WO2023050066A1 - 显示基板及其制备方法、显示装置 - Google Patents

显示基板及其制备方法、显示装置 Download PDF

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Publication number
WO2023050066A1
WO2023050066A1 PCT/CN2021/121357 CN2021121357W WO2023050066A1 WO 2023050066 A1 WO2023050066 A1 WO 2023050066A1 CN 2021121357 W CN2021121357 W CN 2021121357W WO 2023050066 A1 WO2023050066 A1 WO 2023050066A1
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WIPO (PCT)
Prior art keywords
layer
film layer
flexible substrate
isolation groove
isolation
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PCT/CN2021/121357
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English (en)
French (fr)
Inventor
张子予
孙韬
秦成杰
王品凡
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京东方科技集团股份有限公司
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Priority to CN202180002730.3A priority Critical patent/CN116210363A/zh
Priority to US17/793,980 priority patent/US20240179952A1/en
Priority to PCT/CN2021/121357 priority patent/WO2023050066A1/zh
Priority to GB2312276.5A priority patent/GB2618275A/en
Publication of WO2023050066A1 publication Critical patent/WO2023050066A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED

Definitions

  • the present disclosure relates to the field of display technology, in particular to a display substrate, a manufacturing method thereof, and a display device.
  • OLED Organic Light Emitting Diode
  • OLED is an active light-emitting display device, which has the advantages of self-illumination, wide viewing angle, high contrast, low power consumption, wide color gamut, light and thin, and can be shaped.
  • OLED technology is increasingly used in flexible displays.
  • an open area is usually provided on the OLED display panel. The opening area can improve the flexibility of the OLED display panel, and achieve 3D curved surface attachment, dynamic small-angle bending and other effects.
  • the present disclosure provides a display substrate, including an opening area and an isolation area arranged around the opening area, the isolation area includes: a first flexible substrate, and a flexible substrate arranged on one side of the first flexible substrate At least one isolation groove, each of which is composed of a stacked first inorganic film layer, an organic film layer and a second inorganic film layer;
  • the first inorganic film layer is arranged close to the first flexible substrate, and the first inorganic film layer has a first end surface facing the opening area; the organic film layer is arranged on the first inorganic film layer.
  • the film layer is away from the side of the first flexible substrate, and the organic film layer has a second end surface facing the opening area; the second inorganic film layer is arranged on the side of the organic film layer away from the first flexible substrate.
  • the second inorganic film layer On one side of the flexible substrate, the second inorganic film layer has a third end surface facing the opening area;
  • the second end surface is indented relative to the first end surface and the third end surface in a direction away from the opening area, and the surface of the first inorganic film layer opposite to the second inorganic film layer and The second end surface constitutes the isolation groove.
  • the at least one isolation groove includes a first isolation groove
  • the first inorganic film layer forming the first isolation groove includes a first barrier layer
  • the organic layer forming the first isolation groove The film layer is the second flexible substrate.
  • the at least one isolation groove includes a second isolation groove
  • the organic film layer constituting the second isolation groove is a first organic functional layer
  • the first organic functional layer includes at least One: a flat layer, a pixel defining layer disposed on a side of the flat layer facing away from the first flexible substrate, and a support layer disposed on a side of the pixel defining layer facing away from the first flexible substrate.
  • the first organic functional layer is provided with a first groove and a first dam, and the first groove is located at the side of the first dam away from the opening area. On one side, the first trench penetrates through the first organic functional layer.
  • the second inorganic film layer forming the second isolation groove includes a first passivation layer, and the orthographic projection of the first passivation layer on the first flexible substrate covers An orthographic projection of the first dam on the first flexible substrate.
  • the first organic functional layer is the planar layer, and the at least one isolation groove further includes The third isolation tank;
  • the first inorganic film layer forming the third isolation groove is the first passivation layer
  • the organic film layer constituting the third isolation groove is a second organic functional layer, and the second organic functional layer includes at least one of the following: disposed on the side of the first passivation layer away from the first flexible substrate A pixel defining layer and a supporting layer disposed on the side of the pixel defining layer away from the first flexible substrate;
  • the second inorganic film layer forming the third isolation groove is a second passivation layer
  • the second organic functional layer includes a third groove and a third dam
  • the third groove is located on the side of the third dam away from the opening region, and the third groove runs through
  • the orthographic projection of the third dam on the first flexible substrate is within the range of the orthographic projection of the first dam on the first flexible substrate
  • the The orthographic projection of the second passivation layer on the first flexible substrate covers the orthographic projection of the third dam on the first flexible substrate.
  • the at least one isolation groove includes a first isolation groove and a second isolation groove, and the second isolation groove is arranged on a side of the first isolation groove away from the first flexible substrate. side;
  • the first inorganic film layer constituting the first isolation groove includes a first barrier layer, the organic film layer constituting the first isolation groove is a second flexible substrate, and the second inorganic film layer constituting the first isolation groove reused as the first inorganic film layer constituting the second isolation groove;
  • the organic film layer forming the second isolation groove includes a planar layer, and the second inorganic film layer forming the second isolation groove includes a first passivation layer.
  • the flat layer is provided with a second groove and a second dam, and the second groove is located on a side of the second dam away from the opening area, the second trench runs through the planar layer;
  • the orthographic projection of the first passivation layer on the first flexible substrate covers the orthographic projection of the second dam on the first flexible substrate.
  • the at least one isolation groove further includes a third isolation groove disposed on a side of the second isolation groove away from the first flexible substrate;
  • the first inorganic film layer forming the third isolation groove is the first passivation layer
  • the organic film layer constituting the third isolation groove is a second organic functional layer, and the second organic functional layer includes at least one of the following: disposed on the side of the first passivation layer away from the first flexible substrate A pixel defining layer and a supporting layer disposed on the side of the pixel defining layer away from the first flexible substrate;
  • the second inorganic film layer forming the third isolation groove is a second passivation layer
  • the second organic functional layer includes a third groove and a third dam
  • the third groove is located on the side of the third dam away from the opening region, and the third groove runs through
  • the orthographic projection of the third dam on the first flexible substrate is within the range of the orthographic projection of the second dam on the first flexible substrate
  • the The orthographic projection of the second passivation layer on the first flexible substrate covers the orthographic projection of the third dam on the first flexible substrate.
  • the display substrate further includes:
  • the luminescent material layer is arranged on the side of the at least one isolation groove away from the first flexible substrate, and the luminescent material layer is disconnected in each isolation groove.
  • the display substrate further includes:
  • the encapsulation layer includes:
  • a first inorganic encapsulation film layer disposed on the side of the luminescent material layer away from the first flexible substrate, the orthographic projection of the first inorganic encapsulation film layer on the first flexible substrate covers the opening area and said isolated area;
  • the first organic encapsulation film layer disposed on the side of the first inorganic encapsulation film layer away from the first flexible substrate, the orthographic projection of the first organic encapsulation film layer on the first flexible substrate and the first flexible substrate
  • the opening area and the isolation area do not overlap
  • the second inorganic encapsulation film layer disposed on the side of the first organic encapsulation film layer away from the first flexible substrate, the orthographic projection of the second inorganic encapsulation film layer on the first flexible substrate covers the opening hole area as well as the isolation area.
  • the encapsulation layer includes:
  • a third inorganic encapsulation film layer disposed on the side of the luminescent material layer away from the first flexible substrate, the orthographic projection of the third inorganic encapsulation film layer on the first flexible substrate covers the opening area and said isolated area;
  • the second organic packaging film layer disposed on the side of the third inorganic packaging film layer facing away from the first flexible substrate, the orthographic projection of the second organic packaging film layer on the first flexible substrate and the There is no overlap in the opening area.
  • the thickness of the organic film layer is greater than or equal to the thickness of the encapsulation layer and less than or equal to five times the thickness of the encapsulation layer.
  • the thickness of the encapsulation layer is greater than or equal to 0.5 microns and less than or equal to 3 microns.
  • each isolation groove is a closed structure surrounding the opening area.
  • the first end surface is flush with the third end surface.
  • the first flexible substrate has a fourth end face facing the hole area, and the fourth end face faces away from the hole area relative to the first end face. direction indentation.
  • the indentation of the second end surface relative to the first end surface and the third end surface is greater than or equal to 0.1 micron and less than or equal to 5.0 micron.
  • the present disclosure provides a display device, including any one of the display substrates.
  • the present disclosure provides a method for preparing a display substrate.
  • the display substrate includes an opening area and an isolation area surrounding the opening area.
  • the preparation method for the isolation area includes:
  • At least one isolation groove is formed on one side of the first flexible substrate, and each isolation groove is composed of a first inorganic film layer, an organic film layer and a second inorganic film layer that are stacked;
  • the first inorganic film layer is arranged close to the first flexible substrate, and the first inorganic film layer has a first end surface facing the opening area; the organic film layer is arranged on the first inorganic film layer.
  • the film layer is away from the side of the first flexible substrate, and the organic film layer has a second end surface facing the opening area; the second inorganic film layer is arranged on the side of the organic film layer away from the first flexible substrate.
  • the second inorganic film layer On one side of the flexible substrate, the second inorganic film layer has a third end face facing the opening area; the second end face faces away from the opening relative to the first end face and the third end face The direction of the hole area is indented, and the surface of the first inorganic film layer opposite to the second inorganic film layer and the second end surface form the isolation groove.
  • a luminescent material layer is formed on a side of the at least one isolation groove away from the first flexible substrate, and the luminescent material layer is disconnected in each of the isolation grooves;
  • An encapsulation layer is formed on a side of the luminescent material layer away from the first flexible substrate, and the encapsulation layer is continuous in each of the isolation grooves.
  • FIG. 1 shows a schematic cross-sectional structure diagram of a display substrate in the related art
  • FIG. 2 shows a schematic plan view of a display substrate provided by an embodiment of the present disclosure
  • FIG. 3 shows a schematic cross-sectional structure diagram of a first display substrate provided by an embodiment of the present disclosure
  • FIG. 4 shows a schematic cross-sectional structure diagram of a second display substrate provided by an embodiment of the present disclosure
  • FIG. 5 shows a schematic cross-sectional structure diagram of a third display substrate provided by an embodiment of the present disclosure
  • FIG. 6 shows a schematic cross-sectional structure diagram of a fourth display substrate provided by an embodiment of the present disclosure
  • FIG. 7 shows a flowchart of steps of a method for preparing a display substrate provided by an embodiment of the present disclosure
  • FIG. 8 shows a schematic cross-sectional structure diagram of a fifth display substrate provided by an embodiment of the present disclosure
  • FIG. 9 shows a schematic cross-sectional structure diagram of a sixth display substrate provided by an embodiment of the present disclosure.
  • isolation structures 11 are usually arranged in the peripheral area of the opening area.
  • the isolation structure 11 shown in FIG. 1 will greatly occupy the space of the peripheral area, which is not conducive to the improvement of the pixel density or stretchability of the display substrate.
  • an embodiment of the present disclosure provides a display substrate.
  • FIG. 2 a schematic plan view of a display substrate provided by an embodiment of the present disclosure is shown.
  • the display substrate includes openings An area HA and an isolation area TA arranged around the open area HA.
  • the display substrate may adopt an island bridge structure.
  • the island bridge structure is to arrange the light emitting device on the pixel island PA, and the pixel island PA may be located on the side of the isolation area TA away from the hole area HA.
  • the connection lines are arranged in the connection bridge regions between the pixel islands PA and between the hole areas HA.
  • the display area of the display substrate may include a plurality of pixel islands PA arranged in a matrix
  • the pixel island PA may include at least one pixel unit
  • each pixel unit may include a red sub-pixel R, a green sub-pixel G and Blue subpixel B and other subpixels.
  • Each sub-pixel may include a pixel driving circuit and a light emitting device.
  • the shape of each sub-pixel may be, for example, a rectangle, a rhombus, a pentagon, or a hexagon.
  • the three sub-pixels can be arranged horizontally, vertically or in a vertical manner (as shown in Figure 2); when the pixel unit includes four sub-pixels, the four light-emitting units can use Horizontally juxtaposed, vertically juxtaposed or arranged in a square manner, which is not limited in the present disclosure.
  • the shape of the stretching hole may include any one or more of the following: "I" shape, "T” shape, "L” shape and "H” shape, which are not discussed in this disclosure. limited.
  • the display substrate in the isolation area TA includes: a first flexible substrate 01, and At least one isolation groove 02 on the side of the bottom 01 , each isolation groove 02 is composed of a first inorganic film layer 21 , an organic film layer 22 and a second inorganic film layer 23 that are stacked.
  • the first inorganic film layer 21 is arranged close to the first flexible substrate 01, and the first inorganic film layer 21 has a first end face facing the opening area HA;
  • the organic film layer 22 is arranged on the first flexible substrate 01 away from the first inorganic film layer On one side of the substrate 01, the organic film layer 22 has a second end surface facing the hole area HA;
  • the second inorganic film layer 23 is arranged on the side of the organic film layer 22 away from the first flexible substrate 01, and the second inorganic film layer 23 has a third end surface facing the opening area HA.
  • the second end face is retracted from the first end face and the third end face toward the direction away from the hole area HA, and the surface of the first inorganic film layer 21 opposite to the second inorganic film layer 23 and the second end face form the isolation groove 02 .
  • the number of isolation grooves 02 can be one, as shown in Figure 3, Figure 4 and Figure 8; it can also be multiple, as shown in Figure 5, three, Figure 6 and Figure 9 Two are shown, and the number of isolation grooves 02 is not limited in this embodiment.
  • the material of the first flexible substrate 01 may be, for example, high temperature resistant polyimide, which is not limited in this disclosure.
  • the lower layer of the first flexible substrate 01 may be provided with a process-carrying glass substrate, and after the display substrate is prepared, the first flexible substrate 01 and the first flexible substrate 01 may be bonded by a laser lift off (LLO) process. The glass substrate is separated.
  • LLO laser lift off
  • the material of the first inorganic film layer 21 may include at least one of inorganic materials such as silicon oxide, silicon nitride, aluminum oxide, and silicon oxynitride, which is not limited in the present disclosure.
  • the material of the second inorganic film layer 23 may include at least one of inorganic materials such as silicon oxide, silicon nitride, aluminum oxide, and silicon oxynitride, which is not limited in the present disclosure.
  • the material of the organic film layer 22 may include at least one of organic materials such as polyimide, acrylic and polyethylene terephthalate, which is not limited in the present disclosure.
  • dry etching can be used, and by selecting a suitable etching gas composition, the etching rate of the organic film layer 22 by the etching gas is greater than that of the first inorganic film layer 21 and the second inorganic film layer 23 The etch rate, thereby forming the isolation trench 02.
  • the isolation trench 02 is located on the side surface of the isolation area TA facing the opening area HA, and the opening of the isolation trench 02 is facing the opening area HA.
  • the luminescent material layer 03 is not deposited in the isolation groove 02 or is only partially deposited in the isolation groove 02. Therefore, the luminescent material in the isolation groove 02 The layer 03 is disconnected, and the discontinuous luminescent material layer 03 can block the intrusion path of water and oxygen between the inside and outside of the hole area HA, improving the reliability of the display substrate.
  • the preparation process of the encapsulation layer 04 is different from that of the luminescent material layer 03.
  • the encapsulation layer 04 can completely cover the isolation groove 02, the encapsulation layer 04 is continuous in the isolation groove 02, and the encapsulation layer 04 can completely cover the section of the luminescent material layer, thereby avoiding The intrusion of external water and oxygen further improves the reliability of the display substrate.
  • the display substrate provided in this embodiment by setting the isolation groove 02 on the side of the isolation area TA, can realize reliable packaging of the stretchable display substrate on the one hand; As shown in FIG. 1 ), this solution can reduce the space occupation of the isolation groove 02, thereby reducing the size of the isolation area TA, and the saved space can be used to increase the size of the opening area HA to improve the pull-out of the display substrate. It can also be used to increase the pixel island PA to increase the pixel density of the display substrate.
  • the opening area HA and the isolation groove 02 can be formed synchronously. Compared with the structure shown in FIG. 1 , one mask process can be saved, the process difficulty can be reduced, and the yield rate can be improved.
  • the structure of the isolation groove 02 may be realized in various manners.
  • At least one isolation groove 02 includes a first isolation groove 31, and the first inorganic film layer 21 constituting the first isolation groove 31 includes a first barrier layer 32, constituting The organic film layer 22 of the first isolation groove 31 is the second flexible substrate 33 .
  • the second flexible substrate 33 plays a role of supporting the display substrate, and the material may be the same as or different from that of the first flexible substrate 01 , which is not limited in the present disclosure.
  • the first barrier layer 32 may be composed of multiple layers of inorganic materials, which can block water and oxygen, and also block the diffusion of laser energy into the display substrate during the subsequent laser lift-off process.
  • the second inorganic film layer 23 constituting the first isolation trench 31 may include at least one of the following film layers, for example: a stacked second barrier layer 311, a first gate insulating layer 312, a second gate insulating layer
  • the layer 313 and the interlayer dielectric layer 314 are not limited in this disclosure.
  • the second barrier layer 311 may be composed of multiple layers of inorganic materials, which can block water and oxygen.
  • the first gate insulating layer 312, the second gate insulating layer 313, and the interlayer dielectric layer 314 can all be film layers extending from the pixel island PA to the isolation area TA, and can be formed synchronously with the thin film transistors in the pixel island PA.
  • the structure of the PA is introduced in the subsequent embodiments.
  • At least one isolation groove 02 may include a second isolation groove 41, and the organic film layer 22 constituting the second isolation groove 41 is the first organic functional layer 42.
  • the first organic functional layer 42 includes at least one of the following: a planar layer 421, a pixel defining layer 422 disposed on the side of the planar layer 421 away from the first flexible substrate 01 and a pixel defining layer 422 disposed on the side away from the first flexible substrate 01 side support layer 423.
  • the first organic functional layer 42 may be a planar layer 421 .
  • the planarization layer 421 is a film layer extending from the pixel island PA to the isolation area TA, and plays a role of planarization in the pixel island PA.
  • the first organic functional layer 42 may be a stacked pixel defining layer 422 and a supporting layer 423, and the pixel defining layer 422 and supporting layer 423 are film layers extending from the pixel island PA to the isolation area TA .
  • the pixel defining layer 422 serves to define the light-emitting area of each sub-pixel in the pixel island PA, and the support layer 423 includes isolation columns 134 in the pixel island PA, and the isolation columns 134 function to support the evaporation mask.
  • the first organic functional layer 42 can also be a pixel defining layer 422, a supporting layer 423, a stacked flat layer 421 and a pixel defining layer 422, or a stacked flat layer 421. and the support layer 423 , the disclosure does not specifically limit the first organic functional layer 42 .
  • the first organic functional layer 42 is provided with a first groove 43 and a first dam 44, the first groove 43 is located on the side of the first dam 44 away from the hole area HA, The first trench 43 penetrates the first organic functional layer 42 in a first direction.
  • the first direction is a direction in which the surface of the first organic functional layer 42 close to the first flexible substrate 01 points away from the surface of the first flexible substrate 01 .
  • the groove bottom or the second end surface of the second isolation groove 41 includes the surface of the first dam 44 on the side close to the opening area HA.
  • the second inorganic film layer 23 constituting the second isolation groove 41 may include a first passivation layer 45, and the orthographic projection of the first passivation layer 45 on the first flexible substrate 01 covers the second An orthographic projection of a dam 44 on the first flexible substrate 01 .
  • the first passivation layer 45 can completely isolate the first organic functional layer 42 and the luminescent material layer 03 on both sides thereof, preventing water and oxygen from invading into the luminescent material layer 03 through the first organic functional layer 42, and improving the performance of the display substrate. reliability.
  • the first inorganic film layer 21 constituting the second isolation trench 41 may include at least one of the following film layers: a stacked second barrier layer 311 , a first gate insulating layer 312 , and a second barrier layer 312 . Two gate insulating layers 313 and interlayer dielectric layers 314 and so on.
  • the second barrier layer 311 may be composed of multiple layers of inorganic materials, which can block water and oxygen.
  • the first gate insulating layer 312, the second gate insulating layer 313, and the interlayer dielectric layer 314 can all be film layers extending from the pixel island PA to the isolation area TA, and can be formed synchronously with the thin film transistors in the pixel island PA, as shown in FIG. 4 and Figure 8.
  • At least one isolation groove 02 may further include a third isolation groove 53 disposed on a side of the second isolation groove 41 away from the first flexible substrate 01 .
  • the structure of the second isolation trench 41 is the same as that described in the second implementation manner, and will not be repeated here.
  • the organic film layer 22 constituting the second isolation trench 41 is a planar layer 421 , as shown in FIG. 9 .
  • the first inorganic film layer 21 constituting the third isolation trench 53 is the first passivation layer 45 . That is, the first passivation layer 45 constituting the second inorganic film layer 23 of the second isolation trench 41 is reused as the first inorganic film layer 21 of the third isolation trench 53 .
  • the organic film layer 22 constituting the third isolation groove 53 is the second organic functional layer 54, and the second organic functional layer 54 includes at least one of the following: pixels arranged on the side of the first passivation layer 45 away from the first flexible substrate 01 The defining layer 422 and the supporting layer 423 disposed on the side of the pixel defining layer 422 away from the first flexible substrate 01 .
  • the second inorganic film layer 23 constituting the third isolation trench 53 is the second passivation layer 55 .
  • the second organic functional layer 54 is provided with a third groove 59 and a third dam 56, the third groove 59 is located on the side of the third dam 56 away from the opening area HA, and the third groove 59 runs through the first
  • the orthographic projection of the third dam 56 on the first flexible substrate 01 is within the range of the orthographic projection of the first dam 44 on the first flexible substrate 01 .
  • the orthographic projection of the second passivation layer 55 on the first flexible substrate 01 covers the orthographic projection of the third dam 56 on the first flexible substrate 01 .
  • the second passivation layer 55 can completely isolate the second organic functional layer 54 on both sides from the luminescent material layer 03, preventing water and oxygen from invading into the luminescent material layer 03 through the second organic functional layer 54, and improving the performance of the display substrate. reliability.
  • At least one isolation groove 02 includes a first isolation groove 31 and a second isolation groove 41, and the second isolation groove 41 is arranged on the side where the first isolation groove 31 is away from the first isolation groove.
  • the first inorganic film layer 21 constituting the first isolation groove 31 may include a first barrier layer 32, the organic film layer 22 constituting the first isolation groove 31 may be a second flexible substrate 33, and the second barrier layer 32 constituting the first isolation groove 31 may be formed.
  • the inorganic film layer 23 is reused as the first inorganic film layer 21 constituting the second isolation trench 41 .
  • the film structure of the first inorganic film layer 21, the organic film layer 22, and the second inorganic film layer 23 constituting the first isolation groove 31 is the same as the description of the first isolation groove 31 in the previous embodiment, and is not described here. Let me repeat.
  • the organic film layer 22 constituting the second isolation trench 41 includes a flat layer 421
  • the second inorganic film layer 23 constituting the second isolation trench 41 includes a first passivation layer 45
  • the flat layer 421 is provided with a second groove 51 and a second dam 52
  • the second groove 51 is located on the side of the second dam 52 away from the opening area HA
  • the second groove 51 is on the first The direction runs through the flat layer 421 .
  • the orthographic projection of the first passivation layer 45 on the first flexible substrate 01 covers the orthographic projection of the second dam 52 on the first flexible substrate 01 .
  • the first passivation layer 45 can completely isolate the planar layer 421 on both sides of the passivation layer 03 from the luminescent material layer 03, preventing water and oxygen from invading into the luminescent material layer 03 through the planar layer 421, and improving the reliability of the display substrate.
  • the groove bottom or the second end surface of the second isolation groove 41 includes the surface of the second dam 52 on the side close to the opening area HA.
  • At least one isolation groove 02 may further include a third isolation groove 53 disposed on a side of the second isolation groove 41 away from the first flexible substrate 01 .
  • the second isolation groove 41 can be located on the side of the first isolation groove 31 away from the first flexible substrate 01, and the structure of the second isolation groove 41 and the first isolation groove 31 can refer to the above description of FIG. repeat.
  • the first inorganic film layer 21 constituting the third isolation trench 53 is the first passivation layer 45 . That is, the first passivation layer 45 constituting the second inorganic film layer 23 of the second isolation trench 41 is reused as the first inorganic film layer 21 of the third isolation trench 53 .
  • the organic film layer 22 constituting the third isolation groove 53 is the second organic functional layer 54, and the second organic functional layer 54 includes at least one of the following: pixels arranged on the side of the first passivation layer 45 away from the first flexible substrate 01 The defining layer and the supporting layer arranged on the side of the pixel defining layer away from the first flexible substrate 01 .
  • the second inorganic film layer 23 constituting the third isolation trench 53 is the second passivation layer 55 .
  • the second organic functional layer 54 is provided with a third groove 59 and a third dam 56, the third groove 59 is located on the side of the third dam 56 away from the opening area HA, and the third groove 59 runs through the first
  • the orthographic projection of the third dam 56 on the first flexible substrate 01 is within the range of the orthographic projection of the second dam 52 on the first flexible substrate 01 .
  • the orthographic projection of the second passivation layer 55 on the first flexible substrate 01 covers the orthographic projection of the third dam 56 on the first flexible substrate 01 .
  • the second passivation layer 55 can completely isolate the second organic functional layer 54 and the luminescent material layer 03 on both sides thereof, preventing water and oxygen from invading into the luminescent material layer 03 through the second organic functional layer 54, and improving the performance of the display substrate. reliability.
  • the display substrate may further include: a luminescent material layer 03 arranged on the side of at least one isolation groove 02 away from the first flexible substrate 01, and the luminescent material layer 03 is arranged in each isolation groove 02. Slot 02 is disconnected.
  • the luminescent material layer 03 may include, for example, one or more of film layers such as a common organic layer, a cathode layer, and an optical coupling layer, which is not limited in the present disclosure.
  • the luminescent material layer 03 may be a film layer extending from the pixel island PA to the isolation area TA.
  • the display substrate may further include: an encapsulation layer 04 arranged on the side of the luminescent material layer 03 away from the first flexible substrate 01, and the encapsulation layer 04 is in each isolation groove 02 continuous.
  • the encapsulation layer 04 may include:
  • the first inorganic encapsulation film layer 61 disposed on the side of the luminescent material layer 03 away from the first flexible substrate 01, the orthographic projection of the first inorganic encapsulation film layer 61 on the first flexible substrate 01 covers the opening area HA and the isolation area TA;
  • the first organic packaging film layer 62 disposed on the side of the first inorganic packaging film layer 61 facing away from the first flexible substrate 01, the orthographic projection of the first organic packaging film layer 62 on the first flexible substrate 01 and the opening area HA and the isolation area TA has no overlap;
  • the first inorganic packaging film layer 61 completely wraps the opening area HA and the isolation area TA to ensure the integrity of the package, not only effectively isolating the water and oxygen from the opening area HA, but also the isolation area TA.
  • the groove forms a pinning point for the encapsulation layer 04, which can further prevent peeling failure at the edge of the film layer.
  • the first organic encapsulation film layer 62 is disposed on the first inorganic encapsulation film layer, and the first organic encapsulation film layer 62 in the opening area HA and isolation area TA is removed to expose the surface of the first inorganic encapsulation film layer 61 .
  • the first inorganic packaging film layer 61, the first organic packaging film layer 62, and the second inorganic packaging film layer 63 are stacked, that is, the second inorganic packaging film layer
  • the film layer 63 is disposed on the first organic packaging film layer 62 to form a laminated structure of inorganic material/organic material/inorganic material.
  • the second inorganic encapsulation film layer 63 is disposed on the first inorganic encapsulation film layer 61 to form a laminated structure of inorganic material/inorganic material.
  • the materials of the first inorganic encapsulation film layer 61 and the second inorganic encapsulation film layer 63 may include at least one of inorganic materials such as silicon oxide, silicon nitride, and silicon oxynitride, and may be single-layer, multi-layer or composite layer. , which can ensure that external water and oxygen cannot enter the light-emitting structure layer.
  • the material of the first organic encapsulation film layer 62 can be a resin material, which plays a role of covering each film layer of the display substrate, and can improve structural stability and flatness.
  • the encapsulation layer 04 may include:
  • the second organic packaging film layer 58 disposed on the side of the third inorganic packaging film layer 57 facing away from the first flexible substrate 01, the orthographic projection of the second organic packaging film layer 58 on the first flexible substrate 01 and the opening area HA No overlap.
  • the third inorganic packaging film layer 57 completely wraps the opening area HA and the isolation area TA to ensure the integrity of the package, not only effectively isolating the water and oxygen from the opening area HA, but also the isolation area TA.
  • the groove forms a pinning point for the encapsulation layer 04, which can further prevent peeling failure at the edge of the film layer.
  • the second organic encapsulation film layer 58 is disposed on the third inorganic encapsulation film layer 57 , and the first organic encapsulation film layer in the opening area HA is removed to expose the surface of the third inorganic encapsulation film layer 57 .
  • the third inorganic packaging film layer 57 and the second organic packaging film layer 58 are stacked to form a laminated structure of inorganic materials/organic materials.
  • the opening area HA is completely covered by the third inorganic packaging film layer 57 .
  • the material of the third inorganic encapsulation film layer 57 may include at least one of inorganic materials such as silicon oxide, silicon nitride, and silicon oxynitride, and may be a single layer, multiple layers, or a composite layer, which can ensure that external water and oxygen cannot enter Luminous structural layer.
  • the material of the second organic encapsulation film layer 58 can be a resin material, which plays a role of covering each film layer of the display substrate, and can improve structural stability and flatness.
  • the thickness of the organic film layer 22 is greater than or equal to the thickness of the encapsulation layer 04 and less than or equal to five times the thickness of the encapsulation layer 04 . If the thickness of the encapsulation layer 04 is a, the thickness of the organic film layer 22 may be greater than or equal to a and less than or equal to 5*a. In this way, the structure of the encapsulation layer 04 in the isolation groove 02 can be ensured to be stable, and the adhesion of the encapsulation layer 04 can be improved.
  • the thickness of the encapsulation layer 04 is greater than or equal to 0.5 microns and less than or equal to 3 microns, which is not limited in the present disclosure.
  • the thickness of the encapsulation layer 04 can be 1 micron, 1.5 micron, 2 micron, etc., and the specific thickness can be set according to actual needs.
  • the thickness of the film layer refers to the size of the film layer in the first direction.
  • each isolation groove 02 may be a closed structure surrounding the open area HA.
  • the first end surface is flush with the third end surface. Since the first end surface is flush with the third end surface, the first inorganic film layer 21 and the second inorganic film layer 23 can share a mask, so that the process can be simplified and the cost can be reduced. Moreover, the first end surface is flush with the third end surface, which can further reduce the size of the isolation area TA, and provide space for improving the stretchability or pixel density of the display substrate.
  • the indentation of the second end surface relative to the first end surface and the third end surface is greater than or equal to 0.1 micron and less than or equal to 5.0 micron.
  • the indentation of the second end surface relative to the first end surface may be greater than or equal to 0.3 microns and less than or equal to 1.5 microns.
  • the indentation of the second end surface relative to the third end surface may be greater than or equal to 0.3 microns and less than or equal to 1.5 microns. That is, the depth of the isolation trench 02 may be greater than or equal to 0.3 microns and less than or equal to 1.5 microns. Further, the depth of the isolation groove 02 may be greater than or equal to 0.5 microns and less than or equal to 1.5 microns.
  • each film layer of the display substrate can be formed on the rigid base first, and then the display substrate and the rigid base are peeled off by the LLO process.
  • the encapsulation layer 04 in the opening area HA is prone to breakage, which may lead to encapsulation failure.
  • the first flexible substrate 01 has a fourth end face facing the hole area HA, and the fourth end face faces away from the hole area relative to the first end face.
  • the direction of the HA is indented.
  • the first end surface plays a role in blocking cracks in the encapsulation layer 04 from extending upward along the side of the isolation area TA, avoiding openings
  • the cracks on the encapsulation layer 04 in the region extend to the isolation grooves 02 to prevent encapsulation failure and improve the encapsulation reliability of the display substrate.
  • the indentation of the fourth end surface relative to the first end surface may be formed synchronously with the isolation groove 02 .
  • the indentation of the fourth end surface relative to the first end surface may be greater than or equal to 0.3 microns and less than or equal to 1.5 microns. Further, the indentation of the fourth end surface relative to the first end surface may be greater than or equal to 0.5 microns and less than or equal to 1.5 microns.
  • the pixel island PA includes a pixel circuit disposed on the second barrier layer 311, and the thin film transistor in the pixel circuit may include a channel material 110 , the first gate insulating layer 312 , the first gate 112 , the second gate insulating layer 313 , the second gate 114 , the interlayer dielectric layer 314 , the source 121 and the drain 122 .
  • 4 , 6 , 8 and 9 and the structure of the above-mentioned thin film transistors are only illustrative examples, and other stacked structures, as well as bottom-gate and double-gate structures, are not limited in this embodiment.
  • the flat layer 421 covers the above-mentioned pixel circuit, and the flat layer 421 plays a role of planarization.
  • the anode 132 is connected to the drain 122 through a via hole provided on the flat layer 421 .
  • the pixel defining layer 422 is arranged on the side of the anode layer 132 away from the pixel circuit.
  • the pixel defining layer 422 is provided with a pixel opening. The material of the pixel defining layer in the pixel opening is removed, and the electroluminescent layer of the light emitting device is formed in the pixel opening. .
  • the position of the pixel opening corresponds to the anode 132 and is used for evaporating the electroluminescent layer 141 .
  • the support pillars 134 in the support layer 423 are arranged on the side of the non-pixel opening area of the pixel defining layer 422 away from the first flexible substrate 01 , and are used to support the evaporation mask during evaporation.
  • the supporting layer 423 and the pixel defining layer 422 may be formed through the same patterning process through a halftone mask, which is not limited in this disclosure.
  • An electroluminescent layer 141 , a common organic layer 142 , a cathode and an optical adjustment layer 143 are disposed on the side of the pixel defining layer 422 and the anode 132 away from the pixel circuit.
  • the cathode and the optical adjustment layer 143 are disposed on a side of the common organic layer 142 away from the anode 132 .
  • the encapsulation layer 04 is disposed on the side of the cathode and optical adjustment layer 143 away from the anode 132 .
  • the electroluminescent layer 141 and the common organic layer 142 can be deposited by evaporation.
  • the common organic layer may include, for example, an electron transport layer, a hole transport layer, a resistance injection layer, a hole injection layer, and the like.
  • the electroluminescent layer 141 may be disposed between the electron transport layer and the hole transport layer for realizing light emission of the pixel.
  • the shared organic layer is used to improve the luminous efficiency of the light emitting layer.
  • the material of the cathode layer can be, for example, metal materials such as magnesium, silver, aluminum, copper or lithium.
  • Another embodiment of the present disclosure further provides a display device, which may include the display substrate described in any embodiment.
  • the pixel structure of the display substrate can be organic light-emitting diode (Organic Light-Emitting Diode, OLED), sub-millimeter light-emitting diode (Mini Light-Emitting Diode, Mini LED), micro light-emitting diode (Micro Light-Emitting Diode, Micro LED) , Quantum Dot Light-Emitting Diode (QLED), etc.
  • OLED Organic Light-Emitting Diode
  • Mini LED sub-millimeter light-emitting diode
  • micro light-emitting diode Micro Light-Emitting Diode, Micro LED
  • QLED Quantum Dot Light-Emitting Diode
  • the display device in this embodiment can be any product or component with 2D or 3D display function, such as display panel, electronic paper, mobile phone, tablet computer, television, notebook computer, digital photo frame, and navigator.
  • Another embodiment of the present disclosure also provides a method for preparing a display substrate, wherein the display substrate includes an opening area and an isolation area arranged around the opening area.
  • the preparation method for the isolation area includes:
  • Step 71 Providing a first flexible substrate.
  • Step 72 forming at least one isolation groove on one side of the first flexible substrate, and each isolation groove is composed of a first inorganic film layer, an organic film layer and a second inorganic film layer stacked together.
  • the first inorganic film layer is arranged close to the first flexible substrate, and the first inorganic film layer has a first end surface facing the opening area;
  • the organic film layer is arranged on the side of the first inorganic film layer away from the first flexible substrate,
  • the organic film layer has a second end surface facing the hole area;
  • the second inorganic film layer is arranged on the side of the organic film layer away from the first flexible substrate, and the second inorganic film layer has a third end surface facing the hole area;
  • the end face is indented relative to the first end face and the third end face toward the direction away from the hole area, and the surface of the first inorganic film layer opposite to the second inorganic film layer and the second end face form an isolation groove.
  • the display substrate of any of the above embodiments can be prepared.
  • step 72 it may further include: forming a luminescent material layer on a side of at least one isolation groove away from the first flexible substrate, and the luminescent material layer is disconnected in each isolation groove.
  • the following step may also be included: forming an encapsulation layer on the side of the luminescent material layer away from the first flexible substrate, and the encapsulation layer is continuous in each isolation groove.
  • step 71 may specifically include: providing a first flexible film.
  • Step 72 may specifically include the following steps: first, using a film forming process, sequentially forming a first inorganic film, an organic film, and a second inorganic film on one side of the first flexible film; then using a dry etching process, forming the first inorganic film , the organic thin film, the second inorganic thin film and the first flexible thin film to simultaneously form the opening region, the first flexible substrate in the isolation region, and at least one isolation groove on one side of the first flexible substrate.
  • the film forming process may include any one or more of sputtering, evaporation and chemical vapor deposition.
  • the dry etching process is a technique for etching thin films using plasma.
  • the gas exists in the form of plasma, it has two characteristics: on the one hand, the chemical activity of these gases in the plasma is much stronger than that under normal conditions. React with the material to achieve the purpose of etching and removing the film; on the other hand, the electric field can also be used to guide and accelerate the plasma so that it has a certain energy.
  • the electric field can also be used to guide and accelerate the plasma so that it has a certain energy.
  • the etched The atoms of the etching material are knocked out, so as to achieve the purpose of etching by using physical energy transfer.
  • the preparation of the anode layer and the pixel defining layer in the pixel island can be completed before the opening region and the isolation groove located in the isolation region are formed by a dry etching process.
  • the preparation of the anode layer and the pixel defining layer is set before the dry etching process, which can avoid the influence of the preparation process of the anode layer and the pixel defining layer on the opening area and the isolation groove.
  • references herein to "one embodiment,” “an embodiment,” or “one or more embodiments” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present disclosure. Additionally, please note that examples of the word “in one embodiment” herein do not necessarily all refer to the same embodiment.
  • any reference signs placed between parentheses shall not be construed as limiting the claim.
  • the word “comprising” does not exclude the presence of elements or steps not listed in a claim.
  • the word “a” or “an” preceding an element does not exclude the presence of a plurality of such elements.
  • the disclosure can be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In a unit claim enumerating several means, several of these means can be embodied by one and the same item of hardware.
  • the use of the words first, second, and third, etc. does not indicate any order. These words can be interpreted as names.

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Abstract

显示基板及其制备方法、显示装置。显示基板包括开孔区域以及环绕开孔区域设置的隔离区域，隔离区域包括：第一柔性衬底，以及设置在第一柔性衬底一侧的至少一个隔离槽，各隔离槽由层叠设置的第一无机膜层、有机膜层以及第二无机膜层构成；其中，第一无机膜层靠近第一柔性衬底设置，第一无机膜层具有朝向开孔区域的第一端面；有机膜层设置在第一无机膜层背离第一柔性衬底的一侧，有机膜层具有朝向开孔区域的第二端面；第二无机膜层设置在有机膜层背离第一柔性衬底的一侧，第二无机膜层具有朝向开孔区域的第三端面；第二端面相对于第一端面和第三端面朝远离开孔区域的方向缩进，第一无机膜层与第二无机膜层相对的表面以及第二端面构成所述隔离槽。

Description

显示基板及其制备方法、显示装置 技术领域
本公开涉及显示技术领域，特别是涉及一种显示基板及其制备方法、显示装置。
背景技术
有机发光二极管(Organic Light Emitting Diode，OLED)为主动发光显示器件，具有自发光、广视角、高对比度、低功耗、宽色域、轻薄化、可异形化等优点。随着显示技术的不断发展，OLED技术越来越多地应用于柔性显示中。为了提高柔性OLED显示面板的拉伸性能，通常在OLED显示面板上设置开孔区域。开孔区域可以提高OLED显示面板的柔性，实现3D曲面贴附、动态小角度弯折等效果。
概述
本公开提供了一种显示基板，包括开孔区域以及环绕所述开孔区域设置的隔离区域，所述隔离区域包括：第一柔性衬底，以及设置在所述第一柔性衬底一侧的至少一个隔离槽，各所述隔离槽由层叠设置的第一无机膜层、有机膜层以及第二无机膜层构成；
其中，所述第一无机膜层靠近所述第一柔性衬底设置，所述第一无机膜层具有朝向所述开孔区域的第一端面；所述有机膜层设置在所述第一无机膜层背离所述第一柔性衬底的一侧，所述有机膜层具有朝向所述开孔区域的第二端面；所述第二无机膜层设置在所述有机膜层背离所述第一柔性衬底的一侧，所述第二无机膜层具有朝向所述开孔区域的第三端面；
所述第二端面相对于所述第一端面和所述第三端面朝远离所述开孔区域的方向缩进，所述第一无机膜层与所述第二无机膜层相对的表面以及所述第二端面构成所述隔离槽。
在一种可选的实现方式中，所述至少一个隔离槽包括第一隔离槽，构成所述第一隔离槽的第一无机膜层包括第一阻挡层，构成所述第一隔离槽的有机 膜层为第二柔性衬底。
在一种可选的实现方式中，所述至少一个隔离槽包括第二隔离槽，构成所述第二隔离槽的有机膜层为第一有机功能层，所述第一有机功能层包括以下至少之一：平坦层，设置在所述平坦层背离所述第一柔性衬底一侧的像素界定层以及设置在所述像素界定层背离所述第一柔性衬底一侧的支撑层。
在一种可选的实现方式中，所述第一有机功能层上设置有第一沟槽和第一围坝，所述第一沟槽位于所述第一围坝远离所述开孔区域的一侧，所述第一沟槽贯穿所述第一有机功能层。
在一种可选的实现方式中，构成所述第二隔离槽的第二无机膜层包括第一钝化层，所述第一钝化层在所述第一柔性衬底上的正投影覆盖所述第一围坝在所述第一柔性衬底上的正投影。
在一种可选的实现方式中，所述第一有机功能层为所述平坦层，所述至少一个隔离槽还包括设置在所述第二隔离槽背离所述第一柔性衬底的一侧的第三隔离槽；
构成所述第三隔离槽的第一无机膜层为所述第一钝化层；
构成所述第三隔离槽的有机膜层为第二有机功能层，所述第二有机功能层包括以下至少之一：设置在所述第一钝化层背离所述第一柔性衬底一侧的像素界定层以及设置在所述像素界定层背离所述第一柔性衬底一侧的支撑层；
构成所述第三隔离槽的第二无机膜层为第二钝化层；
其中，所述第二有机功能层包括第三沟槽和第三围坝，所述第三沟槽位于所述第三围坝远离所述开孔区域的一侧，所述第三沟槽贯穿所述第二有机功能层，所述第三围坝在所述第一柔性衬底上的正投影位于所述第一围坝在所述第一柔性衬底上的正投影范围内，所述第二钝化层在所述第一柔性衬底上的正投影覆盖所述第三围坝在所述第一柔性衬底上的正投影。
在一种可选的实现方式中，所述至少一个隔离槽包括第一隔离槽和第二隔离槽，所述第二隔离槽设置在所述第一隔离槽背离所述第一柔性衬底的一侧；
构成所述第一隔离槽的第一无机膜层包括第一阻挡层，构成所述第一隔离槽的有机膜层为第二柔性衬底，构成所述第一隔离槽的第二无机膜层复用为构成所述第二隔离槽的第一无机膜层；
构成所述第二隔离槽的有机膜层包括平坦层，构成所述第二隔离槽的第二无机膜层包括第一钝化层。
在一种可选的实现方式中，所述平坦层上设置有第二沟槽和第二围坝，所述第二沟槽位于所述第二围坝远离所述开孔区域的一侧，所述第二沟槽贯穿所述平坦层；
所述第一钝化层在所述第一柔性衬底上的正投影覆盖所述第二围坝在所述第一柔性衬底上的正投影。
在一种可选的实现方式中，所述至少一个隔离槽还包括设置在所述第二隔离槽背离所述第一柔性衬底的一侧的第三隔离槽；
构成所述第三隔离槽的第一无机膜层为所述第一钝化层；
构成所述第三隔离槽的有机膜层为第二有机功能层，所述第二有机功能层包括以下至少之一：设置在所述第一钝化层背离所述第一柔性衬底一侧的像素界定层以及设置在所述像素界定层背离所述第一柔性衬底一侧的支撑层；
构成所述第三隔离槽的第二无机膜层为第二钝化层；
其中，所述第二有机功能层包括第三沟槽和第三围坝，所述第三沟槽位于所述第三围坝远离所述开孔区域的一侧，所述第三沟槽贯穿所述第二有机功能层，所述第三围坝在所述第一柔性衬底上的正投影位于所述第二围坝在所述第一柔性衬底上的正投影范围内，所述第二钝化层在所述第一柔性衬底上的正投影覆盖所述第三围坝在所述第一柔性衬底上的正投影。
在一种可选的实现方式中，所述显示基板还包括：
设置在所述至少一个隔离槽背离所述第一柔性衬底一侧的发光材料层，所述发光材料层在各所述隔离槽内断开。
在一种可选的实现方式中，所述显示基板还包括：
设置在所述发光材料层背离所述第一柔性衬底一侧的封装层，所述封装层在各所述隔离槽内连续。
在一种可选的实现方式中，所述封装层包括：
设置在所述发光材料层背离所述第一柔性衬底一侧的第一无机封装膜层，所述第一无机封装膜层在所述第一柔性衬底上的正投影覆盖所述开孔区域以及所述隔离区域；
设置在所述第一无机封装膜层背离所述第一柔性衬底一侧的第一有机封 装膜层，所述第一有机封装膜层在所述第一柔性衬底上的正投影与所述开孔区域以及所述隔离区域无交叠；
设置在第一有机封装膜层背离所述第一柔性衬底一侧的第二无机封装膜层，所述第二无机封装膜层在所述第一柔性衬底上的正投影覆盖所述开孔区域以及所述隔离区域。
在一种可选的实现方式中，所述封装层包括：
设置在所述发光材料层背离所述第一柔性衬底一侧的第三无机封装膜层，所述第三无机封装膜层在所述第一柔性衬底上的正投影覆盖所述开孔区域以及所述隔离区域；
设置在所述第三无机封装膜层背离所述第一柔性衬底一侧的第二有机封装膜层，所述第二有机封装膜层在所述第一柔性衬底上的正投影与所述开孔区域无交叠。
在一种可选的实现方式中，所述有机膜层的厚度大于或等于所述封装层的厚度，且小于或等于所述封装层的厚度的五倍。
在一种可选的实现方式中，所述封装层的厚度大于或等于0.5微米，且小于或等于3微米。
在一种可选的实现方式中，各所述隔离槽为环绕所述开孔区域的闭合结构。
在一种可选的实现方式中，所述第一端面与所述第三端面平齐。
在一种可选的实现方式中，所述第一柔性衬底具有朝向所述开孔区域的第四端面，所述第四端面相对于所述第一端面朝远离所述开孔区域的方向缩进。
在一种可选的实现方式中，所述第二端面相对于所述第一端面和所述第三端面的缩进量大于或等于0.1微米，且小于或等于5.0微米。
本公开提供了一种显示装置，包括任一项所述的显示基板。
本公开提供了一种显示基板的制备方法，所述显示基板包括开孔区域以及环绕所述开孔区域设置的隔离区域，所述隔离区域的制备方法包括：
提供第一柔性衬底；
在所述第一柔性衬底的一侧形成至少一个隔离槽，各所述隔离槽由层叠设置的第一无机膜层、有机膜层以及第二无机膜层构成；
其中，所述第一无机膜层靠近所述第一柔性衬底设置，所述第一无机膜层具有朝向所述开孔区域的第一端面；所述有机膜层设置在所述第一无机膜层背离所述第一柔性衬底的一侧，所述有机膜层具有朝向所述开孔区域的第二端面；所述第二无机膜层设置在所述有机膜层背离所述第一柔性衬底的一侧，所述第二无机膜层具有朝向所述开孔区域的第三端面；所述第二端面相对于所述第一端面和所述第三端面朝远离所述开孔区域的方向缩进，所述第一无机膜层与所述第二无机膜层相对的表面以及所述第二端面构成所述隔离槽。
在一种可选的实现方式中，在所述第一柔性衬底的一侧形成至少一个隔离槽的步骤之后，还包括：
在所述至少一个隔离槽背离所述第一柔性衬底的一侧形成发光材料层，所述发光材料层在各所述隔离槽内断开；
在所述发光材料层背离所述第一柔性衬底的一侧形成封装层，所述封装层在各所述隔离槽内连续。
上述说明仅是本公开技术方案的概述，为了能够更清楚了解本公开的技术手段，而可依照说明书的内容予以实施，并且为了让本公开的上述和其它目的、特征和优点能够更明显易懂，以下特举本公开的具体实施方式。
附图简述
为了更清楚地说明本公开实施例或相关技术中的技术方案，下面将对实施例或相关技术描述中所需要使用的附图作一简单地介绍，显而易见地，下面描述中的附图是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。需要说明的是，附图中的比例仅作为示意并不代表实际比例。
图1示出了相关技术中的一种显示基板的剖面结构示意图；
图2示出了本公开实施例提供的一种显示基板的平面结构示意图；
图3示出了本公开实施例提供的第一种显示基板的剖面结构示意图；
图4示出了本公开实施例提供的第二种显示基板的剖面结构示意图；
图5示出了本公开实施例提供的第三种显示基板的剖面结构示意图；
图6示出了本公开实施例提供的第四种显示基板的剖面结构示意图；
图7示出了本公开实施例提供的一种显示基板的制备方法的步骤流程图；
图8示出了本公开实施例提供的第五种显示基板的剖面结构示意图；
图9示出了本公开实施例提供的第六种显示基板的剖面结构示意图。
详细描述
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
相关技术中，为了切断水氧的入侵通道，如图1所示，通常在开孔区域的周边区域设置一些隔离结构11。然而，图1所示的隔离结构11会大幅占据周边区域的空间，不利于显示基板像素密度或拉伸性能的提升。
为了解决上述问题，本公开一实施例提供了一种显示基板，参照图2示出了本公开实施例提供的一种显示基板的平面结构示意图，如图2所示，该显示基板包括开孔区域HA以及环绕开孔区域HA设置的隔离区域TA。
如图2所示，显示基板可以采用岛桥结构，岛桥结构是将发光器件设置在像素岛PA，像素岛PA可以位于隔离区域TA远离开孔区域HA的一侧。连接线设置在像素岛PA之间以及开孔区域HA之间的连接桥区。施加外力拉伸显示基板时，形变主要发生在开孔区域HA和连接桥区，像素岛PA内的发光器件保持形状不变，因此可以保证像素岛PA内的发光器件不会受到破坏，提高显示基板的拉伸性能。
如图2所示，显示基板的显示区域可以包括以矩阵方式排布的多个像素岛PA，像素岛PA可以包括至少一个像素单元，各像素单元可以包括红色子像素R、绿色子像素G以及蓝色子像素B等子像素。各子像素中可以包括像素驱动电路和发光器件。在示例性实施方式中，各子像素的形状例如可以是矩形状、菱形、五边形或六边形等。当像素单元包括三个子像素时，三个子像素可以采用水平并列、竖直并列或品字方式排列(如图2所示出的)；当像素单元包括四个子像素时，四个发光单元可以采用水平并列、竖直并列或正方形方式排列，本公开在此不做限定。
在垂直于显示基板的平面上，开孔区域HA中的基底和结构膜层被全部 去掉，形成通孔结构，或者，开孔区域HA中的基底和结构膜层被部分去掉，形成盲孔结构。在平行于显示基板的平面上，拉伸孔的形状可以包括如下任意一种或多种：“I”字形、“T”字形、“L”字形和“H”字形，本公开在此不做限定。
参照图3至图6、图8和图9示出了沿图2中II’位置处的剖面结构示意图，隔离区域TA的显示基板包括：第一柔性衬底01，以及设置在第一柔性衬底01一侧的至少一个隔离槽02，各隔离槽02由层叠设置的第一无机膜层21、有机膜层22以及第二无机膜层23构成。
其中，第一无机膜层21靠近第一柔性衬底01设置，第一无机膜层21具有朝向开孔区域HA的第一端面；有机膜层22设置在第一无机膜层21背离第一柔性衬底01的一侧，有机膜层22具有朝向开孔区域HA的第二端面；第二无机膜层23设置在有机膜层22背离第一柔性衬底01的一侧，第二无机膜层23具有朝向开孔区域HA的第三端面。
第二端面相对于第一端面和第三端面朝远离开孔区域HA的方向缩进，第一无机膜层21与第二无机膜层23相对的表面以及第二端面构成隔离槽02。
本实施例中，隔离槽02的数量可以为一个，如图3、图4和图8所示出的；还可以为多个，如图5所示出的三个，图6和图9所示出的两个，本实施例对隔离槽02的数量不作限定。
本实施例中，第一柔性衬底01的材料例如可以为耐高温的聚酰亚胺，本公开对此不作限定。在制备显示基板的过程中，第一柔性衬底01的下层可以设置有工艺承载玻璃基板，显示基板制备完成后可以通过激光剥离(laser lift off，LLO)工艺，将第一柔性衬底01与玻璃基板进行分离。
第一无机膜层21的材料可以包括氧化硅、氮化硅、氧化铝以及氮氧化硅等无机材料中的至少一种，本公开对此不作限定。
第二无机膜层23的材料可以包括氧化硅、氮化硅、氧化铝以及氮氧化硅等无机材料中的至少一种，本公开对此不作限定。
有机膜层22的材料可以包括聚酰亚胺、亚克力以及聚对苯二甲酸乙二醇酯等有机材料中的至少一种，本公开对此不作限定。
在具体实现中，可以采用干法刻蚀，通过选择合适的刻蚀气体组分，实现刻蚀气体对有机膜层22的刻蚀速率大于对第一无机膜层21和第二无机膜层 23的刻蚀速率，从而形成隔离槽02。
本实施例中，隔离槽02位于隔离区域TA朝向开孔区域HA的一侧表面上，隔离槽02的开口朝向开孔区域HA。在后续蒸镀发光材料层03的过程中，由于隔离槽02位于隔离区域TA的侧面，使得发光材料层03在隔离槽02内无沉积或只部分位置沉积，因此，隔离槽02内的发光材料层03是断开的，不连续的发光材料层03可以阻断开孔区域HA内外之间的水氧入侵路径，提高显示基板的可靠性。
封装层04与发光材料层03的制备工艺不同，封装层04可以完整包覆隔离槽02，封装层04在隔离槽02内连续，封装层04可以完整包覆发光材料层的断面，从而可以避免外界水氧的入侵，进一步提高显示基板的可靠性。
本实施例提供的显示基板，通过在隔离区域TA的侧面设置隔离槽02，一方面可以实现可拉伸显示基板的可靠封装；另一方面，与隔离槽02设置在隔离区域TA正面的方案(如图1所示)相比，本方案可以减小隔离槽02的空间占用，从而可以缩小隔离区域TA的尺寸，节省的空间可以用于增大开孔区域HA的尺寸以提高显示基板的拉伸性能，还可以用于增加像素岛PA以提高显示基板的像素密度。
本实施例中，开孔区域HA与隔离槽02可以同步形成，与图1所示的结构相比，可以节省一道掩膜版工艺，降低工艺难度，提高良率。
本实施例中，隔离槽02的结构可以有多种实现方式。
在第一种可选的实现方式中，如图3所示，至少一个隔离槽02包括第一隔离槽31，构成第一隔离槽31的第一无机膜层21包括第一阻挡层32，构成第一隔离槽31的有机膜层22为第二柔性衬底33。
第二柔性衬底33对显示基板起到承托作用，材料可以与第一柔性衬底01的材料相同或不同，本公开对此不作限定。
第一阻挡层32可以由多层无机材料构成，起到阻挡水氧的作用，并且在后续的激光剥离工艺中还起到阻挡激光能量向显示基板内部扩散的作用。
本实现方式中，构成第一隔离槽31的第二无机膜层23例如可以包括以下膜层至少之一：层叠设置的第二阻挡层311、第一栅极绝缘层312、第二栅极绝缘层313以及层间介质层314等，本公开对此不作限定。
其中，第二阻挡层311可以由多层无机材料构成，起到阻挡水氧的作用。 第一栅极绝缘层312、第二栅极绝缘层313以及层间介质层314可以均为像素岛PA延伸至隔离区域TA的膜层，可以与像素岛PA中的薄膜晶体管同步形成，像素岛PA的结构在后续实施例介绍。
在第二种可选的实现方式中，如图4和图8所示，至少一个隔离槽02可以包括第二隔离槽41，构成第二隔离槽41的有机膜层22为第一有机功能层42，第一有机功能层42包括以下至少之一：平坦层421，设置在平坦层421背离第一柔性衬底01一侧的像素界定层422以及设置在像素界定层422背离第一柔性衬底01一侧的支撑层423。
可选地，如图4所示，第一有机功能层42可以为平坦层421。平坦层421为像素岛PA延伸至隔离区域TA的膜层，在像素岛PA内起到平坦化的作用。
可选地，如图8所示，第一有机功能层42可以为层叠设置的像素界定层422和支撑层423，像素界定层422和支撑层423为像素岛PA延伸至隔离区域TA的膜层。像素界定层422在像素岛PA内起到限定各个子像素的发光区域的作用，支撑层423在像素岛PA内包括隔离柱134，隔离柱134起到支撑蒸镀掩膜版的作用。
需要说明的是，第一有机功能层42还可以为像素界定层422，还可以为支撑层423，还可以为层叠设置的平坦层421和像素界定层422，还可以为层叠设置的平坦层421和支撑层423，本公开对第一有机功能层42不作具体限定。
如图4和图8所示，第一有机功能层42上设置有第一沟槽43和第一围坝44，第一沟槽43位于第一围坝44远离开孔区域HA的一侧，第一沟槽43在第一方向上贯穿第一有机功能层42。
其中，第一方向为第一有机功能层42靠近第一柔性衬底01的表面指向背离第一柔性衬底01的表面的方向。第二隔离槽41的槽底或第二端面包括第一围坝44靠近开孔区域HA一侧的表面。
通过在第一有机功能层42上设置第一沟槽43和第一围坝44，可以防止后续工艺流程中的液态材料溢流至开孔区域HA中。
如图4和图8所示，构成第二隔离槽41的第二无机膜层23可以包括第一钝化层45，第一钝化层45在第一柔性衬底01上的正投影覆盖第一围坝44在第一柔性衬底01上的正投影。这样，第一钝化层45可以将位于其两侧的 第一有机功能层42和发光材料层03进行完全隔离，防止水氧通过第一有机功能层42入侵至发光材料层03，提高显示基板的可靠性。
如图4和图8所示，构成第二隔离槽41的第一无机膜层21例如可以包括以下膜层至少之一：层叠设置的第二阻挡层311、第一栅极绝缘层312、第二栅极绝缘层313以及层间介质层314等。
其中，第二阻挡层311可以由多层无机材料构成，起到阻挡水氧的作用。第一栅极绝缘层312、第二栅极绝缘层313以及层间介质层314可以均为像素岛PA延伸至隔离区域TA的膜层，可以与像素岛PA中的薄膜晶体管同步形成，如图4和图8所示。
在第三种可选的实现方式中，如图9所示，至少一个隔离槽02还可以包括设置在第二隔离槽41背离第一柔性衬底01的一侧的第三隔离槽53。
第二隔离槽41的结构与第二种实现方式中的描述相同，这里不再赘述。本实现方式中，构成第二隔离槽41的有机膜层22为平坦层421，如图9所示。
构成第三隔离槽53的第一无机膜层21为第一钝化层45。也就是，构成第二隔离槽41的第二无机膜层23的第一钝化层45复用为第三隔离槽53的第一无机膜层21。
构成第三隔离槽53的有机膜层22为第二有机功能层54，第二有机功能层54包括以下至少之一：设置在第一钝化层45背离第一柔性衬底01一侧的像素界定层422以及设置在像素界定层422背离第一柔性衬底01一侧的支撑层423。
构成第三隔离槽53的第二无机膜层23为第二钝化层55。
其中，第二有机功能层54上设置有第三沟槽59和第三围坝56，第三沟槽59位于第三围坝56远离开孔区域HA的一侧，第三沟槽59贯穿第二有机功能层54，第三围坝56在第一柔性衬底01上的正投影位于第一围坝44在第一柔性衬底01上的正投影范围内。通过设置第三沟槽59和第三围坝56，可以防止后续工艺流程中的液态材料溢流至开孔区域HA中。
第二钝化层55在第一柔性衬底01上的正投影覆盖第三围坝56在第一柔性衬底01上的正投影。这样，第二钝化层55可以将位于其两侧的第二有机功能层54和发光材料层03进行完全隔离，防止水氧通过第二有机功能层54 入侵至发光材料层03，提高显示基板的可靠性。
在第四种可选的实现方式中，如图6所示，至少一个隔离槽02包括第一隔离槽31和第二隔离槽41，第二隔离槽41设置在第一隔离槽31背离第一柔性衬底01的一侧。
构成第一隔离槽31的第一无机膜层21可以包括第一阻挡层32，构成第一隔离槽31的有机膜层22可以为第二柔性衬底33，构成第一隔离槽31的第二无机膜层23复用为构成第二隔离槽41的第一无机膜层21。本实现方式中，构成第一隔离槽31的第一无机膜层21、有机膜层22和第二无机膜层23的膜层结构与前述实施例中第一隔离槽31的描述相同，这里不再赘述。
构成第二隔离槽41的有机膜层22包括平坦层421，构成第二隔离槽41的第二无机膜层23包括第一钝化层45。可选地，平坦层421上设置有第二沟槽51和第二围坝52，第二沟槽51位于第二围坝52远离开孔区域HA的一侧，第二沟槽51在第一方向上贯穿平坦层421。通过设置第二沟槽51和第二围坝52，可以防止后续工艺流程中的液态材料溢流至开孔区域HA中。
第一钝化层45在第一柔性衬底01上的正投影覆盖第二围坝52在第一柔性衬底01上的正投影。这样，第一钝化层45可以将位于其两侧的平坦层421和发光材料层03进行完全隔离，防止水氧通过平坦层421入侵至发光材料层03，提高显示基板的可靠性。
第二隔离槽41的槽底或第二端面包括第二围坝52靠近开孔区域HA一侧的表面。
如图5所示，至少一个隔离槽02还可以包括设置在第二隔离槽41背离第一柔性衬底01的一侧的第三隔离槽53。
其中，第二隔离槽41可以位于第一隔离槽31背离第一柔性衬底01的一侧，第二隔离槽41与第一隔离槽31的结构可以参照上述对图6的描述，这里不再赘述。
构成第三隔离槽53的第一无机膜层21为第一钝化层45。也就是，构成第二隔离槽41的第二无机膜层23的第一钝化层45复用为第三隔离槽53的第一无机膜层21。
构成第三隔离槽53的有机膜层22为第二有机功能层54，第二有机功能层54包括以下至少之一：设置在第一钝化层45背离第一柔性衬底01一侧的 像素界定层以及设置在像素界定层背离第一柔性衬底01一侧的支撑层。
构成第三隔离槽53的第二无机膜层23为第二钝化层55。
其中，第二有机功能层54上设置有第三沟槽59和第三围坝56，第三沟槽59位于第三围坝56远离开孔区域HA的一侧，第三沟槽59贯穿第二有机功能层54，第三围坝56在第一柔性衬底01上的正投影位于第二围坝52在第一柔性衬底01上的正投影范围内。通过设置第三沟槽59和第三围坝56，可以防止后续工艺流程中的液态材料溢流至开孔区域HA中。
第二钝化层55在第一柔性衬底01上的正投影覆盖第三围坝56在第一柔性衬底01上的正投影。这样，第二钝化层55可以将位于其两侧的第二有机功能层54和发光材料层03进行完全隔离，防止水氧通过第二有机功能层54入侵至发光材料层03，提高显示基板的可靠性。
如图3至图6、图8和图9所示，显示基板还可以包括：设置在至少一个隔离槽02背离第一柔性衬底01一侧的发光材料层03，发光材料层03在各隔离槽02内断开。
发光材料层03例如可以包括共用有机层、阴极层以及光学耦合层等膜层中的一种或多种，本公开对此不作限定。发光材料层03可以为从像素岛PA延伸至隔离区域TA的膜层。
如图3至图6、图8和图9所示，显示基板还可以包括：设置在发光材料层03背离第一柔性衬底01一侧的封装层04，封装层04在各隔离槽02内连续。
在一种可选的实现方式中，如图6所示，封装层04可以包括：
设置在发光材料层03背离第一柔性衬底01一侧的第一无机封装膜层61，第一无机封装膜层61在第一柔性衬底01上的正投影覆盖开孔区域HA以及隔离区域TA；
设置在第一无机封装膜层61背离第一柔性衬底01一侧的第一有机封装膜层62，第一有机封装膜层62在第一柔性衬底01上的正投影与开孔区域HA以及隔离区域TA无交叠；以及
设置在第一有机封装膜层62背离第一柔性衬底01一侧的第二无机封装膜层63，第二无机封装膜层63在第一柔性衬底01上的正投影覆盖开孔区域HA以及隔离区域TA。
本实现方式中，第一无机封装膜层61对开孔区域HA以及隔离区域TA的完整包裹保证了封装完整性，不仅有效隔绝了来自开孔区域HA的水氧，而且隔离区域TA内的隔离槽对封装层04形成钉扎点，可以进一步防止膜层边缘的剥离失效。
第一有机封装膜层62设置在第一无机封装膜层上，开孔区域HA以及隔离区域TA内的第一有机封装膜层62被去掉，暴露出第一无机封装膜层61的表面。
在开孔区域HA以及隔离区域TA以外的区域，如像素岛PA内，第一无机封装膜层61、第一有机封装膜层62以及第二无机封装膜层63层叠设置，即第二无机封装膜层63设置在第一有机封装膜层62上，形成无机材料/有机材料/无机材料的叠层结构。在开孔区域HA以及隔离区域TA内，第二无机封装膜层63设置在第一无机封装膜层61上，形成无机材料/无机材料的叠层结构。
其中，第一无机封装膜层61以及第二无机封装膜层63的材料可以包括氧化硅、氮化硅以及氮氧化硅等无机材料中的至少一种，可以是单层、多层或复合层，可以保证外界水氧无法进入发光结构层。
第一有机封装膜层62的材料可以采用树脂材料，起到包覆显示基板各个膜层的作用，可以提高结构稳定性和平坦性。
在另一种可选的实现方式中，如图3至图5、图8和图9所示，封装层04可以包括：
设置在发光材料层03背离第一柔性衬底01一侧的第三无机封装膜层57，第三无机封装膜层57在第一柔性衬底01上的正投影覆盖开孔区域HA以及隔离区域TA；以及
设置在第三无机封装膜层57背离第一柔性衬底01一侧的第二有机封装膜层58，第二有机封装膜层58在第一柔性衬底01上的正投影与开孔区域HA无交叠。
本实现方式中，第三无机封装膜层57对开孔区域HA以及隔离区域TA的完整包裹保证了封装完整性，不仅有效隔绝了来自开孔区域HA的水氧，而且隔离区域TA内的隔离槽对封装层04形成钉扎点，可以进一步防止膜层边缘的剥离失效。
第二有机封装膜层58设置在第三无机封装膜层57上，开孔区域HA内的第一有机封装膜层被去掉，暴露出第三无机封装膜层57的表面。
在开孔区域HA以外的区域，如隔离区域TA以及像素岛PA内，第三无机封装膜层57以及第二有机封装膜层58层叠设置，形成无机材料/有机材料的叠层结构。在开孔区域HA内，由第三无机封装膜层57完整包覆。
其中，第三无机封装膜层57的材料可以包括氧化硅、氮化硅以及氮氧化硅等无机材料中的至少一种，可以是单层、多层或复合层，可以保证外界水氧无法进入发光结构层。
第二有机封装膜层58的材料可以采用树脂材料，起到包覆显示基板各个膜层的作用，可以提高结构稳定性和平坦性。
可选地，有机膜层22的厚度大于或等于封装层04的厚度，且小于或等于封装层04的厚度的五倍。若封装层04的厚度为a，则有机膜层22的厚度可以大于或等于a，且小于或等于5*a。这样，可以确保封装层04在隔离槽02内的结构稳固，提高封装层04的附着力。
可选地，封装层04的厚度大于或等于0.5微米，且小于或等于3微米，本公开对此不作限定。例如，封装层04的厚度可以为1微米、1.5微米、2微米等，具体厚度可以根据实际需求设定。
需要说明的是，膜层的厚度指的是膜层在第一方向上的尺寸。
为了全面阻隔开孔区域HA四周的水氧入侵路径，各隔离槽02可以为环绕开孔区域HA的闭合结构。
在一种可选的实现方式中，第一端面与第三端面平齐。由于第一端面与第三端面平齐，因此，第一无机膜层21和第二无机膜层23可以共用一个掩膜板，从而可以简化工艺，降低成本。并且，第一端面与第三端面平齐，可以进一步缩小隔离区域TA的尺寸，为提高显示基板的拉伸性能或像素密度提供空间。
在一种可选的实现方式中，第二端面相对于第一端面和第三端面的缩进量大于或等于0.1微米，且小于或等于5.0微米。
具体地，第二端面相对于第一端面的缩进量可以大于或等于0.3微米，且小于或等于1.5微米。第二端面相对于第三端面的缩进量可以大于或等于0.3微米，且小于或等于1.5微米。也就是，隔离槽02的槽深可以大于或等于0.3 微米，且小于或等于1.5微米。进一步地，隔离槽02的槽深可以大于或等于0.5微米，且小于或等于1.5微米。
在显示基板的制备过程中，可以首先在刚性基底上形成显示基板的各膜层，然后再通过LLO工艺将显示基板与刚性基底剥离。在激光剥离的过程中，开孔区域HA内的封装层04容易发生破裂，进而可能导致封装失效。
为了解决上述问题，在一种可选的实现方式中，参照图3，第一柔性衬底01具有朝向开孔区域HA的第四端面，第四端面相对于第一端面朝远离开孔区域HA的方向缩进。
由于第四端面相对于第一端面缩进，即第一端面相对于第四端面凸出，因此第一端面起到阻隔封装层04裂痕沿着隔离区域TA的侧面向上延伸的作用，避免开孔区域内封装层04上的裂痕延伸各隔离槽02，防止封装失效，提高显示基板的封装可靠性。
在具体实现中，第四端面相对于第一端面缩进可以与隔离槽02同步形成。
第四端面相对于第一端面缩进的缩进量可以大于或等于0.3微米，且小于或等于1.5微米。进一步地，第四端面相对于第一端面缩进的缩进量可以大于或等于0.5微米，且小于或等于1.5微米。
在一种可选的实现方式中，参照图4、图6、图8和图9，像素岛PA包括设置在第二阻挡层311上的像素电路，像素电路中的薄膜晶体管可以包括沟道材料110、第一栅极绝缘层312、第一栅极112、第二栅极绝缘层313、第二栅极114、层间介质层314、源极121和漏极122。图4、图6、图8和图9所示以及上述薄膜晶体管的结构仅为一种实施例示意，其他堆叠结构乃至底栅、双栅结构等本实施例不作限定。
平坦层421覆盖在上述像素电路上，平坦层421起到平坦化的作用。阳极132通过设置在平坦层421上的过孔与漏极122连接。像素界定层422设置在阳极层132背离像素电路的一侧，像素界定层422上设置有像素开口，像素开口内的像素界定层材料被去掉，像素开口内用于形成发光器件的电致发光层。像素开口的位置与阳极132对应，用于蒸镀电致发光层141。支撑层423中的支撑柱134设置在像素界定层422的非像素开口区域背离第一柔性衬底01的一侧，在蒸镀时用于支撑蒸镀掩膜版。在示例性实施方式中，支撑层423与像素界定层422可以通过半色调掩膜版通过同一次图案化工艺形成， 本公开在此不做限定。
在像素界定层422和阳极132背离像素电路的一侧设置有电致发光层141、共用有机层142、阴极及光学调整层143。阴极及光学调整层143设置在共用有机层142背离阳极132的一侧。封装层04设置在阴极及光学调整层143背离阳极132的一侧。
其中，电致发光层141和共用有机层142可以采用蒸镀法进行沉积。共用有机层例如可以包括电子传输层、空穴传输层、电阻注入层、空穴注入层等。电致发光层141可以设置在电子传输层和空穴传输层之间，用于实现像素发光。共用有机层用于提高发光层的发光效率。阴极层的材料例如可以为镁、银、铝、铜或锂等金属材料。
本公开另一实施例还提供了一种显示装置，该显示装置可以包括任一实施例所述的显示基板。
其中，显示基板的像素结构可以为有机发光二极管(Organic Light-Emitting Diode，OLED)、次毫米发光二极管(Mini Light-Emitting Diode，Mini LED)、微型发光二极管(Micro Light-Emitting Diode，Micro LED)、量子发光二极管(Quantum Dot Light-Emitting Diode，QLED)等。
需要说明的是，本实施例中的显示装置可以为：显示面板、电子纸、手机、平板电脑、电视机、笔记本电脑、数码相框、导航仪等任何具有2D或3D显示功能的产品或部件。
本公开另一实施例还提供了一种显示基板的制备方法，其中，显示基板包括开孔区域以及环绕开孔区域设置的隔离区域，参照图7，隔离区域的制备方法包括：
步骤71：提供第一柔性衬底。
步骤72：在第一柔性衬底的一侧形成至少一个隔离槽，各隔离槽由层叠设置的第一无机膜层、有机膜层以及第二无机膜层构成。
其中，第一无机膜层靠近第一柔性衬底设置，第一无机膜层具有朝向开孔区域的第一端面；有机膜层设置在第一无机膜层背离第一柔性衬底的一侧，有机膜层具有朝向开孔区域的第二端面；第二无机膜层设置在有机膜层背离第 一柔性衬底的一侧，第二无机膜层具有朝向开孔区域的第三端面；第二端面相对于第一端面和第三端面朝远离开孔区域的方向缩进，第一无机膜层与第二无机膜层相对的表面以及第二端面构成隔离槽。
采用本实施例提供的制备方法，可以制备得到上述任一实施例的显示基板。
在一种可选的实现方式中，在步骤72之后，还可以包括：在至少一个隔离槽背离第一柔性衬底的一侧形成发光材料层，发光材料层在各隔离槽内断开。在形成发光材料层之后，还可以包括以下步骤：在发光材料层背离第一柔性衬底的一侧形成封装层，封装层在各隔离槽内连续。
在一种可选的实现方式中，步骤71具体可以包括：提供第一柔性薄膜。步骤72具体可以包括以下步骤：首先采用成膜工艺，在第一柔性薄膜的一侧依次形成第一无机薄膜、有机薄膜和第二无机薄膜；然后采用干法刻蚀工艺，对第一无机薄膜、有机薄膜、第二无机薄膜以及第一柔性薄膜进行处理，同步形成开孔区域、位于隔离区域内的第一柔性衬底以及位于第一柔性衬底一侧的至少一个隔离槽。
其中，成膜工艺可以包括溅射、蒸镀和化学气相沉积中的任意一种或多种。
干法刻蚀工艺是用等离子体进行薄膜刻蚀的技术。当气体以等离子体形式存在时，它具备两个特点：一方面等离子体中的这些气体化学活性比常态下时要强很多，根据被刻蚀材料的不同，选择合适的气体，就可以更快地与材料进行反应，实现刻蚀去除薄膜的目的；另一方面，还可以利用电场对等离子体进行引导和加速，使其具备一定能量，当其轰击被刻蚀物的表面时，会将被刻蚀物材料的原子击出，从而达到利用物理上的能量转移来实现刻蚀的目的。
在具体实现中，在采用干法刻蚀工艺形成开孔区域以及位于隔离区域的隔离槽之前，可以完成像素岛中阳极层和像素界定层的制备。
本实现方式中，将阳极层以及像素界定层的制备设置在干刻工艺之前，可以避免阳极层以及像素界定层的制备工艺对开孔区域以及隔离槽造成影响。
本说明书中的各个实施例均采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似的部分互相参见即可。
最后，还需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅 仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、商品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、商品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、商品或者设备中还存在另外的相同要素。
以上对本公开所提供的一种显示基板及其制备方法、显示装置进行了详细介绍，本文中应用了具体个例对本公开的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本公开的方法及其核心思想；同时，对于本领域的一般技术人员，依据本公开的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本公开的限制。
本领域技术人员在考虑说明书及实践这里公开的发明后，将容易想到本公开的其它实施方案。本公开旨在涵盖本公开的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和精神由下面的权利要求指出。
应当理解的是，本公开并不局限于上面已经描述并在附图中示出的精确结构，并且可以在不脱离其范围进行各种修改和改变。本公开的范围仅由所附的权利要求来限制。
本文中所称的“一个实施例”、“实施例”或者“一个或者多个实施例”意味着，结合实施例描述的特定特征、结构或者特性包括在本公开的至少一个实施例中。此外，请注意，这里“在一个实施例中”的词语例子不一定全指同一个实施例。
在此处所提供的说明书中，说明了大量具体细节。然而，能够理解，本公开的实施例可以在没有这些具体细节的情况下被实践。在一些实例中，并未详细示出公知的方法、结构和技术，以便不模糊对本说明书的理解。
在权利要求中，不应将位于括号之间的任何参考符号构造成对权利要求的限制。单词“包含”不排除存在未列在权利要求中的元件或步骤。位于元件 之前的单词“一”或“一个”不排除存在多个这样的元件。本公开可以借助于包括有若干不同元件的硬件以及借助于适当编程的计算机来实现。在列举了若干装置的单元权利要求中，这些装置中的若干个可以是通过同一个硬件项来具体体现。单词第一、第二、以及第三等的使用不表示任何顺序。可将这些单词解释为名称。
最后应说明的是：以上实施例仅用以说明本公开的技术方案，而非对其限制；尽管参照前述实施例对本公开进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本公开各实施例技术方案的精神和范围。

Claims (22)

  1. 一种显示基板，其特征在于，包括开孔区域以及环绕所述开孔区域设置的隔离区域，所述隔离区域包括：第一柔性衬底，以及设置在所述第一柔性衬底一侧的至少一个隔离槽，各所述隔离槽由层叠设置的第一无机膜层、有机膜层以及第二无机膜层构成；
    其中，所述第一无机膜层靠近所述第一柔性衬底设置，所述第一无机膜层具有朝向所述开孔区域的第一端面；所述有机膜层设置在所述第一无机膜层背离所述第一柔性衬底的一侧，所述有机膜层具有朝向所述开孔区域的第二端面；所述第二无机膜层设置在所述有机膜层背离所述第一柔性衬底的一侧，所述第二无机膜层具有朝向所述开孔区域的第三端面；
    所述第二端面相对于所述第一端面和所述第三端面朝远离所述开孔区域的方向缩进，所述第一无机膜层与所述第二无机膜层相对的表面以及所述第二端面构成所述隔离槽。
  2. 根据权利要求1所述的显示基板，其特征在于，所述至少一个隔离槽包括第一隔离槽，构成所述第一隔离槽的第一无机膜层包括第一阻挡层，构成所述第一隔离槽的有机膜层为第二柔性衬底。
  3. 根据权利要求1所述的显示基板，其特征在于，所述至少一个隔离槽包括第二隔离槽，构成所述第二隔离槽的有机膜层为第一有机功能层，所述第一有机功能层包括以下至少之一：平坦层，设置在所述平坦层背离所述第一柔性衬底一侧的像素界定层以及设置在所述像素界定层背离所述第一柔性衬底一侧的支撑层。
  4. 根据权利要求3所述的显示基板，其特征在于，所述第一有机功能层上设置有第一沟槽和第一围坝，所述第一沟槽位于所述第一围坝远离所述开孔区域的一侧，所述第一沟槽贯穿所述第一有机功能层。
  5. 根据权利要求4所述的显示基板，其特征在于，构成所述第二隔离槽的第二无机膜层包括第一钝化层，所述第一钝化层在所述第一柔性衬底上的正投影覆盖所述第一围坝在所述第一柔性衬底上的正投影。
  6. 根据权利要求5所述的显示基板，其特征在于，所述第一有机功能层为所述平坦层，所述至少一个隔离槽还包括设置在所述第二隔离槽背离所述 第一柔性衬底的一侧的第三隔离槽；
    构成所述第三隔离槽的第一无机膜层为所述第一钝化层；
    构成所述第三隔离槽的有机膜层为第二有机功能层，所述第二有机功能层包括以下至少之一：设置在所述第一钝化层背离所述第一柔性衬底一侧的像素界定层以及设置在所述像素界定层背离所述第一柔性衬底一侧的支撑层；
    构成所述第三隔离槽的第二无机膜层为第二钝化层；
    其中，所述第二有机功能层包括第三沟槽和第三围坝，所述第三沟槽位于所述第三围坝远离所述开孔区域的一侧，所述第三沟槽贯穿所述第二有机功能层，所述第三围坝在所述第一柔性衬底上的正投影位于所述第一围坝在所述第一柔性衬底上的正投影范围内，所述第二钝化层在所述第一柔性衬底上的正投影覆盖所述第三围坝在所述第一柔性衬底上的正投影。
  7. 根据权利要求1所述的显示基板，其特征在于，所述至少一个隔离槽包括第一隔离槽和第二隔离槽，所述第二隔离槽设置在所述第一隔离槽背离所述第一柔性衬底的一侧；
    构成所述第一隔离槽的第一无机膜层包括第一阻挡层，构成所述第一隔离槽的有机膜层为第二柔性衬底，构成所述第一隔离槽的第二无机膜层复用为构成所述第二隔离槽的第一无机膜层；
    构成所述第二隔离槽的有机膜层包括平坦层，构成所述第二隔离槽的第二无机膜层包括第一钝化层。
  8. 根据权利要求7所述的显示基板，其特征在于，所述平坦层上设置有第二沟槽和第二围坝，所述第二沟槽位于所述第二围坝远离所述开孔区域的一侧，所述第二沟槽贯穿所述平坦层；
    所述第一钝化层在所述第一柔性衬底上的正投影覆盖所述第二围坝在所述第一柔性衬底上的正投影。
  9. 根据权利要求8所述的显示基板，其特征在于，所述至少一个隔离槽还包括设置在所述第二隔离槽背离所述第一柔性衬底的一侧的第三隔离槽；
    构成所述第三隔离槽的第一无机膜层为所述第一钝化层；
    构成所述第三隔离槽的有机膜层为第二有机功能层，所述第二有机功能层包括以下至少之一：设置在所述第一钝化层背离所述第一柔性衬底一侧的像素界定层以及设置在所述像素界定层背离所述第一柔性衬底一侧的支撑层；
    构成所述第三隔离槽的第二无机膜层为第二钝化层；
    其中，所述第二有机功能层包括第三沟槽和第三围坝，所述第三沟槽位于所述第三围坝远离所述开孔区域的一侧，所述第三沟槽贯穿所述第二有机功能层，所述第三围坝在所述第一柔性衬底上的正投影位于所述第二围坝在所述第一柔性衬底上的正投影范围内，所述第二钝化层在所述第一柔性衬底上的正投影覆盖所述第三围坝在所述第一柔性衬底上的正投影。
  10. 根据权利要求1至9任一项所述的显示基板，其特征在于，所述显示基板还包括：
    设置在所述至少一个隔离槽背离所述第一柔性衬底一侧的发光材料层，所述发光材料层在各所述隔离槽内断开。
  11. 根据权利要求10所述的显示基板，其特征在于，所述显示基板还包括：
    设置在所述发光材料层背离所述第一柔性衬底一侧的封装层，所述封装层在各所述隔离槽内连续。
  12. 根据权利要求11所述的显示基板，其特征在于，所述封装层包括：
    设置在所述发光材料层背离所述第一柔性衬底一侧的第一无机封装膜层，所述第一无机封装膜层在所述第一柔性衬底上的正投影覆盖所述开孔区域以及所述隔离区域；
    设置在所述第一无机封装膜层背离所述第一柔性衬底一侧的第一有机封装膜层，所述第一有机封装膜层在所述第一柔性衬底上的正投影与所述开孔区域以及所述隔离区域无交叠；
    设置在第一有机封装膜层背离所述第一柔性衬底一侧的第二无机封装膜层，所述第二无机封装膜层在所述第一柔性衬底上的正投影覆盖所述开孔区域以及所述隔离区域。
  13. 根据权利要求11所述的显示基板，其特征在于，所述封装层包括：
    设置在所述发光材料层背离所述第一柔性衬底一侧的第三无机封装膜层，所述第三无机封装膜层在所述第一柔性衬底上的正投影覆盖所述开孔区域以及所述隔离区域；
    设置在所述第三无机封装膜层背离所述第一柔性衬底一侧的第二有机封装膜层，所述第二有机封装膜层在所述第一柔性衬底上的正投影与所述开孔 区域无交叠。
  14. 根据权利要求11至13任一项所述的显示基板，其特征在于，所述有机膜层的厚度大于或等于所述封装层的厚度，且小于或等于所述封装层的厚度的五倍。
  15. 根据权利要求11至14任一项所述的显示基板，其特征在于，所述封装层的厚度大于或等于0.5微米，且小于或等于3微米。
  16. 根据权利要求1至15任一项所述的显示基板，其特征在于，各所述隔离槽为环绕所述开孔区域的闭合结构。
  17. 根据权利要求1至16任一项所述的显示基板，其特征在于，所述第一端面与所述第三端面平齐。
  18. 根据权利要求1至17任一项所述的显示基板，其特征在于，所述第一柔性衬底具有朝向所述开孔区域的第四端面，所述第四端面相对于所述第一端面朝远离所述开孔区域的方向缩进。
  19. 根据权利要求1至18任一项所述的显示基板，其特征在于，所述第二端面相对于所述第一端面和所述第三端面的缩进量大于或等于0.1微米，且小于或等于5.0微米。
  20. 一种显示装置，其特征在于，包括权利要求1至19任一项所述的显示基板。
  21. 一种显示基板的制备方法，其特征在于，所述显示基板包括开孔区域以及环绕所述开孔区域设置的隔离区域，所述隔离区域的制备方法包括：
    提供第一柔性衬底；
    在所述第一柔性衬底的一侧形成至少一个隔离槽，各所述隔离槽由层叠设置的第一无机膜层、有机膜层以及第二无机膜层构成；
    其中，所述第一无机膜层靠近所述第一柔性衬底设置，所述第一无机膜层具有朝向所述开孔区域的第一端面；所述有机膜层设置在所述第一无机膜层背离所述第一柔性衬底的一侧，所述有机膜层具有朝向所述开孔区域的第二端面；所述第二无机膜层设置在所述有机膜层背离所述第一柔性衬底的一侧，所述第二无机膜层具有朝向所述开孔区域的第三端面；所述第二端面相对于所述第一端面和所述第三端面朝远离所述开孔区域的方向缩进，所述第一无机膜层与所述第二无机膜层相对的表面以及所述第二端面构成所述隔离槽。
  22. 根据权利要求21所述的制备方法，其特征在于，在所述第一柔性衬底的一侧形成至少一个隔离槽的步骤之后，还包括：
    在所述至少一个隔离槽背离所述第一柔性衬底的一侧形成发光材料层，所述发光材料层在各所述隔离槽内断开；
    在所述发光材料层背离所述第一柔性衬底的一侧形成封装层，所述封装层在各所述隔离槽内连续。
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CN110504291A (zh) * 2019-08-27 2019-11-26 京东方科技集团股份有限公司 一种显示基板及其制备方法、显示装置
CN111564482A (zh) * 2020-05-21 2020-08-21 京东方科技集团股份有限公司 显示基板及制备方法、显示装置
CN111755627A (zh) * 2020-07-08 2020-10-09 京东方科技集团股份有限公司 显示装置、显示面板及其制造方法
CN112038389A (zh) * 2020-09-16 2020-12-04 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置

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CN111564482A (zh) * 2020-05-21 2020-08-21 京东方科技集团股份有限公司 显示基板及制备方法、显示装置
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