WO2020113820A1 - 柔性oled面板 - Google Patents

柔性oled面板 Download PDF

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Publication number
WO2020113820A1
WO2020113820A1 PCT/CN2019/075007 CN2019075007W WO2020113820A1 WO 2020113820 A1 WO2020113820 A1 WO 2020113820A1 CN 2019075007 W CN2019075007 W CN 2019075007W WO 2020113820 A1 WO2020113820 A1 WO 2020113820A1
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WIPO (PCT)
Prior art keywords
layer
organic
disposed
retaining wall
inorganic
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Ceased
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PCT/CN2019/075007
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English (en)
French (fr)
Inventor
邬可荣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US16/467,982 priority Critical patent/US11081661B2/en
Publication of WO2020113820A1 publication Critical patent/WO2020113820A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the invention relates to the field of display technology, in particular to a flexible OLED panel.
  • the flexible OLED panel adopts thin film encapsulation (TFE) technology, as shown in FIGS. 1A and 1B, the current common TFE film layer structure 150 is an inorganic layer 151/ The organic layer 152/inorganic layer 153 overlap and match. In this way, the inorganic layer is used to achieve the effect of isolating moisture/oxygen, and the organic film layer is used to planarize and release the stress of the inorganic layer.
  • TFE thin film encapsulation
  • two barrier walls 121 and 122 are made near the cutting line, that is, near the edge of the flexible OLED panel, to prevent the overflow of the organic layer 152 of the TFE.
  • the inorganic layers 151, 153 and the organic layer 152 are only in planar contact, they are close to the bending region 20. Due to the bending stress, the organic layer 152 and the inorganic layers 151, 153 of TFE are peeled (Peeling). Especially at the boundary in contact with the retaining walls 121 and 122, moisture/oxygen permeates into the flexible OLED panel through the peeling place, thereby causing poor display.
  • the purpose of the present invention is to provide a flexible OLED panel that allows the organic layer in the TFE packaging structure to contact the flexible substrate to increase the adhesion of the organic layer and avoid the problem of peeling.
  • Another object of the present invention is to provide a flexible OLED panel that can further improve the ability to isolate moisture/oxygen and improve the quality of the flexible OLED panel package.
  • the present invention provides a flexible OLED panel, which includes:
  • a flexible substrate, the flexible substrate includes:
  • a first organic layer is a first organic layer
  • a first retaining wall is disposed on the buffer layer, the first retaining wall surrounds the buffer layer groove and defines a display area;
  • a second retaining wall disposed on the buffer layer and above the plurality of grooves, the second retaining wall surrounding the first retaining wall;
  • An encapsulation layer is disposed in the display area.
  • the encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer. Part of the organic encapsulation layer is disposed in the buffer layer groove And in contact with the second organic layer.
  • the organic encapsulation layer is disposed between the first inorganic encapsulation layer and the second inorganic encapsulation layer
  • the material of the second organic layer includes polyimide.
  • the first retaining wall and the second retaining wall are formed of organic materials.
  • the buffer layer is in contact with the inorganic layer.
  • the first inorganic encapsulation layer is disposed on the buffer layer, and the second inorganic encapsulation layer is disposed on the organic encapsulation layer.
  • the second inorganic encapsulation layer covers the first retaining wall and the second retaining wall.
  • the present invention also provides a flexible OLED panel.
  • the flexible OLED panel includes:
  • a flexible substrate including a groove
  • a first retaining wall is disposed on the buffer layer, the first retaining wall surrounds the buffer layer groove and defines a display area;
  • a second retaining wall disposed on the buffer layer and above the groove, the second retaining wall surrounding the first retaining wall;
  • An encapsulation layer is disposed in the display area.
  • the encapsulation layer includes an organic encapsulation layer. Part of the organic encapsulation layer is disposed in the buffer layer groove and contacts the flexible substrate.
  • the flexible OLED panel further includes a flat layer and a pixel definition layer, the flat layer and the pixel definition layer are located in the display area, wherein the flat layer is disposed on the buffer layer And the pixel definition layer is disposed on the flat layer.
  • the encapsulation layer further includes a first inorganic encapsulation layer and a second inorganic encapsulation layer, and the organic encapsulation layer is disposed on the first inorganic encapsulation layer and the second inorganic encapsulation layer between.
  • the flexible substrate includes a polyimide layer, and the polyimide layer contacts the organic encapsulation layer.
  • the first retaining wall and the second retaining wall are formed of organic materials.
  • the present invention also provides a flexible OLED panel.
  • the flexible OLED panel includes:
  • a flexible substrate, the flexible substrate includes:
  • a first organic layer is a first organic layer
  • An encapsulation layer is disposed in the display area.
  • the encapsulation layer includes an organic encapsulation layer. Part of the organic encapsulation layer is disposed in the buffer layer groove and contacts the flexible substrate.
  • the material of the second organic layer includes polyimide.
  • the flexible OLED panel further includes: a second blocking wall disposed on the buffer layer and above the groove, the second blocking wall surrounding the first blocking wall.
  • the first retaining wall and the second retaining wall are formed of organic materials.
  • the flexible OLED panel further includes a flat layer and a pixel definition layer, the flat layer and the pixel definition layer are located in the display area, wherein the flat layer is disposed on the buffer layer And the pixel definition layer is disposed on the flat layer.
  • the beneficial effect of the present invention is that the buffer layer groove connects the organic encapsulation layer to the flexible substrate, increases the contact area of the organic encapsulation layer, thereby improving the adhesion of the organic encapsulation layer and avoiding the problem of peeling.
  • the buffer layer is brought into contact with the inorganic layer in the flexible substrate, thereby further improving the ability to isolate moisture/oxygen, and improving the quality of the flexible OLED panel package.
  • FIG. 1A is a top view of a conventional flexible OLED panel.
  • FIG. 1B is a cross-sectional view of the line A-A in FIG. 1A.
  • FIG. 2 is a partial cross-sectional view of a flexible OLED panel according to an embodiment of the invention.
  • FIG 3 is a partial cross-sectional view of a flexible OLED panel according to another embodiment of the present invention.
  • FIG. 4 shows a schematic diagram of the material types of the various layers in FIG. 3.
  • FIG. 1A is a top view of a conventional flexible OLED panel.
  • the existing flexible OLED panel includes a display area 10, a bending area 20, a first retaining wall 121 and a second retaining wall 122, the first retaining wall 121 surrounds the display area 10, and the second The retaining wall 122 surrounds the first retaining wall 121.
  • the first retaining wall 121 is adjacent to the edge of the flexible OLED panel and the bending area 20, and the second retaining wall 122 is at the edge of the flexible OLED panel/the bending area 20 and the first retaining wall 121 between.
  • FIG. 1B is a cross-sectional view of the line A-A in FIG. 1A.
  • the existing flexible OLED panel includes a flexible substrate 100, a buffer layer 110, a flat layer 130, a pixel definition layer 140 and a packaging layer 150.
  • the encapsulation layer 150 includes a first inorganic encapsulation layer 151, an organic encapsulation layer 152, and a second inorganic encapsulation layer 153.
  • the flat layer 130 is modified, and the undulation of the film layer above the flat layer 130 is not too large.
  • the first inorganic encapsulation layer 151, the organic encapsulation layer 152, and the second inorganic encapsulation layer 153 are in planar contact, and even exaggeratedly, there is only one surface contact. Therefore, when the bending region 20 of the flexible OLED panel is stressed (as indicated by arrow 500), the first inorganic encapsulation layer 151, the organic encapsulation layer 152, and the second inorganic encapsulation layer 153 The contact surface may cause peeling (not shown), so that water vapor/oxygen penetrates into the flexible OLED panel through the peeling location, thereby causing poor display.
  • FIG. 2 is a partial cross-sectional view of a flexible OLED panel according to an embodiment of the present invention.
  • the position of the cross section is similar to the position of the line A-A in FIG. 1A.
  • This embodiment provides a flexible OLED panel.
  • the flexible OLED panel includes: a flexible substrate 200, a buffer layer 210, a first retaining wall 221, a second retaining wall 222, a flat layer 230, and a pixel definition Layer 240 and an encapsulation layer 250.
  • the flexible substrate 200 includes a first organic layer 201, an inorganic layer 202, and a second organic layer 203.
  • the inorganic layer 202 is disposed on the first organic layer 201
  • the second organic layer 203 is disposed on the inorganic layer 202.
  • the second organic layer 203 includes one or more grooves 204.
  • the material of the second organic layer 203 may include polyimide (Polyimide, PI).
  • the groove 204 may be formed by exposure development or other similar techniques.
  • the material of the first organic layer 201 may be the same as the second organic layer 203.
  • the buffer layer 210 is disposed on the flexible substrate 200, especially on the second organic layer 203. In addition, part of the buffer layer 210 is located in the groove 204 and is in contact with the inorganic layer 202.
  • the buffer layer 200 includes a buffer layer groove 211.
  • the buffer layer groove 211 exposes the second organic layer 203 of the flexible substrate 200.
  • the buffer layer 210 may be an inorganic material, for example, silicon nitride (SiNx), silicon oxide (SiOx), or other single-layer films or laminated films with moisture/oxygen barrier properties.
  • the first blocking wall 221 is disposed on the buffer layer 210.
  • the first blocking wall 221 surrounds the buffer layer groove 211 and defines a display area 10.
  • the second retaining wall 222 is disposed on the buffer layer 210 and above the groove 204.
  • the second retaining wall 222 surrounds the first retaining wall 221. Similar to the top view of the existing flexible OLED panel shown in FIG. 1A, the second retaining wall 222 is between the edge of the flexible OLED panel and the first retaining wall 221, or the second retaining wall 222 is on the flexible OLED Between the bending area 20 of the panel and the first retaining wall 221.
  • the first retaining wall 221 and the second retaining wall 222 may be formed of organic materials, such as hexamethyldimethicone, polyimide, or other suitable organic materials.
  • the flat layer 230 and the pixel definition layer 240 are located in the display area 10, wherein the flat layer 230 is disposed on the buffer layer 210, and the pixel definition layer 240 is disposed on the flat layer 230.
  • the materials of the flat layer 230 and the pixel definition layer 240 may be organic materials.
  • the encapsulation layer 250 is disposed on the display area 10.
  • the encapsulation layer 250 includes a first inorganic encapsulation layer 251, an organic encapsulation layer 252 and a second inorganic encapsulation layer 253.
  • the organic encapsulation layer 252 is disposed between the first inorganic encapsulation layer 251 and the second inorganic encapsulation layer 253.
  • Part of the organic encapsulation layer 252 is disposed in the buffer layer groove 211 and is in contact with the second organic layer 203 of the flexible substrate 200.
  • the organic encapsulation layer 252 contacts the inner sidewall of the first blocking wall 221.
  • the first inorganic encapsulation layer 251 is disposed on the pixel definition layer 240, and the second inorganic encapsulation layer 253 is disposed on the organic encapsulation layer 252.
  • the second inorganic encapsulation layer 253 also covers the first retaining wall 221 and the second retaining wall 222 at the same time.
  • the first inorganic encapsulation layer 251 and the second inorganic encapsulation layer 253 can be enhanced chemical vapor deposition (PECVE), atomic layer deposition (ALD), pulsed laser deposition (PLD), sputtering (Sputter), or evaporation (Evaporation) and other technologies.
  • PECVE chemical vapor deposition
  • ALD atomic layer deposition
  • PLD pulsed laser deposition
  • Putter sputtering
  • Etvaporation evaporation
  • the materials of the first inorganic encapsulation layer 251 and the second inorganic encapsulation layer 253 may include aluminum oxide (Al2O3), zinc peroxide (ZnO2), titanium dioxide (TiO2), silicon nitride (SiNx), silicon carbonitride One or more combinations of (SiCNx), silicon oxide (SiOx), zirconium dioxide (ZrO2), and aluminum nitride (AlN).
  • Al2O3 aluminum oxide
  • ZnO2 zinc peroxide
  • TiO2 titanium dioxide
  • SiNx silicon nitride
  • SiNx silicon carbonitride
  • SiCNx silicon oxide
  • SiOx silicon oxide
  • ZrO2 zirconium dioxide
  • AlN aluminum nitride
  • the organic encapsulation layer 252 can be spin-coated, screen-printed, slit spin-coated, dispensing, inkjet printing (Ink Jet Printing, IJP) or similar technology.
  • the material of the organic encapsulation layer 252 includes one or more of acrylate, hexamethyldimethicone, polyacrylate, polycarbonate, and polystyrene.
  • the organic encapsulation layer 252 contacts the second organic layer 203 of the flexible substrate 200 through the buffer layer groove 211, except for the contact of the organic encapsulation layer 252
  • the contact with the second organic layer 203 also improves the adhesion of the organic encapsulation layer 252 and greatly reduces the risk of peeling.
  • the buffer layer 210 contacts the inorganic layer 202 through the groove 204, which increases the difficulty of moisture/oxygen intrusion from the side of the flexible substrate 200, thereby improving the moisture/oxygen isolation of the flexible OLED panel Ability.
  • such a design can also improve the adhesion of the buffer layer 210.
  • FIG. 3 is a partial cross-sectional view of a flexible OLED panel according to another embodiment of the present invention.
  • the position of the cross section is similar to the position of the line A-A in FIG. 1A.
  • This embodiment provides a flexible OLED panel.
  • the flexible OLED panel includes: a flexible substrate 300, a buffer layer 310, a first retaining wall 321, a second retaining wall 322, and an encapsulation layer 350.
  • the flexible substrate 300 includes a first organic layer 301, an inorganic layer 302, and a second organic layer 303.
  • the inorganic layer 302 is disposed on the first organic layer 301
  • the second organic layer 303 is disposed on the inorganic layer 302.
  • the second organic layer 303 includes one or more grooves 304.
  • the material of the second organic layer 303 may include polyimide (Polyimide, PI).
  • the groove 304 may be formed by exposure development or other similar techniques.
  • the material of the first organic layer 301 may be the same as the second organic layer 303.
  • the buffer layer 310 is disposed on the flexible substrate 300, especially on the second organic layer 303. In addition, part of the buffer layer 310 is located in the groove 304 and is in contact with the inorganic layer 302.
  • the buffer layer 300 includes a buffer layer groove 311.
  • the buffer layer groove 311 exposes the second organic layer 303 of the flexible substrate 300.
  • the buffer layer 310 may be an inorganic material, for example, silicon nitride (SiNx), silicon oxide (SiOx), or other single-layer films or laminated films with moisture/oxygen barrier effect.
  • the first blocking wall 321 is disposed on the buffer layer 310.
  • the first blocking wall 321 surrounds the buffer layer groove 311 and defines a display area 10.
  • the second retaining wall 322 is disposed on the buffer layer 310 and above the groove 304.
  • the second retaining wall 322 surrounds the first retaining wall 321. Similar to the top view of the existing flexible OLED panel shown in FIG. 1A, the second blocking wall 322 is between the edge of the flexible OLED panel and the first blocking wall 321, or the second blocking wall 322 is on the flexible OLED Between the bending area 20 of the panel and the first retaining wall 321.
  • the first retaining wall 321 and the second retaining wall 322 may be formed of organic materials, such as hexamethyldimethicone, polyimide, or other suitable organic materials.
  • the encapsulation layer 350 is disposed on the display area 10.
  • the encapsulation layer 350 includes a first inorganic encapsulation layer 351, an organic encapsulation layer 352 and a second inorganic encapsulation layer 353.
  • the organic encapsulation layer 352 is disposed between the first inorganic encapsulation layer 351 and the second inorganic encapsulation layer 353.
  • Part of the organic encapsulation layer 352 is disposed in the buffer layer groove 311 and is in contact with the second organic layer 303 of the flexible substrate 300.
  • the organic encapsulation layer 352 contacts the inner sidewall of the first blocking wall 321.
  • the first inorganic encapsulation layer 351 is disposed on the buffer layer 310, and the second inorganic encapsulation layer 353 is disposed on the organic encapsulation layer 352.
  • the second inorganic encapsulation layer 353 also covers the first retaining wall 321 and the second retaining wall 322 at the same time.
  • the first inorganic encapsulation layer 351 and the second inorganic encapsulation layer 353 may be enhanced chemical vapor deposition (PECVE), atomic layer deposition (ALD), pulsed laser deposition (PLD), sputtering (Sputter), or vapor deposition (Evaporation) and other technologies.
  • PECVE chemical vapor deposition
  • ALD atomic layer deposition
  • PLD pulsed laser deposition
  • Sputter sputtering
  • Etvaporation vapor deposition
  • the materials of the first inorganic encapsulation layer 351 and the second inorganic encapsulation layer 353 may include aluminum oxide (Al2O3), zinc peroxide (ZnO2), titanium dioxide (TiO2), silicon nitride (SiNx), silicon carbonitride One or more combinations of (SiCNx), silicon oxide (SiOx), zirconium dioxide (ZrO2), and aluminum nitride (AlN).
  • Al2O3 aluminum oxide
  • ZnO2 zinc peroxide
  • TiO2 titanium dioxide
  • SiNx silicon nitride
  • SiNx silicon carbonitride
  • SiCNx silicon oxide
  • SiOx silicon oxide
  • ZrO2 zirconium dioxide
  • AlN aluminum nitride
  • the organic encapsulation layer 352 can be spin-coated, screen-printed, slit spin-coated, dispensing, inkjet printing (Ink Jet Printing, IJP) or similar technology.
  • the material of the organic encapsulation layer 352 includes one or more of acrylate, hexamethyldimethicone, polyacrylate, polycarbonate, and polystyrene.
  • the first inorganic encapsulation layer 351 directly contacts the buffer layer 310, which further increases the adhesion of the first inorganic encapsulation layer 351 and the ability to isolate moisture/oxygen.
  • FIG. 4 shows a schematic diagram of the material types of the layers in FIG. 3.
  • multiple layers of organic materials in the display area such as the second organic layer 303, the first blocking wall 321, and the organic encapsulation layer 352 are connected to form an organic structure 30. This increases the adhesion of each organic film layer.
  • a plurality of inorganic materials (such as the inorganic layer 302 and the buffer layer 310) on the outside of the display area (ie, near the second retaining wall 322) are connected to form an inorganic structure 40, thereby improving the flexible OLED The panel's ability to isolate moisture/oxygen.
  • each film layer for example, between organic layers, between inorganic layers, or between a base layer and an inorganic layer
  • water vapor/oxygen is difficult to penetrate into the display area 10 because of the inorganic structure 40.
  • the embodiment of FIG. 2 will also form similar structures and functions.
  • the beneficial effect of the present invention is that the buffer layer groove connects the organic encapsulation layer to the flexible substrate, increases the contact area of the organic encapsulation layer, thereby improving the adhesion of the organic encapsulation layer and avoiding the problem of peeling.
  • the buffer layer is brought into contact with the inorganic layer in the flexible substrate, thereby further improving the ability to isolate moisture/oxygen, and improving the quality of the flexible OLED panel package.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
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Abstract

本发明公开了一种柔性OLED面板，包括：一柔性基底，包括一凹槽；一缓冲层，设置于所述柔性基底上，所述缓冲层包括一缓冲层凹槽；一第一挡墙，设置于所述缓冲层上，所述第一挡墙围绕所述缓冲层凹槽并且定义形成一显示区；一第二挡墙，设置于所述缓冲层上并且位于所述凹槽上方，所述第二挡墙围绕所述第一挡墙；及一封装层，设置于所述显示区，所述封装层包括一有机封装层，部分所述有机封装层设置于所述缓冲层凹槽中并且与所述柔性基底接触。

Description

柔性OLED面板 技术领域
本发明涉及显示技术领域，特别是涉及一种柔性OLED面板。
 背景技术
柔性OLED面板最大的优势在于其可做成可折叠\可卷曲的产品。相较于使用玻璃封装的刚性OLED面板(无法弯折)，柔性OLED面板是采用薄膜封装(TFE)技术，如图1A及图1B所示，现行常见TFE的膜层结构150为无机层151/有机层152/无机层153的交叠搭配。藉此，利用无机层达到隔绝水气/氧气的功效，并且通过有机膜层达到平坦化及释放无机层应力的功效。然而，相较于使用玻璃封装的刚性OLED面板，TFE封装结构的隔绝水气/氧气的能力还需要进一步提高。
 技术问题
而上述现行的柔性OLED面板，在靠近切割线附近，也就是柔性OLED面板边缘附近，制作两道挡墙121、122分别用来避免TFE的有机层152外溢。然而，由于无机层151、153与有机层152之间仅为平面接触，因此靠近弯折区20，由于弯折的应力影响，TFE的有机层152与无机层151、153发生剥离(Peeling)，特别是在与挡墙121、122接触的边界处，使得水气/氧气通过剥离处渗入柔性OLED面板中，进而引起显示不良。
故，有必要提供一种柔性OLED面板，以解决现有技术所存在的问题。
 技术解决方案
本发明的目的在于提供一种柔性OLED面板，让TFE封装结构中的有机层与柔性基板接触，增加有机层的附着力，避免剥离的问题发生。本发明的另一目的在于提供一种柔性OLED面板，可以进一步提高隔绝水气/氧气的能力，提升柔性OLED面板封装的品质。
为达成本发明的前述目的，本发明提供一种柔性OLED面板，其包含：
一柔性基底，所述柔性基底包括：
一第一有机层；
一无机层，设置于所述第一有机层上；及
一第二有机层，设置于所述无机层上，所述第二有机层包括多个凹槽；
一缓冲层，设置于所述第二有机层上及所述多个凹槽内，所述缓冲层包括一缓冲层凹槽，所述缓冲层凹槽暴露出所述第二有机层；
一第一挡墙，设置于所述缓冲层上，所述第一挡墙围绕所述缓冲层凹槽并且定义形成一显示区；
一第二挡墙，设置于所述缓冲层上并且位于所述多个凹槽上方，所述第二挡墙围绕所述第一挡墙；及
一封装层，设置于所述显示区，所述封装层包括一第一无机封装层、一有机封装层及一第二无机封装层，部分所述有机封装层设置于所述缓冲层凹槽中并且与所述第二有机层接触。
根据本发明一实施例，所述有机封装层设置于所述第一无机封装层及所述第二无机封装层之间
根据本发明一实施例，所述第二有机层的材料包括聚酰亚胺。
根据本发明一实施例，所述第一挡墙及所述第二挡墙是由有机材料所形成。
根据本发明一实施例，所述缓冲层与所述无机层接触。
根据本发明一实施例，所述第一无机封装层设置于所述缓冲层上，并且所述第二无机封装层设置于所述有机封装层上。
根据本发明一实施例，所述第二无机封装层覆盖所述第一挡墙及所述第二挡墙。
本发明还提供一种柔性OLED面板，所述柔性OLED面板包括：
一柔性基底，包括一凹槽；
一缓冲层，设置于所述柔性基底上，所述缓冲层包括一缓冲层凹槽；
一第一挡墙，设置于所述缓冲层上，所述第一挡墙围绕所述缓冲层凹槽并且定义形成一显示区；
一第二挡墙，设置于所述缓冲层上并且位于所述凹槽上方，所述第二挡墙围绕所述第一挡墙；及
一封装层，设置于所述显示区，所述封装层包括一有机封装层，部分所述有机封装层设置于所述缓冲层凹槽中并且与所述柔性基底接触。
根据本发明一实施例，所述柔性OLED面板更包括一平坦层及一像素定义层，所述平坦层及所述像素定义层位于所示显示区，其中所述平坦层设置于所述缓冲层上，并且所述像素定义层设置于所述平坦层上。
根据本发明一实施例，所述封装层更包括一第一无机封装层及一第二无机封装层，并且所述有机封装层设置于所述第一无机封装层及所述第二无机封装层之间。
根据本发明一实施例，所述柔性基底包括一聚酰亚胺层，并且所述聚酰亚胺层接触所述有机封装层。
根据本发明一实施例，所述第一挡墙及所述第二挡墙是由有机材料所形成。
本发明还提供一种柔性OLED面板，所述柔性OLED面板包括：
一柔性基底，所述柔性基底包括：
一第一有机层；
一无机层，设置于所述第一有机层上；及
一第二有机层，设置于所述无机层上，所述第二有机层包括一凹槽；
一缓冲层，设置于所述柔性基底上，部分所述缓冲层位于所述凹槽内并且与所述无机层接触，所述缓冲层包括一缓冲层凹槽；
一第一挡墙，设置于所述缓冲层上，所述第一挡墙围绕所述缓冲层凹槽并且定义形成一显示区；及
一封装层，设置于所述显示区，所述封装层包括一有机封装层，部分所述有机封装层设置于所述缓冲层凹槽中并且与所述柔性基底接触。
根据本发明一实施例，所述第二有机层的材料包括聚酰亚胺。
根据本发明一实施例，所述柔性OLED面板更包括：一第二挡墙，设置于所述缓冲层上并且位于所述凹槽上方，所述第二挡墙围绕所述第一挡墙。
根据本发明一实施例，所述第一挡墙及所述第二挡墙是由有机材料所形成。
根据本发明一实施例，所述柔性OLED面板更包括一平坦层及一像素定义层，所述平坦层及所述像素定义层位于所示显示区，其中所述平坦层设置于所述缓冲层上，并且所述像素定义层设置于所述平坦层上。
 有益效果
本发明的有益效果为：通过缓冲层凹槽使得有机封装层与柔性基底接触相连，增加有机封装层的接触面积，进而提高有机封装层的附着力，避免剥离的问题发生。此外，通过第二有机层的凹槽，使得缓冲层与柔性基底中的无机层接触，进一步提高隔绝水气/氧气的能力，提升柔性OLED面板封装的品质。
 附图说明
为让本发明的上述内容能更明显易懂，下文特举优选实施例，并配合所附图式，作详细说明如下：
图1A是现有柔性OLED面板的上视图。
图1B是图1A中A-A线段的截面图。
图2是根据本发明一实施例的一种柔性OLED面板的部分截面图。
图3是根据本发明另一实施例的一种柔性OLED面板的部分截面图。
图4示出了图3中各膜层材料类型的示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。再者，本发明所提到的方向用语，例如上、下、顶、底、前、后、左、右、内、外、侧面、周围、中央、水平、横向、垂直、纵向、轴向、径向、最上层或最下层等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
请参照图1A，图1A是现有柔性OLED面板的上视图。现有柔性OLED面板包括一显示区10、一弯折区20、一第一挡墙121及一第二挡墙122，所述第一挡墙121围绕所述显示区10，而所述第二挡墙122围绕所述第一挡墙121。所述第一挡墙121邻近柔性OLED面板的边缘及所述弯折区20，而所述第二挡墙122在柔性OLED面板的边缘/所述弯折区20与所述第一挡墙121之间。
请参照图1B，图1B是图1A中A-A线段的截面图。现有柔性OLED面板包括一柔性基底100、一缓冲层110、一平坦层130、一像素定义层140及一封装层150。而所述封装层150包括一第一无机封装层151、一有机封装层152及一第二无机封装层153。而在所述显示区10内通过所述平坦层130的修饰，所述平坦层130之上的膜层的起伏不会太大。所述第一无机封装层151、所述有机封装层152及所述第二无机封装层153各层之间为平面接触，甚至夸张的说只有一个面的接触。因此，当柔性OLED面板的所述弯折区20受力(如箭头500所示)，所述第一无机封装层151、所述有机封装层152及所述第二无机封装层153之间的接触面就可能会造成剥离(未绘示)，使得水气/氧气通过剥离处渗入柔性OLED面板中，进而引起显示不良。
请参照图2，图2是根据本发明一实施例的一种柔性OLED面板的部分截面图。而截面的位置类似于图1A中A-A线段的位置。本实施例提供了一种柔性OLED面板，所述柔性OLED面板包括：一柔性基底200、一缓冲层210、一第一挡墙221、一第二挡墙222、一平坦层230、一像素定义层240及一封装层250。
所述柔性基底200包括一第一有机层201、一无机层202及一第二有机层203。所述无机层202设置于第一有机层201上，所述第二有机层203设置于所述无机层202上。所述第二有机层203包括一个或多个凹槽204。所述第二有机层203的材料可以包括聚酰亚胺(Polyimide, PI)。所述凹槽204可以通过曝光显影或其它相似技术形成。所述第一有机层201的材料可以与所述第二有机层203相同。
所述缓冲层210设置于所述柔性基底200上，特别是在所述第二有机层203上。此外，部分所述缓冲层210位于所述凹槽204内并且与所述无机层202接触。所述缓冲层200包括一缓冲层凹槽211。所述缓冲层凹槽211暴露出所述柔性基底200的所述第二有机层203。所述缓冲层210可以是一无机材料，例如是氮化硅(SiNx)、氧化硅(SiOx)或是其它具有隔绝水气/氧气功效的单层薄膜或叠层薄膜。
所述第一挡墙221设置于所述缓冲层210上，所述第一挡墙221围绕所述缓冲层凹槽211并且定义形成一显示区10。所述第二挡墙222设置于所述缓冲层210上并且位于所述凹槽204上方，所述第二挡墙222围绕所述第一挡墙221。与图1A所示现有柔性OLED面板的上视图相似，所述第二挡墙222在柔性OLED面板的边缘与所述第一挡墙221之间，或者所述第二挡墙222在柔性OLED面板的所述弯折区20与所述第一挡墙221之间。所述第一挡墙221及所述第二挡墙222可以是由有机材料所形成，例如六甲基二甲硅醚、聚酰亚胺或其它合适的有机材料。
所述平坦层230及所述像素定义层240位于所示显示区10，其中所述平坦层230设置于所述缓冲层210上，并且所述像素定义层240设置于所述平坦层230上。所述平坦层230及所述像素定义层240的材料可以是有机材料。
一封装层250设置于所述显示区10，所述封装层250包括一第一无机封装层251、一有机封装层252及一第二无机封装层253。所述有机封装层252设置于所述第一无机封装层251及所述第二无机封装层253之间。部分所述有机封装层252设置于所述缓冲层凹槽211中并且与所述柔性基底200的所述第二有机层203接触。此外，所述有机封装层252接触所述第一挡墙221的内侧壁。所述第一无机封装层251设置于所述像素定义层240上，并且所述第二无机封装层253设置于所述有机封装层252上。此外，所述第二无机封装层253同时也会覆盖所述第一挡墙221及所述第二挡墙222。
所述第一无机封装层251及所述第二无机封装层253可以通过增强化学气相沉积(PECVE)、原子层沉积(ALD)、脉冲激光沉积(PLD)、溅射(Sputter)、或者蒸镀(Evaporation)等技术形成。所述第一无机封装层251及所述第二无机封装层253的材料可以包括氧化铝(Al2O3)、过氧化锌(ZnO2)、二氧化钛(TiO2)、氮化硅(SiNx)、碳氮化硅(SiCNx)、氧化硅(SiOx)、二氧化锆(ZrO2)、及氮化铝(AlN)中的一种或多种组合。第一无机封装层251及所述第二无机封装层253的作用在于隔绝水气/氧气。
所述有机封装层252可以通过旋涂、网印、狭缝旋涂、点胶、喷墨打印(Ink Jet Printing, IJP)或相似技术形成。有机封装层252的材料包括丙烯酸脂、六甲基二甲硅醚、聚丙烯酸酯、聚碳酸脂、及聚苯乙烯中的一种或多种。
如此一来，图2中的实施例中，所述有机封装层252通过所述缓冲层凹槽211接触所述柔性基底200的所述第二有机层203，除了所述有机封装层252的接触面积增加之外，与所述第二有机层203的接触也进而提高所述有机封装层252的附着力，大幅降低剥离发生的风险。所述缓冲层210通过所述凹槽204接触所述无机层202，增加了水气/氧气由所述柔性基底200侧边侵入的困难度，进而提高了所述柔性OLED面板隔绝水气/氧气的能力。此外，这样的设计也可以提高所述缓冲层210的附着力。
请参照图3，图3是根据本发明另一实施例的一种柔性OLED面板的部分截面图。而截面的位置类似于图1A中A-A线段的位置。本实施例提供了一种柔性OLED面板，所述柔性OLED面板包括：一柔性基底300、一缓冲层310、一第一挡墙321、一第二挡墙322及一封装层350。
所述柔性基底300包括一第一有机层301、一无机层302及一第二有机层303。所述无机层302设置于第一有机层301上，所述第二有机层303设置于所述无机层302上。所述第二有机层303包括一个或多个凹槽304。所述第二有机层303的材料可以包括聚酰亚胺(Polyimide, PI)。所述凹槽304可以通过曝光显影或其它相似技术形成。所述第一有机层301的材料可以与所述第二有机层303相同。
所述缓冲层310设置于所述柔性基底300上，特别是在所述第二有机层303上。此外，部分所述缓冲层310位于所述凹槽304内并且与所述无机层302接触。所述缓冲层300包括一缓冲层凹槽311。所述缓冲层凹槽311暴露出所述柔性基底300的所述第二有机层303。所述缓冲层310可以是一无机材料，例如是氮化硅(SiNx)、氧化硅(SiOx)或是其它具有隔绝水气/氧气功效的单层薄膜或叠层薄膜。
所述第一挡墙321设置于所述缓冲层310上，所述第一挡墙321围绕所述缓冲层凹槽311并且定义形成一显示区10。所述第二挡墙322设置于所述缓冲层310上并且位于所述凹槽304上方，所述第二挡墙322围绕所述第一挡墙321。与图1A所示现有柔性OLED面板的上视图相似，所述第二挡墙322在柔性OLED面板的边缘与所述第一挡墙321之间，或者所述第二挡墙322在柔性OLED面板的所述弯折区20与所述第一挡墙321之间。所述第一挡墙321及所述第二挡墙322可以是由有机材料所形成，例如六甲基二甲硅醚、聚酰亚胺或其它合适的有机材料。
一封装层350设置于所述显示区10，所述封装层350包括一第一无机封装层351、一有机封装层352及一第二无机封装层353。，所述有机封装层352设置于所述第一无机封装层351及所述第二无机封装层353之间。部分所述有机封装层352设置于所述缓冲层凹槽311中并且与所述柔性基底300的所述第二有机层303接触。此外，所述有机封装层352接触所述第一挡墙321的内侧壁。所述第一无机封装层351设置于所述缓冲层310上，并且所述第二无机封装层353设置于所述有机封装层352上。此外，所述第二无机封装层353同时也会覆盖所述第一挡墙321及所述第二挡墙322。
所述第一无机封装层351及所述第二无机封装层353可以通过增强化学气相沉积(PECVE)、原子层沉积(ALD)、脉冲激光沉积(PLD)、溅射(Sputter)、或者蒸镀(Evaporation)等技术形成。所述第一无机封装层351及所述第二无机封装层353的材料可以包括氧化铝(Al2O3)、过氧化锌(ZnO2)、二氧化钛(TiO2)、氮化硅(SiNx)、碳氮化硅(SiCNx)、氧化硅(SiOx)、二氧化锆(ZrO2)、及氮化铝(AlN)中的一种或多种组合。第一无机封装层351及所述第二无机封装层353的作用在于隔绝水气/氧气。
所述有机封装层352可以通过旋涂、网印、狭缝旋涂、点胶、喷墨打印(Ink Jet Printing, IJP)或相似技术形成。有机封装层352的材料包括丙烯酸脂、六甲基二甲硅醚、聚丙烯酸酯、聚碳酸脂、及聚苯乙烯中的一种或多种。
相较于图2实施例，在图3的实施例中，在所述显示区10内并且邻近所述第一挡墙321处，没有设置平坦层及像素定义层，所述第一无机封装层351直接接触所述缓冲层310，进一步增加了第一无机封装层351的附着力及隔绝水气/氧气的能力。
请一并参照图3及图4，图4示出了图3中各膜层材料类型的示意图。本发明实施例中，所述显示区内的多层有机材料(如所述第二有机层303、所述第一挡墙321及所述有机封装层352)连接形成一有机结构体30，藉此增加各有机膜层的附着力。而在所述显示区外侧(即所述第二挡墙322附近)的多层无机材料(如所述无机层302及所述缓冲层310)连接形成一无机结构体40，藉此提高柔性OLED面板隔绝水气/氧气的能力。这样一来，当柔性OLED面板受力(如箭头501所示)时，可以大幅降低各膜层(例如，各有机层之间、各无机层之间或有基层与无机层之间)剥离发生的风险。此外，水气/氧气也因为所述无机结构体40而难以侵入到所述显示区10中。同理，图2的实施例也会形成相似的结构体及功效。
本发明的有益效果为：通过缓冲层凹槽使得有机封装层与柔性基底接触相连，增加有机封装层的接触面积，进而提高有机封装层的附着力，避免剥离的问题发生。此外，通过第二有机层的凹槽，使得缓冲层与柔性基底中的无机层接触，进一步提高隔绝水气/氧气的能力，提升柔性OLED面板封装的品质。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (17)

  1.    一种柔性OLED面板，其包含：
    一柔性基底，所述柔性基底包括：
    一第一有机层；
    一无机层，设置于所述第一有机层上；及
    一第二有机层，设置于所述无机层上，所述第二有机层包括多个凹槽；
    一缓冲层，设置于所述第二有机层上及所述多个凹槽内，所述缓冲层包括一缓冲层凹槽，所述缓冲层凹槽暴露出所述第二有机层；
    一第一挡墙，设置于所述缓冲层上，所述第一挡墙围绕所述缓冲层凹槽并且定义形成一显示区；
    一第二挡墙，设置于所述缓冲层上并且位于所述多个凹槽上方，所述第二挡墙围绕所述第一挡墙；及
    一封装层，设置于所述显示区，所述封装层包括一第一无机封装层、一有机封装层及一第二无机封装层，部分所述有机封装层设置于所述缓冲层凹槽中并且与所述第二有机层接触。
  2.    如权利要求1所述的柔性OLED面板，其中所述有机封装层设置于所述第一无机封装层及所述第二无机封装层之间。
  3.    如权利要求1所述的柔性OLED面板，其中所述第二有机层的材料包括聚酰亚胺。
  4.    如权利要求3所述的柔性OLED面板，其中所述第一挡墙及所述第二挡墙是由有机材料所形成。
  5.    如权利要求1所述的柔性OLED面板，其中所述缓冲层与所述无机层接触。
  6.    如权利要求1所述的柔性OLED面板，其中所述第一无机封装层设置于所述缓冲层上，并且所述第二无机封装层设置于所述有机封装层上。
  7.    如权利要求6所述的柔性OLED面板，其中所述第二无机封装层覆盖所述第一挡墙及所述第二挡墙。
  8.    一种柔性OLED面板，其包含：
    一柔性基底，包括一凹槽；
    一缓冲层，设置于所述柔性基底上，所述缓冲层包括一缓冲层凹槽；
    一第一挡墙，设置于所述缓冲层上，所述第一挡墙围绕所述缓冲层凹槽并且定义形成一显示区；
    一第二挡墙，设置于所述缓冲层上并且位于所述凹槽上方，所述第二挡墙围绕所述第一挡墙；及
    一封装层，设置于所述显示区，所述封装层包括一有机封装层，部分所述有机封装层设置于所述缓冲层凹槽中并且与所述柔性基底接触。
  9.    如权利要求8所述的柔性OLED面板，其中更包括一平坦层及一像素定义层，所述平坦层及所述像素定义层位于所示显示区，其中所述平坦层设置于所述缓冲层上，并且所述像素定义层设置于所述平坦层上。
  10. 如权利要求8所述的柔性OLED面板，其中所述封装层更包括一第一无机封装层及一第二无机封装层，并且所述有机封装层设置于所述第一无机封装层及所述第二无机封装层之间。
  11. 如权利要求8所述的柔性OLED面板，其中所述柔性基底包括一聚酰亚胺层，并且所述聚酰亚胺层接触所述有机封装层。
  12. 如权利要求8所述的柔性OLED面板，其中所述第一挡墙及所述第二挡墙是由有机材料所形成。
  13. 一种柔性OLED面板，其包含：
    一柔性基底，所述柔性基底包括：
    一第一有机层；
    一无机层，设置于所述第一有机层上；及
    一第二有机层，设置于所述无机层上，所述第二有机层包括一凹槽；
    一缓冲层，设置于所述柔性基底上，部分所述缓冲层位于所述凹槽内并且与所述无机层接触，所述缓冲层包括一缓冲层凹槽；
    一第一挡墙，设置于所述缓冲层上，所述第一挡墙围绕所述缓冲层凹槽并且定义形成一显示区；及
    一封装层，设置于所述显示区，所述封装层包括一有机封装层，部分所述有机封装层设置于所述缓冲层凹槽中并且与所述柔性基底接触。
  14. 如权利要求13所述的柔性OLED面板，其中所述第二有机层的材料包括聚酰亚胺。
  15. 如权利要求13所述的柔性OLED面板，其中更包括：
    一第二挡墙，设置于所述缓冲层上并且位于所述凹槽上方，所述第二挡墙围绕所述第一挡墙。
  16. 如权利要求15所述的柔性OLED面板，其中所述第一挡墙及所述第二挡墙是由有机材料所形成。
  17. 如权利要求13所述的柔性OLED面板，其中更包括一平坦层及一像素定义层，所述平坦层及所述像素定义层位于所示显示区，其中所述平坦层设置于所述缓冲层上，并且所述像素定义层设置于所述平坦层上。
PCT/CN2019/075007 2018-12-03 2019-02-14 柔性oled面板 Ceased WO2020113820A1 (zh)

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