WO2020113764A1 - 柔性有机发光二极管（oled）显示基板及其制作方法 - Google Patents

柔性有机发光二极管（oled）显示基板及其制作方法 Download PDF

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Publication number
WO2020113764A1
WO2020113764A1 PCT/CN2019/070998 CN2019070998W WO2020113764A1 WO 2020113764 A1 WO2020113764 A1 WO 2020113764A1 CN 2019070998 W CN2019070998 W CN 2019070998W WO 2020113764 A1 WO2020113764 A1 WO 2020113764A1
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Prior art keywords
flow channel
oled
emitting diode
organic light
liquid conductive
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English (en)
French (fr)
Inventor
贾永臻
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US16/344,308 priority Critical patent/US11227908B2/en
Publication of WO2020113764A1 publication Critical patent/WO2020113764A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/179—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H10D86/443—Interconnections, e.g. scanning lines adapted for preventing breakage, peeling or short circuiting
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to the field of display technology, in particular to a flexible organic light-emitting diode (OLED) display substrate and a manufacturing method thereof.
  • OLED organic light-emitting diode
  • Smartphones have now entered the era of Full Screen Display, and all major mobile phone manufacturers use the high screen ratio as the main selling point of their respective mini mobile phones.
  • panel manufacturers it is necessary to increase the ratio of screen to non-display area (ie Pad Bending) Reversely bend to the back of the display area, so as to maximize the proportion of mobile phone screen. Therefore, Pad The bending performance of the Bending area is a problem that full-screen manufacturers are focusing on.
  • the existing Pad Bending zone structure usually adopts a metal circuit structure of titanium/aluminum/titanium (Ti/Al/Ti) or molybdenum/aluminum/molybdenum (Mo/Al/Mo), and the metal circuit is deposited on the base film through a plasma sputtering process The surface of the layer, and solidified under the condition of high temperature quenching to form a brittle amorphous structure. This process inevitably formed micro-cracks on the surface of metal lines, these micro-cracks in Pad Cracking occurred during the bending of the Bending structure, which eventually caused the metal line to break.
  • Ti/Al/Ti titanium/aluminum/titanium
  • Mo/Al/Mo molybdenum/aluminum/molybdenum
  • the existing Pad Bending zone structure usually adopts a metal circuit structure of titanium/aluminum/titanium (Ti/Al/Ti) or molybdenum/aluminum/molybdenum (Mo/Al/Mo), and the metal circuit is deposited on the base film through a plasma sputtering process The surface of the layer, and solidified under the condition of high temperature quenching to form a brittle amorphous structure. This process inevitably formed micro-cracks on the surface of metal lines, these micro-cracks in Pad Cracking occurred during the bending of the Bending structure, which eventually caused the metal line to break.
  • Ti/Al/Ti titanium/aluminum/titanium
  • Mo/Al/Mo molybdenum/aluminum/molybdenum
  • the present invention provides a flexible organic light-emitting diode (OLED) display substrate and a manufacturing method thereof to solve the problem that the existing OLED display panel is prone to metal wire breakage during the bending process.
  • OLED organic light-emitting diode
  • the object of the present invention is to provide a flexible organic light-emitting diode (OLED) display substrate and a manufacturing method thereof.
  • the liquid conductive material with high conductivity and high bending strength (Bending Strength) is used as the liquid conductive circuit, and the organic polymer material is used Encapsulate the liquid conductive material, and design the transition between the metal wire part and the liquid conductive material at both ends of the Pad Bending area to increase the contact area with the liquid conductive material to ensure good electrical conduction and functional integrity.
  • an embodiment of the present invention provides a flexible organic light emitting diode (OLED) display substrate including a display area, a non-display area, and a bend connecting the display area and the non-display area A permissible area, characterized in that the bending permissible area is provided with a plurality of liquid conductive lines interspersed with each other, and any one of the liquid conductive lines includes a circuit flow channel and a connection line flow provided in the bending permissible area A metal wire part at both ends of the channel, an encapsulation layer is provided on the circuit flow channel to store liquid conductive material, wherein the liquid conductive material is enclosed in the circuit flow channel, and one end of the metal wire part extends into the circuit flow channel In contact with the liquid conductive material to form electrical conduction, the other end of the metal wire portion is electrically connected to the display area and the non-display area, respectively.
  • OLED organic light emitting diode
  • the line flow channel structure is linear, double-chain, staggered three-chain or staggered four-chain.
  • the cross-sectional shape of the line flow channel is circular, elliptical or rectangular.
  • the liquid conductive material is metallic mercury or a saturated strong electrolyte solution.
  • the encapsulation layer is an organic polymer material.
  • the flexible OLED display substrate includes a display area, a non-display area, and a bending allowance area connecting the display area and the non-display area.
  • the bending allowable area there are a plurality of liquid conductive circuits interdigitated, and any of the liquid conductive circuits includes a circuit flow path provided in the bending allowable area and a metal connecting both ends of the circuit flow path.
  • the line part is provided with an encapsulation layer on the line flow channel to store the liquid conductive material, wherein the liquid conductive material is enclosed in the line flow channel.
  • one end of the metal wire portion extends into the circuit flow channel and contacts the liquid conductive material to form electrical conduction, and the other end of the metal wire portion is electrically connected to the display area and The non-display area.
  • the line flow channel structure is linear, double-chain, staggered three-chain or staggered four-chain.
  • the cross-sectional shape of the line flow channel is circular, elliptical or rectangular.
  • the liquid conductive material is metallic mercury or a saturated strong electrolyte solution.
  • the encapsulation layer is an organic polymer material.
  • the present invention also provides a method for manufacturing a flexible organic light emitting diode (OLED) display substrate.
  • the flexible OLED display substrate includes a display area, a non-display area, and a bending allowance area connecting the display area and the non-display area, including The following steps:
  • any one of the liquid conductive circuits includes a circuit flow path forming the bend allowable area and a metal connecting both ends of the line flow path Line department
  • step S10 laser etching is used to form the line flow channel.
  • step S30 the liquid conductive material is introduced into the circuit flow channel using inkjet printing or evaporation technology.
  • step S40 a process including surface smoothing, coating of UV glue and bending is further performed.
  • the present invention can greatly improve the yield rate of manufacturing in the bending allowance area, reduce the manufacturing cost of the OLED full screen in the module section, and further improve the profitability of the OLED full screen manufacturer. Furthermore, due to the fluidity of the liquid conductive material in the present invention, no stress is generated even after bending in the bending allowance region, and the encapsulation layer ensures that the liquid conductive material does not leak.
  • the multi-chain circuit flow channels between each other eliminate the hidden danger of single flow channel blockage, and ensure that the electrical signals in the bending allowable area can be stably transmitted to the display area and the non-display area.
  • FIG. 1 is a schematic diagram of a flexible organic light emitting diode (OLED) display substrate of the present invention
  • FIG. 2 is a schematic diagram of the bending allowable area of the present invention.
  • FIG. 3 is a schematic sectional view of FIG. 2;
  • FIG. 4 is another schematic sectional view of FIG. 2;
  • FIG. 5 is a block diagram of a method for manufacturing a flexible organic light emitting diode (OLED) display substrate of the present invention.
  • FIG. 6A to FIG. 6D are schematic diagrams of the flow path structure of each line of the present invention.
  • a flexible organic light emitting diode (OLED) display substrate of the present invention includes a display area 1, a non-display area 2, and a display area 1 and a non-display area 2 connected Bending allowable zone 3.
  • the bending allowance area 3 is provided with a plurality of liquid conductive circuits 4 interdigitated, and any liquid conductive line 4 includes a line flow channel 41 provided in the bending allowable area 3 and a metal connecting both ends of the line flow channel 41 ⁇ 42 ⁇ 42 line section.
  • the circuit flow channel 41 is provided with an encapsulation layer 6 to store the liquid conductive material 5, wherein the liquid conductive material 5 is enclosed in the circuit flow channel 41.
  • the liquid conductive material 5 is, for example, metallic mercury, a saturated strong electrolyte solution, or other suitable fluids.
  • the shape of the metal wire portion 42 is not limited, but the basic requirement is to be covered or submerged by the liquid conductive material 5 so as to ensure good conductivity.
  • the material of the metal wire portion 42 may be formed using two or more layers selected from aluminum (Al), titanium (Ti), molybdenum (Mo), and copper (Cu), for example, titanium/aluminum/ Titanium (Ti/Al/Ti) or molybdenum/aluminum/molybdenum (Mo/Al/Mo) etc.
  • the encapsulation layer 6 is an organic polymer material, which is coated on the entire inner wall surface of the circuit flow channel 41 and its vertical wall surface.
  • the composition of the organic polymer material is, for example, polyimide (PI), polyethylene terephthalate (polyethylene terephthalate, PET), or other organic polymer materials with high water-oxygen barrier properties and low permeability to ensure that the liquid conductive material 5 does not leak from the circuit flow channel 41.
  • one end of the metal wire portion 42 extends into the circuit flow channel 41 and contacts the liquid conductive material 5 to form an electrical conduction, thereby increasing contact with the liquid conductive material 5 Area; the other end of the metal wire portion 42 is electrically connected to the display area 1 and the non-display area 2, respectively, thereby ensuring good electrical conduction and functional integrity.
  • the cross-sectional shape of the circuit flow channel 41 of any liquid conductive circuit 4 is, for example, circular, oval, or rectangular, and is not limited.
  • the structure of the line flow channel 41 is linear, double-chain, staggered three-chain or staggered four-chain.
  • the line channels 41 in FIGS. 2, 3, 4 and 6A are linear.
  • 6B, 6C, and 6D are a double-chain type, a staggered three-chain type, or a staggered four-chain type, respectively.
  • the multi-chain line flow channels 41 spaced apart from each other can eliminate the hidden danger of a single flow channel clogging, and ensure that the electrical signal of the bending allowable area 3 can be stably transmitted to the display area 1 and the non-display area 2.
  • the present invention also provides a method for manufacturing a flexible organic light emitting diode (OLED) display substrate, the flexible OLED display substrate includes a display area, a non-display area, and a bend connecting the display area and the non-display area Allowable area, including the following steps:
  • any one of the liquid conductive circuits includes a circuit flow path forming the bend allowable area and a metal connecting both ends of the line flow path Line part; S20, coating a encapsulation layer in the circuit flow channel; S30, injecting a liquid conductive material into the circuit flow channel; and S40, performing encapsulation treatment on the circuit flow channel to close the liquid conductive material .
  • step S10 laser etching is used to form the circuit flow channel on the bending allowance region. Specifically, a plurality of circuit flow channels are formed on the base layer of the flexible display substrate by laser etching.
  • step S20 surface etching treatment is performed on each of the etched circuit flow channels, and a polymer encapsulation material such as PI or PET is coated to form the encapsulation layer.
  • step S30 the liquid conductive material is introduced into the circuit flow channel by using inkjet printing or evaporation technology, and then the upper part of the circuit flow channel is encapsulated so that the liquid conductive material is enclosed in the circuit flow channel.
  • the metal wire parts located at both ends of the flow channel can also be made by inkjet printing, evaporation technology or other suitable processes.
  • step S40 the post-bending process of the bending allowance zone is further included, including surface smoothing treatment, coating of UV glue and bending. In this way, the flexible organic light emitting diode (OLED) display substrate of the present invention is made.
  • the present invention can greatly improve the yield rate of manufacturing in the bending allowance area, reduce the manufacturing cost of the OLED full screen in the module section, and further improve the profitability of the OLED full screen manufacturer. Furthermore, due to the fluidity of the liquid conductive material in the present invention, no stress is generated even after bending in the bending allowance region, and the encapsulation layer ensures that the liquid conductive material does not leak.
  • the multi-chain circuit flow channels between each other eliminate the hidden danger of single flow channel blockage, and ensure that the electrical signals in the bending allowable area can be stably transmitted to the display area and the non-display area.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种柔性有机发光二极管（OLED）显示基板及其制作方法，其中柔性有机发光二极管（OLED）显示基板包括显示区（1）、非显示区（2）及连接显示区（1）和非显示区（2）的弯折容许区（3），其特征在于，所述弯折容许区（3）设有相互间格的多个液态导电线路（4），任一所述液态导电线路（4）包括设于所述弯折容许区（3）内的线路流道（41）及连接线路流道（41）两端的一金属线部（42），所述线路流道（41）上设有封装层（6）以储存液态导电材料（5），其中所述液态导电材料（5）封闭于所述线路流道（41）内。藉此，液态导电线路（4）能够大幅提高弯折容许区（3）的良品率，消除现行弯折容许区弯折过程易断线的问题。

Description

柔性有机发光二极管（OLED）显示基板及其制作方法 技术领域
本发明涉及显示技术领域，尤指一种柔性有机发光二极管（OLED）显示基板及其制作方法。
 背景技术
智能手机现在已进入了全面屏（Full Screen Display）时代，各大手机厂商均以高屏占比作为各自品牌旗舰手机的主打卖点。对于面板厂商而言，提高屏占比势必要将非显示区域（即Pad Bending）反向弯折到显示区域的背面，这样才能最大限度的提高手机屏占比。因此，Pad Bending区域的弯折性能是全面屏生产厂商着力研究的问题。
现有Pad Bending区结构通常采用钛/铝/钛（Ti/Al/Ti）或者钼/铝/钼（Mo/Al/Mo）的金属线路结构，金属线路通过等离子溅射的工艺沉积到基底膜层表面，并在高温激冷状态下凝固形成脆性的非晶组织。该工艺不可避免地在金属线路表面形成了微裂纹，这些微裂纹在Pad Bending结构弯折过程中发生裂纹扩展，最终造成金属线路断线。Pad Bending的弯折断线问题是OLED全面屏模组段制程的重要难题，是造成Pad bending良品率降低的主要原因。此外，由于裂纹宽度细窄，一般显微镜下难于察觉，含有断线问题的产品也较难进行修复。
 技术问题
现有Pad Bending区结构通常采用钛/铝/钛（Ti/Al/Ti）或者钼/铝/钼（Mo/Al/Mo）的金属线路结构，金属线路通过等离子溅射的工艺沉积到基底膜层表面，并在高温激冷状态下凝固形成脆性的非晶组织。该工艺不可避免地在金属线路表面形成了微裂纹，这些微裂纹在Pad Bending结构弯折过程中发生裂纹扩展，最终造成金属线路断线。Pad Bending的弯折断线问题是OLED全面屏模组段制程的重要难题，是造成Pad bending良品率降低的主要原因。此外，由于裂纹宽度细窄，一般显微镜下难于察觉，含有断线问题的产品也较难进行修复。
 技术解决方案
有鉴于此，本发明提供一种柔性有机发光二极管（OLED）显示基板及其制作方法，以解决现有技术所存在OLED显示面板在弯折过程中易发生金属线路断裂的问题。
本发明的目的在于提供一种柔性有机发光二极管（OLED）显示基板及其制作方法，采用高导电率且高抗弯折强度(Bending Strength)的液态导电材料作为液态导电线路，以有机高分子材料对液态导电材料进行封装，并在Pad Bending区域的两端进行金属线部与液态导电材料的过渡设计，增大与液态导电材料的接触面积，保证良好的电性导通效果与功能完好。
为达成本发明的前述目的，本发明一实施例提供一种柔性有机发光二极管（OLED）显示基板，所述柔性OLED显示基板包括显示区、非显示区及连接显示区和非显示区的弯折容许区，其特征在于，所述弯折容许区设有相互间格的多个液态导电线路，任一所述液态导电线路包括设于所述弯折容许区内的线路流道及连接线路流道两端的一金属线部，所述线路流道上设有封装层以储存液态导电材料，其中所述液态导电材料封闭于所述线路流道内，所述金属线部一端伸入所述线路流道内并与所述液态导电材料接触形成电性导通，所述金属线部另一端分别电性连接所述显示区和所述非显示区。
根据本发明一实施例，所述线路流道结构为线型、双链条型、交错三链条型或交错四链条型。
根据本发明一实施例，所述线路流道断面形状为圆形、椭圆形或矩形。
根据本发明一实施例，所述液态导电材料为金属汞或饱和强电解质溶液。
根据本发明一实施例，所述封装层为有机高分子材料。
本发明另一广义的实施例提供一种柔性有机发光二极管（OLED）显示基板，所述柔性OLED显示基板包括显示区、非显示区及连接显示区和非显示区的弯折容许区，其特征在于，所述弯折容许区设有相互间格的多个液态导电线路，任一所述液态导电线路包括设于所述弯折容许区内的线路流道及连接线路流道两端的一金属线部，所述线路流道上设有封装层以储存液态导电材料，其中所述液态导电材料封闭于所述线路流道内。
根据本发明一实施例，所述金属线部一端伸入所述线路流道内并与所述液态导电材料接触形成电性导通，所述金属线部另一端分别电性连接所述显示区和所述非显示区。
根据本发明一实施例，所述线路流道结构为线型、双链条型、交错三链条型或交错四链条型。
根据本发明一实施例，所述线路流道断面形状为圆形、椭圆形或矩形。
根据本发明一实施例，所述液态导电材料为金属汞或饱和强电解质溶液。
根据本发明一实施例，所述封装层为有机高分子材料。
再者，本发明还提供一种柔性有机发光二极管（OLED）显示基板的制作方法，所述柔性OLED显示基板包括显示区、非显示区及连接显示区和非显示区的弯折容许区，包括以下步骤：
  S10、在所述弯折容许区上形成相互间格的多个液态导电线路，任一所述液态导电线路包括形成所述弯折容许区内的线路流道及连接线路流道两端的一金属线部；
  S20、在所述线路流道内涂布一封装层；
  S30、在所述线路流道内注入一液态导电材料；及
  S40、在所述线路流道上进行封装处理以封闭所述液态导电材料。
根据本发明一实施例，在步骤S10中，采用激光蚀刻形成所述线路流道。
根据本发明一实施例，在步骤S30中，采用喷墨打印或蒸镀技术在所述线路流道内导入所述液态导电材料。
根据本发明一实施例，在步骤S40后，进一步进行包括表面平整处理、涂布UV固话胶以及弯折制程。
 有益效果
与现有技术相比较，本发明能够大幅提高弯折容许区制造的良品率，降低OLED全面屏在模组段的制造成本，进一步提升OLED全面屏生产商的利润率。再者，本发明由于液态导电材料的流动性，即使在弯折容许区弯折之后，并不产生应力，且封装层确保液态导电材料不会发生渗漏。相互间格的多链条的线路流道消除单一流道堵塞隐患，保证弯折容许区的电信号可以稳定传导至显示区和非显示区。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明柔性有机发光二极管（OLED）显示基板的示意图；
图2是本发明弯折容许区的示意图；
图3是图2的剖视示意图；
图4是图2的另一剖视示意图；
图5是本发明柔性有机发光二极管（OLED）显示基板的制作方法的方块图；及
图6A至图6D是本发明各个线路流道结构的示意图。
 本发明的实施方式
在具体实施方式中提及“实施例”意指结合实施例描述的特定特征、结构或特性可以包含在本发明的至少一个实施例中。在说明书中的不同位置出现的相同用语并非必然被限制为相同的实施方式，而应当理解为与其它实施例互为独立的或备选的实施方式。在本发明提供的实施例所公开的技术方案启示下，本领域的普通技术人员应理解本发明所描述的实施例可具有其他符合本发明构思的技术方案结合或变化。
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如[上]、[下 ]、[前]、 [后]、 [左]、 [右]、 [内]、 [外]、 [侧面 ]、[竖直]、[水平]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是用以相同标号表示。
请参照图1及图2所示，本发明一种柔性有机发光二极管（OLED）显示基板，所述柔性OLED显示基板包括显示区1、非显示区2及连接显示区1和非显示区2的弯折容许区3。弯折容许区3设有相互间格的多个液态导电线路4，任一液态导电线路4包括设于所述弯折容许区3内的线路流道41及连接线路流道41两端的一金属线部42。线路流道41上设有封装层6以储存液态导电材料5，其中所述液态导电材料5封闭于所述线路流道41内。
在如图1及图2所示的实施例中，所述液态导电材料5例如为金属汞、饱和强电解质溶液或其他适合的流体。金属线部42的形状不限制，但基本要求为要被液态导电材料5覆盖或浸没，从而保证良好的导电性。在一些实施例中，金属线部42的材料可以使用选自铝(A1)、钛(Ti)、钼(Mo)、铜(Cu)中的两层或更多层形成，例如钛/铝/钛（Ti/Al/Ti）或钼/铝/钼（Mo/Al/Mo）等。
所述封装层6为有机高分子材料，涂布于整个线路流道41内层壁面及其垂直壁面上。有机高分子材料的成分例如是聚酰亚胺(Polyimide, PI)、聚对苯二甲酸乙二酯（polyethylene terephthalate, PET），或者是其他具有较高的水氧阻隔性能和低渗透性的有机高分子材料，以确保液态导电材料5不会从线路流道41中渗漏。
如图2至图4所示，金属线部42的一端伸入所述线路流道41内并与所述液态导电材料5接触形成电性导通，借此增大与液态导电材料5的接触面积；金属线部42的另一端分别电性连接显示区1和非显示区2，从而保证良好的电性导通与功能完好。任一液态导电线路4的线路流道41的断面形状例如为圆形、椭圆形或矩形，并不限制。
请一并参照图6A至图6D所示，所述线路流道41的结构分别为线型、双链条型、交错三链条型或交错四链条型。换句话说，图2、图3、图4及图6A的线路流道41为线型。图6B、图6C及图6D分别为双链条型、交错三链条型或交错四链条型。相互间隔的多链条的线路流道41能够消除单一流道堵塞隐患，保证弯折容许区3的电信号可以稳定传导至显示区1和非显示区2。具体实施方案可参考液态导电线路4的宽度要求，选择合适的线路流道41结构类型。
同样参照图5所示，本发明另提供一种柔性有机发光二极管（OLED）显示基板的制作方法，所述柔性OLED显示基板包括显示区、非显示区及连接显示区和非显示区的弯折容许区，包括以下步骤：
S10、在所述弯折容许区上形成相互间格的多个液态导电线路，任一所述液态导电线路包括形成所述弯折容许区内的线路流道及连接线路流道两端的一金属线部；S20、在所述线路流道内涂布一封装层；S30、在所述线路流道内注入一液态导电材料；及S40、在所述线路流道上进行封装处理以封闭所述液态导电材料。
在步骤S10中，采用激光蚀刻在弯折容许区上形成所述线路流道。具体而言，在柔性显示基板的基底层，采用激光蚀刻形成多个线路流道。在步骤S20中，对蚀刻出的各线路流道进行表面封装处理，涂布例如PI或PET等高分子封装材料，以形成所述封装层。
在步骤S30中，采用喷墨打印或蒸镀技术在所述线路流道内导入所述液态导电材料，再对线路流道的上部进行封装处理，使液态导电材料封闭于线路流道内。位于线路流道两端的金属线部也可以通过喷墨打印、蒸镀技术或其他适合工艺制作而成。在步骤S40后，进弯折容许区后段制程，进一步包括表面平整处理、涂布UV固话胶以及弯折等制程。如此制成本发明的柔性有机发光二极管（OLED）显示基板。
因此，本发明能够大幅提高弯折容许区制造的良品率，降低OLED全面屏在模组段的制造成本，进一步提升OLED全面屏生产商的利润率。再者，本发明由于液态导电材料的流动性，即使在弯折容许区弯折之后，并不产生应力，且封装层确保液态导电材料不会发生渗漏。相互间格的多链条的线路流道消除单一流道堵塞隐患，保证弯折容许区的电信号可以稳定传导至显示区和非显示区。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，所衍生的各种更动与变化，皆涵盖于本发明以权利要求界定的保护范围内。

Claims (15)

  1. 一种柔性有机发光二极管（OLED）显示基板，所述柔性OLED显示基板包括显示区、非显示区及连接显示区和非显示区的弯折容许区，其特征在于，所述弯折容许区设有相互间格的多个液态导电线路，任一所述液态导电线路包括设于所述弯折容许区内的线路流道及连接线路流道两端的一金属线部，所述线路流道上设有封装层以储存液态导电材料，其中所述液态导电材料封闭于所述线路流道内，所述金属线部一端伸入所述线路流道内并与所述液态导电材料接触形成电性导通，所述金属线部另一端分别电性连接所述显示区和所述非显示区。
  2. 如权利要求1所述的柔性有机发光二极管（OLED）显示基板，其中所述线路流道结构为线型、双链条型、交错三链条型或交错四链条型。
  3. 如权利要求1所述的柔性有机发光二极管（OLED）显示基板，其中所述线路流道断面形状为圆形、椭圆形或矩形。
  4. 如权利要求1所述的柔性有机发光二极管（OLED）显示基板，其中所述液态导电材料为金属汞或饱和强电解质溶液。
  5. 如权利要求1所述的柔性有机发光二极管（OLED）显示基板，其中所述封装层为有机高分子材料。
  6. 一种柔性有机发光二极管（OLED）显示基板，所述柔性OLED显示基板包括显示区、非显示区及连接显示区和非显示区的弯折容许区，其特征在于，所述弯折容许区设有相互间格的多个液态导电线路，任一所述液态导电线路包括设于所述弯折容许区内的线路流道及连接线路流道两端的一金属线部，所述线路流道上设有封装层以储存液态导电材料，其中所述液态导电材料封闭于所述线路流道内。
  7. 如权利要求6所述的柔性有机发光二极管（OLED）显示基板，其中所述金属线部一端伸入所述线路流道内并与所述液态导电材料接触形成电性导通，所述金属线部另一端分别电性连接所述显示区和所述非显示区。
  8. 如权利要求6所述的柔性有机发光二极管（OLED）显示基板，其中所述线路流道结构为线型、双链条型、交错三链条型或交错四链条型。
  9. 如权利要求6所述的柔性有机发光二极管（OLED）显示基板，其中所述线路流道断面形状为圆形、椭圆形或矩形。
  10. 如权利要求6所述的柔性有机发光二极管（OLED）显示基板，其中所述液态导电材料为金属汞或饱和强电解质溶液。
  11. 如权利要求6所述的柔性有机发光二极管（OLED）显示基板，其中所述封装层为有机高分子材料。
  12. 一种柔性有机发光二极管（OLED）显示基板的制作方法，所述柔性OLED显示基板包括显示区、非显示区及连接显示区和非显示区的弯折容许区，包括以下步骤：
      S10、在所述弯折容许区上形成相互间格的多个液态导电线路，任一所述液态导电线路包括形成所述弯折容许区内的线路流道及连接线路流道两端的一金属线部；
      S20、在所述线路流道内涂布一封装层；
      S30、在所述线路流道内注入一液态导电材料；及
      S40、在所述线路流道上进行封装处理以封闭所述液态导电材料。
  13. 如权利要求12所述的柔性有机发光二极管（OLED）显示基板的制作方法，其中在步骤S10中，采用激光蚀刻形成所述线路流道。
  14. 如权利要求12所述的柔性有机发光二极管（OLED）显示基板的制作方法，其中在步骤S30中，采用喷墨打印或蒸镀技术在所述线路流道内导入所述液态导电材料。
  15. 如权利要求12所述的柔性有机发光二极管（OLED）显示基板的制作方法，其中在步骤S40后，进一步进行包括表面平整处理、涂布UV固话胶以及弯折制程。
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CN108598142A (zh) * 2018-06-28 2018-09-28 上海天马微电子有限公司 柔性显示基板、柔性显示面板和柔性显示装置

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