WO2022056935A1 - 指纹识别装置和电子设备 - Google Patents

指纹识别装置和电子设备 Download PDF

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Publication number
WO2022056935A1
WO2022056935A1 PCT/CN2020/116623 CN2020116623W WO2022056935A1 WO 2022056935 A1 WO2022056935 A1 WO 2022056935A1 CN 2020116623 W CN2020116623 W CN 2020116623W WO 2022056935 A1 WO2022056935 A1 WO 2022056935A1
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WO
WIPO (PCT)
Prior art keywords
fingerprint
identification device
fingerprint identification
processing unit
fingerprint sensor
Prior art date
Application number
PCT/CN2020/116623
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English (en)
French (fr)
Inventor
王仁峰
黄新利
Original Assignee
深圳市汇顶科技股份有限公司
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Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to PCT/CN2020/116623 priority Critical patent/WO2022056935A1/zh
Publication of WO2022056935A1 publication Critical patent/WO2022056935A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition

Definitions

  • the present application relates to the field of optical fingerprint technology, and more particularly, to a fingerprint identification device and an electronic device.
  • fingerprint identification technology is widely used in mobile terminal design, automotive electronics, smart home and other fields. Consumers have increased functional requirements for various electronic terminal products, and at the same time require the product to be as thin and light as possible. Therefore, the internal structure of electronic products is becoming more and more compact, and the design of fingerprint identification devices is more difficult. Therefore, it is more urgent to miniaturize and reduce the thickness of fingerprint identification devices. , requires the fingerprint identification device to achieve more accurate functions under the condition of occupying a smaller volume of electronic products.
  • Embodiments of the present application provide a fingerprint identification device and an electronic device.
  • the fingerprint identification device has an ultra-thin thickness and good fingerprint identification performance, and can be applied to an electronic device in a space under an ultra-thin screen.
  • a fingerprint identification device which is arranged in a blind hole on the upper surface of a middle frame of an electronic device and is located below a display screen of the electronic device, the fingerprint identification device includes: a fingerprint sensor; an optical component, It is arranged above the fingerprint sensor, and is used to guide the fingerprint light signal passing through the display screen to enter the fingerprint sensor after reflection or scattering of the finger above the display screen; the processing unit is arranged on one side of the fingerprint sensor , used to process the fingerprint image signal obtained by the fingerprint sensor, and the processed fingerprint image signal is used for fingerprint recognition; a circuit board, arranged below the fingerprint sensor and the processing unit, the fingerprint sensor and the processing unit pass through the circuit board Installed in the blind hole of the middle frame of the electronic device, the circuit board is used for transmitting the signals of the fingerprint sensor and the processing unit.
  • the processing unit and the fingerprint sensor are arranged in the corresponding area of the blind hole in the middle frame through the circuit board, and is located under the display screen, so there is no need to set a reinforcement plate for the processing unit, and it is not necessary to encapsulate the processing unit. Therefore, the thickness space occupied by the processing unit is small, so that the thickness of the entire fingerprint identification device can be reduced.
  • the thickness space occupied by the entire fingerprint identification device under the screen can be further compressed.
  • the design of the blind hole It is beneficial to improve the accuracy of the installation position of the fingerprint identification device, so that the fingerprint identification device can be installed in the electronic equipment more conveniently and flexibly.
  • the fingerprint identification device further includes: a light-shielding layer in which a first opening window is formed, the first opening window is arranged above the fingerprint sensor, and the first opening window is used for passing the fingerprint light signal to be received by the fingerprint sensor.
  • the optical assembly is located in the first fenestration.
  • a second window is further formed in the light shielding layer, the fingerprint sensor is connected to the top area of the first lead of the circuit board and the processing unit is connected to the top area of the second lead of the circuit board are located in the second opening.
  • the first lead is provided on the first side of the fingerprint sensor
  • the second lead is provided on the first side of the processing unit
  • the first side of the fingerprint sensor is connected with the first lead of the processing unit. Adjacent to one side.
  • the first side of the fingerprint sensor and the first side of the processing unit are parallel to each other.
  • the first lead and/or the second lead are coated with lead protection glue, and the height of the lead protection glue is not greater than 150 ⁇ m.
  • the upper surface of the light shielding layer is not higher than the highest point of the upper surface of the lead protection adhesive, and/or the upper surface of the light shielding layer is not higher than the highest point of the upper surface of the optical component .
  • the fingerprint identification device further includes: a support layer disposed between the circuit board and the light shielding layer for supporting the light shielding layer; a third window is provided in the support layer, the The fingerprint sensor and the processing unit are arranged in the third opening.
  • the upper surface of the support layer is not higher than the highest point of the upper surface of the optical component, and the upper surface of the support layer is not higher than the upper surface of the processing unit.
  • the fingerprint identification device further includes: a foam layer in which a fourth opening is formed, the fourth opening is arranged above the fingerprint sensor, and the fourth opening is used to pass the fingerprint
  • the light signal is received by the fingerprint sensor, and the area of the fourth window is not smaller than the area of the first window in the light shielding layer.
  • the fourth window is located directly above the optical assembly.
  • a positioning column is formed in the blind hole of the middle frame, and the fingerprint identification device further includes: a positioning hole corresponding to the positioning column, so that the fingerprint identification device can be fixedly installed in the blind hole .
  • the number of the positioning holes is multiple, and the positioning holes are arranged in the edge area of the fingerprint identification device.
  • the height of the positioning column is not lower than the depth of the blind hole, and/or the positioning hole is circular or waist-shaped.
  • the circuit board is a flexible circuit board
  • the fingerprint identification device further includes: a reinforcing plate, which is arranged under the circuit board and is located in a blind hole of a middle frame of the electronic device, the reinforcing plate The board is used to support the circuit board and the fingerprint sensor and the processing unit above it.
  • the optical component includes: a microlens array; at least one diaphragm layer disposed below the microlens array, and each diaphragm layer of the at least one diaphragm layer is formed with a plurality of through-hole layers.
  • Optical apertures; the microlens array is used for converging the fingerprint optical signal into a plurality of light-passing apertures of the at least one aperture layer, and the fingerprint optical signal is transmitted to the fingerprint sensor through the plurality of light-passing apertures to Perform optical fingerprint imaging.
  • each microlens in the microlens array corresponds to at least one light-passing aperture in each diaphragm layer, and at least one pixel unit in the fingerprint sensor; the fingerprint sensor uses for receiving a fingerprint light signal in at least one direction to acquire a fingerprint image signal of at least one fingerprint image.
  • the fingerprint identification device includes: a plurality of the fingerprint sensors, and the plurality of the fingerprint sensors are arranged side by side above the circuit board to form a fingerprint sensor assembly by splicing; and/or, a plurality of the processing A plurality of the processing units are arranged side by side above the circuit board to form a processing unit assembly by splicing.
  • the distance between the fingerprint identification device and the light-emitting layer of the display screen is less than 600 ⁇ m.
  • an electronic device including: a display screen; including the fingerprint identification device according to the first aspect or any possible implementation manner of the first aspect; a middle frame, the upper surface of the middle frame is provided with a blind hole , the blind hole is located under the display screen, and the fingerprint identification device is installed in the blind hole of the middle frame, so that the fingerprint identification device is arranged under the display screen.
  • At least one positioning column is formed in the blind hole of the middle frame, and the positioning column is used to correspond to the positioning hole in the fingerprint identification device, so as to fix the fingerprint identification device to the blind hole. in the hole.
  • the blind hole of the middle frame is arranged in the middle area or the lower middle area of the middle frame, so that the fingerprint detection area of the fingerprint identification device is located in the middle position of the display area of the display screen or Lower middle position.
  • FIG. 1 is a schematic cross-sectional view of a fingerprint identification device provided by an embodiment of the present application.
  • FIG. 2 is a schematic top view of the fingerprint identification device in FIG. 1 .
  • FIG. 3 is a schematic cross-sectional view of another fingerprint identification device provided by an embodiment of the present application.
  • FIG. 4 is a schematic cross-sectional view of another fingerprint identification device provided by an embodiment of the present application.
  • FIG. 5 is a schematic top view of the fingerprint identification device in FIG. 4 .
  • FIG. 6 is another schematic top view of the fingerprint identification device in FIG. 4 .
  • FIG. 7 is another schematic top view of the fingerprint identification device in FIG. 4 .
  • FIG. 8 is a schematic cross-sectional view of another fingerprint identification device provided by an embodiment of the present application.
  • FIG. 9 is a schematic top view of the fingerprint identification device in FIG. 8 .
  • embodiments of the present application can be applied to optical fingerprint systems, including but not limited to optical fingerprint recognition systems and products based on optical fingerprint imaging.
  • the embodiments of the present application only take the optical fingerprint system as an example for description, but should not be implemented in this application.
  • the examples constitute any limitation, and the embodiments of the present application are also applicable to other systems using optical imaging technology, and the like.
  • the optical fingerprint system provided in the embodiments of the present application can be applied to smart phones, tablet computers, and other mobile terminals with display screens or other electronic devices; more specifically, in the above electronic devices, fingerprint identification
  • the device may specifically be an optical fingerprint device, which may be arranged in a partial area or all areas below the display screen, thereby forming an under-display optical fingerprint system.
  • FIG. 1 shows a schematic cross-sectional view of a fingerprint identification device 100 .
  • the fingerprint identification device 100 is arranged on the middle frame 101 of the electronic device where it is located, and the middle frame 101 is provided with a blind hole 102 , and the fingerprint identification device 100 is arranged in the blind hole 102 and is located in the electronic device. Below the display screen 103 of the device.
  • the middle frame 101 is a frame of the electronic device that is arranged between the display screen 103 and the battery and is used to carry various internal components, including but not limited to the main board, the camera, the cable, various sensors devices, microphones, earpieces, etc.
  • the middle frame 103 may be made of metal or alloy material, or may also be made of plastic material, which is not limited in this embodiment of the present application.
  • the fingerprint identification device 100 may include: an optical component 110 , a fingerprint sensor 120 and a circuit board 130 .
  • the optical component 110 is used to guide the fingerprint light signal passing through the display screen to enter the fingerprint sensor 120 after being reflected or scattered by the finger above the display screen, so as to form a fingerprint image of the finger.
  • the light source signal emitted to the finger above the display screen 103 can be derived from the self light source of the display screen 103, for example, an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display screen or a Micro-LED (Micro-LED) ) light source of the display unit in the display.
  • OLED Organic Light-Emitting Diode
  • Micro-LED Micro-LED
  • the light source signal emitted to the finger above the display screen may also be other built-in light sources or external light sources, such as infrared light sources or light sources with specific wavelengths of invisible light, etc.
  • the display screen may be a liquid crystal Displays or other passively illuminated displays.
  • the optical assembly 110 may include: the microlens array 111 shown in FIG. 1 and a diaphragm layer 112 disposed under the microlens array 111 .
  • the microlens array 111 includes a plurality of microlenses, and each microlens is used for condensing the light signal above it and transmitting it to the diaphragm layer below it.
  • the diaphragm layer 112 is made of a light absorbing material, and is provided with a plurality of light-passing holes, which are used to select the direction of the light signal after the microlens converges, so that the light signal in the target direction passes through the light-passing hole.
  • the light hole enters the fingerprint sensor 120, and the stray light signal in the non-target direction is absorbed by the light absorbing material not passing through the area where the small hole is located, thereby preventing the stray light signal from interfering with fingerprint imaging.
  • the fingerprint sensor 120 includes a pixel array formed by a plurality of pixel units, and is used to convert the light signal passing through the diaphragm layer 112 into a corresponding image signal.
  • the fingerprint sensor 120 may be a fingerprint sensor chip fabricated by a semiconductor process, and the optical component 110 may be integrally packaged in the fingerprint sensor chip, or may be independently disposed above the fingerprint sensor chip.
  • the fingerprint sensor 120 is connected to the circuit board 130 through an electrical connector 131, so as to realize the electrical connection between the fingerprint sensor 120 and the circuit board 130.
  • the electrical connector 131 includes but is not limited to wire bonding. , WB) method to prepare the formed leads.
  • circuit board 130 includes, but is not limited to, a printed circuit board (printed circuit board, PCB), a flexible printed circuit (FPC), or a rigid-flex board, etc., which is not specifically limited in this embodiment of the present application.
  • PCB printed circuit board
  • FPC flexible printed circuit
  • rigid-flex board etc.
  • FIG. 2 shows a schematic top view of the fingerprint identification device 100 in FIG. 1 .
  • the circuit board 130 is provided with a microcontroller unit (MCU) 131 for generating control signals to control the operation of the fingerprint sensor 120 and/or receiving the fingerprint image signal of the fingerprint sensor 120 for processing , and the processed fingerprint image signal is used for fingerprint detection and identification.
  • MCU microcontroller unit
  • circuit board 130 is also provided with a connector 132 for connecting the circuit board 130 to other electrical components of the electronic device, for example, to a central processing unit (CPU) of the electronic device to control the Operation of the fingerprint recognition device 100 .
  • CPU central processing unit
  • circuit board 130 is further provided with related electrical components such as capacitors and resistors, which are not described in detail in this embodiment of the present application.
  • the circuit board 130 in order to facilitate the installation of the fingerprint identification device 100 in the middle frame, the circuit board 130 is an FPC, and the MCU 131 on the FPC needs to be arranged on the reinforcing steel plate to support the MCU 131.
  • the MCU 131 is a packaged chip, which is independently set in different positions of the FPC according to different design requirements. Therefore, in this embodiment, the MCU needs to additionally design a reinforcing steel plate for it, and its own thickness is relatively large, which is not conducive to the thin and light design of the fingerprint identification device 100, and is also not conducive to the development of thin and light electronic equipment.
  • the distance between the MCU and the fingerprint sensor is long, and the fingerprint image signal is easily interfered during the transmission process, which affects the quality of the fingerprint image signal, thereby affecting the performance of fingerprint recognition.
  • the present application proposes a fingerprint identification device, which can realize the design of the fingerprint identification device to be light and thin, and improve the overall performance of the fingerprint identification device, so as to meet the installation requirements of the fingerprint identification device in different electronic devices and realize the Ultra thin.
  • FIG. 3 is a schematic structural diagram of a fingerprint identification device 200 provided by an embodiment of the present application.
  • the fingerprint identification device 200 is configured to be disposed in the blind hole 102 on the upper surface of the middle frame of the electronic device, and is located on the display of the electronic device. below the screen 103.
  • the fingerprint identification device 200 includes: an optical component 210, a fingerprint sensor 220, a circuit board 230 and a processing unit 240;
  • the optical component 210 is disposed above the fingerprint sensor 220, and is used to guide the fingerprint light signal passing through the display screen to enter the fingerprint sensor 220 after being reflected or scattered by the finger above the display screen 103;
  • the fingerprint sensor 220 is arranged below the optical component 210, and is used for receiving the fingerprint light signal guided by the optical component 210 to obtain the fingerprint image signal;
  • the processing unit 240 is arranged on one side of the above-mentioned fingerprint sensor 220, and is used for processing the fingerprint image signal obtained by the fingerprint sensor 220, and the processed fingerprint image signal is used for fingerprint identification;
  • the circuit board 230 is arranged below the fingerprint sensor 220 and the processing unit 240.
  • the fingerprint sensor 220 and the processing unit 240 are installed in the blind hole 102 of the middle frame of the electronic device through the circuit board 230.
  • the circuit board 230 is used to transmit the Signals from the fingerprint sensor 220 and the processing unit 240 .
  • the optical assembly 210 may be similar to the optical assembly 110 in FIG. 1 , including a microlens array 211 and a diaphragm layer disposed below the microlens array 211 212.
  • the optical assembly 110 in FIG. 1 including a microlens array 211 and a diaphragm layer disposed below the microlens array 211 212.
  • the optical component 210 may also include multiple layers of diaphragm layers 212 .
  • the fingerprint sensor 220 includes a pixel array composed of a plurality of pixel units, each microlens in the microlens array 211 corresponds to at least one light-passing aperture in each diaphragm layer 212, and at least one pixel unit in the pixel array , each microlens transmits the concentrated optical signal to the inside of the corresponding light-passing hole and transmits it to the corresponding pixel unit via the light-passing hole to perform optical fingerprint imaging.
  • multiple pixel units in the fingerprint sensor 220 can be used to receive fingerprint light signals in the same direction, for example, multiple pixel units all receive fingerprint light signals perpendicular to the display screen, or multiple pixel units all receive oblique fingerprint signals.
  • the fingerprint light signal in the specific direction of the display screen.
  • the plurality of pixel units in the fingerprint sensor 220 can also be used to receive fingerprint light signals in different directions to form fingerprint image signals of a plurality of fingerprint images, for example, the first part of the pixel units in the plurality of pixel units receives the first The fingerprint light signal in the direction forms the fingerprint image signal of the first fingerprint image; the second part of the pixel unit receives the fingerprint light signal in the second direction to form the fingerprint image signal of the second fingerprint image.
  • the aperture layer 212 may be grown on the fingerprint sensor 220 by semiconductor process growth or other processes, for example, by atomic layer deposition, sputter coating, electron beam evaporation coating, ion beam coating, etc. on the fingerprint sensor A layer of non-light-transmitting material film is prepared on the top of 220, and then photolithography and etching of the pinhole pattern are performed to form a plurality of light-transmitting pinholes. It can be understood that, in the case where the optical assembly 210 includes a plurality of diaphragm layers 212, the transparent medium layer may be passed between the bottom diaphragm layer 212 and the fingerprint sensor 220, and between the adjacent diaphragm layers 212. isolate.
  • the optical component 210 can also be other light guiding structures, such as a collimator layer, with a plurality of collimation units or a micro-hole array; or , an optical lens (Lens) layer, which has one or more lens units, such as a lens group composed of one or more aspherical lenses, the specific structure of the optical component 210 is not limited in this embodiment of the present application.
  • a collimator layer with a plurality of collimation units or a micro-hole array
  • an optical lens (Lens) layer which has one or more lens units, such as a lens group composed of one or more aspherical lenses
  • the optical assembly 210 adopts the above structure. Compared with the fingerprint identification device based on the imaging of the optical lens layer, it is not limited by the imaging optical path of the lens, and the thickness of the optical assembly is reduced, which is beneficial to realize the lightness and thinness of the fingerprint identification device. change. In addition, compared with the fingerprint identification device based on the imaging of the collimator layer, it uses a microlens array to condense the optical signal, and uses one or more diaphragm layers to guide the direction of the optical signal, which can further improve the fingerprint optical signal. quality, thereby improving the fingerprint recognition performance of the fingerprint recognition device.
  • the fingerprint sensor 220 and the processing unit 240 are arranged side by side above the circuit board 230 and are connected to the circuit board 230 through electrical connectors.
  • the electrical connector may be a gold wire, which is wire-bonded.
  • the first wire 2311 is connected to the pad of the fingerprint sensor 220 and the pad of the circuit board 230
  • the second wire 2312 is connected to the processing unit 240 . pads and pads of the circuit board 230 .
  • the fingerprint sensor 220 and the processing unit 240 are directly disposed on the surface of the circuit board 230, and the electrical connection is realized by wire bonding, and there is no need for additional processing such as opening the circuit board 230.
  • the processing unit 240 is electrically connected to the fingerprint sensor 220 through the electrical connector and the circuit board 230, it is used to process the fingerprint image signal obtained by the fingerprint sensor 220, and the processed fingerprint image signal is used for fingerprint recognition.
  • the processing unit 240 may perform digital synthesis (binning), filtering (filtering) and other signal processing on the fingerprint image signal obtained by the fingerprint sensor 220, and then pass the processed fingerprint image signal through the circuit board 230 and the circuit board.
  • the connector on 230 is transmitted to the processor of the electronic device, and the processor is used for fingerprint detection and identification of the processed fingerprint image signal.
  • the processing unit 240 can also be used to form a control signal of the fingerprint sensor, so as to control the operation of the circuit in the fingerprint sensor to perform fingerprint image acquisition.
  • the processing unit 240 may be configured to process and identify the fingerprint image signal acquired by the fingerprint sensor 220 to determine whether the fingerprint image signal belongs to the fingerprint of the target user. Further, the processing unit 240 may also use In vivo detection is performed on the fingerprint image signal to determine whether the fingerprint image signal belongs to a living finger.
  • the processing unit 240 includes, but is not limited to, an MCU, which can also be a digital signal processor (DSP), an image signal processor (ISP), an application specific integrated circuit (ASIC) , Off-the-shelf programmable gate array (field programmable gate array, FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components.
  • DSP digital signal processor
  • ISP image signal processor
  • ASIC application specific integrated circuit
  • FPGA field programmable gate array
  • FPGA field programmable gate array
  • the processing units 240 are arranged side by side on one side of the fingerprint sensor 220, rather than at other positions on the circuit board 230, so that the wiring distance between the processing unit 240 and the fingerprint sensor 220 can be reduced, thereby reducing the wiring distance between the processing unit 240 and the fingerprint sensor 220. Prevent the signal quality from deteriorating during the transmission process and affect the fingerprint recognition effect.
  • the processing unit 240 and the fingerprint sensor 220 are arranged below the display screen 103, and are arranged in the blind hole area of the middle frame through the reinforcing plate 250, so there is no need to separately dispose a reinforcing plate below the processing unit 240, nor does it need to be
  • the processing unit 240 is encapsulated, that is, an encapsulation material layer is additionally prepared outside the processing unit 240 . Therefore, in the embodiment of the present application, compared with the arrangement of the MCU 131 in FIG. 2 , the arrangement of the processing unit 240 can reduce the overall thickness space occupied by the processing unit 240 , thereby further reducing the thickness of the entire fingerprint identification device 200 .
  • the circuit board 230 is an FPC, which facilitates the installation of the fingerprint identification device under the display screen.
  • a reinforcing plate such as a reinforcing steel plate, may be provided below the FPC to support and reinforce the FPC above it and the processing unit 240 and the fingerprint sensor 220 above the FPC.
  • the processing unit 240 can reuse the reinforcing plate under the fingerprint sensor 220.
  • the reinforcing plate of the processing unit 240 is not additionally added, and the An additional increase in the thickness of the entire fingerprint identification device can also reduce the cost of the fingerprint identification device.
  • the processing unit 240 and the fingerprint sensor 220 side by side above the circuit board 230, and performing signal transmission through the circuit board 230, the gap between the processing unit 240 and the fingerprint sensor 220 can be reduced.
  • the signal transmission distance between the two is improved, the signal quality between the two is improved, and the fingerprint recognition effect is improved.
  • the processing unit 240, together with the fingerprint sensor 220 is disposed in the corresponding area of the blind hole in the middle frame through the circuit board 230, and is located below the display screen, so there is no need to separately set a reinforcing plate for the processing unit 240, nor does it need to The processing unit 240 is packaged.
  • the processing unit 240 occupies a small thickness space, so that the thickness of the entire fingerprint identification device 200 can be reduced.
  • the fingerprint identification device is arranged in the blind hole of the middle frame, the thickness space occupied by the entire fingerprint identification device under the screen can be further compressed.
  • the design of the blind hole It is beneficial to improve the accuracy of the installation position of the fingerprint identification device, so that the fingerprint identification device can be installed in electronic devices more conveniently and flexibly, and can be applied to more electronic devices.
  • one side of the processing unit 240 is parallel or perpendicular to one side of the fingerprint sensor 220 .
  • the fingerprint sensor 200 and the processing unit 240 may be a quadrilateral chip, and one side thereof may be any side of the quadrilateral chip.
  • the first side of the processing unit 240 is the right side and the first side of the fingerprint sensor 220 is the left side, then the first side of the processing unit 240 is parallel to the first side of the fingerprint sensor 220 .
  • the processing unit 240 can be said to be disposed in parallel with the fingerprint sensor 220 .
  • the processing unit 240 may not be disposed parallel to the fingerprint sensor 220 , that is, the first side of the processing unit 240 and the first side of the fingerprint sensor 220 form a certain angle, and the certain angle is The angle is not 0° or 90°.
  • This embodiment of the present application does not specifically limit the angular relationship between the processing unit 240 and the fingerprint sensor 220 .
  • the right side of the processing unit 240 is adjacent to the left side of the fingerprint sensor 220, and the distance between the two is the shortest, and the circuit
  • the pads of the board 230 are located between the left side of the fingerprint sensor 220 and the right side of the processing unit 240, so that the fingerprint sensor 220 and the processing unit 240 are connected to the pads of the circuit board.
  • FIG. 3 only shows the case where the processing unit 240 is arranged in parallel on the left side of the fingerprint sensor 220, and the processing unit 240 can also be arranged in parallel or non-parallel on any side of the other three sides of the second sensor 230. This is not specifically limited in the application examples.
  • FIG. 4 shows a schematic structural diagram of another fingerprint identification device 200 .
  • the above-mentioned circuit board 230 is an FPC, and the circuit board 230 is adhered to the reinforcing plate 250 through the first adhesive layer 231 . Further, the reinforcing plate 250 is adhered to the upper surface of the blind hole 102 of the middle frame 101 through the second adhesive layer 251 .
  • the material of the reinforcing plate 250 may be a stainless steel reinforcing plate, an aluminum foil reinforcing plate, a glass fiber reinforcing plate or other organic material reinforcing plate, which is not limited in the embodiment of the present application.
  • the reinforcing plate 250 is a reinforcing steel plate.
  • the first adhesive layer 231 includes, but is not limited to, conductive adhesive, which is used to connect the FPC and the reinforcing steel plate.
  • the second adhesive layer 251 includes, but is not limited to, module-laminated double-sided adhesive, water adhesive, solid adhesive foam layer with adhesive layer, or other types of adhesive layers. The specific types of the first adhesive layer 231 and the second adhesive layer 251 are not limited in this embodiment of the present application.
  • the fingerprint sensor 220 may be adhered to the circuit board 230 through the third adhesive layer 221
  • the processing unit 240 may be adhered to the circuit board 230 through the fourth adhesive layer 241 .
  • the third adhesive layer 221 and the fourth adhesive layer 241 include, but are not limited to, die attach films (Die Attach Film, DAF), which can realize ultra-thin connections between chips and circuit boards.
  • the first lead 2311 for connecting the fingerprint sensor 220 and the circuit board 230 and the second lead 2312 for connecting the processing unit 240 and the circuit board 230 are covered with lead protection glue 232 to prevent the The leads are supported and protected.
  • the lead protection glue 232 can ensure the stability of the electrical connection between the circuit board 230 and the fingerprint sensor 220 , as well as the first circuit board 230 and the processing unit 240 , and further, can ensure the performance of the fingerprint identification device 200 .
  • the height of the lead protection glue 232 is not greater than 150 ⁇ m, and the height of the lead protection glue 232 refers to the height between the highest point of its upper surface and the upper surface of the circuit board 230 height between.
  • the fingerprint identification device 200 may further include the following components.
  • the fingerprint identification device 200 may further include:
  • the light shielding layer 270 has a first window 2701 formed therein.
  • the first window 2701 is located above the fingerprint sensor 220 for passing the fingerprint light signal to be received by the fingerprint sensor 220 .
  • Fig. 5 shows a schematic top view of the fingerprint identification device in Fig. 4 .
  • a light shielding layer is provided in the surrounding area of the first window opening 2701 , which can be used to shield stray light or fingerprint light signals in non-target directions. , to prevent it from entering the fingerprint sensor 220, thereby reducing the interference of environmental factors on the fingerprint identification process.
  • setting the light shielding layer 270 can also improve the appearance of the fingerprint identification device 200 under the display screen. Due to the light shielding layer 270, it can absorb the light signal emitted from the top of the display screen and reduce the reflection of the light signal back to the display screen. Intensity, to prevent users from being able to observe the fingerprint recognition device under the display screen, thereby improving the user experience.
  • the light shielding layer 270 is a shielding glue layer.
  • the thickness of the light shielding layer 270 is 10-30 ⁇ m, for example, 20 ⁇ m.
  • the thickness of the light shielding layer 270 may also be other specific values or within a range of other preset values, which is not specifically limited in this application.
  • the light shielding layer 270 may also be replaced by a filter.
  • the filter is used to reduce undesired ambient light in fingerprint sensing to improve the optical sensing of the received light by the fingerprint sensor 220 .
  • the filter can specifically be used to filter out light of a specific wavelength, for example, near-infrared light and part of red light.
  • human fingers absorb most of the energy of light with wavelengths below 580 nm, based on this, filters can be designed to filter light with wavelengths from 580 nm to the infrared to reduce the effect of ambient light on optical detection in fingerprint sensing.
  • At least a part of the above-mentioned optical component 210 is located in the first window 2701 .
  • the microlens array 211 in the optical component 210 is located in the above-mentioned first opening 2701 , and at least one diaphragm layer in the optical component 210 is integrated with the fingerprint sensor 220 in the fingerprint sensor chip , the surrounding area of the first window 2701 in the light shielding layer 270 is disposed on the surface of the edge area of the fingerprint sensor chip.
  • a light-shielding layer 270 is also disposed between the first lead 2311 of the fingerprint sensor 220 and the microlens array 211 .
  • the light-shielding layer 270 can not only block stray light, but also block the lead protective glue 232 spread to the microlens array 211 , thereby affecting the light guiding effect of the microlens array 211 .
  • a second window 2701 is also provided in the area corresponding to the lead connection. Open window 2702.
  • the top area of the first lead 2311 of the fingerprint sensor 220 connected to the circuit board 240 and the top area of the second lead 2312 of the processing unit 240 to the circuit board 240 are located in the second opening 2702. Further, the top regions of the lead protection glue 232 of the first lead 2311 and the second lead 2312 are also located in the second opening 2702 .
  • the first side of the fingerprint sensor 220 (the left side of the fingerprint sensor 220 in the figure) is the same as the first side of the processing unit 240 (the right side of the processing unit 240 in the figure) Neighbor settings.
  • the first side of the fingerprint sensor 220 (the left side of the fingerprint sensor 220 in the figure) is provided with a plurality of first leads 2311
  • the first side of the processing unit 240 (the right side of the processing unit 240 in the figure) is provided with a plurality of first leads 2311 .
  • the two leads 2312, the top regions of the plurality of first leads 2311 on the first side of the fingerprint sensor 220 and the top regions of the plurality of second leads 2312 on the first side of the processing unit 240 are all located in the second opening 2702, and further Yes, the top area of the lead protection adhesive 232 on the first side of the fingerprint sensor 220 and the top area of the lead protection adhesive 232 on the first side of the processing unit 240 are also located in the second opening 2702 .
  • a plurality of first leads 2311 and a plurality of second leads 2312 are arranged between the fingerprint sensor 220 and the processing unit 240 , and the second window 2702 covers the gap between the fingerprint sensor 220 and the processing unit 240 . area.
  • all the first leads 2311 of the fingerprint sensor 220 can be disposed on the first side of the fingerprint sensor 220 .
  • a part of the second leads 2312 of the processing unit 240 are arranged on the first side of the processing unit 240 , and the other second leads 2312 are arranged on other sides of the processing unit 240 .
  • the second lead 2312 located on the first side of the processing unit 240 and the top area of its lead protection adhesive located in the second opening 2702 can also be located in the second opening 2702.
  • connection leads may be arranged on multiple sides of the processing unit 240 .
  • the lead pads of the processing unit 240 are arranged on three sides (upper side, lower side and right side), and the second opening 2702 is located on the processing unit 240
  • the shading layer 270 does not cover the processing unit 240 at all, and the projection of the second window 2702 on the plane where the processing unit 240 is located completely covers the area where the processing unit 240 is located.
  • the light shielding layer 270 may also cover the side of the processing unit 240 where the second lead is not provided.
  • the light shielding layer 270 may also cover the left side in FIG. 5 .
  • the second open The projection of the window 2702 on the plane where the processing unit 240 is located may only partially cover the area where the processing unit 240 is located.
  • first opening 2701 and the second opening 2702 can also have other regular or irregular shapes, which are not specifically limited in this embodiment of the present application.
  • the second opening 2702 in the light shielding layer 270 by arranging the second opening 2702 in the light shielding layer 270, and disposing the top area of the lead and its lead protection adhesive in the second opening 2702, compared with the direct opening of the light shielding layer 270 It is arranged on the top of the lead wire and the lead wire protective glue, which can further reduce the overall thickness of the fingerprint identification device.
  • the upper surface of the light shielding layer 270 is not higher than the highest point of the upper surface of the lead protection adhesive 232 , and/or the upper surface of the light shielding layer 270 is not higher than the highest point of the upper surface of the optical component 210 .
  • the arrangement of the light shielding layer 270 does not increase the thickness of the fingerprint identification device 200 , but only improves the performance of the fingerprint identification device 200 .
  • the first window 2701 is formed in cooperation with the microlens array 211, and the second window 2702 is formed in conjunction with the lead wire and its lead protective adhesive, which can block stray light or non-targets.
  • the fingerprint light signal in the direction of the fingerprint identification can reduce the interference of the outside world on the fingerprint identification process, and reduce the thickness of the fingerprint identification device. Furthermore, the appearance problem of the fingerprint identification device under the display screen can be improved.
  • the fingerprint identification device 200 may further include: a support layer 260 disposed between the circuit board 230 and the light shielding layer 270 for supporting the light shielding layer 270 .
  • FIG. 6 shows another schematic top view of the fingerprint identification device in FIG. 4 .
  • a third opening 2601 is provided in the support layer 260 , and the fingerprint sensor 220 and the processing unit 240 are arranged in the third opening 2601 .
  • the light shielding layer 270 is disposed on the surface of the support layer 260 and extends toward the fingerprint sensor 220 , and a first window 2701 is formed around the microlens array 211 .
  • the support layer 260 supports a part of the light shielding layer 270 , and another part of the light shielding layer 270 is suspended below or supported by the fingerprint sensor 220 .
  • the upper surface of the support layer 260 is not higher than the highest point of the upper surface of the microlens array 211 in the optical component 210. Further, as shown in FIG. 4 , at least one diaphragm layer in the optical component 210 and the fingerprint The sensor is integrated in the fingerprint sensor chip, and the upper surface of the support layer 260 is not higher than the upper surface of the fingerprint sensor chip. In addition, the upper surface of the support layer 260 is also not higher than the upper surface of the processing unit 240 .
  • the support layer 260 is fixed on the upper surface of the circuit board 230 by fixing glue.
  • the material of the support layer 260 includes, but is not limited to, metal, resin, glass fiber composite board, adhesive layer, and the like.
  • the support layer 260 is a polyethylene terephthalate (polyethylene terephthalate, PET) material layer or a polyimide (polyimide, PI) material layer.
  • the support layer 260 may also be a bracket formed of a foam material.
  • the fixing adhesive can be a double-sided adhesive.
  • the disposition of the support layer 260 does not increase the thickness of the fingerprint identification device 200 , but only supports the light shielding layer 270 to improve the stability of the light shielding layer 270 .
  • the fingerprint identification device 200 may further include: a foam layer 280 , and the foam layer 280 may be connected to the surface of the light shielding layer 270 by a tape 281 , so that the foam layer 280 It is fixed above the fingerprint sensor 220 and the processing unit 240 .
  • FIG. 7 shows another schematic top view of the fingerprint identification device in FIG. 4 .
  • the foam layer 280 may be provided with a fourth window 2801 penetrating the foam layer 280 .
  • the fourth window 2801 is disposed just above the optical assembly, specifically, is disposed directly above the microlens array 211, so that the fingerprint light signal can be passed through the fourth window 2801 by the optical assembly 210 and the fingerprint sensor. 220 received.
  • the area of the fourth opening 2801 is not smaller than the area of the first opening 2701 in the light shielding layer 270 .
  • the upper surface of the fingerprint identification device 200 is pressed against the lower surface of the display screen through the foam layer 280 or maintains a certain gap with the lower surface of the display screen.
  • the foam layer 280 can not only be used for The detection performance of the fingerprint identification device 200 is prevented from being affected by the fingerprint identification device 200 touching the display screen, and the fingerprint identification device 200 can be sealed against dust to ensure the identification performance of the fingerprint identification device 200 and improve the service life of the fingerprint identification device 200 .
  • the foam layer 280 can further play the role of shading, thereby reducing the visibility of the fingerprint identification device 200 when the user views the fingerprint identification device 200 from the front of the display screen, thereby beautifying the appearance of the electronic device.
  • the fingerprint identification device 200 further includes: a filter, and the filter is disposed between the fingerprint sensor 220 and the display screen. It is used to filter out the optical signal in the non-target band and pass the optical signal in the target band.
  • the area of the filter is larger than the area of the fingerprint detection area of the fingerprint sensor 220 .
  • the filter may include one or more optical filters, which may be configured, for example, as band-pass filters to allow transmission of light emitted by OLED displays or assist in fingerprint recognition in LCD displays The transmission of light emitted by the light source, while blocking other light components such as infrared light in sunlight.
  • optical filters may be configured, for example, as band-pass filters to allow transmission of light emitted by OLED displays or assist in fingerprint recognition in LCD displays The transmission of light emitted by the light source, while blocking other light components such as infrared light in sunlight.
  • the filter is used to reduce undesired ambient light in fingerprint sensing, so as to improve the optical sensing of the received light by the fingerprint sensor 220 .
  • the filter can specifically be used to filter out light of a specific wavelength, for example, near-infrared light and part of red light.
  • the reflectivity of the filter to light is less than 1%, so as to ensure that the fingerprint sensor 220 can receive enough light signals, thereby improving the fingerprint recognition effect.
  • the optical filter is disposed above the optical assembly 210 , for example, it can be connected and fixed to the circuit board 230 through a bracket or an adhesive layer, so as to be disposed above the optical assembly.
  • the filter and the optical component 210 may be an air gap not filled with any auxiliary material, or may be filled with a glue material whose refractive index is lower than the preset refractive index.
  • the preset refractive index includes but not Limited to 1.3.
  • the optical filter can also be grown on the surface of the fingerprint sensor by a semiconductor process, specifically, a filter layer for passing the optical signal of the target wavelength band and filtering the optical signal of the non-target wavelength band is grown on the surface of the fingerprint sensor.
  • the filter layer is integrated into the chip together with the fingerprint sensor.
  • the above-mentioned filter layer can be formed by coating on the light detection array of the fingerprint sensor 220 by an evaporation process, for example, by atomic layer deposition, sputtering coating, electron beam evaporation coating, ion beam coating and other methods above the sensor chip Preparation of multilayer filter material films.
  • the circuit board 230 may have an irregular shape, and the head area thereof is approximately a quadrilateral.
  • the fingerprint sensor 220 , the processing unit 240 , and the support layer 260 , the light shielding layer 270 and the foam layer 280 are all provided with the head area of the circuit board 230 .
  • the circuit board 230 is specifically the head area of the circuit board 230 unless otherwise specified.
  • the peripheral shapes of the light shielding layer 270 , the supporting layer 260 , the foam layer 280 and the reinforcing plate 250 are similar to the head area of the circuit board 230 , so that the circuit The head area of the board 230 and the fingerprint sensor 220 and the processing unit 240 disposed above it are well protected, and can be easily installed in the blind hole of the middle frame without causing appearance problems due to the reflection of the circuit board 230 .
  • the thickness of the middle frame is generally small, the depth of the blind hole on the middle frame is shallow.
  • the installation accuracy is poor.
  • the fingerprint identification device is installed outside the blind hole, which is not only unfavorable for the compression of the thickness and space of the electronic equipment, but also causes the fingerprint identification device to be unable to be stably fixed under the display screen, which affects the fingerprint identification performance of the fingerprint identification device. Damage to the fingerprint reader and display.
  • the embodiment of the present application further improves the design of the middle frame of the electronic device and the fingerprint identification device 200 on the basis of the above-mentioned fingerprint identification device 200, so as to improve the installation accuracy of the fingerprint identification device 200 in the blind hole of the middle frame, and improve the Reliability of fingerprint recognition devices.
  • FIG. 8 shows a schematic structural diagram of another fingerprint identification device 200 .
  • a positioning post 1021 is provided in the blind hole 102 of the middle frame 101 .
  • the positioning post 1021 is located at the edge area of the blind hole 102 .
  • its height may be higher than the depth of the blind hole 102 .
  • a positioning hole 201 is provided in the edge region of the fingerprint identification device 200 , and the positioning hole 201 penetrates through the circuit board 230 and the reinforcing plate in the fingerprint identification device 200 . 250, the support layer 260, the light shielding layer 270, the foam layer 280, and the connecting adhesive layer between the layers.
  • the positioning post 1021 is located in the positioning hole 201 to limit the installation position of the fingerprint identification device 200. In other words, during the installation process of the fingerprint identification device 200, the positioning hole 201 needs to be installed corresponding to the positioning post 1021, and then further , which defines the installation position of the entire fingerprint identification device 200 in the blind hole.
  • the positioning hole 201 includes, but is not limited to, a circular hole or a waist-shaped hole, and correspondingly, the cross-section of the positioning post 1021 includes, but is not limited to, a circular or waist-shaped hole.
  • the positioning posts 1021 in the blind holes 102 may be integrally formed with the middle frame 101, or may be separately installed in the middle frame.
  • the installation accuracy can be improved, and the positioning column and the positioning column are
  • the matching of the through holes in the fingerprint identification device not only has high installation accuracy, but also facilitates the realization of the installation process.
  • FIG. 9 shows a schematic top view of the fingerprint identification device 200 in FIG. 8 .
  • the fingerprint identification device 200 is provided with two positioning holes 201 , and the two positioning holes 201 are respectively disposed at the diagonal positions of the fingerprint identification device 200 and located at the edge area of the fingerprint identification device 200 .
  • two positioning posts 1021 are correspondingly provided, which are used to cooperate with the installation of the above two positioning holes 201 .
  • two positioning holes 201 are provided in the fingerprint identification device 200 to install the fingerprint identification device 200 .
  • the installation accuracy is improved. be further improved.
  • the two positioning holes 201 are respectively arranged at the diagonal positions of the fingerprint identification device 200, which will not affect the fingerprint sensor 220 and the processing unit 240 in the fingerprint identification device 200, and the two The distance between the positioning holes 201 is relatively large, which facilitates the installation and operation of the fingerprint identification device.
  • the fingerprint identification device 200 includes, but is not limited to, 1 or 2 positioning holes, and the position of the positioning holes can be set in addition to the diagonal position of the fingerprint identification device 200 . It can be placed in any other position such as the two sides of the fingerprint identification device.
  • the embodiments of the present application do not specifically limit the number, shape and position of the positioning holes.
  • the related technical solutions are described by taking the fingerprint identification device including a single fingerprint sensor 220 and a single processing unit 240 as an example.
  • the fingerprint identification device may further include multiple fingerprint sensors 220 and/or multiple processing units 240 .
  • a plurality of fingerprint sensors 220 are arranged side by side above the circuit board 230 to form a fingerprint sensor assembly, wherein the sensing areas of the plurality of fingerprint sensors 220 together constitute the fingerprint detection area of the fingerprint identification device 200 in the display screen, thereby expanding the Fingerprint detection area for full-screen fingerprint recognition.
  • a plurality of processing units 240 are arranged side by side above the circuit board 230 to form a processing unit assembly.
  • the processing unit assembly is disposed adjacent to the fingerprint sensor assembly, and is used for processing the fingerprint image signal obtained by the fingerprint sensor assembly.
  • the blind hole 102 of the middle frame is opened in the middle area or the lower middle area of the middle frame 101, so that the fingerprint detection area of the at least one fingerprint sensor 220 is located in the middle position of the display area of the display screen 103 or The lower middle position is convenient for the user to hold the fingerprint identification, thereby improving the user experience.
  • the embodiment of the present application also provides an electronic device, and the electronic device may include:
  • the middle frame the upper surface of the middle frame is provided with a blind hole, the blind hole is located below the display screen, and the fingerprint recognition device is installed in the blind hole of the middle frame, so that the fingerprint recognition device is arranged under the display screen, so that the screen can be used under the screen. Fingerprint recognition.
  • the electronic device can be any electronic device with a display screen.
  • the display screen can be an OLED display screen, an LCD display screen or other types of display screens in the related art. Specifically, it may correspond to the display screen 103 in the foregoing embodiment, and the related description can refer to the foregoing description about the display screen 103 , which is not repeated here for brevity.
  • the middle frame may correspond to the middle frame 101 in the foregoing embodiments, and reference may be made to the foregoing description of the middle frame 101 for the relevant description, which is not repeated here for brevity.
  • At least one positioning column is formed in the blind hole of the middle frame, and the positioning column is used to correspond to the positioning hole in the fingerprint identification device, so that the fingerprint identification device can be fixedly installed in the fingerprint identification device. in the blind hole.
  • the blind hole of the middle frame is arranged in the middle area or the lower middle area of the middle frame, so that the fingerprint detection area of the fingerprint recognition device is located in the middle position of the display area of the display screen or Lower middle position.
  • the distance between the fingerprint identification device and the light-emitting layer of the display screen is less than a preset threshold, for example, the preset threshold is 600 ⁇ m.
  • the disclosed systems and apparatuses may be implemented in other manners.
  • the apparatus embodiments described above are only illustrative.
  • the division of the units is only a logical function division. In actual implementation, there may be other division methods.
  • multiple units or components may be combined or Can be integrated into another system, or some features can be ignored, or not implemented.
  • the shown or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may also be electrical, mechanical or other forms of connection.
  • the units described as separate components may or may not be physically separated, and components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solutions of the embodiments of the present application.
  • each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically alone, or two or more units may be integrated into one unit.
  • the above-mentioned integrated units may be implemented in the form of hardware, or may be implemented in the form of software functional units.
  • the integrated unit if implemented in the form of a software functional unit and sold or used as an independent product, may be stored in a computer-readable storage medium.
  • the technical solutions of the present application are essentially or part of contributions to the prior art, or all or part of the technical solutions can be embodied in the form of software products, and the computer software products are stored in a storage medium , including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present application.
  • the aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (Read-Only Memory, ROM), random access memory (Random Access Memory, RAM), magnetic disk or optical disk and other media that can store program codes .

Abstract

一种指纹识别装置（200）和电子设备，指纹识别装置（200）具有超薄厚度且具有良好的指纹识别性能，能够适用于超薄屏下空间的电子设备。指纹识别装置（200）用于设置在电子设备中框（101）的上表面的盲孔（102）中，且位于电子设备的显示屏（103）下方，指纹识别装置（200）包括：指纹传感器（220）；光学组件（210），设置于指纹传感器（220）上方，用于引导经过显示屏（103）上方的手指反射或者散射后，再穿过显示屏（103）的指纹光信号进入到指纹传感器（220）中；处理单元（240），设置于指纹传感器（220）的一侧，用于处理指纹传感器（220）获取的指纹图像信号，处理后的指纹图像信号用于指纹识别；电路板（230），设置于指纹传感器（220）和处理单元（240）下方，指纹传感器（220）和处理单元（240）通过电路板（230）安装于电子设备的中框（101）的盲孔（102）中，电路板（230）用于传输指纹传感器（220）和处理单元（240）的信号。

Description

指纹识别装置和电子设备 技术领域
本申请涉及光学指纹技术领域，并且更具体地，涉及一种指纹识别装置和电子设备。
背景技术
随着生物识别技术发展，指纹识别技术广泛应用于移动终端设计、汽车电子、智能家居等领域。消费者对各种电子终端产品的功能需求增多的同时要求产品尺寸尽量轻薄，因此电子产品内部结构日益紧凑，指纹识别装置设计难度增大，由此指纹识别装置小型化以及厚度超薄化更加迫切，要求指纹识别装置在占有电子产品更小的体积空间的条件下去实现更加精准的功能。
发明内容
本申请实施例提供了一种指纹识别装置和电子设备，该指纹识别装置具有超薄厚度且具有良好的指纹识别性能，能够适用于超薄屏下空间的电子设备。
第一方面，提供了一种指纹识别装置，用于设置在电子设备中框的上表面的盲孔中，且位于该电子设备的显示屏下方，该指纹识别装置包括：指纹传感器；光学组件，设置于该指纹传感器上方，用于引导经过该显示屏上方的手指反射或者散射后，再穿过该显示屏的指纹光信号进入到该指纹传感器中；处理单元，设置于该指纹传感器的一侧，用于处理该指纹传感器获取的指纹图像信号，处理后的该指纹图像信号用于指纹识别；电路板，设置于该指纹传感器和该处理单元下方，该指纹传感器和该处理单元通过该电路板安装于该电子设备的中框的盲孔中，该电路板用于传输该指纹传感器和该处理单元的信号。
采用本申请实施例的技术方案，通过将处理单元和指纹传感器并排设置于电路板上方，且通过电路板进行信号传输，能够减小处理单元与指纹传感器之间的信号传输距离，提高二者之间的信号质量，提高指纹识别效果。进一步地，处理单元与指纹传感器一起，通过电路板设置在中框盲孔的对应区域，且位于显示屏下方，不需要对该处理单元单独设置补强板，也不需要对 该处理单元进行封装，因此，处理单元占用的厚度空间较小，从而可以降低整个指纹识别装置的厚度。此外，配合本申请实施例中，厚度较小的光学组件，并将指纹识别装置设置在中框的盲孔中，能够进一步的压缩整个指纹识别装置在屏幕下方占用的厚度空间，盲孔的设计有利于提高指纹识别装置安装位置的精度，使得指纹识别装置能够更加便利和灵活的安装于电子设备中。
在一种可能的实施方式中，该指纹识别装置还包括：遮光层，其中形成有第一开窗，该第一开窗设置于该指纹传感器上方，该第一开窗用于通过该指纹光信号以被该指纹传感器接收。
在一种可能的实施方式中，该光学组件位于该第一开窗中。
在一种可能的实施方式中，该遮光层中还形成有第二开窗，该指纹传感器连接该电路板的第一引线的顶部区域以及该处理单元连接该电路板的第二引线的顶部区域均位于该第二开窗中。
在一种可能的实施方式中，该指纹传感器的第一边设置有该第一引线，该处理单元的第一边设置有该第二引线，该指纹传感器的第一边与该处理单元的第一边相邻。
在一种可能的实施方式中，该指纹传感器的第一边与该处理单元的第一边相互平行。
在一种可能的实施方式中，该第一引线和/或该第二引线包覆有引线保护胶，该引线保护胶的高度不大于150μm。
在一种可能的实施方式中，该遮光层的上表面不高于引线保护胶的上表面的最高点，和/或，该遮光层的上表面不高于该光学组件的上表面的最高点。
在一种可能的实施方式中，该指纹识别装置还包括：支撑层，设置于该电路板与该遮光层之间，用于支撑该遮光层；该支撑层中设置有第三开窗，该指纹传感器和该处理单元设置于该第三开窗中。
在一种可能的实施方式中，该支撑层的上表面不高于该光学组件的上表面的最高点，且该支撑层的上表面不高于该处理单元的上表面。
在一种可能的实施方式中，该指纹识别装置还包括：泡棉层，其中形成有第四开窗，该第四开窗设置于该指纹传感器上方，该第四开窗用于通过该指纹光信号以被该指纹传感器接收，该第四开窗的面积不小于该遮光层中该第一开窗的面积。
在一种可能的实施方式中，该第四开窗位于该光学组件的正上方。
在一种可能的实施方式中，该中框的盲孔中形成有定位柱，该指纹识别装置还包括：定位孔，与该定位柱对应，以将该指纹识别装置固定安装于该盲孔中。
在一种可能的实施方式中，该定位孔的数量为多个，设置于该指纹识别装置的边缘区域。
在一种可能的实施方式中，该定位柱的高度不低于该盲孔的深度，和/或，该定位孔为圆形或者腰圆形。
在一种可能的实施方式中，该电路板为柔性电路板，该指纹识别装置还包括：补强板，设置于该电路板下方并位于该电子设备的中框的盲孔中，该补强板用于支撑该电路板及其上方的该指纹传感器和该处理单元。
在一种可能的实施方式中，该光学组件包括：微透镜阵列；至少一光阑层，设置于该微透镜阵列下方，该至少一光阑层中每层光阑层中形成有多个通光小孔；该微透镜阵列用于将该指纹光信号汇聚至该至少一光阑层的多个通光小孔中，该指纹光信号通过该多个通光小孔传输至该指纹传感器以进行光学指纹成像。
在一种可能的实施方式中，该微透镜阵列中的每个微透镜对应于每层光阑层中的至少一个通光小孔，以及该指纹传感器中的至少一个像素单元；该指纹传感器用于接收至少一个方向的指纹光信号，以获取至少一张指纹图像的指纹图像信号。
在一种可能的实施方式中，该指纹识别装置包括：多个该指纹传感器，多个该指纹传感器并排设置于该电路板上方，以拼接形成一个指纹传感器组件；和/或，多个该处理单元，多个该处理单元并排设置于该电路板上方，以拼接形成一个处理单元组件。
在一种可能的实施方式中，该指纹识别装置与该显示屏的发光层之间的距离小于600μm。
第二方面，提供一种电子设备，包括：显示屏；包括如第一方面或第一方面的任一可能的实施方式中的指纹识别装置；中框，该中框的上表面设置有盲孔，该盲孔位于该显示屏下方，该指纹识别装置安装于该中框的盲孔中，以使得该指纹识别装置设置于该显示屏下方。
在一种可能的实施方式中，该中框的盲孔中形成有至少一个定位柱，该 定位柱用于与该指纹识别装置中的定位孔对应，以将该指纹识别装置固定安装于该盲孔中。
在一种可能的实施方式中，该中框的盲孔设置于该中框的中间区域或者中间偏下区域，以使该指纹识别装置的指纹检测区域位于该显示屏的显示区域的中间位置或者中间偏下位置。
附图说明
图1是本申请实施例提供的一种指纹识别装置的截面示意图。
图2是图1中的指纹识别装置的俯视示意图。
图3是本申请实施例提供的另一种指纹识别装置的截面示意图。
图4是本申请实施例提供的另一种指纹识别装置的截面示意图。
图5是图4中的指纹识别装置的一种俯视示意图。
图6是图4中的指纹识别装置的另一种俯视示意图。
图7是图4中的指纹识别装置的另一种俯视示意图。
图8是本申请实施例提供的另一种指纹识别装置的截面示意图。
图9是图8中的指纹识别装置的一种俯视示意图。
具体实施方式
下面将结合附图，对本申请实施例中的技术方案进行描述。
应理解，本申请实施例可以应用于光学指纹系统，包括但不限于光学指纹识别系统和基于光学指纹成像的产品，本申请实施例仅以光学指纹系统为例进行说明，但不应对本申请实施例构成任何限定，本申请实施例同样适用于其他采用光学成像技术的系统等。
作为一种常见的应用场景，本申请实施例提供的光学指纹系统可以应用在智能手机、平板电脑以及其他具有显示屏的移动终端或者其他电子设备；更具体地，在上述电子设备中，指纹识别装置可以具体为光学指纹装置，其可以设置在显示屏下方的局部区域或者全部区域，从而形成屏下(Under-display)光学指纹系统。
图1示出了一种指纹识别装置100的截面示意图。
如图1所示，该指纹识别装置100设置在其所在的电子设备的中框101上，该中框101中设置有盲孔102，指纹识别装置100设置于该盲孔102中， 且位于电子设备的显示屏103下方。
在本申请中，中框101为电子设备的设置于显示屏103和电池之间用于承载内部各种组件的框架，其内部各种组件包括但不限于主板，摄像头，排线，各种感应器，话筒，听筒等等零部件。
可选地，中框103可以由金属或者合金材料制成，或者也可以由塑胶材料制成，本申请实施例对此不作限定。
具体地，该指纹识别装置100可以包括：光学组件110，指纹传感器120以及电路板130。
其中，该光学组件110用于引导经过显示屏上方的手指反射或者散射后，再穿过显示屏的指纹光信号进入到指纹传感器120中，以形成手指的指纹图像。在一些实施方式中，发射至显示屏103上方手指的光源信号可以来源自显示屏103的自身光源，例如，有机发光二极管(Organic Light-Emitting Diode，OLED)显示屏或者微型发光二极管(Micro-LED)显示屏中显示单元的光源。在另一些实施方式中，发射至显示屏上方手指的光源信号也可以为其它内置光源或者外置光源，例如红外光源或者特定波长非可见光的光源等等，在此情况下，显示屏可以为液晶显示屏或者其他的被动发光显示屏。
作为示例，该光学组件110可以包括：图1中所示的微透镜阵列111以及设置于该微透镜阵列111下方的光阑层112。其中，微透镜阵列111包括多个微透镜，每个微透镜用于将其上方的光信号进行会聚后传输至其下方的光阑层。光阑层112为光吸收材料制备形成，其中设置有多个通光小孔，该多个通光小孔用于对微透镜会聚后的光信号进行方向选择，使得目标方向的光信号经过通光小孔进入至指纹传感器120中，而非目标方向的杂散光信号则被非通过小孔所在区域的光吸收材料吸收，从而防止杂散光信号对指纹成像造成干扰。
指纹传感器120中包括多个像素单元形成的像素阵列，用于将经过光阑层112的光信号转换为对应的图像信号。具体地，该指纹传感器120可以为通过半导体工艺制作的指纹传感器芯片，上述光学组件110可以一体封装于该指纹传感器芯片中，或者也可以独立设置于指纹传感器芯片的上方。
进一步地，该指纹传感器120通过电连接件131连接至电路板130，从而实现指纹传感器120与电路板130之间的电连接，该电连接件131包括但不限于是通过引线键合(wire bonding，WB)方式制备形成的引线。
此外，电路板130包括但不限于是印刷电路板(printed circuit board，PCB)、柔性电路板(flexible printed circuit，FPC)或者软硬结合板等等，本申请实施例对此不做具体限定。
图2示出了图1中指纹识别装置100的俯视示意图。
如图2所示，该电路板130中设置有微控制单元(microcontroller unit，MCU)131，用于产生控制信号以控制指纹传感器120的工作，和/或接收指纹传感器120的指纹图像信号进行处理，处理后的指纹图像信号用于指纹检测和识别。
进一步地，该电路板130中还设置有连接器132，用于将电路板130连接至电子设备的其它电学组件，例如连接至电子设备的处理器(central processing unit，CPU)上，以控制该指纹识别装置100的运行。
可以理解的是，为了实现完整的电路功能，电路板130中还设有电容、电阻等相关电学元器件，本申请实施例对此不做详细说明。
在一些实施方式中，为了便于指纹识别装置100在中框内的安装，电路板130为FPC，该FPC上的MCU 131需设置于补强钢板上，以对该MCU 131进行支撑。且MCU 131为一种经过封装之后的芯片，其根据不同的设计需求，独立设置于FPC的不同位置。因此，在该实施方式中，MCU需要额外为其设计补强钢板，且其自身的厚度较大，不利于指纹识别装置100的轻薄化设计，进一步也不利于电子设备的轻薄化发展。此外，该MCU与指纹传感器之间的距离较远，指纹图像信号传输过程中容易受到干扰，影响指纹图像信号的质量，从而影响指纹识别的性能。
基于上述问题，本申请提出一种指纹识别装置，能够实现指纹识别装置轻薄化的设计，且提高指纹识别装置的整体性能，以满足指纹识别装置在不同电子设备中的安装需求，实现电子设备的超薄化。
以下，结合图3至图9，详细介绍本申请实施例的指纹识别装置。
需要说明的是，为便于理解，在以下示出的实施例中，相同的结构采用相同的附图标记，并且为了简洁，省略对相同结构的详细说明。
图3是本申请实施例提供的一种指纹识别装置200的示意性结构图，该指纹识别装置200用于设置在电子设备的中框的上表面的盲孔102中，且位于电子设备的显示屏103下方。
如图3所示，该指纹识别装置200包括：光学组件210，指纹传感器220， 电路板230和处理单元240；
其中，光学组件210设置于指纹传感器220的上方，用于引导经过显示屏103上方的手指反射或者散射后，再穿过显示屏的指纹光信号进入到指纹传感器220中；
指纹传感器220，设置于光学组件210的下方，用于接收经过该光学组件210引导后的指纹光信号，以获取指纹图像信号；
处理单元240，设置于上述指纹传感器220的一侧，用于处理该指纹传感器220获取的指纹图像信号，处理后的指纹图像信号用于指纹识别；
电路板230，设置于指纹传感器220和处理单元240的下方，该指纹传感器220和处理单元240通过该电路板230安装于电子设备的中框的盲孔102中，该电路板230用于传输该指纹传感器220和处理单元240的信号。
可选地，在本申请实施例中，如图3所示，该光学组件210可以与图1中的光学组件110类似，包括微透镜阵列211以及设置于该微透镜阵列211下方的光阑层212，相关技术方案可以参见上文中的具体描述。
进一步地，除了图3中所示的一层光阑层212的方案以外，在本申请实施例中，光学组件210也可以包括多层光阑层212。指纹传感器220中包括多个像素单元组成的像素阵列，微透镜阵列211中的每个微透镜对应于每层光阑层212中的至少一个通光小孔，以及像素阵列中的至少一个像素单元，每个微透镜将汇聚的光信号传输至对应的通光小孔内部并经由通光小孔传输到对应的像素单元以进行光学指纹成像。
可选地，该指纹传感器220中的多个像素单元可以用于接收相同方向的指纹光信号，例如，多个像素单元均接收垂直于显示屏的指纹光信号，或者多个像素单元均接收倾斜于显示屏的特定方向的指纹光信号。
可选地，该指纹传感器220中的多个像素单元还可以用于接收不同方向的指纹光信号以形成多张指纹图像的指纹图像信号，例如，多个像素单元中第一部分像素单元接收第一方向的指纹光信号，形成第一指纹图像的指纹图像信号；第二部分像素单元接收第二方向的指纹光信号，形成第二指纹图像的指纹图像信号。
在一些实施方式中，该光阑层212可以通过半导体工艺生长或者其它工艺形成在指纹传感器220上方，例如，通过原子层沉积、溅射镀膜、电子束蒸发镀膜、离子束镀膜等方法在指纹传感器220上方制备一层非透光材料薄 膜，再进行小孔图形光刻和刻蚀，形成多个通光小孔。可以理解的是，在光学组件210包括多层光阑层212的情况下，其中最底层光阑层212与指纹传感器220之间，以及相邻的光阑层212之间，可以通过透明介质层进行隔离。
可以理解的是，光学组件210除了可以为图3中所示的结构以外，其还可以为其它光引导结构，例如准直器(collimator)层，具有多个准直单元或者微孔阵列；或者，光学透镜(Lens)层，具有一个或多个透镜单元，比如一个或多个非球面透镜组成的透镜组，本申请实施例对该光学组件210的具体结构不做限定。
在本申请实施例中，光学组件210采用上述结构，相比于基于光学透镜层成像的指纹识别装置，可以不受制透镜成像光路的限制，降低光学组件的厚度，有利于实现指纹识别装置的轻薄化。此外，相比于基于准直器层成像的指纹识别装置，其利用微透镜阵列进行光信号的会聚，且利用一层或者多层光阑层对光信号进行方向引导，能够进一步提高指纹光信号的质量，从而提高指纹识别装置的指纹识别性能。
如图3所示，指纹传感器220和处理单元240并排设置于电路板230上方，并通过电连接件连接至电路板230。具体地，该电连接件的相关技术方案可以参见图1中的相关描述。在一些实施方式中，该电连接件可以为金线，其通过引线键合的方式，第一引线2311连接指纹传感器220的焊盘与电路板230的焊盘，第二引线2312连接处理单元240的焊盘与电路板230的焊盘。
可选地，除了采用引线键合的方式实现指纹传感器、处理单元以及电路板之间的电连接以外，本申请实施例也可以采用相关技术中其它的电连接技术实现指纹传感器、处理单元以及电路板之间的电连接，例如硅通孔(through silicon via，TSV)等等，本申请实施例对此不做具体限定。
在本申请实施例中，直接将指纹传感器220和处理单元240设置在电路板230的表面，且通过引线键合的方式实现电连接，不需要额外对电路板230进行开孔等其它处理，工艺易于实现、工艺产能较高且成本低。
进一步地，该处理单元240通过电连接件以及电路板230实现与指纹传感器220的电连接后，用于处理指纹传感器220获取的指纹图像信号，处理后的指纹图像信号用于指纹识别。
作为一种示例，该处理单元240可以对指纹传感器220获取的指纹图像 信号进行数字合成(binning)、滤波(filtering)等等信号处理，然后将处理后的指纹图像信号通过电路板230以及电路板230上的连接器传输至电子设备的处理器中，该处理器用于对处理后的指纹图像信号进行指纹检测和识别。可选地，与此同时，该处理单元240还可以用于形成指纹传感器的控制信号，以控制指纹传感器中的电路运行执行指纹图像采集。
作为另一种示例，该处理单元240可以用于对指纹传感器220获取的指纹图像信号进行处理和识别，以判断该指纹图像信号是否属于目标用户的指纹，进一步地，该处理单元240还可以用于对该指纹图像信号进行活体检测，以判断该指纹图像信号是否属于活体手指。
该处理单元240包括但不限于是MCU，其还可以为数字信号处理器(digital signal processor，DSP)、图像信号处理器(image signal processor，ISP)、专用集成电路(application specific integrated circuit，ASIC)、现成可编程门阵列(field programmable gate array，FPGA)或者其他可编程逻辑器件、分立门或者晶体管逻辑器件、分立硬件组件。
在本申请实施例中，将处理单元240并排设置于指纹传感器220的一侧，而不是设置在电路板230的其它位置，可以减小处理单元240与指纹传感器220之间的走线距离，从而防止信号在传输过程中信号质量下降，影响指纹识别效果。
另外，将处理单元240与指纹传感器220设置在显示屏103下方，且通过补强板250设置在中框的盲孔区域，不需要对该处理单元240的下方单独设置补强板，也不需要对该处理单元240进行封装，即在处理单元240外侧额外制备封装材料层。因此，本申请实施例中，处理单元240的设置方式相比于图2中MCU 131的设置方式，可以减小其整体占用的厚度空间，从而进一步降低整个指纹识别装置200的厚度。
可选地，在本申请实施例中，电路板230的相关技术方案可以参见图1和图2中电路板130的相关说明。优选地，该电路板230为FPC，便于该指纹识别装置在显示屏下的安装。
可选地，若电路板230为FPC，则该FPC下方可以设置补强板，例如，补强钢板，以支撑和补强其上方的FPC以及FPC上方的处理单元240与指纹传感器220。
采用该实施方式，处理单元240可以复用指纹传感器220下方的补强板， 在保证处理单元240和指纹传感器220的安装可靠度的前提下，不额外增加处理单元240的补强板，不会额外增加整个指纹识别装置的厚度，也能够降低指纹识别装置的成本。
综上，采用本申请实施例的技术方案，通过将处理单元240和指纹传感器220并排设置于电路板230上方，且通过电路板230进行信号传输，能够减小处理单元240与指纹传感器220之间的信号传输距离，提高二者之间的信号质量，提高指纹识别效果。进一步地，处理单元240与指纹传感器220一起，通过电路板230设置在中框盲孔的对应区域，且位于显示屏下方，不需要对该处理单元240单独设置补强板，也不需要对该处理单元240进行封装，因此，处理单元240占用的厚度空间较小，从而可以降低整个指纹识别装置200的厚度。此外，配合本申请实施例中，厚度较小的光学组件，并将指纹识别装置设置在中框的盲孔中，能够进一步的压缩整个指纹识别装置在屏幕下方占用的厚度空间，盲孔的设计有利于提高指纹识别装置安装位置的精度，使得指纹识别装置能够更加便利和灵活的安装于电子设备中，且能够适用于更多的电子设备。
可选地，如图3所示，在本申请实施例中处理单元240的一边与指纹传感器220的一边平行或垂直。其中，指纹传感器200和处理单元240可以为四边形芯片，其中的一边可以为四边形芯片的任意一边。
例如，在图3中，处理单元240的第一边为其右侧一边，指纹传感器220的第一边为其左侧一边，则处理单元240的第一边与指纹传感器220的第一边平行。在此情况下，处理单元240可以称之为与指纹传感器220平行设置。
除了图3所示的情况下，处理单元240也可以不与指纹传感器220平行设置，即处理单元240的第一边与指纹传感器220的第一边呈一定角度的夹角，该一定角度的夹角不为0°或者90°。本申请实施例对于处理单元240与指纹传感器220的角度关系不做具体限定。
可以理解的是，若采用图3中处理单元240与指纹传感器220平行设置的布局，处理单元240的右侧一边与指纹传感器220的左侧一边相邻，且两者之间的距离最短，电路板230的焊盘位于指纹传感器220的左侧一边与处理单元240的右侧一边之间，便于指纹传感器220与处理单元240与电路板的焊盘连接。
还可以理解的是，图3中仅示出了处理单元240平行设置于指纹传感器 220左侧的情况，处理单元240还可以平行或者非平行设置于第二传感器230其它三侧任意一侧，本申请实施例对此不做具体限定。
图4示出了另一种指纹识别装置200的结构示意图。
如图4所示，上述电路板230为FPC，该电路板230通过第一胶层231粘附至补强板250上。进一步地，该补强板250通过第二胶层251粘附至中框101的盲孔102的上表面。该补强板250的材料可以为不锈钢补强板、铝箔补强板、玻璃纤维补强板或者其它有机材料补强板，本申请实施例对此并不限定。优选地，补强板250为补强钢板。
作为示例，该第一胶层231包括但不限于是导电胶，用于连接FPC与补强钢板。该第二胶层251包括但不限于是模组贴合双面胶、水胶、固态胶带有胶层的泡棉层、或者其它类型的胶层。本申请实施例对该第一胶层231和第二胶层251的具体类型不做限定。
进一步地，如图4所示，指纹传感器220可以通过第三胶层221粘附至电路板230上，且处理单元240通过第四胶层241粘附至电路板230上。该第三胶层221和第四胶层241包括但不限于是芯片粘接薄膜(Die Attach Film，DAF)，可以实现芯片和电路板之间的超薄连接。
此外，在图4中，用于连接指纹传感器220与电路板230的第一引线2311，以及用于连接处理单元240与电路板230的第二引线2312周围包覆有引线保护胶232，以对该引线进行支撑和保护。
通过引线保护胶232，能够保证电路板230和指纹传感器220，以及第电路板230和处理单元240之间的电连接的稳定性，进一步的，能够保证指纹识别装置200的性能。
在本申请实施例中，为了限制整个指纹识别装置的厚度，该引线保护胶232的高度不大于150μm，该引线保护胶232的高度是指其上表面的最高点与电路板230的上表面之间的高度。
具体地，除了上述通过胶层实现元器件之间的可靠连接之外，如图4所示，在本申请实施例中，该指纹识别装置200进一步可以包括以下部件。
可选地，指纹识别装置200还可以包括：
遮光层270，其中形成有第一开窗2701，该第一开窗2701位于指纹传感器220上方，用于通过指纹光信号以被指纹传感器220接收。
为了方便说明该遮光层270，图5示出了图4中的指纹识别装置的一种 俯视示意图。
参见图4和图5，在本申请实施例中，除了第一开窗2701区域以外，在第一开窗2701的周围区域设置遮光层，可以用于遮挡杂散光或者非目标方向的指纹光信号，防止其进入至指纹传感器220中，从而减小环境因素对指纹识别过程的干扰。进一步地，设置遮光层270也可以提升指纹识别装置200在显示屏下的外观问题，由于设置有遮光层270，其可以吸收从显示屏上方发射的光信号，减少反射回显示屏的光信号的强度，避免用户能够观察到显示屏下方的指纹识别装置，从而提高用户的使用体验。
在本申请的一些实施例中，遮光层270为遮挡胶层，可选地，遮光层270的厚度为10-30μm，例如20μm。当然，遮光层270的厚度也可以为其它具体数值或在一个其他预设数值范围内，本申请对此不做具体限定。
当然，在其他可替代实施例中，也可以利用滤光片替代遮光层270。其中，滤光片用于来减少指纹感应中的不期望的环境光，以提高指纹传感器220对接收到的光的光学感应。滤光片具体可以用于过滤掉特定波长的光，例如，近红外光和部分的红光等。例如，人类手指吸收波长低于580nm的光的能量中的大部分，基于此，滤光片可以设计为过滤波长从580nm至红外的光，以减少环境光对指纹感应中的光学检测的影响。
可选地，在一些实施方式中，上述光学组件210中的至少部分区域位于该第一开窗2701中。
例如，如图4和图5所示，光学组件210中的微透镜阵列211位于上述第一开窗2701中，光学组件210中的至少一光阑层与指纹传感器220一起集成于指纹传感器芯片中，该遮光层270中第一开窗2701的四周区域设置于指纹传感器芯片的边缘区域的表面。
需要说明的是，指纹传感器220的第一引线2311与微透镜阵列211之间也设置有遮光层270，该遮光层270除了可以用于阻挡杂散光以外，还可以阻挡用于阻挡引线保护胶232蔓延至微透镜阵列211，从而影响微透镜阵列211的光引导效果。
在一些实施方式中，如图4和图5所示，在遮光层270中，除了对应于指纹传感器220上方的区域设置有第一开窗2701以外，在对应于引线连接区域还设置有第二开窗2702。
具体地，指纹传感器220连接电路板240的第一引线2311的顶部区域 以及处理单元240连接电路板240的第二引线2312的顶部区域均位于该第二开窗2702中。进一步地，该第一引线2311和第二引线2312的引线保护胶232的顶部区域也位于该第二开窗2702中。
在一些实施方式中，如图5所示，指纹传感器220的第一边(图中指纹传感器220的左侧一边)与处理单元240的第一边(图中处理单元240的右侧一边)相邻设置。指纹传感器220的第一边(图中指纹传感器220的左侧一边)设置有多个第一引线2311，处理单元240的第一边(图中处理单元240的右侧一边)设置有多个第二引线2312，该指纹传感器220的第一边的多个第一引线2311的顶部区域以及处理单元240的第一边的多个第二引线2312的顶部区域均位于第二开窗2702中，进一步的，该指纹传感器220的第一边的引线保护胶232的顶部区域以及处理单元240的第一边的引线保护胶232的顶部区域也位于第二开窗2702中。
换言之，在图5中，指纹传感器220和处理单元240之间设置有多个第一引线2311以及多个第二引线2312，上述第二开窗2702覆盖该指纹传感器220和处理单元240之间的区域。
作为一种示例，如图5所示，指纹传感器220的全部第一引线2311均能设置于指纹传感器220的第一边。而处理单元240的一部分第二引线2312设置于处理单元240的第一边，另一部第二引线2312设置于处理单元240的其它边。
可以理解的是，在此情况下，除了上述位于处理单元240第一边的第二引线2312及其引线保护胶的顶部区域位于第二开窗2702中，位于处理单元240其它边的第二引线及其引线保护胶的顶部区域也可以位于第二开窗2702中。
由于处理单元240一般涉及的连接端口数量较多，其连接引线可能设置于处理单元240的多侧。在一些实施方式中，例如图5中所示，处理单元240的引线焊盘设置于其中三边(上侧一边、下侧一边和右侧一边)，该第二开窗2702位于处理单元240的上方，遮光层270完全不覆盖该处理单元240，第二开窗2702在处理单元240所在平面上的投影完全覆盖该处理单元240的所在区域。
在另一些实施方式中，该遮光层270也可以覆盖处理单元240中未设置第二引线的一边，例如，遮光层270也可以覆盖图5中的左侧一边，在此情 况下，第二开窗2702在处理单元240所在平面上的投影也可以仅部分覆盖该处理单元240的所在区域。
可以理解的是，第一开窗2701和第二开窗2702除了可以为图5所示的设计形状外，其还可以为其它规则或者不规则形状，本申请实施例对此不做具体限定。
在本申请实施例中，通过在遮光层270中设置第二开窗2702，并将引线及其引线保护胶中的顶部区域设置在该第二开窗2702中，相比于将遮光层270直接设置在引线以及引线保护胶顶部，可以进一步降低指纹识别装置整体的厚度。
进一步地，该遮光层270的上表面不高于引线保护胶232的上表面的最高点，和/或，该遮光层270的上表面不高于光学组件210的上表面的最高点。该遮光层270的设置不会额外增加指纹识别装置200的厚度，而仅为提升指纹识别装置200的性能。
综上，采用该实施方式，通过遮光层270的设置，在其中配合微透镜阵列211形成第一开窗2701，配合引线及其引线保护胶形成第二开窗2702，可以遮挡杂散光或者非目标方向的指纹光信号，从而减小外界对指纹识别过程的干扰，并降低指纹识别装置的厚度，进一步的，还可以提升指纹识别装置在显示屏下的外观问题。
可选地，如图4所示，指纹识别装置200还可以包括：支撑层260，设置于电路板230和遮光层270之间，用于支撑遮光层270。
为了方便说明该遮光层260，图6示出了图4中的指纹识别装置的另一种俯视示意图。
参见图4和图6，在本申请实施例中，支撑层260中设置有第三开窗2601，指纹传感器220和处理单元240设置于该第三开窗2601中。
具体地，遮光层270设置于支撑层260表面，并向指纹传感器220延伸，在微透镜阵列211四周形成第一开窗2701。换言之，该支撑层260支撑遮光层270中的一部分区域，遮光层270中的另一部分区域下方悬空或者被指纹传感器220支撑。
可选地，该支撑层260的上表面不高于光学组件210中微透镜阵列211的上表面的最高点，进一步地，如图4所示，光学组件210中至少一层光阑层与指纹传感器集成在指纹传感器芯片中，该支撑层260的上表面不高于该 指纹传感器芯片的上表面。此外，该支撑层260的上表面也不高于处理单元240的上表面。
在一些实施方式中，支撑层260通过固定胶固定在电路板230的上表面。例如，支撑层260的材料包括但不限于金属、树脂、玻纤复合板以及胶层等。例如，支撑层260为聚对苯二甲酸乙二醇酯(polyethylene glycol terephthalate，PET)材料层或者聚酰亚胺(polyimide，PI)材料层。再如，支撑层260也可以是由泡棉材料形成的支架。可选地，固定胶可以为双面胶。
通过本申请实施例的方案，该支撑层260的设置不会额外增加指纹识别装置200的厚度，而仅为支撑遮光层270，以提高遮光层270的稳定性。
可选地，如图4所示，指纹识别装置200还可以包括：泡棉层280，该泡棉层280可以通过胶带(tape)281连接在遮光层270的表面，以将该泡棉层280固定于指纹传感器220和处理单元240的上方。
为了方便说明该泡棉层280，图7示出了图4中的指纹识别装置的另一种俯视示意图。
可选地，如图4和图7所示，该泡棉层280可以设置有贯通该泡棉层280的第四开窗2801。可选地，该第四开窗2801设置于光学组件的正上方，具体的，设置于微透镜阵列211的正上方，以通过指纹光信号经过该第四开窗2801被光学组件210以及指纹传感器220接收。可选地，该第四开窗2801的面积不小于上述遮光层270中第一开窗2701的面积。
在一些实施方式中，指纹识别装置200的上表面通过该泡棉层280抵靠至显示屏的下表面或者与显示屏的下表面之间保持一定的间隙，该泡棉层280不仅可以用于避免由于指纹识别装置200触碰到显示屏而影响指纹识别装置200的检测性能，还能够密封绝尘，以保证指纹识别装置200的识别性能并提高指纹识别装置200的使用寿命。此外，通过泡棉层280还可以进一步的起到遮光作用，从而降低用户从显示屏的正面观看指纹识别装置200时的可视程度，进而能够美化电子设备的外观。
可选地，在本申请实施例中，指纹识别装置200还包括：滤光片，该滤光片设置于指纹传感器220和显示屏之间。用于滤掉非目标波段的光信号，透过目标波段的光信号。
可选地，滤光片的面积大于指纹传感器220的指纹检测区域面积。
可选地，滤光片可以包括一个或多个光学过滤器，一个或多个光学过滤 器可以配置为例如带通过滤器，以允许OLED显示屏发射的光的传输或者LCD显示屏中指纹识别辅助的光源发射的光的传输，同时阻挡太阳光中的红外光等其他光组分。
本申请实施例中，滤光片用于来减少指纹感应中的不期望的环境光，以提高指纹传感器220对接收到的光的光学感应。滤光片具体可以用于过滤掉特定波长的光，例如，近红外光和部分的红光等。
可选地，滤光片对光的反射率小于1％，从而能够保证指纹传感器220能够接收到足够的光信号，进而提升指纹识别效果。
在一些实施方式中，滤光片设置于光学组件210的上方，作为示例，其可以通过支架或者胶层与电路板230连接固定，从而设置于光学组件上方。
可选地，滤光片与光学组件210之间可以是不填充任何辅助材料的空气间隙，也可以填充一种折射率低于预设折射率的胶材，例如，预设折射率包括但不限于1.3。
在另一些实施方式中，滤光片还可以通过半导体工艺生长在指纹传感器表面，具体地，在指纹传感器表面生长用于通过目标波段光信号，并滤除非目标波段光信号的滤光层，该滤光层与指纹传感器一起集成于芯片中。
具体地，可以采用蒸镀工艺在指纹传感器220的光检测阵列上进行镀膜形成上述滤光层，例如，通过原子层沉积、溅射镀膜、电子束蒸发镀膜、离子束镀膜等方法在传感器芯片上方制备多层滤光材料薄膜。
结合上文图5至图7可以看出，在本申请实施例中，电路板230可能为不规则形状，其中的头部区域近似为四边形，上述指纹传感器220、处理单元240、以及支撑层260、遮光层270和泡棉层280等均设置电路板230的头部区域，为了方便描述，在本申请中，除了特殊说明以外，电路板230具体为电路板230的头部区域。
进一步的，参见图5至图7，在本申请实施例中，遮光层270、支撑层260、泡棉层280以及补强板250的外围形状与电路板230的头部区域近似，以对电路板230的头部区域以及其上方设置的指纹传感器220和处理单元240进行良好的防护，并便于安装于中框的盲孔中，不会引起由于电路板230的反光造成外观问题。
进一步地，由于中框的厚度一般较小，因此，中框上的盲孔深度较浅，在将指纹识别装置安装于该盲孔中时，安装精度较差，在一些情况下，可能 会将指纹识别装置安装于盲孔之外，不仅不利于电子设备厚度空间上的压缩，也会造成指纹识别装置无法稳定固定于显示屏下方，影响指纹识别装置的指纹识别性能，更严重的，会造成指纹识别装置和显示屏的损坏。
基于此，本申请实施例在上述指纹识别装置200的基础上，进一步地对电子设备的中框以及指纹识别装置200进行改进设计，提高指纹识别装置200在中框盲孔中的安装精度，提高指纹识别装置的可靠性。
图8示出了另一种指纹识别装置200的结构示意图。
如图8所示，在中框101的盲孔102中，设置有定位柱1021，该定位柱1021位于盲孔102的边缘区域，可选地，其高度可以高于盲孔102的深度。
对应地，如图8所示，指纹识别装置200中，例如，在指纹识别装置200的边缘区域中设置有定位孔201，该定位孔201贯穿指纹识别装置200中的电路板230、补强板250、支撑层260、遮光层270、泡棉层280以及各层之间的连接胶层。定位柱1021位于该定位孔201中，以对该指纹识别装置200的安装位置进行限制，换言之，在指纹识别装置200的安装过程中，需要将其定位孔201与定位柱1021对应安装，则进一步的，限定了整个指纹识别装置200在盲孔中的安装位置。
可选地，该定位孔201包括但不限于是圆形孔或者腰圆形孔，对应的，定位柱1021的横截面包括但不限于是圆形或者腰圆形。
可选地，盲孔102中的定位柱1021可以与中框101一体成型，或者也可以单独安装于中框中。
通过该实施方式，在指纹识别装置的安装过程中，不仅仅依靠于盲孔限定指纹识别装置的安装位置，进一步加上定位柱限定指纹识别装置的安装位置，能够提高安装精度，且定位柱与指纹识别装置中通孔的配合，不仅安装精度高，而且便于安装工艺的实现。
作为示例，图9示出了图8中指纹识别装置200的俯视示意图。
如图9所示，该指纹识别装置200中设置有两个定位孔201，该两个定位孔201分别设置于指纹识别装置200的对角位置，且位于指纹识别装置200的边缘区域。
可以理解的是，在中框盲孔102的边缘区域，对应的设置有两个定位柱1021，用于配合上述两个定位孔201的安装。
采用图9中所示的技术方案，通过在指纹识别装置200中设置两个定位 孔201，以进行指纹识别装置200的安装，相比于仅在指纹识别装置200中设置一个定位孔，安装精度得到进一步提高。且在图9所示的技术方案中，两个定位孔201分别设置于指纹识别装置200的对角位置，不会对指纹识别装置200中的指纹传感器220和处理单元240造成影响，且两个定位孔201之间的距离较大，便于指纹识别装置的安装操作。
可选地，在本申请实施例中，指纹识别装置200中包括但不限定设置有1个或者2个定位孔，该定位孔的位置除了为指纹识别装置200的对角位置以外，还可以设置于指纹识别装置的两边位置等其它任意位置。本申请实施例对该定位孔的数量、形状以及位置均不做具体限定。
在上述申请实施例中，以指纹识别装置中包括单个指纹传感器220和单个处理单元240为例，说明了相关的技术方案。
可选地，在本申请实施例中，指纹识别装置还可以包括多个指纹传感器220和/或多个处理单元240。具体地，多个指纹传感器220并排设置于电路板230上方，以拼接形成一个指纹传感器组件，其中多个指纹传感器220的感应区域共同构成指纹识别装置200在显示屏中的指纹检测区域，从而扩大指纹检测区域，实现全屏指纹识别。
具体地，多个处理单元240并排设置于电路板230上方，以拼接形成一个处理单元组件。该处理单元组件与指纹传感器组件相邻设置，用于处理上述指纹传感器组件获取的指纹图像信号。
作为一个可选实施例，该中框的盲孔102开设在中框101的中间区域或中间偏下区域，以使至少一个指纹传感器220的指纹检测区域位于显示屏103的显示区域的中间位置或者中间偏下位置，便于用户握持进行指纹识别，从而提升用户体验。
以上结合附图详细描述了本申请的优选实施方式，但是，本申请并不限于上述实施方式中的具体细节，在本申请的技术构思范围内，可以对本申请的技术方案进行多种简单变型，这些简单变型均属于本申请的保护范围。
例如，在上述具体实施方式中所描述的各个具体技术特征，在不矛盾的情况下，可以通过任何合适的方式进行组合，为了避免不必要的重复，本申请对各种可能的组合方式不再另行说明。
又例如，本申请的各种不同的实施方式之间也可以进行任意组合，只要其不违背本申请的思想，其同样应当视为本申请所公开的内容。
本申请实施例还提供了一种电子设备，该电子设备可以包括：
显示屏；
上述任一申请实施例的指纹识别装置，以及
中框，该中框的上表面设置有盲孔，该盲孔位于显示屏下方，该指纹识别装置安装于中框的盲孔中，以使得指纹识别装置设置于显示屏下方，以进行屏下指纹识别。
该电子设备可以为任何具有显示屏的电子设备。该显示屏可以为OLED显示屏、LCD显示屏或者相关技术中其它类型的显示屏。具体可以对应于前述实施例中的显示屏103，其相关说明可以参考可以参照前述关于显示屏103的描述，为了简洁，在此不再赘述。
该中框可以对应于前述实施例中的中框101，其相关说明可以参考可以参照前述关于中框101的描述，为了简洁，在此不再赘述。
可选地，在本申请的一个实施例中，中框的盲孔中形成有至少一个定位柱，该定位柱用于与指纹识别装置中的定位孔对应，以将指纹识别装置固定安装于所述盲孔中。
可选地，在本申请的一个实施例中，中框的盲孔设置于中框的中间区域或者中间偏下区域，以使指纹识别装置的指纹检测区域位于显示屏的显示区域的中间位置或者中间偏下位置。
可选地，在本申请一个实施例中，指纹识别装置与显示屏的发光层之间的距离小于预设阈值，作为示例，该预设阈值为600μm。
应理解，本申请实施例中的具体的例子只是为了帮助本领域技术人员更好地理解本申请实施例，而非限制本申请实施例的范围。
应理解，在本申请实施例和所附权利要求书中使用的术语是仅仅出于描述特定实施例的目的，而非旨在限制本申请实施例。例如，在本申请实施例和所附权利要求书中所使用的单数形式的“一种”、“上述”和“该”也旨在包括多数形式，除非上下文清楚地表示其他含义。
本领域普通技术人员可以意识到，结合本文中所公开的实施例描述的各示例的单元，能够以电子硬件、计算机软件或者二者的结合来实现，为了清楚地说明硬件和软件的可互换性，在上述说明中已经按照功能一般性地描述了各示例的组成及步骤。这些功能究竟以硬件还是软件方式来执行，取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用 来使用不同方法来实现所描述的功能，但是这种实现不应认为超出本申请的范围。
在本申请所提供的几个实施例中，应该理解到，所揭露的系统、装置，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另外，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口、装置或单元的间接耦合或通信连接，也可以是电的，机械的或其它的形式连接。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本申请实施例方案的目的。
另外，在本申请各个实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以是两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现，也可以采用软件功能单元的形式实现。
所述集成的单元如果以软件功能单元的形式实现并作为独立的产品销售或使用时，可以存储在一个计算机可读取存储介质中。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分，或者该技术方案的全部或部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质中，包括若干指令用以使得一台计算机设备(可以是个人计算机，服务器，或者网络设备等)执行本申请各个实施例所述方法的全部或部分步骤。而前述的存储介质包括：U盘、移动硬盘、只读存储器(Read-Only Memory，ROM)、随机存取存储器(Random Access Memory，RAM)、磁碟或者光盘等各种可以存储程序代码的介质。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (23)

  1. 一种指纹识别装置，其特征在于，用于设置在电子设备中框的上表面的盲孔中，且位于所述电子设备的显示屏下方，所述指纹识别装置包括：
    指纹传感器；
    光学组件，设置于所述指纹传感器上方，用于引导经过所述显示屏上方的手指反射或者散射后，再穿过所述显示屏的指纹光信号进入到所述指纹传感器中；
    处理单元，设置于所述指纹传感器的一侧，用于处理所述指纹传感器获取的指纹图像信号，处理后的所述指纹图像信号用于指纹识别；
    电路板，设置于所述指纹传感器和所述处理单元下方，所述指纹传感器和所述处理单元通过所述电路板安装于所述电子设备的中框的盲孔中，所述电路板用于传输所述指纹传感器和所述处理单元的信号。
  2. 根据权利要求1所述的指纹识别装置，其特征在于，所述指纹识别装置还包括：
    遮光层，其中形成有第一开窗，所述第一开窗设置于所述指纹传感器上方，所述第一开窗用于通过所述指纹光信号以被所述指纹传感器接收。
  3. 根据权利要求2所述的指纹识别装置，其特征在于，所述光学组件位于所述第一开窗中。
  4. 根据权利要求2所述的指纹识别装置，其特征在于，所述遮光层中还形成有第二开窗，所述指纹传感器连接所述电路板的第一引线的顶部区域以及所述处理单元连接所述电路板的第二引线的顶部区域均位于所述第二开窗中。
  5. 根据权利要求4所述的指纹识别装置，其特征在于，所述指纹传感器的第一边设置有所述第一引线，所述处理单元的第一边设置有所述第二引线，所述指纹传感器的第一边与所述处理单元的第一边相邻。
  6. 根据权利要求5所述的指纹识别装置，其特征在于，所述指纹传感器的第一边与所述处理单元的第一边相互平行。
  7. 根据权利要求4至6中任一项所述的指纹识别装置，其特征在于，所述第一引线和/或所述第二引线包覆有引线保护胶，所述引线保护胶的高度不大于150μm。
  8. 根据权利要求7所述的指纹识别装置，其特征在于，所述遮光层的 上表面不高于引线保护胶的上表面的最高点，和/或，所述遮光层的上表面不高于所述光学组件的上表面的最高点。
  9. 根据权利要求2至8中任一项所述的指纹识别装置，其特征在于，所述指纹识别装置还包括：
    支撑层，设置于所述电路板与所述遮光层之间，用于支撑所述遮光层；
    所述支撑层中设置有第三开窗，所述指纹传感器和所述处理单元设置于所述第三开窗中。
  10. 根据权利要求9所述的指纹识别装置，其特征在于，所述支撑层的上表面不高于所述光学组件的上表面的最高点，且所述支撑层的上表面不高于所述处理单元的上表面。
  11. 根据权利要求2至10中任一项所述的指纹识别装置，其特征在于，所述指纹识别装置还包括：
    泡棉层，其中形成有第四开窗，所述第四开窗设置于所述指纹传感器上方，所述第四开窗用于通过所述指纹光信号以被所述指纹传感器接收，所述第四开窗的面积不小于所述遮光层中所述第一开窗的面积。
  12. 根据权利要求11所述的指纹识别装置，其特征在于，所述第四开窗位于所述光学组件的正上方。
  13. 根据权利要求1至12中任一项所述的指纹识别装置，其特征在于，所述中框的盲孔中形成有定位柱，所述指纹识别装置还包括：
    定位孔，与所述定位柱对应，以将所述指纹识别装置固定安装于所述盲孔中。
  14. 根据权利要求13所述的指纹识别装置，其特征在于，所述定位孔的数量为多个，设置于所述指纹识别装置的边缘区域。
  15. 根据权利要求13所述的指纹识别装置，其特征在于，所述定位柱的高度不低于所述盲孔的深度，和/或，所述定位孔为圆形或者腰圆形。
  16. 根据权利要求1至15中任一项所述的指纹识别装置，其特征在于，所述电路板为柔性电路板，所述指纹识别装置还包括：
    补强板，设置于所述电路板下方并位于所述电子设备的中框的盲孔中，所述补强板用于支撑所述电路板及其上方的所述指纹传感器和所述处理单元。
  17. 根据权利要求1至16中任一项所述的指纹识别装置，其特征在于， 所述光学组件包括：
    微透镜阵列；
    至少一光阑层，设置于所述微透镜阵列下方，所述至少一光阑层中每层光阑层中形成有多个通光小孔；
    所述微透镜阵列用于将所述指纹光信号汇聚至所述至少一光阑层的多个通光小孔中，所述指纹光信号通过所述多个通光小孔传输至所述指纹传感器以进行光学指纹成像。
  18. 根据权利要求17所述的指纹识别装置，其特征在于，所述微透镜阵列中的每个微透镜对应于每层光阑层中的至少一个通光小孔，以及所述指纹传感器中的至少一个像素单元；
    所述指纹传感器用于接收至少一个方向的指纹光信号，以获取至少一张指纹图像的指纹图像信号。
  19. 根据权利要求1至18中任一项所述的指纹识别装置，其特征在于，所述指纹识别装置包括：
    多个所述指纹传感器，多个所述指纹传感器并排设置于所述电路板上方，以拼接形成一个指纹传感器组件；和/或，
    多个所述处理单元，多个所述处理单元并排设置于所述电路板上方，以拼接形成一个处理单元组件。
  20. 根据权利要求1至19中任一项所述的指纹识别装置，其特征在于，所述指纹识别装置与所述显示屏的发光层之间的距离小于600μm。
  21. 一种电子设备，其特征在于，包括：显示屏；
    如权利要求1至20中任一项所述的指纹识别装置；
    中框，所述中框的上表面设置有盲孔，所述盲孔位于所述显示屏下方，所述指纹识别装置安装于所述中框的盲孔中，以使得所述指纹识别装置设置于所述显示屏下方。
  22. 根据权利要求21所述的电子设备，其特征在于，所述中框的盲孔中形成有至少一个定位柱，所述定位柱用于与所述指纹识别装置中的定位孔对应，以将所述指纹识别装置固定安装于所述盲孔中。
  23. 根据权利要求21所述的电子设备，其特征在于，所述中框的盲孔设置于所述中框的中间区域或者中间偏下区域，以使所述指纹识别装置的指纹检测区域位于所述显示屏的显示区域的中间位置或者中间偏下位置。
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CN210955119U (zh) * 2019-12-03 2020-07-07 敦泰电子（深圳）有限公司 一种光学指纹识别模组及电子设备
CN211062062U (zh) * 2020-06-16 2020-07-21 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备

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