CN109616024A - 面光源及采用该面光源的显示装置 - Google Patents
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Abstract
本发明公开了一种面光源及采用该面光源的显示装置,该面光源包括基板,具有正面和背面,所述基板的正面和背面均设有焊盘及金属走线;第一芯片,分布于所述基板的正面且焊接至所述焊盘;第二芯片,分布于所述基板的背面且焊接至所述焊盘。本发明的面光源及采用该面光源的显示装置,采用双面固晶能够有效改善回流焊工艺中基板翘曲造成的不利影响,且减轻了因基板严重翘曲带来的芯片被锡膏拉扯倾斜产生的短路现象,从而提升了面光源整面亮度均一性。虽然基板的厚度增加,但面光源整体厚度以及显示装置的厚度相对减小,使得显示装置更加轻薄。
Description
技术领域
本发明涉显示装置等领域,具体为一种面光源及采用该面光源的显示装置。
背景技术
miniLED显示技术作为未来市场OLED显示技术的强有力竞争对手,miniLED显示装置具有高亮、柔性可弯曲、可制作高动态对比度显示技术、窄边框显示技术、异形显示技术等诸多优点,成为市场研究热点。然而miniLED显示装置为追求柔性显示效果,多采用柔性电路板作为基板,基板衬底材料PI在受热过程中会造成较大的内应力,在回流焊工艺后会造成板材的大幅度卷曲,该卷曲会影响到固晶时芯片的位置和光出射方向,同时也会对后续的模组组装工艺造成较大的挑战。高分子材料在经过高温处理时均会产生内应力,材料的热性无法改变。对于材料的内应力造成的固晶困扰,人们暂未找到较好的解决方式。常规的双面显示技术多采用侧入式背光的方式,其背面的显示也需要依靠液晶层,通过液晶分子的控光方式进行显示,此种双面显示架构增加了显示屏的厚度。如何减少双面显示屏的厚度,人们也未找到合适的改进方式。
而传统面光源在固晶作业过程中,基板在固晶机台转移芯片过程中,由于仅进行单面固晶作业,易在基板上产生内应力,且内应力随着基板的减薄而更加明显。在高温回流焊过程中,基板积累的内应力得到释放则会造成基板的卷曲。卷曲一方面会造成回流焊时锡膏拉扯芯片,导致虚焊或者短路,另一方面对后续的切割工艺也会造成困扰。
发明内容
本发明所要解决的技术问题是:提供一种面光源及采用该面光源的显示装置,面光源采用双面固晶的方式减轻基板上的内应力,从而减轻回流焊工艺中板材的翘曲问题,同时制备的双面的面光源在实现双面显示时,背面采用分区显示的方式直接由面光源进行显示,以减薄显示装置中显示屏的厚度,实现显示屏的超薄化。
解决上述问题的技术方案是:提供一种面光源,包括基板,具有正面和背面,所述基板的正面和背面均设有焊盘及金属走线;第一芯片,分布于所述基板的正面且焊接至所述焊盘;第二芯片,分布于所述基板的背面且焊接至所述焊盘。
在本发明一实施例中,所述基板的厚度为150微米-200微米。
在本发明一实施例中,所述第一芯片阵列排布,每一所述第一芯片的尺寸为1μm-500μm;所述第二芯片阵列排布,每一所述第二芯片的尺寸为0.1mm-3mm。
在本发明一实施例中,所述基板的背面分设多个第一发光区,所述面光源还包括第一驱动芯片,每一所述第一驱动芯片对应一所述第一发光区的其中之一。
在本发明一实施例中,所述第二芯片为RGB三色芯片,一所述第一发光区对应一种颜色的所述第二芯片。
在本发明一实施例中,所述基板的正面分设多个第二发光区,所述面光源还包括第二驱动芯片,每一所述第二驱动芯片对应一所述第二发光区的其中之一;或所述基板的正面整面为第三发光区,所述面光源还包括第三驱动芯片,所述第三驱动芯片对应所述第三发光区。
在本发明一实施例中,所述的面光源还包括荧光膜,覆于所述第一芯片上。
在本发明一实施例中,所述基板包括第一基板;胶合层,覆于所述第一基板的一表面;第二基板,通过所述胶合层胶合于所述第一基板上。
在本发明一实施例中,所述基板的正面和背面上均设有反射层,该反射层填充于所述第一芯片之间或者所述第二芯片之间。
本发明还提供了一种显示装置,包括所述的面光源;以及显示面板,位于所述面光源的上方,且位于所述第一芯片所在一侧。
本发明的有益效果:本发明的面光源及采用该面光源的显示装置,一方面采用双面固晶的方式,理论上,固晶工艺完成后,基板的两面的内应力可以相互抵消。采用双面固晶的基板上的内应力小于采用单面固晶的基板上的内应力,因此可见,采用双面固晶能够有效改善回流焊工艺中基板翘曲造成的不利影响,且减轻了因基板严重翘曲带来的芯片被锡膏拉扯倾斜产生的短路现象,从而提升了面光源整面亮度均一性。另一方面,采用双面固晶所用基板比单面基板略厚,一定程度上增加了基板的厚度,较厚的基板也能够减少固晶作业中的内应力;采用分区控制的方式,每个分区(发光区)类似一个显示像素,可较好显示出简单文字或者图片,显示画质的分辨率随芯片整面分区数量的增多而变得更加精细。基板的背面利用第二芯片直接进行显示,相比于常规的双面显示屏,面光源利用RGB三基色芯片直接进行控制显示,无须搭配玻璃面板,也无须整面封装荧光膜或量子点膜,虽然基板的厚度增加,但面光源整体厚度以及显示装置的厚度相对减小,使得显示装置更加轻薄。
附图说明
下面结合附图和实施例对本发明作进一步解释。
图1是本发明实施例的面光源的层状结构示意图。
图2是本发明实施例的基板的正面或基板的背面金属走线和焊盘分布图。
图3是本发明实施例的基板的层状结构图。
图4是本发明实施例的面光源正面的发光区与驱动芯片的一种对应关系图。
图5是本发明实施例的面光源正面的发光区与驱动芯片的另一种对应关系图。
图6是本发明实施例的面光源背面的发光区与驱动芯片的一种对应关系图。
图7是本发明实施例的显示装置的层状结构示意图。
附图标记:
1 显示装置;
10 面光源; 20 显示面板;
110 基板; 120 第一芯片;
130 第二芯片; 140 反射层;
150 金属走线; 160 焊盘;
170 荧光膜; 181 第一驱动芯片;
182 第二驱动芯片; 183 第三驱动芯片;
111 第一基板; 112 第二基板;
113 胶合层; 1101 基板的正面;
1102 基板的背面; 11011 第二发光区;
11012 第三发光区; 11021 第一发光区。
具体实施方式
以下实施例的说明是参考附加的图式,用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语,例如「上」、「下」、「前」、「后」、「左」、「右」、「顶」、「底」等,仅是参考附加图式的方向。因此,使用的方向用语是用以说明及理解本发明,而非用以限制本发明。
如图1所示,在一实施例中,本发明的面光源10,包括基板110、第一芯片120、第二芯片130和反射层140。所示基板110具有正面和背面,所述第一芯片120安装于所述正面;所述第二芯片130安装于所述背面。
如图2所示,所述基板的正面1101和背面1102均设有金属走线150及焊盘160。图2为所述正面或所述背面的金属走线150和焊盘160的一种分布结构。其中,所述第一芯片120分布于所述基板的正面1101且焊接至所述焊盘160;第二芯片130分布于所述基板的背面1102且焊接至所述焊盘160。
如图3所示,在固晶作业过程前,需要制作所述基板110,本实施例中,所述基板110的厚度为150微米-200微米,其尺寸根据显示屏的尺寸设定。所述基板110包括第一基板111、第二基板112、胶合层113;其中,所述胶合层113是通过将一复合胶涂覆于所述第一基板111的一表面上而形成的,所述第二基板112通过所述胶合层113胶合于所述第一基板111上。其中,所述基板的正面1101即所述第一基板111远离所述第二基板112的一面,所述基板的背面1102即所述第二基板112远离所述第一基板111的一面。
参见图1、图2,在固晶作业时,先在所述基板的正面1101和所述基板的背面1102上均涂覆一层反射材料,形成反射层140,所述反射层140覆盖所述基板110上的所述金属走线150,从而提高折射率和反光率,在封胶后能有效的提高灯珠亮度。反光材料可采用酚醛树脂、环氧树脂、聚酰亚胺树脂、聚酯树脂、白油等,本实施例中的反射层140所用材料采用白油。然后在所述基板的正面1101上采用回流焊工艺进行固晶作业。本实施例中,所述第一芯片120阵列排布于所述基板的正面1101上,每一所述第一芯片120的尺寸为1μm-500μm,每平方厘米的面积中,设置20-50颗所述第一芯片120。若采用六寸屏,那么所对应的基板110上的所述第一芯片120的数量在2000-5000颗。布置完所述第一芯片120后,在所述第一芯片120的上压覆一荧光膜170,通过所述荧光膜170实现颜色转换。
如图4所示,本实施例中,在所述基板的正面1101,所述第一芯片120可采用两种驱动方式。第一种方式为:将所述基板的正面1101分设多个第二发光区11011,本发明的面光源10还包括第二驱动芯片182,每一所述第二驱动芯片182对应一所述第二发光区11011。第二种方式为:所述基板的正面1101的整面为第三发光区11012,所述面光源10还包括第三驱动芯片183,所述第三驱动芯片183对应所述第三发光区11012。本实施例的所述基板的正面1101若采用分区控制的方式,每个分区(发光区)类似一个显示像素,可较好显示出简单文字或者图片,显示画质的分辨率随芯片整面分区数量的增多而变得更加精细。
参见图1、图2,在所述基板的正面1101作业完成后,继续在所述基板的背面1102采用回流焊工艺进行固晶作业。同样的,所述第二芯片130阵列排布于所述基板的背面1102,每一所述第二芯片130的尺寸为0.1mm-3mm。每平方厘米的面积中,设置1-100颗所述第二芯片130。若采用六寸屏,那么所对应的基板110上的所述第一芯片120的数量在100-10000颗,根据分辨率要求设置。本实施例中,所述第二芯片130为RGB三基色芯片。本实施例中的所述基板的背面1102利用第二芯片130直接进行显示,相比于常规的双面显示屏,本实施例中的面光源10利用RGB三基色芯片直接进行控制显示,无须搭配玻璃面板,也无须整面封装荧光膜170或量子点膜。
如图所示,所述背面分设多个第一发光区11021,所述面光源10还包括第一驱动芯片181,每一所述第一驱动芯片181对应一所述第一发光区11021。每一所述第一发光区11021对应一种颜色的所述第二芯片130。本实施例的所述基板的背面1102采用分区控制的方式,每个分区(发光区)类似一个显示像素,可较好显示出简单文字或者图片,显示画质的分辨率随芯片整面分区数量的增多而变得更加精细。
本发明的面光源10从两方面对基板110在固晶作业中的内应力进行改善。一方面,采用双面固晶的方式,理论上,固晶工艺完成后,所述基板110的两面的内应力可以相互抵消。采用双面固晶的基板上的内应力小于采用单面固晶的基板上的内应力,因此可见,采用双面固晶能够有效改善回流焊工艺中所述基板110翘曲造成的不利影响,且减轻了因基板严重翘曲带来的芯片被锡膏拉扯倾斜产生的短路现象,从而提升了面光源10整面亮度均一性。另一方面,采用双面固晶所用基板比单面基板略厚,一定程度上增加了基板的厚度,较厚的所述基板110也能够减少固晶作业中的内应力,本实施例采用所述第一基板111和所述第二基板112通过中间的所述胶合层113胶合形成加厚的基板110。
本发明还提供了一种显示装置1,包括所述的面光源10以及显示面板20,所述显示面板20位于所述面光源10的上方,且位于所述第一芯片120所在一侧。本发明的主要设计要点在于面光源10结构,对于显示面板20、框架等其他结构不再一一赘述。
本实施例中的所述显示装置1可实现双面显示,同时,所述显示装置1的背面利用第二芯片130直接进行显示,相比于常规的双面显示屏,本实施例中的显示装置1利用RGB三基色芯片直接进行控制显示,无须搭配玻璃面板,即无须增加阵列基板和彩膜基板,也无须整面封装荧光膜170或量子点膜,由此可以减薄显示装置1的厚度,实现了超薄化双面显示架构。所述显示装置1的背面由于只需要显示一些简单的文字或图片信息,可采用localdimming算法控制面光源10直接进行显示,显示区域的分辨率与面光源10分区以及芯片的数量相关联。
以上仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。
Claims (10)
1.一种面光源,其特征在于,包括
基板,具有正面和背面,所述基板的正面和背面均设有焊盘及金属走线;
第一芯片,分布于所述基板的正面且焊接至所述焊盘;
第二芯片,分布于所述基板的背面且焊接至所述焊盘。
2.根据权利要求1所述的面光源,其特征在于,所述基板的厚度为150微米-200微米。
3.根据权利要求1所述的面光源,其特征在于,所述第一芯片阵列排布,每一所述第一芯片的尺寸为1μm-500μm;所述第二芯片阵列排布,每一所述第二芯片的尺寸为0.1mm-3mm。
4.根据权利要求1所述的面光源,其特征在于,所述基板的背面分设多个第一发光区,所述面光源还包括第一驱动芯片,每一所述第一驱动芯片对应所述第一发光区的其中之一。
5.根据权利要求4所述的面光源,其特征在于,所述第二芯片为RGB三基色芯片,每一所述第一发光区对应一种颜色的所述第二芯片。
6.根据权利要求1所述的面光源,其特征在于,
所述基板的正面分设多个第二发光区,所述面光源还包括第二驱动芯片,每一所述第二驱动芯片对应所述第二发光区的其中之一;或
所述基板的正面整面为第三发光区,所述面光源还包括第三驱动芯片,所述第三驱动芯片对应所述第三发光区。
7.根据权利要求1所述的面光源,其特征在于,还包括荧光膜,覆于所述第一芯片上。
8.根据权利要求1所述的面光源,其特征在于,所述基板包括
第一基板;
胶合层,覆于所述第一基板的一表面;
第二基板,通过所述胶合层胶合于所述第一基板上。
9.根据权利要求1所述的面光源,其特征在于,所述基板的正面和背面上均设有反射层,该反射层填充于所述第一芯片之间或者所述第二芯片之间。
10.一种显示装置,其特征在于,包括
如权利要求1-9中任意一项所述的面光源;以及
显示面板,位于所述面光源的上方,且位于所述第一芯片所在一侧。
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CN103762211A (zh) * | 2011-12-31 | 2014-04-30 | 苏州晶品光电科技有限公司 | 柔性电路基板双面出光led阵列光源 |
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