WO2020093549A1 - 一种应用于扬声器振膜的补强部、振膜及扬声器 - Google Patents

一种应用于扬声器振膜的补强部、振膜及扬声器 Download PDF

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Publication number
WO2020093549A1
WO2020093549A1 PCT/CN2018/122339 CN2018122339W WO2020093549A1 WO 2020093549 A1 WO2020093549 A1 WO 2020093549A1 CN 2018122339 W CN2018122339 W CN 2018122339W WO 2020093549 A1 WO2020093549 A1 WO 2020093549A1
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WIPO (PCT)
Prior art keywords
body layer
filler
speaker
hole
reinforcing part
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PCT/CN2018/122339
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English (en)
French (fr)
Inventor
李勇
张翠丽
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歌尔股份有限公司
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Priority to US17/292,513 priority Critical patent/US20210400390A1/en
Publication of WO2020093549A1 publication Critical patent/WO2020093549A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H04R7/06—Plane diaphragms comprising a plurality of sections or layers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/022—Cooling arrangements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2207/00—Details of diaphragms or cones for electromechanical transducers or their suspension covered by H04R7/00 but not provided for in H04R7/00 or in H04R2307/00
    • H04R2207/021—Diaphragm extensions, not necessarily integrally formed, e.g. skirts, rims, flanges
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
    • H04R2307/027—Diaphragms comprising metallic materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/13—Use or details of compression drivers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Definitions

  • the invention relates to the technical field of electroacoustics. More specifically, it relates to a reinforcing part structure for a speaker diaphragm, and a diaphragm and a speaker to which the reinforcing part structure is applied.
  • the speaker As a component that can convert electrical energy into sound, the speaker is widely used in terminal electronic devices such as mobile phones, tablet computers, notebook computers, and PDAs.
  • the structure of the speaker generally includes a magnetic circuit system, a vibration system and an auxiliary system, wherein the vibration system mainly includes a diaphragm and a voice coil.
  • the voice coil When the speaker is working, the voice coil generates a large amount of heat. Since the voice coil is located in the relatively closed back cavity of the speaker, the heat generated by the voice coil is not easily dissipated to the outside world.
  • a reinforcement part (DOME, also called a composite part) is usually provided on the diaphragm. Therefore, the speaker can conduct the heat generated by the voice coil from the rear sound cavity to the front sound cavity through the reinforcement structure, and then radiate the heat outward through the flow of the front sound cavity and the outside air, thereby dissipating the speaker.
  • the existing reinforcement structure is usually a resin composite material, a metal material, or a composite material of metal and resin.
  • Such a reinforcement structure has a low thermal conductivity and a poor thermal conduction effect, and cannot meet the heat dissipation requirements of the micro speaker. Therefore, there is a need to provide a new type of reinforcing portion structure with excellent heat conduction effect.
  • An object of the present invention is to provide a structure of a reinforcing portion having a high thermal conductivity.
  • a reinforcing portion including a body layer, the body layer includes through holes penetrating through both surfaces of the body layer, and the reinforcing portion further includes a The filler for heat conduction in the through hole is described.
  • the thermal conductivity of the filler is higher than the thermal conductivity of the body layer
  • the side wall surface of the filler is bonded and fixed to the inner wall of the through hole by an adhesive method.
  • the side wall surface of the filler and the inner wall of the through hole are fixed by interference fit.
  • the body layer includes a plurality of through holes penetrating through both sides of the body layer, and the plurality of through holes are evenly distributed on the body layer.
  • the cross-sectional shape of the through hole is circular, elliptical or rectangular.
  • the material of the body layer is carbon fiber, resin or steel.
  • the filler is thermally conductive particles; wherein the material of the filler is graphene, copper or aluminum.
  • a diaphragm including a fixing portion, a folding ring portion integrally provided with the fixing portion, a central portion located in the folding ring portion, and a surface fixed to the central portion The aforementioned reinforcement.
  • a speaker including the above-mentioned diaphragm.
  • the reinforcing part of the present invention improves the ability to conduct heat between the two sides of the support layer by opening a through hole in the support layer and providing a thermally conductive filler in the through hole.
  • a loudspeaker adopting such a reinforcement structure can quickly conduct heat from the rear acoustic cavity to the front acoustic cavity, and then radiate the heat outward through the flow of the front acoustic cavity and the outside air, thereby quickly dissipating heat from the speaker.
  • FIG. 1 shows a schematic diagram of an exploded structure of the reinforcing part of the present invention.
  • FIG. 2 shows a schematic diagram of an exploded structure of the diaphragm of the present invention.
  • FIG. 3 shows a schematic diagram of an exploded structure of the vibration system of the speaker of the present invention.
  • the present invention provides a reinforcing portion 1 applied to a diaphragm, wherein the shape of the reinforcing portion is not limited, and its shape depends on the actual application, such as a circle, a rectangle, an ellipse, etc.
  • the shape according to the actual needs, is made into a plane, spherical surface and other shapes, which are compounded on the diaphragm and used directly.
  • the reinforcing portion 1 includes a body layer 10, and the material of the body layer 10 is selected from one of metal materials, resin materials, or carbon fiber materials, and then the corresponding manufacturing process is selected according to different materials of the body layer 10 to present a thin plate shape.
  • the body layer 10 of the present invention includes a through hole 101 penetrating through both sides of the surface, and a filler 11 is provided in the through hole 101.
  • the thermal conductivity of the filler 11 is greater than Thermal conductivity of the body layer 10.
  • the material of the filler 11 may be selected from one of graphene, copper, or aluminum, and the filler 11 is thermally conductive particles.
  • the filler 11 is copper particles, and the copper particles are located in the through hole 101 of the steel sheet.
  • the outer surface of the filler 11 and the inner wall of the through-hole 101 are bonded together.
  • the outer surface of the filler 11 and the inner wall of the through hole 101 are fixedly connected by adhesion, or the side wall surface of the filler 11 and the inner wall of the through hole 101 are fixed by interference fit. This structure enhances the connection strength between the filler 11 and the body layer 10, thereby improving the reliability of the reinforcing portion 1.
  • the filler 11 is in the form of a powder.
  • an adhesive may be mixed in the filler 11, and the filler 11 and the through-hole 101 fixed connection.
  • the body layer 10 includes a plurality of through holes 101 penetrating through both sides of the surface.
  • the plurality of through holes 101 are evenly distributed on the body layer 10, and each of the through holes 101 is provided with a filler 11 to further increase heat in the body layer 10 Conductivity between the two sides.
  • the cross-sectional shape of the through hole 101 formed in the body layer 10 may be circular, elliptical, or rectangular, and those skilled in the art may choose according to actual needs.
  • the present invention also provides a diaphragm 2.
  • the diaphragm 2 includes a fixing portion 21 fixed to the sound generator housing, a folding ring portion 22 integrally provided with the fixing portion 21, and is located in the folding ring portion 22
  • the central part 23 and the reinforcing part 1 fixed to the central part 23 are fixed.
  • the central portion 23 has a hollow structure, and the reinforcing portion 1 is fixedly coupled to the hollow portion. Since the reinforcing portion 1 has the aforementioned structure, it has a high thermal conductivity between the two sides of the body layer 10, so the heat is increased. Conductivity between the two sides of the diaphragm.
  • the present invention also provides a speaker including a magnetic circuit system and a vibration system cooperating with the magnetic circuit system.
  • the vibration system includes the above-mentioned diaphragm 2 and a voice coil 3 fixedly coupled to the diaphragm 2 side.
  • the loudspeaker of the present invention conducts the heat generated by the voice coil 3 from the rear sound cavity to the front sound cavity through the diaphragm 2, and then radiates the heat outward through the flow of the front sound cavity and the outside air. Since the diaphragm 2 has strong heat conduction capability and can quickly dissipate heat to the speaker, the speaker of the present invention has good heat dissipation capability, thereby improving its working reliability.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

本发明公开一种应用于扬声器振膜的补强部，该补强部包括本体层，所述本体层上包括有贯穿本体层两侧表面的通孔，所述补强部还包括有位于所述通孔内的用于导热的填充物，所述填充物的导热系数高于所述本体层的导热系数。本发明的补强部通过在支承层上开设通孔，并在该通孔内设置导热的填充物，提高支承层两侧之间能够导热能力。采用此种补强部结构的扬声器可将热量从后声腔中快速传导到前声腔中，进而通过前声腔与外界空气的流动，将该热量向外散发，从而对扬声器快速散热。

Description

一种应用于扬声器振膜的补强部、振膜及扬声器 技术领域
本发明涉及电声技术领域。更具体地，涉及一种用于扬声器振膜的补强部结构以及应用该补强部结构的振膜和扬声器。
背景技术
扬声器作为一种能够将电能转化为声音的部件，其广泛应用于手机、平板电脑、笔记本电脑、PDA等终端电子设备中。扬声器的结构一般包括磁路系统、振动系统和辅助系统，其中振动系统主要包括振膜和音圈。扬声器在工作时，音圈会产生大量的热量，由于音圈位于相对封闭的扬声器后声腔中，因此，音圈产生的热量不易向外界发散。
由于扬声器的前声腔通过声孔与外界连通，而目前现有的扬声器为了增强产品高频位置的性能，通常在振膜上设置补强部(DOME，也可称为复合部)。因此，扬声器可通过补强部结构，将音圈产生的热量从后声腔中传导到前声腔，进而通过前声腔与外界空气的流动，将该热量向外散发，从而对扬声器进行散热。
现有的补强部结构通常为树脂类复合材质、金属材质、或金属与树脂的复合材料，此种补强部结构的导热系数较低、热传导效果较差，不能满足微型扬声器的散热要求。因此，需要提供一种新型的导热效果优良的补强部结构。
发明内容
本发明的目的在于提供一种具有高导热系数的补强部结构。
根据本发明的一个方面，提供了一种补强部，该补强部包括本体层，所述本体层上包括有贯穿本体层两侧表面的通孔，所述补强部还包括有位于所述通孔内的用于导热的填充物。
优选地，所述填充物的导热系数高于所述本体层的导热系数
优选地，所述填充物的侧壁表面通过粘接方式与所述通孔的内壁结合固定。
优选地，所述填充物的侧壁表面与所述通孔的内壁之间通过过盈配合贴合固定。
优选地，所述本体层包括有若干贯穿本体层两侧表面的通孔，若干通孔均匀分布在所述本体层上。
优选地，所述通孔的截面形状为圆形、椭圆形或矩形。
优选地，所述本体层的材料为碳纤维、树脂或钢。
优选地，所述填充物为导热的颗粒；其中，所述填充物的材料为石墨烯、铜或铝。
根据本发明的另一个方面，提供了一种振膜，所述振膜包括固定部、与固定部一体设置的折环部、位于折环部内的中央部以及与所述中央部表面结合固定的上述的补强部。
根据本发明的又一个方面，提供了一种扬声器，该扬声器包括上述的振膜。
本发明的有益效果如下：
本发明的补强部通过在支承层上开设通孔，并在该通孔内设置导热的填充物，提高支承层两侧之间能够导热能力。采用此种补强部结构的扬声器可将热量从后声腔中快速传导到前声腔中，进而通过前声腔与外界空气的流动，将该热量向外散发，从而对扬声器快速散热。
附图说明
下面结合附图对本发明的具体实施方式作进一步详细的说明。
图1示出本发明的补强部的分解结构示意图。
图2示出本发明的振膜的分解结构示意图。
图3示出本发明的扬声器的振动系统分解结构示意图。
具体实施方式
为了更清楚地说明本发明，下面结合优选实施例和附图对本发明做进一步的说明。附图中相似的部件以相同的附图标记进行表示。本领域技术人员应当理解，下面所具体描述的内容是说明性的而非限制性的，不应以此限制本发明的保护范围。
如图1所示，本发明提供了一种应用于振膜的补强部1，其中，补强部的形状不做限定，其形状根据实际应用而定，比如圆形、长方形、椭圆形等形状，依据实际需求，制成平面、球面等形状，复合到振膜上直接使用。补强部1包括本体层10，本体层10的材料选自金属材料、树脂材料或碳纤维材料中的一 种，然后根据本体层10材料的不同选取相应的制程呈现薄板状。
为了提高本体层10两侧之间的热传导效率，本发明的本体层10上包括有贯穿其两侧表面的通孔101，并在通孔101内设置填充物11，填充物11的导热系数大于本体层10的导热系数。此种结构可以提高热量在本体层10两侧之间的传导，从而整体上提高补强部导热能力。
进一步地，填充物11的材料可选自石墨烯、铜或铝中的一种，填充物11为导热的颗粒。本实施方式中填充物11为铜粒，该铜粒位于钢片的通孔101内。
填充物11的外侧表面与通孔101的内壁之间贴合设置。优选地，填充物11外侧表面与通孔101的内壁之间通过粘接方式固定连接，或者填充物11的侧壁表面与通孔101的内壁之间通过过盈配合贴合固定。此种结构增强了填充物11与本体层10之间的连接强度，从而提高补强部1的可靠性。
在另一实施方式中，填充物11为粉末状，为增加粉末状的填充物11与通孔101之间的连接强度，可在填充物11内混合粘接剂，将填充物11与通孔101固定连接。
进一步地，本体层10包括有若干贯穿两侧表面的通孔101，若干通孔101均匀分布在本体层10上，每一个通孔101内均设置有填充物11，从而进一步提高热量在本体层10的两侧之间的传导能力。
本体层10上开设的通孔101的截面形状可以是圆形、椭圆形或矩形，本领域技术人员可以根据实际需要进行选择。
如图2所示，本发明还提供了一种振膜2，该振膜2包括与发声器外壳固定的固定部21、与固定部21一体设置的折环部22、位于折环部22内的中央部23以及与中央部23结合固定的补强部1。中央部23为镂空结构，补强部1固定结合于该镂空处，由于补强部1为前述的结构，在本体层10的两侧之间具有较高的热传导能力，因此，提高了热量在振膜两侧之间的传导能力。
本发明还提供了一种扬声器，该扬声器包括磁路系统、以及与磁路系统配合的振动系统，振动系统包括上述的振膜2、以及固定结合于振膜2一侧的音圈3。本发明的扬声器通过振膜2将音圈3产生的热量从后声腔中传导到前声腔，进而通过前声腔与外界空气的流动，将该热量向外散发。由于振膜2具有较强的热传导能力，可对扬声器进行快速的散热，因而本发明的扬声器具有良好的散热能力，从而提高了其工作可靠性。
显然，本发明的上述实施例仅仅是为清楚地说明本发明所作的举例，而并 非是对本发明的实施方式的限定，对于所属领域的普通技术人员来说，在上述说明的基础上还可以做出其它不同形式的变化或变动，这里无法对所有的实施方式予以穷举，凡是属于本发明的技术方案所引伸出的显而易见的变化或变动仍处于本发明的保护范围之列。

Claims (10)

  1. 一种应用于扬声器振膜的补强部，该补强部包括本体层，其特征在于，所述本体层上包括有贯穿本体层两侧表面的通孔，所述补强部还包括有位于所述通孔内的用于导热的填充物。
  2. 根据权利要求1所述的应用于扬声器振膜的补强部，其特征在于，所述填充物的导热系数高于所述本体层的导热系数。
  3. 根据权利要求1所述的应用于扬声器振膜的补强部，其特征在于，所述填充物的侧壁表面通过粘接方式与所述通孔的内壁结合固定。
  4. 根据权利要求1所述的应用于扬声器振膜的补强部，其特征在于，所述填充物的侧壁表面与所述通孔的内壁之间通过过盈配合贴合固定。
  5. 根据权利要求1所述的应用于扬声器振膜的补强部，其特征在于，所述本体层包括有若干贯穿本体层两侧表面的通孔，若干通孔均匀分布在所述本体层上。
  6. 根据权利要求1所述的应用于扬声器振膜的补强部，其特征在于，所述通孔的截面形状为圆形、椭圆形或矩形。
  7. 根据权利要求1所述的应用于扬声器振膜的补强部，其特征在于，所述本体层的材料为碳纤维、树脂或钢。
  8. 根据权利要求1所述的应用于扬声器振膜的补强部，其特征在于，所述填充物为导热的颗粒；其中，
    所述填充物的材料为石墨烯、铜或铝。
  9. 一种振膜，其特征在于，所述振膜包括固定部、与固定部一体设置的折环部、位于折环部内的中央部以及与所述中央部表面结合固定的如权利要求1-8任一项所述的应用于扬声器振膜的补强部。
  10. 一种扬声器，其特征在于，包括如权利要求9所述的振膜。
PCT/CN2018/122339 2018-11-09 2018-12-20 一种应用于扬声器振膜的补强部、振膜及扬声器 WO2020093549A1 (zh)

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