WO2021017123A1 - 一种显示面板及其显示装置 - Google Patents

一种显示面板及其显示装置 Download PDF

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Publication number
WO2021017123A1
WO2021017123A1 PCT/CN2019/107180 CN2019107180W WO2021017123A1 WO 2021017123 A1 WO2021017123 A1 WO 2021017123A1 CN 2019107180 W CN2019107180 W CN 2019107180W WO 2021017123 A1 WO2021017123 A1 WO 2021017123A1
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WO
WIPO (PCT)
Prior art keywords
fluorescent film
display panel
light
film unit
display
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PCT/CN2019/107180
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English (en)
French (fr)
Inventor
杨勇
Original Assignee
武汉华星光电技术有限公司
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Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US16/631,177 priority Critical patent/US20210035959A1/en
Publication of WO2021017123A1 publication Critical patent/WO2021017123A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G02F1/133607—Direct backlight including a specially adapted diffusing, scattering or light controlling members the light controlling member including light directing or refracting elements, e.g. prisms or lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133614—Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Definitions

  • the present invention relates to the field of display technology, in particular to a display panel and a display device thereof.
  • the display device can transform computer data into various characters, numbers, symbols or intuitive images for display, and can use keyboard and other input tools to input commands or data into the computer, and add, delete, modify, and change the display at any time with the help of system hardware and software content.
  • Display devices are classified into plasma, liquid crystal, light emitting diode and cathode ray tube types according to the display device used.
  • Mini LED is also called sub-millimeter light-emitting diode. It has ultra-thin, special-shaped, local dimming (that is, TV backlight area adjustment technology), high contrast, narrow bezel, and HDR (full English name: high-dynamic). Range, high dynamic range image) display and many other advantages, so it is favored by people.
  • local Dimming to achieve high-contrast display has become a major technical advantage of mini LEDs. It can achieve extremely bright and extremely dark grayscale changes in the display area through partitioned backlight control to improve display quality.
  • An object of the present invention is to provide a display panel and a display device thereof, which can solve the color unevenness caused by the existing mini LED during local dimming zone control, thereby improving the image quality contrast and avoiding color distortion.
  • an embodiment of the present invention provides a display panel, which includes: a back panel, a light-emitting lamp panel, a diffusion panel, and a fluorescent film unit.
  • the light-emitting lamp board is arranged on the back plate;
  • the light-emitting lamp board includes a lamp substrate and an LED chip, the LED chips are arranged in an array in the lamp substrate at intervals;
  • the diffuser is arranged on the The light-emitting lamp board;
  • the fluorescent film unit corresponding to the LED chips are spaced apart and arranged in an array on the side surface of the diffuser plate facing the light-emitting lamp board.
  • the thickness of the fluorescent film unit ranges from 0.05 to 0.08 mm.
  • the fluorescent film unit is arranged on the diffusion plate by positioning spraying or brushing.
  • the length of the fluorescent film unit is 1-3 times the length of the LED chip.
  • the width of the fluorescent film unit is 1-3 times the width of the LED chip.
  • constituent materials of the fluorescent film unit include one or more of silicate and yttrium aluminum garnet.
  • the distance between the LED chips ranges from 0.7 to 10 mm.
  • the distance between the fluorescent film units ranges from 0.1 to 3 mm.
  • the display panel further includes a prism sheet, and the prism sheet is disposed on a surface of the diffusion plate away from the back plate.
  • Another embodiment of the present invention also provides a display device, which includes the display panel related to the present invention.
  • the present invention relates to a display panel and a display device thereof.
  • fluorescent film units are arranged in an array corresponding to the LED chips on the diffusion plate.
  • the fluorescent film units are spaced from each other in an array.
  • the way of setting can make part of the blue light emitted by the LED chip not pass through the fluorescent film unit to compensate for the yellowish difference of part of the light, improve the "yellow edge" phenomenon of the partition boundary, so as to avoid color distortion, and achieve higher color reproduction and high contrast display.
  • the thickness of the fluorescent film unit is thinner than that of the existing fluorescent film, so it can be more beneficial to the thinning application of the display panel.
  • FIG. 1 is a schematic diagram of the structure of the display panel of the present invention.
  • Fig. 2 is a schematic diagram of light in the prior art.
  • Figure 3 is a schematic diagram of the light of the present invention.
  • Fig. 4 is a schematic diagram of the fluorescent film unit and the LED chip of the present invention.
  • Figure 5 is the first schematic diagram of the preparation process of the fluorescent film unit.
  • Fig. 6 is the second schematic diagram of the preparation process of the fluorescent film unit.
  • Figure 7 is the third schematic diagram of the preparation process of the fluorescent film unit.
  • Figure 8 is a fourth schematic diagram of the preparation process of the fluorescent film unit.
  • Lamp substrate 22 LED chip
  • the third ray 10.
  • the component can be directly placed on the other component; there may also be an intermediate component on which the component is placed , And the intermediate component is placed on another component.
  • a component is described as “installed to” or “connected to” another component, both can be understood as directly “installed” or “connected”, or a component is “installed to” or “connected to” through an intermediate component Another component.
  • a display panel 100 includes: a back plate 1, a light-emitting lamp plate 2, a protective layer 3, a diffusion plate 4, a fluorescent film unit 5, and a prism sheet 6.
  • the backplane 1 adopts a rubber-iron frame structure, which mainly plays a role of protecting and supporting the upper structure.
  • the light-emitting lamp board 2 includes a lamp substrate 21 and an LED chip 22, and the LED chips 22 are arranged in an array in the lamp substrate 21 at intervals.
  • the LED chip 22 may be connected to the copper wire on the lamp substrate 21 by soldering and energized to emit light.
  • the protective layer 3 can also be formed by coating a transparent glue layer on the light-emitting lamp board 2, which can prevent the LED chip 22 from being invaded by water and oxygen.
  • the diffusion plate 4 is disposed on the protective layer 3.
  • the diffuser plate 4 may be a bulk diffuser or a membrane structure containing a diffuser on the surface. Specifically, the diffuser is coated on the surface of the diffuser 4 away from the back plate 1.
  • the fluorescent film unit 5 is arranged on the side surface of the diffusion plate 4 facing the light-emitting lamp plate 2 in an array manner corresponding to the LED chips 32 at intervals.
  • the prism sheet 6 is arranged on the surface of the diffusion plate 4 away from the back plate 1.
  • the prism sheet 6 includes a lower prism sheet 61 disposed on a surface of the diffusion plate 4 away from the back plate 1 and an upper prism sheet 62 disposed on the lower prism sheet 61.
  • the upper prism sheet 62 and the lower prism sheet 61 are mainly used to improve the brightness of the display panel 100.
  • the fluorescent film units 5 are arranged in an array at a distance from each other, so that part of the blue light emitted by the LED chip 22 does not pass through the fluorescent film unit 5 so as to compensate for the yellowish difference of part of the light, improve the "yellow edge" phenomenon of the partition boundary, and avoid Color distortion, high color reproduction and high contrast display are realized.
  • the thickness of the fluorescent film unit 5 is thinner than that of the existing fluorescent film, so it can be more beneficial to the thinning application of the display panel 100.
  • the existing COB method is used to prepare the structure of the mini LED, in which the ratio of the blue light emitted by the LED chip 32 through the fluorescent film layer and the RGB three-color ratio changes with the waveguide distance of the light. Specifically, The shorter the waveguide distance is, the less red and green light are excited, and the emitted light becomes blue, otherwise it becomes yellow, which is the so-called "yellow edge" phenomenon. Therefore, the emitted light after the first light 7, the second light 8 to the third light 9 in FIG. 2 passes through the fluorescent film layer is from blue to yellow.
  • the thickness of the fluorescent film unit 5 of the present invention is thinner than that of the fluorescent film layer in the prior art, which is beneficial to the thinner application of the display panel 100.
  • the fourth light 10 and the fifth light 11 emitted by the LED chip 22 have different waveguide distances in the fluorescent film unit 5, so the emitted light may also have the phenomenon that the fifth light 11 is more yellow than the fourth light 10. Since the fluorescent film units 5 are spaced apart in an array manner corresponding to the LED chips 22 being arranged on the diffuser plate 4, there will be a sixth light 12 that does not pass through the fluorescent film unit 5 as shown in FIG.
  • the light 12 can make up for the difference in the emitted light between the fifth light 11 and the fourth light 10, improve the "yellow edge" phenomenon of the partition boundary, thereby avoiding color distortion, and achieving higher color reproduction and high contrast display.
  • the thickness of the fluorescent film unit 5 ranges from 0.05 to 0.08 mm, and the fluorescent film unit 5 is disposed on the diffusion plate 4 by positioning spraying or brushing.
  • the size of the fluorescent film unit 5 is larger than that of the LED chip 22, so that the blue light emitted by the LED chip 22 can pass through the fluorescent light.
  • the film unit 5 is converted into RGB three colors to achieve the effect of white light emission. Specifically, the length of the fluorescent film unit 5 is 1-3 times the length of the LED chip 22, and the width of the fluorescent film unit 5 is 1-3 times the width of the LED chip 22.
  • the distance between the LED chips 22 is in the range of 0.7-10 mm, and the distance between the fluorescent film units is in the range of 0.1-3 mm.
  • the composition material of the fluorescent film unit 5 includes one or more of silicate and yttrium aluminum garnet.
  • the resulting fluorescent film unit 5 can well realize the effect of converting the blue light emitted by the LED chip 22 into RGB three colors to realize the white light emission.
  • the present invention also provides a schematic diagram of the preparation process of the fluorescent film unit 5.
  • a diffusion plate 4 is provided first; then a fluorescent film layer is formed on the diffusion plate 4 by a brushing or spraying process, and a patterned steel mesh is placed on the fluorescent film layer, and the steel mesh corresponds to
  • the LED chips 22 are patterned, and then exposed, baked and cured to form fluorescent film units 5 arranged in an array corresponding to the LED chips 22 at intervals.
  • Another embodiment of the present invention also provides a display device, which includes the display panel 100 related to the present invention.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Theoretical Computer Science (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种显示面板（100）及其显示装置，通过在扩散板（4）上对应于LED芯片（22）相互间隔呈阵列的方式设置荧光膜单元（5），一方面，荧光膜单元（5）相互间隔呈阵列的方式设置，可以使LED芯片（22）射出的部分蓝光不经过荧光膜单元（5）从而弥补部分光线的偏黄差异，改善分区边界"黄边"现象，从而避免颜色失真，实现较高的色彩还原性和高对比度显示。另一方面，荧光膜单元（5）的厚度相比现有的荧光膜厚度薄，因此可以更有利于显示面板（100）的薄型化应用。

Description

一种显示面板及其显示装置 技术领域
本发明涉及显示技术领域，具体涉及一种显示面板及其显示装置。
 背景技术
显示装置可以把计算机的数据变换成各种文字、数字、符号或直观的图像显示出来，并且可以利用键盘等输入工具把命令或数据输入计算机，借助系统的硬件和软件随时增添、删改、变换显示内容。显示装置根据所用之显示器件分为等离子、液晶、发光二极管和阴极射线管等类型。
Mini LED又称为次毫米发光二极管，其有着超薄、异形、local dimming（即电视背光区域调节技术）、高对比度、窄边框、可实现HDR（英文全称：high-dynamic range，高动态范围图像）显示等诸多优势，因而受到人们的青睐。在消费品显示领域，local dimming实现高对比度显示成为mini LED的一大技术优势，其可通过分区背光控制的方式实现显示区域极亮和极暗的灰阶变化，提升显示画质。
 技术问题
由于常规的mini LED多数采用封面封装的COB(英文全称：chip on board)方式，LED芯片在出光过程中由于光程的差异及光在胶膜材料中的波导效应，造成每个区域边界之间颜色的差异，引起显示画质的色偏。人们试图通过通道亮度算法调整的方式来克服这一缺陷，然而在技术方案成熟的情况下，此类算法需要根据不同的图片做不同调整，会增加产品的成本和功耗，因此此种方案不具备量产性。因此需要寻求一种新型的显示面板以解决上述问题。
 技术解决方案
本发明的一个目的是提供一种显示面板及其显示装置，其能够解决现有的mini LED在做local dimming分区控制时造成的颜色不均现象，从而提升画质对比度，避免颜色失真。
为了解决上述问题，本发明的一个实施方式提供了一种显示面板，其中包括：背板、发光灯板、扩散板以及荧光膜单元。其中所述发光灯板设置于所述背板上；所述发光灯板包括灯基板和LED芯片，所述LED芯片相互间隔呈阵列方式设置于所述灯基板中；所述扩散板设置于所述发光灯板上；所述荧光膜单元对应于所述LED芯片相互间隔呈阵列方式设置于所述扩散板朝向所述发光灯板的一侧表面上。
进一步的，其中所述荧光膜单元的厚度范围为0.05-0.08mm。
进一步的，其中所述荧光膜单元采用定位喷涂或刷涂的方式设置于所述扩散板上。
进一步的，其中所述荧光膜单元的长度为所述LED芯片的长度的1-3倍。
进一步的，其中所述荧光膜单元的宽度为所述LED芯片的宽度的1-3倍。
进一步的，其中所述荧光膜单元的组成材料包括硅酸盐、钇铝石榴石中的一种或多种。
进一步的，其中所述LED芯片之间的间距范围为0.7-10mm。
进一步的，其中所述荧光膜单元之间的间距范围为0.1-3mm。
进一步的，其中所述显示面板还包括棱镜片，所述棱镜片设置于所述扩散板远离所述背板的一侧表面上。
本发明的另一个实施方式还提供了一种显示装置，其中包括本发明所涉及的显示面板。
 有益效果
本发明涉及一种显示面板及其显示装置，本发明通过在所述扩散板上对应于所述LED芯片相互间隔呈阵列的方式设置荧光膜单元，一方面，所述荧光膜单元相互间隔呈阵列的方式设置，可以使LED芯片射出的部分蓝光不经过荧光膜单元从而弥补部分光线的偏黄差异，改善分区边界“黄边”现象，从而避免颜色失真，实现较高的色彩还原性和高对比度显示。另一方面，荧光膜单元的厚度相比现有的荧光膜厚度薄，因此可以更有利于显示面板的薄型化应用。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明显示面板的结构示意图。
图2是现有技术的光线示意图。
图3是本发明的光线示意图。
图4是本发明的荧光膜单元和LED芯片的示意图。
图5是荧光膜单元制备工艺示意图一。
图6是荧光膜单元制备工艺示意图二。
图7是荧光膜单元制备工艺示意图三。
图8是荧光膜单元制备工艺示意图四。
图中部件标识如下：
100、显示面板
1、背板                   2、发光灯板
21、灯基板                22、LED芯片
3、保护层                 4、扩散板
5、荧光膜单元             6、棱镜片
61、下棱镜片              62、上棱镜片
7、第一光线               8、第二光线
9、第三光线               10、第四光线
11、第五光线              12、第六光线
13、钢网
 本发明的实施方式
以下结合说明书附图详细说明本发明的优选实施例，以向本领域中的技术人员完整介绍本发明的技术内容，以举例证明本发明可以实施，使得本发明公开的技术内容更加清楚，使得本领域的技术人员更容易理解如何实施本发明。然而本发明可以通过许多不同形式的实施例来得以体现，本发明的保护范围并非仅限于文中提到的实施例，下文实施例的说明并非用来限制本发明的范围。
本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是附图中的方向，本文所使用的方向用语是用来解释和说明本发明，而不是用来限定本发明的保护范围。
在附图中，结构相同的部件以相同数字标号表示，各处结构或功能相似的组件以相似数字标号表示。此外，为了便于理解和描述，附图所示的每一组件的尺寸和厚度是任意示出的 ，本发明并没有限定每个组件的尺寸和厚度。
当某些组件，被描述为“在”另一组件“上”时，所述组件可以直接置于所述另一组件上；也可以存在一中间组件，所述组件置于所述中间组件上，且所述中间组件置于另一组件上。当一个组件被描述为“安装至”或“连接至”另一组件时，二者可以理解为直接“安装”或“连接”，或者一个组件通过一中间组件“安装至”或“连接至”另一个组件。
实施例1
如图1所示，一种显示面板100，其中包括：背板1、发光灯板2、保护层3、扩散板4、荧光膜单元5以及棱镜片6。
其中所述背板1采用胶铁框结构，主要是起到保护和支撑上层结构的作用。
其中所述发光灯板2包括灯基板21和LED芯片22，所述LED芯片22相互间隔呈阵列方式设置于所述灯基板21中。具体的，所述LED芯片22可以通过锡焊的方式和灯基板21上的铜线进行连接通电发光。另外，还可以通过在所述发光灯板2上涂覆透明胶层形成保护层3，可以很好的防止LED芯片22被水氧入侵等。
所述扩散板4设置于所述保护层3上。所述扩散板4可以是体扩散也可以是表面含有扩散剂的膜片结构，具体的所述扩散剂涂覆与所述扩散板4远离所述背板1的一侧表面上。
所述荧光膜单元5对应于所述LED芯片32相互间隔呈阵列方式设置于所述扩散板4朝向所述发光灯板2的一侧表面上。
其中所述棱镜片6设置于所述扩散板4远离所述背板1的一侧表面上。所述棱镜片6包括设置于所述扩散板4远离所述背板1的一侧表面上的下棱镜片61以及设置于所述下棱镜片61上的上棱镜片62。所述上棱镜片62和下棱镜片61主要是用于提高显示面板100的亮度。
其中所述荧光膜单元5相互间隔呈阵列的方式设置，可以使LED芯片22射出的部分蓝光不经过荧光膜单元5从而弥补部分光线的偏黄差异，改善分区边界“黄边”现象，从而避免颜色失真，实现较高的色彩还原性和高对比度显示。另一方面，荧光膜单元5的厚度相比现有的荧光膜厚度薄，因此可以更有利于显示面板100的薄型化应用。
如图2所示，现有的COB方式制备mini LED的架构，其中LED芯片32发出的蓝光经过所述荧光膜层发出的RGB三色比例随着光线的波导距离的不同而改变，具体的，所述波导距离越短，被激发的红光和绿光越少，出射光线偏蓝，反之则偏黄，即所谓的“黄边”现象。因此如图2中的第一光线7、第二光线8到第三光线9经过所述荧光膜层之后的出射光是由蓝到黄的。
如图3所示，本发明的所述荧光膜单元5厚度相较现有技术中的荧光膜层厚度变薄，有利于显示面板100的薄型化应用。所述LED芯片22发出的第四光线10和第五光线11在所述荧光膜单元5中的波导距离存在差异，因此出射光也会存在第五光线11比第四光线10偏黄的现象。由于荧光膜单元5相互间隔呈阵列方式对应于所述LED芯片22设置于所述扩散板4上，因此会存在如图3中所示不经过荧光膜单元5的第六光线12，因此第六光线12可以弥补第五光线11和第四光线10之间的出射光差异，改善分区边界“黄边”的现象，从而避免颜色失真，实现较高的色彩还原性和高对比度显示。
其中所述荧光膜单元5的厚度范围为0.05-0.08mm，所述荧光膜单元5采用定位喷涂或刷涂的方式设置于所述扩散板4上。
如图1、图4所示，由于LED芯片22具有一定的发光角度，所以所述荧光膜单元5的尺寸要比所述LED芯片22的尺寸大，从而才能实现LED芯片22发出的蓝光经过荧光膜单元5转换成RGB三色实现白光出射的效果。具体的，所述荧光膜单元5的长度为所述LED芯片22的长度的1-3倍，所述荧光膜单元5的宽度为所述LED芯片22的宽度的1-3倍。
其中所述LED芯片22之间的间距范围为0.7-10mm，所述荧光膜单元之间的间距范围为0.1-3mm。
其中所述荧光膜单元5的组成材料包括硅酸盐、钇铝石榴石中的一种或多种。由此制成的荧光膜单元5能很好的实现将LED芯片22发射出的蓝光转换成RGB三色实现白光出射的效果。
如图5、图6、图7、图8所示，本发明还提供了所述荧光膜单元5的制备工艺示意图。
具体的，首先提供一扩散板4；然后通过刷涂或喷涂工艺在所述扩散板4上形成荧光膜层，在通过在所述荧光膜层上放置图案化的钢网，所述钢网对应于所述LED芯片22设置图案，然后经过曝光、烘烤固化形成对应于所述LED芯片22相互间隔呈阵列方式设置的荧光膜单元5。
本发明的另一个实施方式还提供了一种显示装置，其中包括本发明涉及的显示面板100。
以上对本发明所提供的显示面板及其显示装置进行了详细介绍。应理解，本文所述的示例性实施方式应仅被认为是描述性的，用于帮助理解本发明的方法及其核心思想，而并不用于限制本发明。在每个示例性实施方式中对特征或方面的描述通常应被视作适用于其他示例性实施例中的类似特征或方面。尽管参考示例性实施例描述了本发明，但可建议所属领域的技术人员进行各种变化和更改。本发明意图涵盖所附权利要求书的范围内的这些变化和更改，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种显示面板，其包括：
    背板；
    发光灯板，所述发光灯板设置于所述背板上；
    所述发光灯板包括灯基板和LED芯片，所述LED芯片相互间隔呈阵列方式设置于所述灯基板中；
    扩散板，所述扩散板设置于所述发光灯板上；以及
    荧光膜单元，所述荧光膜单元对应于所述LED芯片相互间隔呈阵列方式设置于所述扩散板朝向所述发光灯板的一侧表面上。
  2. 根据权利要求1所述的显示面板，其中所述荧光膜单元的厚度范围为0.05-0.08mm。
  3. 根据权利要求1所述的显示面板，其中所述荧光膜单元采用定位喷涂或刷涂的方式设置于所述扩散板上。
  4. 根据权利要求1所述的显示面板，其中所述荧光膜单元的长度为所述LED芯片的长度的1-3倍。
  5. 根据权利要求1所述的显示面板，其中所述荧光膜单元的宽度为所述LED芯片的宽度的1-3倍。
  6. 根据权利要求1所述的显示面板，其中所述荧光膜单元的组成材料包括硅酸盐、钇铝石榴石中的一种或多种。
  7. 根据权利要求1所述的显示面板，其中所述LED芯片之间的间距范围为0.7-10mm。
  8. 根据权利要求1所述的显示面板，其中所述荧光膜单元之间的间距范围为0.1-3mm。
  9. 根据权利要求1所述的显示面板，其中还包括棱镜片，所述棱镜片设置于所述扩散板远离所述背板的一侧表面上。
  10. 一种显示装置，其包括权利要求1所述的显示面板。
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