WO2020087800A1 - 面光源及采用该面光源的显示装置 - Google Patents

面光源及采用该面光源的显示装置 Download PDF

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Publication number
WO2020087800A1
WO2020087800A1 PCT/CN2019/075064 CN2019075064W WO2020087800A1 WO 2020087800 A1 WO2020087800 A1 WO 2020087800A1 CN 2019075064 W CN2019075064 W CN 2019075064W WO 2020087800 A1 WO2020087800 A1 WO 2020087800A1
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Prior art keywords
substrate
light source
chip
surface light
display device
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PCT/CN2019/075064
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English (en)
French (fr)
Inventor
杨勇
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Wuhan China Star Optoelectronics Technology Co Ltd
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Wuhan China Star Optoelectronics Technology Co Ltd
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Priority to US16/631,348 priority Critical patent/US20210226085A1/en
Publication of WO2020087800A1 publication Critical patent/WO2020087800A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/815—Bodies having stress relaxation structures, e.g. buffer layers
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means

Definitions

  • the invention relates to the field of display devices and the like, in particular to a surface light source and a display device using the surface light source.
  • miniLED display technology As a strong competitor of OLED display technology in the future market, miniLED display technology has many advantages such as high brightness, flexible and flexible, high dynamic contrast display technology, narrow bezel display technology, and special-shaped display technology, etc. .
  • the miniLED display device mostly uses a flexible circuit board as a substrate.
  • the substrate substrate material PI will cause a large internal stress during heating, and will cause a large curl of the plate after the reflow soldering process. It will affect the position of the chip and the light exit direction during die bonding, and will also cause greater challenges to the subsequent module assembly process. Polymer materials will generate internal stress when subjected to high temperature treatment, and the thermal properties of the material cannot be changed.
  • Double-sided display technology mostly adopts the side-entry backlight method, and the display on the back thereof also needs to rely on the liquid crystal layer to display through the light-controlling method of liquid crystal molecules.
  • This double-sided display architecture increases the thickness of the display screen. How to reduce the thickness of double-sided display, people have not found a suitable way to improve.
  • the substrate is transferred to the die bonding machine. Due to the single-sided die bonding operation, internal stress is easily generated on the substrate, and the internal stress becomes more and more as the substrate thins. obvious. During the high temperature reflow soldering process, the internal stress accumulated in the substrate is released, which causes the substrate to curl. On the one hand, curling will cause the solder paste to pull the chip during reflow soldering, resulting in virtual soldering or short circuit, on the other hand, it will also cause trouble for the subsequent cutting process.
  • the technical problem to be solved by the present invention is to provide a surface light source and a display device using the surface light source.
  • the surface light source uses double-sided solid crystal to reduce the internal stress on the substrate, thereby reducing the warpage of the plate in the reflow process
  • the double-sided surface light source prepared at the same time realizes double-sided display
  • the back surface is directly displayed by the surface light source in a partitioned display mode, so as to reduce the thickness of the display screen in the display device and realize the ultra-thin display screen.
  • the technical solution to the above problem is to provide a surface light source, including a substrate, having a front surface and a back surface, the front and back surfaces of the substrate are provided with pads and metal traces; the first chip is distributed on the front surface of the substrate And soldered to the pad; the second chip is distributed on the back of the substrate and soldered to the pad.
  • the thickness of the substrate is 150 micrometers to 200 micrometers.
  • the first chip array is arranged, and the size of each first chip is 1 ⁇ m-500 ⁇ m; the second chip array is arranged, and the size of each second chip is 0.1 mm-3mm.
  • a plurality of first light-emitting regions are arranged on the back of the substrate, and the surface light source further includes a first driving chip, and each of the first driving chips corresponds to one of the first light-emitting regions one.
  • the second chip is an RGB three-color chip, and one of the first light-emitting areas corresponds to the second chip of one color.
  • the front surface of the substrate is divided into a plurality of second light-emitting regions
  • the surface light source further includes a second driving chip, and each of the second driving chips corresponds to one of the second light-emitting regions One; or the entire front surface of the substrate is a third light-emitting area, the surface light source further includes a third driving chip, the third driving chip corresponds to the third light-emitting area.
  • the surface light source further includes a fluorescent film covering the first chip.
  • the substrate includes a first substrate; an adhesive layer covering a surface of the first substrate; a second substrate is adhered to the first substrate by the adhesive layer.
  • a reflective layer is provided on both the front and back sides of the substrate, and the reflective layer is filled between the first chips or between the second chips.
  • the invention also provides a display device comprising the surface light source; and a display panel located above the surface light source and on the side where the first chip is located.
  • the surface light source and the display device adopting the surface light source of the present invention adopt the double-sided solid crystal method.
  • the internal stresses on both sides of the substrate can cancel each other out.
  • the internal stress on the substrate using double-sided die bonding is less than the internal stress on the substrate using single-sided die bonding, so it can be seen that the use of double-sided die bonding can effectively improve the adverse effects of substrate warpage in the reflow soldering process and reduce
  • the short circuit phenomenon caused by the chip being pulled and tilted by the solder paste due to the severe warpage of the substrate improves the uniformity of the brightness of the entire surface of the surface light source.
  • the substrate used for double-sided die bonding is slightly thicker than the single-sided substrate, which increases the thickness of the substrate to a certain extent.
  • the thicker substrate can also reduce the internal stress in the die-bonding operation; using the partition control method, each The partition (light emitting area) is similar to a display pixel, which can display simple text or pictures.
  • the resolution of the display quality becomes more fine as the number of partitions on the entire surface of the chip increases.
  • the backside of the substrate is directly displayed by the second chip.
  • the surface light source uses the RGB three-primary color chip to directly control the display. There is no need to match the glass panel or the entire surface of the fluorescent film or quantum dot film.
  • the thickness of the substrate is increased, the overall thickness of the surface light source and the thickness of the display device are relatively reduced, making the display device lighter and thinner.
  • FIG. 1 is a schematic diagram of a layered structure of a surface light source according to an embodiment of the invention.
  • FIG. 2 is a distribution diagram of metal traces and pads on the front surface of the substrate or the back surface of the substrate according to an embodiment of the present invention.
  • FIG. 3 is a layered structure diagram of a substrate according to an embodiment of the invention.
  • FIG. 4 is a diagram of a correspondence between a light emitting area on the front of a surface light source and a driving chip according to an embodiment of the invention.
  • FIG. 5 is another diagram of the correspondence between the light emitting area on the front of the surface light source and the driving chip according to an embodiment of the invention.
  • FIG. 6 is a diagram of a correspondence between the light emitting area on the back of the surface light source and the driving chip according to an embodiment of the invention.
  • FIG. 7 is a schematic diagram of a layered structure of a display device according to an embodiment of the invention.
  • 170 fluorescent film 181 The first driver chip
  • the surface light source 10 of the present invention includes a substrate 110, a first chip 120, a second chip 130 and a reflective layer 140.
  • the substrate 110 shown has a front surface and a back surface, and the first chip 120 is mounted on the front surface; the second chip 130 is mounted on the back surface.
  • FIG. 2 is a distribution structure of the metal trace 150 and the pad 160 on the front side or the back side.
  • the first chip 120 is distributed on the front surface 1101 of the substrate and soldered to the pad 160; the second chip 130 is distributed on the rear surface 1102 of the substrate and soldered to the pad 160.
  • the substrate 110 needs to be manufactured.
  • the thickness of the substrate 110 is 150 ⁇ m-200 ⁇ m, and its size is set according to the size of the display screen.
  • the substrate 110 includes a first substrate 111, a second substrate 112, and an adhesive layer 113; wherein, the adhesive layer 113 is formed by applying a compound adhesive on a surface of the first substrate 111.
  • the second substrate 112 is glued on the first substrate 111 through the glue layer 113.
  • the front surface 1101 of the substrate is the side of the first substrate 111 away from the second substrate 112, and the rear surface 1102 of the substrate is the side of the second substrate 112 away from the first substrate 111.
  • a layer of reflective material is first coated on both the front surface 1101 of the substrate and the rear surface 1102 of the substrate to form a reflective layer 140, and the reflective layer 140 covers the
  • the metal traces 150 on the substrate 110 can improve the refractive index and reflectivity, and can effectively improve the brightness of the lamp beads after sealing.
  • the reflective material may be phenolic resin, epoxy resin, polyimide resin, polyester resin, white oil, etc.
  • the material used for the reflective layer 140 in this embodiment is white oil.
  • a reflow soldering process is performed on the front surface 1101 of the substrate to perform a crystal bonding operation.
  • the array of the first chips 120 is arranged on the front surface 1101 of the substrate, each of the first chips 120 has a size of 1 ⁇ m-500 ⁇ m, and 20-50 chips are arranged per square centimeter area The first chip 120. If a six-inch screen is used, the number of the first chips 120 on the corresponding substrate 110 is 2000-5000. After arranging the first chip 120, a fluorescent film 170 is laminated on the first chip 120, and color conversion is achieved through the fluorescent film 170.
  • the first chip 120 may use two driving methods.
  • the first method is to divide the front surface 1101 of the substrate into a plurality of second light-emitting regions 11011.
  • the surface light source 10 of the present invention further includes a second driving chip 182, and each of the second driving chips 182 corresponds to a first Two light-emitting areas 11011.
  • the second method is: the entire surface of the front surface 1101 of the substrate is a third light-emitting area 11012, the surface light source 10 further includes a third driving chip 183, and the third driving chip 183 corresponds to Nar the third light emitting area 11012.
  • each partition is similar to a display pixel, which can better display simple text or pictures, and the resolution of the display quality is partitioned along the entire surface of the chip As the number increases, it becomes more refined.
  • the solid crystal operation is continued on the rear surface 1102 of the substrate using a reflow soldering process.
  • the second chips 130 are arranged in an array on the back surface 1102 of the substrate, and each second chip 130 has a size of 0.1 mm-3 mm. In each square centimeter area, 1-100 second chips 130 are provided. If a six-inch screen is used, the number of the first chips 120 on the corresponding substrate 110 is 100-10000, which is set according to the resolution requirements. In this embodiment, the second chip 130 is an RGB three primary color chip. The back surface 1102 of the substrate in this embodiment is directly displayed by the second chip 130.
  • the surface light source 10 in this embodiment directly uses the RGB three-primary color chip for direct display, no need to match There is no need to encapsulate the fluorescent film 170 or quantum dot film on the entire surface of the glass panel.
  • a plurality of first light-emitting regions 11021 are provided on the back surface, and the surface light source 10 further includes a first driving chip 181, and each of the first driving chips 181 corresponds to one of the first light-emitting regions 11021.
  • Each of the first light-emitting areas 11021 corresponds to the second chip 130 of one color.
  • the back surface 1102 of the substrate in this embodiment adopts a partition control method.
  • Each partition (light-emitting area) is similar to a display pixel, which can better display simple text or pictures. The resolution of the display quality depends on the number of partitions on the entire surface of the chip Has become more refined.
  • the surface light source 10 of the present invention improves the internal stress of the substrate 110 during the crystal bonding operation from two aspects.
  • the double-sided crystal bonding method is adopted. In theory, after the crystal bonding process is completed, the internal stresses on both sides of the substrate 110 can cancel each other out.
  • the internal stress on the substrate using double-sided die bonding is less than the internal stress on the substrate using single-sided die bonding, so it can be seen that the use of double-sided die bonding can effectively improve the adverse effects caused by the warpage of the substrate 110 in the reflow soldering process.
  • the substrate used for double-sided die bonding is slightly thicker than the single-sided substrate, which increases the thickness of the substrate to a certain extent.
  • the thicker substrate 110 can also reduce the internal stress in the die bonding operation.
  • the first substrate 111 and the second substrate 112 are glued by the glue layer 113 in the middle to form a thickened substrate 110.
  • the present invention also provides a display device 1 including the surface light source 10 and a display panel 20, the display panel 20 is located above the surface light source 10 and is located on the first chip 120 is on the side.
  • the main design point of the present invention is the structure of the surface light source 10, and the other structures such as the display panel 20, the frame, and the like will not be described in detail.
  • the display device 1 in this embodiment can realize double-sided display, and at the same time, the back surface of the display device 1 is directly displayed using the second chip 130.
  • the display in this embodiment uses RGB three primary color chips to directly control and display, without the need for a glass panel, that is, there is no need to add an array substrate and a color film substrate, and there is no need to encapsulate the entire surface of the fluorescent film 170 or quantum dot film, thereby reducing the thickness of the display device 1 , Realized ultra-thin double-sided display architecture. Since the back of the display device 1 only needs to display some simple text or picture information, a local dimming algorithm can be used to control the surface light source 10 for direct display. The resolution of the display area is related to the area of the surface light source 10 and the number of chips.

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  • General Physics & Mathematics (AREA)
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Abstract

本发明公开了一种面光源及采用该面光源的显示装置，该面光源包括基板，具有正面和背面，所述基板的正面和背面均设有焊盘及金属走线；第一芯片，分布于所述基板的正面且焊接至所述焊盘；第二芯片，分布于所述基板的背面且焊接至所述焊盘。本发明的面光源及采用该面光源的显示装置，采用双面固晶能够有效改善回流焊工艺中基板翘曲造成的不利影响，且减轻了因基板严重翘曲带来的芯片被锡膏拉扯倾斜产生的短路现象，从而提升了面光源整面亮度均一性。虽然基板的厚度增加，但面光源整体厚度以及显示装置的厚度相对减小，使得显示装置更加轻薄。

Description

面光源及采用该面光源的显示装置 技术领域
本发明涉显示装置等领域，具体为一种面光源及采用该面光源的显示装置。
 背景技术
miniLED显示技术作为未来市场OLED显示技术的强有力竞争对手， miniLED显示装置具有高亮、柔性可弯曲、可制作高动态对比度显示技术、窄边框显示技术、异形显示技术等诸多优点，成为市场研究热点。然而miniLED显示装置为追求柔性显示效果，多采用柔性电路板作为基板，基板衬底材料PI在受热过程中会造成较大的内应力，在回流焊工艺后会造成板材的大幅度卷曲，该卷曲会影响到固晶时芯片的位置和光出射方向，同时也会对后续的模组组装工艺造成较大的挑战。高分子材料在经过高温处理时均会产生内应力，材料的热性无法改变。对于材料的内应力造成的固晶困扰，人们暂未找到较好的解决方式。常规的双面显示技术多采用侧入式背光的方式，其背面的显示也需要依靠液晶层，通过液晶分子的控光方式进行显示，此种双面显示架构增加了显示屏的厚度。如何减少双面显示屏的厚度，人们也未找到合适的改进方式。
而传统面光源在固晶作业过程中，基板在固晶机台转移芯片过程中，由于仅进行单面固晶作业，易在基板上产生内应力，且内应力随着基板的减薄而更加明显。在高温回流焊过程中，基板积累的内应力得到释放则会造成基板的卷曲。卷曲一方面会造成回流焊时锡膏拉扯芯片，导致虚焊或者短路，另一方面对后续的切割工艺也会造成困扰。
 技术问题
本发明所要解决的技术问题是：提供一种面光源及采用该面光源的显示装置，面光源采用双面固晶的方式减轻基板上的内应力，从而减轻回流焊工艺中板材的翘曲问题，同时制备的双面的面光源在实现双面显示时，背面采用分区显示的方式直接由面光源进行显示，以减薄显示装置中显示屏的厚度，实现显示屏的超薄化。
 技术解决方案
解决上述问题的技术方案是：提供一种面光源，包括基板，具有正面和背面，所述基板的正面和背面均设有焊盘及金属走线；第一芯片，分布于所述基板的正面且焊接至所述焊盘；第二芯片，分布于所述基板的背面且焊接至所述焊盘。
在本发明一实施例中，所述基板的厚度为150微米-200微米。
在本发明一实施例中，所述第一芯片阵列排布，每一所述第一芯片的尺寸为1μm-500μm；所述第二芯片阵列排布，每一所述第二芯片的尺寸为0.1 mm-3mm。
在本发明一实施例中，所述基板的背面分设多个第一发光区，所述面光源还包括第一驱动芯片，每一所述第一驱动芯片对应一所述第一发光区的其中之一。
在本发明一实施例中，所述第二芯片为RGB三色芯片，一所述第一发光区对应一种颜色的所述第二芯片。
在本发明一实施例中，所述基板的正面分设多个第二发光区，所述面光源还包括第二驱动芯片，每一所述第二驱动芯片对应一所述第二发光区的其中之一；或所述基板的正面整面为第三发光区，所述面光源还包括第三驱动芯片，所述第三驱动芯片对应所述第三发光区。
在本发明一实施例中，所述的面光源还包括荧光膜，覆于所述第一芯片上。
在本发明一实施例中，所述基板包括第一基板；胶合层，覆于所述第一基板的一表面；第二基板，通过所述胶合层胶合于所述第一基板上。
在本发明一实施例中，所述基板的正面和背面上均设有反射层，该反射层填充于所述第一芯片之间或者所述第二芯片之间。
本发明还提供了一种显示装置，包括所述的面光源；以及显示面板，位于所述面光源的上方，且位于所述第一芯片所在一侧。
 有益效果
本发明的面光源及采用该面光源的显示装置，一方面采用双面固晶的方式，理论上，固晶工艺完成后，基板的两面的内应力可以相互抵消。采用双面固晶的基板上的内应力小于采用单面固晶的基板上的内应力，因此可见，采用双面固晶能够有效改善回流焊工艺中基板翘曲造成的不利影响，且减轻了因基板严重翘曲带来的芯片被锡膏拉扯倾斜产生的短路现象，从而提升了面光源整面亮度均一性。另一方面，采用双面固晶所用基板比单面基板略厚，一定程度上增加了基板的厚度，较厚的基板也能够减少固晶作业中的内应力；采用分区控制的方式，每个分区（发光区）类似一个显示像素，可较好显示出简单文字或者图片，显示画质的分辨率随芯片整面分区数量的增多而变得更加精细。基板的背面利用第二芯片直接进行显示，相比于常规的双面显示屏，面光源利用RGB三基色芯片直接进行控制显示，无须搭配玻璃面板，也无须整面封装荧光膜或量子点膜，虽然基板的厚度增加，但面光源整体厚度以及显示装置的厚度相对减小，使得显示装置更加轻薄。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
下面结合附图和实施例对本发明作进一步解释。
图1是本发明实施例的面光源的层状结构示意图。
图2是本发明实施例的基板的正面或基板的背面金属走线和焊盘分布图。
图3是本发明实施例的基板的层状结构图。
图4是本发明实施例的面光源正面的发光区与驱动芯片的一种对应关系图。
图5是本发明实施例的面光源正面的发光区与驱动芯片的另一种对应关系图。
图6是本发明实施例的面光源背面的发光区与驱动芯片的一种对应关系图。
图7是本发明实施例的显示装置的层状结构示意图。
附图标记：
1显示装置；
10面光源；                   20显示面板；
110基板；                    120第一芯片；
130第二芯片；                140反射层；
150金属走线；                160焊盘；
170荧光膜；                  181第一驱动芯片；
182第二驱动芯片；            183第三驱动芯片；
111第一基板；                112第二基板；
113胶合层；                  1101基板的正面；
1102基板的背面；             11011第二发光区；
11012第三发光区；            11021第一发光区。
 本发明的实施方式
下面详细描述本发明的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
以下实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「顶」、「底」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
如图1所示，在一实施例中，本发明的面光源10，包括基板110、第一芯片120、第二芯片130和反射层140。所示基板110具有正面和背面，所述第一芯片120安装于所述正面；所述第二芯片130安装于所述背面。
如图2所示，所述基板的正面1101和背面1102均设有金属走线150及焊盘160。图2为所述正面或所述背面的金属走线150和焊盘160的一种分布结构。其中，所述第一芯片120分布于所述基板的正面1101且焊接至所述焊盘160；第二芯片130分布于所述基板的背面1102且焊接至所述焊盘160。
如图3所示，在固晶作业过程前，需要制作所述基板110，本实施例中，所述基板110的厚度为150微米-200微米，其尺寸根据显示屏的尺寸设定。所述基板110包括第一基板111、第二基板112、胶合层113；其中，所述胶合层113是通过将一复合胶涂覆于所述第一基板111的一表面上而形成的，所述第二基板112通过所述胶合层113胶合于所述第一基板111上。其中，所述基板的正面1101即所述第一基板111远离所述第二基板112的一面，所述基板的背面1102即所述第二基板112远离所述第一基板111的一面。
参见图1、图2，在固晶作业时，先在所述基板的正面1101和所述基板的背面1102上均涂覆一层反射材料，形成反射层140，所述反射层140覆盖所述基板110上的所述金属走线150，从而提高折射率和反光率，在封胶后能有效的提高灯珠亮度。反光材料可采用酚醛树脂、环氧树脂、聚酰亚胺树脂、聚酯树脂、白油等，本实施例中的反射层140所用材料采用白油。然后在所述基板的正面1101上采用回流焊工艺进行固晶作业。本实施例中，所述第一芯片120阵列排布于所述基板的正面1101上，每一所述第一芯片120的尺寸为1μm-500μm，每平方厘米的面积中，设置20-50颗所述第一芯片120。若采用六寸屏，那么所对应的基板110上的所述第一芯片120的数量在2000-5000颗。布置完所述第一芯片120后，在所述第一芯片120的上压覆一荧光膜170，通过所述荧光膜170实现颜色转换。
如图4所示，本实施例中，在所述基板的正面1101，所述第一芯片120可采用两种驱动方式。第一种方式为：将所述基板的正面1101分设多个第二发光区11011，本发明的面光源10还包括第二驱动芯片182，每一所述第二驱动芯片182对应一所述第二发光区11011。
如图5所示，第二种方式为：所述基板的正面1101的整面为第三发光区11012，所述面光源10还包括第三驱动芯片183，所述第三驱动芯片183对应所述第三发光区11012。本实施例的所述基板的正面1101若采用分区控制的方式，每个分区（发光区）类似一个显示像素，可较好显示出简单文字或者图片，显示画质的分辨率随芯片整面分区数量的增多而变得更加精细。
参见图1、图2，在所述基板的正面1101作业完成后，继续在所述基板的背面1102采用回流焊工艺进行固晶作业。同样的，所述第二芯片130阵列排布于所述基板的背面1102，每一所述第二芯片130的尺寸为0.1 mm-3mm。每平方厘米的面积中，设置1-100颗所述第二芯片130。若采用六寸屏，那么所对应的基板110上的所述第一芯片120的数量在100-10000颗，根据分辨率要求设置。本实施例中，所述第二芯片130为RGB三基色芯片。本实施例中的所述基板的背面1102利用第二芯片130直接进行显示，相比于常规的双面显示屏，本实施例中的面光源10利用RGB三基色芯片直接进行控制显示，无须搭配玻璃面板，也无须整面封装荧光膜170或量子点膜。
如图6所示，所述背面分设多个第一发光区11021，所述面光源10还包括第一驱动芯片181，每一所述第一驱动芯片181对应一所述第一发光区11021。每一所述第一发光区11021对应一种颜色的所述第二芯片130。本实施例的所述基板的背面1102采用分区控制的方式，每个分区（发光区）类似一个显示像素，可较好显示出简单文字或者图片，显示画质的分辨率随芯片整面分区数量的增多而变得更加精细。
本发明的面光源10从两方面对基板110在固晶作业中的内应力进行改善。一方面，采用双面固晶的方式，理论上，固晶工艺完成后，所述基板110的两面的内应力可以相互抵消。采用双面固晶的基板上的内应力小于采用单面固晶的基板上的内应力，因此可见，采用双面固晶能够有效改善回流焊工艺中所述基板110翘曲造成的不利影响，且减轻了因基板严重翘曲带来的芯片被锡膏拉扯倾斜产生的短路现象，从而提升了面光源10整面亮度均一性。另一方面，采用双面固晶所用基板比单面基板略厚，一定程度上增加了基板的厚度，较厚的所述基板110也能够减少固晶作业中的内应力，本实施例采用所述第一基板111和所述第二基板112通过中间的所述胶合层113胶合形成加厚的基板110。
如图7所示，本发明还提供了一种显示装置1，包括所述的面光源10以及显示面板20，所述显示面板20位于所述面光源10的上方，且位于所述第一芯片120所在一侧。本发明的主要设计要点在于面光源10结构，对于显示面板20、框架等其他结构不再一一赘述。
本实施例中的所述显示装置1可实现双面显示，同时，所述显示装置1的背面利用第二芯片130直接进行显示，相比于常规的双面显示屏，本实施例中的显示装置1利用RGB三基色芯片直接进行控制显示，无须搭配玻璃面板，即无须增加阵列基板和彩膜基板，也无须整面封装荧光膜170或量子点膜，由此可以减薄显示装置1的厚度，实现了超薄化双面显示架构。所述显示装置1的背面由于只需要显示一些简单的文字或图片信息，可采用local dimming算法控制面光源10直接进行显示，显示区域的分辨率与面光源10分区以及芯片的数量相关联。
以上仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种面光源，其包括
    基板，具有正面和背面，所述基板的正面和背面均设有焊盘及金属走线；
    第一芯片，分布于所述基板的正面且焊接至所述焊盘；
    第二芯片，分布于所述基板的背面且焊接至所述焊盘。
  2. 根据权利要求1所述的面光源，其中，所述基板的厚度为150微米-200微米。
  3. 根据权利要求1所述的面光源，其中，所述第一芯片阵列排布，每一所述第一芯片的尺寸为1μm-500μm；所述第二芯片阵列排布，每一所述第二芯片的尺寸为0.1 mm-3mm。
  4. 根据权利要求1所述的面光源，其中，所述基板的背面分设多个第一发光区，所述面光源还包括第一驱动芯片，每一所述第一驱动芯片对应所述第一发光区的其中之一。
  5. 根据权利要求4所述的面光源，其中，所述第二芯片为RGB三基色芯片，每一所述第一发光区对应一种颜色的所述第二芯片。
  6. 根据权利要求1所述的面光源，其中，
    所述基板的正面分设多个第二发光区，所述面光源还包括第二驱动芯片，每一所述第二驱动芯片对应所述第二发光区的其中之一；或
    所述基板的正面整面为第三发光区，所述面光源还包括第三驱动芯片，所述第三驱动芯片对应所述第三发光区。
  7. 根据权利要求1所述的面光源，其还包括荧光膜，覆于所述第一芯片上。
  8. 根据权利要求1所述的面光源，其中，所述基板包括
    第一基板；
    胶合层，覆于所述第一基板的一表面；
    第二基板，通过所述胶合层胶合于所述第一基板上。
  9. 根据权利要求1所述的面光源，其中，所述基板的正面和背面上均设有反射层，该反射层填充于所述第一芯片之间或者所述第二芯片之间。
  10. 一种显示装置，其包括
    如权利要求1所述的面光源；以及
    显示面板，位于所述面光源的上方，且位于所述第一芯片所在一侧。
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