JP5453036B2 - 複合磁性体 - Google Patents
複合磁性体 Download PDFInfo
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- JP5453036B2 JP5453036B2 JP2009232053A JP2009232053A JP5453036B2 JP 5453036 B2 JP5453036 B2 JP 5453036B2 JP 2009232053 A JP2009232053 A JP 2009232053A JP 2009232053 A JP2009232053 A JP 2009232053A JP 5453036 B2 JP5453036 B2 JP 5453036B2
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- Prior art keywords
- soft magnetic
- powder
- composite magnetic
- magnetic body
- magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002131 composite material Substances 0.000 title claims description 60
- 239000000696 magnetic material Substances 0.000 title claims description 22
- 239000006247 magnetic powder Substances 0.000 claims description 41
- 230000035699 permeability Effects 0.000 claims description 32
- 239000000843 powder Substances 0.000 claims description 18
- 239000002245 particle Substances 0.000 claims description 14
- 229910045601 alloy Inorganic materials 0.000 claims description 13
- 239000000956 alloy Substances 0.000 claims description 13
- 239000011230 binding agent Substances 0.000 claims description 12
- 229910002796 Si–Al Inorganic materials 0.000 claims description 10
- 230000005484 gravity Effects 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 6
- 238000004438 BET method Methods 0.000 claims description 3
- 230000004907 flux Effects 0.000 claims description 3
- 230000000052 comparative effect Effects 0.000 description 20
- 239000000463 material Substances 0.000 description 10
- 238000009826 distribution Methods 0.000 description 9
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 230000001629 suppression Effects 0.000 description 7
- 238000005259 measurement Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 229910000702 sendust Inorganic materials 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910000859 α-Fe Inorganic materials 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 230000007257 malfunction Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 229920000800 acrylic rubber Polymers 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910000889 permalloy Inorganic materials 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- 229910017082 Fe-Si Inorganic materials 0.000 description 1
- 229910017133 Fe—Si Inorganic materials 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- 229910000557 Permendur alloy Inorganic materials 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910000595 mu-metal Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229910000815 supermalloy Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Landscapes
- Soft Magnetic Materials (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
前記軟磁性粉末は、最大長さが60μm以上で厚さが1〜10μmの偏平状粒子を90%
以上含み、かつ、BET法により求めた粉末比表面積が0.55m2/g以下であって、
前記軟磁性体の比重に対する比率が0.52以上であり、前記軟磁性体は、キュリー温度が450℃以下となる組成を有するFe−Si−Al合金であって、かつ、初透磁率が30000以上で飽和磁束密度が0.9T(テスラ)未満であることを特徴とする。
図1は本発明による複合磁性体の実施の形態を示す図であり、図1(a)は複合磁性体の断面構造を模式的に示す図、図1(b)は軟磁性粉末の平面形状を模式的に示す図である。なお、実際には軟磁性粉末の平面形状は図1(b)のように円形のみでなく、長円形、楕円形、その他様々な形状を取り得る。
11 軟磁性粉末
12 結合材
21、22、23 測定結果
51 PETフィルム
52 マイクロストリップライン
53 おもり
Claims (1)
- 粉末状の軟磁性体からなる軟磁性粉末と結合材とから構成される複合磁性体であって、
前記軟磁性粉末は、最大長さが60μm以上で厚さが1〜10μmの偏平状粒子を90%
以上含み、かつ、BET法により求めた粉末比表面積が0.55m2/g以下であって、
前記軟磁性体の比重に対する比率が0.52以上であり、前記軟磁性体は、キュリー温度が450℃以下となる組成を有するFe−Si−Al合金であって、かつ、初透磁率が30000以上で飽和磁束密度が0.9T(テスラ)未満であることを特徴とする複合磁性体。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009232053A JP5453036B2 (ja) | 2009-10-06 | 2009-10-06 | 複合磁性体 |
Applications Claiming Priority (1)
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---|---|---|---|
JP2009232053A JP5453036B2 (ja) | 2009-10-06 | 2009-10-06 | 複合磁性体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011082278A JP2011082278A (ja) | 2011-04-21 |
JP5453036B2 true JP5453036B2 (ja) | 2014-03-26 |
Family
ID=44076043
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009232053A Active JP5453036B2 (ja) | 2009-10-06 | 2009-10-06 | 複合磁性体 |
Country Status (1)
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JP (1) | JP5453036B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106133849B (zh) * | 2014-03-17 | 2019-01-11 | 株式会社东金 | 软磁性成型体、磁芯以及磁性片 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6567259B2 (ja) * | 2013-10-01 | 2019-08-28 | 日東電工株式会社 | 軟磁性樹脂組成物、軟磁性フィルム、軟磁性フィルム積層回路基板および位置検出装置 |
JP6514461B2 (ja) * | 2013-10-01 | 2019-05-15 | 日東電工株式会社 | 軟磁性粒子粉末、軟磁性樹脂組成物、軟磁性フィルム、軟磁性フィルム積層回路基板および位置検出装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0547572A (ja) * | 1991-08-14 | 1993-02-26 | Yokogawa Electric Corp | コモンモ―ド・チヨ―クコイル及びスイツチング電源装置 |
JP3722391B2 (ja) * | 1996-09-05 | 2005-11-30 | Necトーキン株式会社 | 複合磁性体およびそれを用いた電磁干渉抑制体 |
JP2001028491A (ja) * | 1999-07-14 | 2001-01-30 | Daido Steel Co Ltd | 高温においても性能を維持する電磁波吸収体 |
JP2001210510A (ja) * | 2000-01-28 | 2001-08-03 | Tokin Corp | 軟磁性粉末及びそれを用いた複合磁性体 |
JP2003229694A (ja) * | 2002-02-05 | 2003-08-15 | Sony Corp | 電磁波吸収体およびその製造方法 |
JP2009043778A (ja) * | 2007-08-06 | 2009-02-26 | Nec Tokin Corp | 複合磁性体用金属磁性材料粉末 |
-
2009
- 2009-10-06 JP JP2009232053A patent/JP5453036B2/ja active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106133849B (zh) * | 2014-03-17 | 2019-01-11 | 株式会社东金 | 软磁性成型体、磁芯以及磁性片 |
US10515751B2 (en) | 2014-03-17 | 2019-12-24 | Tokin Corporation | Soft magnetic molded body, magnetic core, and magnetic sheet |
Also Published As
Publication number | Publication date |
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JP2011082278A (ja) | 2011-04-21 |
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