WO2022165770A1 - 芯片封装结构和电子设备 - Google Patents

芯片封装结构和电子设备 Download PDF

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Publication number
WO2022165770A1
WO2022165770A1 PCT/CN2021/075643 CN2021075643W WO2022165770A1 WO 2022165770 A1 WO2022165770 A1 WO 2022165770A1 CN 2021075643 W CN2021075643 W CN 2021075643W WO 2022165770 A1 WO2022165770 A1 WO 2022165770A1
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WO
WIPO (PCT)
Prior art keywords
chip
display screen
sensor chip
package structure
chips
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Application number
PCT/CN2021/075643
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English (en)
French (fr)
Inventor
武艳伟
Original Assignee
深圳市汇顶科技股份有限公司
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Filing date
Publication date
Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to PCT/CN2021/075643 priority Critical patent/WO2022165770A1/zh
Priority to CN202122185400.2U priority patent/CN216250727U/zh
Priority to CN202122181447.1U priority patent/CN216250726U/zh
Publication of WO2022165770A1 publication Critical patent/WO2022165770A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

Definitions

  • the present application relates to the field of electronic technology, and more particularly, to a chip packaging structure and an electronic device.
  • the present application provides a chip package structure and an electronic device, which can optimize the overall performance and reduce the overall thickness of the electronic device.
  • a chip packaging structure for being disposed under a display screen of an electronic device, comprising: a circuit board; a plurality of chips, at least part of the plurality of chips is disposed above the circuit board, and the plurality of The chip is packaged on the circuit board; wherein, the plurality of chips include at least two of a fingerprint sensor chip, an ambient light sensor chip and a vital sign detection sensor chip, and the fingerprint sensor chip is used to receive a finger that passes over the display screen and then passes through
  • the fingerprint light signal of the display screen is used for fingerprint detection
  • the vital sign detection sensor is used for receiving the vital sign light signal passing through the display screen after passing through the finger
  • the ambient light sensor chip is used for receiving the vital sign light signal passing through the display screen.
  • the ambient light signal of the display screen for ambient light detection.
  • the present application provides a chip package structure, which includes a plurality of chips including at least two of a fingerprint sensor chip, an ambient light sensor chip, and a vital sign detection sensor, so that fingerprint detection, ambient light detection, and vital signs detection can be realized. At least two functions in the physical sign detection are beneficial to improve the overall performance of the electronic device. Further, the plurality of chips in the chip packaging structure are packaged on the circuit board and arranged under the display screen of the electronic device, and do not need to occupy the surface space of the electronic device and the gap area between the display screen and the middle frame, and do not require The additional package body has a thinner thickness, which is convenient for the overall design of the electronic device, and is also conducive to the development of the thinning and lightening of the electronic device.
  • the embodiment of the present application integrates a plurality of chips with different functions in the same chip package, and the same chip package can be used.
  • the packaging process performs the packaging of multiple different functional chips, so the packaging process can be effectively reduced, thereby improving production efficiency and reducing production costs.
  • the plurality of chips include the vital sign detection sensor, and the chip package structure further includes: a light source of the vital sign detection sensor; the light source is arranged on one side of the vital sign detection sensor and is packaged in In the circuit board, the light source includes at least one of the following light sources: a red light source, a green light source and an infrared light source.
  • the plurality of chips include the fingerprint sensor chip
  • the circuit board is a flexible circuit board
  • the chip packaging structure further includes: a first reinforcing plate disposed under the flexible circuit board for The flexible circuit board is supported; a window is arranged in the flexible circuit board, and at least the fingerprint sensor chip among the plurality of chips is arranged above the first reinforcing plate and arranged in the window.
  • the first reinforcement plate includes a first reinforcement area and a second reinforcement area, at least the fingerprint sensor chip in the plurality of chips is disposed above the first reinforcement area, the The light source of the vital sign detection sensor is arranged above the circuit board area corresponding to the second reinforcement area; wherein, the upper surface of the second reinforcement area is lower than the upper surface of the first reinforcement area.
  • the first reinforcement plate is disposed on the upper surface of the middle frame of the electronic device, and the thickness of the second reinforcement region is smaller than the thickness of the first reinforcement region.
  • the chip package structure further includes: a second reinforcing plate, and the light source of the vital sign detection sensor is disposed above the circuit board area corresponding to the second reinforcing plate; wherein, the second reinforcing plate The upper surface of the strong plate is lower than the upper surface of the first reinforcing plate.
  • both the first reinforcing plate and the second reinforcing plate are disposed on the upper surface of the middle frame of the electronic device, and the thickness of the second reinforcing plate is smaller than the thickness of the first reinforcing plate thickness; or, the first reinforcement plate is arranged on the upper surface of the middle frame of the electronic equipment, the second reinforcement plate is arranged in the groove of the middle frame of the electronic equipment, the thickness of the second reinforcement plate is not greater than the thickness of the first reinforcing plate.
  • the chip package structure further includes: a third reinforcing plate, an edge region of the third reinforcing plate is bent upward to form a stepped structure, and the light source of the vital sign detection sensor is disposed on the third reinforcing plate.
  • a third reinforcing plate Above the circuit board area corresponding to the middle area of the strong plate; wherein, the upper surface of the middle area of the third reinforcing plate is lower than the upper surface of the first reinforcing plate.
  • the first reinforcing plate is disposed on an upper surface of a middle frame of the electronic device, the middle frame is formed with a through hole, and the step structure of the third reinforcing plate is used to overlap the through hole. the edge of the hole.
  • the chip package structure further includes: the ambient light sensor chip, the ambient light sensor chip and/or the vital sign detection sensor and the light source of the vital sign detection sensor are disposed on the third reinforcement together with the light source of the vital sign detection sensor
  • the middle area of the board corresponds to the top of the board area.
  • the chip package structure further includes: a foam layer disposed above the edge region of the circuit board; the upper surface of the foam layer is attached to the display screen, the foam layer, the The circuit board and the display screen form a cavity structure for protecting the plurality of chips.
  • the foam layer is attached to a first protective layer area in the protective layer of the display screen, and the first protective layer area is a surrounding area of the first opening in the protective layer, and the first protective layer area is A window is correspondingly disposed above the plurality of chips for transmitting light signals passing through the display screen to the plurality of chips.
  • the plurality of chips include the fingerprint sensor chip, and the foam layer is further disposed between the fingerprint sensor chip and other chips in the plurality of chips except the fingerprint sensor chip.
  • the foam layer is attached to a second protective layer area in the protective layer of the display screen, and the second protective layer area is a surrounding area of a plurality of second windows in the protective layer, The plurality of second windows are disposed above the plurality of chips in a one-to-one correspondence, and are used for transmitting light signals passing through the display screen to the plurality of chips.
  • the plurality of chips include the vital sign detection sensor, and the chip package structure further includes a light source of the vital sign detection sensor; the foam layer is further disposed between the vital sign detection sensor and its light source .
  • the foam layer is attached to a third protective layer area in the protective layer of the display screen, and the third protective layer area is the surrounding area of the two third openings in the protective layer,
  • the two third windows are disposed above the vital sign detection sensor and its light source in a one-to-one correspondence, and are used to transmit the light signal of the light source to the finger, and transmit the light signal passing through the finger and through the display screen to the finger.
  • Vital signs detection sensor is disposed above the vital sign detection sensor and its light source in a one-to-one correspondence, and are used to transmit the light signal of the light source to the finger, and transmit the light signal passing through the finger and through the display screen to the finger.
  • the plurality of chips further include the ambient light sensor, the light source of the vital sign detection sensor is disposed adjacent to the ambient light sensor, and the foam is not disposed between the light source and the ambient light sensor Floor.
  • the plurality of chips include the fingerprint sensor chip and/or the ambient light sensor chip
  • the chip package structure further includes: a light shielding layer disposed on the periphery of the fingerprint sensor chip above the photosensitive area and/or Or around the ambient light sensor chip above the photosensitive area.
  • the chip package structure further includes: an optical component disposed on the upper surface of the fingerprint sensor chip for guiding the fingerprint light signal into the fingerprint sensor chip, and the light shielding layer is disposed on the optical components around.
  • the chip package structure further includes: an optical layer, disposed on the upper surface of the ambient light sensor chip, for entering the ambient light sensor chip through the light signal of the target wavelength band, and the light shielding layer is disposed around the optical layer.
  • the chip package structure further includes: a protective adhesive layer disposed under the light shielding layer for supporting the light shielding layer.
  • the protective adhesive layer is further disposed around the plurality of chips for protecting the plurality of chips; and/or, the protective adhesive layer covers between the plurality of chips and the circuit board lead to protect the lead.
  • the chip packaging structure further includes: a control chip, disposed on one side of the fingerprint sensor chip and packaged on the circuit board; the circuit board is used to transmit the information of the fingerprint sensor chip and the control chip.
  • the control chip is used to control the operation of the fingerprint sensor chip, and/or process the signal generated by the fingerprint sensor chip to perform fingerprint detection.
  • control chip is also used to control the operation of the ambient light sensor chip, and/or the control chip is also used to control the operation of the vital sign detection sensor.
  • the chip package structure further includes: a connector and/or a passive element, and the plurality of chips share the connector and/or the passive element.
  • the plurality of chips are packaged on the circuit board by means of chip-on-board COB packaging.
  • the chip packaging structure is fixedly arranged on the middle frame of the electronic device so as to be arranged below the display screen; or, the chip packaging structure is fixedly connected to the display screen through a foam layer and an adhesive layer , to be placed below the display.
  • the chip package structure is configured to be disposed under the middle region or the lower middle region of the display screen.
  • an electronic device comprising: a display screen; and a chip packaging structure according to the first aspect or any possible implementation manner of the first aspect, the chip packaging structure is disposed below the display screen , for receiving the light signal passing the finger above the display screen and passing through the display screen and/or the ambient light signal passing through the display screen, so as to realize at least two of the following detection functions: fingerprint detection, vital sign detection and ambient light detection.
  • FIG. 1 is a schematic front view of an electronic device to which this application can be applied.
  • Fig. 2 is a schematic cross-sectional view of the electronic device shown in Fig. 1 along the direction A-A'.
  • FIG. 3 is a schematic structural diagram of a chip packaging structure provided by an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of another chip packaging structure provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of another chip packaging structure provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of another chip packaging structure provided by an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of another chip packaging structure provided by an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of another chip packaging structure provided by an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of another chip package structure provided by an embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of another chip package structure provided by an embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of another chip packaging structure provided by an embodiment of the present application.
  • FIG. 12 is a schematic structural diagram of another chip package structure provided by an embodiment of the present application.
  • FIG. 13 is a schematic top view of a chip packaging structure provided by an embodiment of the present application.
  • FIG. 14 is a schematic top view of another chip package structure provided by an embodiment of the present application.
  • FIG. 15 is a schematic top view of another chip package structure provided by an embodiment of the present application.
  • FIG. 16 is a schematic bottom perspective view corresponding to the chip package structure shown in FIG. 15 .
  • FIG. 17 is a schematic structural diagram of another chip package structure provided by an embodiment of the present application.
  • FIG. 18 is a schematic structural diagram of another chip package structure provided by an embodiment of the present application.
  • FIG. 19 is a schematic structural diagram of another chip package structure provided by an embodiment of the present application.
  • FIG. 20 is a schematic structural diagram of another chip packaging structure provided by an embodiment of the present application.
  • FIG. 21 is a schematic structural diagram of another chip packaging structure provided by an embodiment of the present application.
  • FIG. 22 is a schematic structural diagram of another chip packaging structure provided by an embodiment of the present application.
  • FIG. 23 is a schematic top view of another chip package structure provided by an embodiment of the present application.
  • FIG. 24 is a schematic top view of another chip package structure provided by an embodiment of the present application.
  • FIG. 25 is a schematic top view of another chip package structure provided by an embodiment of the present application.
  • the technical solutions of the embodiments of the present application can be applied to various electronic devices, and are especially applicable to three types of 3C electronic products related to computers and their peripherals, communications and consumer electronics, for example, Smartphones, laptops, tablets, smart wearables, home appliances, gaming devices, etc.
  • the technical solutions involved in the embodiments of the present application also involve other types of electronic devices such as automotive electronics, which are not specifically limited in the embodiments of the present application.
  • FIG. 1 shows a schematic front view of an electronic device 10 to which the present application can be applied.
  • the electronic device 10 includes a middle frame 120 and a display screen 110 with a gap area 130 between the display screen 110 and the middle frame 120 .
  • the area where the display screen 110 is located as shown in FIG. 1 is the display area of the display screen 110 , and a cover glass (CG) may be provided in the gap area 130 to protect the display screen 110 and provide the user's finger 140 touch interface.
  • CG cover glass
  • the display screen 110 may be a self-luminous display screen, which uses display units having self-luminescence as display pixels.
  • the display screen 110 may be an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display screen or a micro light-emitting diode (Micro-LED) display screen.
  • the display screen 110 may also be a liquid crystal display (Liquid Crystal Display, LCD) or other passive light-emitting display screens, which are not limited in this embodiment of the present application.
  • the display screen 110 may also be specifically a touch display screen, which can not only display a picture, but also detect a user's touch or pressing operation, thereby providing a human-computer interaction interface for the user.
  • the electronic device 10 may include a touch sensor, and the touch sensor may be specifically a touch panel (Touch Panel, TP), which may be provided on the surface of the display screen 110, for example, it may be integrally provided In the cover glass layer, it can also be partially integrated or integrally integrated into the display screen 110 to form the touch display screen.
  • touch panel Touch Panel
  • the middle frame 120 shown in FIG. 1 may be the outer frame of the electronic device 10 .
  • the outer frame shown in It is a frame that carries various components inside an electronic device, including but not limited to motherboards, batteries, cameras, cables, various sensors, microphones, earpieces and other components.
  • the electronic device 10 is provided with an ambient light sensor for sensing ambient light.
  • the mainstream ambient light sensor is a Land Grid Array (LGA) package or a quad flat leadless (Quad Flat).
  • LGA Land Grid Array
  • QFN quad flat leadless packaging and other packaging methods have a package body, so they have a larger thickness.
  • the first area 101 is a partial area located on the upper part of the electronic device in the above-mentioned gap area 130 .
  • the position space of the above-mentioned gap area 130 that is, the first area 101 will become smaller and smaller, resulting in the limited arrangement of the ambient light sensor.
  • the ambient light sensor is separately disposed in the second area 102 shown in FIG. 1 , and the second area 102 is the upper area of the display screen 110 .
  • the ambient light sensor is provided separately, and has a large thickness and high cost, which is not conducive to the overall design of the electronic device, and restricts and affects the overall performance and thickness of the electronic device.
  • a vital sign detection device that can be used to detect vital sign information in electronic equipment such as mobile communication equipment, so as to provide users with their own vital signs. Sign information and health status are also a design to improve the overall performance of electronic devices.
  • a vital sign detection sensor can be used to detect the detection of various vital sign information of the user, the vital sign information including but not limited to the user's blood oxygen, heart rate, blood pressure, respiratory rate, etc.
  • the vital sign information including but not limited to the user's blood oxygen, heart rate, blood pressure, respiratory rate, etc.
  • the vital sign detection sensor may include a photo sensor (Photo Detector, PD), which can measure the percentage of oxyhemoglobin in the total hemoglobin by using the change in the amount of light absorption by blood, so as to obtain the arterial blood oxygen saturation SPO2 can be used to detect the blood oxygen information of the user, or, it can also use the influence of pulse beating on the optical signal to measure the photoplethysmographic (PPG) signal within a certain time range, through analysis and research The features in the PPG signal and the multiple vital sign information contained in it are extracted, which can facilitate users to know their own physical status at any time, and provide help for the early diagnosis and prevention of cardiovascular system-related diseases.
  • PD Photo Detector
  • the vital sign detection sensor is separately arranged on the surface of the electronic device, for example, on the side of the electronic device or the non-display area on the front of the electronic device.
  • the vital sign detection sensor needs to occupy a certain design space of the whole machine, and has a large
  • the thickness and high cost of the electronic device are also not conducive to the overall design of the electronic device, which restricts and affects the overall performance and thickness of the electronic device.
  • the present application provides a chip package structure, which includes a plurality of chips including at least two of a fingerprint sensor chip, an ambient light sensor chip and a vital sign detection sensor, so that fingerprint detection, environmental At least two functions of light detection and vital sign detection are beneficial to improve the overall performance of electronic devices.
  • the chip packaging structure is used to be arranged under the display screen of the electronic device, and does not need to occupy the surface space of the electronic device and the gap area between the display screen and the middle frame, and does not need an additional package body, so it has a relatively thin
  • the thickness of the electronic device is convenient for the overall design of the electronic device, and it is also conducive to the thinning and light development of the electronic device.
  • Fig. 2 shows a schematic cross-sectional view of the electronic device 10 shown in Fig. 1 along the direction A-A'.
  • an embodiment of the present application provides a chip package structure 200 , which is configured to be disposed below the display screen 120 of the electronic device 10 .
  • the chip package structure 200 is configured to be disposed below the third area 103 of the display screen 120 , and the third area 103 is the middle area or the lower middle area in the display screen 120 , which may be the common touch area of the user's finger .
  • the chip package structure 200 may include: a plurality of chips, for example, the first chip 210 and the second chip 220 shown in FIG. 1 , and a circuit board 230 , at least part of the plurality of chips are disposed on the circuit board 230 above, and the plurality of chips are packaged on the circuit board 230;
  • the plurality of chips include at least two of a fingerprint sensor chip, an ambient light sensor chip, and a vital sign detection sensor, and the fingerprint sensor chip is used to receive the fingerprint light signal passing through the finger above the display screen and passing through the display screen for fingerprinting.
  • the vital sign detection sensor is used for receiving the light signal carrying the vital sign information of the finger passing through the finger and passing through the display screen to detect the vital sign information
  • the ambient light sensor chip is used for receiving the ambient light signal passing through the display screen for ambient light detection.
  • the plurality of chips are unpackaged bare chips (die), or may also be referred to as bare chips, which may be disposed on the circuit board 230 by means of chip on board (COB) packaging.
  • the circuit board 230 includes, but is not limited to, a printed circuit board (Printed Circuit Board, PCB), a flexible printed circuit board (Flexible Printed Circuit, FPC), or a rigid-flex board.
  • the conductive adhesive layer is adhered to the circuit board, and the electrical connection between the chip and the circuit board is realized by wire bonding (Wire Bonding, WB).
  • the plurality of chips may be connected to the circuit board 230 through die attach adhesive (Die Attach Film, DAF), silver glue, and solder paste.
  • the packaged chip package structure 200 has a smaller thickness, thereby realizing an ultra-thin design of the chip package structure 200 .
  • the embodiment of the present application integrates a plurality of chips with different functions in the same chip package, and the same packaging process can be used.
  • the packaging of multiple different functional chips can be performed, thereby effectively reducing the packaging process, thereby improving production efficiency and reducing production costs.
  • the chip packaging structure 200 may only include one interface module, such as a connector, which can realize information interaction between multiple chips with different functions and other functional modules in the electronic device, and multiple Auxiliary electrical components required by chips with different functions, such as passive components such as resistors, capacitors, and inductors, may be shared with each other depending on the specific situation.
  • the technical solutions of the embodiments of the present application further reduce the process cost and the space occupied by the chips with different functions in the electronic device, which is more beneficial to the electronic equipment.
  • FIG. 3 shows a schematic structural diagram of a chip packaging structure 200 provided by an embodiment of the present application.
  • a plurality of chips can be a fingerprint sensor chip 201 and a vital sign detection sensor chip 202, and the fingerprint sensor chip 201 and the vital sign detection sensor chip 202 are disposed on the surface of the rigid circuit board 231 through an adhesive layer.
  • the circuit board 231 may be one of the types of the above-mentioned circuit boards 230, which may have a rigid base material and electrically transmitting circuit layers, and as an example, the rigid circuit board 231 may be a PCB.
  • the fingerprint sensor chip 201 and the vital sign detection sensor chip 202 are disposed adjacent to each other. In the direction perpendicular to the display screen, the two chips can be located in the orthographic projection of the finger 140.
  • both the fingerprint sensor chip 201 and the vital sign detection sensor chip 202 can receive the light signal after passing through the finger 140, so that when the finger is pressed, the fingerprint information and the vital sign information can be detected at the same time, so as to perform both fingerprint detection and vital sign detection. a function.
  • the vital sign detection sensor chip 202 includes a light sensor, for example, the light sensor includes, but is not limited to, at least one photodiode.
  • the vital sign detection sensor chip 202 is used to receive the finger light signal passing through the finger 140 above the display screen and passing through the display screen, and the finger light signal carries vital signs such as blood oxygen, pulse, blood pressure, respiratory rate, etc. of the finger Sign information, the vital sign detection sensor chip 202 can convert the finger light signal into a corresponding electrical signal after receiving the finger light signal, and the electrical signal can be used for processing to obtain vital signs such as blood oxygen saturation or pulse value, blood pressure value, respiratory rate value, etc. parameter.
  • the vital sign detection sensor chip 202 may also include other related auxiliary circuits such as signal processing circuits and signal control circuits.
  • the electrical signal detected by the detector is subjected to signal processing to obtain vital sign parameters.
  • a partial circuit or all circuits of the signal processing circuit may be integrated in the vital sign detection sensor chip 202, or a partial circuit or all circuits of the signal processing circuit may also be integrated.
  • a chip may be formed separately and disposed outside the vital sign detection sensor chip 202 .
  • the chip package structure 200 of this embodiment of the present application further includes: a light source 203 for emitting light signals to the user
  • the finger 140 generates a finger light signal passing through the user's finger 140 and is received by the vital sign detection sensor chip 202 .
  • the light source 203 is disposed on one side of the vital sign detection sensor chip 202 and is also packaged on the rigid circuit board 231 .
  • the light source 203 includes, but is not limited to, at least one light emitting diode (Light Emitting Diode, LED).
  • the cathode of the at least one LED is connected to the rigid circuit board 231 through a conductive adhesive layer, and the anode of the at least one LED is bonded to the rigid circuit board 231 by wire bonding, so as to realize the electrical connection between the at least one LED and the rigid circuit board 231 .
  • the chip package structure 200 of the embodiments of the present application may not include a light source, and the vital sign detection sensor chip 202 may reuse the display screen as the light source.
  • the finger light signal of 140 is received by the vital sign detection sensor chip 202 .
  • the vital sign detection sensor chip 202 is configured with a light source 203 alone, and the light source 203 is not limited to the light-emitting band of the display screen.
  • the light source 203 can emit light in the visible light band except for In addition to the signal, the light signal in the non-visible light band can also be emitted, and the light source 203 is not limited to the lighting control of the display screen, and the control method of the light source 203 is relatively simple and flexible. Therefore, through the technical solutions of the embodiments of the present application, the flexibility and accuracy of vital sign detection can be improved, and the types of detectable vital sign information can also be increased, thereby improving user experience.
  • the vital sign detection sensor chip 202 can be used to measure the blood oxygen saturation of the user
  • the light source 203 can correspondingly include a red light source and an infrared light source, and the intensity of the red light signal passing through the finger and the infrared light passing through the finger Signal strength to obtain the user's blood oxygen saturation information.
  • the vital sign detection sensor chip 202 can be used to measure the user's pulse, blood pressure, respiratory rate and other information
  • the light source 203 can correspondingly include a red light source and/or a green light source.
  • the intensity change of the red light signal and/or the intensity of the green light signal passing through the finger can obtain the pulse wave signal of the user, and then obtain the user's pulse, blood pressure, respiratory rate and other information.
  • the light source 203 in the vital sign detection sensor chip 202 may include one or more of the red light source, green light source and infrared light source mentioned above, and may also include any other wavelength band.
  • the light source is used to improve the accuracy of vital sign information detection, which is not specifically limited in this embodiment of the present application.
  • the vital sign detection sensor chip 202 in the embodiment of the present application is described above, and the fingerprint sensor chip 201 is described below.
  • the fingerprint sensor chip 201 may include: a pixel array 2011 formed by a plurality of pixels, and a related circuit structure for controlling the pixel array 2011 .
  • an optical component 2012 is further disposed above the fingerprint sensor chip 201 .
  • the optical component 2012 is used to guide the fingerprint light signal passing through the display screen to enter the fingerprint sensor chip 201 after being reflected or scattered by the finger above the display screen, so as to form a fingerprint image of the finger.
  • the optical assembly 2012 may include: a microlens array and at least one diaphragm layer disposed under the microlens array.
  • the microlens array includes a plurality of microlenses, and each microlens is used for condensing the light signal above it and transmitting it to the diaphragm layer below it.
  • the diaphragm layer is made of light-absorbing material, and is provided with a plurality of light-passing holes, which are used to select the direction of the light signal after the microlens converges, so that the light signal in the target direction passes through the light-passing hole.
  • the small hole enters the fingerprint sensor chip 201, and the stray light signal in the non-target direction is absorbed by the light absorbing material that does not pass through the area where the small hole is located, thereby preventing the stray light signal from interfering with fingerprint imaging.
  • the pixel array 2011 in the fingerprint sensor chip 201 is used to convert the light signal passing through the diaphragm layer to form a corresponding fingerprint image.
  • At least a part of the above-mentioned optical component 2012 may be integrated into the fingerprint sensor chip 201 , or may be independently disposed outside the fingerprint sensor chip 201 .
  • the above-mentioned optical component 2012 can also be other light guiding structures, such as a collimator layer, with a plurality of collimation units or a micro-hole array,
  • the specific structure of the optical component 2012 is not limited in this embodiment of the present application.
  • the optical component adopts the structure shown in FIG. 3 .
  • the fingerprint device based on the imaging of the collimator layer, it uses a microlens array to condense optical signals, and uses one or more layers of light
  • the diaphragm layer guides the optical signal in the direction, which can further improve the quality of the fingerprint optical signal, thereby improving the fingerprint imaging performance of the fingerprint sensor chip 201 .
  • the display screen 110 may be an OLED display screen, which may include a cover plate 111 , a light-emitting layer 112 and a protective layer 113 .
  • the cover plate 111 may be the glass cover plate CG mentioned above
  • the light-emitting layer 112 may be an OLED organic light-emitting panel
  • the protective layer 113 may be understood as the rear panel of the display screen 110, which has a light-shielding layer.
  • the protective layer 113 can be a black sheet layer or a printed layer for shielding light, which includes at least a part of a metal layer, such as copper foil for heat dissipation, and can also include foam layer for buffering and protection.
  • the metal layer may be disposed under the foam layer, and the metal layer and the foam layer are connected by an adhesive layer.
  • the protective layer 113 is provided with a first window 1131 , and the first window 1131 is correspondingly disposed above the plurality of chips in the chip package structure 200 for transmitting the optical signal passing through the display screen 110 to the plurality of chips.
  • the first opening 1131 in the protective layer 113 may be correspondingly disposed in the middle region or the middle-lower region of the display screen 110 , that is, correspondingly disposed in the above-mentioned third region 103 .
  • the size of the first opening 1131 can be correspondingly designed according to the size of the field of view of each chip in the chip package structure 200 below it in the display screen.
  • the structure of the display screen 110 is only a schematic illustration, and it may also include other necessary components required for the display screen.
  • the relevant technical description please refer to the relevant technical description, and details are not repeated here. .
  • the chip packaging structure 200 provided by the embodiment of the present application may be fixedly disposed on the middle frame 120 so as to be fixedly positioned below the display screen 110 .
  • the rigid circuit board 231 may be fixed by an adhesive layer. It is arranged on the upper surface of the middle frame 120 , or the rigid circuit board 231 is fixedly arranged in the groove of the middle frame 120 through an adhesive layer, so that the chip package structure 200 is fixedly arranged on the middle frame 120 .
  • the chip package structure 200 provided in this embodiment of the present application may further include: a foam layer 240 disposed on the surrounding area of the rigid circuit board 231 .
  • the foam layer 240 can be attached to the protective layer 113 of the display screen 110 , and the foam layer 240 , the rigid circuit board 231 and the display screen 110 can form a cavity structure for protecting fingerprints therein.
  • the sensor chip 201 , the vital sign detection sensor chip 202 and its light source 203 play the role of sealing and dustproof.
  • the foam layer 240 has elasticity and support. When the finger is pressed against the display screen, or the electronic device is subjected to other external forces, resulting in vibration or extrusion, the foam layer 240 can be used to buffer a part of the external force, thereby preventing the chips from being affected by collision or extrusion of the display screen, thereby improving the reliability of the chip package structure 200 .
  • the foam layer 240 can also be replaced by other materials with properties such as elasticity, support, light absorption, etc., for example, it can also be rubber, etc.
  • the foam layer is located in this application, only the material where the foam layer is located is the foam Cotton is exemplified, but is not specifically limited in this application.
  • the foam layer 240 can be attached to the first protective layer area in the protective layer 113 , and the first protective layer area is the surrounding area of the first opening 1131 in the protective layer 113 . .
  • the foam layer 240 can be connected to the protective layer 113 through an adhesive layer, and/or, the foam layer 240 can be connected to the rigid circuit board 231 through an adhesive layer, so as to further improve the mounting reliability of the chip package structure 200 .
  • the chip package structure 200 provided by the embodiment of the present application can be fixedly disposed under the display screen 110 by being disposed on the upper surface of the middle frame 120, and the rigid circuit board 231 and the display screen can also be connected only through the foam layer 240. Step 110 , the chip packaging structure 200 is fixedly disposed under the display screen 110 . In addition to being disposed on the upper surface of the middle frame 120, the chip package structure 200 may also be disposed on the middle frame 120 in other fixing manners, which are not specifically limited in this embodiment of the present application.
  • FIG. 4 shows a schematic structural diagram of another chip package structure 200 provided by an embodiment of the present application.
  • the foam layer 240 is not only disposed on the rigid circuit board 231 In addition to the surrounding area, it is also arranged between the fingerprint sensor chip 201 and the vital sign detection sensor chip 202 to prevent the light signal reflected or scattered by the vital sign detection sensor chip 202 from directly entering the fingerprint sensor chip 201 to interfere with fingerprint imaging, and to prevent The light signal reflected or scattered by the fingerprint sensor chip 201 directly enters the vital sign detection sensor chip 202 to interfere with vital sign information detection.
  • the foam layer 240 is attached to the second protective layer region in the protective layer 113 , and the second protective layer region It is the surrounding area of the plurality of second windows 1132 in the protective layer 113, wherein one of the second windows 1132 is correspondingly disposed above the fingerprint sensor chip 201 for transmitting the light signal passing through the display screen to the fingerprint sensor chip 201, and another A second opening 1132 corresponds to above the vital sign detection sensor chip 202 for transmitting the light signal passing through the display screen to the vital sign detection sensor chip 202 .
  • the foam layer 260 is also disposed between the vital sign detection sensor chip 202 and its light source 203 to prevent the light source 203 from emitting light.
  • the light signal directly enters the vital sign detection sensor chip 202 to interfere with the detection of vital sign information.
  • the foam layer 240 in the chip package structure 200 is attached to the third protection layer area in the protection layer 113 , and the third protection layer area is The surrounding area of the plurality of third windows 1133 in the protective layer 113, wherein one third window 1133 is correspondingly disposed above the vital sign detection sensor chip 202 for transmitting the light signal passing through the display screen to the vital sign detection sensor chip 202, another third window 1133 corresponds to the top of the light source 203, and is used for transmitting the light signal of the light source 203 through the display screen to the finger above the display screen.
  • the foam layer 240 , the rigid circuit board 231 and the display screen 110 can form three chambers, and the fingerprint sensor chip 201 , the vital sign detection sensor chip 202 and its light source 203 are respectively arranged in three chambers.
  • the two chips can perform two detection functions, optical crosstalk between them can be prevented, and the detection performance can be improved.
  • the upper surface of the foam layer 240 is located on the same plane, and the lower surface of the protective layer 113 of the display screen 110 is also located on the same plane, and the foam layer 240 and the protective layer 113 have relatively good adhesion. Therefore, the sealing and dustproof performance and chip protection performance are better.
  • a plurality of openings are formed in the protective layer 113 , and the foam layer 240 is attached to the surrounding area of the openings to form three cavities for protecting three chips.
  • the foam layer 240 is attached to the surrounding area of the openings to form three cavities for protecting three chips.
  • the foam layer 240 may include a first foam layer area 2401 and a second foam layer area 2402, wherein the second foam layer
  • the cotton layer area 2402 is located on the upper surface of the foam layer 240 between the fingerprint sensor chip 201 and the vital sign detection sensor chip 202, and/or the foam layer 240 located between the vital sign detection sensor chip 202 and its light source 203
  • the first A foam layer area 2401 is located around the rigid circuit board 231
  • the upper surface of the second foam layer area 2402 is higher than the upper surface of the first foam layer area 2401
  • the upper surface of the second foam layer area 2402 is attached
  • the upper surface of the first foam layer region 2401 is attached to the surrounding region of the first opening 1131 of the protective layer 113 in the display screen 110 .
  • the foam layer 240 , the rigid circuit board 231 and the display screen 110 can also form three chambers to protect multiple chips, and the processing cost of the display screen 110 can be reduced by this implementation.
  • the chip package structure 200 further includes: a light shielding layer 260 disposed in the photosensitive area of the fingerprint sensor chip 201 Around the top, the photosensitive area in the fingerprint sensor chip 201 can be the area where the pixel array 2011 is located.
  • the light shielding layer 260 may be disposed on the surrounding area of the optical component 2012.
  • the light shielding layer 260 may be light shielding ink.
  • the light shielding layer 260 can be used to absorb stray light and prevent the stray light from entering the fingerprint sensor chip 201, thereby reducing the interference of environmental factors on the fingerprint detection process. Further, providing the light shielding layer 260 can also improve the appearance of the chip package structure 200 under the display screen. Due to the light shielding layer 260, it can absorb the light signal emitted from the top of the display screen and reduce the reflection of the light signal back to the display screen. Intensity, to prevent the user from being able to observe the chip package structure under the display screen, thereby improving the user experience.
  • the chip package structure 200 further includes: a protective adhesive layer 250 disposed around the fingerprint sensor chip 201 and used to support The above-mentioned light shielding layer 260 .
  • the protective adhesive layer 250 can be a chip protective adhesive, which can be disposed around the fingerprint sensor chip 201 by dispensing glue, and can be used to protect the fingerprint sensor chip 201 and improve the stability of the fingerprint sensor 201 .
  • the protective adhesive layer 250 can be used as a lead protective adhesive for the leads of the fingerprint sensor chip 201 at the same time, and the lead protective adhesive can completely cover the leads to ensure the stability of the lead connections. and reliability.
  • the protective adhesive layer 250 can not only protect the fingerprint sensor chip 201, but also protect the leads of the fingerprint sensor chip 201, and can also be used as a support layer for supporting the light shielding layer 260. Therefore, through the implementation of the present application In the technical solution of the example, multiple functions can be realized by multiplexing the same protective adhesive layer, and the realization process is relatively convenient, and the performance of the chip packaging structure can be improved, and the production efficiency can also be improved.
  • the protective adhesive layer 250 can be arranged around the vital sign detection sensor chip 202 and its light source 203 in addition to being arranged around the fingerprint sensor chip 201 to protect the vital sign detection sensor chip. 202 and its light source 203.
  • FIG. 6 shows a schematic structural diagram of another chip package structure 200 provided by the embodiment of the present application.
  • the chip packaging structure 200 further includes: a control chip 204 .
  • the control chip 204 can be the driver chip of the fingerprint sensor chip 201, which is disposed on one side of the fingerprint sensor chip 201 and is also packaged on the rigid circuit board 231, and the control chip 204 is used for generating control signals In order to control the operation of the fingerprint sensor chip 201, and/or process the signal generated by the fingerprint sensor chip 201 to perform fingerprint detection and fingerprint identification.
  • control chip 204 can also be packaged on the rigid circuit board 231 through the COB packaging process, and the rigid circuit board 231 is used to realize signal transmission between the fingerprint sensor chip 201 and the control chip 204 .
  • control chip 204 includes, but is not limited to, a microcontroller unit (MCU), which may also be a digital signal processor (DSP), an image signal processor (image signal processor) , ISP), application specific integrated circuit (ASIC), off-the-shelf programmable gate array (field programmable gate array, FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components formed chip structure .
  • MCU microcontroller unit
  • DSP digital signal processor
  • ISP image signal processor
  • ASIC application specific integrated circuit
  • FPGA off-the-shelf programmable gate array
  • FPGA field programmable gate array
  • control chips 204 are arranged side by side on one side of the fingerprint sensor chip 201 , rather than at other positions on the rigid circuit board 231 , which can reduce the wiring between the control chip 204 and the fingerprint sensor chip 201 distance, so as to prevent the signal quality from being degraded during the transmission process and affecting the fingerprint detection effect.
  • control chip 204 can be used not only as a driver chip for the fingerprint sensor chip 201 but also as a driver chip for other chips on the rigid circuit board 231, for example, it can be used as a vital sign detection sensor chip 202 and/or a driver chip of the ambient light sensor chip, for controlling the operation of the vital sign detection sensor chip 202 and/or the ambient light sensor chip.
  • control chip 204 can also be used to process the electrical signal generated by the vital sign detection sensor chip 202 to obtain the vital sign information of the user, and/or process the electrical signal generated by the ambient light sensor chip to obtain the environmental light information.
  • the rigid circuit board 231 can be used to realize signal transmission among the vital sign detection sensor chip 202 , the ambient light sensor chip and the control chip 204 .
  • the light shielding layer 260 may be disposed on the upper surface of the control chip 204 to further absorb stray light and prevent the surface reflection of the control chip 204 The stray light signal entering the fingerprint sensor chip 201 interferes with fingerprint imaging, thereby improving fingerprint imaging performance.
  • disposing the light shielding layer 260 on the surface of the control chip 204 can further help alleviate the appearance problem of the chip package structure 200 under the display screen.
  • FIG. 7 shows a schematic structural diagram of another chip package structure 200 .
  • the above-mentioned circuit board 230 can be a flexible circuit board FPC232, and the plurality of chips in the chip package structure 200 and the light source 303 of the vital sign detection sensor chip 202 are all disposed on the upper surface of the FPC , and the chip package structure 200 also includes a first reinforcing plate 233, which is arranged under at least part of the area of the FPC 232, and is fixedly connected to the FPC through an adhesive layer, and the first reinforcing plate 233 is used to reinforce the FPC 232.
  • the FPC 232 may be a single-layer FPC, a double-layer FPC, or a multi-layer FPC.
  • a part of the local area of the FPC 232 is a single-layer FPC, while another part of the local area is a double-layer or multi-layer FPC.
  • a plurality of chips in the chip package structure 200 can be set Above the single-layer FPC, the overall thickness of the chip package structure 200 can be reduced, and the surrounding areas of the plurality of chips can be arranged as multi-layer FPC, so as to improve the flexibility of circuit wiring in the FPC.
  • the foam layer 240 may be disposed above the multi-layer FPC and adhered to the protective layer 113 of the display screen 110 .
  • the first reinforcing plate 233 can be fixedly disposed on the upper surface of the middle frame 120 through an adhesive layer, or the first reinforcing plate 233 can be fixedly disposed in the groove of the middle frame 120 through an adhesive layer , so that the chip package structure 200 is fixedly disposed on the middle frame 120 .
  • FIG. 8 shows a schematic structural diagram of another chip packaging structure 200 .
  • the circuit board 230 can be a flexible circuit board FPC 232, and the FPC 232 is provided with a window, and the chip package structure 200 further includes a first reinforcing plate 233, which is disposed under at least a part of the FPC and is The first reinforcing plate 233 is used to reinforce the FPC 232 by being fixedly connected with the FPC 232 through the adhesive layer.
  • the plurality of chips in the chip package structure 200 are disposed above the first reinforcing plate 233 and located in the opening of the FPC 232 .
  • the plurality of chips can be disposed on the upper surface of the first reinforcing plate 233 through an adhesive layer, and located in the opening of the FPC 232.
  • the overall thickness of the chip packaging structure 200 can be further reduced.
  • the light source 303 of the vital sign detection sensor chip 202 is not disposed above the first reinforcing plate 233, but is still disposed above the FPC 232, which is different from the above-mentioned arrangement of the plurality of chips, so as to realize the light source. Both the anode and cathode of 303 achieve effective electrical connection with FPC 232.
  • the upper surface of the light source 303 is higher than the upper surfaces of the plurality of chips in the chip package structure 200 , which limits the overall thickness of the chip package structure 200 and increases the light source 303 against the display screen 110 . risk, and may cause damage to the chip package structure 200 and the display screen 110 .
  • FIGS. 9 to 12 show other schematic structural diagrams of the chip package structure 200 , which can effectively reduce the height of the upper surface of the light source 303 and improve the reliability of the chip package structure 200 under the display screen.
  • the first reinforcement plate 233 is a special-shaped reinforcement plate, which includes a first reinforcement area and a second reinforcement area, and the upper surface of the second reinforcement area is lower than the first reinforcement area. upper surface.
  • the fingerprint sensor chip 201 among the plurality of chips is disposed above the first reinforcement area, and optionally, the vital sign detection sensor chip 202 and/or the control chip 204 are also disposed on the first reinforcement area.
  • the light source 203 of the vital sign detection sensor 202 is disposed above the second reinforcement area; for example, in FIG. 9 , the fingerprint sensor chip 201 , the vital sign detection sensor chip 202 and the control chip 204 are all disposed on the first reinforcement through an adhesive layer
  • the light source 203 is disposed on the upper surface of the local area of the FPC 232 corresponding to the reinforcement in the second reinforcement area through the adhesive layer.
  • the second reinforcement area can be designed by designing the second reinforcement area.
  • the height difference between the upper surface of the reinforcement area and the upper surface of the first reinforcement area reduces the height difference between the upper surface of the light source 203 and the upper surfaces of other chips, and even makes the upper surface of the light source 203 no higher than the upper surface of other chips. surface.
  • the lower surface of the first reinforcement plate 233 is on the same plane, then the thickness of the second reinforcement region can be designed to be smaller than the thickness of the first reinforcement region, so that the upper surface of the second reinforcement region can be lower than the upper surface of the first reinforcement area.
  • the lower surface of the first reinforcing plate 2031 may be disposed on the upper surface of the middle frame 120 of the electronic device.
  • the chip package structure 200 not only includes the first reinforcing plate 233 for reinforcing a local area in the FPC 232 , but also includes the second reinforcing plate 234 for reinforcing another part of the FPC 232 .
  • a local area is reinforced, and the upper surface of the second reinforcement plate 234 is lower than the upper surface of the first reinforcement plate 233 .
  • the fingerprint sensor chip 201 of the plurality of chips is disposed above the first reinforcing plate 233, and the light source 203 of the vital sign detection sensor 202 is disposed above the second reinforcing plate 234;
  • the fingerprint sensor chip 201 , the vital sign detection sensor chip 202 and the control chip 204 are all disposed on the upper surface of the first reinforcing plate 233 through an adhesive layer, and the light source 203 is disposed on the second reinforcing plate through an adhesive layer.
  • the strong plate 234 corresponds to the upper surface of the reinforced FPC local area.
  • the upper surface of the second reinforcing plate 234 is lower than the upper surface of the first reinforcing plate 233, even if the FPC 232 is further arranged between the light source 203 and the second reinforcing plate 234, the The height difference between the upper surface of the second reinforcing plate 234 and the upper surface of the first reinforcing plate 233 is designed to reduce the height difference between the upper surface of the light source 203 and the upper surfaces of other chips, so that the upper surface of the light source 203 is not high on the top surface of other chips.
  • the thickness of the second reinforcing plate 234 can be designed to be smaller than that of the first reinforcing plate 234 .
  • the thickness of the reinforcing plate 233 is such that the upper surface of the second reinforcing plate 234 is lower than the upper surface of the first reinforcing plate 233 .
  • the lower surfaces of the first reinforcing plate 2031 and the second reinforcing plate 234 may be disposed on the upper surface of the middle frame 120 of the electronic device.
  • the lower surfaces of the first reinforcing plate 233 and the second reinforcing plate 234 may not be on the same surface, for example, the first reinforcing plate 2031 is disposed on the upper surface of the middle frame 120, The second reinforcing plate 2032 is disposed in the groove of the middle frame 120, so that the lower surface of the first reinforcing plate 233 is lower than the lower surface of the second reinforcing plate 234.
  • the second reinforcing plate The thickness of the plate 234 may not be greater than the thickness of the first reinforcement plate 233 , so that the upper surface of the second reinforcement plate 234 is lower than the upper surface of the first reinforcement plate 233 .
  • the second reinforcement area or the FPC above the second reinforcement plate 234 is only provided with the light source 203 to reduce the height of the upper surface of the light source 203.
  • the second reinforcement area Or the FPC 232 above the second reinforcement plate 234 can be provided with a vital sign detection sensor chip 202 or other chips in addition to the light source 203, but in the above-mentioned manner, by reducing the second reinforcement area or the second reinforcement
  • the thickness of the plate 234, or a groove is arranged in the middle frame, and the second reinforcing plate 234 is arranged in the groove, the thickness of the reinforcing plate that can be reduced, or the depth of the groove is very limited, and in the middle When the thickness of the frame itself is small, it is difficult to realize the groove. Therefore, in order to solve this problem, FIG. 12 shows a schematic diagram of another chip packaging structure.
  • the chip package structure 200 not only includes the first reinforcing plate 233 for reinforcing a local area in the FPC 232 , but also includes a third reinforcing plate 235 for reinforcing another local area in the FPC 232 .
  • the third reinforcement plate 235 is a special-shaped steel plate, and its edge area is bent upward to form a step structure; optionally, the surrounding edge areas of the third reinforcement plate 235 are all bent upward to form a step structure.
  • the middle area of the third reinforcing plate is a conventional plate-like structure, and a partial area in the FPC 232 is arranged on the upper surface of the middle area of the third reinforcing plate 235 .
  • the fingerprint sensor chip 201 of the plurality of chips is disposed above the first reinforcing plate 233, and the light source 203 of the vital sign detection sensor 202 is disposed above the third reinforcing plate 235;
  • both the fingerprint sensor chip 201 and the control chip 204 are disposed on the upper surface of the first reinforcing plate 233 through an adhesive layer, while the vital sign detection sensor chip 202 and its light source 203 are disposed on the third reinforcing plate 235 through an adhesive layer.
  • the middle area corresponds to the upper surface of the reinforced FPC local area.
  • a window is provided in the middle area of the third reinforcing plate 235 corresponding to the reinforced FPC local area, and the vital sign detection sensor chip 202 is disposed in the middle of the third reinforcing plate 235 through an adhesive layer
  • the upper surface of the area is disposed in the opening, and the light source 203 is disposed on the upper surface of the reinforced FPC local area corresponding to the middle area of the third reinforcing plate 235 through the adhesive layer.
  • the upper surface of the middle region of the third reinforcing plate 235 is lower than the upper surface of the first reinforcing plate 233 , even if there is an FPC between the light source 203 and the third reinforcing plate 235 232, the height difference between the upper surface of the middle area of the third reinforcing plate 235 and the upper surface of the first reinforcing plate 233 can also be designed, so that the upper surface of the light source 203 is not higher than the height of the plurality of chips in the chip packaging structure 200. upper surface.
  • the middle frame 120 may be formed with an accommodating area, such as a through hole, and the stepped structure of the edge of the third reinforcing plate 235 may overlap the edge of the through hole, so that the third The reinforcing plate 235 can be installed on the middle frame.
  • the first reinforcing plate 233 is located on the upper surface of the middle frame, by designing the height of the stepped structure of the third reinforcing plate 235, the upper surface of the middle area of the third reinforcing plate 235 can be flexibly controlled
  • the height difference between the surface and the upper surface of the first reinforcing plate 233 can greatly reduce the height difference between the upper surface of the light source 203 and the upper surface of the chip located above the first reinforcing plate 233 .
  • forming the through hole in the middle frame 120 does not need to consider the thickness of the middle frame, and the process is easy to implement.
  • the vital sign detection sensor can be 202 and its light source 203 are both disposed above the third reinforcing plate 235, thereby reducing the distance between the vital sign detection sensor 202 and its light source 203, thereby improving the detection effect.
  • the FPC 232 in FIG. 12 is the same FPC connected to each other, rather than two separate FPCs, and the FPC area corresponding to the first reinforcing plate 233 and the third reinforcing plate 235 are not shown in FIG. 12 . Connected parts between corresponding FPC regions.
  • the height of the upper surface of the light source 303 can be reduced, thereby further reducing the overall thickness of the chip package structure 200 , and reducing the risk of the light source 303 hitting the display screen 110 .
  • the reliability of the package structure is not limited to the embodiments shown in FIGS. 9 to 12 .
  • FIGS. 13 to 15 show schematic top views of three embodiments of the chip package structure 200 .
  • any form of chip package structure 200 shown in FIGS. 13 to 15 can be selected for different situations.
  • the chip package structure 200 shown in FIG. 13 and FIG. 14 may correspond to the chip package structure 200 shown in FIG. 10 or FIG. 11 above, the circuit board is the FPC 232, and includes the first reinforcing plate 233 and The second reinforcing plate 234 .
  • the chip package structure 200 shown in FIG. 15 may correspond to the chip package structure 200 shown in FIG. 12 above, and the circuit board is an FPC 232, and includes a first reinforcing plate 233 and a third reinforcing plate 235. .
  • FIG. 16 shows a bottom perspective view of the chip package structure 200 corresponding to FIG. 15 .
  • a certain side of the FPC 232 is arranged in parallel or perpendicular to a certain side of the display screen 110, and a certain side of the fingerprint sensor chip 201 can be in a certain clip with a certain side of the FPC 232.
  • Angle setting so that a certain side of the fingerprint sensor chip 201 and a certain side of the display screen are set at a certain angle, which can effectively reduce the influence of the polarizer in the display screen on the light signal, and can also significantly reduce or eliminate fingerprint imaging. Moiré fringes in the process, thereby improving fingerprint image quality.
  • FIGS. 13 to 15 are only used as examples to illustrate the positional relationship among the fingerprint sensor chip 201 , the vital sign detection sensor chip 202 and its light source 203 , and the vital sign detection sensor chip 202 is also based on actual design requirements. , which is set at any other position on the circuit board 230 , which is not specifically limited in this embodiment of the present application.
  • the plurality of chips in the chip package structure 200 include: a fingerprint sensor chip 201 and a vital sign detection sensor chip 202 , which can implement a fingerprint detection function and a vital sign detection function.
  • the plurality of chips may further include: an ambient light sensor chip for detecting ambient light signals passing through the display screen to perform ambient light detection, so that the chip package structure 200 can Three different detection functions are implemented.
  • FIG. 17 shows a schematic structural diagram of another chip package structure 200 provided by the present application.
  • the plurality of chips in the chip package structure 200 may include: a fingerprint sensor chip 201 , a vital sign detection sensor chip 202 , and an ambient light sensor chip 205 .
  • the ambient light sensor chip 205 is provided with a photosensitive region 2051 , and the photosensitive region can specifically be a photo sensor, for example, the photo sensor includes, but is not limited to, at least one photodiode.
  • the ambient light sensor chip 205 is used to receive the ambient light signal after passing through the display screen 110 to detect the ambient light intensity.
  • the ambient light sensor chip 205 in order to reduce or even prevent the optical crosstalk between the ambient light sensor chip 205 , the fingerprint sensor chip 201 and the vital sign detection sensor chip 202 , the ambient light sensor chip 205 , the fingerprint sensor chip 201 And the distance between the vital sign detection sensor chips 202 should be greater than the preset threshold, so as to reduce the stray light signal reflected or scattered by one chip from entering the other two chips and causing interference to the corresponding detection performance.
  • the ambient light sensor chip 205 may also include other related auxiliary circuits such as signal processing circuits, signal control circuits, etc.
  • the signal processing circuit is used to detect the light
  • the electrical signal detected by the sensor is processed by signal processing to obtain ambient light intensity information.
  • the partial circuit or the whole circuit of the signal processing circuit can be integrated in the ambient light sensor chip, or the partial circuit or the whole circuit of the signal processing circuit can also be independent.
  • a chip is formed and disposed outside the ambient light sensor chip.
  • the chip packaging structure 200 further includes: a foam layer 240 , which is disposed on the surrounding area of the rigid circuit board 231 .
  • the foam layer 240 can be attached to the first protective layer area in the protective layer 113 of the display screen 110, the first protective layer area is the surrounding area of the first window in the protective layer 113, and the foam
  • the layer 240 , the rigid circuit board 231 and the display screen 110 can form a cavity structure for protecting the fingerprint sensor chip 201 , the vital sign detection sensor chip 202 and the ambient light sensor chip 205 therein, and play the role of sealing and dustproof.
  • the chip package structure 200 may further include the light source 203 of the vital sign detection sensor chip 202 , the relevant technical features of the light source 203 can also be referred to the relevant descriptions in the above embodiments, which will not be repeated here.
  • FIG. 18 shows a schematic structural diagram of another chip package structure 200 provided by the present application.
  • the foam layer 240 is not only disposed in the surrounding area of the rigid circuit board 231 , the foam layer 240 is also disposed between the ambient light sensor chip 205 and the fingerprint sensor chip 201, to prevent the light signal reflected or scattered by the ambient light sensor chip 205 from directly entering the fingerprint sensor chip 201 to interfere with fingerprint imaging, and to prevent the fingerprint sensor chip 201 from reflecting or scattering.
  • the scattered light signal directly enters the ambient light sensor chip 205 to interfere with ambient light detection, thereby improving the detection performance of the ambient light sensor chip 205 and the fingerprint sensor chip 201 .
  • the foam layer 240 is bonded to the second protective layer area in the protective layer 113 , and the foam layer 240 is The second protective layer area is the surrounding area of the plurality of second windows in the protective layer 113 , wherein one second window is correspondingly disposed above the fingerprint sensor chip 201 for transmitting the light signal passing through the display screen to the fingerprint sensor chip 201 , another second opening corresponds to the top of the ambient light sensor chip 205 , and is used for transmitting the light signal passing through the display screen to the ambient light sensor chip 205 .
  • no foam layer may be provided between the ambient light sensor chip 205 and the vital sign detection sensor chip 202 240 , that is, the ambient light sensor chip 205 may be disposed in the same chamber as the vital sign detection sensor chip 202 .
  • a foam layer 240 is also disposed between the ambient light sensor chip 205 and the vital sign detection sensor chip 202 That is, the ambient light sensor chip 205 is separately disposed in an independent chamber to prevent optical crosstalk between the ambient light sensor chip 205 and the vital sign detection sensor chip 202 .
  • the ambient light sensor chip 205 and the light source 203 of the vital sign detection sensor chip 202 may also be arranged in the same chamber, that is, in the embodiment shown in FIG. 18 , the vital sign detection sensor chip 202
  • the position of its light source 203 is interchanged. Due to the small size of the light source 203, the stray light generated by the light source 203 is relatively small. Therefore, even if the foam layer 240 is not disposed between the ambient light sensor chip 205 and the light source 203, the ambient light sensor chip 205 and the light source 203 are not provided with the foam layer 240.
  • the light source 203 is arranged in the same chamber, and the interference caused by the light source 203 to the ambient light sensor chip 205 is relatively small.
  • the accommodating space of the chip package structure 200 under the display screen can be saved, and the detection performance of each chip in the chip package structure 200 can be guaranteed.
  • a light shielding layer 260 is also provided above the ambient light sensor chip 205 ,
  • the light shielding layer 260 may be disposed around the ambient light sensor chip 205 above the photosensitive area 2051 .
  • an optical layer 2052 is further provided above the photosensitive area 2501 of the ambient light sensor chip 205 , and the optical layer 2052 includes but is not limited to a filter layer for passing the light of the target wavelength band.
  • the signal enters the ambient light sensor chip 205 .
  • the light shielding layer 260 is disposed around the optical layer 2052 .
  • the optical layer 2052 is only used to pass visible light and block invisible light.
  • the photosensitive area 2501 in the ambient light sensor chip 205 is used to detect the intensity of visible light in the ambient light.
  • the optical layer 2052 can also be used to pass light signals of other wavelength bands, and the optical layer 2052 and the photosensitive region 2501 cooperate with each other to detect the intensity of visible light in ambient light.
  • the related scheme of the ambient light sensor chip 205 reference may be made to the specific scheme of the related art, and details are not described here.
  • the above-mentioned protective adhesive layer 250 is also provided around the ambient light sensor chip 205 .
  • the related technical solutions of the protective adhesive layer 250 and the light-shielding layer 260 can be referred to above. The relevant descriptions in the embodiments are not repeated here.
  • the fingerprint sensor chip 201 can all be disposed on the upper surface of the rigid circuit board 231 through an adhesive layer.
  • the rigid circuit board 231 It can be a printed circuit board PCB, a flexible circuit board FPC or other types of circuit boards.
  • PCB printed circuit board
  • FPC flexible circuit board
  • the fingerprint sensor chip 201 , the vital sign detection sensor chip 202 and the ambient light sensor chip 205 can also be packaged on the flexible circuit board FPC.
  • FIG. 20 to FIG. 22 show The schematic diagrams of the other three chip packaging structures 200 are shown.
  • the fingerprint sensor chip 201 , the vital sign detection sensor chip 202 and its light source 203 , and the ambient light sensor chip 205 are packaged in the FPC 232 .
  • the specific solution under this packaging method can be See the detailed description of the embodiments shown in FIGS. 7 and 8 above.
  • the fingerprint sensor chip 201 and the control chip 204 are both disposed on the upper surface of the first reinforcing plate 233 through an adhesive layer, while the ambient light sensor chip 205 and the vital sign detection sensor chip 202
  • the light source 203 thereof is disposed on the upper surface of the reinforced FPC local area corresponding to the middle area of the third reinforcing plate 235 through the adhesive layer.
  • a window is provided in the middle region of the third reinforcing plate 235 corresponding to the reinforced FPC partial region, and the vital sign detection sensor chip 202 and the ambient light sensor chip 205 are disposed on the third reinforcing plate 235 through an adhesive layer.
  • the upper surface of the middle area of the reinforcing plate 235 is disposed in the opening, and the light source 203 is disposed on the upper surface of the corresponding reinforced FPC local area in the middle area of the third reinforcing plate 235 through the adhesive layer.
  • the light source 203 and the ambient light sensor chip 205 are disposed adjacent to each other, and the foam layer 240 is not disposed between the two. Due to the small size of the light source 203, the stray light generated by the light source 203 is also There are relatively few, so even if the foam layer 240 is not disposed between the ambient light sensor chip 205 and the light source 203, the ambient light sensor chip 205 and the light source 203 are disposed in the same chamber, and the interference caused by the light source 203 to the ambient light sensor chip 202 is relatively low. smaller.
  • the accommodating space of the chip package structure 200 under the display screen can be saved, and the detection performance of each chip in the chip package structure 200 can be guaranteed.
  • a foam layer 240 can also be arranged between the light source 203 and the ambient light sensor chip 205 to prevent optical crosstalk between the two and further improve the detection performance of the chip package structure 200 .
  • FIGS. 23 to 25 show schematic top views of the chip package structure 200 under another three implementation manners.
  • FIGS. 23 to 25 are only used as examples to illustrate the positional relationship among the fingerprint sensor chip 201 , the vital sign detection sensor chip 202 , its light source 203 , and the ambient light sensor chip 205 .
  • the ambient light sensor chip 205 also According to actual design requirements, any other position on the circuit board 230 may be provided, which is not specifically limited in this embodiment of the present application.
  • the chip package structure 200 may only include two chips, the fingerprint sensor chip 201 and the ambient light sensor chip 205, so as to realize the fingerprint detection function and the ambient light detection function, or, The chip package structure 200 may also include only two chips, the vital sign detection sensor chip 202 and the ambient light sensor chip 205, so as to realize the vital sign detection function and the ambient light detection function.
  • the chip package structure 200 may also include only two chips, the vital sign detection sensor chip 202 and the ambient light sensor chip 205, so as to realize the vital sign detection function and the ambient light detection function.
  • the embodiment of the present application also provides an electronic device, and the electronic device may include:
  • the chip packaging structure is disposed below the display screen, and is used for receiving light signals passing through a finger above the display screen and passing through the display screen and/or passing through the environment of the display screen light signal to realize at least two of the following detection functions: fingerprint detection, vital sign detection and ambient light detection.
  • the electronic device can be any electronic device with a display screen.
  • the display screen can be an OLED display screen, an LCD display screen or other types of display screens in the related art. Specifically, it may correspond to the display screen 110 in the foregoing embodiment, and the relevant description may refer to the foregoing description of the display screen 110 , which is not repeated here for brevity.
  • the chip packaging structure can be fixedly connected to the display screen through the foam layer and the adhesive layer, so as to be arranged under the display screen. Below the middle and lower area to adapt to the user's habitual pressing area.
  • the electronic device further includes a middle frame
  • the chip packaging structure can be fixedly arranged on the middle frame, for example, on the upper surface of the middle frame, or a groove is provided on the upper surface of the middle frame, and the chip packaging structure is fixedly arranged in the recess. in the slot.
  • the middle frame may correspond to the middle frame 120 in the foregoing embodiment, and reference may be made to the foregoing description of the middle frame 120 for the relevant description, which is not repeated here for brevity.
  • the disclosed systems and apparatuses may be implemented in other manners.
  • the apparatus embodiments described above are only illustrative.
  • the division of the units is only a logical function division. In actual implementation, there may be other division methods.
  • multiple units or components may be combined or Can be integrated into another system, or some features can be ignored, or not implemented.
  • the shown or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may also be electrical, mechanical or other forms of connection.
  • the units described as separate components may or may not be physically separated, and components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solutions of the embodiments of the present application.
  • each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically alone, or two or more units may be integrated into one unit.
  • the above-mentioned integrated units may be implemented in the form of hardware, or may be implemented in the form of software functional units.
  • the integrated unit if implemented in the form of a software functional unit and sold or used as an independent product, may be stored in a computer-readable storage medium.
  • the technical solutions of the present application are essentially or part of contributions to the prior art, or all or part of the technical solutions can be embodied in the form of software products, and the computer software products are stored in a storage medium , including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present application.
  • the aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (Read-Only Memory, ROM), random access memory (Random Access Memory, RAM), magnetic disk or optical disk and other media that can store program codes .

Abstract

本申请提供一种芯片封装结构和电子设备，能够优化电子设备的整体性能且降低其整体厚度。芯片封装结构用于设置在电子设备的显示屏的下方，包括：电路板；多个芯片，多个芯片的至少部分设置于电路板上方，且多个芯片封装于电路板；其中，多个芯片包括指纹传感器芯片、环境光传感器芯片以及生命体征检测传感器芯片中的至少两种，指纹传感器芯片用于接收经过显示屏上方手指后穿过显示屏的指纹光信号以进行指纹检测，生命体征检测传感器用于接收经过手指后穿过显示屏的生命体征光信号以进行生命体征检测，环境光传感器芯片用于接收穿过显示屏的环境光信号以进行环境光检测。

Description

芯片封装结构和电子设备 技术领域
本申请涉及电子技术领域，并且更具体地，涉及一种芯片封装结构和电子设备。
背景技术
随着消费电子行业的发展，尤其是移动通讯设备的快速发展，如何提升移动通讯设备的用户体验以及移动通讯设备的整体性能，是行业内持续关注的问题。
目前，市面上大部分的移动通讯设备，由于多种因素制约，其具备的功能有限且整体厚度较厚。因此，如何优化电子设备，尤其是移动通讯设备的整体性能、降低其整体厚度，是一项待解决的技术问题。
发明内容
本申请提供一种芯片封装结构和电子设备，能够优化电子设备的整体性能且降低其整体厚度。
第一方面，提供一种芯片封装结构，用于设置在电子设备的显示屏的下方，包括：电路板；多个芯片，该多个芯片的至少部分设置于该电路板上方，且该多个芯片封装于该电路板；其中，该多个芯片包括指纹传感器芯片、环境光传感器芯片以及生命体征检测传感器芯片中的至少两种，该指纹传感器芯片用于接收经过该显示屏上方手指后穿过该显示屏的指纹光信号以进行指纹检测，该生命体征检测传感器用于接收经过该手指后穿过该显示屏的生命体征光信号以进行生命体征检测，该环境光传感器芯片用于接收穿过该显示屏的环境光信号以进行环境光检测。
本申请提供一种芯片封装结构，其中包括多个芯片，该多个芯片包括指纹传感器芯片、环境光传感器芯片以及生命体征检测传感器中的至少两种，因而能够实现指纹检测、环境光检测以及生命体征检测中的至少两种功能，有利于提升电子设备的整体性能。进一步地，该芯片封装结构中的多个芯片封装于电路板，且设置在电子设备的显示屏下方，不需要占用电子设备的表面空间以及显示屏和中框之间的间隙区域，也不需要额外的封装体，因而具 有较薄的厚度，便于电子设备的整机设计，也有利于电子设备的轻薄化发展。
进一步地，相比于相关技术中，多个不同功能的芯片单独设置于电子设备不同区域的情况，本申请实施例将多个不同功能的芯片均集成设置于同一芯片封装体中，可采用同一封装工序执行多个不同功能芯片的封装，因而可以有效降低封装工序，从而提高生产效率且降低生产成本。
在一些可能的实施方式中，该多个芯片包括该生命体征检测传感器，该芯片封装结构还包括：该生命体征检测传感器的光源；该光源设置于该生命体征检测传感器的一侧，并封装于该电路板，该光源包括以下至少一种光源：红光光源、绿光光源以及红外光光源。
在一些可能的实施方式中，该多个芯片包括该指纹传感器芯片，该电路板为柔性电路板，该芯片封装结构还包括：第一补强板，设置于该柔性电路板的下方，用于支撑该柔性电路板；该柔性电路板中设置有开窗，该多个芯片中的至少该指纹传感器芯片设置于该第一补强板的上方，且设置于该开窗中。
在一些可能的实施方式中，该第一补强板包括第一补强区域和第二补强区域，该多个芯片中的至少该指纹传感器芯片设置于该第一补强区域的上方，该生命体征检测传感器的光源设置于该第二补强区域对应的电路板区域的上方；其中，该第二补强区域的上表面低于该第一补强区域的上表面。
在一些可能的实施方式中，该第一补强板设置于该电子设备的中框的上表面，该第二补强区域的厚度小于该第一补强区域的厚度。
在一些可能的实施方式中，该芯片封装结构还包括：第二补强板，该生命体征检测传感器的光源设置于该第二补强板对应的电路板区域的上方；其中，该第二补强板的上表面低于该第一补强板的上表面。
在一些可能的实施方式中，该第一补强板和该第二补强板均设置于该电子设备的中框的上表面，该第二补强板的厚度小于该第一补强板的厚度；或者，该第一补强板设置于该电子设备的中框的上表面，该第二补强板设置于该电子设备的中框的凹槽中，该第二补强板的厚度不大于该第一补强板的厚度。
在一些可能的实施方式中，该芯片封装结构还包括：第三补强板，该第三补强板的边缘区域向上弯曲，形成台阶结构，该生命体征检测传感器的光源设置于该第三补强板的中间区域对应的电路板区域的上方；其中，该第三 补强板的中间区域的上表面低于该第一补强板的上表面。
在一些可能的实施方式中，该第一补强板设置于该电子设备的中框的上表面，该中框形成有通孔，该第三补强板的台阶结构用于搭接在该通孔的边缘。
在一些可能的实施方式中，该芯片封装结构还包括：该环境光传感器芯片，该环境光传感器芯片和/或该生命体征检测传感器与该生命体征检测传感器的光源一起设置于该第三补强板的中间区域对应的电路板区域的上方。
在一些可能的实施方式中，该芯片封装结构还包括：泡棉层，设置于该电路板的边缘区域的上方；该泡棉层的上表面与该显示屏贴合，该泡棉层、该电路板与该显示屏形成腔室结构，用于保护该多个芯片。
在一些可能的实施方式中，该泡棉层与该显示屏的保护层中的第一保护层区域贴合，该第一保护层区域为该保护层中第一开窗的四周区域，该第一开窗对应设置于该多个芯片上方，用于传输穿过该显示屏的光信号至该多个芯片。
在一些可能的实施方式中，该多个芯片包括该指纹传感器芯片，该泡棉层还设置于该指纹传感器芯片与该多个芯片中除该指纹传感器芯片外的其它芯片之间。
在一些可能的实施方式中，该泡棉层与该显示屏的保护层中的第二保护层区域贴合，该第二保护层区域为该保护层中多个第二开窗的四周区域，该多个第二开窗一一对应的设置于该多个芯片上方，用于传输穿过该显示屏的光信号至该多个芯片。
在一些可能的实施方式中，该多个芯片包括该生命体征检测传感器，且该芯片封装结构还包括该生命体征检测传感器的光源；该泡棉层还设置于该生命体征检测传感器与其光源之间。
在一些可能的实施方式中，该泡棉层与该显示屏的保护层中的第三保护层区域贴合，该第三保护层区域为该保护层中两个第三开窗的四周区域，该两个第三开窗一一对应的设置于该生命体征检测传感器与其光源上方，用于传输该光源的光信号至该手指，且传输经过该手指并穿过该显示屏的光信号至该生命体征检测传感器。
在一些可能的实施方式中，该多个芯片还包括该环境光传感器，该生命体征检测传感器的光源与该环境光传感器相邻设置，且该光源与该环境光传 感器之间未设置该泡棉层。
在一些可能的实施方式中，该多个芯片包括该指纹传感器芯片和/或该环境光传感器芯片，该芯片封装结构还包括：遮光层，设置于该指纹传感器芯片中感光区域上方的四周和/或该环境光传感器芯片中感光区域上方的四周。
在一些可能的实施方式中，该芯片封装结构还包括：光学组件，设置于该指纹传感器芯片的上表面，用于引导该指纹光信号进入到该指纹传感器芯片中，该遮光层设置于该光学组件四周。
在一些可能的实施方式中，该芯片封装结构还包括：光学层，设置于该环境光传感器芯片的上表面，用于通过目标波段的光信号进入到该环境光传感器芯片中，该遮光层设置于该光学层四周。
在一些可能的实施方式中，该芯片封装结构还包括：保护胶层，设置于该遮光层下方，用于支撑该遮光层。
在一些可能的实施方式中，该保护胶层还设置于该多个芯片的四周，用于保护该多个芯片；和/或，该保护胶层包覆该多个芯片与该电路板之间的引线，用于保护该引线。
在一些可能的实施方式中，该芯片封装结构还包括：控制芯片，设置于该指纹传感器芯片的一侧，并封装于该电路板；该电路板用于传输该指纹传感器芯片和该控制芯片的信号，且该控制芯片用于控制该指纹传感器芯片运行，和/或，对该指纹传感器芯片产生的信号进行处理以进行指纹检测。
在一些可能的实施方式中，该控制芯片还用于控制该环境光传感器芯片运行，和/或，该控制芯片还用于控制该生命体征检测传感器运行。
在一些可能的实施方式中，该芯片封装结构还包括：连接器和/或被动元件，该多个芯片共用该连接器和/或该被动元件。
在一些可能的实施方式中，该多个芯片通过板上芯片COB封装方式封装于该电路板。
在一些可能的实施方式中，该芯片封装结构固定设置于该电子设备的中框，以设置于该显示屏的下方；或者，该芯片封装结构通过泡棉层与胶层与该显示屏固定连接，以设置于该显示屏的下方。
在一些可能的实施方式中，该芯片封装结构用于设置在该显示屏的中部区域或者中下部区域的下方。
第二方面，提供一种电子设备，包括：显示屏；以及，如上述第一方面 或者第一方面中任一种可能的实施方式中的芯片封装结构，该芯片封装结构设置于该显示屏下方，用于接收经过该显示屏上方手指并穿过该显示屏的光信号和/或穿过该显示屏的环境光信号，以实现以下至少两种检测功能：指纹检测、生命体征检测和环境光检测。
附图说明
图1为本申请可以适用的一种电子设备的正面示意图。
图2为图1所示的电子设备沿A-A’方向的一种示意性剖面示意图。
图3为本申请实施例提供的一种芯片封装结构的示意性结构图。
图4为本申请实施例提供的另一芯片封装结构的示意性结构图。
图5为本申请实施例提供的另一芯片封装结构的示意性结构图。
图6为本申请实施例提供的另一芯片封装结构的示意性结构图。
图7为本申请实施例提供的另一芯片封装结构的示意性结构图。
图8为本申请实施例提供的另一芯片封装结构的示意性结构图。
图9为本申请实施例提供的另一芯片封装结构的示意性结构图。
图10为本申请实施例提供的另一芯片封装结构的示意性结构图。
图11为本申请实施例提供的另一芯片封装结构的示意性结构图。
图12为本申请实施例提供的另一芯片封装结构的示意性结构图。
图13为本申请实施例提供的一种芯片封装结构的示意性俯视图。
图14为本申请实施例提供的另一芯片封装结构的示意性俯视图。
图15为本申请实施例提供的另一芯片封装结构的示意性俯视图。
图16为图15所示的芯片封装结构对应的示意性仰视立体图。
图17为本申请实施例提供的另一芯片封装结构的示意性结构图。
图18为本申请实施例提供的另一芯片封装结构的示意性结构图。
图19为本申请实施例提供的另一芯片封装结构的示意性结构图。
图20为本申请实施例提供的另一芯片封装结构的示意性结构图。
图21为本申请实施例提供的另一芯片封装结构的示意性结构图。
图22为本申请实施例提供的另一芯片封装结构的示意性结构图。
图23为本申请实施例提供的另一芯片封装结构的示意性俯视图。
图24为本申请实施例提供的另一芯片封装结构的示意性俯视图。
图25为本申请实施例提供的另一芯片封装结构的示意性俯视图。
具体实施方式
下面将结合附图，对本申请实施例中的技术方案进行描述。
本申请实施例的技术方案可以应用于各种电子设备，尤其适用于电脑(Computer)及其周边、通讯(Communications)和消费电子(Consumer-Electronics)这三种类型相关的3C电子产品，例如，智能手机、笔记本电脑、平板电脑、智能穿戴设备、家电设备、游戏设备等等。此外，本申请实施例涉及的技术方案还涉及汽车电子等其他类型的电子设备，本申请实施例对此不做具体限定。
需要说明的是，为便于说明，在本申请的实施例中，相同的附图标记表示相同的部件，并且为了简洁，在不同实施例中，省略对相同部件的详细说明。应理解，附图示出的本申请实施例中的各种部件的厚度、长宽等尺寸，以及集成装置的整体厚度、长宽等尺寸仅为示例性说明，而不应对本申请构成任何限定。
图1示出了本申请可以适用的一种电子设备10的正面示意图。
如图1所示，该电子设备10包括中框120和显示屏110，该显示屏110和中框120之间具有间隙区域130。其中，图1中所示的显示屏110所在区域为显示屏110的显示区域，间隙区域130中可设置有玻璃盖板(Cover Glass，CG)，用于保护显示屏110且为用户手指140提供触摸界面。
可选地，显示屏110可以为自发光显示屏，其采用具有自发光的显示单元作为显示像素。比如显示屏110可以为有机发光二极管(Organic Light-Emitting Diode，OLED)显示屏或者微型发光二极管(Micro-LED)显示屏。在其他可替代实施例中，显示屏110也可以为液晶显示屏(Liquid Crystal Display,LCD)或者其他被动发光显示屏，本申请实施例对此不做限制。进一步地，显示屏110还可以具体为触控显示屏，其不仅可以进行画面显示，还可以检测用户的触摸或者按压操作，从而为用户提供一个人机交互界面。比如，在一种实施例中，电子设备10可以包括触摸传感器，该触摸传感器可以具体为触控面板(Touch Panel,TP)，其可以设置在所述显示屏110表面，例如，其可以集成设置于玻璃盖板层中，或者也可以部分集成或者整体集成到所述显示屏110内部，从而形成所述触控显示屏。
此外，图1中所示的中框120可为电子设备10的外框，除图1中所示 的外框以外，本申请实施例中的中框120还包括设置于显示屏110下方，用于承载电子设备内部各种组件的框架，其内部各种组件包括但不限于主板，电池、摄像头，排线，各种感应器，话筒，听筒等等零部件。
在一些相关技术中，电子设备10中设置有用于感应环境光的环境光传感器，目前主流的环境光传感器为平面网格阵列(Land Grid Array，LGA)封装方式或者方形扁平无引脚(Quad Flat No-leads，QFN)封装方式等具有封装体的封装方式，因而具有较大的厚度。
且由于在电子设备的整机设计时，会优先考虑摄像头，主板，扬声器，振动马达等较大元件的布置，类似于环境光传感器(Ambient Light Sensor，ALS)的小型传感器则一般设置于图1所示的第一区域101中，该第一区域101为上述间隙区域130中位于电子设备上部的局部区域。而随着电子设备的全面屏设计需求，上述间隙区域130，也即第一区域101的位置空间会越来越小，造成环境光传感器的布置受限。为了解决上述问题，在另一些相关技术中，环境光传感器单独设置于图1所示的第二区域102中，该第二区域102为显示屏110的上部区域。
上文两种实施方式中，环境光传感器单独设置，且具有较大的厚度和较高的成本，不利于电子设备的整机设计，对电子设备的整机性能和厚度造成制约和影响。
另外，随着生活水平的日益提升，人们对于自身的健康状态日益关注，如何在移动通讯设备等电子设备中集成能够用于检测生命体征信息的生命体征检测装置，便于向用户提供其自身的生命体征信息和健康状态，也是提升电子设备整体性能的一项设计。
在一些相关技术中，可采用生命体征检测传感器来检测用户的多种生命体征信息的检测，该生命体征信息包括但不限于是用户的血氧、心率、血压、呼吸频率等等，本申请实施例对此不做具体限定。
作为一种示例，该生命体征检测传感器可包括光感测器(Photo Detector，PD)，其可利用血液对光吸收量的变化，测量氧合血红蛋白占全部血红蛋白的百分比，从而得到动脉血氧饱和度(SPO2)，以检测得到用户的血氧信息，或者，且其还可利用脉搏跳动对于光信号的影响，测量一定时间范围内的光电容积脉搏波描记(Photoplethysmographic，PPG)信号，通过分析研究PPG信号中的特征，提取其中包含的多项生命体征信息，可便于用户随时了解其 自身的身体状态，为心血管系统相关疾病的早期诊断和预防提供帮助。
一般情况下，生命体征检测传感器单独设置于电子设备的表面，例如，电子设备的侧面或者电子设备正面的非显示屏区域，该生命体征检测传感器需要占用一定的整机设计空间，且具有较大的厚度和较高的成本，同样不利于电子设备的整机设计，对电子设备的整机性能和厚度造成制约和影响。
基于上述问题，本申请提供一种芯片封装结构，其中包括多个芯片，该多个芯片包括指纹传感器芯片、环境光传感器芯片以及生命体征检测传感器中的至少两种，因而能够实现指纹检测、环境光检测以及生命体征检测中的至少两种功能，有利于提升电子设备的整体性能。进一步地，该芯片封装结构用于设置在电子设备的显示屏下方，不需要占用电子设备的表面空间以及显示屏和中框之间的间隙区域，也不需要额外的封装体，因而具有较薄的厚度，便于电子设备的整机设计，也有利于电子设备的轻薄化发展。
图2示出了图1所示的电子设备10沿A-A’方向的一种示意性剖面示意图。
如图2所示，本申请实施例提供一种芯片封装结构200，其用于设置在电子设备10的显示屏120的下方。
具体地，该芯片封装结构200用于设置在显示屏120的第三区域103的下方，该第三区域103为显示屏120中的中部区域或者中下部区域，其可为用户手指的常用触摸区域。
如图2所示，芯片封装结构200可包括：多个芯片，例如，图1所示的第一芯片210和第二芯片220，以及电路板230，该多个芯片的至少部分设置于电路板230上方，且该多个芯片封装于该电路板230；
其中，该多个芯片包括指纹传感器芯片、环境光传感器芯片以及生命体征检测传感器中的至少两种，该指纹传感器芯片用于接收经过显示屏上方手指并穿过显示屏的指纹光信号以进行指纹检测，该生命体征检测传感器用于接收经过手指并穿过显示屏的携带有手指的生命体征信息的光信号以进行生命体征信息检测，环境光传感器芯片用于接收穿过显示屏的环境光信号以进行环境光检测。
在本申请实施例中，多个芯片为未封装的裸芯片(die)，或者也可称为裸晶片，其可通过板上芯片(Chip On Board，COB)封装方式设置于电路板230上。可选地，该电路板230包括但不限于为印刷电路板(Printed Circuit  Board，PCB)、柔性电路板(Flexible Printed Circuit，FPC)或者软硬结合板，多个芯片可通过导电胶层或非导电胶层粘附在电路板上，且通过引线键合(Wire Bonding，WB)方式实现芯片与电路板之间的电气连接。作为示例，该多个芯片可通过芯片贴合胶(Die Attach Film，DAF)、银胶、锡膏连接至电路板230。
在本申请实施例中，通过采用COB封装方式对多个芯片进行封装，使得封装后的芯片封装结构200具有较小的厚度，实现芯片封装结构200的超薄设计。
且相比于相关技术中，多个不同功能的芯片单独设置于电子设备不同区域的情况，本申请实施例将多个不同功能的芯片均集成设置于同一芯片封装体中，可采用同一封装工序执行多个不同功能芯片的封装，因而可以有效降低封装工序，从而提高生产效率且降低生产成本。
进一步地，本申请实施例中，芯片封装结构200可仅包括一个接口模块，例如连接器(Connector)，即可实现多个不同功能的芯片与电子设备中其它功能模块的信息交互，且多个不同功能的芯片所需要的辅助电学元器件，例如电阻、电容、电感等被动元件(Passive Components)可视具体情况相互共用。相比于多个不同功能的芯片单独设置的情况，本申请实施例的技术方案进一步降低了工艺成本，减小了多个不同功能的芯片在电子设备中占用的空间，因而可更有利于电子设备的整机设计和电子设备的轻薄化发展。
作为一种可选的实施方式，图3示出了本申请实施例提供的一种芯片封装结构200的结构示意图。该芯片封装结构200中，多个芯片可为指纹传感器芯片201和生命体征检测传感器芯片202，该指纹传感器芯片201和生命体征检测传感器芯片202通过胶层设置于硬性电路板231的表面，该硬性电路板231可为上述电路板230的其中一种类型，其可具有刚性的基底材料以及电学传输的电路层，作为示例，该硬性电路板231可以为PCB。
在该实施方式中，指纹传感器芯片201和生命体征检测传感器芯片202相邻设置，在垂直于显示屏的方向上，该两个芯片能够位于手指140的正投影中，当手指140按压于显示屏时，指纹传感器芯片201和生命体征检测传感器芯片202均能接收经过手指140后的光信号，以在手指按压时，能够同时检测得到指纹信息和生命体征信息，以执行指纹检测和生命体征检测两种功能。
可选地，该生命体征检测传感器芯片202包括光感测器，例如，该光感测器包括但不限于是至少一个光电二极管。具体地，该生命体征检测传感器芯片202用于接收经过显示屏上方手指140后，并穿过显示屏的手指光信号，该手指光信号携带有手指的血氧、脉搏、血压、呼吸频率等生命体征信息，该生命体征检测传感器芯片202接收该手指光信号后可将其转换为对应的电信号，该电信号可用于处理得到血氧饱和度或者脉搏值、血压值、呼吸频率值等生命体征参数。
可以理解的是，该生命体征检测传感器芯片202除了包括光检测器以外，还可以包括其它相关的信号处理电路、信号控制电路等辅助电路，在一些实施方式中，该信号处理电路用于将光检测器检测得到的电信号进行信号处理以得到生命体征参数，该信号处理电路的局部电路或者全部电路可集成设置于生命体征检测传感器芯片202中，或者该信号处理电路的局部电路或者全部电路也可单独形成一个芯片，设置于生命体征检测传感器芯片202之外。
在一些实施方式中，如图3所示，为了配合该生命体征检测传感器芯片202用于检测生命体征信息，本申请实施例的芯片封装结构200还包括：光源203，用于发射光信号至用户手指140，产生经过用户手指140的手指光信号，并被生命体征检测传感器芯片202接收。在一些实施方式中，该光源203设置于生命体征检测传感器芯片202的一侧，且同样封装于该硬性电路板231。
作为示例，该光源203包括但不限于是至少一个发光二极管(Light Emitting Diode，LED)。具体地，至少一个LED的阴极通过导电胶层连接于硬性电路板231，该至少一个LED的阳极通过引线键合至硬性电路板231，从而实现至少一个LED与硬性电路板231的电气连接。
在另一些实施方式中，本申请实施例的芯片封装结构200也可不包括光源，生命体征检测传感器芯片202可复用显示屏作为光源，换言之，显示屏向用户手指发射光信号，产生经过用户手指140的手指光信号被生命体征检测传感器芯片202接收。
优选地，在本申请实施例中，生命体征检测传感器芯片202单独配置有光源203，该光源203不受限于显示屏的发光波段，针对于具体应用，该光源203除了可发射可见光波段的光信号以外，还可以发射非可见光波段的光信号，且该光源203也不受限于显示屏的发光控制，该光源203的控制方式 较为简单和灵活。因此，通过本申请实施例的技术方案，可以提升生命体征检测的灵活性和准确性，也有利于增多可检测的生命体征信息的类型，从而提升用户体验。
作为一种示例，生命体征检测传感器芯片202可用于测量用户的血氧饱和度，则光源203可对应包括红光光源和红外光光源，通过经过手指的红光信号的强度以及经过手指的红外光信号的强度，获取用户的血氧饱和度信息。
作为另一种示例，生命体征检测传感器芯片202可用于测量用户的脉搏、血压、呼吸频率等信息，则光源203可对应包括红光光源和/或绿光光源，通过获取一定时间内，经过手指的红光信号的强度变化和/或经过手指的绿光信号的强度，获取用户的脉搏波信号，进而得到用户的脉搏、血压、呼吸频率等信息。
当然，本申请实施例中，生命体征检测传感器芯片202中的光源203除了可包括上文中红光光源，绿光光源以及红外光光源中的一种或者多种以外，还可以包括其它任意波段的发光光源，以提高生命体征信息检测的准确度，本申请实施例对此不做具体限定。
上文对本申请实施例中的生命体征检测传感器芯片202进行说明，下面对指纹传感器芯片201进行说明。
具体地，指纹传感器芯片201可包括：多个像素(pixel)形成的像素阵列2011，以及控制该像素阵列2011的相关电路结构。
可选地，在本申请实施例中，指纹传感器芯片201上方还设置有光学组件2012。该光学组件2012用于引导经过显示屏上方的手指反射或者散射后，再穿过显示屏的指纹光信号进入到指纹传感器芯片201中，以形成手指的指纹图像。
作为示例，如图3所示，该光学组件2012可以包括：微透镜阵列以及设置于该微透镜阵列下方的至少一层光阑层。其中，微透镜阵列包括多个微透镜，每个微透镜用于将其上方的光信号进行会聚后传输至其下方的光阑层。光阑层为光吸收材料制备形成，其中设置有多个通光小孔，该多个通光小孔用于对微透镜会聚后的光信号进行方向选择，使得目标方向的光信号经过通光小孔进入至指纹传感器芯片201中，而非目标方向的杂散光信号则被非通过小孔所在区域的光吸收材料吸收，从而防止杂散光信号对指纹成像造 成干扰。指纹传感器芯片201中的像素阵列2011用于将经过光阑层的光信号进行转换，以形成对应的指纹图像。
可选地，上述光学组件2012至少部分，例如至少一光阑层可以一体集成于该指纹传感器芯片201中，或者也可以独立设置于指纹传感器芯片201的外部。
可以理解的是，上述光学组件2012除了可以为图3中所示的结构以外，其还可以为其它光引导结构，例如准直器(collimator)层，具有多个准直单元或者微孔阵列，本申请实施例对该光学组件2012的具体结构不做限定。
在本申请实施例中，光学组件采用如图3所示的结构，相比于基于准直器层成像的指纹装置，其利用微透镜阵列进行光信号的会聚，且利用一层或者多层光阑层对光信号进行方向引导，能够进一步提高指纹光信号的质量，从而提高指纹传感器芯片201的指纹成像性能。
继续参见图3，显示屏110可为OLED显示屏，其可包括盖板111、发光层112和保护层113。
具体地，本申请实施例中，盖板111可为上文中提到的玻璃盖板CG，发光层112可为OLED有机发光面板，保护层113可理解为显示屏110的后面板，其具有遮光、散热以及保护的作用，可选地，该保护层113可为用于遮蔽光的黑色片状层或者印刷层，其中包括至少一部分金属层，例如铜箔用于散热，且还可以包括泡棉层以起到缓冲以及保护的作用。可选地，在该保护层113中，金属层可设置于泡棉层下方，金属层与泡棉层之间通过胶层连接。
其中，保护层113中设置有第一开窗1131，所述第一开窗1131对应设置于芯片封装结构200中的多个芯片上方，用于传输穿过显示屏110的光信号至多个芯片。在本申请实施例中，该保护层113中的第一开窗1131可对应设置于显示屏110的中部区域或者中下部区域，即对应设置于上述第三区域103。该第一开窗1131的尺寸可依据其下方的芯片封装结构200中各芯片在显示屏中的视场大小进行对应设计。
需要说明的是，本申请实施例中，显示屏110的结构仅为示意性说明，其还可包括显示屏所需的其它必要元器件，具体方案可参见相关技术说明，此处不做具体赘述。
可选地，如图3所示，本申请实施例提供的芯片封装结构200可固定设 置于中框120，从而固定位于显示屏110的下方，作为示例，可通过胶层将硬性电路板231固定设置于中框120的上表面，或者，通过胶层将硬性电路板231固定设置于中框120的凹槽中，使得芯片封装结构200固定设置于中框120。
可选地，如图3所示，本申请实施例提供的芯片封装结构200还可包括：泡棉层240，设置于硬性电路板231的四周区域。
如图3所示，泡棉层240可贴合于上述显示屏110的保护层113，且该泡棉层240、硬性电路板231以及显示屏110可形成腔室结构，用于保护其中的指纹传感器芯片201、生命体征检测传感器芯片202及其光源203，且起到密封防尘的作用。进一步地，该泡棉层240具有弹性和支撑性，当手指按压于显示屏，或者电子设备受到其它外力，产生震动或者挤压时，泡棉层240可用于缓冲一部分外力，从而防止各芯片受到显示屏的碰撞或挤压，从而提升芯片封装结构200的可靠性。可选地，本申请中，泡棉层240还可以用其它具有弹性、支撑性、吸光性等性能材料代替，例如，还可为橡胶等，本申请仅以泡棉层所在位置的材料为泡棉进行举例说明，但本申请对其不做具体限定。
具体地，在图3所示实施方式中，泡棉层240可与保护层113中的第一保护层区域贴合，该第一保护层区域为保护层113中第一开窗1131的四周区域。
在一些实施方式中，泡棉层240可通过胶层与保护层113连接，和/或，泡棉层240可通过胶层与硬性电路板231连接，从而进一步提高芯片封装结构200的安装可靠性。
需要说明的是，本申请实施例提供的芯片封装结构200除了可通过设置于中框120上表面固定设置于显示屏110下方以外，还可以仅通过泡棉层240连接硬性电路板231和显示屏110，实现芯片封装结构200固定设置于显示屏110下方。且芯片封装结构200除了可设置于中框120上表面以外，还可以通过其它固定方式设置于中框120，本申请实施例对此不做具体限定。
图4示出了本申请实施例提供的另一种芯片封装结构200的示意性结构图。
如图4所示，可选地，在本申请实施例中，为了减小乃至防止指纹传感器芯片201和生命体征检测传感器芯片202之间的光学串扰，泡棉层240除 了设置于硬性电路板231的四周区域以外，还设置于指纹传感器芯片201与生命体征检测传感器芯片202之间，用于防止生命体征检测传感器芯片202反射或散射的光信号直接进入至指纹传感器芯片201干扰指纹成像，且防止指纹传感器芯片201反射或散射的光信号直接进入至生命体征检测传感器芯片202干扰生命体征信息检测。
在一些实施方式中，如图4所示，为了配合芯片封装结构200中的泡棉层240，该泡棉层240与保护层113中的第二保护层区域贴合，该第二保护层区域为保护层113中多个第二开窗1132的四周区域，其中，一个第二开窗1132对应设置于指纹传感器芯片201上方，用于传输穿过显示屏的光信号至指纹传感器芯片201，另一个第二开窗1132对应于生命体征检测传感器芯片202上方，用于传输穿过显示屏的光信号至生命体征检测传感器芯片202。
可选地，为了减小乃至防止生命体征检测传感器芯片202与其光源203之间的光学串扰，泡棉层260还设置于生命体征检测传感器芯片202与其光源203之间，用于防止光源203发出的光信号直接进入生命体征检测传感器芯片202干扰生命体征信息检测。
在一些实施方式中，如图4所示，为了芯片封装结构200中的泡棉层240，该泡棉层240与保护层113中的第三保护层区域贴合，该第三保护层区域为保护层113中多个第三开窗1133的四周区域，其中，一个第三开窗1133对应设置于生命体征检测传感器芯片202上方，用于传输穿过显示屏的光信号至生命体征检测传感器芯片202，另一个第三开窗1133对应于光源203上方，用于传输光源203的光信号穿过显示屏至显示屏上方的手指。
因此，在图4所示实施例中，泡棉层240、硬性电路板231以及显示屏110可形成三个腔室，指纹传感器芯片201、生命体征检测传感器芯片202及其光源203分别设置于三个腔室中，在两个芯片能够完成两种检测功能的同时，还能防止相互之间的光学串扰，提高检测性能。
且在本申请实施例中，泡棉层240的上表面位于同一平面，且显示屏110的保护层113的下表面也位于同一平面，泡棉层240与保护层113之间具有较为良好的贴合效果，因此，密封防尘以及芯片保护性能较优。
除了图4所示的实施例，保护层113中形成有多个开窗，且泡棉层240与开窗的四周区域贴合，以形成保护三个芯片的三个腔室外，在另一些实施 例中，如图5所示，保护层113中也可仅形成一个第一开窗1131，泡棉层240可包括第一泡棉层区域2401和第二泡棉层区域2402，其中第二泡棉层区域2402位于指纹传感器芯片201和生命体征检测传感器芯片202之间的泡棉层240的上表面，和/或，位于生命体征检测传感器芯片202与其光源203之间的泡棉层240，第一泡棉层区域2401位于硬性电路板231四周，且第二泡棉层区域2402的上表面高于第一泡棉层区域2401的上表面，该第二泡棉层区域2402的上表面贴合于显示屏110中发光层112，该第一泡棉层区域2401的上表面贴合于显示屏110中保护层113的第一开窗1131的四周区域。
采用该实施例的实施方式，泡棉层240、硬性电路板231以及显示屏110也可形成三个腔室，从而保护多个芯片，且采用该实施方式，可以降低显示屏110的加工成本。
进一步地，由于指纹传感器芯片201对于指纹成像要求较高，如图4和图5所示，在一些实施方式中，芯片封装结构200还包括：遮光层260，设置于指纹传感器芯片201中感光区域上方的四周，该指纹传感器芯片201中感光区域可为上述像素阵列2011所在区域。可选地，该遮光层260可设置于上述光学组件2012的四周区域，作为一种示例，该遮光层260可为遮光油墨。
具体地，遮光层260可用于吸收杂散光，防止杂散光进入至指纹传感器芯片201中，从而减小环境因素对指纹检测过程的干扰。进一步地，设置遮光层260也可以提升芯片封装结构200在显示屏下的外观问题，由于设置有遮光层260，其可以吸收从显示屏上方发射的光信号，减少反射回显示屏的光信号的强度，避免用户能够观察到显示屏下方的芯片封装结构，从而提高用户的使用体验。
进一步地，为了支撑上述遮光层260，如图4和图5所示，在一些实施方式中，芯片封装结构200还包括：保护胶层250，设置于指纹传感器芯片201的四周，且用于支撑上述遮光层260。
具体地，该保护胶层250可为芯片保护胶，其可通过点胶的方式设置于指纹传感器芯片201四周，其可用于保护指纹传感器芯片201，且提高指纹传感器201的稳定性。
可选地，如图4和图5所示，该保护胶层250可同时用作指纹传感器芯 片201的引线的引线保护胶，该引线保护胶可完全包覆引线，以保证引线连接的稳定性与可靠性。
在本申请实施例中，利用保护胶层250，既能保护指纹传感器芯片201，也能保护指纹传感器芯片201的引线，且还能用作支撑遮光层260的支撑层，因此，通过本申请实施例的技术方案，复用同一保护胶层实现多种功能，且实现工艺较为方便，在提升芯片封装结构的性能的同时，还能够提高生产效率。
可选地，继续参见图4和图5，保护胶层250除了设置于指纹传感器芯片201四周以外，还可以设置于生命体征检测传感器芯片202及其光源203的四周，以保护生命体征检测传感器芯片202及其光源203。
在上文图4所示实施例的基础上，图6示出了本申请实施例提供的另一种芯片封装结构200的示意性结构图。
如图6所示，在本申请实施例中，芯片封装结构200还包括：控制芯片204。在一些实施方式中，该控制芯片204可为上述指纹传感器芯片201的驱动芯片，其设置于指纹传感器芯片201的一侧，且同样封装于硬性电路板231，该控制芯片204用于产生控制信号以控制指纹传感器芯片201的工作，和/或，对该指纹传感器芯片201产生的信号进行处理以进行指纹检测和指纹识别。
具体地，该控制芯片204同样可通过COB封装工艺封装于硬性电路板231，硬性电路板231用于实现该指纹传感器芯片201和控制芯片204之间的信号传输。
在本申请实施例中，该控制芯片204包括但不限于是微控制单元(microcontroller unit，MCU)，其还可以为数字信号处理器(digital signal processor，DSP)、图像信号处理器(image signal processor，ISP)、专用集成电路(application specific integrated circuit，ASIC)、现成可编程门阵列(field programmable gate array，FPGA)或者其他可编程逻辑器件、分立门或者晶体管逻辑器件、分立硬件组件形成的芯片结构。
在本申请实施例中，将控制芯片204并排设置于指纹传感器芯片201的一侧，而不是设置在硬性电路板231的其它位置，可以减小控制芯片204与指纹传感器芯片201之间的走线距离，从而防止信号在传输过程中信号质量下降，影响指纹检测效果。
可选地，在一些实施方式中，该控制芯片204除了可作为指纹传感器芯片201的驱动芯片以外，还可以作为硬性电路板231上其它芯片的驱动芯片，例如，其可作为生命体征检测传感器芯片202和/或环境光传感器芯片的驱动芯片，用于控制生命体征检测传感器芯片202和/或环境光传感器芯片的运行。可选地，控制芯片204还可以用于对生命体征检测传感器芯片202产生的电信号进行处理，得到用户的生命体征信息，和/或，对环境光传感器芯片产生的电信号进行处理，得到环境光信息。
具体地，在该实施方式中，硬性电路板231可用于实现该生命体征检测传感器芯片202、环境光传感器芯片和控制芯片204的之间的信号传输。
继续参见图6，在本申请实施例中，由于控制芯片204不需要接收光信号，因此，遮光层260可设置在该控制芯片204的上表面，以进一步吸收杂散光，防止控制芯片204表面反射的杂散光信号进入至指纹传感器芯片201中干扰指纹成像，从而可提升指纹成像性能。且在控制芯片204表面设置遮光层260，也可进一步有助于缓解芯片封装结构200在显示屏下的外观问题。
在上文图3至图6所示实施例中，芯片封装结构200中的多个芯片均可通过胶层设置于硬性电路板231上表面，该硬性电路板231可为PCB或者其它类型的硬性电路板。图7示出了另一种芯片封装结构200的示意性结构图。
如图7所示，在本申请实施例中，上述电路板230可为柔性电路板FPC232，芯片封装结构200中的多个芯片以及生命体征检测传感器芯片202的光源303均设置于FPC的上表面，且芯片封装结构200还包括第一补强板233，其设置在FPC 232的至少部分区域下方，并通过胶层与FPC固定连接，该第一补强板233用于对FPC 232进行补强。
可选地，在一些实施方式中，该FPC 232可为单层FPC、双层FPC或者还可以为多层FPC。或者，如图7所示，FPC 232中的一部分局部区域为单层FPC，而另一部分局部区域为双层或者多层FPC，在该实施方式中，芯片封装结构200中的多个芯片可设置于单层FPC上方，以减小芯片封装结构200整体厚度，而多个芯片的四周区域可设置为多层FPC，以提高FPC中电路布线的灵活性。在图7所示的实施例中，泡棉层240可以设置于多层FPC上方，并与显示屏110的保护层113贴合。
在本申请实施例中，可通过胶层将第一补强板233固定设置于中框120 的上表面，或者，通过胶层将第一补强板233固定设置于中框120的凹槽中，使得芯片封装结构200固定设置于中框120。
图8示出了另一种芯片封装结构200的示意性结构图。
如图8所示，电路板230可为柔性电路板FPC 232，该FPC 232中设置有开窗，芯片封装结构200还包括第一补强板233，其设置在FPC的至少部分区域下方，并通过胶层与FPC 232固定连接，该第一补强板233用于对FPC 232进行补强。
在本申请实施例中，芯片封装结构200中的多个芯片设置于第一补强板233的上方，且位于FPC 232的开窗中。可选地，该多个芯片可通过胶层设置于第一补强板233的上表面，且位于FPC 232的开窗中。
通过该实施例的技术方案，相比于上文直接将多个芯片设置于电路板表面的技术方案，可以进一步降低芯片封装结构200的整体厚度。
另外，在本申请实施例中，与上述多个芯片的设置方式不同，生命体征检测传感器芯片202的光源303不是设置于第一补强板233上方，而仍旧设置于FPC 232上方，以实现光源303的阳极和阴极均实现与FPC 232的有效电连接。
因此，在图8所示的实施方式中，光源303的上表面高于芯片封装结构200中多个芯片的上表面，限制了芯片封装结构200的整体厚度，且增加了光源303顶撞显示屏110的风险，并可能造成芯片封装结构200和显示屏110的损坏。
基于该问题，图9至图12示出了芯片封装结构200的另几种示意性结构图，可以有效降低光源303的上表面高度，提升芯片封装结构200在显示屏下的使用可靠性。
如图9所示，第一补强板233为异形补强板，其中包括第一补强区域和第二补强区域，该第二补强区域的上表面低于该第一补强区域的上表面。
具体地，芯片封装结构200中，多个芯片中的至少指纹传感器芯片201设置于第一补强区域的上方，可选地，生命体征检测传感器芯片202和/或控制芯片204也设置于第一补强区域的上方。而生命体征检测传感器202的光源203设置于第二补强区域的上方；例如，图9中，指纹传感器芯片201、生命体征检测传感器芯片202以及控制芯片204均通过胶层设置于第一补强区域的上表面，光源203通过胶层设置于第二补强区域对应补强的FPC 232 局部区域的上表面。
在本申请实施例中，由于第二补强区域的上表面低于第一补强区域的上表面，即使光源203与第二补强区域之间还设置有FPC 232，也可通过设计第二补强区域的上表面与第一补强区域的上表面的高度差，减小光源203的上表面与其它芯片的上表面的高度差，乃至使得光源203的上表面不高于其它芯片的上表面。
在一些实施方式中，第一补强板233的下表面在同一平面，则可通过将第二补强区域的厚度设计为小于第一补强区域的厚度，使得第二补强区域的上表面低于第一补强区域的上表面。可选地，第一补强板2031的下表面可设置于电子设备的中框120的上表面。
如图10和图11所示，芯片封装结构200除了包括第一补强板233用于对FPC 232中的一局部区域进行补强以外，还包括第二补强板234对FPC 232中的另一局部区域进行补强，且第二补强板234的上表面低于第一补强板233的上表面。
具体地，芯片封装结构200中，多个芯片中的至少指纹传感器芯片201设置于第一补强板233的上方，而生命体征检测传感器202的光源203设置于第二补强板234的上方；例如，图10和图11中，指纹传感器芯片201、生命体征检测传感器芯片202以及控制芯片204均通过胶层设置于第一补强板233的上表面，光源203通过胶层设置于第二补强板234对应补强的FPC局部区域的上表面。
在本申请实施例中，由于第二补强板234的上表面低于第一补强板233的上表面，即使光源203与第二补强板234之间还设置有FPC 232，也可通过设计第二补强板234的上表面与第一补强板233的上表面的高度差，减小光源203的上表面与其它芯片的上表面的高度差，乃至使得光源203的上表面不高于其它芯片的上表面。
在一些实施方式中，如图10所示，第一补强板233和第二补强板234的下表面在同一平面，则可通过将第二补强板234的厚度设计为小于第一补强板233的厚度，使得第二补强板234的上表面低于第一补强板233的上表面。可选地，第一补强板2031和第二补强板234的下表面可设置于电子设备的中框120的上表面。
在另一些实施方式中，图11所示，第一补强板233和第二补强板234 的下表面可不在同一表面，例如，第一补强板2031设置于中框120的上表面，而第二补强板2032设置于中框120的凹槽中，从而使得第一补强板233的下表面低于第二补强板234的下表面，在该实施例中，第二补强板234的厚度可不大于第一补强板233的厚度，进而使得第二补强板234的上表面低于第一补强板233的上表面。
在上文实施例中，第二补强区域或者第二补强板234上方的FPC仅设置有光源203，以实现降低光源203的上表面的高度，在一些实施方式中，第二补强区域或者第二补强板234上方的FPC 232除了设置有光源203以外，还可设置有生命体征检测传感器芯片202或者其它芯片，但采用上述方式，通过减小第二补强区域或者第二补强板234的厚度，又或者是在中框设置凹槽，将第二补强板234设置于凹槽中，能够减小的补强板厚度，或者是凹槽的深度均十分有限，且在中框自身的厚度较小时，凹槽不易实现，因此，为了解决该问题，图12示出了另一种芯片封装结构的示意图。
如图12所示，芯片封装结构200除了包括第一补强板233用于对FPC232中的一局部区域进行补强以外，还包括第三补强板235对FPC 232中的另一局部区域进行补强，该第三补强板235为异形钢板，其边缘区域向上弯曲，形成台阶结构；可选地，该第三补强板235的四周边缘区域均向上弯曲，形成台阶结构。该第三补强板的中间区域为常规的板状结构，FPC 232中的局部区域设置于该第三补强板235的中间区域的上表面。
芯片封装结构200中，多个芯片中的至少指纹传感器芯片201设置于第一补强板233的上方，而生命体征检测传感器202的光源203设置于第三补强板235的上方；例如，图12中，指纹传感器芯片201以及控制芯片204均通过胶层设置于第一补强板233的上表面，而生命体征检测传感器芯片202及其光源203通过胶层设置于第三补强板235的中间区域对应补强的FPC局部区域的上表面。或者，在另一些实施方式中，第三补强板235的中间区域对应补强的FPC局部区域中设置有开窗，生命体征检测传感器芯片202通过胶层设置于第三补强板235的中间区域的上表面，且设置于该开窗中，而光源203通过胶层设置于第三补强板235的中间区域对应补强的FPC局部区域的上表面。
具体地，在本申请实施例中，第三补强板235的中间区域的上表面低于第一补强板233的上表面，即使光源203与第三补强板235之间还设置有 FPC 232，也可通过设计第三补强板235的中间区域的上表面与第一补强板233的上表面的高度差，使得光源203的上表面不高于芯片封装结构200中多个芯片的上表面。
在一些实施方式中，如图12所示，中框120可形成有容置区域，例如通孔，第三补强板235的边缘的台阶结构可搭接于通孔的边缘，以使得第三补强板235可安装设置于中框。在本申请实施方式中，若第一补强板233位于中框的上表面，则通过设计第三补强板235的台阶结构的高度，可灵活控制第三补强板235的中间区域的上表面与第一补强板233的上表面的高度差，从而可较大程度的减小光源203的上表面与位于第一补强板233上方的芯片的上表面的高度差。另外，在中框120中形成通孔不需考虑中框的厚度，工艺便于实现。
可选地，在本申请实施例中，由于可较大程度的减小光源203的上表面与位于第一补强板233上方的芯片的上表面的高度差，因此，可将生命体征检测传感器202与其光源203均设置于第三补强板235上方，从而减小生命体征检测传感器202与其光源203之间的间距，从而提升检测效果。
另外，需要说明的是，图12中FPC 232为相互连接的同一FPC，而非分立的两个FPC，图12中未示出第一补强板233对应的FPC区域和第三补强板235对应的FPC区域之间的相连部分。
通过上述图9至图12所示实施例的技术方案，可以降低光源303的上表面的高度，从而进一步降低了芯片封装结构200的整体厚度，且降低光源303顶撞显示屏110的风险，提高芯片封装结构的使用可靠性。
作为示例，图13至图15示出了芯片封装结构200的三种实施方式下的示意性俯视图。根据不同的电子设备中不同形态的容置空间，可针对不同情况选择图13至图15中所示的任一种形态的芯片封装结构200。
可选地，图13和图14所示的芯片封装结构200可对应于上文图10或图11中所示的芯片封装结构200，电路板为FPC 232，且包括第一补强板233和第二补强板234。
可选地，图15所示的芯片封装结构200可对应于上文图12中所示的芯片封装结构200，电路板为FPC 232，且包括第一补强板233和第三补强板235。为了便于说明本申请中第三补强板235的形态，图16示出了对应于图15的芯片封装结构200的仰视立体图。
可选地，在上述图14至图15所示实施例中，FPC 232的某一边与显示屏110的某一边平行或者垂直设置，指纹传感器芯片201的某一边可与FPC232的某一边呈一定夹角设置，从而使得使指纹传感器芯片201的某一边和显示屏的某一边呈一定的夹角设置，能够有效降低显示屏中的偏振片对光信号的影响，同时还可以显著减少或消除指纹成像过程中的莫尔条纹，从而提高指纹图像质量。
需要说明的是，图13至图15仅作为示例说明指纹传感器芯片201、生命体征检测传感器芯片202及其光源203三者之间的位置关系，该生命体征检测传感器芯片202还根据实际的设计需要，设置位于电路板230上的其它任意位置，本申请实施例对此不做具体限定。
在上文图3至图16所示的实施例中，芯片封装结构200中多个芯片包括：指纹传感器芯片201和生命体征检测传感器芯片202，可实现指纹检测功能和生命体征检测功能。
可选地，在上文实施例的基础上，多个芯片还可以进一步包括：环境光传感器芯片，用于检测穿过显示屏的环境光信号以进行环境光检测，从而使得芯片封装结构200可实现三种不同的检测功能。
图17示出了本申请提供的另一芯片封装结构200的示意性结构图。
如图17所示，该芯片封装结构200中多个芯片可以包括：指纹传感器芯片201、生命体征检测传感器芯片202、以及环境光传感器芯片205。具体地，该环境光传感器芯片205中设置有感光区域2051，该感光区域具体可为光感测器，例如，该光感测器包括但不限于是至少一个光电二极管。具体地，该环境光传感器芯片205用于接收穿过显示屏110后的环境光信号，以检测环境光强度。
可选地，如图17所示，为了减小乃至防止环境光传感器芯片205、指纹传感器芯片201以及生命体征检测传感器芯片202两两之间的光学串扰，环境光传感器芯片205、指纹传感器芯片201以及生命体征检测传感器芯片202两两之间距离需大于预设阈值，以减小经过某一芯片反射或散射的杂散光信号进入其它两个芯片中，对相应的检测性能造成干扰。
可以理解的是，该环境光传感器芯片205除了包括光检测器以外，还可以包括其它相关的信号处理电路、信号控制电路等辅助电路，在一些实施方式中，该信号处理电路用于将光检测器检测得到的电信号进行信号处理以得 到环境光强度信息，该信号处理电路的局部电路或者全部电路可集成设置于环境光传感器芯片中，或者该信号处理电路的局部电路或者全部电路也可单独形成一个芯片，设置于环境光传感器芯片之外。
可选地，如图17所示，芯片封装结构200还包括：泡棉层240，其设置于硬性电路板231的四周区域。进一步地，泡棉层240可贴合于上述显示屏110的保护层113中的第一保护层区域，该第一保护层区域为保护层113中第一开窗的四周区域，且该泡棉层240、硬性电路板231以及显示屏110可形成腔室结构，用于保护其中的指纹传感器芯片201、生命体征检测传感器芯片202及其环境光传感器芯片205，且起到密封防尘的作用。
需要说明的是，在本申请实施例中，除了环境光传感器芯片205以外，指纹传感器芯片201、生命体征检测传感器芯片202、硬性电路板231以及泡棉层240等相关技术特征可参见上文实施例中的相关描述，此处不做赘述。
还需要说明的是，对应于上文图3所示的实施例，在其基础上，图17所示的实施例中，芯片封装结构200中还可进一步包括生命体征检测传感器芯片202的光源203，该光源203的相关技术特征同样可参见上文实施例中的相关描述，此处不做赘述。
对应于上文图4所示的实施例，在其基础上，图18示出了本申请提供的另一芯片封装结构200的示意性结构图。
可选地，如图18所示，为了减小乃至防止指纹传感器芯片201和环境光传感器芯片205之间的光学串扰，泡棉层240除了设置于硬性电路板231的四周区域以外，泡棉层240还设置于环境光传感器芯片205与指纹传感器芯片201之间，用于防止环境光传感器芯片205反射或散射的光信号直接进入至指纹传感器芯片201干扰指纹成像，且防止指纹传感器芯片201反射或散射的光信号直接进入至环境光传感器芯片205干扰环境光检测，从而提高环境光传感器芯片205和指纹传感器芯片201的检测性能。
可选地，在本申请实施例中，如图18所示，为了配合芯片封装结构200中的泡棉层240，该泡棉层240与保护层113中的第二保护层区域贴合，该第二保护层区域为保护层113中多个第二开窗的四周区域，其中，一个第二开窗对应设置于指纹传感器芯片201上方，用于传输穿过显示屏的光信号至指纹传感器芯片201，另一个第二开窗对应于环境光传感器芯片205上方，用于传输穿过显示屏的光信号至环境光传感器芯片205。
可选地，在一些实施方式中，如电子设备中容置芯片封装结构200的空间有限，则如图18所示，环境光传感器芯片205与生命体征检测传感器芯片202之间可不设置泡棉层240，即环境光传感器芯片205可与生命体征检测传感器芯片202设置于同一腔室中。或者，为了进一步保证芯片封装结构200中各芯片的检测性能，如图19所示，在另一实施方式中，环境光传感器芯片205与生命体征检测传感器芯片202之间也设置有泡棉层240，即环境光传感器芯片205单独设置于一独立腔室中，以防止环境光传感器芯片205与生命体征检测传感器芯片202之间的光学串扰。
或者，在第三种实施方式中，环境光传感器芯片205也可与生命体征检测传感器芯片202的光源203设置于同一腔室中，即在图18所示实施例中，生命体征检测传感器芯片202与其光源203的位置互换，由于光源203的体积小，其产生的杂散光也相对较少，因而即使环境光传感器芯片205与光源203之间未设置泡棉层240，环境光传感器芯片205与光源203设置于同一腔室，光源203对环境光传感器芯片205造成的干扰也相对较小。
采用该实施方式的技术方案，既能节省芯片封装结构200在显示屏下的容置空间，也可以保证芯片封装结构200中各芯片的检测性能。
进一步地，如图18和图19所示，为了提高环境光传感器芯片205的检测性能，防止杂散光对其造成影响，在一些实施方式中，环境光传感器芯片205的上方也设置有遮光层260，可选地，该遮光层260可设置于环境光传感器芯片205中感光区域2051上方的四周。
可选地，如图18和图19所示，环境光传感器芯片205的感光区域2501上方还设置有光学层2052，该光学层2052包括但不限于是滤光层，用于通过目标波段的光信号进入到环境光传感器芯片205中，可选地，该遮光层260设置于该光学层2052四周。
作为一种示例，在本申请实施例中，光学层2052仅用于通过可见光，而阻挡非可见光，对应的，环境光传感器芯片205中的感光区域2501用于检测环境光中可见光的强度。在其它替代实施方式中，光学层2052还可以用于通过其它波段的光信号，该光学层2052和感光区域2501相互配合，以检测得到环境光中可见光的强度。该环境光传感器芯片205的相关方案可以参见相关技术的具体方案，此处不做过多赘述。
可选地，如图18和图19所示，该环境光传感器芯片205的四周也设置 有上述保护胶层250，具体地，该保护胶层250以及遮光层260的相关技术方案可以参见上文实施例中的相关描述，此处不做过多赘述。
可以理解的是，上文图17至图19中，指纹传感器芯片201、生命体征检测传感器芯片202和环境光传感器芯片205均可通过胶层设置于硬性电路板231上表面，该硬性电路板231可为印刷电路板PCB、柔性电路板FPC或者其它类型的电路板。该硬性电路板231的相关技术方案可参见上文图3至图6中硬性电路板231的相关描述，此处不做具体赘述。
除了该实施方式外，在本申请实施例中，指纹传感器芯片201、生命体征检测传感器芯片202和环境光传感器芯片205同样也可封装于柔性电路板FPC，作为示例，图20至图22示出了另三种芯片封装结构200的结构示意图。在图20至图22所示实施例中，指纹传感器芯片201、生命体征检测传感器芯片202及其光源203，以及环境光传感器芯片205封装于FPC 232，具体地，该封装方式下的具体方案可以参见上文图7和图8所示实施例的具体描述。另外，在该实施方式下，光源203的相关设置方式可以参见上文图9至图12中的相关描述，此处不做过多赘述。
如图22所示，在本申请实施例中，指纹传感器芯片201以及控制芯片204均通过胶层设置于第一补强板233的上表面，而环境光传感器芯片205、生命体征检测传感器芯片202及其光源203通过胶层设置于第三补强板235的中间区域对应补强的FPC局部区域的上表面。或者，在另一些实施方式中，第三补强板235的中间区域对应补强的FPC局部区域中设置有开窗，生命体征检测传感器芯片202和环境光传感器芯片205通过胶层设置于第三补强板235的中间区域的上表面，且设置于该开窗中，而光源203通过胶层设置于第三补强板235的中间区域对应补强的FPC局部区域的上表面。
可选地，在本申请实施例中，光源203和环境光传感器芯片205之间相邻设置，且两者之间未设置泡棉层240，由于光源203的体积小，其产生的杂散光也相对较少，因而即使环境光传感器芯片205与光源203之间未设置泡棉层240，环境光传感器芯片205与光源203设置于同一腔室，光源203对环境光传感器芯片202造成的干扰也相对较小。采用该实施方式的技术方案，既能节省芯片封装结构200在显示屏下的容置空间，也可以保证芯片封装结构200中各芯片的检测性能。
当然，在显示屏下的容置空间足够时，光源203和环境光传感器芯片205 之间也可设置泡棉层240，防止两者之间的光学串扰，进一步提升芯片封装结构200的检测性能。
对应于上文图13至图15所示的芯片封装结构200的俯视图，图23至图25示出了芯片封装结构200的另三种实施方式下的示意性俯视图。
需要说明的是，图23至图25仅作为示例说明指纹传感器芯片201、生命体征检测传感器芯片202及其光源203、环境光传感器芯片205四者之间的位置关系，该环境光传感器芯片205还根据实际的设计需要，设置位于电路板230上的其它任意位置，本申请实施例对此不做具体限定。
可以理解的是，除了上文所示的实施例以外，芯片封装结构200还可仅包括指纹传感器芯片201和环境光传感器芯片205两种芯片，从而实现指纹检测功能和环境光检测功能，或者，芯片封装结构200也可仅包括生命体征检测传感器芯片202和环境光传感器芯片205两种芯片，从而实现生命体征检测功能和环境光检测功能。具体的实施方式可以参见上文相关描述，此处不做过多赘述。
以上结合附图详细描述了本申请的优选实施方式，但是，本申请并不限于上述实施方式中的具体细节，在本申请的技术构思范围内，可以对本申请的技术方案进行多种简单变型，这些简单变型均属于本申请的保护范围。
例如，在上述具体实施方式中所描述的各个具体技术特征，在不矛盾的情况下，可以通过任何合适的方式进行组合，为了避免不必要的重复，本申请对各种可能的组合方式不再另行说明。
又例如，本申请的各种不同的实施方式之间也可以进行任意组合，只要其不违背本申请的思想，其同样应当视为本申请所公开的内容。
本申请实施例还提供了一种电子设备，该电子设备可以包括：
显示屏以及上述任一申请实施例的芯片封装结构200，该芯片封装结构设置于显示屏下方，用于接收经过显示屏上方手指并穿过显示屏的光信号和/或穿过显示屏的环境光信号，以实现以下至少两种检测功能：指纹检测、生命体征检测和环境光检测。
该电子设备可以为任何具有显示屏的电子设备。该显示屏可以为OLED显示屏、LCD显示屏或者相关技术中其它类型的显示屏。具体可以对应于前述实施例中的显示屏110，其相关说明可以参考可以参照前述关于显示屏110的描述，为了简洁，在此不再赘述。
可选地，该芯片封装结构可通过泡棉层与胶层与显示屏固定连接，以设置在显示屏的下方，在一些实施方式中，该芯片封装结构用于设置在显示屏的中部区域或者中下部区域的下方，以适应于用户的惯常按压区域。
可选地，电子设备还包括中框，该芯片封装结构可固定设置于中框，例如设置于中框的上表面，或者，中框的上表面设置有凹槽，芯片封装结构固定设置于凹槽中。
可选地，该中框可以对应于前述实施例中的中框120，其相关说明可以参考可以参照前述关于中框120的描述，为了简洁，在此不再赘述。
应理解，本申请实施例中的具体的例子只是为了帮助本领域技术人员更好地理解本申请实施例，而非限制本申请实施例的范围。
应理解，在本申请实施例和所附权利要求书中使用的术语是仅仅出于描述特定实施例的目的，而非旨在限制本申请实施例。例如，在本申请实施例和所附权利要求书中所使用的单数形式的“一种”、“上述”和“该”也旨在包括多数形式，除非上下文清楚地表示其他含义。
本领域普通技术人员可以意识到，结合本文中所公开的实施例描述的各示例的单元，能够以电子硬件、计算机软件或者二者的结合来实现，为了清楚地说明硬件和软件的可互换性，在上述说明中已经按照功能一般性地描述了各示例的组成及步骤。这些功能究竟以硬件还是软件方式来执行，取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能，但是这种实现不应认为超出本申请的范围。
在本申请所提供的几个实施例中，应该理解到，所揭露的系统、装置，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另外，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口、装置或单元的间接耦合或通信连接，也可以是电的，机械的或其它的形式连接。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或 者全部单元来实现本申请实施例方案的目的。
另外，在本申请各个实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以是两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现，也可以采用软件功能单元的形式实现。
所述集成的单元如果以软件功能单元的形式实现并作为独立的产品销售或使用时，可以存储在一个计算机可读取存储介质中。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分，或者该技术方案的全部或部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质中，包括若干指令用以使得一台计算机设备(可以是个人计算机，服务器，或者网络设备等)执行本申请各个实施例所述方法的全部或部分步骤。而前述的存储介质包括：U盘、移动硬盘、只读存储器(Read-Only Memory，ROM)、随机存取存储器(Random Access Memory，RAM)、磁碟或者光盘等各种可以存储程序代码的介质。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (29)

  1. 一种芯片封装结构，其特征在于，用于设置在电子设备的显示屏的下方，包括：
    电路板；
    多个芯片，所述多个芯片的至少部分设置于所述电路板上方，且所述多个芯片封装于所述电路板；
    其中，所述多个芯片包括指纹传感器芯片、环境光传感器芯片以及生命体征检测传感器芯片中的至少两种，所述指纹传感器芯片用于接收经过所述显示屏上方手指后穿过所述显示屏的指纹光信号以进行指纹检测，所述生命体征检测传感器用于接收经过所述手指后穿过所述显示屏的生命体征光信号以进行生命体征检测，所述环境光传感器芯片用于接收穿过所述显示屏的环境光信号以进行环境光检测。
  2. 根据权利要求1所述的芯片封装结构，其特征在于，所述多个芯片包括所述生命体征检测传感器，所述芯片封装结构还包括：所述生命体征检测传感器的光源；
    所述光源设置于所述生命体征检测传感器的一侧，并封装于所述电路板，所述光源包括以下至少一种光源：红光光源、绿光光源以及红外光光源。
  3. 根据权利要求1或2所述的芯片封装结构，其特征在于，所述多个芯片还包括所述指纹传感器芯片，所述电路板为柔性电路板，所述芯片封装结构还包括：第一补强板，设置于所述柔性电路板的下方，用于支撑所述柔性电路板；
    所述柔性电路板中设置有开窗，所述多个芯片中的至少所述指纹传感器芯片设置于所述第一补强板的上方，且设置于所述开窗中。
  4. 根据权利要求3所述的芯片封装结构，其特征在于，所述第一补强板包括第一补强区域和第二补强区域，所述多个芯片中的至少所述指纹传感器芯片设置于所述第一补强区域的上方，所述生命体征检测传感器的光源设置于所述第二补强区域对应的电路板区域的上方；
    其中，所述第二补强区域的上表面低于所述第一补强区域的上表面。
  5. 根据权利要求4所述的芯片封装结构，其特征在于，所述第一补强板设置于所述电子设备的中框的上表面，所述第二补强区域的厚度小于所述第一补强区域的厚度。
  6. 根据权利要求3所述的芯片封装结构，其特征在于，所述芯片封装结构还包括：第二补强板，所述生命体征检测传感器的光源设置于所述第二补强板对应的电路板区域的上方；
    其中，所述第二补强板的上表面低于所述第一补强板的上表面。
  7. 根据权利要求6所述的芯片封装结构，其特征在于，所述第一补强板和所述第二补强板均设置于所述电子设备的中框的上表面，所述第二补强板的厚度小于所述第一补强板的厚度；或者，
    所述第一补强板设置于所述电子设备的中框的上表面，所述第二补强板设置于所述电子设备的中框的凹槽中，所述第二补强板的厚度不大于所述第一补强板的厚度。
  8. 根据权利要求3所述的芯片封装结构，其特征在于，所述芯片封装结构还包括：第三补强板，所述第三补强板的边缘区域向上弯曲，形成台阶结构，所述生命体征检测传感器的光源设置于所述第三补强板的中间区域对应的电路板区域的上方；
    其中，所述第三补强板的中间区域的上表面低于所述第一补强板的上表面。
  9. 根据权利要求8所述的芯片封装结构，其特征在于，所述第一补强板设置于所述电子设备的中框的上表面，且所述中框还形成有通孔，所述第三补强板的台阶结构用于搭接在所述通孔的边缘。
  10. 根据权利要求8或9所述的芯片封装结构，其特征在于，所述芯片封装结构还包括：所述环境光传感器芯片，所述环境光传感器芯片和/或所述生命体征检测传感器与所述生命体征检测传感器的光源一起设置于所述第三补强板的中间区域对应的电路板区域的上方。
  11. 根据权利要求1至10中任一项所述的芯片封装结构，其特征在于，所述芯片封装结构还包括：泡棉层，设置于所述电路板的边缘区域的上方；
    所述泡棉层的上表面与所述显示屏贴合，所述泡棉层、所述电路板与所述显示屏形成腔室结构，用于保护所述多个芯片。
  12. 根据权利要求11所述的芯片封装结构，其特征在于，所述泡棉层与所述显示屏的保护层中的第一保护层区域贴合，所述第一保护层区域为所述保护层中第一开窗的四周区域，所述第一开窗对应设置于所述多个芯片上方，用于传输穿过所述显示屏的光信号至所述多个芯片。
  13. 根据权利要求11所述的芯片封装结构，其特征在于，所述多个芯片包括所述指纹传感器芯片，所述泡棉层还设置于所述指纹传感器芯片与所述多个芯片中除所述指纹传感器芯片外的其它芯片之间。
  14. 根据权利要求13所述的芯片封装结构，其特征在于，所述泡棉层与所述显示屏的保护层中的第二保护层区域贴合，所述第二保护层区域为所述保护层中多个第二开窗的四周区域，所述多个第二开窗一一对应的设置于所述多个芯片上方，用于传输穿过所述显示屏的光信号至所述多个芯片。
  15. 根据权利要求11所述的芯片封装结构，其特征在于，所述多个芯片包括所述生命体征检测传感器，且所述芯片封装结构还包括所述生命体征检测传感器的光源；
    所述泡棉层还设置于所述生命体征检测传感器与其光源之间。
  16. 根据权利要求15所述的芯片封装结构，其特征在于，所述泡棉层与所述显示屏的保护层中的第三保护层区域贴合，所述第三保护层区域为所述保护层中两个第三开窗的四周区域，所述两个第三开窗一一对应的设置于所述生命体征检测传感器与其光源上方，用于传输所述光源的光信号至所述手指，且传输经过所述手指并穿过所述显示屏的光信号至所述生命体征检测传感器。
  17. 根据权利要求15或16所述的芯片封装结构，其特征在于，所述多个芯片还包括所述环境光传感器，所述生命体征检测传感器的光源与所述环境光传感器相邻设置，且所述光源与所述环境光传感器之间未设置所述泡棉层。
  18. 根据权利要求1至17中任一项所述的芯片封装结构，其特征在于，所述多个芯片包括所述指纹传感器芯片和/或所述环境光传感器芯片，所述芯片封装结构还包括：遮光层，设置于所述指纹传感器芯片中感光区域上方的四周和/或所述环境光传感器芯片中感光区域上方的四周。
  19. 根据权利要求18所述的芯片封装结构，其特征在于，所述芯片封装结构还包括：光学组件，设置于所述指纹传感器芯片的上表面，用于引导所述指纹光信号进入到所述指纹传感器芯片中，所述遮光层设置于所述光学组件四周。
  20. 根据权利要求18或19所述的芯片封装结构，其特征在于，所述芯片封装结构还包括：光学层，设置于所述环境光传感器芯片的上表面，用于 通过目标波段的光信号进入所述环境光传感器芯片中，所述遮光层设置于所述光学层四周。
  21. 根据权利要求18至20中任一项所述的芯片封装结构，其特征在于，所述芯片封装结构还包括：保护胶层，设置于所述遮光层下方，用于支撑所述遮光层。
  22. 根据权利要求21所述的芯片封装结构，其特征在于，所述保护胶层还设置于所述多个芯片的四周，用于保护所述多个芯片；和/或，
    所述保护胶层包覆所述多个芯片与所述电路板之间的引线，用于保护所述引线。
  23. 根据权利要求1至22中任一项所述的芯片封装结构，其特征在于，所述芯片封装结构还包括：控制芯片，设置于所述指纹传感器芯片的一侧，并封装于所述电路板；
    所述电路板用于传输所述指纹传感器芯片和所述控制芯片的信号，且所述控制芯片用于控制所述指纹传感器芯片运行，和/或，对所述指纹传感器芯片产生的信号进行处理以进行指纹检测。
  24. 根据权利要求23所述的芯片封装结构，其特征在于，所述控制芯片还用于控制所述环境光传感器芯片运行，和/或，所述控制芯片还用于控制所述生命体征检测传感器运行。
  25. 根据权利要求1至24中任一项所述的芯片封装结构，其特征在于，所述芯片封装结构还包括：连接器和/或被动元件，所述多个芯片共用所述连接器和/或所述被动元件。
  26. 根据权利要求1至25中任一项所述的芯片封装结构，其特征在于，所述多个芯片通过板上芯片COB封装方式封装于所述电路板。
  27. 根据权利要求1至26中任一项所述的芯片封装结构，其特征在于，所述芯片封装结构固定设置于所述电子设备的中框，以设置于所述显示屏的下方；或者，
    所述芯片封装结构通过泡棉层与胶层与所述显示屏固定连接，以设置于所述显示屏的下方。
  28. 根据权利要求1至27中任一项所述的芯片封装结构，其特征在于，所述芯片封装结构用于设置在所述显示屏的中部区域或者中下部区域的下方。
  29. 一种电子设备，其特征在于，包括：显示屏；以及
    如上述权利要求1至28中任一项所述的芯片封装结构，所述芯片封装结构设置于所述显示屏下方，用于接收经过所述显示屏上方手指并穿过所述显示屏的光信号和/或穿过所述显示屏的环境光信号，以实现以下至少两种检测功能：指纹检测、生命体征检测和环境光检测。
PCT/CN2021/075643 2021-02-05 2021-02-05 芯片封装结构和电子设备 WO2022165770A1 (zh)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100302206A1 (en) * 2009-06-01 2010-12-02 Ming-Chang Yu Touch sensing display and touch panel thereof
CN108475334A (zh) * 2017-06-29 2018-08-31 深圳市汇顶科技股份有限公司 指纹识别装置和终端设备
CN109196524A (zh) * 2018-02-23 2019-01-11 深圳市汇顶科技股份有限公司 具有有机发光二极管（oled）屏幕或其他屏幕的设备中用于屏上指纹感测的屏下光学传感器模块中经由成像透镜和成像针孔的光学成像
CN109416737A (zh) * 2018-09-21 2019-03-01 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN110533008A (zh) * 2019-09-18 2019-12-03 上海菲戈恩微电子科技有限公司 光学生物识别模组及制备方法、显示装置和电子设备
CN110770749A (zh) * 2019-03-21 2020-02-07 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100302206A1 (en) * 2009-06-01 2010-12-02 Ming-Chang Yu Touch sensing display and touch panel thereof
CN108475334A (zh) * 2017-06-29 2018-08-31 深圳市汇顶科技股份有限公司 指纹识别装置和终端设备
CN109196524A (zh) * 2018-02-23 2019-01-11 深圳市汇顶科技股份有限公司 具有有机发光二极管（oled）屏幕或其他屏幕的设备中用于屏上指纹感测的屏下光学传感器模块中经由成像透镜和成像针孔的光学成像
CN109416737A (zh) * 2018-09-21 2019-03-01 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN110770749A (zh) * 2019-03-21 2020-02-07 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN110533008A (zh) * 2019-09-18 2019-12-03 上海菲戈恩微电子科技有限公司 光学生物识别模组及制备方法、显示装置和电子设备

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