详细说明。
如图3所示，所述指纹检测装置200包括基板210、光路层220、第一传感器芯片230、第一固定胶240以及第一金线250。
其中，所述基板210由上至下依次包括第一覆盖层212、第一导电层211、 基材层213、第二导电层214以及第二覆盖层215，所述基板210的上表面在第一区域向下延伸并贯通所述第一覆盖层212和所述第一导电层211以形成第一凹槽，所述基板210的上表面在与所述第一区域相连的第二区域向下延伸并贯通所述第一覆盖层212以形成所述基板210的焊盘2111。可选地，在其他可替代实施例中，所述基板210可以包括除所述第一导电层211和所述第二导电层214之外的导电层。可选地，所述第一导电层211或所述第二导电层214可以是铜层或铜箔层。可选地，所述第一覆盖层212或所述第二覆盖层213可以是绝缘层(例如树脂层)。
光路层220设置在所述第一传感器芯片230的上方，所述第一传感器芯片230的下表面通过所述第一固定胶240固定至所述第一凹槽内，所述第一传感器芯片230通过所述第一金线250连接至所述基板210的焊盘2111，所述第一传感器芯片230用于接收经由所述显示屏上方的人体手指返回的并通过所述光路层220引导的指纹检测信号，所述指纹检测信号用于检测所述手指的指纹信息。
换言之，所述第一传感器芯片230下表面通过第一固定胶240粘贴在所述第一凹槽内，使得所述第一传感器芯片230的至少一部分设置在所述第一凹槽内，并通过所述第一金线250电连接至所述基板210；其中，所述第一传感器芯片230可以通过所述基板210设置在电子设备的显示屏的下方所述第一传感器芯片230用于接收经由所述显示屏上方的人体手指反射或散射而返回的指纹检测信号，并基于所述指纹检测信号检测所述手指的指纹信息，以进行指纹注册或识别。
应理解，所述第一传感器芯片230可以包括多个芯片也可以包括一个芯片，例如所述第一传感器芯片230可以包括多个光学指纹传感器芯片，所述多个光学指纹传感器芯片并排设置在所述第一凹槽内，以拼接成一个光学指纹传感器芯片组件。所述光学指纹传感器芯片组件可以用于同时获取多张指纹图像，所述多张指纹图像拼接后可以作为一个指纹图像进行指纹注册或识别。
针对所述指纹检测装置200，光路层220直接设置在第一传感器芯片230的上表面，所述第一传感器芯片230的下表面通过所述第一固定胶240固定在基板210上，能够避免单独为所述光路层220以及所述第一传感器芯片230设置外壳，降低了所述指纹检测装置200的尺寸(例如厚度)。
此外，通过去除所述基板210在所述第一区域处的第一覆盖层212和所述第一导电层211，形成用于容纳所述第一固定胶240和所述第一传感器芯片230的第一凹槽，能够降低所述指纹检测装置200的厚度。
其次，通过去除所述基板210的所述第二区域处的第一覆盖层212，形成用于电连接所述第一传感器芯片230的基板210焊盘，能够为用于电连接所述第一传感器芯片230和所述基板210的所述第一金线250提供容纳空间，相应的，降低了所述第一金线250在所述基板210上方的占用空间，进而能够降低所述指纹检测装置200的厚度。
再次，在厚度方向上通过各个层之间的紧密配合，保证最大程度的降低所述指纹检测装置200的厚度。
最后，由于所述光路层220直接设置在所述第一传感器芯片230的上表面，所述指纹检测装置200的图像采集视场仅受到所述光路层220的面积以及对应的第一传感器芯片230的面积的影响，基于此，可以根据实际需求合理设计光路层220的面积及其对应的第一传感器芯片230的面积，以满足不同用户以及不同客户的需求(例如大面积图像采集视场的需求)。
综上所述，本申请的技术方案不仅能够降低所述指纹检测装置200的厚度，还能够保证具有足够大的图像采集视场。
如图3所示，在本申请的一些实施例中，所述第一传感器芯片230的侧壁和所述第一凹槽的侧壁之间存在间隙d1。
通过在所述第一传感器芯片230的侧壁和所述第一凹槽的侧壁之间设计一定的间隙d1，即使所述第一传感器芯片230的制备产品的尺寸与所述第一传感器芯片230设计尺寸之间存在差异，或者即使所述第一凹槽的实际尺寸和所述第一凹槽的设计尺寸之间存在差异，也不影响所述将所述第一传感器芯片230安装在所述第一凹槽内。
换言之，所述第一传感器芯片230的侧壁和所述第一凹槽的侧壁之间的间隙d1不仅可以作为所述第一传感器芯片230的尺寸公差和/或作为所述第一凹槽的尺寸公差，也可以作为所述第一传感器芯片230的安装公差，相应的，能够提升所述指纹检测装置200的良率。所述尺寸公差可以是允许的最大极限尺寸减最小极限尺寸之差的绝对值的大小，或所述尺寸公差可以是允许的上偏差减下偏差之差大小。极限偏差＝极限尺寸-基本尺寸，上偏差＝最大极限尺寸-基本尺寸，下偏差＝最小极限尺寸-基本尺寸。所述第一传感器芯 片230的尺寸公差可以是在切削加工所述第一传感器芯片230的过程中允许的变动量。在基本尺寸相同的情况下，尺寸公差愈小，则尺寸精度愈高。类似地，所述第一传感器芯片230的安装公差可以指允许的第一极限安装位置与第二极限安装位置之间的偏移距离，所述第一极限安装位置可以是允许的最靠近所述第一凹槽的第一侧壁的安装位置，所述第二极限安装位置可以是允许的最靠近所述第一凹槽的第二侧壁的安装位置，所述第一侧壁为与所述第二侧壁相对的侧壁。
例如，所述第一传感器芯片230的侧壁和所述第一凹槽的侧壁之间的间隙d1的宽度为100-300um。例如200um。当然可替代地，所述第一传感器芯片230的侧壁和所述第一凹槽的侧壁之间的间隙d1的宽度也可以为其他数值，或者属于一个其他预设数值范围内，本申请对此不做具体限定。例如，所述第一传感器芯片230的侧壁和所述第一凹槽的侧壁之间的间隙d1的宽度也可以是100um或250um，再如，所述第一传感器芯片230的侧壁和所述第一凹槽的侧壁之间的间隙d1的宽度还可以在100um～400un内。
需要说明的是，本申请对所述指纹检测装置200中各个部件或层的厚度不做具体限定，只要所述各个部件或层之间的结构关系采用本申请的设计方案，且通过紧密配合的方式控制指纹检测装置的厚度，其均属于本申请保护的范围。
作为示例，所述第一覆盖层212的厚度和所述第二覆盖层的厚度均为10-30um，例如20um；所述第一导电层211的厚度和所述第二导电层的厚度均为10-20um，例如13um；所述基材的厚度为40-80um，例如64um；所述第一传感器芯片230的厚度为50-150um，例如60um；所述光路层220的厚度为10-30um，例如21um；所述第一金线250的最大弧高d6为30-60um，例如40um；所述第一固定胶240的厚度为10-30um，例如15um。
当然，所述第一覆盖层212的厚度、第一导电层211的厚度、基材层213的厚度、第二导电层214的厚度、第二覆盖层215的厚度、所述第一传感器芯片230的厚度、所述第一固定胶240的厚度、或所述第一金线250的最大弧高d6也可以是其它数值或在一个其他预设数值范围内，本申请对此不做具体限定。
如图3所示，在本申请的一些实施例中，所述指纹检测装置200还可包括支架251和金线保护胶252；其中，所述金线保护胶252用于封装所述第 一金线250，所述支架251设置在所述第一覆盖层212的上表面并位于所述第一传感器芯片230的外侧。可选地，所述支架251通过支架固定胶253固定在所述第一覆盖层212的上表面并位于所述第一传感器芯片230的外侧。例如，所述支架251的材料包括但不限于金属、树脂、玻纤复合板以及胶层等。例如，所述支架251为聚对苯二甲酸乙二醇酯(polyethylene glycol terephthalate，PET)胶层。再如，所述支架251可以是由泡棉材料形成的支架。可选地，所述支架固定胶可以为双面胶。
换言之，所述支架251可以设置在所述基板210的上方且位于所述第一凹槽和所述基板210的焊盘2111(用于电连接所述第一传感器芯片230)的外侧或周围区域。
如图3所示，在本申请的一些实施例中，所述第一传感器芯片230和所述支架251形成的间隙d2的宽度大于或等于所述第一传感器芯片230的侧壁和所述第一凹槽的侧壁之间形成的间隙d1的宽度，所述支架251的外侧相对所述第一覆盖层212的外侧向靠近所述第一传感器芯片230的方向延伸预设距离d3。作为示例，所述第一传感器芯片230和所述支架251形成的间隙d2的宽度为100-400um，例如270um，所述预设距离d3为100-400um，例如200um。可选地，所述支架251的厚度为40-100um，例如50um或80um。
当然，在其他可替代实施例中，所述第一传感器芯片230和所述支架251形成的间隙d2、所述预设距离d3或所述支架251的厚度可以为其他具体数值，也可以在一个其他预设数值范围内。例如，所述支架251的厚度还可以是80um。
通过所述金线保护胶252，能够保证所述基板210和所述第一传感器芯片230之间的电连接的稳定性，相应的，能够保证所述指纹检测装置200的性能。
此外，所述第一传感器芯片230和所述支架251形成的间隙d2不仅可以作为所述支架251的尺寸公差，也可以作为所述支架251的安装公差，相应的，能够提升所述指纹检测装置200的良率。类似地，所述预设距离d3不仅可以作为所述支架251的尺寸公差，也可以作为所述支架251的安装公差，相应的，能够提升所述指纹检测装置200的良率。
在本申请的一些实施例中，所述金线保护胶252的厚度小于或等于所述光路层220的厚度、所述第一传感器芯片230的厚度以及所述第一固定胶240 的厚度之和。
将所述金线保护胶252的厚度构造为小于或等于所述光路层220的厚度、所述第一传感器芯片230的厚度以及所述第一固定胶240的厚度之和，能够在有效封装所述第一金线250的同时尽可能的降低所述指纹检测装置200的厚度。
在其他可替代实施例中，如图3所示，所述金线保护胶252的厚度也可以大于所述光路层220中光路引导层222的厚度、所述第一传感器芯片230的厚度以及所述第一固定胶240的厚度之和。
当然，针对所述支架251，还可以设计出其它参数，用来直到所述支架251的制备以及安装。例如，如图3所示，在本申请的一些实施例中，所述第一传感器芯片230的靠近所述基板210的焊盘2111(用于电连接所述第一传感器芯片230)一侧和所述支架251之间的间隙d4的宽度大于所述第一传感器芯片230的背离所述基板210的焊盘2111(用于电连接所述第一传感器芯片230)一侧和所述支架251之间的间隙d2，以为所述支架固定胶252预留足够的容纳空间。可选地，所述第一传感器芯片230的靠近所述基板210的焊盘2111一侧和所述支架251之间的间隙d4的宽度可以是1300um或其他数值。
如图3所示，在本申请的一些实施例中，所述指纹检测装置200还包括遮光层260。
其中，所述光路层220包括透镜层221和光路引导层222，所述透镜层221用于将经由所述显示屏上方的人体手指返回的光信号会聚至所述光路引导层222，所述光路引导层222将所述透镜层221会聚的光信号引导至所述第一传感器芯片230，所述遮光层260从所述支架251的上方延伸至所述光路引导层222上方，所述遮光层260和所述透镜层221之间形成有间隙d5，所述遮光层260用于遮挡从所述第一传感器芯片230的入射面之外的其它位置入射的光信号。可选地，所述遮光层260的厚度为10-30um，例如20um。当然，所述遮光层260的厚度也可以为其它具体数值或在一个其他预设数值范围内，本申请对此不做具体限定。
将所述遮光层260构造为从所述支架251的上方延伸至所述光路引导层222的上方，不仅能够有效遮挡从所述第一传感器芯片230的非入射面入射的光信号，还能够尽可能的将所述遮光层260紧密固定至所述光路层220， 相应的，能够尽可能的降低所述指纹检测装置200的厚度。
此外，将所述遮光层260构造为从所述支架251的上方延伸至所述光路引导层222的上方，能够避免由于所述遮光层260覆盖所述透镜层221而缩小所述指纹检测装置的图像采集区域。
如图3所示，在本申请的一些实施例中，所述遮光层260为遮挡胶层，所述第一金线250的弧高位置被所述遮挡胶层覆盖。
将所述第一金线250的弧高位置设计为被所述遮挡胶层覆盖，不仅能够能够有效遮挡从所述第一传感器芯片230的非入射面入射的光信号，还能够利用所述第一金线250的金线保护胶支撑所述遮挡胶层，相应的，能够提升所述指纹检测装置200的稳定性。
当然，在其他可替代实施例中，也可以利用滤光片替代所述遮光层260。其中，滤光片用于来减少指纹感应中的不期望的环境光，以提高所述第一传感器芯片230对接收到的光的光学感应。滤光片具体可以用于过滤掉特定波长的光，例如，近红外光和部分的红光等。例如，人类手指吸收波长低于580nm的光的能量中的大部分，基于此，所述滤光片可以设计为过滤波长从580nm至红外的光，以减少环境光对指纹感应中的光学检测的影响。在具体实现中，所述滤光片可以包括一个或多个光学过滤器，所述一个或多个光学过滤器可以配置为例如带通过滤器，以允许OLED屏发射的光的传输，同时阻挡太阳光中的红外光等其他光组分。一个或多个光学过滤器可以实现为例如光学过滤涂层，光学过滤涂层形成在一个或多个连续界面上，或可以实现为一个或多个离散的界面上。例如，所述滤光片可以是直接设计在所述透镜层上的涂层，以避免所述第一传感器芯片230获取的指纹图像中出现牛顿环。可选地，此外，所述滤光片的进光面可以设置有光学无机镀膜或有机黑化涂层，以使得滤光片的进光面的反射率低于第一阈值，例如1％，从而能够保证所述第一传感器芯片230能够接收到足够的光信号，进而提升指纹识别效果。
如图3所示，在本申请的一些实施例中，所述第一金线250的金线保护胶252用于支撑所述遮光层260。
换言之，所述金线保护胶252的厚度等于所述光路层220的中的光路引导层222的厚度、所述第一传感器芯片230的厚度以及所述第一固定胶240的厚度之和，使得所述金线保护胶250支撑所述遮光层260。
如图3所示，在本申请的一些实施例中，所述指纹检测装置200还包括第一双面胶层271、膜材层272和第二双面胶层273；其中，所述第一双面胶层271设置在所述遮光层260的上方，所述膜材层272设置在所述第一双面胶层271的上方，所述第二双面胶层273设置在所述膜材层272的上方。
在安装所述指纹检测装置200之前，通过设置所述第一双面胶层271、所述膜材层272和所述第二双面胶层273，能够有效防止在运输过程中损坏所述指纹检测装置200中的光路层220。
图4是图3所示的指纹检测装置200的变形结构的示意性结构图。
如图4所示，所述指纹检测装置200还可包括第二传感器芯片280、第二固定胶281以及第二金线282。
其中，所述基板210的上表面在与所述第二区域相连的第三区域向下延伸并贯通所述第一覆盖层212和所述第一导电层211以形成第二凹槽，所述第二传感器芯片280通过第二固定胶281固定在所述第二凹槽内，所述第二传感器芯片280通过所述第二金线282连接至所述基板210的焊盘2111，以使得所述第二传感器芯片280连接至所述第一传感器芯片230，所述第二传感器芯片280用于配合所述第一传感器芯片230进行屏下指纹识别。可选地，所述第三区域与所述第一区域分别位于所述第二区域的两侧。
通过设置的所述第二传感器芯片280，可以分担所述第一传感器芯片230的处理任务，相当于，将功能完整的且较厚的一个传感器芯片替换为并列设置的厚度较薄的第一传感器芯片230和第二传感器芯片280，相应的，能够在不影响指纹识别性能的基础上降低所述指纹检测装置200的厚度。
在本申请的一些实施例中，所述第二传感器芯片280的侧壁和所述第二凹槽的侧壁之间存在间隙d7。可选地，所述第二传感器芯片280的侧壁和所述第二凹槽的侧壁之间的间隙d7的宽度为100-300um，例如200um。可选地，所述第二传感器芯片280的厚度为50-150um，例如60um，所述第二金线282的最大弧高为30-60um，例如40um，所述第二固定胶281的厚度为10-30um，例如15um。当然，可替代地，所述第二传感器芯片280的侧壁和所述第二凹槽的侧壁之间的间隙d7的宽度、所述第二传感器芯片280的厚度、所述第二金线282的最大弧高、或所述第二固定胶281的厚度也可以为其它具体数值或在一个其他预设数值范围内，本申请实施例对此不做具体限定。
通过在所述第二传感器芯片280的侧壁和所述第二凹槽的侧壁之间设计一定的间隙d7，即使所述第二传感器芯片280的制备产品的尺寸与所述第二传感器芯片280的设计尺寸之间存在差异，或者即使所述第二凹槽的实际尺寸和所述第二凹槽的设计尺寸之间存在差异，也不影响所述将所述第二传感器芯片280安装在所述第二凹槽内。
换言之，所述第二传感器芯片280的侧壁和所述第二凹槽的侧壁之间的间隙不仅可以作为所述第二传感器芯片280的尺寸公差和/或作为所述第二凹槽的尺寸公差，也可以作为所述第二传感器芯片280的安装公差，相应的，能够提升所述指纹检测装置200的良率。
需要说明的是，所述指纹检测装置200安装至电子设备时，可以通过额外的柔性电路板连接至所述电子设备的主板上。例如，如图5所示，所述基板210还可以包括基板210的金手指2122，所述基板210的金手指2122用于连接至柔性电路板，相应的，所述基板210通过所述柔性电路板连接至电子设备的主板。
图6是本申请实施例的设置有柔性电路板的指纹检测装置200的示意性结构图。
如图6所示，在本申请的一些实施例中，所述指纹检测装置200还可包括柔性电路板290和(Anisotropic Conductive Film，ACF)292，所述柔性电路板290形成有所述柔性电路板290的金手指291；所述柔性电路板290的金手指291通过所述各向异性导电胶膜292电连接至所述基板210的金手指2122。
通过所述各向异性导电胶膜292，能够将所述柔性电路板290的金手指291压合至所述基板210的金手指2122，相当于，可以为所述指纹检测装置200配置不同规格的柔性电路板，使得所述指纹检测装置200更具有通用性，相应的，能够满足不同用户或客户的需求。
如图6所示，在本申请的一些实施例中，所述指纹检测装置200还可包括包括各向异性导电胶膜292的保护胶293，所述保护胶293可以位于所述各向异性导电胶膜292的两端，以保护所述各向异性导电胶膜292，进而保护所述柔性电路板290的金手指291和所述基板210的金手指2122。如图6所示，在本申请的一些实施例中，所述指纹检测装置200还可以包括图像处理器296，所述图像处理器296设置在所述柔性电路板290的一端。例如， 图像处理器296可以为微处理器(Micro Processing Unit，MCU)，用于接收来自所述第一传感器芯片230通过所述柔性电路板290发送的指纹检测信号(例如指纹图像)，并对所述指纹检测信号进行简单的处理。如图6所示，在本申请的一些实施例中，所述指纹检测装置200还可以包括设置在所述柔性电路板290的一端的至少一个电容器295，所述至少一个电容器295用于优化(例如滤波处理)所述第一传感器芯片230采集的指纹检测信号。可选地，所述第一传感器芯片230中的每个芯片对应一个或者多个电容器。如图6所示，在本申请的一些实施例中，所述指纹检测装置200还可以包括设置在所述柔性电路板290的一端的连接器294，所述连接器294可以用于与外部装置或者所述电子设备的其它部件(例如主板)进行连接，进而实现与所述外部装置的通信或者所述电子设备的其它部件的通信。例如，所述连接器294可以用于连接所述电子设备的处理器，以便于所述电子设备的处理器接收经过所述图像处理器296处理过的指纹检测信号，并基于所述处理过的指纹检测信号进行指纹识别。
应当理解，图3至图6仅为本申请实施例的示例，不应理解为对本申请的限制。
例如，在图3和图4中，以透镜层221作为光路层220中用于会聚光信号的器件，可替代地，所述透镜层221也可以利用光学准直器。所述光学准直器的相关描述可以参照前述内容中对所述指纹检测装置130的光路设计的相关描述。
再如，所述透镜层221可以具有由多个微透镜形成的微透镜阵列，所述光路引导层222可以为挡光层，所述挡光层具有多个微孔并设置在微透镜层221的下方，并且所述微孔与所述微透镜一一对应，所述第一传感器芯片230中的一个或多个光学感应单元对应所述透镜层221中的一个微透镜。可选地，所述光路层220还可以包括其他光学膜层，比如介质层或者钝化层。
上文结合图3至图6对本申请实施例的指纹检测装置200进行了介绍，下面针对所述指纹检测装置200的安装方案进行详细说明。
需要说明的是，由于所述支架251、支架固定胶253和所述遮光层260均作为可选层，为便于从安装的角度描述所述指纹检测装置，下文引入一个中间概念(即固定结构)。即，所述固定结构包括所述支架251、支架固定胶253和所述遮光层260中的至少一项。换言之，所述固定结构设置在所述基 板210的上表面且所述固定结构包围所述第一传感器芯片230。所述固定结构为所述指纹检测装置200的连接部，用于将所述指纹检测装置200连接并固定在所述显示屏的下表面。
换言之，所述指纹检测装置200包括基板210、光路层220、第一传感器芯片230、第一固定胶240以及第一金线250。其中，所述基板210由上至下依次包括第一覆盖层212、第一导电层211层212、基材层213、第二导电层214以及第二覆盖层215。可选地，所述光路层220包括透镜层221以及其下方的光路引导层222。可选地，所述固定结构可以包括支架251和金线保护胶252。所述固定结构还可以包括遮光层260。可选地，所述指纹检测装置200还可以包括第二传感器芯片280、第二固定胶281以及第二金线282。
在本申请的一些实施例中，所述指纹检测装置200可适用于具有显示屏的电子设备，所述显示屏的底层为不透明层，所述不透明层上形成有贯通所述不透明层的开窗。可选地，所述指纹检测装置的整体厚度为0.15-0.6mm。当然，也可以是其它数值。
其中，所述指纹检测装置200包括：
光路层220和第一传感器芯片230，所述光路层220设置在所述第一传感器芯片230的上方；
基板210、固定结构以及压敏胶；
其中，所述第一传感器芯片230固定电连接至所述基板210，所述固定结构设置在所述基板210的上表面且所述固定结构包围所述第一传感器芯片230，所述固定结构的上表面通过所述压敏胶固定至所述显示屏的下表面，以使得所述第一传感器芯片230对准所述开窗设置，所述第一传感器芯片230用于通过所述开窗接收经由所述显示屏上方的人体手指返回的并通过所述光路层220引导的指纹检测信号，所述指纹检测信号用于检测所述手指的指纹信息。
以所述显示屏为OLED屏为例，当手指放于亮屏的OLED屏上方，手指就会反射OLED屏发出的光，此反射光会穿透OLED屏直到OLED屏下方。由于指纹是一个漫反射体，因此，经由手指反射或漫射形成的光信号在各方向都会存在。所述指纹检测装置200收集OLED屏上方漏下来的光信号，并基于接收到的光信号进行指纹图像的成像。
针对所述指纹检测装置200，光路层220直接设置在第一传感器芯片230的上表面，所述第一传感器芯片230的下表面通过所述第一固定胶240固定在基板210上，能够避免单独为所述光路层220以及所述第一传感器芯片230设置外壳，降低了所述指纹检测装置200的尺寸(例如厚度)。
此外，光路层220直接设置在第一传感器芯片230的上表面，所述第一传感器芯片230的下表面通过所述第一固定胶240固定在基板210上，使得各部件在厚度方向上紧密配合(即各部件在厚度方向上紧密配合不预留间隙)，降低了所述指纹检测装置200的尺寸(例如厚度)。
相应的，当所述指纹检测装置200的厚度得到控制后，可以在所述显示屏和所述电池之间，相对于将所述指纹识别装置设置在所述电池之外的其它位置，不仅不需要调整所述电子设备的原有内部结构，还能够提升所述电子设备的内部空间的利用率。例如，可以增大电池的体积，并将节省出来的空间用来容纳增大体积后的电池，相应的，能够在不增加电子设备体积的情况下增加所述电子设备的使用寿命和用户体验。
为了便于理解所述指纹检测装置200的安装方案，下面简单介绍一下适用于本申请的显示屏的结构。
图7是本申请实施例的显示屏310的示意性结构图。
如图7所示，所述显示屏310由上至下依次可包括：
盖板(cover glass，CG)311、第一光学胶(Optical Clear Adhesive，OCA)312、触摸屏313、第二OCA 314、偏光片(Polarizer，POL)315、显示面板316、支撑膜317、缓冲层(cushion)318以及铜箔层319。可选地，所述触摸屏313也可集成到所述显示面板316内，即所述显示面板316还可以用作触摸屏。
所述显示面板316用于显示图像，所述显示面板316也可称为液晶面板或显示屏面板。可选地，所述显示面板316可以是采用不同材质形成各种类型的显示屏面板。所述显示面板316可以包括液晶显示屏(Liquid Crystal display，LCD)面板或有机发光二极管(Organic Light Emitting Diode，OLED)显示屏面板。LCD面板包括但不限于薄膜晶体管(TFT)显示屏面板、平面转换(In-Plane Switching，IPS)显示屏面板以及超级LCD(Super LCD，SLCD)显示屏面板。可选地，所述显示面板316可以采用不同的材料技术形成不同的面板。例如，所述显示面板316可以是采用低温多晶硅技术(Low  Temperature Poly-silicon，LTPS)制成的OLED有机发光面板，其厚度超薄、重量轻、低耗电，可以用于提供较为清晰的影像。当然，也可以是用其他材料技术制备面板，所述其他材料技术包括但不限于非晶硅(A-Si)技术、铟镓锌氧化物(IGZO)技术和连续粒状结晶硅(CGS)技术。
所述CG 311用于保护所述显示屏，所述第一OCA用于将所述CG 311与所述触摸屏313相贴合，所述第二OCA 314用于将所述触摸屏313与所述POL 315相贴合，所述POL 315可以是一种由多层高分子材料复合而成的具有产生偏振光功能的光学薄膜，非偏振光通过所述POL 315时被过滤成与目标方向平行的线性偏振光，所述目标方向为所述POL 315的偏振方向。所述支撑膜317用于支撑所述显示面板316。
所述缓冲层318也可以称为屏幕印刷(screen print)层或压花层，所述屏幕印刷层可以带有图文，所述图文可以用作商标图案等标识。所述缓冲层318可以是用于遮蔽光的黑色片状层或者印刷层。例如，所述缓冲层318可以是由泡棉材料形成层结构。铜箔层319也可以称为散热层(用作降低所述显示屏的温度)或者防辐射层。所述缓冲层318和所述铜箔层319可以合成为所述显示屏310的后面板或底层，或者所述显示屏的后面板还可以包括除所述缓冲层318和所述铜箔层319之外的透明层或不透明层，本申请对此不做限定。
图8是本申请实施例的显示屏310的另一示意性结构图。
如图8所示，所述显示屏310由上至下依次可包括：
盖板(cover glass，CG)321、光学胶(Optical Clear Adhesive，OCA)322、偏光片(Polarizer，POL)323、封装(Encapsulation，Encap)层324、显示面板325以及缓冲层(cushion)326。可选地，所述显示面板325还可以用作触摸屏。
需要说明的是，图7所示的显示屏310也可称为软屏。图8所示的显示屏310也可称为硬屏。换言之，本申请实施例的指纹检测装置200既可以应用于软屏(即所述显示屏310)，也可应用于硬屏(即所述显示屏310)。
下面结合附图对指纹检测装置200应用于具有铜箔层或支撑膜的显示屏的具体方案进行示例性说明。
图9是本申请实施例提供的在缓冲层319的下表面粘贴有指纹检测装置200的电子设备300的示意性侧剖图。图10是图9所示的电子设备300的示 意性仰视图。其中，图9是沿图10所示虚线方向的电子设备300的示意性剖面图。
如图9所示，在本申请的一些实施例中，所述指纹检测装置200还可以包括：
把持部420；
其中，所述固定结构的侧部包括所述第一侧部297和除所述第一侧部之外的至少一个第二侧部，所述基板210在靠近第一侧部的位置设置有金手指，所述基板210的金手指(例如，图6所示的基板210的金手指2122)通过各向异性导电胶膜可电连接至柔性电路板的金手指(例如，图6所示的柔性电路板290的金手指291)，所述把持部420固定设置在所述至少一个第二侧部中的任一侧部，所述把持部420用于从所述显示屏310上剥离所述指纹检测装置。
通过设置所述把持部420，能够降低所述指纹检测装置200的安装复杂度和拆卸复杂度，相应的，能够提升其实用性。
综上所述，本申请的技术方案不仅能够降低所述指纹检测装置200的厚度，还能够降低所述指纹检测装置200的安装复杂度和拆卸复杂度，以提升其实用性。
如图10所示，在本申请的一些实施例中，所述基板210在靠近所述第一侧部的位置设置有金手指，所述基板210的金手指通过各向异性导电胶膜可电连接至柔性电路板的金手指，所述固定结构的侧部包括所述第一侧部和除所述第一侧部之外的至少一个第二侧部，所述至少一个第二侧部和所述压敏胶391之间，所述把持部420和所述固定结构的侧部之间均设置有固化胶392，以固定所述固定结构和所述把持部420。
不失一般性地，所述固化胶392为紫外固化胶或热熔胶。
其中，紫外(ultraviolet，UV)固化胶也可称为UV胶水、无影胶、UV光固化胶等，所述紫外固化胶是一种单组分，低粘度，高强度的丙烯酸酯类胶粘剂，可以通过紫外线光照射固化所述紫外固化胶。所述紫外固化胶具有贮存期长、不含溶剂、固化速度快、透明性好以及耐热耐化学品性能好等特点。
所述热熔胶(Hot Glue)是一种可塑性的粘合剂，在一定温度范围内其物理状态可以随温度改变而改变，基于此，通过所述热熔胶相对所述显示屏 固定所述压敏胶，不仅能够保证所述固化胶的固化效果，在拆卸所述指纹检测装置200的过程中，还可以通过加热所述热熔胶，以降低其固化效果，进而能够降低拆卸或更换所述指纹检测装置200的操作复杂度。
通过在所述至少一个第二侧部和所述压敏胶391之间设置所述固化胶392，以相对所述显示屏固定所述压敏胶391，能够使得所述指纹检测装置200的推力值满足终端客户的推力测试要求，即能够使得所述指纹检测装置200在推力测试过程中不会产生位移，基于此，能够保证所述指纹检测装置200在使用过程中的连接稳固性，相应的，能够保证所述指纹检测装置200的性能稳定性。
此外，通过在所述把持部420和所述固定结构的侧部之间设置所述固化胶392，能够固定所述把持部420，相应的，能够保证所述把持部420的连接可靠性。
如图9所示，在本申请的一些实施例中，所述固定结构的上表面可以通过所述压敏胶391固定至所述铜箔层319的下表面的位于所述开窗的周围区域。此时，从仰视图的角度来看，如图10所示，所述固化胶392可以不覆盖所述压敏胶391。所述固定结构的侧部包括所述第一侧部297和除所述第一侧部297之外的至少一个第二侧部，其中，所述固化胶392可以设置在所述固定结构的至少一个第二侧部的外侧。
如图9所示，在本申请的一些实施例中，所述电子设备300还可以包括中框360。所述中框360可以用于承载或支撑所述电子设备300中的各个器件或部件。所述器件或部件包括但不限于电池、摄像头、天线、主板以及所述显示屏。
不失一般性地，所述中框360形成有贯通所述中框的开孔361，所述开孔361用于为所述指纹检测装置200提供容纳空间。换言之，所述指纹检测装置200通过悬挂的方式贴合至所述显示屏的下表面。例如，所述指纹检测装置200和所述中框360的下方的器件之间存在间隙。例如，所述电子设备还可以包括位于所述指纹检测装置200的下方的电池，所述指纹检测装置200和所述电池之间形成有间隙。可选地，所述电子设备的后盖和所述电池之间设置有电池易拉胶。
图11是本申请实施例提供的在支撑膜317的下表面粘贴有指纹检测装置200的电子设备300的示意性侧剖图。图12是图11所示的电子设备300 的示意性仰视图。其中，图11是沿图12所示虚线方向的电子设备300的示意性剖面图。
如图11所示，在本申请的一些实施例中，所述固定结构的上表面可以通过所述压敏胶391固定至所述支撑膜317的下表面。所述不透明层的开窗可以包括缓冲层318的开窗和铜箔层319的开窗。所述不透明层的开窗用于为所述指纹检测装置200以及固化胶392提供容纳空间。此时，从仰视图的角度来看，如图12所示，所述固化胶392可以不覆盖所述压敏胶391，且能够看见所述支撑膜317中的一部分下表面。所述固定结构的侧部包括所述第一侧部297和除所述第一侧部297之外的至少一个第二侧部，其中，所述固化胶392可以设置在所述固定结构的至少一个第二侧部的外侧。
换言之，所述指纹检测装置200可应用于具有软屏的电子设备，由于所述显示屏310的底层包括缓冲层318和铜箔层319，所述不透明层的开窗可以包括缓冲层318的开窗和铜箔层319的开窗。此时，所述固定结构的上表面通过所述压敏胶固定至所述铜箔层319的下表面的位于所述开窗的周围区域。或者，所述固定结构的上表面通过所述压敏胶固定至所述支撑膜317的下表面。
简言之，若所述显示屏的不透明层(即底层)由上至下依次包括缓冲层和铜箔层，且所述缓冲层的上方设置有支撑膜；其中，所述固定结构的上表面可以通过所述压敏胶固定至所述铜箔层的下表面的位于所述开窗的周围区域，或者，所述固定结构的上表面通过所述压敏胶固定至所述支撑膜的下表面。
应理解，图9至图12仅为本申请的示例，不应理解为对本申请的限制。
在其他可替代实施例中，所述指纹检测装置200还可以应用于具有硬屏的电子设备，即所述指纹检测装置还可以应用于底层为缓冲层的电子设备。
结合图8来说，若所述指纹检测装置200可应用于具有硬屏的电子设备，由于所述显示屏310的底层为缓冲层326，所述固定结构的上表面通过所述压敏胶固定至所述缓冲层326的下表面的位于所述开窗的周围区域。此时，所述缓冲层326的开窗即为所述不透明层的开窗。
简言之，所述显示屏的不透明层(即底层)为缓冲层，所述固定结构的上表面通过所述压敏胶固定至所述缓冲层的下表面的位于所述开窗的周围区域。
通过压敏胶利用所述基板的固定结构，将所述指纹检测装置粘贴至所述显示屏的缓冲层(例如，如图8所示的缓冲层326)、铜箔层(例如，如图7所示的铜箔层319)或支撑膜(例如，如图7所示的支撑膜317)的下表面，相较于将所述指纹检测装置直接贴合至所述显示屏的显示面板(例如，如图7所示的显示面板316，再如，如图8所示的显示面板325)，不仅能够避免将所述指纹检测装置贴合至所述显示屏后影响所述显示屏的性能，还能够降低安装所述指纹检测装置的困难程度，相应的，能够降低所述指纹检测装置的安装复杂度并提升所述电子设备的良率。
而且，将所述指纹检测装置粘贴至所述显示屏的的缓冲层、铜箔层或支撑膜的下表面，还能够避免在拆卸所述指纹检测装置的过程中损坏显示屏，相应的，能够降低所述指纹检测装置的拆卸复杂度并提升所述电子设备的良率。
此外，通过所述第一压敏胶利用所述基板的固定结构，将所述指纹检测装置粘贴至所述显示屏的缓冲层(例如，如图8所示的缓冲层326)或铜箔层(例如，如图7所示的铜箔层319)的下表面，当所述显示屏受到按压或者所述电子设备出现跌落或碰撞时，由于所述显示面板和所述指纹检测装置之间存在缓冲层和/或铜箔层的下表面，能够避免所述显示面板和所述指纹检测装置发生挤压而影响所述显示面板和所述指纹检测装置的性能。
而且，通过将所述指纹检测装置粘贴至所述显示屏的缓冲层或铜箔层的下表面，相较于将所述指纹检测装置直接贴合至所述显示屏的显示面板或支撑膜，还能够避免所述开窗的尺寸过大，相应的，能够减弱用户从所述显示屏的正面观看所述指纹检测装置时的可视程度，进而能够美化电子设备的外观。
图13是本申请实施例提供的具有连接部432的电子设备300的示意性侧剖图。图14是图13所示的电子设备300的示意性仰视图。其中，图13是沿图14所示虚线方向的电子设备300的示意性剖面图。
如图13所示，在本申请的一些实施例中，所述支撑膜317的下表面在所述窗口的区域设置有与所述固定结构的上表面对应的连接部432，所述连接部432通过双面胶431连接至所述支撑膜317。可选地，所述连接部432为刚性补强板或为聚对苯二甲酸乙二醇酯胶层。可选地，所述连接部432为不透明的介质层。
通过所述连接部432，可以避免所述压敏胶391或固化胶392在所述支撑膜317上形成不规则的粘贴痕迹，相应的，能够保证安装有所述指纹检测装置的电子设备的美观性。
需要说明的是，在其他可替代实施例中，所述连接部432可以通过任一能够制备到支撑膜317上的粘合胶层。本申请实施例对所述连接部432的具体材料和形状不做限定。
例如，所述连接部的形状可以与所述固定结构的上表面的形状相同。再如，所述连接部的尺寸可以大于所述固定结构的上表面的尺寸，以为所述固化胶392预留容纳空间。
还应理解，图9至图14仅为本申请的示例，不应理解为对本申请的限制。
例如，指纹检测装置200还可以通过限位结构固定设置在如图7所示的铜箔层319或如图8所示的缓冲层326的下表面的位于窗口的周围区域，或者，所述指纹检测装置200可以通过限位结构固定设置在如图7所示的支撑膜317的下表面。
再如，图9至图14所述的把持部420设置在所述遮光层260的靠近所述支架251的表面。但本申请实施例并不限于此。
图15是本申请实施例提供的设置有把持部420的指纹检测装置200的示意性结构图。
如图15所示，所述遮光层260的背离所述显示屏310的一侧形成有容纳空间，所述把持部420设置在所述容纳空间内。换言之，所述遮光层260的靠近所述支架251的一侧设置有容纳空间，所述把持部420设置在所述容纳空间内。如图15所示，可选地，所述遮光层260的设置有所述把持部420的一侧向外延伸预设距离，以便用户把持所述把持部420。可选地，所述遮光层260和所述把持部420一体成型，以增加所述把持部420的连接的可靠性。
将所述把持部420设置在所述遮光层260的容纳空间内，不仅能够减小所述指纹检测装置200的厚度，还保证所述把持部420和所述遮光层260具有足够的接触面积，以增加所述遮光层260和所述把持部420的连接可靠性。
需要说明的是，以上结合附图详细描述了本申请的优选实施方式，但是，本申请并不限于上述实施方式中的具体细节，在本申请的技术构思范围内， 可以对本申请的技术方案进行多种简单变型，这些简单变型均属于本申请的保护范围。例如，在上述具体实施方式中所描述的各个具体技术特征，在不矛盾的情况下，可以通过任何合适的方式进行组合，为了避免不必要的重复，本申请对各种可能的组合方式不再另行说明。又例如，本申请的各种不同的实施方式之间也可以进行任意组合，只要其不违背本申请的思想，其同样应当视为本申请所公开的内容。
本领域普通技术人员可以意识到，结合本文中所公开的实施例描述的各示例的单元及算法步骤，能够以电子硬件、或者计算机软件和电子硬件的结合来实现。这些功能究竟以硬件还是软件方式来执行，取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能，但是这种实现不应认为超出本申请的范围。
所属领域的技术人员可以清楚地了解到，为描述的方便和简洁，上述描述的系统、装置和单元的具体工作过程，可以参考前述方法实施例中的对应过程，在此不再赘述。
在本申请所提供的几个实施例中，应该理解到，所揭露的系统、装置和方法，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另一点，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口，装置或单元的间接耦合或通信连接，可以是电性，机械或其它的形式。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。
另外，在本申请各个实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个单元中。
所述功能如果以软件功能单元的形式实现并作为独立的产品销售或使用时，可以存储在一个计算机可读取存储介质中。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分或者该技术方案的部 分可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质中，包括若干指令用以使得一台计算机设备(可以是个人计算机，服务器，或者网络设备等)执行本申请各个实施例所述方法的全部或部分步骤。而前述的存储介质包括：U盘、移动硬盘、只读存储器(ROM，Read-Only Memory)、随机存取存储器(RAM，Random Access Memory)、磁碟或者光盘等各种可以存储程序代码的介质。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应所述以权利要求的保护范围为准。

Claims (20)

  1. 一种指纹检测装置，其特征在于，适用于具有显示屏的电子设备，所述显示屏的底层为不透明层，所述不透明层上形成有贯通所述不透明层的开窗；
    所述指纹检测装置包括：
    光路层和第一传感器芯片，所述光路层设置在所述第一传感器芯片的上方；
    基板、固定结构以及压敏胶；
    其中，所述第一传感器芯片固定电连接至所述基板，所述固定结构设置在所述基板的上表面且所述固定结构包围所述第一传感器芯片，所述固定结构的上表面通过所述压敏胶固定至所述显示屏的下表面，以使得所述第一传感器芯片对准所述开窗设置，所述第一传感器芯片用于通过所述开窗接收经由所述显示屏上方的人体手指返回的并通过所述光路层引导的指纹检测信号，所述指纹检测信号用于检测所述手指的指纹信息；
    把持部；
    其中，所述固定结构的侧部包括第一侧部和除所述第一侧部之外的至少一个第二侧部，所述基板在靠近所述第一侧部的位置设置有金手指，所述基板的金手指通过各向异性导电胶膜可电连接至柔性电路板的金手指，所述把持部固定设置在所述至少一个第二侧部中的任一侧部，所述把持部用于从所述显示屏上剥离所述指纹检测装置。
  2. 根据权利要求1所述的指纹检测装置，其特征在于，所述至少一个第二侧部和所述压敏胶之间，所述把持部和所述固定结构的侧部之间均设置有固化胶，以固定所述固定结构和所述把持部。
  3. 根据权利要求2所述的指纹检测装置，其特征在于，所述固化胶为紫外固化胶或热熔胶。
  4. 根据权利要求1至3中任一项所述的指纹检测装置，其特征在于，所述不透明层为缓冲层，所述固定结构的上表面通过所述压敏胶固定至所述缓冲层的下表面的位于所述开窗的周围区域。
  5. 根据权利要求1至3中任一项所述的指纹检测装置，其特征在于，所述不透明层由上至下依次包括缓冲层和铜箔层，所述缓冲层的上方设置有支 撑膜；其中，所述固定结构的上表面通过所述压敏胶固定至所述铜箔层的下表面的位于所述开窗的周围区域，或者，所述固定结构的上表面通过所述压敏胶固定至所述支撑膜的下表面。
  6. 根据权利要求5所述的指纹检测装置，其特征在于，所述支撑膜的下表面在所述窗口的区域设置有与所述固定结构的上表面对应的连接部，所述连接部通过双面胶连接至所述支撑膜。
  7. 根据权利要求6所述的指纹检测装置，其特征在于，所述连接部为刚性补强板或为聚对苯二甲酸乙二醇酯胶层。
  8. 根据权利要求6所述的指纹检测装置，其特征在于，所述连接部为不透明的介质层。
  9. 根据权利要求1至3中任一项所述的指纹检测装置，其特征在于，所述基板由上至下依次包括第一覆盖层、第一导电层、基材层、第二导电层以及第二覆盖层，所述基板的上表面在第一区域向下延伸并贯通所述第一覆盖层和所述第一导电层以形成第一凹槽，所述基板的上表面在与所述第一区域相连的第二区域向下延伸并贯通所述第一覆盖层以形成所述基板的焊盘；
    所述指纹检测装置还包括：
    第一固定胶以及第一金线；
    其中，所述第一传感器芯片的下表面通过所述第一固定胶固定至所述第一凹槽内，所述第一传感器芯片通过所述第一金线连接至所述基板的焊盘。
  10. 根据权利要求9所述的指纹检测装置，其特征在于，所述指纹检测装置还包括：
    第二传感器芯片、第二固定胶以及第二金线；
    其中，所述基板的上表面在与所述第二区域相连的第三区域向下延伸并贯通所述第一覆盖层和所述第一导电层以形成第二凹槽，所述第二传感器芯片通过第二固定胶固定在所述第二凹槽内，所述第二传感器芯片通过所述第二金线连接至所述基板的焊盘，以使得所述第二传感器芯片连接至所述第一传感器芯片，所述第二传感器芯片用于配合所述第一传感器芯片进行屏下指纹识别。
  11. 根据权利要求9所述的指纹检测装置，其特征在于，所述固定结构包括：
    支架和金线保护胶；
    其中，所述金线保护胶用于封装所述第一金线，所述支架设置在所述第一覆盖膜的上表面并位于所述第一传感器芯片的外侧。
  12. 根据权利要求11所述的指纹检测装置，其特征在于，所述支架为聚对苯二甲酸乙二醇酯胶层；或所述支架通过支架固定胶固定在所述第一覆盖膜的上表面并位于所述第一传感器芯片的外侧。
  13. 根据权利要求11所述的指纹检测装置，其特征在于，所述固定结构还包括：
    遮光层；
    其中，所述光路层包括透镜层和光路引导层，所述微透镜用于将经由所述显示屏上方的人体手指返回的光信号会聚至所述光路引导层，所述光路引导层将所述微透镜会聚的光信号引导至所述第一传感器芯片，所述遮光层从所述支架的上方延伸至所述光路引导层上方，所述遮光层和所述微透镜层之间形成有间隙，所述遮光层用于遮挡从所述第一传感器芯片的入射面之外的其它位置入射的光信号。
  14. 根据权利要求13所述的指纹检测装置，其特征在于，所述遮光层和所述把持部一体成型。
  15. 根据权利要求13所述的指纹检测装置，其特征在于，所述遮光层的背离所述显示屏的一侧形成有容纳空间，所述把持部设置在所述容纳空间内。
  16. 根据权利要求13所述的指纹检测装置，其特征在于，所述遮光层的设置有所述把持部的一侧向外延伸预设距离，以便用户把持所述把持部。
  17. 根据权利要求13所述的指纹检测装置，其特征在于，所述遮光层为遮挡胶层，所述第一金线的弧高位置被遮光胶层覆盖。
  18. 根据权利要求1至3中任一项所述的指纹检测装置，其特征在于，所述指纹检测装置还包括所述柔性电路板，所述柔性电路板的金手指通过所述各向异性导电胶膜电连接至所述基板的金手指。
  19. 一种电子设备，其特征在于，包括：
    显示屏；
    指纹检测装置，设置在所述显示屏下方，所述指纹检测装置为如权利要求1至18中任一项所述的指纹检测装置，且其指纹采集区域至少部分位于所述显示屏的显示区域之中。
  20. 根据权利要求19所述的电子设备，其特征在于，所述电子设备还包括中框，所述中框形成有贯通所述中框的开孔，所述开孔用于为所述指纹检测装置提供容纳空间。
PCT/CN2020/095957 2020-06-12 2020-06-12 指纹检测装置和电子设备 WO2021248496A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2020/095957 WO2021248496A1 (zh) 2020-06-12 2020-06-12 指纹检测装置和电子设备
CN202080096189.2A CN115104139A (zh) 2020-06-12 2020-06-12 指纹检测装置和电子设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/095957 WO2021248496A1 (zh) 2020-06-12 2020-06-12 指纹检测装置和电子设备

Publications (1)

Publication Number Publication Date
WO2021248496A1 true WO2021248496A1 (zh) 2021-12-16

Family

ID=78846805

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/095957 WO2021248496A1 (zh) 2020-06-12 2020-06-12 指纹检测装置和电子设备

Country Status (2)

Country Link
CN (1) CN115104139A (zh)
WO (1) WO2021248496A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117111186A (zh) * 2023-04-10 2023-11-24 荣耀终端有限公司 透光结构及可穿戴设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170100252A (ko) * 2016-02-25 2017-09-04 엘지전자 주식회사 이동단말기 및 그 제어방법
WO2018038288A1 (ko) * 2016-08-25 2018-03-01 엘지전자(주) 이동 단말기
CN207637122U (zh) * 2017-11-30 2018-07-20 维沃移动通信有限公司 一种具有指纹识别功能的移动终端
CN207867178U (zh) * 2018-03-08 2018-09-14 深圳秋田微电子股份有限公司 一种框贴显示隔离结构及其显示模组
CN109716351A (zh) * 2018-12-13 2019-05-03 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN109791611A (zh) * 2018-12-29 2019-05-21 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN110770746A (zh) * 2019-05-29 2020-02-07 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170100252A (ko) * 2016-02-25 2017-09-04 엘지전자 주식회사 이동단말기 및 그 제어방법
WO2018038288A1 (ko) * 2016-08-25 2018-03-01 엘지전자(주) 이동 단말기
CN207637122U (zh) * 2017-11-30 2018-07-20 维沃移动通信有限公司 一种具有指纹识别功能的移动终端
CN207867178U (zh) * 2018-03-08 2018-09-14 深圳秋田微电子股份有限公司 一种框贴显示隔离结构及其显示模组
CN109716351A (zh) * 2018-12-13 2019-05-03 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN109791611A (zh) * 2018-12-29 2019-05-21 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN110770746A (zh) * 2019-05-29 2020-02-07 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117111186A (zh) * 2023-04-10 2023-11-24 荣耀终端有限公司 透光结构及可穿戴设备

Also Published As

Publication number Publication date
CN115104139A (zh) 2022-09-23

Similar Documents

Publication Publication Date Title
WO2020238382A1 (zh) 指纹检测装置和电子设备
WO2020186523A1 (zh) 指纹识别装置和电子设备
KR102440709B1 (ko) 지문 식별 장치 및 전자 기기
WO2021088464A1 (zh) 光学指纹装置及其制备方法、电子设备
WO2020177032A1 (zh) 指纹识别装置和电子设备
CN212135452U (zh) 指纹识别装置和电子设备
WO2020215187A1 (zh) 指纹识别的装置和电子设备
CN214225933U (zh) 指纹识别的装置和电子设备
CN210864756U (zh) 光学指纹装置和电子设备
WO2021248496A1 (zh) 指纹检测装置和电子设备
CN111801686A (zh) 指纹检测装置和电子设备
CN209911987U (zh) 指纹识别装置和电子设备
CN212541359U (zh) 指纹检测装置和电子设备
CN212541358U (zh) 指纹检测装置和电子设备
WO2021248497A1 (zh) 指纹检测装置和电子设备
CN111788576A (zh) 指纹检测装置和电子设备
CN111801685B (zh) 指纹检测装置和电子设备
WO2021138781A1 (zh) 指纹检测装置和电子设备
CN111801685A (zh) 指纹检测装置和电子设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20940305

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20940305

Country of ref document: EP

Kind code of ref document: A1