CN115720644A - 背光模组、其制作方法及显示装置 - Google Patents
背光模组、其制作方法及显示装置 Download PDFInfo
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- CN115720644A CN115720644A CN202180001286.3A CN202180001286A CN115720644A CN 115720644 A CN115720644 A CN 115720644A CN 202180001286 A CN202180001286 A CN 202180001286A CN 115720644 A CN115720644 A CN 115720644A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
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- Computer Hardware Design (AREA)
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Abstract
提供背光模组、其制作方法及显示装置，背光模组(00)包括：驱动背板(01)，包括多个焊盘(101)；多个发光二极管(02)，与焊盘(101)电连接；多个透明保护结构(03)，位于多个发光二极管(02)背离驱动背板(01)的一侧，透明保护结构(03)包覆发光二极管(02)，且透明保护结构(03)在驱动背板(01)上的正投影中心与发光二极管(02)在驱动背板(01)上的正投影中心之间具有第一距离，发光二极管(02)在驱动背板(01)上的正投影的长度为第二距离，发光二极管(02)在驱动背板(01)上的正投影的宽度为第三距离，第一距离与第二距离之比小于或等于1:2‑1:10，第一距离与第三距离之比小于或等于1:2‑1:10。背光模组的制作方法包括：在多个发光二极管(02)上放置钢网(04)，钢网(04)的开窗完全暴露出发光二极管(02)，且钢网(04)背离驱动背板(01)一侧的表面到驱动背板(01)所在平面的距离大于发光二极管(02)背离驱动背板(01)一侧的表面到驱动背板(01)所在平面的距离；在钢网(04)的开窗内形成透明保护图案(03')，对透明保护图案(03')进行固化，形成包覆发光二极管(02)的透明保护结构(03)。显示装置，包括背光模组(00)。
Description
PCT国内申请，说明书已公开。
Claims (14)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2021/096428 WO2022246745A1 (zh) | 2021-05-27 | 2021-05-27 | 背光模组、其制作方法及显示装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115720644A true CN115720644A (zh) | 2023-02-28 |
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ID=84229406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180001286.3A Pending CN115720644A (zh) | 2021-05-27 | 2021-05-27 | 背光模组、其制作方法及显示装置 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN115720644A (zh) |
| WO (1) | WO2022246745A1 (zh) |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102005520B (zh) * | 2010-10-29 | 2012-08-29 | 北京大学 | 一种led封装方法 |
| JP2012204370A (ja) * | 2011-03-23 | 2012-10-22 | Sony Corp | 光源回路ユニットおよび照明装置、並びに表示装置 |
| CN105990492A (zh) * | 2015-02-12 | 2016-10-05 | 展晶科技(深圳)有限公司 | 发光二极管封装体及其制造方法 |
| US10032757B2 (en) * | 2015-09-04 | 2018-07-24 | Hong Kong Beida Jade Bird Display Limited | Projection display system |
| CN107170771B (zh) * | 2017-05-23 | 2019-12-24 | 深圳市华星光电技术有限公司 | 微发光二极管阵列基板的封装结构及其封装方法 |
| CN108732818A (zh) * | 2018-05-29 | 2018-11-02 | 武汉华星光电技术有限公司 | 背光模组、显示装置及背光模组的制作方法 |
| CN110875345A (zh) * | 2018-08-31 | 2020-03-10 | 昆山工研院新型平板显示技术中心有限公司 | Led显示器件及其制造方法、led显示面板 |
| CN109411458A (zh) * | 2018-11-14 | 2019-03-01 | 易美芯光（北京）科技有限公司 | 一种micro led显示器件及其制作方法 |
| WO2020263181A1 (en) * | 2019-06-28 | 2020-12-30 | Massachusetts Institute Of Technology | Method of fabricating an integrated structure for an optoelectronic device and integrated structure for an optoelectronic device |
| JP7282620B2 (ja) * | 2019-07-04 | 2023-05-29 | シャープ福山レーザー株式会社 | 画像表示素子 |
| CN112216684A (zh) * | 2019-07-10 | 2021-01-12 | 北京易美新创科技有限公司 | 迷你led封装器件及其制造方法 |
| CN110456560A (zh) * | 2019-07-29 | 2019-11-15 | 武汉华星光电技术有限公司 | 一种显示面板及其显示装置 |
| CN210982988U (zh) * | 2019-11-29 | 2020-07-10 | 海信视像科技股份有限公司 | 一种显示装置 |
| CN111653689B (zh) * | 2020-06-15 | 2023-04-28 | 京东方科技集团股份有限公司 | 透镜阵列的制备方法、显示装置及其制备方法 |
-
2021
- 2021-05-27 WO PCT/CN2021/096428 patent/WO2022246745A1/zh active Application Filing
- 2021-05-27 CN CN202180001286.3A patent/CN115720644A/zh active Pending
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| Publication number | Publication date |
|---|---|
| WO2022246745A1 (zh) | 2022-12-01 |
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