WO2020105543A1 - 磁気シールド材 - Google Patents

磁気シールド材

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Publication number
WO2020105543A1
WO2020105543A1 PCT/JP2019/044731 JP2019044731W WO2020105543A1 WO 2020105543 A1 WO2020105543 A1 WO 2020105543A1 JP 2019044731 W JP2019044731 W JP 2019044731W WO 2020105543 A1 WO2020105543 A1 WO 2020105543A1
Authority
WO
WIPO (PCT)
Prior art keywords
magnetic
shield material
thickness
magnetic shield
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2019/044731
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
太一 石原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kitagawa Industries Co Ltd
Original Assignee
Kitagawa Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=70774495&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2020105543(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Kitagawa Industries Co Ltd filed Critical Kitagawa Industries Co Ltd
Priority to US17/294,873 priority Critical patent/US11690207B2/en
Priority to CN201980062317.9A priority patent/CN112740848B/zh
Priority to EP19887297.0A priority patent/EP3886550B1/en
Publication of WO2020105543A1 publication Critical patent/WO2020105543A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/18—Layered products comprising a layer of metal comprising iron or steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/14—Layered products comprising a layer of synthetic resin next to a particulate layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/30—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being formed of particles, e.g. chips, granules, powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0075—Magnetic shielding materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/105—Metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/208—Magnetic, paramagnetic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/702—Amorphous
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0058—Casings specially adapted for optoelectronic applications

Definitions

  • the present invention relates to a magnetic shield material having a magnetic field shielding effect.
  • the magnetic field shielding (magnetic field shielding) effect of the above magnetic shield material is generally determined by the relative permeability and thickness of a high relative permeability material such as permalloy used for the magnetic shield material.
  • a high relative permeability material such as permalloy used for the magnetic shield material.
  • the high relative permeability material such as permalloy that has been used for the conventional magnetic shield material is expensive because it needs to be heat-treated at the time of manufacturing and contains Ni.
  • Patent Document 1 by laminating a magnetic layer containing a (soft) magnetic material and a conductive layer containing a conductive material (a material having a low electric resistivity), the magnetic field can be relatively low.
  • a magnetic shield material with improved shielding effect.
  • the present invention is to solve the above problems, and an object of the present invention is to provide a magnetic shield material capable of obtaining a good magnetic field shielding effect in the frequency band of electromagnetic waves to be shielded.
  • a magnetic shield material of the present invention is a magnetic shield material including a magnetic layer containing a magnetic material and a conductive layer containing a conductive material, wherein the conductive layer is an electromagnetic wave to be shielded. It has a thickness corresponding to the frequency band.
  • the thickness of the conductive layer is preferably a thickness that maximizes the magnetic field shielding effect of the magnetic shield material in the frequency band of the electromagnetic waves to be shielded.
  • the conductive material is preferably aluminum.
  • the conductive layer may be a sheet metal containing a metal foil.
  • the magnetic material is preferably a soft magnetic material.
  • the magnetic material is preferably an amorphous metal.
  • the magnetic layer is preferably a sheet metal containing a metal foil.
  • the conductive layer has a thickness according to the frequency band of the electromagnetic wave to be shielded.
  • the magnetic shield material including the magnetic layer containing the magnetic material and the conductive layer containing the conductive material like the magnetic shield material of the present invention
  • the magnetic field shielding effect is maximized depending on the frequency band of the electromagnetic wave to be shielded.
  • the thickness of the conductive layer is different. Therefore, as described above, by setting the thickness of the conductive layer according to the frequency band of the electromagnetic wave to be shielded (by changing the thickness of the conductive layer according to the frequency band of the electromagnetic wave to be shielded), It is possible to obtain a good magnetic field shielding effect in the frequency band of the electromagnetic wave to be shielded.
  • Sectional drawing of the magnetic shield material of one Embodiment of this invention Sectional drawing of the member around the usage example of the same magnetic shield material.
  • the graph which shows the measurement result of the magnetic field shield effect when the thickness of the aluminum foil in the magnetic shield material shown in FIG. 2 is 6.5 micrometers, 11 micrometers, and 30 micrometers, and there is no aluminum foil.
  • FIG. 3 is a cross-sectional view of the magnetic shield material and the electronic component when the magnetic shield material is placed upside down in the electronic component with the magnetic shield material upside down.
  • FIG. 1 is a sectional view of the magnetic shield material according to the present embodiment.
  • the magnetic shield material 1 includes a magnetic layer 2 containing a magnetic material and a conductive layer 3 containing a conductive material. More specifically, the magnetic shield material 1 is formed by laminating a magnetic layer 2 containing a magnetic material and a conductive layer 3 containing a conductive material.
  • the conductive layer 3 has a thickness corresponding to the frequency band of the electromagnetic wave to be shielded (electromagnetic wave generated from a device around the magnetic shield material).
  • the thickness of the conductive layer 3 is set to a thickness that maximizes the magnetic field shielding effect of the magnetic shield material 1 in the frequency band of the electromagnetic wave to be shielded.
  • the magnetic layer 2 includes a sheet metal formed of a metal having a high relative magnetic permeability such as permalloy, silicon steel, iron, stainless steel, and sendust in a plate shape, a metal foil of an amorphous metal, a ferrite material fired in a plate shape, and
  • the above magnetic materials metal such as permalloy, silicon steel, iron, and stainless steel having a high relative magnetic permeability, amorphous metals, and ferrite materials
  • Each magnetic material used for the magnetic layer 2 is basically a soft magnetic material.
  • the conductive layer 3 includes a sheet metal obtained by molding a conductive metal (having a low electrical resistivity) such as copper, gold, silver, nickel, and aluminum into a plate shape, and the conductive metal described above.
  • a conductive metal having a low electrical resistivity
  • the conductive layer 3 includes a sheet metal obtained by molding a conductive metal (having a low electrical resistivity) such as copper, gold, silver, nickel, and aluminum into a plate shape, and the conductive metal described above.
  • the magnetic shield material 1 includes a layer of a PET (polyethylene terephthalate) film 11 and layers of double-sided adhesive tapes 14 and 15 in addition to the layers of the magnetic foil 12 and the aluminum foil 13 described above.
  • the lower surface of the PET film 11 is adhered to the upper surface of the magnetic foil 12 using an acrylic resin adhesive.
  • the reason why the PET film 11 is provided as the uppermost layer of the magnetic shield material 1 is to protect the surface of the magnetic shield material 1 and to enhance the heat resistance of the magnetic shield material 1.
  • the upper surface and the lower surface of the double-sided adhesive tape 14 are attached to the lower surface of the magnetic foil 12 and the upper surface of the aluminum foil 13, respectively, and the upper surface and the lower surface of the double-sided adhesive tape 15 are respectively the lower surface of the aluminum foil 13. It is attached to the upper surface of the electronic component 16 that is a source of electromagnetic waves (noise).
  • the electronic component 16 includes a switching power supply as well as a circuit such as an IC.
  • the KEC method is a measuring method developed by KEC (Kansai Electronics Industry Promotion Center).
  • the measurement system of the KEC method is the amount of attenuation of the magnetic field or electric field strength in the near field when there is a shield material, as seen from the strength of the magnetic field or electric field in the near field (space near the electromagnetic wave generation source) in the absence of the shield material Is measured in decibels as the shielding effect.
  • the shield effect (SE: Shield Effect) is obtained by the following equation (1).
  • SE (dB) 20 log 10 (E 0 / E 1 ) ... (1) (However, E 0 : near-field magnetic field strength or electric field strength without shield material, E 1 : near-field magnetic field strength or electric field strength with shield material)
  • Graphs A, B, and C in FIG. 3 are graphs of the measurement results of the magnetic field shielding effect when the thickness of the aluminum foil 13 in the magnetic shield material 1 shown in FIG. 2 is 6.5 ⁇ m, 11 ⁇ m, and 30 ⁇ m, respectively. is there.
  • the graph of D in FIG. 3 is a graph of the measurement result of the magnetic field shield effect when the aluminum foil 13 is removed from the magnetic shield material 1 shown in FIG.
  • the magnetic foil 12 of the magnetic shield material 1 used for these measurements had a thickness of 20 ⁇ m and a relative magnetic permeability ( ⁇ / ⁇ 0) of about 9,000.
  • the magnetic shield material 1 is the magnetic foil 12 and the aluminum foil 13 only.
  • the thickness of the aluminum foil 13 is set to 6.5 ⁇ m, 11 ⁇ m, and 30 ⁇ m, the measurement result of the magnetic field shield effect similar to the graphs of A, B, and C can be obtained. Further, for the same reason as this, the graph of the measurement result of the magnetic field shield effect of only the magnetic foil 12 is substantially the same as the graph of D above.
  • the magnetic foil 12 of the magnetic shield material 1 a metal foil of Fe-based nanocrystal soft magnetic material was used as the magnetic foil 12 of the magnetic shield material 1.
  • the composition (weight ratio) of this Fe-based nanocrystalline soft magnetic material is, as shown in Table 1 below, iron (Fe) 83 wt%, silicon (Si) 9 wt%, niobium (Nb) 6 wt%, and boron (boron).
  • B) was 1 wt% and copper (Cu) was 1 wt%.
  • the magnetic field (or electric field) shielding effect of the shield material against electromagnetic waves of various frequencies can be measured by changing the frequency from the signal generator.
  • the inventor of the present application uses each of the magnetic shields in the case where the aluminum foil 13 having a different thickness is laminated on the magnetic foil 12 while changing the frequency band of the electromagnetic wave to be shielded using the measurement system of the KEC method.
  • the maximum magnetic field shield effect is obtained depending on the thickness of the aluminum foil 13 (conductive layer). It has been discovered that the frequency band (of electromagnetic waves) that can obtain is different (shifted).
  • the inventor of the present application changes the thickness of the aluminum foil 13 according to the frequency band of the electromagnetic wave to be shielded based on the above-mentioned discovery, and thereby the magnetic shield in each frequency band of the electromagnetic wave.
  • the technical idea of maximizing the magnetic field shielding effect (magnetic field shielding effect) of the material 1 has been conceived.
  • the frequency (of electromagnetic waves) at which the magnetic shield material 1 using the aluminum foil 13 having a certain thickness can obtain the maximum magnetic field shielding effect is defined as (magnetic shield using the aluminum foil 13 having that thickness).
  • Material 1) peak frequency".
  • the thickness of each aluminum foil 13 in the magnetic shield material 1 is The thickness (for example, 50 ⁇ m) which is considered to have the peak value frequency of 0.3 MHz or less was not included.
  • FIG. 4 is a graph showing the change in the peak value frequency when the thickness of the aluminum foil 13 is changed in the magnetic shield material 1 shown in FIG.
  • FIG. 4 is a graph showing a correspondence relationship (combination) between the thickness of the aluminum foil 13 and the peak value frequency of the magnetic shield material 1 using the aluminum foil 13 having that thickness.
  • FIG. 4 similar to the graphs of A, B, and C shown in FIG. 3, only the peak value frequencies when the thickness of the aluminum foil 13 is 6.5 ⁇ m, 11 ⁇ m, and 30 ⁇ m are plotted, but in reality,
  • the graph E of the approximate straight line shown in FIG. 4 is obtained by using a large number of measurement data of the combination of the thickness of the aluminum foil 13 and the peak value frequency.
  • the thickness of the aluminum foil 13 (conductive layer 3) when the intermediate value (average value) of the frequency band of the electromagnetic wave to be shielded is the peak value frequency is obtained, and the magnetic shield is obtained.
  • the thickness of the aluminum foil 13 in the material 1 is set to the thickness obtained from the above graph E. Thereby, the aluminum foil 13 can have a thickness according to the frequency band of the electromagnetic wave to be shielded.
  • FIGS. 5 and 6 Effects of different placement of magnetic shield material on electromagnetic field source on magnetic field shield effect
  • the direction of the magnetic shield material 1 is opposite to that of the case shown in FIG. 2, and the double-sided adhesive tape 15, the aluminum foil 13, the double-sided adhesive tape 14, the magnetic foil 12, are shown from top to bottom.
  • the PET films 11 are laminated in this order.
  • the solid line graph F indicates that when the aluminum foil 13 (conductive layer) is arranged on the electronic component 16 and the magnetic foil 12 (magnetic layer) is further arranged thereon.
  • FIG. 5 is a graph of the measurement result of the magnetic field shield effect of FIG. Further, the broken line graph G in FIG. 5 shows the measurement of the magnetic field shield effect when the magnetic foil 12 is arranged on the electronic component 16 and the aluminum foil 13 is further arranged thereon as shown in FIG. It is a graph of a result. In these measurements, an aluminum foil 13 having a thickness of 50 ⁇ m was used.
  • the magnetic shield material 1 has, as shown in FIG. 2, a conductive layer (aluminum foil 13) arranged on an electromagnetic wave generation source (electronic component 16), and further on that. When the magnetic layer (magnetic foil 12) is arranged, as shown in FIG.
  • the magnetic layer (magnetic foil 12) is arranged on the electromagnetic wave generation source (electronic component 16), and further on it. As compared with the case where the conductive layer (aluminum foil 13) is provided, a larger magnetic field shield effect can be obtained.
  • the aluminum foil 13 has a thickness according to the frequency band of electromagnetic waves to be shielded.
  • the magnetic shield material 1 including (laminated) the magnetic layer 2 containing a magnetic material and the conductive layer 3 containing a conductive material electromagnetic waves to be shielded are shielded.
  • the thickness of the conductive layer 3 that maximizes the magnetic field shielding effect (magnetic field shielding effect) varies depending on the frequency band.
  • the conductive layer 3 (aluminum foil 13) has a thickness corresponding to the frequency band of the electromagnetic wave to be shielded (the conductive layer 3 ( By changing the thickness of the aluminum foil 13)), it becomes possible to obtain a good magnetic field shielding effect in the frequency band of the electromagnetic wave to be shielded.
  • the thickness of the conductive layer 3 (aluminum foil 13) is set so that the magnetic field shield effect (magnetic field shield effect) by the magnetic shield material 1 is achieved in the frequency band of electromagnetic waves to be shielded.
  • the maximum thickness was used. Thereby, the magnetic field shielding effect by the magnetic shield material 1 can be maximized in the frequency band of the electromagnetic wave to be shielded.
  • the electromagnetic shield ability of the magnetic shield material 1 is enhanced.
  • the magnetic shield material 1 of the present embodiment as the magnetic material of the magnetic layer 2, as described above, a soft magnetic material having a small coercive force and a high relative permeability (including a Fe-based nanocrystalline soft magnetic material) is used. Since the magnetic shield material 1 is used, the magnetic field shielding effect (magnetic field shielding effect) of the magnetic shield material 1 can be enhanced.
  • the thickness of the conductive layer 3 is a thickness that maximizes the magnetic field shielding effect (magnetic field shielding effect) of the magnetic shield material 1 in the frequency band of the electromagnetic wave to be shielded.
  • the thickness of the conductive layer is not limited to this, and may be a thickness corresponding to the frequency band of the electromagnetic wave to be shielded (a thickness that enhances the magnetic field shielding effect of the magnetic shield material in the frequency band of the electromagnetic wave to be shielded). Good.
  • FIG. 1 shows an example in which the magnetic shield material 1 is composed of the magnetic layer 2 and the conductive layer 3.
  • the magnetic shield material 1 is composed of the PET film 11 and the magnetic layer (
  • the magnetic foil 12 the double-sided adhesive tapes 14 and 15, and the conductive layer (aluminum foil 13) are shown
  • the magnetic shield material of the present invention is not limited to these, and a magnetic material may be used. Any material may be used as long as it includes a magnetic layer containing a conductive layer and a conductive layer containing a conductive material.
  • Magnetic Shielding Material 1 Magnetic Shielding Material 2 Magnetic Layer 3 Conductive Layer 12 Magnetic Foil (Magnetic Layer) 13 Aluminum foil (conductive layer)

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
PCT/JP2019/044731 2018-11-19 2019-11-14 磁気シールド材 Ceased WO2020105543A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US17/294,873 US11690207B2 (en) 2018-11-19 2019-11-14 Magnetic shield material
CN201980062317.9A CN112740848B (zh) 2018-11-19 2019-11-14 磁屏蔽件
EP19887297.0A EP3886550B1 (en) 2018-11-19 2019-11-14 Magnetic shield material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-216845 2018-11-19
JP2018216845A JP7207706B2 (ja) 2018-11-19 2018-11-19 磁気シールド材

Publications (1)

Publication Number Publication Date
WO2020105543A1 true WO2020105543A1 (ja) 2020-05-28

Family

ID=70774495

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/044731 Ceased WO2020105543A1 (ja) 2018-11-19 2019-11-14 磁気シールド材

Country Status (5)

Country Link
US (1) US11690207B2 (enExample)
EP (1) EP3886550B1 (enExample)
JP (1) JP7207706B2 (enExample)
CN (1) CN112740848B (enExample)
WO (1) WO2020105543A1 (enExample)

Cited By (1)

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WO2022209565A1 (ja) * 2021-03-29 2022-10-06 Ｊｘ金属株式会社 積層体及びその製造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12064250B2 (en) * 2020-12-28 2024-08-20 Biosense Webster (Israel) Ltd. Generic box for electrophysiology system adapters
KR102586948B1 (ko) * 2021-04-02 2023-10-10 주식회사 아모센스 자기장 차폐시트 및 이의 제조방법
JP7627247B2 (ja) * 2022-07-20 2025-02-07 Ｊｘ金属株式会社 電磁波遮蔽材料、被覆材又は外装材及び電気・電子機器
CN115484808A (zh) * 2022-10-17 2022-12-16 宁波中科毕普拉斯新材料科技有限公司 一种电磁屏蔽复合材料及制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005514797A (ja) * 2002-01-08 2005-05-19 エレクタ ネウロマグ オイ 磁気シールドルーム用壁部材及び、磁気シールドルーム
JP2018067629A (ja) 2016-10-19 2018-04-26 京セラ株式会社 電磁波シールド用積層接着シートおよびその接着方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5260128A (en) * 1989-12-11 1993-11-09 Kabushiki Kaisha Riken Electromagnetic shielding sheet
JP3900559B2 (ja) * 1996-09-19 2007-04-04 大同特殊鋼株式会社 磁気遮蔽用シートとその製造方法及びこれを用いたケーブル
JP2005142551A (ja) 2003-10-17 2005-06-02 Nitta Ind Corp 磁気シールドシートおよび入力対応表示装置
JP2010153542A (ja) * 2008-12-25 2010-07-08 Ado Union Kenkyusho:Kk 電磁波抑制シート及びその製造方法
CN101704312A (zh) * 2009-11-06 2010-05-12 电子科技大学 复合电磁屏蔽材料及其制造方法
JPWO2015137257A1 (ja) * 2014-03-14 2017-04-06 株式会社カネカ 電子端末機器及びその組立方法
US20160052240A1 (en) * 2014-08-25 2016-02-25 Chase Corporation Paper/ plastic laminate and electromagnetic shielding material
CN205454370U (zh) * 2015-12-24 2016-08-10 上海光线新材料科技有限公司 一种电磁屏蔽复合材料
CN107864604A (zh) * 2017-11-10 2018-03-30 中国科学院西安光学精密机械研究所 一种电磁辐射屏蔽结构

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005514797A (ja) * 2002-01-08 2005-05-19 エレクタ ネウロマグ オイ 磁気シールドルーム用壁部材及び、磁気シールドルーム
JP2018067629A (ja) 2016-10-19 2018-04-26 京セラ株式会社 電磁波シールド用積層接着シートおよびその接着方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3886550A4

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022209565A1 (ja) * 2021-03-29 2022-10-06 Ｊｘ金属株式会社 積層体及びその製造方法
JP2022153032A (ja) * 2021-03-29 2022-10-12 Ｊｘ金属株式会社 積層体及びその製造方法
JP2023085266A (ja) * 2021-03-29 2023-06-20 Ｊｘ金属株式会社 積層体及びその製造方法
CN116568834A (zh) * 2021-03-29 2023-08-08 Ｊｘ金属株式会社 层叠体及其制造方法

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